TWI592077B - Probe card and its probe module and power probe - Google Patents

Description

Probe card and its probe module and power probe

The invention relates to an electrical detection device; in particular to a probe card and a probe module thereof and a power supply probe.

According to the electrical detection method of the electronic object to be tested, a probe card is electrically connected to a tester, and the probe card is used as a test between the detector and the electronic object to be tested (DUT). The signal transmission interface is used to effectively transmit the test signal sent from the detector to the electronic object to be tested.

However, there are many factors affecting the measurement results. When the power signal is transmitted to the electronic object to be tested through the probe card, the impedance of the probe and the corresponding transmission line often causes energy loss when transmitting the power signal, so that the supply is waiting for The electrical energy of the electronic object is not stable enough, which in turn affects the detection results. Therefore, how to reduce the energy loss caused by the detection, and effectively and stably use the probe to supply power to the electronic object to be tested has been the direction of improvement of today's industry.

In view of this, the object of the present invention is to provide a probe card, a probe module thereof and a power supply probe, which can effectively reduce the energy loss caused by the detection.

In order to achieve the above object, the power supply probe provided by the present invention comprises a probe head, a conductive element and a capacitive element. Wherein, the probe head is made of a conductor. The conducting element has a conductor and is separated from each other A signal conducting line and a ground conducting line, and the signal conducting line is electrically connected to one end of the probe head. The capacitive element is electrically connected to the signal conducting line at one end and electrically connected to the grounded transmission line at the other end.

According to the above concept, the present invention further provides a probe module including a power probe and a ground probe. Wherein, the power probe comprises a probe head, a conducting component and a capacitive component; the probe head is made of a conductor; the conducting component has a signal conducting line made of a conductor and separated from each other and a ground conducting a line, and the signal conducting line is electrically connected to one end of the probe head; one end of the capacitive element is electrically connected to the signal conducting line, and the other end is electrically connected to the grounding transmission line; the grounding probe is The conductor is made and electrically connected to the ground transmission line.

According to the above concept, the present invention further provides a probe card including a substrate, a fixing base and a probe module. The fixing base is disposed on the substrate. The probe module is connected to the fixing base and includes a power probe and a grounding probe; the power probe includes a probe head, a conducting component and a capacitive component; the probe head is made of a conductor The conductive element has a signal conducting line made of a conductor and separated from each other and a ground conducting line, and the signal conducting line is electrically connected to one end of the probe head; one end of the capacitive element is electrically connected to the signal The conductive line is electrically connected to the ground transmission line; the ground probe is made of a conductor and is electrically connected to the ground transmission line.

Therefore, through the structural design of the upper number, the probe card of the present invention, the probe module thereof and the power supply probe can effectively reduce the energy loss during signal transmission during detection.

10‧‧‧Substrate

12‧‧‧through hole

20‧‧‧ Fixed seat

22‧‧‧Hosting

24‧‧‧Insulation fixtures

30‧‧‧ Probe Module

32‧‧‧Power probe

321‧‧‧ probe head

321a‧‧‧needle section

321b‧‧‧ Connection section

322‧‧‧Transmission elements

322a‧‧‧ Signal transmission line

322b‧‧‧Isolation

322c‧‧‧ Grounded Conduction Line

322d‧‧‧ skin

323‧‧‧Capacitive components

324‧‧‧Cover parts

325‧‧‧ circuit board

325a‧‧‧ signal connection pad

325b‧‧‧Ground connection pad

325c‧‧‧connection structure

34‧‧‧ Grounding probe

Θ‧‧‧ angle

1 is a structural view of a probe card according to a first preferred embodiment of the present invention; 2 is a structural view of a probe module according to a first preferred embodiment of the present invention; FIG. 3 is an exploded view of a probe module according to a first preferred embodiment of the present invention; FIG. 5 is a structural diagram of a probe card according to a second preferred embodiment of the present invention; and FIG. 6 is a schematic view showing that the circuit boards of the probe modules can be stacked on each other.

In order to explain the present invention more clearly, the preferred embodiment will be described in detail with reference to the accompanying drawings. Referring to FIGS. 1 to 3, the probe card of the preferred embodiment of the present invention is used for connecting a detecting machine. (not shown) and an electronic object to be tested (not shown), and the structure mainly comprises a probe module 30, a substrate 10 and a fixing base 20. among them:

As can be seen from FIG. 2 and FIG. 3 , the probe module 30 includes a power probe 32 , a grounding probe 34 , and a covering member 324 . The power probe 32 includes a probe head 321, a conductive element 322, and a capacitive element 323. The probe head 321 is made of a conductor and has a connecting pin segment 321a and a connecting portion 321b for contacting the power contact (not shown) of the electronic object to be tested. The needle tip segment 321a has an angle θ with the connecting segment 321b, and the angle θ is between 90 degrees and 180 degrees, and preferably between 120 degrees and 150 degrees, for the point 321a of the needle tip segment When the electronic object to be tested is touched, the probe head 321 is elastically strained to remove the impact force when the touch is made, and the service life of the probe head 321 can be effectively improved. Of course, in practical implementation, the probe head 321 can also be designed to be straight without an angle. In addition, the outer diameter of the probe head 321 is gradually expanded from the tip end segment 321a toward the connecting portion 321b.

