TWI677730B - Camera device - Google Patents

Abstract

A lens module includes a circuit board and an optical bearing structure. The circuit board includes a bearing surface. The bearing surface includes a photosensitive area and a peripheral area surrounding the photosensitive area. The photosensitive area is provided with an image sensor. The peripheral region is provided with a first contact layer, the first contact layer forms a frame-like structure with the same size as the bottom of the optical bearing structure, and the bottom of the optical bearing structure is fixed on the first contact layer.

Description

Lens module

The invention relates to a lens module.

With the rapid development of multimedia technology, digital cameras, camcorders and mobile phones with cameras have become more and more popular with consumers, and people have increasingly higher requirements for the imaging quality of such devices. Camera module. In the prior art, the optical bearing structure is fixed on the surface of the circuit board. Because the circuit board needs to meet the requirements of electrical transmission, the surface of the circuit board is usually uneven, so it is easy to cause the optical axis of the optical bearing structure to tilt and affect the lens. The shooting quality of the module. Therefore, it is necessary to provide a lens module capable of overcoming the above technical problems.

An object of the present invention is to provide a lens module capable of solving the above problems.

A lens module includes a circuit board and an optical bearing structure. The circuit board includes a bearing surface. The bearing surface includes a photosensitive area and a peripheral area surrounding the photosensitive area. The photosensitive area is provided with an image sensor. The peripheral region is provided with a first contact layer, the first contact layer forms a frame-like structure with the same outline size as the bottom of the optical bearing structure, and the bottom of the optical bearing structure is fixed on the first contact layer .

In a preferred embodiment, the first contact layer is a closed frame structure formed by a metal layer.

In a preferred embodiment, the first contact layer includes a plurality of discontinuous metal segments, and each metal segment is strip-shaped.

In a preferred embodiment, a width of the first contact layer is not less than a bottom width of the optical bearing structure.

In a preferred embodiment, the lens module further includes a metal shell, and the bearing surface is further provided with a second contact layer, the second contact layer is a closed frame structure and surrounds the first contact layer, The metal shell is fixed to the second contact layer to form an electrical ground of the metal shell.

In a preferred embodiment, the second contact layer is electrically grounded and spaced from the first contact layer.

In a preferred embodiment, a solder resist layer is formed on a surface where the circuit region is located, and a solder resist layer is also formed between the first contact layer and the second contact layer.

In a preferred embodiment, a surface on which the first contact layer and the second contact layer are located is lower than a surface on which the solder resist layer is located.

In a preferred embodiment, the width of the second contact layer is not less than the thickness of the metal shell.

In a preferred embodiment, the lens module is a fixed focus lens module or a zoom lens module.

Compared with the prior art, the lens module provided by the present invention includes a circuit board and an optical bearing structure. The circuit board includes a bearing surface. The bearing surface includes a circuit area and a peripheral area surrounding the circuit area. There are no conductive lines and conductive holes in the peripheral area. The circuit area is provided with an image sensor. A first contact layer is provided on the bearing surface of the circuit board. The first contact layer is the bottom contour of the optical bearing structure. And a frame-like structure of the same size, the bottom of the optical bearing structure is fixed on the surface of the first contact layer, ensuring the flatness of the optical bearing structure, thereby avoiding the tilt of the optical axis of the lens unit, which is conducive to improvement Camera quality of the lens module.

100, 300‧‧‧ lens modules

10, 210‧‧‧ circuit board

20‧‧‧Image Sensor

30, 301‧‧‧ optical bearing structure

12‧‧‧ main body

14‧‧‧ extension

15‧‧‧electrical connector

101‧‧‧bearing surface

111‧‧‧ route area

121‧‧‧Peripheral area

113‧‧‧solder mask

131, 231‧‧‧ first contact layer

141‧‧‧Second contact layer

151‧‧‧Conductive line

161‧‧‧ conductive hole

32‧‧‧Voice Coil Motor

320‧‧‧ Containment Department

330‧‧‧ lens unit

40‧‧‧metal case

401‧‧‧Top

403‧‧‧through hole

405‧‧‧ bottom

233‧‧‧ metal fragments

FIG. 1 is a perspective assembly view of a lens module according to a first embodiment of the present invention.

FIG. 2 is an exploded perspective view of the lens module shown in FIG. 1.

3 is a top view of a circuit board included in the lens module shown in FIG. 1 when a solder resist layer is not provided.

FIG. 4 is a sectional view of the lens module shown in FIG. 1.

FIG. 5 is a structural diagram of a circuit board included in a lens module according to a second embodiment of the present invention.

FIG. 6 is a sectional view of a lens module according to a third embodiment of the present invention.

It should be noted that when an element is referred to as "fixed to", "disposed to" or "mounted on" another element, it may be directly on the other element or indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or indirectly connected to the other element. In addition, the connection can be used for fixing or circuit connection.

