[go: up one dir, main page]
More Web Proxy on the site http://driver.im/

TWI671202B - Method of manufacturing sheet film - Google Patents

Method of manufacturing sheet film Download PDF

Info

Publication number
TWI671202B
TWI671202B TW107142080A TW107142080A TWI671202B TW I671202 B TWI671202 B TW I671202B TW 107142080 A TW107142080 A TW 107142080A TW 107142080 A TW107142080 A TW 107142080A TW I671202 B TWI671202 B TW I671202B
Authority
TW
Taiwan
Prior art keywords
film
multilayer film
adhesive layer
cutting
layer
Prior art date
Application number
TW107142080A
Other languages
Chinese (zh)
Other versions
TW201930089A (en
Inventor
中原亮
八幡直樹
Original Assignee
日商住友化學股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商住友化學股份有限公司 filed Critical 日商住友化學股份有限公司
Publication of TW201930089A publication Critical patent/TW201930089A/en
Application granted granted Critical
Publication of TWI671202B publication Critical patent/TWI671202B/en

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B26HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26FPERFORATING; PUNCHING; CUTTING-OUT; STAMPING-OUT; SEVERING BY MEANS OTHER THAN CUTTING
    • B26F1/00Perforating; Punching; Cutting-out; Stamping-out; Apparatus therefor
    • B26F1/38Cutting-out; Stamping-out
    • B26F1/40Cutting-out; Stamping-out using a press, e.g. of the ram type
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B26HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26DCUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
    • B26D5/00Arrangements for operating and controlling machines or devices for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B26HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26FPERFORATING; PUNCHING; CUTTING-OUT; STAMPING-OUT; SEVERING BY MEANS OTHER THAN CUTTING
    • B26F1/00Perforating; Punching; Cutting-out; Stamping-out; Apparatus therefor
    • B26F1/38Cutting-out; Stamping-out
    • B26F1/44Cutters therefor; Dies therefor
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00Ancillary operations in connection with laminating processes
    • B32B38/0004Cutting, tearing or severing, e.g. bursting; Cutter details
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04Interconnection of layers
    • B32B7/12Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B26HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26FPERFORATING; PUNCHING; CUTTING-OUT; STAMPING-OUT; SEVERING BY MEANS OTHER THAN CUTTING
    • B26F2210/00Perforating, punching, cutting-out, stamping-out, severing by means other than cutting of specific products
    • B26F2210/02Perforating, punching, cutting-out, stamping-out, severing by means other than cutting of specific products of stacked sheets
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00Properties of the layers or laminate
    • B32B2307/40Properties of the layers or laminate having particular optical properties
    • B32B2307/42Polarizing, birefringent, filtering

Landscapes

  • Life Sciences & Earth Sciences (AREA)
  • Forests & Forestry (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Laminated Bodies (AREA)
  • Polarising Elements (AREA)
  • Nonmetal Cutting Devices (AREA)
  • Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
  • Adhesive Tapes (AREA)
  • Control Of Cutting Processes (AREA)

Abstract

本發明提供一種片狀膜的製造方法,係具有切割具有n層(n為1以上的整數)之黏著劑層的多層膜而由前述多層膜得到片狀膜的切割步驟,其中,前述切割步驟包含使壓切刀片從前述多層膜的第一表面朝前述多層膜的第二表面進入前述多層膜內,而切割前述多層膜的壓切步驟;在將n層的前述黏著劑層之中任一個前述黏著劑層做為基準黏著劑層時,前述壓切刀片在前述多層膜之第一表面的速度V(μm/秒)係滿足下述關係式(1),t/V<1/ω1 (1) The present invention provides a method for manufacturing a sheet-like film, which is a cutting step having a multilayer film having an adhesive layer having n layers (n is an integer of 1 or more) and obtaining a sheet-like film from the multilayer film, wherein the cutting step The method includes a step of cutting the multi-layer film from a first surface of the multi-layer film to a second surface of the multi-layer film, and cutting the multi-layer film; any of the n-layers of the adhesive layer When the adhesive layer is used as a reference adhesive layer, the speed V (μm / sec) of the cutting blade on the first surface of the multilayer film satisfies the following relational expression (1), t / V <1 / ω 1 (1)

[上述關係式(1)中,t表示多層膜的厚度(μm),ω1表示依據前述基準黏著劑層在溫度20℃的頻率掃描所進行的動態黏彈性測量的測量值計算出的儲存彈性模數顯示為3.0×105(Pa)時的頻率(1/秒)]。 [In the above-mentioned relational expression (1), t represents the thickness (μm) of the multilayer film, and ω 1 represents the storage elasticity calculated from the measurement value of the dynamic viscoelasticity measurement performed at the frequency sweep of the reference adhesive layer at a temperature of 20 ° C. Frequency (1 / sec) when the modulus is displayed as 3.0 × 10 5 (Pa)].

Description

片狀膜的製造方法 Manufacturing method of sheet film

本發明係關於一種由具有黏著劑層的多層膜得到片狀膜之片狀膜的製造方法,亦有關該多層膜的製造裝置及該多層膜的切割方法。 The present invention relates to a method for manufacturing a sheet-like film from a multilayer film having an adhesive layer, and also relates to a manufacturing apparatus for the multilayer film and a cutting method for the multilayer film.

以往,切割包含偏光板等的多層膜的方法已知有使用壓切刀片切割的方法(例如:日本特開2015-33727號公報(專利文獻1))。 Conventionally, as a method of cutting a multilayer film including a polarizing plate or the like, a method of cutting using a cutting blade is known (for example, Japanese Patent Application Laid-Open No. 2015-33727 (Patent Document 1)).

專利文獻1中已記載用於切割多層膜的壓切刀片係藉由使用刀片前端部的表面粗度在特定的數值範圍內的壓切刀片以抑制切割面起毛。 Patent Document 1 discloses that a cutting blade for cutting a multilayer film uses a cutting blade having a surface roughness at a tip end portion of the blade in a specific numerical range to suppress fluff on a cutting surface.

如專利文獻1所記載,使用壓切刀片切割多層膜時,在多層膜表面的切割部附近有時會產生條紋狀的細微凹凸。在切割用於智慧型手機等移動設備的多層膜以製造片狀膜時,由於片狀膜的尺寸小,而顯示的文字及圖像比較小,從近距離才能看得到畫面,即使細微凹凸也很明顯而容易造成外觀上的缺陷。本發明人等進行研究發現多層膜具有黏著劑層時,容易產生這種條紋狀的細微凹凸。然後再進行深入研究發現可抑制這 種條紋狀的細微凹凸的方法,因而完成本發明。 As described in Patent Document 1, when a multilayer film is cut using a cutting blade, fine unevenness in the form of stripes may occur in the vicinity of the cutting portion on the surface of the multilayer film. When cutting multilayer films for mobile devices such as smartphones to make sheet films, the size of the sheet film is small and the displayed text and images are relatively small. The screen can be seen from a short distance, even with slight unevenness. Obvious and easy to cause defects in appearance. The present inventors have conducted studies and found that when a multilayer film has an adhesive layer, such striped fine unevenness is liable to occur. Then further research found that this could be suppressed This method of fine stripe-like unevenness is completed, and the present invention has been completed.

本發明的目的係提供一種可抑制條紋狀的細微凹凸產生之片狀膜的製造方法和製造裝置,以及多層膜的切割方法。 An object of the present invention is to provide a method and apparatus for producing a sheet-like film capable of suppressing generation of fine unevenness in a stripe shape, and a method for cutting a multilayer film.

本發明係提供以下所示之片狀膜的製造方法和製造裝置,以及多層膜的切割方法。 This invention provides the manufacturing method and manufacturing apparatus of the sheet-like film shown below, and the cutting method of a multilayer film.

[1]一種片狀膜的製造方法,係具有切割具有n層(n為1以上的整數)之黏著劑層的多層膜而由前述多層膜得到片狀膜的切割步驟,其中,前述切割步驟包含使壓切刀片從前述多層膜的第一表面朝前述多層膜的第二表面進入前述多層膜內,而切割前述多層膜的壓切步驟;在將n層的前述黏著劑層之中任一個前述黏著劑層做為基準黏著劑層時,前述壓切刀片在前述多層膜之第一表面的速度V(μm/秒)係滿足下述關係式(1)。 [1] A method for manufacturing a sheet-shaped film, comprising a cutting step of cutting a multilayer film having an adhesive layer having n layers (n is an integer of 1 or more) and obtaining a sheet-shaped film from the multilayer film, wherein the cutting step The method includes a step of cutting the multi-layer film from a first surface of the multi-layer film to a second surface of the multi-layer film, and cutting the multi-layer film; any of the n-layers of the adhesive layer When the adhesive layer is used as a reference adhesive layer, the speed V (μm / sec) of the cutting blade on the first surface of the multilayer film satisfies the following relational expression (1).

t/V<1/ω1 (1) t / V <1 / ω 1 (1)

[上述關係式(1)中,t表示多層膜的厚度(μm),ω1表示依據前述基準黏著劑層在溫度20℃的頻率掃描所進行的動態黏彈性測量的測量值計算出的儲存彈性模數顯示為3.0×105(Pa)時的頻率(1/秒)] [In the above-mentioned relational expression (1), t represents the thickness (μm) of the multilayer film, and ω 1 represents the storage elasticity calculated from the measurement value of the dynamic viscoelasticity measurement performed at the frequency sweep of the reference adhesive layer at a temperature of 20 ° C. Frequency when the modulus is 3.0 × 10 5 (Pa) (1 / s)

[2]如[1]所述之片狀膜的製造方法,其中,將前述黏著劑層之中,在溫度20℃、角頻率1,000rad/sec之儲存彈性模數最小的黏著劑層設為前述基準黏著劑層。 [2] The method for producing a sheet-like film according to [1], wherein the adhesive layer having the smallest storage elastic modulus at a temperature of 20 ° C. and an angular frequency of 1,000 rad / sec among the aforementioned adhesive layers is set as The aforementioned reference adhesive layer.

[3]如[1]所述之片狀膜的製造方法,其中,前述多層膜係具有:最表層的分離膜,以及藉由前述分離膜的剝離而露出於最表面之最表層下的黏著劑層;且將前述最表層下的黏著劑層設為前述基準黏著劑層。 [3] The method for producing a sheet-like film according to [1], wherein the multilayer film system includes a separation film on the outermost surface and adhesion under the outermost surface layer by peeling off the separation film. The adhesive layer; and the adhesive layer below the outermost layer is referred to as the reference adhesive layer.

[4]如[1]至[3]中任一項所述之片狀膜的製造方法,其中,前述多層膜係具有偏光片。 [4] The method for producing a sheet-like film according to any one of [1] to [3], wherein the multilayer film has a polarizer.

[5]一種片狀膜的製造裝置,係具有切割具有n層(n為1以上的整數)之黏著劑層的多層膜而由前述多層膜得到片狀膜的切割部,其中,前述切割部係具備:配置成可從前述多層膜的第一表面朝前述多層膜的第二表面進入前述多層膜內的壓切刀片,以及控制前述壓切刀片的移動的控制部;前述控制部係在將n層的前述黏著劑層之中任一個黏著劑層做為基準黏著劑層時,以使前述壓切刀片在前述多層膜之第一表面的速度V(μm/秒)滿足下述關係式(1)的方式進行控制。 [5] An apparatus for manufacturing a sheet-like film, comprising a cutting section for cutting a multilayer film having an adhesive layer having n layers (n is an integer of 1 or more) and obtaining a sheet-shaped film from the multilayer film, wherein The cutting unit includes a cutting blade configured to enter the multilayer film from the first surface of the multilayer film toward the second surface of the multilayer film, and a control unit that controls the movement of the cutting blade; When any one of the n-layered adhesive layers is used as a reference adhesive layer, the speed V (μm / sec) of the cutting blade on the first surface of the multilayer film satisfies the following relation ( 1).

t/V<1/ω1 (1) t / V <1 / ω 1 (1)

[上述關係式(1)中,t表示多層膜的厚度(μm),ω1表示依據前述基準黏著劑層在溫度20℃的頻率掃描所進行的動態黏彈性測量的測量值計算出的儲存彈性模數顯示為3.0×105(Pa)時的頻率(1/秒)] [In the above-mentioned relational expression (1), t represents the thickness (μm) of the multilayer film, and ω 1 represents the storage elasticity calculated from the measurement value of the dynamic viscoelasticity measurement performed at the frequency sweep of the reference adhesive layer at a temperature of 20 ° C. Frequency when the modulus is 3.0 × 10 5 (Pa) (1 / s)

[6]如[5]所述之片狀膜的製造裝置,其中,將前述黏著劑層之中,在溫度20℃、角頻率1,000rad/sec之儲存彈性模數最小的黏著劑層設為前述基準黏著劑層。 [6] The device for manufacturing a sheet-like film according to [5], wherein the adhesive layer having the smallest storage elastic modulus among the adhesive layers at a temperature of 20 ° C and an angular frequency of 1,000 rad / sec is set as The aforementioned reference adhesive layer.

[7]如[5]所述之片狀膜的製造裝置,其中,前述多層膜係具有:最表層的分離膜;以及藉由前述分離膜的剝離而露出於最表面之最表層下的黏著劑層;且將前述最表層下的黏著劑層設為前述基準黏著劑層。 [7] The apparatus for producing a sheet-like film according to [5], wherein the multilayer film includes: a topmost separation film; and an adhesive exposed under the outermost surface layer by peeling of the separation film. The adhesive layer; and the adhesive layer below the outermost layer is referred to as the reference adhesive layer.

