TWI514632B - Package manufacturing process - Google Patents

Description

Packaging process

The present invention relates to a packaging process, and more particularly to a packaging process for laminating a substrate using a stencil and a press mold.

In a conventional light-emitting diode (LED) coating process, a fluorescent material is usually formed on a substrate by dispensing or spraying. The dispensing method is to mix the desired fluorescent material and the polymer adhesive into a fluorescent glue, and inject the fluorescent glue into the cup-shaped LED solid crystal seat by using a dispensing tube. However, the distribution of phosphor powder in the rubber material is not easy to control, and only a single LED component can be processed at the same time, and it is impossible to perform multiple or large-area dispensing. If the spraying method is used, the fluorescent material can be quickly and widely applied to the LED element to increase the productivity, but the required flow rate and the pressure of the spraying must be accurately controlled to effectively control the firefly above and to the side of the LED element. The thickness of the light layer is high, so the accuracy required by the equipment is high, and the yield is not easy to control, resulting in an increase in cost.

The present invention relates to a packaging process for forming a colloid on a substrate using a template and a press mold to improve the disadvantages of conventional coating processes.

According to an aspect of the invention, a packaging process is proposed comprising the following steps. A substrate is provided, the surface of which includes a plurality of die attach regions. Providing a template, The surface includes a plurality of nips, wherein each nip is coincident with each of the die-bonding regions and has a size matching the die-bonding region, and an annular protrusion surrounding the nip, such that a plurality of runners are formed there The annular protrusions are connected to the nips and are connected to each other by a ditch between the two adjacent flow channels. A press mold is provided. The substrate and the template are placed in a press mold. A fluid colloid is provided and the colloid is injected into the flow channels. The colloid is solidified to form a retaining wall structure surrounding the solid crystal region. After that, remove the template.

According to an aspect of the invention, a packaging process is proposed comprising the following steps. A substrate is provided, the surface of which includes a plurality of solid crystal regions, each of which includes a light emitting element. A template is provided, the surface of which includes a plurality of recesses, wherein each recessed portion is equal to the die-bonding region with respect to each of the die-bonding regions, and each of the recessed portions is connected to each other by a ditch and other adjacent recessed portions thereof, A plurality of flow paths are formed. A press mold is provided. The substrate and the template are placed in a press mold such that each of the light emitting elements is placed in the recess. A fluid colloid is provided and the colloid is injected into the flow channels. The colloid is cured to coat each of the light-emitting elements. After that, remove the template.

In order to better understand the above and other aspects of the present invention, the preferred embodiments are described below, and in conjunction with the drawings, the detailed description is as follows:

20‧‧‧上模

30‧‧‧Down

32‧‧‧Jiaodao

34‧‧‧Inlet

36‧‧‧ cavity

40‧‧‧Pusher

100‧‧‧Compression mould

110, 310‧‧‧ substrate

111, 311‧‧‧ surface

112, 312‧‧‧ Gujing District

113‧‧‧First electrode

114‧‧‧Retaining wall structure

115‧‧‧second electrode

116, 316‧‧‧Lighting elements

117‧‧‧ third electrode

118‧‧‧ colloid

119‧‧‧fourth electrode

120, 320‧‧‧ template

121, 321‧‧‧ surface

122‧‧‧First wire

123‧‧‧Second wire

124‧‧‧Stained materials

125‧‧‧Fluorescent materials

126‧‧‧Fluorescent powder

128‧‧‧Packaging materials

130‧‧‧Pressing Department

140‧‧‧ annular protrusion

150‧‧‧ flow path

160‧‧‧ditch

314‧‧‧Bumps

322‧‧‧Wire

324‧‧‧colloid

326‧‧‧Fluorescent materials

330‧‧‧Depression

Figure 1 is a schematic illustration of a press mold applied to a packaging process.

Fig. 2 is a schematic view showing a template used in the press mold of Fig. 1.

3A and 3B respectively show the substrate before forming a colloid and after forming a colloid Schematic diagram.

4 is a schematic diagram of a packaging process in accordance with an embodiment of the present invention.

5A-5D are schematic diagrams showing the packaging of the light-emitting elements, respectively.

Figure 6 is a schematic view showing another template used in the press mold of Figure 1.

7A and 7B are schematic views showing the substrate before and after forming the colloid without forming a colloid.