It should be understood that the terms "length", "width", "up", "down", "front", "rear", "left", "right", "vertical", "level", "top" The orientations or positional relationships indicated by "bottom", "inside", "outer", etc. are based on the orientations or positional relationships shown in the drawings, and are only for the convenience of describing the embodiments of the present invention and simplifying the description, rather than indicating or implying The device or element must have a specific orientation, be constructed and operate in a specific orientation, and therefore cannot be understood as a limitation on the present invention.

First embodiment

Please refer to FIGS. 1 to 4, which is a lens module 100 provided by the first embodiment of the present invention, and this embodiment takes the zoom lens module as an example to illustrate the present invention. The lens module 100 includes a circuit board 10, an image sensor 20 electrically connected to the circuit board 10, an optical bearing structure 30 disposed on the circuit board 10, and an image sensor 20 disposed on the circuit board 10. Metal case 40.

The circuit board 10 is a rigid board, a flexible board, or a rigid-flexible board. In this embodiment, the circuit board 10 is a rigid-soft board. The circuit board 10 includes a main body portion 12 and an extension portion 14 connected to the main body portion 12. The main body portion 12 is used for setting the image sensor 20, the optical bearing structure 30 and the metal casing 40. The extension portion 14 is used to provide an electrical connector 15, and the electrical connector 15 It is electrically connected to the image sensor 20 and is used for signal transmission between the lens module 100 and the electronic device.

The main body portion 12 includes a bearing surface 101. The bearing surface 101 includes a circuit area 111 and a peripheral area 121 surrounding the circuit area 111. As shown in FIG. 3, the circuit area 111 is used for setting conductive lines 151 and conductive holes 161 required for the lens module to work normally. In addition, a solder mask layer 113 is formed on a surface of the circuit region 111, and the solder mask layer 113 is used for protecting the conductive circuits and conductive holes. A first contact layer 131 and a second contact layer 141 are disposed at intervals in the peripheral region 121. A solder resist layer 113 is also formed between the first contact layer 131 and the second contact layer 141.

The first contact layer 131 is a frame-shaped structure with the same size as the bottom of the optical bearing structure 30. In this embodiment, the first contact layer 131 is a closed frame structure. The second contact layer 141 is a closed frame structure. In this embodiment, the first contact layer 131 and the second contact layer 141 are made of metal and are formed at the same time. The second contact layer 141 is electrically grounded.

The surface on which the first contact layer 131 and the second contact layer 141 are located is lower than the surface on which the solder resist layer 113 is located. Therefore, when the optical bearing structure 30 is fixed on the surface of the first contact layer 131, At the same time, it can also play a role of limiting the optical bearing structure 30. The relationship between the second contact layer 141 and the metal shell 40 is also the same. On the one hand, it can play a role of limiting, on the other hand, it can also realize the grounding of the metal shell and shield the external signals. Because the first contact layer 131 and the second contact layer 141 are formed at the same time as the lead line, and the conductive line is formed, the solder resist layer 113 is formed, so that the surface on which the solder resist layer 113 is located will protrude from the surface. Surfaces on which the first contact layer 131 and the second contact layer 141 are located.

Of course, it can be understood that the materials of the first contact layer 131 and the second contact layer 141 may be different, and may not be formed at the same time. For example, the material of the first contact layer 131 is a solder resist layer formed on the surface of the insulating layer included in the circuit board, and the material of the second contact layer 141 is a metal layer.

The image sensor 20 is disposed in the circuit region 111 of the main body 12 and is electrically connected to the circuit region 111 (not shown). The image sensor 20 may be a charge-coupled device or a Complementary metal oxide semiconductor. The image sensor 20 may be a chip-level package (CSP) type image sensor, or may be a chip-on-chip package (COB) type image sensor.

In this embodiment, the optical bearing structure 30 is a substantially square supporting frame body made of plastic material for supporting and setting a zoom lens module. In this embodiment, the zoom lens module includes a voice coil Motor 32. The optical bearing structure 30 is disposed on a surface of the first contact layer 131. The optical bearing structure 30 can be fixed on the surface of the first contact layer 131 by colloid. The width of the first contact layer 131 is not less than the bottom width (thickness) of the optical bearing structure 30 to ensure the flatness of the optical bearing structure 30. Preferably, the bottom width of the optical bearing structure 30 is in contact with the first The widths of the layers 131 are equal. Since no conductive circuit is arranged at the position where the first contact layer 131 is provided, the flatness of the first contact layer 131 can be ensured, thereby ensuring the flatness when the optical bearing structure 30 is installed. Subsequently, when the voice coil motor 32 The optical bearing structure 30 is fixed to ensure that the optical axis of the voice coil motor 32 does not tilt.

The voice coil motor 32 is assembled on the circuit board 10 through the optical bearing structure 30. The voice coil motor 32 includes a receiving portion 320 for receiving the lens unit 330. The accommodating portion 320 and the lens unit 330 may be screw-fitted, snap-fitted, or the like to fix the lens unit 330 therein. The circuit board 10 controls the voice coil motor 32 to drive the lens unit 330 so that the lens unit 330 can move within the housing 320 to perform focusing or zooming operations.

