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TWI695151B - Gas enclosure system - Google Patents

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TWI695151B
TWI695151B TW107126347A TW107126347A TWI695151B TW I695151 B TWI695151 B TW I695151B TW 107126347 A TW107126347 A TW 107126347A TW 107126347 A TW107126347 A TW 107126347A TW I695151 B TWI695151 B TW I695151B
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assembly
gas
panel
various embodiments
inert gas
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TW201840949A (en
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賈斯汀 默克
亞歷山大 守康 高
伊莉亞 沃斯凱
珊登 歐德森
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美商凱特伊夫公司
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Abstract

The present teachings relate to various embodiments of an hermetically-sealed gas enclosure assembly and system that can be readily transportable and assemblable and provide for maintaining a minimum inert gas volume and maximal access to various devices and apparatuses enclosed therein. Various embodiments of an hermetically-sealed gas enclosure assembly and system of the present teachings can have a gas enclosure assembly constructed in a fashion that minimizes the internal volume of a gas enclosure assembly, and at the same time optimizes the working space to accommodate a variety of footprints of various OLED printing systems. Various embodiments of a gas enclosure assembly so constructed additionally provide ready access to the interior of a gas enclosure assembly from the exterior during processing and readily access to the interior for maintenance, while minimizing downtime.

Description

氣體包體系統 Gas inclusion system 【相關申請案之交互參照】[Cross-reference of related applications]

本申請案係2012年12月19日申請之美國申請案第13/720,830號的部分接續申請案。本申請案主張2012年11月30日申請之美國臨時申請案第61/732,173號的權益,且另外主張2013年2月14日申請之美國臨時申請案第61/764,973號的權益。所有交互參照之申請案的全文納入本文中。 This application is a partial continuation application of US Application No. 13/720,830 filed on December 19, 2012. This application claims the rights and interests of US Provisional Application No. 61/732,173 filed on November 30, 2012, and the rights and interests of US Provisional Application No. 61/764,973 filed on February 14, 2013. The full text of all cross-referenced applications is included in this article.

本教示係關於氣密式密封型氣體包體總成及系統的各種實施例,該氣體包體總成及系統可易於傳送及組裝且可提供用於維持最小惰性氣體體積以及對其中所包封之各種裝置及設備的最大接取。 This teaching is about various embodiments of hermetically sealed gas enclosure assemblies and systems. The gas enclosure assemblies and systems can be easily transported and assembled and can be provided to maintain a minimum inert gas volume and to encapsulate therein The largest access to various devices and equipment.

對OLED顯示技術之潛力的興趣受到OLED顯示技術屬性的驅使,該等屬性包括具有高度飽和之顏色、高對比度、超薄、快速響應且高效節能之顯示面板的證實。另外,包括撓性聚合物材料之多種基板材料可用於製造OLED顯示技術。儘管對用於小螢幕應用(主要用於手機)之顯示器的證實已用來強調該技術之潛力,但使製造擴展至更大型式仍存在挑戰。例如,在比尺寸約為130cm X 150cm之第5.5代基板大的基板上製 造OLED顯示器尚未得到證實。 The interest in the potential of OLED display technology is driven by the properties of OLED display technology, which include the verification of highly saturated colors, high contrast, ultra-thin, fast response, and energy efficient display panels. In addition, a variety of substrate materials including flexible polymer materials can be used to manufacture OLED display technology. Although the verification of displays for small screen applications (mainly used in mobile phones) has been used to emphasize the potential of the technology, there are still challenges to expanding manufacturing to larger formats. For example, on a substrate larger than the 5.5th generation substrate with a size of about 130cm X 150cm OLED display has not been confirmed.

可藉由使用OLED列印系統在基板上列印各種有機薄膜以及其他材料來製造有機發光二極體(OLED)裝置。此等有機材料可容易因氧化及其他化學處理而受損壞。以某種方式來封裝(housing)OLED列印系統以使得其可針對各種基板大小來縮放且可在惰性、大致上無粒子之列印環境中完成可提出多種挑戰。因為用於列印大型面板基板列印之設備需要很大空間,所以將大型設施維持在惰性氣氛下(其不斷需要氣體淨化來移除諸如水蒸汽及氧氣之反應性大氣物種以及有機溶劑蒸汽)提出很大的工程挑戰。例如,提供氣密式密封之大型設施可提出工程挑戰。另外,饋入及饋出OLED列印系統之用於操作該列印系統的各種纜線、接線及管線可對有效地使氣體包體在大氣成分(諸如氧氣及水蒸汽)之含量方面符合規格提出挑戰,因為該等纜線、接線及管線可產生很大的無效體積,此等反應性物種可被吸留在該無效體積中。此外,希望將此設施保持在惰性環境中來進行處理,從而提供輕鬆接取以便在停機時間最少的情況下進行維護。除了大致上無反應性物種之外,用於OLED裝置之列印環境亦需要大致上低粒子之環境。就此而言,在整個被包封系統中提供及維持大致上無粒子之環境提出額外挑戰,而用於可在諸如露天、高流量層流過濾罩之大氣條件下完成的處理之粒子減少並未提出此等額外挑戰。 Organic light emitting diode (OLED) devices can be manufactured by printing various organic thin films and other materials on a substrate using an OLED printing system. These organic materials can be easily damaged by oxidation and other chemical treatments. Housing the OLED printing system in a manner such that it can be scaled for various substrate sizes and can be accomplished in an inert, substantially particle-free printing environment can present multiple challenges. Because the equipment used to print large panel substrates requires a lot of space, maintain large facilities under an inert atmosphere (which constantly requires gas purification to remove reactive atmospheric species such as water vapor and oxygen and organic solvent vapors) It presents great engineering challenges. For example, large facilities that provide hermetic seals can present engineering challenges. In addition, the various cables, wires, and pipelines used to operate the printing system that feed into and out of the OLED printing system can effectively make the gas envelope meet the specifications in terms of the content of atmospheric components (such as oxygen and water vapor) Challenges are presented because these cables, wires, and pipelines can generate a large dead volume, and these reactive species can be trapped in the dead volume. In addition, it is desirable to keep this facility in an inert environment for processing, thereby providing easy access for maintenance with minimal downtime. In addition to the substantially non-reactive species, the printing environment used for OLED devices also requires a substantially low particle environment. In this regard, providing and maintaining a substantially particle-free environment throughout the encapsulated system presents additional challenges, while particle reduction for processes that can be performed under atmospheric conditions such as open-air, high-flow laminar flow filter covers has not Present these additional challenges.

因此,存在對氣體包體之各種實施例的需要,該氣體包體可將OLED列印系統封裝在惰性、大致上無粒子之環境中,且可容易縮放來提供用於在多種基板大小及基板材料上製造OLED面板,同時亦提供在處理期間自外部對OLED列印系統之輕鬆接取,以及對內部之輕鬆接取以便在停機時間最少的情況下進行維護。 Therefore, there is a need for various embodiments of gas inclusions that can encapsulate an OLED printing system in an inert, substantially particle-free environment and can be easily scaled to provide a variety of substrate sizes and substrates The OLED panel is made of materials, and it also provides easy access to the OLED printing system from the outside during processing, and easy access to the inside for maintenance with minimal downtime.

本教示揭示氣體包體總成之各種實施例,該氣體包體總成可密封地建構並且與氣體循環組件、過濾組件及淨化組件整合來形成氣體包體總成及系統,該氣體包體總成及系統可維持惰性、大致上無粒子之環境來用於需要此環境的處理。氣體包體總成及系統之此等實施例可將各種反應性物種中之每一物種的含量維持在100ppm或更低,例如10ppm或更低、1.0ppm或更低或者0.1ppm或更低,該等反應性物種包括諸如水蒸汽及氧氣之各種反應性大氣氣體,以及有機溶劑蒸汽。此外,氣體包體總成之各種實施例可提供滿足ISO 14644第3級及第4級無塵室標準之低粒子環境。 This teaching discloses various embodiments of a gas inclusion assembly, which can be constructed hermetically and integrated with a gas circulation component, a filtration component, and a purification component to form a gas inclusion component and system. The system can maintain an inert, substantially particle-free environment for processing that requires this environment. These embodiments of the gas inclusion assembly and system can maintain the content of each of the various reactive species at 100 ppm or less, such as 10 ppm or less, 1.0 ppm or less, or 0.1 ppm or less, Such reactive species include various reactive atmospheric gases such as water vapor and oxygen, and organic solvent vapors. In addition, various embodiments of the gas envelope assembly can provide a low-particle environment that meets ISO 14644 Class 3 and Class 4 clean room standards.

多種技術領域之一般技藝人士可瞭解氣體包體總成之實施例對多種技術領域的效用。儘管諸如化學、生物技術、高科技及製藥技術之諸多不同技術可受益於本教示,但使用OLED列印來例證根據本教示之氣體包體總成及系統的各種實施例之效用。可封裝OLED列印系統之氣體包體總成系統的各種實施例可提供多個特徵,該等特徵諸如但不限於:在建構及解構週期中提供氣密式密封型包體的密封、包體體積之最小化,以及在處理期間與維護期間自外部對內部之輕鬆接取。如隨後將討論,氣體包體總成之各種實施例的此等特徵可對功能性有影響,該功能性諸如但不限於:結構完整性,其為在處理期間維持反應性物種之低含量提供方便;以及快速包體體積翻轉,其使維護週期期間之停機時間最小化。因此,為OLED面板列印提供效用之各種特徵及規格亦可為多種技術領域提供益處。 Persons of ordinary skill in various technical fields can understand the effect of the embodiment of the gas inclusion assembly on various technical fields. Although many different technologies such as chemistry, biotechnology, high technology, and pharmaceutical technology can benefit from this teaching, OLED printing is used to illustrate the effectiveness of various embodiments of gas inclusion assemblies and systems according to this teaching. Various embodiments of a gas package assembly system that can encapsulate an OLED printing system can provide multiple features, such as, but not limited to, providing a hermetically sealed package seal and package in the construction and deconstruction cycle Minimization of volume and easy access from outside to inside during handling and maintenance. As will be discussed later, such features of various embodiments of gas inclusion assemblies can have an impact on functionality, such as but not limited to: structural integrity, which provides for maintaining low levels of reactive species during processing Convenient; and rapid body volume turnover, which minimizes downtime during maintenance cycles. Therefore, various features and specifications that provide utility for OLED panel printing can also provide benefits for various technical fields.

如前面所提及,在比尺寸約為130cm X 150cm之第5.5代基 板大的基板上製造OLED顯示器尚未得到證實。大約從1990年代初開始,對於藉由除OLED列印以外之技術所製造之平板顯示器,各代母玻璃基板大小已經歷演變。被稱為第1代(Gen 1)之第一代母玻璃基板約為30cm x 40cm,且因此可產生15"面板。大約在1990年代中期,用於生產平板顯示器之現有技術已演變為第3.5代之母玻璃基板大小,其尺寸約為60cm x 72cm。 As mentioned earlier, the manufacture of OLED displays on substrates larger than the 5.5th generation substrates with dimensions of about 130 cm X 150 cm has not been confirmed. From about the beginning of the 1990s, for flat panel displays manufactured by technologies other than OLED printing, the size of each generation of mother glass substrate has undergone evolution. The first generation mother glass substrate called Gen 1 is about 30cm x 40cm, and therefore can produce 15" panels. Around the mid-1990s, the existing technology used to produce flat panel displays has evolved to 3.5 Instead, the size of the mother glass substrate is about 60cm x 72cm.

隨著各代的進步,第7.5代及第8.5代之母玻璃大小已投入生產,用於除OLED列印製造處理以外之處理。第7.5代母玻璃之尺寸約為195cm x 225cm,且每個基板可切割成八個42"平板或六個47”平板。第8.5代中所使用之母玻璃約為220 x 250cm,且每個基板可切割成六個55”平板或八個46”平板。已實現OLED平板顯示器之品質保證,諸如更真實之顏色、更高之對比度、薄、可撓性、透明度及能源效率,同時OLED製造實際上被限於G 3.5及更小。目前,OLED列印被認為係打破此限制並且不僅針對第3.5代及更小之母玻璃大小,而且針對最大之母玻璃大小(諸如第5.5代、第7.5代及第8.5代)來實現OLED面板製造之最佳製造技術。一般技藝人士將瞭解的是,OLED面板列印之特徵中之一者包括可使用多種基板材料,例如但不限於多種玻璃基板材料以及多種聚合物基板材料。就此而言,由基於玻璃的基板之使用所產生的術語所列舉之大小可適用於適合在OLED列印中使用之任何材料的基板。 With the advancement of each generation, the mother glass size of the 7.5th and 8.5th generation has been put into production, which is used for processing other than OLED printing manufacturing processing. The size of the 7.5th generation mother glass is about 195cm x 225cm, and each substrate can be cut into eight 42" plates or six 47" plates. The mother glass used in the 8.5th generation is approximately 220 x 250 cm, and each substrate can be cut into six 55” plates or eight 46” plates. Quality assurance of OLED flat panel displays has been achieved, such as more realistic colors, higher contrast, thinness, flexibility, transparency, and energy efficiency, while OLED manufacturing is actually limited to G 3.5 and smaller. At present, OLED printing is considered to break this limitation and not only for the size of the mother glass of the 3.5th generation and smaller, but also for the largest mother glass size (such as the 5.5th generation, 7.5th generation and 8.5th generation) to realize the OLED panel The best manufacturing technology for manufacturing. Those of ordinary skill will understand that one of the features of OLED panel printing includes the use of multiple substrate materials, such as but not limited to multiple glass substrate materials and multiple polymer substrate materials. In this regard, the sizes enumerated by the terminology resulting from the use of glass-based substrates are applicable to substrates of any material suitable for use in OLED printing.

關於OLED列印,根據本教示,已經發現維持反應性物種之大致上低含量與提供滿足必要壽命規格之OLED平板顯示器有關,該等反應性物種例如但不限於:諸如氧氣及水蒸汽之大氣成分,以及OLED墨水 中所使用之各種有機溶劑蒸汽。壽命規格對OLED面板技術特別重要,因為此直接與顯示器產品耐久性有關;耐久性係所有面板技術之產品規格,目前係OLED面板技術要滿足的挑戰。為了提供滿足必要壽命規格之面板,可利用本教示之氣體包體總系統的各種實施例來將諸如水蒸汽、氧氣以及有機溶劑蒸汽之反應性物種中之每一者的含量維持在100ppm或更低,例如10ppm或更低、1.0ppm或更低或者0.1ppm或更低。另外,OLED列印需要大致上無粒子之環境。維持用於OLED列印之大致上無粒子之環境特別重要,因為即使極小之粒子亦可導致OLED面板上之可見缺陷。目前,OLED顯示器要滿足商品化所需之低缺陷水平係一個挑戰。在整個被包封系統中維持大致上無粒子之環境提出額外挑戰,而用於可在諸如露天、高流量層流過濾罩之大氣條件下完成的處理之粒子減少並未提出此等額外挑戰。因此,在大型設施中維持惰性、無粒子環境的必要規格可提出多種挑戰。 Regarding OLED printing, according to this teaching, it has been found that maintaining a substantially low content of reactive species is related to providing an OLED flat panel display that meets the necessary lifetime specifications, such reactive species such as but not limited to: atmospheric components such as oxygen and water vapor , And various organic solvent vapors used in OLED inks. Lifetime specifications are particularly important for OLED panel technology, because it is directly related to the durability of display products; durability is the product specification of all panel technologies and is currently a challenge to be met by OLED panel technology. In order to provide a panel that meets the necessary life specifications, various embodiments of the gas inclusion system of the present teaching can be used to maintain the content of each of the reactive species such as water vapor, oxygen, and organic solvent vapor at 100 ppm or more Low, for example, 10 ppm or less, 1.0 ppm or less, or 0.1 ppm or less. In addition, OLED printing requires a substantially particle-free environment. Maintaining a substantially particle-free environment for OLED printing is particularly important because even very small particles can cause visible defects on the OLED panel. At present, it is a challenge for OLED displays to meet the low defect levels required for commercialization. Maintaining a substantially particle-free environment throughout the encapsulated system presents additional challenges, while particle reduction for processes that can be completed under atmospheric conditions such as open air, high-flow laminar flow filter covers does not present such additional challenges. Therefore, the necessary specifications to maintain an inert, particle-free environment in large facilities can present a variety of challenges.

可查閱表1中所概括之資訊來例示對於在一設施中列印OLED面板之需要,在該設施中,諸如水蒸汽、氧氣以及有機溶劑蒸汽之反應性物種中之每一者的含量可維持在100ppm或更低,例如,10ppm或更低、1.0ppm或更低或者0.1ppm或更低。表1中所概括之資料係由對試樣(test coupon)中之每一者的測試而產生,該試樣包含以大像素、旋塗裝置格式製成的用於紅色、綠色及藍色中之每一者的有機薄膜組成物。此等試樣大致上更易於製造及測試,以便快速評估各種調配物及處理。儘管試樣測試不應與列印面板之壽命測試相混淆,但試樣測試可指示各種調配物及處理對壽命的影響。下表中所展示之結果表示在試樣之製造的處理步驟中的變化,其中僅在反應性物種小於1ppm的氮氣環境中製造之試樣的旋塗 環境發生改變,此與以類似方式製造但係在空氣而非氮氣環境中製造之試樣產生比較。 The information summarized in Table 1 can be consulted to illustrate the need for printing OLED panels in a facility where the content of each of the reactive species such as water vapor, oxygen, and organic solvent vapor can be maintained At 100 ppm or lower, for example, 10 ppm or lower, 1.0 ppm or lower, or 0.1 ppm or lower. The data summarized in Table 1 was generated by testing each of the coupons (test coupons), which included red, green, and blue colors in a large pixel, spin-coating device format Organic thin film composition of each. These samples are generally easier to manufacture and test to quickly evaluate various formulations and treatments. Although the sample test should not be confused with the life test of the printed panel, the sample test can indicate the effects of various formulations and treatments on the life. The results shown in the table below represent changes in the processing steps for the manufacture of samples, in which the spin-coating environment of samples made only in a nitrogen environment with reactive species less than 1 ppm is changed. Comparisons were made with samples made in air instead of nitrogen.

經由檢查表1中關於在不同處理環境下製造之試樣的資料,特別係在紅色及藍色之狀況下,顯而易見的是:在有效地減少將有機薄膜組成物曝露於反應性物種的環境中之列印可對各種EL之穩定性有實質影響,且因此對壽命有實質影響。 According to the information in Table 1 regarding samples manufactured under different processing environments, especially in the red and blue conditions, it is obvious that: in an environment that effectively reduces the exposure of the organic thin film composition to reactive species Printing can have a substantial effect on the stability of various ELs, and therefore on the lifespan.

Figure 107126347-A0101-12-0006-1
Figure 107126347-A0101-12-0006-1

因此,將OLED列印自第3.5代縮放至第8.5代及更大且同時提供穩健的包體環境存在挑戰,該包體環境可將OLED列印系統容納於惰性、大致上無粒子之氣體包體環境中。預期的是,根據本教示,此氣體包體將具有多種屬性,該等屬性包括:例如但不限於一種氣體包體,其可易於縮放來為OLED列印系統提供最佳化之工作空間,同時提供最小化之惰性氣體體積,並且另外提供在處理期間自外部對OLED列印系統之輕鬆接取,同時提供對內部之接取以便在停機時間最少的情況下進行維護。 Therefore, it is challenging to scale OLED printing from 3.5th generation to 8.5th generation and larger while providing a robust package environment that can accommodate the OLED printing system in an inert, substantially particle-free gas package Body environment. It is expected that, according to the teachings, this gas inclusion will have multiple attributes, such as: but not limited to a gas inclusion, which can be easily scaled to provide an optimized working space for the OLED printing system, while Provides a minimum volume of inert gas, and additionally provides easy access to the OLED printing system from the outside during processing, while providing access to the inside for maintenance with minimal downtime.

根據本教示之各種實施例,提供用於需要惰性環境之各種空氣敏感型處理的氣體包體總成,該氣體包體總成可包括可密封在一起的複數個壁框架構件及天花板框架構件。在一些實施例中,可使用例如螺栓及螺紋孔之可重複使用的緊固件將複數個壁框架構件及天花板框架構件緊固在一起。對於根據本教示之氣體包體總成的各種實施例,複數個框架構件可經建構來界定氣體包體框架總成,每一框架構件包含複數個面板框架區段。 According to various embodiments of the present teachings, a gas envelope assembly for various air-sensitive processes requiring an inert environment is provided. The gas envelope assembly may include a plurality of wall frame members and ceiling frame members that may be sealed together. In some embodiments, a plurality of wall frame members and ceiling frame members may be fastened together using reusable fasteners such as bolts and threaded holes. For various embodiments of the gas enclosure assembly according to the present teachings, a plurality of frame members can be constructed to define the gas enclosure frame assembly, each frame member including a plurality of panel frame sections.

本教示之氣體包體總成可經設計來以某種方式容納諸如OLED列印系統之系統,以使得可使圍繞系統之包體的體積最小化。氣體包體總成之各種實施例可以某種方式建構,以使得使氣體包體總成之內部體積最小化,且同時使用來容納各種OLED列印系統之各種佔據面積的工作空間最佳化。如此建構之氣體包體總成的各種實施例另外提供:在處理期間自外部對氣體包體總成之內部的輕鬆接取,以及為了維護而對內部的輕鬆接取,同時使停機時間最小化。就此而言,根據本教示之氣體包體總成的各種實施例可針對各種OLED列印系統之各種佔據面積來進行輪廓塑造(contoured)。根據各種實施例,一旦經輪廓塑造之框架構件經建構來形成氣體包體框架總成,則可將各種類型之面板密封地安裝於包含框架構件的複數個面板區段中,來完成氣體包體總成之安裝。在氣體包體總成之各種實施例中,複數個框架構件(包括例如但不限於複數個壁框架構件及至少一個天花板框架構件)以及用於安裝於面板框架區段中的複數個面板可在一個位置或多個位置製造,且隨後在另一位置建構。此外,考慮到用來建構本教示之氣體包體總成之組件的可傳送性質,在建構及解構週期中可反 復安裝及移除氣體包體總成之各種實施例。 The gas package assembly of the present teachings can be designed to accommodate a system such as an OLED printing system in such a way that the volume of the package surrounding the system can be minimized. Various embodiments of the gas envelope assembly can be constructed in a manner to minimize the internal volume of the gas envelope assembly and optimize the working space used to accommodate various occupied areas of various OLED printing systems. Various embodiments of the gas package assembly thus constructed additionally provide: easy access to the inside of the gas package assembly from outside during processing, and easy access to the inside for maintenance, while minimizing downtime . In this regard, various embodiments of the gas envelope assembly according to the present teachings can be contoured for various occupied areas of various OLED printing systems. According to various embodiments, once the contoured frame member is constructed to form the gas inclusion frame assembly, various types of panels can be sealingly installed in the plurality of panel sections including the frame member to complete the gas inclusion The assembly is installed. In various embodiments of the gas enclosure assembly, a plurality of frame members (including, for example, but not limited to, a plurality of wall frame members and at least one ceiling frame member) and a plurality of panels for installation in the panel frame section may be One location or multiple locations are manufactured and then constructed in another location. In addition, considering the transportable nature of the components used to construct the gas enclosure assembly of this teaching, various embodiments of the gas enclosure assembly can be repeatedly installed and removed during the construction and deconstruction cycles.

為確保氣體包體被氣密式密封,本教示之氣體包體總成的各種實施例提供用於連接每一框架構件以便提供框架密封。內部可被充分密封,例如藉由各種框架構件之間緊密配合的相交處而被氣密式密封,該等相交處包括墊圈或其他密封件。一旦完全建構,密封的氣體包體總成則可包含一內部及複數個內部角邊緣,至少一個內部角邊緣係提供在每一框架構件與一相鄰框架構件之相交處。該等框架構件中之一或多者(例如該等框架構件之至少一半)可包含沿其一或多個對應邊緣固定的一或多個可壓縮墊圈。一旦將複數個框架構件連接在一起且安裝了氣密式面板,則該或該等可壓縮墊圈可經組配來產生氣密式密封型氣體包體總成。密封的氣體包體總成可形成為具有藉由複數個可壓縮墊圈來密封的框架構件之角邊緣。對於每一框架構件,例如但不限於內部壁框架表面、頂部壁框架表面、垂直側壁框架表面、底部壁框架表面及其組合可具備一或多個可壓縮墊圈。 To ensure that the gas enclosure is hermetically sealed, various embodiments of the gas enclosure assembly of the present teachings are provided for connecting each frame member to provide a frame seal. The interior can be sufficiently sealed, for example, by hermetically sealing intersections between various frame members, such as gaskets or other seals. Once fully constructed, the sealed gas envelope assembly may include an inner and a plurality of inner corner edges, at least one inner corner edge being provided at the intersection of each frame member and an adjacent frame member. One or more of the frame members (eg, at least half of the frame members) may include one or more compressible washers secured along one or more corresponding edges thereof. Once a plurality of frame members are connected together and a gas-tight panel is installed, the compressible gasket(s) can be assembled to produce a gas-tight, sealed gas envelope assembly. The sealed gas envelope assembly may be formed to have corner edges of the frame member sealed by a plurality of compressible gaskets. For each frame member, such as but not limited to inner wall frame surface, top wall frame surface, vertical side wall frame surface, bottom wall frame surface, and combinations thereof may be provided with one or more compressible washers.

對於氣體包體總成之各種實施例,每一框架構件可包含複數個區段,該等區段經構架及製造來接納可密封地安裝於每一區段中的多種面板類型中之任一者,以便為每一面板提供氣密式面板密封。在本教示之氣體包體總成的各種實施例中,每一區段框架可具有區段框架墊圈,該區段框架墊圈與所選緊固件一起確保安裝於每一區段框架中之每一面板可為每一面板提供氣密式密封,且因此為完全建構之氣體包體提供氣密式密封。在各種實施例中,氣體包體總成可具有位於壁面板中之每一者中的窗口面板或服務窗口中之一或多者;其中每一窗口面板或服務窗口可具有至少一個手套埠(gloveport)。在氣體包體總成之組裝期間,每一手套埠可使 手套得以附接以使得該手套可延伸至該內部中。根據各種實施例中,每一手套埠可具有用於安裝手套之硬體,其中此硬體在每一手套埠周圍利用墊圈密封,其提供氣密式密封以便使透過手套埠之洩漏或分子擴散最小化。對於本教示之氣體包體總成的各種實施例,該硬體經進一步設計用於為終端使用者對手套埠進行封蓋(capping)及開蓋(uncapping)提供方便。 For various embodiments of the gas enclosure assembly, each frame member may include a plurality of sections that are framed and manufactured to accept any of a variety of panel types that can be sealingly installed in each section In order to provide hermetic panel sealing for each panel. In various embodiments of the gas enclosure assembly of the present teachings, each section frame may have a section frame washer that together with the selected fasteners ensure that each is installed in each section frame The panel can provide a gas-tight seal for each panel, and therefore a fully constructed gas envelope. In various embodiments, the gas enclosure assembly may have one or more of a window panel or service window located in each of the wall panels; wherein each window panel or service window may have at least one glove port ( gloveport). During assembly of the gas enclosure assembly, each glove port allows the glove to be attached so that the glove can extend into the interior. According to various embodiments, each glove port may have a hard body for mounting gloves, wherein the hard body is sealed with a gasket around each glove port, which provides an airtight seal to allow leakage or molecular diffusion through the glove port minimize. For various embodiments of the gas enclosure assembly of the present teachings, the hardware is further designed to facilitate the end user in capping and uncapping the glove port.

根據本教示之氣體包體總成及系統的各種實施例可包括由複數個框架構件及面板區段形成之氣體包體總成,以及氣體循環組件、過濾組件及淨化組件。對於氣體包體總成及系統之各種實施例,可在組裝處理期間安裝管道(ductwork)。根據本教示之各種實施例,可將管道安裝於已由複數個框架構件建構而成之氣體包體框架總成中。在各種實施例中,可在複數個框架構件被連接來形成氣體包體框架總成之前將管道安裝於該複數個框架構件上。用於氣體包體總成及系統之各種實施例的管道可經組配以使得自一或多個管道入口吸入該管道中之大致全部氣體被移動通過在氣體包體總成及系統內部之用於移除顆粒物的氣體循環及過濾迴路之各種實施例。另外,氣體包體總成及系統之各種實施例的管道可經組配來將在氣體包體總成外部的氣體淨化迴路之入口及出口與在氣體包體總成內部的氣體循環及過濾迴路分開。 Various embodiments of the gas envelope assembly and system according to the present teachings may include a gas envelope assembly formed by a plurality of frame members and panel sections, as well as gas circulation components, filtration components, and purification components. For various embodiments of gas enclosure assemblies and systems, ductwork can be installed during the assembly process. According to various embodiments of the present teaching, the pipeline can be installed in a gas envelope frame assembly that has been constructed from a plurality of frame members. In various embodiments, the piping may be installed on the plurality of frame members before the plurality of frame members are connected to form the gas inclusion frame assembly. The pipes used in various embodiments of the gas envelope assembly and system can be configured so that substantially all of the gas drawn into the pipe from one or more pipe inlets is moved through the use inside the gas envelope assembly and system Various embodiments of gas circulation and filtration circuits for removing particulate matter. In addition, the gas package assembly and the piping of various embodiments of the system can be configured to combine the inlet and outlet of the gas purification circuit outside the gas package assembly with the gas circulation and filtration circuit inside the gas package assembly separate.

例如,氣體包體總成及系統可具有在氣體包體總成內部的氣體循環及過濾系統。此內部過濾系統可具有在該內部中之複數個風扇過濾單元,且可經組配來在該內部中提供氣體的層流。該層流可在自該內部之頂部至該內部之底部的方向上,或在任何其他方向上。儘管藉由循環系統所產生之氣流無需為層狀的,但氣體之層流可用來確保內部中之氣體之徹 底及完全的翻轉。氣體之層流亦可用來使紊流最小化,此紊流係不受歡迎的,因為其可導致環境中之粒子在此等紊流區域中聚集,從而阻礙過濾系統自環境中移除彼等粒子。此外,為了在內部中維持所需溫度,可提供利用複數個熱交換器之熱調節系統,其例如與風扇或另一氣體循環裝置一起操作、相鄰或結合使用。氣體淨化迴路可經組配來使來自氣體包體總成之內部的氣體循環通過在該包體外部的至少一個氣體淨化組件。就此而言,在氣體包體總成內部的循環及過濾系統與在氣體包體總成外部的氣體淨化迴路相結合,可在整個氣體包體總成中提供大致上低微粒的惰性氣體之連續循環,該惰性氣體具有大致上低含量之反應性物種。氣體淨化系統可經組配來維持不需要的成分之極低含量,該等成分例如有機溶劑及其蒸汽,以及水、水蒸汽、氧氣及類似物。 For example, the gas enclosure assembly and system may have a gas circulation and filtration system inside the gas enclosure assembly. This internal filtration system may have a plurality of fan filtration units in the interior, and may be configured to provide a laminar flow of gas in the interior. The laminar flow may be in the direction from the top of the interior to the bottom of the interior, or in any other direction. Although the gas flow generated by the circulation system need not be laminar, the laminar flow of gas can be used to ensure the complete and complete turning of the gas in the interior. The laminar flow of gas can also be used to minimize turbulence, which is undesirable because it can cause particles in the environment to accumulate in these turbulent areas, thereby preventing the filtration system from removing them from the environment particle. In addition, in order to maintain a desired temperature in the interior, a heat regulation system using a plurality of heat exchangers may be provided, which operates, for example, in conjunction with a fan or another gas circulation device, adjacent or in combination. The gas purification circuit may be configured to circulate gas from inside the gas enclosure assembly through at least one gas purification assembly outside the enclosure. In this regard, the circulation and filtration system inside the gas envelope assembly, combined with the gas purification circuit outside the gas envelope assembly, can provide a continuous flow of substantially low particulate inert gas throughout the gas envelope assembly Circulating, the inert gas has a substantially low content of reactive species. The gas purification system can be configured to maintain extremely low levels of undesirable components, such as organic solvents and their vapors, as well as water, water vapor, oxygen, and the like.

除了提供氣體循環組件、過濾組件及淨化組件之外,管道亦可經設定大小及設定形狀來在其中容納電線、線束以及各種含流體之管線中之至少一者,該等管線在成束時可具有相當大之無效體積,諸如水、水蒸汽、氧氣及類似物之大氣成分可被截留在該無效體積中且難以藉由淨化系統將其移除。在一些實施例中,電纜、電線及線束以及含流體之管線中之任一者的組合可大致上佈置於管道中,且可操作性地與佈置於內部中之電氣系統、機械系統、流體系統及冷卻系統中之至少一者分別相關聯。因為氣體循環組件、過濾組件及淨化組件可經組配以使得大致上全部循環惰性氣體通過該管道,所以,藉由使各種成束材料包含於該管道中,可自此等成束材料之相當大的無效體積有效地沖洗掉截留在此等成束材料之無效體積中的大氣成分。 In addition to providing gas circulation components, filtration components, and purification components, the pipes can also be sized and shaped to accommodate at least one of electrical wires, wiring harnesses, and various fluid-containing pipelines. These pipelines can be bundled With a considerable invalid volume, atmospheric components such as water, water vapor, oxygen, and the like can be trapped in the invalid volume and it is difficult to remove it by a purification system. In some embodiments, the combination of any of the cables, wires and harnesses, and fluid-containing pipelines may be arranged substantially in the pipeline, and operable with electrical systems, mechanical systems, fluid systems arranged in the interior It is associated with at least one of the cooling systems. Because the gas circulation component, the filtration component, and the purification component can be configured so that substantially all of the circulating inert gas passes through the pipeline, by including various bundled materials in the pipeline, the bundled materials can be equivalent The large void volume effectively flushes out atmospheric components trapped in the void volume of these bundled materials.

根據本教示之氣體包體總成及系統的各種實施例可包括由複數個框架構件及面板區段形成之氣體包體總成,以及氣體循環組件、過濾組件及淨化組件,且另外包括加壓惰性氣體再循環系統之各種實施例。如隨後將更為詳細地討論,此加壓惰性氣體再循環系統可在OLED列印系統之操作中用於各種氣動驅動式裝置及設備利用。 Various embodiments of the gas envelope assembly and system according to the present teaching may include a gas envelope assembly formed by a plurality of frame members and panel sections, as well as gas circulation components, filtration components, and purification components, and additionally including pressurization Various embodiments of inert gas recycling systems. As will be discussed in more detail later, this pressurized inert gas recirculation system can be used for various pneumatically driven devices and equipment in the operation of OLED printing systems.

根據本教示,解決了若干工程挑戰,以便在氣體包體總成及系統中提供加壓惰性氣體再循環系統之各種實施例。首先,在無加壓系統惰性氣體再循環系統的氣體包體總成及系統之典型操作下,氣體包體總成可相對於外部壓力維持在小幅正內部壓力下,以便在氣體包體總成及系統中出現任何洩漏時防止外部氣體或空氣進入內部。例如,在典型操作下,對於本教示之氣體包體總成及系統的各種實施例,氣體包體總成之內部可相對於在包體系統外部的周圍大氣維持在例如至少為2mbarg之壓力下,例如,維持在至少為4mbarg之壓力下、維持在至少為6mbarg之壓力下、維持在至少為8mbarg之壓力下,或維持在更高之壓力下。在氣體包體總成系統中維持加壓惰性氣體再循環系統可具有挑戰性,因為其關於維持氣體包體總成及系統之小幅正內部壓力而同時持續地引入加壓氣體至氣體包體總成及系統中提出了動態及持續平衡作用。此外,各種裝置及設備之可變的需求可產生本教示之各種氣體包體總成及系統之不規則壓力分佈。在此等條件下,對相對於外部環境保持在小幅正壓力下的氣體包體總成維持動態壓力平衡可提供正在進行的OLED列印處理之完整性。 According to the present teachings, several engineering challenges are solved in order to provide various embodiments of a pressurized inert gas recirculation system in the gas envelope assembly and system. First of all, under the typical operation of the gas envelope assembly of the inert gas recirculation system without a pressurized system and the system, the gas envelope assembly can be maintained at a slightly positive internal pressure relative to the external pressure so that the gas envelope assembly And prevent any outside air or air from entering the interior when there is any leakage in the system. For example, under typical operations, for various embodiments of the gas enclosure assembly and system of the present teachings, the interior of the gas enclosure assembly can be maintained at a pressure of, for example, at least 2 mbarg relative to the surrounding atmosphere outside the enclosure system For example, maintaining a pressure of at least 4 mbarg, maintaining a pressure of at least 6 mbarg, maintaining a pressure of at least 8 mbarg, or maintaining a higher pressure. Maintaining a pressurized inert gas recirculation system in a gas inclusion assembly system can be challenging because it involves maintaining a small positive internal pressure of the gas inclusion assembly and the system while continuously introducing pressurized gas to the gas inclusion assembly The dynamic and continuous balance function is proposed in the Chengji system. In addition, the variable requirements of various devices and equipment can produce irregular pressure distributions for various gas inclusion assemblies and systems taught in this teaching. Under these conditions, maintaining the dynamic pressure balance of the gas inclusion assembly maintained at a slight positive pressure relative to the external environment can provide the integrity of the ongoing OLED printing process.

對於氣體包體總成及系統之各種實施例,根據本教示之加壓惰性氣體再循環系統可包括可利用壓縮機、累積器(accumulator)及鼓風機 及其組合中之至少一者的加壓惰性氣體迴路之各種實施例。包括加壓惰性氣體迴路之各種實施例的加壓惰性氣體再循環系統之各種實施例可具有特別設計之壓力控制型旁通迴路,該旁通迴路可在本教示之氣體包體總成及系統中提供處於穩定的所定義值的惰性氣體內部壓力。在氣體包體總成及系統之各種實施例中,加壓惰性氣體再循環系統可經組配來當加壓惰性氣體迴路之累積器中的惰性氣體之壓力超出預先設定之臨界壓力時,經由壓力控制型旁通迴路來再循環加壓惰性氣體。臨界壓力可例如在約25psig(磅/平方吋表壓)至約200psig之間的範圍內,或更具體而言在約75psig至約125psig之間的範圍內,或更具體而言在約90psig至約95psig之間的範圍內。就此而言,具有擁有特別設計之壓力控制型旁通迴路的加壓惰性氣體再循環系統的本教示之氣體包體總成及系統可維持在氣密式密封型氣體包體中具有加壓惰性氣體再循環系統之平衡。 For various embodiments of the gas envelope assembly and system, the pressurized inert gas recirculation system according to the teachings can include pressurized inerts that can utilize at least one of a compressor, an accumulator, a blower, and combinations thereof Various embodiments of gas circuits. Various embodiments of the pressurized inert gas recirculation system including various embodiments of the pressurized inert gas circuit may have a specially designed pressure control type bypass circuit, which can be included in the gas envelope assembly and system of this teaching Provides the internal pressure of the inert gas at a stable defined value. In various embodiments of the gas envelope assembly and system, the pressurized inert gas recirculation system can be configured to pass when the pressure of the inert gas in the accumulator of the pressurized inert gas circuit exceeds a preset critical pressure, Pressure controlled bypass circuit to recycle pressurized inert gas. The critical pressure may range, for example, from about 25 psig (pounds per square inch gauge) to about 200 psig, or more specifically from about 75 psig to about 125 psig, or more specifically from about 90 psig to Within the range between about 95 psig. In this regard, the gas enclosure assembly and system of the present teaching having a pressurized inert gas recirculation system with a specially designed pressure-controlled bypass circuit can be maintained in a gas-tight sealed gas enclosure with pressurized inertness Balance of gas recirculation system.

根據本教示,各種裝置及設備可佈置於內部中且與具有各種加壓惰性氣體迴路之加壓惰性氣體再循環系統之各種實施例流體連通,該等加壓惰性氣體迴路可利用多種加壓氣體源,諸如壓縮機、鼓風機及其組合中之至少一者。對於本教示之氣體包體及系統的各種實施例,各種氣動操作型裝置及設備之使用可提供低粒子生成性能並且具有低維護性。可佈置於氣體包體總成及系統之內部中且與各種加壓惰性氣體迴路流體連通的示例性裝置及設備可包括:例如但不限於氣動機器人、基板漂浮台、空氣軸承、空氣套管、壓縮氣體工具、氣動致動器及其組合中之一或多者。基板漂浮台以及空氣軸承可用於操作根據本教示之氣體包體總成的各種實施例之OLED列印系統的各方面。例如,利用空氣軸承技術之基板漂浮台可 用來將基板傳送至列印頭腔室中之位置中,以及用來在OLED列印處理期間支撐基板。 According to the teachings, various devices and equipment can be arranged in the interior and in fluid communication with various embodiments of a pressurized inert gas recirculation system having various pressurized inert gas circuits that can utilize multiple pressurized gases Source, such as at least one of a compressor, a blower, and combinations thereof. For various embodiments of the gas enclosure and system taught in this teaching, the use of various pneumatically operated devices and equipment can provide low particle generation performance and low maintenance. Exemplary devices and equipment that can be placed in the interior of the gas envelope assembly and system and in fluid communication with various pressurized inert gas circuits can include, for example, but not limited to, pneumatic robots, substrate floating tables, air bearings, air sleeves, One or more of compressed gas tools, pneumatic actuators, and combinations thereof. The substrate floating table and the air bearing can be used to operate various aspects of the OLED printing system according to various embodiments of the gas inclusion assembly of the present teachings. For example, a substrate floating table using air bearing technology can be used to transfer the substrate into a position in the print head chamber, and to support the substrate during the OLED printing process.

A‧‧‧管線/反應性物種 A‧‧‧Pipeline/Reactive species

B‧‧‧電線/惰性氣體物種 B‧‧‧Wire/Inert gas species

C‧‧‧同軸電纜 C‧‧‧Coaxial cable

D‧‧‧無效空間 D‧‧‧Invalid space

FH1‧‧‧第一懸浮高度 FH1‧‧‧First flying height

FH2‧‧‧第二懸浮高度 FH2‧‧‧Second flying height

I‧‧‧第一墊圈/第一墊圈長度/束 I‧‧‧First washer/first washer length/bundle

I’‧‧‧墊圈分段 I’‧‧‧ Washer section

II‧‧‧墊圈/第二墊圈長度/管道 II‧‧‧washer/second washer length/pipe

II’‧‧‧墊圈分段 II’‧‧‧ Washer section

III‧‧‧墊圈/惰性氣體 III‧‧‧Gasket/inert gas

III’‧‧‧墊圈分段 III’‧‧‧ Washer section

W1‧‧‧接觸長度 W1‧‧‧ contact length

W2‧‧‧接觸長度 W2‧‧‧Contact length

W3‧‧‧接觸長度 W3‧‧‧Contact length

V1‧‧‧閥 V1‧‧‧Valve

V2‧‧‧閥 V2‧‧‧Valve

V3‧‧‧閥 V3‧‧‧Valve

V4‧‧‧閥 V4‧‧‧Valve

10‧‧‧嵌入式面板區段 10‧‧‧Embedded panel section

12‧‧‧框架 12‧‧‧Frame

14‧‧‧盲螺紋孔 14‧‧‧blind threaded hole

15‧‧‧螺釘 15‧‧‧screw

16‧‧‧壓縮墊圈 16‧‧‧Compression washer

20‧‧‧窗口面板區段 20‧‧‧Window panel section

22‧‧‧框架 22‧‧‧Frame

30‧‧‧服務窗口面板區段 30‧‧‧Service window panel section

32‧‧‧框架 32‧‧‧Frame

34‧‧‧窗口導引間隔物 34‧‧‧Window guide spacer

35‧‧‧窗口夾 35‧‧‧Window clip

36‧‧‧夾緊座 36‧‧‧Clamp seat

38‧‧‧可壓縮墊圈 38‧‧‧Compressible washer

40‧‧‧天花板框架區段 40‧‧‧ Ceiling frame section

41‧‧‧第一側 41‧‧‧ First side

42‧‧‧天花板框架梁 42‧‧‧ Ceiling frame beam

43‧‧‧第二側 43‧‧‧Second side

44‧‧‧天花板框架梁 44‧‧‧ Ceiling frame beam

45‧‧‧第一照明元件 45‧‧‧First lighting element

46‧‧‧照明元件 46‧‧‧Lighting components

47‧‧‧第二照明元件 47‧‧‧Second lighting element

50‧‧‧OLED列印系統 50‧‧‧OLED printing system

54‧‧‧基板漂浮台 54‧‧‧Substrate floating platform

56‧‧‧橋 56‧‧‧ Bridge

58‧‧‧空氣軸承 58‧‧‧Air bearing

70‧‧‧花崗岩台 70‧‧‧ Granite table

87‧‧‧間隔物/間隔塊 87‧‧‧ spacer/spacer

89‧‧‧間隔物/間隔塊 89‧‧‧ spacer/spacer

90‧‧‧間隔塊條 90‧‧‧ spacer strip

91‧‧‧間隔物/間隔塊 91‧‧‧ spacer/spacer

92‧‧‧橫向側 92‧‧‧Horizontal side

93‧‧‧間隔物/間隔塊 93‧‧‧ spacer/spacer

94‧‧‧頂部表面 94‧‧‧Top surface

95‧‧‧間隔物/間隔塊 95‧‧‧ spacer/spacer

96‧‧‧底部表面 96‧‧‧Bottom surface

97‧‧‧間隔物/間隔塊 97‧‧‧ spacer/spacer

100‧‧‧氣體包體總成 100‧‧‧ gas inclusion assembly

103‧‧‧風扇過濾單元罩蓋 103‧‧‧Fan filter unit cover

105‧‧‧第一天花板框架管道 105‧‧‧The first ceiling frame pipe

107‧‧‧第二天花板框架管道 107‧‧‧Second ceiling frame pipe

109‧‧‧薄片金屬面板區段 109‧‧‧ Sheet metal panel section

110‧‧‧嵌入式面板 110‧‧‧Embedded panel

120‧‧‧窗口面板 120‧‧‧Window panel

122‧‧‧面板框架 122‧‧‧Panel frame

124‧‧‧窗口 124‧‧‧window

130‧‧‧易於移除之服務窗口 130‧‧‧Easy to remove service window

131‧‧‧內部表面 131‧‧‧Internal surface

132‧‧‧服務窗口框架 132‧‧‧Service window frame

134‧‧‧窗口 134‧‧‧window

136‧‧‧反作用肘節夾 136‧‧‧ Reaction toggle clamp

138‧‧‧窗口把手 138‧‧‧Window handle

140‧‧‧手套埠 140‧‧‧Glove port

142‧‧‧手套 142‧‧‧ gloves

150‧‧‧蓋子 150‧‧‧ lid

151‧‧‧內部表面 151‧‧‧Internal surface

152‧‧‧側 152‧‧‧ side

153‧‧‧外部表面 153‧‧‧External surface

154‧‧‧輪緣 154‧‧‧Rim

155‧‧‧螺釘桿 155‧‧‧Screw rod

156‧‧‧有肩螺釘 156‧‧‧Shoulder screw

157‧‧‧頭部/有肩螺釘頭部 157‧‧‧Head/shoulder screw head

160‧‧‧手套埠硬體總成 160‧‧‧Glove port hardware assembly

161‧‧‧後部板 161‧‧‧Rear board

162‧‧‧螺紋螺釘頭部 162‧‧‧Threaded screw head

163‧‧‧前部板 163‧‧‧Front panel

164‧‧‧凸緣 164‧‧‧Flange

165‧‧‧槽口/開口 165‧‧‧notch/opening

166‧‧‧卡口式閂鎖 166‧‧‧ bayonet latch

167‧‧‧鎖定凹部 167‧‧‧lock recess

168‧‧‧槽口 168‧‧‧Notch

169‧‧‧O型環密封件 169‧‧‧O-ring seal

200‧‧‧框架構件總成 200‧‧‧Frame member assembly

201‧‧‧前部外圍邊緣 201‧‧‧ Front peripheral edge

202‧‧‧底座 202‧‧‧Base

204‧‧‧底盤 204‧‧‧Chassis

205‧‧‧右側外圍邊緣 205‧‧‧Right peripheral edge

207‧‧‧後部外圍邊緣 207‧‧‧ Rear peripheral edge

210‧‧‧前部壁框架/第一壁框架 210‧‧‧Front wall frame/first wall frame

210’‧‧‧前部壁面板/第一壁面板 210’‧‧‧Front wall panel/first wall panel

220‧‧‧壁框架 220‧‧‧Wall frame

220’‧‧‧左側壁面板/壁面板 220’‧‧‧left wall panel/wall panel

226‧‧‧頂部 226‧‧‧Top

227‧‧‧頂部壁框架間隔板 227‧‧‧Top wall frame partition

228‧‧‧底部 228‧‧‧Bottom

229‧‧‧底部壁框架間隔板 229‧‧‧Bottom wall frame partition

230‧‧‧右側或第三壁框架/壁框架 230‧‧‧Right or third wall frame/wall frame

230’‧‧‧右側壁面板/第三壁面板/壁面板 230’‧‧‧right wall panel/third wall panel/wall panel

240‧‧‧壁框架 240‧‧‧Wall frame

240’‧‧‧後部壁面板/壁面板 240’‧‧‧ Rear wall panel/wall panel

250‧‧‧天花板框架 250‧‧‧Ceiling frame

250’‧‧‧天花板面板 250’‧‧‧ Ceiling panel

251‧‧‧內部部分 251‧‧‧Internal part

300‧‧‧密封總成 300‧‧‧Seal assembly

302‧‧‧間隙/墊圈間隙 302‧‧‧Gap/washer gap

304‧‧‧間隙/墊圈間隙 304‧‧‧ clearance/washer clearance

306‧‧‧墊圈間隙 306‧‧‧Gasket gap

310‧‧‧壁框架/第一壁框架 310‧‧‧Wall frame/first wall frame

311‧‧‧內部側/內部框架構件 311‧‧‧Inner side/inner frame member

312‧‧‧間隔板 312‧‧‧Spacer

314‧‧‧垂直側 314‧‧‧Vertical side

315‧‧‧頂部表面 315‧‧‧Top surface

316‧‧‧間隔板 316‧‧‧ spacer

317‧‧‧內部邊緣 317‧‧‧Inner edge

320‧‧‧第一墊圈/墊圈 320‧‧‧First washer/washer

321‧‧‧垂直墊圈長度 321‧‧‧Vertical washer length

323‧‧‧曲線墊圈長度 323‧‧‧curve washer length

325‧‧‧墊圈長度/長度 325‧‧‧washer length/length

340‧‧‧第二墊圈/墊圈 340‧‧‧Second washer/washer

345‧‧‧長度 345‧‧‧Length

350‧‧‧壁框架/第二壁框架 350‧‧‧Wall frame/second wall frame

353‧‧‧外部框架側 353‧‧‧External frame side

354‧‧‧垂直側 354‧‧‧Vertical side

355‧‧‧頂部表面 355‧‧‧Top surface

356‧‧‧間隔板 356‧‧‧Spacer

360‧‧‧第一墊圈/墊圈 360‧‧‧First washer/washer

361‧‧‧水平長度 361‧‧‧horizontal length

363‧‧‧曲線長度 363‧‧‧Curve length

365‧‧‧長度 365‧‧‧Length

370‧‧‧天花板框架 370‧‧‧Ceiling frame

400‧‧‧氣體包體框架總成 400‧‧‧Gas body frame assembly

402‧‧‧升降器總成 402‧‧‧Lift assembly

404‧‧‧升降器總成 404‧‧‧lifter assembly

406‧‧‧升降器總成 406‧‧‧lifter assembly

408‧‧‧磨損墊 408‧‧‧Wear pad

410‧‧‧安裝板 410‧‧‧Mounting plate

412‧‧‧第一夾鉗座 412‧‧‧The first clamp seat

413‧‧‧第二夾鉗座 413‧‧‧Second clamp seat

414‧‧‧第一夾鉗 414‧‧‧First clamp

415‧‧‧第二夾鉗 415‧‧‧Second clamp

416‧‧‧千斤頂曲柄 416‧‧‧jack crank

418‧‧‧千斤頂軸桿 418‧‧‧Jack shaft

422‧‧‧千斤頂底座 422‧‧‧Jack base

424‧‧‧腳座 424‧‧‧Foot

426‧‧‧整平腳 426‧‧‧Leveling feet

433‧‧‧頂部面板天花板 433‧‧‧Top panel ceiling

500‧‧‧管道總成 500‧‧‧Pipe assembly

502‧‧‧入口管道總成 502‧‧‧Inlet pipe assembly

505‧‧‧天花板管道 505‧‧‧Ceiling pipe

507‧‧‧天花板管道 507‧‧‧ Ceiling pipe

510‧‧‧前部壁面板管道總成 510‧‧‧Front wall panel pipe assembly

511‧‧‧開口 511‧‧‧ opening

512‧‧‧前部壁面板入口管道 512‧‧‧Front wall inlet pipe

514‧‧‧第一前部壁面板豎管 514‧‧‧The first front wall panel riser

515‧‧‧出口 515‧‧‧Export

516‧‧‧第二前部壁面板豎管 516‧‧‧Second front wall panel riser

517‧‧‧出口 517‧‧‧Export

520‧‧‧左側壁面板管道總成 520‧‧‧Left wall panel pipe assembly

521‧‧‧開口 521‧‧‧ opening

522‧‧‧左側壁面板入口管道 522‧‧‧Inlet pipe on the left wall panel

524‧‧‧第一左側壁面板豎管 524‧‧‧The first left wall panel riser

525‧‧‧第一管道入口端 525‧‧‧The first pipeline entrance

526‧‧‧左側壁面板第二豎管 526‧‧‧Second vertical pipe on left side wall panel

527‧‧‧第二管道出口端 527‧‧‧The second pipeline outlet

528‧‧‧左側壁面板上部管道 528‧‧‧Upper pipe on left side wall panel

530‧‧‧右側壁面板總成 530‧‧‧Right side wall panel assembly

531‧‧‧開口 531‧‧‧ opening

532‧‧‧右側壁面板入口管道 532‧‧‧Inlet pipe on the right side wall panel

533‧‧‧管道開口 533‧‧‧pipe opening

534‧‧‧右側壁面板第一豎管 534‧‧‧The first vertical pipe of the right side wall panel

535‧‧‧第一管道入口端 535‧‧‧The first pipeline entrance

536‧‧‧右側壁面板第二豎管/後部壁面板上部管道 536‧‧‧Second vertical pipe of right wall panel/upper pipe of rear wall panel

