TWI685043B - Chip pressing device - Google Patents

Abstract

A chip pressing device can be fixedly disposed on a chip carrier to press against a chip disposed on the chip carrier. The chip pressing device includes: a body, a pressing unit and an engaging assembly. The pressing unit is detachably disposed on the body. The engaging assembly is disposed on the body, and the body is fixedly disposed on the chip carrier via the engaging assembly. The pressing unit has a contact structure. When the chip pressing device is fixedly disposed on the chip carrier, the contact structure presses the chip. Since the pressing unit is detachably disposed on the body, a user can replace the pressing unit having the corresponding contact structure depending on the type of the chip.

Description

Wafer pressing device and chip pressing device kit

The invention relates to a wafer pressing device and a wafer pressing device kit, in particular to a manual type wafer pressing device and a wafer pressing device kit.

Generally speaking, in the process of developing a wafer, the R&D personnel of the wafer must always carry out on-board testing of the wafer to verify the development result. The method of on-board testing is roughly as follows: the R&D personnel first set the chip on an electrical socket (socket), and then the R&D personnel will use the corresponding pressure component to press against the chip to ensure that the chip is in the inspection process It can be firmly connected to the wafer carrier.

For the R&D personnel of the chip, when developing chips of different sizes, it is necessary to purchase the corresponding size of the electrical connection seat and the corresponding pressure component, and the chips of different sizes cannot share the same electrical connection seat or the pressure Components, which increases R&D costs. For manufacturers of electrical connection bases and pressure-resistant components, in response to the testing needs of wafers of different sizes, manufacturers must redesign the corresponding electrical connection bases and voltage-resistant components, thereby increasing production costs.

The chip pressing device and the chip pressing device kit of the present invention are used to improve the existing manufacturers must customize different electrical connection seats and pressing components (commonly known as hand measuring cover components) according to the needs of different customers, resulting in production costs The problem of lifting; the chip pressing device and the chip pressing device kit of the present invention can also improve R&D personnel must purchase different electrical connection seats and their pressing components when testing chips of different sizes, which leads to the problem of increased research and development costs .

An embodiment of the present invention discloses a chip pressing device, which is used to be fixedly arranged on a chip carrying device to press a chip arranged on the chip carrying device. The chip pressing device comprises: a body, a pressing unit and One snap assembly. At least one first connection component is provided on one side of the body. The pressing unit is detachably disposed on the body, and the pressing unit is provided with a second connection component, the second connection component is detachably connected to the first connection component, and the pressing unit also has a contact structure; wherein, When the second connection component and the first connection component are connected to each other, the pressing unit is fixedly disposed on the body. The engaging component is disposed on the body, and the engaging component can be operated to engage with the wafer carrying device. Wherein, when the clamping component and the wafer carrying device are engaged with each other, and the wafer pressing device is fixedly disposed above the position where the wafer is provided with the wafer, the contact structure can correspond to the side of the pressing wafer opposite to the wafer carrying device.

The embodiment of the invention also discloses a chip pressing device kit, which comprises: a chip pressing device and a plurality of pressing units. The chip pressing device is used for fixing on a chip carrying device to press a chip arranged on the chip carrying device. The chip pressing device comprises: a body and a clamping component. At least one first connection component is provided on one side of the body. The engaging component is disposed on the body, and the engaging component can be operated to be engaged with the wafer carrying device. Each pressing unit is detachably disposed on the body, and each pressing unit is provided with a second connecting component, and each second connecting component Detachably connected with the first connection component; each pressing unit also has a contact structure, and the plurality of pressing units have different appearance contact structures; wherein, when the second connection component of each pressing unit is connected to the first When a connecting component is connected to each other, each pressing unit is fixedly disposed on the body. Wherein, the clamping component of any pressing unit and the wafer carrier are engaged with each other, and when the wafer pressing device is fixedly disposed above the position where the wafer is mounted on the wafer carrier, the contact structure of the pressing unit can correspond to the opposite of pressing the wafer On one side of the wafer carrier.

In summary, the chip pressing device and the chip pressing device kit of the present invention can be replaced according to demand, so the production cost of the electrical connector manufacturer can be reduced, and the research and development cost of the chip R&D personnel can also be reduced .

In order to understand the features and technical contents of the present invention, please refer to the following detailed description and drawings of the present invention, but these descriptions and drawings are only used to illustrate the present invention, not to make any protection to the scope of the present invention. limit.

