TWI529440B - Image capturing module for reducing the assembly tilt - Google Patents

Description

Image capture module for reducing assembly tilt

The present invention relates to an image capture module, and more particularly to an image capture module for reducing the assembly tilt angle of a lens assembly relative to an image sensing wafer.

In recent years, the trend of handheld devices such as mobile phones and PDAs has become increasingly popular, and with the market demand for better handheld devices and smaller size, The group has faced the dual requirements of higher image quality and miniaturization. In view of the improvement of the image quality of the image capture module, on the one hand, the pixel is improved. The market trend is from the original VGA level of 30 pixels, which has progressed to the current two million pixels and three million pixels commonly used in the market. Even worse, it has introduced a higher level of more than eight million pixels. In addition to the improvement of pixels, on the other hand, the resolution of the image is taken care of. Therefore, the image capturing module of the handheld device is also developed by the fixed focus image capturing function toward the camera-like optical autofocus function or even the optical zoom function.

The optical autofocus function is operated according to different distances and close distances of the target object to appropriately move the lens in the image capturing module, so that the optical image of the image capturing object can be accurately focused on the image sensor. To produce a clear image. At present, it is common to activate the lens movement in the image capturing module, which includes stepping motor actuation, piezoelectric actuation, and voice coil motor (VCM) actuation. However, since the image sensor and the sensor bracket in the conventional image capturing module are stacked on the board as a stacking reference plane, the sensor bracket is opposite to the image sensor. The assembly tilt angle is too large, so that the image quality captured by the conventional image capture module cannot be effectively improved.

An embodiment of the present invention provides an image capturing module for reducing the assembly tilt angle, which can effectively solve the problem that "the image sensor and the sensor bracket in the conventional image capturing module are stacked on a circuit board. The reference planes are stacked on top of each other, so that the assembly tilt angle of the sensor holder relative to the image sensor is too large, and the image quality captured by the conventional image capturing module cannot be effectively improved.

An image capturing module for reducing an assembly tilt angle according to an embodiment of the present invention includes: an image sensing unit, a frame housing, and an actuator structure. The image sensing unit includes a carrier substrate and an image sensing chip disposed on the carrier substrate and electrically connected to the carrier substrate. The frame housing is disposed on the carrier substrate and is in contact with the image sensing wafer facing downward, wherein the image sensing wafer is surrounded by the frame housing. The actuator structure is disposed on the frame housing and above the image sensing wafer, wherein the actuator structure includes a lens carrier disposed on the frame housing and a lens holder A lens assembly that is flatly attached to the frame housing is disposed in the lens carrier and facing downward. Thereby, the image sensing wafer, the frame housing and the lens assembly are sequentially stacked upwards with each other for reducing the assembly tilt angle of the lens assembly relative to the image sensing wafer.

Another embodiment of the present invention provides an image capturing module for reducing an assembly tilt angle, comprising: an image sensing unit, a frame housing, and an actuator structure. The image sensing unit includes a carrier substrate and an image sensing chip disposed on the carrier substrate and electrically connected to the carrier substrate. The frame housing is disposed on the carrier substrate and is in contact with the image sensing wafer facing downward, wherein the image sensing wafer is surrounded by the frame housing. The actuator structure is disposed on the frame housing and above the image sensing wafer, wherein the actuator structure includes a lens carrier disposed on the frame housing and an movable a lens assembly disposed in the lens carrier and facing downwardly to the frame housing, the lens carrier having a surrounding movable member inside, the lens assembly The fixing member is fixed in the surrounding movable member, and the lens assembly is movably disposed in the lens holder through the surrounding movable member. Thereby, the image sensing wafer, the frame housing and the lens assembly are sequentially stacked upwards with each other for reducing the assembly tilt angle of the lens assembly relative to the image sensing wafer.

