TWI606328B - Radiator and Server Module - Google Patents

Description

Heat sink and server cooling system

The present invention relates to a heat sink, and more particularly to a server cooling system including a heat sink.

Heat sinks are very common in electronic and mechanical applications, especially in industries such as electronic devices, machine tools, or large-scale machines. Since electronic devices or machinery often generate high temperatures during operation, high temperatures often affect the performance of electronic devices or machinery during operation, or may cause malfunction of electronic devices or machinery or damage of components therein. Therefore, how to remove heat from an electronic device or machinery is very important.

In the case of a computer or server system, it is common to use water cooling or air cooling. The principle of the water-cooled radiator is to use the liquid to drive the heat of the radiator away from the electronic device or machinery. Therefore, the water-cooled radiator has the advantages of quietness, stable temperature drop, and low dependence on the environment compared with the air-cooled cooling method. However, water-cooled heat sinks are often used in practical applications because of the limitations in structural configuration, which often limit the placement of water-cooled heat sinks in electronic devices or machinery. Moreover, the positional arrangement of the vents in the general water-cooled radiator also reduces the heat dissipation effect of the fluids in different directions. In contrast, the way of air cooling and heat dissipation usually uses a fan to drive air cooling of the air to achieve a cooling effect. However, due to physical limitations such as small air heat, the heat dissipation efficiency is usually poor and consumes a considerable amount of energy. In addition, the sound and wind cut of the fan motor itself can cause considerable noise. What's more, today's electronic components are moving toward miniaturization, and the thermal density of electronic components is also increasing. Therefore, in terms of material limitations and cost considerations, air cooling may not provide sufficient cooling capacity for computer systems.

Therefore, how to improve the above problem of water cooling or air cooling and increase the heat dissipation efficiency of the electronic device has been a problem faced by those skilled in the art.

In view of the above, it is an object of the present invention to provide a heat sink and a server cooling system including the aforementioned heat sink.

In order to achieve the above object, according to an embodiment of the present invention, a heat dissipation row includes a first draft tube, a second draft tube, a plurality of heat dissipation tubes, and a plurality of fins. The second draft tube is disposed opposite to the first draft tube. The heat pipes are parallel to each other and in fluid communication between the first draft tube and the second draft tube. One of the heat pipes has a vertical projection on the other adjacent one. The vertical projection system partially overlaps the other of the adjacent heat pipes. The fins are connected between adjacent ones of the heat pipes.

In accordance with an embodiment of the present invention, a server cooling system includes a chassis and a heat sink. The chassis contains a backplane. The heat dissipation row includes a first draft tube, a second draft tube, a plurality of heat dissipation tubes, and a plurality of fins. The second draft tube is disposed opposite to the first draft tube. The heat pipes are parallel to each other and in fluid communication between the first draft tube and the second draft tube. One of the heat pipes has a vertical projection on the other adjacent one. The vertical projection system partially overlaps the other of the adjacent heat pipes. The fins are connected between adjacent ones of the heat pipes.

According to an embodiment of the invention, the aforementioned fin is perpendicular to the bottom plate.

According to an embodiment of the invention, the heat dissipation tubes are respectively heat dissipation flat tubes.

According to an embodiment of the invention, the heat dissipation flat tube is perpendicular to the bottom plate.

According to an embodiment of the invention, the heat dissipation row further comprises at least one connecting piece connected to one end of the first draft tube and one end of the second draft tube, and is located at one side of the heat dissipation flat tube. A first angle is formed between the virtual extension surface of any of the heat dissipation flat tubes and the virtual extension surface of the connecting sheet.

According to an embodiment of the invention, the first draft tube has a first surface and a second surface. The first surface is connected to the heat dissipation flat tube. The second surface is adjacent to the first surface. The second surface is sandwiched by a second angle between each of the heat dissipation flat tubes.

According to an embodiment of the invention, the fins are perpendicular to the heat dissipation flat tubes.

According to an embodiment of the invention, the fin is a parallelogram.