537‧‧‧第二管道出口端 537‧‧‧The second pipeline outlet

538‧‧‧右側壁面板上部管道 538‧‧‧Upper pipe of right side wall panel

540‧‧‧後部壁管道總成 540‧‧‧ Rear wall pipe assembly

541‧‧‧後部壁面板第一入口 541‧‧‧First entrance of rear wall panel

542‧‧‧後部壁面板入口管道 542‧‧‧ Rear wall inlet pipe

543‧‧‧後部壁面板第二入口 543‧‧‧Second entrance of rear wall panel

544‧‧‧後部壁面板底部管道 544‧‧‧The bottom pipe of the rear wall panel

545‧‧‧通風口 545‧‧‧ vent

547‧‧‧隔框 547‧‧‧frame

549‧‧‧第二隔框/隔框 549‧‧‧Second partition/frame

600‧‧‧氣體包體總成 600‧‧‧Gas body assembly

605‧‧‧回流管道 605‧‧‧Return pipeline

610‧‧‧嵌入式面板 610‧‧‧Embedded panel

630‧‧‧右側壁面板 630‧‧‧Right side wall panel

631‧‧‧開口 631‧‧‧ opening

632‧‧‧管道 632‧‧‧Pipeline

633‧‧‧滑動罩蓋 633‧‧‧Sliding cover

634‧‧‧第一束管道入口 634‧‧‧The first beam entrance

635‧‧‧頂部 635‧‧‧Top

636‧‧‧第二束管道入口 636‧‧‧Second beam entrance

637‧‧‧上部分 637‧‧‧Part

640‧‧‧後部壁面板 640‧‧‧ Rear wall panel

700‧‧‧漂浮台 700‧‧‧floating platform

710‧‧‧壓力-真空區 710‧‧‧pressure-vacuum zone

720‧‧‧第一過渡區 720‧‧‧The first transition zone

722‧‧‧第二過渡區 722‧‧‧Second Transition Zone

740‧‧‧僅壓力區 740‧‧‧ Pressure zone only

742‧‧‧熱交換器/僅壓力區 742‧‧‧ Heat exchanger/pressure zone only

744‧‧‧熱交換器 744‧‧‧ heat exchanger

752‧‧‧風扇過濾單元 752‧‧‧Fan filter unit

754‧‧‧風扇過濾單元 754‧‧‧Fan filter unit

760‧‧‧基板之部分 760‧‧‧Part of the substrate

800‧‧‧漂浮台 800‧‧‧floating platform

810‧‧‧壓力-真空區 810‧‧‧Pressure-vacuum zone

820‧‧‧第一過渡區 820‧‧‧The first transition zone

822‧‧‧第二過渡區 822‧‧‧The second transition zone

840‧‧‧僅壓力區 840‧‧‧ Pressure area only

842‧‧‧僅壓力區 842‧‧‧Pressure zone only

860‧‧‧基板 860‧‧‧ substrate

1000‧‧‧氣體包體總成 1000‧‧‧Gas body assembly

1010‧‧‧氣體包體總成 1010‧‧‧Gas body assembly

1050‧‧‧列印系統 1050‧‧‧ printing system

1051‧‧‧第一隔離體 1051‧‧‧Isolate

1052‧‧‧漂浮台支撐體 1052‧‧‧Floating platform support

1053‧‧‧第二隔離體 1053‧‧‧Second Isolator

1054‧‧‧基板漂浮台 1054‧‧‧Substrate floating platform

1058‧‧‧基板 1058‧‧‧Substrate

1070‧‧‧底座 1070‧‧‧Base

1070-1A‧‧‧陰影線 1070-1A‧‧‧hatched

1070-1B‧‧‧陰影線 1070-1B‧‧‧hatched

1070-2A‧‧‧陰影線結構 1070-2A ‧‧‧ hatched structure

1070-2B‧‧‧陰影線結構 1070-2B‧‧‧Shaded line structure

1071‧‧‧第一上表面/頂部表面 1071‧‧‧First upper surface/top surface

1072‧‧‧第一端部 1072‧‧‧First end

1073‧‧‧第二上表面 1073‧‧‧Second upper surface

1074‧‧‧第二端部 1074‧‧‧second end

1075‧‧‧第一豎管 1075‧‧‧The first vertical tube

1076‧‧‧第一側 1076‧‧‧First side

1077‧‧‧第二豎管 1077‧‧‧Second vertical pipe

1078‧‧‧第二側 1078‧‧‧Second side

1079‧‧‧橋 1079‧‧‧Bridge

1080‧‧‧第一列印頭總成 1080‧‧‧ First print head assembly

1081‧‧‧第二列印頭總成 1081‧‧‧ Second print head assembly

1082‧‧‧列印頭裝置 1082‧‧‧Print head device

1083‧‧‧列印頭裝置 1083‧‧‧Print head device

1084‧‧‧第一列印頭總成包體 1084‧‧‧The first print head assembly package

1085‧‧‧第二列印頭總成包體 1085‧‧‧The second print head assembly package

1086‧‧‧第一列印頭總成包體開口 1086‧‧‧Package opening of the first print head assembly

1088‧‧‧第一列印頭總成包體輪緣 1088‧‧‧The first printing head assembly body rim

1089‧‧‧第二列印頭總成包體輪緣 1089‧‧‧The second printing head assembly body rim

1090‧‧‧第一列印頭總成定位系統 1090‧‧‧First print head assembly positioning system

1091‧‧‧第二列印頭總成定位系統 1091‧‧‧Second print head assembly positioning system

1092‧‧‧第一X軸托架 1092‧‧‧The first X axis bracket

1094‧‧‧第一Z軸活動板 1094‧‧‧The first Z-axis movable board

1100‧‧‧前部框架總成 1100‧‧‧Front frame assembly

1100’‧‧‧前部面板總成 1100’‧‧‧Front panel assembly

1120‧‧‧前部底座框架/前部包體總成底座 1120‧‧‧Front base frame/front body assembly base

1120’‧‧‧前部底座面板總成 1120’‧‧‧Front base panel assembly

1121‧‧‧第一前部包體隔離體座 1121‧‧‧The first front body isolation seat

1122‧‧‧底盤 1122‧‧‧Chassis

1123‧‧‧第一前部包體隔離體壁框架 1123‧‧‧The first front enclosure wall frame

1127‧‧‧第二前部包體隔離體壁框架 1127‧‧‧Second front enclosure wall frame

1140‧‧‧前部壁框架 1140‧‧‧Front wall frame

1140’‧‧‧前部壁面板總成 1140’‧‧‧Front wall panel assembly

1142‧‧‧開口 1142‧‧‧ opening

1144‧‧‧橋框架 1144‧‧‧ bridge frame

1146‧‧‧嵌入式框架 1146‧‧‧Embedded frame

1147‧‧‧墊圈 1147‧‧‧washer

1148‧‧‧開口 1148‧‧‧ opening

1150‧‧‧閘閥門總成 1150‧‧‧Gate valve assembly

1151‧‧‧第一軌道 1151‧‧‧ First Track

1152‧‧‧第二軌道 1152‧‧‧The second track

1153‧‧‧第一托架 1153‧‧‧ First bracket

1154‧‧‧第二托架 1154‧‧‧Second bracket

1158‧‧‧門 1158‧‧‧ door

1160‧‧‧前部天花板框架 1160‧‧‧Front ceiling frame

1160’‧‧‧天花板面板總成 1160’‧‧‧ Ceiling panel assembly

1200‧‧‧中間框架總成 1200‧‧‧Intermediate frame assembly

1200’‧‧‧中間面板總成 1200’‧‧‧ Middle panel assembly

1220‧‧‧中間包體底座 1220‧‧‧Base base

1220’‧‧‧中間底座面板總成 1220’‧‧‧Intermediate base panel assembly

1221‧‧‧第一中間包體隔離體座 1221‧‧‧The first intermediate body isolation seat

1222‧‧‧底盤 1222‧‧‧Chassis

1223‧‧‧第一中間包體隔離體壁框架 1223‧‧‧Issue Wall Frame

1224‧‧‧第一框架構件 1224‧‧‧First frame member

1225‧‧‧通道 1225‧‧‧channel

1225’‧‧‧第一隔離體壁面板 1225’‧‧‧ First isolator wall panel

1226‧‧‧第二框架構件 1226‧‧‧Second frame member

1227‧‧‧第二中間包體隔離體壁框架 1227‧‧‧Second middle body isolation wall frame

1227’‧‧‧第二隔離體壁面板 1227’‧‧‧Second isolator wall panel

1228‧‧‧面板 1228‧‧‧Panel

1230’‧‧‧第一中間維護系統面板總成 1230’‧‧‧ First intermediate maintenance system panel assembly

1235‧‧‧第一密封件支撐面板 1235‧‧‧The first seal support panel

1237‧‧‧第一外表面 1237‧‧‧First outer surface

1238’‧‧‧第一後部壁面板總成 1238’‧‧‧First rear wall panel assembly

1240‧‧‧第一中間包體框架總成 1240‧‧‧The first tundish frame assembly

1240’‧‧‧第一中間包體面板總成 1240’‧‧‧First intermediate body panel assembly

1241‧‧‧第一底板總成 1241‧‧‧First bottom plate assembly

1241’‧‧‧第一底板總成 1241’‧‧‧First bottom plate assembly

1242‧‧‧第一列印頭總成開口 1242‧‧‧ First print head assembly opening

1245‧‧‧第一列印頭總成對接墊圈 1245‧‧‧ Butt washer for the first print head assembly

1247‧‧‧第一列印頭總成閘閥 1247‧‧‧ First print head assembly gate valve

1250‧‧‧第一維護系統總成 1250‧‧‧ First maintenance system assembly

1251‧‧‧第一維護系統定位系統 1251‧‧‧The first maintenance system positioning system

1252‧‧‧液滴校準模組 1252‧‧‧Drop calibration module

1253‧‧‧第一維護系統總成平台 1253‧‧‧The first maintenance system assembly platform

1254‧‧‧沖洗盆模組 1254‧‧‧Flush basin module

1256‧‧‧吸墨模組 1256‧‧‧ ink absorption module

1260‧‧‧天花板框架總成 1260‧‧‧Ceiling frame assembly

1260’‧‧‧中間壁及天花板面板總成 1260’‧‧‧Middle wall and ceiling panel assembly

1261‧‧‧第一通道 1261‧‧‧ First channel

1263‧‧‧第一密封件 1263‧‧‧The first seal

1265‧‧‧第二通道 1265‧‧‧Second channel

1267‧‧‧第二密封件 1267‧‧‧Second seal

1270’‧‧‧第二中間維護系統面板總成 1270’‧‧‧ Second intermediate maintenance system panel assembly

1275‧‧‧第二密封件支撐面板 1275‧‧‧Second seal support panel

1277‧‧‧第二外表面 1277‧‧‧Second outer surface

1278‧‧‧第二後部壁框架總成 1278‧‧‧Second rear wall frame assembly

1278’‧‧‧第二後部壁面板總成 1278’‧‧‧Second rear wall panel assembly

1280‧‧‧第二中間包體框架總成 1280‧‧‧Second middle body frame assembly

1280’‧‧‧第二中間包體面板總成 1280’‧‧‧Second middle body panel assembly

1281’‧‧‧第二底板總成 1281’‧‧‧Second base plate assembly

1282‧‧‧第二列印頭總成開口 1282‧‧‧Second print head assembly opening

1285‧‧‧第二列印頭總成對接墊圈 1285‧‧‧ Butt washer for the second print head assembly

1287‧‧‧第二列印頭總成閘閥 1287‧‧‧Second print head assembly gate valve

1290‧‧‧第二維護系統總成 1290‧‧‧Second maintenance system assembly

1291‧‧‧第二維護系統定位系統 1291‧‧‧Second maintenance system positioning system

1293‧‧‧第二維護總成系統平台 1293‧‧‧Second maintenance assembly system platform

1300‧‧‧後部框架總成 1300‧‧‧ Rear frame assembly

1300’‧‧‧後部面板總成 1300’‧‧‧ Rear panel assembly

1320‧‧‧後部底座框架 1320‧‧‧Rear base frame

1320’‧‧‧後部底座面板總成 1320’‧‧‧ Rear base panel assembly

1321‧‧‧第一後部包體隔離體座 1321‧‧‧The first rear body isolation seat

1322‧‧‧底盤 1322‧‧‧Chassis

1323‧‧‧後部中間包體隔離體壁框架 1323‧‧‧Rear tundish partition wall frame

1327‧‧‧第二後部包體隔離體壁框架 1327‧‧‧Second rear enclosure wall frame

1340‧‧‧後部壁框架 1340‧‧‧Rear wall frame

1340’‧‧‧後部壁面板總成 1340’‧‧‧ Rear wall panel assembly

1360‧‧‧後部天花板框架 1360‧‧‧Rear ceiling frame

1360’‧‧‧後部天花板面板總成 1360’‧‧‧ Rear ceiling panel assembly

1500‧‧‧氣體包體總成/氣體包體總成腔室 1500‧‧‧Gas body assembly/Gas body assembly chamber

1500-S1‧‧‧第一框架構件總成區段 1500-S1‧‧‧The first frame member assembly section

1500-S2‧‧‧第二框架構件總成區段 1500-S2‧‧‧Second frame member assembly section

1510‧‧‧入口腔室 1510‧‧‧ Entrance chamber

1512‧‧‧第一入口閘/閘 1512‧‧‧First entrance gate/gate

1514‧‧‧閘 1514‧‧‧ gate

1520‧‧‧出口腔室 1520‧‧‧Exit the oral cavity

1522‧‧‧閘 1522‧‧‧ gate

1524‧‧‧閘 1524‧‧‧ gate

1550‧‧‧基板 1550‧‧‧ substrate

1600‧‧‧系統控制器 1600‧‧‧System controller

1700‧‧‧氣動控制系統 1700‧‧‧Pneumatic control system

1710‧‧‧惰性氣體源 1710‧‧‧Inert gas source

1712‧‧‧閥 1712‧‧‧Valve

1720‧‧‧真空源 1720‧‧‧Vacuum source

1722‧‧‧閥 1722‧‧‧Valve

2000‧‧‧氣體包體總成及系統 2000‧‧‧Gas body assembly and system

2100‧‧‧氣體包體總成及系統 2100‧‧‧Gas body assembly and system

2130‧‧‧氣體淨化系統 2130‧‧‧ gas purification system

2131‧‧‧氣體淨化出口線路 2131‧‧‧ Gas purification outlet line

2132‧‧‧溶劑移除系統 2132‧‧‧Solvent removal system

2133‧‧‧入口線路 2133‧‧‧ Entry Line

2134‧‧‧氣體淨化系統 2134‧‧‧ gas purification system

2140‧‧‧熱調節系統 2140‧‧‧Thermal Regulation System

2141‧‧‧急冷器 2141‧‧‧Quick cooler

2142‧‧‧第一熱交換器 2142‧‧‧The first heat exchanger

2143‧‧‧流體出口線路 2143‧‧‧ fluid outlet line

2144‧‧‧第二熱交換器 2144‧‧‧Second heat exchanger

2145‧‧‧流體入口線路 2145‧‧‧ fluid inlet circuit

2146‧‧‧第三熱交換器 2146‧‧‧The third heat exchanger

2150‧‧‧過濾系統 2150‧‧‧Filter system

2151‧‧‧風扇過濾單元 2151‧‧‧Fan filter unit

2152‧‧‧風扇過濾單元 2152‧‧‧Fan filter unit

2153‧‧‧風扇過濾單元 2153‧‧‧Fan filter unit

2154‧‧‧風扇過濾單元 2154‧‧‧Fan filter unit

2155‧‧‧風扇過濾單元 2155‧‧‧Fan filter unit

2156‧‧‧風扇過濾單元 2156‧‧‧Fan filter unit

2160‧‧‧壓縮機迴路 2160‧‧‧Compressor circuit

2161‧‧‧第一旁通入口閥 2161‧‧‧First bypass inlet valve

2162‧‧‧壓縮機 2162‧‧‧Compressor

2163‧‧‧第二閥 2163‧‧‧Second valve

2164‧‧‧累積器 2164‧‧‧Accumulator

2165‧‧‧壓力控制型旁通迴路 2165‧‧‧ Pressure-controlled bypass circuit

2168‧‧‧第二累積器 2168‧‧‧The second accumulator

2169‧‧‧加壓惰性氣體再循環系統 2169‧‧‧Pressure inert gas recirculation system

2170‧‧‧管道系統 2170‧‧‧Pipeline system

2171‧‧‧第一管道入口 2171‧‧‧The first pipeline entrance

2172‧‧‧第二管道入口 2172‧‧‧Second pipeline entrance

2173‧‧‧第一管道導管 2173‧‧‧The first pipeline catheter

2174‧‧‧第二管道導管 2174‧‧‧Second pipeline conduit

2175‧‧‧第一管道出口 2175‧‧‧The first pipeline outlet

2176‧‧‧第二管道出口 2176‧‧‧Second pipeline outlet

2190‧‧‧鼓風機迴路 2190‧‧‧Blower circuit

2192‧‧‧殼體 2192‧‧‧case

2193‧‧‧第一隔離閥 2193‧‧‧Isolation valve

2194‧‧‧第一鼓風機 2194‧‧‧First blower

2195‧‧‧止回閥 2195‧‧‧ Check valve

2196‧‧‧可調整閥 2196‧‧‧Adjustable valve

2197‧‧‧第二隔離閥 2197‧‧‧Second isolation valve

2198‧‧‧熱交換器 2198‧‧‧ heat exchanger

2200‧‧‧氣體包體總成及系統 2200‧‧‧Gas body assembly and system

2300‧‧‧氣體包體總成及系統 2300‧‧‧Gas body assembly and system

2400‧‧‧氣體包體總成及系統 2400‧‧‧Gas body assembly and system

2500‧‧‧外部迴路 2500‧‧‧External circuit

2501‧‧‧氣體包體總成出口 2501‧‧‧ gas package assembly outlet

2502‧‧‧第一機械閥 2502‧‧‧ First mechanical valve

2503‧‧‧線路 2503‧‧‧ Line

2504‧‧‧第二機械閥 2504‧‧‧Second mechanical valve

2505‧‧‧閥 2505‧‧‧Valve

2506‧‧‧第三機械閥 2506‧‧‧The third mechanical valve

2507‧‧‧止回閥 2507‧‧‧Check valve

2508‧‧‧第四機械閥 2508‧‧‧ Fourth mechanical valve

2509‧‧‧封裝惰性氣體源 2509‧‧‧Package inert gas source

2510‧‧‧封裝惰性氣體線路 2510‧‧‧Package inert gas circuit

2512‧‧‧清潔乾燥空氣源/CDA源 2512‧‧‧ Clean dry air source/CDA source

2513‧‧‧低消耗量歧管 2513‧‧‧Low consumption manifold

2514‧‧‧交叉線第一區段 2514‧‧‧ Cross section 1

2516‧‧‧第一流量接點 2516‧‧‧First flow contact

2518‧‧‧第二流量接點 2518‧‧‧Second flow contact

2520‧‧‧壓縮機惰性氣體線路 2520‧‧‧Compressor inert gas circuit

2522‧‧‧CDA線路 2522‧‧‧CDA line

2524‧‧‧高消耗量歧管線路 2524‧‧‧High consumption manifold line

2525‧‧‧高消耗量歧管 2525‧‧‧High consumption manifold

2526‧‧‧第三流量接點 2526‧‧‧ Third Flow Contact

2528‧‧‧交叉線第二區段 2528‧‧‧The second section of the intersection

2530‧‧‧閥 2530‧‧‧Valve

2550‧‧‧真空系統 2550‧‧‧Vacuum system

2552‧‧‧線路 2552‧‧‧ Line

2554‧‧‧閥 2554‧‧‧Valve

3000‧‧‧氣體包體設備 3000‧‧‧Gas inclusion equipment

3100‧‧‧氣體包體總成及系統 3100‧‧‧Gas body assembly and system

藉由參考隨附圖式,將獲得對本揭露內容之特徵及優勢的更好理解,該等隨附圖式意欲例展示而非限制本教示。 By referring to the accompanying drawings, a better understanding of the features and advantages of this disclosure will be obtained. These accompanying drawings are intended to illustrate but not limit this teaching.

圖1為根據本教示之各種實施例的氣體包體總成及系統的示意圖。 FIG. 1 is a schematic diagram of a gas inclusion assembly and system according to various embodiments of the present teaching.

圖2為根據本教示之各種實施例的氣體包體總成及系統的左前部透視圖。 2 is a front left perspective view of a gas enclosure assembly and system according to various embodiments of the present teachings.

圖3為根據本教示之各種實施例的氣體包體總成之右前部透視圖。 FIG. 3 is a front right perspective view of a gas enclosure assembly according to various embodiments of the present teachings.

圖4描繪根據本教示之各種實施例的氣體包體總成之分解視圖。 FIG. 4 depicts an exploded view of a gas enclosure assembly according to various embodiments of the present teachings.

圖5為框架構件總成之分解的前透視圖,其描繪根據本教示之各種實施例的各種面板框架區段及區段面板。 5 is an exploded front perspective view of the frame member assembly, which depicts various panel frame sections and section panels according to various embodiments of the present teachings.

圖6A為手套埠蓋子之後部透視圖,而圖6B為根據本教示之氣體包體總成的各種實施例的手套埠蓋子之有肩螺釘(shoulder screw)的擴展視圖。 FIG. 6A is a rear perspective view of the glove port cover, and FIG. 6B is an expanded view of a shoulder screw of the glove port cover according to various embodiments of the gas bag assembly of the present teachings.

圖7A為手套埠封蓋總成之卡口式閂鎖的擴展透視圖,而圖7B為手套埠封蓋總成之截面圖,其展示有肩螺釘之頭部與卡口式閂鎖中之凹部的嚙合。 FIG. 7A is an expanded perspective view of the bayonet latch of the glove port cover assembly, and FIG. 7B is a cross-sectional view of the glove port cover assembly, showing the head of the shoulder screw and the bayonet type latch. Engagement of the recess.

圖8A至圖8C為用於形成接縫之墊圈密封的各種實施例之 頂部示意圖。 8A to 8C are schematic top views of various embodiments of gasket seals used to form seams.

圖9A及圖9B為描繪根據本教示之氣體包體總成的各種實施例之框架構件的密封之各種透視圖。 9A and 9B are various perspective views depicting sealing of frame members according to various embodiments of the gas enclosure assembly of the present teachings.

圖10A至圖10B為與根據本教示之氣體包體總成的各種實施例的區段面板之密封相關的各種視圖,該區段面板用於接納易於移除之服務窗口。 10A-10B are various views related to the sealing of a segment panel according to various embodiments of the gas enclosure assembly according to the present teachings, the segment panel being used to receive an easily removable service window.

圖11A至圖11B為與根據本教示之各種實施例之區段面板的密封相關之放大的透視截面圖,該區段面板用於接納嵌入式面板或窗口面板。 11A to 11B are enlarged perspective cross-sectional views related to sealing of a segment panel according to various embodiments of the present teachings, the segment panel being used to receive an embedded panel or a window panel.

圖12A為根據本教示之各種實施例的底座,其包括底盤及擱置於底盤上之複數個間隔塊。圖12B為圖12A中所指示之間隔塊的擴展透視圖。 12A is a base according to various embodiments of the present teachings, which includes a chassis and a plurality of spacers resting on the chassis. 12B is an expanded perspective view of the spacer block indicated in FIG. 12A.

圖13為與根據本教示之各種實施例的底盤相關聯之壁框架構件及天花板構件的分解視圖。 13 is an exploded view of wall frame members and ceiling members associated with a chassis according to various embodiments of the present teachings.

圖14A為根據本教示之各種實施例的氣體包體總成之一建構階段之透視圖,其中升降器總成位於升高的位置中。圖14B為圖14A中所指示之升降器總成的分解視圖。 14A is a perspective view of one stage of construction of a gas enclosure assembly according to various embodiments of the present teachings, where the lifter assembly is in a raised position. 14B is an exploded view of the elevator assembly indicated in FIG. 14A.

圖15為氣體包體總成之假想前部透視圖,其描繪安裝於根據本教示之各種實施例的氣體包體總成內部的管道。 15 is a imaginary front perspective view of the gas enclosure assembly, which depicts pipes installed inside the gas enclosure assembly according to various embodiments of the present teachings.

圖16為氣體包體總成之假想頂部透視圖,其描繪安裝於根據本教示之各種實施例的氣體包體總成內部的管道。 FIG. 16 is an imaginary top perspective view of the gas enclosure assembly, which depicts pipes installed inside the gas enclosure assembly according to various embodiments of the present teachings.

圖17為氣體包體總成之假想底部透視圖,其描繪安裝於根 據本教示之各種實施例的氣體包體總成內部的管道。 Fig. 17 is a hypothetical bottom perspective view of a gas package assembly, depicting a pipe installed inside the gas package assembly according to various embodiments of the present teachings.

圖18A為展示電纜、線及管線以及類似物之多個束的示意性表示。圖18B描繪氣體吹掃經過經由根據本教示之管道的各種實施例來饋送之此等束。 18A is a schematic representation showing multiple bundles of cables, wires and pipelines, and the like. FIG. 18B depicts a gas purge through these beams fed via various embodiments of the pipeline according to the present teachings.

圖19為展示如何藉由惰性氣體(B)吹掃過該等束所選路通過之管道來主動沖洗吸留在電纜、線、管線以及類似物之多個束之無效空間中的反應性物種(A)之示意性表示。 Fig. 19 shows how to actively flush the reactive species trapped in the ineffective space of multiple beams of cables, wires, pipelines and the like by sweeping the pipes selected by the beams through the inert gas (B) Schematic representation of (A).

圖20A為根據本教示之氣體包體總成及系統的各種實施例之選路通過管道的電纜及管線之假想透視圖。圖20B為圖20A中所示之開口的放大視圖,其展示根據本教示之氣體包體總成的各種實施例之用於封閉住該開口之罩蓋的細節。 FIG. 20A is a hypothetical perspective view of cables and pipelines routed through pipelines according to various embodiments of the gas enclosure assembly and system of the present teachings. FIG. 20B is an enlarged view of the opening shown in FIG. 20A showing details of a cover for closing the opening according to various embodiments of the gas bag assembly of the present teachings.

圖21為根據本教示之各種實施例的用於氣體包體總成及系統之天花板之視圖,該天花板包括照明系統。 21 is a view of a ceiling for a gas enclosure assembly and system according to various embodiments of the present teachings, the ceiling including a lighting system.

圖22為描繪根據本教示之各種實施例的用於氣體包體總成及系統組件之照明系統的LED光譜之曲線圖。 FIG. 22 is a graph depicting the LED spectrum of the lighting system for the gas envelope assembly and system components according to various embodiments of the present teachings.

圖23為根據本教示之各種實施例的氣體包體總成之視圖的前部透視圖。 23 is a front perspective view of a view of a gas enclosure assembly according to various embodiments of the present teachings.

圖24描繪根據本教示之各種實施例的如圖23中所描繪之氣體包體總成的各種實施例之分解視圖。 24 depicts an exploded view of various embodiments of the gas enclosure assembly as depicted in FIG. 23 according to various embodiments of the present teachings.

圖25描繪根據本教示之各種實施例的氣體包體總成之各種實施例之部分分解的前部透視圖。 Figure 25 depicts a partially exploded front perspective view of various embodiments of a gas enclosure assembly according to various embodiments of the present teachings.

圖26描繪根據本教示之各種實施例的如圖25中所描繪之氣 體包體總成的各種實施例之部分分解的側面透視圖。 26 depicts a partially exploded side perspective view of various embodiments of the gas enclosure assembly as depicted in FIG. 25 according to various embodiments of the present teachings.

圖27A及圖27B描繪根據本教示之各種實施例的如圖26中所描繪之氣體包體總成的擴展視圖。 27A and 27B depict expanded views of the gas enclosure assembly as depicted in FIG. 26 according to various embodiments of the present teachings.

圖28為穿過根據本教示之各種實施例的框架構件總成的截面圖,該框架構件總成包括底座及豎管。 28 is a cross-sectional view through a frame member assembly according to various embodiments of the present teachings, the frame member assembly including a base and a stand pipe.

圖29為根據本教示之各種實施例的氣體包體總成之視圖的前部透視圖。 FIG. 29 is a front perspective view of a view of a gas enclosure assembly according to various embodiments of the present teachings.

圖30描繪根據本教示之各種實施例的如圖29中所描繪之氣體包體總成的各種實施例之分解視圖。 30 depicts an exploded view of various embodiments of the gas enclosure assembly as depicted in FIG. 29 according to various embodiments of the present teachings.

圖31A為根據圖29中所描繪之氣體包體的各種實施例之氣體包體總成的橫截面圖。 31A is a cross-sectional view of a gas inclusion assembly according to various embodiments of the gas inclusion depicted in FIG. 29.

圖31B及圖31C為圖29中所描繪之氣體包體總成的橫截面圖,其描繪根據本教示之各種實施例的移動至維護位置中的列印頭總成之連續移動。 31B and 31C are cross-sectional views of the gas inclusion assembly depicted in FIG. 29, which depicts the continuous movement of the print head assembly moved to the maintenance position according to various embodiments of the present teachings.

圖31D至圖31F為根據圖29中所描繪之氣體包體的各種實施例之氣體包體總成的橫截面圖。 31D to 31F are cross-sectional views of gas inclusion assemblies according to various embodiments of the gas inclusion depicted in FIG. 29.

圖32描繪根據本教示之各種實施例的安裝於如圖29中所描繪之氣體包體總成的框架總成區段中之維護台的透視圖。 32 depicts a perspective view of a maintenance station installed in the frame assembly section of the gas enclosure assembly as depicted in FIG. 29 according to various embodiments of the present teachings.

圖33為根據本教示之各種實施例的如圖29中所描繪之氣體包體總成之框架總成區段的透視圖。 33 is a perspective view of a frame assembly section of the gas enclosure assembly as depicted in FIG. 29 according to various embodiments of the present teachings.

圖34A及圖34B為本教示之氣體包體總成及相關系統組件的各種實施例之示意圖。 34A and 34B are schematic diagrams of various embodiments of the gas enclosure assembly and related system components of the teaching.

圖35為氣體包體總成及系統之示意圖,其描繪通過根據本教示之各種實施例的氣體包體總成之氣體循環之實施例。 FIG. 35 is a schematic diagram of a gas enclosure assembly and system depicting an embodiment of gas circulation through the gas enclosure assembly according to various embodiments of the present teachings.

圖36為氣體包體總成及系統之示意圖,其描繪通過根據本教示之各種實施例的氣體包體總成之氣體循環之實施例。 36 is a schematic diagram of a gas enclosure assembly and system depicting an embodiment of gas circulation through a gas enclosure assembly according to various embodiments of the present teachings.

圖37為根據本教示之各種實施例的氣體包體總成之橫截面示意圖。 37 is a schematic cross-sectional view of a gas inclusion assembly according to various embodiments of the present teachings.

圖38為根據本教示之各種實施例的氣體包體總成及系統的示意圖。 38 is a schematic diagram of a gas inclusion assembly and system according to various embodiments of the present teachings.

圖39為根據本教示之各種實施例的氣體包體總成及系統的示意圖。 39 is a schematic diagram of a gas inclusion assembly and system according to various embodiments of the present teachings.

圖40為展示用於根據本教示之各種實施例的氣體包體總成及系統的各種操作模式之閥位置之表,該氣體包體總成及系統可利用外部氣體迴路。 FIG. 40 is a table showing valve positions for various operating modes of a gas enclosure assembly and system according to various embodiments of the present teachings that can utilize an external gas circuit.

圖41為描繪根據本教示之各種實施例的漂浮台之前部透視圖。 FIG. 41 is a front perspective view depicting a floating platform according to various embodiments of the present teachings.

圖42為圖40中所指示之用於根據本教示之各種實施例的漂浮台之區域的擴展視圖。 42 is an expanded view of the area indicated in FIG. 40 for the floating platform according to various embodiments of the present teachings.

圖43A及圖43B為展示基板在如圖40中所描繪之漂浮台上方行進期間所產生的彎曲之示意性截面圖。 43A and 43B are schematic cross-sectional views showing the bending of the substrate during travel over the floating platform as depicted in FIG. 40.

圖44為描繪根據本教示之漂浮台的各種實施例之漂浮台的前部透視圖。 44 is a front perspective view depicting a floating platform according to various embodiments of the floating platform of the present teachings.

圖45A及圖45B為展示基板在如圖43中所描繪之漂浮台上 方行進期間的大致平坦佈置之示意性截面圖。 45A and 45B are schematic cross-sectional views showing the substantially flat arrangement of the substrate during travel above the floating platform as depicted in FIG.

如前面所討論,基板漂浮台以及空氣軸承之各種實施例可用於封裝在根據本教示之氣體包體總成中的OLED列印系統之各種實施例的操作。如圖1中關於氣體包體總成及系統2000示意性地展示,利用空氣軸承技術之基板漂浮台可用來將基板傳送至列印頭腔室中之位置中,以及用來在OLED列印處理期間支撐基板。在圖1中,氣體包體總成1500可為可具有入口腔室1510之負載鎖定系統,該入口腔室用於經由第一入口閘1512及閘1514接納基板,以便將基板自入口腔室1510移動至氣體包體總成1500來進行列印。根據本教示之各種閘可用來將腔室彼此隔離以及與外部周圍環境隔離。根據本教示,各種閘可選自實體閘及氣體簾幕。 As previously discussed, various embodiments of the substrate floating table and air bearings can be used for the operation of various embodiments of the OLED printing system packaged in the gas envelope assembly according to the present teachings. As shown schematically in FIG. 1 with respect to the gas inclusion assembly and system 2000, a substrate floating table using air bearing technology can be used to transfer the substrate to a position in the print head chamber, and for OLED printing processing Support the substrate during. In FIG. 1, the gas inclusion assembly 1500 may be a load lock system that may have an inlet chamber 1510 for receiving a substrate through the first inlet gate 1512 and the gate 1514 so as to transfer the substrate from the inlet chamber 1510 Move to the gas package assembly 1500 to print. Various gates according to this teaching can be used to isolate the chambers from each other and the external surroundings. According to this teaching, various gates can be selected from physical gates and gas curtains.

在基板接納處理期間,閘1512可打開,而閘1514可處於關閉位置以便防止大氣氣體進入氣體包體總成1500。一旦基板被接納於入口腔室1510中,則兩個閘1512及1514均可關閉,且可使用諸如氮氣、稀有氣體中之任一者及其任一組合的惰性氣體來沖洗入口腔室1510,直至反應性大氣氣體係處於100ppm或更低之低含量,例如10ppm或更低、1.0ppm或更低或者0.1ppm或更低。大氣氣體達到足夠低的含量之後,閘1514可打開,而閘1512保持關閉,以便允許基板1550自入口腔室1510傳送至氣體包體總成腔室1500,如圖1中所描繪。自入口腔室1510至氣體包體總成腔室1500之基板傳送可經由例如但不限於腔室1500及1510中所提供之漂浮台。自入口腔室1510至氣體包體總成腔室1500之基板傳送亦可經由例如但不限於基板傳送機器人,該基板傳送機器人可將基板1550置放至腔室 1500中所提供之漂浮台上。在列印處理期間,基板1550可保持支撐於基板漂浮台上。 During the substrate receiving process, the gate 1512 may be opened, and the gate 1514 may be in a closed position to prevent atmospheric gas from entering the gas inclusion assembly 1500. Once the substrate is received in the inlet chamber 1510, both gates 1512 and 1514 can be closed, and an inert gas such as any one of nitrogen, a rare gas, and any combination thereof can be used to flush the inlet chamber 1510, Until the reactive atmospheric gas system is at a low content of 100 ppm or less, such as 10 ppm or less, 1.0 ppm or less, or 0.1 ppm or less. After the atmospheric gas reaches a sufficiently low content, the gate 1514 can be opened, while the gate 1512 remains closed to allow the substrate 1550 to be transferred from the inlet chamber 1510 to the gas inclusion assembly chamber 1500, as depicted in FIG. The substrate transfer from the inlet chamber 1510 to the gas inclusion assembly chamber 1500 may be via, for example but not limited to, the floating tables provided in the chambers 1500 and 1510. The substrate transfer from the entrance chamber 1510 to the gas inclusion assembly chamber 1500 may also be via, for example but not limited to, a substrate transfer robot that can place the substrate 1550 on the floating table provided in the chamber 1500. During the printing process, the substrate 1550 may remain supported on the substrate floating table.

氣體包體總成及系統2000之各種實施例可具有經由閘1524與氣體包體總成1500流體連通的出口腔室1520。根據氣體包體總成及系統2000之各種實施例,列印處理完成之後,可將基板1550經由閘1524自氣體包體總成1500傳送至出口腔室1520。自氣體包體總成腔室1500至出口腔室1520之基板傳送可係經由例如但不限於腔室1500及1520中所提供之漂浮台。自氣體包體總成腔室1500至出口腔室1520之基板傳送亦可經由例如但不限於基板傳送機器人,該基板傳送機器人可自腔室1500中所提供之漂浮台拾取基板1550並且將其傳送至腔室1520中。對於氣體包體總成及系統2000之各種實施例,當閘1524處於關閉位置以便防止反應性大氣氣體進入氣體包體總成1500時,可經由閘1522自出口腔室1520取回基板1550。 Various embodiments of the gas inclusion assembly and system 2000 may have an exit chamber 1520 in fluid communication with the gas inclusion assembly 1500 via a gate 1524. According to various embodiments of the gas package assembly and the system 2000, after the printing process is completed, the substrate 1550 can be transferred from the gas package assembly 1500 to the exit chamber 1520 via the gate 1524. Substrate transfer from the gas inclusion assembly chamber 1500 to the exit chamber 1520 may be via, for example, but not limited to, floating tables provided in chambers 1500 and 1520. The substrate transfer from the gas inclusion assembly chamber 1500 to the exit chamber 1520 can also be via, for example but not limited to, a substrate transfer robot that can pick up and transfer the substrate 1550 from the floating table provided in the chamber 1500 Into the chamber 1520. For various embodiments of the gas inclusion assembly and system 2000, when the gate 1524 is in the closed position to prevent reactive atmospheric gas from entering the gas inclusion assembly 1500, the substrate 1550 can be retrieved from the exit chamber 1520 via the gate 1522.

除了包括分別經由閘1514及閘1524與氣體包體總成1500流體連通之入口腔室1510及出口腔室1520之負載鎖定系統之外,氣體包體總成及系統2000亦可包括系統控制器1600。系統控制器1600可包括與一或多個記憶體電路(未圖示)連通之一或多個處理器電路(未圖示)。系統控制器1600亦可與包括入口腔室1510及出口腔室1520之負載鎖定系統連通,且最終與OLED列印系統之列印噴嘴連通。以此方式,系統控制器1600可協調閘1512、1514、1522及1524之打開與關閉。系統控制器1600亦可控制至OLED列印系統之列印噴嘴的墨水分配。可經由例如但不限於利用空氣軸承技術的基板漂浮台或利用空氣軸承技術之基板漂浮台與基板傳送機器人之組合來將基板1550傳送通過本教示之負載鎖定系統之各種實施例, 該負載鎖定系統包括分別經由閘1514及閘1524與氣體包體總成1500流體連通的入口腔室1510及出口腔室1520。 In addition to the load lock system including the inlet chamber 1510 and the outlet chamber 1520 in fluid communication with the gas capsule assembly 1500 via gate 1514 and gate 1524, respectively, the gas capsule assembly and system 2000 may also include a system controller 1600 . The system controller 1600 may include one or more processor circuits (not shown) in communication with one or more memory circuits (not shown). The system controller 1600 may also communicate with the load lock system including the inlet chamber 1510 and the outlet chamber 1520, and eventually communicate with the printing nozzle of the OLED printing system. In this way, the system controller 1600 can coordinate the opening and closing of the gates 1512, 1514, 1522, and 1524. The system controller 1600 can also control the ink distribution to the printing nozzles of the OLED printing system. The substrate 1550 can be transferred through various embodiments of the load lock system of the present teachings via, for example, but not limited to, a substrate floating table using air bearing technology or a combination of a substrate floating table using air bearing technology and a substrate transfer robot. It includes an inlet chamber 1510 and an outlet chamber 1520 in fluid communication with the gas inclusion assembly 1500 via gate 1514 and gate 1524, respectively.

圖1之負載鎖定系統的各種實施例亦可包括氣動控制系統1700,該氣動控制系統可包括真空源及惰性氣體源,該惰性氣體源可包括氮氣、稀有氣體中之任一者及其任一組合。封裝在氣體包體總成及系統2000中之基板漂浮系統可包括多個真空埠及氣體軸承埠,該等埠通常佈置於平坦表面上。可藉由諸如氮氣、稀有氣體中之任一者及其任一組合的惰性氣體之壓力自硬質表面提起基板1550並且保持其離開硬質表面。軸承體積之流出係藉由多個真空埠來實現。基板1550在基板漂浮台上方之懸浮高度通常隨氣體壓力及氣體流量而變。氣動控制系統1700之真空及壓力可用來在圖1之負載鎖定系統中之氣體包體總成1500內部的處置期間,例如列印期間,支撐基板1550。控制系統1700亦可用來在傳送通過圖1之負載鎖定系統期間支撐基板1550,該負載鎖定系統包括分別經由閘1514及閘1524與氣體包體總成1500流體連通的入口腔室1510及出口腔室1520。為了控制傳送基板1550通過氣體包體總成及系統2000,系統控制器1600分別經由閥1712及1722與惰性氣體源1710及真空源1720連通。可將額外的真空及惰性氣體供應線路及閥(未圖示)提供給圖1中之負載鎖定系統所例示的氣體包體總成及系統2000,來進一步提供控制被包封環境所需的各種氣體及真空設施。 Various embodiments of the load lock system of FIG. 1 may also include a pneumatic control system 1700. The pneumatic control system may include a vacuum source and an inert gas source. The inert gas source may include any one of nitrogen and rare gases and any one of them. combination. The substrate floating system packaged in the gas envelope assembly and system 2000 may include a plurality of vacuum ports and gas bearing ports, which are usually arranged on a flat surface. The substrate 1550 can be lifted from the hard surface by the pressure of an inert gas such as any one of nitrogen, a rare gas, and any combination thereof and kept away from the hard surface. The outflow of the bearing volume is achieved by multiple vacuum ports. The flying height of the substrate 1550 above the substrate floating table usually changes with the gas pressure and gas flow rate. The vacuum and pressure of the pneumatic control system 1700 can be used to support the substrate 1550 during the processing inside the gas envelope assembly 1500 in the load lock system of FIG. 1, such as during printing. The control system 1700 can also be used to support the substrate 1550 during transfer through the load lock system of FIG. 1, which includes an inlet chamber 1510 and an outlet chamber that are in fluid communication with the gas inclusion assembly 1500 via gates 1514 and 1524 1520. To control the transfer substrate 1550 through the gas package assembly and the system 2000, the system controller 1600 communicates with the inert gas source 1710 and the vacuum source 1720 via valves 1712 and 1722, respectively. Additional vacuum and inert gas supply lines and valves (not shown) can be provided to the gas envelope assembly and system 2000 illustrated by the load lock system in FIG. 1 to further provide various controls required for the enclosed environment Gas and vacuum facilities.

為了給根據本教示之氣體包體總成及系統的各種實施例提供更為立體之視角,圖2係氣體包體總成及系統2000之各種實施例的左前部透視圖。圖2描繪包括氣體包體總成1500、入口腔室1510及第一閘1512 之負載鎖定系統。圖2之氣體包體總成及系統2000可包括氣體淨化系統2130,其用於給氣體包體總成1500提供具有大致上低含量之反應性大氣物種(諸如水蒸汽及氧氣以及由OLED列印處理產生的有機溶劑蒸汽)的惰性氣體的恆定供應。圖2之氣體包體總成及系統2000亦具有如前面所討論的用於系統控制功能之系統控制器1600。 In order to provide a more three-dimensional perspective of various embodiments of the gas enclosure assembly and system according to the present teachings, FIG. 2 is a front left perspective view of various embodiments of the gas enclosure assembly and system 2000. FIG. 2 depicts a load lock system including a gas enclosure assembly 1500, an inlet chamber 1510, and a first gate 1512. The gas enclosure assembly and system 2000 of FIG. 2 may include a gas purification system 2130 that is used to provide the gas enclosure assembly 1500 with a substantially low content of reactive atmospheric species (such as water vapor and oxygen and printing by OLED A constant supply of inert gas from the organic solvent vapor generated by the treatment. The gas envelope assembly and system 2000 of FIG. 2 also has a system controller 1600 for system control functions as previously discussed.

圖3為根據本教示之各種實施例的完全建構之氣體包體總成100之右前部透視圖。氣體包體總成100可含有用於在氣體包體總成內部中維持惰性環境的一或多種氣體。本教示之氣體包體總成及系統可用於在內部中維持惰性氣體氣氛。惰性氣體可為在一組所定義條件下不會經歷化學反應之任何氣體。惰性氣體之一些常用實例可包括氮氣、稀有氣體中之任一者及其任一組合。氣體包體總成100經組配來包圍且保護空氣敏感型處理,諸如使用工業列印系統之有機發光二極體(OLED)墨水列印。與OLED墨水起反應的大氣氣體之實例包括水蒸汽及氧氣。如前面所討論,氣體包體總成100可經組配來維持密封之氣氛且允許組件或列印系統有效地操作,同時避免對其他反應性材料及基板的污染、氧化及損壞。 FIG. 3 is a front right perspective view of a fully constructed gas enclosure assembly 100 according to various embodiments of the present teachings. The gas enclosure assembly 100 may contain one or more gases for maintaining an inert environment inside the gas enclosure assembly. The gas inclusion assembly and system of this teaching can be used to maintain an inert gas atmosphere inside. The inert gas may be any gas that will not undergo a chemical reaction under a defined set of conditions. Some common examples of inert gases may include any of nitrogen, rare gases, and any combination thereof. The gas inclusion assembly 100 is configured to surround and protect air-sensitive processes, such as organic light-emitting diode (OLED) ink printing using industrial printing systems. Examples of atmospheric gases that react with OLED ink include water vapor and oxygen. As previously discussed, the gas inclusion assembly 100 can be configured to maintain a sealed atmosphere and allow components or printing systems to operate efficiently while avoiding contamination, oxidation, and damage to other reactive materials and substrates.

如圖3中所描繪,氣體包體總成之各種實施例可包含組件部分,該等組件部分包括前部或第一壁面板210'、左側或第二壁面板(未圖示)、右側或第三壁面板230'、後部或第四壁面板(未圖示)以及天花板面板250',其中氣體包體總成可附接至擱置於底座(未圖示)上之底盤204。如隨後將更為詳細地討論,圖1之氣體包體總成100的各種實施例可由前部或第一壁框架210、左側或第二壁框架(未圖示)、右側或第三壁框架230、後部或第四壁面板(未圖示)以及天花板框架250建構而成。天花板框架 250之各種實施例可包括風扇過濾單元罩蓋103以及第一天花板框架管道105及第二天花板框架管道107。根據本教示之實施例,各種類型之區段面板可安裝於包含框架構件之複數個面板區段中之任一者中。在圖1之氣體包體總成100的各種實施例中,薄片金屬面板區段109可在框架之建構期間焊接至框架構件中。對於氣體包體總成100之各種實施例,在氣體包體總成之建構及解構週期中可反復安裝及移除的區段面板之類型可包括:關於壁面板210'所指示之嵌入式面板110,以及關於壁面板230'所指示之窗口面板120及易於移除之服務窗口130。 As depicted in FIG. 3, various embodiments of the gas enclosure assembly may include component parts including a front or first wall panel 210', a left or second wall panel (not shown), a right or A third wall panel 230', a rear or fourth wall panel (not shown), and a ceiling panel 250', wherein the gas enclosure assembly can be attached to the chassis 204 resting on a base (not shown). As will be discussed in more detail later, various embodiments of the gas enclosure assembly 100 of FIG. 1 may be formed by the front or first wall frame 210, the left or second wall frame (not shown), the right or third wall frame 230, a rear or fourth wall panel (not shown) and a ceiling frame 250 are constructed. Various embodiments of the ceiling frame 250 may include the fan filter unit cover 103 and the first ceiling frame duct 105 and the second ceiling frame duct 107. According to the embodiments of the present teaching, various types of section panels can be installed in any one of a plurality of panel sections including frame members. In various embodiments of the gas enclosure assembly 100 of FIG. 1, the thin metal panel section 109 may be welded into the frame member during construction of the frame. For various embodiments of the gas enclosure assembly 100, the types of section panels that can be repeatedly installed and removed during the construction and deconstruction cycle of the gas enclosure assembly can include: embedded panels as indicated for the wall panel 210' 110, and the window panel 120 indicated on the wall panel 230' and the easily removable service window 130.

儘管易於移除之服務窗口130可提供對包體100之內部的輕鬆接取,但任何可移除之面板可用來提供對氣體包體總成及系統之內部的接取,以便進行修理及定期服務。用於服務或修理之此接取與諸如窗口面板120及易於移除之服務窗口130之面板所提供之接取不同該等面板可提供在使用期間自氣體包體總成之外部對氣體包體總成之內部的終端使用者手套接取。例如,如圖3中關於面板230所展示,手套中之任一者(諸如附接至手套埠140之手套142)可提供在氣體包體總成系統之使用期間對內部的終端使用者接取。 Although the easy-to-remove service window 130 can provide easy access to the interior of the enclosure 100, any removable panel can be used to provide access to the interior of the gas enclosure assembly and system for repair and regular service. This access for service or repair is different from the access provided by panels such as the window panel 120 and the easily removable service window 130. These panels can provide external access to the gas enclosure during use from the gas enclosure assembly The end-user gloves inside the assembly are accessible. For example, as shown in FIG. 3 with respect to panel 230, any of the gloves (such as gloves 142 attached to glove port 140) may provide access to internal end users during use of the gas body assembly system .

圖4描繪圖3中所描繪之氣體包體總成的各種實施例之分解視圖。氣體包體總成之各種實施例可具有複數個壁面板,包括前部壁面板210'之外側透視圖、左側壁面板220'之外側透視圖、右側壁面板230'之內部透視圖、後部壁面板240’之內部透視圖以及天護板面板250'之頂部透視圖,如圖3中所展示,該等壁面板可附接至擱置於底座202上之底盤204。OLED列印系統可安裝於底盤204之頂部上,其中已知列印處理對大氣條件 敏感。根據本教示,氣體包體總成可由框架構件建構而成,例如壁面板210'之壁框架210、壁面板220'之壁框架220、壁面板230'之壁框架230、壁面板240'之壁框架240以及天花板面板250'之天花板框架250,隨後將複數個區段面板安裝於該等框架構件中。就此而言,可能需要簡化在本教示之氣體包體總成的各種實施例之建構及解構週期中可反復安裝及移除的區段面板之設計。此外,可進行氣體包體總成100之輪廓塑造來容納OLED列印系統之各種實施例的佔據面積,以便使氣體包體總成中所需要之惰性氣體的體積最小化,並且在氣體包體總成之使用期間以及在維護期間給終端使用者提供輕鬆接取。 FIG. 4 depicts an exploded view of various embodiments of the gas inclusion assembly depicted in FIG. 3. Various embodiments of the gas enclosure assembly may have a plurality of wall panels, including a front perspective view of the front wall panel 210', an external perspective view of the left side wall panel 220', an internal perspective view of the right side wall panel 230', and the rear wall An internal perspective view of the panel 240' and a top perspective view of the roof panel 250', as shown in FIG. 3, the wall panels can be attached to the chassis 204 resting on the base 202. An OLED printing system can be installed on top of the chassis 204, where the printing process is known to be sensitive to atmospheric conditions. According to this teaching, the gas envelope assembly can be constructed from frame members, such as the wall frame 210 of the wall panel 210', the wall frame 220 of the wall panel 220', the wall frame 230 of the wall panel 230', and the wall of the wall panel 240' The frame 240 and the ceiling frame 250 of the ceiling panel 250' are then installed with a plurality of section panels in the frame members. In this regard, it may be necessary to simplify the design of the segment panel that can be repeatedly installed and removed during the construction and deconstruction cycles of various embodiments of the gas inclusion assembly of this teaching. In addition, the outline of the gas envelope assembly 100 can be contoured to accommodate the footprint of various embodiments of the OLED printing system, so as to minimize the volume of inert gas required in the gas envelope assembly, and End users are provided with easy access during the use of the assembly and during maintenance.