In the following description, if there is a record, please refer to the specific drawing or as shown in the specific drawing, which is only used to emphasize in the subsequent description, most of the related content mentioned in the specific drawing, However, it does not limit that only specific patterns can be referred to in the subsequent description.

Please refer to FIGS. 1 to 6 together. FIGS. 1 and 2 show schematic assembly diagrams of the wafer pressing device of the present invention; FIG. 3 shows a schematic diagram of the separation of the pressing unit and the body of the wafer pressing device of the present invention; 4 is a schematic view of the wafer pressing device of the present invention fixedly mounted on the wafer carrier; FIGS. 5 and 6 are exploded schematic views of the wafer pressing device of the present invention. As shown in the figure, the wafer pressing device 1 includes a body 10, a pressing unit 20 and an engaging component 30.

As shown in FIGS. 1 to 3, at least one first connecting component 11 is provided on one side of the body 10. The pressing unit 20 is provided with a second connecting component 21, and the pressing unit 20 is detachably disposed on the side of the body 10 where the first connecting component 11 is provided. The second connection component 21 can be connected to the first connection component 11, and the pressing unit 20 can be connected to the first connection component 11 through the second connection component 21, thereby being fixed to one side of the body 10. The pressing unit 20 has a contact structure 201 for pressing the wafer B disposed on the wafer carrier A. The engaging component 30 is disposed on the body 10. The clamping assembly 30 can be operated, so that the wafer pressing device 1 and the wafer carrier A are engaged or separated from each other, that is, the body 10 can be fixedly disposed on the wafer carrier A through the clamping assembly 30 Above the position of B.

As shown in FIG. 4, when the pressing unit 20 is fixedly disposed on one side of the body 10 and the body 10 is fixed above the wafer carrier A through the engaging assembly 30, the contact structure 201 of the pressing unit 20 will correspondingly press The wafer B is opposite to the side of the wafer carrier A; at this time, relevant personnel can perform relevant inspection operations on the wafer B through the wafer carrier A. In practical applications, the wafer carrier A may be various electrical sockets for connecting to the wafer B, and the form of the wafer B may also vary according to requirements.

Based on the above, a practical example will be given below to explain in detail the possible specific implementations of the body 10, the first connecting component 11, the pressing unit 20, the second connecting component 21, and the engaging component 30. As shown in FIG. 6, one side of the body 10 may be concavely formed with an engaging groove 12. The first connection assembly 11 may include four first magnetic attraction members 111, and the plurality of first magnetic attraction members 111 are disposed on the body 10, and the plurality of first magnetic attraction members 111 are correspondingly located in the engaging groove 12.

As shown in FIGS. 2 to 6, the pressing unit 20 may have an engaging structure 202, and one side of the engaging structure 202 protrudes outward to form a contact structure 201. The appearance of the engaging structure 202 corresponds to the appearance of the engaging groove 12, and the engaging structure 202 can be correspondingly arranged in the engaging groove 12; when the engaging structure 202 is fixedly arranged in the engaging groove 12, contact The structure 201 will be exposed on one side of the body 10.

The second connection component 21 may include four second magnetic attraction members 211, each second magnetic attraction member 211 can attract each first magnetic attraction member 111, for example, each first magnetic attraction member 111 and each The second magnetic attraction member 211 may be magnets of different polarities, or one of the first magnetic attraction member 111 and the second magnetic attraction member 211 is a magnet, and the other is a member that can be attracted by the magnet. When the engaging structure 202 is engaged and fixedly arranged in the engaging groove 12, each first magnetic attraction member 111 and each second magnetic attraction member 211 will attract each other, and the pressing unit 20 will be correspondingly fixedly arranged on the body 10. side.

The shape, size, number, etc. of the first magnetic attraction member 111 and the second magnetic attraction member 211 can be changed according to requirements, and are not limited to those shown in the figure. The manner in which the first connection component 11 and the second connection component 21 are connected to each other is not limited to the above-mentioned magnetic attraction method, as long as the first connection component 11 and the second connection component 21 can be connected to each other and fixed to each other, and the first connection The component 11 and the second connecting component 21 can be directly separated by manual means, and all belong to the scope covered by this embodiment. For example, the first connection assembly 11 may not have the first magnetic attraction member 111, the second connection assembly 21 may not have the second magnetic attraction member 211, and the first connection assembly 11 and the second connection assembly 21 That is, the engaging groove 12 and the engaging structure 202 respectively, that is, the first connecting component 11 and the second connecting component 21 may also be directly connected by engaging with each other.

