TWI643890B - Resin sheet for hollow sealing and manufacturing method of hollow package - Google Patents

Abstract

When the width of the void of the hollow structure is about 100 μm, the hollow structure can be maintained, and the resin sheet for hollow sealing and the method of manufacturing the hollow package can be manufactured in a hollow package with high reliability. In the resin sheet for hollow sealing of the present invention, the inorganic filler is contained in an amount of 70% by volume or more and 90% by volume or less, and when the total amount of the inorganic filler is 100% by volume, the inorganic filler is subjected to laser diffraction scattering method. The measured particle size distribution satisfies the following conditions.

More than 100 μm: 1% by volume or less

10 μm or less: 30% by volume or more and 70% by volume or less

1 μm or less: 10% by volume or more

Description

Resin sheet for hollow sealing and manufacturing method of hollow package

The present invention relates to a resin sheet for hollow sealing and a method for producing a hollow package.

The electronic device package is produced by sealing a resin or a plurality of electronic devices that are fixed to a substrate or the like through a bump or the like, and the sealing body is required to be a package of the electronic device. As such a sealing resin, a sheet-shaped sealing resin can be used.

In recent years, the development of microelectronic devices called MEMS, such as a semiconductor package, a SAW (Surface Acoustic Wave) filter, or a CMOS (Complementary Metal Oxide Semiconductor) sensor, an acceleration sensor, and the like, has continued to progress. Each of the packages in which the electronic devices are sealed has a hollow structure for ensuring propagation of a general surface elastic wave, maintenance of an optical system, and movability of a movable member of the electronic device. The hollow structure is often provided as a gap between the substrate and the element. At the time of sealing, it is necessary to maintain a hollow structure and seal in order to ensure the operational reliability of the movable member or the connection reliability of the element. For example, Patent Document 1 describes the use of a gel-like hardenable tree. The fat sheet is a technique in which a functional element is subjected to a hollow mold.

[Previous Technical Literature] [Patent Literature]

[Patent Document 1] Japanese Patent Laid-Open Publication No. 2006-19714

In view of the above-described requirements for imparting a hollow structure, the smaller the size, the higher the cost, or the expansion of the movable member or the expansion of the hollow structure for the composite, it is expected that the diameter of the bump can be increased to expand the gap in the future. Countermeasures. In the technique described in Patent Document 1, as the hollow structure between the element and the substrate, the electronic device can be sealed while maintaining a desired hollow structure with a gap of about several tens of μm. However, when the sealing is performed while securing a gap having a width of approximately 100 μm as the hollow structure, there is a case where the resin flows into the hollow structure and the like, and the yield becomes difficult, and the yield of the package is lowered.

An object of the present invention is to provide a method for producing a hollow sealing resin sheet and a hollow package in which a hollow package can be produced at a high yield even when the width of the void of the hollow structure is about 100 μm.

The inventors worked hard to study the results and found that by using The above configuration can solve the above problems and complete the present invention.

That is, in the present invention, the inorganic filler is contained in an amount of 70% by volume or more and 90% by volume or less, and the inorganic filler is measured by a laser diffraction scattering method when the total amount of the inorganic filler is 100% by volume. The particle size distribution satisfies the following resin sheet for hollow sealing.

More than 100 μm: 1% by volume or less

10 μm or less: 30% by volume or more and 70% by volume or less

1 μm or less: 10% by volume or more

The resin sheet for hollow sealing contains an inorganic filler having a predetermined particle size distribution at a high content, and imparts a restricting flow effect (expansion-like action) to the resin in the vicinity of the hollow structure, thereby effectively preventing the resin from entering the hollow structure. As a result, even if the width of the void is about 100 μm, the hollow package can be produced at a high yield while maintaining the hollow structure. Further, the method of measuring the content and particle size distribution of the inorganic filler is based on the description of the examples.

The viscosity of the resin sheet for hollow sealing at 80 ° C before curing is 5000 Pa. s above 20000Pa. The following is better. Thereby, the hollow structure can be secured with the unevenness of the portion other than the hollow structure. Further, the method for measuring the dynamic viscosity is based on the description of the examples.

In the resin sheet for hollow sealing, the inorganic filler is preferably cerium oxide particles, alumina particles or a mixture thereof. Thereby, the linear expansion coefficient after hardening can be reduced, and a highly reliable package can be obtained.

In the present invention, the package is also disposed on the attached body The lamination step of laminating the resin sheet for hollow sealing while maintaining the hollow portion between the adherend and the electronic device while laminating the electronic device, and the resin for hollow sealing A method of manufacturing a hollow package in which a sheet is hardened to form a sealed body forming step of a sealing body.

