TWI694625B - Light emitting device - Google Patents

Abstract

The light-emitting device of the present invention includes: a first substrate 2; an organic electroluminescent element 5 on which a lower electrode 11, an organic electroluminescent layer 12, and an upper portion are sequentially arranged from the first substrate 2 side on the first substrate 2 Made of electrodes 13; a drive circuit 7, which is arranged on the first substrate 2 and used to drive the organic electroluminescent element 5; a planarization layer 8, which is formed of an organic material and covers the drive circuit 7 to fill the drive circuit 7 Concavo-convex; and, an organic insulating layer 6 formed of an organic material and covering the corners of the lower electrode 11 to demarcate the light-emitting pixels A; wherein, the drive circuit 7 is provided corresponding to each light-emitting pixel A, and the planarization layer 8 is viewed from above The lower part is arranged away from the organic electroluminescent element 5.

Description

Light emitting device

The invention relates to a light-emitting device using an actively driven organic electroluminescent device (Organic EL device).

In general, in a light-emitting device using an actively driven organic electroluminescent element, the organic electroluminescent element constituting the light-emitting pixel and the driving circuit (thin film transistor) for driving the organic electroluminescent element correspond to each other one to one . In this type of light-emitting device, the unevenness of the drive circuit disposed on the substrate is filled with the planarization layer, and the organic electroluminescence element is disposed on the planarization layer. The drive circuit and the organic electroluminescence element are electrically connected through a through-hole that has been formed in the planarization layer (for example, refer to Patent Document 1). [Prior Technical Literature] (Patent Literature)

Patent Document 1: Japanese Patent Laid-Open No. 2009-087951

Generally, in order to fill the unevenness of the drive circuit to flatten the surface, the flattening layer is formed of an organic material. However, the planarization layer formed of an organic material easily introduces moisture. Therefore, if the organic electroluminescence element is arranged on the planarization layer, moisture permeates from the water-containing planarization layer into the organic electroluminescence element, resulting in non-luminescence unevenness and luminance unevenness of the light-emitting pixels.

Therefore, an object of one aspect of the present invention is to provide a light-emitting device capable of suppressing non-luminescence unevenness and luminance unevenness of light-emitting pixels.

A light-emitting device according to an aspect of the present invention includes: a first substrate; an organic electroluminescence element in which a lower electrode, an organic electroluminescent layer, and an upper electrode are sequentially arranged on the first substrate from the first substrate side Drive circuit, which is arranged on the first substrate and used to drive the organic electroluminescent element; a planarization layer, which is formed of organic material and covers the drive circuit to fill the unevenness of the drive circuit; and, an organic insulating layer, which A light-emitting pixel is defined by covering the corners of the lower electrode with an organic material; the driving circuit is provided corresponding to each light-emitting pixel, and the planarization layer is disposed away from the organic electroluminescent element in a plan view.

In this light-emitting device, the planarization layer is disposed away from the organic electroluminescence element in a plan view. Therefore, even if the planarization layer contains water or moisture penetrates into the planarization layer, the penetration of moisture from the planarization layer into the organic electroluminescence element can be suppressed. With this, it is possible to suppress the occurrence of non-luminescence unevenness and brightness unevenness of the light-emitting pixels. In addition, since the flattening layer is formed of an organic material, the covering performance is good compared to the case where the flattening layer is formed of an inorganic material, so the insulating property is high, a thick film is easily formed, and the unevenness reducing performance is high. In addition, it is possible to reduce the strain caused by the stress, and it is also possible to suppress the peeling of the film. Furthermore, since the organic insulating layer formed of an organic material covers the corners of the lower electrode and defines the light-emitting pixels, the organic electroluminescent layer and the upper electrode can be formed gently. Thereby, since the electric field concentration between the upper electrode and the lower electrode can be suppressed, the short-circuit failure of the organic electroluminescence element can be suppressed.