使用前部壁面板210'及左側壁面板220'作為示例,框架構件之各種實施例可具有在框架構件建構期間焊接至框架構件中的薄片金屬面板區段109。嵌入式面板110、窗口面板120及易於移除之服務窗口130可安裝於壁框架構件中之每一者中,且可在圖4之氣體包體總成100的建構及解構週期中反復安裝及移除。如可看出,在壁面板210'及壁面板220'之實例中,壁面板可具有靠近易於移除之服務窗口130的窗口面板120。類似地,如示例性後部壁面板240’中所描繪,壁面板可具有諸如窗口面板125之窗口面板,其具有兩個相鄰之手套埠140。對於根據本教示之壁框架構件的各種實施例,且及如關於圖3之氣體包體總成100所看出,此手套佈置提供自氣體包體之外部對被包封系統中的組件部分的輕鬆接取。因此,氣體包體之各種實施例可提供兩個或兩個以上手套埠,以使得終端使用者可將左側手套及右側手套延伸至內部中並且操縱內部中之一或多個物品而不擾亂內部中之氣態氣氛的組成物。例如,窗口面板120及服務窗口130中之任一者 可經定位來促進自氣體包體總成之外部對氣體包體總成之內部中的可調整組件的輕鬆接取。根據諸如窗口面板120及服務窗口130之窗口面板之各種實施例,當未指示經由手套埠手套之終端使用者接取時,此等窗口可能不包括手套埠及手套埠總成。 Using the front wall panel 210' and the left side wall panel 220' as examples, various embodiments of the frame member may have a sheet metal panel section 109 welded into the frame member during construction of the frame member. The embedded panel 110, the window panel 120, and the easily removable service window 130 may be installed in each of the wall frame members, and may be repeatedly installed and deconstructed during the construction and deconstruction cycle of the gas enclosure assembly 100 of FIG. Remove. As can be seen, in the example of the wall panel 210' and the wall panel 220', the wall panel may have a window panel 120 near the service window 130 that is easy to remove. Similarly, as depicted in the exemplary rear wall panel 240', the wall panel may have a window panel, such as window panel 125, having two adjacent glove ports 140. For the various embodiments of the wall frame member according to the present teachings, and as seen with respect to the gas enclosure assembly 100 of FIG. 3, this glove arrangement provides for the component parts of the encapsulated system from the outside of the gas enclosure Easy access. Therefore, various embodiments of the gas pack can provide two or more glove ports so that the end user can extend the left and right gloves into the interior and manipulate one or more items in the interior without disturbing the interior The composition of the gaseous atmosphere. For example, any one of the window panel 120 and the service window 130 may be positioned to facilitate easy access from the outside of the gas enclosure assembly to the adjustable components in the inside of the gas enclosure assembly. According to various embodiments of window panels such as window panel 120 and service window 130, when end users are not instructed to access via glove port gloves, these windows may not include the glove port and glove port assembly.

如圖4中所描繪之壁面板及天花板面板的各種實施例可具有複數個嵌入式面板110。如圖4中可看出,嵌入式面板可具有多種形狀及縱橫比。除了嵌入式面板之外,天花板面板250'亦可具有安裝、栓接、擰緊、固定或以其他方式固定至天花板框架250之風扇過濾單元罩蓋103以及第一天花板框架管道105及第二天花板框架管道107。如隨後將更為詳細地討論,與天花板面板250'之管道107流體連通的管道可安裝於氣體包體總成之內部中。根據本教示,此管道可為在氣體包體總成內部的氣體循環系統之一部分,並且提供用於分離退出氣體包體總成之流以便循環通過在氣體包體總成外部的至少一個氣體淨化組件。 Various embodiments of wall panels and ceiling panels as depicted in FIG. 4 may have multiple embedded panels 110. As can be seen in Figure 4, the embedded panel can have a variety of shapes and aspect ratios. In addition to the embedded panel, the ceiling panel 250' may also have a fan filter unit cover 103, a first ceiling frame duct 105, and a second ceiling frame installed, bolted, tightened, fixed, or otherwise fixed to the ceiling frame 250 Pipeline 107. As will be discussed in more detail later, a pipe in fluid communication with the pipe 107 of the ceiling panel 250' can be installed in the interior of the gas enclosure assembly. According to the teachings, this pipeline may be part of the gas circulation system inside the gas envelope assembly and provide a flow for separating and exiting the gas envelope assembly for circulation through at least one gas purification outside the gas envelope assembly Components.

圖5係框架構件總成200之分解的前部透視圖,其中壁框架220可建構成包括多個面板之完整補充。儘管不限於所展示之設計,但使用壁框架220之框架構件總成200可用作根據本教示之框架構件總成的各種實施例之示例。框架構件總成之各種實施例可由各種框架構件以及安裝於根據本教示之各種框架構件的各種框架面板區段中之區段面板組成。 FIG. 5 is an exploded front perspective view of the frame member assembly 200, where the wall frame 220 can be constructed as a complete supplement including multiple panels. Although not limited to the design shown, the frame member assembly 200 using the wall frame 220 may be used as an example of various embodiments of the frame member assembly according to the present teachings. Various embodiments of the frame member assembly may be composed of various frame members and section panels installed in various frame panel sections of various frame members according to the present teachings.

根據本教示之各種框架構件總成的各種實施例,框架構件總成200可由諸如壁框架220之框架構件組成。對於氣體包體總成之各種實施例,諸如圖3之氣體包體總成100,可利用封裝在此氣體包體總成中之設備的處理可能不僅需要提供惰性環境之氣密式密封型包體,而且需要大致上 無顆粒物之環境。就此而言,根據本教示之框架構件可利用各種尺寸之金屬管材料來進行框架之各種實施例的建構。此等金屬管材料解決所需之材料屬性,該等屬性包括但不限於:將不會退化而產生顆粒物的高完整性材料,以及產生具有高強度卻又具有最佳重量之框架構件,從而提供包含各種框架構件及面板區段之氣體包體總成自一個地點至另一地點之方便的傳送、建構及解構。一般技藝人士將容易理解的是,滿足此等要求之任何材料可用於產生根據本教示之各種框架構件。 According to various embodiments of the various frame member assemblies of the present teachings, the frame member assembly 200 may be composed of frame members such as wall frames 220. For various embodiments of the gas envelope assembly, such as the gas envelope assembly 100 of FIG. 3, the treatment of equipment enclosed in the gas envelope assembly may not only require a hermetically sealed package that provides an inert environment And require an environment that is substantially free of particulate matter. In this regard, the frame member according to the present teaching can utilize various sizes of metal tube materials to construct various embodiments of the frame. These metal tube materials solve the required material properties, including but not limited to: high integrity materials that will not degrade to produce particulate matter, and frame members with high strength but with optimal weight to provide Convenient transmission, construction and deconstruction of gas enclosure assembly including various frame members and panel sections from one place to another. Those of ordinary skill will readily understand that any material that meets these requirements can be used to produce various frame members according to this teaching.

例如,根據本教示之框架構件的各種實施例,諸如框架構件總成200,可由擠製金屬管線建構而成。根據框架構件之各種實施例,鋁、鋼及多種金屬複合材料可用於建構框架構件。在各種實施例中,尺寸為例如但不限於2”wX2”h、4”wX2”h及4”wX4”h且壁厚度為1/8”至1/4”之金屬管可用來建構根據本教示之框架構件的各種實施例。另外,可利用多種管或其他形式之多種強化纖維聚合物複合材料,該等材料所具有的材料屬性包括但不限於:將不會退化而產生顆粒物的高完整性材料,以及產生具有高強度卻又具有最佳重量之框架構件,從而提供自一個地點至另一地點之方便的傳送、建構及解構。 For example, various embodiments of frame members according to the present teachings, such as frame member assembly 200, can be constructed from extruded metal pipelines. According to various embodiments of the frame member, aluminum, steel, and various metal composite materials may be used to construct the frame member. In various embodiments, metal tubes with dimensions such as but not limited to 2"wX2"h, 4"wX2"h and 4"wX4"h and wall thicknesses from 1/8" to 1/4" can be used to construct Various examples of frame members taught. In addition, a variety of tubes or other types of reinforced fiber polymer composite materials can be used. The material properties of these materials include but are not limited to: high integrity materials that will not degrade and produce particles, and produce high strength but It also has a frame member with the best weight to provide convenient transmission, construction and deconstruction from one location to another.

關於由各種尺寸之金屬管材料建構各種框架構件,預期的是,可進行焊接來產生框架焊接件之各種實施例。另外,由各種尺寸之建築材料建構各種框架構件可使用適當之工業黏合劑來接下。預期的是,各種框架構件之建構應以將不會本質上產生穿過框架構件之洩漏路徑的方式進行。就此而言,對於氣體包體總成之各種實施例,各種框架構件之建構可使用不會本質上產生穿過框架構件之洩漏路徑的任何方法進行。此外, 根據本教示之框架構件的各種實施例,諸如圖4之壁框架220,可被塗漆或塗布。對於由容易發生例如氧化的金屬管線材料製成的框架構件之各種實施例,其中形成於表面處的材料可產生顆粒物,可進行塗漆或塗布或諸如陽極處理之其他表面處理來防止顆粒物之形成。 Regarding the construction of various frame members from metal tube materials of various sizes, it is expected that various embodiments of frame welded parts can be produced by welding. In addition, various frame members constructed from building materials of various sizes can be attached using appropriate industrial adhesives. It is expected that the construction of various frame members should be carried out in a manner that will not essentially create a leakage path through the frame members. In this regard, for various embodiments of the gas enclosure assembly, the construction of the various frame members can be performed using any method that does not essentially create a leakage path through the frame member. In addition, various embodiments of frame members according to the present teachings, such as the wall frame 220 of FIG. 4, may be painted or coated. For various embodiments of frame members made of metal pipeline materials that are susceptible to oxidation, for example, the material formed at the surface can generate particulate matter, which can be painted or coated or other surface treatments such as anodization to prevent the formation of particulate matter .

諸如圖5之框架構件總成之框架構件總成200可具有諸如壁框架220之框架構件。壁框架220可具有頂部226,頂部壁框架間隔板227可緊固至該頂部上;以及底部228,底部壁框架間隔板229可緊固至該底部上。如隨後將更為詳細地討論,安裝於框架構件之表面上的間隔板係墊圈密封系統之一部分,該墊圈密封系統與安裝於框架構件區段中之面板的墊圈密封相結合,來提供根據本教示之氣體包體總成的各種實施例之氣密式密封。諸如圖5之框架構件總成200之壁框架220的框架構件可具有若干面板框架區段,其中每一區段可被製造來接納各種類型之面板,諸如但不限於嵌入式面板110、窗口面板120及易於移除之服務窗口130。各種類型之面板區段可在框架構件之建構處理中形成。面板區段之類型可包括:例如但不限於用於接納嵌入式面板110之嵌入式面板區段10、用於接納窗口面板120之窗口面板區段20,以及用於接納易於移除之服務窗口130之服務窗口面板區段30。 A frame member assembly 200 such as the frame member assembly of FIG. 5 may have a frame member such as a wall frame 220. The wall frame 220 may have a top portion 226 to which the top wall frame partition plate 227 may be fastened; and a bottom portion 228 to which the bottom wall frame partition plate 229 may be fastened. As will be discussed in more detail later, the spacer plate mounted on the surface of the frame member is part of a gasket sealing system that is combined with the gasket seal of the panel mounted in the frame member section to provide Teach the gas-tight seal of various embodiments of the gas inclusion assembly. The frame member such as the wall frame 220 of the frame member assembly 200 of FIG. 5 may have several panel frame sections, where each section may be manufactured to receive various types of panels, such as but not limited to embedded panels 110, window panels 120 and easy to remove service window 130. Various types of panel sections can be formed in the construction process of the frame member. The types of panel sections may include, for example, but not limited to, embedded panel section 10 for receiving embedded panel 110, window panel section 20 for receiving window panel 120, and service window for receiving easy removal The service window panel section 130 of 130.

每一類型之面板區段可具有用來接納面板之面板區段框架,且可使得每一面板可密封地緊固至根據本教示之每一面板區段中,以便建構氣密式密封型氣體包體總成。例如,在描繪根據本教示之框架總成的圖5中,嵌入式面板區段10經展示為具有框架12,窗口面板區段20經展示為具有框架22,且服務窗口面板區段30經展示為具有框架32。對於本 教示之壁框架總成的各種實施例,各種面板區段框架可為使用連續焊珠焊接至面板區段中以提供氣密式密封之金屬薄片材料。對於壁框架總成之各種實施例,各種面板區段框架可由多種薄片材料製成,包括選自強化纖維聚合物複合材料之建築材料,可使用適當之工業黏合劑將該等材料安裝於面板區段中。如關於密封之後續教示中將更為詳細地討論,每一面板區段框架可具有佈置於其上之可壓縮墊圈,來確保可為安裝及緊固於每一面板區段中的每一面板形成氣密式密封。除了面板區段框架之外,每一面板構件區段亦可具有與定位面板以及將面板牢固地緊固於面板區段中相關的硬體。 Each type of panel section may have a panel section frame for receiving the panel, and may enable each panel to be hermetically fastened into each panel section according to the teachings in order to construct a hermetically sealed gas Package body assembly. For example, in FIG. 5 depicting a frame assembly according to the present teachings, embedded panel section 10 is shown as having frame 12, window panel section 20 is shown as having frame 22, and service window panel section 30 is shown As has a frame 32. For various embodiments of the wall frame assembly of the present teachings, the various panel section frames may be sheet metal materials that are welded into the panel section using continuous welding beads to provide a hermetic seal. For various embodiments of the wall frame assembly, various panel section frames can be made from a variety of sheet materials, including construction materials selected from reinforced fiber polymer composite materials, which can be installed in the panel area using appropriate industrial adhesives In the paragraph. As will be discussed in more detail in the subsequent teachings on sealing, each panel section frame may have compressible gaskets disposed thereon to ensure that each panel can be installed and fastened in each panel section Form a hermetic seal. In addition to the panel section frame, each panel member section may also have hardware associated with positioning the panel and firmly securing the panel in the panel section.

嵌入式面板110及用於窗口面板120之面板框架122的各種實施例可由諸如但不限於鋁、各種鋁合金及不銹鋼薄片金屬材料建構而成。面板材料之屬性可與構成框架構件之各種實施例的結構性材料之屬性相同。就此而言,材料具有用於各種面板構件之屬性,包括但不限於:將不會退化而產生顆粒物的高完整性材料,以及產生具有高強度卻又具有最佳重量之面板,以便提供自一個地點至另一地點之方便的傳送、建構及解構。例如蜂巢心薄片材料之各種實施例可具有必要屬性來用作面板材料,以便建構嵌入式面板110及用於窗口面板120之面板框架122。蜂巢心薄片材料可由多種材料製成,即金屬及金屬複合材料與聚合材料,以及聚合物複合材料蜂巢心薄片材料。當由金屬材料製成時,可移除之面板的各種實施例可具有包括於面板中之接地連接,來確保當氣體包體總成得以建構時,整個結構被接地。 Various embodiments of the embedded panel 110 and the panel frame 122 for the window panel 120 may be constructed from metal materials such as but not limited to aluminum, various aluminum alloys, and stainless steel sheets. The properties of the panel material can be the same as the properties of the structural materials of the various embodiments that make up the frame member. In this regard, the materials have properties for various panel components, including but not limited to: high integrity materials that will not degrade to produce particulate matter, and panels that have high strength but have the best weight to provide a Convenient transmission, construction and deconstruction from place to place. For example, various embodiments of honeycomb core sheet material may have necessary properties to be used as a panel material in order to construct the embedded panel 110 and the panel frame 122 for the window panel 120. The honeycomb core sheet material can be made of a variety of materials, namely metal and metal composite materials and polymeric materials, and polymer composite material honeycomb core sheet materials. When made of metallic materials, various embodiments of the removable panel may have a ground connection included in the panel to ensure that when the gas enclosure assembly is constructed, the entire structure is grounded.

考慮到用來建構本教示之氣體包體總成的氣體包體總成組 件的可傳送性質,在氣體包體總成及系統之使用期間可反復安裝及移除本教示之區段面板的各種實施例中之任一者,來提供對氣體包體總成之內部的接取。 Considering the transportable nature of the gas enclosure assembly used to construct the gas enclosure assembly of this teaching, various types of section panels of this teaching can be repeatedly installed and removed during use of the gas enclosure assembly and system Any of the embodiments to provide access to the interior of the gas envelope assembly.

例如,用於接納易於移除之服務窗口面板130的面板區段30可具有一組四個間隔物,該等間隔物中之一者被指示為窗口導引間隔物34。另外,被建構用於接納易於移除之服務窗口面板130之面板區段30可具有一組四個夾緊座(clamping cleat)36,該等夾緊座可用來使用一組四個反作用肘節夾136來將服務窗口130夾緊至服務窗口面板區段30中,該等反作用肘節夾係安裝於用於易於移除之服務窗口130中之每一者的服務窗口框架132上。此外,窗口把手138中之每一者中的兩個可安裝於易於移除之服務窗口框架132上,用來為終端使用者移除及安裝服務窗口130提供方便。可移除之服務窗口把手之數量、類型及置放可改變。另外,用於接納易於移除之服務窗口面板130的服務窗口面板區段30可具有選擇性地安裝於每一服務窗口面板區段30中的至少兩個窗口夾35。儘管被描繪成位於服務窗口面板區段30中之每一者的頂部及底部,但是至少兩個窗口夾可以任何方式安裝,以便用來用來將服務窗口130固定在面板區段框架32中。可使用工具來移除及安裝窗口夾35,以便允許移除及重新安裝服務窗口130。 For example, the panel section 30 for receiving the easily removable service window panel 130 may have a set of four spacers, one of which is indicated as the window guide spacer 34. In addition, the panel section 30 constructed to receive the easily removable service window panel 130 may have a set of four clamping cleats 36, which may be used to use a set of four reaction toggle joints The clip 136 clamps the service window 130 into the service window panel section 30, and the reaction toggle clips are mounted on the service window frame 132 for each of the service windows 130 for easy removal. In addition, two of each of the window handles 138 may be installed on the easily removable service window frame 132 to facilitate the removal and installation of the service window 130 by the end user. The number, type and placement of removable service window handles can be changed. In addition, the service window panel section 30 for receiving the easily removable service window panel 130 may have at least two window clips 35 selectively installed in each service window panel section 30. Although depicted as being located at the top and bottom of each of the service window panel sections 30, at least two window clips may be installed in any manner for use to secure the service window 130 in the panel section frame 32. A tool can be used to remove and install the window folder 35 to allow the service window 130 to be removed and reinstalled.

服務窗口130之反作用肘節夾136以及安裝於面板區段30上之硬體(包括夾緊座36、窗口導引間隔物34以及窗口夾35)可由任何合適之材料及材料之組合建構而成。例如,此等元件中之一或多者可包含至少一種金屬、至少一種陶瓷、至少一種塑膠及其組合。可移除之服務窗口把手138可由任何合適之材料及材料之組合建構而成。例如,此等元件中 之一或多者可包含至少一種金屬、至少一種陶瓷、至少一種塑膠、至少一種橡膠及其組合。包體窗口(諸如窗口面板120之窗口124或服務窗口130之窗口134)可包含任何合適之材料以及材料之組合。根據本教示之氣體包體總成的各種實施例,包體窗口可包含透明材料及半透明材料。在氣體包體總成之各種實施例中,包體窗口可包含:二氧化矽基材料,例如但不限於諸如玻璃及石英;以及各種類型之聚合物基材料,例如但不限於各種類別之聚碳酸酯、丙烯酸類及乙烯類。一般技藝人士可理解的是,示例性窗口材料之各種複合材料及其組合亦可用作根據本教示之透明材料及半透明材料。 The reaction toggle clamp 136 of the service window 130 and the hardware (including the clamping base 36, the window guide spacer 34, and the window clamp 35) mounted on the panel section 30 can be constructed from any suitable materials and combinations of materials . For example, one or more of these elements may include at least one metal, at least one ceramic, at least one plastic, and combinations thereof. The removable service window handle 138 can be constructed from any suitable material and combination of materials. For example, one or more of these elements may include at least one metal, at least one ceramic, at least one plastic, at least one rubber, and combinations thereof. The inclusion window (such as the window 124 of the window panel 120 or the window 134 of the service window 130) may include any suitable material and combination of materials. According to various embodiments of the gas package assembly of the present teaching, the package window may include a transparent material and a translucent material. In various embodiments of the gas inclusion assembly, the inclusion window may include: silica-based materials such as but not limited to such as glass and quartz; and various types of polymer-based materials such as but not limited to various types of polymer Carbonate, acrylic and vinyl. A person of ordinary skill can understand that various composite materials and combinations of exemplary window materials can also be used as transparent materials and translucent materials according to the teachings.

如自圖5中之框架構件總成200可看出,易於移除之服務窗口面板130可具有帶有蓋子150之手套埠。儘管將圖3展示為所有手套埠具有向外延伸之手套,但是如圖5中所展示,亦可封蓋住手套埠,此取決於終端使用者是否需要對氣體包體總成之內部的遠程接取。如圖6A至圖7B中所描繪,封蓋總成之各種實施例提供用於當終端使用者未使用手套時將蓋子牢固地鎖定於手套上,且同時在終端使用者希望使用手套時提供輕鬆接取。 As can be seen from the frame member assembly 200 in FIG. 5, the easily removable service window panel 130 may have a glove port with a cover 150. Although FIG. 3 shows that all glove ports have outwardly extending gloves, as shown in FIG. 5, the glove ports can also be covered, depending on whether the end user needs to remotely Pick up. As depicted in FIGS. 6A to 7B, various embodiments of the lid assembly provide for firmly locking the lid to the glove when the end user is not using the glove, and at the same time providing ease when the end user wishes to use the glove Pick up.

圖6A中展示蓋子150,其可具有內部表面151、外部表面153及可經輪廓塑造以便抓握之側面152。自蓋子150之輪緣154延伸的係三個有肩螺釘156。如圖6B中所展示,每一有肩螺釘係設置於輪緣154中,以使得螺釘桿155自輪緣154延伸一設定的距離,以使得頭部157不緊靠輪緣154。在圖7A至圖7B中,手套埠硬體總成160可經修改來提供包括鎖定機構之封蓋總成,其用於當包體被加壓來相對於包體外部具有正壓力時封 蓋住手套埠。 A cover 150 is shown in FIG. 6A, which can have an inner surface 151, an outer surface 153, and a side 152 that can be contoured for gripping. Three shoulder screws 156 extend from the rim 154 of the cover 150. As shown in FIG. 6B, each shoulder screw is disposed in the rim 154 so that the screw rod 155 extends a set distance from the rim 154 so that the head 157 does not abut the rim 154. In FIGS. 7A to 7B, the glove port hardware assembly 160 may be modified to provide a capping assembly including a locking mechanism for capping when the bag body is pressurized to have a positive pressure relative to the outside of the bag body Live in glove port.

對於圖6A之手套埠硬體總成160的各種實施例,卡口式夾緊可提供蓋子150在手套埠硬體總成160上之封閉,且同時提供快速耦合設計以便於終端使用者對手套的輕鬆接取。在圖7A中所展示之手套埠硬體總成160之頂部擴展視圖中,手套埠總成160可包含後部板161以及前部板163,該前部板具有用於安裝手套之螺紋螺釘頭部162及凸緣164。在凸緣164上展示了卡口式閂鎖166,該卡口式閂鎖具有用於接納有肩螺釘156(圖6B)之有肩螺釘頭部157的槽口165。有肩螺釘156中之每一者可與手套埠硬體總成160之卡口式閂鎖166中之每一者對準及嚙合。卡口式閂鎖166之槽口168具有位於槽口168之一端的開口165及位於另一端的鎖定凹部167。一旦每一有肩螺釘頭部157被插入至每一開口165中,則可旋轉蓋子150,直至有肩螺釘頭部緊靠槽口168之靠近鎖定凹部167的一端。圖7B中所展示之截面圖描繪在氣體包體總成系統在使用中時用於封蓋住手套之鎖定特徵。在使用期間,包體中之惰性氣體的內部氣體壓力比氣體包體總成外部的壓力高出一設定的量。該正壓力可填充手套(圖3),以使得在本教示之氣體包體總成的使用期間當手套被壓縮在蓋子150下方時,使有肩螺釘頭部157移動至鎖定凹部167中,從而確保手套埠窗口將被牢固地封蓋。然而,終端使用者可藉由經輪廓塑造以便抓握之側面152抓握住蓋子150,並且在不使用時容易地使固定在卡口式閂鎖中之蓋子脫齧。圖7B另外展示窗口134之內部表面131上的後部板161,以及窗口134之外部表面上的前部板163,該等板均具有O型環密封件169。 For various embodiments of the glove port hardware assembly 160 of FIG. 6A, the bayonet clamp can provide closure of the cover 150 on the glove port hardware assembly 160, and at the same time provide a quick coupling design to facilitate end users Easy access. In the top expanded view of the glove port hardware assembly 160 shown in FIG. 7A, the glove port assembly 160 may include a rear plate 161 and a front plate 163 with a threaded screw head for installing gloves 162及 flange164. A bayonet latch 166 is shown on the flange 164, which has a notch 165 for receiving the shoulder screw head 157 of the shoulder screw 156 (FIG. 6B). Each of the shoulder screws 156 can be aligned and engaged with each of the bayonet latches 166 of the glove port hardware assembly 160. The slot 168 of the bayonet latch 166 has an opening 165 at one end of the slot 168 and a locking recess 167 at the other end. Once each shoulder screw head 157 is inserted into each opening 165, the cover 150 can be rotated until the shoulder screw head abuts the end of the notch 168 near the locking recess 167. The cross-sectional view shown in FIG. 7B depicts the locking feature used to cap the glove when the gas inclusion assembly system is in use. During use, the internal gas pressure of the inert gas in the envelope is higher than the pressure outside the gas envelope assembly by a set amount. This positive pressure can fill the glove (FIG. 3) so that when the glove is compressed under the cover 150 during use of the gas inclusion assembly of the present teachings, the shoulder screw head 157 moves into the locking recess 167, thereby Make sure the glove port window will be securely covered. However, the end user can grasp the cover 150 by the side 152 contoured for grasping, and easily disengage the cover fixed in the bayonet latch when not in use. FIG. 7B additionally shows the rear plate 161 on the inner surface 131 of the window 134 and the front plate 163 on the outer surface of the window 134, each of which has an O-ring seal 169.

如以下關於圖8A至圖9B的教示中將更為詳細地討論,壁 框架構件及天花板框架構件密封件與氣密式區段面板框架密封件一起提供氣密式密封型氣體包體總成之各種實施例,以便用於需要惰性環境之空氣敏感型處理。氣體包體總成及系統之有助於提供大致上低濃度之反應性物種以及大致上低微粒環境的組件可包括但不限於:氣密式密封型氣體包體總成,以及包括管道之高效氣體循環及粒子過濾系統。為氣體包體總成提供有效氣密式密封可具有挑戰性,尤其在三個框架構件合到一起來形成三面接縫之處。因此,三面接縫密封對為可在建構及解構週期中組裝及拆卸的氣體包體總成提供可易於安裝之氣密式密封提出特別困難之挑戰。 As will be discussed in more detail in the teachings of FIGS. 8A-9B below, the wall frame member and ceiling frame member seals together with the airtight section panel frame seals provide the airtight seal type gas envelope assembly Various embodiments for use in air-sensitive processes that require an inert environment. Components of the gas envelope assembly and system that help provide a substantially low concentration of reactive species and a substantially low particulate environment may include, but are not limited to: gas-tight and sealed gas envelope assemblies, as well as efficient pipelines Gas circulation and particle filtration system. Providing an effective gas-tight seal for the gas enclosure assembly can be challenging, especially where the three frame members come together to form a three-sided seam. Therefore, the three-sided seam seal presents a particularly difficult challenge to provide a gas-tight seal that can be assembled and disassembled during the construction and deconstruction cycle and that can be easily installed.

就此而言,根據本教示之氣體包體總成的各種實施例經由接縫之有效墊圈密封以及在承受負載的建築組件周圍提供有效墊圈密封來提供完全建構之氣體包體總成及系統的氣密式密封。與習知的接縫密封不同的是,根據本教示之接縫密封:1)在頂部及底部終端框架接合點(三個框架構件在此處連接)處包括來自正交定向之墊圈長度的緊靠之墊圈分段的均勻的平行對準,從而避免有角的縫對準及密封,2)提供用於形成跨越接縫之整個寬度的緊靠長度,從而增加三面接合點處的密封接觸面積,3)經設計成具有間隔板,該等間隔板提供跨越所有垂直及水平以及頂部及底部三面接縫墊圈密封的均勻壓縮力。另外,墊圈材料之選擇可影響提供氣密式密封之有效性,隨後將對此進行討論。 In this regard, various embodiments of the gas enclosure assembly according to the teachings provide a fully constructed gas enclosure assembly and system gas through effective gasket sealing of the joints and providing effective gasket sealing around the load-bearing building components Sealed tightly. Unlike the conventional seam seals, the seam seals according to the teachings: 1) At the top and bottom terminal frame joints (three frame members are connected here) include the tightness from the orthogonally oriented gasket length Uniform parallel alignment of the gasket segments to avoid angular seam alignment and sealing, 2) Provide abutting length for forming the entire width of the seam, thereby increasing the sealing contact area at the three-sided junction , 3) Designed with spacers that provide uniform compressive force across all vertical and horizontal and top and bottom seam gasket seals. In addition, the choice of gasket material can affect the effectiveness of providing a hermetic seal, which will be discussed later.

圖8A至圖8C為頂部示意圖,其描繪習知的三面接縫密封與根據本教示之三面接縫密封的比較。根據本教示之氣體包體總成的各種實施例,可存在例如但不限於至少四個壁框架構件、天花板框架構件及底盤,上述各者可被連接來形成氣體包體總成,從而產生需要氣密式密封之 複數個垂直、水平及三面接縫。圖8A中為藉由第一墊圈I形成之習知的三面墊圈密封之頂部示意圖,該第一墊圈在X-Y平面中與墊圈II正交定向。如圖8A中所展示,X-Y平面中藉由正交定向所形成的縫具有在兩個分段之間的接觸長度W1,該接觸長度由墊圈之寬度的尺寸來定義。另外,如陰影線所指示,墊圈III之終端部分可緊靠墊圈I及墊圈II,該墊圈III係在垂直方向上與墊圈I及墊圈II兩者正交定向的墊圈。圖8B中為藉由第一墊圈長度I所形成之習知的三面接縫墊圈密封的頂部示意圖,該第一墊圈長度I與第二墊圈長度II正交,且具有連接兩個長度之45°面的縫,其中該縫具有在兩個分段之間的接觸長度W2,該接觸長度大於墊圈材料之寬度。與圖8A之組配類似的是,如陰影線所指示,墊圈III之末端部分可緊靠墊圈I及墊圈II,該墊圈III在垂直方向上與墊圈I及墊圈II兩者正交。假定圖8A及圖8B中的墊圈寬度相同,則圖8B之接觸長度W2大於圖8A之接觸長度W18A to 8C are top schematic diagrams depicting a comparison of the conventional three-sided seam seal and the three-sided seam seal according to the teachings. According to various embodiments of the gas enclosure assembly of the present teachings, there may be, for example, but not limited to, at least four wall frame members, ceiling frame members, and a chassis, each of which may be connected to form a gas enclosure assembly, thereby creating a need A plurality of vertical, horizontal and three-side seams for air-tight sealing. FIG. 8A is a schematic top view of a conventional three-sided gasket seal formed by a first gasket I, which is oriented orthogonally to gasket II in the XY plane. Shown in Figure 8A, slot oriented perpendicular to the XY plane formed by the contact having a length W 1 between the two segments, the contact length is defined by the width dimension of the gasket. In addition, as indicated by hatching, the terminal portion of the washer III may abut against the washer I and the washer II, which is a washer oriented orthogonally to both the washer I and the washer II in the vertical direction. FIG. 8B is a schematic top view of a conventional three-sided seam gasket seal formed by a first gasket length I, the first gasket length I is orthogonal to the second gasket length II, and has 45° connecting the two lengths A face slit, where the slit has a contact length W 2 between the two segments, the contact length being greater than the width of the gasket material. Similar to the arrangement of FIG. 8A, as indicated by hatching, the end portion of the gasket III may abut against the gasket I and the gasket II, which is orthogonal to both the gasket I and the gasket II in the vertical direction. Assuming that the gasket widths in FIGS. 8A and 8B are the same, the contact length W 2 in FIG. 8B is greater than the contact length W 1 in FIG. 8A.

圖8C係根據本教示之三面接縫墊圈密封的頂部示意圖。第一墊圈長度I可具有形成為與墊圈長度I之方向正交的墊圈分段I',其中墊圈分段I'之長度大約為所連接的結構組件之寬度的尺寸,該組件諸如用來形成本教示之氣體包體總成的各種壁框架構件的4”w X 2”h或4”w X 4”h金屬管。墊圈II在X-Y平面中與墊圈I正交,且具有墊圈分段II',該墊圈分段II'具有與墊圈分段I'重疊之長度,該長度大約為所連接之結構組件的寬度。墊圈分段I'及II'之寬度為所選擇的之可壓縮墊圈材料的寬度。墊圈III在垂直方向上與墊圈I及墊圈II兩者正交定向。墊圈分段III'係墊圈III之末端部分。墊圈分段III'係藉由墊圈分段III'與墊圈III之垂直長度的正交定向 而形成。墊圈分段III'可經形成以使得其長度與墊圈分段I'及墊圈分段II'大約相同,且其寬度為所選擇之可壓縮墊圈材料的厚度。就此而言,圖8C中所展示之三個對準分段的接觸長度W3大於圖8A或圖8B中之任一者中所展示之習知的三角接縫密封的長度(分別具有接觸長度W1及W2)。 FIG. 8C is a schematic top view of a three-sided seam gasket seal according to this teaching. The first washer length I may have a washer segment I′ formed orthogonal to the direction of the washer length I, wherein the length of the washer segment I′ is approximately the size of the width of the connected structural component, such as The 4"w X 2"h or 4"w X 4"h metal tubes of various wall frame members of the gas inclusion assembly of this teaching. The washer II is orthogonal to the washer I in the XY plane, and has a washer segment II' that has a length that overlaps with the washer segment I', which is approximately the width of the connected structural component. The width of the gasket segments I'and II' is the width of the selected compressible gasket material. The washer III is oriented orthogonally to both the washer I and the washer II in the vertical direction. Washer segment III' is the end portion of washer III. The washer segment III' is formed by the orthogonal orientation of the vertical length of the washer segment III' and the washer III. Gasket segment III' may be formed so that its length is approximately the same as gasket segment I'and gasket segment II', and its width is the thickness of the compressible gasket material selected. In this regard, the contact length W 3 of the three aligned segments shown in FIG. 8C is greater than the length of the conventional triangular seam seal shown in either of FIGS. 8A or 8B (with contact lengths, respectively) W 1 and W 2 ).

就此而言,根據本教示之三面接縫墊圈密封在終端接合點處由否則將正交對準的墊圈(如圖8A及圖8B中所展示)產生墊圈分段之均勻的水平對準。三面接縫墊圈密封分段之此均勻的水平對準提供用於施加跨越該等分段之均勻的橫向密封力,來促進由壁框架構件所形成之頂部及底部接角處的氣密式三面接縫密封。另外,每一三面接縫密封之均勻對準的墊圈分段中之每一分段經選擇成大約為所連接之結構組件的寬度,從而提供均勻對準的分段之最大接觸長度。此外,根據本教示之接縫密封經設計成具有間隔板,該等間隔板提供跨越建築接縫之所有垂直、水平及三面墊圈密封的均勻壓縮力。可認為經選擇用於針對圖8A及圖8B之實例所給出的習知三面密封的墊圈材料之寬度可至少為所連接之結構組件的寬度。 In this regard, the three-sided seam washer seal at the terminal junction produces a uniform horizontal alignment of the gasket segments by otherwise orthogonally aligned gaskets (as shown in FIGS. 8A and 8B). This uniform horizontal alignment of the three-sided seam gasket seal segments provides uniform lateral sealing force across the segments to promote airtight three-sided joints at the top and bottom joints formed by the wall frame members Seam sealing. In addition, each of the uniformly aligned gasket segments of each three-sided seam seal is selected to be approximately the width of the connected structural component, thereby providing the maximum contact length of the uniformly aligned segments. In addition, the seam seals according to the teachings are designed with spacer plates that provide uniform compressive force across all vertical, horizontal, and three-sided gasket seals across the construction joint. It can be considered that the width of the gasket material selected for the conventional three-sided seal given for the examples of FIGS. 8A and 8B may be at least the width of the connected structural component.

圖9A之分解透視圖描繪所有框架構件被連接在一起之前的根據本教示之密封總成300,以便描繪未壓縮狀態下之墊圈。在圖9A中,諸如壁框架310、壁框架350以及天花板框架370之複數個壁框架構件可在由氣體包體總成之各種組件來建構氣體包體之第一步驟中密封地連接起來。根據本教示之框架構件密封係確保以下情形的實質部分:氣體包體總成一旦被完全建構則被氣密式密封,並且提供可在氣體包體總成之建構及解構週期中實行的密封。儘管以下關於圖9A至圖9B的教示中給出之實例係用於氣體包體總成之一部分的密封,但是一般技藝人士將瞭解的是,此 等教示適用於本教示之氣體包體總成中之任一者的整體。 FIG. 9A is an exploded perspective view depicting the sealing assembly 300 according to the present teachings before all the frame members are connected together to depict the gasket in an uncompressed state. In FIG. 9A, a plurality of wall frame members such as the wall frame 310, the wall frame 350, and the ceiling frame 370 may be hermetically connected in the first step of constructing the gas envelope from various components of the gas envelope assembly. The sealing of the frame member according to this teaching ensures the essential part of the following situation: the gas envelope assembly is hermetically sealed once it is fully constructed, and provides a seal that can be implemented during the construction and deconstruction cycle of the gas envelope assembly. Although the examples given in the following teachings regarding FIGS. 9A to 9B are used to seal a part of the gas inclusion assembly, the person skilled in the art will understand that these teachings are applicable to the gas inclusion assembly of this teaching The whole of any of them.

圖9A中所描繪之第一壁框架310可具有:內部側311,間隔板312係安裝於該內部側上;垂直側314;以及頂部表面315,間隔板316係安裝於該頂部表面上。第一壁框架310可具有第一墊圈320,該第一墊圈佈置於由間隔板312形成之空間中且黏附至該空間。在第一墊圈320佈置於由間隔板312形成之空間中且黏附至該空間後剩餘的間隙302可容第一墊圈320之垂直長度通過,如圖9A中所展示。如圖9A中所展示,順應墊圈320可佈置於由間隔板312所形成之空間中且黏附至該空間,且可具有垂直墊圈長度321、曲線墊圈長度323以及墊圈長度325,墊圈長度325係形成為與內部框架構件311上之垂直墊圈長度321在平面中成90°且在壁框架310之垂直側314處終止。在圖9A中,第一壁框架310可具有頂部表面315,間隔板316係安裝於該頂部表面上,從而在表面315上靠近壁框架310之內部邊緣317形成一空間,第二墊圈340係佈置於該空間中且黏附至該空間。在第一墊圈340佈置於由間隔板316形成之空間中且黏附至該空間後剩餘的間隙304可容第二墊圈340之水平長度通過,如圖9A中所展示。此外,如陰影線所指示,墊圈340之長度345與墊圈320之長度325均勻地平行且相連地對準。 The first wall frame 310 depicted in FIG. 9A may have: an inner side 311 on which the partition plate 312 is mounted; a vertical side 314; and a top surface 315 on which the partition plate 316 is mounted. The first wall frame 310 may have a first gasket 320 that is arranged in the space formed by the partition plate 312 and adhered to the space. The gap 302 remaining after the first gasket 320 is arranged in the space formed by the partition plate 312 and adhered to the space can allow the vertical length of the first gasket 320 to pass, as shown in FIG. 9A. As shown in FIG. 9A, the compliant washer 320 may be arranged in and adhered to the space formed by the partition plate 312, and may have a vertical washer length 321, a curved washer length 323, and a washer length 325, and the washer length 325 is formed To be 90° in plane with the vertical washer length 321 on the inner frame member 311 and terminate at the vertical side 314 of the wall frame 310. In FIG. 9A, the first wall frame 310 may have a top surface 315 on which the partition plate 316 is mounted so that a space is formed on the surface 315 near the inner edge 317 of the wall frame 310, and the second gasket 340 is arranged In the space and adhere to the space. The gap 304 remaining after the first gasket 340 is arranged in the space formed by the partition plate 316 and adhered to the space can allow the horizontal length of the second gasket 340 to pass through, as shown in FIG. 9A. In addition, as indicated by hatching, the length 345 of the gasket 340 and the length 325 of the gasket 320 are uniformly parallel and continuously aligned.

圖9A中所描繪之第二壁框架350可具有外部框架側353、垂直側354及頂部表面355,間隔板356係安裝於該頂部表面上。第二壁框架350可具有第一墊圈360,該第一墊圈佈置於由間隔板356形成的一空間中且黏附至該空間。在第一墊圈360佈置於由間隔板356形成之空間中且黏附至該空間後剩餘的間隙306可容第一墊圈360之水平長度通過,如圖9A 中所展示。如圖9A中所描繪,順應墊圈360可具有水平長度361、曲線長度363以及長度365,長度365係在頂部表面355之平面中形成為90°且在外部框架構件353處終止。 The second wall frame 350 depicted in FIG. 9A may have an outer frame side 353, a vertical side 354, and a top surface 355 on which the partition plate 356 is mounted. The second wall frame 350 may have a first gasket 360 that is arranged in a space formed by the partition plate 356 and adhered to the space. The gap 306 remaining after the first gasket 360 is arranged in the space formed by the partition plate 356 and adhered to the space can allow the horizontal length of the first gasket 360 to pass, as shown in FIG. 9A. As depicted in FIG. 9A, the compliant washer 360 may have a horizontal length 361, a curved length 363, and a length 365 that is formed at 90° in the plane of the top surface 355 and terminates at the outer frame member 353.

如圖9A之分解透視圖中所指示,壁框架310之內部框架構件311可連接至壁框架350之垂直側354,從而形成氣體包體總成之一建築接縫。關於如此形成的建築接縫之密封,在如圖9A中所描繪的根據本教示之壁框架構件的終端接合點處之墊圈密封的各種實施例中,墊圈320之長度325、墊圈360之長度365以及墊圈340之長度345全部相連地且均勻地對準。另外,如隨後將更為詳細地討論,本教示之間隔板的各種實施例可提供均勻壓縮,此壓縮介於用於氣密式密封本教示之氣體包體總成的各種實施例的可壓縮墊圈材料之約20%至約40%撓曲之間。 As indicated in the exploded perspective view of FIG. 9A, the inner frame member 311 of the wall frame 310 may be connected to the vertical side 354 of the wall frame 350, thereby forming a building joint of the gas envelope assembly. Regarding the seal of the thus formed building joint, in various embodiments of the gasket seal at the terminal joint of the wall frame member according to the present teaching as depicted in FIG. 9A, the length 325 of the gasket 320 and the length 365 of the gasket 360 And the lengths 345 of the washers 340 are all connected and evenly aligned. In addition, as will be discussed in more detail later, various embodiments of the separators between the present teachings can provide uniform compression that is intermediate between the various embodiments of the gas enclosure assembly used to hermetically seal the gas enclosure assembly of the present teachings Between about 20% and about 40% deflection of the gasket material.

圖9B描繪所有框架構件被連接在一起之後的根據本教示之密封總成300,以便描繪壓縮狀態下之墊圈。圖9B係透視圖,其展示在第一壁框架310、第二壁框架350及以假想視圖來展示之天花板框架370之間的頂部終端接合點處所形成的三面接縫之角密封的細節。如圖9B中所展示,間隔板所界定之墊圈空間可被確定為一寬度,以使得在壁框架310、壁框架350及以假想視圖來展示之天花板框架370連接在一起後,介於用於形成垂直、水平及三面墊圈密封之可壓縮墊圈材料的約20%至約40%撓曲之間的均勻壓縮確保在壁框架構件之接縫處獲密封的所有表面處的墊圈密封可提供氣密式密封。另外,墊圈間隙302、304及306(未圖示)經設定尺寸,以使得在介於可壓縮墊圈材料之約20%至約40%撓曲之間的最佳壓縮後,每一墊圈可填充墊圈間隙,如圖9B中關於墊圈340及墊圈360所展示。 因此,除了藉由界定一空間且每一墊圈係佈置於該空間中且黏附至該空間來提供均勻壓縮之外,經設計來提供間隙之間隔板的各種實施例亦確保每一壓縮之墊圈可適應由間隔板所界定之空間而不會在壓縮狀態下起皺或膨出或以其他方式不規則地形成,從而可能形成洩漏路徑。 9B depicts the sealing assembly 300 according to the present teaching after all the frame members are connected together, so as to depict the gasket in the compressed state. 9B is a perspective view showing details of the corner seal of the three-sided seam formed at the top terminal junction between the first wall frame 310, the second wall frame 350, and the ceiling frame 370 shown in an imaginary view. As shown in FIG. 9B, the gasket space defined by the partition plate can be determined to be a width such that after the wall frame 310, the wall frame 350, and the ceiling frame 370 shown in an imaginary view are connected together, it is used for Uniform compression between about 20% to about 40% of the deflection of the compressible gasket material forming vertical, horizontal and three-sided gasket seals ensures that gasket seals at all surfaces that are sealed at the joints of the wall frame members can provide airtightness Type seal. In addition, the gasket gaps 302, 304, and 306 (not shown) are sized so that after optimal compression between about 20% to about 40% of the deflection of the compressible gasket material, each gasket can be filled The washer gap is as shown with respect to washer 340 and washer 360 in FIG. 9B. Therefore, in addition to providing uniform compression by defining a space in which each gasket is disposed and adhered to the space, various embodiments designed to provide a partition between gaps also ensure that each compressed gasket It adapts to the space defined by the partition plate without wrinkling or bulging or otherwise irregularly formed in the compressed state, so that a leak path may be formed.

根據本教示之氣體包體總成的各種實施例,各種類型之區段面板可使用佈置於面板區段框架中之每一者上的可壓縮墊圈材料來密封。與框架構件墊圈密封相結合,用來形成各種區段面板與面板區段框架之間的密封之可壓縮墊圈的位置及材料可提供具有很少的氣體洩漏或沒有氣體洩漏之氣密式密封型氣體包體總成。另外,所有類型之面板(諸如圖5之嵌入式面板110、窗口面板120及易於移除之服務窗口130)的密封設計可提供在此等面板之反復移除及安裝之後的耐久性面板密封,需要此等面板之反復移除及安裝來接取氣體包體總成之內部,以便例如進行維護。 According to various embodiments of the gas enclosure assembly of the present teachings, various types of section panels can be sealed using compressible gasket materials disposed on each of the panel section frames. Combined with the frame member gasket seal, the position and material of the compressible gasket used to form the seal between various section panels and panel section frames can provide a hermetic seal type with little or no gas leakage Gas inclusion assembly. In addition, the sealing design of all types of panels (such as the embedded panel 110, the window panel 120, and the easily removable service window 130 of FIG. 5) can provide a durable panel seal after repeated removal and installation of these panels, The repeated removal and installation of these panels is required to access the interior of the gas enclosure assembly, for example for maintenance.

例如,圖10A係描繪服務窗口面板區段30及易於移除之服務窗口130的分解視圖。如前面所討論,服務窗口面板區段30可經製造用於接納易於移除之服務窗口130。對於氣體包體總成之各種實施例,諸如可移除之服務面板區段30之面板區段可具有面板區段框架32以及佈置於面板區段框架32上的可壓縮墊圈38。在各種實施例中,與將易於移除之服務窗口130緊固於可移除之服務窗口面板區段30中相關的硬體可為終端使用者進行安裝及重新安裝提供方便,且同時確保當需要直接接取氣體包體總成之內部的終端使用者需要易於移除之服務窗口130被安裝及重新安裝於面板30中時,維持氣密式密封得以。易於移除之服務窗口130可包括剛性窗口框架132,該剛性窗口框架可由例如但不限於經描述用於建構本教示之框 架構件中之任一者的金屬管材料建構而成。服務窗口130可利用快速作用緊固硬體,例如但不限於反作用肘節夾136,以便提供終端使用者對服務窗口130之輕鬆移除及重新安裝。圖10A中所展示的係前面提及的圖7A至圖7B之手套埠硬體總成160,其展示一組3個卡口式閂鎖166。 For example, FIG. 10A is an exploded view depicting the service window panel section 30 and the easily removable service window 130. As previously discussed, the service window panel section 30 may be manufactured to receive an easily removable service window 130. For various embodiments of the gas enclosure assembly, the panel section such as the removable service panel section 30 may have a panel section frame 32 and a compressible gasket 38 disposed on the panel section frame 32. In various embodiments, the hardware associated with securing the easily removable service window 130 in the removable service window panel section 30 can provide ease of installation and reinstallation for the end user while ensuring End users who need to directly access the interior of the gas enclosure assembly need to easily remove the service window 130 when it is installed and reinstalled in the panel 30 to maintain the hermetic seal. The easily removable service window 130 may include a rigid window frame 132 that may be constructed from, for example, but not limited to, a metal tube material described in any of the frame members described in this teaching. The service window 130 may utilize fast-acting fastening hardware, such as but not limited to a reaction toggle clamp 136, so as to provide easy removal and reinstallation of the service window 130 by an end user. Shown in FIG. 10A is the aforementioned glove port hardware assembly 160 of FIGS. 7A to 7B, which shows a set of three bayonet latches 166.

如圖10A之可移除之服務窗口面板區段30之前視圖中所展示,易於移除之服務窗口130可具有固定在窗口框架132上之一組四個肘節夾136。可將服務窗口130以所定義的距離定位至面板區段框架30中,以確保抵靠在墊圈38上之適當壓縮力。使用如圖10B中所展示之一組四個窗口導引間隔物34,其可安裝於面板區段30之每一角中,以便將服務窗口130定位於面板區段30中。可提供一組夾緊座36中之每一者來接納易於移除之服務窗口130的反作用肘節夾136。根據在安裝及移除週期中對服務窗口130的氣密式密封之各種實施例,服務窗口框架132之機械強度與藉由一組窗口導引間隔物34所提供之服務窗口130相對於可壓縮墊圈38之所定義位置相結合,可確保一旦例如但不限於使用緊固於對應之夾緊座36中之反作用肘節夾136將服務窗口130固定於適當位置,服務窗口框架132則可在面板區段框架32上提供均勻的力,其具有由一組窗口導引間隔物34所設定之所定義壓縮。該組窗口導引間隔物34經定位,以使得窗口130對墊圈38之壓縮力使可壓縮墊圈38撓曲約20%至約40%之間。就此而言,服務窗口130之建構以及面板區段30之製造提供面板區段30中之服務窗口130的氣密式密封。如前面所討論,可在將服務窗口130緊固於面板區段30中後將窗口夾35安裝至面板區段30中,且在需要移除服務窗口130時而移除窗口夾35。 As shown in the front view of the removable service window panel section 30 of FIG. 10A, the easily removable service window 130 may have a set of four toggle clamps 136 fixed to the window frame 132. The service window 130 can be positioned into the panel section frame 30 at a defined distance to ensure proper compression against the gasket 38. A set of four window guide spacers 34 as shown in FIG. 10B is used, which can be installed in each corner of the panel section 30 in order to position the service window 130 in the panel section 30. Each of a set of clamping seats 36 may be provided to receive the reaction toggle clamp 136 of the service window 130 that is easily removable. According to various embodiments of hermetically sealing the service window 130 during the installation and removal cycle, the mechanical strength of the service window frame 132 and the service window 130 provided by the set of window guide spacers 34 are relatively compressible The combination of the defined positions of the washer 38 ensures that once the service window 130 is fixed in place by using, for example but not limited to, a reaction toggle clamp 136 fastened in the corresponding clamping seat 36, the service window frame 132 can A uniform force is provided on the segment frame 32, which has a defined compression set by a set of window guide spacers 34. The set of window guide spacers 34 are positioned so that the compressive force of the window 130 against the gasket 38 deflects the compressible gasket 38 between about 20% and about 40%. In this regard, the construction of the service window 130 and the manufacture of the panel section 30 provide a hermetic seal of the service window 130 in the panel section 30. As previously discussed, the window clip 35 may be installed into the panel section 30 after the service window 130 is secured in the panel section 30, and the window clip 35 may be removed when the service window 130 needs to be removed.

