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TWI607197B - Method of manufacturing heat dissipation device - Google Patents

Method of manufacturing heat dissipation device Download PDF

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Publication number
TWI607197B
TWI607197B TW104108742A TW104108742A TWI607197B TW I607197 B TWI607197 B TW I607197B TW 104108742 A TW104108742 A TW 104108742A TW 104108742 A TW104108742 A TW 104108742A TW I607197 B TWI607197 B TW I607197B
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transfer unit
heat transfer
frame
heat
manufacturing
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TW104108742A
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Chinese (zh)
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TW201634892A (en
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楊修維
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奇鋐科技股份有限公司
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Description

散熱裝置製造方法 Heat sink manufacturing method

本發明係有關於一種散熱裝置,尤指一種可減少製程步驟與降低製造成本之散熱裝置製造方法。 The invention relates to a heat dissipating device, in particular to a heat dissipating device manufacturing method which can reduce the manufacturing steps and reduce the manufacturing cost.

由於現行手持式行動裝置(如手機、平板電腦、PDA)隨著科技進步,在使用者其傾愛輕薄與運算及效能越來越高之要求下,導致手持式行動裝置的內部元件,例如中央處理器、積體電路等元件,運作時因裝置或機構內空間極為有限(因輕薄的要求)與執行或運算速度太快下皆會產生極高熱量,因此必須首要先將元件的熱量散去,方才能維持元件的運作效率及使用壽命。 As current handheld mobile devices (such as mobile phones, tablets, and PDAs) advance with technology, internal components of handheld mobile devices, such as the central government, are required to be thinner and more computationally intensive and more efficient. Processors, integrated circuits and other components, because of the extremely limited space in the device or mechanism (due to thin and light requirements) and the speed of execution or operation are too high, so the heat of the components must be dissipated first. In order to maintain the operational efficiency and service life of the components.

而目前具有散熱結構的手持式行動裝置,係包含一殼體、中框、一發熱元件及金屬材質或複合材料所構成的一導熱件,該發熱元件(如中央處理器或積體電路或其他電子構件)係容設在該殼體之容腔內及貼附於所述中框上,而其導熱件係與所述中框對應接合,其對接方式可區分有二,其一方式為利用膠材(Epoxy,環氧樹脂)或膠帶將其導熱件固定於所述中框上,但其需要另外耗費塗膠材或使用膠帶之材料成本。 The hand-held mobile device having a heat dissipating structure currently comprises a heat insulating component composed of a casing, a middle frame, a heating element and a metal material or a composite material, such as a central processing unit or an integrated circuit or the like. The electronic component is disposed in the cavity of the casing and attached to the middle frame, and the heat conducting component is correspondingly engaged with the middle frame, and the manner of docking can be divided into two, one way is to utilize Epoxy (epoxy) or tape fixes its heat-conducting member to the middle frame, but it requires additional material cost for the glue or tape.

又或在導熱件與中框對接方式上也可利用錫焊接(Soldering)的技術來進行組接固定,一般錫焊接(Soldering)是一種利用金屬焊料加熱熔化後,滲入並充填金屬件連接處間隙的焊接方法,而焊接材料(Solder)通常使用錫 基合金,在錫焊接時不需熔化金屬工件,但在焊接過程中,需要再連結的部份加熱,而焊料熱融後流到導熱件與中框接合處使之結合,但此技術方式其導熱件與中框需經過高溫接觸,其容易造成彼此位置相互的偏移,更且其導熱件與中框間之焊接材料也會使導熱件與中框和發熱元件間的累積公差會增加,導致組裝上之困難。 Or in the way of the heat-conducting member and the middle frame, the soldering technology can also be used for the assembly and fixing. Generally, the soldering is a kind of soldering, which is melted by metal solder, and penetrates and fills the joint of the metal parts. Welding method, while solder material (Solder) usually uses tin The base alloy does not need to melt the metal workpiece during soldering, but during the soldering process, the reconnected portion needs to be heated, and the solder is melted and then flows to the joint between the heat conducting member and the middle frame to be combined, but the technical method thereof The heat conducting member and the middle frame are subjected to high temperature contact, which easily cause mutual displacement of each other, and the welding material between the heat conducting member and the middle frame also increases the cumulative tolerance between the heat conducting member and the middle frame and the heating element. Causes difficulties in assembly.

