TWI615342B - Circuit board test system, circuit board test method, and circuit board clamping apparatus - Google Patents

Abstract

A circuit board test system includes a test device, a buffer stage, two clamping jigs, a pick-and-place device, and one or more controllers. The test device has a test stage. The buffer stage is located outside the test device. The clamping fixtures are respectively placed on the test stage and the buffer stage, and are respectively configured to clamp the two circuit boards. The test device is configured to test a circuit board placed above the test stage. The pick-and-place device includes two pick-and-place modules. Each pick-and-place module is configured to move between the test carrier and the buffer carrier, and is configured to grab or place one of the holding fixtures. One or more controllers are configured to drive the pick-and-place module to exchange the placement of the clamping jig after the test device tests the circuit board placed above the test stage.

Description

Circuit board test system, circuit board test method, and circuit board mounting device

The invention relates to a circuit board testing system, a circuit board testing method and a circuit board mounting device.

In general, in order to check the electrical conductivity of a circuit on a printed circuit board (referred to as a circuit board for short), a test device is used to test by examining the contact between the probe and the contact on the printed board. During the test, the circuit board is fixed on a carrier inside the test device. Then, the inspection probe will extend down to the circuit board and make contact with the contacts of the circuit board to check whether it is conductive.

However, the aforementioned test device may sometimes fail to perform a stable inspection with a sufficiently high accuracy. For example, when inspecting a flexible circuit board, the central portion of the flexible circuit board may sag due to the effect of gravity, making it unable to maintain a flat state all the time. For this reason, when using a test device to inspect such a flexible circuit board, the inspection probe may not reliably make contact with the contacts of the flexible circuit board. Even when the test device is equipped with a precision inspection probe with high positioning accuracy, the precision inspection probe can easily be deflected or changed by a flexible circuit board Deformation is beyond its physical tolerance and is destroyed.

In addition, the existing test device has only one carrier, so the user must wait for the test to be completed and then remove the circuit board that has been tested before putting down another circuit board to continue the test. Therefore, the test cycle of the circuit board is longer.

In view of this, one object of the present invention is to provide a circuit board test system and method that can effectively reduce the test cycle of a circuit board, and a circuit board mounting device that can improve test accuracy.

In order to achieve the above object, according to an embodiment of the present invention, a circuit board test system includes a test device, a buffer stage, two clamping jigs, a pick-and-place device, and one or more controllers. The test device has a test stage. The buffer stage is located outside the test device. The clamping fixtures are respectively placed on the test stage and the buffer stage, and are respectively configured to clamp the two circuit boards. The test device is configured to test a circuit board placed above the test stage. The pick-and-place device includes two pick-and-place modules. Each pick-and-place module is configured to move between the test carrier and the buffer carrier, and is configured to grab or place one of the holding fixtures. One or more controllers are configured to drive the pick-and-place module to exchange the placement of the clamping jig after the test device tests the circuit board placed above the test stage.

In one or more embodiments of the present invention, each of the above-mentioned pick-and-place modules includes a track, a moving part, and a pick-and-place unit. The track extends between the test carrier and the buffer carrier. The moving part slidably engages the track. The pick-and-place unit is connected to the moving part and is configured to pick up or place one of the holding jigs.

In order to achieve the above object, according to an embodiment of the present invention, A circuit board testing method includes: placing a clamping fixture holding a circuit board on a test stage of a test device; and providing another clamp holding another circuit board on a buffer stage outside the test device Fixture; use a test device to test the circuit board placed above the test carrier; after the test device tests the circuit board placed above the test carrier, change the placement of the clamping fixture.

In one or more embodiments of the present invention, the step of placing another clamping jig holding another circuit board on the buffer stage includes: placing the other clamping jig on the buffer stage. And clamping another circuit board on another clamping jig.

In one or more embodiments of the present invention, the above-mentioned step of placing another clamping jig holding another circuit board on the buffer stage is a test device pair placed above the test stage. Conducted during circuit board testing.

To achieve the above object, according to an embodiment of the present invention, a circuit board mounting device includes a clamping jig. The clamping jig includes a first base body and a plurality of clamping mechanisms. Each of the clamping mechanisms includes a fixed substrate, a displacement component, a clamping head, at least one first elastic member, and at least one second elastic member. The fixed substrate is detachably fixed on the first base. The displacement component is slidably disposed on the fixed substrate along the first direction. The clamping head is disposed on the displacement component and is configured to move toward or away from the displacement component. The first elastic member connects the fixed substrate and the displacement component, and is configured to drive the displacement component to move outward relative to the first base body based on the fixed substrate. The second elastic member connects the displacement component and the clamping head, and is configured to drive the clamping head toward the displacement component.

In one or more embodiments of the present invention, the circuit board described above The mounting device also includes an unlocking device, which includes a second base and a plurality of unlocking mechanisms. The second base is configured to be disposed below the clamping jig. The unlocking mechanism is fixed on the second base and corresponds to the clamping mechanism respectively. Each unlocking mechanism includes a push-on assembly. The pushing component is configured to push against the corresponding clamping head, so that the corresponding clamping head leaves the corresponding displacement component.