[8]如[5]至[7]中任一項所述之片狀膜的製造裝置,其中,前述多層膜係具有偏光片。 [8] The apparatus for producing a sheet-like film according to any one of [5] to [7], wherein the multilayer film includes a polarizer.

[9]一種多層膜的切割方法,係切割具有n層(n為1以上的整數)之黏著劑層的多層膜,該多層膜的切割方法包含:使壓切刀片從前述 多層膜的第一表面朝前述多層膜的第二表面進入前述多層膜內,而切割前述多層膜的壓切步驟;在將n層的前述黏著劑層之中任一個黏著劑層做為基準黏著劑層時,前述壓切刀片在前述多層膜之第一表面的速度V(μm/秒)係滿足下述關係式(1)。 [9] A method for cutting a multilayer film, which is a method for cutting a multilayer film having an adhesive layer having n layers (n is an integer of 1 or more). The method for cutting a multilayer film includes: The first surface of the multilayer film enters into the multilayer film toward the second surface of the multilayer film, and the cutting step of cutting the multilayer film is performed; and any one of the n-layer adhesive layers is used as a reference adhesive. In the agent layer, the speed V (μm / sec) of the cutting blade on the first surface of the multilayer film satisfies the following relational expression (1).

t/V<1/ω1 (1) t / V <1 / ω 1 (1)

[上述關係式(1)中,t表示多層膜的厚度(μm),ω1表示依據前述基準黏著劑層在溫度20℃的頻率掃描所進行的動態黏彈性測量的測量值計算出的儲存彈性模數顯示為3.0×105(Pa)時的頻率(1/秒)] [In the above-mentioned relational expression (1), t represents the thickness (μm) of the multilayer film, and ω 1 represents the storage elasticity calculated from the measurement value of the dynamic viscoelasticity measurement performed at the frequency sweep of the reference adhesive layer at a temperature of 20 ° C. Frequency when the modulus is 3.0 × 10 5 (Pa) (1 / s)

[10]如[9]所述之多層膜的切割方法,其中,將前述黏著劑層之中,在溫度20℃、角頻率1,000rad/sec之儲存彈性模數最小的黏著劑層設為前述基準黏著劑層。 [10] The method for cutting a multilayer film according to [9], wherein the adhesive layer having the smallest storage elastic modulus at a temperature of 20 ° C. and an angular frequency of 1,000 rad / sec among the adhesive layers is the aforementioned Reference adhesive layer.

[11]如[9]所述之多層膜的切割方法,其中,前述多層膜係具有:最表層的分離膜,以及藉由前述分離膜的剝離而露出於最表面之最表層下的黏著劑層;且將前述最表層下的黏著劑層設為前述基準黏著劑層。 [11] The method for cutting a multilayer film according to [9], wherein the multilayer film includes: a topmost separation film; and an adhesive agent exposed under the outermost surface layer by peeling of the separation film. And the adhesive layer below the outermost layer is referred to as the reference adhesive layer.

[12]如[9]至[11]中任一項所述之多層膜的切割方法,其中,前述多層膜係具有偏光片。 [12] The method for cutting a multilayer film according to any one of [9] to [11], wherein the multilayer film has a polarizer.

本發明之上述及其他的目的、特徵、形態及優點係與添附的圖式相關,並可由以下的詳細說明理解。 The above and other objects, features, forms, and advantages of the present invention are related to the attached drawings and can be understood from the following detailed description.

10‧‧‧多層膜 10‧‧‧Multilayer film

10a‧‧‧多層膜 10a‧‧‧multilayer film

10b‧‧‧多層膜 10b‧‧‧multilayer film

10c‧‧‧多層膜 10c‧‧‧multilayer film

10d‧‧‧多層膜 10d‧‧‧multilayer film

11‧‧‧片狀膜 11‧‧‧ sheet film

20‧‧‧切割裝置 20‧‧‧ cutting device

21‧‧‧壓切刀片構件 21‧‧‧cutting blade member

21a‧‧‧壓切刀片構件 21a‧‧‧cutting blade member

21b‧‧‧壓切刀片構件 21b‧‧‧cutting blade member

22‧‧‧刀片承受板 22‧‧‧Blade receiving board

23‧‧‧承載台 23‧‧‧bearing platform

24‧‧‧控制部 24‧‧‧Control Department

31‧‧‧第一黏著劑層 31‧‧‧first adhesive layer

60‧‧‧防護膜 60‧‧‧ protective film

61‧‧‧樹脂膜(非黏著性樹脂層) 61‧‧‧resin film (non-adhesive resin layer)

62‧‧‧第二黏著劑層(黏著性樹脂層) 62‧‧‧Second adhesive layer (adhesive resin layer)

70‧‧‧分離膜 70‧‧‧ separation membrane

100‧‧‧偏光板 100‧‧‧ polarizing plate

101‧‧‧第一表面(層) 101‧‧‧ first surface (layer)

102‧‧‧第二表面(黏著劑層) 102‧‧‧Second surface (adhesive layer)

102a‧‧‧凸條 102a‧‧‧ convex strip

103‧‧‧層 103‧‧‧Floor

103a‧‧‧凸條 103a‧‧‧ convex strip

211‧‧‧壓切刀片 211‧‧‧cutting blade

211a‧‧‧壓切刀片 211a‧‧‧cutting blade

211b‧‧‧壓切刀片 211b‧‧‧cutting blade

212a‧‧‧彈性體 212a‧‧‧ elastomer

212b‧‧‧彈性體 212b‧‧‧ elastomer

213a‧‧‧保持部 213a‧‧‧holding department

第1圖(a)、(b)、(c)係示意性地顯示由多層膜得到片狀膜之切割步驟 的一例的概略圖。 Figures 1 (a), (b), and (c) schematically show the cutting steps for obtaining a sheet-like film from a multilayer film An example of a schematic diagram.

第2圖(a)、(b)係示意性地顯示由多層膜得到片狀膜之切割步驟的一例的概略圖。 2 (a) and 2 (b) are schematic diagrams schematically showing an example of a cutting step for obtaining a sheet-like film from a multilayer film.

第3圖(a)、(b)、(c)係示意性地顯示由多層膜得到片狀膜之切割步驟的一例的概略圖。 3 (a), (b), and (c) are schematic diagrams schematically showing an example of a dicing step for obtaining a sheet-like film from a multilayer film.

第4圖係示意性地顯示具有壓切刀片之切割裝置的剖面圖。 Fig. 4 is a cross-sectional view schematically showing a cutting device having a cutting blade.

第5圖係顯示壓切刀片構件之一例的(a)剖面圖、(b)從底部觀看的立體圖、(c)仰視圖。 Fig. 5 shows (a) a sectional view, (b) a perspective view viewed from the bottom, and (c) a bottom view showing an example of a cutting blade member.

第6圖(a)、(b)、(c)係示意性地顯示壓切刀片之切割動作的圖。 Figures 6 (a), (b), and (c) are diagrams schematically showing the cutting operation of the cutting blade.

第7圖係顯示與第5圖之壓切刀片構件相異之一例的仰視圖。 FIG. 7 is a bottom view showing an example different from the cutting blade member of FIG. 5.

第8圖係顯示在多層膜表面的切割面附近產生之條紋狀的細微凹凸的意像圖。 FIG. 8 is an image diagram showing fine stripe-like unevenness generated near the cut surface of the multilayer film surface.

第9圖係示意性地顯示多層膜之具體的層構成之一例的概略剖面圖。 FIG. 9 is a schematic cross-sectional view schematically showing an example of a specific layer configuration of a multilayer film.

以下參照圖式說明本發明之實施形態,惟本發明並不限於下列之實施形態。在以下的所有圖式中,為易於理解各構成要素,適當調整顯示比例,顯示於圖式之各構成要素的比例與實際之構成要素的比例不一定一致。 Hereinafter, embodiments of the present invention will be described with reference to the drawings, but the present invention is not limited to the following embodiments. In all the drawings below, for easy understanding of each component, the display ratio is appropriately adjusted, and the ratio of each component displayed in the drawing and the ratio of the actual component are not necessarily the same.

[片狀膜的製造方法] [Manufacturing method of sheet film]

本實施形態之片狀膜的製造方法係具有切割具有n層(n為1以上的整數)之黏著劑層的多層膜,由多層膜得到片狀膜的切割步驟。切割步驟係包 含使壓切刀片從多層膜的第一表面朝多層膜的第二表面進入多層膜內,切割多層膜的壓切步驟。 The manufacturing method of the sheet-like film of this embodiment is a cutting process which has a multilayer film which cuts the adhesive layer which has n layers (n is an integer of 1 or more), and obtains a sheet-like film from a multilayer film. Cutting step package It includes a step of cutting the multilayer film from the first surface of the multilayer film to the second surface of the multilayer film, and cutting the multilayer film.

在壓切步驟中,壓切刀片在多層膜之第一表面的速度V(μm/秒)係在將n層的前述黏著劑層之中任一個黏著劑層做為基準黏著劑層時,滿足以下的關係式(1)。 In the cutting step, the speed V (μm / sec) of the cutting blade on the first surface of the multilayer film is satisfied when any one of the n layers of the foregoing adhesive layers is used as the reference adhesive layer. The following relational expression (1).

t/V<1/ω1 (1) t / V <1 / ω 1 (1)

上述關係式(1)中,t表示多層膜的厚度(μm),ω1表示依據基準黏著劑層在溫度20℃的頻率掃描所進行的動態黏彈性測量的測量值計算出的儲存彈性模數顯示為3.0×105(Pa)時的頻率(1/秒)。 In the above-mentioned relational expression (1), t represents the thickness (μm) of the multilayer film, and ω 1 represents the storage elastic modulus calculated based on the measurement value of the dynamic viscoelasticity measurement performed at a frequency sweep of the reference adhesive layer at a temperature of 20 ° C. The frequency (1 / sec) when displayed is 3.0 × 10 5 (Pa).

藉由使壓切刀片在多層膜之第一表面的速度V(μm/秒)滿足上述關係式(1),可抑制在壓切步驟中在基準黏著劑層產生細微凹凸,結果可抑制在多層膜表面的切割面附近產生條紋狀的細微凹凸。就基準黏著劑層而言,較佳為在壓切步驟容易產生細微凹凸的黏著劑層。基準黏著劑層的選擇方法詳細如後述。 By making the speed V (μm / sec) of the cutting blade on the first surface of the multilayer film satisfy the above-mentioned relational expression (1), it is possible to suppress the occurrence of fine unevenness in the reference adhesive layer in the cutting step, and as a result, it can be suppressed in the multilayer Stripe-like fine irregularities occur near the cut surface of the film surface. The reference adhesive layer is preferably an adhesive layer that is liable to cause fine unevenness in the cutting step. The method of selecting the reference adhesive layer will be described in detail later.

本發明者等發現在壓切步驟中黏著劑層的黏彈性特性與黏著劑層中之細微凹凸的產生容易度相關。在黏著劑層產生的細微凹凸係在多層膜的表面產生的細微凹凸的原因。壓切步驟中黏著劑層的黏彈性特性係取決於通過黏著劑層之壓切刀片的通過速度。本發明者等假設與通過速度相關之壓切刀片通過多層膜之第一表面至第二表面所需要的大概時間t/V若非常短,可適當地維持黏著劑層的黏彈性特性,在黏著劑層不易產生細微凹凸,而有在多層膜表面的切割面附近亦不易產生細微凹凸的結果, 對此進行深入研究而完成上述關係式(1)。另外,速度V(μm/秒)係壓切刀片在多層膜之第一表面的速度,但壓切刀片在多層膜內的速度亦可控制為大致相同的速度,故通過多層膜之第一表面至第二表面所需要的時間可視為與大概時間t/V大致一致。通常大概時間t/V設為小於9.0×10-3(秒),為抑制多層膜表面產生細微凹凸,較佳為設為小於2.5×10-3(秒)。又,通常大概時間t/V為1.0×10-4(秒)以上。 The present inventors have found that the viscoelastic properties of the adhesive layer in the cutting step are related to the ease of generation of fine unevenness in the adhesive layer. The fine unevenness generated in the adhesive layer is the cause of the fine unevenness generated on the surface of the multilayer film. The viscoelastic properties of the adhesive layer during the cutting step depend on the speed at which the cutting blade passes through the adhesive layer. The inventors have assumed that the approximate time t / V required for a cutting blade that is related to the passage speed to pass through the first surface to the second surface of the multilayer film is very short, and the viscoelastic properties of the adhesive layer can be properly maintained. The agent layer is less prone to generate fine unevenness, and it is difficult to produce fine unevenness near the cut surface of the multilayer film surface. Intensive research has been conducted to complete the above-mentioned relational expression (1). In addition, the speed V (μm / sec) is the speed of the cutting blade on the first surface of the multilayer film, but the speed of the cutting blade in the multilayer film can also be controlled to be about the same speed, so it passes through the first surface of the multilayer film. The time required to reach the second surface can be regarded as approximately the same as the approximate time t / V. Generally, the approximate time t / V is set to less than 9.0 × 10 -3 (seconds), and in order to suppress fine unevenness on the surface of the multilayer film, it is preferably set to less than 2.5 × 10 -3 (seconds). The approximate time t / V is usually 1.0 × 10 -4 (seconds) or more.

