TWI531604B - 增韌及增撓熱塑性及熱固性聚合物之替代方法 - Google Patents
增韌及增撓熱塑性及熱固性聚合物之替代方法 Download PDFInfo
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- TWI531604B TWI531604B TW103114489A TW103114489A TWI531604B TW I531604 B TWI531604 B TW I531604B TW 103114489 A TW103114489 A TW 103114489A TW 103114489 A TW103114489 A TW 103114489A TW I531604 B TWI531604 B TW I531604B
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- cerium oxide
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- DHRXPBUFQGUINE-UHFFFAOYSA-N n-(2-hydroxypropyl)benzenesulfonamide Chemical compound CC(O)CNS(=O)(=O)C1=CC=CC=C1 DHRXPBUFQGUINE-UHFFFAOYSA-N 0.000 description 1
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- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
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- NUISVCFZNCYUIM-UHFFFAOYSA-N terbutylazine-desethyl-2-hydroxy Chemical compound CC(C)(C)NC1=NC(=O)N=C(N)N1 NUISVCFZNCYUIM-UHFFFAOYSA-N 0.000 description 1
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- LMYRWZFENFIFIT-UHFFFAOYSA-N toluene-4-sulfonamide Chemical compound CC1=CC=C(S(N)(=O)=O)C=C1 LMYRWZFENFIFIT-UHFFFAOYSA-N 0.000 description 1
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- AGCQZYRSTIRJFM-UHFFFAOYSA-N triethylene glycol dinitrate Chemical compound [O-][N+](=O)OCCOCCOCCO[N+]([O-])=O AGCQZYRSTIRJFM-UHFFFAOYSA-N 0.000 description 1
- UFTFJSFQGQCHQW-UHFFFAOYSA-N triformin Chemical compound O=COCC(OC=O)COC=O UFTFJSFQGQCHQW-UHFFFAOYSA-N 0.000 description 1
- GWVUTNGDMGTPFE-UHFFFAOYSA-N trihexyl 2-butanoyloxypropane-1,2,3-tricarboxylate Chemical compound CCCCCCOC(=O)CC(C(=O)OCCCCCC)(OC(=O)CCC)CC(=O)OCCCCCC GWVUTNGDMGTPFE-UHFFFAOYSA-N 0.000 description 1