11‧‧‧Seal sheet for hollow sealing

11a‧‧‧Support

13‧‧‧SAW chip

15‧‧‧ Sealing body

18‧‧‧ hollow package

Fig. 1 is a cross-sectional view showing a resin sheet mode according to an embodiment of the present invention.

Fig. 2A is a view showing a step mode of a method of manufacturing an electronic device package according to an embodiment of the present invention.

Fig. 2B is a view showing a step mode of a method of manufacturing an electronic device package according to an embodiment of the present invention.

Fig. 2C is a view showing a step mode of a method of manufacturing an electronic device package according to an embodiment of the present invention.

[Best Mode for Carrying Out the Invention]

The present invention will be described in detail below with reference to the embodiments, but the invention is not limited to the embodiments.

"First Embodiment" [Resin Sheet for Hollow Sealing]

Fig. 1 is a cross-sectional view showing a resin sheet for hollow sealing according to an embodiment of the present invention (hereinafter, simply referred to as "resin sheet"). The resin sheet 11 is typically provided in a state of being laminated on a support 11a such as a polyethylene terephthalate (PET) film. Moreover, the support 11a can be subjected to a release treatment in order to facilitate the peeling of the resin sheet 11.

The resin sheet 11 is preferably an epoxy resin or a phenol resin. Thereby, good thermosetting properties can be obtained.

The epoxy resin is not particularly limited. For example, a triphenylmethane type epoxy resin, a cresol novolak type epoxy resin, a biphenyl type epoxy resin, a modified bisphenol A type epoxy resin, a bisphenol A type epoxy resin, a bisphenol can be used. Various epoxy resins such as F-type epoxy resin, modified bisphenol F-type epoxy resin, dicyclopentadiene type epoxy resin, phenol novolac type epoxy resin, and phenoxy resin. These epoxy resins may be used singly or in combination of two or more.

From the viewpoint of ensuring the toughness after curing of the epoxy resin and the reactivity of the epoxy resin, it is preferable to use a solid equivalent of an epoxy equivalent of 150 to 250, a softening point, or a melting point of 50 to 130 ° C. From the viewpoint of preference, a triphenylmethane type epoxy resin, a cresol novolak type epoxy resin, and a biphenyl type epoxy resin are more preferable.

The phenol resin is not particularly limited as long as it causes a hardening reaction with the epoxy resin. For example, a phenol novolak resin, a phenol aralkyl resin, a biphenyl aralkyl resin, a dicyclopentadiene type phenol resin, a cresol novolak resin, a resol resin, or the like can be used. These phenolic resins can be used alone or 2 More than one kind.

In the case of the phenol resin, from the viewpoint of reactivity with the epoxy resin, it is preferred to use a hydroxyl group equivalent of 70 to 250 and a softening point of 50 to 110 ° C. Among them, a phenol novolak resin is preferably used from the viewpoint of high curing reactivity. Further, from the viewpoint of reliability, those having low hygroscopicity like a phenol aralkyl resin or a biphenyl aralkyl resin are also preferably used.

The ratio of the epoxy resin to the phenol resin is preferably from 1 to 1.5 equivalents based on the epoxy group in the epoxy resin, and the total amount of the hydroxyl groups in the phenol resin is 0.7 to 1.5 equivalents. It is preferably 0.9 to 1.2 equivalents.

The lower limit of the total content of the epoxy resin and the phenol resin in the resin sheet 11 is preferably 2.0% by weight or more, more preferably 3.0% by weight or more. When it is 2.0% by weight or more, a good adhesion to an electronic device, a substrate, or the like can be obtained. On the other hand, the upper limit of the total content is preferably 20% by weight or less, more preferably 10% by weight or less. When it is 20% by weight or less, the hygroscopicity of the resin sheet can be lowered.

The resin sheet 11 is preferably a thermoplastic resin. Thereby, the heat resistance, flexibility, and strength of the obtained resin sheet for hollow sealing can be improved.

Examples of the thermoplastic resin include natural rubber, butyl rubber, isoprene rubber, chloroprene rubber, ethylene-vinyl acetate copolymer, ethylene-acrylic acid copolymer, ethylene-acrylate copolymer, Polybutadiene resin, polycarbonate resin, thermoplastic polyimide resin, polyamine resin such as 6-nylon or 6,6-nylon, phenoxy resin, C A olefinic resin, a saturated polyester resin such as PET or PBT, a polyamidoximine resin, a fluororesin, a styrene-isobutylene-styrene block copolymer or the like. These thermoplastic resins may be used alone or in combination of two or more. Among them, a styrene-isobutylene-styrene block copolymer is preferred from the viewpoint of low stress and low water absorption of the resin sheet.

