TWI598661B - display device - Google Patents
display device Download PDFInfo
- Publication number
- TWI598661B TWI598661B TW105143233A TW105143233A TWI598661B TW I598661 B TWI598661 B TW I598661B TW 105143233 A TW105143233 A TW 105143233A TW 105143233 A TW105143233 A TW 105143233A TW I598661 B TWI598661 B TW I598661B
- Authority
- TW
- Taiwan
- Prior art keywords
- circuit board
- flexible circuit
- display device
- connection portion
- signal connection
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/111—Pads for surface mounting, e.g. lay-out
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/118—Printed elements for providing electric connections to or between printed circuits specially for flexible printed circuits, e.g. using folded portions
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/147—Structural association of two or more printed circuits at least one of the printed circuits being bent or folded, e.g. by using a flexible printed circuit
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Nonlinear Science (AREA)
- General Physics & Mathematics (AREA)
- Mathematical Physics (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Optics & Photonics (AREA)
- Theoretical Computer Science (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Liquid Crystal (AREA)
Description
本發明係關於一種顯示裝置;具體而言,本發明係關於一種液晶顯示裝置。The present invention relates to a display device; in particular, the present invention relates to a liquid crystal display device.
軟性電路板(flexible printed circuit board, FPCB)具有可彎折、輕巧之特性,可有效節省顯示裝置之內部空間,並利於組裝之進行,故被廣泛應用於顯示裝置中各組件之電性連結。The flexible printed circuit board (FPCB) has the characteristics of being bendable and light, which can effectively save the internal space of the display device and facilitate the assembly, so it is widely used for electrical connection of various components in the display device.
目前顯示裝置的設計,在組裝完成後,需要將連接顯示面板之主要軟性電路板上的導電接墊以及背光模組中設有發光元件的副軟性電路板上的導電接墊相互焊接以讓訊號傳遞到發光元件。然而,目前之顯示裝置中,主要軟性電路板上的導電接墊以及副軟性電路板之導電接墊均設置在背面,且兩者以焊錫連接,當主要軟性電路板與副軟性電路板共同翻折到顯示面板以及背光模組之背面時,焊錫會朝向背光模組,此時背光模組對應處需做退讓,否則會因焊錫的嚴重干涉造成背光模組中之元件(例如背光模組中之反射片)頂傷。而另一種現有技術之顯示裝置中,需將副軟性電路板翻折至主要軟性電路板上作焊接,此翻折的過程不僅耗費工時且翻折過程中易發生副軟性電路板折傷以及主要軟性電路板撕裂的問題。At present, the design of the display device needs to be soldered to the conductive pads on the main flexible circuit board connected to the display panel and the conductive pads on the sub-soft circuit board provided with the light-emitting elements in the backlight module after the assembly is completed. Transfer to the light-emitting element. However, in the current display device, the conductive pads on the main flexible circuit board and the conductive pads of the sub-soft circuit board are disposed on the back side, and the two are connected by soldering, when the main flexible circuit board and the sub-soft circuit board are turned together. When folding to the back of the display panel and the backlight module, the solder will face the backlight module. At this time, the backlight module needs to be retracted. Otherwise, the components in the backlight module may be caused by the serious interference of the solder (for example, in the backlight module). Reflective film) top injury. In another prior art display device, the sub-flexible circuit board needs to be folded over to the main flexible circuit board for soldering, and the folding process is not only time-consuming but also prone to breakage of the sub-soft circuit board during the folding process and The main problem of flexible circuit board tearing.
本發明之一目的在於提供一種顯示裝置,具有較簡易之生產流程以及較佳之生產效率。It is an object of the present invention to provide a display device having a relatively simple production process and better production efficiency.