- 239000013638 trimer Substances 0.000 description 1
- XZZNDPSIHUTMOC-UHFFFAOYSA-N triphenyl phosphate Chemical compound C=1C=CC=CC=1OP(OC=1C=CC=CC=1)(=O)OC1=CC=CC=C1 XZZNDPSIHUTMOC-UHFFFAOYSA-N 0.000 description 1
- OXFUXNFMHFCELM-UHFFFAOYSA-N tripropan-2-yl phosphate Chemical compound CC(C)OP(=O)(OC(C)C)OC(C)C OXFUXNFMHFCELM-UHFFFAOYSA-N 0.000 description 1
- WTLBZVNBAKMVDP-UHFFFAOYSA-N tris(2-butoxyethyl) phosphate Chemical compound CCCCOCCOP(=O)(OCCOCCCC)OCCOCCCC WTLBZVNBAKMVDP-UHFFFAOYSA-N 0.000 description 1
- 235000015112 vegetable and seed oil Nutrition 0.000 description 1
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- 229910052725 zinc Inorganic materials 0.000 description 1
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Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
- C08L83/04—Polysiloxanes
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/34—Silicon-containing compounds
- C08K3/36—Silica
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L59/00—Compositions of polyacetals; Compositions of derivatives of polyacetals
- C08L59/04—Copolyoxymethylenes
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L77/00—Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Compositions of derivatives of such polymers
- C08L77/02—Polyamides derived from omega-amino carboxylic acids or from lactams thereof
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L77/00—Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Compositions of derivatives of such polymers
- C08L77/06—Polyamides derived from polyamines and polycarboxylic acids
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Description