According to still another embodiment of the present invention, an image capturing module for reducing an assembly tilt angle includes: an image sensing unit, a frame housing, and an actuator structure. The image sensing unit includes a carrier substrate and an image sensing chip disposed on the carrier substrate and electrically connected to the carrier substrate, wherein the top end of the image sensing wafer has a first stacked reference plane . The frame housing is disposed on the carrier substrate and surrounds the image sensing wafer, wherein the frame housing has a surrounding support portion disposed on the carrier substrate through a first adhesive body, and a setting a surrounding contact portion of the first stacking reference surface directly contacting the image sensing wafer on the image sensing wafer, and a connection between the surrounding supporting portion and the surrounding contact portion a surrounding connecting portion, and a top end of the surrounding connecting portion of the frame housing has a second stacking reference surface. The actuator structure is disposed on the frame housing and above the image sensing wafer, wherein the actuator structure includes a second adhesive body disposed on the frame housing a lens carrier and a lens assembly disposed in the lens carrier, and the lens assembly is disposed on the surrounding connection to directly contact the second stacked reference surface of the surrounding connection.

The image capture module provided by the embodiment of the present invention can be designed to "stack the image sensing wafer, the frame housing and the lens assembly in sequence with each other". So that "the first assembly datum of the surrounding stacking reference portion relative to the first stacking reference plane of the image sensing wafer" may be very close or substantially equivalent to "the a second assembly tilt angle of the assembly reference plane of the lens assembly relative to the first stacking reference plane of the image sensing wafer, thereby effectively reducing the set of the lens assembly An assembly tilt angle of the reference plane relative to the first stacking reference plane of the image sensing wafer to ensure planarity of the lens assembly relative to the image sensing wafer.

For a better understanding of the features and technical aspects of the present invention, reference should be made to the accompanying drawings.

M‧‧‧Image Capture Module

1‧‧‧Image sensing unit

10‧‧‧Loading substrate

11‧‧‧Image sensing wafer

S1‧‧‧ first stacking datum

2‧‧‧Frame housing

200‧‧‧ top opening

21‧‧‧round support

22‧‧‧round contact

23‧‧‧round connection

S2‧‧‧Second stacking datum

3‧‧‧Activity structure

30‧‧‧Lens carrier

30M‧‧‧around movable parts

300‧‧‧With no screw surface

31‧‧‧ lens assembly

310‧‧‧ outside the surface without a screw

S3‧‧‧Assembly datum

4‧‧‧ Filter elements

H1‧‧‧First Adhesive Colloid

H2‧‧‧Second Adhesive

F‧‧‧Fixed colloid

1 is a side cross-sectional view of a video capture module for reducing the assembly tilt angle of the present invention using a voice coil actuator.

Fig. 2 is an enlarged schematic view showing a portion A of Fig. 1.

FIG. 3 is a side cross-sectional view showing another embodiment of the image capturing module for reducing the assembly tilt angle of the present invention.

The following describes an embodiment of the "image capturing module for reducing the assembly tilt angle" disclosed by the present invention by a specific specific example. Those skilled in the art can easily understand other advantages of the present invention from the contents disclosed in the present specification. efficacy. The present invention may be embodied or applied in various other specific embodiments, and various modifications and changes can be made without departing from the spirit and scope of the invention. Further, the drawings of the present invention are merely illustrative, and are not depicted in actual dimensions, that is, the actual dimensions of the related structures are not reflected, which will be described first. The following embodiments are intended to further explain the related art of the present invention, but are not intended to limit the technical scope of the present invention.

Please refer to FIG. 1 and FIG. 2 , wherein FIG. 2 is an enlarged schematic view of a portion A of FIG. 1 . As can be seen from the above figures, the present invention provides an image capturing module M for reducing the assembly tilt angle, comprising: an image sensing unit 1, a frame housing 2 and an actuator structure 3.