It also includes an inorganic insulating layer disposed on the lower electrode except for the light-emitting pixels. The upper electrode is formed of an inorganic material, and the upper electrode and the inorganic insulating layer can be in close contact between the planarization layer and the organic electroluminescent element. In this light-emitting device, the upper electrode formed of an inorganic material is in close contact with the inorganic insulating layer between the planarization layer and the organic electroluminescence element, so that the propagation of moisture from the planarization layer to the organic electroluminescence element can be suppressed.

The upper electrode may cover the organic electroluminescent layer in the light-emitting pixel. In this light-emitting device, since the upper electrode covers the organic electroluminescent layer in the light-emitting pixel, the upper electrode can also function as a sealing film that prevents moisture from penetrating into the organic electroluminescent layer.

The organic insulating layer has: a first organic insulating layer portion that delimits light-emitting pixels; and, a second organic insulating layer portion that covers the end of the planarization layer; and, the first organic insulating layer portion and the second organic insulating layer The portion may be divided between the light-emitting pixel and the planarization layer. In this light-emitting device, the first organic insulating layer portion and the second organic insulating layer portion are divided between the light-emitting pixel and the planarization layer, so even if moisture penetrates from the planarization layer to the second organic insulating layer portion, the moisture propagates It is blocked by the division between the first organic insulating layer portion and the second organic insulating layer portion. Therefore, it is possible to further suppress the occurrence of uneven light emission and uneven brightness of the light-emitting pixels.

The organic electroluminescent element and the driving circuit can be connected to the first substrate. In this light-emitting device, the organic electroluminescence element and the drive circuit are in contact with the first substrate, so space saving can be achieved in the thickness direction of the first substrate. In addition, for example, when the light emitting device is a bottom emission type that emits light on the first substrate side, excellent optical characteristics can be obtained.

It may further include: a second substrate facing the first substrate; and an adhesive that bonds the first substrate and the second substrate and forms a sealed organic electroluminescent element between the first substrate and the second substrate Seal the space. In this light-emitting device, the organic electroluminescence element is sealed by the first substrate, the second substrate, and the adhesive, and therefore, it is possible to achieve long life.

According to the present invention, it is possible to suppress the occurrence of non-luminescence unevenness and brightness unevenness of light-emitting pixels.

Hereinafter, a preferred embodiment of the present invention will be described with reference to the drawings. In addition, in each drawing, the same or corresponding requirements are given the same symbols, and repeated description is omitted. In addition, the numerical range shown by "-" in this specification means the range which includes the numerical value described before and after "-" as a minimum value and a maximum value, respectively.

(First embodiment) The light-emitting device of this embodiment is a light-emitting device of an active drive type. Examples of the light-emitting device include an optical print head that emits light for exposing a photosensitive medium, an illumination device that emits light for illumination, and a display device that displays a signboard or segment pattern. The shape of the light-emitting device is not particularly limited, and can be set to a long and thin linear shape, a curved shape, a spiral shape, or the like. In this embodiment, as an example, a description will be given of a light-emitting device formed into a rectangular shape in a plan view.

As shown in FIG. 1, the light-emitting device 1 of this embodiment is formed into a rectangular shape in a plan view. In this plan view, the direction in which the long side 1a of the light-emitting device 1 extends (the opposing direction of the pair of short sides 1b, 1b) is called the long-side direction D1, and the direction in which the short side 1b of the light-emitting device 1 extends (a The direction facing the long sides 1a, 1a) is called the short side direction D2.

As shown in FIGS. 1 to 4, the light-emitting device 1 of this embodiment includes a first substrate 2, a second substrate 3, an adhesive 4, an organic electroluminescent element 5, an organic insulating layer 6, a drive circuit 7, and planarization Layer 8 and desiccant 9. In addition, FIG. 2 is a cross-sectional view taken along line II-II shown in FIGS. 3 and 4.

The first substrate 2 is an element substrate provided with an organic electroluminescence element 5 and the like. The first substrate 2 is, for example, a glass substrate, a ceramic substrate, a metal substrate, or a flexible substrate (such as a plastic substrate, etc.). The first substrate 2 has translucency, for example. The first substrate 2 is formed in a rectangular plate shape, for example. The first substrate 2 is preferably formed of a material that does not transmit water vapor. Among them, impermeable to water vapor refers to substantially impermeable to water vapor, and does not merely refer to a case where impermeable to water vapor is at all. Specifically, it means that the water vapor transmission rate is 10 ^-5 [g/m ² ·day] or less.

