TWI661394B - Image recognion method for soldered dot - Google Patents

Abstract

A solder joint image recognition method includes: reading a solder joint position data and projecting a number of solder joints onto a first plane; reading a component data and projecting a digital element onto a second plane; the first plane and The second plane is stacked; calculating a distance between a projection position of a solder joint and a projection position of a component to obtain a first distance value; and if the first distance value exceeds a first preset distance, judging the weld The points belong to solder joints of different components. If the first distance value does not exceed the first preset distance, it is determined that the solder joints belong to solder joints of the same component.

Description

Image recognition method of solder joints

This creation is about an image recognition method, especially a solder joint image recognition method.

Technology is developing rapidly, and many convenient devices in life are inseparable from the assistance of technology. However, many circuits are still tested by manual visual inspection, so that the product yield is not necessarily proportional to the labor cost.

Welding not only serves as an electrical connection, it is also a means of fixing components. However, as components are miniaturized, the distance between solder joints is getting closer. In order to maintain component quality, solder joint inspection has become an important issue.

One of the purposes of this creation is to provide a method for identifying solder joint images, which can quickly determine the ownership of solder joints and components.

Another purpose of this creation is to provide a solder joint image identification method, which can quickly determine the assignment of solder joints and components through dual projection.

Another purpose of this creation is to provide a solder joint image identification method, which can quickly and more accurately judge the ownership of solder joints and components by using skirt projection.

Another purpose of this creation is to provide a solder joint image identification method, which can reduce the misjudgment of solder joints and components through dual projection and skirt projection.

In order to achieve the foregoing and other objectives, the technical means provided by this creation include: a method for identifying a solder joint image, including: reading a solder joint position data, projecting a few solder joints onto a first plane; reading a component data, Projecting a digital element onto a second plane; stacking the first plane and the second plane; calculating a distance between a projection position of a solder joint and a projection position of one element to obtain a first distance value; and if the If the first distance value exceeds a first preset distance, it is judged that the solder joint belongs to a solder joint of a different component. If the first distance value does not exceed the first preset distance, it is judged that the solder joint belongs to a solder joint of the same component. .

In an embodiment, the solder joint image recognition method, wherein the step of reading component data comprises reading a component model, a component size, or a preset layout position coordinate of the component from a database.

In one embodiment, the solder joint image recognition method, wherein the step of reading component data includes reading a safe working distance of a corresponding machine from a database.

In one embodiment, the method for identifying a solder joint image further includes: finding the center coordinates of each component from the second plane; calculating the distance between the center coordinates of each component; and if the distance between the center coordinates of each component exceeds one For the second preset distance, it is determined that the components belong to a safe group. If the distance between the center coordinates of the components does not exceed the second preset distance, the components are determined to belong to an unsafe group.

In one embodiment, the method for identifying a solder joint image further includes: selecting one of the components from the unsafe group; reading an altimeter from the solder joint position data and the component data; and The projection of the component and the altimeter generate the skirt projection of the component; the projection of the skirt of each component is superimposed Plus; and if the projections of the skirts of the components do not overlap, the components are judged to belong to a security group; if the projections of the skirts of the components are overlapped, the components are judged to belong to a highly insecure group.

In one embodiment, the solder joint image recognition method, wherein the step of generating a skirt projection of the component includes generating a skirt projection of the component at a distance of 1/2 of the safety distance set by the altimeter.

In an embodiment, the method for identifying a solder joint image further includes: projecting a skirt number of each component and assigning a skirt parameter to each skirt, the skirt parameter is (X, Y, L), where X and Y are coordinate values; and each component's skirt is projected, each assigned a brightness value, the brightness value is L of the skirt parameter, and the brightness value is preset to 1.

In one embodiment, the solder joint image identification method, wherein the step of projecting and superimposing the skirt of each component includes adding the brightness values of the skirt parameters after the components are superimposed. , It is determined that the skirt projections of the components overlap.

