TWI503923B - - Google Patents

Info

Publication number: TWI503923B
Authority: TW; Taiwan

Application number

TW102130662A

Other languages

Other versions

TW201419442A (en

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

2012-08-28

Filing date

2013-08-27

Publication date

2015-10-11

2013-08-27 Application filed filed Critical

2014-05-16 Publication of TW201419442A publication Critical patent/TW201419442A/en

2015-10-11 Application granted granted Critical

2015-10-11 Publication of TWI503923B publication Critical patent/TWI503923B/zh

Classifications

- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
- H01L21/6833—Details of electrostatic chucks

Landscapes

Engineering & Computer Science (AREA)
Physics & Mathematics (AREA)
Condensed Matter Physics & Semiconductors (AREA)
General Physics & Mathematics (AREA)
Manufacturing & Machinery (AREA)
Computer Hardware Design (AREA)
Microelectronics & Electronic Packaging (AREA)
Power Engineering (AREA)
Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

TW102130662A 2012-08-28 2013-08-27 Electrostatic chuck TW201419442A (en)

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
CN201210310949.2A CN103633003B (en)	2012-08-28	2012-08-28	A kind of electrostatic chuck

Publications (2)

Publication Number	Publication Date
TW201419442A TW201419442A (en)	2014-05-16
TWI503923B true TWI503923B (en)	2015-10-11

Family

ID=50213888

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
TW102130662A TW201419442A (en)	2012-08-28	2013-08-27	Electrostatic chuck

Country Status (2)

Country	Link
CN (1)	CN103633003B (en)
TW (1)	TW201419442A (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
CN104952682A (en) *	2014-03-25	2015-09-30	中微半导体设备(上海)有限公司	Plasma treatment chamber and base station thereof
KR20190114216A (en) *	2018-03-29	2019-10-10	어플라이드 머티어리얼스, 인코포레이티드	Electrostatic Chuck and Substrate Processing Apparatus
CN110911332B (en) *	2018-09-14	2022-11-25	北京北方华创微电子装备有限公司	Electrostatic chuck
CN112289732B (en) *	2020-10-19	2022-11-08	Tcl华星光电技术有限公司	Substrate processing apparatus
TWI796780B (en) *	2021-09-07	2023-03-21	南韓商自適應等離子體技術公司	An electrostatic chuck with multi heating areas

Citations (3)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
TW546984B (en) *	2001-05-02	2003-08-11	Saint Gobain Ceramics	Ceramic heater with heater element and method for use thereof
TW200822281A (en) *	2006-08-29	2008-05-16	Lam Res Corp	Method of tuning thermal conductivity of electrostatic chuck support assembly
TW201138019A (en) *	2010-03-24	2011-11-01	Toto Ltd	Electrostatic chuck

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JP3980187B2 (en) *	1998-07-24	2007-09-26	日本碍子株式会社	Semiconductor holding device, its manufacturing method and its use
JP2001144167A (en) *	1999-11-12	2001-05-25	Ngk Insulators Ltd	Semiconductor holder
JP2008205415A (en) *	2007-02-16	2008-09-04	Creative Technology:Kk	Electrostatic chuck
JP2009152475A (en) *	2007-12-21	2009-07-09	Shinko Electric Ind Co Ltd	Substrate temperature adjusting-fixing device
US8637794B2 (en) *	2009-10-21	2014-01-28	Lam Research Corporation	Heating plate with planar heating zones for semiconductor processing

2012
- 2012-08-28 CN CN201210310949.2A patent/CN103633003B/en active Active
2013
- 2013-08-27 TW TW102130662A patent/TW201419442A/en unknown

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
TW546984B (en) *	2001-05-02	2003-08-11	Saint Gobain Ceramics	Ceramic heater with heater element and method for use thereof
TW200822281A (en) *	2006-08-29	2008-05-16	Lam Res Corp	Method of tuning thermal conductivity of electrostatic chuck support assembly
US7501605B2 (en) *	2006-08-29	2009-03-10	Lam Research Corporation	Method of tuning thermal conductivity of electrostatic chuck support assembly
TW201138019A (en) *	2010-03-24	2011-11-01	Toto Ltd	Electrostatic chuck

Also Published As

Publication number	Publication date
CN103633003B (en)	2016-12-21
TW201419442A (en)	2014-05-16
CN103633003A (en)	2014-03-12

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