The conducting component 322 is configured to be electrically connected to a power output terminal (not shown) of the detecting device. In the embodiment, the conductive component 322 is an example of a coaxial signal line and has a conductor. One of the signals The conductive line 322a and a grounded conductive line 322c, and an insulating layer 322b and an outer skin 322d are made of an insulating material. The signal conducting line 322a is connected to the connecting portion 321b of the probe head 321, and the isolation layer 322b is coated on the signal conducting line 322a. The ground conducting line 322c covers the isolation layer 322b, and the outer skin 322d is coated on the ground conductive line 322c, such that the isolation layer 322b is located between the signal conducting line 322a and the ground conducting line 322c, and the ground conducting line 322c is located between the isolation layer 322b and the outer skin 322d. Therefore, other factors in the detection environment will be blocked by the outer skin 322d and the isolation layer 322b without disturbing the signal transmission on the signal conducting line 322a and the ground conducting line 322c. Of course, in practical implementation, the conductive component 322 can also be made of materials such as twisted pair, multi-stranded wire, printed circuit board or flexible circuit board to achieve the purpose of forming a signal conducting line and a ground conducting line.

The capacitive element 323 is electrically connected to the signal conducting line 322a at one end and electrically connected to the ground transmitting line 322c at the other end. In this embodiment, the capacitive component 323 is directly connected to the signal conducting line 322a and the grounding transmission line 322c by soldering. Of course, in practical implementation, the connecting component made of a conductor may also be A metal plate, a metal wire, or the like, which is not shown, is connected to the signal conducting line 322a and the grounding connecting line 322c, respectively, so that both ends of the capacitive element 323 are electrically connected to the signal conducting line 322a through the connecting element, respectively. Ground transmission line 322c.

The grounding probe 34 is made of a conductor and electrically connected to the grounding transmission line 322c, and is used for contacting a grounding contact (not shown) of the electronic object to be tested. In this embodiment, the grounding probe 34 is bent and directly connected to the grounding transmission line 322c by soldering to the grounding transmission line 322c, so that the grounding conducting line 322c has the effect of grounding. Of course, in other embodiments, it can also be connected through a conductor. Connecting components (such as metal plates, metal wires, etc., not shown) are respectively connected to the grounding probe 34 and the grounding transmission line 322c, so that the grounding probe 34 is electrically connected to the grounding transmission line 322c through the connecting component.

The covering member 324 is made of an insulating material and covers a part of the probe head 321 , a part of the conductive element 322 , a part of the grounding probe 34 , and the capacitive element 323 , thereby further Fixing the connection between the above components and other components can avoid the situation that the components are detached after soldering and fixing, thereby increasing the reliability of the probe module 30. In the embodiment, the covering member 324 is made of a curable epoxy resin (Epoxy), and the initial state of the epoxy resin is gelatinized and applied to a part of the probe head 321 . A portion of the conductive element 322, a portion of the ground probe 34, and the capacitive element 323 are then cured by illumination or heating to achieve the above-described purpose of coating the components. Of course, in addition to the use of epoxy resin, other insulating materials can be used to make the covering member.

In this embodiment, the substrate 10 is a printed circuit board, and is mainly used to support and carry other components of the probe card except for the circuit layout (not shown) for detecting. In addition, the substrate 10 further has a through hole 12, and the through hole 12 extends through opposite sides of the substrate 10 for the conductive element 322 to pass through, so as to save space and make the probe card small. The purpose of the transformation.

The holder 20 is disposed on the substrate 10, and in the embodiment, the holder 20 includes a carrier 22 and an insulating fixture 24, the carrier 22 is coupled to the substrate 10, and the insulating member 34 is attached. It is made of epoxy resin (Epoxy) and is disposed on the carrier 22 and covered on the outside of the covering member 324 to make a part of the probe head 321 , a part of the conducting component 322 , and the grounding. A portion of the probe 34 and the capacitive component 323 are embedded in the insulating fixture 24 to fix the probe module 30. The purpose. Of course, in addition to the use of epoxy resin, the insulating fixture 24 can also be made using other insulating materials. In addition, the probe head 321 is embedded in the insulating fixture 24, and the outer diameter of the probe head 321 is designed to be gradually expanded. The probe head 321 will not easily be insulated from the covering member 324. The fixing member 24 is disengaged, and the reliability of the probe card detection can be improved.