又或如習知技術中華民國專利證書號M484134一案揭示一種其散熱裝置包括一導熱板及一熱管,所述導熱板具有一鏤空槽及形成在鏤空槽內的一內壁,內壁的表面呈一C字狀弧面;熱管迫緊式嵌入鏤空槽並被C字狀弧面所卡掣定位,其中所述導熱板之內壁需先加工成C字狀弧面,再將其熱管外壁以C字狀之形體且以壓扁方式嵌入鏤空槽,使其熱管迫緊式嵌入鏤空槽並被C字狀弧面所卡掣定位,因此,其散熱裝置於製造上需增加製程成本,且其散熱裝置僅能使用熱管為其導熱件,一般無C字狀外壁之導熱件或無法被形變塑形之導熱件則就無法使用,造成在使用上實為不便與困擾。 Or, as in the prior art, the Chinese Patent No. M484134 discloses a heat dissipating device comprising a heat conducting plate and a heat pipe, the heat conducting plate having a hollow groove and an inner wall formed in the hollow groove, the surface of the inner wall The C-shaped arc surface is formed; the heat pipe is tightly embedded in the hollow groove and is positioned by the C-shaped arc surface, wherein the inner wall of the heat-conducting plate is first processed into a C-shaped arc surface, and then the outer wall of the heat pipe is The C-shaped body is embedded in the hollow groove in a flattened manner, so that the heat pipe is tightly embedded in the hollow groove and is positioned by the C-shaped curved surface. Therefore, the heat dissipation device needs to increase the manufacturing cost in manufacturing. The heat dissipating device can only use the heat pipe as its heat conducting member, and the heat conducting member without the C-shaped outer wall or the heat conducting member which cannot be deformed and shaped can not be used, which is inconvenient and troublesome in use.

是以,要如何解決上述習用之問題與缺失,即為本案之發明人與從事此行業之相關廠商所亟欲研究改善之方向所在者。 Therefore, how to solve the above problems and problems in the past, that is, the inventors of this case and the relevant manufacturers engaged in this industry are eager to study the direction of improvement.

爰此,為有效解決上述之問題,本發明之主要目的在提供一種可減少製程步驟與降低製造成本之散熱裝置製造方法。 Accordingly, in order to effectively solve the above problems, the main object of the present invention is to provide a heat sink manufacturing method which can reduce the number of manufacturing steps and reduce the manufacturing cost.

本發明之另一目的係在提供一種可提高熱傳單元使用相容性之散熱裝置製造方法。 Another object of the present invention is to provide a heat sink manufacturing method which can improve the compatibility of use of a heat transfer unit.

本發明之另一目的係在提供一種可避免造成組裝公差之散熱裝置製造方法。 Another object of the present invention is to provide a method of manufacturing a heat sink that avoids assembly tolerances.

為達上述目的,本發明係提供一種散熱裝置製造方法,首先提供至少一熱傳單元,所述熱傳單元具有一腔室,該腔室內設有至少一毛細結構及該腔室內填充有一工作流體;另提供至少一框架與所述熱傳單元對接;再將該熱傳單元與所述框架交接處施以點焊方式連接,使其熱傳單元固定於框架上;透過本發明此方法的設計,可有效減少熱傳單元與框架組接之步驟與減去需耗費塗膠材或使用膠帶之材料成本與製程成本,且同時可避免因為透過焊接材料所造成之組裝公差問題。 To achieve the above object, the present invention provides a heat sink manufacturing method, firstly providing at least one heat transfer unit, the heat transfer unit having a chamber having at least one capillary structure and a working fluid filled in the chamber Providing at least one frame to interface with the heat transfer unit; and then connecting the heat transfer unit to the frame intersection in a spot welding manner to fix the heat transfer unit to the frame; and designing the method by the method of the present invention The utility model can effectively reduce the steps of connecting the heat transfer unit and the frame and reduce the material cost and process cost of the adhesive material or the use of the adhesive tape, and at the same time avoid the assembly tolerance problem caused by the welding material.