The content of the thermoplastic resin in the resin sheet 11 is preferably 1.0% by weight or more, more preferably 1.5% by weight or more. When it is 1.0% by weight or more, the resin sheet can be imparted with flexibility and flexibility. The content of the thermoplastic resin in the resin sheet 11 is preferably 3.5% by weight or less, more preferably 3.0% by weight or less. When it is 3.5% by weight or less, the adhesion to the resin sheet of the electronic device or the substrate can be improved.

The resin sheet 11 contains an inorganic filler in an amount of 70% by volume or more and 90% by volume or less. The lower limit of the above content is preferably 74% by volume or more, more preferably 78% by volume or more. Further, the upper limit of the above content is preferably 85% by volume or less, more preferably 83% by volume or less. By the content of the inorganic filler in the above range, the resin is provided with a swelling-like effect in the vicinity of the hollow structure, the hollow structure can be maintained, and the coefficient of linear expansion after hardening can be reduced to prevent warpage of the package, and a highly reliable hollow package can be obtained. . Further, when the inorganic filler is a mixture of a plurality of kinds of particles, the content of the mixture satisfies the above range.

The content of the inorganic filler can also be expressed in terms of "% by weight". The content of the representative cerium oxide is described in terms of "% by weight".

The cerium oxide usually has a specific gravity of 2.2 g/cm ³ , so the preferred range of the content (% by weight) of cerium oxide is as follows. That is, the content of cerium oxide in the resin sheet 11 is preferably 81% by weight or more, more preferably 84% by weight or more. The content of cerium oxide in the resin sheet 11 is preferably 94% by weight or less, more preferably 91% by weight or less.

The alumina generally has a specific gravity of 3.9 g/cm ³ , so the preferred range of the content (% by weight) of alumina is as follows. That is, the content of the alumina in the resin sheet 11 is preferably 88% by weight or more, more preferably 90% by weight or more. The content of the alumina in the resin sheet 11 is preferably 97% by weight or less, more preferably 95% by weight or less.

In the resin sheet 11, the particle size distribution measured by the laser diffraction scattering method of the above-mentioned inorganic filler when the total amount of the inorganic filler is 100% by volume satisfies a specific relationship. Specifically, in the particle size distribution, the ratio of particles having a particle diameter of more than 100 μm is 1% by volume or less, preferably 0.5% by volume or less, more preferably 0.3% by volume or less. Further, the lower limit of the ratio of the particles having a particle diameter of more than 100 μm is preferably 0.01% by volume or more. The ratio of the particles having a particle diameter of 10 μm or less is 30% by volume or more and 70% by volume or less, preferably 35% by volume or more and 65% by volume or less, more preferably 40% by volume or more and 60% by volume or less. Further, the ratio of the particles having a particle diameter of 1 μm or less is preferably 10% by volume or more, preferably 13% by volume or more, more preferably 15% by volume or more. Further, the upper limit of the ratio of the particles having a particle diameter of 1 μm or less is preferably 40% by volume or less. The particle size distribution of the laser diffraction scattering method of the inorganic filler imparts a bulk-like effect to the resin in the vicinity of the hollow structure by the above specific relationship, and the resin can be appropriately prevented from entering the hollow structure at the time of sealing. Further, when the inorganic filler is a mixture of a plurality of kinds of particles, the particle size distribution of the mixture satisfies the above-mentioned system. The particle size distribution can be derived by using a sample arbitrarily extracted by a parent group and measuring it using a laser diffraction scattering type particle size distribution measuring apparatus.

The inorganic filler is not particularly limited, and various conventional fillers such as quartz glass, talc, cerium oxide (melted cerium oxide or crystalline cerium oxide), alumina, aluminum nitride, and the like can be used. A powder of tantalum nitride or boron nitride. These may be used alone or in combination of two or more. Among them, cerium oxide and aluminum oxide are preferred, and cerium oxide is more preferable because the linear expansion coefficient can be favorably lowered.

In terms of cerium oxide, cerium oxide powder is preferred, and molten cerium oxide powder is more preferable. The molten cerium oxide powder may, for example, be a spherical molten cerium oxide powder or a crushed molten cerium oxide powder, but it is preferable to use a spherical molten cerium oxide powder from the viewpoint of fluidity.

The average particle diameter of the inorganic filler is preferably in the range of 50 μm or less, preferably in the range of 0.1 to 30 μm, and particularly preferably in the range of 0.5 to 25 μm. Further, the average particle diameter was determined as D ₅₀ according to the particle size distribution measurement procedure of the examples.