可使用任何合適之裝置以及裝置之組合將反作用肘節夾136固定至易於移除之服務窗口框架132。可使用的合適之固定裝置的實例包括:至少一黏合劑,例如但不限於環氧樹脂或水泥;至少一螺栓;至少一螺釘;至少一其他緊固件;至少一槽口;至少一軌道;至少一焊接點及其組合。反作用肘節夾136可直接連接至可移除之服務窗口框架132或經由接頭板來間接連接。反作用肘節夾136、夾緊座36、窗口導引間隔物34以及窗口夾35可由任何合適之材料及材料之組合建構而成。例如,一或多個此等元件可包含至少一種金屬、至少一種陶瓷、至少一種塑膠及其組合。 Any suitable device and combination of devices can be used to secure the reaction toggle clamp 136 to the easily removable service window frame 132. Examples of suitable fixing devices that can be used include: at least one adhesive, such as but not limited to epoxy resin or cement; at least one bolt; at least one screw; at least one other fastener; at least one notch; at least one rail; at least A welding point and its combination. The reaction toggle clamp 136 may be directly connected to the removable service window frame 132 or indirectly connected via a joint plate. The reaction toggle clamp 136, the clamping base 36, the window guide spacer 34, and the window clamp 35 can be constructed from any suitable materials and combinations of materials. For example, one or more of these elements may include at least one metal, at least one ceramic, at least one plastic, and combinations thereof.

除了密封易於移除之服務窗口之外,氣密式密封亦可被提供用於嵌入式面板及窗口面板。可在面板區段中反復安裝及移除的其他類型之區段面板包括:例如但不限於嵌入式面板110及窗口面板120,如圖5中所展示。如圖5中可看出,窗口面板120之面板框架122係與嵌入式面板110類似地建構而成。因此,根據氣體包體總成之各種實施例,用於接納嵌入式面板及窗口面板之面板區段的製造可相同。就此而言,可使用相同原理來實行嵌入式面板及窗口面板之密封。 In addition to sealing service windows that are easy to remove, airtight seals can also be provided for embedded panels and window panels. Other types of section panels that can be repeatedly installed and removed in the panel section include, for example, but not limited to, the embedded panel 110 and the window panel 120, as shown in FIG. 5. As can be seen in FIG. 5, the panel frame 122 of the window panel 120 is constructed similarly to the embedded panel 110. Therefore, according to various embodiments of the gas package assembly, the manufacturing of the panel sections for receiving the embedded panel and the window panel may be the same. In this regard, the same principle can be used for sealing of embedded panels and window panels.

參考圖11A及圖11B,且根據本教示之各種實施例,氣體包體(諸如圖1之氣體包體總成100)之面板中之任一者可包括一或多個嵌入式面板區段10,該或該等嵌入式面板區段可具有經組配來接納對應之嵌入式面板110之框架12。圖11A係指示圖11B中所展示之放大部分的透視圖。在圖11A中,嵌入式面板110經描繪為相對於嵌入式框架12來定位。如圖11B中可看出,將嵌入式面板110貼附於框架12,其中框架12可例如由金屬建構而成。在一些實施例中,該金屬可包含鋁、鋼、銅、不銹鋼、鉻、 合金及其組合以及類似物。可在嵌入式面板區段框架12中製作複數個盲螺孔14。面板區段框架12經建構以便包含介於嵌入式面板110與框架12之間的墊圈16,可壓縮墊圈18可佈置於其中。盲螺孔14可為M5品種。螺釘15可由盲螺孔14接納,從而壓縮介於嵌入式面板110與框架12之間的墊圈16。一旦抵靠墊圈16緊固至適當位置,嵌入式面板110則在嵌入式面板區段10中形成氣密式密封。如前面所討論,可針對多種區段面板實行此面板密封,該等區段面板包括但不限於圖5中所展示之嵌入式面板110及窗口面板120。 11A and 11B, and according to various embodiments of the present teachings, any one of the panels of the gas enclosure (such as the gas enclosure assembly 100 of FIG. 1) may include one or more embedded panel sections 10 The embedded panel section(s) may have a frame 12 configured to receive the corresponding embedded panel 110. FIG. 11A is a perspective view indicating an enlarged part shown in FIG. 11B. In FIG. 11A, the embedded panel 110 is depicted as being positioned relative to the embedded frame 12. As can be seen in FIG. 11B, the embedded panel 110 is attached to the frame 12, wherein the frame 12 may be constructed of metal, for example. In some embodiments, the metal may include aluminum, steel, copper, stainless steel, chromium, alloys, combinations thereof, and the like. A plurality of blind screw holes 14 can be made in the embedded panel section frame 12. The panel section frame 12 is constructed so as to include a gasket 16 between the embedded panel 110 and the frame 12 in which a compressible gasket 18 can be arranged. The blind screw hole 14 may be of the M5 variety. The screw 15 may be received by the blind screw hole 14, thereby compressing the washer 16 between the embedded panel 110 and the frame 12. Once secured against the gasket 16 in place, the embedded panel 110 forms an airtight seal in the embedded panel section 10. As previously discussed, this panel seal can be implemented for a variety of segment panels, including but not limited to the embedded panel 110 and the window panel 120 shown in FIG. 5.

根據本教示之可壓縮墊圈的各種實施例,用於框架構件密封及面板密封的可壓縮墊圈材料可選自多種可壓縮聚合物材料,例如但不限於封閉胞體(closed-cell)聚合物材料之類別中的任何材料,在此項技術中亦稱為膨脹橡膠材料或膨脹聚合物材料。簡單而言,封閉胞體聚合物係以氣體被包封在離散胞體中之方式製備;其中每一離散胞體係由聚合物材料所包封。需要在框架組件及面板組件之氣密式密封中使用的可壓縮封閉胞體聚合物墊圈材料之特性包括但不限於:該等材料在廣泛化學物種之化學腐蝕下表現穩健;擁有極好之防潮特性;在廣泛之溫度範圍內有彈性;以及其能夠抵抗永久性壓縮變形。大體而言,與開放胞體結構型聚合物材料相比,封閉胞體聚合物材料具有較高之尺寸穩定性、較低之吸濕係數及較高之強度。用來製造封閉胞體聚合物材料之各種類型的聚合物材料包括:例如但不限於聚矽氧、氯丁橡膠(neoprene)、乙烯-丙烯-二烯三元共聚物(EPT);使用甲基-丙烯-二烯單體(EPDM)製造之聚合物及複合材料、乙烯基晴(vinyl nitrile)、苯乙烯-丁二烯橡膠(SBR)及其各種共聚物及摻合 物。 According to various embodiments of the compressible gasket of the present teaching, the compressible gasket material for frame member sealing and panel sealing can be selected from a variety of compressible polymer materials, such as but not limited to closed-cell polymer materials Any material in the category is also called expanded rubber material or expanded polymer material in this technology. In simple terms, closed cell polymers are prepared in such a way that gas is encapsulated in discrete cells; each discrete cell system is encapsulated by a polymer material. The characteristics of compressible closed cell polymer gasket materials used in the airtight sealing of frame components and panel components include, but are not limited to: These materials perform robustly under chemical corrosion of a wide range of chemical species; have excellent moisture resistance Characteristics; elasticity in a wide temperature range; and its resistance to permanent compression deformation. Generally speaking, the closed cell polymer material has higher dimensional stability, lower moisture absorption coefficient and higher strength than the open cell structure type polymer material. Various types of polymer materials used to manufacture closed cell polymer materials include: but not limited to polysiloxane, neoprene (neoprene), ethylene-propylene-diene terpolymer (EPT); use of methyl -Polypropylene-diene monomer (EPDM) polymer and composite materials, vinyl nitrile, styrene-butadiene rubber (SBR) and various copolymers and blends thereof.

僅當包含塊狀材料之胞體在使用期間保持完整時,封閉胞體聚合物之所需材料特性才得以維持。就此而言,以可能超出針對封閉胞體聚合物所設定之材料規格(例如超出在規定溫度或壓縮範圍中使用之規格)的方式來使用此材料可能引起墊圈密封之退化。在用於密封框架面板區段中之框架構件及區段面板的封閉胞體聚合物墊圈之各種實施例中,此等材料之壓縮不應超出約50%至約70%之間的撓曲,且為了實現最佳性能,壓縮可介於約20%至約40%之間的撓曲。 Only when the cell body containing the bulk material remains intact during use, the desired material properties of the closed cell polymer are maintained. In this regard, the use of this material in a manner that may exceed the material specifications set for the closed cell polymer (eg, exceeding the specifications used in the specified temperature or compression range) may cause degradation of the gasket seal. In various embodiments for sealing frame members in frame panel sections and closed cell polymer gaskets of the section panels, the compression of these materials should not exceed deflections between about 50% and about 70%, And in order to achieve the best performance, compression can be between about 20% to about 40% deflection.

除了封閉胞體可壓縮墊圈材料之外,具有所需性質以便用於建構根據本教示之氣體包體總成之實施例的可壓縮墊圈材料類別的另一實例包括空心擠製型可壓縮墊圈材料類別。作為一種材料類別,空心擠製型墊圈材料具有所需屬性,包括但不限於:該等墊圈材料在廣泛化學物種之化學腐蝕下表現穩健;擁有極好之防潮特性;在廣泛之溫度範圍內有彈性;以及其能夠抵抗永久性壓縮變形。此等空心擠製型可壓縮墊圈材料可表現為廣泛多種外觀尺寸,諸如:例如但不限於U型胞體、D型胞體、正方形胞體、矩形胞體,以及多種定製外觀尺寸空心擠製型墊圈材料中之任一者。各種空心擠製型墊圈材料可由用於封閉胞體可壓縮墊圈製造之聚合物材料製成。例如但不限於空心擠製墊圈之各種實施例可由以下製成:聚矽氧、氯丁橡膠、乙烯-丙烯-二烯三元共聚物(EPT)、使用甲基-丙烯-二烯單體(EPDM)製造之聚合物及複合材料、乙烯基晴、苯乙烯-丁二烯橡膠(SBR)及其各種共聚物及摻合物。為了維持所需屬性,此等空心胞體墊圈材料之壓縮不應超出約50%的撓曲。 In addition to the closed cell compressible gasket material, another example of a class of compressible gasket materials that has the desired properties for use in constructing embodiments of gas inclusion assemblies according to the present teachings includes hollow extruded compressible gasket materials category. As a material category, hollow extruded gasket materials have the required properties, including but not limited to: These gasket materials perform robustly under chemical corrosion of a wide range of chemical species; have excellent moisture resistance; have a wide temperature range Elasticity; and its ability to resist permanent compression deformation. These hollow extruded compressible gasket materials can exhibit a wide variety of appearance sizes, such as, but not limited to, U-shaped cell body, D-shaped cell body, square cell body, rectangular cell body, and various customized appearance size hollow extrusion Any one of the molding gasket materials. Various hollow extruded gasket materials can be made of polymer materials used in the manufacture of closed cell compressible gaskets. For example, but not limited to, various embodiments of hollow extruded gaskets can be made from the following: polysiloxane, neoprene, ethylene-propylene-diene terpolymer (EPT), using methyl-propylene-diene monomer ( EPDM) polymer and composite materials, vinyl chloride, styrene-butadiene rubber (SBR) and its various copolymers and blends. In order to maintain the required properties, the compression of these hollow cell gasket materials should not exceed about 50% of the deflection.

一般技藝人士可易於理解的是,儘管已作為實例來給出封閉胞體可壓縮墊圈材料類別及空心擠製型可壓縮墊圈材料類別,但可使用具有所需屬性的任何可壓縮墊圈材料來密封諸如各種壁框架構件及天花板框架構件之結構組件,以及密封面板區段框架中之各種面板,如本教示所提供。 It can be easily understood by those skilled in the art that although the closed cell compressible gasket material category and the hollow extruded compressible gasket material category have been given as examples, any compressible gasket material with desired properties can be used for sealing Structural components such as various wall frame members and ceiling frame members, and various panels in the frame of the sealed panel section, as provided by this teaching.

可進行由複數個框架構件來建構氣體包體總成(諸如圖3及圖4之氣體包體總成100,或如隨後將討論的圖23及圖24之氣體包體總成1000)以便使損壞系統組件之風險最小化,該等系統組件諸如:例如但不限於墊圈密封件、框架構件、管道及區段面板。例如,墊圈密封件係在由複數個框架構件建構氣體包體期間可能容易損壞之組件。根據本教示之各種實施例,提供材料及方法以便在根據本教示之氣體包體的建構期間最小化或消除損壞氣體包體總成之各種組件的風險。 It is possible to construct the gas inclusion assembly from a plurality of frame members (such as the gas inclusion assembly 100 of FIGS. 3 and 4 or the gas inclusion assembly 1000 of FIGS. 23 and 24 as will be discussed later) so that The risk of damaging system components such as, for example, but not limited to gasket seals, frame members, pipes and section panels is minimized. For example, a gasket seal is a component that may be easily damaged during the construction of a gas envelope from a plurality of frame members. According to various embodiments of the present teachings, materials and methods are provided to minimize or eliminate the risk of damage to various components of the gas enclosure assembly during construction of the gas enclosure according to the present teachings.

圖12A係諸如圖3之氣體包體總成100的氣體包體總成之初始建構階段的透視圖。儘管使用諸如氣體包體總成100之氣體包體總成來例證本教示之氣體包體總成的建構,但是一般技藝人士可認識到,此等教示適用於氣體包體總成之各種實施例。如圖12A中所描繪,在氣體包體總成之初始建構階段期間,首先將複數個間隔塊置放在由底座202支撐之底盤204上。該等間隔塊可比安裝於底盤204上之各種壁框架構件上所佈置的可壓縮墊圈材料厚。可將一系列間隔塊置放在底盤204之外圍邊緣上之多個位置處,在該等位置處,可在組裝期間將氣體包體總成之各種壁框架構件置放在一系列間隔塊上且置放至靠近底盤204之位置中而不接觸底盤204。需要以某種方式在底盤204上組裝各種壁框架構件,以使得可防護對 佈置於各種壁框架構件上以便與底盤204密封之可壓縮墊圈材料的任何損壞。因此,間隔塊之使用防止對佈置於各種壁框架構件上以便與底盤204形成氣密式密封之可壓縮墊圈材料的此損壞,在該等間隔塊上可將各種壁面板組件置放至底盤204上之初始位置中。例如但不限於,如圖12A中所展示,前部外圍邊緣201可具有間隔物93、95及97,前部壁框架構件可擱置於該等間隔物上;右側外圍邊緣205可具有間隔物89及91,右側壁框架構件可擱置於該等間隔物上;且後部外圍邊緣207可具有兩個間隔物,後部壁框架構件可擱置於該等間隔物上,展示了其中一個間隔物87。可使用任何數量、類型之間隔塊及其組合。一般技藝人士將理解的是,可根據本教示將間隔塊定位在底盤204上,儘管圖12A至圖14B中之每一者中未例示相異之間隔塊。 FIG. 12A is a perspective view of the initial construction stage of a gas enclosure assembly, such as the gas enclosure assembly 100 of FIG. 3. Although a gas inclusion assembly such as the gas inclusion assembly 100 is used to exemplify the construction of the gas inclusion assembly of this teaching, a person of ordinary skill can recognize that these teachings are applicable to various embodiments of the gas inclusion assembly . As depicted in FIG. 12A, during the initial construction phase of the gas inclusion assembly, a plurality of spacer blocks are first placed on the chassis 204 supported by the base 202. The spacers may be thicker than the compressible gasket material disposed on various wall frame members mounted on the chassis 204. A series of spacers can be placed at multiple locations on the peripheral edge of the chassis 204, and at these locations, various wall frame members of the gas enclosure assembly can be placed on the series of spacers during assembly And placed in a position close to the chassis 204 without touching the chassis 204. It is necessary to assemble various wall frame members on the chassis 204 in a manner such that any damage to the compressible gasket material disposed on the various wall frame members to seal with the chassis 204 can be protected. Therefore, the use of the spacer blocks prevents this damage to the compressible gasket material that is arranged on various wall frame members to form an airtight seal with the chassis 204, and various wall panel assemblies can be placed on the chassis 204 on the spacer blocks In the initial position. For example, but not limited to, as shown in FIG. 12A, the front peripheral edge 201 may have spacers 93, 95, and 97, and the front wall frame member may rest on such spacers; the right peripheral edge 205 may have spacers 89 At 91, the right side wall frame member may rest on the spacers; and the rear peripheral edge 207 may have two spacers, and the rear wall frame member may rest on the spacers, one of the spacers 87 is shown. Any number and type of spacer blocks and combinations can be used. Those of ordinary skill will understand that the spacer block may be positioned on the chassis 204 according to the present teachings, although different spacer blocks are not illustrated in each of FIGS. 12A-14B.

在圖12B中展示根據本教示之關於由組件框架構件來組裝氣體包體之各種實施例的示例性間隔塊,圖12B係圖12A之圓圈部分中所展示之第三間隔塊91的透視圖。示例性間隔塊91可包括附接至間隔塊之橫向側92的間隔塊條(spacer block strap)90。間隔塊可由任何合適之材料以及材料之組合製成。例如,每一間隔塊可包含超高分子量聚乙烯。間隔塊條90可由任何合適之材料以及材料之組合製成。在一些實施例中,間隔塊條90包含尼龍(nylon)材料、聚亞烷基材料或類似物。間隔塊91具有頂部表面94及底部表面96。間隔塊87、89、93、95、97及任何其他所使用的間隔塊可以相同或類似之實體屬性來組配且可包含相同或類似之材料。間隔塊可以允許穩定的置放而又容易移除之方式擱置於、夾緊於或以其他方式容易地佈置於底盤204之外圍上部邊緣。 Exemplary spacer blocks according to the present teaching regarding various embodiments of assembling a gas enclosure from an assembly frame member are shown in FIG. 12B, and FIG. 12B is a perspective view of a third spacer block 91 shown in the circled portion of FIG. 12A. An exemplary spacer block 91 may include a spacer block strap 90 attached to the lateral side 92 of the spacer block. The spacer can be made of any suitable material and combination of materials. For example, each spacer block may include ultra high molecular weight polyethylene. Spacer bar 90 can be made of any suitable material and combination of materials. In some embodiments, the spacer bar 90 comprises nylon material, polyalkylene material, or the like. The spacer 91 has a top surface 94 and a bottom surface 96. The spacers 87, 89, 93, 95, 97 and any other spacers used may be assembled with the same or similar physical attributes and may contain the same or similar materials. The spacer may allow stable placement and easy removal to rest, clamp, or otherwise be easily arranged on the peripheral upper edge of the chassis 204.

在圖13中所呈現之分解透視圖中,框架構件可包含前部壁框架210、左側壁框架220、右側壁框架230、後部壁框架240以及天花板或頂部框架250,該等框架可附接至擱置於底座202上之底盤204。OLED列印系統50可安裝於底盤204之頂部上。 In the exploded perspective view presented in FIG. 13, the frame members may include a front wall frame 210, a left side wall frame 220, a right side wall frame 230, a rear wall frame 240, and a ceiling or top frame 250, which may be attached to The chassis 204 rests on the base 202. The OLED printing system 50 can be installed on the top of the chassis 204.

根據本教示之氣體包體總成及系統的各種實施例之OLED列印系統50可包含例如:花崗岩底座;移動式橋,其可支撐OLED列印裝置;自加壓惰性氣體再循環系統延伸之一或多個裝置及設備,諸如基板漂浮台、空氣軸承、軌道、軌條;用於將OLED成膜材料沈積至基板上之噴墨印表機系統,其包括OLED墨水供應子系統及噴墨列印頭;一或多個機器人及類似物。考慮到可包含OLED列印系統50之組件的多樣性,OLED列印系統50之各種實施例可具有多種佔據面積及外觀尺寸。 The OLED printing system 50 according to various embodiments of the gas inclusion assembly and system of the present teaching may include, for example: a granite base; a mobile bridge that can support the OLED printing device; extending from the pressurized inert gas recirculation system One or more devices and equipment, such as a substrate floating table, air bearings, rails, rails; an inkjet printer system for depositing OLED film-forming materials onto a substrate, which includes an OLED ink supply subsystem and inkjet Print head; one or more robots and the like. Considering the diversity of components that can include the OLED printing system 50, various embodiments of the OLED printing system 50 can have a variety of footprints and dimensions.

OLED噴墨列印系統可由若干裝置及設備組成,該等裝置及設備允許墨水液滴至基板上之特定位置上的可靠置放。此等裝置及設備可包括但不限於:列印頭總成;墨水輸送系統;運動系統;基板支撐設備,諸如漂浮台或卡盤;基板裝載及卸載系統;以及列印頭維護系統。列印頭總成由至少一個噴墨頭組成,該至少一個噴墨頭具有能夠以受控制之速率、速度及大小來噴射墨水液滴的至少一個孔口。該噴墨頭係由墨水供應系統供給,該墨水供應系統提供墨水至噴墨頭。列印需要列印頭總成與基板之間的相對運動。此運動係藉由運動系統來實現,該運動系統通常為門架或分體軸XYZ系統。列印頭總成可在固定基板上方移動(門架式),或在分體軸組配之狀況下,列印頭與基板均可移動。在另一實施例中,列印台可為固定的,且基板可相對於列印頭在X軸及Y軸上移動,其中在基板 處或列印頭處提供Z軸運動。隨著列印頭相對於基板移動,在正確的時間噴射墨水液滴,以便將其沈積於基板上之所需位置中。使用基板裝載及卸載系統來插入基板並且自印表機移除基板。取決於印表機組配,此操作可藉由機械輸送機、基板漂浮台或具有末端執行器之機器人來實現。列印頭維護系統可由若干子系統(亦即,模組)組成,該等子系統允許進行維護任務,諸如液滴體積校準、噴墨噴嘴表面之擦拭、起動以便噴射墨水至廢料盆中。 The OLED inkjet printing system can be composed of several devices and equipment that allow reliable placement of ink droplets at specific locations on the substrate. Such devices and equipment may include, but are not limited to: print head assemblies; ink delivery systems; motion systems; substrate support equipment such as floating tables or chucks; substrate loading and unloading systems; and print head maintenance systems. The print head assembly consists of at least one inkjet head having at least one orifice capable of ejecting ink droplets at a controlled rate, speed, and size. The inkjet head is supplied by an ink supply system, which supplies ink to the inkjet head. Printing requires relative movement between the print head assembly and the substrate. This movement is realized by a movement system, which is usually a gantry or split axis XYZ system. The print head assembly can be moved above the fixed substrate (gantry type), or in the condition of split shaft assembly, both the print head and the substrate can be moved. In another embodiment, the printing table may be fixed, and the substrate may move on the X axis and the Y axis relative to the print head, where Z-axis motion is provided at the substrate or at the print head. As the print head moves relative to the substrate, ink droplets are ejected at the correct time to deposit them in the desired location on the substrate. A substrate loading and unloading system is used to insert the substrate and remove the substrate from the printer. Depending on the printer unit configuration, this operation can be achieved by mechanical conveyors, substrate floating tables, or robots with end effectors. The printhead maintenance system can be composed of several subsystems (ie, modules) that allow maintenance tasks such as droplet volume calibration, wiping of the inkjet nozzle surface, and activation to eject ink into the waste bin.

根據本教示之關於氣體包體之組裝的各種實施例,如圖13中所展示之前部或第一壁框架210、左側或第二壁框架220、右側或第三壁框架230、後部或第四壁框架240以及天花板框架250可按系統次序一起建構,並且隨後附接至安裝於底座202上之底盤204。如前面所討論,可使用門架起重機將框架構件之各種實施例定位在間隔塊上,以便防止對可壓縮墊圈材料之損壞。例如,使用門架起重機,可將前部壁框架210擱置於至少三個間隔塊上,諸如圖12A中所展示之底盤204的外圍上部邊緣201上之間隔塊93、95及97。在將前部壁框架210置放於間隔塊上之後,可將壁框架220及壁框架230按任何次序相繼地或循序地置放於間隔塊上,該等間隔塊已分別設置於底盤204之外圍邊緣203及外圍邊緣205上。根據本教示之關於由組件框架構件來組裝氣體包體的各種實施例,可將前部壁框架210置放於間隔塊上,隨後將左側壁框架220及右側壁框架230置放於間隔塊上,以使得該左側壁框架及該右側壁框架處於適當位置以便栓接或以其他方式緊固至前部壁框架210。在各種實施例中,可將後部壁框架240置放於間隔塊上,以使得該後部壁框架處於適當位置以便栓接或緊固至左側壁框 架220及右側壁框架230。對於各種實施例,一旦壁框架已固定在一起來形成相連的壁框架包體總成,則可將頂部天花板框架250貼附於此壁框架包體總成,來形成完整之氣體包體框架總成。在本教示之關於氣體包體總成之建構的各種實施例中,完整之氣體包體框架總成在此組裝階段係擱置於複數個間隔塊上以便保護各種框架構件墊圈之完整性。 According to various embodiments of the present teaching regarding the assembly of a gas bag, as shown in FIG. 13, the front or first wall frame 210, the left or second wall frame 220, the right or third wall frame 230, the rear or fourth The wall frame 240 and the ceiling frame 250 may be constructed together in a system order, and then attached to the chassis 204 mounted on the base 202. As discussed previously, a gantry crane can be used to position various embodiments of the frame member on the spacer block in order to prevent damage to the compressible gasket material. For example, using a gantry crane, the front wall frame 210 may rest on at least three spacer blocks, such as spacer blocks 93, 95, and 97 on the peripheral upper edge 201 of the chassis 204 shown in FIG. 12A. After the front wall frame 210 is placed on the spacer block, the wall frame 220 and the wall frame 230 can be placed on the spacer block sequentially or sequentially in any order, and these spacer blocks have been placed on the chassis 204 respectively On the peripheral edge 203 and the peripheral edge 205. According to various embodiments of the present teaching regarding assembling the gas enclosure from the assembly frame member, the front wall frame 210 may be placed on the spacer block, and then the left side wall frame 220 and the right side wall frame 230 may be placed on the spacer block , So that the left side wall frame and the right side wall frame are in place to be bolted or otherwise fastened to the front wall frame 210. In various embodiments, the rear wall frame 240 may be placed on the spacer block so that the rear wall frame is in place for bolting or fastening to the left side wall frame 220 and the right side wall frame 230. For various embodiments, once the wall frames have been fixed together to form a connected wall frame package assembly, the top ceiling frame 250 may be attached to this wall frame package assembly to form a complete gas package frame assembly to make. In various embodiments of the present teaching regarding the construction of a gas enclosure assembly, a complete gas enclosure frame assembly is placed on a plurality of spacers during this assembly stage to protect the integrity of various frame member gaskets.

如圖14A中所展示,對於本教示之關於氣體包體總成之建構的各種實施例,隨後可定位氣體包體框架總成400以使得間隔物可被移除,以便為將氣體包體框架總成400附接至底盤204作準備。圖14A描繪氣體包體框架總成400,使用升降器總成402、升降器總成404及升降器總成406將其升高至自間隔塊提升且離開間隔塊的位置。在本教示之各種實施例中,升降器總成402、404及406可附接在氣體包體框架總成400之外圍周圍。在附接了該等升降器總成之後,可藉由致動每一升降器總成來提升或延伸該等升降器總成中之每一者而自間隔塊提起完全建構之氣體包體框架總成,藉此提升氣體包體框架總成400。如圖14A中所展示,氣體包體框架總成400經展示為提升至複數個間隔塊之上方,其先前係擱置於該等間隔塊上。隨後可將該複數個間隔塊自其在底盤204上之擱置位置移除,以使得隨後可將框架可隨後被降下至底盤204上,並隨後將其附接至底盤204。 As shown in FIG. 14A, for the various embodiments of the present teachings regarding the construction of the gas inclusion assembly, the gas inclusion frame assembly 400 can then be positioned so that the spacer can be removed in order to The assembly 400 is attached to the chassis 204 in preparation. FIG. 14A depicts the gas enclosure frame assembly 400, which is raised to a position where it is lifted from the spacer block and away from the spacer block using the elevator assembly 402, the elevator assembly 404, and the elevator assembly 406. FIG. In various embodiments of the present teachings, the lifter assemblies 402, 404, and 406 can be attached around the periphery of the gas enclosure frame assembly 400. After attaching the lifter assemblies, the fully constructed gas enclosure frame can be lifted from the spacer block by actuating each lifter assembly to lift or extend each of the lifter assemblies Assembly, thereby lifting the gas inclusion frame assembly 400. As shown in FIG. 14A, the gas inclusion frame assembly 400 is shown as being lifted above a plurality of spacer blocks, which were previously placed on the spacer blocks. The plurality of spacer blocks can then be removed from its resting position on the chassis 204, so that the frame can then be lowered onto the chassis 204 and then attached to the chassis 204.

圖14B係根據本教示之升降器總成的各種實施例且如圖14A中所描繪之相同升降器總成402的分解視圖。如所展示,升降器總成402包括磨損墊408、安裝板410、第一夾鉗座(clamp mount)412及第二夾鉗座413。第一夾鉗414及第二夾鉗415經展示為符合對應之夾鉗座412及 413。千斤頂曲柄416附接至千斤頂軸桿418之頂部。千斤頂底座422被展示為千斤頂軸桿418之下端部的一部分。千斤頂底座422下方係腳座424,該腳座經組配來接納千斤頂軸桿418之下端部且可連接至千斤頂軸桿418之下端部。亦展示整平腳426,且其經組配來被腳座424接納。一般技藝人士可易於認識到,適合用於提升操作之任何裝置可用來自間隔塊升高氣體包體框架總成,以使得可移除間隔塊且將完整之氣體包體總成降下至底盤上。例如,代替諸如上述402、404及406之一或多個提升器總成,可使用液壓提升器、氣動提升器或電動提升器。 FIG. 14B is an exploded view of the same elevator assembly 402 according to various embodiments of the elevator assembly of the present teachings and as depicted in FIG. 14A. As shown, the lifter assembly 402 includes a wear pad 408, a mounting plate 410, a first clamp mount 412, and a second clamp mount 413. The first clamp 414 and the second clamp 415 are shown as corresponding to the corresponding clamp bases 412 and 413. Jack crank 416 is attached to the top of jack shaft 418. The jack base 422 is shown as part of the lower end of the jack shaft 418. Below the jack base 422 is a foot seat 424 that is assembled to receive the lower end of the jack shaft 418 and can be connected to the lower end of the jack shaft 418. The leveling foot 426 is also shown, and it is assembled to be received by the foot holder 424. A person of ordinary skill can easily recognize that any device suitable for the lifting operation can raise the gas inclusion frame assembly from the spacer, so that the spacer can be removed and the complete gas inclusion assembly can be lowered onto the chassis. For example, instead of one or more lifter assemblies such as 402, 404, and 406 described above, hydraulic lifters, pneumatic lifters, or electric lifters may be used.

根據本教示之關於氣體包體總成之建構的各種實施例,可提供複數個緊固件且該複數個緊固件經組配來將複數個框架構件緊固在一起,並隨後將氣體包體框架總成緊固至底盤。該複數個緊固件可包括一或多個緊固件部分,其沿每一框架構件之每一邊緣佈置於一位置處,在該位置處對應之框架構件經組配來與複數個框架構件中之一相鄰框架構件相交。複數個緊固件及可壓縮墊圈可經組配以使得,當框架構件被連接在一起時,可壓縮墊圈係佈置成靠近內部且硬體靠近外部,以便硬體不會給本教示之氣密式包體總成提供複數個洩漏路徑。 According to various embodiments of the present teaching regarding the construction of the gas inclusion assembly, a plurality of fasteners may be provided and the plurality of fasteners are assembled to fasten the plurality of frame members together, and then the gas inclusion frame The assembly is fastened to the chassis. The plurality of fasteners may include one or more fastener portions arranged along each edge of each frame member at a position where the corresponding frame member is assembled to match one of the plurality of frame members An adjacent frame member intersects. A plurality of fasteners and compressible washers can be assembled so that when the frame members are connected together, the compressible washers are arranged close to the inside and the hard body is close to the outside so that the hard body does not give the airtightness of this teaching The body assembly provides multiple leak paths.

複數個緊固件可包含沿該等框架構件中之一或多者的邊緣之複數個螺栓,以及沿複數個框架構件中之一或多個不同框架構件的邊緣之複數個螺紋孔。複數個緊固件可包含複數個固定的螺栓。該等螺栓可包含自對應面板之外表面延伸出去的螺栓頭。該等螺栓可凹陷至框架構件中之凹部中。夾鉗、螺釘、鉚釘、黏合劑及其他緊固件可用來將該等框架構件固定在一起。該等螺栓或其他緊固件可延伸穿過該等框架構件中之一或 多者的外壁並且進入位於一或多個相鄰框架構件之側壁或頂部壁中的螺紋孔中或其他互補的緊固件特徵中。 The plurality of fasteners may include a plurality of bolts along an edge of one or more of the frame members, and a plurality of threaded holes along the edge of one or more different frame members of the plurality of frame members. The plurality of fasteners may include a plurality of fixed bolts. The bolts may include bolt heads extending from the outer surface of the corresponding panel. The bolts can be recessed into the recesses in the frame member. Clamps, screws, rivets, adhesives and other fasteners can be used to fix these frame members together. The bolts or other fasteners may extend through the outer wall of one or more of the frame members and into threaded holes in the side walls or top wall of one or more adjacent frame members or other complementary fasteners Features.

如圖15至圖17中所描繪,對於用於建構氣體包體之方法的各種實施例,可將管道安裝於藉由將壁框架構件及天花板框架構件連接在一起而形成的內部部分中。對於氣體包體總成之各種實施例,可在建構處理期間安裝管道。根據本教示之各種實施例,可將管道安裝於已由複數個框架構件建構而成之氣體包體框架總成中。在各種實施例中,可在複數個框架構件被連接來形成氣體包體框架總成之前將管道安裝於該複數個框架構件上。用於氣體包體總成及系統之各種實施例的管道可經組配以使得自一或多個管道入口吸入管道中之大致全部氣體被移動通過在氣體包體總成內部之用於移除顆粒物的氣體循環及過濾迴路之各種實施例。另外,氣體包體總成及系統之各種實施例的管道可經組配來將在氣體包體總成外部的氣體淨化迴路之入口及出口與在氣體包體總成內部的用於移除顆粒物之氣體循環及過濾迴路分開。根據本教示之管道的各種實施例可由金屬薄片製成,該金屬薄片例如但不限於厚度約為80密耳之鋁薄片。 As depicted in FIGS. 15 to 17, for various embodiments of the method for constructing the gas enclosure, the pipes may be installed in the inner portion formed by connecting the wall frame member and the ceiling frame member together. For various embodiments of the gas enclosure assembly, piping may be installed during the construction process. According to various embodiments of the present teaching, the pipeline can be installed in a gas envelope frame assembly that has been constructed from a plurality of frame members. In various embodiments, the piping may be installed on the plurality of frame members before the plurality of frame members are connected to form the gas inclusion frame assembly. The piping for various embodiments of the gas enclosure assembly and system may be configured so that substantially all of the gas drawn into the pipe from one or more pipe inlets is moved through for removal within the gas enclosure assembly Various embodiments of gas circulation and filtration circuits for particulate matter. In addition, the gas inclusion assembly and the piping of various embodiments of the system can be configured to combine the inlet and outlet of the gas purification circuit outside the gas inclusion assembly with the inside of the gas inclusion assembly for removing particulate matter The gas circulation and the filter circuit are separated. Various embodiments of pipes according to the present teachings can be made of metal foil, such as but not limited to aluminum foil with a thickness of about 80 mils.

圖15描繪氣體包體總成100之管道總成500的右前部假想透視圖。包體管道總成500可具有前部壁面板管道總成510。如所展示,前部壁面板管道總成510可具有前部壁面板入口管道512、第一前部壁面板豎管514及第二前部壁面板豎管516,該等豎管均與前部壁面板入口管道512流體連通。第一前部壁面板豎管514經展示為具有出口515,該出口係與風扇過濾單元罩蓋103之天花板管道505密封地嚙合。以類似之方式,第二前部壁面板豎管516經展示為具有出口517,該出口係與風扇過濾單元罩蓋103 之天花板管道507密封地嚙合。就此而言,前部壁面板管道總成510提供用於利用前部壁面板入口管道512、經由每一前部壁面板豎管514及516使惰性氣體在氣體包體總成中自底部開始循環,並且分別經由出口505及507輸送空氣,以使得空氣可藉由例如風扇過濾單元752來過濾。如隨後將更為詳細地討論,可根據處理期間基板在列印系統中之實體位置來選擇風扇過濾單元之數量、大小及形狀。靠近風扇過濾單元752的係熱交換器742,該熱交換器作為熱調節系統之一部分可將循環通過氣體包體總成100之惰性氣體維持在所需溫度。 FIG. 15 depicts an imaginary perspective view of the front right portion of the pipe assembly 500 of the gas enclosure assembly 100. FIG. The body duct assembly 500 may have a front wall panel duct assembly 510. As shown, the front wall panel duct assembly 510 may have a front wall panel inlet duct 512, a first front wall panel riser 514, and a second front wall panel riser 516, all of which are the same as the front The wall panel inlet duct 512 is in fluid communication. The first front wall panel standpipe 514 is shown as having an outlet 515 that sealingly engages the ceiling duct 505 of the fan filter unit cover 103. In a similar manner, the second front wall panel standpipe 516 is shown as having an outlet 517 that sealingly engages the ceiling duct 507 of the fan filter unit cover 103. In this regard, the front wall panel duct assembly 510 is provided for using the front wall panel inlet duct 512 to circulate the inert gas from the bottom through the front wall panel risers 514 and 516 in the gas envelope assembly And deliver air through outlets 505 and 507, respectively, so that the air can be filtered by, for example, fan filter unit 752. As will be discussed in more detail later, the number, size, and shape of fan filter units can be selected based on the physical location of the substrate in the printing system during processing. Close to the fan filter unit 752 is a heat exchanger 742, which is part of the thermal regulation system to maintain the inert gas circulating through the gas envelope assembly 100 at the desired temperature.

右側壁面板管道總成530可具有右側壁面板入口管道532,其經由右側壁面板第一豎管534及右側壁面板第二豎管536與右側壁面板上部管道538流體連通。右側壁面板上部管道538可具有第一管道入口端535及第二管道出口端537,該第二管道出口端537與後部壁管道總成540之後部壁面板上部管道536流體連通。左側壁面板管道總成520可具有與關於右側壁面板總成530所描述之組件相同的組件,其中左側壁面板入口管道522在圖15中清晰可見,該左側壁面板入口管道經由第一左側壁面板豎管524及第一左側壁面板豎管524與左側壁面板上部管道(未圖示)流體連通。後部壁面板管道總成540可具有後部壁面板入口管道542,其與左側壁面板總成520及右側壁面板總成530流體連通。另外,後部壁面板管道總成540可具有後部壁面板底部管道544,其可具有後部壁面板第一入口541及後部壁面板第二入口543。後部壁面板底部管道544可經由第一隔框(bulkhead)547及第二隔框549與後部壁面板上部管道536流體連通,該等隔框結構可用來將例如但不限於電纜、線及管線以及類似物之各種束自氣體包體總成 100之外部饋送至內部中。管道開口533提供用於將電纜、線及管線以及類似物之多個束自後部壁面板上部管道536中移出,該等束可經由隔框549通過上部管道536。可使用如前面所述之可移除之嵌入式面板在外部氣密式密封隔框547及隔框549。後部壁面板上部管道經由通氣孔545與例如但不限於風扇過濾單元754流體連通,圖15中展示該通氣孔之一角。就此而言,左側壁面板管道總成520、右側壁面板管道總成530及後部壁面板管道總成540提供用於分別利用壁面板入口管道522、532及542以及後部面板下部管道544使惰性氣體在氣體包體總成中自底部開始循環,該等管道經由前面所述之各種豎管、管道、隔框通道及類似物與通氣孔545流體連通,以使得空氣可藉由例如風扇過濾單元754來過濾。靠近風扇過濾單元754的係熱交換器744,該熱交換器作為熱調節系統之一部分可將循環通過氣體包體總成100之惰性氣體維持在所需溫度。 The right side wall panel duct assembly 530 may have a right side wall panel inlet duct 532 that is in fluid communication with the right side wall panel upper duct 538 via the right side wall panel first vertical pipe 534 and the right side wall panel second vertical pipe 536. The right side wall panel upper duct 538 may have a first duct inlet end 535 and a second duct outlet end 537 in fluid communication with the rear wall duct assembly 540 and the rear wall panel upper duct 536. The left side wall panel duct assembly 520 may have the same components as described with respect to the right side wall panel assembly 530, where the left side wall panel inlet duct 522 is clearly visible in FIG. 15 and the left side wall panel inlet duct passes through the first left side wall The panel standpipe 524 and the first left-side panel standpipe 524 are in fluid communication with the left-side wall panel upper duct (not shown). The rear wall panel duct assembly 540 may have a rear wall panel inlet duct 542 that is in fluid communication with the left side wall panel assembly 520 and the right side wall panel assembly 530. In addition, the rear wall panel duct assembly 540 may have a rear wall panel bottom duct 544, which may have a rear wall panel first inlet 541 and a rear wall panel second inlet 543. The rear wall panel bottom duct 544 can be in fluid communication with the rear wall panel upper duct 536 via a first bulkhead 547 and a second bulkhead 549. These bulkhead structures can be used to, for example but not limited to, cables, wires and pipelines, and Various beams of the analog are fed from the outside of the gas envelope assembly 100 into the inside. The duct opening 533 provides for removing multiple bundles of cables, wires and pipelines, and the like from the rear wall panel upper duct 536, which can pass through the upper duct 536 via the bulkhead 549. The removable built-in panel as described above can be used to hermetically seal the outer partition 547 and the partition 549 on the outside. The upper duct of the rear wall panel is in fluid communication with, for example, but not limited to, a fan filter unit 754 via a vent hole 545, one corner of which is shown in FIG. In this regard, the left-side wall panel duct assembly 520, the right-side wall panel duct assembly 530 and the rear wall panel duct assembly 540 provide for inert gas using the wall panel inlet ducts 522, 532 and 542 and the rear panel lower duct 544, respectively Circulates from the bottom in the gas envelope assembly, and the pipes are in fluid communication with the vent holes 545 through various standpipes, pipes, frame channels, and the like as described above, so that the air can pass through the fan filter unit 754, for example To filter. Close to the fan filter unit 754 is a heat exchanger 744, which as part of the thermal regulation system can maintain the inert gas circulating through the gas envelope assembly 100 at the desired temperature.

圖15中展示經由開口533之電纜饋送。如隨後將更為詳細地討論,本教示之氣體包體總成的各種實施例提供用於使電纜、線及管線以及類似物之多個束穿過管道。為了消除在此等束周圍形成之洩漏路徑,可使用各種方法,該等方法用於使用保形材料來密封一束中之不同大小的電纜、線及管線。圖15中亦展示包體管道總成500之導管I及導管II,該等導管被展示為風扇過濾單元罩蓋103之一部分。導管I提供惰性氣體至外部空氣淨化系統之出口,而導管II提供淨化之惰性氣體至在氣體包體總成100內部的氣體循環及粒子過濾迴路的回流。 The cable feed through opening 533 is shown in FIG. 15. As will be discussed in more detail later, various embodiments of the gas enclosure assembly of the present teachings are provided for passing multiple bundles of cables, wires and pipelines, and the like through a pipeline. In order to eliminate the leakage path formed around these bundles, various methods can be used. These methods are used to use conformal materials to seal cables, wires, and pipelines of different sizes in a bundle. Also shown in FIG. 15 are the duct I and duct II of the body duct assembly 500, which are shown as part of the fan filter unit cover 103. Conduit I provides the inert gas to the outlet of the external air purification system, while conduit II provides the purified inert gas to the gas circulation inside the gas envelope assembly 100 and the return of the particle filtration circuit.

圖16中展示包體管道總成500之頂部假想透視圖。可看出左側壁面板管道總成520及右側壁面板管道總成530之對稱性質。對於右側 壁面板管道總成530,右側壁面板入口管道532經由右側壁面板第一豎管534及右側壁面板第二豎管536與右側壁面板上部管道538流體連通。右側壁面板上部管道538可具有第一管道入口端535及第二管道出口端537,該第二管道出口端537與後部壁管道總成540之後部壁面板上部管道536流體連通。類似地,左側壁面板管道總成520可具有左側壁面板入口管道522,其經由左側壁面板第一豎管524及左側壁面板第二豎管526與左側壁面板上部管道528流體連通。左側壁面板上部管道528可具有第一管道入口端525及第二管道出口端527,其中第二管道出口端527與後部壁管道總成540之後部壁面板上部管道536流體連通。另外,後部壁面板管道總成可具有後部壁面板入口管道542,其與左側壁面板總成520及右側壁面板總成530流體連通。另外,後部壁面板管道總成540可具有後部壁面板底部管道544,其可具有後部壁面板第一入口541及後部壁面板第二入口543。後部壁面板底部管道544可經由第一隔框547及第二隔框549與後部壁面板上部管道536流體連通。圖15及圖16中所展示之管道總成500可提供:惰性氣體自前部壁面板管道總成510的之有效循環,該前部壁面板管道總成使惰性氣體自前部壁面板入口管道512分別經由前部壁面板出口515及517循環至天花板面板管道505及507;以及惰性氣體自左側壁面板總成520、右側壁面板總成530及後部壁面板管道總成540之有效循環,上述三個總成使空氣分別自入口管道522、532及542循環至通氣孔545。一旦經由天花板面板管道505及507以及通氣孔545將惰性氣體排出至在包體100之風扇過濾單元罩蓋103下方的包體區域中,則如此排出的惰性氣體可經由風扇過濾單元752及754過濾。另外,可藉由熱交換器742及744將循環之惰性氣體維持在所需 溫度,該等熱交換器係熱調節系統之一部分。 An imaginary perspective view of the top of the package pipe assembly 500 is shown in FIG. 16. It can be seen that the left-side wall panel duct assembly 520 and the right-side wall panel duct assembly 530 are symmetrical. For the right side wall panel duct assembly 530, the right side wall panel inlet channel 532 is in fluid communication with the right side wall panel upper channel 538 via the right side wall panel first vertical tube 534 and the right side wall panel second vertical tube 536. The right side wall panel upper duct 538 may have a first duct inlet end 535 and a second duct outlet end 537 in fluid communication with the rear wall duct assembly 540 and the rear wall panel upper duct 536. Similarly, the left-side wall panel duct assembly 520 may have a left-side wall panel inlet duct 522 that is in fluid communication with the left-side wall panel upper duct 528 via the left-side wall panel first vertical pipe 524 and the left-side wall panel second vertical pipe 526. The left wall panel upper duct 528 may have a first duct inlet end 525 and a second duct outlet end 527, wherein the second duct outlet end 527 is in fluid communication with the rear wall duct assembly 540 and the rear wall panel upper duct 536. In addition, the rear wall panel duct assembly may have a rear wall panel inlet duct 542 that is in fluid communication with the left side wall panel assembly 520 and the right side wall panel assembly 530. In addition, the rear wall panel duct assembly 540 may have a rear wall panel bottom duct 544, which may have a rear wall panel first inlet 541 and a rear wall panel second inlet 543. The rear wall panel bottom duct 544 may be in fluid communication with the rear wall panel upper duct 536 via the first partition frame 547 and the second partition frame 549. The duct assembly 500 shown in FIGS. 15 and 16 can provide: effective circulation of inert gas from the front wall panel duct assembly 510, which enables the inert gas from the front wall panel inlet duct 512, respectively Circulate to the ceiling panel ducts 505 and 507 through the front wall panel outlets 515 and 517; and the effective circulation of inert gas from the left side wall panel assembly 520, the right side wall panel assembly 530 and the rear wall panel duct assembly 540 The assembly circulates air from the inlet ducts 522, 532, and 542 to the vent 545, respectively. Once the inert gas is discharged through the ceiling panel ducts 505 and 507 and the vent hole 545 into the package area under the fan filter unit cover 103 of the package 100, the inert gas thus discharged can be filtered through the fan filter units 752 and 754 . In addition, the circulating inert gas can be maintained at the desired temperature by heat exchangers 742 and 744, which are part of the thermal regulation system.

圖17係包體管道總成500之底部假想視圖。入口管道總成502包括前部壁面板入口管道512、左側壁面板入口管道522、右側壁面板入口管道532及後部壁面板入口管道542,該等入口管道彼此流體連通。對於入口管道總成502中所包括之每一入口管道,存在清晰可見的開口,該等開口跨每一管道之底部均勻分佈,為達本教示之目的,將該等開口之集合特別突顯為前部壁面板入口管道512之開口511、左側壁面板入口管道522之開口521、右側壁面板入口管道532之開口531以及後部壁面板入口管道542之開口541。跨每一入口管道之底部清晰可見的此等開口提供對包體100中之惰性氣體的有效吸取,以實現連續循環及過濾。氣體包體總成之各種實施例的惰性氣體之連續循環及過濾提供用於在氣體包體總成系統之各種實施例中維持大致上無粒子之環境。氣體包體總成系統之各種實施例可維持在關於顆粒物之ISO 14644第4級。氣體包體總成系統之各種實施例可維持在關於對粒子污染特別敏感之處理的ISO 14644第3級規格。如前面所討論,導管I提供惰性氣體至外部空氣淨化系統之出口,而導管II提供淨化之惰性氣體至在氣體包體總成100內部的過濾及循環迴路之回流。 Fig. 17 is an imaginary view of the bottom of the package pipe assembly 500. The inlet duct assembly 502 includes a front wall panel inlet duct 512, a left side wall panel inlet duct 522, a right side wall panel inlet duct 532, and a rear wall panel inlet duct 542, which are in fluid communication with each other. For each inlet pipe included in the inlet pipe assembly 502, there are clearly visible openings, and these openings are evenly distributed across the bottom of each pipe. For the purpose of this teaching, the collection of these openings is particularly highlighted as the front The opening 511 of the partial wall panel inlet duct 512, the opening 521 of the left side wall panel inlet duct 522, the opening 531 of the right side wall panel inlet duct 532, and the opening 541 of the rear wall panel inlet duct 542. These openings clearly visible across the bottom of each inlet pipe provide effective suction of the inert gas in the package 100 to achieve continuous circulation and filtration. The continuous circulation and filtration of the inert gas in various embodiments of the gas inclusion assembly provides for maintaining a substantially particle-free environment in various embodiments of the gas inclusion assembly system. Various embodiments of the gas inclusion assembly system can be maintained at ISO 14644 level 4 for particulate matter. Various embodiments of the gas inclusion assembly system can be maintained at ISO 14644 level 3 specifications for processes that are particularly sensitive to particle contamination. As previously discussed, conduit I provides inert gas to the outlet of the external air purification system, while conduit II provides purified inert gas to the filtration and circulation loop inside the gas envelope assembly 100.

在根據本教示之氣體包體總成及系統的各種實施例中,電纜、線及管線以及類似物之多個束可操作性地與佈置於氣體包體總成及系統之內部中之電氣系統、機械系統、流體系統及冷卻系統(例如用於OLED列印系統之操作)相關聯。可經由管道來饋送此等束,以便沖洗吸留在電纜、線及管線以及類似物之多個束之無效空間中的反應性大氣氣體,諸如水蒸汽及氧氣。根據本教示,已發現形成於電纜、線及管線之多個束中之 無效空間會產生被吸留之反應性物種的儲積(reservoir),其可顯著地延長使氣體包體總成滿足關於執行空氣敏感型處理之規格所可能花費的時間。對於本教示之可用於列印OLED裝置的氣體包體總成及系統之各種實施例,各種反應性物種中之每一物種包括諸如水蒸汽及氧氣之各種反應性大氣氣體,以及有機溶劑蒸汽,可將其維持在100ppm或更低,例如為10ppm或更低、1.0ppm或更低或者0.1ppm或更低。 In various embodiments of the gas envelope assembly and system according to the present teachings, multiple bundles of cables, wires and pipelines, and the like are operably associated with electrical systems arranged in the interior of the gas envelope assembly and system , Mechanical systems, fluid systems and cooling systems (for example, for the operation of OLED printing systems). These bundles can be fed through pipes to flush reactive atmospheric gases, such as water vapor and oxygen, that are trapped in the ineffective space of multiple bundles of cables, wires and pipelines, and the like. According to this teaching, it has been found that ineffective spaces formed in multiple bundles of cables, wires, and pipelines can produce a reservoir of reactive species that are occluded, which can be significantly extended to make the gas inclusion assembly satisfy The time it may take for air-sensitive processing specifications. For various embodiments of gas inclusion assemblies and systems that can be used to print OLED devices in this teaching, each of the various reactive species includes various reactive atmospheric gases such as water vapor and oxygen, and organic solvent vapors, It may be maintained at 100 ppm or less, for example, 10 ppm or less, 1.0 ppm or less, or 0.1 ppm or less.