The second substrate 3 is a sealing substrate that seals the organic electroluminescence element 5 and the like, and is provided to face the first substrate 2. The first substrate 2 and the second substrate 3 are stacked on each other. Hereinafter, the direction in which the first substrate 2 and the second substrate 3 are stacked will be simply referred to as a “stacking direction” for description. The stacking direction corresponds to the thickness direction of the first substrate 2 and the second substrate 3. In this embodiment, the case of viewing from the stacking direction is referred to as a plan view. The second substrate 3 is, for example, a glass substrate, a ceramic substrate, a metal substrate, or a flexible substrate (such as a plastic substrate, etc.). The second substrate 3 has translucency, for example. The second substrate 3 is formed in a rectangular plate shape, for example. The second substrate 3 is preferably formed of a material that does not transmit water vapor.

The adhesive 4 is an adhesive that directly or indirectly bonds (joins) the first substrate 2 and the second substrate 3 and forms a sealed space S between the first substrate 2 and the second substrate 3. The adhesive 4 is formed in a frame shape (ring shape) in order to form a sealed space S between the first substrate 2 and the second substrate 3. The adhesive 4 is formed in a rectangular frame shape with rounded corners, for example. As the material forming the adhesive 4, for example, an ultraviolet-curing epoxy resin can be used.

The organic electroluminescence element 5 is an element that generates light by supplying current. The organic electroluminescent element 5 is arranged on the first substrate 2. The organic electroluminescence element 5 has a light-emitting pixel A driven by the drive circuit 7 to emit light. The organic electroluminescent element 5 is preferably connected to the first substrate 2. The organic electroluminescence element 5 is formed by sequentially arranging the lower electrode 11, the organic electroluminescence layer 12, and the upper electrode 13 from the first substrate 2 side.

A plurality of organic electroluminescent elements 5 are provided on the first substrate 2. A plurality of organic electroluminescent elements 5 are arranged in one or two columns. A plurality of organic electroluminescent elements 5 in each row are arranged linearly along the longitudinal direction D1. When a plurality of organic electroluminescent elements 5 are arranged in two columns, each column is juxtaposed along the short-side direction D2, and the organic electroluminescent elements 5 of each column are alternately arranged along the long-side direction D1.

The lower electrode 11 is a conductive layer that functions as either an anode or a cathode. In the present embodiment, the following electrode 11 is a transparent conductive layer that functions as an anode. As a material for forming the lower electrode 11, for example, in addition to ITO (indium tin oxide), IZO (indium zinc oxide), etc. having transparency, aluminum, silver, alkaline earth metal, etc., having no transparency can be used. The lower electrode 11 is formed by patterning a transparent conductive film formed on the first substrate 2 by a PVD method (physical vapor deposition method) such as a vacuum evaporation method or a sputtering method. Furthermore, an inorganic insulating layer 16 is arranged on the lower electrode 11 except for the light-emitting pixel A.

The organic electroluminescent layer 12 includes at least an organic light-emitting layer containing a light-emitting material. The organic electroluminescent layer 12 includes not only an organic light-emitting layer, but also a hole injection layer, a hole transport layer, an electron injection layer, an electron transport layer, and the like. The organic electroluminescent layer 12 is formed by, for example, a PVD method or a solution coating method.

The upper electrode 13 is a conductive layer that functions as the other of the anode and the cathode. In this embodiment, the upper electrode 13 is a conductive layer that functions as a cathode. The upper electrode 13 is formed of an inorganic material. As a material for forming the upper electrode 13, for example, metals such as aluminum and silver, ITO, IZO, alkaline earth metals, etc. are used. The upper electrode 13 is formed by, for example, electron beam evaporation method or PVD method.