The resin sheet 11 is preferably a hardening accelerator.

The hardening accelerator is not particularly limited in order to carry out the hardening of the epoxy resin and the phenol resin, for example, an organophosphorus compound such as triphenylphosphine or tetraphenylphosphonium tetraphenylborate; 2-benzene An imidazole compound such as benzyl-4,5-dihydroxymethylimidazole or 2-phenyl-4-methyl-5-hydroxymethylimidazole; and the like. Among them, the reason why the resin sheet 11 can be favorably produced by the temperature rise hardening reaction at the time of kneading is preferably 2-phenyl-4,5-dihydroxymethylimidazole.

The content of the hardening accelerator is preferably 0.1 to 5 parts by weight based on 100 parts by weight of the total of the epoxy resin and the phenol resin.

The resin sheet 11 is preferably a component containing a flame retardant. Thereby, it is possible to reduce the short-circuiting of the parts, heat generation, etc., and to expand the combustion at the time of fire. For the composition of the flame retardant, for example, various metal hydroxides such as aluminum hydroxide, magnesium hydroxide, iron hydroxide, calcium hydroxide, tin hydroxide, and composite metal hydroxide can be used; Agents, etc. Among them, a compound represented by the formula (1) or the formula (2) is preferable because the flame retardancy, the flexibility in the uncured state, and the strength after curing are excellent, and the phosphine-based flame retardant is preferable.

(wherein R ¹ and R ^{2 are the} same or different and are alkoxy, phenoxy, amine, hydroxy, allyl or at least one selected from the group consisting of The organic base of the valence. X is an integer from 3 to 25.)

(wherein R ³ and R ^{5 are the} same or different and each is an alkoxy group, a phenoxy group, an amine group, a hydroxyl group, an allyl group or at least one group selected from the group consisting of such groups; The organic group of the valence. R ⁴ is a divalent organic group having at least one group selected from the group consisting of an alkoxy group, a phenoxy group, an amine group, a hydroxyl group, and an allyl group. y is an integer of 3 to 25. z is an integer from 3 to 25.)

Examples of the alkoxy group of R ¹ and R ² include a methoxy group, an ethoxy group, an n-propoxy group, an isopropoxy group, an n-butoxy group, and a t-butoxy group. Among them, an alkoxy group having 4 to 10 carbon atoms is preferred.

The phenoxy group of R ¹ and R ² may, for example, be a group represented by the formula (3).

(wherein R ¹¹ is hydrogen, a hydroxyl group, an alkyl group, an alkoxy group, a glycidyl group or a monovalent organic group having at least one group selected from the group consisting of such a group.)

The alkyl aspect of R ¹¹ , for example, methyl, ethyl, n-propyl, isopropyl, n-butyl, iso-butyl, sec-butyl, tert-butyl, pentyl, hexyl, g. Base, 2-ethylhexyl, octyl, decyl, decyl, undecyl, dodecyl, thirteenyl, tetradecyl, fifteen, eleven, and the like. The alkoxy group of R ¹¹ may, for example, be the same group as the alkoxy group of R ¹ and R ² .

In the case of R ¹ and R ² , a phenoxy group is preferred, and a group represented by the formula (3) is more preferable because of good flame retardancy and strength after hardening.

X is an integer from 3 to 25, but good flame retardancy is obtained. The reason for the strength after hardening is preferably 3 to 10 and more preferably 3 to 4.

In the formula (2), the alkoxy group of R ³ and R ⁵ may, for example, be a methoxy group, an ethoxy group, an n-propoxy group, an isopropoxy group, an n-butoxy group or a t-butoxy group. Wait. Among them, an alkoxy group having 4 to 10 carbon atoms is preferred.

The phenoxy group of R ³ and R ⁵ is, for example, a group represented by the above formula (3).

The monovalent organic group having at least one group selected from the group consisting of an alkoxy group, a phenoxy group, an amine group, a hydroxyl group, and an allyl group in R ³ and R ⁵ is not particularly limited.

In the case of R ³ and R ⁵ , a phenoxy group is preferred, and a group represented by the formula (3) is more preferable because of good flame retardancy and strength after hardening.

The alkoxy group which the divalent organic group of R ⁴ has is, for example, a methoxy group, an ethoxy group, an n-propoxy group, an isopropoxy group, an n-butoxy group, a t-butoxy group or the like. Among them, an alkoxy group having 4 to 10 carbon atoms is preferred.