In one or more embodiments of the present invention, the first base body is a frame body and has a plurality of corners. The clamping mechanisms are respectively disposed adjacent to the corners.

In one or more embodiments of the present invention, the above-mentioned displacement component includes a first displacement substrate, a second displacement substrate, and a third elastic member. The first displacement substrate is slidably disposed on the fixed substrate. The first elastic member connects the fixed substrate and the first displacement substrate. The second displacement substrate is slidably disposed on the first displacement substrate along the second direction. The clamping head is disposed on the second displacement substrate. The second elastic member connects the second displacement substrate and the clamping head. The third elastic member connects the first displacement substrate and the second displacement substrate, and is configured to drive the second displacement substrate to move outward relative to the first base body based on the first displacement substrate.

In one or more embodiments of the present invention, each of the unlocking mechanisms described above further includes a first pushing block and a second pushing block. The first pushing block is configured to push against the corresponding first displacement substrate, so that the corresponding first displacement substrate moves inward relative to the first base body based on the corresponding fixed substrate. The second pushing block is configured to push against the corresponding second displacement substrate, so that the corresponding second displacement substrate moves inward relative to the first base body based on the corresponding first displacement substrate.

In one or more embodiments of the present invention, the first elastic member is configured so that the first displacement substrate moves substantially away from one of the other clamping mechanisms relative to the fixed substrate. The third elastic member is configured to make the second displacement substrate The relative displacement substrate is substantially moved away from the other of the other clamping mechanisms.

In one or more embodiments of the present invention, the above-mentioned fixed substrate has at least one guide block. The first displacement substrate has at least one guide groove. The guide block is slidably engaged in the guide groove. The first elastic member is connected between the guide block and one end of the guide groove.

In one or more embodiments of the present invention, the above-mentioned first displacement substrate has at least one guide block. The second displacement substrate has at least one guide groove. The guide block is slidably engaged in the guide groove. The third elastic member is connected between the guide block and one end of the guide groove.

In one or more embodiments of the present invention, the above-mentioned second displacement substrate includes a plate body, a linkage plate, and a fourth elastic member. The plate is slidably disposed on the first displacement substrate. The third elastic member connects the first displacement substrate and the plate body. The interlocking plate is slidably disposed on the plate body along the first direction. The clamping head is arranged on the linkage plate. The fourth elastic member connects the plate body and the linkage plate, and is configured to drive the linkage plate to move inward relative to the fixed substrate based on the plate body.

In one or more embodiments of the present invention, each of the unlocking mechanisms described above further includes a third pushing block. The third pushing block is configured to push against the corresponding linkage plate, so that the corresponding linkage plate moves outward relative to the first base body based on the corresponding plate body.

In one or more embodiments of the present invention, the aforementioned pushing assembly includes a moving substrate, a guide rod, a fixing member, and a spring. The moving substrate is configured to move toward or away from the corresponding clamping head, and has opposite first and second surfaces. The guide rod slides through the first surface and the second surface, and has a first end. And the second end. The first end is configured to abut the first surface. The fixing member is connected to the second end and is configured to push against the corresponding clamping head. The spring is sleeved outside the guide rod and is configured to drive the fixing member away from the second surface, so that the first end is configured to abut against the first surface.

In one or more embodiments of the present invention, the above-mentioned fixing member includes a fixing block and a roller. The fixed block is connected to the second end. The roller is pivotally connected to the fixed block and is configured to push against the corresponding clamping head.

In one or more embodiments of the present invention, each of the unlocking devices described above further includes a cylinder module. The cylinder module has a cylinder rod. The pushing component is arranged on the cylinder rod.

In summary, according to the circuit board testing system and the circuit board testing method of the present invention, a clamping jig holding a circuit board can be first placed on a test stage in a testing device for testing. During the test of the test device, the user can pre-clamp another circuit board on another clamping fixture on a buffer stage outside the test device. Therefore, after the test device completes the test, the pick-and-place device can be used to quickly exchange the placement position of the clamping fixture, so that the test device can immediately continue to detect the next circuit board, thereby effectively reducing the test cycle of the circuit board. In addition, according to the clamping jig of the circuit board mounting device of the present invention, after the clamping head abuts toward the displacement component to clamp the circuit board, the displacement component is driven by the elastic member to face outward from the first base body based on the fixed substrate. Move to extend the circuit board outward to ensure that the circuit board remains flat, which can improve test accuracy. According to the unlocking device of the circuit board mounting device of the present invention, the circuit board can be restored to an unopened state by using the pushing block to push against the displacement component, and the pushing component can be used to push the clamping head away from the displacement component to release the circuit board. . It can be seen that the circuit board of the present invention The mounting device completes the installation and unlocking of the circuit board in a purely mechanical manner, so that complicated wiring can be omitted and suitable for use with the circuit board test system and the circuit board test method of the present invention.

The above is only used to explain the problem to be solved by the present invention, the technical means for solving the problem, and the effects produced by it, etc. The specific details of the present invention will be described in detail in the following embodiments and related drawings.