1‧‧‧熱傳單元 1‧‧‧heat transfer unit

11‧‧‧腔室 11‧‧‧ chamber

12‧‧‧無效端 12‧‧‧Invalid end

13‧‧‧毛細結構 13‧‧‧Capillary structure

14‧‧‧工作流體 14‧‧‧Working fluid

2‧‧‧框架 2‧‧‧Frame

21‧‧‧第一側 21‧‧‧ first side

22‧‧‧第二側 22‧‧‧ second side

23‧‧‧嵌槽 23‧‧‧Inlay

24‧‧‧內壁 24‧‧‧ inner wall

第1圖係為本發明之散熱裝置製造方法之第一實施例之步驟流程圖;第2A圖係為本發明之散熱裝置製造方法之第一實施例之實施示意圖;第2B圖係為本發明之散熱裝置製造方法之第一實施例之組合剖視示意圖;第3A圖係為本發明之散熱裝置製造方法之第二實施例之實施示意圖;第3B圖係為本發明之散熱裝置製造方法之第二實施例之組合剖視示意圖;第4A圖係為本發明之散熱裝置製造方法之第三實施例之分解實施示意圖;第4B圖係為本發明之散熱裝置製造方法之第三實施例之組合實施示意圖;第4C圖係為本發明之散熱裝置製造方法之第三實施例之組合剖視示意圖;第5A圖係為本發明之散熱裝置製造方法之第四實施例之分解實施示意圖;第5B圖係為本發明之散熱裝置製造方法之第四實施例之組合剖視示意圖;第6A圖係為本發明之散熱裝置製造方法之第五實施例之組合剖視示意圖;第6B圖係為本發明之散熱裝置製造方法之第六實施例之組合實施示意圖;第7圖係為本發明之散熱裝置製造方法之第七實施例之實施示意圖。 1 is a flow chart of a first embodiment of a method for manufacturing a heat sink according to the present invention; FIG. 2A is a schematic view showing a first embodiment of a method for manufacturing a heat sink according to the present invention; A schematic cross-sectional view of a first embodiment of a heat sink manufacturing method; FIG. 3A is a schematic view of a second embodiment of a heat sink manufacturing method of the present invention; and FIG. 3B is a heat sink manufacturing method of the present invention. 2 is a schematic exploded view of a third embodiment of the heat sink manufacturing method of the present invention; and FIG. 4B is a third embodiment of the heat sink manufacturing method of the present invention. FIG. 4C is a schematic cross-sectional view showing a third embodiment of the heat dissipation device manufacturing method of the present invention; FIG. 5A is a schematic exploded view of the fourth embodiment of the heat dissipation device manufacturing method of the present invention; 5B is a schematic cross-sectional view showing a fourth embodiment of the heat sink manufacturing method of the present invention; FIG. 6A is a fifth embodiment of the heat sink manufacturing method of the present invention. A combination cross-sectional view; FIG. 6B based on a combination of the sixth embodiment of the method of the present invention for manufacturing the heat sink schematic embodiment; seventh embodiment schematic view of the method for manufacturing the heat sink of the present invention showing a first embodiment of the system 7.

本發明之上述目的及其結構與功能上的特性,將依據所附圖式之較佳實施例予以說明。 The above object of the present invention, as well as its structural and functional features, will be described in accordance with the preferred embodiments of the drawings.

請分別參閱第1圖及第2A圖及第2B圖所示,係為本發明之散熱裝置製造方法之第一實施例之步驟流程圖及實施示意圖及組合剖視示意圖,所述散熱裝置製造方法,係包含下列步驟: Please refer to FIG. 1 and FIG. 2A and FIG. 2B respectively, which are a flow chart, an implementation schematic diagram and a combined cross-sectional view of a first embodiment of a heat dissipation device manufacturing method according to the present invention, and the heat dissipation device manufacturing method. , which consists of the following steps:

(100)提供至少一熱傳單元,所述熱傳單元具有一腔室,該腔室內設有至少一毛細結構及該腔室內填充有一工作流體;提供一成品為扁平熱管之熱傳單元1,該熱傳單元1內具有一腔室11,且該熱傳單元1兩端分別具有一封閉所述腔室11之一無效端12,並該腔室11內形成有至少一毛細結構13,該毛細結構13於該較佳實施例係以燒結粉末體做說明,但並不侷限於此,於具體實施時,亦可選擇為溝槽或金屬網或纖維網,且該腔室11內填充有一工作流體14(如純水、純水、無機化合物、醇類、酮類、液態金屬、冷煤或有機化合物);另其中該熱傳單元1內的毛細結構13與相對該兩端之封閉端之間分別界定有所述無效端12,而其無效端12位置處則無設置有所述毛細結構13,其用以便利於工作流體14填充至腔室11內,所以熱傳單元1之無效端12此部位是無法進行導熱的。 (100) providing at least one heat transfer unit, the heat transfer unit having a chamber having at least one capillary structure and a working fluid filled in the chamber; and a heat transfer unit 1 provided as a flat heat pipe The heat transfer unit 1 has a chamber 11 therein, and each end of the heat transfer unit 1 has an invalid end 12 for closing the chamber 11, and at least one capillary structure 13 is formed in the chamber 11. The capillary structure 13 is described in the preferred embodiment as a sintered powder body, but is not limited thereto. In a specific implementation, a groove or a metal mesh or a fiber mesh may be selected, and the chamber 11 is filled with a cavity. Working fluid 14 (such as pure water, pure water, inorganic compounds, alcohols, ketones, liquid metals, cold coal or organic compounds); in addition, the capillary structure 13 in the heat transfer unit 1 and the closed end opposite to the ends The ineffective end 12 is defined between each other, and the capillary structure 13 is not disposed at the position of the inactive end 12 for facilitating the filling of the working fluid 14 into the chamber 11, so that the inactive end of the heat transfer unit 1 is 12 This part is not heat conductive.

(101)另提供至少一框架與所述熱傳單元對接;前述熱傳單元1兩端於封閉端處分別為所述無效端12,於該較佳實施例之無效端12係為該熱傳單元1上無法進行導熱之部位,而其中所述框架2於本實施例中係可為防電磁波材質,而其防電磁波材質係包括金屬,又其框架2具有一第一側21及一相反該第一側21之第二側22,其中該第一側21於本實施例中係以平面方式呈現,而其熱傳單元1係設置於所述第一側21上且貼附所述第一側21。 (101) Further providing at least one frame to interface with the heat transfer unit; the two ends of the heat transfer unit 1 are respectively the inactive end 12 at the closed end, and the invalid end 12 of the preferred embodiment is the hot leaflet In the embodiment, the heat-conducting portion is not available, and the frame 2 is an electromagnetic wave-proof material in the embodiment, and the electromagnetic wave-proof material includes a metal, and the frame 2 has a first side 21 and an opposite The second side 22 of the first side 21, wherein the first side 21 is presented in a planar manner in the present embodiment, and the heat transfer unit 1 is disposed on the first side 21 and attached to the first side Side 21.

(102)將該熱傳單元與所述框架交接處施以點焊方式連接,使其熱 傳單元固定於框架上。 (102) applying a spot welding manner to the heat transfer unit and the frame intersection to make it hot The transmission unit is fixed to the frame.

其中所述將該為扁平熱管之熱傳單元1設置所述框架2之第一側21上後,其熱傳單元1係貼附所述第一側21且與所述第一側21間具有至少一交接處,而後將該熱傳單元1與所述框架2交接處施以點焊方式連接,其中所述點焊方式焊接係為電阻焊、超音波焊接或雷射點焊其中任一者,且其熱傳單元1係以端緣位置處之無效端12與所述框架2點焊連接,使其熱傳單元1固定於框架2上;藉此,所述熱傳單元1利用點焊方式連接且固定於所述框架2上,可有效減少熱傳單元1與框架2組接之步驟與減去需耗費塗膠材或使用膠帶之材料成本與製程成本,進而達到減少製程步驟與降低製造成本之功效者,且同時可避免因為透過焊接材料所造成之組裝公差問題。 After the heat transfer unit 1 which is the flat heat pipe is disposed on the first side 21 of the frame 2, the heat transfer unit 1 is attached to the first side 21 and has a space between the first side 21 and the first side 21 At least one intersection, and then the spot connection of the heat transfer unit 1 and the frame 2 is spot welded, wherein the spot welding method is any one of electric resistance welding, ultrasonic welding or laser spot welding And the heat transfer unit 1 is spot-welded to the frame 2 at the ineffective end 12 at the edge position, so that the heat transfer unit 1 is fixed to the frame 2; thereby, the heat transfer unit 1 utilizes spot welding The method is connected and fixed on the frame 2, which can effectively reduce the steps of assembling the heat transfer unit 1 and the frame 2 and reduce the material cost and process cost of the adhesive material or the use of the adhesive tape, thereby reducing the process steps and reducing the process steps. The cost of manufacturing is effective, and at the same time avoids the assembly tolerance problem caused by the welding material.