The phenoxy group which the organic group of the divalent valence of R ⁴ has, for example, the group represented by the above formula (3).

y is an integer of 3 to 25, but it is preferably 3 to 10 because of good flame retardancy and strength after hardening.

z is an integer of 3 to 25, but it is preferably 3 to 10 because of good flame retardancy and strength after hardening.

The content of the phosphorus element contained in the phosphorous-nitrogen-based flame retardant is preferably 12% by weight or more from the viewpoint of exhibiting a flame retardant effect even in a small amount.

The content of the flame retardant component in the resin sheet 11 is all organic More preferably, 10% by weight or more of the component is more preferably 15% by weight or more. When it is 10% by weight or more, good flame retardancy can be obtained. The content of the thermoplastic resin in the resin sheet 11 is preferably 30% by weight or less, more preferably 25% by weight or less, based on the total organic component. When it is 30% by weight or less, the physical properties of the cured product tend to decrease (specifically, the physical properties such as the glass transition temperature or the high-temperature resin strength are lowered).

The resin sheet 11 is preferably a decane coupling agent. The decane coupling agent is not particularly limited, and examples thereof include 3-glycidoxypropyltrimethoxydecane.

The content of the decane coupling agent in the resin sheet 11 is preferably 0.1 to 3% by weight. When the content is 0.1% by weight or more, the strength of the resin sheet after curing can be improved, and the water absorption rate can be lowered. On the other hand, when the content is 3% by weight or less, the generation of outgas can be suppressed.

The resin sheet 11 is preferably a pigment. The pigment is not particularly limited, and examples thereof include carbon black.

The content of the pigment in the resin sheet 11 is preferably 0.1 to 2% by weight. When it is 0.1% by weight or more, good marking properties to the resin sheet can be obtained. On the other hand, when the content is 2% by weight or less, the strength of the cured resin sheet is good.

Further, in the resin composition, in addition to the above respective components, other additives may be appropriately added as necessary.

The viscosity of the resin sheet 11 before curing at 80 ° C is 5000 Pa. s above 30000Pa. s below is better, 7000Pa. s above 25000Pa. s is better, 10000Pa. s above 20000Pa. s below good. In the above range, the dynamic viscosity of the resin sheet 11 can be efficiently ensured both in the hollow structure and in the unevenness of the portion other than the hollow structure.

[Method of Manufacturing Resin Sheet for Hollow Sealing]

The method for producing the resin sheet 11 is not particularly limited, but a method of preparing the kneaded material and processing the obtained kneaded product into a sheet shape is preferred. Specifically, the above-described components are melt-kneaded by a conventional kneading machine such as a mixing roll, a press kneader, or an extruder to prepare a kneaded product, and the obtained kneaded product is processed into a sheet shape. The kneading conditions are preferably at least the softening point of each of the above components, for example, 30 to 150 ° C, and the thermosetting property of the epoxy resin is preferably 40 to 140 ° C, more preferably 60 to 120 ° C. The time is, for example, 1 to 30 minutes, preferably 5 to 15 minutes.

The kneading is preferably carried out under reduced pressure (under reduced pressure). The upper limit of the pressure under reduced pressure is preferably 0.1 kg/cm ² or less, more preferably 0.05 kg/cm ² or less. Although the lower limit of the pressure under reduced pressure is as good as possible, it may be 1 × 10 ^-4 kg / cm ² or more from the limit of productivity or physicality. Thereby, it is possible to prevent gas from being mixed into the kneaded material, and it is possible to suppress the generation of pores in the obtained kneaded material.

It is preferred that the kneaded material after the melt kneading is maintained at a high temperature without cooling. The processing method is not particularly limited, and examples thereof include a plate press method, a T die extrusion method, a roll calendering method, a roll kneading method, a blow molding method, a coextrusion method, and a calender molding method. The processing temperature is preferably at least the softening point of each of the above components, and the thermal hardening property and the epoxy resin are considered. The shape is, for example, 40 to 150 ° C, preferably 50 to 140 ° C, more preferably 70 to 120 ° C.

The thickness of the resin sheet 11 is not particularly limited, but is preferably 100 to 2000 μm. Within the above range, the electronic device can be well sealed. Moreover, by making the resin sheet thin, the calorific value can be lowered, and the hardening shrinkage is less likely to occur. As a result, the package warpage can be reduced, and a highly reliable hollow package can be obtained.

The resin sheet 11 may have a single layer structure or a multilayer structure in which two or more layers of resin sheets are laminated. However, it is preferable to use a single layer structure because the layer is not peeled off between layers, the sheet thickness is uniform, and the moisture absorption is easy to be low. .