100‧‧‧Circuit board test system

110‧‧‧test device

111‧‧‧test stage

120‧‧‧ buffer stage

130‧‧‧Clamping fixture

131‧‧‧First Block

132‧‧‧Clamping mechanism

132a‧‧‧Fixed substrate

132a1, 132b12‧‧‧Guide block

132b‧‧‧Displacement component

132b1‧‧‧First displacement substrate

132b11, 132b22‧‧‧Guide groove

132b2‧‧‧Second displacement substrate

132b21‧‧‧board

132b23‧‧‧Linking board

132b24‧‧‧The fourth elastic member

132b25‧‧‧Clamp base plate

132b26‧‧‧block

132b3‧‧‧The third elastic member

132c‧‧‧Clamping head

132d‧‧‧ Lifting floor

132e‧‧‧Second elastic member

132f‧‧‧First elastic member

140‧‧‧Put module

141‧‧‧ track

142‧‧‧moving parts

143‧‧‧Pick and place unit

150‧‧‧controller

160‧‧‧Unlocking device

161‧‧‧Second Block

162‧‧‧Unlocking mechanism

162a‧‧‧Pushing component

162a1‧‧‧mobile substrate

162a11‧‧‧First surface

162a12‧‧‧Second surface

162a2‧‧‧Guide

162a21‧‧‧ the first end

162a22‧‧‧ second end

162a3‧‧‧Fixing

162a31‧‧‧Fixed block

162a32‧‧‧roller

162a4‧‧‧Spring

162b‧‧‧The first push block

162c‧‧‧The second push block

162d‧‧‧The third push block

163‧‧‧Cylinder Module

163a‧‧‧cylinder rod

S101 ~ S105‧‧‧ steps

A1‧‧‧First direction

A2‧‧‧Second direction

In order to make the above and other objects, features, advantages, and embodiments of the present invention more comprehensible, the description of the drawings is as follows: FIG. 1 is a perspective view illustrating a circuit board testing system according to an embodiment of the present invention.

FIG. 2 is a circuit diagram of some components of a circuit board test system according to an embodiment of the present invention.

FIG. 3 is a flowchart illustrating a circuit board testing method according to an embodiment of the present invention.

FIG. 4 is a perspective view illustrating a circuit board mounting device according to an embodiment of the present invention.

Fig. 5 is a perspective view showing the clamping jig in Fig. 4;

FIG. 6 is a perspective view showing the unlocking device in FIG. 4.

FIG. 7 is a perspective view showing some components of one of the clamping mechanisms in FIG. 5.

FIG. 8 is a perspective view showing some components of one of the unlocking mechanisms in FIG. 6.

FIG. 9A is a front view illustrating a group of clamping mechanisms and an unlocking mechanism according to an embodiment of the present invention, wherein the unlocking mechanism has not unlocked the clamping mechanism.

FIG. 9B is a top view showing all the components in 9A.

FIG. 10A is a front view illustrating a group of clamping mechanisms and an unlocking mechanism according to an embodiment of the present invention, wherein the unlocking mechanism has unlocked the clamping mechanism.

FIG. 10B is a top view showing all the components in 10A.

In the following, a plurality of embodiments of the present invention will be disclosed graphically. For the sake of clarity, many practical details will be described in the following description. It should be understood, however, that these practical details should not be used to limit the invention. That is, in some embodiments of the present invention, these practical details are unnecessary. In addition, in order to simplify the drawings, some conventional structures and components will be shown in the drawings in a simple and schematic manner.

Please refer to Figure 1 and Figure 2. FIG. 1 is a perspective view illustrating a circuit board testing system 100 according to an embodiment of the present invention. FIG. 2 is a circuit diagram of some components of the circuit board test system 100 according to an embodiment of the present invention. As shown in FIG. 1 and FIG. 2, in this embodiment, the circuit board test system 100 includes a test device 110, a buffer stage 120, two holding fixtures 130, a pick-and-place device, and one or more controllers 150. (Figure 2 shows only one by way of example). The test apparatus 110 includes a test stage 111. The buffer stage 120 is located outside the test apparatus 110. The clamping fixtures 130 are respectively placed on the test stage 111 and the buffer stage 120, and are respectively configured to clamp the two circuit boards. The test device 110 is configured to test a circuit board placed above the test stage 111. The testing device 110 is used for testing a circuit board The specific components are not described in detail here. The pick-and-place device includes two pick-and-place modules 140. Each pick-and-place module 140 is configured to move between the test stage 111 and the buffer stage 120, and is configured to grip or place one of the holding fixtures 130. The one or more controllers 150 are configured to drive the pick-and-place module 140 to exchange the placement position of the clamping fixture 130 after the test device 110 tests the circuit board placed above the test stage 111.

Specifically, each pick-and-place module 140 includes a track 141, a moving member 142, and a pick-and-place unit 143. The track 141 extends between the test stage 111 and the buffer stage 120. The moving member 142 slidably engages the rail 141. The pick-and-place unit 143 is connected to the moving member 142 and is configured to pick up or place one of the holding fixtures 130.