First, as shown in FIG. 1 , the image sensing unit 1 includes a carrier substrate 10 and an image sensing wafer 11 disposed on the carrier substrate 10 and electrically connected to the carrier substrate 10 . For example, the image sensing wafer 11 can be a CMOS image sensing wafer, and The image sensing wafer 11 can be disposed on the carrier substrate 10 by an adhesive (not labeled, such as a UV adhesive, a heat hardening adhesive, or an in-furnace hardening adhesive, etc.). In addition, the carrier substrate 10 can be a circuit substrate having a plurality of conductive pads (not labeled) on the upper surface thereof. The upper surface of the image sensing wafer 11 has a plurality of conductive pads (not labeled), and the image sensing wafer 11 is Each of the conductive pads (not labeled) can be electrically connected to the conductive pads (not labeled) of the carrier substrate 10 through a conductive line (not labeled), thereby achieving the image sensing wafer 11 and the carrier substrate 10. Electrical continuity between.

Furthermore, as shown in FIG. 1, the frame housing 2 is disposed on the carrier substrate 10 and faces the flat image sensing wafer 11 downward, and the image sensing wafer 11 is surrounded by the frame housing 2. Furthermore, the actuator structure 3 is disposed on the frame housing 2 and above the image sensing wafer 11, and the actuator structure 3 includes a lens carrier 30 and a lens carrier 2 disposed thereon. The lens assembly 31 is disposed within the lens carrier 30 and faces downwardly to the flat frame housing 2. For example, the frame housing 2 may be disposed on the carrier substrate 10 through the first adhesive colloid H1 (eg, UV adhesive, thermosetting adhesive, or in-furnace hardening glue, etc.), and the lens carrier 30 may pass through the second Adhesive H2 (such as UV adhesive, thermosetting adhesive, or in-furnace hardening glue, etc.) to be disposed on the frame housing 2, and the lens assembly 31 can be made up of a lens holder (not labeled) and a plurality of optical lenses (not labeled ) composed of.

It is worth mentioning that, as shown in FIG. 1 , the actuator structure 3 can be a voice coil actuator, but the invention is not limited thereto (as shown in FIG. 3 ). If the actuator structure 3 employs a voice coil actuator, the actuator structure 3 includes a lens assembly 31 that is movably disposed within the lens carrier 30 and that faces downwardly into the planar frame housing 2, wherein the lens carrier The inside of the 30 has a surrounding movable member 30M, the lens assembly 31 can be fixed in the surrounding movable member 30M by the fixing colloid F, and the lens assembly 31 can be movably disposed on the lens holder through the surrounding movable member 30M. 30 inside. For example, the lens carrier 30 or the surrounding movable member 30M has an inner surrounding screwless surface 300, and the lens assembly 31 has a corresponding inner screwless surface 300 and cooperates with the inner surrounding screwless surface 300. Surrounded by no snail Tooth surface 310.

In addition, as shown in FIG. 1 , the image capturing module M for reducing the assembly tilt angle disclosed in the embodiment of the present invention further includes: a filter element 4 disposed on the frame housing 2 and located in the image sensing device. Between the wafer 11 and the lens assembly 31. Furthermore, the frame housing 2 has a top opening 200 between the image sensing wafer 11 and the lens assembly 31, and the top opening 200 of the frame housing 2 is closed by the filter element 4. For example, the filter element 4 can be a flat glass plate coated with an anti-infrared (IR) layer and/or an anti-reflection (AR) layer, and the filter element 4 can be fixed to the frame shell by an adhesive. 2 in a recessed space.

Furthermore, as shown in FIG. 1 and FIG. 2, the top end of the image sensing wafer 11 has a first stacked reference plane S1. The frame housing 2 has a surrounding support portion 21 disposed on the carrier substrate 10 through the first adhesive colloid H1, and a first stacked reference surface S1 disposed on the image sensing wafer 11 to directly contact the image sensing wafer 11. a surrounding contact portion 22, and a surrounding connecting portion 23 connected between the surrounding supporting portion 21 and the surrounding contact portion 22, and the top end of the surrounding connecting portion 23 of the frame housing 2 has a second stacking reference Face S2. Thereby, the filter element 4 can be disposed on the surrounding contact portion 22 and surrounded by the surrounding connection portion 23, and the lens carrier 30 can be disposed on the surrounding connection portion 23 of the frame housing 2 through the second adhesive body H2. Upper, and the lens assembly 31 may be disposed on the surrounding connecting portion 23 to directly contact the second stacked reference surface S2 of the surrounding connecting portion 23.