FIG. 8 is a schematic diagram of a packaging process in accordance with another embodiment of the present invention.

9A to 9B and 10A to 10B are diagrams showing the package of the light-emitting element, respectively.

The packaging process of the present invention utilizes a stencil and a press mold to improve conventional dispensing or painting processes. Since the conventional dispensing device must be used for dispensing on a substrate having a concave cup structure, if the substrate is a flat substrate and there is no concave cup structure (or a retaining wall structure), the dispensing process cannot be performed. Therefore, the colloid in the packaging process of the present invention uses a transfer molding method to form a retaining wall structure around the substrate to form a solid crystal region, and then remove the pressing mold and the template, and then the light emitting element (for example, the light emitting diode) The polar body is placed in the die-bonding zone to facilitate the filling process. Alternatively, the light-emitting element may be first placed in the die-bonding region, and the colloid may be injected into the die-bonding region by a transfer method to coat the respective light-emitting elements. After that, the press mold and the template are removed.

It can be seen that the filling process can be performed on a flat substrate by using the packaging process of the present invention. In addition, during the filling process, the thickness of the fluorescent material can be precisely controlled and the light uniformity is improved, so that the yield is increased and the productivity is increased.

The following is a detailed description of the embodiments, and the examples are only used for The description is not intended to limit the scope of the invention as claimed.

First embodiment

Please refer to FIG. 1 to FIG. 4 , wherein FIG. 1 is a schematic view showing a press mold 100 applied in a packaging process, and FIG. 2 is a schematic view showing a template 120 used in the press mold 100 of FIG. 1 . 3A and 3B are schematic views showing the substrate 110 before the colloid 118 is formed and the colloid 118 is formed, and FIG. 4 is a schematic view showing the encapsulation process according to an embodiment of the invention.

In Fig. 1, the press mold 100 is composed of an upper mold 20 and a lower mold 30. A lower side of the lower mold 30 is provided with a glue path 32 and a pusher 40 for pressing the glue body 118, such as a push rod, to cause the glue body 118 to flow in the glue path 32 of the lower mold 30 and to be injected into the cavity 36. In addition, a substrate 110 and a template 120 are disposed in the cavity 36. The substrate 110 is, for example, a ceramic heat dissipation substrate or a metal core PCB (MCPCB). The template 120 is, for example, a plastic substrate (for example, an FR-4 substrate) for conventional printing.

Referring to FIG. 2 , the surface 121 of the template 120 includes a plurality of nips 130 , a plurality of annular protrusions 140 surrounding the nip 130 , and a plurality of formed between the annular protrusions 140 and the nip 130 . The flow channel 150 and a plurality of trenches 160 are located between the two adjacent flow channels 150. Further, in FIG. 3A, the surface 111 of the substrate 110 includes a plurality of die bonding regions 112. Each nip 130 on the template 120 is opposite to each of the die bonding regions 112 on the substrate 110, and the size of each nip 130 coincides with the size of the die bonding region 112.

The following describes the use of the template 120 and the press mold 100 described above. A flow chart of the colloid 118 is formed on the substrate 110. Referring to FIG. 4, in step 201, a substrate 110, a template 120, and a press mold 100 are provided, and the substrate 110 and the template 120 are placed in the press mold 100. When the upper mold 20 of the press mold 100 covers the lower mold 30, the substrate 110 and the template 120 are stacked on each other and pressed into the cavity 36 for the steps of injection molding and glue.

In step 202, a fluid colloid 118 is provided and the colloid 118 is injected into the flow channels 150. In one embodiment, the fluid colloid 118 is a solid colloid before it is injected into the flow channel 150. The solid colloid is first heat treated to become a fluid, and the fluid can be caused to flow from the glue inlet 34 to the flow passage 150 in the cavity 36 by pressing the ejector 40 of the colloid 118. In order to enable the colloid 118 to smoothly advance along the flow path 150, the pressure of the injection can be reduced by vacuuming in the cavity 36, so that the colloid 118 can sequentially pass through the respective flow passages 150 and the mutual inlets 34. Each of the trenches 160 is connected to each other between two adjacent flow channels 150.