In some embodiments, the aforementioned moving member 142 may be implemented by using a servo motor with a linear slide rail or other alternative methods, and it is not forgivable here.

In some embodiments, the pick-and-place unit 143 may be composed of a lifting rod or a multi-axis robotic arm, but the present invention is not limited thereto.

In some embodiments, the pick-and-place unit 143 can pick up or place the clamping jig 130 using a mechanical clamping jaw or an adsorption method, but the invention is not limited thereto. Further, the aforementioned adsorption method may further include a magnetic suction method (for example, an electromagnet is used to adsorb a magnetically permeable element provided on the clamping jig 130) and an air suction method (for example, a suction cup or a vacuum is used).

Please refer to FIG. 3, which is a flowchart illustrating a circuit board testing method according to an embodiment of the present invention. The circuit board testing method of this embodiment can be used with the circuit board testing system 100 shown in FIG. 1. The circuit board testing method includes steps S101 to S105.

In step S101, the holding fixture 130 holding the circuit board is placed on the test stage 111 of the testing device 110.

In step S102, the test device 110 is used to test a circuit board placed above the test stage 111.

In step S103, another holding fixture 130 is placed on the buffer stage 120 outside the testing device 110.

In step S104, another circuit board is clamped on another clamping jig 130. In this embodiment, step S104 is performed after step S103, but the invention is not limited thereto. Since the buffer stage 120 is located outside the testing device 110 and is close to the user, the user can easily place another clamping fixture 130. In this embodiment, steps S103 and S104 are performed during the execution of step S102, but the invention is not limited thereto.

In step S105, after the test device 110 tests the circuit board placed above the test stage 111, the placement position of the clamping jig 130 is exchanged.

It can be known from the foregoing structural configuration and step operation that the clamping jig 130 holding a circuit board can be first placed on the test stage 111 in the testing device 110 for testing. During the test of the testing device 110, the user can pre-clamp another circuit board on another holding fixture 130 on the buffer stage 120 outside the testing device 110. Therefore, after the test device 110 completes the test, the placement position of the clamping jig 130 can be quickly exchanged using the pick and place device, so that the testing device 110 can immediately detect another circuit board on another clamping jig 130, This can effectively reduce the test cycle of the circuit board.

Please refer to Figure 4 to Figure 6. FIG. 4 is a perspective view illustrating a circuit board mounting device according to an embodiment of the present invention. Figure 5 shows the clip in Figure 4 A perspective view of the holding fixture 130. FIG. 6 is a perspective view illustrating the unlocking device 160 in FIG. 4. As shown in FIGS. 4 to 6, in this embodiment, the circuit board mounting device includes a clamping jig 130 and an unlocking device 160. The clamping jig 130 includes a first base 131 and four clamping mechanisms 132 (only one is illustrated as an example in FIG. 4). The first base body 131 is a frame body and has four corners. The clamping mechanisms 132 are disposed adjacent to the corners, respectively. The unlocking device 160 includes a second base 161 and four unlocking mechanisms 162 (only one is shown as an example in FIG. 4). The second base 161 is configured to be disposed below the holding fixture 130. Specifically, the first base 131 can be carried on the buffer stage 120, and the second base 161 is disposed below the buffer stage 120. The unlocking mechanisms 162 are fixed on the second base 161 and respectively correspond to the clamping mechanisms 132. In practical applications, the number of the clamping mechanisms 132 included in the clamping fixture 130, the number of corners of the first base 131, and the number of the unlocking mechanisms 162 included in the unlocking device 160 are not limited to this embodiment. The structure and function of the components included in the clamping mechanism 132 and the unlocking mechanism 162 and the connection and seating relationship between the components will be described in detail below.

Please refer to Fig. 7, Fig. 9A, and Fig. 9B. FIG. 7 is a perspective view showing some components of one of the clamping mechanisms 132 in FIG. 5. To be precise, FIG. 7 illustrates the upper right holding mechanism 132 in FIG. 5 as an example. FIG. 9A is a front view illustrating a group of the clamping mechanism 132 and the unlocking mechanism 162 according to an embodiment of the present invention, wherein the unlocking mechanism 162 has not unlocked the clamping mechanism 132. FIG. 9B is a top view showing all the components in 9A. In this embodiment, the clamping mechanisms 132 each include a fixed substrate 132a, a displacement component 132b, a clamping head 132c, a second elastic member 132e (refer to FIG. 9A), and four first elastic members 132f (FIG. 7 is an example only) Sexually draw one). In practical applications, the first bomb The number of the sex pieces 132f is not limited to this embodiment. The fixed substrate 132a is detachably fixed to the first base 131 (refer to FIG. 5 for cooperation). The displacement component 132b is slidably disposed on the fixed substrate 132a along the first direction A1. The clamping head 132c is disposed on the displacement component 132b, and is configured to move toward or away from the displacement component 132b. The first elastic member 132f connects the fixed substrate 132a and the displacement component 132b, and is configured to drive the displacement component 132b to move outward relative to the first base 131 based on the fixed substrate 132a (refer to FIG. 5 for cooperation). The second elastic member 132e connects the displacement component 132b and the clamping head 132c, and is configured to drive the clamping head 132c toward the displacement component 132b.