再請參閱第3A圖及第3B圖所示,係為本發明之散熱裝置製造方法之第二實施例之實施示意圖及組合剖視示意圖,本實施例部分結構係與前述第一實施例相同,故在此將不再贅述,惟本實施例與前述第一實施例之不同處係為所述熱傳單元1係為提供一成品為板式熱管或均溫板,其板式熱管外側封邊係為無效端12,於具體實施時,將該為板式熱管之熱傳單元1設置所述框架2之第一側21上後,其熱傳單元1係貼附所述第一側21且與所述第一側21間具有所述交接處,而後將該熱傳單元1與所述框架2交接處施以點焊方式連接,其中所述點焊方式焊接係為電阻焊、超音波焊接或雷射點焊其中任一者,且其熱傳單元1係以端緣位置處之無效端12與所述框架2點焊連接,使其熱傳單元1固定於框架2上;藉此,所述熱傳單元1利用點焊方式連接且固定於所述框架2上,可有效減少熱傳單元1與框架2組接之步驟與減去需耗費塗膠材或使用膠帶之材料成本與製程成本,進而達到減少製程步驟與降低製造成本之功效者,且同時可避免因為透過焊接材料所造成之組裝公差問題。 FIG. 3A and FIG. 3B are schematic diagrams showing a second embodiment of the method for manufacturing a heat sink according to the present invention, and a schematic cross-sectional view of the second embodiment. The partial structure of the embodiment is the same as that of the first embodiment. Therefore, the difference between this embodiment and the foregoing first embodiment is that the heat transfer unit 1 is provided with a finished plate heat pipe or a temperature equalizing plate, and the outer side of the plate heat pipe is The inactive end 12, in a specific implementation, after the heat transfer unit 1 of the plate heat pipe is disposed on the first side 21 of the frame 2, the heat transfer unit 1 is attached to the first side 21 and The first side 21 has the intersection, and then the heat transfer unit 1 is connected to the frame 2 by spot welding, wherein the spot welding is welding, ultrasonic welding or laser welding. Spot welding any one of them, and the heat transfer unit 1 is spot welded to the frame 2 at the ineffective end 12 at the end edge position, so that the heat transfer unit 1 is fixed to the frame 2; thereby, the heat is The transfer unit 1 is connected and fixed to the frame 2 by spot welding, which can effectively reduce heat The steps of unit 1 and frame 2 are combined with the cost of material and process cost of the adhesive or the use of tape, thereby reducing the process steps and reducing the manufacturing cost, and at the same time avoiding the transmission of the material. Assembly tolerance issues.

再請參閱第4A圖及第4B圖及4C圖所示,係為本發明之散熱裝置製造方法之第三實施例之分解示意圖及實施示意圖及組合剖視示意圖,本實施例部分結構係與前述第一實施例相同,故在此將不再贅述,惟本實施例與前述第一實施例之不同處為所述框架2另形成有一嵌槽23,所述嵌槽23貫穿所述第一側21及第二側22,且其框架2於嵌槽23位置處具有一內壁24,所述內壁24與第一側21及第二側22相互垂直,而其熱傳單元1係設置於所述框架2之嵌槽23內,且將該框架2與熱傳單元1交接處施以焊接,使其熱傳單元1固定於所述嵌槽23內,而後將該熱傳單元1與所述框架2交接處施以點焊方式連接,其中所述點焊方式焊接係為電阻焊、超音波焊接或雷射點焊其中任一者,且其熱傳單元1係以端緣位置處之無效端12與所述框架2點焊連接,使其熱傳單元1固定於框架2上;藉此,所述熱傳單元1利用點焊方式連接且固定於所述框架2上,可有效減少熱傳單元1與框架2組接之步驟與減去需耗費塗膠材或使用膠帶之材料成本與製程成本,進而達到減少製程步驟與降低製造成本之功效者,且同時可避免因為透過焊接材料所造成之組裝公差問題。 Referring to FIG. 4A and FIG. 4B and FIG. 4C , FIG. 4 is an exploded perspective view, a schematic view of the implementation, and a schematic cross-sectional view of the third embodiment of the heat dissipation device manufacturing method of the present invention. The first embodiment is the same, so it will not be described here. However, the difference between the embodiment and the first embodiment is that the frame 2 is further formed with a recess 23, and the slot 23 extends through the first side. 21 and the second side 22, and the frame 2 has an inner wall 24 at the position of the slot 23, the inner wall 24 is perpendicular to the first side 21 and the second side 22, and the heat transfer unit 1 is disposed on The frame 2 is embedded in the groove 23, and the frame 2 is welded to the heat transfer unit 1 to be welded, so that the heat transfer unit 1 is fixed in the groove 23, and then the heat transfer unit 1 is The joint of the frame 2 is welded by spot welding, wherein the spot welding method is any one of electric resistance welding, ultrasonic welding or laser spot welding, and the heat transfer unit 1 is at the edge position. The inactive end 12 is spot welded to the frame 2 such that the heat transfer unit 1 is fixed to the frame 2; thereby, the heat transfer The unit 1 is connected and fixed on the frame 2 by spot welding, which can effectively reduce the steps of assembling the heat transfer unit 1 and the frame 2 and reduce the material cost and process cost of the adhesive material or the use of the tape, thereby achieving Reduce the efficiency of the manufacturing process and reduce the manufacturing cost, and at the same time avoid the assembly tolerance caused by the welding material.