Furthermore, as shown in FIG. 1 and FIG. 2, the surrounding contact portion 22 of the frame housing 2 is disposed on the first stacking reference surface S1 of the image sensing wafer 11 to obtain a second surrounding portion 23 The first assembly tilt angle of the stacked reference plane S2 relative to the first stacked reference plane S1 of the image sensing wafer 11. The lens assembly 31 is disposed on the second stacking reference surface S2 of the surrounding connecting portion 23 to obtain a second assembly tilt angle of an assembly reference surface S3 of the lens assembly 31 with respect to the first stacked reference surface S1 of the image sensing wafer 11. The assembly reference surface S3 may be designed on the top or bottom surface of the lens assembly 31. Thereby, since the second stacked reference surface S2 of the surrounding connecting portion 23 is relatively The first assembly tilt angle of the first stacked reference plane S1 of the image sensing wafer 11 may be very close to or substantially equal to the second assembly reference surface S3 of the lens assembly 31 relative to the first stacked reference plane S1 of the image sensing wafer 11 The tilt angle is assembled, so the present invention can be used to reduce the assembly tilt angle of the lens assembly 31 relative to the image sensing wafer 11. In other words, since the image sensing wafer 11, the frame housing 2, and the lens assembly 31 are sequentially stacked upward with each other, the second stacked reference surface S2 of the surrounding connecting portion 23 is opposite to the first stacked reference surface S1 of the image sensing wafer 11. The first assembly tilt angle may be very close to or substantially equal to the second assembly tilt angle of the assembly reference surface S3 of the lens assembly 31 relative to the first stack reference plane S1 of the image sensing wafer 11, whereby the lens assembly 31 is lowered. The assembly tilt angle of the assembly reference surface S3 with respect to the first stack reference plane S1 of the image sensing wafer 11.

[Possible effects of the examples]

In summary, the image capturing module M provided by the embodiment of the present invention can be sequentially stacked up through the image sensing wafer 11, the frame housing 2, and the lens assembly 31. The design is such that "the first assembly datum angle of the second stacking reference plane S2 of the surrounding connection portion 23 relative to the first stacking reference plane S1 of the image sensing wafer 11" will be very close or substantially equivalent to the "lens assembly" The second assembly tilt angle of the assembly reference surface S3 of the lens sensing wafer 11 relative to the first stacking reference surface S1 of the image sensing wafer 11 is effective to reduce the first stacking reference of the assembly reference surface S3 of the lens assembly 31 relative to the image sensing wafer 11. The assembly angle of the face S1 is to ensure the flatness of the lens assembly 31 relative to the image sensing wafer 11.

The above description is only a preferred embodiment of the present invention, and is not intended to limit the scope of the present invention. Therefore, equivalent technical changes made by using the present specification and the contents of the drawings are included in the protection scope of the present invention. .

M‧‧‧Image Capture Module

1‧‧‧Image sensing unit

10‧‧‧Loading substrate

11‧‧‧Image sensing wafer

2‧‧‧Frame housing

200‧‧‧ top opening

21‧‧‧round support

22‧‧‧round contact

23‧‧‧round connection

3‧‧‧Activity structure

30‧‧‧Lens carrier

30M‧‧‧around movable parts

300‧‧‧With no screw surface

31‧‧‧ lens assembly

310‧‧‧ outside the surface without a screw

S3‧‧‧Assembly datum

4‧‧‧ Filter elements

H1‧‧‧First Adhesive Colloid

H2‧‧‧Second Adhesive

F‧‧‧Fixed colloid

Claims (10)