吾人已知，Veerag Mehta(新澤西(New Jersey)州米德爾塞克斯(Middlesex)郡平原(Plainsboro)市居民，美利堅合眾國公民)已發明新穎且適用之組成物，其為
增韌及增撓熱塑性及熱固性聚合物之替代方法
本發明係關於一種提供熱塑性或熱固性樹脂組成物之方法。本發明主張2013年4月22日申請之美國臨時第61/814,362號之優先權。
開發多用途可撓性聚合物組成物存在許多障礙。聚合物廣泛用於諸多不同應用中。經由改質，可相對於預期效能調整聚合物之特性。此等應用包括(但不限於)汽車、建築、油田、封裝，包括管、軟管及纜線護套以及多種其他應用及組成物。此等應用需要在廣泛溫度範圍內之高可撓性及/或改良之衝擊強度。通常藉由添加塑化劑添加劑獲得此等屬性。
傳統塑化劑於最終用途產品中提供可撓性。該等塑化劑最常見之作用機制為其於添加至其中之聚合物中具有部分可溶性，因此其易於摻合及分散。一旦分散於聚合物基質中，其於聚合物鏈之間產生間距，降低玻璃轉化溫度，且因此增加可撓性。
儘管塑化劑添加劑在許多應用中表現良好，但其具有許多問
題，諸如有限的效能範圍及消極生態毒理學態樣。舉例而言，磺醯胺(諸如N-乙基-鄰/對甲苯磺醯胺及N-丁基苯磺醯胺)常用於商業及工業應用中以賦予各種聚醯胺可撓性及/或衝擊強度。磺醯胺可比在與水或N-烷基咯啶酮之情況下寬的溫度範圍內與多種聚醯胺組成物一起使用。猜想磺醯胺具有廣泛範圍之生態毒理學特性，諸如神經毒性及於地表水中之積聚之報導。另外，其效能限於-25℃以下且在150℃以上之溫度下，已知其自聚醯胺樹脂揮發。
再次使用聚醯胺6或聚醯胺66樹脂作為實例，亦將水用作塑化劑。儘管水具有良好生態毒理學型態，但由於其在0℃下之熔點及其100℃之沸點(基本上影響其低溫脆性效能及其於較高溫度下之揮發性)，其在廣泛溫度範圍內之用途受限。此等態樣極大地影響當使用水時各種聚醯胺組成物之效能特性。水亦在用於需要較高混配溫度(因此導致添加劑大量損失)之較「奇異(exotic)」聚醯胺組成物中相當受限。
市場需要對於現有技術以及潛在新應用，諸如汽車、建築、油田、封裝，包括管、軟管及纜線護套以及多種其他應用及組成物之改良。本發明將潛在地為現有的技術上較困難領域以及新潛在市場中之各種聚合物組成物開闢新途徑。
本發明描述一種改良添加劑之現有技術之所有態樣以改良廣泛範圍之聚合物組成物之可撓性及/或衝擊強度的新穎組成物。此技術為新穎的，因為其並不如同當前工業技術那般依賴於干涉聚合物鏈之間的氫鍵結以展現其效能特性。另外，所述技術可在自-50℃以下至400℃以上之廣大溫度範圍內使用。
另一態樣為極大改良之生態毒理學型態。用作本發明中之添加劑之材料常用於多種應用中以與食物間接及直接接觸。由於此等添加劑之高分子量，其不經各種生物代謝。
本發明之目的為使用改質有機聚矽氧添加劑代替習知技術用於廣泛範圍之聚合物組成物及構築體中。本發明特定言之適用於汽車、建築、油田、封裝，包括管、軟管、金屬線及纜線、用於食物或一般封裝之容器、電連接器、保護罩、特製膜、汽車組件、工業外殼、運動用品、鞋類、纖維、發泡體以及多種其他應用及組成物中。此等全部為可藉由習知聚合物處理製得之產品。
因此，本文揭示且主張一種目標組成物，其包含20至98重量%熱塑性樹脂及2至80重量%分子量(Mn)為至少10,000且不超過約1,000,000(Mn)之超高分子量聚矽氧烷之摻合物，其中該超高分子量聚二甲基矽氧烷已與3至35重量%選自由沈澱二氧化矽及煙霧狀二氧化矽組成之群的二氧化矽摻合。
超高分子量聚二甲基矽氧烷具有選自由以下組成之群的側基、端基或側基與端基之混合物：氫、三甲基、二甲基、甲基、苯基、氟基、胺基、乙烯基、羥基及甲基丙烯酸酯基。
在另一具體實例中，存在一種目標組成物，其包含20至98重量%熱固性樹脂及2至80重量%分子量(Mn)為至少10,000且不超過約1,000,000(Mn)之超高分子量聚矽氧烷之摻合物，其中該超高分子量聚二甲基矽氧烷已與3至35重量%選自由沈澱二氧化矽及煙霧狀二氧化矽組成之群的二氧化矽摻合。
