TWI513840B - Production method of multilayer film - Google Patents

Description

Mass production method of multilayer film

The present invention relates to a method for mass production of a film, and more particularly to a method for mass production of a multilayer film.

In the thin film process, the mass production equipment generally used for plating a multilayer film on the surface of the object to be plated is mostly completed by a coating production line. The coating production line is arranged in a sequence along a front buffer zone in the same vacuum chamber, a plurality of coating zones containing different targets, and a rear buffer zone, and the coating production line further comprises a carrier. When the coating production line of the mass production equipment performs a mass production method of a batch of the multilayer film to be plated, the waiting plate is sequentially sent into the coating production line by the carrier to sequentially pass through the coating production line. The coating process is performed between the front buffer regions and the coating sections, and the coating process of each coating section is completed to form a total thickness of about several tens of nanometers (nm) to several tens of micrometers on each of the objects to be plated. After the (μm) multilayer film is removed from the back buffer zone of the coating line, a complete batch of finished products coated with the respective multilayer films can be obtained.

At present, the mass production method of the above multilayer film can produce a finished product of the entire batch of the multilayer film. However, it should be noted that in the mass production process, in order to uniformly plate the multilayer films, the waiting plating is carried out in each coating interval. Each coating process needs to be displaced multiple times under the target of each coating section. However, since the position below the target of each coating section belongs to a plasma zone; therefore, in the coating process for each multilayer film having a thickness of several tens of nanometers to several tens of micrometers, the waiting plating material will be long Exposure to each plasma zone gives rise to overheating problems. Once the waiting plating material is composed of a heat-resistant material, the waiting plating material is also deformed by the aforementioned overheating problem, so that the coating quality of the finished product is lowered.

Moreover, the above coating production line is also hindered by the limitation of the mass production equipment, and the carrier can only make a single object to be plated in the batch to be plated after the coating process of each coating section is completed to produce the finished product. In order to reload the next object to be plated. Therefore, the coating section where the coating process is not performed is left idle, and the mass production efficiency is ineffective and the time cost is increased.

According to the above description, under the premise of solving the problem of overheating of the object to be plated, it is a difficult problem for the relevant technical personnel in the technical field to find out how to use each coating section more efficiently to improve the mass production efficiency.

Accordingly, it is an object of the present invention to provide a method of mass production of a multilayer film.

Therefore, the mass production method of the multilayer film of the present invention is to carry out a multi-coating process for a plurality of materials to be plated, which comprises the following steps in sequence: one step (a), one step (b), one step (c) , a step (d), and a step (e).

The step (a) is to provide a coating production line having (n+1) buffer zones, n coating zones and a plurality of carriers, wherein the buffer zones and the coating zones are arranged in turn along an arrangement direction. a vacuum chamber, n ≧ 2 is a positive integer.

In the step (b), the first carrier placed with the first object to be plated is loaded between the first buffer or the second buffer of the coating line.

The step (c) is to perform the first coating process in the first coating zone to form a first film layer on the first object to be plated, in the first and second buffers. The interval is shifted at least once between the two.

The step (d) is to place the first carrier between the second buffer or the third buffer, and simultaneously load the second buffer between the first buffer or the second buffer of the coating line. The second carrier to be plated, but conditionally, when the second carrier is located between the second buffer, the first carrier is located between the third buffer.

The step (e) is to simultaneously perform the first coating process and the second coating process in the first coating zone and the second coating zone respectively for the second carrier and the first carrier, respectively. When the first film layer and the second film layer are formed on the two objects to be plated and the first object to be plated, respectively, the first and second buffers are respectively separated from the second and third buffers. The interval is shifted at least once, but conditionally, when the second carrier is located between the second buffer, the first carrier is located between the third buffer.