由更能抑制在黏著劑層產生細微凹凸的觀點看來,在壓切步驟中,壓切刀片在多層膜之第一表面的速度V(μm/秒)係在將n層的前述黏著劑層之中任一個黏著劑層做為基準黏著劑層時,滿足以上的關係式(1),較佳為滿足以下的關係式(2)。 From the viewpoint of further suppressing the generation of fine unevenness in the adhesive layer, in the cutting step, the speed V (μm / sec) of the cutting blade on the first surface of the multilayer film is based on the n-layer of the aforementioned adhesive layer. When any one of the adhesive layers is used as the reference adhesive layer, the above relational expression (1) is satisfied, and preferably the following relational expression (2) is satisfied.

t/V<1/ω2 (2) t / V <1 / ω 2 (2)

上述關係式(2)中,t與關係式(1)相同地表示多層膜的厚度(μm),ω2表示顯示前述基準黏著劑層在溫度20℃的頻率掃描所進行的動態黏彈性測量的測量值計算出的儲存彈性模數顯示為6.0×105(Pa)時的頻率(1/秒)。 In the above-mentioned relational expression (2), t represents the thickness (μm) of the multilayer film in the same way as the relational expression (1), and ω 2 represents the dynamic viscoelasticity measurement performed by the frequency sweep of the reference adhesive layer at a temperature of 20 ° C. The storage elastic modulus calculated from the measured value is displayed as a frequency (1 / sec) at 6.0 × 10 5 (Pa).

<切割步驟> <Cutting step>

第1圖至第3圖係分別示意性地顯示切割多層膜由多層膜得到片狀膜之切割步驟的一例的概略圖。在第1圖至第3圖中,虛線係顯示切割步驟中的切割線。在第1圖所示的例子中,係使用刀片前端為直線狀的壓切刀片在與長邊方向垂直的方向切割細長狀多層膜10a(參照第1圖(a)),得到小片化多層膜10b(參照第1圖(b)),之後,使用刀片前端為直線狀的壓切刀片在原來的多層膜10a的長邊方向切割小片化多層膜10b(參照第1圖 (b)),得到所需尺寸的片狀膜11(參照第1圖(c))。 1 to 3 are schematic diagrams each schematically showing an example of a cutting step of cutting a multilayer film to obtain a sheet-like film from the multilayer film. In FIGS. 1 to 3, the dotted lines indicate the cutting lines in the cutting step. In the example shown in FIG. 1, a long and thin multilayer film 10a is cut in a direction perpendicular to the long side direction using a cutting blade with a straight blade tip (see FIG. 1 (a)) to obtain a chipped multilayer film. 10b (refer to FIG. 1 (b)), and thereafter, using a cutting blade with a straight blade tip to cut the small-sized multilayer film 10b in the longitudinal direction of the original multilayer film 10a (refer to FIG. 1) (b)) to obtain a sheet-like film 11 having a desired size (see FIG. 1 (c)).

在第2圖所示的例子中,係以模具壓切刀片沖壓細長狀多層膜10a並切割(參照第2圖(a)),得到所需尺寸的片狀膜11(參照第2圖(b))。 In the example shown in FIG. 2, the elongated multilayer film 10 a is punched and cut with a die-cutting blade (see FIG. 2 (a)) to obtain a sheet-like film 11 of a desired size (see FIG. 2 (b )).

在第3圖所示的例子中,係使用刀片前端為直線狀的壓切刀片在與長邊方向垂直的方向切割細長狀多層膜10a(參照第3圖(a)),得到小片化多層膜10c(參照第3圖(b)),之後,以模具壓切刀片沖壓,得到所需尺寸的片狀膜11(參照第3圖(c))。 In the example shown in FIG. 3, a thin multi-layer film 10a is cut in a direction perpendicular to the long side direction using a cutting blade with a straight blade tip (see FIG. 3 (a)) to obtain a chipped multilayer film. 10c (refer to FIG. 3 (b)), and then press with a die-cutting blade to obtain a sheet-like film 11 having a desired size (refer to FIG. 3 (c)).

第1圖至第3圖所示之切割步驟的切割方向並無特別限定,在切割具有定向特性的多層膜時,以可獲得具有所需之定向特性的片狀膜11的方式來決定切割方向。 The cutting direction of the cutting steps shown in FIGS. 1 to 3 is not particularly limited. When cutting a multilayer film having an orientation characteristic, the cutting direction is determined so that a sheet-like film 11 having a desired orientation characteristic can be obtained. .

在第1圖至第3圖所示之各個例子中,經過一次或複數次的切割,可由多層膜得到一片或複數片的片狀膜。切割步驟中的切割次數並無限定。又,上述係針對切割步驟中的所有切割為壓切步驟時進行說明,惟任何切割若為壓切步驟,則無限定。除了壓切步驟以外,亦可以為包含雷射光切割、旋轉圓形刀片切割等的切割步驟。亦即,得到的片狀膜亦可以為包含壓切步驟的切割面者。藉由壓切步驟,在多層膜表面的切割部分附近容易產生條紋狀的細微凹凸,但在本實施形態中,即使所有切割均為壓切步驟,仍可抑制這種條紋狀的細微凹凸產生。 In each of the examples shown in Figs. 1 to 3, one or more sheet-like films can be obtained from the multilayer film after one or more cuttings. The number of cuts in the cutting step is not limited. In addition, the above description is for the case where all the cutting in the cutting step is a cutting step, but any cutting is not limited if it is a cutting step. In addition to the cutting step, a cutting step including laser light cutting, rotating circular blade cutting, or the like may also be used. That is, the obtained sheet-like film may be a cut surface including a cutting step. The stripe-shaped fine unevenness easily occurs near the cut portion of the surface of the multilayer film by the press-cutting step. However, in this embodiment, even if all the cutting is a press-cutting step, the generation of such stripe-shaped fine unevenness can be suppressed.

<壓切步驟> <Cutting step>

第4圖係示意性地顯示具有壓切刀片之切割裝置的剖面圖。藉由第4圖所示之切割裝置20可實施本實施形態之壓切步驟。切割裝置20係具備:具有壓切刀片之壓切刀片構件21、控制壓切刀片構件21之上下移動的控 制部24、及上表面設有刀片承受板22之用以承載多層膜10的承載台23。多層膜10係以與刀片承受板22接觸的方式承載於承載台23上。承載於承載台23上的多層膜10中,係將與刀片承受板22接觸的表面設為第二表面102,與第二表面102相對向之上側的表面設為第一表面101。在壓切步驟中,藉由使壓切刀片構件21向下方移動,使壓切刀片由多層膜10的第一表面101朝第二表面102進入多層膜10內。之後,藉由使壓切刀片構件21向上方移動,使壓切刀片從多層膜10分離。藉由壓切刀片構件21的這種上下移動來切割多層膜10。 Fig. 4 is a cross-sectional view schematically showing a cutting device having a cutting blade. The cutting device 20 shown in FIG. 4 can perform the cutting step of this embodiment. The cutting device 20 is provided with a cutting blade member 21 having a cutting blade, and a control for controlling the cutting blade member 21 to move up and down. The manufacturing portion 24 and the upper surface of the blade receiving plate 22 are provided with a supporting table 23 for supporting the multilayer film 10. The multi-layer film 10 is carried on the supporting table 23 in a manner to be in contact with the blade receiving plate 22. In the multilayer film 10 carried on the supporting table 23, a surface in contact with the blade receiving plate 22 is set as a second surface 102, and a surface on the upper side opposite to the second surface 102 is set as a first surface 101. In the cutting step, the cutting blade member 21 is moved downward so that the cutting blade enters the multilayer film 10 from the first surface 101 toward the second surface 102 of the multilayer film 10. Thereafter, the cutting blade member 21 is moved upward to separate the cutting blade from the multilayer film 10. The multilayer film 10 is cut by this up and down movement of the cutting blade member 21.

第5圖(a)係詳細顯示第4圖所示之壓切刀片構件21之一例的壓切刀片構件21a的剖面圖。第5圖(b)係顯示由壓切刀片構件21a的底部觀看的立體圖,第5圖(b)的a-a剖面圖相當於第5圖(a)。第5圖(c)係顯示壓切刀片構件21a的仰視圖。壓切刀片構件21a係具備:具有直線狀之刀片前端部的壓切刀片211a、保持壓切刀片211a的保持部213a、配置於保持部213a下方的彈性體212a。彈性體212a的最下方係位於與壓切刀片211a之刀片前端部相同的位置或比壓切刀片211a之刀片前端部下方的位置。 FIG. 5 (a) is a cross-sectional view showing the cutting blade member 21a as an example of the cutting blade member 21 shown in FIG. 4 in detail. Fig. 5 (b) is a perspective view showing the cutting blade member 21a as viewed from the bottom, and the a-a cross-sectional view of Fig. 5 (b) corresponds to Fig. 5 (a). Fig. 5 (c) is a bottom view showing the cutting blade member 21a. The cutting blade member 21a includes a cutting blade 211a having a straight blade tip, a holding portion 213a holding the cutting blade 211a, and an elastic body 212a disposed below the holding portion 213a. The lowermost part of the elastic body 212a is located at the same position as or lower than the blade front end portion of the cutting blade 211a.

第6圖(a)至(c)係示意性地顯示藉由第5圖(a)至(c)所示之具備壓切刀片構件21a的切割裝置切割多層膜10時之壓切刀片211a的切割動作的圖。切割動作係使壓切刀片構件21a向下方移動(參照第6圖(a)),使壓切刀片構件21a的彈性體212a的最下方與多層膜10的第一表面101接觸(參照第6圖(b))。之後,藉由使壓切刀片構件21a更向下方移動,彈性體212a在多層膜10的第一表面101上收縮,僅壓切刀片211a由多層膜 10的第一表面101進入多層膜10內,直到到達刀片承受板22為止(參照第6圖(c))。壓切刀片211a到達刀片承受板22後,壓切刀片構件21的移動方向會切換為上方,使壓切刀片211a從多層膜10拉出。藉由以上的切割動作沿層疊方向切割多層膜10。 Figs. 6 (a) to (c) are diagrams schematically showing the state of a cutting blade 211a when the multilayer film 10 is cut by a cutting device having a cutting blade member 21a shown in Figs. 5 (a) to (c). Illustration of cutting action. The cutting operation moves the cutting blade member 21a downward (refer to FIG. 6 (a)), and the lowermost part of the elastic body 212a of the cutting blade member 21a is brought into contact with the first surface 101 of the multilayer film 10 (refer to FIG. 6). (b)). After that, by moving the cutting blade member 21a further downward, the elastic body 212a contracts on the first surface 101 of the multilayer film 10, and only the cutting blade 211a passes through the multilayer film. The first surface 101 of 10 enters the multilayer film 10 until it reaches the blade receiving plate 22 (see FIG. 6 (c)). After the cutting blade 211 a reaches the blade receiving plate 22, the moving direction of the cutting blade member 21 is switched to the upper direction, and the cutting blade 211 a is pulled out from the multilayer film 10. The multilayer film 10 is cut in the laminating direction by the above cutting operation.

壓切刀片構件21a所具備的壓切刀片211a並不限於如第5圖(a)至(c)所示之可直線狀切割多層膜10的壓切刀片,可設計成能夠進行所需的切割。亦可以為能夠從多層膜10沖壓出矩形之片狀膜的模具狀的壓切刀片。有關具備模具狀之壓切刀片的壓切刀片構件的一例,其仰視圖顯示於第7圖。第7圖所示之壓切刀片構件21b係具備壓切刀片211b、保持構件及彈性體212b,除了壓切刀片211b的形狀不同之外,與第5圖所示之壓切刀片構件21a為相同的構成,可藉由同樣的方法切割多層膜10。 The cutting blade 211a included in the cutting blade member 21a is not limited to a cutting blade capable of cutting the multilayer film 10 in a straight line as shown in FIGS. 5 (a) to (c), and can be designed to perform the required cutting . It may be a die-shaped die-cutting blade capable of punching a rectangular sheet-shaped film from the multilayer film 10. An example of a cutting blade member having a die-shaped cutting blade is shown in FIG. 7 in a bottom view. The cutting blade member 21b shown in FIG. 7 includes a cutting blade 211b, a holding member, and an elastic body 212b. The cutting blade member 21b is the same as the cutting blade member 21a shown in FIG. 5 except that the shape of the cutting blade 211b is different. In the structure, the multilayer film 10 can be cut by the same method.

就壓切刀片211a、211b而言,較佳為使用湯姆遜刀片。湯姆遜刀片亦可為在表面施以樹脂加工者。彈性體212a、212b為可在多層膜的表面收縮,切割時可與刀片承受板22一起將多層膜10夾入並固定多層膜者即可,並無限定。較佳為使用胺甲酸酯泡沫等的多孔質材料、胺甲酸酯橡膠等的軟質材料。 For the cutting blades 211a and 211b, a Thomson blade is preferably used. Thomson blades can also be resin-coated. The elastic bodies 212a and 212b are not limited as long as they can shrink on the surface of the multilayer film, and can sandwich and fix the multilayer film 10 together with the blade receiving plate 22 during cutting. Porous materials such as urethane foam and soft materials such as urethane rubber are preferably used.