In detail, in this embodiment, the displacement component 132b includes a first displacement substrate 132b1, a second displacement substrate 132b2, and four third elastic members 132b3 (only one is illustrated as an example in FIG. 7). In practical applications, the number of the third elastic members 132b3 is not limited to this embodiment. The first displacement substrate 132b1 is slidably disposed on the fixed substrate 132a. The first elastic member 132f connects the fixed substrate 132a and the first displacement substrate 132b1. The second displacement substrate 132b2 is slidably disposed on the first displacement substrate 132b1 along the second direction A2. The clamping head 132c is disposed on the second displacement substrate 132b2. The second elastic member 132e connects the second displacement substrate 132b2 and the clamping head 132c. The third elastic member 132b3 connects the first displacement substrate 132b1 and the second displacement substrate 132b2, and is configured to drive the second displacement substrate 132b2 based on the first displacement substrate 132b1 to move outward in the second direction A2 relative to the first base 131 (fitting) (See Figure 5).

Please refer to FIG. 5 in this embodiment. In this embodiment, the first elastic member 132f is configured to move the first displacement substrate 132b1 relative to the fixed substrate 132a substantially away from one of the other clamping mechanisms 132 (that is, away from the first Figure 5 The middle right lower grip mechanism 132 moves). The third elastic member 132b3 is configured to drive the second displacement substrate 132b2 relative to the first displacement substrate 132b1 to move substantially away from the other of the other clamping mechanisms 132 (that is, away from the upper left clamping mechanism 132 in FIG. 5). ).

In this embodiment, the fixed substrate 132a has four guide blocks 132a1 (FIG. 7 only shows one by way of example). The first displacement substrate 132b1 has four guide grooves 132b11 (only one is illustrated as an example in FIG. 7). The guide block 132a1 is slidably engaged in the guide groove 132b11. The first elastic member 132f is connected between the guide block 132a1 and one end of the guide groove 132b11, so as to drive the first displacement substrate 132b1 to move outward relative to the first base 131 along the first direction A1 based on the fixed substrate 132a. . In practical applications, the number of the guide blocks 132a1 and the guide grooves 132b11 is not limited to this embodiment.

In this embodiment, the first displacement substrate 132b1 has four guide blocks 132b12 (FIG. 7 only shows one by way of example). The second displacement substrate 132b2 has four guide grooves 132b22 (only one is illustrated as an example in FIG. 7). The guide block 132b12 is slidably engaged in the guide groove 132b22. The third elastic member 132b3 is connected between the guide block 132b12 and one end of the guide groove 132b22, so as to drive the second displacement substrate 132b2 based on the first displacement substrate 132b1 to move outward along the second direction A2 relative to the first base 131 the goal of. In practical applications, the number of the guide blocks 132b12 and the guide grooves 132b22 is not limited to this embodiment.

Further, the second displacement substrate 132b2 includes a plate body 132b21, a linkage plate 132b23, a fourth elastic member 132b24, a clamping base plate 132b25, and a blocking block 132b26. The plate body 132b21 is slidably disposed on the first Displace on the substrate 132b1. The aforementioned guide groove 132b22 is provided on the plate body 132b21. The third elastic member 132b3 connects the first displacement substrate 132b1 and the plate body 132b21. The interlocking plate 132b23 is slidably disposed on the plate body 132b21 along the first direction A1. The clamping head 132c is provided on the interlocking plate 132b23. The clamping base plate 132b25 is fixed to the plate body 132b21, and is arranged for the clamping head 132c to abut. The clamping mechanism 132 further includes a lifting base plate 132d. The lifting bottom plate 132d passes through the linking plate 132b23 to connect the clamping head 132c, and the second elastic member 132e is compressed between the linking plate 132b23 and the lifting bottom plate 132d, so as to drive the clamping head 132c to clamp toward the clamping bottom plate 132b25. The blocking block 132b26 is fixed on the plate body 132b21. The fourth elastic member 132b24 connects the plate body 132b21 and the link plate 132b23, and is configured to drive the link plate 132b23 to move inward along the first direction A1 relative to the fixed substrate 132a based on the plate body 132b21. Specifically, the fourth elastic member 132b24 is compressed between the blocking block 132b26 and the linking plate 132b23 on the plate body 132b21, so as to drive the linking plate 132b23 away from the blocking block 132b26 and abut against the lifting base plate 132d (refer to FIG. 9A).