As mentioned above, since the pressing unit 20 can be easily detached from the body 10, the user can replace the corresponding shape according to the appearance and size of the chip B to be pressed , The contact unit 201 of the size contact structure 201. Specifically, in the case where two wafers B of different sizes are respectively disposed on two wafer carriers A of the same size, the user can simply replace the different pressing units 20 to allow the body 10 to pass through the card The engaging assembly 30 successively engages with the wafer carrier A of the same size, and can use different pressing units 20 to press the wafers B of different sizes successively.

As shown in FIGS. 3, 5 and 6, it is worth mentioning that, in practical applications, the body 10 may also have a first foolproof structure 13, and the pressing unit 20 also has a second foolproof structure 22 . When the first connection component 11 and the second connection component 21 are connected to each other, and the pressing unit 20 is fixed to the body 10, the first foolproof structure 13 and the second foolproof structure 22 are fixed to each other. Specifically, a position of the body 10 adjacent to the engaging groove 12 may be a concave formed with a groove, the groove communicates with the engaging groove 12, and the groove may serve as the first foolproof structure 13. The second foolproof structure 22 may be a protruding structure formed by the engaging structure 202 extending outward. In this way, when the user fixes the engaging structure 202 to the engaging groove 12, the user must make the second foolproof structure 22 correspond to the first foolproof structure 13, so that the engaging structure 202 can be smoothly engaged and installed In the engaging groove 12, the problem that the user incorrectly installs the pressing unit 20 and causes the contact structure 201 to incorrectly press the wafer B can be avoided. Of course, the shapes and installation positions of the first foolproof structure 13 and the second foolproof structure 22 may be changed according to requirements, and the figures shown are only one of the exemplary aspects.

As shown in FIGS. 4 to 6, two opposite side walls of the body 10 may be concavely formed with an operation groove 14. The engaging component 30 may include two fasteners 31 and two elastic members 32. Each buckle 31 may be provided with a pivot shaft 33 pivotally connected to the pivot hole 15 of the body 10. The two fasteners 31 may be correspondingly located in the two operating slots 14. One end of each fastener 31 and the wafer carrier A may have a fastening structure 311 and A1 that can be engaged with each other. The two elastic members 32 are correspondingly disposed between the two fasteners 31 and the body 10. One end of each elastic member 32 is fixed to the body 10, and the other end of the elastic member 32 is fixed to the buckling member 31. With regard to the manner in which both ends of each elastic member 32 are fixed to the buckle 31 and the body 10, for example, the buckle 31 and the body 10 shown in the figure are respectively formed with corresponding insertion grooves, and the elastic member 32 Each end is correspondingly set in the embedded groove, but not limited to this.

As shown in FIG. 7, when each buckle 31 is operated and rotated relative to the body 10, each elastic member 32 between each buckle 31 and the body 10 will be squeezed to generate an elastic restoring force correspondingly, the user In the state of FIG. 7, the two fasteners 31 can be clamped to the wafer carrier A. As shown in FIG. 4, when the engaging structure 311 of the engaging member 31 correspondingly engages with the engaging structure A1 of the wafer carrier A, the elastic restoring force generated by each elastic member 32 may be such that each engaging member 31 The buckling structure 311 is used to hold the buckling structure A1 of the wafer carrier A more firmly.

In this embodiment, the clamping assembly 30 has two fasteners 31, and the body 10 clamps the wafer carrier A through the two fasteners 31, and is accordingly fixed above the wafer carrier A as an example However, the components included in the snap assembly 30 are not limited thereto. As long as the engaging assembly 30 can detachably fix the body 10 to the wafer carrier A, the engaging assembly 30 can be of any structure or can include any member.

It is worth mentioning that in different applications, the chip pressing device 1 may also include a pivoting component (not shown), the pivoting component is fixedly disposed on the body 10, and the pivoting component of the chip pressing device 1 The pivoting components (not shown) corresponding to the wafer carrier A can be pivotally connected to each other, whereby the wafer pressing device 1 can be operated to rotate relative to the wafer carrier A. When the user operates the wafer pressing device 1 to rotate the wafer pressing device 1 toward the wafer carrier A, and accordingly the wafer pressing device 1 is located directly above the wafer carrier A, the user can reuse the engagement In the assembly 30, the wafer pressing device 1 and the wafer carrier A are engaged with each other, so that the wafer pressing device 1 is fixedly arranged directly above the wafer carrier A.