The effect of the invention is that the buffer zone and the coating zone arranged in turn in the coating production line are combined with the carriers to simultaneously enter the corresponding coating zones to perform each coating process, which is in each coating zone. The displacement between the two adjacent buffers enables each coating process to be performed simultaneously in each coating section and does not exhibit an idle state, so as to effectively utilize each plating. The membrane section improves the utilization rate of the coating line and increases the production capacity.

1‧‧‧vacuum chamber

2‧‧‧ inlet valve

3‧‧‧Export valve

41‧‧‧The first buffer zone

42‧‧‧Between the second buffer zone

43‧‧‧The third buffer zone

44‧‧‧The fourth buffer zone

51‧‧‧First coating interval

52‧‧‧Second coating interval

53‧‧‧The third coating interval

61‧‧‧First vehicle

62‧‧‧Second vehicle

63‧‧‧ third vehicle

64‧‧‧fourth vehicle

7‧‧‧Transportation agency

71‧‧‧Roller set

72‧‧‧Servo motor

8‧‧‧Automatic reflow unit

81‧‧‧Loading the cavity

82‧‧‧Loading cavity

83‧‧‧Return agency

831‧‧‧Settlement

832‧‧‧lifting section

833‧‧‧ hop

X‧‧‧Orientation

Other features and effects of the present invention will be apparent from the following description of the drawings, wherein: Figure 1 is a schematic diagram illustrating a step (c) of an embodiment of the method for mass production of the multilayer film of the present invention. The first carrier is displaced between the first and second buffers of the coating line for performing the first coating process; FIG. 2 is a schematic diagram illustrating the second of the step (e) of the embodiment. The first carrier is respectively displaced between the first, second and second and third buffers to perform the first and second coating processes respectively; FIG. 3 is a schematic diagram illustrating one of the steps of the embodiment ( g) The third, second and first carriers are respectively displaced between the first, second, second, third and third and fourth buffers to perform the first and second respectively The third coating process; FIG. 4 is a schematic view showing that the first carrier of the embodiment is transferred to an inlet valve of the coating production line through a returning mechanism in an automatic reflow unit after completing each coating process. .

Before the present invention is described in detail, it should be noted that in the following description, similar elements are denoted by the same reference numerals.

Referring to FIG. 1, FIG. 2, FIG. 3 and FIG. 4, an embodiment of the mass production method of the multilayer film of the present invention is used for performing a plurality of coating processes for a plurality of materials to be plated (not shown), and The plating object is plated with a multilayer film (not shown) Finished product. The finished product may be, for example, an optical lens whose surface is plated with an optical coating or a semiconductor package wafer whose surface is plated with a metal plating. The embodiment of the present invention comprises the following steps: a step (a), a step (b), a step (c), a step (d), a step (e), a step (f), and a step (g). ).

This step (a) is to provide a coating line as shown in FIG. Specifically, the coating line has (n+1) buffer zones 41, 42, 43, 44, n coating sections 51, 52, 53 and a plurality of carriers 61, 62, 63, 64. The buffer zones 41, 42, 43, 44 and the coating sections 51, 52, and 53 are sequentially disposed in a vacuum chamber 1 in an array direction X, n ≧ 2 and are positive integers.

The coating production line further has an inlet valve 2, an outlet valve 3 respectively disposed at opposite ends of the vacuum chamber 1, and a continuous arrangement in the buffer zones 41, 42, 43, 44 and the coating sections 51, 52, 53 and a transport mechanism 7 for transporting the carriers 61, 62, 63, 64, and a return of the carriers 61, 62, 63, 64 from the outlet valve 3 to the inlet valve 2 Automatic reflow unit 8. The automatic reflow unit 8 includes a loading chamber 81 that connects the outlet valve 3, a loading chamber 82 that engages the inlet valve 2, and a return mechanism that is coupled between the loading chamber 81 and the loading chamber 82. 83. The return mechanism 83 has a pair of settling sections 831 to be provided by the loading chamber 81, a pair of lifting sections 832 to be placed in the loading chamber 82, and a hop section 833 connecting the settling section 831 and the lifting section 832. . In this embodiment of the invention, n = 3; the number of the carriers 61, 62, 63, 64 is four or more.