本發明提出一種顯示裝置,包括第一電子模組、第二電子模組以及接合件,第一電子模組包括第一軟性電路板,第一軟性電路板之第一表面包括至少一第一接墊,第二電子模組位於第一電子模組之下方且包括第二軟性電路板,第二軟性電路板與第一軟性電路板至少部分重疊,第二軟性電路板之第二表面包括至少一第二接墊,第二表面朝向第一軟性電路板,各第一接墊垂直投影於第二軟性電路板之輪廓與對應之各第二接墊至少部分重疊或者相鄰,接合件則分別連接對應之各第一接墊與各第二接墊。The present invention provides a display device including a first electronic module, a second electronic module, and a bonding component. The first electronic module includes a first flexible circuit board. The first surface of the first flexible circuit board includes at least one first connection. a second electronic module is disposed under the first electronic module and includes a second flexible circuit board, the second flexible circuit board at least partially overlapping the first flexible circuit board, and the second surface of the second flexible circuit board includes at least one a second pad, the second surface is opposite to the first flexible circuit board, and the first pad is vertically projected on the second flexible circuit board and at least partially overlaps or adjacent to the corresponding second pads, and the bonding components are respectively connected Corresponding to each of the first pads and the second pads.
依照本發明實施例所述之顯示裝置,上述之各輪廓具有第一寬度w1及第一中心軸,各第二接墊具有第二寬度w2及第二中心軸,第一寬度w1與第二寬度w2均大致等於d,且第一中心軸與該第二中心軸之距離小於d/2。According to the display device of the embodiment of the present invention, each of the contours has a first width w1 and a first central axis, and each of the second pads has a second width w2 and a second central axis, the first width w1 and the second width Both w2 are substantially equal to d, and the distance between the first central axis and the second central axis is less than d/2.
依照本發明實施例所述之顯示裝置,上述之第一電子模組包括顯示面板,顯示面板連接第一軟性電路板。According to the display device of the embodiment of the invention, the first electronic module includes a display panel, and the display panel is connected to the first flexible circuit board.
依照本發明實施例所述之顯示裝置,上述之第二電子模組包括背光模組,背光模組包括至少一光源設置於第二軟性電路板上。According to the display device of the embodiment of the invention, the second electronic module includes a backlight module, and the backlight module includes at least one light source disposed on the second flexible circuit board.
依照本發明實施例所述之顯示裝置,上述之第一軟性電路板包括第一訊號連接部,第一接墊位於第一訊號連接部,上述之第二軟性電路板包括第二訊號連接部,第二接墊位於第二訊號連接部,第一訊號連接部與第二訊號連接部係設置於顯示面板之下方。According to the display device of the embodiment of the present invention, the first flexible circuit board includes a first signal connection portion, the first pad is located at the first signal connection portion, and the second flexible circuit board includes the second signal connection portion. The second pad is located at the second signal connection portion, and the first signal connection portion and the second signal connection portion are disposed below the display panel.
依照本發明實施例所述之顯示裝置,上述之第二訊號連接部至少部分位於第一軟性電路板垂直投影於第二軟性電路板之範圍外。According to the display device of the embodiment of the invention, the second signal connection portion is at least partially located outside the range in which the first flexible circuit board is vertically projected on the second flexible circuit board.
依照本發明實施例所述之顯示裝置,上述之第一軟性電路板於靠近顯示面板處具有一缺口,第二接墊至少部分位於缺口中。According to the display device of the embodiment of the invention, the first flexible circuit board has a notch near the display panel, and the second pad is at least partially located in the notch.
依照本發明實施例所述之顯示裝置,上述之第二訊號連接部至少部分突出於第一軟性電路板之外。According to the display device of the embodiment of the invention, the second signal connection portion at least partially protrudes beyond the first flexible circuit board.
依照本發明實施例所述之顯示裝置,上述之第二軟性電路板完全位於第一軟性電路板之該第一表面的相反側。According to the display device of the embodiment of the invention, the second flexible circuit board is completely located on the opposite side of the first surface of the first flexible circuit board.
依照本發明實施例所述之顯示裝置,上述之接合件係為導電膠、焊錫或者導電膠帶。According to the display device of the embodiment of the invention, the bonding component is a conductive adhesive, a solder or a conductive tape.