再請參閱第5A及5B圖所示,係為本發明之散熱裝置製造方法之第四實施例之分解實施示意圖及組合剖視示意圖,本實施例部分結構係與前述第一實施例相同,故在此將不再贅述,惟本實施例與前述第一實施例之不同處為所述框架2另形成有一嵌槽23,所述嵌槽23不貫穿所述第一側21及第二側22,且其框架2於嵌槽23位置處具有一內壁24,所述內壁24與第一側21及第二側22相互垂直,而其熱傳單元1係設置於所述框架2之嵌槽23內,且將該框架2與熱傳單元1交接處施以焊接,使其熱傳單元1固定於所述嵌槽23內,而後將該熱傳單元1與所述框架2交接處施以點焊方式連接,其中所述點焊方式焊接係為電阻焊、超音波焊接或雷射點焊其中任一者,且其熱傳 單元1係以端緣位置處之無效端12與所述框架2點焊連接,使其熱傳單元1固定於框架2上;藉此,所述熱傳單元1利用點焊方式連接且固定於所述框架2上,可有效減少熱傳單元1與框架2組接之步驟與減去需耗費塗膠材或使用膠帶之材料成本與製程成本,進而達到減少製程步驟與降低製造成本之功效者,且同時可避免因為透過焊接材料所造成之組裝公差問題。 5A and 5B are schematic views of a disassembled embodiment and a cross-sectional view of a fourth embodiment of the method for manufacturing a heat sink according to the present invention. The partial structure of the present embodiment is the same as that of the first embodiment. It will not be described again here, but the difference between this embodiment and the foregoing first embodiment is that the frame 2 is further formed with a recess 23, and the recess 23 does not penetrate the first side 21 and the second side 22 And the frame 2 has an inner wall 24 at the position of the slot 23, the inner wall 24 is perpendicular to the first side 21 and the second side 22, and the heat transfer unit 1 is disposed on the frame 2 In the groove 23, the frame 2 and the heat transfer unit 1 are welded to each other to fix the heat transfer unit 1 in the recess 23, and then the heat transfer unit 1 and the frame 2 are handed over. Connected by spot welding, wherein the spot welding method is any one of electric resistance welding, ultrasonic welding or laser spot welding, and the heat transfer thereof The unit 1 is spot-welded to the frame 2 by the ineffective end 12 at the end edge position, so that the heat transfer unit 1 is fixed to the frame 2; thereby, the heat transfer unit 1 is connected and fixed by spot welding. The frame 2 can effectively reduce the steps of assembling the heat transfer unit 1 and the frame 2 and reduce the material cost and process cost of the adhesive material or the adhesive tape, thereby reducing the process steps and reducing the manufacturing cost. At the same time, the assembly tolerance problem caused by the welding material can be avoided.