The resin sheet 11 is used for a SAW (Surface Acoustic Wave) filter; a MEMS (Micro Electro Mechanical Systems) such as a pressure sensor or a vibration sensor; an IC such as an LSI or a semiconductor such as a transistor; a capacitor; a resistor; Sealing of electronic devices such as detectors. Among them, it can be suitably used for the sealing of electronic devices (specifically, SAW filters, MEMS) requiring a hollow seal, and is particularly suitable for the sealing of SAW filters.

[Manufacturing method of hollow package]

2A to 2C are each a schematic diagram showing a step mode of a method of manufacturing a hollow package according to an embodiment of the present invention. The hollow sealing method is not particularly limited and may be sealed by a conventional method. For example, the uncured resin sheet 11 is laminated (mounted) on the substrate while maintaining the hollow structure so as to cover the electronic device on the adherend, and then the resin is thin. The sheet 11 is hardened to be sealed, and the like. The adherend is not particularly limited, and examples thereof include a printed wiring board, a ceramic substrate, a tantalum substrate, and a metal substrate. In the present embodiment, the SAW wafer 13 mounted on the printed wiring board 12 is hollow-sealed by the resin sheet 11, and a hollow package is produced.

(SAW wafer mounting substrate preparation step)

In the SAW wafer mounting substrate preparation step, the printed wiring substrate 12 on which the plurality of SAW wafers 13 are mounted is prepared (see FIG. 2A for reference). The SAW wafer 13 can be formed by subjecting a piezoelectric crystal having a specified comb-shaped electrode to a dicing process by a conventional method. The SAW wafer 13 is mounted on the printed wiring board 12, and a conventional device such as a flip chip bonding machine or a die bonding machine can be used. The SAW wafer 13 and the printed wiring board 12 are electrically connected to each other through the bump electrodes 13a such as bumps. Further, between the SAW wafer 13 and the printed wiring board 12, the hollow portion 14 is maintained so as not to hinder the propagation of the surface elastic wave on the surface of the SAW filter. The distance between the SAW wafer 13 and the printed wiring board 12 can be appropriately set, and is generally about 10 to 100 μm.

(sealing step)

In the sealing step, the resin sheet 11 is laminated on the printed wiring substrate 12 to cover the SAW wafer 13, and the SAW wafer 13 is resin-sealed with the resin sheet 11 (refer to FIG. 2B for reference). The resin sheet 11 is used as a sealing resin from the external environmental protection SAW wafer 13 and the elements attached thereto.

The method of laminating the resin sheet 11 on the printed wiring board 12 is not particularly limited, and it can be carried out by a conventional method such as hot pressing or lamination. The hot pressing condition is, for example, 40 to 100 ° C, preferably 50 to 90 ° C, and the pressure is, for example, 0.1 to 10 MPa, preferably 0.5 to 8 MPa, and the time is, for example, 0.3 to 10 minutes, preferably 0.5 to 5 minutes. . In addition, when the adhesion and followability of the resin sheet 11 to the SAW wafer 13 and the printed wiring board 12 are increased, it is preferable to pressurize under a reduced pressure condition (for example, 0.1 to 5 kPa).

(sealing body forming step)

In the sealing body forming step, the resin sheet 11 is subjected to a heat hardening treatment to form a sealing body 15 (refer to Fig. 2B for reference). In terms of the conditions of the heat hardening treatment, the heating temperature is preferably 100 ° C or higher, more preferably 120 ° C or higher. On the other hand, the upper limit of the heating temperature is preferably 200 ° C or lower, more preferably 180 ° C or lower. The heating time is preferably 10 minutes or longer, more preferably 30 minutes or longer. On the other hand, the upper limit of the heating time is preferably 180 minutes or shorter, more preferably 120 minutes or shorter. Further, it may be pressurized if necessary, and is preferably 0.1 MPa or more, and more preferably 0.5 MPa or more. On the other hand, the upper limit is preferably 10 MPa or less, and more preferably 5 MPa or less.

(cutting step)

Next, the sealing of the sealing body 15 can be performed (see Fig. 2C for reference). Thereby, a hollow package 18 of 13 units in the SAW wafer can be obtained.

(substrate mounting step)

Rewiring and convexizing of the hollow package 18 can be performed as necessary This block is mounted on a substrate mounting step of another substrate (not shown). For the mounting of the hollow package 18 to the substrate, a conventional device such as a flip chip bonding machine or a die bonding machine can be used.