In step 203, the colloid 118 is cured to form a retaining wall structure 114 that surrounds the die attach region 112. The manner in which the colloid 118 is cured is, for example, illuminated or heated. As shown in FIG. 3B, when the template 120 is removed, the photocured or thermally cured colloid 118 can be easily detached from the stencil 120 and fixed to the surface 111 of the substrate 110. Each of the retaining wall structures 114 corresponds to a die bonding region 112 of the substrate 110, so that the planar substrate 110 becomes a package substrate having a concave cup structure.

In the steps 204-208, the packaging process of the embodiment may further include a die bonding step 204, a bonding step 205 or a flip chip bonding step 206, a filling step 207, and a package forming step 208. Please also refer to the 5A~5D map. The package schematic diagram of the light emitting element 116 is shown separately. In FIG. 5A, the solid crystal step 204 is disposed in a die attach region 112 of the substrate 110 and surrounds the periphery of the light emitting device 116 with the barrier structure 114. The light emitting device 116 includes a first electrode 113 and a second electrode 115, and the substrate 110 includes a third electrode 117 and a fourth electrode 119. The first electrode 113 corresponds to the third electrode 117, and the second electrode 115 corresponds to the fourth electrode 119. In FIG. 5B, the wire bonding step 205 forms a first wire 122 across the retaining wall structure 114, electrically connecting the first electrode 113 and the third electrode 117, and forming a second spanning the retaining wall structure 114. The wire 123 electrically connects the second electrode 115 and the fourth electrode 119.

In addition to the wire bonding step 205, the present invention may be embodied by the flip chip bonding step 206 instead of the wire bonding step.

In FIG. 5C, the dispensing step 207 is filled with a phosphor material 125, such as a gel material (polymer adhesive) 124 containing phosphor powder 126, in the die bonding region 112 surrounded by the retaining wall structure 114. The phosphor material 125 is made to have a predetermined thickness with respect to the light emitting element 116. In one embodiment, the manner in which the phosphor material 125 is filled includes dispensing or spraying. Preferably, the fluorescent glue is injected by the dispensing method to uniformly disperse the fluorescent powder 126 in the rubber 124. The fluorescent powder 126 can uniformly cover the upper surface and the side surface of the light-emitting element 116, thereby controlling the light uniformity.

Next, in FIG. 5D, the package forming step is to form a package material 128 on the substrate 110, and the package material 128 covers at least the light-emitting element 116 electrically connected to the substrate 110 and the surrounding wall structure 114. In one embodiment, the encapsulation material 128 may be a light transmissive polymer material and formed by a lens. In the step, the encapsulating material 128 is formed into a geometric lens, such as a semi-circular convex lens, but the invention is not limited thereto.

Second embodiment

Please refer to FIGS. 6-8 , wherein FIG. 6 is a schematic view showing another template 320 used in the press mold 100 of FIG. 1 . 7A and 7B are schematic views showing the substrate 310 before the colloid 324 is formed and after forming the colloid 324, and FIG. 8 is a schematic view showing the encapsulation process according to another embodiment of the present invention.

The template 320 of the present embodiment is different from the template 120 of the first embodiment in that the surface 321 of the template 320 includes a plurality of recesses 330. Each recess 330 on the template 320 is opposite to each of the die attach regions 312 on the substrate 310, and the size of each recess 330 coincides with the size of the die attach region 312. In addition, each of the recesses 330 is connected to each other by a trench 340 and other recesses 330 adjacent thereto to form a plurality of runners 350.

In addition, referring to FIG. 7A, each of the die bonding regions 312 of the substrate 310 includes a light emitting element 316 electrically connected to the substrate 310 by wire bonding or flip chip bonding. As shown in FIGS. 9A and 10A, the electrodes of the light-emitting element 316 are electrically connected to the substrate 310 by two bumps 314, or the electrodes of the light-emitting element 316 are electrically connected to the substrate 310 by two wires 322.

A flow chart for forming the colloid 324 on a substrate 310 using the template 320 and the press mold 100 described above will be described below. Referring to FIG. 8, in step 401, a substrate 310, a template 320, and a press mold 100 are provided, and the substrate 310 and the template 320 are placed in the press mold 100. When pressing the mold 100 When the upper mold 20 covers the lower mold 30, the substrate 310 and the template 320 are stacked on each other and pressed into the cavity 36 for the steps of injection molding and glue.