為了理解經由管道來饋送之纜線可如何導致減少自成束之電纜、線及管線以及類似物中之無效體積沖洗掉被吸留之反應性大氣氣體所花費的時間,參考圖18A至圖19。圖18A描繪束I之擴展視圖,該束可為可包括諸如管線A之管線的束,管線A係用於輸送各種墨水、溶劑及類似物至列印系統,諸如圖13之列印系統50。圖18A之束I可另外包括諸如電線B之電接線,或諸如同軸電纜C之纜線。此等管線、線及電纜可束在一起且自外部至內部選路通過,以便連接至包含OLED列印系統之各種裝置及設備。如圖18A之陰影區域中所看出,此等束可產生很大的無效空間D。在圖18B之示意性透視圖中,當電纜、線及管線束I係經由管道II來饋送時,惰性氣體III可連續地吹掃經過該束。圖19之擴展截面圖描繪惰性氣體連續地吹掃經過成束之管線、線及電纜如何可有效地增加自此等束中之無效體積移除被吸留之反應性物種之速率。反應性物種A(圖19中由物種A所佔據之集體區域來指示)自無效體積擴散之速率與無效體積外的反應性物種(圖19中由惰性氣體物種B所佔據之集體區域來指示)之濃度成反比。換言之,若緊靠在該無效體積外之體積中的反應性物種之濃度較高,則擴散之速率降低。若藉由惰性氣體流使此區域中之反應性物種濃度自緊 靠在該無效體積外的體積連續地降低,則藉由質量作用,反應性物種自無效體積擴散之速率增加。另外,藉由相同原理,隨著被吸留之反應性物種有效地自彼等空間被移除,惰性氣體可擴散至無效體積中。 To understand how the cables fed through the pipeline can lead to a reduction in the time it takes for the ineffective volume of self-bundled cables, wires and pipelines and the like to flush away the trapped reactive atmospheric gas, refer to FIGS. 18A to 19 . 18A depicts an expanded view of bundle I, which may be a bundle that may include a pipeline such as pipeline A, which is used to transport various inks, solvents, and the like to a printing system, such as printing system 50 of FIG. 13. Bundle I of FIG. 18A may additionally include an electrical connection such as wire B, or a cable such as coaxial cable C. These pipelines, wires and cables can be bundled together and routed from the outside to the inside to connect to various devices and equipment including OLED printing systems. As can be seen in the shaded area of FIG. 18A, these beams can create a large invalid space D. In the schematic perspective view of FIG. 18B, when the cable, wire, and pipeline bundle I is fed through the pipe II, the inert gas III can be continuously purged through the bundle. The expanded cross-sectional view of FIG. 19 depicts how continuous purge of inert gas through the bundled pipelines, wires, and cables can effectively increase the rate of removal of occluded reactive species from the invalid volume in these bundles. Reactive species A (indicated by the collective area occupied by species A in Figure 19) The rate of diffusion from the invalid volume and reactive species outside the invalid volume (indicated by the collective area occupied by inert gas species B in Figure 19) The concentration is inversely proportional. In other words, if the concentration of reactive species in the volume immediately outside the invalid volume is higher, the rate of diffusion decreases. If the concentration of reactive species in this region is continuously reduced by the inert gas flow, which is close to the invalid volume continuously, the rate of diffusion of reactive species from the invalid volume increases by mass action. In addition, by the same principle, as the absorbed reactive species are effectively removed from their spaces, the inert gas can diffuse into the ineffective volume.

圖20A係氣體包體總成600之各種實施例的後部角之透視圖,以及穿過回流管道605進入氣體包體總成600之內部的假想視圖。對於氣體包體總成600之各種實施例,後部壁面板640可具有嵌入式面板610,該嵌入式面板經組配來提供對例如電氣隔框之接取。電纜、線及管線以及類似物之束可經由隔框饋送至電纜選路管道中,該管道諸如右側壁面板630中所展示之管道632,其中可移除之嵌入式面板已被移除來顯露選路進入第一電纜、線及管線束管道入口636中之束。可將該束自該入口饋送至氣體包體總成600之內部中,且在穿過氣體包體總成600之內部中的回流管道605的假想視圖中展示該束。關於電纜、線及管線束選路的氣體包體總成之各種實施例可具有諸如圖20A中所展示之一個以上的電纜、線及管線束入口,圖20A描繪用於另一束之第一束管道入口634及第二束管道入口636。圖20B描繪用於電纜、線及管線束之束管道入口634的擴展視圖。束管道入口634可具有開口631,該開口經設計來與滑動罩蓋633形成密封。在各種實施例中,開口631可容納可撓性密封模組,諸如由Roxtec公司提供之用於電纜入口密封之模組,該等模組可容納一束中之電纜、線及管線以及類似物的各種直徑。另一選擇為,滑動罩蓋633之頂部635以及開口631之上部分637可具有佈置於每一表面上的保形材料,以使得該保形材料可在經由諸如束管道入口634之入口來饋送的一束中之各種大小直徑的電纜、線及管線以及類似物周圍形成密封。 FIG. 20A is a perspective view of the rear corner of various embodiments of the gas enclosure assembly 600, and a hypothetical view of the interior of the gas enclosure assembly 600 through the return duct 605. FIG. For various embodiments of the gas enclosure assembly 600, the rear wall panel 640 may have an embedded panel 610 that is configured to provide access to, for example, electrical bulkheads. Bundles of cables, wires and pipelines, and the like can be fed into the cable routing duct through the bulkhead, such as duct 632 shown in the right side wall panel 630, where the removable embedded panel has been removed to reveal Route to enter the bundle in the first cable, wire and pipeline bundle pipe inlet 636. The beam may be fed into the interior of the gas package assembly 600 from the inlet, and the beam is shown in a phantom view through the return duct 605 in the interior of the gas package assembly 600. Various embodiments of gas envelope assemblies for routing cables, wires, and pipeline bundles may have more than one cable, wire, and pipeline bundle inlets such as shown in FIG. 20A, which depicts the first for another bundle The beam duct inlet 634 and the second beam duct inlet 636. FIG. 20B depicts an expanded view of the bundle duct inlet 634 for cables, wires, and pipeline bundles. The beam duct inlet 634 may have an opening 631 designed to form a seal with the sliding cover 633. In various embodiments, the opening 631 can accommodate a flexible sealing module, such as a module provided by Roxtec for cable entry sealing, which can accommodate cables, wires and pipelines in a bundle, and the like Of various diameters. Another option is that the top 635 of the sliding cover 633 and the upper portion 637 of the opening 631 may have a conformal material arranged on each surface so that the conformal material can be fed through an inlet such as a beam duct inlet 634 Seals are formed around cables, wires and pipelines of various sizes and diameters in a bundle.

圖21係本教示之天花板面板的各種實施例之底部視圖,該天花板面板諸如圖3之氣體包體總成及系統100之天花板面板250'。根據本教示之關於氣體包體之組裝的各種實施例,可將照明安裝於天花板面板之內部頂部表面上,該天花板面板諸如圖3之氣體包體總成及系統100之天花板面板250'。如圖21中所描繪,具有內部部分251之天花板框架250可具有安裝於各種框架構件之內部部分上的照明。例如,天花板框架250可具有兩個天花板框架區段40,該等區段共同具有兩個天花板框架梁42及44。每一天花板框架區段40可具有朝向天花板框架250之內部來定位的第一側41以及朝向天花板框架250之外部來定位的第二側43。對於根據本教示之為氣體包體提供照明的各種實施例,可安裝數對照明元件46。每一對照明元件46可包括靠近天花板框架區段40的第一側41之第一照明元件45以及靠近天花板框架區段40的第二側43之第二照明元件47。圖21中所展示之照明元件的數量、定位及分組係示例性的。照明元件之數量及分組可以任何所需之方式或合適之方式改變。在各種實施例中,可將該等照明元件安裝成平的,而在其他實施例中可安裝該等照明元件以使得其可移動至多種位置及角度。該等照明元件之置放並不限於頂部面板天花板433,而是除此之外或作為另一選擇,可安裝於圖3中所展示之氣體包體總成及系統100的任何其他內部表面、外部表面及表面之組合上。 21 is a bottom view of various embodiments of ceiling panels of the present teachings, such as the gas enclosure assembly of FIG. 3 and the ceiling panel 250' of the system 100. FIG. According to various embodiments of the present teaching regarding the assembly of gas enclosures, lighting can be installed on the inner top surface of a ceiling panel, such as the gas enclosure assembly of FIG. 3 and ceiling panel 250' of system 100. As depicted in FIG. 21, the ceiling frame 250 with the inner portion 251 may have lighting installed on the inner portion of various frame members. For example, the ceiling frame 250 may have two ceiling frame sections 40 that collectively have two ceiling frame beams 42 and 44. Each ceiling frame section 40 may have a first side 41 positioned toward the inside of the ceiling frame 250 and a second side 43 positioned toward the outside of the ceiling frame 250. For various embodiments of providing illumination for gas enclosures according to the teachings, several pairs of illumination elements 46 may be installed. Each pair of lighting elements 46 may include a first lighting element 45 near the first side 41 of the ceiling frame section 40 and a second lighting element 47 near the second side 43 of the ceiling frame section 40. The number, positioning, and grouping of lighting elements shown in FIG. 21 are exemplary. The number and grouping of lighting elements can be changed in any desired way or in a suitable way. In various embodiments, the lighting elements can be installed flat, while in other embodiments the lighting elements can be installed so that they can be moved to a variety of positions and angles. The placement of these lighting elements is not limited to the top panel ceiling 433, but in addition or as an alternative, it can be installed on the gas envelope assembly shown in FIG. 3 and any other internal surface of the system 100, On external surfaces and surface combinations.

各種照明元件可包含任何數量、類型之燈或其組合,例如鹵素燈、白燈、白熾燈、弧光燈或發光二極體或裝置(LED)。例如,每一照明元件可包含1個LED至約100個LED,約10個LED至約50個LED,或超過100個LED。LED或其他照明裝置可發射色譜中、色譜外或其組合之 任何顏色或顏色組合。根據用於噴墨列印OLED材料的氣體包體總成之各種實施例,因為一些材料對一些波長之光敏感,所以安裝於氣體包體總成中之照明裝置的光之波長可經特別選擇來避免處理期間的材料退化。例如,可使用4X冷白色LED,亦可使用4X黃色LED或其任何組合。4X冷白色LED之一實例係可自IDEC公司(Sunnyvale,California)購得之LF1B-D4S-2THWW4。可使用的4X黃色LED之一實例係亦可自IDEC公司購得的LF1B-D4S-2SHY6。LED或其他照明元件可定位或懸掛在天花板框架250之內部部分251上或氣體包體總成之另一表面上的任何位置。照明元件並不限於LED。可使用任何合適之照明元件或照明元件之組合。圖22係IDEC LED光譜之曲線圖,且展示對應於當峰值強度為100%時的強度之x軸以及對應於波長(單位為奈米)之y軸。展示LF1B黃色型、黃色螢光燈、LF1B白色型LED、LF1B冷白色型LED以及LF1B紅色型LED之光譜。根據本教示之各種實施例,可使用其他光譜或光譜之組合。 The various lighting elements may include any number and type of lamps or combinations thereof, such as halogen lamps, white lamps, incandescent lamps, arc lamps, or light emitting diodes or devices (LEDs). For example, each lighting element may include 1 LED to about 100 LEDs, about 10 LEDs to about 50 LEDs, or more than 100 LEDs. LEDs or other lighting devices can emit any color or combination of colors in, outside the spectrum, or a combination thereof. According to various embodiments of the gas package assembly for inkjet printing OLED materials, since some materials are sensitive to light of some wavelengths, the wavelength of the light of the lighting device installed in the gas package assembly can be specially selected To avoid material degradation during processing. For example, 4X cool white LEDs can be used, as can 4X yellow LEDs or any combination thereof. One example of 4X cool white LED is LF1B-D4S-2THWW4 available from IDEC (Sunnyvale, California). An example of a 4X yellow LED that can be used is LF1B-D4S-2SHY6, which is also available from IDEC. The LED or other lighting element can be positioned or hung on the inner portion 251 of the ceiling frame 250 or anywhere on the other surface of the gas envelope assembly. The lighting element is not limited to LEDs. Any suitable lighting element or combination of lighting elements may be used. FIG. 22 is a graph of the IDEC LED spectrum, and shows the x-axis corresponding to the intensity when the peak intensity is 100% and the y-axis corresponding to the wavelength (in nanometers). Display the spectrum of LF1B yellow type, yellow fluorescent lamp, LF1B white type LED, LF1B cool white type LED and LF1B red type LED. According to various embodiments of the present teachings, other spectra or combinations of spectra can be used.

回顧前文,氣體包體總成之各種實施例係以某種方式建構,以使得使氣體包體總成之內部體積最小化,且同時使用來容納各種OLED列印系統之各種佔據面積的工作空間最佳化。如此建構之氣體包體總成的各種實施例另外提供:在處理期間自外部對氣體包體總成之內部的輕鬆接取,以及為了維護而對內部的輕鬆接取,同時使停機時間最小化。就此而言,根據本教示之氣體包體總成的各種實施例可針對各種OLED列印系統之各種佔據面積來進行輪廓塑造。 Recalling the foregoing, various embodiments of the gas inclusion assembly are constructed in such a way as to minimize the internal volume of the gas inclusion assembly, and at the same time be used to accommodate various occupied work spaces of various OLED printing systems optimization. Various embodiments of the gas package assembly thus constructed additionally provide: easy access to the inside of the gas package assembly from outside during processing, and easy access to the inside for maintenance, while minimizing downtime . In this regard, various embodiments of the gas envelope assembly according to the present teaching can be contoured for various occupied areas of various OLED printing systems.

一般技藝人士可瞭解的是,關於框架構件建構、面板建構、框架及面板密封以及氣體包體總成(諸如圖3之氣體包體總成100)之建構 的本教示可適用於多種大小及設計之氣體包體總成。例如但不限於,涵蓋第3.5代至第10代之基板大小的本教示之經輪廓塑造之氣體包體總成的各種實施例可具有約6m3至約95m3之間的內部體積,其可為未經輪廓塑造且具有相對較大尺寸的包體節省約30%至約70%之間的體積。氣體包體總成之各種實施例可具有各種框架構件,該等框架構件經建構來提供氣體包體總成之輪廓,以便容納OLED列印系統以實現其功能且同時使工作空間最佳化以使惰性氣體體積最小化,且亦允許在處理期間自外部對OLED列印系統的輕鬆接取。就此而言,本教示之各種氣體包體總成可在經輪廓塑造之拓撲及體積上變化。 Those of ordinary skill can understand that the teachings on frame member construction, panel construction, frame and panel sealing, and the construction of gas enclosures (such as the gas enclosure assembly 100 of FIG. 3) can be applied to a variety of sizes and designs The gas inclusion assembly. For example, but not limited to, various embodiments of the contoured gas inclusion assembly of the present teachings covering the substrate sizes of the 3.5th to 10th generations may have an internal volume of between about 6m 3 and about 95m 3 , which may It saves about 30% to about 70% of the volume for a package that is not contoured and has a relatively large size. Various embodiments of the gas envelope assembly may have various frame members that are constructed to provide the outline of the gas envelope assembly to accommodate the OLED printing system to achieve its function and at the same time optimize the working space to The volume of inert gas is minimized, and also allows easy access to the OLED printing system from outside during processing. In this regard, the various gas inclusion assemblies taught in this teaching can vary in contour topology and volume.

圖23提供根據本教示之氣體包體總成的實例。氣體包體總成1000可包括前部框架總成1100、中間框架總成1200以及後部框架總成1300。前部框架總成1100可包括前部底座框架1120;前部壁框架1140,其可具有用於接納基板之開口1142;以及前部天花板框架1160。中間框架總成1200可包括第一中間包體框架總成1240、中間壁及天花板框架總成1260以及第二中間包體框架總成1280。後部框架總成1300可包括後部底座框架1320、後部壁框架1340以及後部天花板框架1360。用陰影線展示之區域描繪氣體總成1000之可用工作體積,該可用工作體積係可用來容納OLED列印系統之體積。氣體包體總成1000之各種實施例經輪廓塑造,以便使操作諸如OLED列印處理之空氣敏感型處理所需要的再循環之惰性氣體的體積最小化,且同時允許對OLED列印系統之輕鬆接取(在操作期間遠程接取,或藉由經由易於移除之面板的輕鬆接取來直接接取)。對於根據本教示之涵蓋第3.5代至第10m代之基板大小的氣體包體總成之各種實施例,根據本教 示之經輪廓塑造的氣體包體總成之各種實施例可具有約6m3至約95m3之間的氣體包體體積,例如但不限於約15m3至約30m3之間,此可用於例如第5.5代至第8.5代基板大小之OLED列印。根據本案發明之某些實施例,基板支撐設備可支撐一基板,該基板具有在約第5代至約第10代之間的一大小。根據本案發明之某些實施例,基板支撐設備可支撐一基板,該基板具有在約第3.5代至約第8.5代之間的一大小。 Figure 23 provides an example of a gas inclusion assembly according to the teachings. The gas package assembly 1000 may include a front frame assembly 1100, a middle frame assembly 1200, and a rear frame assembly 1300. The front frame assembly 1100 may include a front base frame 1120; a front wall frame 1140, which may have an opening 1142 for receiving a substrate; and a front ceiling frame 1160. The intermediate frame assembly 1200 may include a first intermediate body frame assembly 1240, an intermediate wall and ceiling frame assembly 1260, and a second intermediate body frame assembly 1280. The rear frame assembly 1300 may include a rear base frame 1320, a rear wall frame 1340, and a rear ceiling frame 1360. The hatched area depicts the available working volume of the gas assembly 1000, which is the volume that can be used to accommodate the OLED printing system. The various embodiments of the gas inclusion assembly 1000 are contoured to minimize the volume of recirculated inert gas required to operate air-sensitive processes such as OLED printing processes, while at the same time allowing easy access to the OLED printing system Access (remote access during operation, or direct access by easy access via an easily removable panel). For various embodiments of gas inclusion assemblies covering substrate sizes from 3.5th generation to 10m generation according to this teaching, various embodiments of contoured gas inclusion assemblies according to this teaching may have about 6m 3 to The volume of gas inclusions between about 95 m 3 , such as but not limited to between about 15 m 3 to about 30 m 3 , can be used for OLED printing of substrate sizes from 5.5th to 8.5th generation, for example. According to some embodiments of the present invention, the substrate supporting apparatus may support a substrate having a size between about 5th generation to about 10th generation. According to some embodiments of the present invention, the substrate supporting apparatus may support a substrate having a size between about 3.5th generation to about 8.5th generation.

氣體包體總成1000可具有本教示中關於示例性氣體包體總成100所列舉之所有特徵。例如但不限於,氣體包體總成1000可利用根據在建構及解構週期中提供氣密式密封型包體的本教示之密封。基於氣體包體總成1000之氣體包體系統的各種實施例可具有氣體淨化系統,該氣體淨化系統可將各種反應性物種中之每一物種的含量維持在100ppm或更低,例如為10ppm或更低、1.0ppm或更低或者0.1ppm或更低,該等反應性物種包括諸如水蒸汽及氧氣之各種反應性大氣氣體,以及有機溶劑蒸汽。 The gas inclusion assembly 1000 may have all the features listed in this teaching regarding the exemplary gas inclusion assembly 100. For example, but not limited to, the gas package assembly 1000 may utilize a seal according to the teachings of providing a hermetically sealed package during construction and deconstruction cycles. Various embodiments of the gas inclusion system based on the gas inclusion assembly 1000 may have a gas purification system that can maintain the content of each of the various reactive species at 100 ppm or less, for example, 10 ppm or Lower, 1.0 ppm or lower, or 0.1 ppm or lower, such reactive species include various reactive atmospheric gases such as water vapor and oxygen, and organic solvent vapor.

此外,基於氣體包體總成1000之氣體包體總成及系統的各種實施例可具有循環及過濾系統,該循環及過濾系統可提供滿足ISO 14644第3級及第4級無塵室標準的無粒子環境。另外,如隨後將更為詳細地討論,基於本教示之氣體包體總成(諸如氣體包體總成100及氣體包體總成1000)之氣體包體總成系統的各種實施例可具有加壓惰性氣體再循環系統之各種實施例,該加壓惰性氣體再循環系統可用來操作例如但不限於氣動機器人、基板漂浮台、空氣軸承、空氣套管、壓縮氣體工具、氣動致動器及其組合中之一或多者。對於本教示之氣體包體及系統的各種實施例,各種氣動操作型裝置及設備之使用可提供低粒子生成性能並且具有低維護性。 In addition, various embodiments of the gas envelope assembly and system based on the gas envelope assembly 1000 can have a circulation and filtration system that can provide a clean room standard that meets ISO 14644 Level 3 and Level 4 clean room standards No particle environment. In addition, as will be discussed in more detail later, various embodiments of gas inclusion assembly systems based on gas inclusion assemblies (such as gas inclusion assembly 100 and gas inclusion assembly 1000) of the present teachings can have additional Various embodiments of a pressurized inert gas recirculation system, the pressurized inert gas recirculation system can be used to operate, for example, but not limited to, pneumatic robots, substrate floating tables, air bearings, air sleeves, compressed gas tools, pneumatic actuators and their One or more of the combination. For various embodiments of the gas enclosure and system taught in this teaching, the use of various pneumatically operated devices and equipment can provide low particle generation performance and low maintenance.

圖24係氣體包體總成1000之分解視圖,其描繪各種框架構件,該等框架構件可被建構來提供根據本教示之氣密式密封型氣體包體。如前面關於圖3及圖13的氣體包體100之各種實施例所討論,OLED噴墨列印系統1050可由若干裝置及設備組成,該等裝置及設備允許墨水液滴至諸如基板1058之基板上之特定位置上的可靠置放,該基板經展示為由基板漂浮台1054支撐。基板漂浮台1054可用於支撐基板1058,並且提供基板1058之無摩擦輸送。OLED列印系統之基板漂浮台1054可界定基板1058在基板之OLED列印期間可被移動通過系統1000所經過的行程。考慮到可包含OLED列印系統1050之多種組件,OLED列印系統1050之各種實施例可具有多種佔據面積及外觀尺寸。根據OLED噴墨列印系統之各種實施例,多種基板材料可用於基板1058,例如但不限於多種玻璃基板材料以及多種聚合物基板材料。 FIG. 24 is an exploded view of a gas enclosure assembly 1000 depicting various frame members that can be constructed to provide a hermetically sealed gas enclosure according to the teachings. As previously discussed with respect to various embodiments of the gas envelope 100 of FIGS. 3 and 13, the OLED inkjet printing system 1050 can be composed of several devices and devices that allow ink droplets to drop onto a substrate such as substrate 1058 For reliable placement at specific locations, the substrate was shown to be supported by the substrate floating table 1054. The substrate floating table 1054 can be used to support the substrate 1058 and provide frictionless transportation of the substrate 1058. The substrate floating table 1054 of the OLED printing system can define the travel distance that the substrate 1058 can be moved through the system 1000 during the OLED printing of the substrate. Considering that various components of the OLED printing system 1050 can be included, various embodiments of the OLED printing system 1050 can have a variety of occupied areas and appearance dimensions. According to various embodiments of the OLED inkjet printing system, a variety of substrate materials can be used for the substrate 1058, such as but not limited to a variety of glass substrate materials and a variety of polymer substrate materials.

根據本教示之氣體包體總成的各種實施例,如前面關於氣體包體總成100所描述,氣體包體總成之建構可圍繞整個OLED列印系統來進行,從而使氣體包體總成之體積最小化並且提供對內部的輕鬆接取。在圖24中,可考慮OLED列印系統1050來給出輪廓塑造之實例。 According to various embodiments of the gas inclusion assembly of the present teaching, as described above with respect to the gas inclusion assembly 100, the construction of the gas inclusion assembly can be performed around the entire OLED printing system, so that the gas inclusion assembly The volume is minimized and provides easy access to the interior. In FIG. 24, the OLED printing system 1050 may be considered to give an example of contour shaping.

如圖24中所展示,OLED列印系統1050上可存在六個隔離體:第一隔離體組1051(未展示該組中在對立面上的第二隔離體)及第二隔離體組1053(未展示該組中在對立面上的第二隔離體),該等隔離體組支撐OLED列印系統1050之基板漂浮台1054。漂浮台1054係支撐於漂浮台底座1052上。除了在圖24中不可見且定位成與第一隔離體1051及第二隔離體1053相對之兩個隔離體之外,亦存在支撐OLED列印系統底座1070之一 組兩個隔離體。前部包體底座1120可具有支撐第一前部包體隔離體壁框架1123之第一前部包體隔離體座1121。第二前部包體隔離體壁框架1127係由第二前部包體隔離體座(未圖示)支撐。類似地,中間包體底座1220可具有支撐第一中間包體隔離體壁框架1223之第一中間包體隔離體座1221。第二中間包體隔離體壁框架1227係由第二中間包體隔離體座(未圖示)支撐。最後,後部包體底座1320可具有支撐後部包體隔離體壁框架1323之第一後部包體隔離體座1321。第二後部包體隔離體壁框架1327係由第二後部包體隔離體座(未圖示)支撐。隔離體壁框架構件之各種實施例已圍繞每一隔離體來進行輪廓塑造,藉此使圍繞每一隔離體支撐構件之體積最小化。另外,關於底座1120、1220及1320之每一隔離體壁框架所展示的陰影面板區段係可移除之面板,該等面板可被移除來例如維修隔離體。前部包體總成底座1120可具有底盤1122,而中間包體總成底座1220可具有底盤1222,且後部包體總成底座1320可具有底盤1322。當該等底座被完全建構來形成相連的底座時,可將OLED列印系統安裝於藉此形成之相連的底盤上,安裝方式與將OLED列印系統50安裝於圖13之底盤204上類似。如前面所描述,隨後可圍繞OLED列印系統1050將壁框架構件及天花板框架構件連接起來,該等壁框架構件及天花板框架構件諸如:前部框架總成1100之壁框架1140、天花板框架1160;中間框架總成1200之第一中間包體框架總成1240、中間壁及天花板框架總成1260及第二中間包體框架總成1280';以及後部框架總成1300之壁框架1340及天花板框架1360。因此,本教示之氣密式密封型經輪廓塑造的框架構件總成的各種實施例有效地減小氣體包體總成1000中之惰性氣體的體積,而同時提供對OLED列印系統之各種裝置及 設備的輕鬆接取。 As shown in FIG. 24, there may be six spacers on the OLED printing system 1050: a first spacer group 1051 (the second spacer on the opposite surface in this group is not shown) and a second spacer group 1053 (not The second spacers on the opposite surface of the group are shown). These spacer groups support the substrate floating table 1054 of the OLED printing system 1050. The floating platform 1054 is supported on the floating platform base 1052. In addition to the two spacers that are not visible in FIG. 24 and are positioned opposite the first spacer 1051 and the second spacer 1053, there are also a set of two spacers that support the OLED printing system base 1070. The front package base 1120 may have a first front package isolation base 1121 that supports the first front package isolation wall frame 1123. The second front bag separator wall frame 1127 is supported by a second front bag separator seat (not shown). Similarly, the tundish base 1220 may have a first tundish separator seat 1221 that supports the first tundish separator wall frame 1223. The second tundish separator wall frame 1227 is supported by a second tundish separator seat (not shown). Finally, the rear package base 1320 may have a first rear package isolation base 1321 that supports the rear package isolation wall frame 1323. The second rear body separator wall frame 1327 is supported by a second rear body separator seat (not shown). Various embodiments of spacer wall frame members have been contoured around each spacer, thereby minimizing the volume of support members surrounding each spacer. In addition, the shaded panel sections shown with respect to each of the isolator wall frames of the bases 1120, 1220, and 1320 are removable panels that can be removed, for example, to repair the isolator. The front package assembly base 1120 may have a chassis 1122, while the middle package assembly base 1220 may have a chassis 1222, and the rear package assembly base 1320 may have a chassis 1322. When the bases are completely constructed to form a connected base, the OLED printing system can be installed on the connected chassis formed thereby, in a similar manner to the OLED printing system 50 installed on the chassis 204 of FIG. 13. As described above, the wall frame member and the ceiling frame member may be connected around the OLED printing system 1050, such as the wall frame 1140 and the ceiling frame 1160 of the front frame assembly 1100; The first tundish frame assembly 1240, the middle wall and ceiling frame assembly 1260 and the second tundish frame assembly 1280' of the middle frame assembly 1200; and the wall frame 1340 and ceiling frame 1360 of the rear frame assembly 1300 . Therefore, various embodiments of the hermetically sealed profile-shaped frame member assembly taught by the present teaching effectively reduce the volume of inert gas in the gas envelope assembly 1000 while providing various devices for the OLED printing system And easy access to equipment.

此外,本教示之氣體包體總成的各種實施例可以某種方式來建構以便提供單獨起作用之框架構件總成區段。參考圖5進行回顧,根據本教示之氣體包體總成及系統的各種實施例之框架構件總成可包括具有密封地安裝於框架構件上之各種面板的框架構件。例如但不限於,壁框架構件總成或壁面板總成可為包括密封地安裝於壁框架構件上之各種面板的壁框架構件。因此,各種完全建構之面板總成,諸如但不限於壁面板總成、天花板面板總成、壁及天花板面板總成、底座支撐面板總成及類似物,係各種類型之框架構件總成。本教示之氣體包體總成的各種實施例之模組化性質可提供具有各種框架構件總成區段之氣體包體總成的實施例,其中每一框架構件總成區段係氣體包體總成之總體積的一部分。包含氣體包體總成之各種實施例的各種框架構件總成區段可共同具有至少一個框架構件。對於氣體包體總成之各種實施例,包含氣體包體總成之各種框架構件總成區段可共同具有至少一個框架構件總成。包含氣體包體總成之各種實施例的各種框架構件總成區段可共同具有至少一個框架構件及至少一個框架構件總成之組合。 In addition, various embodiments of the gas enclosure assembly of the present teachings can be constructed in a manner to provide a separately functioning frame member assembly section. Referring back to FIG. 5, the frame member assembly according to various embodiments of the gas enclosure assembly and system of the present teaching may include a frame member having various panels sealingly mounted on the frame member. For example, but not limited to, the wall frame member assembly or the wall panel assembly may be a wall frame member including various panels sealingly mounted on the wall frame member. Therefore, various fully constructed panel assemblies, such as but not limited to wall panel assemblies, ceiling panel assemblies, wall and ceiling panel assemblies, base support panel assemblies, and the like, are various types of frame member assemblies. The modular nature of the various embodiments of the gas enclosure assembly of this teaching can provide an embodiment of the gas enclosure assembly with various frame member assembly sections, where each frame member assembly section is a gas enclosure Part of the total volume of the assembly. The various frame member assembly sections containing various embodiments of the gas envelope assembly may collectively have at least one frame member. For various embodiments of the gas enclosure assembly, the various frame member assembly sections containing the gas enclosure assembly may collectively have at least one frame member assembly. The various frame member assembly sections including various embodiments of the gas enclosure assembly may collectively have at least one frame member and a combination of at least one frame member assembly.

根據本教示,可經由例如但不限於封閉框架構件總成區段中之每一者所共有的開口或通道或其組合來將各種框架構件總成區段分成多個區段。例如,在各種實施例中,可藉由覆蓋住在每一框架構件總成區段所共有的框架構件或框架構件面板中之開口或通道或其組合(藉此有效地封閉該開口或通道或其組合)來分離框架構件總成區段。在各種實施例中,可藉由密封每一框架構件總成區段所共有的開口或通道或其組合(藉此有 效地封閉該開口或通道或其組合)來分離框架構件總成區段。密封地封閉開口或通道或其組合可導致分離,該分離會中斷每一框架構件總成區段之每一體積之間的流體連通,其中每一體積係氣體包體總成中所包含之總體積的一部分。密封地封閉開口或通道可藉此隔離每一框架構件總成區段中所包含之每一體積。 According to the present teachings, various frame member assembly sections can be divided into multiple sections via, for example, but not limited to, openings or channels common to each of the closed frame member assembly sections, or a combination thereof. For example, in various embodiments, the opening or channel or a combination thereof that covers the frame member or frame member panel common to each frame member assembly section (whereby effectively closing the opening or channel or Its combination) to separate the frame member assembly sections. In various embodiments, the frame member assembly sections may be separated by sealing an opening or channel or combination thereof common to each frame member assembly section (whereby effectively closing the opening or channel or combination thereof). Sealing the openings or channels or a combination thereof can result in a separation that interrupts fluid communication between each volume of each frame member assembly section, where each volume is the total volume contained in the gas inclusion assembly Part of the volume. Hermetically closing the opening or channel can thereby isolate each volume contained in each frame member assembly section.

因此,參考圖24,底座1070可具有:第一端部1072及第二端部1074,其界定寬度;以及第一側1076及第二側1078,其界定長度。與底座1070正交且安裝於該底座上的可為第一豎管1075及第二豎管1077,橋1079安裝於該第一豎管及該第二豎管上。對於OLED列印系統1050之各種實施例,橋1079可支撐第一列印頭總成定位系統1090及第二列印頭總成定位系統1091,該等定位系統分別用於控制第一列印頭總成1080及第二列印頭總成1081在基板漂浮台1054上方之X-Z軸移動。儘管圖24描繪兩個定位系統及兩個列印頭總成,但是對於OLED列印系統1050之各種實施例,可存在單個定位系統及單個列印頭總成。此外,對於OLED列印系統1050之各種實施例,可存在安裝於定位系統上之單個列印頭總成,例如第一列印頭總成1080及第二列印頭總成1081中之任一者,而用於檢查基板1058之特徵的攝影機系統可安裝於第二定位系統上。根據氣體包體總成1000之各種實施例,列印頭維護系統可例如但不限於在底座1070之第一上表面1071及第二上表面1073上安裝成靠近列印頭總成。 Thus, referring to FIG. 24, the base 1070 may have: a first end 1072 and a second end 1074, which define a width; and a first side 1076 and a second side 1078, which define a length. Orthogonal to the base 1070 and mounted on the base may be a first standpipe 1075 and a second standpipe 1077, and a bridge 1079 is installed on the first standpipe and the second standpipe. For various embodiments of the OLED printing system 1050, the bridge 1079 can support the first printing head assembly positioning system 1090 and the second printing head assembly positioning system 1091, which are used to control the first printing head, respectively The assembly 1080 and the second print head assembly 1081 move on the XZ axis above the substrate floating table 1054. Although FIG. 24 depicts two positioning systems and two print head assemblies, for various embodiments of the OLED printing system 1050, there may be a single positioning system and a single print head assembly. In addition, for various embodiments of the OLED printing system 1050, there may be a single print head assembly installed on the positioning system, such as any of the first print head assembly 1080 and the second print head assembly 1081 Furthermore, the camera system for inspecting the characteristics of the substrate 1058 can be installed on the second positioning system. According to various embodiments of the gas package assembly 1000, the print head maintenance system may be installed, for example but not limited to, on the first upper surface 1071 and the second upper surface 1073 of the base 1070 to be close to the print head assembly.

此外,參考圖24,可將面板安裝於底座1220之第一框架構件1224及第二框架構件1226上,且可將墊圈貼附於每一面板上。該等墊圈可用來封閉該等面板與底座1070之間的通道中之每一者。另外,橋框架1144 可支撐中間框架總成1200,並且提供用來支撐嵌入式框架之各種實施例的架構。插入至橋框架1144中之嵌入式框架的各種實施例可具有允許列印頭總成行進的開口,且亦可支撐閘閥總成,該閘閥門總成用於封閉允許列印頭總成行進之開口。藉由密封地封閉底座周圍之通道以及密封地封閉允許列印頭總成行進之開口,中間框架總成1200圍繞安裝於底座1070上之橋1079所粗略界定之體積可與氣體包體總成1000的剩餘部分體積隔離。 In addition, referring to FIG. 24, the panel may be mounted on the first frame member 1224 and the second frame member 1226 of the base 1220, and a gasket may be attached to each panel. The gaskets can be used to close each of the channels between the panels and the base 1070. In addition, the bridge frame 1144 can support the intermediate frame assembly 1200 and provide a framework for supporting various embodiments of the embedded frame. Various embodiments of the embedded frame inserted into the bridge frame 1144 may have an opening that allows the print head assembly to travel, and may also support a gate valve assembly that is used to close the travel of the print head assembly. Opening. By sealingly sealing the channel around the base and sealingly closing the opening that allows the print head assembly to travel, the volume of the intermediate frame assembly 1200 roughly defined by the bridge 1079 mounted on the base 1070 can be equal to the gas envelope assembly 1000 The remaining volume is isolated.

分離氣體包體之離散區段之示例性用途可為,對列印頭總成(諸如列印系統1050之第一列印頭總成1080及第二列印頭總成1081)執行各種維護程序。此等維護程序可包括:例如但不限於更換列印頭總成中之列印頭而無需使氣體包體總成向大氣開放。此外,因為中間框架總成1200圍繞安裝於底座1070上之橋1079所粗略界定之部分體積可與氣體包體總成1000之剩餘體積完全隔離,所以該部分體積可向諸如但不限於水蒸汽及氧氣之大氣物種開放,而不會污染氣體包體總成之剩餘的更大體積。藉由限制可曝露於大氣物種之體積,可在短得多的時間內完成系統復原。一般技藝人士將瞭解的是,儘管作為示例來呈現列印頭總成之維護的實例,但是需要氣體包體總成之各種處理可易於利用氣體包體總成,在此氣體包體總成中可將多個區段離散地分離來提供單獨起作用之框架構件總成區段,其中至少一個區段可具有總包體體積之大致上較小的部分體積。 Exemplary uses for separating discrete sections of gas envelopes may be to perform various maintenance procedures on the print head assembly (such as the first print head assembly 1080 and the second print head assembly 1081 of the printing system 1050) . Such maintenance procedures may include, for example, but not limited to, replacing the print head in the print head assembly without opening the gas envelope assembly to the atmosphere. In addition, because the part of the volume roughly defined by the intermediate frame assembly 1200 around the bridge 1079 mounted on the base 1070 can be completely isolated from the remaining volume of the gas package assembly 1000, the part of the volume can be such as but not limited to water vapor and The atmospheric species of oxygen are open without polluting the larger remaining volume of the gas inclusion assembly. By limiting the volume of species that can be exposed to the atmosphere, system recovery can be completed in a much shorter time. A person of ordinary skill will understand that although an example of maintenance of the print head assembly is presented as an example, various processes that require the gas inclusion assembly can easily utilize the gas inclusion assembly, and in this gas inclusion assembly Multiple sections can be discretely separated to provide individually functioning frame member assembly sections, where at least one section can have a substantially smaller partial volume of the total envelope volume.

圖25描繪根據圖23及圖24之氣體包體總成1000的各種實施例之部分分解透視圖。圖25中指示各種完整之面板總成,該等面板總成可以多種方式分離以便界定:第一框架構件總成區段,其界定第一體積;以及第二框架構件總成區段,其界定第二體積。 FIG. 25 depicts a partially exploded perspective view of various embodiments of the gas enclosure assembly 1000 according to FIGS. 23 and 24. FIG. Various complete panel assemblies are indicated in FIG. 25, which can be separated in various ways to define: a first frame member assembly section, which defines a first volume; and a second frame member assembly section, which defines The second volume.

在圖25中,例如但不限於,氣體包體總成1000可包括前部面板總成1100'、中間面板總成1200'以及後部面板總成1300'。前部面板總成1100'可包括前部天花板面板總成1160'、前部壁面板總成1140'以及前部底座面板總成1120',而後部面板總成1300'可包括後部天花板面板總成1360'、後部壁面板總成1340'以及後部底座面板總成1320'。如自圖24之關於前部框架總成1100及中間面板框架1200之分解圖可看出,圖25之前部面板總成1100'及中間面板總成1200'共同具有橋框架1144。中間面板總成1200'可包括第一中間包體面板總成1240'、中間壁及天花板面板總成1260'以及第二中間包體面板總成1280',該等總成在密封地安裝於中間底座面板總成1220'上時可覆蓋底座1070,該底座包括第一豎管1075及第二豎管1077,橋1079係安裝於該第一豎管及該第二豎管上。如前面所討論,橋1079可支撐第一列印頭總成定位系統1090,該定位系統可控制列印頭總成1080在基板漂浮台1054(見圖24)上方之移動。用於將列印頭總成1080定位在基板漂浮台1054(見圖24)上方的第一列印頭總成定位系統1090可包括第一X軸托架1092及第一Z軸活動板1094,第一列印頭總成1080可安裝於該活動板上。第二列印頭總成定位系統1091可被類似地組配來控制第二列印頭總成1081在基板漂浮台1054(見圖24)上方之X-Z軸移動。 In FIG. 25, for example and without limitation, the gas package assembly 1000 may include a front panel assembly 1100', a middle panel assembly 1200', and a rear panel assembly 1300'. The front panel assembly 1100' may include a front ceiling panel assembly 1160', a front wall panel assembly 1140', and a front base panel assembly 1120', and the rear panel assembly 1300' may include a rear ceiling panel assembly 1360', rear wall panel assembly 1340' and rear base panel assembly 1320'. As can be seen from the exploded view of the front frame assembly 1100 and the middle panel frame 1200 of FIG. 24, the front panel assembly 1100′ and the middle panel assembly 1200′ of FIG. 25 have a bridge frame 1144 in common. The intermediate panel assembly 1200' may include a first intermediate package panel assembly 1240', an intermediate wall and ceiling panel assembly 1260', and a second intermediate package panel assembly 1280', which are sealingly installed in the middle The base panel assembly 1220' can cover the base 1070 when the base panel assembly 1220' includes a first vertical pipe 1075 and a second vertical pipe 1077, and the bridge 1079 is installed on the first vertical pipe and the second vertical pipe. As previously discussed, the bridge 1079 can support the first print head assembly positioning system 1090, which can control the movement of the print head assembly 1080 above the substrate floating table 1054 (see FIG. 24). The first print head assembly positioning system 1090 for positioning the print head assembly 1080 above the substrate floating table 1054 (see FIG. 24) may include a first X-axis bracket 1092 and a first Z-axis movable plate 1094, The first print head assembly 1080 can be installed on the movable board. The second print head assembly positioning system 1091 can be similarly configured to control the X-Z axis movement of the second print head assembly 1081 above the substrate floating table 1054 (see FIG. 24).

圖26描繪氣體包體總成1000之部分分解的側面透視圖,該氣體包體總成包括前部面板總成1100'之各種區段,以及中間面板總成1200'及後部面板總成1300'。前部面板總成1100'可包括嵌入式框架1146,可看出該嵌入式框架係安裝於橋框架1144中,該橋框架係前部面板總成1100'及中間面板總成1200'兩者所共有的框架構件。嵌入式框架1146可包括開口 1148,圍繞該開口可貼附有墊圈1147。在嵌入式框架1146上方指示閘閥門總成1150。閘閥門總成1150可安裝於嵌入式框架1146上方。如圖27A及圖27B中可看出,閘閥門總成1150可具有門1158,該門係經由第一托架1153及第二托架1154安裝至Y-Z定位系統,該Y-Z定位系統用於使門1158在嵌入式框架1146之開口1148上方移動,以及用於將門1158嚙合來密封地覆蓋住開口1148。在圖27A中,包括第一軌道1151及第二軌道1152之定位系統可分別具有第一托架1153及第二托架1154,該等托架可與軌條導軌系統嚙合。如一般技藝人士可瞭解的是,軌條導軌系統可包括多個組件,該等組件諸如:例如但不限於軌條、軸承及致動器,用來控制定位系統之移動且因此控制門1158之移動。在圖27A中,圍繞開口1148展示墊圈1147。墊圈1147可為如前面關於密封框架構件總成所描述之墊圈材料中的任一者。在圖27A中,門1158被縮回,以使得可分別藉由第一列印頭總成定位系統1090及第二列印頭總成定位系統1091使列印頭總成1080及1081藉由在開口1148(見圖24及圖25)中行進而在漂浮台1054上方移動。在圖27B中,展示門1158覆蓋住開口1148。門1158所安裝至之定位系統(包括第一托架1153及第二托架1154)可將門1158定位在開口1148上方以便密封地嚙合墊圈1147,藉此密封地封閉開口1148。 Fig. 26 depicts a partially exploded side perspective view of the gas enclosure assembly 1000, which includes various sections of the front panel assembly 1100', and the middle panel assembly 1200' and the rear panel assembly 1300' . The front panel assembly 1100' may include an embedded frame 1146. It can be seen that the embedded frame is installed in the bridge frame 1144. The bridge frame is formed by both the front panel assembly 1100' and the middle panel assembly 1200' Common frame components. The embedded frame 1146 may include an opening 1148 around which a gasket 1147 may be attached. The gate valve assembly 1150 is indicated above the embedded frame 1146. The gate valve assembly 1150 may be installed above the embedded frame 1146. As can be seen in FIGS. 27A and 27B, the gate valve assembly 1150 may have a door 1158 that is mounted to the YZ positioning system via the first bracket 1153 and the second bracket 1154, which is used to make the door 1158 moves over the opening 1148 of the embedded frame 1146 and serves to engage the door 1158 to sealingly cover the opening 1148. In FIG. 27A, the positioning system including the first rail 1151 and the second rail 1152 can have a first bracket 1153 and a second bracket 1154, respectively, which can be engaged with the rail guide system. As one of ordinary skill can understand, a rail guide system may include multiple components such as, for example, but not limited to rails, bearings, and actuators, used to control the movement of the positioning system and thus the door 1158 mobile. In FIG. 27A, a gasket 1147 is shown around the opening 1148. The gasket 1147 may be any of the gasket materials as previously described with respect to the sealing frame member assembly. In FIG. 27A, the door 1158 is retracted so that the print head assembly 1080 and 1081 can be moved by the first print head assembly positioning system 1090 and the second print head assembly positioning system 1091, respectively, in The opening 1148 (see FIG. 24 and FIG. 25) travels in the middle of the floating platform 1054. In FIG. 27B, the display door 1158 covers the opening 1148. The positioning system to which the door 1158 is installed (including the first bracket 1153 and the second bracket 1154) can position the door 1158 above the opening 1148 to sealingly engage the gasket 1147, thereby sealingly closing the opening 1148.

圖28描繪穿過與前部面板總成1100'及後部面板總成1300'相關聯之中間底座面板總成1220'的截面圖。如圖28中所指示,通道1225可定位在底座1070周圍;其中底座1070延伸穿過第一框架構件1224。在框架構件1224中,提供框架結構的面板(諸如面板1228)可密封地安裝於框架構件1224中。預期的是,提供機械密封之多種墊圈可用於密封通道1225。 在各種實施例中,可使用用於密封通道1225之充氣式墊圈。充氣式墊圈之各種實施例可由強化彈性材料製成為空心模製結構,該結構在未充氣時可為凹面構型、迴旋狀構型或扁平構型。在各種實施例中,墊圈可安裝於面板1228上,以便密封地封閉底座1070周圍之通道1225。因此,當使用多種適當之流體介質(例如但不限於惰性氣體)中之任一者予以充氣時,用於封閉底座1070周圍之通道1225的充氣式墊圈之各種實施例可在安裝表面(諸如面板1228之內表面)與衝擊表面(諸如底座1070之表面)之間形成緊密障壁。在各種實施例中,充氣式墊圈可安裝於底座1070上,以便密封地封閉底座1070周圍之通道1225,以使得底座1070可為安裝表面且面板1228之內表面可為衝擊表面。就此而言,保形密封可密封地封閉通道1225。 28 depicts a cross-sectional view through the middle base panel assembly 1220' associated with the front panel assembly 1100' and the rear panel assembly 1300'. As indicated in FIG. 28, the channel 1225 may be positioned around the base 1070; wherein the base 1070 extends through the first frame member 1224. In the frame member 1224, a panel providing a frame structure (such as the panel 1228) may be sealingly installed in the frame member 1224. It is expected that a variety of gaskets that provide a mechanical seal can be used to seal the passage 1225. In various embodiments, an inflatable gasket for sealing the channel 1225 may be used. Various embodiments of the inflatable gasket may be made of reinforced elastic material into a hollow molded structure, which may be in a concave configuration, a convoluted configuration or a flat configuration when not inflated. In various embodiments, a gasket may be installed on the panel 1228 so as to sealingly close the channel 1225 around the base 1070. Therefore, when using any of a variety of suitable fluid media (such as but not limited to inert gas) to inflate, various embodiments of the inflatable gasket used to close the passage 1225 around the base 1070 can be installed on the surface (such as a panel A tight barrier is formed between the inner surface of 1228) and the impact surface (such as the surface of the base 1070). In various embodiments, an inflatable gasket may be mounted on the base 1070 to sealingly close the channel 1225 around the base 1070 so that the base 1070 may be the mounting surface and the inner surface of the panel 1228 may be the impact surface. In this regard, the conformal seal sealably closes the channel 1225.

除了充氣式墊圈之各種實施例之外,永久性附接(例如附接至面板1228以及附接至底座1070)的可撓性密封件,諸如波紋管密封件或唇形密封件,亦可用於密封通道1225。此永久性附接的密封件可提供實現底座1070之各種平移移動及振動移動所需要的可撓性,而同時為通道1225提供氣密式密封。 In addition to various embodiments of inflatable gaskets, permanently attached (eg, attached to the panel 1228 and attached to the base 1070) flexible seals, such as bellows seals or lip seals, can also be used Sealed channel 1225. This permanently attached seal can provide the flexibility required to achieve various translational and vibratory movements of the base 1070 while providing an airtight seal for the channel 1225.

如一般技藝人士可瞭解的是,圍繞有明顯邊界之邊緣(well-defined edge)形成保形密封可能有問題。在指示了圍繞諸如底座1070之結構的密封之氣體包體之各種實施例中,此結構可經製造來消除有明顯邊界之邊緣,在此等邊緣處需要密封。在圖24之列印系統1050的各種實施例中,最初可將底座1070製造成具有底座1070之磨圓的橫側邊緣以促進密封,如陰影線1070-1A關於第一側1076所指示以及陰影1070-1B關於第二側1078所指示。在圖24之列印系統1050的各種實施例中,可稍後修改底 座1070以使其具有多個結構,該等結構被安裝來提供底座1070之磨圓的橫側邊緣以促進密封,如陰影線結構1070-2A關於第一側1076所指示以及陰影線結構1070-2B關於第二側1078所指示。底座1070可由可提供支撐列印系統所需要之穩定性的材料製成,該材料例如但不限於花崗岩及鋼。如圖28中所指示,可易於修改此等材料。儘管對使用墊圈來封閉中間底座面板總成1220'中之底座1070周圍的通道1225給出一實例,但一般技藝人士將瞭解的是,跨越底座總成1220'之框架構件1226對底座1070周圍之封閉(見圖24)可使用相同的原理來進行。 As one of ordinary skill can understand, it may be problematic to form a conformal seal around a well-defined edge. In various embodiments that indicate a sealed gas envelope surrounding a structure such as base 1070, this structure can be manufactured to eliminate edges with significant boundaries where sealing is required. In various embodiments of the printing system 1050 of FIG. 24, the base 1070 may initially be manufactured with rounded lateral edges of the base 1070 to facilitate sealing, as indicated by hatching 1070-1A on the first side 1076 and shaded 1070-1B is instructed regarding the second side 1078. In various embodiments of the printing system 1050 of FIG. 24, the base 1070 may be modified later to have multiple structures that are installed to provide rounded lateral edges of the base 1070 to promote sealing, such as shadows The line structure 1070-2A is indicated with respect to the first side 1076 and the hatched structure 1070-2B is indicated with respect to the second side 1078. The base 1070 may be made of a material that can provide the stability needed to support the printing system, such as but not limited to granite and steel. As indicated in Figure 28, these materials can be easily modified. Although an example is given of using a gasket to close the passage 1225 around the base 1070 in the middle base panel assembly 1220', a person skilled in the art will understand that the frame member 1226 that spans the base assembly 1220' surrounds the base 1070. Closure (see Figure 24) can be performed using the same principle.