The following is for convenience of explanation, along the row from the inlet valve 2 Column direction X to the outlet valve 3, it is intended to name the buffer zones 41, 42, 43, 44 and the coating zones 51, 52, 53 respectively, the first buffer zone 41, the first coating zone 51, a second buffer zone 42, a second coating zone 52, a third buffer zone 43, a third coating zone 53, and a fourth buffer zone 44, and the carriers 61, 62, 63, 64 are The order is named as the first carrier 61, the second carrier 62, the third carrier 63, and the fourth carrier 64.

Each of the coating sections 51, 52, and 53 of the step (a) includes at least one coating section, and the coating sections respectively perform a coating process by using a target material, which is made of different materials or the same material. Composition. In this embodiment of the invention, the number of coating sections of the first, second and third coating sections 51, 52, 53 is two, one and two, respectively; in addition, the two of the first coating section 51 The target of the coating section (hereinafter referred to as the front coating section and the rear coating section) is sequentially composed of stainless steel (SUS) and copper (Cu) along the alignment direction X, and the coating section of the second coating section 52 is The target is made of copper, and the targets of the two coating sections (hereinafter referred to as the front coating section and the rear coating section) of the third coating section 53 are made of copper and stainless steel along the alignment direction X.

Referring again to Figure 1, step (b) is to load the first carrier 61 in which the first object to be plated is placed in the first buffer zone 41 or the second buffer zone 42 of the coating line. The step (c) is after the step (b), the first carrier 61 is subjected to the first coating process in the first coating section 51 to form a first film layer on the first object to be plated. Is displaced at least once between the first and second buffers 41, 42. This embodiment of the invention In the step (b), the first buffer zone 42 in which the first object to be plated is placed is loaded in the first buffer zone 42 of the coating line; in the step (c), the first coating film is first opened. The target (SUS) power supply of the coating section before the interval 51 causes the first carrier 61 to be displaced 5 times between the first and second buffer zones 41, 42 and closes the coating section before the first coating section 51. The target (SUS) power supply and the target (Cu) power supply of the post-coating section is turned on, so that the first carrier 61 continues to be displaced 20 times between the first and second buffer zones 41, 42 to complete the The first coating procedure of step (c). In detail, the first carrier 61 of the step (c) is displaced 25 times between the first and second buffer zones 41 and 42 when the first coating process is performed in the first coating section 51. And the foregoing number of shifts refers to the first carrier 61 being defined as the displacement for the first time from the first buffer 41 to the second buffer, and returning to the first buffer from the second buffer 42 The interval 41 is called the displacement for the second time, and so on.

Referring to FIG. 2, the step (d) is after the step (c), the first carrier 61 is located between the second buffer zone 42 or the third buffer zone 43 and simultaneously at the first of the coating production line. The buffer zone 41 or the second buffer zone 42 loads the second carrier 62 on which the second object to be plated is placed; but conditionally, when the second carrier 62 is located between the second buffer zone 42, The first carrier 61 is located between the third buffer zone 43.

Referring to FIG. 2, the step (e) is after the step (d), and the second carrier 62 and the first carrier 61 are respectively disposed in the first coating section 51 and the second coating section 52. Performing a first coating process and a second coating process to respectively be on the second object to be plated and the first object to be plated When the first film layer and the second film layer are formed, they are displaced at least once between the first and second buffer zones 41, 42 and the second and third buffer zones 42, 43 respectively; Conditionally, when the second carrier 62 is located between the second buffers 42, the first carrier 61 is located between the third buffers 43.