Please refer to FIG. 8, which is an exploded view of the chip pressing device kit 2 of the present invention. As shown in the figure, the wafer pressing device kit 2 includes a wafer pressing device 1 and a plurality of pressing units 20A, 20B. The chip pressing device 1 includes a body 10 and an engaging component 30. The body 10 is provided with a first connecting component 11. Each pressing unit 20A (20B) has an engaging structure 202, a contact structure 201 and a second connection component 21. For detailed descriptions of the body 10, the engaging component 30, the first connecting component 11, the engaging structure 202, the contact structure 201, and the second connecting component 21 of each pressing unit 20, please refer to the foregoing description, and no further description is provided here.

In summary, the wafer pressing device 1 and the wafer pressing device set 2 of the present invention can allow the user to replace the pressing unit 20 with different contact structures 201 according to different sizes of the wafer B, thereby, The user can use the same body 10 and different pressing units 20 to press the wafer B provided on the wafer carrier of the same size but with different sizes, and the user does not need to purchase two sets of wafer pressing devices 1. In turn, the R&D costs of relevant R&D personnel can be reduced. In contrast, for the manufacturer of the wafer pressing device 1, for the wafer carrier A of the same size, the manufacturer may only develop and produce different pressing units 20 without redesigning the entire wafer pressing device 1, so that Reduce its production costs and research and development expenses.

The above are only the preferred and feasible embodiments of the present invention, and do not limit the patent scope of the present invention. Therefore, equivalent technical changes made by using the description and drawings of the present invention are included in the protection scope of the present invention. .

1‧‧‧chip pressure device 2‧‧‧chip pressure device kit 10‧‧‧Body 11‧‧‧The first connection assembly 111‧‧‧The first magnetic member 12‧‧‧Snap slot 13‧‧‧The first foolproof structure 14‧‧‧Operation slot 15‧‧‧Pivot hole 20, 20A, 20B ‧‧‧ pressure unit 201‧‧‧Contact structure 202‧‧‧Snap-in structure 21‧‧‧Second connection assembly 211‧‧‧Second magnetic member 22‧‧‧The second foolproof structure 30‧‧‧Snap-in components 31‧‧‧Snap fastener 311‧‧‧buckle structure 32‧‧‧Elastic parts 33‧‧‧ pivot shaft A‧‧‧chip carrier A1‧‧‧buckle structure B‧‧‧chip

FIG. 1 is an assembly diagram of a wafer pressing device of the present invention.

2 is an assembly diagram of the wafer pressing device of the present invention from another perspective.

3 is an exploded schematic view of the pressing unit and the body of the wafer pressing device of the present invention.

4 is a schematic side view of the wafer pressing device of the present invention fixedly disposed on the wafer carrier.

FIG. 5 is an exploded schematic view of the wafer pressing device of the present invention.

6 is an exploded schematic view of the wafer pressing device of the present invention from another perspective.

7 is a schematic side view of the operation of the wafer pressing device of the present invention.

FIG. 8 is an exploded schematic view of the wafer pressing device kit of the present invention.

1‧‧‧chip pressure device

10‧‧‧Body

11‧‧‧The first connection assembly

111‧‧‧The first magnetic member

12‧‧‧Snap slot

13‧‧‧The first foolproof structure

20‧‧‧Pressure unit

201‧‧‧Contact structure

202‧‧‧Snap-in structure

21‧‧‧Second connection assembly

211‧‧‧Second magnetic member

22‧‧‧The second foolproof structure

30‧‧‧Snap-in components

31‧‧‧Snap fastener

311‧‧‧buckle structure

Claims (10)