在本實施形態之切割裝置中,壓切刀片在多層膜之第一表面的速度V(μm/秒)係使控制部24控制壓切刀片構件21向下方的移動速度以滿足關係式(1)。 In the cutting device of this embodiment, the speed V (μm / sec) of the cutting blade on the first surface of the multilayer film is such that the control section 24 controls the downward moving speed of the cutting blade member 21 to satisfy the relationship (1) .

<其他步驟> <Other steps>

本實施形態之片狀膜的製造方法可具備上述之切割步驟以外的步驟,例如可列舉:製造多層膜之多層膜製造步驟、捲出捲繞成卷筒狀之多層膜 的捲出步驟、搬運多層膜或片狀膜的搬運步驟、乾燥多層膜或片狀膜的乾燥步驟等。 The method for producing a sheet-like film according to this embodiment may include steps other than the cutting step described above, and examples thereof include a step for producing a multilayer film for producing a multilayer film, and rolling out a multilayer film wound into a roll. Step of unwinding, conveying step of conveying multilayer film or sheet film, drying step of drying multilayer film or sheet film, and the like.

<多層膜> <Multilayer film>

多層膜若為具有黏著劑層者即可,無特別限定。多層膜例如可以為光學層疊膜。為光學層疊膜時,即使細微凹凸也容易造成外觀上的問題。多層膜的厚度例如為5至3000μm,較佳為20至500μm。多層膜的層構成較佳為在切割步驟中汙染物不易付著於黏著劑層的方式使黏著劑層不露出於最表面者。 The multilayer film is not particularly limited as long as it has an adhesive layer. The multilayer film may be, for example, an optical laminated film. In the case of an optical laminated film, even slight irregularities easily cause problems in appearance. The thickness of the multilayer film is, for example, 5 to 3000 μm, and preferably 20 to 500 μm. The layer structure of the multilayer film is preferably such that the contaminant layer is not easily attached to the adhesive layer during the cutting step so that the adhesive layer is not exposed on the outermost surface.

多層膜具有黏著劑層時,若使用壓切刀片進行切割,在多層膜表面的切割面附近容易產生條紋狀的細微凹凸,但根據本實施形態之片狀膜的製造方法可抑制這種細微凹凸的產生。更具體而言,細微凹凸多數為延伸在與切割面大致平行的方向的條紋狀凸條,大多產生於與刀片承受板接觸的第二表面。產生細微凹凸的機制(mechanism)雖不明確,就一種可能的機制而言,可列舉:藉由壓切刀片的進入,於各層產生不同的剪應力,作用於與黏著劑層接觸之兩層的剪應力不同而引起黏著劑層局部變形。推測這種局部變形係由於黏著劑層比其他層柔軟。 When the multilayer film has an adhesive layer, if a cutting blade is used for cutting, stripe-like fine unevenness is easily generated near the cut surface of the multilayer film surface. However, the method for manufacturing a sheet-like film according to this embodiment can suppress such fine unevenness The generation. More specifically, the fine unevenness is often a stripe-shaped ridge extending in a direction substantially parallel to the cutting surface, and most of it is generated on the second surface in contact with the blade receiving plate. Although the mechanism for the generation of fine unevenness is not clear, as for a possible mechanism, it can be listed as follows: through the entry of the cutting blade, different shear stresses are generated in each layer, which acts on the two layers in contact with the adhesive layer. Different shear stress causes local deformation of the adhesive layer. It is speculated that this local deformation is due to the softer adhesive layer than the other layers.

第8圖係顯示在多層膜表面的切割面附近產生之條紋狀的細微凹凸的意像圖。利用第8圖說明產生細微凹凸的機制係一種可能的機制,藉由本實施形態之片狀膜的製造方法抑制的細微凹凸並不限於由這種機制產生的凹凸,此外,也不限於在第8圖示意性地顯示之細微凹凸。在第8圖中,做為切割對象的多層膜10,假設包括層101、黏著劑層102、層103。使壓切刀片211進入多層膜10,於各層產生不同的剪應力,由於黏著劑層 102比相鄰之層101及層103柔軟,作用於此兩個層101、103的剪應力不同而引起黏著劑層102之切割面附近的局部稍微隆起形成凸條102a。由於黏著劑層102的凸條102a,有時與黏著劑層102相鄰之層103也稍微隆起形成凸條103a。如上述方式在黏著劑層102形成的凸條102a及在層103形成的凸條103a成為在外觀上見到條紋狀凹凸的原因。 FIG. 8 is an image diagram showing fine stripe-like unevenness generated near the cut surface of the multilayer film surface. The mechanism for generating fine unevenness using FIG. 8 is one possible mechanism. The fine unevenness suppressed by the method for manufacturing a sheet-shaped film according to this embodiment is not limited to the unevenness caused by this mechanism. The figure schematically shows the fine unevenness. In FIG. 8, the multilayer film 10 as a cutting target is assumed to include a layer 101, an adhesive layer 102, and a layer 103. When the cutting blade 211 enters the multilayer film 10, different shear stresses are generated in each layer. 102 is softer than the adjacent layers 101 and 103, and the shear stress acting on the two layers 101 and 103 is different, which causes a part of the vicinity of the cutting surface of the adhesive layer 102 to swell slightly to form a convex strip 102a. Due to the convex strips 102a of the adhesive layer 102, the layer 103 adjacent to the adhesive layer 102 is sometimes slightly raised to form the convex strips 103a. As described above, the ridges 102a formed on the adhesive layer 102 and the ridges 103a formed on the layer 103 cause the appearance of streak-like irregularities.

[黏著劑層] [Adhesive layer]

黏著劑層可由(甲基)丙烯酸系、橡膠系、胺基甲酸酯系、酯系、聚矽氧系、聚乙烯醚系等的樹脂做為主成分的黏著劑組成物構成。其中,以透明性、耐候性、耐熱性等優異的(甲基)丙烯酸系樹脂做為基礎聚合物的黏著劑組成物為佳。黏著劑組成物亦可以為活性能量線硬化型、熱硬化型。 The adhesive layer may be composed of a (meth) acrylic-based, rubber-based, urethane-based, ester-based, silicone-based, or polyvinyl ether-based resin as a main component. Among them, a (meth) acrylic resin excellent in transparency, weather resistance, heat resistance and the like as a base polymer is preferably an adhesive composition. The adhesive composition may be an active energy ray hardening type or a thermosetting type.

就使用於黏著劑組成物的(甲基)丙烯酸系樹脂(基礎聚合物)而言,例如適合使用將(甲基)丙烯酸丁酯、(甲基)丙烯酸乙酯、(甲基)丙烯酸異辛酯、(甲基)丙烯酸2-乙基己酯等的(甲基)丙烯酸酯中的1種或2種以上做為單體的聚合物或共聚物。較佳為使基礎聚合物與極性單體共聚。就極性單體而言,例如可列舉:(甲基)丙烯酸、(甲基)丙烯酸2-羥丙酯、(甲基)丙烯酸羥乙酯、(甲基)丙烯醯胺、(甲基)丙烯酸N,N-二甲基胺基乙酯、(甲基)丙烯酸縮水甘油酯等具有羧基、羥基、醯胺基、胺基、環氧基的單體。 As the (meth) acrylic resin (base polymer) used in the adhesive composition, for example, butyl (meth) acrylate, ethyl (meth) acrylate, and isooctyl (meth) acrylate are suitably used. A polymer or copolymer in which one or two or more of (meth) acrylates such as esters and 2-ethylhexyl (meth) acrylate are used as monomers. Preferably, the base polymer is copolymerized with a polar monomer. Examples of the polar monomer include (meth) acrylic acid, 2-hydroxypropyl (meth) acrylate, hydroxyethyl (meth) acrylate, (meth) acrylamide, and (meth) acrylic acid. Monomers having a carboxyl group, a hydroxyl group, a sulfonylamino group, an amino group, and an epoxy group, such as N, N-dimethylaminoethyl ester and glycidyl (meth) acrylate.

黏著劑組成物亦可為僅含有上述基礎聚合物者,通常更含有交聯劑。就交聯劑而言,例如:會與羧基形成羧酸金屬鹽之2價以上的金屬離子、會與羧基形成醯胺鍵的多胺化合物、會與羧基形成酯鍵的聚環氧化合物或多元醇、會與羧基形成醯胺鍵的聚異氰酸酯化合物。其中,較佳為聚異氰酸酯化合物。 The adhesive composition may include only the base polymer described above, and usually further contains a crosslinking agent. Examples of the cross-linking agent include: a metal ion having a valence of two or more that forms a carboxylic acid metal salt with a carboxyl group, a polyamine compound that forms a amide bond with a carboxyl group, a polyepoxide compound that forms an ester bond with a carboxyl group, or a polyvalent compound Alcohols, polyisocyanate compounds that form amido bonds with carboxyl groups. Among these, a polyisocyanate compound is preferable.

活性能量線硬化型黏著劑組成物係指具有受到紫外線或電子線等活性能量線的照射而硬化的性質,並具有在照射活性能量線前亦具有黏著性而可密接於薄膜等黏附體,可藉由照射活性能量線硬化而調整密接力的性質的黏著劑組成物。活性能量線硬化型黏著劑組成物較佳為紫外線硬化型。活性能量線硬化型黏著劑組成物除了含有基礎聚合物、交聯劑之外,更含有活性能量線聚合性化合物。依照需要更可含有光聚合開始劑、光敏劑等。 The active energy ray-curable adhesive composition refers to a property that is hardened by being irradiated with active energy rays such as ultraviolet rays or electron rays, and has adhesiveness before irradiation with active energy rays, and can be adhered to an adherend such as a film. An adhesive composition that adjusts the properties of adhesion by irradiating active energy rays to harden. The active energy ray-curable adhesive composition is preferably an ultraviolet-curable type. The active energy ray-curable adhesive composition contains an active energy ray polymerizable compound in addition to a base polymer and a crosslinking agent. If necessary, a photopolymerization initiator, a photosensitizer, and the like may be further contained.

黏著劑組成物可含有用來賦予光散射性的微粒子、珠粒(樹脂珠粒、玻璃珠粒等)、玻璃纖維、基礎聚合物以外的樹脂、增黏劑、填充劑(金屬粉或其他的無機粉末等)、抗氧化劑、紫外線吸收劑、染料、顏料、著色劑、消泡劑、緩蝕劑、光聚合開始劑等添加劑。 The adhesive composition may contain fine particles, beads (resin beads, glass beads, etc.), glass fibers, resins other than the base polymer, tackifiers, fillers (metal powder or other Inorganic powder, etc.), antioxidants, ultraviolet absorbers, dyes, pigments, colorants, defoamers, corrosion inhibitors, photopolymerization starters and other additives.

可將上述黏著劑組成物的有機溶劑稀釋液塗佈在基材上,藉由乾燥形成黏著劑層。使用活性能量線硬化型黏著劑組成物時,藉由對所形成的黏著劑層照射活性能量線可得到具有所需之硬化度的硬化物。 The organic solvent diluent of the adhesive composition can be coated on a substrate, and an adhesive layer can be formed by drying. When an active energy ray-curable adhesive composition is used, a hardened product having a desired degree of hardening can be obtained by irradiating the formed adhesive layer with an active energy ray.

黏著劑層的厚度例如可以為1至40μm。黏著劑層的厚度為1至40μm時,藉由壓切步驟容易產生條紋狀的細微凹凸,但依據本實施形態之片狀膜的製造方法,即使黏著劑層的厚度為1至40μm,仍能夠抑制條紋狀的細微凹凸產生。 The thickness of the adhesive layer may be, for example, 1 to 40 μm. When the thickness of the adhesive layer is 1 to 40 μm, fine stripe-like unevenness is easily generated by the cutting step. However, according to the method for manufacturing the sheet film of this embodiment, even if the thickness of the adhesive layer is 1 to 40 μm, It suppresses the generation of fine unevenness in stripes.

黏著劑層在溫度20℃、角頻率1,000rad/sec可顯示0.15至1MPa之儲存彈性模數。黏著劑層為上述儲存彈性模數時,比其他層軟而容易產生細微凹凸,但依據本實施形態之片狀膜的製造方法,即使黏著劑層在溫度20℃之儲存彈性模數為0.15至1MPa,仍可抑制細微凹凸產生。 The adhesive layer can display a storage elastic modulus of 0.15 to 1 MPa at a temperature of 20 ° C and an angular frequency of 1,000 rad / sec. When the adhesive layer has the above-mentioned storage elastic modulus, it is softer than other layers and easily generates fine unevenness. However, according to the manufacturing method of the sheet film of this embodiment, the storage elastic modulus of the adhesive layer at a temperature of 20 ° C is 0.15 to 1MPa, can still suppress the generation of fine unevenness.

黏著劑層的儲存彈性模數可使用亦市售的黏彈性測量裝置,例如REOMETRIC公司製造的黏彈性測量裝置「DYNAMIC ANALYZER RDA II」來測量。 The storage elastic modulus of the adhesive layer can be measured using a commercially available viscoelasticity measuring device such as a viscoelasticity measuring device "DYNAMIC ANALYZER RDA II" manufactured by REOMETRIC.