In this embodiment of the invention, the step (d) is such that the first carrier 61 is located between the second buffers 42 and simultaneously loaded with the second buffer 41 in the first buffer of the coating line. a second carrier 62 of the plating; the step (e) is a target (SUS) power supply of the coating section and a coating section of the coating section of the second coating section 52 before the first coating section 51 is simultaneously opened. After the (Cu) power supply, the second carrier 62 and the first carrier 61 are respectively displaced between the first and second buffer zones 41, 42 and the second and third buffer zones 42, 43 respectively. After 5 times, the target (SUS) power supply of the coating section before the first coating section 51 is turned off and the target (Cu) power supply of the subsequent coating section is turned on, and the second carrier 62 and the first carrier 61 are continued. Displacement between the first and second buffers 41, 42 and the second and third buffers 42 and 43 respectively to complete the first coating process and the second step of the step (e), respectively. In addition, the second carrier 62 and the first carrier 61 of the step (e) perform the first in the first coating section 51 and the second coating section 52, respectively. The coating process is the same as the second coating process, with the same number of shifts (25 times) and the same rate of displacement.

Referring to FIG. 3, the step (f) is after the step (e), the first carrier 61 is placed between the third buffer zone 43 or the fourth buffer zone 44. At the same time, the second carrier 62 is located between the second buffer zone 42 or the third buffer zone 43 and simultaneously loaded in the first buffer zone 41 or the second buffer zone 42 of the coating production line. a third carrier 63 to be plated; but conditionally, when the third carrier 63 is located between the second buffers 42, the second carrier 62 is located between the third buffers 43 and The first carrier 61 is located between the fourth buffer zone 44.

Referring to FIG. 3 again, the step (g) is after the step (f), and the third carrier 63, the second carrier 62 and the first carrier 61 are respectively in the first coating section 51, The first coating section 52 and the third coating section 53 perform the first coating process, the second coating process and the third coating process to respectively be on the third object to be plated, and the second object to be plated When the first film layer, the second film layer and the third layer film are formed on the first object to be plated, the film is simultaneously between the first and second buffer zones 41 and 42 respectively. 2. The displacement between the three buffers 42 and 43 and the third and fourth buffers 43 and 44 is at least once; but conditionally, when the third carrier 63 is located between the second buffers 42 The second carrier 62 is located between the third buffer zone 43 and the first carrier 61 is located between the fourth buffer zone 44.

In this embodiment of the invention, the step (f) is such that the first carrier 61 is located in the third buffer zone 43, and at the same time the second carrier 62 is located in the second buffer zone 42, and at the same time The first buffer zone 41 of the coating line is loaded with the third carrier 63 on which the third object to be plated is placed; this step (g) is the target of the coating section before the first coating zone 51 is simultaneously opened ( SUS) power supply, target of the coating section of the second coating section 52 (Cu) After the power source and the target (Cu) power supply of the coating section before the third coating section 53, the third carrier 63, the second carrier 62 and the first carrier 61 are respectively disposed between the first and second buffers. After 41, 42 between the second and third buffer zones 42, 43 and the third and fourth buffer zones 43 and 44, the coating section is closed before the first coating section 51 is closed. The target (Cu) power supply and the target (Cu) power supply of the coating section before the third coating section 53 and after the first coating section 51 is opened, the target (Cu) power supply of the coating section and the third coating section 53 are The target (SUS) power supply of the coating section continues to cause the third carrier 63, the second carrier 62 and the first carrier 61 to be respectively between the first and second buffer zones 41, 42 and the second And shifting between the three buffers 42 and 43 and the third and fourth buffers 43 and 44 to complete the first coating process and the second coating process of the step (g), respectively. a third coating process; further, the third carrier 63, the second carrier 62 and the first carrier 61 of the step (g) are respectively in the first coating section 51, the second The coating time 52 and the third coating section 53 are the same in the first coating process, the second coating process and the third coating process, and the number of displacements is the same (25 times), and The rate of displacement is the same.

As can be seen from the above paragraphs, the first object to be plated placed on the first carrier 61 sequentially finishes the first, second and third coating processes, and then becomes plated 75 times. The first finished product covered with the first film layer, the second film layer and the third film layer.