The upper electrode 13 covers the organic electroluminescent layer 12 in the light-emitting pixel A. Specifically, the upper electrode 13 covers the organic electroluminescent layer 12 in the light-emitting pixel A, and is in close contact with the inorganic insulating layer 16 between the planarization layer 8 and the organic electroluminescent element 5. Furthermore, the organic electroluminescent layer 12 is sealed by the upper electrode 13, the inorganic insulating layer 16 and the lower electrode 11. In addition, the upper electrode 13 only needs to cover the organic electroluminescent layer 12 at least in the light-emitting pixel A, and does not necessarily need to be connected to the inorganic insulating layer 16.

The organic insulating layer 6 is disposed in the sealed space S. The organic insulating layer 6 is formed of an organic material. As the organic material forming the organic insulating layer 6, for example, epoxy resin or novolac resin can be used. The organic insulating layer 6 covers the corner of the lower electrode 11 and demarcates the light-emitting pixel A. The organic insulating layer 6 has an opening 14 for defining the light-emitting pixel A. Therefore, the position and shape of the light-emitting pixel A are defined by the opening 14 of the organic insulating layer 6. The organic insulating layer 6 is formed by coating a film by a wet method such as spin coating, and patterning it into an arbitrary shape by photolithography.

When viewed from the stacking direction (in plan view), both ends of the organic insulating layer 6 in the longitudinal direction D1 extend to the planarizing layer 8 and cover the ends of the planarizing layer 8. On the other hand, both ends in the short-side direction D2 of the organic insulating layer 6 do not extend to the planarization layer 8 and do not cover the planarization layer 8 at all.

The driving circuit 7 is a switching element for driving the organic electroluminescence element 5 and is provided corresponding to each light-emitting pixel A. The drive circuit 7 is assembled on a circuit (not shown) that drives the organic electroluminescence element 5 and is connected to the upper electrode 13 of the organic electroluminescence element 5 via the wiring 15. As the drive circuit 7, for example, a semiconductor circuit composed of a low-temperature polysilicon thin film transistor (LTPS-TFT) and a capacitor can be used.

The driving circuit 7 is arranged on the first substrate 2. The driving circuit 7 is preferably connected to the first substrate 2. The drive circuit 7 is arranged at a position away from the organic electroluminescence element 5 in a plan view. That is, the driving circuit 7 is not arranged below the organic electroluminescence element 5. More specifically, the drive circuit 7 is arranged in a position between the organic electroluminescent element 5 and the long side in such a manner that the organic electroluminescent element 5 and the drive circuit 7 corresponding to each other are arranged in the short-side direction D2 in a plan view. Linear area between the sides 1a. When the organic electroluminescent elements 5 are arranged in one row, the drive circuit 7 may be arranged on one of the long sides 1a side of the row of the organic electroluminescent elements 5 or on the other long side 1a side. However, from the viewpoint of space saving, it is preferable that all the driving circuits 7 are arranged on the same side with respect to the row of the organic electroluminescent elements 5. On the other hand, when the organic electroluminescent elements 5 are arranged in two rows, the drive circuit 7 is arranged in a row opposite to the other organic electroluminescent element 5 rows with respect to one of the organic electroluminescent element 5 rows The long side 1a side. In addition, the drive circuit 7 is arranged outside the upper electrode 13 in a plan view.

The planarization layer 8 is made of an organic material and covers the drive circuit 7 to fill the unevenness of the drive circuit 7. In order to reduce the unevenness formed by the driving circuit 7 and the like, the planarization layer 8 needs to be formed to be a film thicker than the unevenness. Therefore, in general, the planarization layer 8 is formed of an organic material that can perform a liquid-phase coating film and is easier to thicken and planarize than inorganic materials. By thickening the film, it is possible to ensure insulation between the structure on the planarization layer 8 and the structure directly under the planarization layer 8. In addition, by planarization, a structure can be stably formed on the planarization layer 8.

As a method of forming the planarization layer 8, in general, a method of forming an organic material such as a polyimide resin, an acrylic resin, or the like by a coating method using a wet method is suitable. As a wet method, for example, there is a method of coating an organic material by spin coating and patterning by photolithography. Compared with the case where the planarization layer is formed of an inorganic material, this method of forming the planarization layer 8 has good covering performance, high insulation, easy formation of a thick film, and high relief performance. In addition, the strain caused by the stress can be reduced, and the film can be suppressed from falling off.