The bottom of the metal casing 40 is fixed on the surface where the second contact layer 141 is located. The metal shell 40 is a bottomless rectangular parallelepiped shell. A through hole 403 is defined on the top surface 401 of the metal casing 40 as a light through hole, so that light can enter the lens unit 330. The bottom 405 of the metal casing 40 may be fixed to the second contact layer 141 by welding or conductive adhesive, so as to realize the electrical grounding of the metal casing 40 and make the metal casing 40 have a ground covering effect. Since the width of the second contact layer 141 is not less than the thickness of the metal shell 40 and the second contact layer 141 is a closed frame structure, therefore, the metal shell 40 and the second contact layer 141 Form a sealed structure. Therefore, the metal case 40 can conduct the electromagnetic interference generated by the voice coil motor 32 to Ground to eliminate electromagnetic interference; it can also shield interference signals outside the metal casing 40 to prevent noise from entering the metal casing to interfere with the operation of the lens module 100.

Second embodiment

Please refer to FIG. 5, a circuit board 210 included in a lens module according to a second embodiment. The structure of the circuit board 210 provided in this embodiment is basically the same as that of the circuit board 10 provided in the first embodiment, that is, the circuit board 210 includes a bearing surface 101 that includes a circuit area 111 and surrounds the circuit area A peripheral region 121 of 111. The circuit region 111 is provided with the image sensor 20. The peripheral region 121 is provided with a first contact layer 231 and a second contact layer 141 spaced from the first contact layer 231. The difference is that the first contact layer 231 includes a plurality of discontinuous metal segments 233, and each metal segment 233 is strip-shaped. The length of each metal segment 233 is consistent with or slightly smaller than the length of each side of the bottom of the optical bearing structure 30.

Third embodiment

Please refer to FIG. 6, a lens module 300 according to a third embodiment. The structure of the lens module 300 provided in this embodiment is basically the same as that of the lens module 100 provided in the first embodiment, that is, the lens module 300 includes a circuit board 10, and an image sense electrically disposed on the circuit board 10. The tester 20, an optical bearing structure 301 provided on the circuit board 10, and a metal case 40 provided on the circuit board 10. The difference is that the lens module 300 is a fixed focus lens module, and the optical bearing structure 301 is a lens holder (Lens Holder) for receiving the lens unit 330. The metal case 40 covers the optical bearing structure 301 and is fixed to the second contact layer 141. The mask structure formed by the metal case 40 and the second contact layer 141 can prevent external noise from sensing the image The signal from the camera 20 is disturbed to ensure the shooting quality.

In summary, the lens modules 100 and 300 provided by the present invention are provided with the first contact layers 131 and 231 on the bearing surface 101 of the circuit board 10. The first contact layer 131 is in contact with the optical bearing structure 30. A frame-like structure with the same dimensions at the bottom. The optical bearing structure 30 is fixed on the circuit board 10, In addition, the bottom of the optical bearing structure 30 is located on the surfaces of the first contact layers 131 and 231, so that the optical axis of the lens unit can be prevented from tilting, which is beneficial to improving the imaging quality of the lens module.

In summary, the present invention has indeed met the requirements for an invention patent, and a patent application was filed in accordance with the law. However, the above are only preferred embodiments of the present invention, and the scope of patent application in this case cannot be limited by this limitation. For example, those who are familiar with the skills of this case and equivalent modifications or changes made in accordance with the spirit of the present invention should be covered by the following patent applications.

Claims (9)

A lens module includes a circuit board and an optical bearing structure. The circuit board includes a bearing surface. The bearing surface includes a circuit area and a peripheral area surrounding the circuit area. The circuit area is provided with an image sensor. Wherein: the peripheral region is provided with a first contact layer, the first contact layer is a frame-like structure with the same outline and size as the bottom of the optical bearing structure, and the bottom of the optical bearing structure is fixed to the first The surface of the contact layer, the lens module further includes a metal shell, the bearing surface is further provided with a second contact layer, and the metal shell is fixed with the second contact layer to form an electrical ground of the metal shell. The second contact layer is electrically grounded, and the second contact layer surrounds the first contact layer and is spaced from the first contact layer. The lens module according to claim 1, wherein the first contact layer is a closed frame structure formed by a metal layer. The lens module according to claim 1, wherein the first contact layer includes a plurality of discontinuous metal segments, and each metal segment is strip-shaped. The lens module according to claim 1, wherein a width of the first contact layer is not less than a bottom width of the optical bearing structure. The lens module according to claim 4, wherein the second contact layer is a closed frame structure. The lens module according to claim 1, wherein a solder resist layer is formed on a surface where the circuit area is located, and a solder resist layer is also formed between the first contact layer and the second contact layer. The lens module according to claim 6, wherein a surface on which the first contact layer and the second contact layer are located is lower than a surface on which the solder resist layer is located. The lens module according to claim 1, wherein a width of the second contact layer is not less than a thickness of the metal casing. The lens module according to claim 1, wherein the lens module is a fixed focus lens module or a zoom lens module.