再請參閱第6A圖及6B圖所示,係為本發明之散熱裝置製造方法之第五及第六實施例之組合剖視示意圖及組合實施示意圖,本實施例部分結構係與前述第一實施例相同,故在此將不再贅述,惟本實施例與前述第一實施例之不同處為所述熱傳單元1係為扁平熱管及板式熱管同時設置於所述框架2之第一側21上或分別設置於所述框架2之第一側21及第二側22,於本實施例中,其中所述為扁平熱管之熱傳單元1設置於所述第一側21且與所述第一側21間具有所述交接處,而後將該熱傳單元1與所述框架2交接處施以點焊方式連接,再將其為板式熱管之熱傳單元1設置於所述第一側21或第二側22,使其熱傳單元1與第一側21或第二側22間具有所述交接處,而後將該熱傳單元1與所述框架2交接處施以點焊方式連接,其中所述點焊方式焊接係為電阻焊、超音波焊接或雷射點焊其中任一者,且其熱傳單元1係以端緣位置處之無效端12與所述框架2點焊連接,使其熱傳單元1固定於框架2上,進而達到減少製程步驟與降低製造成本之功效者,且同時可避免因為透過焊接材料所造成之組裝公差問題。 6A and 6B are schematic cross-sectional schematic views and a combined implementation diagram of the fifth and sixth embodiments of the heat dissipation device manufacturing method of the present invention, and the partial structure of the present embodiment and the first implementation described above. The example is the same, so it will not be described here. However, the difference between the embodiment and the first embodiment is that the heat transfer unit 1 is a flat heat pipe and a plate heat pipe are disposed on the first side 21 of the frame 2 at the same time. The first side 21 and the second side 22 of the frame 2 are respectively disposed on the first side 21 and the second side 22 of the frame 2, wherein in the embodiment, the heat transfer unit 1 which is a flat heat pipe is disposed on the first side 21 and The side 21 has the intersection, and then the junction of the heat transfer unit 1 and the frame 2 is spot welded, and the heat transfer unit 1 which is a plate heat pipe is disposed on the first side 21 Or the second side 22, such that the heat transfer unit 1 and the first side 21 or the second side 22 have the intersection, and then the heat transfer unit 1 and the frame 2 are placed in a spot welding manner. The spot welding method is any one of electric resistance welding, ultrasonic welding or laser spot welding. And the heat transfer unit 1 is spot-welded to the frame 2 by the ineffective end 12 at the edge position, so that the heat transfer unit 1 is fixed on the frame 2, thereby achieving the effect of reducing the manufacturing process and reducing the manufacturing cost. At the same time, the assembly tolerance problem caused by the welding material can be avoided.

再請參閱第7圖所示,係為本發明之散熱裝置製造方法之第七實施例之實施示意圖,本實施例部分結構係與前述第一實施例相同,故在此將不再贅述,惟本實施例與前述第一實施例之不同處為所述熱傳單元1係為扁平熱管,且其熱傳單元1係設置於兩框架2之第一側21上,並將其兩框架2與熱傳單元1交接處施以點焊方式連接,且其熱傳單元1係以端緣位置處之無效 端12與所述框架2點焊連接,使其熱傳單元1固定於兩框架2上;藉此,所述熱傳單元1利用點焊方式連接且固定於所述框架2上,可有效減少熱傳單元1與框架2組接之步驟與減去需耗費塗膠材或使用膠帶之材料成本與製程成本,進而達到減少製程步驟與降低製造成本之功效者,且同時可避免因為透過焊接材料所造成之組裝公差問題。 Referring to FIG. 7 , it is a schematic diagram of the implementation of the seventh embodiment of the heat dissipation device manufacturing method of the present invention. The partial structure of this embodiment is the same as that of the foregoing first embodiment, and therefore will not be further described herein. The difference between this embodiment and the foregoing first embodiment is that the heat transfer unit 1 is a flat heat pipe, and the heat transfer unit 1 is disposed on the first side 21 of the two frames 2, and the two frames 2 are The junction of the heat transfer unit 1 is connected by spot welding, and the heat transfer unit 1 is invalid at the edge position The end 12 is spot-welded to the frame 2 such that the heat transfer unit 1 is fixed to the two frames 2; thereby, the heat transfer unit 1 is connected and fixed to the frame 2 by spot welding, which can effectively reduce The step of assembling the heat transfer unit 1 and the frame 2 and subtracting the material cost and process cost of the adhesive material or the use of the tape, thereby achieving the effect of reducing the process steps and reducing the manufacturing cost, and at the same time avoiding the passage of the solder material The resulting assembly tolerance problem.