"Second Embodiment"

In the first embodiment, each of the components is kneaded by a kneading machine or the like to prepare a kneaded product, and the kneaded product is extrusion molded to form a sheet. On the other hand, in the present embodiment, a varnish in which each component is dissolved or dispersed in an organic solvent or the like is applied to form a sheet.

In the specific production process of the varnish, the above-mentioned components and other additives necessary for the varnish are appropriately mixed according to a usual method to uniformly dissolve or disperse in an organic solvent to prepare a varnish. Then, the varnish is applied onto a support such as polyester and dried to obtain a resin sheet 11 for hollow sealing. Then, if necessary, a release sheet such as a polyester film may be bonded to protect the surface of the resin sheet for hollow sealing. The release sheet peeled off upon sealing.

The organic solvent is not particularly limited, and various conventional organic solvents such as methyl ethyl ketone, acetone, cyclohexanone, dioxane, diethyl ketone, toluene, ethyl acetate, and the like can be used. These may be used alone or in combination of two or more. Further, it is usually preferred to use an organic solvent in a range of 30 to 95% by weight of the solid content of the varnish.

The thickness of the sheet after the drying of the organic solvent is not particularly limited, but is preferably 5 to 100 μm, more preferably 20 to 70 μm, from the viewpoint of uniformity of thickness and amount of residual solvent.

[Examples]

Hereinafter, preferred embodiments of the present invention will be described in detail. However, the materials, the collocation amounts, and the like described in the examples are not particularly limited, and the scope of the invention is not limited thereto.

The ingredients used in the examples are illustrated.

Epoxy resin: YSLV-80XY (bisphenol F type epoxy resin, epoxy equivalent 200g/eq., softening point 80 °C) manufactured by Nippon Steel Chemical Co., Ltd.

Phenol resin: MEH-7851-SS (a phenol resin having a biphenyl aralkyl skeleton, a hydroxyl equivalent of 203 g/eq., a softening point of 67 ° C) manufactured by Minghe Chemical Co., Ltd.

Thermoplastic resin: SIBSTER 072T (styrene-isobutylene-styrene block copolymer) manufactured by KANEKA

Inorganic Filler 1: FB-9454FC (Fused Spherical Cerium Oxide, Average Particle Diameter 20 μm) manufactured by Electrochemical Industry Co., Ltd.

Inorganic filler 2: SE-40 (melt spherical cerium oxide, average particle diameter 38 μm) manufactured by Tokuyama Co., Ltd.

Inorganic filler 3: FB-5SDC manufactured by Electrochemical Industry Co., Ltd. (melted spherical ceria, average particle diameter 5 μm)

Inorganic filler 4: SO-25R (melt spherical cerium oxide, average particle diameter 0.5 μm) manufactured by Admatechs Co., Ltd.

矽Case coupling agent: KBM-403 (3-glycidoxypropyltrimethoxydecane) manufactured by Shin-Etsu Chemical Co., Ltd.

Carbon black: #20 from Mitsubishi Chemical Corporation

Flame Retardant: FP-100 (Azo Phosphorus Flammable Agent) made by Fushimi Pharmaceutical Co., Ltd. a compound represented by the formula (4)

(where m is an integer from 3 to 4.)

Hardening accelerator: 2PHZ-PW (2-phenyl-4,5-dihydroxymethylimidazole) manufactured by Shikoku Chemicals Co., Ltd.

[Examples 1 to 4 and Comparative Examples 1 to 4]

According to the mixing ratio described in Table 1, the components were mixed and kneaded by a roll kneading machine at 60 to 120 ° C for 10 minutes under reduced pressure (0.01 kg/cm ² ) to prepare a kneaded product. Then, the obtained kneaded material was formed into a sheet shape by a flat plate pressing method, and a resin sheet for hollow sealing having a thickness shown in Table 1 was produced.

[Example 5]

According to the mixing ratio described in Table 1, each component was dissolved or dispersed in a 1:1 mixed solvent of methyl ethyl ketone and toluene to prepare a varnish having a solid content of 40% by weight. Next, on the PET film subjected to the release treatment, the thickness of the coating film after the varnish was applied to dry the solvent was 50 μm, and then the coating film was dried under the drying condition of 120 ° C for 3 minutes to obtain a resin having a thickness of 50 μm. Sheet. Laminating the obtained resin sheet to a thickness using a laminator 200 μm, a resin sheet for hollow sealing having a thickness of 200 μm was produced.