According to an embodiment of the invention, the heat dissipation row further includes a liquid inlet and a liquid outlet. The liquid inlet and the liquid outlet are respectively located on side surfaces of the first draft tube or the second draft tube. The heat sink also contains fluid. The fluid flows through the first inlet tube, the second tube, and the plurality of heat pipes through the liquid inlet and the liquid outlet.

According to an embodiment of the invention, the aforementioned fluid comprises water, oil or a refrigerant.

According to an embodiment of the invention, the aforementioned server cooling system further includes a first insulating liquid. The first insulating liquid is installed in at least the chassis, and the first insulating liquid has a boiling temperature ranging from about 40 ° C to about 70 ° C.

According to an embodiment of the invention, the aforementioned server cooling system further comprises a second insulating liquid. The second insulating liquid is installed in at least the chassis, and the specific heat capacity of the second insulating liquid is substantially greater than 1012 J/(kg·K) at 25 °C.

In summary, the server cooling system of the present disclosure includes a chassis and a heat dissipation row. The chassis contains a backplane. The heat dissipation row includes a first draft tube, a second draft tube, a plurality of heat dissipation tubes, and a plurality of fins. One of the heat pipes has a vertical projection on the other adjacent one. The vertical projection system partially overlaps the other of the adjacent heat dissipation flat tubes. That is to say, the arrangement of the adjacent heat-dissipating flat tubes is misaligned. In addition, the heat dissipation flat tubes and the fins are vertically disposed with respect to the bottom plate of the chassis. Thereby, since the heat dissipation flat tubes of the heat dissipation fins and the fins are perpendicular to the bottom plate, the heat dissipation flat tubes and the fins are parallel to the direction of gravity and thus do not hinder the flow of the vapor and the condensed liquid. Therefore, the condensed liquid can be directly dripped into the tank below the chassis of the server cooling system by gravity, and will not accumulate on the heat sink. In the foregoing structural configuration, the heat dissipation row can improve the efficiency of recovering the condensed liquid. In addition, since the opening direction of the heat dissipation holes formed by the first draft tube, the second draft tube, and the heat dissipation flat tube is also parallel to the direction of gravity, that is, the direction of gravity, the vapor is easily contacted with the heat dissipation flat tube and the fins. In order to improve the condensation efficiency of the steam and improve the cooling effect of the server cooling system.

Please refer to Figure 1. 1 is a perspective view of a server cooling system 1 in accordance with an embodiment of the present invention. As shown in the figure, in the present embodiment, the server cooling system 1 includes a chassis 10 (only a part is shown in FIG. 1) and a heat dissipation row 12. The chassis 10 includes a bottom plate 10a. The heat dissipation row 12 is disposed in the chassis 10 of the server cooling system 1 and includes a first draft tube 120, a second draft tube 122, a plurality of heat dissipation tubes 124, and a plurality of fins 126. In addition, the server cooling system 1 also includes an insulating liquid 136. The structure, function, and connection relationship between the components will be described in detail below.

Please refer to Figure 2. 2 is a perspective view of a heat dissipation row 12 according to an embodiment of the present invention. In the present embodiment, the heat dissipation row 12 is applied to heat dissipation of the server cooling system 1 (see Fig. 1).

In FIG. 1, the insulating liquid 136 is mounted in the chassis 10. In detail, the insulating liquid 136 of the present embodiment has a boiling temperature of a range of from about 40 ° C to about 70 ° C and a specific heat capacity of substantially greater than 10 12 J / (kg. K) at 25 ° C. However, the present disclosure is not limited to the aforementioned boiling point temperature and specific heat capacity, and any insulating liquid that can be applied to the heat dissipation of the server cooling system 1 can be applied to the present disclosure. Further, the server cooling system 1 is an immersion cooling system. That is to say, the server cooling system 1 immerses an electronic system (for example, a server) in a liquid that is larger than air and is not electrically conductive, and uses the density caused by the heat generated by the liquid or the flow caused by the phase change to leave the tropics away from the servo. The electronic components in the system 1 are cooled (not shown). With the foregoing configuration, the component configuration (for example, a fan or a pump) required to drive the fluid to achieve heat dissipation can be eliminated. Thereby, the server cooling system 1 of the present disclosure can reduce the power consumption required for cooling the electronic components by insulating the liquid 136.