如前面所討論,列印頭總成之維護可包括各種校準程序及維護程序。例如,為了列印OLED顯示面板基板,每一列印頭總成(諸如圖24之第一列印頭總成1080及第二列印頭總成1081)可具有安裝於至少一個列印頭裝置中的複數個列印頭。在各種實施例中,列印頭裝置可包括:例如但不限於通向至少一個列印頭的流體及電子連接;每一列印頭具有能夠以受控制之速率、速度及大小來噴射墨水之複數個噴嘴或孔口。對於圖24之第一列印頭總成1080及第二列印頭總成1081的各種實施例,每一列印頭總成可包括約1個至約60個之間的列印頭裝置,其中每一列印頭裝置可具有位於每一列印頭裝置中之約1個至約30個之間的列印頭。例如工業噴墨頭之列印頭可具有約16個至約2048個噴嘴,該等噴嘴可射出約0.1pL至約200pL之間的液滴體積。校準列印頭可包括:例如但不限於檢查噴嘴發射、量測液滴體積、速度及方向,以及調諧列印頭,以使得每一噴嘴噴射均勻體積之液滴。維護列印頭可包括例如但不限於諸如以下程序:列印頭起動,此需要收集及圍阻自列印頭射出之墨水;在起動程序之後移除多餘墨水; 以及列印頭替換。在列印處理中,例如為了列印OLED顯示面板基板,噴嘴之可靠發射對確保列印處理可製造優質OLED面板顯示器很關鍵。因此,需要容易地且可靠地實行與列印頭維護相關聯之各種程序;尤其是無需將氣體包體總成之內部曝露於諸如以下各種反應性成分:例如但不限於來自於大氣的氧氣及水蒸汽,以及例如但不限於來自列印處理之有機溶劑蒸汽。 As previously discussed, the maintenance of the print head assembly may include various calibration procedures and maintenance procedures. For example, in order to print an OLED display panel substrate, each print head assembly (such as the first print head assembly 1080 and the second print head assembly 1081 of FIG. 24) may have at least one print head device installed in it Multiple print heads. In various embodiments, the print head device may include, for example, but not limited to, fluid and electrical connections to at least one print head; each print head has a plurality of inks capable of ejecting ink at a controlled rate, speed, and size Nozzles or orifices. For various embodiments of the first print head assembly 1080 and the second print head assembly 1081 of FIG. 24, each print head assembly may include between about 1 to about 60 print head devices, wherein Each print head device may have between about 1 to about 30 print heads in each print head device. For example, a print head of an industrial inkjet head may have about 16 to about 2048 nozzles, and these nozzles may eject a droplet volume between about 0.1 pL and about 200 pL. Calibrating the print head may include, for example, but not limited to, checking nozzle firing, measuring droplet volume, speed and direction, and tuning the print head so that each nozzle ejects a uniform volume of droplets. Maintaining the print head may include, for example, but not limited to, procedures such as: print head activation, which requires the collection and containment of ink ejected from the print head; removal of excess ink after the startup procedure; and print head replacement. In the printing process, for example, for printing OLED display panel substrates, the reliable emission of nozzles is critical to ensure that the printing process can produce high-quality OLED panel displays. Therefore, various procedures related to printhead maintenance need to be easily and reliably performed; in particular, there is no need to expose the interior of the gas envelope assembly to various reactive components such as, for example, but not limited to, oxygen from the atmosphere and Water vapor, and for example, but not limited to organic solvent vapor from printing processes.

就此而言,對於圖24之氣體包體總成的各種實施例,維護系統可例如但不限於在底座1070之頂部表面1071上安裝成靠近第一列印頭總成1080,以及在底座1070之頂部表面1073上安裝成靠近第二列印頭總成1081。此維護系統可包括:例如但不限於用於執行各種列印頭校準程序之液滴校準台;用於在沖洗或起動程序期間收集及圍阻自列印頭射出之墨水的沖洗台;以及用於在已於沖洗台處執行沖洗或起動程序之後移除多餘墨水的吸墨台。在例行維護期間,此等程序可在完全自動化的模式下執行。在一些情況下,當維護程序期間可能指示一定程度之人為干預時,可經由例如手套埠之使用來在外部完成終端使用者接取。如前面所討論,圖23至圖28之氣體包體總成1000的各種實施例有效地減小OLED列印處理期間所需要之惰性氣體的體積,而同時提供對氣體包體之內部的輕鬆接取。 In this regard, for various embodiments of the gas package assembly of FIG. 24, the maintenance system may be, for example but not limited to, mounted on the top surface 1071 of the base 1070 close to the first print head assembly 1080, and on the base 1070. The top surface 1073 is mounted close to the second print head assembly 1081. This maintenance system may include, for example, but not limited to, a droplet calibration station used to perform various print head calibration procedures; a washing station used to collect and contain ink ejected from the print head during the flushing or starting procedure; and Ink suction station that removes excess ink after a rinse or start-up procedure has been performed at the rinse station. During routine maintenance, these procedures can be performed in a fully automated mode. In some cases, when a certain level of human intervention may be indicated during the maintenance procedure, the end user access may be completed externally through the use of, for example, a glove port. As previously discussed, the various embodiments of the gas envelope assembly 1000 of FIGS. 23 to 28 effectively reduce the volume of inert gas required during the OLED printing process, while providing easy access to the interior of the gas envelope take.

此外,若列印頭維護需要對列印頭總成或各種維護台中之任一者的直接接取,則使門1158密封地封閉住開口1148(如關於圖27A及圖27B所描述)以及密封地封閉底座1070周圍之通道(如關於圖28所描述)可將一框架構件總成區段所界定之體積與氣體包體總成1000之剩餘體積隔離開,該框架構件總成區段包括中間面板總成1200'及中間底座面板總成1220'之被隔離部分。此外,一般技藝人士將理解的是,使門1158密封地封 閉住開口1148(如關於圖27A、圖27B及圖28所描述)以及密封地封閉底座1070周圍之通道(如關於圖28所描述)可遠程且自動地完成。對於氣體包體總成1000之各種實施例,此維護框架構件總成區段之此被隔離體積之部分體積可小於或等於經輪廓塑造之氣體包體總成的各種實施例之總體積的約20%。對於氣體包體總成1000之各種實施例,此維護框架構件總成區段之此被隔離體積之部分體積可小於或等於經輪廓塑造之氣體包體總成的各種實施例之總體積的約50%。藉由大大減少需要終端使用者直接接取來進行列印頭維護的氣體包體總成之部分,可大大減少系統復原時間。 In addition, if the print head maintenance requires direct access to the print head assembly or any of various maintenance stations, the door 1158 hermetically closes the opening 1148 (as described with respect to FIGS. 27A and 27B) and seals Ground-sealing the passage around the base 1070 (as described with respect to FIG. 28) can isolate the volume defined by a frame member assembly section from the remaining volume of the gas envelope assembly 1000, which includes the middle The isolated parts of the panel assembly 1200' and the middle base panel assembly 1220'. In addition, one of ordinary skill will understand that the door 1158 hermetically closes the opening 1148 (as described with respect to FIGS. 27A, 27B, and 28) and hermetically closes the passageway around the base 1070 (as described with respect to FIG. 28) It can be done remotely and automatically. For various embodiments of the gas enclosure assembly 1000, the portion of the isolated volume of the maintenance frame member assembly section may be less than or equal to approximately the total volume of the various embodiments of the contoured gas enclosure assembly 20%. For various embodiments of the gas enclosure assembly 1000, the portion of the isolated volume of the maintenance frame member assembly section may be less than or equal to approximately the total volume of the various embodiments of the contoured gas enclosure assembly 50%. By greatly reducing the portion of the gas envelope assembly that requires end users to directly access for printhead maintenance, system recovery time can be greatly reduced.

圖29描繪根據本教示之氣體包體總成的各種實施例之氣體包體總成1010的透視圖。氣體包體總成1010可包括前部面板總成1100'、中間面板總成1200'以及後部面板總成1300'。前部面板總成1100'可包括前部天花板面板總成1160';前部壁面板總成1140',其具有用於接納基板之開口1142;以及前部底座面板總成1120'。後部面板總成1300'可包括後部天花板面板總成1360'、後部壁面板總成1340'及後部底座面板總成1320'。中間面板總成1200'可包括第一中間包體面板總成1240'、中間壁及天花板面板總成1260'及第二中間包體面板總成1280',以及中間底座面板總成1220'。另外,中間面板總成1200'可包括第一中間維護系統面板總成1230'以及第二中間維護系統面板總成(未圖示)。 FIG. 29 depicts a perspective view of a gas enclosure assembly 1010 according to various embodiments of the gas enclosure assembly of the present teachings. The gas package assembly 1010 may include a front panel assembly 1100', a middle panel assembly 1200', and a rear panel assembly 1300'. The front panel assembly 1100' may include a front ceiling panel assembly 1160'; a front wall panel assembly 1140' having an opening 1142 for receiving a substrate; and a front base panel assembly 1120'. The rear panel assembly 1300' may include a rear ceiling panel assembly 1360', a rear wall panel assembly 1340', and a rear base panel assembly 1320'. The intermediate panel assembly 1200' may include a first intermediate package panel assembly 1240', an intermediate wall and ceiling panel assembly 1260', a second intermediate package panel assembly 1280', and an intermediate base panel assembly 1220'. In addition, the intermediate panel assembly 1200' may include a first intermediate maintenance system panel assembly 1230' and a second intermediate maintenance system panel assembly (not shown).

圖30描繪根據本教示之氣體包體總成的各種實施例之氣體包體1010的分解透視圖。氣體包體總成1010可封裝OLED列印系統1050,該OLED列印系統可包括由基板漂浮台底座1052支撐的基板漂浮台1054。基板漂浮台底座1052可安裝於底座1070上。OLED列印系統之基板漂浮台 1054可支撐基板1058,並且界定基板1058在基板之OLED列印期間可被移動通過系統1010所經過的行程。基板漂浮台1054可提供基板1058之無摩擦輸送。對於圖30之氣體包體總成1010,OLED列印系統1050上可存在四個隔離體:第一隔離體組1051(未展示對立面上之第二隔離體)以及第二隔離體組1053(未展示對立面上之第二隔離體),該等隔離體組支撐OLED列印系統1050之基板漂浮台1054。底座1070可包括第一豎管1075及第二豎管1077,橋1079安裝於該第一豎管及該第二豎管上。對於OLED列印系統1050之各種實施例,橋1079可支撐第一列印頭總成定位系統1090及第二定位系統1091,該等定位系統可分別控制第一列印頭總成1080及第二列印頭總成1081之移動。對於OLED列印系統1050之各種實施例,可存在單個定位系統及單個列印頭總成。對於OLED列印系統1050之各種實施例,可存在單個列印頭總成,例如第一列印頭總成1080及第二列印頭總成1081中之任一者,而用於檢查基板1058之特徵的攝影機系統可安裝至第二定位系統。 FIG. 30 depicts an exploded perspective view of the gas enclosure 1010 according to various embodiments of the gas enclosure assembly of the present teachings. The gas package assembly 1010 may encapsulate an OLED printing system 1050, which may include a substrate floating table 1054 supported by a substrate floating table base 1052. The base 1052 of the substrate floating platform can be installed on the base 1070. The substrate floating table 1054 of the OLED printing system can support the substrate 1058 and define the travel distance that the substrate 1058 can be moved through the system 1010 during OLED printing of the substrate. The substrate floating table 1054 can provide frictionless transportation of the substrate 1058. For the gas package assembly 1010 of FIG. 30, there may be four spacers on the OLED printing system 1050: a first spacer group 1051 (the second spacer on the opposite surface is not shown) and a second spacer group 1053 (not The second spacer on the opposite side is shown). These spacer groups support the substrate floating table 1054 of the OLED printing system 1050. The base 1070 may include a first standpipe 1075 and a second standpipe 1077, and a bridge 1079 is installed on the first standpipe and the second standpipe. For various embodiments of the OLED printing system 1050, the bridge 1079 can support the first printing head assembly positioning system 1090 and the second positioning system 1091, which can control the first printing head assembly 1080 and the second The movement of the print head assembly 1081. For various embodiments of the OLED printing system 1050, there may be a single positioning system and a single print head assembly. For various embodiments of the OLED printing system 1050, there may be a single print head assembly, such as any one of the first print head assembly 1080 and the second print head assembly 1081, which is used to inspect the substrate 1058 The characteristic camera system can be installed to the second positioning system.

用於將第一列印頭總成1080定位在基板漂浮台1054上方的第一列印頭總成定位系統1090可包括第一X軸托架1092及第一Z軸活動板1094,第一列印頭總成包體1084可安裝於該活動板上。第二列印頭總成定位系統1091可被類似地組配來控制可包括第二列印頭總成包體1085之第二列印頭總成1081的X-Z軸移動。如圖30中關於第一列印頭總成1080所描繪,其中第一列印頭總成包體1084係以局部視圖來描繪,列印頭總成之各種實施例可具有安裝於該第一列印頭總成包體中之複數個列印頭裝置1082。對於列印系統1050之各種實施例,列印頭總成可包括約1個至約60 個之間的列印頭裝置,其中每一列印頭裝置可具有位於每一列印頭裝置中之約1個至約30個之間的列印頭。如隨後將更為詳細地討論,考慮到需要持續維護的列印頭裝置及列印頭的數量很大,可看出第一維護系統總成1250經定位以實現對第一列印頭總成1080之輕鬆接取。 The first print head assembly positioning system 1090 for positioning the first print head assembly 1080 above the substrate floating table 1054 may include a first X-axis bracket 1092 and a first Z-axis movable plate 1094, the first row The print head assembly body 1084 can be mounted on the movable board. The second print head assembly positioning system 1091 can be similarly configured to control the X-Z axis movement of the second print head assembly 1081, which can include the second print head assembly body 1085. As depicted in FIG. 30 with respect to the first print head assembly 1080, wherein the first print head assembly body 1084 is depicted in a partial view, various embodiments of the print head assembly may have mounted on the first A plurality of print head devices 1082 in the package of the print head assembly. For various embodiments of the printing system 1050, the print head assembly may include between about 1 to about 60 print head devices, where each print head device may have about 1 in each print head device Between about 30 and about 30 print heads. As will be discussed in more detail later, considering the large number of printhead devices and printheads that require continuous maintenance, it can be seen that the first maintenance system assembly 1250 is positioned to achieve the first printhead assembly 1080 is easy to access.

如圖30中所描繪,氣體包體總成1010可包括前部底座面板總成1120'、中間底座面板總成1220'及後部底座面板總成1320',該等總成在被完全建構時形成相連的底座,可將OLED列印系統1050安裝於藉此形成之相連的底盤上,安裝方式與將OLED列印系統50安裝於圖13之底盤204上類似。第一隔離體組1051及第二隔離體組可安裝於對應之隔離體壁面板(諸如中間底座面板總成1220'之第二隔離體壁面板1225'及第二隔離體壁面板1227')中之每一者中。隨後可圍繞OLED列印系統1050將包含前部面板總成1100'、中間面板總成1200'及後部面板總成1300'之各種面板構件及面板連接起來以便形成氣體包體總成1010之各種實施例,其方式與關於圖3的氣體包體總成100之建構所描述的類似。 As depicted in FIG. 30, the gas enclosure assembly 1010 may include a front base panel assembly 1120', a middle base panel assembly 1220', and a rear base panel assembly 1320', which are formed when fully constructed With the connected base, the OLED printing system 1050 can be installed on the connected chassis thus formed in a similar manner to the OLED printing system 50 installed on the chassis 204 of FIG. 13. The first isolator group 1051 and the second isolator group can be installed in corresponding isolator wall panels (such as the second isolator wall panel 1225' and the second isolator wall panel 1227' of the middle base panel assembly 1220') In each of them. Various panel components and panels including the front panel assembly 1100', the middle panel assembly 1200' and the rear panel assembly 1300' can be connected around the OLED printing system 1050 to form various implementations of the gas package assembly 1010 For example, the method is similar to that described with respect to the construction of the gas inclusion assembly 100 of FIG. 3.

對於圖30之氣體包體總成1010,中間底座總成1220'可包括第一中間維護系統面板總成1230'以及第二中間維護系統面板總成1270'。第一中間維護系統面板總成1230'及第二中間維護系統面板總成1270'可分別包括第一底板(floor panel)總成1241'之第一列印頭總成開口1242及第二底板總成1281'之第二列印頭總成開口1282。圖30中將第一底板總成1241'描繪成中間面板總成1200'之第一中間包體面板總成1240'的一部分。第一底板總成1241'係第一中間包體面板總成1240'及第一中間維護系統面板總成1230'兩者所共有的面板總成。圖30中將第二底板總成1281'描繪成中間面板總成 1200'之第二中間包體面板總成1280'的一部分。第二底板總成1281'係第二中間包體面板總成1280'及第二中間維護系統面板總成1270'兩者所共有的面板總成。 For the gas package assembly 1010 of FIG. 30, the intermediate base assembly 1220' may include a first intermediate maintenance system panel assembly 1230' and a second intermediate maintenance system panel assembly 1270'. The first intermediate maintenance system panel assembly 1230' and the second intermediate maintenance system panel assembly 1270' may include a first print head assembly opening 1242 and a second bottom plate assembly of the first floor panel assembly 1241', respectively The opening 1282 of the second print head assembly 1281'. In FIG. 30, the first bottom plate assembly 1241' is depicted as a part of the first intermediate body panel assembly 1240' of the intermediate panel assembly 1200'. The first bottom plate assembly 1241' is a panel assembly common to both the first tundish panel assembly 1240' and the first intermediate maintenance system panel assembly 1230'. In FIG. 30, the second bottom plate assembly 1281' is depicted as a part of the second intermediate body panel assembly 1280' of the intermediate panel assembly 1200'. The second bottom plate assembly 1281' is a panel assembly common to both the second tundish panel assembly 1280' and the second intermediate maintenance system panel assembly 1270'.

如前面所提及,第一列印頭總成1080可封裝在第一列印頭總成包體1084中,且第二列印頭總成1081可封裝在第二列印頭總成包體1085中。如隨後將更為詳細地討論,第一列印頭總成包體1084及第二列印頭總成包體1085可具有位於可具有輪緣(未圖示)的底部之開口,以使得各種列印頭總成可經定位以便在列印處理期間進行列印。另外,第一列印頭總成包體1084及第二列印頭總成總體1085之形成殼體的各部分可如前面關於各種面板總成所描述來建構,以使得框架總成構件及面板能夠提供氣密式包體。可圍繞第一列印頭總成開口1242及第二列印頭總成開口1282中之每一者貼附可壓縮墊圈,或另一選擇為,分別圍繞第一列印頭總成包體1084及第二列印頭總成包體1085的輪緣貼附可壓縮墊圈。如圖30中所描繪,可分別圍繞第一列印頭總成開口1242及第二列印頭總成開口1282貼附第一列印頭總成對接墊圈1245及第二列印頭總成對接墊圈1285。第一列印頭總成定位系統1090及第二列印頭總成定位系統1091可將第一列印頭總成包體1084及第二列印頭總成包體1085分別與第一中間維護系統面板總成1230'及第二中間維護系統面板總成1270'對接。對於各種列印頭維護程序,該對接可包括在該等列印頭總成包體中之每一者與該等維護系統面板總成中之每一者之間形成墊圈密封。當第一列印頭總成包體1084及第二列印頭總成包體1085與第一中間維護系統面板總成1230'及第二中間維護系統面板總成1270'對接來密封地封閉第一列印頭總成開口1242及第二列印頭總 成開口1282時,如此形成的組合式結構被氣密式密封。 As mentioned earlier, the first print head assembly 1080 can be packaged in the first print head assembly package 1084, and the second print head assembly 1081 can be packaged in the second print head assembly package 1085. As will be discussed in more detail later, the first print head assembly package 1084 and the second print head assembly package 1085 may have openings at the bottom that may have rims (not shown) to allow various The print head assembly can be positioned for printing during the printing process. In addition, the parts of the first print head assembly package 1084 and the second print head assembly body 1085 that form the housing can be constructed as described above with respect to various panel assemblies, so that the frame assembly components and panels Able to provide airtight package. A compressible gasket can be attached around each of the first print head assembly opening 1242 and the second print head assembly opening 1282, or another option is to surround the first print head assembly package 1084, respectively A compressible washer is attached to the rim of the package body 1085 of the second print head assembly. As depicted in FIG. 30, the first print head assembly butt gasket 1245 and the second print head assembly can be butted around the first print head assembly opening 1242 and the second print head assembly opening 1282, respectively Washer 1285. The first print head assembly positioning system 1090 and the second print head assembly positioning system 1091 can maintain the first print head assembly package 1084 and the second print head assembly package 1085 and the first intermediate maintenance respectively The system panel assembly 1230' and the second intermediate maintenance system panel assembly 1270' are docked. For various printhead maintenance procedures, the docking may include forming a gasket seal between each of the printhead assembly packages and each of the maintenance system panel assemblies. When the first print head assembly package 1084 and the second print head assembly package 1085 are docked with the first intermediate maintenance system panel assembly 1230' and the second intermediate maintenance system panel assembly 1270' to seal the first When the first print head assembly opening 1242 and the second print head assembly opening 1282 are formed, the combined structure thus formed is hermetically sealed.

在各種列印頭維護程序期間,第一列印頭總成1080及第二列印頭總成1081可分別藉由第一列印頭總成定位系統1090及第二列印頭總成定位系統1091分別定位在第一底板總成1241'之第一列印頭總成開口1242以及第二底板總成1281'之第二列印頭總成開口1282上方。就此而言,對於各種列印頭維護程序,第一列印頭總成1080及第二列印頭總成1081可分別定位在第一底板總成1241'之第一列印頭總成開口1242及第二底板總成1281'之第二列印頭總成開口1282上方,而不覆蓋或密封第一列印頭總成開口1242及第二列印頭總成開口1282。此外,對於各種列印頭維護程序,第一列印頭總成開口1242及第二列印頭總成開口1282之封閉可將第一中間維護系統面板總成1230'作為一區段並且將第二中間維護系統面板總成1270'作為一區段與氣體包體總成1010之剩餘體積分開。對於各種列印頭維護程序,第一列印頭總成1080及第二列印頭總成1081可分別在第一列印頭總成開口1242及第二列印頭總成開口1282上方在Z軸方向中對接在墊圈上,藉此封閉第一列印頭總成開口1242及第二列印頭總成開口1282。根據本教示,取決於在Z軸方向上施加至第一列印頭總成包體1084及第二列印頭總成包體1085的力,第一列印頭總成開口1242及第二列印頭總成開口1282可被覆蓋或密封。就此而言,在Z軸方向上施加至第一列印頭總成包體1084的可密封第一列印頭總成開口1242的力可將第一中間維護系統面板總成1230'作為一區段與包含氣體包體總成1010的剩餘框架構件總成區段隔離開。類似地,在Z軸方向上施加至第二列印頭總成包體1085的可密封第二列印頭總成開口1282的力可將第二中間維護系統面板總成1270'作為一區段 與包含氣體包體總成1010的剩餘框架構件總成區段隔離開。 During various print head maintenance procedures, the first print head assembly 1080 and the second print head assembly 1081 can be accessed by the first print head assembly positioning system 1090 and the second print head assembly positioning system, respectively 1091 are respectively positioned above the first print head assembly opening 1242 of the first base plate assembly 1241' and the second print head assembly opening 1282 of the second base plate assembly 1281'. In this regard, for various print head maintenance procedures, the first print head assembly 1080 and the second print head assembly 1081 can be positioned at the first print head assembly opening 1242 of the first base plate assembly 1241', respectively And the second base plate assembly 1281' above the second print head assembly opening 1282 without covering or sealing the first print head assembly opening 1242 and the second print head assembly opening 1282. In addition, for various printhead maintenance procedures, the closure of the first printhead assembly opening 1242 and the second printhead assembly opening 1282 can use the first intermediate maintenance system panel assembly 1230' as a section and the first The two intermediate maintenance system panel assembly 1270' is separated from the remaining volume of the gas envelope assembly 1010 as a section. For various printhead maintenance procedures, the first printhead assembly 1080 and the second printhead assembly 1081 may be above the first printhead assembly opening 1242 and the second printhead assembly opening 1282 in Z The shaft is butted against the washer in the axial direction, thereby closing the first print head assembly opening 1242 and the second print head assembly opening 1282. According to this teaching, depending on the forces applied to the first print head assembly body 1084 and the second print head assembly body 1085 in the Z-axis direction, the first print head assembly opening 1242 and the second row The print head assembly opening 1282 may be covered or sealed. In this regard, the force applied to the first printhead assembly package 1084 in the Z-axis direction that can seal the first printhead assembly opening 1242 can use the first intermediate maintenance system panel assembly 1230' as a zone The segment is isolated from the remaining frame member assembly section containing the gas inclusion assembly 1010. Similarly, the force applied to the second printhead assembly package 1085 in the Z-axis direction that can seal the second printhead assembly opening 1282 can use the second intermediate maintenance system panel assembly 1270' as a section It is isolated from the remaining frame member assembly section containing the gas inclusion assembly 1010.

預期的是,在氣體包體總成1010之各種實施例中,罩蓋(諸如,例如但不限於前面關於圖26以及圖27A及圖27B所描述之閘閥總成)可安裝於第一中間維護系統面板總成1230'及第二中間維護系統面板總成1270'中。此罩蓋可用來分別覆蓋第一中間維護系統面板總成1230'之第一列印頭總成開口1242及第二中間維護系統面板總成1270'之第二列印頭總成開口1282。如隨後將更為詳細地討論,使用罩蓋(諸如,例如但不限於閘閥總成)來封閉第一列印頭總成開口1242及第二列印頭總成開口1282可允許在不對接列印頭總成的情況下將第一框架構件總成區段與第二框架構件總成區段隔離開。就此而言,可在不中斷列印處理之情況下執行各種維護程序。 It is expected that in various embodiments of the gas package assembly 1010, a cover (such as, for example but not limited to, the gate valve assembly described above with respect to FIGS. 26 and 27A and 27B) may be installed in the first intermediate maintenance The system panel assembly 1230' and the second intermediate maintenance system panel assembly 1270'. The cover can be used to respectively cover the first print head assembly opening 1242 of the first intermediate maintenance system panel assembly 1230' and the second print head assembly opening 1282 of the second intermediate maintenance system panel assembly 1270'. As will be discussed in more detail later, the use of a cover (such as, for example, but not limited to, a gate valve assembly) to close the first printhead assembly opening 1242 and the second printhead assembly opening 1282 may allow the non-docking row In the case of the print head assembly, the first frame member assembly section is isolated from the second frame member assembly section. In this regard, various maintenance procedures can be performed without interrupting the printing process.

氣體包體總成1010之圖30描繪可包括第一後部壁面板總成1238'之第一中間維護系統面板總成1230'。類似地,亦描繪可包括第二後部壁面板總成1278'之第二中間維護系統面板總成1270'。第一中間維護系統面板總成1230'之第一後部壁面板總成1238'的建構方式可與關於第二後部壁面板總成1278'所展示的類似。第二中間維護系統面板總成1270'之第二後部壁面板總成1278'可由具有第二密封件支撐面板1275之第二後部壁框架總成1278建構而成,該第二密封件支撐面板密封地安裝至第二後部壁框架總成1278。第二密封件支撐面板1275可具有第二通道1265,該第二通道靠近底座1070之第二端部(未圖示)。第二密封件1267可圍繞第二通道1265安裝於第二密封件支撐面板1275上。 Figure 30 of the gas package assembly 1010 depicts a first intermediate maintenance system panel assembly 1230' that may include a first rear wall panel assembly 1238'. Similarly, a second intermediate maintenance system panel assembly 1270' that may include a second rear wall panel assembly 1278' is also depicted. The first rear wall panel assembly 1238' of the first intermediate maintenance system panel assembly 1230' may be constructed in a manner similar to that shown with respect to the second rear wall panel assembly 1278'. The second rear wall panel assembly 1278' of the second intermediate maintenance system panel assembly 1270' can be constructed from a second rear wall frame assembly 1278 with a second seal support panel 1275, which supports the panel seal Installed to the second rear wall frame assembly 1278. The second seal support panel 1275 may have a second channel 1265 that is close to the second end (not shown) of the base 1070. The second seal 1267 may be mounted on the second seal support panel 1275 around the second channel 1265.

圖31A至圖31F係氣體包體總成1010之示意性橫截面圖, 其可進一步例示第一中間維護系統面板總成1230'及第二中間維護系統面板總成1270'之各方面。如一般技藝人士可瞭解,考慮到可具有分別用於定位第一列印頭總成1080及第二列印頭總成1081的第一列印頭總成定位系統1090及第二列印頭總成定位系統1091之列印系統1050的對稱性(見圖30),針對圖31A至圖31D所例示之關於第一中間維護系統面板總成1230'的以下教示可適用於第二中間維護系統面板總成1270'。 FIGS. 31A to 31F are schematic cross-sectional views of the gas envelope assembly 1010, which can further illustrate various aspects of the first intermediate maintenance system panel assembly 1230′ and the second intermediate maintenance system panel assembly 1270′. As one of ordinary skill can understand, consider that there can be a first print head assembly positioning system 1090 and a second print head assembly that can be used to position the first print head assembly 1080 and the second print head assembly 1081, respectively. The symmetry of the printing system 1050 of the positioning system 1091 (see FIG. 30), the following teachings regarding the first intermediate maintenance system panel assembly 1230′ illustrated in FIGS. 31A to 31D can be applied to the second intermediate maintenance system panel Assembly 1270'.

圖31A描繪氣體包體總成1010之示意性橫截面圖,其展示第一中間維護系統面板總成1230'及第二中間維護系統面板總成1270'。圖31A之第一中間維護系統面板總成1230'可封裝第一維護系統總成1250,可藉由第一維護系統定位系統1251相對於第一列印頭總成開口1242來定位該第一維護系統總成。第一列印頭總成開口1242係第一底板總成1241'中之開口,該第一底板總成係第一中間維護系統面板總成1230'及第一中間包體面板總成1240'所共有的面板。第一維護系統定位系統1251可安裝於第一維護系統總成平台1253上,該第一維護系統總成平台可穩固地安裝至底座1070之第一端部1072上。第一維護系統總成平台1253可自底座1070之第一端部1072延伸穿過第一通道1261,進入第一中間維護系統面板總成1230'。類似地,如圖31A中所描繪,圖31A之第二中間維護系統面板總成1270'可封裝第二維護系統總成1290,可藉由第二維護系統定位系統1291相對於第二列印頭總成開口1282來定位該第二維護系統總成。第二列印頭總成開口1282係第一底板總成1281'中之開口,該第一底板總成係第二中間維護系統面板總成1270'及第二中間包體面板總成1280'所共有的面板。第二維護系統定位系統1291可安裝於第二維護總成系統平台1293上,該第二維護總成系 統平台可自底座1070之第二端部1074延伸穿過通道1265,進入第二中間維護系統面板總成1270'。第一密封件1263可圍繞第一通道1261安裝於第一密封件支撐面板1235的第一外表面1237上。類似地,第二密封件1267可圍繞第二通道1265安裝於第二密封件支撐面板1275的第二外表面1277上。第一密封件1263及第二密封件1267可為如前面關於圖28所描述之充氣式墊圈。第一密封件1263及第二密封件1267之各種實施例可為永久性附接(例如,分別附接至第一外表面1237及第二外表面1277,並且附接至底座1070之底座第一端部1072及底座1070之第二端部1074)的可撓性密封件。如前面所討論,可撓性密封件可為諸如波紋管密封件或唇形密封件之密封件。此永久性附接的密封件可提供實現底座1070之各種平移及振動移動所需要的可撓性,而同時為第一通道1261及第二通道1265提供氣密式密封。 FIG. 31A depicts a schematic cross-sectional view of a gas enclosure assembly 1010, which shows a first intermediate maintenance system panel assembly 1230' and a second intermediate maintenance system panel assembly 1270'. The first intermediate maintenance system panel assembly 1230' of FIG. 31A can encapsulate the first maintenance system assembly 1250, which can be positioned relative to the first print head assembly opening 1242 by the first maintenance system positioning system 1251 System assembly. The first print head assembly opening 1242 is an opening in the first bottom plate assembly 1241', the first bottom plate assembly is formed by the first intermediate maintenance system panel assembly 1230' and the first intermediate package panel assembly 1240' Shared panel. The first maintenance system positioning system 1251 can be installed on the first maintenance system assembly platform 1253, which can be firmly installed on the first end 1072 of the base 1070. The first maintenance system assembly platform 1253 can extend from the first end 1072 of the base 1070 through the first channel 1261 and into the first intermediate maintenance system panel assembly 1230'. Similarly, as depicted in FIG. 31A, the second intermediate maintenance system panel assembly 1270′ of FIG. 31A can encapsulate the second maintenance system assembly 1290, which can be positioned relative to the second print head by the second maintenance system positioning system 1291 An assembly opening 1282 is used to position the second maintenance system assembly. The second print head assembly opening 1282 is an opening in the first bottom plate assembly 1281', the first bottom plate assembly is the second intermediate maintenance system panel assembly 1270' and the second intermediate body panel assembly 1280' Shared panel. The second maintenance system positioning system 1291 can be installed on a second maintenance assembly system platform 1293 which can extend from the second end 1074 of the base 1070 through the passage 1265 to enter the second intermediate maintenance system Panel assembly 1270'. The first seal 1263 may be installed on the first outer surface 1237 of the first seal support panel 1235 around the first channel 1261. Similarly, the second seal 1267 may be mounted on the second outer surface 1277 of the second seal support panel 1275 around the second channel 1265. The first seal 1263 and the second seal 1267 may be inflatable gaskets as previously described with respect to FIG. 28. Various embodiments of the first seal 1263 and the second seal 1267 may be permanently attached (eg, attached to the first outer surface 1237 and the second outer surface 1277, respectively, and attached to the base first of the base 1070 Flexible seals of the end 1072 and the second end 1074 of the base 1070). As previously discussed, the flexible seal may be a seal such as a bellows seal or lip seal. This permanently attached seal can provide the flexibility required to achieve various translational and vibratory movements of the base 1070 while providing a hermetic seal for the first channel 1261 and the second channel 1265.

圖31B及圖31C例示出本教示之氣體包體總成1010的各種開口及通道之覆蓋及密封,其例示出相對於第一中間維護系統面板總成1230'來定位第一列印頭總成1080以便進行各種維護程序。如前面所提及,關於第一中間維護系統面板總成1230'之以下教示亦可適用於第二中間維護系統面板總成1270'。 FIGS. 31B and 31C illustrate the covering and sealing of various openings and channels of the gas package assembly 1010 of this teaching, which illustrates the positioning of the first print head assembly relative to the first intermediate maintenance system panel assembly 1230′ 1080 for various maintenance procedures. As mentioned earlier, the following teachings regarding the first intermediate maintenance system panel assembly 1230' can also be applied to the second intermediate maintenance system panel assembly 1270'.

在圖31B中,第一列印頭總成1080可包括具有至少一個列印頭之列印頭裝置1082,該至少一個列印頭包括複數個噴嘴或孔口。列印頭裝置1082可封裝在第一列印頭總成包體1084中,該第一列印頭總成包體可具有第一列印頭總成包體開口1086,列印頭裝置1082可自該第一列印頭總成包體開口被定位,以使得在列印期間,該等噴嘴以受控制之速率、速度及大小來噴射墨水至安裝於漂浮台1054上之基板上;該漂浮台係由漂浮 台支撐體1052支撐。如前面所討論,在列印處理期間可控制第一列印頭總成定位系統1090來將第一列印頭總成1080定位在基板上方以便進行列印。另外,如圖31B中所描繪,對於氣體包體總成1010之各種實施例,具有可控制之X-Z軸移動的第一列印頭總成定位系統1090可將第一列印頭總成1080定位在第一列印頭總成開口1242上方。如圖31B中所描繪,第一底板總成1241'之第一列印頭總成開口1242係第一中間包體面板總成1240'及第一中間維護系統面板總成1230'所共有的。 In FIG. 31B, the first print head assembly 1080 may include a print head device 1082 having at least one print head, the at least one print head including a plurality of nozzles or orifices. The print head device 1082 may be packaged in a first print head assembly package 1084, the first print head assembly package may have a first print head assembly package opening 1086, and the print head device 1082 may The package opening from the first print head assembly is positioned so that during printing, the nozzles eject ink onto the substrate mounted on the floating table 1054 at a controlled rate, speed, and size; the float The platform is supported by the floating platform support 1052. As previously discussed, the first print head assembly positioning system 1090 can be controlled during the printing process to position the first print head assembly 1080 above the substrate for printing. In addition, as depicted in FIG. 31B, for various embodiments of the gas package assembly 1010, the first print head assembly positioning system 1090 with controllable XZ axis movement can position the first print head assembly 1080 Above the opening 1242 of the first print head assembly. As depicted in FIG. 31B, the first print head assembly opening 1242 of the first base plate assembly 1241' is common to the first tundish panel assembly 1240' and the first intermediate maintenance system panel assembly 1230'.

圖31B之第一列印頭總成包體1084可包括第一列印頭總成包體輪緣1088,該輪緣可為圍繞第一列印頭總成開口1242與第一底板總成1241'對接的表面。第一列印頭總成包體輪緣1088可嚙合第一列印頭總成對接墊圈1245,該第一列印頭總成對接墊圈在圖31B中係描繪成圍繞第一列印頭總成開口1242來貼附的。一般技藝人士將瞭解的是,儘管展示第一列印頭總成包體輪緣1088被描繪成向內突出之結構,但可在第一列印頭總成包體1084上建構多種輪緣中之任一者。另外,儘管圖31B中描繪第一列印頭總成對接墊圈1245係圍繞第一列印頭總成開口1242來貼附的,但一般從業人士將瞭解的是,墊圈1245可貼附於第一列印頭總成包體輪緣1088。第一列印頭總成對接墊圈1245可為如前面關於密封框架構件總成所描述之墊圈材料中之任一者。在圖31B之氣體包體總成1010的各種實施例中,第一列印頭總成對接墊圈1245可為充氣式墊圈,諸如墊圈1263。就此而言,第一列印頭總成對接墊圈1245可為如前面關於圖28所描述之充氣式墊圈。如前面所呈現,第一密封件1263可圍繞第一通道1261安裝於第一密封件支撐面板1235的第一外表面1237上。 The first print head assembly package 1084 of FIG. 31B may include a first print head assembly package rim 1088, which may be a first print head assembly opening 1242 and a first base plate assembly 1241 that surround the first print head assembly 'Docking surface. The first print head assembly body rim 1088 can engage the first print head assembly butt washer 1245, which is depicted in FIG. 31B to surround the first print head assembly The opening 1242 is attached. A person of ordinary skill will understand that although the first print head assembly package rim 1088 is shown to project inwardly, a variety of rims can be constructed on the first print head assembly package 1084 Any of them. In addition, although FIG. 31B depicts the first print head assembly butt gasket 1245 being attached around the first print head assembly opening 1242, the general practitioner will understand that the gasket 1245 can be attached to the first Print head assembly package rim 1088. The first print head assembly butt gasket 1245 may be any of the gasket materials as previously described with respect to the sealing frame member assembly. In various embodiments of the gas envelope assembly 1010 of FIG. 31B, the first print head assembly butt gasket 1245 may be an inflatable gasket, such as gasket 1263. In this regard, the first print head assembly butt gasket 1245 may be an air-filled gasket as previously described with respect to FIG. 28. As previously presented, the first seal 1263 may be mounted on the first outer surface 1237 of the first seal support panel 1235 around the first channel 1261.

如圖31B及圖31C中所描繪,對於可在完全自動化的模式下執行之各種維護程序,第一列印頭總成1080可保持定位在第一列印頭總成開口1242上方。就此而言,可藉由第一列印頭總成定位系統1090在Z軸方向上調整第一列印頭總成1080,以便在第一列印頭總成開口1242上方相對於第一維護系統總成1250來定位列印頭裝置1082。另外,可於第一維護系統定位系統1251上在Y-X軸方向上調整第一維護系統總成1250,以便相對於列印頭裝置1082來定位第一維護系統總成1250。在各種維護程序期間,可藉由第一列印頭總成定位系統1090在Z軸方向上所作的進一步調整來將第一列印頭總成1080置放成與第一列印頭總成對接墊圈1245接觸,從而將第一列印頭總成包體1084置放在覆蓋第一列印頭總成開口1242的位置中(未圖示)。如圖31C中所描繪,對於各種維護程序,例如但不限於需要直接接取第一中間維護系統面板總成1230'之內部之維護程序,可藉由第一列印頭總成定位系統1090在Z軸方向上所作的更進一步調整來將第一列印頭總成1080與第一列印頭總成對接墊圈1245對接,從而密封第一列印頭總成開口1242。如前面所提及,第一列印頭總成對接墊圈1245可為如前面關於各種框架構件的氣密式密封所描述之可壓縮墊圈材料,或為如前面關於圖28所描述之充氣式墊圈。另外,如圖31C中所描繪,充氣式墊圈1263可被充氣,藉此密封地封閉第一通道1261。此外,第一列印頭總成包體1084之形成殼體的各部分可如前面關於各種面板總成所描述來建構,以使得框架總成構件及面板能夠提供氣密式包體。因此,對於圖31C,當第一列印頭總成開口1242及第一通道1261被密封地封閉時,可將第一中間維護系統面板總成1230'與氣體包體總成1010之剩餘體積隔離開。 As depicted in FIGS. 31B and 31C, for various maintenance procedures that can be performed in a fully automated mode, the first print head assembly 1080 can remain positioned above the first print head assembly opening 1242. In this regard, the first print head assembly 1080 can be adjusted in the Z-axis direction by the first print head assembly positioning system 1090 so as to be relative to the first maintenance system above the first print head assembly opening 1242 The assembly 1250 positions the print head device 1082. In addition, the first maintenance system assembly 1250 can be adjusted in the Y-X axis direction on the first maintenance system positioning system 1251 to position the first maintenance system assembly 1250 relative to the print head device 1082. During various maintenance procedures, the first print head assembly 1080 can be placed to dock with the first print head assembly by further adjustments made by the first print head assembly positioning system 1090 in the Z-axis direction The gasket 1245 contacts, so that the first print head assembly package 1084 is placed in a position covering the first print head assembly opening 1242 (not shown). As depicted in FIG. 31C, for various maintenance procedures, such as but not limited to the maintenance procedures that require direct access to the interior of the first intermediate maintenance system panel assembly 1230', the first print head assembly positioning system 1090 can be used Further adjustments in the Z-axis direction are made to dock the first print head assembly 1080 with the first print head assembly butt gasket 1245, thereby sealing the first print head assembly opening 1242. As mentioned previously, the first print head assembly butt gasket 1245 may be a compressible gasket material as described above with respect to the airtight seals of various frame members, or an inflatable gasket as described above with respect to FIG. 28 . In addition, as depicted in FIG. 31C, the inflatable gasket 1263 may be inflated, thereby sealingly closing the first passage 1261. In addition, the portions of the first printhead assembly package 1084 that form the housing can be constructed as described above with respect to the various panel assemblies, so that the frame assembly components and panels can provide an airtight package. Therefore, for FIG. 31C, when the first print head assembly opening 1242 and the first channel 1261 are hermetically closed, the first intermediate maintenance system panel assembly 1230' can be isolated from the remaining volume of the gas package assembly 1010 open.

圖31D及圖31E中描繪氣體包體1010之各種實施例,其中第一維護系統總成1250及第二維護系統總成1290可分別安裝於第一維護系統總成平台1253及第二維護系統總成平台1293上。在圖31D及圖31E中,第一維護系統總成平台1253及第二維護系統總成平台1293分別包封在第一中間維護系統面板總成1230'及第二中間維護系統面板總成1270'中。如前面所提及,關於第一中間維護系統面板總成1230'之以下教示亦可適用於第二中間維護系統面板總成1270'。就此而言,如圖31D中所描繪,可利用由第一列印頭總成定位系統1090在Z軸方向上施加之足夠的力來將第一列印頭總成1080與第一列印頭總成對接墊圈1245對接,以使得第一列印頭總成開口1242可被密封。因此,對於圖31D,當第一列印頭總成開口1242被密封地封閉時,可將第一中間維護系統面板總成1230'與氣體包體總成1010之剩餘體積隔離開。 31D and FIG. 31E depict various embodiments of the gas enclosure 1010, wherein the first maintenance system assembly 1250 and the second maintenance system assembly 1290 can be installed on the first maintenance system assembly platform 1253 and the second maintenance system assembly, respectively On the platform 1293. In FIGS. 31D and 31E, the first maintenance system assembly platform 1253 and the second maintenance system assembly platform 1293 are respectively encapsulated in the first intermediate maintenance system panel assembly 1230′ and the second intermediate maintenance system panel assembly 1270′ in. As mentioned earlier, the following teachings regarding the first intermediate maintenance system panel assembly 1230' can also be applied to the second intermediate maintenance system panel assembly 1270'. In this regard, as depicted in FIG. 31D, sufficient force applied in the Z-axis direction by the first print head assembly positioning system 1090 can be used to align the first print head assembly 1080 with the first print head The assembly butt gasket 1245 is butted so that the first print head assembly opening 1242 can be sealed. 31D, when the first print head assembly opening 1242 is hermetically closed, the first intermediate maintenance system panel assembly 1230' can be isolated from the remaining volume of the gas package assembly 1010.

如前面關於圖31A至圖31C的氣體包體總成1010之各種實施例所教示,列印頭在各種維護程序期間可保持定位在第一列印頭總成開口1242上方,而不覆蓋或密封第一列印頭總成開口1242以致於封閉第一列印頭總成開口1242。在氣體包體總成1010之各種實施例中,對於各種維護程序,可藉由調節Z軸來將列印頭總成包體置放成與墊圈接觸,以便覆蓋列印頭總成開口。就此而言,可以兩種方式來解釋圖31E。在第一種解釋中,第一列印頭總成對接墊圈1245及第二列印頭總成對接墊圈1285可由諸如前面關於各種框架構件之氣密式密封所描述之可壓縮墊圈材料製成。在圖31E中,第一列印頭總成1080已在Z軸方向上定位在第一維護系統總成1250上方,以使得墊圈1245已被壓縮,藉此密封地封閉第一列印頭總成開口 1242。相比之下,第二列印頭總成1081已在Z軸方向上定位在第二維護系統總成1290上方,以便與第二列印頭總成對接墊圈1285接觸,藉此密封地覆蓋第二列印頭總成開口1282。在第二種解釋中,第一列印頭總成對接墊圈1245及第二列印頭總成對接墊圈1285可為如前面關於圖28所描述之充氣式墊圈。在圖31E中,第一列印頭總成1080可在Z軸方向上定位在第一維護系統總成1250上方,以便與第一列印頭總成對接墊圈1245接觸,藉此覆蓋第一列印頭總成開口1242。相比之下,第二列印頭總成1081已在Z軸方向上定位在第二維護系統總成1290上方,以使得當第二列印頭總成對接墊圈1285被充氣時,第二列印頭總成開口1282被密封地封閉。 As previously taught with respect to various embodiments of the gas package assembly 1010 of FIGS. 31A to 31C, the print head can remain positioned over the first print head assembly opening 1242 during various maintenance procedures without covering or sealing The first print head assembly opening 1242 is such that the first print head assembly opening 1242 is closed. In various embodiments of the gas package assembly 1010, for various maintenance procedures, the print head assembly package can be placed in contact with the gasket by adjusting the Z axis to cover the print head assembly opening. In this regard, FIG. 31E can be explained in two ways. In the first explanation, the first print head assembly butt gasket 1245 and the second print head assembly butt gasket 1285 may be made of a compressible gasket material such as described above with regard to the airtight seals of various frame members. In FIG. 31E, the first print head assembly 1080 has been positioned above the first maintenance system assembly 1250 in the Z-axis direction so that the gasket 1245 has been compressed, thereby sealingly sealing the first print head assembly Opening 1242. In contrast, the second print head assembly 1081 has been positioned above the second maintenance system assembly 1290 in the Z-axis direction to contact the second print head assembly butt gasket 1285, thereby sealingly covering the first The second print head assembly has an opening 1282. In the second explanation, the first print head assembly butt washer 1245 and the second print head assembly butt washer 1285 may be air-filled washers as previously described with respect to FIG. 28. In FIG. 31E, the first print head assembly 1080 can be positioned above the first maintenance system assembly 1250 in the Z-axis direction so as to contact the first print head assembly butt washer 1245, thereby covering the first row印头总成开1242。 The print head assembly opening 1242. In contrast, the second print head assembly 1081 has been positioned above the second maintenance system assembly 1290 in the Z-axis direction so that when the second print head assembly butt gasket 1285 is inflated, the second row The print head assembly opening 1282 is hermetically closed.

圖31F描繪的是,可使用罩蓋(諸如,例如但不限於閘閥總成)來密封例如使用第一中間維護系統面板總成1230'及第二中間維護系統面板總成1270'來例示之維護體積。關於第一中間維護系統面板總成1230'及第二中間維護系統面板總成1270'之以下教示可適用於維護系統面板總成及氣體包體總成之各種實施例。如圖31F中所描繪,分別使用例如但不限於第一列印頭總成閘閥1247及第二列印頭總成閘閥1287來封閉第一列印頭總成開口1242及第二列印頭總成開口1282可分別提供第一列印頭總成1080及第二列印頭總成1081之連續操作。如關於圖31F的第一中間維護系統面板總成1230'所描繪,使用第一列印頭總成閘閥1247來密封地封閉第一列印頭總成開口1242(如關於圖27A及圖27B所描述)以及密封地封閉底座1070周圍之第一通道1261(如關於圖28所描述)可遠程且自動地完成。類似地,如關於圖31F的第二中間維護系統面板總成1270'所描繪,使用第二列印頭總成閘閥1287來密封地封閉第二列印頭總成開口1282(如關於圖27A及圖 27B所描述)可遠程且自動地完成。預期的是,可藉由隔離例如由第一中間維護系統面板總成1230'及第二中間維護系統面板總成1270'所界定之維護體積來促進各種列印頭維護體積程序,同時仍然提供利用第一列印頭總成1080及第二列印頭總成1081之列印處理的持續。 FIG. 31F depicts that a cover (such as, for example, but not limited to, a gate valve assembly) can be used to seal maintenance such as exemplified using the first intermediate maintenance system panel assembly 1230′ and the second intermediate maintenance system panel assembly 1270′ volume. The following teachings regarding the first intermediate maintenance system panel assembly 1230' and the second intermediate maintenance system panel assembly 1270' can be applied to various embodiments of the maintenance system panel assembly and the gas package assembly. As depicted in FIG. 31F, for example, but not limited to, the first print head assembly gate valve 1247 and the second print head assembly gate valve 1287 are used to close the first print head assembly opening 1242 and the second print head assembly, respectively. The opening 1282 can provide continuous operation of the first print head assembly 1080 and the second print head assembly 1081, respectively. As described with respect to the first intermediate maintenance system panel assembly 1230' of FIG. 31F, the first print head assembly gate valve 1247 is used to sealingly close the first print head assembly opening 1242 (as described with respect to FIGS. 27A and 27B Description) and hermetically closing the first channel 1261 around the base 1070 (as described with respect to FIG. 28) can be done remotely and automatically. Similarly, as described with respect to the second intermediate maintenance system panel assembly 1270' of FIG. 31F, the second print head assembly gate valve 1287 is used to sealingly close the second print head assembly opening 1282 (as with FIG. 27A and (Described in FIG. 27B) can be done remotely and automatically. It is expected that various printhead maintenance volume procedures can be facilitated by isolating the maintenance volume defined by, for example, the first intermediate maintenance system panel assembly 1230' and the second intermediate maintenance system panel assembly 1270' while still providing utilization The printing process of the first print head assembly 1080 and the second print head assembly 1081 continues.

如前面所提及,可分別圍繞第一列印頭總成開口1242及第二列印頭總成開口1282貼附第一列印頭總成對接墊圈1245及第二列印頭總成對接墊圈1285。另外,如圖31F中所描繪,可分別圍繞第一列印頭總成包體輪緣1088及第二列印頭總成包體輪緣1089貼附第一列印頭總成對接墊圈1245及第二列印頭總成對接墊圈1285。當指示第一列印頭總成1080及第二列印頭總成1081之維護時,第一列印頭總成閘閥1247及第二列印頭總成閘閥1287可打開,且第一列印頭總成1080及第二列印頭總成1081可如前面所描述與第一中間維護系統面板總成1230'及第二中間維護系統面板總成1270'對接。 As mentioned earlier, the first print head assembly butt gasket 1245 and the second print head assembly butt gasket can be attached around the first print head assembly opening 1242 and the second print head assembly opening 1282, respectively 1285. In addition, as depicted in FIG. 31F, the first print head assembly butt gasket 1245 and the first print head assembly body rim 1088 and the second print head assembly body rim 1089 can be respectively attached The second print head assembly butt washer 1285. When the maintenance of the first print head assembly 1080 and the second print head assembly 1081 is instructed, the first print head assembly gate valve 1247 and the second print head assembly gate valve 1287 can be opened, and the first print The head assembly 1080 and the second print head assembly 1081 can be docked with the first intermediate maintenance system panel assembly 1230' and the second intermediate maintenance system panel assembly 1270' as described above.

例如但不限於,可在不中斷列印處理之情況下分別藉由隔離第一中間維護系統面板總成1230'及第二中間維護系統面板總成1270'來完成可在第一維護系統總成1250及第二維護系統總成1290上提供維護之任何維護程序。進一步預期的是,可在不中斷列印處理之情況下分別藉由隔離第一中間維護系統面板總成1230'及第二中間維護系統面板總成1270'來完成以下操作:將新列印頭或列印頭總成裝載至系統中,或自系統中移除列印頭或列印頭總成。可例如但不限於藉由使用機器人來自動地促進此等活動。例如但不限於,可完成對儲存在維護體積(諸如圖31F之第一中間維護系統面板總成1230'及第二中間維護系統面板總成1270')中之列印頭的自動取 回,隨後將第一列印頭總成1080之列印頭裝置1082上或第二列印頭總成1081之列印頭裝置1083上的故障列印頭自動更換為起作用之列印頭。此後可將故障列印頭自動沈積至位於第一維護系統總成1250或第二維護系統總成1290中的模組中。可在不中斷正在進行之列印處理的情況下在自動化模式下執行此等維護程序。 For example, but not limited to, the first maintenance system assembly can be completed by isolating the first intermediate maintenance system panel assembly 1230' and the second intermediate maintenance system panel assembly 1270' without interrupting the printing process 1250 and the second maintenance system assembly 1290 provide any maintenance procedures for maintenance. It is further expected that the following operations can be accomplished by isolating the first intermediate maintenance system panel assembly 1230' and the second intermediate maintenance system panel assembly 1270' without interrupting the printing process: Or the print head assembly is loaded into the system, or the print head or print head assembly is removed from the system. Such activities can be promoted automatically, for example, but not limited to, by using robots. For example, but not limited to, the automatic retrieval of the print heads stored in the maintenance volume (such as the first intermediate maintenance system panel assembly 1230' and the second intermediate maintenance system panel assembly 1270' of FIG. 31F) can be completed, and then Automatically replace the faulty print head on the print head device 1082 of the first print head assembly 1080 or the print head device 1083 of the second print head assembly 1081 with the active print head. Thereafter, the faulty print head can be automatically deposited into the module located in the first maintenance system assembly 1250 or the second maintenance system assembly 1290. These maintenance procedures can be performed in automated mode without interrupting the ongoing printing process.