In one embodiment, the solder joint image recognition method further includes: for the components of the unsafe group, reading the component data from the database again to calculate the actual distance of the components.

In one embodiment, the solder joint image recognition method further includes: for the components of the highly unsafe group, reading the component data from the database again to calculate the actual distance of the components.

In one embodiment, the solder joint image recognition method further includes: for the components of the security group, reading the component data from the database again to calculate the actual distance of the components.

S1‧‧‧Soldering Spot Projection Procedure

S2‧‧‧Component location projection steps

S3‧‧‧Projection stacking steps

S4‧‧‧First distance calculation steps

S5‧‧‧The first grouping step

S6‧‧‧ center coordinate steps

S7‧‧‧Second distance calculation steps

S8‧‧‧ Most screening steps

S9‧‧‧Small selection steps

S10‧‧‧ Altimeter Reading Procedure

S11‧‧‧skirt projection steps

S12‧‧‧skirt projection superposition steps

S13‧‧‧Second grouping steps

S141‧‧‧Detailed screening steps

S142‧‧‧Detailed screening steps

S143‧‧‧Detailed screening steps

B‧‧‧Solder

C‧‧‧Solder

D‧‧‧Element

E‧‧‧Element

D1, D2, D3‧‧‧ distance

D’ ‧‧‧ skirt projection

X‧‧‧skirt parameters

Y‧‧‧skirt parameters

L‧‧‧skirt parameters

Φ‧‧‧ Overlap

FIG. 1 is a flowchart of steps of a method for identifying a solder joint image according to an embodiment of the present invention.

Figure 1-1 is a schematic diagram of the results of the projection stacking steps of this creative embodiment.

FIG. 2 is a flowchart of steps of a method for identifying a solder joint image according to another embodiment of the present invention.

Figure 2-1 is a schematic diagram showing the results of most screening steps in another embodiment of the present invention.

FIG. 3 is a flowchart of steps of a method for identifying a solder joint image according to another embodiment of the present invention.

Figure 3-1 is a schematic diagram of a skirt projection step according to another embodiment of the present invention.

FIG. 3-2 is a schematic diagram of a skirt projection step according to another embodiment of the present invention.

This embodiment is specifically directed to PCB design examples. In PCB design, Gerber is a two-dimensional vector image file format, which is a standard format used to describe printed circuit board images in the software of the printed circuit board industry. One of the applications of the Gerber format is to transform PCB design materials from design to production. PCB is usually designed by circuit board designers using professional electronic design automation (EDA) or computer-aided design (CAD) software, and then exported to Gerber format files. The Gerber file is sent to the PCB factory and is input to the computer-aided manufacturing CAM system to convert the design information and provide data for each process of PCB production.

In addition, the "projection" described below can be carried out by those with ordinary knowledge in the field by using "CAM350" software. The details are not described below.

FIG. 1 is a flowchart of steps of a method for identifying a solder joint image according to an embodiment of the present invention. The method for identifying a solder joint image in this embodiment includes: a solder joint position projection step S1, reading a solder joint position data, and projecting several solder joints onto a first plane; a component position projection step S2, reading a component data, Projecting a digital element onto a second plane; projecting and stacking step S3, stacking the first plane and the second plane; first distance calculating step S4, calculating a distance between a projection position of a solder joint and a projection position of one of the elements Distance to obtain a first distance value; and a first grouping step S5, if the first distance value exceeds a first preset Distance, it is judged that the solder joint belongs to a solder joint of a different component, and if the first distance value does not exceed the first preset distance, it is judged that the solder joint belongs to a solder joint of the same component.

Figure 1-1 is a schematic diagram of the results of the projection stacking steps of this creative embodiment. For example, after the distance calculation step S4, the first grouping step S5 is performed. If the first distance value D1 does not exceed the first preset distance, it is determined that the solder joint belongs to a solder joint of the same component. For another example, if the first distance value D2 exceeds a first preset distance, it is determined that the solder joint belongs to a solder joint of a different component.