以上關於本發明內容的說明及以下實施方式的說明係用以示範與解釋本發明的原理,並且提供本發明的專利申請範圍更進一步的解釋。The above description of the present invention and the following description of the embodiments are intended to illustrate and explain the principles of the invention, and to provide a further explanation of the scope of the invention.
本發明係提供一種顯示裝置,在較佳實施例中,本發明之顯示裝置包含一液晶顯示裝置。液晶顯示裝置係泛指使用液晶面板之顯示裝置,包含家用的液晶電視、個人電腦及膝上型電腦之液晶監視器、智慧型手機、可攜式上網裝置及數位相機之液晶顯示幕等。然而在不同實施例中,本發明亦可包含有機發光二極體面板或其他面板之顯示裝置。The present invention provides a display device. In a preferred embodiment, the display device of the present invention comprises a liquid crystal display device. The liquid crystal display device generally refers to a display device using a liquid crystal panel, and includes a liquid crystal television for a household, a liquid crystal monitor for a personal computer and a laptop computer, a smart phone, a portable internet device, and a liquid crystal display screen of a digital camera. However, in various embodiments, the present invention may also include display devices for organic light emitting diode panels or other panels.
在圖1所示之實施例中,顯示裝置包含第一電子模組100及第二電子模組200;第一電子模組100較佳係與第二電子模組200至少部分重疊。於此實施例中,第一電子模組100係為一顯示面板模組,且較佳為一液晶面板模組;第二電子模組200則為一背光模組並設置於第一電子模組100之下方。然而在不同實施例中,第一電子模組100亦可為有機發光二極體面板模組或其他面板模組;而第二電子模組200則可為電磁式觸控感應模組或其他與第一電子模組100至少部分重疊之模組。In the embodiment shown in FIG. 1 , the display device includes a first electronic module 100 and a second electronic module 200 . The first electronic module 100 preferably at least partially overlaps with the second electronic module 200 . In this embodiment, the first electronic module 100 is a display panel module, and is preferably a liquid crystal panel module. The second electronic module 200 is a backlight module and is disposed on the first electronic module. Below 100. In different embodiments, the first electronic module 100 can also be an organic light emitting diode panel module or other panel module; and the second electronic module 200 can be an electromagnetic touch sensing module or the like. The modules of the first electronic module 100 at least partially overlap.
如圖1與圖3所示,第一電子模組100包含顯示面板120以及第一軟性電路板110。在此實施例中,第一軟性電路板110係可撓性電路板,其連接於顯示面板120並自顯示面板120之週邊區向外延伸,供與外部之訊號源連接以傳遞訊號至顯示面板120。然而在不同實施例中,第一軟性電路板110亦可由排線、薄膜或其他具類似功用之元件所取代。第一軟性電路板110具有第一訊號連接部111以及第一表面110a,第一訊號連接部111以及第一表面110a上設置有至少一個第一接墊130。As shown in FIG. 1 and FIG. 3 , the first electronic module 100 includes a display panel 120 and a first flexible circuit board 110 . In this embodiment, the first flexible circuit board 110 is a flexible circuit board that is connected to the display panel 120 and extends outward from the peripheral area of the display panel 120 for connection with an external signal source to transmit signals to the display panel. 120. However, in various embodiments, the first flexible circuit board 110 may also be replaced by a cable, a film, or other similarly functioning component. The first flexible circuit board 110 has a first signal connection portion 111 and a first surface 110a. The first signal connection portion 111 and the first surface 110a are provided with at least one first pad 130.
在此實施例中,第二電子模組200為一背光模組,包括第二軟性電路板210,第二軟性電路板210上設置有至少一個發光元件214,例如發光二極體。然而在不同實施例中,發光元件214亦可採其他光源如燈管等,而燈管與第二軟性電路板210例如為互相連接。In this embodiment, the second electronic module 200 is a backlight module, and includes a second flexible circuit board 210. The second flexible circuit board 210 is provided with at least one light emitting element 214, such as a light emitting diode. However, in different embodiments, the light-emitting element 214 may also adopt other light sources such as a lamp tube, etc., and the lamp tube and the second flexible circuit board 210 are connected to each other, for example.