In the second embodiment, the second draft tube 122 of the heat dissipation row 12 is disposed opposite to the first draft tube 120, and the outer shape of the first draft tube 120 and the second draft tube 122 is a square tube. In other embodiments, the outer shape of the first draft tube 120 and the second draft tube 122 may also be rounded. In addition, the second draft tube 122 and the first draft tube 120 on both sides of the heat dissipation row 12 serve as a water tank for storing liquid to assist in subsequent heat dissipation.

In FIG. 2, the heat dissipation row 12 includes a connecting piece 128 and a connecting piece 129. The connecting piece 128 is connected to one end of the first draft tube 120 and one end of the second draft tube 122, and is located at one side of the heat pipe 124. The connecting piece 129 is connected to the other end of the first draft tube 120 and the other end of the second draft tube 122, and is located on the other side of the heat pipe 124. The tabs 128 and the tabs 129 are used to increase the structural strength of the heat sink 12. The first draft tube 120, the second draft tube 122, the connecting piece 128, and the connecting piece 129 of the present embodiment form an outer frame of the heat dissipating row 12, and the heat dissipating tube 124 and the fin 126 are housed in the outer frame.

In Fig. 2, the heat dissipation tubes 124 of the heat dissipation row 12 are respectively a plurality of heat dissipation flat tubes which are flat and have two surfaces parallel to each other and perpendicular to the bottom plate 10a of the chassis 10 (see Fig. 1). However, the shape of the flat tubes 124 of the present embodiment is not limited to the flat tube shape. In other embodiments, the heat pipe 124 may also have a circular tubular shape or other suitable shape. In the present embodiment, the heat pipes 124 are parallel to each other and are in fluid communication with the first draft tube 120 and the second draft tube 122. The first draft tube 120, the second draft tube 122, and the heat dissipation tube 124 may be collectively formed to form a plurality of heat dissipation holes 125. In addition, in the heat dissipation row 12, regardless of the form in which the heat pipe 124 is adjacent to the flat tube and the plurality of fins 126, or the heat pipe is in a tubular shape and penetrates a plurality of fins, the fins of the two fins Both the heat pipe and the heat pipe face the direction of fluid flow in the direction with the smallest projected area, thereby reducing the obstacle caused by the fluid.

Referring to FIG. 1, as shown, when the insulating liquid 136 in the chassis 10 absorbs heat located in the electronic components (not shown) in the chassis 10, the insulating liquid 136 can produce a density or phase change and cause the insulating liquid 136 itself. The flow and the tropics away from the electronic components. That is, the heat absorbing insulating liquid 136 can be converted into a vapor. Thereby, since the heat dissipation pipe 124 of the heat dissipation row 12 is perpendicular to the bottom plate 10a of the chassis 10, that is, the heat dissipation pipe 124 is parallel to the direction of gravity, the flow of the vapor and the condensed liquid is not hindered. Therefore, the condensed liquid can be directly dripped into the lower tank of the chassis 10 of the server cooling system 1 by the influence of gravity, and does not accumulate on the heat sink 12. In the foregoing structural configuration, the heat dissipation fins 12 can increase the efficiency of recovering the condensed liquid. In addition, since the opening direction of the heat dissipation holes 125 formed by the first draft tube 120, the second flow guiding tube 122, and the heat dissipation tube 124 is also parallel to the direction of gravity, that is, the direction of gravity, the vapor is easily in contact with the heat pipe 124. In order to improve the condensation efficiency of the steam and improve the cooling effect of the servo cooling system 1.

Please refer to Figure 3. FIG. 3 is a perspective view showing a portion of the heat dissipation tubes 124 (shown as two) in FIG. 1 . In addition, in order to better understand the present invention, the fins 126 between the heat dissipation tubes 124 are omitted in FIG. As shown, in the present embodiment, one of the heat pipes 124 has a vertical projection 1244 on the other adjacent one. The vertical projection 1244 is partially overlapped with the other of the adjacent heat pipes 124.