The planarization layer 8 is arranged on the first substrate 2. The planarization layer 8 is arranged at a position away from the organic electroluminescence element 5 in a plan view. That is, the planarization layer 8 is not arranged below the organic electroluminescence element 5. More specifically, the planarization layer 8 is arranged in a frame-like region between the organic electroluminescence element 5 and the long side 1a and the short side 1b so as to surround the organic electroluminescence element 5 in a plan view. As a result, the planarization layer 8 covers the driving circuit 7 and fills the unevenness of the driving circuit 7, and is not disposed between the organic electroluminescent element 5 and the first substrate 2.

The planarization layer 8 is covered by the inorganic insulating layer 17. Moreover, the adhesive 4 is adhered to the inorganic insulating layer 17. Therefore, even if moisture penetrates into the adhesive 4, the moisture can be suppressed from reaching the flattening layer 8. The inorganic insulating layer 17 is preferably in contact with the planarization layer 8. Between the planarization layer 8 and the inorganic insulating layer 17, wiring (not shown) such as a lead wiring connected to an external circuit is arranged. As a material for forming the inorganic insulating layer 17, for example, oxide such as SiO ₂ or SiN can be used. The planarization layer 8 is formed by a method of coating a film by a wet method such as spin coating.

The desiccant 9 is contained in the sealed space S and dries the sealed space. The desiccant 9 fills the sealed space S without a gap. As the material forming the desiccant 9, for example, alkaline earth metal oxides such as CaO or organometallic complex compounds can be used.

As described above, in the light-emitting device 1 of the present embodiment, the planarization layer 8 is arranged at a position away from the organic electroluminescence element 5 in plan view. Therefore, even if the planarizing layer 8 contains water, or moisture penetrates into the planarizing layer 8, it is possible to suppress the penetration of moisture from the planarizing layer 8 into the organic electroluminescent element 5. With this, it is possible to suppress the occurrence of uneven light emission and uneven brightness of the light-emitting pixel A. In addition, since the flattening layer 8 is formed of an organic material, the covering performance is good compared with the case where the flattening layer 8 is formed of an inorganic material, so the insulating property is high, a thick film is easily formed, and the unevenness reduction performance is high. In addition, it is possible to reduce the strain caused by the stress, and it is also possible to suppress the peeling of the film. In addition, since the organic insulating layer 6 formed of an organic material covers the corners of the lower electrode 11 and defines the light-emitting pixel A, the organic electroluminescent layer 12 and the upper electrode 13 can be formed gently. Thereby, since the electric field concentration between the upper electrode 13 and the lower electrode 11 can be suppressed, the short-circuit failure of the organic electroluminescence element 5 can be suppressed.

In addition, between the planarization layer 8 and the organic electroluminescent element 5, since the upper electrode 13 formed of an inorganic material is in close contact with the inorganic insulating layer 16, it is possible to suppress moisture from the planarization layer 8 to the organic electroluminescent element 5. spread.

In addition, since the upper electrode 13 covers the organic electroluminescent layer 12 in the light-emitting pixel A, the upper electrode 13 can also function as a sealing film for preventing the penetration of moisture into the organic electroluminescent layer 12.

In addition, since the organic electroluminescence element 5 and the drive circuit 7 are in contact with the first substrate 2, it is possible to save space in the thickness direction of the first substrate 2. In addition, for example, when the light-emitting device 1 is a bottom-emission type that emits light on the first substrate 2 side, excellent optical characteristics can be obtained.

In addition, since the organic electroluminescence element 5 is sealed by the first substrate 2, the second substrate 3 and the adhesive 4, it is possible to achieve a longer life.

(Second embodiment) The second embodiment is basically the same as the first embodiment, and differs from the first embodiment only in the structure of the organic insulating layer. Therefore, in the following, only the contents different from the first embodiment will be described, and the same contents as the first embodiment will be omitted.