請參考圖1與圖3,第二電子模組200還包括位於第二軟性電路板210旁之導光板220,亦即,第二軟性電路板210與並列之導光板220共同組成背光模組且設置於第一電子模組100之下方,以提供第一電子模組100中之顯示面板120所需之背光。在其他實施例中,第二電子模組200還包含如位於導光板220下方之反射片(圖未示)以及位於導光板220上方之光學膜片(圖未示)等。另外,在其他實施例中,第二電子模組200包含以矩陣排列之發光元件(圖未示)直接分佈於顯示面板120之下方,以在不使用導光板220之狀況下形成直下式之背光模組。Referring to FIG. 1 and FIG. 3 , the second electronic module 200 further includes a light guide plate 220 adjacent to the second flexible circuit board 210 , that is, the second flexible circuit board 210 and the parallel light guide plate 220 together form a backlight module. The light is disposed under the first electronic module 100 to provide a backlight required by the display panel 120 in the first electronic module 100. In other embodiments, the second electronic module 200 further includes a reflective sheet (not shown) under the light guide plate 220 and an optical film (not shown) located above the light guide plate 220. In addition, in other embodiments, the second electronic module 200 includes light-emitting elements (not shown) arranged in a matrix directly distributed under the display panel 120 to form a direct-type backlight without using the light guide plate 220. Module.
在此實施例中,第二軟性電路板210為位於發光元件214下方之可撓性電路板,供與外部之訊號源連接以將訊號傳遞至發光元件214。然而在不同實施例中,第二軟性電路板210亦可由排線、薄膜或其他具類似功用之元件所形成。第二軟性電路板210係可撓性電路板,其延伸方向與第一軟性電路板110之延伸方向大致平行並至少部分重疊。第二軟性電路板210包括第二訊號連接部211,第二接墊230位於第二訊號連接部211上,且第二接墊230位於第二軟性電路板210之第二表面210a; 第二表面210a朝向第一軟性電路板110,亦即,第一表面110a與第二表面210a均朝向同個方向。In this embodiment, the second flexible circuit board 210 is a flexible circuit board located below the light-emitting element 214 for connection with an external signal source to transmit signals to the light-emitting element 214. However, in various embodiments, the second flexible circuit board 210 can also be formed by wires, films, or other components having similar functions. The second flexible circuit board 210 is a flexible circuit board extending in a direction substantially parallel to and extending at least partially from the extending direction of the first flexible circuit board 110. The second flexible circuit board 210 includes a second signal connection portion 211, the second pad 230 is located on the second signal connection portion 211, and the second pad 230 is located on the second surface 210a of the second flexible circuit board 210; The 210a faces the first flexible circuit board 110, that is, the first surface 110a and the second surface 210a both face in the same direction.
如圖2及圖3所示,第二訊號連接部211至少部分位於第一軟性電路板110垂直投影於第二軟性電路板210之範圍外,亦即,第二訊號連接部211至少部分突出於第一軟性電路板110之外。接合件150則分別連接對應之各第一接墊130與各第二接墊230。接合件150例如為導電膠、焊錫或者導電膠帶,亦即,以焊接或黏合等連接方式將各第一接墊130與各第二接墊230相互耦接。就焊接方式而言,較佳可包含拉焊、雷射點焊及其他具相同功效之連接方式。As shown in FIG. 2 and FIG. 3, the second signal connection portion 211 is at least partially located outside the range in which the first flexible circuit board 110 is vertically projected on the second flexible circuit board 210, that is, the second signal connection portion 211 at least partially protrudes from The first flexible circuit board 110 is outside. The joint member 150 is connected to each of the corresponding first pads 130 and the second pads 230 respectively. The bonding member 150 is, for example, a conductive paste, a solder or a conductive tape, that is, the first pads 130 and the second pads 230 are coupled to each other by soldering or bonding. In terms of soldering method, it is preferable to include soldering, laser spot welding and other connection methods having the same effect.