In step 402, a fluid colloid 324 is provided and a colloid 324 is injected into the flow channels 350. In one embodiment, the fluid colloid 324 is a solid colloid before it is injected into the flow channel 350. The solid colloid is first heat treated to become a fluid, and the fluid can be caused to flow from the glue inlet 34 to the flow passage 350 in the cavity 36 by the pusher 40 of the extrusion colloid 324. In order to enable the colloid 324 to smoothly advance along the flow path 350, the pressure of the injection can be reduced by vacuuming in the cavity 36, so that the colloid 324 can pass through the respective flow passages 350 sequentially through the glue inlet 34.

In step 403, the colloid 324 is cured to coat each of the light-emitting elements 316. As shown in FIGS. 9B and 10B, the colloid 324 can cover the light-emitting element 316 electrically connected to the substrate 310. The manner in which the colloid 324 is cured is either illumination or heating. As shown in FIG. 7B, when the template 320 is removed, the photocured or thermally cured colloid 324 can be easily detached from the template 320 and fixed to the surface 311 of the substrate 310.

In one embodiment, when the phosphor 324 contains a fluorescent material 326, the fluorescent material 326 can enter the cavity 36 along with the flowing colloid 324 and coat each of the light-emitting elements 316, so that multiple The light-emitting element 316 is filled to increase productivity. In this embodiment, the colloid 324 containing the fluorescent material 326 is injected into the mold to uniformly disperse the fluorescent material 326 in the colloid 324. The fluorescent material 326 can uniformly cover the upper surface and the side surface of the light-emitting element 316, thereby controlling the light uniformity.

In addition, the package forming step 208 in the first embodiment can also be applied in the embodiment, and the light-emitting element 316 and the colloid are covered with a sealing material 128. 324. The encapsulating material 128 is, for example, a semi-circular convex lens, but the invention is not limited thereto.

In conclusion, the present invention has been disclosed in the above preferred embodiments, and is not intended to limit the present invention. A person skilled in the art can make various changes and modifications without departing from the spirit and scope of the invention. Therefore, the scope of the invention is defined by the scope of the appended claims.

110‧‧‧Substrate

111‧‧‧ surface

112‧‧‧ Gujing District

114‧‧‧Retaining wall structure

Claims (11)

A packaging process comprising: providing a substrate having a surface comprising a plurality of die bonding regions; providing a template having a surface including a plurality of nips, wherein each nip is dimensioned relative to each of the die bonding regions The regions are coincident, and an annular protrusion surrounding the nip portion is formed such that a plurality of flow passages are formed between the annular projection portion and the nip portions, and the two adjacent ones are located a ditch between the flow passages to be connected to each other; a pressing mold is provided; the substrate and the template are placed in the pressing mold; a fluid colloid is provided, and the colloid is injected into the flow channels; curing The colloid forms a retaining wall structure surrounding the die attaching region; and removing the template. The encapsulation process described in claim 1 further comprises the step of forming the fluid colloid before injecting the colloid into the flow channels, wherein the step of heating the solid colloid is a fluid, and pressing the same a fluid that causes the fluid to flow toward the flow channels. The encapsulation process of claim 1, after the template is removed, further comprising a solid crystal step, wherein the step of disposing a light-emitting element in the die-bonding region, and the retaining wall structure surrounds the The periphery of the light-emitting element. The illuminating device includes a first and a second electrode, the substrate includes a third and fourth electrodes, wherein the first and third electrodes are electrically connected, and the The second and fourth electrodes are electrically connected. The packaging process of claim 4, further comprising a first-line step of forming a first wire across the retaining wall structure to electrically connect the first and third electrodes, and a spanning The second wire of the retaining wall structure electrically connects the second and fourth electrodes. The packaging process as described in claim 3, further comprising a filling step of filling a fluorescent material in the solid crystal region surrounded by the retaining wall structure, so that the fluorescent material is opposite to the fluorescent material The light emitting element has a predetermined thickness. The packaging process described in claim 6 wherein the step of filling the fluorescent material is achieved by spraying or dispensing. The encapsulation process of claim 1, wherein the step of curing the colloid is achieved by illumination or heating. The packaging process of claim 4, further comprising a package forming step of forming a package material on the substrate, and the package material covers at least the light-emitting element and the retaining wall structure. The packaging process of claim 9, further comprising a lens forming step of forming the encapsulating material into a geometric lens. The lens is semi-circular as in the packaging process described in claim 10 of the patent application.