As shown in FIGS. 5 to 7, the light-emitting device 1A of this embodiment includes a first substrate 2, a second substrate 3, an adhesive 4, an organic electroluminescent element 5, an organic insulating layer 6A, a drive circuit 7, and a planarization layer 8 and desiccant 9. In addition, FIG. 5 is a cross-sectional view taken along line V-V shown in FIGS. 6 and 7.

The organic insulating layer 6A is a layer corresponding to the organic insulating layer 6 of the first embodiment. The function and material of the organic insulating layer 6A are the same as those of the organic insulating layer 6 of the first embodiment. The organic insulating layer 6A is arranged in the sealed space S similarly to the organic insulating layer 6 of the first embodiment, and an opening 14 for forming the light-emitting pixel A is formed. Both ends of the organic insulating layer 6A in the long-side direction D1 cover the ends of the planarizing layer 8, and both ends of the organic insulating layer 6A in the short-side direction D2 do not cover the planarizing layer 8 at all.

The organic insulating layer 6A has: a first organic insulating layer portion 6A1 that defines the light-emitting pixel A; and a second organic insulating layer portion 6A2 that covers the end of the planarization layer 8. The first organic insulating layer portion 6A1 and the second organic insulating layer portion 6A2 are divided between the light-emitting pixel A and the planarization layer 8. The division of the first organic insulating layer portion 6A1 and the second organic insulating layer portion 6A2 means that the first organic insulating layer portion 6A1 and the second organic insulating layer portion 6A2 are separated without contact.

The organic insulating layer 6A has one first organic insulating layer portion 6A1 that delimits all the light-emitting pixels A. That is, in one first organic insulating layer portion 6A1, all the openings 14 defining the light-emitting pixels A are formed. On the other hand, the organic insulating layer 6A has a pair of second organic insulating layer portions 6A2, and the pair of second organic insulating layer portions 6A2 are arranged on the first organic insulating layer portion 6A1 so as to cover the ends of the planarization layer 8 respectively. Both sides in the long side direction D1.

The portion between the first organic insulating layer portion 6A1 and the second organic insulating layer portion 6A2 where the organic insulating layer 6A is not formed is referred to as a divided portion 6A3. That is, the divided portion 6A3 is a portion where the first organic insulating layer portion 6A1 and the second organic insulating layer portion 6A2 are divided. The dividing portion 6A3 is a portion that divides an organic insulating layer that may become a moisture propagation path, and in this embodiment, the organic electroluminescent layer 12 is provided in the dividing portion 6A3. That is, by dividing the organic insulating layers (the first organic insulating layer portion 6A1 and the second organic insulating layer portion 6A2) that may become the moisture propagation path by the dividing portion 6A3, it is possible to prevent penetration from the end of the light emitting device 1A The moisture reaches the light-emitting pixel A. The division 6A3 may be provided at any position as long as it is between the light-emitting pixel A and the planarization layer 8. In addition, the dividing portion 6A3 may have any width and shape as long as it can divide the moisture propagation path.

As described above, in the light-emitting device 1A of the present embodiment, since the first organic insulating layer portion 6A1 and the second organic insulating layer portion 6A2 are divided between the light-emitting pixel A and the planarization layer 8, even if moisture penetrates from the planarization layer 8 To the second organic insulating layer portion 6A2, the propagation of this moisture is blocked by the dividing portion 6A3 between the first organic insulating layer portion 6A1 and the second organic insulating layer portion 6A2. Therefore, it is possible to further suppress the occurrence of uneven light emission and uneven brightness of the light-emitting pixels.

The preferred embodiments of the present invention have been described above, but the present invention is not limited to the above embodiments. For example, in the above-described embodiment, the desiccant is filled in the sealed space without a gap, but the desiccant may be any as long as it can dry the sealed space. For example, as in the light-emitting device 1B described in FIGS. 8 and 9, the desiccant 9B formed in a sheet shape can be attached to the second substrate 3 from the sealed space S side. 8 is a schematic cross-sectional view corresponding to the III-III line shown in FIG. 2, and FIG. 9 is a schematic cross-sectional view corresponding to the IV-IV line described in FIG. 2.