於本實施例中,第一軟性電路板110與第二軟性電路板210部分重疊,且第二軟性電路板210完全位於第一軟性電路板110之第一表面110a的相反側。第一訊號連接部111與第二訊號連接部211相鄰或者至少部分重合,且設置於第一訊號連接部111與第二訊號連接部211上對應之第一接墊130、第二接墊230係電連接。藉由對應之第一訊號連接部111與第二訊號連接部211間之電連接,訊號源所送出之訊號得以經由第一軟性電路板110傳遞至第一訊號連接部111上之第一接墊130,再經由第一訊號連接部111上之第一接墊130傳送至第二訊號連接部211上之第二接墊230。In the embodiment, the first flexible circuit board 110 partially overlaps the second flexible circuit board 210, and the second flexible circuit board 210 is completely located on the opposite side of the first surface 110a of the first flexible circuit board 110. The first signal connection portion 111 is adjacent to or at least partially overlapped with the second signal connection portion 211 , and is disposed on the first connection pad 130 and the second connection pad 230 corresponding to the first signal connection portion 111 and the second signal connection portion 211 . Electrical connection. The signal sent from the signal source is transmitted to the first pad on the first signal connection portion 111 via the first flexible circuit board 110 by the electrical connection between the corresponding first signal connection portion 111 and the second signal connection portion 211. The second pad 130 is transferred to the second pad 230 on the second signal connecting portion 211 via the first pad 130 on the first signal connecting portion 111.
如圖4所示,並請參考圖3,第一軟性電路板110與第二軟性電路板210於以接合件150電連接後,即部分彎折並疊合於顯示面板120及導光板220之下方,即,第一訊號連接部111以及第二訊號連接部211疊合於顯示面板120及導光板220之下方並縮入第一電子模組100之覆蓋範圍內,而接合件150則位於遠離第二電子模組200之一側。第二軟性電路板210完全位於第一軟性電路板110的內側,即,第二軟性電路板210完全位於第一軟性電路板110之第一表面110a的相反側。藉由上述設計,本實施例的第二軟性電路板210不需由下至上翻折至第一軟性電路板210上,可有效避免第二軟性電路板折傷或第一軟性電路板撕裂的問題。As shown in FIG. 4, and referring to FIG. 3, the first flexible circuit board 110 and the second flexible circuit board 210 are partially bent and superposed on the display panel 120 and the light guide plate 220 after being electrically connected by the bonding member 150. The first signal connection portion 111 and the second signal connection portion 211 are superposed on the display panel 120 and the light guide plate 220 and are retracted into the coverage of the first electronic module 100, and the engagement member 150 is located away from the cover. One side of the second electronic module 200. The second flexible circuit board 210 is completely inside the first flexible circuit board 110, that is, the second flexible circuit board 210 is completely located on the opposite side of the first surface 110a of the first flexible circuit board 110. With the above design, the second flexible circuit board 210 of the present embodiment does not need to be folded from the bottom to the top of the first flexible circuit board 210, and the second flexible circuit board is damaged or the first flexible circuit board is torn. problem.
圖5為本發明之另一實施例,於本實施例中,第一軟性電路板110於靠近顯示面板120處具有一缺口160,即,在沿第一軟性電路板110之延伸方向y方向上,第一軟性電路板110自顯示面板120向外延伸之之寬度變化係由窄變寬以形成缺口160。換言之,第一軟性電路板110於靠近顯示面板120處寬度較窄,以形成缺口160,而第二接墊230至少部分位於缺口160中。也就是說,第二軟性電路板210之第二訊號連接部211至少部分位於第一軟性電路板110垂直投影於第二軟性電路板210之範圍外,使第二接墊230自缺口160曝露出。FIG. 5 is another embodiment of the present invention. In the embodiment, the first flexible circuit board 110 has a notch 160 near the display panel 120, that is, in the direction of the y direction along the extending direction of the first flexible circuit board 110. The width of the first flexible circuit board 110 extending outward from the display panel 120 is widened to form a notch 160. In other words, the first flexible circuit board 110 is narrower near the display panel 120 to form the notch 160, and the second pad 230 is at least partially located in the notch 160. That is, the second signal connection portion 211 of the second flexible circuit board 210 is at least partially located outside the range of the first flexible circuit board 110 perpendicularly projected on the second flexible circuit board 210, so that the second pad 230 is exposed from the notch 160. .