Please refer to FIGS. 8, 10A, and 10B. FIG. 8 is a perspective view showing some components of one of the unlocking mechanisms 162 in FIG. 6. To be precise, FIG. 8 illustrates the upper right unlocking mechanism 162 in FIG. 5 as an example. FIG. 10A is a front view illustrating a group of clamping mechanisms 132 and an unlocking mechanism 162 according to an embodiment of the present invention, wherein the unlocking mechanism 162 has unlocked the clamping mechanism 132. FIG. 10B is a top view showing all the components in 10A. In this embodiment, each unlocking device 160 further includes a cylinder module 163. The cylinder module 163 includes a cylinder rod 163a. The unlocking mechanism 162 includes a push-on assembly 162a. The pushing component 162a is provided on the cylinder rod 163a and is configured to push against the corresponding clamping head 132c (borrowed The clamping head 132c) is driven by pushing against the lifting bottom plate 132d, so that the corresponding clamping head 132c leaves the clamping bottom plate 132b25 on the second displacement substrate 132b2 of the corresponding displacement component 132b.

In detail, please refer to FIG. 8, FIG. 9A, and FIG. 10A, and the pushing assembly 162 a includes a moving substrate 162 a 1, a guide rod 162 a 2, a fixing member 162 a 3, and a spring 162 a 4. The moving substrate 162a1 is configured to move toward or away from the corresponding holding head 132c, and has an opposite first surface 162a11 and a second surface 162a12. The guide rod 162a2 slidably passes through the first surface 162a11 and the second surface 162a12, and has a first end 162a21 and a second end 162a22. The first end 162a21 has a larger head and is therefore configured to abut the first surface 162a11. The fixing member 162a3 is connected to the second end 162a22, and is configured to push against the corresponding clamping head 132c (the clamping head 132c is driven by pushing against the lifting base plate 132d). The spring 162a4 is sleeved outside the guide rod 162a2, and is configured to drive the fixing member 162a3 away from the second surface 162a12, so that the first end 162a21 is configured to abut against the first surface 162a11.

As shown in FIG. 8, the unlocking mechanism 162 further includes a first pushing block 162 b and a second pushing block 162 c. The first pushing block 162b and the second pushing block 162c are respectively connected to the moving substrate 162a1 of the pushing member 162a. The first pushing block 162b is configured to push against the corresponding first displacement substrate 132b1, so that the corresponding first displacement substrate 132b1 moves inward along the first direction A1 relative to the first base 131 based on the corresponding fixed substrate 132a (see the reference Figure 10B). The second pushing block 162c is configured to push against the corresponding second displacement substrate 132b2, so that the corresponding second displacement substrate 132b2 moves inward along the second direction A2 relative to the first base 131 based on the corresponding first displacement substrate 132b1 ( (See Figure 10B for cooperation).

As shown in FIG. 8, the unlocking mechanism 162 further includes a third pushing block 162 d. The third pushing block 162d is connected to the moving substrate 162a1 of the pushing element 162a. The third pushing block 162d is configured to push against the corresponding linking plate 132b23, so that the corresponding linking plate 132b23 moves outward in the first direction A1 relative to the first base 131 based on the plate body 132b21 of the corresponding second displacement substrate 132b2 ( (See Figure 5 and Figure 10B for a closer look).

Please refer to FIG. 8, FIG. 9A, and FIG. 10A in cooperation. The fixing member 162 a 3 includes a fixing block 162 a 31 and a roller 162 a 32. The fixing block 162a31 is connected to the second end 162a22. The roller 162a32 is pivotally connected to the fixing block 162a31, and is configured to push against the corresponding clamping head 132c. Thereby, during the period when the roller 162a32 pushes against the lifting base plate 132d, even if the lifting base plate 132d moves along the first direction A1 along with the interlocking plate 132b23, the roller 162a32 can eliminate the frictional force with the lifting base plate 132d.

According to the foregoing structural configuration, when the circuit board is to be mounted, the clamping mechanism 132 can be unlocked by using the unlocking mechanism 162, so that the clamping head 132c leaves the clamping base plate 132b25. Specifically, the cylinder module 163 can drive the cylinder rod 163a to extend toward the clamping mechanism 132, and then drive the pushing-on assembly 162a against the holding head 132c (by pushing against the lifting base plate 132d, the holding head 132c is driven) Leaving the clamping base plate 132b25, driving the first pushing block 162b against the first displacement substrate 132b1 and moving inward relative to the first base 131 in the first direction A1, driving the second pushing block 162c against the second displacement substrate 132b2 moves inward in the second direction A2 relative to the first base 131 and drives the third pushing block 162d to push against the link plate 132b23 to move outward in the first direction A1 relative to the first base 131, so that The clamping mechanism 132 proceeds to the unlocked state shown in FIGS. 10A and 10B. At this time, the user can protrude a part of the circuit board between the clamping head 132c and the clamping base plate 132b25 to wait for clamping.

Then, during the time when the cylinder module 163 drives the cylinder rod 163a to retract to move away from the clamping mechanism 132, the pushing module 162a, the first pushing block 162b, the second pushing block 162c, and the third pushing block 162d are performed. With proper length design, the third pushing block 162d can be disengaged from the linkage plate 132b23, and then the pushing assembly 162a can be disengaged from the lifting bottom plate 132d, and the clamping head 132c can be clamped to the clamping bottom plate 132b25. The abutting block 162b and the second pushing block 162c are separated from the first displacement substrate 132b1 and the second displacement substrate 132b2, respectively, so that the clamping mechanism 132 can be moved to the clamping state shown in FIGS. 9A and 9B.