超高分子量聚二甲基矽氧烷具有選自由以下組成之群的側基、端基或側基與端基之混合物：氫、三甲基、二甲基、甲基、苯基、氟基、胺基、乙烯基、羥基及甲基丙烯酸酯基。
另外，存在一種目標組成物，其包含20至98重量%熱固性橡膠及2至80重量%分子量(Mn)為至少10,000且不超過約1,000,000(Mn)
之超高分子量聚矽氧烷之摻合物，其中該超高分子量聚二甲基矽氧烷已與3至35重量%選自由沈澱二氧化矽及煙霧狀二氧化矽組成之群的二氧化矽摻合。
超高分子量聚二甲基矽氧烷具有選自由以下組成之群的側基、端基或側基與端基之混合物：氫、三甲基、二甲基、甲基、苯基、氟基、胺基、乙烯基、羥基及甲基丙烯酸酯基。
因此，本文中之本發明為一種組成物，其藉由摻合熱塑性或熱固性聚合物，諸如樹脂或橡膠與超高分子量聚矽氧烷基質來提供。
熱塑性聚合物可選自由以下組成之群：尤其為聚苯乙烯、高衝擊聚苯乙烯、聚丙烯、聚碳酸酯、聚碸、聚(苯硫醚)、丙烯腈-丁二烯-苯乙烯共聚物、耐綸、縮醛、聚乙烯、聚酮、聚(對苯二甲酸伸乙酯)、聚(對苯二甲酸伸丁酯)、丙烯酸酯、氟塑膠、聚酯、酚醛樹脂、環氧樹脂、胺基甲酸酯、聚醯亞胺、三聚氰胺甲醛及脲。此等聚合物之摻合物涵蓋在本發明之範疇內。
適用之熱固性聚合物尤其為聚酯、聚胺基甲酸酯、橡膠、酚-甲醛、脲-甲醛、三聚氰胺、環氧樹脂、聚醯亞胺及聚氰尿酸酯。此等聚合物之摻合物涵蓋在本發明之範疇內。
典型地，此等聚合物以20重量%至98重量%比80至2重量%之超高分子量聚矽氧烷基質之比使用。更佳地，該等聚合物以50重量%至98重量%使用，且最佳地，該等聚合物以70至98重量%使用(全部以聚合物及聚矽氧烷基質之重量計)。
聚合物與2至80重量%之超高分子量聚矽氧烷基質摻合。
該等基質中之聚矽氧烷具有選自諸如三甲基、二甲基、甲基、苯基、氟基、胺基、乙烯基、羥基及甲基丙烯酸酯基(且舉幾例)之基團的側基、端基或側基及端基之混合物。
該等基質中之二氧化矽主要由沈澱及煙霧狀二氧化矽組成。以二氧化矽及聚矽氧烷之重量計，二氧化矽以3至35重量%之範圍存在。二氧化矽之更佳範圍為15至25重量%。
用於本發明之較佳聚矽氧烷為聚二甲基-矽氧烷，其具有羥基二甲基末端、乙烯基二甲基末端、三甲基矽烷氧基末端或上文所提及之材料，其中存在前述側基。「超高分子量(ultra-high molecular weight)」意謂聚矽氧烷之分子量(Mn)為至少10,000且不超過約1,000,000(Mn)。較佳為50,000至500,000之Mn且最佳為250,000至350,000之Mn。當分子量在10,000以下時，所得聚矽氧基質可能並非如此有效。當分子量在1,000,000以上時，聚矽氧烷與二氧化矽之摻合變得難以分散，但仍可採用此類聚矽氧烷。
摻合物係藉由行業中之已知方法製備且未必伴有複雜製造。
可視希望增強之特性而定，添加其他材料或佐劑至摻合物。舉例而言，可添加相容劑。該等相容劑為此項技術中已知的且可基於熱塑性或熱固性聚合物之類型及其具有之官能基之種類進行選擇。典型相容劑包括聚合物及寡聚物，其為具有包括(但不限於)以下之基團之嵌段及/或接枝共聚物、三聚物、四聚物或寡聚物：伸乙基、伸丙基、伸丁基、丁二烯、乙烯基、順丁烯二酸酐、乙酸乙烯酯、甲酸、丙烯酸、乳酸、酯、矽烷、二甲基矽氧烷、苯乙烯、醚、丙烯酸酯、環氧化物、氧化物、二烯、氰尿酸酯、胺基甲酸酯、醌、氮代內酯、磺酸酯、氯化物、氟化物、醯亞胺、酮、乙烯基、苯基、羥基、環氧基、甲氧基、醯胺、醯亞胺、異戊二烯、己烷、辛烷、癸烷及十二烷。可在摻合聚合物與超高分子量聚矽氧烷
基質期間添加相容劑。