如圖6所示,其為第一接墊130垂直投影於第二表面210a之輪廓130’與對應之第二接墊230之相對位置示意圖。請參考圖6a,第二表面210a上之輪廓130’與對第二接墊230一一對應且相鄰接,各輪廓130’具有第一寬度w1及第一中心軸a1,各第二接墊230具有第二寬度w2及第二中心軸a2,第一寬度w1與第二寬度w2均大致等於d,且相對應之輪廓130以及第二接墊230,其第一中心軸a1與該第二中心軸a2之距離小於d/2,例如為0。請參考圖6b,第二表面210a之輪廓130’與對應之第二接墊230相鄰但不接觸且於x方向有一偏移,即相對應之輪廓130’以及第二接墊230其第一中心軸a1與該第二中心軸a2有一偏移距離s,s小於d/2。請參考圖6c,其中,輪廓130’與對應之第二接墊230至少部分相互重疊。As shown in FIG. 6, it is a schematic diagram of the relative position of the first pad 130 perpendicularly projected on the contour 130' of the second surface 210a and the corresponding second pad 230. Referring to FIG. 6a, the contour 130' on the second surface 210a is in one-to-one correspondence with the second pad 230, and each contour 130' has a first width w1 and a first central axis a1, and each second pad 230 has a second width w2 and a second central axis a2, the first width w1 and the second width w2 are both substantially equal to d, and the corresponding contour 130 and the second pad 230, the first central axis a1 and the second The distance from the central axis a2 is less than d/2, for example 0. Referring to FIG. 6b, the contour 130' of the second surface 210a is adjacent to but not in contact with the corresponding second pad 230 and has an offset in the x direction, that is, the corresponding contour 130' and the second pad 230 are first. The central axis a1 has an offset distance s from the second central axis a2, and s is smaller than d/2. Please refer to Fig. 6c, wherein the contour 130' and the corresponding second pad 230 at least partially overlap each other.
本發明已由上述相關實施例加以描述,然而上述實施例僅為實施本發明之範例。必需指出的是,已揭露之實施例並未限制本發明之範圍。相反地,包含於申請專利範圍之精神及範圍之修改及均等設置均包含於本發明之範圍內。The present invention has been described by the above-described related embodiments, but the above embodiments are merely examples for implementing the present invention. It must be noted that the disclosed embodiments do not limit the scope of the invention. On the contrary, modifications and equivalents of the spirit and scope of the invention are included in the scope of the invention.
雖然本發明以前述之較佳實施例揭露如上,然其並非用以限定本發明,任何熟習相像技藝者,在不脫離本發明之精神和範圍內,當可作些許之更動與潤飾,因此本發明之專利保護範圍須視本說明書所附之申請專利範圍所界定者為準。While the present invention has been described above in terms of the preferred embodiments thereof, it is not intended to limit the invention, and the invention may be modified and modified without departing from the spirit and scope of the invention. The patent protection scope of the invention is subject to the definition of the scope of the patent application attached to the specification.