An image capturing module for reducing an assembly tilt angle includes: an image sensing unit, the image sensing unit includes a carrier substrate, and is disposed on the carrier substrate and electrically connected to the carrier substrate Image sensing wafer; a frame housing disposed on the carrier substrate and facing downwardly contacting the image sensing wafer, wherein the image sensing wafer is Surrounding; and an actuator structure disposed on the frame housing and above the image sensing wafer, wherein the actuator structure includes a frame housing a lens mount and a lens assembly disposed in the lens carrier and facing downwardly to planarly contact the frame housing; wherein the image sensing wafer, the frame housing and the lens assembly are mutually dependent The sequences are stacked upward for reducing the assembly tilt angle of the lens assembly relative to the image sensing wafer. The image capturing module for reducing the assembly tilt angle according to claim 1, further comprising: a filter element disposed on the frame housing and located on the image sensing chip Between the lens assembly and the lens assembly, wherein the frame housing has a top opening between the image sensing wafer and the lens assembly, and the top opening of the frame housing is filtered The component is enclosed, wherein the lens carrier has an inner surrounding screwless surface, and the lens assembly has an outer surrounding screwless surface corresponding to the inner surrounding screwless surface. The image capturing module of claim 2, wherein the top end of the image sensing wafer has a first stacking reference surface, and the frame housing has a first adhesive body to be disposed. a surrounding support portion on the carrier substrate is disposed on the image sensing wafer to directly contact the image sense a surrounding contact portion of the first stacking reference surface of the wafer, and a surrounding connecting portion connected between the surrounding supporting portion and the surrounding contact portion, and the frame housing The top end of the surrounding connection portion has a second stacking reference surface, wherein the filter element is disposed on the surrounding contact portion and surrounded by the surrounding connection portion, and the lens carrier passes through the second adhesive colloid To be disposed on the surrounding connecting portion of the frame housing, and the lens assembly is disposed on the surrounding connecting portion to directly contact the second stacked reference surface of the surrounding connecting portion. The image capturing module of claim 3, wherein the surrounding contact portion of the frame housing is disposed on the first stacking reference surface of the image sensing wafer, Obtaining a first assembly tilt angle of the second stacking reference plane of the surrounding connection portion with respect to the first stacking reference plane of the image sensing wafer, wherein the lens assembly is disposed at the surrounding connection portion a second stacking reference plane to obtain a second assembly tilt angle of an assembly reference plane of the lens assembly relative to the first stacking reference plane of the image sensing wafer, wherein the surrounding connection portion The first assembly tilt angle of the second stack reference plane relative to the first stack reference plane of the image sensing wafer is close to or equal to the assembly reference plane of the lens assembly relative to the surrounding joint The second assembly tilt angle of the second stacked reference plane. An image capturing module for reducing an assembly tilt angle includes: an image sensing unit, the image sensing unit includes a carrier substrate, and is disposed on the carrier substrate and electrically connected to the carrier substrate Image sensing wafer; a frame housing disposed on the carrier substrate and facing downwardly contacting the image sensing wafer, wherein the image sensing wafer is Surrounding; and an actuator structure disposed on the frame housing and above the image sensing wafer, wherein the actuator structure includes a setting a lens mount on the frame housing and a lens assembly movably disposed in the lens mount and facing downwardly to the frame housing, the interior of the lens mount having a surrounding shape a movable member, the lens assembly is fixed in the surrounding movable member by a fixing colloid, and the lens assembly is movably disposed in the lens carrier through the surrounding movable member; wherein The image sensing wafer, the frame housing and the lens assembly are sequentially stacked upwardly with each other for reducing the assembly tilt angle of the lens assembly relative to the image sensing wafer. The image capturing module for reducing the assembly tilt angle according to claim 5, further comprising: a filter element disposed on the frame housing and located on the image sensing chip Between the lens assembly and the lens assembly, wherein the frame housing