亦可添加塑化劑至聚矽氧烷基質及聚合物之摻合物，該等塑化劑可例如為基於二羧酸/三羧酸酯之塑化劑，諸如基於鄰苯二甲酸酯之塑化劑：鄰苯二甲酸雙(2-乙基己酯)(DEHP)、鄰苯二甲酸二[2-乙基己酯]、鄰苯二甲酸二異壬酯(DINP)、鄰苯二甲酸二正丁酯(DnBP，DBP)、鄰苯二甲酸丁基苄酯(BBzP)、鄰苯二甲酸二異癸酯(DIDP)、鄰苯二甲酸二正辛酯(DOP或DnOP)、鄰苯二甲酸二異辛酯(DIOP)、鄰苯二甲酸二乙酯(DEP)、鄰苯二甲酸二異丁酯(DIBP)、鄰苯二甲酸二正己酯、鄰苯二甲酸二-2-乙基己酯、鄰苯二甲酸丁基苯、鄰苯二甲酸二異壬酯、鄰苯二甲酸二異癸酯、鄰苯二甲酸二丙基庚酯、鄰苯二甲酸雙十一酯、鄰苯二甲酸二異十一酯、鄰苯二甲酸雙十三酯、鄰苯二甲酸二丁酯、鄰苯二甲酸二異丁酯、鄰苯二甲酸二艾杜丁酯(Diidobutyl phthalate)、鄰苯二甲酸二異庚酯、鄰苯二甲酸二丙酯、鄰苯二甲酸二甲酯；偏苯三酸酯，諸如偏苯三酸三甲酯(TMTM)、偏苯三酸三-(2-乙基己酯)(TEHTM-MG)、偏苯三酸三-(正辛基,正癸酯)(ATM)、偏苯三酸三-(庚基,壬酯)(ITM)、偏苯三酸正辛酯(OTM)、偏苯三酸三辛酯/偏苯三酸參(2-乙基己酯)；己二酸酯、癸二酸酯、順丁烯二酸酯，諸如己二酸雙(2-乙基己酯)(DEHA)、己二酸二甲酯(DMAD)、己二酸單甲酯(MMAD)、己二酸二辛酯(DOA)、癸二酸二丁酯(DBS)、順丁烯二酸二丁酯(DBM)、順丁烯二酸二異丁酯(DIBM)、己二酸二(丁氧基乙酯)、己二酸二丁氧基乙氧基乙酯、己二酸二(2-乙基己酯)及己二酸二辛酯/己二酸雙(2-乙基己酯)。
其他塑化劑包括苯甲酸酯、對苯二甲酸酯(諸如對苯二甲酸二辛酯/DEHT)、三苯甲酸甘油酯、1,4-環己烷二甲醇二苯甲酸酯、聚丙二醇二苯甲酸酯、新戊二醇二苯甲酸酯、1,2-環己二酸二異壬酯、環氧化植物油、烷基磺酸苯酯(ASE)、磺醯胺、N-乙基甲苯磺醯胺(o/p ETSA)、鄰位及對
位異構體、N-(2-羥丙基)苯磺醯胺(HP BSA)、N-乙基-鄰/對甲苯磺醯胺、N-(正丁基)苯磺醯胺(BBSA-NBBS)、N-丁基苯磺醯胺、有機磷酸酯、二丙二醇二苯甲酸酯、二丙二醇1,4-環己烷二甲醇二苯甲酸酯、磷酸三乙酯、磷酸三異丙基苯酯、磷酸三甲苯酯(TCP)、磷酸三丁酯(TBP)、磷酸e-乙基己基二苯酯、磷酸二辛酯、磷酸異癸基二苯酯、磷酸三苯酯、磷酸三芳基酯合成物、磷酸三丁氧基乙酯、磷酸參-(氯乙酯)、磷酸丁基苯基二苯酯、氯化有機磷酸酯、磷酸甲苯基二苯酯、磷酸參-(二氯丙酯)、磷酸異丙基苯基二苯酯、磷酸三聯苯酯、磷酸三甲苯酯、磷酸二苯基辛酯、二醇/聚醚、三乙二醇二己酸酯(3G6，3GH)、四乙二醇二庚酸酯(4G7)、聚合塑化劑、聚丁烯、N-正丁基苯磺醯胺、三乙二醇雙(2-乙基己酸酯)、N-乙基鄰/對甲苯磺醯胺、PEG二-2-乙基己酸酯、PEG-二月桂酸酯、檸檬酸三乙基乙醯酯、檸檬酸乙醯基三丁酯、三乙二醇雙(2-乙基己酸酯)、對苯二甲酸二辛酯/1,4-苯二甲酸雙(2-乙基己酯)、琥珀酸二辛酯/琥珀酸雙(2-乙基己酯)、琥珀酸二辛酯/琥珀酸雙(2-乙基己酯)及可生物降解塑化劑，諸如乙醯化單酸甘油酯、檸檬酸烷基酯、檸檬酸三乙酯(TEC)、檸檬酸乙醯基三乙酯(ATEC)、檸檬酸三丁酯(TBC)、檸檬酸乙醯基三丁酯(ATBC)、檸檬酸三辛酯(TOC)、檸檬酸乙醯基三辛酯(ATOC)、檸檬酸三己酯(THC)、檸檬酸乙醯基三己酯(ATHC)、檸檬酸丁醯基三己酯(BTHC，檸檬酸三己基o-丁醯酯)、檸檬酸三甲酯(TMC)。用於高能材料之塑化劑，諸如硝化甘油(Nitro glycerine)(NG，亦稱為「硝化甘油(nitro)」，三硝酸甘油酯)、丁三醇三硝酸酯(BTTN)、二硝基甲苯(DNT)、三羥甲基乙烷三硝酸酯(TMETN，亦稱為甲三醇三硝酸酯，METN)、二乙二醇二硝酸酯(DEGDN，較不通常地示作DEGN)、三乙二醇二硝酸酯(TEGDN，較不通常地示作TEGN)、雙(2,2-二硝基丙基)縮甲醛(BDNPF)、雙(2,2-二硝基丙基)縮醛(BDNPA)、2,2,2-三硝基乙基2-硝氧基乙醚(TNEN)、環氧酯、磷酸酯、二級塑化劑、環氧化大豆油(ESBO)
及環氧化亞麻籽油(ELO)、環己烷二酸酯：環己烷二甲酸二異壬酯，三酸甘油酯塑化劑：偏苯三酸參-2-乙基己酯(偏苯三酸三辛酯-TOTM)、偏苯三酸三(2-乙基己酯)、甘油乙醯化酯、二(對苯二甲酸2-乙基己酯)、環己烷1,2-二甲酸二(異壬酯)、乙酸二(2-乙基己酯)及己二酸2-乙基己酯。