100‧‧‧第一電子模組100‧‧‧First electronic module
110‧‧‧第一軟性電路板110‧‧‧First flexible circuit board
110a‧‧‧第一表面110a‧‧‧ first surface
111‧‧‧第一訊號連接部111‧‧‧First Signal Connection
120‧‧‧顯示面板120‧‧‧ display panel
130‧‧‧第一接墊130‧‧‧First mat
130’‧‧‧輪廓130’‧‧‧ contour
150‧‧‧接合件150‧‧‧Joint parts
160‧‧‧缺口160‧‧‧ gap
200‧‧‧第二電子模組200‧‧‧Second electronic module
210‧‧‧第二軟性電路板210‧‧‧Second flexible circuit board
210a‧‧‧第二表面210a‧‧‧second surface
211‧‧‧第二訊號連接部211‧‧‧second signal connection
214‧‧‧發光元件214‧‧‧Lighting elements
220‧‧‧導光板220‧‧‧Light guide plate
230‧‧‧第二接墊230‧‧‧second mat
圖1為本發明顯示裝置實施例的元件爆炸圖; 圖2為第一電子模組與第二電子模組組合之實施例示意圖; 圖3為本發明顯示裝置實施例之側視圖; 圖4為第一軟性電路板與第二軟性電路板部分向下彎折之實施例示意圖; 圖5為本發明顯示裝置之另一實施例; 圖6a-6c為輪廓與第二接墊之相對位置示意圖;1 is a view showing an exploded view of an embodiment of a display device according to an embodiment of the present invention; FIG. 2 is a schematic view showing an embodiment of a combination of a first electronic module and a second electronic module; FIG. 5 is a schematic view showing another embodiment of the display device of the present invention; FIG. 6a-6c is a schematic view showing the relative position of the first flexible circuit board and the second flexible circuit board;
110‧‧‧第一軟性電路板 110‧‧‧First flexible circuit board
111‧‧‧第一訊號連接部 111‧‧‧First Signal Connection
120‧‧‧顯示面板 120‧‧‧ display panel
130‧‧‧第一接墊 130‧‧‧First mat
210‧‧‧第二軟性電路板 210‧‧‧Second flexible circuit board
211‧‧‧第二訊號連接部 211‧‧‧second signal connection
230‧‧‧第二接墊 230‧‧‧second mat
Claims (10)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW105143233A TWI598661B (en) | 2016-12-26 | 2016-12-26 | display device |
CN201710092153.7A CN106814484A (en) | 2016-12-26 | 2017-02-21 | Display device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW105143233A TWI598661B (en) | 2016-12-26 | 2016-12-26 | display device |
Publications (2)
Publication Number | Publication Date |
---|---|
TWI598661B true TWI598661B (en) | 2017-09-11 |
TW201823812A TW201823812A (en) | 2018-07-01 |
Family
ID=59112708
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW105143233A TWI598661B (en) | 2016-12-26 | 2016-12-26 | display device |
Country Status (2)
Country | Link |
---|---|
CN (1) | CN106814484A (en) |
TW (1) | TWI598661B (en) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107481619B (en) * | 2017-09-29 | 2019-09-24 | 武汉天马微电子有限公司 | Display module and display device |
TWI637364B (en) * | 2017-12-15 | 2018-10-01 | 友達光電股份有限公司 | Electronic device |
CN108008584B (en) * | 2017-12-29 | 2020-11-13 | 武汉华星光电技术有限公司 | Liquid crystal display device having a plurality of pixel electrodes |
US10509277B2 (en) | 2017-12-29 | 2019-12-17 | Wuhan China Star Optoelectronics Technology Co., Ltd. | Liquid crystal display device |
CN108541131B (en) * | 2018-05-30 | 2020-04-17 | 业成科技(成都)有限公司 | Circuit board connecting structure and display device using same |
CN110286535B (en) * | 2019-06-20 | 2021-08-31 | 上海天马微电子有限公司 | Display module, manufacturing method of display module and display device |
CN113675165B (en) * | 2020-08-14 | 2023-05-02 | 友达光电股份有限公司 | Display device and method for manufacturing the same |
CN115311949B (en) * | 2022-08-31 | 2023-11-28 | 昆山国显光电有限公司 | Binding structure, display module assembly and electronic equipment |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW201432518A (en) * | 2013-02-07 | 2014-08-16 | Htc Corp | Touch panel assembly and electronic apparatus |
TW201611693A (en) * | 2014-09-12 | 2016-03-16 | 友達光電股份有限公司 | Display apparatus |