As shown in FIG. 4, the fourth carrier 64, the third carrier 63, and the second carrier 62 are simultaneously divided by the same execution conditions as the foregoing steps. Except in the first coating section 51, the second coating section 52 and the third coating section 53, the first coating procedure, the second coating procedure and the third coating procedure are performed to respectively treat the fourth coating Forming the first film layer, the second film layer and the third layer film on the plating object, the third object to be plated and the second object to be plated, respectively, at the same time as the first and the second Between the buffers 41, 42 and between the second and third buffers 42, 43 and the third and fourth buffers 43 and 44 are shifted 25 times, respectively, which are executed in the first and second The third coating process takes the same amount of time and the rate of displacement is the same. And so on, when the second object to be plated placed on the second carrier 62 sequentially ends the first, second, and third coating processes, the plate is displaced 75 times. A second finished product of a film layer, a second film layer and a third film layer.

It should be noted here (see FIG. 4 again) that the first finished product placed on the first carrier 61 enters the loading chamber 81 through the outlet valve 3, and is then taken through a mechanical arm or manually. The first finished product. At this time, a compression type lifting unit (not shown) disposed in the loading chamber 81 causes the first carrier 61 not placed with any object to be plated to descend to the settling section 831 to pass through the returning mechanism 83. The first carrier 61, which is not placed with any object to be plated, is returned to the lift section 822 through the hop section 833, and then passes through a compression type lifting unit disposed in the lift section 832 (not shown). The first carrier 61, which is not placed with any object to be plated, is raised to the loading chamber 82 to continue to place the fifth object to be plated on the first carrier 61 through a robotic arm or manually.

A similar process is repeated continuously, with the object to be plated The first carrier 61, the second carrier 62, the third carrier 63, and the fourth carrier 64 are continuously synchronized and simultaneously enter the predetermined entering coating sections, respectively, by the respective carriers 63, 62, 61 carrying each of the materials to be plated while completing each coating process, and after performing each coating process, the carriers 64, 63, 62 are pre-entered into the buffer zone 41, 42, 43 before performing the next coating process. The next coating process is used to further continue the next coating process for each object to be plated. Therefore, it is possible to produce a finished product having the same film thickness in the correct batch amount without completely idling the entire coating production line.

It should be noted that, in this embodiment of the present invention, the transmission unit 7 includes seven sets of roller sets 71 respectively corresponding to the buffer zones 41, 42, 43, 44 and the coating sections 51, 52, 53. And seven servo motors 72 that independently drive the roller sets 71. In a specific implementation, the third, second and first carriers 63, 62, 61 are correspondingly arranged in the first, second and third buffer zones 41, 42, 43 At 71, the driving speed and the direction of rotation of the servomotors 72 are simultaneously controlled to drive the roller sets 71 to roll and drive the carriers 63, 62, 61 to reciprocately move.

As can be seen from the above description, the mass production method of the multilayer film of the present invention is through the arrangement relationship of the coating zones 51, 52, 53 and the buffer zones 41, 42, 43, 44, and the vehicles 61, 62, 63, 64, the operating relationship of the transport mechanism 7 and the automatic reflow unit 8, whereby the third, second and first carriers 63, 62, 61 are continuously in the respective coating sections 51, 52, 53 When each coating process is executed, it is reciprocally displaced in the buffer zones 41, 42, 43, and 44, respectively. On the one hand, it can avoid the prior art in the coating system. In the process, the waiting for the plating material is exposed to the overheating problem caused by the plasma region under the target of each coating zone for a long time; on the other hand, the buffer zones 41, 42, 43, 44 and the coating are used. The arrangement relationship of the sections 51, 52, and 53 is matched with the design of the carriers 64, 63, 62, 61, the transmission mechanism 7, and the automatic reflow unit 8, so that the carriers 64, 63 carrying the objects to be plated, 62 can simultaneously and simultaneously perform each coating process in each coating section 51, 52, 53, so that the overall coating production can form a smooth and uninterrupted circulation production line, and no coating section 51, 52, 53 is idle, and Maximize capacity benefits.