可由使用者按需要添加之其他佐劑包括玻璃纖維、玻璃珠、礦物填料、阻燃劑、穩定劑、抗氧化劑、玻璃氣泡、聚合纖維、碳纖維、顏料、製程助劑、潤滑劑及佐劑之任意混合物。
佐劑可在添加至熱塑性聚合物之前與超高分子量聚矽氧烷及二氧化矽摻合物摻合或其可直接添加至聚合物與聚矽氧烷基質之組合。
聚矽氧烷基質及聚合物緊密地摻合且該摻合物可例如以塗層形式塗覆至金屬線或覆蓋之金屬股線外部且接著經由已知方法進行固化。
該等材料例如使用聚醯胺6樹脂來調配，其賦予樹脂足夠之可撓性以用於THHN金屬線及纜線且可代替依賴己內醯胺用作耐綸樹脂中之添加劑，以使得產物可接受。此方法之附加益處使該材料之可撓性無關於聚合物中之水分含量。此外，該方法使材料在低至-40℃為可撓性的。
呈現以下實施例以更佳地說明本發明之方法。用於以下實施例中之材料為：具有250g/m2之表面積及9微米之平均粒度之沈澱二氧化矽；具有55,000之mn及100pm含量之乙烯基末端之超高分子量聚矽氧烷；具有150之黏度值之通用耐綸66樹脂；具有0.15in3/10min之熔體體積速率之聚醯胺12；基於乙烯丙烯酸之鋅基離聚物；用於處理及長期熱穩定之位阻酚系一級抗氧化劑；具有9g/10min之熔體流動指數之天然縮醛共聚物；具有1.20之比重之熱塑性聚胺基甲酸酯彈性體(聚酯)(TPU-聚酯)材料；具有8g/10min之熔體流動指數之乙烯及丙烯酸甲酯之無規共聚物。
實施例1：聚醯胺12摻合物
可以兩個步驟製備該材料。在第一步中，將沈澱二氧化矽摻合至超高分子量聚矽氧烷中。此基質係在室溫下於25mm雙螺桿擠壓機中製備，其中具有25重量%二氧化矽及75%聚矽氧膠。此摻合物(摻合物1)隨後用於下一步驟中。
在第二步中，加熱雙螺桿擠壓機至250℃且用於混合12%來自步驟1之聚矽氧基質、3%離聚物及85%聚醯胺12。相比於具有125%之伸長率及1103MPa之撓曲模數之天然聚醯胺12，所得材料具有412%伸長率及756.8MPa撓曲模數。
實施例2：聚醯胺66摻合物
以2個步驟製備此材料。在步驟一中，使用雙螺桿擠壓機將22%沈澱二氧化矽與0.5%酚系抗氧化劑及77.5%超高分子量聚矽氧烷一起摻合。
在第二步中，在雙螺桿擠壓機上將來自步驟一之基質與聚醯胺66樹脂摻合以製備具有20%聚矽氧烷基質及80%聚醯胺66之組成物。所得材料具有51.7%伸長率及1545.6MPa撓曲模數。
實施例3：縮醛摻合物
以2個步驟製備此材料。在步驟一中，使用雙螺桿擠壓機將18%沈澱二氧化矽與0.5%酚系抗氧化劑及81.5%超高分子量聚矽氧烷一起摻合。
在雙螺桿擠壓機上於190°下將來自步驟一之聚矽氧烷基質摻合以形成具有15%聚矽氧烷基質、1.25%乙烯丙烯酸甲酯共聚物、3.75%熱塑性聚胺基甲酸酯、0.5%酚系抗氧化劑及78.5%共聚物縮醛之組成物。相比於初始縮醛共聚物樹脂之2595MPa，所得材料具有1651MPa之撓曲模數。
Claims (28)
- 一種目標組成物，其包含具有以下之摻合物：i. 20至98重量%之熱塑性樹脂及ii. 2至80重量%之分子量(Mn)為至少10,000且不超過約1,000,000(Mn)之超高分子量聚矽氧烷，其中該超高分子量聚二甲基矽氧烷已與3至35重量%選自由以下組成之群的二氧化矽進行摻合：a. 沈澱二氧化矽，及b. 煙霧狀二氧化矽其中該超高分子量聚二甲基矽氧烷具有選自由以下組成之群的側基、端基或側基與端基之混合物：氫、三甲基、二甲基、甲基、苯基、氟基、胺基、乙烯基、羥基及甲基丙烯酸酯基。
- 如申請專利範圍第1項之目標組成物，其中該二氧化矽係以15至25重量%之範圍存在。
- 如申請專利範圍第1項之目標組成物，其中該熱塑性樹脂係以50至98重量%存在。
- 如申請專利範圍第1項之目標組成物，其中該熱塑性樹脂係以70至95重量%存在。
- 如申請專利範圍第1項之目標組成物，其中該超高分子量聚矽氧烷為羥基封端之聚二甲基矽氧烷。