就用來將儲存彈性模數調整至上述範圍的方法而言,可列舉在基礎聚合物或還包含交聯劑的黏著劑組成物添加低聚物,具體而言為胺基甲酸酯(甲基)丙烯酸酯系的低聚物而得到活性能量線硬化型黏著劑組成物(較佳為紫外線硬化型黏著劑組成物)。更佳為照射活性能量線使黏著劑層適度地硬化。 Examples of the method for adjusting the storage elastic modulus to the above range include adding an oligomer to a base polymer or an adhesive composition further containing a crosslinking agent, and specifically, a urethane (formaldehyde Group) an acrylate-based oligomer to obtain an active energy ray-curable adhesive composition (preferably an ultraviolet-curable adhesive composition). More preferably, the active energy ray is irradiated to moderately harden the adhesive layer.

[基準黏著劑層] [Reference adhesive layer]

使用本實施形態之片狀膜的製造方法或以本實施形態之片狀膜的製造方法製造的多層膜具有n層(n為1以上的整數)的黏著劑層。包含在多層膜的黏著劑層為一層時,以該黏著劑層為基準黏著劑層,控制壓切刀片的速度以滿足上述關係式(1)。包含在多層膜的黏著劑層為複數層時,以在壓切步驟中見到容易產生凹凸的黏著劑層為基準黏著劑層較佳。以下例示於i)及ii)的黏著劑層係本發明人以在壓切步驟中見到容易產生凹凸的黏著劑層做為基準黏著劑層來例示。 The multilayer film manufactured by the manufacturing method of the sheet-like film of this embodiment, or the manufacturing method of the sheet-like film of this embodiment has an n-layer (n is an integer of 1 or more) adhesive layer. When there is one adhesive layer included in the multilayer film, the speed of the cutting blade is controlled to satisfy the above-mentioned relational expression (1) by using the adhesive layer as a reference adhesive layer. When the adhesive layer included in the multilayer film is a plurality of layers, it is preferable to use the adhesive layer that is prone to generate unevenness in the cutting step as a reference adhesive layer. The adhesive layers exemplified below in i) and ii) are exemplified by the present inventor's use of an adhesive layer that is prone to generate unevenness in the cutting step as a reference adhesive layer.

i)在溫度20℃儲存彈性模數最小的黏著劑層、 ii)多層膜具有最表層的分離膜,以及藉由分離膜的剝離而露出於最表面之最表層下的黏著劑層的構成中,最表層下的黏著劑層。 i) Store the adhesive layer with the smallest modulus of elasticity at a temperature of 20 ℃, ii) The multilayer film has a topmost separation membrane and an adhesive layer under the outermost surface layer which is exposed by peeling of the separation membrane, and the adhesive layer below the outermost layer.

又,在本實施形態之片狀膜的製造方法中,較佳為將n層的黏著劑層之任一者做為基準黏著劑層時,壓切刀片的速度均滿足關係式(1)。 In the method for producing a sheet-like film according to this embodiment, it is preferable that when any of the n-layer adhesive layers is used as the reference adhesive layer, the speed of the cutting blade satisfies the relational expression (1).

[多層膜的層構成例] [Example of layer constitution of multilayer film]

第9圖係示意性地顯示使用本實施形態之片狀膜的製造方法或以本實施形態之片狀膜的製造方法製造的多層膜之具體的層構成之一例的概略剖面圖。多層膜10d係層疊有包含偏光片(未圖示於第9圖中)的偏光板100、層疊在其一方的表面的防護膜60、層疊在另一方的表面的第一黏著劑層31、以及在第一黏著劑層31的外面用來暫時保護第一黏著劑層31之可剝離的分離膜70。另一方面,偏光板100中防護膜60側的表面(黏貼防護膜60的表面)及第一黏著劑層31的表面(黏貼第一黏著劑層31的表面)例如可以為保護膜、其他光學膜、或附加在膜上之層的表面。 FIG. 9 is a schematic cross-sectional view schematically showing an example of a specific layer configuration of a multilayer film manufactured by the method for manufacturing a sheet-like film according to this embodiment or the method for manufacturing a sheet-like film according to this embodiment. The multilayer film 10d is a polarizing plate 100 including a polarizer (not shown in FIG. 9), a protective film 60 laminated on one surface thereof, a first adhesive layer 31 laminated on the other surface, and The peelable separation film 70 on the outer surface of the first adhesive layer 31 is used to temporarily protect the first adhesive layer 31. On the other hand, the surface on the protective film 60 side (the surface to which the protective film 60 is adhered) and the surface of the first adhesive layer 31 (the surface to which the first adhesive layer 31 is adhered) in the polarizing plate 100 may be, for example, a protective film or other optical The surface of a film, or a layer attached to a film.

亦可為防護膜60之一方的面為黏著性,另一方的面為非黏著性,而在黏著性之一方的面黏貼並層疊偏光板100。就這種防護膜60而言,可列舉所謂的自黏性防護膜。自黏性防護膜係例如為由包含非黏著性樹脂的非黏著性樹脂層61、及包含自黏性樹脂的黏著性樹脂層62所構成的樹脂膜。就自黏性防護膜而言,例如可列舉「TORETECH」(TORAY FILM加工株式會社製)等。此外,亦可列舉以樹脂膜(基材膜)61、及層疊在樹脂膜上的第二黏著劑層62構成,經由該黏著劑層黏貼層疊於偏光板100的防護膜。防護膜60具有第二黏著劑層62時,通常其上述儲存彈性模數比第一黏著劑層之上述儲存彈性模數大。 One surface of the protective film 60 may be adhesive, and the other surface may be non-adhesive, and the polarizing plate 100 may be adhered and laminated on one of the adhesive surfaces. Examples of such a protective film 60 include a so-called self-adhesive protective film. The self-adhesive protective film system is, for example, a resin film composed of a non-adhesive resin layer 61 including a non-adhesive resin, and an adhesive resin layer 62 including a self-adhesive resin. Examples of the self-adhesive protective film include "TORETECH" (manufactured by TORAY FILM Processing Co., Ltd.). In addition, a protective film composed of a resin film (base film) 61 and a second adhesive layer 62 laminated on the resin film may be laminated on the polarizing plate 100 through the adhesive layer. When the protective film 60 has the second adhesive layer 62, the storage elastic modulus thereof is generally larger than the storage elastic modulus of the first adhesive layer.

偏光板100為至少包含偏光片及第一黏著劑層31的偏光元件,通常更包含黏貼在偏光片的單面或雙面的保護膜。偏光板100除了包含保護膜之外,亦可包含與偏光片具有不同光學功能的膜等的其他光學膜、附加在光學層等膜上的層。包含保護膜的各種光學膜可經由接著劑層 或黏著劑層黏貼。偏光板100可以為包含黏著劑層者,亦可以為不包含黏著劑層者。包含黏著劑層時,包含在偏光板100的黏著劑層成為包含在多層膜之n層的黏著劑層的一個。 The polarizing plate 100 is a polarizing element including at least a polarizer and a first adhesive layer 31, and generally further includes a protective film adhered to one or both sides of the polarizer. The polarizing plate 100 may include, in addition to a protective film, another optical film such as a film having an optical function different from that of a polarizer, or a layer added to a film such as an optical layer. Various optical films including a protective film can be passed through an adhesive layer Or stick the adhesive layer. The polarizing plate 100 may be one including an adhesive layer, or may be one not including an adhesive layer. When the adhesive layer is included, the adhesive layer included in the polarizing plate 100 becomes one of the adhesive layers included in the n layers of the multilayer film.

偏光板100的厚度通常為20至200μm,較佳為30至150μm,更佳為40至120μm,50至100μm又更佳。 The thickness of the polarizing plate 100 is usually 20 to 200 μm, preferably 30 to 150 μm, more preferably 40 to 120 μm, and even more preferably 50 to 100 μm.

多層膜10d可以為相對於由膜卷連續地捲出並搬運之原料膜,層疊同樣由膜卷連續地捲出之其他原料膜,將所獲得之細長狀的層疊膜捲繞成卷筒狀之藉由所謂卷至卷(roll to roll)的方式所製造者,亦可以為將其切割而得到的多層膜。在本實施形態之片狀膜的製造方法中,係在切割步驟切割多層膜10d來製造片狀膜。 The multilayer film 10d may be a raw material film continuously rolled out and transported from a film roll, and other raw material films continuously rolled out from the film roll may be laminated, and the obtained elongated laminated film may be wound into a roll shape. Produced by a so-called roll-to-roll method, it can also be a multilayer film obtained by cutting it. In the method for manufacturing a sheet-like film according to this embodiment, a multilayer film 10d is cut in a cutting step to produce a sheet-like film.

多層膜10d做為黏著劑層包含第一黏著劑層31及第二黏著劑層62時,層疊有可剝離的分離膜70的第一黏著劑層31通常在壓切步驟中容易產生細微凹凸。此被認為可能是由於分離膜70藉由剪應力的作用而發生剝離或移位,使黏著層的位移固定化。 When the multilayer film 10 d includes the first adhesive layer 31 and the second adhesive layer 62 as the adhesive layer, the first adhesive layer 31 on which the peelable separation film 70 is laminated is usually prone to fine unevenness during the cutting step. This is thought to be because the separation film 70 is peeled or displaced due to the effect of shear stress, and the displacement of the adhesive layer is fixed.

將多層膜10d藉由第4圖所示之切割裝置切割時,可將防護膜60側做為第一表面,分離膜70側做為第二表面,以使分離膜70與刀片承受板22接觸的方式承載於承載台23上進行切割,亦可將分離膜70側做為第一表面,防護膜60側做為第二表面,以使構成防護膜60的樹脂膜61與刀片承受板22接觸的方式承載於承載台23上進行切割。根據本實施形態之片狀膜的製造方法,即使將多層膜10d承載於任何方向,均可抑制因壓切步驟產生條紋狀的細微凹凸。 When the multilayer film 10d is cut by the cutting device shown in FIG. 4, the protective film 60 side can be used as the first surface, and the separation film 70 side can be used as the second surface, so that the separation film 70 is in contact with the blade receiving plate 22. It is carried on the bearing table 23 for cutting, and the separation film 70 side can be used as the first surface, and the protective film 60 side can be used as the second surface, so that the resin film 61 constituting the protective film 60 is in contact with the blade receiving plate 22 The method is carried on the supporting platform 23 for cutting. According to the method for manufacturing a sheet-like film according to this embodiment, even if the multi-layer film 10d is carried in any direction, it is possible to suppress generation of fine unevenness in a stripe shape due to the cutting step.

未切割之多層膜10d的形狀雖無特別限定,一般為細長狀(帶 狀)。未切割之多層膜10d的細長方向的長度及寬度方向的長度雖無特別限制,通常多層膜10d的細長方向的長度為100m至20000m,寬度方向的長度為1000mm至1500mm。此外,將多層膜10d切割成小片的多層膜10d之後,亦可進行壓切步驟。此時,小片的多層膜10d的形狀雖無特別限制,較佳為具備具有長邊和短邊之方形形狀,一般為長方形。長邊和短邊的長度並無特別限制,例如長邊的長度為900mm以下,短邊的長度為800mm以下。 Although the shape of the uncut multilayer film 10d is not particularly limited, it is generally elongated (belt shape). Although the length of the slender direction and the width direction of the uncut multilayer film 10d is not particularly limited, the length of the slender direction of the multilayer film 10d is generally 100m to 20,000m, and the length of the width direction is 1000mm to 1500mm. In addition, after the multilayer film 10d is cut into small pieces of the multilayer film 10d, a cutting step may be performed. At this time, although the shape of the small-piece multilayer film 10d is not particularly limited, it is preferably a square shape having long sides and short sides, and generally a rectangular shape. The length of the long side and the short side is not particularly limited, for example, the length of the long side is 900 mm or less, and the length of the short side is 800 mm or less.

片狀膜的的尺寸、形狀及切割角度並無特別限制。片狀膜較佳為方形形狀,更佳為具有長邊和短邊之方形形狀。此方形形狀較佳為長方形。片狀膜為長方形時,長邊的長度例如為50mm至300mm,較佳為70mm至200mm。短邊的長度例如為30mm至200mm,較佳為40mm至100mm。壓切步驟中,在切割面附近之片狀膜的表面產生的細微凹凸,係片狀膜的尺寸愈小越顯眼,而容易成為外觀上的缺陷,根據本實施形態之片狀膜的製造方法,即使在片狀膜的尺寸小的情況,也能夠防止產生細微凹凸。 The size, shape, and cutting angle of the sheet-like film are not particularly limited. The sheet-like film is preferably a square shape, and more preferably a square shape having long sides and short sides. This square shape is preferably rectangular. When the sheet-like film is rectangular, the length of the long side is, for example, 50 mm to 300 mm, and preferably 70 mm to 200 mm. The length of the short side is, for example, 30 mm to 200 mm, and preferably 40 mm to 100 mm. In the press-cutting step, the minute irregularities generated on the surface of the sheet-like film near the cutting surface, the smaller the size of the sheet-like film, the more conspicuous it becomes, and it is easy to become an appearance defect. Even when the size of the sheet-like film is small, fine unevenness can be prevented.