has a top opening between the image sensing wafer and the lens assembly, and the top opening of the frame housing is filtered The component is closed, wherein the surrounding movable member of the lens carrier has an inner surrounding screwless surface, and the lens assembly has an outer surrounding screwless surface corresponding to the inner surrounding screwless surface . The image capturing module of claim 6, wherein the top end of the image sensing wafer has a first stacking reference surface, and the frame housing has a first adhesive body to be disposed. a surrounding support portion on the carrier substrate, a surrounding contact portion disposed on the image sensing wafer to directly contact the first stacked reference surface of the image sensing wafer, and a connection a surrounding connecting portion between the surrounding supporting portion and the surrounding contact portion, and a top end of the surrounding connecting portion of the frame housing has a second stacking reference surface, wherein the filter element is disposed Surrounded by the surrounding contact portion and surrounded by the surrounding connecting portion, the lens carrier is disposed on the surrounding connecting portion of the frame housing by a second adhesive body, and the lens An assembly disposed on the surrounding connecting portion to directly contact the surrounding connecting portion The second stacked reference plane is described. The image capturing module of claim 7, wherein the surrounding contact portion of the frame housing is disposed on the first stacking reference surface of the image sensing wafer. Obtaining a first assembly tilt angle of the second stacking reference plane of the surrounding connecting portion with respect to the first stacking reference plane of the image sensing wafer, wherein the lens assembly is disposed at the surrounding connection a second stacking reference surface of the portion to obtain a second assembly tilt angle of an assembly reference plane of the lens assembly relative to the first stacking reference plane of the image sensing wafer, wherein the surrounding connection portion The first assembly tilt angle of the second stacking reference plane relative to the first stacking reference plane of the image sensing wafer is approximately equal to or equal to the assembly reference plane of the lens assembly relative to the surrounding connector The second assembly tilt angle of the second stacked reference plane. An image capturing module for reducing an assembly tilt angle includes: an image sensing unit, the image sensing unit includes a carrier substrate, and is disposed on the carrier substrate and electrically connected to the carrier substrate Image sensing wafer, wherein the top end of the image sensing wafer has a first stacked reference surface; a frame housing disposed on the carrier substrate and surrounding the image sensing wafer, wherein The frame housing has a surrounding support portion disposed on the carrier substrate by a first adhesive body, and the first portion disposed on the image sensing wafer to directly contact the image sensing wafer a surrounding contact portion of the stacked reference surface, and a surrounding connecting portion connected between the surrounding supporting portion and the surrounding contact portion, and a top end of the surrounding connecting portion of the frame housing has a second stacked reference plane; and an actuator structure disposed on the frame housing and above the image sensing wafer, wherein the actuator structure includes a pass In a second adhesive hydrocolloid disposed on the frame housing and a lens holder carrying a lens assembly disposed within said seat of the lens carrier and the lens assembly is provided And disposed on the surrounding connecting portion to directly contact the second stacked reference surface of the surrounding connecting portion. The image capturing module of claim 9, wherein the surrounding contact portion of the frame housing is disposed on the first stacked reference surface of the image sensing wafer. Obtaining a first assembly tilt angle of the second stacking reference plane of the surrounding connection portion with respect to the first stacking reference plane of the image sensing wafer, wherein the lens assembly is disposed at the surrounding connection portion a second stacking reference plane to obtain a second assembly tilt angle of an assembly reference plane of the lens assembly relative to the first stacking reference plane of the image sensing wafer, wherein the surrounding connection portion The first assembly tilt angle of the second stacking reference plane relative to the first stacking reference plane of the image sensing wafer is approximately equal to or equal to the assembly reference plane of the lens assembly relative to the surrounding connector The second assembly tilt angle of the second stacked reference plane is for reducing an assembly tilt angle of the lens assembly relative to the image sensing wafer.