- 如申請專利範圍第1項之目標組成物，其中該超高分子量聚矽氧烷為三甲基矽烷氧基封端之聚二甲基矽氧烷。
- 如申請專利範圍第1項之目標組成物，其中該目標組成物另外含有相容劑。
- 如申請專利範圍第7項之目標組成物，其中該相容劑係在該熱塑性聚合物與該超高分子量聚矽氧烷之該摻合期間添加。
- 如申請專利範圍第1項之目標組成物，其中該組成物中另外亦存在選自由以下組成之群的佐劑：i. 玻璃纖維，ii. 玻璃珠，iii. 礦物填料，iv. 阻燃劑，v. 穩定劑，vi. 抗氧化劑，vii. 玻璃氣泡，viii.聚合纖維，ix. 碳纖維，x. 顏料，xi. 製程助劑，xii. 潤滑劑，及xiii.i至xii之任意混合物。
- 如申請專利範圍第9項之組成物，其中該等佐劑係在添加至該熱塑性聚合物之前與該超高分子量聚矽氧烷及二氧化矽摻合物摻合。
- 如申請專利範圍第1項之目標組成物，其中該熱塑性聚合物係選自由以下組成之群：聚苯乙烯、高衝擊聚苯乙烯、聚丙烯、聚碳酸酯、聚碸、聚(苯硫醚)、丙烯腈-丁二烯-苯乙烯共聚物、耐綸、縮醛、聚乙烯、聚(對苯二甲酸伸乙酯)、聚(對苯二甲酸伸丁酯)、聚酮、丙烯酸酯、氟塑膠、聚酯、酚醛樹脂、環氧樹脂、胺基甲酸酯、聚醯亞胺、三聚氰胺甲醛及脲。
- 如申請專利範圍第11項之目標組成物，其中該熱塑性聚合物係選自一或多種熱塑性聚合物之摻合物。
- 如申請專利範圍第1項之目標組成物，其中另外存在塑化劑。
- 如申請專利範圍第13項之目標組成物，其中存在塑化劑之摻合物。
- 如申請專利範圍第13項之組成物，其中該塑化劑化合物係以1至30重量%存在。
- 如申請專利範圍第13項之組成物，其中該塑化劑係以2至8重量%存在。
- 一種目標組成物，其包含具有以下之摻合物：i. 20至98重量%之熱固性樹脂，及ii. 2至80重量%之分子量(Mn)為至少10,000且不超過約1,000,000(Mn)之超高分子量聚矽氧烷，其中該超高分子量聚二甲基矽氧烷已與3至35重量%選自由以下組成之群的二氧化矽摻合：a. 沈澱二氧化矽，及b. 煙霧狀二氧化矽，其中該超高分子量聚二甲基矽氧烷具有選自由以下組成之群的側基、端基或側基與端基之混合物：氫、三甲基、二甲基、甲基、苯基、氟基、胺基、乙烯基、羥基及甲基丙烯酸酯基。
- 一種目標組成物，其包含具有以下之摻合物：i. 25至98重量%之熱固性橡膠，及ii. 2至75重量%之分子量(Mn)為至少10,000且不超過約1,000,000(Mn)之超高分子量聚矽氧烷，其中該超高分子量聚二甲基矽氧烷已與3至35重量%選自由以下組成之群的二氧化矽摻合：a. 沈澱二氧化矽，及b. 煙霧狀二氧化矽其中該超高分子量聚二甲基矽氧烷具有選自由以下組成之群的側基、端基或側基與端基之混合物：氫、三甲基、二甲基、甲基、苯基、氟 基、胺基、乙烯基、羥基及甲基丙烯酸酯基。
- 一種組合，其包括如申請專利範圍第1項之組成物與金屬線。
- 一種組合，其包括如申請專利範圍第1項之組成物與纜線。
- 一種組合，其包括如申請專利範圍第1項之組成物與膜。
- 一種組合，其包括如申請專利範圍第1項之組成物與纖維。
- 一種組合，其包括如申請專利範圍第1項之組成物與模製容器或外殼。
- 一種組合，其包括如申請專利範圍第1項之組成物與壓出薄片。
- 一種組合，其包括如申請專利範圍第1項之組成物與軟管。
- 一種組合，其包括如申請專利範圍第1項之組成物與管。
- 一種組合，其包括如申請專利範圍第1項之組成物與纖維。
- 一種組合，其包括如申請專利範圍第1項之組成物與用於體育用品中之物品。
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| US201361814362P | 2013-04-22 | 2013-04-22 | |