In particular, through the first grouping step S5, the components can be quickly grouped and the efficiency of judgment can be increased.

The solder joint image recognition method according to the embodiment, wherein step S2 of reading component data includes reading a component model, a component size, or a preset layout position coordinate of a component from a database.

The method for identifying a solder joint image according to the embodiment, wherein step S2 of reading component data includes reading a safe working distance of a corresponding machine from a database.

FIG. 2 is a flowchart of steps of a method for identifying a solder joint image according to another embodiment of the present invention. In this embodiment, the solder joint image recognition method further includes: a center coordinate step S6, searching for the center coordinates of each component from the second plane; a second distance calculating step S7, calculating the center coordinates of each component Distance; and most of the screening steps S8, if the distance between the center coordinates of each component exceeds a second preset distance, it is determined that the components belong to a security group, and if the distance between the center coordinates of each component does not exceed the second preset distance , It is determined that the components belong to an insecure group.

Figure 2-1 is a schematic diagram showing the results of most screening steps in another embodiment of the present invention. For example, after the second distance calculation step S7, the distance between the center coordinates of the two elements is D3. At this time, it can be determined through most screening steps S8. If the distance D3 does not exceed a second preset distance, it is determined that the components belong to an unsafe group.

In particular, through most of the screening steps S8, the components can be quickly grouped and the efficiency of judgment can be increased.

The solder joint image recognition method described in the embodiment further includes: a detailed screening step S141, and for the components of the unsafe group, the component data is read again from the database to calculate the actual distance of the components. Thereby, the accuracy of judgment can be increased.

FIG. 3 is a flowchart of steps of a method for identifying a solder joint image according to another embodiment of the present invention. In this embodiment, the solder joint image recognition method further includes: a small part screening step S9, selecting one of the components from the unsafe group; an altimeter reading step S10, from the solder joint position data And the component data, read an altimeter; skirt projection step S11, using the component's projection and the altimeter to generate the skirt projection of the component; skirt projection superimposing step S12, project the skirt of each component Superimposition; and the second grouping step S13, if the skirt projections of the components do not overlap, it is determined that the components belong to a security group; if the skirt projections of the components are overlapped, the components are determined to belong to a height Insecure group.

Figure 3-1 is a schematic diagram of a skirt projection step according to another embodiment of the present invention. Inheriting the example of FIG. 2-1 described above, a small part screening step S9 is performed at this time, and one of the components is selected from the unsafe group. Then, for example, according to the altimeter reading step S10, the component D and the solder joints B and C can be subjected to the skirt projection step S11 to generate the skirt projection D 'of the component.

The method for identifying a solder joint image according to the embodiment, wherein the step of generating a skirt projection of the component includes generating a skirt projection of the component at a distance of 1/2 of the safety distance set by the altimeter.

The method for identifying a solder joint image according to the embodiment further includes: projecting a skirt number of each element and assigning a skirt parameter to each skirt, the skirt parameter is (X, Y, L), where X, Y is Coordinate values; and The skirt of each element is projected to give a brightness value, the brightness value is L of the skirt parameter, and the brightness value is preset to 1.

The solder joint image identification method according to the embodiment, wherein the step of projecting and superimposing the skirt of each component includes adding the brightness values of the skirt parameters after superimposing the components, and if the brightness values after the addition are greater than 2, determining each The component's skirt projection overlaps.

FIG. 3-2 is a schematic diagram of a skirt projection step according to another embodiment of the present invention. For example, for example, the D element has a skirt parameter (X1, Y1, L1), and the E element has a skirt parameter (X2, Y2, L2). After the step S12 of projecting and superimposing the skirt, if L1 + L2 is greater than 2, it can be determined that an overlap condition Φ occurs. In other words, at this time, the set positions of the two components D and E are too close, which will affect the welding. Therefore, according to the second grouping step S13, it should be judged that the two components D and E belong to a highly unsafe group.