(Measurement of particle size distribution of inorganic filler)

Each of the resin sheets for hollow sealing of the examples and the comparative examples was placed in a crucible, and heated at 700 ° C for 2 hours to ash. The obtained ash was dispersed in pure water, subjected to ultrasonic treatment, and a particle size distribution (volume basis) was determined using a laser diffraction scattering type particle size distribution measuring apparatus (manufactured by HORIBA, device name; LA-910). Further, the composition of the resin sheet for hollow sealing is an organic component other than the inorganic filler, and substantially all of the organic components are burned off by the above-described intense heat treatment. Therefore, the obtained ash is measured as an inorganic filler. The results are shown in Table 1.

(Measurement of dynamic viscosity of resin sheet for hollow sealing)

The dynamic viscosity of the resin sheet for hollow sealing before thermosetting at 80 ° C was measured. The dynamic viscosity is a value measured by a parallel plate method using a viscoelasticity measuring apparatus ARES manufactured by TA Instruments. More specifically, the gap was 1 mm, the rotating plate diameter was 8 mm, and the number of measured cycles was 0.1 Hz. The temperature was measured at a temperature rising rate of 10 ° C/min in the range of 60 ° C to 130 ° C, and the melt viscosity at 80 ° C obtained at this time was used as a dynamic. Viscosity. The results are shown in Table 1.

(Evaluation of resin ingress into the hollow portion of the package)

A SAW wafer of the following type in which an aluminum comb-shaped electrode was formed was used to produce a SAW wafer mounting substrate mounted on a glass substrate under the following bonding conditions. The gap between the SAW wafer and the glass substrate is wide in Examples 1-3, 5, and Comparative Examples 1 to 2 were 30 μm, and Example 4 was 90 μm.

<SAW wafer>

Wafer size: 1.2mm □ (thickness 150μm)

Bump material (Examples 1 to 3, 5 and Comparative Examples 1 and 2): Au (height 30 μm)

Bump material (Example 4): Solder (lead-free) (height 90 μm)

Number of bumps: 6 bumps

Number of wafers: 100 (10 × 10)

<joining conditions>

Device: Matsushita Electric Works Co., Ltd.

Bonding conditions: 200°C, 3N, 1sec ultrasonic output 2W

On each of the obtained SAW wafer mounting substrates, each of the hollow sealing sheets was bonded under vacuum under pressure and pressure.

<Finishing conditions>

Temperature: 60 ° C

Pressure: 4MPa

Vacuum degree: 1.6kPa

Pressurization time: 1 minute

After opening to atmospheric pressure, the hollow sealing sheet was thermally cured in a hot air dryer at 150 ° C for 1 hour to obtain a sealed body. Glass based The amount of resin entering the hollow portion between the SAW wafer and the glass substrate was measured by an electron microscope (manufactured by Keyence Corporation, "Digital Microscope", 200 times). The amount of resin entering was confirmed by an electron microscope from the glass substrate side before the sealing of the hollow sealing sheet. The end position of the SAW wafer was confirmed by an electron microscope. After sealing, the glass substrate was again observed by an electron microscope, and the observed image before and after sealing was compared. The maximum reach distance of the resin entering the hollow portion from the end of the SAW wafer is used as the resin entry amount. When the amount of resin entering is 20 μm or less, it is evaluated as "○", and when it exceeds 20 μm, it is evaluated as "x". The results are shown in Table 1.

As is clear from Table 1, in the SAW wafer packages of Examples 1 to 5, the resin component of the hollow sealing sheet enters the hollow portion and is suppressed, and even if the hollow portion is enlarged, a high-quality hollow package can be produced. In Comparative Examples 1 and 2, the amount of the resin entering the hollow portion was 20 μm.

Claims (4)

A resin sheet for hollow sealing, which comprises a thermoplastic resin and an inorganic filler, wherein the content of the inorganic filler is 70% by volume or more and 90% by volume or less, and the total amount of the inorganic filler is 100% by volume. The particle size distribution measured by the laser diffraction scattering method of the inorganic filler satisfies the following conditions, and exceeds 100 μm: 1% by volume or less and 10 μm or less: 30% by volume or more and 70% by volume or less and 1 μm or less: 10% by volume or more. The resin sheet for hollow sealing according to claim 1, wherein the dynamic viscosity at 80 ° C before curing is 5000 Pa. s above 30000Pa. s below. The resin sheet for hollow sealing according to claim 1 or 2, wherein the inorganic filler is cerium oxide particles, alumina particles or a mixture thereof. A method of manufacturing a hollow package, comprising the resin sheet for hollow sealing according to any one of claims 1 to 3, which is laminated on the electronic device while maintaining a hollow portion between the adherend and the electronic device A laminating step of one or a plurality of electronic devices on the adherend, and a sealing body forming step of curing the hollow sealing resin sheet to form a sealed body.