For example, in FIG. 3, the third surface 1240 of the heat pipe 124b has a length L and a width W1. The heat pipe 124a has a vertical projection 1244 on the heat pipe 124b. The vertical projection 1244 has a length L and a width W2, and the width W2 is smaller than the width W1 of the heat dissipation tube 124b. The vertical projection 1244 of the heat pipe 124a partially overlaps the heat pipe 124b. That is, the area S2 of the vertical projection 1244 is smaller than the area S1 of the third surface 1240 of the heat dissipation tube 124b.

That is to say, the adjacent heat dissipation tubes 124 are arranged in a dislocation configuration, and the heat dissipation tubes 124 are parallel to each other. Therefore, according to the use requirements of the heat dissipation row 12 in practical applications, the misalignment relationship between the adjacent heat dissipation tubes 124 can be changed, so that the heat dissipation row 12 can be properly disposed on the device requiring heat dissipation to achieve the practical application. Cooling effect.

Next, please refer to Figure 4. Fig. 4 is a perspective cross-sectional view along line 4-4 of Fig. 2. As shown, the fins 126 of the heat sink 12 are connected between adjacent ones of the heat pipes 124 and perpendicular to the heat pipes 124 and the bottom plate 10a of the chassis 10 (see FIG. 1). In the embodiment, the fins 126 are parallelograms, but the disclosure is not limited thereto. In other embodiments, the shape of the fins 126 can also be rectangular or other suitable shape.

Thereby, in addition to the heat pipe 124 of the heat dissipation row 12 being perpendicular to the bottom plate 10a of the chassis 10, the fins 126 of the heat dissipation row 12 are also perpendicular to the bottom plate 10a of the chassis 10. That is to say, in the foregoing structural configuration, the heat dissipation pipe 124 and the fins 126 may not hinder the circulation of the vapor, and by disposing the fins 126 between the adjacent two of the heat dissipation pipes 124, steam and heat dissipation may be increased. The contact area of row 12. Thereby, the heat dissipation row 12 of the present disclosure can further improve the condensation efficiency of the steam, improve the cooling effect of the server cooling system 1, and improve the efficiency of recovering the condensed liquid.

In detail, in FIG. 4, the first draft tube 120 of the heat dissipation row 12 has a first surface 120a and a second surface 120b. The first surface 120a faces and connects the heat pipe 124. The second surface 120b is adjacent to the first surface 120a. The heat pipe 124 has a third surface 1240 and a fourth surface 1242 relative to the third surface 1240. The third surface 1240 and the fourth surface 1242 are both connected between the first draft tube 120 and the second draft tube 122 (refer to FIG. 2 for cooperation). The third surface 1240 is substantially toward the tab 128 and the fourth surface 1242 is substantially toward the tab 129. A second angle A2 is sandwiched between the second surface 120b and the third surface 1240 of each heat pipe 124.

Therefore, in the present embodiment, the angle between the connecting piece 129 of the heat dissipation row 12 and the bottom plate 10a of the chassis 10 can be adjusted to be the same as the second angle A2 (see FIG. 1), and the structural configuration can make the heat pipe 124 is relatively perpendicular to the bottom plate 10a of the chassis 10. Thereby, the heat dissipating row 12 of the present disclosure can enhance the condensation efficiency of the vapor, improve the cooling effect of the servo cooling system 1 and improve the efficiency of recovering the condensed liquid by the foregoing structural configuration.

Next, please refer to Figure 5. Figure 5 is a side cross-sectional view along line 2-4 of Figure 2. As shown, the third surface 1240 of any of the heat dissipation tubes 124 and the virtual extension surfaces 1240a, 1242a of the fourth surface 1242 and the virtual extension surfaces 128a, 129a of the connection sheets 128, 129 sandwich a first angle A1.