1. 1A, 1B‧‧‧‧Lighting device 1a‧‧‧Long side 1b‧‧‧short side 2‧‧‧The first substrate 3‧‧‧Second substrate 4‧‧‧adhesive 5‧‧‧ organic electroluminescent element 6, 6A‧‧‧ organic insulating layer 6A1‧‧‧The first organic insulating layer 6A2‧‧‧Second Organic Insulation Layer 6A3‧‧‧ Division 7‧‧‧Drive circuit 8‧‧‧Planning layer 9, 9B‧‧‧Desiccant 11‧‧‧Lower electrode 12‧‧‧ organic electroluminescent layer 13‧‧‧Upper electrode 14‧‧‧ opening 15‧‧‧Wiring 16‧‧‧Inorganic insulating layer 17‧‧‧Inorganic insulating layer A‧‧‧Light emitting pixels S‧‧‧sealed space

FIG. 1 is a schematic plan view showing a light-emitting device of an embodiment. 2 is a schematic cross-sectional view showing a light-emitting device of the first embodiment. Fig. 3 is a schematic cross-sectional view taken along line III-III shown in Fig. 2. 4 is a schematic cross-sectional view taken along line IV-IV shown in FIG. 2. 5 is a schematic cross-sectional view showing a light-emitting device of a second embodiment. 6 is a schematic cross-sectional view taken along the line VI-VI shown in FIG. 5. 7 is a schematic cross-sectional view taken along the line VII-VII shown in FIG. 5. 8 is a schematic cross-sectional view showing a light-emitting device of a modified example. 9 is a schematic cross-sectional view of a light-emitting device showing a modification.

Domestic storage information (please note in order of storage institution, date, number) no

Overseas hosting information (please note in order of hosting country, institution, date, number) no

1‧‧‧Lighting device

2‧‧‧The first substrate

3‧‧‧Second substrate

4‧‧‧adhesive

5‧‧‧ organic electroluminescent element

6‧‧‧ Organic insulating layer

7‧‧‧Drive circuit

8‧‧‧Planning layer

9‧‧‧Desiccant

11‧‧‧Lower electrode

12‧‧‧ organic electroluminescent layer

13‧‧‧Upper electrode

14‧‧‧ opening

15‧‧‧Wiring

16‧‧‧Inorganic insulating layer

17‧‧‧Inorganic insulating layer

A‧‧‧Light emitting pixels

S‧‧‧sealed space

Claims (5)

A light-emitting device comprising: a first substrate; an organic electroluminescence element formed by sequentially arranging a lower electrode, an organic electroluminescence layer, and an upper electrode from the first substrate side on the first substrate; a drive circuit , Which is arranged on the first substrate and used to drive the organic electroluminescent element; a planarization layer, which is formed of an organic material and covers the drive circuit to fill the irregularities of the drive circuit; an organic insulating layer, which is made of organic The material forms and covers the corners of the lower electrode to define a light-emitting pixel; and, an inorganic insulating layer disposed on the lower electrode except for the light-emitting pixel; wherein the driving circuit corresponds to each light-emitting pixel It is provided that the planarization layer is disposed away from the organic electroluminescent element in a plan view, the upper electrode is formed of an inorganic material, and the upper electrode and the inorganic insulating layer are formed on the planarization layer and the organic electroluminescent element Closely connected. The light-emitting device according to claim 1, wherein the upper electrode covers the organic electroluminescent layer in the light-emitting pixel. The light-emitting device according to claim 2, wherein the foregoing has The organic insulating layer includes: a first organic insulating layer portion that delimits the light-emitting pixel; and a second organic insulating layer portion that covers the end of the planarization layer; and the first organic insulating layer portion and the first The two organic insulating layer portions are separated between the light-emitting pixel and the planarization layer. The light-emitting device according to any one of claims 1 to 3, wherein the organic electroluminescence element and the drive circuit are in contact with the first substrate. The light-emitting device according to any one of claims 1 to 3, further comprising: a second substrate facing the first substrate; and an adhesive that bonds the first substrate and the second substrate, A sealed space for sealing the organic electroluminescent element is formed between the first substrate and the second substrate.

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