在將故障列印頭自動沈積於第一維護系統總成1250或第二維護系統總成1290中之後,可藉由分別使用例如但不限於第一列印頭總成閘閥1247及第二列印頭總成閘閥1287封閉第一列印頭總成開口1242及第二列印頭總成開口1282來分別密封地封閉及隔離維護體積(諸如第一中間維護系統面板總成1230'及第二中間維護系統面板總成1270')。此外,隨後可根據先前教示例如通過個別的中間維護系統面板總成開口而將維護體積(諸如第一中間維護系統面板總成1230'及第二中間維護系統面板總成1270')向大氣開放,以使得可取回及替換故障列印頭。如隨後將更為詳細地討論,因為氣體淨化系統之各種實施例係針對整個氣體包體總成之體積來設計,所以氣體淨化資源可專門用來沖洗維護體積空間之已顯著減小的體積,藉此顯著減少維護體積之系統復原時間。就此而言,可在不中斷正在進行之列印處理或對正在進行之列印處理造成最少中斷的情況下執行需要將維護體積向大氣開放之維護程序。 After the faulty print head is automatically deposited in the first maintenance system assembly 1250 or the second maintenance system assembly 1290, the gate valve 1247 and the second print of the first print head assembly can be used by, for example but not limited to, The head assembly gate valve 1287 closes the first print head assembly opening 1242 and the second print head assembly opening 1282 to sealingly close and isolate the maintenance volume (such as the first intermediate maintenance system panel assembly 1230' and the second intermediate Maintenance system panel assembly 1270'). In addition, the maintenance volume (such as the first intermediate maintenance system panel assembly 1230' and the second intermediate maintenance system panel assembly 1270') can then be opened to the atmosphere according to the previous teaching example, such as through individual intermediate maintenance system panel assembly openings, So that the faulty print head can be retrieved and replaced. As will be discussed in more detail later, because the various embodiments of the gas purification system are designed for the volume of the entire gas enclosure assembly, the gas purification resources can be specifically used to flush and maintain the volume of the volume that has been significantly reduced, This significantly reduces the system recovery time of the maintenance volume. In this regard, maintenance procedures that require the maintenance volume to be open to the atmosphere can be performed without interrupting the ongoing printing process or causing the least interruption to the ongoing printing process.

圖32描繪根據本教示之氣體包體總成及系統的各種實施例之第一維護系統總成1250的擴展視圖。如前面所討論,維護系統可包括:例如但不限於用於執行各種列印頭校準程序之液滴校準台;用於在沖洗或起動程序期間收集及圍阻自列印頭射出之墨水的沖洗台;以及用於在已於 沖洗台處執行沖洗或起動程序之後移除多餘墨水的吸墨台。另外,維護系統可包括用於以下操作之一或多個台:用於接納已自第一列印頭總成1080及第二列印頭總成1081移除之一或多個列印頭或列印頭裝置,或用於儲存可在維護程序期間裝載至第一列印頭總成1080及第二列印頭總成1081中的列印頭或列印頭裝置。 32 depicts an expanded view of the first maintenance system assembly 1250 according to various embodiments of the gas enclosure assembly and system of the present teachings. As previously discussed, the maintenance system may include: for example, but not limited to, a droplet calibration station used to perform various print head calibration procedures; used to collect and contain the flushing of ink ejected from the print head during the flushing or start-up procedure Station; and an ink absorbing station for removing excess ink after a rinsing or starting procedure has been performed at the station. In addition, the maintenance system may include one or more stations for receiving one or more print heads that have been removed from the first print head assembly 1080 and the second print head assembly 1081 or A print head device, or used to store a print head or print head device that can be loaded into the first print head assembly 1080 and the second print head assembly 1081 during a maintenance procedure.

根據本教示之維護系統總成的各種實施例(諸如圖32之第一維護系統總成1250)可包括液滴校準模組1252、沖洗盆模組1254及吸墨模組1256。第一維護系統總成1250可安裝於第一維護系統定位系統1251上。第一維護系統定位系統1251可提供Y軸移動來選擇性地將各種模組中之每一者以及列印頭總成與第一列印頭總成開口1242對準,其中該列印頭總成具有配備至少一個列印頭之列印頭裝置,諸如圖31B之列印頭裝置1082。各種模組以及列印頭總成的定位可使用維護系統定位系統1251及第一列印頭總成定位系統1090之組合來完成,其中該列印頭總成具有配備至少一個列印頭之列印頭裝置。維護系統定位系統1252可提供第一維護系統總成1250的各種模組相對於第一列印頭總成開口1242之Y-X定位,而第一列印頭總成定位系統1090可提供第一列印頭總成1080在第一列印頭總成開口1242上方之X-Z定位。就此而言,配備至少一個列印頭之列印頭裝置可定位在第一列印頭總成開口1242上方或其中來接受維護。 Various embodiments of the maintenance system assembly according to the present teachings (such as the first maintenance system assembly 1250 of FIG. 32) may include a droplet calibration module 1252, a rinse basin module 1254, and an ink absorption module 1256. The first maintenance system assembly 1250 may be installed on the first maintenance system positioning system 1251. The first maintenance system positioning system 1251 can provide Y-axis movement to selectively align each of the various modules and the print head assembly with the first print head assembly opening 1242, where the print head assembly It has a print head device equipped with at least one print head, such as the print head device 1082 of FIG. 31B. The positioning of the various modules and the print head assembly can be accomplished using a combination of the maintenance system positioning system 1251 and the first print head assembly positioning system 1090, where the print head assembly has a row equipped with at least one print head Print head device. The maintenance system positioning system 1252 can provide YX positioning of the various modules of the first maintenance system assembly 1250 relative to the first print head assembly opening 1242, and the first print head assembly positioning system 1090 can provide the first printing The head assembly 1080 is positioned at XZ above the opening 1242 of the first print head assembly. In this regard, a print head device equipped with at least one print head can be positioned above or in the first print head assembly opening 1242 for maintenance.

圖33例示第一中間維護系統面板總成1230'之擴展透視圖,其中描繪被封蓋且具有手套之手套埠。如所展示,預期的是,諸如第一中間維護系統面板總成1230'之各種維護系統面板總成的體積可為約2m3。預期的是,維護系統面板總成之各種實施例可具有約1m3之體積,而在維護 系統面板總成之各種實施例中,該體積可為約10m3。對於氣體包體總成之各種實施例,諸如圖29之氣體包體總成1010,框架構件總成區段可小於或等於氣體包體總成之總體積的約1%。在氣體包體總成之各種實施例中,框架構件總成區段可小於或等於氣體包體總成之總體積的約2%。在氣體包體總成之各種實施例中,框架構件總成區段可小於或等於氣體包體總成之總體積的約10%。對於氣體包體總成之各種實施例,框架構件總成區段可小於或等於氣體包體總成之總體積的約50%。 FIG. 33 illustrates an expanded perspective view of the first intermediate maintenance system panel assembly 1230′, which depicts a covered glove port with gloves. As illustrated, it is contemplated that the various systems, such as maintenance of the first intermediate panel assembly 1230 'of the panel assembly of the maintenance system may be about the volume of 2m 3. It is expected that various embodiments of the maintenance system panel assembly may have a volume of about 1 m 3 , and in various embodiments of the maintenance system panel assembly, the volume may be about 10 m 3 . For various embodiments of the gas enclosure assembly, such as the gas enclosure assembly 1010 of FIG. 29, the frame member assembly section may be less than or equal to about 1% of the total volume of the gas enclosure assembly. In various embodiments of the gas enclosure assembly, the frame member assembly section may be less than or equal to about 2% of the total volume of the gas enclosure assembly. In various embodiments of the gas enclosure assembly, the frame member assembly section may be less than or equal to about 10% of the total volume of the gas enclosure assembly. For various embodiments of the gas enclosure assembly, the frame member assembly section may be less than or equal to about 50% of the total volume of the gas enclosure assembly.

根據本教示之氣體包體總成及系統可具有在氣體包體總成內部的氣體循環及過濾系統。此內部過濾系統可具有在內部中之複數個風扇過濾單元,且可經組配來在內部中提供氣體的層流。該層流可在自內部之頂部至內部之底部的方向上,或在任何其他方向上。儘管藉由循環系統所產生之氣流無需為層狀的,但氣體之層流可用來確保內部中之氣體之徹底及完全的翻轉。氣體之層流亦可用來將紊流最小化,此紊流係不受歡迎的,因為其可導致環境中之粒子在此等紊流區域中聚集,從而阻礙過濾系統自環境中移除彼等粒子。此外,為了在內部中維持所需之溫度,可提供利用複數個熱交換器之熱調節系統,其例如與風扇或另一氣體循環裝置一起操作、相鄰或結合使用。氣體淨化迴路可經組配來使來自氣體包體總成之內部的氣體循環通過在包體外部的至少一個氣體淨化組件。就此而言,在氣體包體總成內部的過濾及循環系統與在氣體包體總成外部的氣體淨化迴路相結合,可在整個氣體包體總成中提供大致上低微粒的惰性氣體之連續循環,該惰性氣體具有大致上低含量之反應性物種。氣體淨化系統可經組配來維持不需要的成分之極低含量,該等成分例如有機溶劑及其蒸汽, 以及水、水蒸汽、氧氣及類似物。 The gas enclosure assembly and system according to the teachings may have a gas circulation and filtration system inside the gas enclosure assembly. This internal filtration system may have multiple fan filtration units in the interior, and may be configured to provide laminar flow of gas in the interior. The laminar flow may be in the direction from the top of the interior to the bottom of the interior, or in any other direction. Although the gas flow generated by the circulation system does not need to be laminar, the laminar flow of gas can be used to ensure the complete and complete turning of the gas in the interior. The laminar flow of gas can also be used to minimize turbulence. This turbulence is undesirable because it can cause particles in the environment to accumulate in these turbulent areas, which prevents the filtration system from removing them from the environment. particle. In addition, in order to maintain a desired temperature in the interior, a heat regulation system using a plurality of heat exchangers can be provided, which operates, for example, in conjunction with a fan or another gas circulation device, adjacent or in combination. The gas purification circuit may be configured to circulate gas from inside the gas enclosure assembly through at least one gas purification assembly outside the enclosure. In this regard, the combination of the filtration and circulation system inside the gas envelope assembly and the gas purification circuit outside the gas envelope assembly can provide a continuous flow of substantially low particulate inert gas throughout the gas envelope assembly Circulating, the inert gas has a substantially low content of reactive species. The gas purification system can be configured to maintain extremely low levels of undesirable components, such as organic solvents and their vapors, as well as water, water vapor, oxygen, and the like.

圖34A為展示氣體包體總成及系統2100之示意圖。氣體包體總成及系統2100之各種實施例可包含根據本教示之氣體包體總成1500、與氣體包體總成1500流體連通之氣體淨化迴路2130以及至少一個熱調節系統2140。另外,氣體包體總成之各種實施例可具有加壓惰性氣體再循環系統2169,該加壓惰性氣體再循環系統可供應惰性氣體來操作各種裝置,該等裝置諸如用於OLED列印系統之基板漂浮台。如隨後將更為詳細地討論,加壓惰性氣體再循環系統2169可利用壓縮機、鼓風機及兩者之組合作為用於惰性氣體再循環系統2169之各種實施例的源頭。另外,氣體包體總成及系統2100可具有在氣體包體總成及系統2100內部的過濾及循環系統(未圖示)。 FIG. 34A is a schematic diagram showing the gas envelope assembly and the system 2100. FIG. Various embodiments of the gas enclosure assembly and system 2100 may include a gas enclosure assembly 1500 according to the present teachings, a gas purification circuit 2130 in fluid communication with the gas enclosure assembly 1500, and at least one thermal regulation system 2140. In addition, various embodiments of the gas envelope assembly may have a pressurized inert gas recirculation system 2169 that can supply inert gas to operate various devices, such as those used in OLED printing systems Substrate floating table. As will be discussed in more detail later, the pressurized inert gas recirculation system 2169 can utilize a compressor, a blower, and a combination of both as a source for various embodiments of the inert gas recirculation system 2169. In addition, the gas envelope assembly and system 2100 may have a filtration and circulation system (not shown) inside the gas envelope assembly and system 2100.

對於根據本教示之氣體包體總成的各種實施例,管道之設計可將循環通過圖34A之氣體淨化迴路2130之惰性氣體與對於氣體包體總成之各種實施例係在內部被持續過濾及循環的惰性氣體分開。氣體淨化迴路2130包括出口線路2131,該出口線路係自氣體包體總成1500至溶劑移除組件2132,且隨後至氣體淨化系統2134。已淨化而不含溶劑及諸如氧氣及水蒸汽之其他反應性氣體物種的惰性氣體隨後經由入口線路2133被傳回至氣體包體總成1500。氣體淨化迴路2130亦可包括適當之導管及連接件以及感測器,例如氧氣、水蒸汽及溶劑蒸汽感測器。可在例如氣體淨化系統2134中單獨地提供或整合諸如風扇、鼓風機或馬達及類似物之氣體循環單元,以便使氣體循環通過氣體淨化迴路2130。根據氣體包體總成之各種實施例,儘管圖33中所展示之示意圖中將溶劑移除系統2132及氣體淨化系統 2134展示為獨立的單元,但溶劑移除系統2132及氣體淨化系統2134可作為單個淨化單元封裝在一起。熱調節系統2140可包括至少一個急冷器(chiller)2141,該急冷器可具有用於將冷卻劑循環至氣體包體總成中之流體出口線路2143以及用於將冷卻劑傳回至急冷器中之流體入口線路2145。 For various embodiments of the gas inclusion assembly according to the present teachings, the design of the pipeline can circulate the inert gas through the gas purification circuit 2130 of FIG. 34A and the various embodiments for the gas inclusion assembly are continuously filtered and The circulating inert gas is separated. The gas purification circuit 2130 includes an outlet line 2131 from the gas envelope assembly 1500 to the solvent removal assembly 2132, and then to the gas purification system 2134. The inert gas that has been purified without solvents and other reactive gas species such as oxygen and water vapor is then passed back to the gas envelope assembly 1500 via the inlet line 2133. The gas purification circuit 2130 may also include appropriate conduits and connectors and sensors, such as oxygen, water vapor, and solvent vapor sensors. Gas circulation units such as fans, blowers or motors, and the like may be separately provided or integrated in, for example, the gas purification system 2134 to circulate the gas through the gas purification circuit 2130. According to various embodiments of the gas inclusion assembly, although the schematic diagram shown in FIG. 33 shows the solvent removal system 2132 and the gas purification system 2134 as separate units, the solvent removal system 2132 and the gas purification system 2134 can be used as The individual purification units are packaged together. The heat regulation system 2140 may include at least one chiller 2141, which may have a fluid outlet line 2143 for circulating the coolant into the gas envelope assembly and for returning the coolant to the quench之fluid inlet line 2145.

圖34A之氣體淨化迴路2130可具有置放在氣體淨化系統2134上游之溶劑移除系統2132,以使得自氣體包體總成1500所循環之惰性氣體經由出口線路2131通過溶劑移除組件2132。根據各種實施例,溶劑移除系統2132可為溶劑截留系統,該系統係基於自通過圖34A之溶劑移除系統2132的惰性氣體吸附溶劑蒸汽。例如但不限於諸如活性炭、分子篩及類似物的吸附劑之一或多個床層可有效地移除多種有機溶劑蒸汽。對於氣體包體總成之各種實施例,在溶劑移除系統2132中可採用冷阱技術來移除溶劑蒸汽。如前面所提及,對於根據本教示之氣體包體總成的各種實施例,諸如氧氣、水蒸汽及溶劑蒸汽感測器之感測器可用來監測此等物種自連續循環通過氣體包體總成系統(諸如圖34之氣體包體總成系統2100)的惰性氣體之有效移除。溶劑移除系統之各種實施例可指示諸如活性炭、分子篩及類似物之吸附劑何時已達到容量,以使得可再生或替換吸附劑之該或該等床層。分子篩之再生可涉及加熱分子篩、使分子篩與合成氣體(forming gas)接觸,及其組合以及類似物。經組配來截留包括氧氣、水蒸汽及溶劑之各種物種的分子篩可藉由加熱及曝露於包含氫氣之合成氣體來再生,該合成氣體例如為包含約96%氮氣及4%氫氣之合成氣體,其中該等百分比係以體積計或以重量計。活性炭之實體再生可使用在惰性環境下加熱之類似程序來完成。 The gas purification circuit 2130 of FIG. 34A may have a solvent removal system 2132 placed upstream of the gas purification system 2134 so that the inert gas circulated from the gas envelope assembly 1500 passes through the solvent removal assembly 2132 via the outlet line 2131. According to various embodiments, the solvent removal system 2132 may be a solvent retention system based on the adsorption of solvent vapor from the inert gas passing through the solvent removal system 2132 of FIG. 34A. For example, but not limited to, one or more beds of adsorbents such as activated carbon, molecular sieves, and the like can effectively remove a variety of organic solvent vapors. For various embodiments of the gas inclusion assembly, cold trap technology may be used in the solvent removal system 2132 to remove solvent vapor. As mentioned previously, for various embodiments of the gas inclusion assembly according to the teachings, sensors such as oxygen, water vapor, and solvent vapor sensors can be used to monitor the continuous circulation of these species through the gas inclusion assembly Effective removal of inert gas into a system, such as the gas inclusion assembly system 2100 of FIG. 34. Various embodiments of the solvent removal system can indicate when adsorbents such as activated carbon, molecular sieves, and the like have reached capacity so that the bed or beds of adsorbent can be regenerated or replaced. The regeneration of molecular sieves may involve heating the molecular sieves, contacting the molecular sieves with forming gas, and combinations thereof and the like. Molecular sieves that are combined to trap various species including oxygen, water vapor, and solvents can be regenerated by heating and exposure to a synthesis gas containing hydrogen, such as synthesis gas containing about 96% nitrogen and 4% hydrogen, These percentages are based on volume or weight. The physical regeneration of activated carbon can be accomplished using a similar procedure of heating in an inert environment.

任何合適之氣體淨化系統可用於圖34A之氣體淨化迴路2130的氣體淨化系統2134。例如可自MBRAUN公司(Statham,New Hampshire)或Innovative Technology of Amesbury公司(Massachusetts)購得的氣體淨化系統可用於整合至本教示之氣體包體總成的各種實施例中。氣體淨化系統2134可用來淨化氣體包體總成及系統2100中之一或多種惰性氣體,例如淨化氣體包體總成中之整個氣體氣氛。如前面所提及,為了使氣體循環通過氣體淨化迴路2130,氣體淨化系統2134可具有氣體循環單元,諸如風扇、鼓風機或馬達以及類似物。就此而言,可取決於包體之體積來選擇氣體淨化系統,該體積可界定用於使惰性氣體移動通過氣體淨化系統之體積流率。對於具有體積達約4m3之氣體包體總成的氣體包體總成及系統之各種實施例;可使用可移動約84m3/h之氣體淨化系統。對於具有體積達約10m3之氣體包體總成的氣體包體總成及系統之各種實施例;可使用可移動約155m3/h之氣體淨化系統。對於體積介於約52-114m3之間的氣體包體總成之各種實施例,可使用一個以上的氣體淨化系統。 Any suitable gas purification system may be used for the gas purification system 2134 of the gas purification circuit 2130 of FIG. 34A. For example, gas purification systems available from MBRAUN (Statham, New Hampshire) or Innovative Technology of Amesbury (Massachusetts) can be used in various embodiments integrated into the gas envelope assembly of the present teachings. The gas purification system 2134 can be used to purify one or more inert gases in the gas envelope assembly and the system 2100, for example, to purify the entire gas atmosphere in the gas envelope assembly. As mentioned previously, in order to circulate gas through the gas purification circuit 2130, the gas purification system 2134 may have a gas circulation unit, such as a fan, a blower, or a motor, and the like. In this regard, the gas purification system may be selected depending on the volume of the envelope, which volume may define the volume flow rate used to move the inert gas through the gas purification system. For the various embodiments of body assembly and having a gas bag system of a volume of up to about 4m 3 of the gas bag body assembly; using a movable about 84m 3 / h of gas cleaning system. For various embodiments of the gas envelope assembly and system having a gas envelope assembly with a volume of about 10 m 3 ; a gas purification system that can move about 155 m 3 /h can be used. For various embodiments of gas inclusion assemblies having a volume between about 52-114 m 3 , more than one gas purification system may be used.

本教示之氣體淨化系統2134中可包括任何合適之氣體過濾器或淨化裝置。在一些實施例中,氣體淨化系統可包含兩個平行的淨化裝置,以使得該等裝置中之一者可自線路上取下以便進行維護,且另一裝置可用來繼續系統操作而不中斷。在一些實施例中,例如,氣體淨化系統可包含一或多個分子篩。在一些實施例中,氣體淨化系統可至少包含第一分子篩以及第二分子篩,以使得當該等分子篩中之一者變得雜質飽和時或另外被視為不足以有效地操作時,該系統可切換至另一分子篩,同時再生該飽和的或無效率的分子篩。可提供控制單元,此控制單元係用於確定每一 分子篩之操作效率,用於在不同分子篩之操作之間切換,用於再生一或多個分子篩,或用於其組合。如前面所提及,可再生及重複使用分子篩。 The gas purification system 2134 of this teaching may include any suitable gas filter or purification device. In some embodiments, the gas purification system may include two parallel purification devices so that one of the devices can be removed from the line for maintenance, and the other device can be used to continue system operation without interruption. In some embodiments, for example, the gas purification system may include one or more molecular sieves. In some embodiments, the gas purification system may include at least a first molecular sieve and a second molecular sieve so that when one of the molecular sieves becomes saturated with impurities or otherwise deemed insufficient to operate efficiently, the system may Switch to another molecular sieve while regenerating the saturated or inefficient molecular sieve. A control unit can be provided, which is used to determine the operating efficiency of each molecular sieve, to switch between the operations of different molecular sieves, to regenerate one or more molecular sieves, or to combine them. As mentioned earlier, molecular sieves can be regenerated and reused.

關於圖34A之熱調節系統2140,可提供至少一個流體急冷器2141,用來冷卻氣體包體總成及系統2100中之氣體氣氛。對於本教示之氣體包體總成的各種實施例,流體急冷器2141將冷卻的流體輸送至包體中之熱交換器,其中使惰性氣體通過在該包體內部之過濾系統。亦可為氣體包體總成及系統2100提供至少一個流體急冷器,用來冷卻由包封在氣體包體2100中之設備產生的熱量。例如但不限於,亦可為氣體包體總成及系統2100提供至少一個流體冷卻機,用來冷卻由OLED列印系統產生的熱量。熱調節系統2140可包含熱交換裝置或帕耳帖(Peltier)裝置,且可具有各種冷卻能力。例如,對於氣體包體總成及系統之各種實施例,急冷器可提供約2kW至約20kW之冷卻能力。流體急冷器1136及1138可急冷一或多種流體。在一些實施例中,該等流體急冷器可利用多種流體作為冷卻劑,例如但不限於作為熱交換流體的水、防凍劑、製冷劑及其組合。適當之無洩漏的鎖定連接件可用於連接相關聯之導管及系統組件。 Regarding the thermal conditioning system 2140 of FIG. 34A, at least one fluid quench 2141 can be provided for cooling the gas envelope assembly and the gas atmosphere in the system 2100. For the various embodiments of the gas enclosure assembly of the present teachings, the fluid quench 2141 delivers the cooled fluid to the heat exchanger in the enclosure, where the inert gas is passed through the filter system inside the enclosure. The gas envelope assembly and the system 2100 may also be provided with at least one fluid quench to cool the heat generated by the equipment enclosed in the gas envelope 2100. For example, but not limited to, at least one fluid cooler may be provided for the gas package assembly and the system 2100 to cool the heat generated by the OLED printing system. The heat regulation system 2140 may include a heat exchange device or a Peltier device, and may have various cooling capabilities. For example, for various embodiments of gas envelope assemblies and systems, the quench can provide a cooling capacity of about 2 kW to about 20 kW. Fluid quenches 1136 and 1138 can quench one or more fluids. In some embodiments, the fluid quenchers may utilize multiple fluids as coolants, such as, but not limited to, water, antifreeze, refrigerants, and combinations thereof as heat exchange fluids. Appropriate leak-free locking connectors can be used to connect the associated catheters and system components.

如關於圖23及圖24的氣體包體總成1000或關於圖29及圖30之氣體包體總成1010所描繪之氣體包體總成的各種實施例可具有界定第一體積之第一框架構件總成區段以及界定第二體積之第二框架構件總成區段,其中每一體積可與另一體積分開。對於圖23及圖24的氣體包體總成1000之各種實施例,或對於圖29及圖30之氣體包體總成1010,關於圖34A之氣體包體總成所描述之所有系統特徵可被包括作為此等實施例之系統特徵,此等實施例具有界定第一體積之第一框架構件總成區段以及界定第二 體積之第二框架構件總成區段,其中每一體積可與另一體積分開。另外,如圖34B中關於氣體總成及系統2100所描繪,對於具有界定第一體積之第一框架構件總成區段以及界定第二體積之第二框架構件總成區段的氣體包體總成之各種實施例,可使每一體積與氣體淨化迴路2130單獨流體連通。 Various embodiments of the gas inclusion assembly as depicted with respect to the gas inclusion assembly 1000 of FIGS. 23 and 24 or with respect to the gas inclusion assembly 1010 of FIGS. 29 and 30 may have a first frame defining a first volume A component assembly section and a second frame component assembly section defining a second volume, where each volume can be separated from another volume. For various embodiments of the gas inclusion assembly 1000 of FIGS. 23 and 24, or for the gas inclusion assembly 1010 of FIGS. 29 and 30, all the system features described with respect to the gas inclusion assembly of FIG. 34A can be Including the system features as these embodiments, these embodiments have a first frame member assembly section defining a first volume and a second frame member assembly section defining a second volume, where each volume can be One volume separates. In addition, as depicted in FIG. 34B with respect to the gas assembly and system 2100, for the gas envelope assembly having a first frame member assembly section defining a first volume and a second frame member assembly section defining a second volume In various embodiments, each volume can be individually in fluid communication with the gas purification circuit 2130.

如圖34B中所描繪,氣體包體總成及系統2100之氣體包體總成1500可具有界定第一體積之第一框架構件總成區段1500-S1及界定第二體積之第二框架構件總成區段1500-S2。若所有閥V1、V2、V3及V4打開,則氣體淨化迴路2130基本上如前面關於圖34A的氣體包體總成及系統1500所描述來操作。在V3及V4之封閉的情況下,僅第一框架構件總成區段1500-S1與氣體淨化迴路2130流體連通。此閥狀態可例如但不限於在需要第二框架構件總成區段1500-S2向大氣開放的維護處理期間密封地封閉第二框架構件總成區段1500-S2並藉此將其與框架構件總成區段1500-S1隔離開時使用。在V1及V2封閉的情況下,僅第二框架構件總成區段1500-S2與氣體淨化迴路2130流體連通。此閥狀態可例如但不限於在第二框架構件總成區段1500-S2已向大氣開放之後的該區段的復原期間使用。如前面所提及,對氣體淨化迴路2130之要求係針對氣體包體總成1500之總體積來規定的。因此,藉由將氣體淨化系統之資源專門用於諸如第二框架構件總成區段1500-S2的框架構件總成區段之復原,可大大減少復原時間,其中圖34B中描繪該第二框架構件總成區段之體積顯著小於氣體包體1500之總體積。 As depicted in FIG. 34B, the gas enclosure assembly and the gas enclosure assembly 1500 of the system 2100 may have a first frame member assembly section 1500-S1 defining a first volume and a second frame member defining a second volume Assembly section 1500-S2. If all of the valves V 1, V 2, V 3 and V 4 is opened, the gas purification circuit 2130 operates substantially 1500 as previously described gas bag assembly and body of the system with respect to Figure 34A. With V 3 and V 4 closed, only the first frame member assembly section 1500-S1 is in fluid communication with the gas purification circuit 2130. This valve state may be, for example but not limited to, hermetically closing the second frame member assembly section 1500-S2 during a maintenance process that requires the second frame member assembly section 1500-S2 to be open to the atmosphere and thereby connecting it with the frame member Used when the assembly section 1500-S1 is isolated. With V 1 and V 2 closed, only the second frame member assembly section 1500-S2 is in fluid communication with the gas purification circuit 2130. This valve state may be used, for example, but not limited to, during the recovery of the second frame member assembly section 1500-S2 after the section has been opened to the atmosphere. As mentioned earlier, the requirements for the gas purification circuit 2130 are specified for the total volume of the gas envelope assembly 1500. Therefore, by dedicating the resources of the gas purification system to the restoration of the frame member assembly section such as the second frame member assembly section 1500-S2, the recovery time can be greatly reduced, wherein the second frame is depicted in FIG. 34B The volume of the component assembly section is significantly smaller than the total volume of the gas envelope 1500.

如圖35及圖36中所描繪,該或該等風扇過濾單元可經組配來提供通過內部之氣體的大致層流。根據本教示之氣體包體總成的各種實施例,一或多個風扇單元佈置成與氣體氣氛包體之第一內部表面相鄰,且 該或該等管道入口佈置成與氣體氣氛包體之第二對立內部表面相鄰。例如,氣體氣氛包體可包含內部天花板及底部內部外圍,該或該等風扇單元可佈置成與該內部天花板相鄰,且該或該等管道入口可包含佈置成與該底部內部外圍相鄰之複數個入口開口,該複數個入口開口係如圖15至圖17中所展示的管道系統(ductwork system)之一部分。 As depicted in FIGS. 35 and 36, the fan filter unit(s) can be configured to provide a substantial laminar flow of gas through the interior. According to various embodiments of the gas enclosure assembly of the present teachings, one or more fan units are arranged adjacent to the first inner surface of the gas atmosphere enclosure, and the duct inlet or inlets are arranged to The second opposing inner surface is adjacent. For example, the gas atmosphere enclosure may include an inner ceiling and a bottom inner periphery, the fan unit(s) may be arranged adjacent to the inner ceiling, and the duct inlet(s) may include an arrangement adjacent to the bottom inner periphery A plurality of inlet openings, which are part of a ductwork system as shown in FIGS. 15-17.

圖35係沿根據本教示之各種實施例的氣體包體總成及系統2200之長度截取的橫截面圖。圖35之氣體包體總成及系統2200可包括:可封裝OLED列印系統50之氣體包體1500,以及氣體淨化系統2130(亦參見圖34)、熱調節系統2140、過濾及循環系統2150以及管道系統2170。熱調節系統2140可包括流體急冷器2141,該流體急冷器與急冷器出口線路2143及急冷器入口線路2145流體連通。經急冷之流體可退出流體急冷器2141,流過急冷器出口線路2143,且可被輸送至熱交換器,對於如圖35中所展示的氣體包體總成及系統之各種實施例,該等熱交換器可定位成靠近複數個風扇過濾單元中之每一者。可經由急冷器入口線路2145將流體自靠近風扇過濾單元之熱交換器傳回至急冷器2141,以便將流體維持在恆定之所需溫度。如前面所提及,急冷器出口線路2141及急冷器入口線路2143與複數個熱交換器流體連通,該複數個熱交換器包括第一熱交換器2142、第二熱交換器2144及第三熱交換器2146。根據如圖34中所展示之氣體包體總成及系統的各種實施例,第一熱交換器2142、第二熱交換器2144及第三熱交換器2146分別與過濾系統2150之第一風扇過濾單元2152、第二風扇過濾單元2154及第三風扇過濾單元2156熱連通。 35 is a cross-sectional view taken along the length of the gas envelope assembly and system 2200 according to various embodiments of the present teachings. The gas package assembly and system 2200 of FIG. 35 may include: a gas package 1500 that can encapsulate the OLED printing system 50, and a gas purification system 2130 (see also FIG. 34), a thermal regulation system 2140, a filtration and circulation system 2150, and Piping system 2170. The thermal regulation system 2140 may include a fluid quench 2141 that is in fluid communication with the quench outlet line 2143 and the quench inlet line 2145. The quenched fluid can exit the fluid quench 2141, flow through the quench outlet line 2143, and can be transported to the heat exchanger. For various embodiments of the gas envelope assembly and system as shown in FIG. 35, these The heat exchanger may be located close to each of the plurality of fan filter units. The fluid can be returned from the heat exchanger near the fan filter unit to the quench 2141 via the quench inlet line 2145 in order to maintain the fluid at a constant desired temperature. As mentioned earlier, the quench outlet line 2141 and the quench inlet line 2143 are in fluid communication with a plurality of heat exchangers, the plurality of heat exchangers including a first heat exchanger 2142, a second heat exchanger 2144, and a third heat Exchanger 2146. According to various embodiments of the gas envelope assembly and system as shown in FIG. 34, the first heat exchanger 2142, the second heat exchanger 2144, and the third heat exchanger 2146 are filtered with the first fan of the filtration system 2150, respectively The unit 2152, the second fan filter unit 2154 and the third fan filter unit 2156 are in thermal communication.

在圖35中,諸多箭頭描繪至各種風扇過濾單元及來自各種 風扇過濾單元之流動,且亦描繪管道系統2170中之流動,該管道系統包括如圖34之簡化示意圖中所描繪之第一管道導管2173及第二管道導管2174。第一管道導管2173可經由第一管道入口2171接收氣體,且可經由第一管道出口2175退出。類似地,第二管道導管2174可經由第二管道入口2172接收氣體,且可經由第二管道出口2176退出。另外,如圖34中所展示,管道系統2170藉由有效地界定空間2180來分離在內部再循環通過過濾系統2150之惰性氣體,該空間經由氣體淨化出口線路2131與氣體淨化系統2130流體連通。包括如圖15至圖17所描繪之管道系統的各種實施例之此循環系統提供大致層流,使紊流最小化,促進包體之內部中的氣體氣氛之循環、翻轉及顆粒物過濾,並且提供通過在氣體包體總成外部的氣體淨化系統之循環。 In FIG. 35, many arrows depict the flow to and from various fan filter units, and also depict the flow in the piping system 2170, which includes the first piping duct as depicted in the simplified schematic diagram of FIG. 34 2173和第二管管2174。 2173 and the second pipeline conduit 2174. The first duct conduit 2173 may receive gas via the first duct inlet 2171, and may exit via the first duct outlet 2175. Similarly, the second duct conduit 2174 may receive gas via the second duct inlet 2172, and may exit via the second duct outlet 2176. In addition, as shown in FIG. 34, the piping system 2170 separates the inert gas that is internally recirculated through the filter system 2150 by effectively defining a space 2180 that is in fluid communication with the gas purification system 2130 via a gas purification outlet line 2131. The circulation system, including various embodiments of the piping system as depicted in FIGS. 15 to 17, provides a substantially laminar flow, minimizes turbulence, promotes circulation, turning, and particulate filtering of the gas atmosphere in the interior of the envelope, and provides Through the circulation of the gas purification system outside the gas envelope assembly.

圖36係沿根據本教示之氣體包體總成的各種實施例之氣體包體總成及系統2300之長度截取的橫截面圖。與圖35之氣體包體總成2200相同的是,圖36之氣體包體總成系統2300可包括:可封裝OLED列印系統50之氣體包體1500,以及氣體淨化系統2130(亦參見圖34)、熱調節系統2140、過濾及循環系統2150以及管道系統2170。對於氣體包體總成2300之各種實施例,熱調節系統2140(其可包括與急冷器出口線路2143及急冷器入口線路2145流體連通之流體急冷器2141)可與複數個熱交換器流體連通,該複數個熱交換器例如為如圖36中所描繪之第一熱交換器2142及第二熱交換器2144。根據如圖36中所展示之氣體包體總成及系統的各種實施例,諸如第一熱交換器2142及第二熱交換器2144之各種熱交換器可藉由定位成靠近管道出口(諸如管道系統2170之第一管道出口2175及第二管道出口2176)而與循環的惰性氣體熱連通。就此而言,自管道入口(諸如管道 入口,諸如管道系統2170之第一管道入口2171及第二管道入口2172)所傳回以便進行過濾的惰性氣體可在分別循環通過例如圖36之過濾系統2150的第一風扇過濾單元2152、第二風扇過濾單元2154及第三風扇過濾單元2156之前得到熱調節。 36 is a cross-sectional view taken along the length of the gas envelope assembly and the system 2300 of various embodiments of the gas envelope assembly according to the present teachings. Similar to the gas package assembly 2200 of FIG. 35, the gas package system 2300 of FIG. 36 may include: a gas package 1500 that can encapsulate the OLED printing system 50, and a gas purification system 2130 (see also FIG. 34 ), heat regulation system 2140, filtration and circulation system 2150, and piping system 2170. For various embodiments of the gas envelope assembly 2300, the thermal regulation system 2140 (which may include the fluid quench 2141 in fluid communication with the quench outlet line 2143 and the quench inlet port 2145) may be in fluid communication with a plurality of heat exchangers, The plurality of heat exchangers are, for example, the first heat exchanger 2142 and the second heat exchanger 2144 as depicted in FIG. 36. According to various embodiments of the gas envelope assembly and system as shown in FIG. 36, various heat exchangers such as the first heat exchanger 2142 and the second heat exchanger 2144 can be positioned close to the pipe outlet (such as a pipe The first pipe outlet 2175 and the second pipe outlet 2176 of the system 2170 are in thermal communication with the circulating inert gas. In this regard, the inert gas returned from the pipeline inlet (such as the pipeline inlet, such as the first pipeline inlet 2171 and the second pipeline inlet 2172 of the pipeline system 2170) for filtration may be separately circulated through, for example, the filtration system 2150 of FIG. 36 The first fan filter unit 2152, the second fan filter unit 2154, and the third fan filter unit 2156 were thermally adjusted before.

如自圖35及圖36中展示通過包體之惰性氣體循環之方向的箭頭可看出,風扇過濾單元經組配來提供自包體之頂部向下,朝向底部的大致層流。例如,可自Flanders公司(Washington,North Carolina)或Envirco公司(Sanford,North Carolina)購得之風扇過濾單元可用於整合於根據本教示之氣體包體總成的各種實施例中。風扇過濾單元之各種實施例可經由每一單元交換約350立方呎每分鐘(CFM)至約700CFM之惰性氣體。如圖35及圖36中所展示,因為風扇過濾單元為並列佈置而非串列佈置,所以在包含複數個風扇過濾單元之系統中可交換的惰性氣體之量可與所使用之單元的數量成比例。在靠近包體之底部處,氣流被引向複數個管道入口,在圖35及圖36中將該複數個管道入口示意性地指示為第一管道入口2171及第二管道入口2172。如前面關於圖15至圖17所討論,將管道入口大致上定位於包體之底部以及引起氣體自上部風扇過濾單元的向下流動促進包體中之氣體氣氛的良好翻轉,並且促進整個氣體氣氛的徹底翻轉及通過氣體淨化系統的移動,該氣體淨化系統係結合該包體來使用的。藉由使氣體氣氛循環通過管道(該管道分離惰性氣流以便循環通過氣體淨化迴路2130)並且使用過濾及循環系統2150來促進包體中之氣體氣氛的層流及徹底翻轉,在氣體包體總成之各種實施例中可將反應性物種(諸如水及氧氣,以及溶劑中之每一者)中之每一者的含量維持在100ppm或更低,例如1ppm 或更低,例如0.1ppm或更低。 As can be seen from the arrows in FIGS. 35 and 36 showing the direction of circulation of the inert gas through the envelope, the fan filter unit is configured to provide a general laminar flow from the top of the envelope down to the bottom. For example, fan filter units available from Flanders Corporation (Washington, North Carolina) or Envirco Corporation (Sanford, North Carolina) can be used to integrate into various embodiments of the gas envelope assembly according to the present teachings. Various embodiments of fan filter units can exchange approximately 350 cubic feet per minute (CFM) to approximately 700 CFM of inert gas through each unit. As shown in FIGS. 35 and 36, because the fan filter units are arranged in parallel rather than in series, the amount of inert gas that can be exchanged in a system that includes multiple fan filter units can be equal to the number of units used proportion. Near the bottom of the package, the airflow is directed to a plurality of duct inlets, which are schematically indicated as the first duct inlet 2171 and the second duct inlet 2172 in FIGS. 35 and 36. As previously discussed with respect to FIGS. 15-17, positioning the duct inlet substantially at the bottom of the package and causing the downward flow of gas from the upper fan filter unit promotes good turnover of the gas atmosphere in the package and promotes the entire gas atmosphere The complete reversal and movement through the gas purification system, the gas purification system is used in conjunction with the package. By circulating the gas atmosphere through a pipe (which separates the inert gas flow for circulation through the gas purification circuit 2130) and using the filtration and circulation system 2150 to promote the laminar flow and complete overturn of the gas atmosphere in the envelope, in the gas envelope assembly In various embodiments, the content of each of the reactive species (such as water and oxygen, and each of the solvents) may be maintained at 100 ppm or less, for example, 1 ppm or less, for example, 0.1 ppm or less .

根據用於OLED列印系統之氣體包體總成系統的各種實施例,可根據處理期間基板在列印系統中之實體位置來選擇風扇過濾單元之數量。因此,儘管圖35及圖36中展示3個風扇過濾單元,但風扇過濾單元之數量可變化。例如,圖37為沿氣體包體總成及系統2400之長度截取的橫截面圖,該氣體包體總成及系統與圖23及圖24以及圖29及圖30中所描繪之氣體包體總成及系統類似。氣體包體總成及系統2400可包括氣體包體總成1500,該氣體包體總成封裝支撐於底座1220上之OLED列印系統1050。OLED列印系統之基板漂浮台1054界定基板在基板之OLED列印期間可被移動通過系統2400所經過的行程。因此,氣體包體總成及系統2400之過濾系統2150具有適當數量之風扇過濾單元;該等風扇過濾單元被展示為2151-2155,對應於基板在處理期間通過OLED列印系統1050之實體行程。另外,圖37之示意性截面圖描繪氣體包體之各種實施例的輪廓塑造,此輪廓塑造可有效地減小OLED列印處理期間所需要之惰性氣體的體積,且同時提供對氣體包體1500之內部的輕鬆接取(在操作期間例如使用安裝於各種手套埠中之手套來遠程接取,或在維護操作之情況下藉由可移除之面板來直接接取)。 According to various embodiments of the gas envelope assembly system used in the OLED printing system, the number of fan filter units can be selected according to the physical position of the substrate in the printing system during processing. Therefore, although three fan filter units are shown in FIGS. 35 and 36, the number of fan filter units may vary. For example, FIG. 37 is a cross-sectional view taken along the length of the gas inclusion assembly and the system 2400. The gas inclusion assembly and the system are similar to the gas inclusion assembly depicted in FIGS. 23 and 24, and FIGS. 29 and 30. Similar to the system. The gas package assembly and the system 2400 may include a gas package assembly 1500 that encapsulates the OLED printing system 1050 supported on the base 1220. The substrate floating table 1054 of the OLED printing system defines the distance that the substrate can be moved through the system 2400 during OLED printing of the substrate. Therefore, the gas package assembly and the filter system 2150 of the system 2400 have an appropriate number of fan filter units; these fan filter units are shown as 2151-2155, corresponding to the physical travel of the substrate through the OLED printing system 1050 during processing. In addition, the schematic cross-sectional view of FIG. 37 depicts the contouring of various embodiments of gas inclusions. This contouring can effectively reduce the volume of inert gas required during the OLED printing process, and at the same time provide the gas inclusions 1500. Easy internal access (for example, use gloves installed in various glove ports for remote access during operation, or direct access via a removable panel during maintenance operations).

氣體包體總成及系統之各種實施例可將加壓惰性氣體再循環系統用於各種氣動操作型裝置及設備的操作。另外,如前面所討論,本教示之氣體包體總成的實施例可相對於外部環境維持在小幅正壓力下,例如但不限於約2mbarg至約8mbarg之間。在氣體包體總成系統中維持加壓惰性氣體再循環系統可具有挑戰性,因為其關於維持氣體包體總成及系統之 小幅正內部壓力而同時持續地引入加壓氣體至氣體包體總成及系統中提出了動態及持續平衡作用。此外,各種裝置及設備之可變的需求可產生本教示之各種氣體包體總成及系統之不規則壓力分佈。在此等條件下,對相對於外部環境保持在小幅正壓力下的氣體包體總成維持動態壓力平衡可提供正在進行的OLED列印處理之完整性。 Various embodiments of gas envelope assemblies and systems can use pressurized inert gas recirculation systems for the operation of various pneumatically operated devices and equipment. Additionally, as previously discussed, embodiments of the gas inclusion assembly of the present teachings can be maintained at a slight positive pressure relative to the external environment, such as but not limited to between about 2 mbarg and about 8 mbarg. Maintaining a pressurized inert gas recirculation system in a gas inclusion assembly system can be challenging because it involves maintaining a small positive internal pressure of the gas inclusion assembly and the system while continuously introducing pressurized gas to the gas inclusion assembly The dynamic and continuous balance function is proposed in the Chengji system. In addition, the variable requirements of various devices and equipment can produce irregular pressure distributions for various gas inclusion assemblies and systems taught in this teaching. Under these conditions, maintaining the dynamic pressure balance of the gas inclusion assembly maintained at a slight positive pressure relative to the external environment can provide the integrity of the ongoing OLED printing process.

如圖38中所展示,氣體包體總成及系統3000之各種實施例可具有外部氣體迴路2500,該外部氣體迴路用於整合及控制惰性氣體源2509及清潔乾燥空氣(CDA)源2512,以便用於氣體包體總成及系統3000之操作的各方面。一般技藝人士將瞭解的是,氣體包體總成及系統3000亦可包括內部粒子過濾及氣體循環系統之各種實施例以及如前面所描述之外部氣體淨化系統的各種實施例。除了用於整合及控制惰性氣體源2509及CDA源2512之外部迴路2500,氣體包體總成及系統3000亦可具有壓縮機迴路2160,該壓縮機迴路可供應惰性氣體,用來操作可佈置於氣體包體總成及系統3000之內部中的各種裝置及設備。 As shown in FIG. 38, various embodiments of the gas envelope assembly and system 3000 may have an external gas circuit 2500 that is used to integrate and control the inert gas source 2509 and the clean dry air (CDA) source 2512 in order to Used in all aspects of the operation of the gas envelope assembly and system 3000. Those of ordinary skill will understand that the gas envelope assembly and system 3000 may also include various embodiments of internal particle filtration and gas circulation systems as well as various embodiments of external gas purification systems as previously described. In addition to the external circuit 2500 for integrating and controlling the inert gas source 2509 and the CDA source 2512, the gas package assembly and system 3000 may also have a compressor circuit 2160, which can supply inert gas for operation and can be arranged in Various devices and equipment in the gas package assembly and the interior of the system 3000.

圖38之壓縮機迴路2160可包括被組配成流體連通之壓縮機2162、第一累積器2164及第二累積器2168。壓縮機2162可經組配來將自氣體包體總成1500抽出之惰性氣體壓縮至所需壓力。壓縮機迴路2160之入口側可通過線路2503經由氣體包體總成出口2501與氣體包體總成1500流體連通,該線路具有閥2505及止回閥2507。壓縮機迴路2160可經由外部氣體迴路2500在壓縮機迴路2160之出口側上與氣體包體總成1500流體連通。累積器2164可佈置於壓縮機2162與壓縮機迴路2160與外部氣體迴路2500之接點之間,且可經組配來產生5psig或更高之壓力。由於壓縮機活塞在約 60Hz下循環,第二累積器2168可位於壓縮機迴路2160中以便提供阻尼波動。對於壓縮機迴路2160之各種實施例,第一累積器2164可具有在約80加侖至約160加侖之間的容量,而第二累積器可具有在約30加侖至約60加侖之間的容量。根據氣體包體總成及系統3000之各種實施例,壓縮機2162可為零入侵壓縮機。各種類型之零入侵壓縮機可在不使大氣氣體洩漏至本教示之氣體包體總成及系統的各種實施例中的情況下操作。例如在利用需要壓縮之惰性氣體的各種裝置及設備之OLED列印處理中,零入侵壓縮機之各種實施例可連續運行。 The compressor circuit 2160 of FIG. 38 may include a compressor 2162, a first accumulator 2164, and a second accumulator 2168 configured in fluid communication. The compressor 2162 may be configured to compress the inert gas drawn from the gas inclusion assembly 1500 to a desired pressure. The inlet side of the compressor circuit 2160 can be in fluid communication with the gas package assembly 1500 through the gas package assembly outlet 2501 through a line 2503, which has a valve 2505 and a check valve 2507. The compressor circuit 2160 may be in fluid communication with the gas package assembly 1500 on the outlet side of the compressor circuit 2160 via the external gas circuit 2500. The accumulator 2164 may be disposed between the junction of the compressor 2162 and the compressor circuit 2160 and the external gas circuit 2500, and may be assembled to generate a pressure of 5 psig or higher. Since the compressor piston circulates at about 60 Hz, a second accumulator 2168 may be located in the compressor circuit 2160 to provide damped fluctuations. For various embodiments of the compressor circuit 2160, the first accumulator 2164 may have a capacity between about 80 gallons and about 160 gallons, and the second accumulator may have a capacity between about 30 gallons and about 60 gallons. According to various embodiments of the gas envelope assembly and the system 3000, the compressor 2162 may be a zero-intrusion compressor. Various types of zero-intrusion compressors can operate without leaking atmospheric gases into various embodiments of the gas envelope assembly and system of the present teachings. For example, in the OLED printing process using various devices and equipment requiring inert gas to be compressed, various embodiments of the zero-intrusion compressor can be continuously operated.

累積器2164可經組配來接收及累積來自壓縮機2162的壓縮之惰性氣體。累積器2164可提供氣體包體總成1500中所需要的壓縮之惰性氣體。例如,累積器2164可提供氣體來維持氣體包體總成1500之各種組件的壓力,該等組件諸如但不限於氣動機器人、基板漂浮台、空氣軸承、空氣套管、壓縮氣體工具、氣動致動器及其組合中之一或多者。如圖38中關於氣體包體總成及系統3000所展示,氣體包體總成1500可具有包封在其中之OLED列印系統50。如圖24及圖30中所展示,OLED列印系統50可藉由花崗岩台70支撐且可包括基板漂浮台54,該基板漂浮台用於將基板傳送至列印頭腔室中之位置中並且在OLED列印處理期間支撐基板。另外,可使用支撐於橋56上之空氣軸承58來代替例如線性機械軸承。對於本教示之氣體包體及系統的各種實施例,多種氣動操作型裝置及設備之使用可提供低粒子生成性能並且具有低維護性。壓縮機迴路2160可經組配來連續地供應加壓惰性氣體至氣體包體設備3000之各種裝置及設備中。除了加壓惰性氣體的供應之外,利用空氣軸承技術的OLED列印系統50之基板漂浮台54 亦利用真空系統2550,當閥2554處於打開位置時,該真空系統經由線路2552與氣體包體總成1500連通。 Accumulator 2164 may be configured to receive and accumulate compressed inert gas from compressor 2162. The accumulator 2164 can provide the compressed inert gas required in the gas envelope assembly 1500. For example, the accumulator 2164 may provide gas to maintain the pressure of various components of the gas envelope assembly 1500, such as but not limited to pneumatic robots, substrate floating tables, air bearings, air sleeves, compressed gas tools, pneumatic actuation One or more of the device and its combination. As shown in FIG. 38 with respect to the gas inclusion assembly and system 3000, the gas inclusion assembly 1500 may have an OLED printing system 50 enclosed therein. As shown in FIGS. 24 and 30, the OLED printing system 50 may be supported by the granite table 70 and may include a substrate floating table 54 for transferring the substrate into a position in the print head chamber and The substrate is supported during the OLED printing process. In addition, air bearings 58 supported on the bridge 56 can be used instead of, for example, linear mechanical bearings. For various embodiments of the gas enclosure and system taught in this teaching, the use of a variety of pneumatically operated devices and equipment can provide low particle generation performance and low maintenance. The compressor circuit 2160 can be configured to continuously supply pressurized inert gas to various devices and equipment of the gas envelope device 3000. In addition to the supply of pressurized inert gas, the substrate floating table 54 of the OLED printing system 50 using air bearing technology also uses a vacuum system 2550. When the valve 2554 is in the open position, the vacuum system is Connected into 1500.