It should be particularly noted that the coating production line demonstrated in the above embodiment is described by taking only four buffer zones 41, 42, 43, 44 and three coating sections 51, 52, and 53 as an example. However, in essence, the number of buffer zones and coating zones in the coating line of the mass production method of the multilayer film of the present invention can be expanded upward. Briefly, the number of coating zones, the number of buffers, and the number of carriers used in the coating line used in the mass production method of the present invention are (n+1), n and (n, respectively. +1) or more. According to the detailed description of the above embodiment of the present invention, when the number of coating sections is expanded to four, it is necessary to match a sufficient number of carriers to avoid the coating section being idle; therefore, the number of carriers must be four at this time. Or more than four.

Further, it should be further added here that the detailed description of the embodiment of the present invention is performed under the condition that the number of displacements, the displacement time, and the displacement rate of the respective carriers 61, 62, 63 are the simplest (all the same). Of course, as long as each carrier 63, 62, 61 is properly adjusted to perform each coating process The number of displacements, the output power of the target of each of the coating sections 51, 52, and 53 are adjusted, or the waiting time of each of the carriers 63, 62, and 61 between the buffer zones 41, 42, and 43 is considered, even for each carrier 63, 62, 61 can also cause the carriers 63, 62, 61 to simultaneously and synchronously execute the next coating process in the case where the number of displacements is different when each coating section 51, 52, 53 performs each coating process. And let the coating production line fully operate, there will be no problems such as idleness of the coating zone and waste of resources.

In summary, the mass production method of the multilayer film of the present invention can avoid the overheating problem caused by the prior art in the coating process due to prolonged exposure to the respective plasma regions in the coating process; The carriers 63, 62, and 61 on which the objects to be plated are placed can simultaneously and simultaneously perform the coating processes in the respective coating sections 51, 52, and 53 to form a smooth and uninterrupted cycle production line without any coating. Since the sections 51, 52, and 53 are idle to maximize the productivity benefit, the object of the present invention can be achieved.

However, the above is only the embodiment of the present invention, and the scope of the present invention is not limited thereto, that is, the simple equivalent changes and modifications made by the patent application scope and the patent specification of the present invention are still It is within the scope of the patent of the present invention.

1‧‧‧vacuum chamber

2‧‧‧ inlet valve

3‧‧‧Export valve

41‧‧‧The first buffer zone

42‧‧‧Between the second buffer zone

43‧‧‧The third buffer zone

44‧‧‧The fourth buffer zone

51‧‧‧First coating interval

52‧‧‧Second coating interval

53‧‧‧The third coating interval

61‧‧‧First vehicle

62‧‧‧Second vehicle

63‧‧‧ third vehicle

64‧‧‧fourth vehicle

7‧‧‧Transportation agency

71‧‧‧Roller set

72‧‧‧Servo motor

8‧‧‧Automatic reflow unit

81‧‧‧Loading the cavity

82‧‧‧Loading cavity

83‧‧‧Return agency

831‧‧‧Settlement

832‧‧‧lifting section

833‧‧‧ hop

X‧‧‧Orientation

Claims (10)