Therefore, in the present embodiment, the angle between the connecting piece 128 of the heat dissipation row 12 or the connecting piece 129 relative to the bottom plate 10a of the chassis 10 can be adjusted to another angle, and the aforementioned angle can be substantially added to the first angle A1. At 90 degrees, this configuration allows the heat pipe 124 to be relatively perpendicular to the bottom plate 10a of the chassis 10 (see Figure 1). Thereby, the heat dissipating row 12 of the present disclosure can enhance the condensation efficiency of the vapor, improve the cooling effect of the servo cooling system 1 and improve the efficiency of recovering the condensed liquid by the foregoing structural configuration.

Please refer back to Figure 1. As shown, the heat sink 12 also includes a liquid inlet 132 and a liquid outlet 134. The liquid inlet 132 and the liquid outlet 134 are respectively located on the side surface of the second draft tube 122. In other embodiments, the liquid inlet 132 and the liquid outlet 134 may also be located on the side surface of the first draft tube 120. In the present embodiment, the heat dissipation row 12 further includes a fluid 130. The fluid 130 flows through the liquid inlet 132 and the liquid outlet 134 through the first draft tube 120, the second draft tube 122, and the plurality of heat radiation tubes 124. Fluid 130 can include water, oil, or a refrigerant. Thereby, the server cooling system 1 can utilize the fluid 130 in the heat dissipation row 12 to drive the heat from the server cooling system 1 through the heat dissipation row 12 to be carried away from the server cooling system 1 by the pump. However, in other embodiments, the server cooling system 1 may also require no pump to drive the circulation of the fluid 130, but utilize the hydraulic pressure difference of the fluid 130 between the inlet 132 and the outlet 134 to drive the circulation of the fluid 130. Furthermore, the vapor in the server cooling system 1 can be condensed by the circulation of the aforementioned fluid 130, and the temperature of the components in the servo cooling system 1 can be provided.

From the above detailed description of the specific embodiments of the present invention, it can be clearly seen that the heat dissipation row of the present disclosure includes a first draft tube, a second draft tube, a plurality of heat dissipation flat tubes, and a plurality of fins. One of the heat dissipating flat tubes has a vertical projection on the other adjacent one. The vertical projection system partially overlaps the other of the adjacent heat dissipation flat tubes. That is to say, the arrangement of the adjacent heat-dissipating flat tubes is misaligned. In addition, the heat dissipation flat tubes and the fins are vertically disposed with respect to the bottom plate of the chassis. Thereby, since the heat dissipation flat tubes of the heat dissipation fins and the fins are perpendicular to the bottom plate of the chassis, the heat dissipation flat tubes and the fins are parallel to the direction of gravity and thus do not hinder the flow of the vapor and the condensed liquid. Therefore, the condensed liquid can be directly dripped into the tank below the chassis of the server cooling system by gravity, and will not accumulate on the heat sink. In the foregoing structural configuration, the heat dissipation row can improve the efficiency of recovering the condensed liquid. In addition, since the opening direction of the heat dissipation holes formed by the first draft tube, the second draft tube, and the heat dissipation flat tube is also parallel to the direction of gravity, that is, the direction of gravity, the vapor is easily contacted with the heat dissipation flat tube and the fins. In order to improve the condensation efficiency of the steam and improve the cooling effect of the servo cooling system.

Although the present invention has been disclosed in the above embodiments, it is not intended to limit the present invention, and the present invention can be modified and modified without departing from the spirit and scope of the present invention. The scope is subject to the definition of the scope of the patent application attached.