(1)偏光片 (1) Polarizer

偏光片係具有吸收具有與其吸收軸平行之振動面的直線偏光,穿透具有與吸收軸垂直(與穿透軸平行)之振動面的直線偏光的性質之吸收型的偏光片,可適當地使用使二色性色素吸附定向於聚乙烯醇系樹脂膜的偏光膜。偏光片例如可藉由包含單軸拉伸聚乙烯醇系樹脂膜的步驟、以二色性色素對聚乙烯醇系樹脂膜進行染色藉以使二色性色素吸附的步驟、以硼酸水溶液將已吸附二色性色素之聚乙烯醇系樹脂膜進行處理的步驟、及在硼 酸水溶液處理後進行洗淨的步驟的方法來製造。 A polarizer is an absorption-type polarizer having the property of absorbing linearly polarized light having a vibration plane parallel to its absorption axis and penetrating linearly polarized light having a vibration plane perpendicular to the absorption axis (parallel to the transmission axis). A polarizing film in which a dichroic dye is adsorbed and oriented on a polyvinyl alcohol-based resin film. The polarizer may include, for example, a step of uniaxially stretching the polyvinyl alcohol-based resin film, a step of dyeing the polyvinyl alcohol-based resin film with a dichroic dye to adsorb the dichroic dye, and an adsorbed solution with a boric acid aqueous solution. Process for processing a polyvinyl alcohol-based resin film of a dichroic pigment, and It is manufactured by a method in which an acid aqueous solution is subjected to a washing step.

偏光片的厚度較佳為50μm以下,更佳為30μm以下。將偏光片的厚度設為30μm以下有利於偏光板100甚至於圖像顯示裝置薄型化。偏光片的厚度通常為2μm以上(例如5μm以上)。 The thickness of the polarizer is preferably 50 μm or less, and more preferably 30 μm or less. Setting the thickness of the polarizer to 30 μm or less is favorable for the polarizing plate 100 and even the thinning of the image display device. The thickness of the polarizer is usually 2 μm or more (for example, 5 μm or more).

(2)保護膜 (2) Protective film

可層疊在偏光片的單面或雙面的保護膜可以為由具有透光性(較佳為光學上透明)之熱塑性樹脂[例如鏈狀聚烯烴系樹脂(聚丙烯系樹脂等)、環狀聚烯烴系樹脂(降冰片烯系樹脂等)等聚烯烴系樹脂;三乙醯纖維素、二乙醯纖維素等纖維素系樹脂;聚對苯二甲酸乙二酯、聚對苯二甲酸丁二酯等聚酯系樹脂;聚碳酸酯系樹脂;甲基丙烯酸甲酯系樹脂等(甲基)丙烯酸系樹脂;聚苯乙烯系樹脂;聚氯乙烯系樹脂;丙烯腈-丁二烯-苯乙烯系樹脂;丙烯腈-苯乙烯系樹脂;聚乙酸乙烯酯系樹脂;聚偏二氯乙烯系樹脂;聚醯胺系樹脂;聚縮醛系樹脂;改性聚苯醚系樹脂;聚碸系樹脂;聚醚碸系樹脂;聚芳酯系樹脂;聚醯胺醯亞胺系樹脂;聚醯亞胺系樹脂等]所構成的膜。其中,較佳為使用聚烯烴系樹脂、纖維素系樹脂。又,本說明書中的「(甲基)丙烯酸系樹脂」係表示選自丙烯酸系樹脂和甲基丙烯酸系樹脂所成之群的至少一種。其他附有「(甲基)」之用語亦相同。 The protective film that can be laminated on one or both sides of the polarizer may be a thermoplastic resin (for example, a chain polyolefin resin (polypropylene resin, etc.), a ring-shaped resin, etc.) that has translucency (preferably optically transparent). Polyolefin-based resins (such as norbornene-based resins) and other polyolefin-based resins; cellulose resins such as triethyl cellulose and diethyl cellulose; polyethylene terephthalate, polybutylene terephthalate Polyester resins such as diesters; polycarbonate resins; (meth) acrylic resins such as methyl methacrylate resins; polystyrene resins; polyvinyl chloride resins; acrylonitrile-butadiene-benzene Vinyl resin; Acrylonitrile-styrene resin; Polyvinyl acetate resin; Polyvinylidene chloride resin; Polyamine resin; Polyacetal resin; Modified polyphenylene ether resin; Polyfluorene resin Resin; polyether fluorene resin; polyarylate resin; polyfluorene amine imine resin; polyfluorene amine resin; etc.]. Among them, polyolefin resins and cellulose resins are preferably used. The "(meth) acrylic resin" in the present specification means at least one selected from the group consisting of an acrylic resin and a methacrylic resin. The same applies to other terms with "(methyl)".

保護膜的厚度通常為1至100μm,但由強度、操作性等的觀點看來,較佳為5至60μm,更佳為5至50μm。 The thickness of the protective film is usually 1 to 100 μm, but from the viewpoints of strength, operability, etc., it is preferably 5 to 60 μm, and more preferably 5 to 50 μm.

保護膜亦可在其至少任一方的外面(與偏光片相反側的面)具備硬塗層、防眩層、光擴散層、相位差層(具有1/4波長之相位差值的相位差層等)、防反射層、防靜電層、防汙層等表面處理層(塗層)或光學層。 The protective film may include a hard coat layer, an anti-glare layer, a light diffusion layer, and a retardation layer (a retardation layer having a retardation value of 1/4 wavelength) on at least one of the surfaces (the surface opposite to the polarizer). Etc.), anti-reflection layer, antistatic layer, antifouling layer and other surface treatment layers (coatings) or optical layers.

保護膜例如可隔著接著劑層黏貼於偏光片。就形成接著劑層的接著劑而言,可使用水系接著劑、活性能量線硬化性接著劑、或熱硬化性接著劑,較佳為水系接著劑、活性能量線硬化性接著劑。 The protective film can be adhered to a polarizer via an adhesive layer, for example. As the adhesive forming the adhesive layer, a water-based adhesive, an active energy ray-curable adhesive, or a thermosetting adhesive can be used, and a water-based adhesive or an active energy ray-curable adhesive is preferred.

(3)其他光學膜 (3) Other optical films

偏光板100可包含偏光片及保護膜以外的其他光學膜,其代表例為增亮膜和相位差膜。偏光板100包含其他光學膜時,保護膜60可層疊在此光學膜的表面。 The polarizing plate 100 may include other optical films other than a polarizer and a protective film, and representative examples thereof include a brightness enhancement film and a retardation film. When the polarizing plate 100 includes another optical film, the protective film 60 may be laminated on the surface of the optical film.

(4)第一黏著劑層 (4) The first adhesive layer

第一黏著劑層31係配置在偏光板100之最外表面的黏著劑層,可使用在將多層膜黏貼在圖像顯示元件(例如液晶單元)、其他光學構件。第一黏著劑層31的厚度可以為1至40μm,但從偏光板100之薄膜化的觀點、以及保持良好的加工性並抑制偏光板100之尺寸變化的觀點看來,較佳為設為3至25μm(例如3至20μm,更佳為3至15μm)。第一黏著劑層31的材料係適用上述黏著劑層的說明。 The first adhesive layer 31 is an adhesive layer disposed on the outermost surface of the polarizing plate 100, and can be used to adhere a multilayer film to an image display element (such as a liquid crystal cell) or other optical members. The thickness of the first adhesive layer 31 may be 1 to 40 μm, but from the viewpoint of thinning the polarizing plate 100 and the viewpoint of maintaining good processability and suppressing the dimensional change of the polarizing plate 100, it is preferably set to 3 To 25 μm (for example, 3 to 20 μm, more preferably 3 to 15 μm). The material of the first adhesive layer 31 is applied to the description of the above-mentioned adhesive layer.

(5)分離膜 (5) Separation membrane

分離膜70係將第一黏著劑層31黏貼在圖像顯示元件(例如液晶單元)、其他光學構件為止,為保護其表面而暫時附著的膜。分離膜70通常以在單面施以脫模處理的熱塑性樹脂膜構成,其脫模處理面黏貼在第一黏著劑層31。構成分離膜70之熱塑性樹脂例如可以為聚乙烯等之聚乙烯系樹脂、聚丙烯等之聚丙烯系樹脂、聚對苯二甲酸乙二醇酯或聚萘二甲酸乙二醇酯等之聚酯系樹脂等。在第三黏著劑層32的表面亦可至黏貼增亮膜50等的光學膜為止,為暫時附著保護其表面而貼附與上述相同的分離膜。 分離膜70的厚度例如為10至100μm。第一黏著劑層31的前述儲存彈性模數為0.15至1MPa時,與此第一黏著劑層31直接接觸之分離膜的厚度若在50μm以下,在壓切步驟中,由於在此第一黏著劑層31產生細微凹凸的情況會變多,較佳為適用本發明的方法。 The separation film 70 is a film temporarily adhered to protect the surface until the first adhesive layer 31 is adhered to an image display element (for example, a liquid crystal cell) or other optical members. The separation film 70 is generally composed of a thermoplastic resin film subjected to a release treatment on one side, and the release treatment surface is adhered to the first adhesive layer 31. The thermoplastic resin constituting the separation membrane 70 may be, for example, a polyethylene resin such as polyethylene, a polypropylene resin such as polypropylene, or a polyester such as polyethylene terephthalate or polyethylene naphthalate. Department of resin and so on. On the surface of the third adhesive layer 32, an optical film such as the brightness enhancement film 50 may be pasted, and the same separation film as described above may be pasted to temporarily protect the surface. The thickness of the separation membrane 70 is, for example, 10 to 100 μm. When the aforementioned storage elastic modulus of the first adhesive layer 31 is 0.15 to 1 MPa, if the thickness of the separation membrane in direct contact with the first adhesive layer 31 is 50 μm or less, during the cutting step, due to the first adhesion here, The fine unevenness of the agent layer 31 may increase, and the method of the present invention is preferably applied.

(6)防護膜 (6) Protective film

防護膜60係以樹脂膜61、及層疊於樹脂膜上之非黏著性樹脂層62或第二黏著劑層62構成。防護膜60係用來保護偏光板100之表面的膜,通常例如在圖像顯示元件、其他光學構件黏貼附有防護膜的偏光板後,將具有防護膜之黏著性樹脂層62或第二黏著劑層62一同剝離去除。 The protective film 60 is composed of a resin film 61 and a non-adhesive resin layer 62 or a second adhesive layer 62 laminated on the resin film. The protective film 60 is a film for protecting the surface of the polarizing plate 100. Generally, for example, after the polarizing plate with the protective film is attached to an image display element or other optical member, an adhesive resin layer 62 or a second adhesive having the protective film is adhered. The agent layer 62 is peeled and removed together.

構成樹脂膜61的樹脂例如可以為聚乙烯等之聚乙烯系樹脂、聚丙烯等之聚丙烯系樹脂、聚對苯二甲酸乙二醇酯或聚萘二甲酸乙二醇酯等之聚酯系樹脂、聚碳酸酯系樹脂等的熱塑性樹脂。較佳為聚對苯二甲酸乙二醇酯等的聚酯系樹脂。樹脂膜61可為單層構造,亦可以為多層構造,但由製造容易性及製造成本等觀點看來,較佳為單層構造。關於第二黏著劑層62係引用有關前述第一黏著劑層31的記述。 The resin constituting the resin film 61 may be, for example, a polyethylene resin such as polyethylene, a polypropylene resin such as polypropylene, or a polyester resin such as polyethylene terephthalate or polyethylene naphthalate. Thermoplastic resins such as resins and polycarbonate resins. Polyester resins such as polyethylene terephthalate are preferred. The resin film 61 may have a single-layer structure or a multi-layer structure, but from the viewpoints of ease of production and manufacturing cost, a single-layer structure is preferred. The second adhesive layer 62 refers to the description of the first adhesive layer 31 described above.

[片狀膜的製造裝置] [Production Device for Sheet Film]

本實施形態之片狀膜的製造裝置係具有切割具有黏著劑層的多層膜而由多層膜得到片狀膜的切割部。切割部係具備可從前述多層膜的第一表面朝前述多層膜的第二表面進入前述多層膜內而配置的壓切刀片。關於切割部係適用片狀膜的製造方法中,上述切割裝置的說明。關於多層膜係適用片狀膜的製造方法中,上述多層膜的說明。 The manufacturing apparatus of the sheet-like film of this embodiment has a cutting part which cuts the multilayer film which has an adhesive layer, and obtains a sheet-like film from a multilayer film. The cutting unit includes a cutting blade that can be placed in the multilayer film from a first surface of the multilayer film toward a second surface of the multilayer film. In the manufacturing method of a sheet-shaped film to which a cutting part is applied, the said cutting device was demonstrated. About the manufacturing method of the sheet-like film suitable for a multilayer film system, the said multilayer film was demonstrated.

本實施形態之片狀膜的製造裝置可具備上述切割部以外的 構成要素,例如可列舉:製造多層膜之多層膜製造部、捲出捲繞成卷筒狀之多層膜的捲出部、搬運多層膜或片狀膜的搬運部、乾燥多層膜或片狀膜的乾燥部等。 The manufacturing apparatus of the sheet-like film of this embodiment may be provided with the other than the said cutting part. The constituent elements include, for example, a multilayer film manufacturing section for manufacturing a multilayer film, a roll-out section for winding a roll-shaped multilayer film, a transport section for transporting a multilayer film or a sheet film, a dried multilayer film or a sheet film Drying section and so on.