| US14/257,032 US20140316041A1 (en) | 2013-04-22 | 2014-04-21 | Alternative approach to toughening and flexibilizing thermoplastic and thermoset polymers |
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| WO2016094381A1 (en) | 2014-12-11 | 2016-06-16 | Ticona Llc | Stabilized flexible thermoplastic composition and products formed therefrom |
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| CN104845362A (zh) * | 2015-06-03 | 2015-08-19 | 苏州靖羽新材料有限公司 | 一种增韧尼龙材料及其制备方法 |
| WO2016200833A1 (en) * | 2015-06-08 | 2016-12-15 | Avery Dennison Corporation | Adhesives for chemical mechanical planarization applications |
| TWI708806B (zh) | 2015-08-17 | 2020-11-01 | 美商堤康那責任有限公司 | 用於相機模組之液晶聚合物組合物 |
| CN108368325A (zh) | 2015-09-30 | 2018-08-03 | 塞拉尼斯销售德国有限公司 | 低摩擦无刺耳音的组合件 |
| CN108368339A (zh) | 2015-12-11 | 2018-08-03 | 提克纳有限责任公司 | 聚芳硫醚组合物 |
| CN108026370B (zh) | 2015-12-11 | 2021-08-06 | 提克纳有限责任公司 | 交联性聚芳硫醚组合物 |
| US11383491B2 (en) | 2016-03-24 | 2022-07-12 | Ticona Llc | Composite structure |
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| WO2018163098A1 (en) * | 2017-03-10 | 2018-09-13 | Celanese Sales Germany Gmbh | Polyester polymer compositions |
| KR101987550B1 (ko) * | 2017-08-18 | 2019-06-11 | 엘에스전선 주식회사 | 난연성 및 내수성을 갖는 시스 조성물 및 이로부터 형성된 시스층을 갖는 케이블 |
| WO2019112847A1 (en) | 2017-12-05 | 2019-06-13 | Ticona Llc | Aromatic polymer composition for use in a camera module |
| KR102701352B1 (ko) | 2018-02-01 | 2024-09-03 | 다우 글로벌 테크놀로지스 엘엘씨 | 조성물, 이를 사용하여 형성된 중합체 복합 물품, 및 이의 제조 방법 |
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| CA2910041A1 (en) | 2014-10-30 |
| US20140316041A1 (en) | 2014-10-23 |
| WO2014176143A1 (en) | 2014-10-30 |
| JP2016516868A (ja) | 2016-06-09 |
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