Therefore, the structural design of connecting the capacitive element 323 to the signal conducting line 322a and the ground conducting line 322c is such that the capacitive element 323 assumes a circuit configuration in parallel with the probe head 321 . In this way, when the power output terminal of the detecting device outputs a power signal, the power signal will store the capacitive component 323 through the signal conducting line 322a of the conducting component 322, and the capacitor is transmitted through the probe head 321 The energy storage of the component 323 is output to the power contact of the electronic object to be tested, so that the electrical energy can be supplied to the electronic object to be tested through the shortest transmission path, thereby greatly reducing the loss during transmission, thereby improving the stability of the power supply. The effect of the degree.

In addition, since the capacitive element 323 is connected to the conductive element 322 instead of being directly connected to the probe head 321, the connection method has the advantages of energy storage and energy supply, and It affects the mechanical action of the probe head 321 when it touches the electronic object to be tested, and has the multiple advantages of improving performance and maintaining reliability.

In addition to the above structure, referring to FIG. 4, a probe module according to a second preferred embodiment of the present invention includes the probe head 321, the conductive element 322, and the capacitive element 323. The difference from the above embodiment is that the power supply probe further includes a circuit board 325, and the circuit board 325 is provided with a signal connection pad 325a made of a conductor and separated from each other and a The grounding connection pad 325b, the probe head 321, the conductive element 322, the capacitive element 323 and the grounding probe 36 are disposed on the circuit board 325, and the probe head 321 and the signal conducting line 322a and one end of the capacitive element 323 are connected to the signal connection pad 325a, and the ground conduction line 322c, the other end of the capacitive element 323, and the ground probe 36 are connected to the ground connection pad 325b, and The circuit board 325 is designed to be electrically connected to the ground conducting line 322c by using a short length grounding probe 36 to reduce losses on the ground path.

In this way, when the power output terminal of the detecting device outputs a power signal, the power signal will store the capacitive component 323 via the signal conducting line 322a and the signal connecting pad 325a, and through the signal connecting pad 325a and The probe head 321 outputs the energy storage of the capacitive element 323 to the electronic object to be tested, and the effect of improving the power supply stability and maintaining the mechanical operation reliability is also achieved.

In addition, referring to FIG. 5, through the design of the circuit board 325, the probe card of the present invention may not be embedded in the probe head 321, the conductive element 322, the grounding probe 34, and the capacitive 323 element. In the insulating fixing member 24 of the previous embodiment, the circuit board 325 is directly locked on the fixing base 40 having a slope, thereby fixing the probe head 321, the capacitive element 323 and the conducting element 322. The purpose of the components.

It is to be noted that, referring to FIG. 6, on the basis of the second embodiment, the circuit board 325 can be further provided with a protruding connection structure 325c for connecting another circuit board 325 of the power probe. The circuit boards 325 can be stacked on each other to have a multi-array probe head 321, so that the probe card of the present invention can achieve the purpose of multiplex detection. In addition, since the connection structure 325c has a certain height, and the circuit boards 325 are connected through the connection structure 325c, the probe heads 321 on the circuit boards 325 will not be probed with another circuit board 325. The head 321 is in contact, and the occurrence of interference between the probe heads 321 at the time of detection can be avoided, thereby ensuring reliability at the time of detection.

It should be noted that the above description is only a preferred embodiment of the present invention, and is not intended to be limited to the above description, and equivalent changes to the scope of the present invention and the scope of the patent application are intended to be included in the scope of the present invention. Inside.

30‧‧‧ Probe Module

32‧‧‧Power probe

321‧‧‧ probe head

322‧‧‧Transmission elements

322a‧‧‧ Signal transmission line

322b‧‧‧Isolation

322c‧‧‧ Grounded Conduction Line

322d‧‧‧ skin

323‧‧‧Capacitive components

324‧‧‧Cover parts

34‧‧‧ Grounding probe

Claims (18)