In detail, while the cylinder module 163 drives the cylinder rod 163a to retract to move away from the clamping mechanism 132, the third pushing block 162d will first disengage from the link plate 132b23, so that the link plate 132b23 moves along the first relative to the first base 131 The direction A1 moves inward, so that the clamping head 132c is moved closer to the center of the first base 131. Since the spring 162a4 provided between the moving base plate 162a1 and the fixing member 162a3 can continuously push the roller 162a32 against the lifting base plate 132d, the time for lowering the clamping head 132c can be further delayed until the third pushing block 162d leaves the linkage plate 132b23 . After the clamping head 132c is lowered to clamp the circuit board to the clamping bottom plate 132b25, the continuously lowered cylinder rod 163a will cause the first pushing block 162b and the second pushing block 162c to separate from the first displacement substrate 132b1 and the second The displacement substrate 132b2 causes the first displacement substrate 132b1 and the second displacement substrate 132b2 to move outward relative to the first base 131. At this time, the holding head 132c holding the circuit board also moves outward relative to the first base body 131, so that the circuit board can be spread apart, thereby ensuring that the circuit board is kept in a flat state, and the test accuracy can be improved. Certainly.

Moreover, it can be known from the foregoing embodiments that the circuit board installation device completes the installation and unlocking of the circuit board in a purely mechanical manner, so that complicated wiring can be omitted, and it is suitable to cooperate with the circuit board test system 100 and the circuit board test method of the foregoing embodiment. use.

In some embodiments, the clamping mechanism 132 may omit the aforementioned displacement component 132b, and the corresponding unlocking mechanism 162 may omit the first pushing block 162b and the second pushing block 162c, and generally perform the operation according to the principle of the previous embodiment Unlocking and clamping procedures. Such a clamping mechanism 132 does not actively support the circuit board during the process of clamping the circuit board, for example, the lower left clamping mechanism 132 in FIG. 5. Other details of the clamping mechanism 132 and the corresponding unlocking mechanism 162 will not be detailed here.

In some embodiments, the clamping mechanism 132 may integrate the first displacement substrate 132b1 and the second displacement substrate 132b2 in the displacement component 132b into a single displacement substrate, and the corresponding unlocking mechanism 162 may omit the second pushing block 162c, and the unlocking and clamping process is generally performed according to the principles of the foregoing embodiments. Such a clamping mechanism 132 will only open the circuit board in one direction during the process of clamping the circuit board. For example, the upper left clamping mechanism 132 in FIG. 5 will open the circuit board in the first direction A1. The lower right clamping mechanism 132 in FIG. 5 extends the circuit board along the second direction A2. Other details of the clamping mechanism 132 and the corresponding unlocking mechanism 162 will not be detailed here.

From the above detailed description of the specific embodiments of the present invention, it can be clearly seen that according to the circuit board testing system and the circuit board testing method of the present invention, a clamping jig holding a circuit board can be placed in a testing device first. Test Test on the stage. During the test of the test device, the user can pre-clamp another circuit board on another clamping fixture on a buffer stage outside the test device. Therefore, after the test device completes the test, the pick-and-place device can be used to quickly exchange the placement position of the clamping fixture, so that the test device can immediately continue to detect the next circuit board, thereby effectively reducing the test cycle of the circuit board. In addition, according to the clamping jig of the circuit board mounting device of the present invention, after the clamping head abuts toward the displacement component to clamp the circuit board, the displacement component is driven by the elastic member to face outward from the first base body based on the fixed substrate. Move to extend the circuit board outward to ensure that the circuit board remains flat, which can improve test accuracy. According to the unlocking device of the circuit board mounting device of the present invention, the circuit board can be restored to an unopened state by using the pushing block to push against the displacement component, and the pushing component can be used to push the clamping head away from the displacement component to release the circuit board. . It can be known from this that the circuit board installation device of the present invention completes the installation and unlocking of the circuit board in a purely mechanical manner, so that complicated wiring can be omitted, and is suitable for use with the circuit board test system and the circuit board test method of the present invention.

Although the present invention has been disclosed in the above embodiments, it is not intended to limit the present invention. Any person skilled in the art can make various modifications and retouches without departing from the spirit and scope of the present invention. Therefore, the protection of the present invention The scope shall be determined by the scope of the attached patent application.