A wafer pressing device is used for fixing on a wafer carrying device to press a chip arranged on the wafer carrying device. The wafer pressing device includes: a body, at least one side of which is provided A first connection component; a pressure unit, the pressure unit is detachably disposed on the body, and the pressure unit is provided with a second connection component, the second connection component is detachably connected with the The first connecting component is connected, and the pressing unit further has a contact structure; wherein, when the second connecting component and the first connecting component are connected to each other, the pressing unit is fixedly disposed on the A body; an engaging component, which is disposed on the body, and the engaging component can be operated to be engaged with the wafer carrier device; wherein, when the engaging component and the wafer carrier device are engaged with each other When the wafer pressing device is fixed above the position where the wafer is mounted on the wafer carrier, the contact structure can correspondingly press the side of the wafer opposite to the wafer carrier. The wafer pressing device according to claim 1, wherein two opposite sides of the body are respectively concavely formed with an operation groove, and the engaging component includes two snap parts and two elastic parts, each of which The buckle is pivotally connected to the body, and the two buckles are correspondingly located in the two operation slots; one end of each buckle and the wafer carrying device respectively have mutually capable of being engaged with each other A snap-fit structure; the two elastic members are correspondingly disposed between the two snap members and the body; one end of each elastic member is fixed to the body, and the other end is fixed to the snap When each of the fasteners is operated and rotated relative to the body, each of the elastic members between each of the fasteners and the body is squeezed to generate an elastic restoring force. The wafer pressing device according to claim 1, wherein the body has an engaging groove, the first connection assembly includes at least a first magnetic attraction member, and the first magnetic attraction member is located on the card In the groove; the second connection assembly includes at least one second magnetic member; the pressing unit is opposite to the side having the contact structure is provided with the second magnetic member; when the pressing unit On the contrary, when the side with the contact structure is engaged in the engaging groove, the second magnetic attraction member can correspondingly attract each other to the first magnetic attraction member, and the second connection assembly It can be fixed on the body. The wafer pressing device according to claim 1, wherein the body further has a first foolproof structure, and the pressing unit further has a second foolproof structure; when the first connecting component is connected to the The second connection components are connected to each other, and when the pressing unit is fixed to the body, the first foolproof structure and the second foolproof structure are fixed to each other. The wafer pressing device according to claim 3, wherein a recess is formed in the body at a position adjacent to the engaging groove, and the groove communicates with the engaging groove, and the concave The groove is the first foolproof structure; one side of the pressing unit protrudes outward to form the second foolproof structure. A chip pressing device kit includes: a chip pressing device, which is fixedly arranged on a chip carrying device to press a chip arranged on the chip carrying device, the chip pressing device comprises : A body with at least one first connection component on one side; an engagement component on the body, the engagement component being operable to engage with the wafer carrier; multiple contacts A pressing unit, each of the pressing units is detachably disposed on the body, and each of the pressing units is provided with a second connecting component, and each of the second connecting components is detachably connected to the first connecting component Connection; each of the pressing units further has a contact structure, and a plurality of the pressing units have different contact structures of different shapes; wherein, when the second connecting component of each pressing unit is connected to When the first connecting components are connected to each other, each of the pressing units is fixedly disposed on the body; wherein, the engaging component of any of the pressing units and the wafer carrying device are engaged with each other, and When the wafer pressing device is fixedly disposed above the position where the wafer is mounted on the wafer carrying device, the contact structure of the pressing unit can correspondingly press the wafer against the one opposite to the wafer carrying device side. The chip pressing device kit according to claim 6, wherein the opposite sides of the body are respectively concavely formed with an operation groove, and the engaging component includes two fasteners and two elastic members, each The buckle is pivotally connected to the body, and the two buckles are correspondingly located in the two operating slots; one end of each buckle and the wafer carrying device are respectively capable of being engaged with each other A snap-fit structure; two elastic members are correspondingly disposed between the two snap members and the body; one end of each elastic member is fixed to the body, and the other end is fixed to the card Fastener; when each of the fasteners is operated and rotated relative to the body, each of the elastic members between each of the fasteners and the body is squeezed to correspondingly generate an elastic restoring force. The wafer pressing device kit according to claim 6, wherein the body has an engaging groove, and the first connection assembly includes at least a first magnetic attraction member, the first magnetic attraction member is located at the In the engaging groove; the second connection assembly includes at least one second magnetic attraction member; each of the pressing units is provided with the second magnetic attraction member on the side opposite to the contact structure; when each of the When the pressing unit is opposite to the side with the contact structure, the second magnetic attraction member can be attracted to the first magnetic attraction member correspondingly, and the second The connecting component can be fixedly arranged on the body. The chip pressing device kit according to claim 6, wherein the body further has a first foolproof structure, and each of the pressing units further has a second foolproof structure; when the first connecting component is The second connection components are connected to each other, and when each of the pressing units is fixed to the body, the first foolproof structure and the second foolproof structure are fixed to each other. The wafer pressing device kit according to claim 9, wherein a recess is formed in the body adjacent to the engaging groove, and the groove communicates with the engaging groove, and the The groove is the first foolproof structure; one side of each of the pressing units protrudes outward to form the second foolproof structure.

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