A power supply probe comprising: a probe head made of a conductor; a conductive element having a signal conducting line made of a conductor and separated from each other and a ground conducting line, and the signal conducting line and the probe head One end of the electrical connection; and a capacitive element, one end is electrically connected to the signal conducting line, and the other end is electrically connected to the grounding transmission line, and the capacitive element is not directly connected to the probe head. The power supply probe of claim 1, wherein the conductive element further comprises an isolation layer made of an insulating material and covering the signal conducting line, and the ground conducting line covers the isolation layer, so that The isolation layer is between the signal conducting line and the ground conducting line. The power supply probe of claim 1, further comprising a circuit board, wherein the circuit board is provided with a signal connection pad made of a conductor and separated from each other, and a ground connection pad; the probe head and the signal transmission The circuit, the grounded conductive line, and the capacitive component are disposed on the circuit board, and the probe head, the signal conducting circuit, and one end of the capacitive component are connected to the signal connecting pad, and the ground conducting line and the The other end of the capacitive element is connected to the ground connection pad. The power supply probe of claim 1, further comprising a covering member made of an insulating material and covering a portion of the probe head, a portion of the conductive member, and the capacitive member. The power probe of claim 1, wherein the probe head has a pin tip segment and a connecting segment connected thereto, and the connecting segment is electrically connected to the signal conducting line, and the pin tip segment and the connecting segment are There is an angle between the angles, and the angle is between 90 degrees and 180 degrees. The power supply probe of claim 1, wherein the outer diameter of the probe head is tapered by the other end opposite to one end of the signal transmission wire connection. A probe module includes: a power supply probe including a probe head, a conductive element and a capacitive element; the probe head is made of a conductor; the conductive element has a conductor made of and separated from each other a signal conducting line and a ground conducting line, wherein the signal conducting line is electrically connected to one end of the probe head; one end of the capacitive element is electrically connected to the signal conducting line, and the other end is electrically connected to the grounding transmission line And the capacitive element is not directly connected to the probe head; and a grounding probe is made of a conductor and electrically connected to the ground transmission line. The probe module of claim 7, wherein the power probe further comprises a circuit board, and the circuit board is provided with a signal connection pad made of a conductor and separated from each other and a ground connection pad; a needle, the signal conducting line, the grounding conducting line, the grounding probe, and the capacitive component are disposed on the circuit board, and the probe head, the signal conducting line, and one end of the capacitive component are coupled to the signal The connection pad is connected, and the ground conduction line, the ground probe, and the other end of the capacitive element are connected to the ground connection pad. The probe module of claim 7, wherein the conductive element further comprises an isolation layer made of an insulating material and covering the signal conducting line, and the ground conducting line covers the isolation layer, so that The isolation layer is between the signal conducting line and the ground conducting line. The probe module of claim 7, further comprising a connecting component, which is made of a conductor, and the two ends are respectively connected to the grounding probe and the grounding transmission line, so that the grounding probe is electrically connected to the connecting component. Connect to the ground transmission line. The probe module of claim 7, further comprising a covering member made of an insulating material and covering a part of the probe head, a part of the conducting component, and the grounding probe Part of the part and the capacitive element. A probe card includes: a substrate; a fixing base disposed on the substrate; and a probe module coupled to the fixing base and including a power probe and a grounding probe; the power probe includes a probe head, a conductive element and a capacitive element; the probe head is made of a conductor; the conductive element has a signal conducting line made of a conductor and separated from each other, and a ground conducting line, and the signal conducting line Electrically connected to one end of the probe head; one end of the capacitive element is electrically connected to the signal conducting line, and the other end is electrically connected to the grounding transmission line, and the capacitive element is not directly connected to the probe head The ground probe is made of a conductor and is electrically connected to the ground transmission line. The probe card of claim 12, wherein the fixing base comprises a carrier and an insulating fixing member, the carrier is connected to the substrate, and the insulating fixing member is made of an insulating material and disposed on the carrier And a portion of the probe head, a portion of the conductive element, a portion of the ground probe, and the capacitive element are embedded in the insulating fixture. The probe card of claim 12, wherein the probe module further comprises a covering member made of an insulating material and covering a part of the probe head, a part of the conducting component, Part of the grounding probe and the capacitive element. The probe card of claim 14, wherein the fixing base comprises a carrier and an insulating fixing member, the carrier is connected to the substrate, and the insulating fixing member is disposed on the carrier, and the package is The cover is embedded in the insulating fixture. The probe card of claim 12, further comprising a connecting component, which is made of a conductor, and the two ends are respectively connected to the grounding probe and the grounding transmission line, so that the grounding probe is electrically transmitted through the connecting component Connected to the ground transmission line. The probe card of claim 12, further comprising a circuit board connected to the fixing base, wherein the circuit board is provided with a signal connection pad made of a conductor and separated from each other, and a ground connection pad. The probe head, the signal conducting line, the ground conducting line, the grounding probe, and the capacitive component are disposed on the circuit board, and the probe head, the signal conducting line, and the end of the capacitive component are Connected to the signal connection pad, and the connection The ground conducting line, the grounding probe, and the other end of the capacitive element are coupled to the ground connection pad. The probe card of claim 17, wherein the circuit board further comprises a connection structure for connecting the circuit board of the other power probe, and after the connection, the probe heads on the circuit board are not the other one. The probe head on the board is in contact.