After that, according to the detailed screening step S142 (described later), the data of the two components D and E are read again from the database to calculate the actual distance between the two components D and E. Or, after going through the above steps, thousands of error messages (judging distance is too close, but actually not so) have been reduced to several. At this time, manual operations can be used to make the most accurate judgment.

The solder joint image recognition method described in the embodiment further includes: a detailed screening step S142, and for the components of the highly unsafe group, the component data is read again from the database to calculate the actual distance of the components. Thereby, the accuracy of judgment can be increased.

The solder joint image recognition method described in the embodiment further includes: a detailed screening step S143, and for the components of the security group, the component data is read again from the database to calculate the actual distance of the components. Thereby, the accuracy of judgment can be increased.

It is worth mentioning that the detail selection step S142 and the detail selection step S143 may be performed separately or alternatively. In the case of alternative execution, only the detailed filtering step S142 may be performed. Row. In other words, only the components of the highly insecure group can be judged again. Thereby, the efficiency of judgment can be accelerated.

Although this creation uses the above-mentioned embodiments to describe the implementation, the above description is not intended to limit the creation, and those with ordinary knowledge in the field should know that without departing from the spirit and scope of this creation, make various changes in accordance with the above-mentioned embodiments Modifications and modifications remain within the scope of this creation.

Claims (11)

A solder joint image recognition method includes: reading a solder joint position data, and projecting a solder joint onto a first plane; reading a component data, projecting a solder joint onto a second plane; The second plane stack; calculating a distance between a projection position of a solder joint and a projection position of a component to obtain a first distance value; and determining the solder if the first distance value exceeds a first preset distance The points belong to solder joints of different components. If the first distance value does not exceed the first preset distance, it is determined that the solder joints belong to solder joints of the same component. The solder joint image identification method according to claim 1, wherein the step of reading component data includes reading a component model, a component size, or a preset layout position coordinate of the component from a database. The method for identifying a solder joint image according to claim 1, wherein the step of reading component data includes reading a safe working distance of a corresponding machine from a database. The solder joint image identification method according to claim 1, further comprising: finding the center coordinates of each component from the second plane; calculating a distance between the center coordinates of each component; and if the distance between the center coordinates of each component exceeds a second If the distance is preset, the components are determined to belong to a safe group. If the distance between the center coordinates of the components does not exceed the second preset distance, the components are determined to belong to an unsafe group. The solder joint image identification method according to claim 4, further comprising: selecting one of the components from the unsafe group; reading an altimeter from the solder joint position data and the component data; using the component The projection of the component and the altimeter to generate the skirt projection of the component; superimpose the projection of the skirt of each component; and if the projection of the skirt of each component does not overlap, determine that the components belong to a security group, if each component When the skirt projections overlap, it is determined that the components belong to a highly insecure group. The method for identifying a solder joint image according to claim 5, wherein the step of generating a skirt projection of the component includes generating a skirt projection of the component at a distance of 1/2 of the safety distance set by the altimeter. The solder joint image identification method according to claim 5, further comprising: projecting a skirt number of each component and assigning a skirt parameter to each of the skirt parameters (X, Y, L), where X, Y is the coordinate value; the skirt of each element is projected, and a brightness value is assigned to each, the brightness value is L of the skirt parameter, and the brightness value is preset to 1. The solder joint image identification method according to claim 7, wherein the step of projecting and superimposing the skirt of each component includes adding the brightness values of the skirt parameters after the components are superimposed. If the brightness value is greater than 2 after adding, Determine whether the projections of the skirts of the components overlap. According to the solder joint image identification method described in claim 4, the method further includes: for the components of the unsafe group, reading the component data from the database again to calculate the actual distance of the components. According to the solder joint image identification method described in claim 5, the method further includes: for the components of the highly insecure group, reading the component data from the database again to calculate the actual distance of the components. According to the solder joint image identification method described in claim 5, the method further includes: for the components of the security group, reading the component data from the database again to calculate the actual distance of the components.