[多層膜的切割方法] [Cutting method of multilayer film]

本實施形態之多層膜的切割方法係包含使壓切刀片從多層膜的第一表面朝多層膜的第二表面進入多層膜內而切割多層膜的壓切步驟。關於切割方法係適用片狀膜的製造方法中,上述切割步驟的說明。 The cutting method of the multilayer film of this embodiment includes a cutting step of cutting the multilayer film by moving a cutting blade into the multilayer film from the first surface of the multilayer film to the second surface of the multilayer film. The dicing method is a description of the above-mentioned dicing steps in the method for producing a sheet-like film.

[實施例] [Example]

以下藉由實施例更詳細說明本發明,惟本發明並不限於該等例子。 Hereinafter, the present invention will be described in more detail through examples, but the present invention is not limited to these examples.

[多層膜A] [Multilayer film A]

就切割對象的多層膜A而言,係使用厚度185μm,長邊的長度300mm×短邊的長度210mm之長方形的附防護膜的環烯烴聚合物(COP)偏光板(SRD341量產原料)。附防護膜的COP偏光板係形成由上層疊有防護膜(58μm)、做為保護膜的TAC膜(25μm)、做為偏光子的PVA膜(12μm)、COP膜(23μm)、第一黏著劑層(20μm)、做為分離膜的PET膜(38μm)的構成。防護膜之一側的面為黏著性,另一側的面為非黏著性,黏著性之一側的面與TAC膜接觸並黏貼。 As for the multilayer film A to be cut, a cyclic olefin polymer (COP) polarizing plate (material for mass production of SRD341) with a protective film having a thickness of 185 μm and a length of 300 mm on the long side and a length of 210 mm on the short side was used. The COP polarizing plate with protective film is formed by laminating a protective film (58 μm), a TAC film (25 μm) as a protective film, a PVA film (12 μm) as a polarizer, a COP film (23 μm), and first adhesion. The structure of an agent layer (20 μm) and a PET film (38 μm) as a separation membrane. One side of the protective film is adhesive, and the other side is non-adhesive. The one side of the adhesive film is in contact with the TAC film and adhered.

第一黏著劑層在溫度20℃、角頻率1,000rad/sec之儲存彈性模數為0.34MPa。關於多層膜A,係以第一黏著劑層為基準黏著劑層。有關基準黏著劑層(第一黏著劑層),係使用REOMETRIC公司製的黏彈性測量裝置「DYNAMIC ANALYZER RDA II」進行在溫度20℃的頻率掃描 的動態黏彈性測量,根據測量值導出儲存彈性模數顯示為3.0×105(Pa)時的頻率ω1為1.20×102(1/秒)。又,同樣地根據測量值導出儲存彈性模數顯示為6.0×105(Pa)時的頻率ω2為6.03×102(1/秒)。 The storage modulus of the first adhesive layer was 0.34 MPa at a temperature of 20 ° C and an angular frequency of 1,000 rad / sec. Regarding the multilayer film A, the first adhesive layer is used as a reference adhesive layer. Regarding the reference adhesive layer (first adhesive layer), a dynamic viscoelasticity measurement at a frequency of 20 ° C was performed by using a viscoelasticity measuring device "DYNAMIC ANALYZER RDA II" manufactured by REOMETRIC, and a storage elastic modulus was derived from the measured values. The frequency ω 1 when the number is displayed as 3.0 × 10 5 (Pa) is 1.20 × 10 2 (1 / second). Similarly, the frequency ω 2 when the storage elastic modulus was 6.0 × 10 5 (Pa) was derived from the measured values and was 6.03 × 10 2 (1 / second).

[多層膜B] [Multilayer film B]

多層膜B係使用與構成多層膜A之第一黏著劑層的黏著劑組成物不同的黏著劑組成物做為構成第一黏著劑層的黏著劑組成物,除了第一黏著劑層的厚度為15μm、多層膜B的厚度為180μm以外,與多層膜A為同樣的構成。第一黏著劑層在溫度20℃、角頻率1,000rad/sec之儲存彈性模數為0.65MPa。關於多層膜B,係以第一黏著劑層為基準黏著劑層。有關基準黏著劑層,係使用REOMETRIC公司製的黏彈性測量裝置「DYNAMIC ANALYZER RDA II」進行在溫度20℃的頻率掃描的動態黏彈性測量,根據測量值導出儲存彈性模數顯示為3.0×105(Pa)時的頻率ω1為1.62×10(1/秒)。又,同樣地根據測量值導出儲存彈性模數顯示為6.0×105(Pa)時的頻率ω2為1.38×102(1/秒)。 The multilayer film B uses an adhesive composition different from the adhesive composition constituting the first adhesive layer of the multilayer film A as the adhesive composition constituting the first adhesive layer, except that the thickness of the first adhesive layer is The thickness is 15 μm, and the thickness of the multilayer film B is other than 180 μm. The structure is the same as that of the multilayer film A. The storage modulus of the first adhesive layer was 0.65 MPa at a temperature of 20 ° C and an angular frequency of 1,000 rad / sec. The multilayer film B is based on the first adhesive layer as a reference adhesive layer. Regarding the reference adhesive layer, a dynamic viscoelasticity measurement at a frequency of 20 ° C was performed using a viscoelasticity measuring device "DYNAMIC ANALYZER RDA II" manufactured by REOMETRIC. The storage elastic modulus was derived from the measured values and displayed as 3.0 × 10 5 The frequency ω 1 at (Pa) is 1.62 × 10 (1 / second). In the same manner, the frequency ω 2 when the storage elastic modulus was 6.0 × 10 5 (Pa) was derived from the measured values, which was 1.38 × 10 2 (1 / second).

[實施例1] [Example 1]

(切割測試) (Cutting test)

使用第4圖所示之切割裝置進行切割測試,該切割裝置係具備第5圖所示之壓切刀片構件21a。使用長邊方向的長度為614mm的湯姆遜刀片(株式會社荻野精機製作所製造)做為壓切刀片構件21a的壓切刀片211a。 The cutting test was performed using a cutting device shown in FIG. 4, which is provided with a cutting blade member 21 a shown in FIG. 5. As the cutting blade 211a of the cutting blade member 21a, a Thomson blade (manufactured by Takino Seiki Co., Ltd.) having a length of 614 mm in the longitudinal direction was used.

首先,以與刀片承受板22接觸的方式將多層膜A承載於承載台23上。此時,以構成防護膜的PET膜(58μm)位於上側,做為分離膜的PET膜(38μm)位於下側的方式承載。然後,使壓切刀片211a在防護膜 的表面以7.6×104(μm/秒)的速度進入多層膜A,在與吸收軸垂直的方向切割,將附防護膜的COP偏光板分成2等分。 First, the multilayer film A is carried on the supporting table 23 so as to be in contact with the blade receiving plate 22. At this time, the PET film (58 μm) constituting the protective film is placed on the upper side, and the PET film (38 μm) as the separation film is placed on the lower side. Then, the cutting blade 211a was allowed to enter the multilayer film A on the surface of the protective film at a speed of 7.6 × 10 4 (μm / sec), and cut in a direction perpendicular to the absorption axis to divide the COP polarizing plate with the protective film into two equal parts. .

(產生條紋狀凹凸的評估) (Evaluation of streaks)

以五個樣品實施切割測試,針對五個樣品以目視評估分成兩等分之切割片表面的切割面附近有無產生條紋狀的凹凸。評估結果顯示於表1。 Five samples were subjected to a cutting test, and the five samples were evaluated visually for the presence or absence of streaks in the vicinity of the cut surface of the surface of the cut piece divided into two. The evaluation results are shown in Table 1.

[實施例2] [Example 2]

在切割測試中,除了使壓切刀片211a在防護膜的表面以1.2×105μm/秒的速度進入多層膜A之外,與實施例1同樣的方式進行切割測試,評估有無產生條紋狀的凹凸。評估結果顯示於表1。 In the cutting test, the cutting test was performed in the same manner as in Example 1 except that the cutting blade 211a was allowed to enter the multilayer film A at a speed of 1.2 × 10 5 μm / sec on the surface of the protective film, and the presence or absence of streaks was evaluated. Bump. The evaluation results are shown in Table 1.

[實施例3] [Example 3]

在切割測試中,除了使用多層膜B取代多層膜A、以及使壓切刀片211a在防護膜的表面以2.1×104μm/秒的速度進入多層膜B之外,與實施例1同樣的方式進行切割測試,評估有無產生條紋狀的凹凸。評估結果顯示於表1。 The cutting test was performed in the same manner as in Example 1 except that the multilayer film B was used instead of the multilayer film A, and the cutting blade 211a entered the multilayer film B at a speed of 2.1 × 10 4 μm / sec on the surface of the protective film. A cutting test was performed to evaluate the presence or absence of streaks. The evaluation results are shown in Table 1.

[實施例4] [Example 4]

在切割測試中,除了使壓切刀片211a在防護膜的表面以7.6×104μm/秒的速度進入多層膜B之外,與實施例3同樣的方式進行切割測試,評估有無產生條紋狀的凹凸。評估結果顯示於表1。 In the cutting test, a cutting test was performed in the same manner as in Example 3, except that the cutting blade 211a was allowed to enter the multilayer film B on the surface of the protective film at a speed of 7.6 × 10 4 μm / second, and the presence or absence of streaks was evaluated. Bump. The evaluation results are shown in Table 1.

[比較例1] [Comparative Example 1]

在切割測試中,除了使壓切刀片211a在防護膜的表面以6.6×103μm/秒的速度進入多層膜A之外,與實施例1同樣的方式進行切割測試,評估有無產生條紋狀的凹凸。評估結果顯示於表1。 In the cutting test, the cutting test was performed in the same manner as in Example 1 except that the cutting blade 211a was allowed to enter the multilayer film A at a speed of 6.6 × 10 3 μm / sec on the surface of the protective film, and the presence or absence of streaks was evaluated. Bump. The evaluation results are shown in Table 1.

[比較例2] [Comparative Example 2]

在切割測試中,除了使壓切刀片211a在防護膜的表面以2.1×104μm/秒的速度進入多層膜A之外,與實施例1同樣的方式進行切割測試,評估有無產生條紋狀的凹凸。評估結果顯示於表1。 In the cutting test, a cutting test was performed in the same manner as in Example 1 except that the cutting blade 211a was allowed to enter the multilayer film A at a speed of 2.1 × 10 4 μm / sec on the surface of the protective film, and the presence or absence of streaks was evaluated. Bump. The evaluation results are shown in Table 1.

以上係針對本發明之實施形態進行說明,惟此次揭示之實施形態在所有方面均為例示,並非有所限制者。本發明的範圍係依據申請專利範圍所示,其包含與申請專利範圍相同的意義及範圍內的所有變更。 The above is a description of the embodiments of the present invention, but the embodiments disclosed this time are illustrative in all respects, and are not limited. The scope of the present invention is shown according to the scope of the patent application, and it includes all changes within the same meaning and scope as the scope of the patent application.

Claims (18)