CN105449343A (en) * | 2013-05-02 | 2016-03-30 | 友达光电股份有限公司 | Display module, electronic device and method applied to display module |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005228870A (en) * | 2004-02-12 | 2005-08-25 | Seiko Epson Corp | Packaging structure, electro-optical device and electronic apparatus |
CN100502618C (en) * | 2006-01-05 | 2009-06-17 | 友达光电股份有限公司 | Circuit board module and its forming method |
CN100492112C (en) * | 2006-08-24 | 2009-05-27 | 胜华科技股份有限公司 | Printing circuit board connecting structure of LCD module |
CN101252808B (en) * | 2008-02-29 | 2010-06-02 | 友达光电(苏州)有限公司 | Soldering circuit plate and soldering method thereof |
CN102073155A (en) * | 2009-11-20 | 2011-05-25 | 群康科技(深圳)有限公司 | Circuit board fixing structure, liquid crystal display device with circuit board fixing structure and electronic device with circuit board fixing structure |
CN102809841B (en) * | 2012-08-21 | 2015-05-20 | 深圳市华星光电技术有限公司 | Liquid display device |
KR102133452B1 (en) * | 2013-12-11 | 2020-07-14 | 삼성디스플레이 주식회사 | Display device |
CN104009044B (en) * | 2014-05-22 | 2018-11-23 | 京东方科技集团股份有限公司 | A kind of array substrate and preparation method thereof, display base plate, display device |
CN205809497U (en) * | 2016-05-04 | 2016-12-14 | 深圳市风雷益泰电子科技有限公司 | Liquid crystal indicator |
-
2016
- 2016-12-26 TW TW105143233A patent/TWI598661B/en active
-
2017
- 2017-02-21 CN CN201710092153.7A patent/CN106814484A/en active Pending
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW201432518A (en) * | 2013-02-07 | 2014-08-16 | Htc Corp | Touch panel assembly and electronic apparatus |
CN105449343A (en) * | 2013-05-02 | 2016-03-30 | 友达光电股份有限公司 | Display module, electronic device and method applied to display module |
TW201611693A (en) * | 2014-09-12 | 2016-03-16 | 友達光電股份有限公司 | Display apparatus |
Also Published As
Publication number | Publication date |
---|---|
TW201823812A (en) | 2018-07-01 |
CN106814484A (en) | 2017-06-09 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
TWI598661B (en) | display device | |
WO2019127705A1 (en) | Liquid crystal display device | |
TWI495409B (en) | Driving printed circuit board and liquid crystal display device including the same | |
TWI487982B (en) | Liquid crystal display device | |
CN100582883C (en) | Flat panel display device and portable display apparatus using the same | |
JP2009216753A (en) | Liquid crystal display device | |
TW200931106A (en) | Gasket, screen spacer, and display device with gasket and screen spacer | |
JP2011059149A (en) | Electronic device | |
WO2019223726A1 (en) | Touch display device and method for manufacturing same | |
TWI277032B (en) | Planar display module | |
CN107102477B (en) | LED lamp strip, backlight unit and display device | |
KR20200067270A (en) | Display unit, electronic apparatus including the same, and method of manufacturing the electronic apparatus | |
WO2012141117A1 (en) | Liquid crystal module, and display device | |
US20080123335A1 (en) | Printed circuit board assembly and display having the same | |
TWI666491B (en) | Display device | |
JP2018185509A (en) | Liquid crystal display device | |
TWI396476B (en) | Light module, composited circuit board device used therein, and assembling method thereof | |
TWI485470B (en) | Display module | |
JP5148059B2 (en) | Liquid crystal display | |
TW201321840A (en) | Display device | |
JP2019008062A (en) | Display | |
KR20130035142A (en) | Liquid crystal display device | |
JP5226225B2 (en) | Wiring board solder joint structure | |
TWI637676B (en) | Wearable device with a chip on film package structure | |
WO2011122120A1 (en) | Wiring line, display device, and television receiver |