100‧‧‧Circuit board test system

110‧‧‧test device

111‧‧‧test stage

120‧‧‧ buffer stage

130‧‧‧Clamping fixture

140‧‧‧Put module

141‧‧‧ track

142‧‧‧moving parts

143‧‧‧Pick and place unit

160‧‧‧Unlocking device

Claims (13)

A circuit board mounting device includes a clamping jig, the clamping jig includes: a first base body; and a plurality of clamping mechanisms, each including: a fixed substrate, detachably fixed to the first base body A displacement component slidably disposed on the fixed substrate along a first direction; a clamping head disposed on the displacement component and configured to move toward or away from the displacement component; at least one first elasticity Component, which connects the fixed substrate and the displacement component, and is configured to drive the displacement component to move outward relative to the first base body based on the fixed substrate; and at least one second elastic component, which connects the displacement component and the clamping head, And configured to drive the clamping head against the displacement component. The circuit board mounting device according to claim 1, wherein the first base body is a frame body and has a plurality of corners, and the clamping mechanisms are respectively disposed adjacent to the corners. The circuit board mounting device according to claim 1, wherein the displacement component comprises: a first displacement substrate slidably disposed on the fixed substrate, wherein the first elastic member connects the fixed substrate to the first Displacement substrate; a second displacement substrate slidably disposed on the first displacement substrate along a second direction; A displacement substrate, wherein the clamping head is disposed on the second displacement substrate, and the second elastic member is connected to the second displacement substrate and the clamping head; and at least one third elastic member is connected to the first displacement. The substrate and the second displacement substrate are configured to drive the second displacement substrate to move outward relative to the first base body based on the first displacement substrate. The circuit board mounting device according to item 3 of the claim, further comprising an unlocking device, the unlocking device comprising: a second base body configured to be disposed below the clamping jig; and a plurality of unlocking mechanisms fixed to The second base body is respectively corresponding to the clamping mechanisms, and each of the unlocking mechanisms includes: a pushing component configured to push against the corresponding clamping head, so that the corresponding clamping head leaves the corresponding The displacement component; a first pushing block configured to push against the corresponding first displacement substrate, so that the corresponding first displacement substrate moves inward relative to the first base body based on the corresponding fixed substrate; and a first The two pushing blocks are configured to push against the corresponding second displacement substrate, so that the corresponding second displacement substrate moves inward relative to the first base body based on the corresponding first displacement substrate. The circuit board mounting device according to claim 3, wherein the first elastic member is configured so that the first displacement substrate moves substantially away from one of the other clamping mechanisms relative to the fixed substrate, and the The third elastic member is configured to substantially move the second displacement substrate relative to the first displacement substrate away from the other one of the other clamping mechanisms. The circuit board mounting device according to claim 3, wherein the fixed substrate has at least one guide block, the first displacement substrate has at least one guide slot, and the guide block is slidably engaged with the guide slot. Inside, and the first elastic member is connected between the guide block and one end of the guide groove. The circuit board mounting device according to claim 3, wherein the first displacement substrate has at least one guide block, the second displacement substrate has at least one guide slot, and the guide block is slidably engaged with the guide block. Inside the guide groove, and the third elastic member is connected between the guide block and one end of the guide groove. The circuit board mounting device according to claim 3, wherein the second displacement substrate includes: a board body slidably disposed on the first displacement substrate, and the third elastic member is connected to the first displacement substrate And the plate body; a linkage plate is slidably disposed on the plate body along the first direction, wherein the clamping head is provided on the linkage plate; and a fourth elastic member connects the plate body and the The interlocking plate is configured to drive the interlocking plate to move inward relative to the fixed substrate based on the plate body. The circuit board mounting device according to item 8 of the claim, further comprising an unlocking device, the unlocking device comprising: a second base body configured to be disposed below the clamping jig; and a plurality of unlocking mechanisms fixed to The second base body is respectively corresponding to the clamping mechanisms, and each of the unlocking mechanisms includes: A pusher component configured to push the corresponding clamping head, so that the corresponding clamping head leaves the corresponding displacement component; a first pusher block configured to push the corresponding displacement substrate, so that The corresponding first displacement substrate moves inward relative to the first base based on the corresponding fixed substrate; a second pushing block is configured to push against the corresponding second displacement substrate, so that the corresponding second displacement substrate Based on the corresponding first displacement substrate moving inward relative to the first base; and a third pushing block configured to push against the corresponding link plate, so that the corresponding link plate is relative to the base based on the corresponding plate body The first body moves outward. The circuit board mounting device according to item 1 of the claim, further comprising an unlocking device, the unlocking device comprising: a second base body configured to be disposed below the clamping jig; and a plurality of unlocking mechanisms fixed to The second base body is respectively corresponding to the clamping mechanisms, and each of the unlocking mechanisms includes a pushing component configured to push against the corresponding clamping head, so that the corresponding clamping head leaves the corresponding one. Displacement component. The circuit board mounting device according to claim 10, wherein the pushing assembly includes: a moving substrate configured to move toward or away from the corresponding clamping head, and having a first surface opposite to the second surface and a second surface Surface; a guide rod slidably penetrating the first surface and the second surface, and There is a first end and a second end, the first end is configured to abut the first surface; a fixing member is connected to the second end, and is configured to push against the corresponding clamping head; and a spring and a sleeve It is arranged outside the guide rod and configured to drive the fixing member away from the second surface, so that the first end is configured to abut against the first surface. The circuit board mounting device according to claim 11, wherein the fixing member includes: a fixing block connected to the second end; and a roller pivotally connected to the fixing block and configured to push against the corresponding clamping head. The circuit board mounting device according to claim 10, wherein each of the unlocking devices further includes a cylinder module, the cylinder module has a cylinder rod, and the pushing component is disposed on the cylinder rod.