一種片狀膜的製造方法,係具有切割具有n層之黏著劑層的多層膜而由前述多層膜得到片狀膜的切割步驟,其中n為1以上的整數,前述切割步驟包含使壓切刀片從前述多層膜的第一表面朝前述多層膜的第二表面進入前述多層膜內,而切割前述多層膜的壓切步驟,在將n層的前述黏著劑層之中任一個前述黏著劑層做為基準黏著劑層時,前述壓切刀片在前述多層膜之第一表面的速度V(μm/秒)係滿足下述關係式(1),t/V<1/ω1 (1)上述關係式(1)中,t表示多層膜的厚度(μm),ω1表示依據前述基準黏著劑層在溫度20℃的頻率掃描所進行的動態黏彈性測量的測量值計算出的儲存彈性模數顯示為3.0×105(Pa)時的頻率(1/秒)。A method for manufacturing a sheet-shaped film, comprising a cutting step of cutting a multilayer film having an adhesive layer of n layers to obtain a sheet-shaped film from the multilayer film, where n is an integer of 1 or more, and the cutting step includes a cutting blade. From the first surface of the multi-layer film to the second surface of the multi-layer film, enter the multi-layer film, and the cutting step of cutting the multi-layer film is performed by using any of the n-layers of the aforementioned adhesive layers When the adhesive layer is a reference, the speed V (μm / sec) of the cutting blade on the first surface of the multilayer film satisfies the following relationship (1), and t / V <1 / ω 1 (1) the above relationship In formula (1), t represents the thickness (μm) of the multilayer film, and ω 1 represents the storage elastic modulus calculated based on the measurement value of the dynamic viscoelasticity measurement performed by the frequency sweep of the reference adhesive layer at a temperature of 20 ° C. The frequency (1 / sec) at 3.0 × 10 5 (Pa). 如申請專利範圍第1項所述之片狀膜的製造方法,其中,將前述黏著劑層之中,在溫度20℃、角頻率1,000rad/sec之儲存彈性模數最小的黏著劑層設為前述基準黏著劑層。The method for manufacturing a sheet-like film according to item 1 of the scope of patent application, wherein the adhesive layer having the smallest storage elastic modulus among the aforementioned adhesive layers at a temperature of 20 ° C and an angular frequency of 1,000 rad / sec is set as The aforementioned reference adhesive layer. 如申請專利範圍第1項所述之片狀膜的製造方法,其中,前述多層膜係具有:最表層的分離膜,及藉由前述分離膜的剝離而露出於最表面之最表層下的黏著劑層;且將前述最表層下的黏著劑層設為前述基準黏著劑層。The method for manufacturing a sheet-like film according to item 1 of the scope of the patent application, wherein the multi-layered film system includes: a separation film on the outermost layer, and adhesion under the outermost surface layer by peeling of the separation film The adhesive layer; and the adhesive layer below the outermost layer is referred to as the reference adhesive layer. 如申請專利範圍第1項所述之片狀膜的製造方法,其中,前述多層膜係具有偏光片。The method for manufacturing a sheet-like film according to item 1 of the scope of patent application, wherein the multilayer film has a polarizer. 如申請專利範圍第1項所述之片狀膜的製造方法,其中,前述基準黏著劑層的厚度為1至20μm。The method for manufacturing a sheet-like film according to item 1 of the scope of patent application, wherein the thickness of the reference adhesive layer is 1 to 20 μm. 如申請專利範圍第1項至第5項中任一項所述之片狀膜的製造方法,其中,前述壓切刀片為湯姆遜刀片。The method for manufacturing a sheet-like film according to any one of claims 1 to 5, wherein the aforementioned cutting blade is a Thomson blade. 一種片狀膜的製造裝置,係具有切割具有n層之黏著劑層的多層膜而由前述多層膜得到片狀膜的切割部,其中n為1以上的整數,前述切割部係具備:配置成可從前述多層膜的第一表面朝前述多層膜的第二表面進入前述多層膜內的壓切刀片;以及控制前述壓切刀片的移動的控制部;前述控制部係在將n層的前述黏著劑層之中任一個黏著劑層做為基準黏著劑層時,以使前述壓切刀片在前述多層膜之第一表面的速度V(μm/秒)滿足下述關係式(1)的方式進行控制,t/V<1/ω1 (1)上述關係式(1)中,t表示多層膜的厚度(μm),ω1表示依據前述基準黏著劑層在溫度20℃的頻率掃描所進行的動態黏彈性測量的測量值計算出的儲存彈性模數顯示為3.0×105(Pa)時的頻率(1/秒)。An apparatus for manufacturing a sheet-like film, comprising a cutting section for cutting a multilayer film having an adhesive layer of n layers and obtaining a sheet-shaped film from the multilayer film, where n is an integer of 1 or more, and the cutting section is provided with: A cutting blade that can enter the multilayer film from the first surface of the multilayer film to the second surface of the multilayer film; and a control part that controls the movement of the cutting blade; the control part is for adhering the n layers of the adhesive When any one of the adhesive layers is used as the reference adhesive layer, it is performed so that the speed V (μm / sec) of the cutting blade on the first surface of the multilayer film satisfies the following relational expression (1). Control, t / V <1 / ω 1 (1) In the above relational expression (1), t represents the thickness (μm) of the multilayer film, and ω 1 represents the frequency scan performed at a temperature of 20 ° C based on the reference adhesive layer described above. The storage elastic modulus calculated from the measured value of the dynamic viscoelasticity measurement is shown as a frequency (1 / second) at 3.0 × 10 5 (Pa). 如申請專利範圍第7項所述之片狀膜的製造裝置,其中,將前述黏著劑層之中,在溫度20℃、角頻率1,000rad/sec之儲存彈性模數最小的黏著劑層設為前述基準黏著劑層。The device for manufacturing a sheet-like film according to item 7 of the scope of patent application, wherein the adhesive layer having the smallest storage modulus of elasticity among the aforementioned adhesive layers at a temperature of 20 ° C and an angular frequency of 1,000 rad / sec is set as The aforementioned reference adhesive layer. 如申請專利範圍第7項所述之片狀膜的製造裝置,其中,前述多層膜係具有:最表層的分離膜;以及藉由前述分離膜的剝離而露出於最表面之最表層下的黏著劑層;並將前述最表層下的黏著劑層設為前述基準黏著劑層。The apparatus for manufacturing a sheet-like film according to item 7 of the scope of the patent application, wherein the multilayer film includes: a topmost separation film; and an adhesion under the outermost surface layer by peeling of the separation film. The adhesive layer; and the adhesive layer below the outermost layer is referred to as the reference adhesive layer. 如申請專利範圍第7項所述之片狀膜的製造裝置,其中,前述多層膜係具有偏光片。The device for manufacturing a sheet-like film according to item 7 of the scope of application for a patent, wherein the multilayer film has a polarizer. 如申請專利範圍第7項所述之片狀膜的製造裝置,其中,前述基準黏著劑層的厚度為1至20μm。The device for manufacturing a sheet-like film according to item 7 of the scope of patent application, wherein the thickness of the reference adhesive layer is 1 to 20 μm. 如申請專利範圍第7項至第11項中任一項所述之片狀膜的製造裝置,其中,前述壓切刀片為湯姆遜刀片。According to the device for manufacturing a sheet-like film according to any one of claims 7 to 11, in the patent application scope, wherein the cutting blade is a Thomson blade. 一種多層膜的切割方法,係切割具有n層之黏著劑層的多層膜,其中n為1以上的整數,該多層膜的切割方法包含:使壓切刀片從前述多層膜的第一表面朝前述多層膜的第二表面進入前述多層膜內,而切割前述多層膜的壓切步驟;在將n層的前述黏著劑層之中任一個黏著劑層做為基準黏著劑層時,前述壓切刀片在前述多層膜之第一表面的速度V(μm/秒)係滿足下述關係式(1),t/V<1/ω1(1)上述關係式(1)中,t表示多層膜的厚度(μm),ω1表示依據前述基準黏著劑層在溫度20℃的頻率掃描所進行的動態黏彈性測量的測量值計算出的儲存彈性模數顯示為3.0×105(Pa)時的頻率(1/秒)。A cutting method of a multilayer film is to cut a multilayer film having an adhesive layer of n layers, where n is an integer of 1 or more. The cutting method of the multilayer film includes: pressing a cutting blade from the first surface of the multilayer film toward the foregoing. The second surface of the multilayer film enters into the multilayer film, and the cutting step of cutting the multilayer film is performed; when any one of the n layers of the adhesive layers is used as a reference adhesive layer, the aforementioned cutting blade The speed V (μm / sec) of the first surface of the multilayer film satisfies the following relationship (1), t / V <1 / ω 1 (1) In the relationship (1), t represents the Thickness (μm), ω 1 represents the frequency at which the storage elastic modulus calculated based on the measured value of the dynamic viscoelasticity measurement performed by the frequency sweep of the reference adhesive layer at a temperature of 20 ° C is 3.0 × 10 5 (Pa) (1 second). 如申請專利範圍第13項所述之多層膜的切割方法,其中,將前述黏著劑層之中,在溫度20℃、角頻率1,000rad/sec之儲存彈性模數最小的黏著劑層設為前述基準黏著劑層。The method for cutting a multilayer film according to item 13 of the scope of patent application, wherein the adhesive layer having the smallest storage modulus of elasticity among the aforementioned adhesive layers at a temperature of 20 ° C and an angular frequency of 1,000 rad / sec is set as the foregoing Reference adhesive layer. 如申請專利範圍第13項所述之多層膜的切割方法,其中,前述多層膜係具有:最表層的分離膜,以及藉由前述分離膜的剝離而露出於最表面之最表層下的黏著劑層;且將前述最表層下的黏著劑層設為前述基準黏著劑層。The method for cutting a multilayer film according to item 13 of the scope of the patent application, wherein the multilayer film has: a topmost separation film; and an adhesive agent exposed under the topmost surface layer by peeling the separation film. And the adhesive layer below the outermost layer is referred to as the reference adhesive layer. 如申請專利範圍第13項所述之多層膜的切割方法,其中,前述多層膜係具有偏光片。The method for cutting a multilayer film according to item 13 of the scope of application, wherein the multilayer film has a polarizer. 如申請專利範圍第13項所述之多層膜的切割方法,其中,前述基準黏著劑層的厚度為1至20μm。The method for cutting a multilayer film according to item 13 of the scope of the patent application, wherein the thickness of the reference adhesive layer is 1 to 20 μm. 如申請專利範圍第13項至第17項中任一項所述之多層膜的切割方法,其中,前述壓切刀片為湯姆遜刀片。The method for cutting a multilayer film according to any one of claims 13 to 17, wherein the aforementioned cutting blade is a Thomson blade.
TW107142080A 2017-12-18 2018-11-26 Method of manufacturing sheet film TWI671202B (en)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2017-241814 2017-12-18
JP2017241814 2017-12-18
JP2018039861A JP6420511B1 (en) 2017-12-18 2018-03-06 Sheet-fed film manufacturing method
JP2018-039861 2018-03-06

Publications (2)

Publication Number Publication Date
TW201930089A TW201930089A (en) 2019-08-01
TWI671202B true TWI671202B (en) 2019-09-11

Family

ID=64098749

Family Applications (1)

Application Number Title Priority Date Filing Date
TW107142080A TWI671202B (en) 2017-12-18 2018-11-26 Method of manufacturing sheet film

Country Status (4)

Country Link
JP (2) JP6420511B1 (en)
KR (1) KR102035432B1 (en)
CN (1) CN110000863B (en)
TW (1) TWI671202B (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113613854B (en) 2019-03-31 2024-01-12 迪睿合株式会社 Upper blade roll, slitting device, slitting method, and laminated tape
KR20220067537A (en) * 2019-09-30 2022-05-24 닛토덴코 가부시키가이샤 A set of polarizing plates and an image display device comprising the set
JP2021117321A (en) * 2020-01-24 2021-08-10 住友化学株式会社 Optical stack and production method therefor
KR20220149510A (en) * 2020-03-16 2022-11-08 수미토모 케미칼 컴퍼니 리미티드 Laminated sheet and its manufacturing method
CN112829004B (en) * 2020-12-29 2022-07-29 安捷利(番禺)电子实业有限公司 Automatic die-cut covers membrane device

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007096111A (en) * 2005-09-29 2007-04-12 Dainippon Printing Co Ltd Composite filter for display and its manufacturing method
JP2015229237A (en) * 2014-06-09 2015-12-21 三菱レイヨン株式会社 Cutting method for lens sheet, lens sheet, and cutting blade

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4780828B2 (en) * 2000-11-22 2011-09-28 三井化学株式会社 Adhesive tape for wafer processing, method for producing the same and method for using the same
JP2002219686A (en) 2001-01-22 2002-08-06 Sumitomo Chem Co Ltd Film cutter, and method for preventing sticking therein
JP4405323B2 (en) * 2004-06-21 2010-01-27 リンテック株式会社 Laminated sheet and method for producing the same
JP2007283440A (en) 2006-04-17 2007-11-01 Tookoo:Kk Sheet cutting apparatus
KR20100129203A (en) * 2009-05-29 2010-12-08 후지필름 가부시키가이샤 Method of cutting laminated body
JP5171863B2 (en) * 2010-03-09 2013-03-27 日東電工株式会社 LAMINATED FILM CUTTING METHOD, CUTTING DEVICE, AND OPTICAL DISPLAY DEVICE MANUFACTURING METHOD
JP6209015B2 (en) 2013-08-07 2017-10-04 住友化学株式会社 Cutting apparatus and cutting method

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007096111A (en) * 2005-09-29 2007-04-12 Dainippon Printing Co Ltd Composite filter for display and its manufacturing method
JP2015229237A (en) * 2014-06-09 2015-12-21 三菱レイヨン株式会社 Cutting method for lens sheet, lens sheet, and cutting blade

Also Published As

Publication number Publication date
KR102035432B1 (en) 2019-10-23
JP6420511B1 (en) 2018-11-07
KR20190073283A (en) 2019-06-26
JP2019107764A (en) 2019-07-04
JP2019107761A (en) 2019-07-04
CN110000863A (en) 2019-07-12
CN110000863B (en) 2020-05-12
TW201930089A (en) 2019-08-01

Similar Documents

Publication Publication Date Title
TWI671202B (en) Method of manufacturing sheet film
JP4743339B2 (en) Manufacturing method of polarizing plate and polarizing plate obtained by the method
JP5382843B2 (en) Manufacturing method of polarizing plate
TWI783087B (en) Optical laminate and production method therefor
KR101625250B1 (en) Film-peeling method, process for production of optical film, film-peeling mechanism, and apparatus for production of optical film
TWI443389B (en) Process for producing polarizer
TW201805095A (en) Method for manufacturing polarizing plate and apparatus for manufacturing same
CN107924020B (en) Optical film assembly and method of making the same
WO2009087942A1 (en) Polarizer
JP7542967B2 (en) Laminate
JP5976969B1 (en) Manufacturing method of polarizing plate with protective film
KR20180103050A (en) Method for producing optical film
TWI666474B (en) Method for producing a protection-film-attached optical film
TWI694272B (en) Method for producing polarizing plate with protection film
KR102356930B1 (en) sheetfed optical film
JP2023001208A (en) optical sheet
JP7016729B2 (en) Manufacturing method of single-wafer film
KR102425954B1 (en) Optical display panel manufacturing method and optical display panel manufacturing system
JP2017009736A (en) Manufacturing method for polarizing plate with protective film
TWI666475B (en) Method for manufacturing sheet-like polarizing plate
WO2022191246A1 (en) Polarizing plate, and method for producing same
JP7240821B2 (en) Method for manufacturing optical laminate
WO2020095792A1 (en) Laminated body, method for manufacturing laminated body, method for forming optical body, and camera module mounting device
JP2022140346A (en) Polarizing plate and method for manufacturing the same