根據本教示之加壓惰性氣體再循環系統可具有如圖38中關於壓縮機迴路2160所展示之壓力控制型旁通迴路2165,該旁通迴路用來補償在使用期間對加壓氣體之可變的需求,藉此為本教示之氣體包體總成及系統的各種實施例提供動態平衡。對於根據本教示之氣體包體總成及系統的各種實施例,旁通迴路可在不中斷或改變包體1500中之壓力的情況下維持累積器2164中的恆定壓力。旁通迴路2165可具有位於旁通迴路2165之入口側上的第一旁通入口閥2161,除非使用旁通迴路2165,否則該第一旁通入口閥係封閉的。旁通迴路2165亦可具有可在第二閥2163封閉時使用的背壓調節器。旁通迴路2165可具有佈置於旁通迴路2165之出口側的第二累積器2168。對於利用零入侵壓縮機之壓縮機迴路2160的各種實施例,旁通迴路2165可補償在氣體包體總成及系統之使用期間隨著時間的過去可能發生的少量壓力偏差。當旁通入口閥2161係處於打開位置時,旁通迴路2165可在旁通迴路2165之入口側上與壓縮機迴路2160流體連通。當旁通入口閥2161打開時,若氣體包體總成1500之內部中不需要來自壓縮機迴路2160之惰性氣體,則可使經由旁通迴路2165分流之惰性氣體再循環至壓縮機。壓縮機迴路2160經組配成當累積器2164中之惰性氣體的壓力超出預先設定之臨界壓力時,經由旁通迴路2165來分流惰性氣體。累積器2164的預先設定之臨界壓力在至少約1立方呎每分鐘(cfm)之流率下可介於約25psig至約200psig之間,或在至少約1立方呎每分鐘(cfm)之流率下可介於約50psig至約150psig之間,或在至少約1立方呎每分鐘(cfm)之流率下可介於約 75psig至約125psig之間,或在至少約1立方呎每分鐘(cfm)之流率下可介於約90psig至約95psig之間。 The pressurized inert gas recirculation system according to the present teaching may have a pressure-controlled bypass circuit 2165 as shown in FIG. 38 with respect to the compressor circuit 2160. The requirements of this provide dynamic balance for various embodiments of the gas inclusion assembly and system taught in this teaching. For various embodiments of the gas envelope assembly and system according to the present teachings, the bypass loop can maintain a constant pressure in the accumulator 2164 without interrupting or changing the pressure in the envelope 1500. The bypass circuit 2165 may have a first bypass inlet valve 2161 on the inlet side of the bypass circuit 2165, which is closed unless a bypass circuit 2165 is used. The bypass circuit 2165 may also have a back pressure regulator that can be used when the second valve 2163 is closed. The bypass circuit 2165 may have a second accumulator 2168 arranged on the outlet side of the bypass circuit 2165. For various embodiments of a compressor circuit 2160 that utilizes zero-intrusion compressors, the bypass circuit 2165 can compensate for small pressure deviations that may occur over time during the use of the gas envelope assembly and system. When the bypass inlet valve 2161 is in the open position, the bypass circuit 2165 may be in fluid communication with the compressor circuit 2160 on the inlet side of the bypass circuit 2165. When the bypass inlet valve 2161 is opened, if no inert gas from the compressor circuit 2160 is needed in the interior of the gas package assembly 1500, the inert gas diverted through the bypass circuit 2165 can be recycled to the compressor. The compressor circuit 2160 is configured to shunt the inert gas through the bypass circuit 2165 when the pressure of the inert gas in the accumulator 2164 exceeds a preset critical pressure. The predetermined critical pressure of the accumulator 2164 may be between about 25 psig and about 200 psig at a flow rate of at least about 1 cubic foot per minute (cfm), or at least about 1 cubic foot per minute (cfm) Can be between about 50 psig to about 150 psig, or at a flow rate of at least about 1 cubic foot per minute (cfm) can be between about 75 psig to about 125 psig, or at least about 1 cubic foot per minute (cfm ) Flow rate can be between about 90 psig to about 95 psig.

壓縮機迴路2160之各種實施例可利用除零侵入壓縮機以外的多種壓縮機,諸如變速壓縮機或可受控制而處於打開狀態或關閉狀態之壓縮機。如前面所討論,零入侵壓縮機確保無大氣反應性物種可被引入至氣體包體總成及系統中。因此,防止大氣反應性物種被引入至氣體包體總成及系統中之任何壓縮機組配可用於壓縮機迴路2160。根據各種實施例,氣體包體總成及系統3000之壓縮機2162可封裝在例如但不限於氣密式密封型殼體中。該殼體內部可組配成與惰性氣體源流體連通,該惰性氣體例如與形成用於氣體包體總成1500之惰性氣體氣氛的惰性氣體相同。對於壓縮機迴路2160之各種實施例,壓縮機2162可被控制在恆定之速度來維持恆定之壓力。在不利用零入侵壓縮機之壓縮機迴路2160的其他實施例中,可在達到最大臨界壓力時關閉壓縮機2162,且在達到最小臨界壓力時打開壓縮機2162。 Various embodiments of the compressor circuit 2160 may utilize a variety of compressors other than zero-intrusion compressors, such as variable speed compressors or compressors that may be controlled to be in an open or closed state. As previously discussed, the zero-invasion compressor ensures that no atmospheric reactive species can be introduced into the gas envelope assembly and system. Therefore, any compressor assembly that prevents atmospheric reactive species from being introduced into the gas envelope assembly and system can be used in the compressor circuit 2160. According to various embodiments, the gas envelope assembly and the compressor 2162 of the system 3000 may be packaged in, for example but not limited to, a hermetically sealed housing. The interior of the housing can be configured to be in fluid communication with a source of inert gas, such as the same inert gas that forms an inert gas atmosphere for the gas envelope assembly 1500. For various embodiments of the compressor circuit 2160, the compressor 2162 may be controlled at a constant speed to maintain a constant pressure. In other embodiments of the compressor circuit 2160 that does not utilize zero-intrusion compressors, the compressor 2162 may be turned off when the maximum critical pressure is reached, and the compressor 2162 may be turned on when the minimum critical pressure is reached.

在關於氣體包體總成及系統3100的圖39中,展示鼓風機迴路2190及鼓風機真空迴路2550,該等迴路係用於封裝在氣體包體總成1500中的OLED列印系統1050之基板漂浮台1054的操作。如前面關於壓縮機迴路2160所討論,鼓風機迴路2190可經組配來連續地供應加壓惰性氣體至基板漂浮台54。 In FIG. 39 regarding the gas package assembly and the system 3100, the blower circuit 2190 and the blower vacuum circuit 2550 are shown. These circuits are used for the substrate floating stage of the OLED printing system 1050 enclosed in the gas package assembly 1500. 1054 operation. As previously discussed with respect to compressor circuit 2160, blower circuit 2190 may be configured to continuously supply pressurized inert gas to substrate floating table 54.

可利用加壓惰性氣體再循環系統之氣體包體總成及系統的各種實施例可具有利用多種加壓氣體源之各種迴路,諸如壓縮機、鼓風機及其組合中之至少一者。在關於氣體包體總成及系統3100之圖39中,壓縮 機迴路2160可與外部氣體迴路2500流體連通,該外部氣體迴路可用於為高消耗量歧管(high consumption manifold)2525以及低消耗量歧管2513供應惰性氣體。對於根據本教示的氣體包體總成及系統之各種實施例,如圖39中關於氣體包體總成及系統3000所展示,高消耗量歧管2525可用來供應惰性氣體至各種裝置及設備,諸如但不限於基板漂浮台、氣動機器人、空氣軸承、空氣套管及壓縮空氣工具及其組合中之一或多者。對於根據本教示之氣體包體總成及系統的各種實施例,低消耗量2513可用來供應惰性氣體至各種設備及裝置,諸如但不限於隔離體及氣動致動器及其組合中之一或多者。 Various embodiments of gas envelope assemblies and systems that can utilize pressurized inert gas recirculation systems can have various circuits that utilize multiple sources of pressurized gas, such as at least one of compressors, blowers, and combinations thereof. In FIG. 39 regarding the gas envelope assembly and the system 3100, the compressor circuit 2160 can be in fluid communication with an external gas circuit 2500, which can be used for a high consumption manifold 2525 and low consumption The manifold 2513 supplies inert gas. For various embodiments of the gas enclosure assembly and system according to the present teaching, as shown in the gas enclosure assembly and system 3000 in FIG. 39, the high-consumption manifold 2525 can be used to supply inert gas to various devices and equipment, Such as, but not limited to, one or more of a substrate floating table, a pneumatic robot, an air bearing, an air sleeve, and compressed air tools, and combinations thereof. For various embodiments of the gas enclosure assembly and system according to the teachings, the low consumption 2513 can be used to supply inert gas to various equipment and devices, such as but not limited to one of isolator and pneumatic actuator and their combination or More.

對於氣體包體總成及系統3100之各種實施例,鼓風機迴路2190可用來供應加壓惰性氣體至基板漂浮台1054之各種實施例,而與外部氣體迴路2500流體連通之壓縮機迴路2160可用來供應加壓惰性氣體至例如但不限於氣動機器人、空氣軸承、空氣套管及壓縮氣體工具及其組合中之一或多者。除了加壓惰性氣體之供應之外,利用空氣軸承技術的OLED列印系統1050之基板漂浮台54亦利用鼓風機真空2550,該鼓風機真空在閥2554處於打開位置時經由線路2552與氣體包體總成1500連通。鼓風機迴路2190之殼體2192可維持:第一鼓風機2194,其用於供應加壓惰性氣體源至基板漂浮台1054;以及第二鼓風機2550,其在惰性氣體環境中充當用於基板漂浮台1054之真空源。對於基板漂浮台之各種實施例,可使得鼓風機適合於用作加壓惰性氣體源或真空源的屬性包括:例如但不限於鼓風機具有高可靠性;使鼓風機具有低維護性,具有變速控制且具有廣泛之流量體積;各種實施例能夠提供介於約100m3/h至約2,500m3/h之間的體積流量。鼓風 機迴路2190之各種實施例可另外具有:位於鼓風機迴路2190之入口端的第一隔離閥2193;以及位於鼓風機迴路2190之出口端的止回閥2195及第二隔離閥2197。鼓風機迴路2190之各種實施例可具有:可調整閥2196,該可調整閥可為例如但不限於閘閥、蝶形閥或球形閥;以及熱交換器2198,其用於將自鼓風機總成2190至基板漂浮台系統1054之惰性氣體維持在所定義之溫度。 For various embodiments of the gas envelope assembly and system 3100, the blower circuit 2190 can be used to supply pressurized inert gas to the various embodiments of the substrate floating table 1054, and the compressor circuit 2160 in fluid communication with the external gas circuit 2500 can be used to supply Pressurize the inert gas to, for example but not limited to, one or more of pneumatic robots, air bearings, air sleeves and compressed gas tools, and combinations thereof. In addition to the supply of pressurized inert gas, the substrate floating table 54 of the OLED printing system 1050 using air bearing technology also uses a blower vacuum 2550, which is connected to the gas envelope assembly via the line 2552 when the valve 2554 is in the open position 1500 connected. The housing 2192 of the blower circuit 2190 can maintain: a first blower 2194, which is used to supply a source of pressurized inert gas to the substrate floating table 1054; and a second blower 2550, which serves as a substrate for the substrate floating table 1054 in an inert gas environment Vacuum source. For various embodiments of the substrate floating table, properties that can make the blower suitable for use as a source of pressurized inert gas or vacuum include: for example, but not limited to, the blower has high reliability; the blower has low maintenance, has variable speed control and has the broad flow volume; various embodiments can be provided between about 100m 3 / h to a volume flow rate of between about 2,500m 3 / h. Various embodiments of the blower circuit 2190 may additionally have: a first isolation valve 2193 located at the inlet end of the blower circuit 2190; and a check valve 2195 and a second isolation valve 2197 located at the outlet end of the blower circuit 2190. Various embodiments of the blower circuit 2190 may have: an adjustable valve 2196, which may be, for example but not limited to, a gate valve, a butterfly valve, or a ball valve; and a heat exchanger 2198, which is used to convert the blower assembly 2190 to The inert gas of the substrate floating table system 1054 is maintained at a defined temperature.

圖39描繪亦在圖38中展示的外部氣體迴路2500,該外部氣體迴路用於整合及控制惰性氣體源2509及清潔乾燥空氣(CDA)源2512,以便用於圖38之氣體包體總成及系統3000及圖39之氣體包體總成及系統3100之操作的各方面。圖38及圖39之外部氣體迴路2500可包括至少四個機械閥。此等閥包含第一機械閥2502、第二機械閥2504、第三機械閥2506及第四機械閥2508。此等各種閥在各種流動線路中係位於允許對以下兩者進行控制的位置中:惰性氣體,例如,諸如氮氣、稀有氣體中之任一者及其任一組合;以及空氣源,諸如清潔乾燥空氣(CDA)。封裝惰性氣體線路2510自封裝惰性氣體源2509延伸。封裝惰性氣體線路2510作為低消耗量歧管線路2512繼續線性地延伸,該低消耗量歧管線路與低消耗量歧管2513流體連通。交叉線第一區段2514自第一流量接點2516延伸,該第一流量接點位於封裝惰性氣體線路2510、低消耗量歧管線路2512及交叉線第一區段2514之相交處。交叉線第一區段2514延伸至第二流量接點2518。壓縮機惰性氣體線路2520自壓縮機迴路2160之累積器2164延伸,且在第二流量接點2518處終止。CDA線路2522自CDA源2512延伸,且作為高消耗量歧管線路2524繼續延伸,該高消耗量歧管線路與高消耗量歧管2525流體連通。 第三流量接點2526定位在交叉線第二區段2528、清潔乾燥空氣線路2522及高消耗量歧管線路2524之相交處。交叉線第二區段2528自第二流量接點2518延伸至第三流量接點2526。 FIG. 39 depicts an external gas circuit 2500 also shown in FIG. 38, which is used to integrate and control an inert gas source 2509 and a clean dry air (CDA) source 2512 for use in the gas envelope assembly of FIG. 38 and Various aspects of the operation of the system 3000 and the gas envelope assembly of FIG. 39 and the system 3100. The external gas circuit 2500 of FIGS. 38 and 39 may include at least four mechanical valves. Such valves include a first mechanical valve 2502, a second mechanical valve 2504, a third mechanical valve 2506, and a fourth mechanical valve 2508. These various valves are located in various flow paths in a position that allows control of the following two: inert gas, for example, any one of nitrogen, rare gas and any combination thereof; and air source, such as clean and dry Air (CDA). The packaged inert gas line 2510 extends from the packaged inert gas source 2509. The encapsulated inert gas line 2510 continues to linearly extend as a low-consumption manifold line 2512, which is in fluid communication with the low-consumption manifold 2513. The first cross section 2514 extends from the first flow contact 2516 at the intersection of the encapsulated inert gas line 2510, the low-consumption manifold line 2512, and the first section 2514 of the cross line. The cross section first section 2514 extends to the second flow junction 2518. The compressor inert gas line 2520 extends from the accumulator 2164 of the compressor circuit 2160 and terminates at the second flow contact 2518. The CDA line 2522 extends from the CDA source 2512 and continues as a high-consumption manifold line 2524 that is in fluid communication with the high-consumption manifold 2525. The third flow contact 2526 is located at the intersection of the second section 2528 of the crossover line, the clean and dry air line 2522, and the high-consumption manifold line 2524. The second cross section 2528 extends from the second flow junction 2518 to the third flow junction 2526.

關於外部氣體迴路2500之描述且參考圖40,以下係一些各種操作模式之概述,其中圖40係用於氣體包體總成及系統之各種操作模式之閥位置的表。 With regard to the description of the external gas circuit 2500 and with reference to FIG. 40, the following is an overview of some various operating modes, where FIG. 40 is a table of valve positions for various operating modes of the gas envelope assembly and system.

圖40之表指示一種處理模式,其中閥狀態產生僅惰性氣體壓縮機操作模式。在如圖38中所展示且在圖40中關於閥狀態所指示之處理模式中,第一機械閥2502及第三機械閥2506處於封閉組配。第二機械閥2504及第四機械閥2508處於打開組配。由於此等特定的閥組配,允許壓縮之惰性氣體流向低消耗量歧管2513且流向高消耗量歧管2525。在正常操作下,阻止來自封裝惰性氣體源之惰性氣體及來自CDA源之清潔乾燥空氣流向低消耗量歧管2513及高消耗量歧管2525中之任一者。 The table of FIG. 40 indicates a processing mode in which the valve state produces an inert gas compressor-only operating mode. In the processing mode as shown in FIG. 38 and indicated in FIG. 40 regarding the valve state, the first mechanical valve 2502 and the third mechanical valve 2506 are in a closed configuration. The second mechanical valve 2504 and the fourth mechanical valve 2508 are in an open configuration. Due to these specific valve configurations, compressed inert gas is allowed to flow to the low consumption manifold 2513 and to the high consumption manifold 2525. Under normal operation, the inert gas from the packaged inert gas source and the clean dry air from the CDA source are prevented from flowing to any of the low consumption manifold 2513 and the high consumption manifold 2525.

如圖40中所指示且參考圖39,存在用於維護及復原之一系列閥狀態。本教示之氣體包體總成及系統的各種實施例可不時地需要維護,且另外需要從系統故障中復原。在此特定模式中,第二機械閥2504及第四機械閥2508處於封閉組配。第一機械閥2502及第三機械閥2506處於打開組配。封裝惰性氣體源及CDA源提供惰性氣體,該惰性氣體將由低消耗量歧管2513供應至為低消耗量且另外具有在復原期間將難以有效地沖洗之無效體積之彼等組件。此等組件之實例包括氣動致動器。對比而言,在維護期間可藉由高消耗量歧管2525、CDA供應至為高消耗量之彼等組件。使用閥2504、2508、2530隔離壓縮機防止了諸如氧氣及水蒸汽之反應性物 種污染壓縮機及累積器中之惰性氣體。 As indicated in FIG. 40 and with reference to FIG. 39, there is a series of valve states for maintenance and recovery. Various embodiments of the gas envelope assembly and system of this teaching may require maintenance from time to time, and additionally need to recover from system failures. In this particular mode, the second mechanical valve 2504 and the fourth mechanical valve 2508 are in a closed configuration. The first mechanical valve 2502 and the third mechanical valve 2506 are in an open configuration. The packaged inert gas source and CDA source provide an inert gas that will be supplied by the low consumption manifold 2513 to those components that are low consumption and additionally have an invalid volume that will be difficult to effectively flush during recovery. Examples of such components include pneumatic actuators. In contrast, high-consumption manifolds 2525, CDA can be supplied to those components that are high-consumption during maintenance. The use of valves 2504, 2508, and 2530 to isolate the compressor prevents reactive species such as oxygen and water vapor from contaminating the inert gas in the compressor and accumulator.

在維護或復原已完成之後,必須經由若干週期來沖洗氣體包體總成,直至諸如氧氣及水的各種反應性大氣物種中之每一物種已達到足夠低的含量,例如100ppm或更低,例如10ppm或更低,1.0ppm或更低或者0.1ppm或更低。如圖40中所指示且參考圖39,在沖洗模式期間,第三機械閥2506封閉且第五機械閥2530亦處於封閉組配。第一機械閥2502、第二機械閥2504及第四機械閥2508處於打開組配。由於此特定的閥組配,僅允許封裝惰性氣體流動且允許其流向低消耗量歧管2513及高消耗量歧管2525兩者。 After maintenance or restoration has been completed, the gas envelope assembly must be flushed through several cycles until each of the various reactive atmospheric species such as oxygen and water has reached a sufficiently low level, for example 100 ppm or less, for example 10 ppm or less, 1.0 ppm or less, or 0.1 ppm or less. As indicated in FIG. 40 and with reference to FIG. 39, during the flush mode, the third mechanical valve 2506 is closed and the fifth mechanical valve 2530 is also in the closed configuration. The first mechanical valve 2502, the second mechanical valve 2504, and the fourth mechanical valve 2508 are in an open configuration. Due to this particular valve arrangement, only the inert gas of the package is allowed to flow and to both the low consumption manifold 2513 and the high consumption manifold 2525.

如圖40中所指示且參考圖38,「無流量」模式及洩漏測試模式係根據需要來使用之模式。「無流量」模式係具有如下閥狀態組配之模式,其中第一機械閥2502、第二機械閥2504、第三機械閥2506及第四機械閥2508均處於封閉組配。此封閉組配產生系統之「無流量」模式,在此模式中無來自惰性氣體源、CDA源或壓縮機源中之任一者的氣體可到達低消耗量歧管2513或高消耗量歧管2525。當系統不使用且可長期保持閒置時,此「無流量模式」可為有用的。洩漏測試模式可用於偵測系統中之洩漏。洩漏測試模式使用專門壓縮之惰性氣體,該惰性氣體將系統與圖39之高消耗量歧管2525隔離開,以便對低消耗量歧管2513之低消耗量組件(諸如隔離體及氣動致動器)進行洩漏檢查。在此測試模式中,第一機械閥2502、第三機械閥2506及第四機械閥2508均處於封閉組配。僅第二機械閥2504處於打開組配。因此,壓縮氮氣能夠自壓縮機惰性氣體源2519流向低消耗量歧管2513,且不存在流向高消耗量歧管2525之氣體。 As indicated in FIG. 40 and referring to FIG. 38, the "no flow" mode and the leak test mode are modes used as needed. The "no flow" mode is a mode in which the following valve states are configured, in which the first mechanical valve 2502, the second mechanical valve 2504, the third mechanical valve 2506, and the fourth mechanical valve 2508 are in a closed configuration. This closed assembly system produces a "no flow" mode in which no gas from any of the inert gas source, CDA source, or compressor source can reach the low-consumption manifold 2513 or the high-consumption manifold 2525. This "no-flow mode" can be useful when the system is not in use and can remain idle for a long time. The leak test mode can be used to detect leaks in the system. The leak test mode uses a specially compressed inert gas that isolates the system from the high-consumption manifold 2525 of FIG. 39 in order to isolate low-consumption components (such as isolators and pneumatic actuators) of the low-consumption manifold 2513. ) Conduct a leak check. In this test mode, the first mechanical valve 2502, the third mechanical valve 2506, and the fourth mechanical valve 2508 are in a closed configuration. Only the second mechanical valve 2504 is in the open configuration. Therefore, compressed nitrogen can flow from the compressor inert gas source 2519 to the low consumption manifold 2513, and there is no gas flowing to the high consumption manifold 2525.

漂浮台之各種實施例可在本教示之氣體包體總成及系統的各種實施例中之任一者中用來實現諸如OLED平板顯示器基板之負載之穩定輸送。預期的是,無摩擦漂浮台可在本教示之惰性氣體包體的各種實施例中之任一者提供諸如OLED基板之負載的穩定輸送以便進行列印。 Various embodiments of the floating platform can be used in any of the various embodiments of the gas envelope assembly and system of the present teaching to achieve stable delivery of loads such as OLED flat panel display substrates. It is expected that the frictionless floating table may provide stable delivery of loads such as OLED substrates for printing in any of the various embodiments of the inert gas envelope of the present teachings.

例如,在圖1中,氣體包體總成及系統2000可包括氣體包體總成1500,其具有入口閘1512及出口閘1522,該等閘用於將諸如OLED平板顯示器基板之基板移進及移出氣體包體系統2000。在圖37中,氣體包體總成及系統2400可具有所展示之支撐於底座1200上的氣體包體總成1500,該氣體包體總成可封裝OLED列印系統50。OLED列印系統50之基板漂浮台54界定基板(未圖示)在OLED平板顯示器基板之噴墨列印期間可被移動通過惰性氣體包體總成及系統2400所經過的行程。如前面關於圖38所討論,氣體包體總成及系統之各種實施例可具有外部迴路,該外部迴路包括:例如但不限於可提供在漂浮台之操作中所使用之加壓惰性氣體及真空的壓縮機迴路以及真空源。如前面關於圖39所討論,利用鼓風機技術的外部迴路之各種實施例可提供用來操作漂浮台之加壓惰性氣體以及真空源。 For example, in FIG. 1, the gas inclusion assembly and system 2000 may include a gas inclusion assembly 1500 having an inlet gate 1512 and an outlet gate 1522, which are used to move substrates such as OLED flat panel display substrates into and Remove the gas inclusion system 2000. In FIG. 37, the gas package assembly and the system 2400 may have the gas package assembly 1500 shown supported on the base 1200, which may encapsulate the OLED printing system 50. The substrate floating table 54 of the OLED printing system 50 defines the travel that the substrate (not shown) can be moved through the inert gas envelope assembly and the system 2400 during inkjet printing of the OLED flat panel display substrate. As previously discussed with respect to FIG. 38, various embodiments of the gas envelope assembly and system may have external circuits including, for example, but not limited to, providing pressurized inert gas and vacuum used in the operation of the floating platform Compressor circuit and vacuum source. As previously discussed with respect to FIG. 39, various embodiments of external circuits utilizing blower technology can provide a pressurized inert gas and vacuum source for operating the floating platform.

如前面所討論,本教示之氣體包體總成及系統的各種實施例可處理一系列大小的OLED平板顯示器基板,範圍從比尺寸約為61cm x 72cm之第3.5代基板更小開始,並且漸進為更高代的大小。預期的是,氣體包體總成及系統之各種實施例可處理尺寸約為130cm X 150cm之第5.5代母玻璃大小,以及尺寸約為195cm x 225cm之第7.5代,且每個基板可切割成八個42"平板或六個47”平板及更大。如前面所討論,第8.5代大約為 220cm x 250cm,且每個基板可切割成六個55”平板或八個46”平板。然而,基板代的大小不斷推進,以使得尺寸約為285cm x 305cm之當前可用的第10代不會是基板大小的終極代。另外,由基於玻璃之基板之使用所產生的術語所列舉之大小可適用於適合於在OLED列印中使用之任何材料的基板。因此,在本教示之氣體包體總成及系統的各種實施例中,存在列印期間需要穩定輸送的多種基板大小及材料。 As previously discussed, various embodiments of the gas inclusion assembly and system of the present teachings can handle a range of OLED flat panel display substrates, ranging from smaller than Gen 3.5 substrates with dimensions of approximately 61cm x 72cm, and gradually For the size of the higher generation. It is expected that various embodiments of the gas envelope assembly and system can handle the size of the 5.5th generation mother glass with a size of about 130cm X 150cm, and the 7.5th generation with a size of about 195cm x 225cm, and each substrate can be cut into Eight 42" tablets or six 47" tablets and larger. As previously discussed, the 8.5th generation is approximately 220cm x 250cm, and each substrate can be cut into six 55" plates or eight 46" plates. However, the size of the substrate generation continues to advance, so that the currently available 10th generation with dimensions of approximately 285 cm x 305 cm will not be the ultimate generation of substrate size. In addition, the sizes enumerated by the terms resulting from the use of glass-based substrates can be applied to substrates of any material suitable for use in OLED printing. Therefore, in various embodiments of the gas envelope assembly and system of the present teaching, there are multiple substrate sizes and materials that need to be stably transported during printing.

在圖41中描繪根據本教示之各種實施例的漂浮台。當前技術之漂浮台700可具有區710,在該區中可經由複數個埠施加壓力及真空。具有壓力及真空控制之此區可有效地在區710與基板(未圖示)之間提供具有雙向剛度之流體彈簧(fluidic spring),藉此產生對基板與區710之間的間隙之實質控制。存在於負載與漂浮台表面之間的間隙被稱為懸浮高度(fly height)。圖41之漂浮台700的諸如區710之區可為諸如基板之負載提供可控制之懸浮高度,在該區中使用複數個壓力埠及真空埠產生具有雙向剛度之流體彈簧。 In FIG. 41, a floating platform according to various embodiments of the present teachings is depicted. The current technology floating platform 700 may have a zone 710 in which pressure and vacuum may be applied through a plurality of ports. This zone with pressure and vacuum control can effectively provide a fluidic spring with bidirectional stiffness between zone 710 and the substrate (not shown), thereby creating substantial control of the gap between the substrate and zone 710 . The gap that exists between the load and the surface of the floating platform is called the fly height. A zone such as zone 710 of the floating platform 700 of FIG. 41 can provide a controllable suspension height for loads such as substrates, in which a plurality of pressure ports and vacuum ports are used to generate a fluid spring with bidirectional stiffness.

靠近區710的分別係第一過渡區720及第二過渡區722,且隨後靠近第一過渡區720及第二過渡區722的分別係僅壓力區740及742。在該等過渡區中,壓力噴嘴與真空噴嘴之比率朝向僅壓力區逐漸增加,來提供自區710至區740及742之逐步過渡。如圖41中所指示,圖42描繪三個區之擴展視圖。對於例如如圖41中所描繪之基板漂浮台之各種實施例,僅壓力區740、742經描繪成由軌條結構組成。對於基板漂浮台之各種實施例,僅壓力區(諸如圖41之僅壓力區740、742)可由連續板(諸如關於圖41的壓力-真空區710所描繪之連續板)組成。 Those near the zone 710 are the first transition zone 720 and the second transition zone 722, respectively, and then those near the first transition zone 720 and the second transition zone 722 are only the pressure zones 740 and 742, respectively. In these transition zones, the ratio of the pressure nozzle to the vacuum nozzle gradually increases toward the pressure-only zone to provide a gradual transition from zone 710 to zones 740 and 742. As indicated in Figure 41, Figure 42 depicts an expanded view of the three zones. For various embodiments of the substrate floating table such as depicted in FIG. 41, only the pressure zones 740, 742 are depicted as consisting of rail structures. For various embodiments of the substrate floating table, the pressure-only zone (such as the pressure-only zone 740, 742 of FIG. 41) may be composed of a continuous plate (such as the continuous plate depicted with respect to the pressure-vacuum zone 710 of FIG. 41).

對於如圖41中所描繪之漂浮台的各種實施例,壓力-真空區、過渡區與僅壓力區之間可存在基本上均勻的高度,以使得在容限內,三個區基本上位於一個平面中。一般技藝人士將瞭解的是,各種區之長度可變化。例如但不限於,為了提供尺度及比例感,對於各種基板,過渡區可為約400mm,而僅壓力區可為約2.5m,且壓力-真空區可為約800mm。 For various embodiments of the floating platform as depicted in FIG. 41, there may be a substantially uniform height between the pressure-vacuum zone, the transition zone, and the pressure-only zone, so that within tolerance, the three zones are located substantially in one In the plane. The general artisan will understand that the length of the various zones can vary. For example, but not limited to, in order to provide a sense of scale and proportion, for various substrates, the transition zone may be about 400 mm, while only the pressure zone may be about 2.5 m, and the pressure-vacuum zone may be about 800 mm.

在圖41中,僅壓力區740及742不提供具有雙向剛度之流體彈簧,且因此不提供區710可提供之控制。因此,負載在僅壓力區上方的懸浮高度通常大於基板在壓力-真空區上方的懸浮高度,以便在僅壓力區中允許足夠的高度,以使得負載將不會與漂浮台碰撞。例如但不限於,可能需要處理OLED面板基板在諸如區740及742的僅壓力區上方具有約150μ至約300μ之間的懸浮高度,且隨後在諸如區710的壓力-真空區上方具有約30μ至約50μ之間的懸浮高度。 In FIG. 41, only the pressure zones 740 and 742 do not provide fluid springs with bidirectional stiffness, and therefore do not provide the control that zone 710 can provide. Therefore, the levitation height of the load above the pressure-only zone is generally greater than the levitation height of the substrate above the pressure-vacuum zone so as to allow sufficient height in the pressure-only zone so that the load will not collide with the floating platform. For example, but not limited to, it may be necessary to process the OLED panel substrate to have a levitation height between about 150 μ to about 300 μ above only the pressure area such as areas 740 and 742, and then to have about 30 μ to above the pressure-vacuum area such as area 710 Suspension height between about 50μ.

對於漂浮台700之各種實施例,具有為所有區提供可變懸浮高度以及跨漂浮台之均勻高度的不同區之組合的結果為,當基板在漂浮台上方行進時可能發生基板撓曲。圖43A及圖43B描繪當基板760在漂浮台700上方行進時的基板撓曲。在圖43A中,當基板760在漂浮台700上方行進時,基板760之駐留於壓力-真空區710上方的部分具有第一懸浮高度FH1,而基板760之駐留於僅壓力區740上方的部分具有第二懸浮高度FH2,且基板760之駐留於過渡區720上方的部分具有可變懸浮高度。在圖43B中,當基板760在漂浮台700上方以相反方向行進時,基板760之駐留於壓力-真空區710上方的部分具有第一懸浮高度FH1,而基板760之駐留於僅壓力區742上方的部分具有第二懸浮高度FH2,且基板760之駐留於過渡區722 上方的部分可具有可變懸浮高度。因此,在基板150在漂浮台200上方的任一行進方向中,基板760中之撓曲顯而易見。 For various embodiments of the floating platform 700, the result of having a combination of different zones that provide variable suspension heights for all zones and a uniform height across the floating platform is that substrate deflection may occur as the substrate travels above the floating platform. 43A and 43B depict the deflection of the substrate as the substrate 760 travels above the floating platform 700. FIG. Portion 710 having a first upper vacuum region levitation height FH 1, and the substrate 760 resides just above the pressure zone 740 - in FIG. 43A, when the substrate 760 travels over the floating station 700, the substrate 760 residing in the pressure It has a second flying height FH 2 , and the portion of the substrate 760 that resides above the transition zone 720 has a variable flying height. In FIG. 43B, when the substrate 760 travels in the opposite direction above the floating table 700, the portion of the substrate 760 that resides above the pressure-vacuum zone 710 has the first flying height FH 1 , while the substrate 760 resides in the pressure-only zone 742 The upper portion has a second flying height FH 2 , and the portion of the substrate 760 that resides above the transition zone 722 may have a variable flying height. Therefore, in any direction of travel of the substrate 150 above the floating table 200, deflection in the substrate 760 is apparent.

在可封裝列印系統(該列印系統用於列印例如但不限於OLED顯示面板基板)的本教示之氣體包體總成及系統之各種實施例中,某種程度之基板撓曲可能對製造物品並無不利影響。然而,對於利用根據本教示之氣體包體總成及系統的列印處理之各種實施例,基板撓曲可對製造物品具有不利影響。 In various embodiments of the gas package assembly and system of the present teaching that can encapsulate a printing system (such as but not limited to OLED display panel substrates), a certain degree of substrate deflection may There are no adverse effects on manufactured items. However, for various embodiments of the printing process using the gas envelope assembly and system according to the teachings, substrate deflection may have an adverse effect on the manufactured article.

因此,如圖44中所描繪之漂浮台的各種實施例可具有可變過渡區高度,以便在基板在漂浮台上方移動時將諸如OLED平板顯示器基板之負載維持大致平坦。圖44描繪具有傾斜佈置的第一過渡區820及第二過渡區822,該等過渡區分別介於壓力-真空區810與第一僅壓力區840及第二僅壓力區842之間。第一過渡區820及第二過渡區822之傾斜佈置提供壓力-真空區810與第一僅壓力區840及第二僅壓力區842之間的高度差。如圖44中所描繪,在容限內,第一僅壓力區840及第二僅壓力區842基本上位於同一平面中,而壓力-真空區810位於與僅壓力區平行之平面中。由壓力-真空區810相對於第一僅壓力區840及第二僅壓力區842界定之基本上平行的平面偏移了一高度差,該高度差補償在各種區上方之懸浮高度的差。 Therefore, various embodiments of the floating platform as depicted in FIG. 44 may have a variable transition zone height to maintain a load such as an OLED flat panel display substrate substantially flat as the substrate moves over the floating platform. FIG. 44 depicts a first transition zone 820 and a second transition zone 822 with an inclined arrangement, which transition zones are between the pressure-vacuum zone 810 and the first pressure-only zone 840 and the second pressure-only zone 842, respectively. The inclined arrangement of the first transition zone 820 and the second transition zone 822 provides a height difference between the pressure-vacuum zone 810 and the first pressure-only zone 840 and the second pressure-only zone 842. As depicted in FIG. 44, within the tolerance, the first pressure-only region 840 and the second pressure-only region 842 are located substantially in the same plane, and the pressure-vacuum region 810 is located in a plane parallel to the pressure-only region. The substantially parallel plane defined by the pressure-vacuum zone 810 relative to the first pressure-only zone 840 and the second pressure-only zone 842 is offset by a height difference that compensates for the difference in suspension height above the various zones.

如前面關於如圖41中所描繪之基板漂浮台之各種實施例所討論,在圖44中將僅壓力區840、842描繪成由軌條結構組成。對於基板漂浮台之各種實施例,僅壓力區(諸如圖44之僅壓力區840、842)可由連續板(諸如關於圖44的壓力-真空區810所描繪之連續板)組成。 As previously discussed with respect to various embodiments of the substrate floating table as depicted in FIG. 41, only the pressure zones 840, 842 are depicted in FIG. 44 as being composed of rail structures. For various embodiments of the substrate floating table, only the pressure zone (such as the pressure zone 840, 842 of FIG. 44) may be composed of a continuous plate (such as the continuous plate depicted with respect to the pressure-vacuum zone 810 of FIG. 44).

如圖45A及圖45B中所描繪,對於根據本教示之漂浮台700 的各種實施例,具有為所有區提供可變懸浮高度以及跨漂浮台之不同高度的不同區之組合的結果為,當基板在漂浮台上方行進時,基板可維持大致平坦之佈置。 As depicted in FIGS. 45A and 45B, for various embodiments of the floating platform 700 according to the present teachings, the result of having a combination of different regions that provide variable floating heights for all regions and different heights across the floating platform is when the substrate When traveling above the floating platform, the substrate can maintain a substantially flat arrangement.

在圖45A中,當基板860在漂浮台800上方行進時,基板860之駐留於壓力-真空區810上方的部分具有第一懸浮高度FH1,而基板860之駐留於僅壓力區840上方的部分具有第二懸浮高度FH2。然而,過渡區820具有傾斜佈置,該傾斜佈置提供壓力-真空區810與僅壓力區840之間的高度差,該高度差可補償壓力-真空區810與僅壓力區840之間的懸浮高度差,當基板860在三個不同區上方行進時,基板860維持大致平坦之佈置。在圖45B中,當基板860在漂浮台800上方行進時,基板860之駐留於壓力-真空區810上方的部分具有第一懸浮高度FH1,而基板860之駐留於僅壓力區842上方的部分具有第二懸浮高度FH2。然而,過渡區842具有傾斜佈置,該傾斜佈置提供壓力-真空區810與僅壓力區842之間的高度差,該高度差可補償壓力-真空區810與僅壓力區842之間的懸浮高度差,當基板860在三個不同區上方行進時,基板860維持大致平坦之佈置。因此,在基板860在漂浮台800上方的任一行進方向中,基板860可維持大致平坦之佈置。 Portion 810 having a first upper vacuum region levitation height FH 1, and the substrate 860 resides just above the pressure zone 840 - in FIG. 45A, when the substrate 860 travels over the floating station 800, the substrate 860 residing in the pressure With a second flying height FH 2 . However, the transition zone 820 has an inclined arrangement that provides a height difference between the pressure-vacuum zone 810 and the pressure-only zone 840, which can compensate for the difference in suspension height between the pressure-vacuum zone 810 and the pressure-only zone 840 As the substrate 860 travels over three different zones, the substrate 860 maintains a substantially flat arrangement. Portion 810 having a first upper vacuum region levitation height FH 1, and the substrate 860 resides just above the pressure zone 842 - in FIG. 45B, when the substrate 860 travels over the floating station 800, the substrate 860 residing in the pressure With a second flying height FH 2 . However, the transition zone 842 has an inclined arrangement that provides a height difference between the pressure-vacuum zone 810 and the pressure-only zone 842, which can compensate for the difference in suspension height between the pressure-vacuum zone 810 and the pressure-only zone 842 As the substrate 860 travels over three different zones, the substrate 860 maintains a substantially flat arrangement. Therefore, in any direction of travel of the substrate 860 above the floating table 800, the substrate 860 can maintain a substantially flat arrangement.

漂浮台700及漂浮台800之各種實施例可容納於氣體包體中,該氣體包體包括本教示之氣體包體總成,例如但不限於關於圖3、圖23及圖29所描繪及描述之彼等氣體包體總成,其可與關於圖34所描述之各種系統功能整合。可具有外部迴路(諸如但不限於關於圖38及圖39所描繪之彼等外部迴路,其可提供加壓惰性氣體以及真空)之各種實施例的氣體包體之各種實施例以及氣體包體及系統的各種實施例可利用漂浮台之各 種實施例,來根據本教示在惰性氣體環境中輸送負載。 Various embodiments of the floating platform 700 and the floating platform 800 can be accommodated in a gas enclosure including the gas enclosure assembly taught in this teaching, such as, but not limited to, the description and description with respect to FIGS. 3, 23, and 29 The other gas inclusion assemblies can be integrated with various system functions described in relation to FIG. 34. Various embodiments of gas enclosures and gas enclosures that can have various embodiments of external circuits (such as but not limited to those described with respect to FIGS. 38 and 39, which can provide pressurized inert gas and vacuum) Various embodiments of the system may utilize various embodiments of the floating platform to deliver loads in an inert gas environment according to the present teachings.

本說明書中所提及之所有公告、專利及專利申請案係以引用方式納入本文中,其程度就如同已具體及單獨地指示將每一單獨的公告、專利或專利申請案以引用方式納入一樣。 All announcements, patents and patent applications mentioned in this specification are incorporated by reference to the same extent as if each individual announcement, patent or patent application was specifically and individually instructed to be included by reference .

儘管本文已展示及描述本揭露內容之實施例,但對於熟習該項技術者而言將顯而易見的是,僅藉由舉例之方式提供此等實施例。現在,熟習該項技術者將在不脫離本揭露內容之情況下想到眾多變化、變更及替換。應理解的是,可採用本文所述之揭露內容的實施例之各種替代方案來實踐本揭露內容。希望以下申請專利範圍界定本揭露內容之範疇,且藉此來涵蓋在此等申請專利範圍及其均等物之範疇內的方法及結構。 Although embodiments of the present disclosure have been shown and described herein, it will be apparent to those skilled in the art that these embodiments are provided by way of example only. Now, those skilled in the art will think of many changes, changes, and replacements without departing from the content of this disclosure. It should be understood that various alternatives to the embodiments of the disclosed content described herein may be used to practice the disclosed content. It is hoped that the scope of the following patent applications defines the scope of the content of this disclosure, and thereby covers methods and structures within the scope of these patent applications and their equivalents.

1100’:前部面板總成 1100’: Front panel assembly

1120’:前部底座面板總成 1120’: Front base panel assembly

1140’:前部壁面板總成 1140’: Front wall panel assembly

1160’:天花板面板總成 1160’: Ceiling panel assembly

1200’:中間面板總成 1200’: Middle panel assembly

1230’:第一中間維護系統面板總成 1230’: The first intermediate maintenance system panel assembly

1240’:第一中間包體面板總成 1240’: The first intermediate body panel assembly

1260’:中間壁及天花板面板總成 1260’: Middle wall and ceiling panel assembly

1280’:第二中間包體面板總成 1280’: Second intermediate body panel assembly

1300’:後部面板總成 1300’: Rear panel assembly

1320’:後部底座面板總成 1320’: Rear base panel assembly

1340’:後部壁面板總成 1340’: Rear wall panel assembly

1360’:後部天花板面板總成 1360’: Rear ceiling panel assembly

Claims (23)

一種氣體包體系統,其包含:一氣體包體總成,其包含經密封地連接以界定一內部之複數個框架構件總成,該氣體包體總成經組配以在該內部中維持處於一第一壓力之一惰性氣體氣氛;一惰性氣體再循環系統,其與該內部處於流動連通以使該內部中之該惰性氣體氣氛之惰性氣體再循環;及一氣動裝置,其處於該內部中,以接納來自與該惰性氣體再循環系統分開之一加壓惰性氣體供應的加壓惰性氣體,該氣動裝置接納處於與該第一壓力不同之一第二壓力的加壓惰性氣體。 A gas inclusion system comprising: a gas inclusion assembly including a plurality of frame member assemblies hermetically connected to define an interior, the gas inclusion assembly being assembled to remain in the interior An inert gas atmosphere at a first pressure; an inert gas recirculation system in flow communication with the interior to recirculate the inert gas in the interior of the inert gas atmosphere in the interior; and a pneumatic device in the interior To receive pressurized inert gas from a pressurized inert gas supply separate from the inert gas recirculation system, the pneumatic device receives pressurized inert gas at a second pressure different from the first pressure. 如申請專利範圍第1項之氣體包體系統,其中該第一壓力至少為大氣壓力,且該第二壓力高於該第一壓力。 For example, in the gas inclusion system of claim 1, the first pressure is at least atmospheric pressure, and the second pressure is higher than the first pressure. 如申請專利範圍第1項之氣體包體系統,其進一步包含與該內部且與該氣動裝置處於流體連通之一加壓惰性氣體再循環系統,以將加壓惰性氣體供應至該氣動裝置。 A gas inclusion system as claimed in item 1 of the patent scope further includes a pressurized inert gas recirculation system in fluid communication with the interior and with the pneumatic device to supply the pressurized inert gas to the pneumatic device. 如申請專利範圍第3項之氣體包體系統,其進一步包含:一漂浮台,其處於該內部中;及一鼓風機迴路,其與該漂浮台處於流體連通,該鼓風機迴路包含:一第一鼓風機,其與該漂浮台處於流體連通,以將加壓惰性氣體供應至該漂浮台;及一第二鼓風機,其與該漂浮台處於流動連通,以提供一真空源予該漂浮台。 For example, the gas inclusion system of claim 3 of the patent scope further includes: a floating platform in the interior; and a blower circuit in fluid communication with the floating platform, the blower circuit includes: a first blower It is in fluid communication with the floating platform to supply pressurized inert gas to the floating platform; and a second blower is in fluid communication with the floating platform to provide a vacuum source to the floating platform. 如申請專利範圍第3項之氣體包體系統,其中該加壓惰性氣體再循環系統進一步包含:一出口,其來自該內部,以將惰性氣體由該內部之該惰性氣體氣氛供應至該加壓惰性氣體再循環系統;一壓縮機,其在該出口之下游;及一累積器,其在該壓縮機之下游。 The gas inclusion system of claim 3, wherein the pressurized inert gas recirculation system further includes: an outlet from the interior to supply an inert gas from the inert gas atmosphere in the interior to the pressurized An inert gas recirculation system; a compressor, which is downstream of the outlet; and an accumulator, which is downstream of the compressor. 如申請專利範圍第5項之氣體包體系統,其進一步包含一壓力控制型旁通迴路,該壓力控制型旁通迴路與該壓縮機之下游及該累積器之上游處於選擇性流體連通,以將來自該壓縮機之流動的加壓惰性氣體分流至該累積器,及使加壓惰性氣體再循環至該壓縮機。 For example, the gas inclusion system of claim 5 of the patent application further includes a pressure-controlled bypass circuit in selective fluid communication with the downstream of the compressor and the upstream of the accumulator to The pressurized inert gas flowing from the compressor is diverted to the accumulator, and the pressurized inert gas is recirculated to the compressor. 如申請專利範圍第6項之氣體包體系統,其中該壓力控制型旁通迴路置放成處於流體連通,以回應於該累積器之一壓力超出一臨界壓力而將加壓氣體再循環至該壓縮機。 A gas inclusion system as claimed in item 6 of the patent application, wherein the pressure-controlled bypass circuit is placed in fluid communication in response to a pressure in the accumulator exceeding a critical pressure to recirculate pressurized gas to the compressor. 如申請專利範圍第7項之氣體包體系統,其中對於至少1立方呎每分鐘之一流率,該臨界壓力之範圍在25psig至200psig。 For example, in the gas inclusion system of claim 7, the critical pressure ranges from 25 psig to 200 psig for a flow rate of at least 1 cubic foot per minute. 如申請專利範圍第6項之氣體包體系統,其中該壓力控制型旁通迴路進一步包含一旁通閥,其可操作以選擇性地將該壓力控制型旁通迴路置放成與該壓縮機之下游處於流動連通,以將來自該壓縮機之流動的加壓惰性氣體分流至該累積器,及使加壓惰性氣體再循環至該壓縮機。 A gas inclusion system as claimed in item 6 of the patent application, wherein the pressure control type bypass circuit further includes a bypass valve operable to selectively place the pressure control type bypass circuit with the compressor Downstream is in flow communication to divert the flow of pressurized inert gas from the compressor to the accumulator, and recirculate the pressurized inert gas to the compressor. 如申請專利範圍第9項之氣體包體系統,其中該壓力控制型旁通迴路進一步包含一額外累積器,其定位於該旁通閥之下游及該壓縮機之上游。 For example, in the gas envelope system of claim 9, the pressure control type bypass circuit further includes an additional accumulator positioned downstream of the bypass valve and upstream of the compressor. 如申請專利範圍第1項之氣體包體系統,其進一步包含與該內部處 於流體連通之一鼓風機迴路,該鼓風機迴路包含與該氣動裝置處於流體連通之一第一鼓風機,以將加壓惰性氣體供應至該氣動裝置。 For example, the gas inclusion system of item 1 of the scope of patent application, which further includes the internal In a blower circuit in fluid communication, the blower circuit includes a first blower in fluid communication with the pneumatic device to supply pressurized inert gas to the pneumatic device. 如申請專利範圍第11項之氣體包體系統,其中該鼓風機迴路進一步包含與該氣動裝置處於流體連通之一第二鼓風機,以提供一真空源予該氣動裝置。 For example, in the gas envelope system of claim 11, the blower circuit further includes a second blower in fluid communication with the pneumatic device to provide a vacuum source to the pneumatic device. 如申請專利範圍第1項之氣體包體系統,其中該氣動裝置選自一氣動機器人、一漂浮台、一空氣軸承、一空氣套管、一壓縮氣體工具及一氣動致動器中之至少一者。 For example, the gas inclusion system of claim 1, wherein the pneumatic device is selected from at least one of a pneumatic robot, a floating platform, an air bearing, an air sleeve, a compressed gas tool, and a pneumatic actuator By. 如申請專利範圍第1項之氣體包體系統,其進一步包含安置於該內部中之一列印系統。 For example, the gas inclusion system according to item 1 of the patent application scope further includes a printing system disposed in the interior. 如申請專利範圍第14項之氣體包體系統,其中該列印系統包含一噴墨列印總成。 For example, the gas inclusion system of the patent application item 14, wherein the printing system includes an inkjet printing assembly. 如申請專利範圍第1項之氣體包體系統,其中該加壓惰性氣體為氮氣、氦氣、氖氣、氬氣、氪氣、氙氣及氡氣中之一或多者。 For example, in the gas inclusion system of claim 1, the pressurized inert gas is one or more of nitrogen, helium, neon, argon, krypton, xenon and radon. 如申請專利範圍第1項之氣體包體系統,其進一步包含與該內部處於流體連通之一氣體淨化迴路。 For example, the gas inclusion system of claim 1 further includes a gas purification circuit in fluid communication with the interior. 如申請專利範圍第17項之氣體包體系統,其中該氣體淨化迴路包含:一入口,其與該內部處於流體連通,以接納來自該內部之惰性氣體氣氛之惰性氣體;一氣體淨化組件,其在該入口之下游;及一出口,其在該氣體淨化組件之下游,該出口與該內部處於流動連通,以將惰性氣體由該氣體淨化組件供應至該內部。 A gas inclusion system as claimed in claim 17, wherein the gas purification circuit includes: an inlet in fluid communication with the interior to receive an inert gas from an inert gas atmosphere within the interior; a gas purification assembly, which Downstream of the inlet; and an outlet downstream of the gas purification assembly, the outlet is in flow communication with the interior to supply an inert gas from the gas purification assembly to the interior. 如申請專利範圍第1項之氣體包體系統,其中該惰性氣體再循環系統包含一或多個過濾器。 A gas inclusion system as claimed in item 1 of the patent application, wherein the inert gas recirculation system includes one or more filters. 如申請專利範圍第19項之氣體包體系統,其中該惰性氣體再循環系統定位於該內部中。 A gas inclusion system as claimed in claim 19, wherein the inert gas recirculation system is located in the interior. 如申請專利範圍第20項之氣體包體系統,其中該惰性氣體再循環系統包含定位於該內部之一外圍之周圍的管道。 A gas inclusion system as claimed in item 20 of the patent application, wherein the inert gas recirculation system includes a pipe positioned around a periphery of the interior. 如申請專利範圍第19項之氣體包體系統,其中該惰性氣體再循環系統包含定位於該內部之外的一惰性氣體再循環迴路,該惰性氣體再循環迴路包含一入口以接納來自該內部之該惰性氣體氣氛之惰性氣體,且包含一出口以使惰性氣體再循環至該內部。 A gas inclusion system as claimed in claim 19, wherein the inert gas recirculation system includes an inert gas recirculation circuit positioned outside the interior, and the inert gas recirculation circuit includes an inlet to receive the gas from the interior The inert gas in the inert gas atmosphere includes an outlet to recycle the inert gas to the interior. 如申請專利範圍第1項之氣體包體系統,其中該氣體包體總成經組配以維持包含含量各自在100ppm或更低之水及氧氣的一惰性氣體氣氛。 A gas inclusion system as claimed in item 1 of the patent application, wherein the gas inclusion assembly is assembled to maintain an inert gas atmosphere containing water and oxygen each having a content of 100 ppm or less.
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