1‧‧‧Server Cooling System

10‧‧‧Chassis

10a‧‧‧floor

12‧‧‧ Heat sink

120‧‧‧First draft tube

120a‧‧‧ first surface

120b‧‧‧second surface

122‧‧‧Second guide tube

124, 124a, 124b‧‧‧ heat pipe

1240‧‧‧ third surface

1242‧‧‧ fourth surface

1240a, 1242a‧‧‧ virtual extension surface

1244‧‧‧Vertical projection

125‧‧‧ vents

126‧‧‧Fins

128, 129‧‧‧ connecting pieces

128a, 129a‧‧‧ virtual extension surface

130‧‧‧ fluid

132‧‧‧ inlet port

134‧‧‧liquid outlet

136‧‧‧Insulating liquid

A1‧‧‧ first angle

A2‧‧‧ second angle

L‧‧‧ length

S1, S2‧‧‧ area

W1, W2‧‧‧ width

The above and other objects, features, advantages and embodiments of the present invention will become more <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; Fig. 2 is a perspective view showing the heat dissipation row in Fig. 1. Fig. 3 is a perspective view showing a portion of the heat dissipating flat tube in Fig. 1. Fig. 4 is a perspective cross-sectional view along line 4-4 of Fig. 2. Figure 5 is a side cross-sectional view along line 2-4 of Figure 2.

1‧‧‧Server Cooling System

10‧‧‧Chassis

10a‧‧‧floor

12‧‧‧ Heat sink

120‧‧‧First draft tube

122‧‧‧Second guide tube

124‧‧‧heat pipe

125‧‧‧ vents

126‧‧‧Fins

128, 129‧‧‧ connecting pieces

130‧‧‧ fluid

132‧‧‧ inlet port

134‧‧‧liquid outlet

136‧‧‧Insulating liquid

Claims (4)

A heat dissipation row comprising: a first draft tube having a first surface and a second surface; a second draft tube disposed opposite the first draft tube; a plurality of heat dissipating tubes parallel to each other and fluid Connected between the first draft tube and the second draft tube, and is a plurality of heat dissipation flat tubes, wherein one of the heat dissipation tubes has a vertical projection on the adjacent one, the vertical The projection system partially overlaps the adjacent one, wherein the first surface of the first draft tube is connected to the heat dissipation flat tubes, and the second surface is adjacent to the first surface, wherein the second surface a second angle is formed between each of the heat dissipation flat tubes; a plurality of fins, each of the fins being connected between adjacent ones of the heat dissipation tubes; and at least one connecting piece connected to One end of the first draft tube and one end of the second draft tube are located on one side of the heat dissipation flat tubes, and a virtual extension surface of any of the heat dissipation flat tubes and a virtual extension of the connecting piece A first angle is sandwiched between the faces. The heat dissipation row according to claim 1, further comprising a liquid inlet and a liquid outlet, wherein the liquid inlet and the liquid outlet are respectively located on a side surface of the first draft tube or the second draft tube And the heat dissipating row further comprises a fluid flowing through the first diversion tube, the second diversion tube and the heat dissipation tubes via the liquid inlet and the liquid outlet. A server cooling system comprising: a chassis comprising a bottom plate; and a heat dissipation row disposed in the chassis and located above the bottom plate, the heat dissipation row comprising: a first draft tube having a first surface and a second surface; a second a guiding tube disposed opposite to the first guiding tube; a plurality of heat dissipating tubes parallel to each other and in fluid communication between the first guiding tube and the second guiding tube, and a plurality of heat dissipating flat tubes, wherein One of the heat pipes has a vertical projection on the other of the adjacent ones, the vertical projection partially overlapping the adjacent one of the other, wherein the first surface of the first draft tube is connected In the heat dissipation flat tubes, the second surface is adjacent to the first surface, wherein the second surface and each of the heat dissipation flat tubes are sandwiched by a second angle; a plurality of fins, each of the fins Connected between adjacent ones of the heat dissipation tubes; and at least one connecting piece connected to one end of the first draft tube and one end of the second draft tube, and located at one of the heat dissipation flat tubes Side, a virtual extension surface of any of the heat dissipation flat tubes A virtual extension of the connection piece interposed between a first angle surface. The server cooling system of claim 3, further comprising a liquid inlet and a liquid outlet, the liquid inlet and the liquid outlet being respectively located on the side of the first draft tube or the second draft tube a surface, and the heat dissipation row further comprises a fluid, the fluid circulating through the liquid inlet and the liquid outlet In the first draft tube, the second draft tube, and the heat dissipation tubes.