雖然本創作以實施方式揭露如上,然其並非用以限定本創作,任何熟悉此技藝者,在不脫離本創作的精神和範圍內,當可作各種的更動與潤飾,因此本創作之保護範圍當視後附的申請專利範圍所定者為準。 Although the present invention is disclosed in the above embodiments, it is not intended to limit the present invention, and any person skilled in the art can make various changes and refinements without departing from the spirit and scope of the present invention. The scope of the patent application is subject to the provisions of the attached patent application.

Claims (7)

一種散熱裝置製造方法,係包含:提供至少一於端緣位置處形成有至少一無效端之熱傳單元,所述熱傳單元具有一腔室,該腔室內設有至少一毛細結構及該腔室內填充有一工作流體,另提供至少一具有一第一側及一第二側及一嵌槽之框架與所述熱傳單元對接;將該熱傳單元之無效端處與所述框架交接處係施以點焊方式連接,使其熱傳單元固定於框架上,進以降低製造成本並避免組裝公差。 A heat sink manufacturing method includes: providing at least one heat transfer unit having at least one invalid end formed at an edge position, the heat transfer unit having a chamber, wherein the chamber is provided with at least one capillary structure and the cavity The chamber is filled with a working fluid, and at least one frame having a first side and a second side and a recessed groove is docked with the heat transfer unit; the ineffective end of the heat transfer unit is connected to the frame The spot welding is connected to fix the heat transfer unit to the frame to reduce manufacturing costs and avoid assembly tolerances. 如申請專利範圍第1項所述之散熱裝置製造方法,其中所述熱傳單元係設置於所述框架之嵌槽內,且將該框架與該熱傳單元交接處施以焊接,使其熱傳單元固定於所述嵌槽內。 The heat sink manufacturing method according to claim 1, wherein the heat transfer unit is disposed in a recess of the frame, and the frame is welded to the heat transfer unit to be heated. The transmission unit is fixed in the slot. 如申請專利範圍第1項所述之散熱裝置製造方法,其中所述嵌槽貫穿所述第一側及第二側,而該熱傳單元係設置於所述框架之嵌槽內,且將該框架與該熱傳單元交接處施以焊接,使所述熱傳單元固定於所述嵌槽內。 The method of manufacturing a heat sink according to claim 1, wherein the slot penetrates the first side and the second side, and the heat transfer unit is disposed in the recess of the frame, and A weld is applied to the interface of the heat transfer unit to fix the heat transfer unit in the recess. 如申請專利範圍第1項所述之散熱裝置製造方法,其中所述框架於嵌槽位置處具有一內壁,所述內壁與所述第一側及第二側相互垂直。 The heat sink manufacturing method according to claim 1, wherein the frame has an inner wall at a slot position, and the inner wall is perpendicular to the first side and the second side. 如申請專利範圍第1項所述之散熱裝置製造方法,其中所述熱傳單元係為扁平熱管或導熱板或板式熱管或均溫板。 The heat sink manufacturing method according to claim 1, wherein the heat transfer unit is a flat heat pipe or a heat conductive plate or a plate heat pipe or a temperature equalizing plate. 如申請專利範圍第1項所述之散熱裝置製造方法,其中所述框架係為防電磁波材質。 The method of manufacturing a heat sink according to claim 1, wherein the frame is an electromagnetic wave preventing material. 如申請專利範圍第1項所述之散熱裝置製造方法,其中所述點焊 方式焊接係為電阻焊、超音波焊接或雷射點焊其中任一者。 The method for manufacturing a heat sink according to claim 1, wherein the spot welding The mode welding is either resistance welding, ultrasonic welding or laser spot welding.
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Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101084408A (en) * 2004-12-22 2007-12-05 Ti集团汽车系统有限公司 A heat exchanger
TWM469525U (en) * 2013-07-23 2014-01-01 Asia Vital Components Co Ltd Heat dissipation structure for handheld mobile device
TWM497420U (en) * 2014-08-22 2015-03-11 Giant Technology Co Ltd Heat dissipation system for electronic device

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101084408A (en) * 2004-12-22 2007-12-05 Ti集团汽车系统有限公司 A heat exchanger
TWM469525U (en) * 2013-07-23 2014-01-01 Asia Vital Components Co Ltd Heat dissipation structure for handheld mobile device
TWM497420U (en) * 2014-08-22 2015-03-11 Giant Technology Co Ltd Heat dissipation system for electronic device

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