A method for mass production of a multilayer film is to perform a plurality of coating processes for a plurality of materials to be plated, comprising the following steps: a step (a), providing a (n+1) buffer zone, n coating zones and a coating production line of a plurality of carriers, wherein the buffer zones and the coating sections are sequentially arranged in a vacuum direction in an arrangement direction, n≧2 and being a positive integer; a step (b) in the coating production line Loading the first carrier with the first object to be plated between the first buffer or the second buffer; in step (c), after the step (b), the first carrier is in the first Performing a first coating process in a coating section to form a first film layer on the first object to be plated, at least once between the first and second buffer zones; a step (d), After the step (c), the first carrier is placed between the second buffer or the third buffer, and is loaded between the first buffer or the second buffer of the coating line. Two second carriers to be plated, but conditionally, when the second carrier is in the second In the interval, the first carrier is located between the third buffer; and a step (e), after the step (d), the second carrier and the first carrier are respectively in the first Performing a first coating process and a second coating process in the coating section and the second coating section to form the first film layer and the first coating object on the second object to be plated The second film layer is displaced at least once between the first and second buffers and between the second and third buffers, respectively, but conditionally, when the second carrier is located in the second When there is a buffer, the first carrier is located between the third buffer. The method for mass production of the multilayer film according to claim 1, further comprising a step (f) and a step (g), wherein n=3, wherein the step (f), after the step (e), The first carrier is located between the third buffer or the fourth buffer, and at the same time the second carrier is located between the second buffer or the third buffer, and at the same time the first buffer of the coating line The third carrier placed with the third object to be plated is loaded between the interval or the second buffer, but conditionally, when the third carrier is located between the second buffer, the second carrier is Located between the third buffer, and the first carrier is located between the fourth buffer; and the step (g), after the step (f), the third carrier and the second carrier are simultaneously The first carrier performs the first coating process, the second coating process and the third coating process in the first coating zone, the second coating zone and the third coating zone, respectively, to respectively be in the third Forming the first film layer, the second film layer and a third layer film on the object to be plated, on the second object to be plated and on the first object to be plated At the same time, it is displaced at least once between the first and second buffers, between the second and third buffers, and between the third and fourth buffers, but conditionally, when When the three carriers are in the second buffer, the second carrier is located between the third buffer and the first carrier is located between the fourth buffer. The method for mass production of a multilayer film according to claim 2, wherein the step (b) is to load a first carrier placed with the first object to be plated between the first buffers of the coating line; In the step (d), the first carrier is placed between the second buffers, and a second carrier placed with the second object to be plated is loaded between the first buffers of the coating line. The method for mass production of a multilayer film according to claim 3, wherein the step (f) is such that the first carrier is located between the third buffers and the second carrier is located between the second buffers. At the same time, a third carrier placed with the third object to be plated is loaded between the first buffers of the coating line. The method for mass production of a multilayer film according to claim 1, wherein the second carrier and the first carrier of the step (e) perform the first in the first coating interval and the second coating interval, respectively. The coating process is the same as the time required for the second coating process. The mass production method of the multilayer film according to claim 5, wherein the second carrier and the first carrier of the step (e) are respectively between the first and the second buffers and the second The number of shifts between the three buffers is the same, and the rate of displacement is the same. The method for mass production of a multilayer film according to claim 2, wherein the third carrier, the second carrier and the first carrier of the step (g) are respectively in the first coating zone and the second The time taken to perform the first coating process, the second coating process, and the third coating process in the coating zone and the third coating zone is the same. The method for mass production of a multilayer film according to claim 7, wherein the step (g) The third carrier, the second carrier and the first carrier are respectively between the first and second buffers, between the second and third buffers, and between the third and fourth buffers. The number of displacements is the same, and the rate of displacement is the same. The method for mass production of a multilayer film according to any one of claims 1 to 8, wherein each of the coating sections of the step (a) comprises at least one coating section, and the coating sections are respectively a target. Each coating process is performed, and the targets are composed of different materials or the same material. The method for mass production of a multilayer film according to any one of claims 1 to 8, wherein the coating production line of the step (a) further has an inlet valve disposed at opposite ends of the vacuum chamber, An outlet valve, a transport mechanism continuously disposed between the buffer zones and the coating zones for transporting the carriers, and an automatic reflow unit for returning the carriers from the outlet valve to the inlet valve, The automatic reflow unit includes a loading chamber that connects the outlet valve, a loading chamber that engages the inlet valve, and a return mechanism that is coupled between the loading chamber and the loading chamber. The returning mechanism has a corresponding A settling section provided by the loading chamber, a pair of lifting sections to be loaded into the chamber, and a hop connecting the settling section and the lifting section.