TWI591368B - Radiation detector and manufacturing method thereof - Google Patents

Description

Radiation detector and method of manufacturing same

This application is based on the Japanese Patent Application, Japanese Patent Application No. 2013-119455 (application date: June 6, 2013), and has priority from this application. This application contains the entire contents of this application by reference to this application.

The embodiment is generally directed to a method of manufacturing a radiation detector and a radiation detector.

As a new generation of X-ray diagnostic detectors, a planar X-ray detector using an active matrix has been developed. The X-ray image or the instantaneous X-ray image is output as a digital signal by detecting the X-rays irradiated to the X-ray detector. In the X-ray detector, X-rays are converted into visible light or fluorescence by a scintillator layer, and an amorphous germanium (a-Si) photodiode or a CMOS (Complementary Metal Oxide Semiconductor) is used. A photoelectric conversion element such as a sensor or a CCD (Charge Coupled Device) converts the fluorescence into a signal charge, thereby acquiring an image.

As a material of the scintillator layer, cesium iodide (CsI) is usually used: sodium (Na), cesium iodide (CsI): strontium (Tl), sodium iodide (NaI) or strontium oxysulfide (Gd ₂ O ₂ S). . The scintillator layer is formed by dicing or the like, or deposited by vapor deposition to form a columnar structure, whereby the resolution characteristics can be improved. As the material of the scintillator, various materials are used as described above, and are used depending on the use or the desired characteristics.

In order to improve the utilization efficiency of the fluorescent light and improve the sensitivity characteristics, it exists in the scintillator layer. A case where a reflective film is formed on the upper surface. In other words, the fluorescent light that is emitted toward the opposite side of the photoelectric conversion element in the fluorescent light that is emitted from the scintillator layer is reflected by the reflection film, so that the amount of fluorescence reaching the photoelectric conversion element side is increased.

The reflective film is formed by a method of forming a metal layer having a high fluorescence reflectance such as a silver alloy or aluminum on a scintillator layer, or coating a light-scattering substance such as TiO ₂ and a binder resin. A method of light scattering a reflective reflective film and drying it. Further, it is not formed on the scintillator layer, and a method in which a reflector having a metal surface such as aluminum is adhered to the scintillator layer to reflect the scintillator light is also put into practical use.

The moisture-proof structure for protecting the scintillator layer or the reflective layer (or the reflecting plate or the like) from the external atmosphere and suppressing deterioration of characteristics due to humidity or the like is an important component for making the detector a practical product. In particular, when a CsI:Tl film or a CsI:Na film which is a material which deteriorates greatly with respect to humidity is used as a scintillator layer, high moisture resistance is required.

As the moisture-proof structure, there is a method of using a CVD (Chemical Vapor Deposition) film of poly-para-Xylylene (hereinafter briefly described as parylene), or surrounding the scintillator by a surrounding member. The structure in which the seal is sealed by a combination with the moisture-proof layer is used. As a structure which can obtain a higher moisture-proof performance, an aluminum foil or the like having excellent moisture-proof performance is processed into a cap shape including a scintillator layer, and the flange portion and the substrate are then sealed. According to the moisture-proof structure, when the sealing material to which the inorganic filler is added is used in the subsequent layer, more excellent moisture-proof performance can be obtained.

The moisture-proof structure including the moisture-proof body such as the cap shape of the scintillator layer and the flange portion and the substrate which are sealed next to the moisture-proof body is remarkably superior to other methods in terms of ensuring high moisture-proof performance. In the moisture-proof structure, in order to sufficiently ensure the sealing property between the flange portion of the moisture-proof body such as the cap shape and the substrate, and to ensure high reliability, it is important to sufficiently increase the interposition of the moisture-proof body. The amount of the adhesive applied between the flange portion and the substrate is sufficient The pressing force for bringing the flange portion into close contact with the substrate is increased.

However, if these two conditions are satisfied, the adhesive will inevitably overflow from the flange portion of the moisture-proof body, and an overflow (expansion) of the excess adhesive layer may be formed on the substrate around the flange portion. When the overflow of the adhesive layer reaches the electrode connection tab pad (TAB Pad) formed on the substrate of the peripheral portion of the moisture-proof structure, the pad portion and the FPC (Flexible Print Circuit) cannot be realized. Connection of printed substrate).

In order to avoid such a problem, it is necessary to provide a certain interval or more between the outer end of the flange portion of the moisture-proof body and the pad (Pad) for electrode connection (lead sheet (TAB) or the like). Considering the positional deviation of the adhesion between the moisture-proof body and the substrate (for example, about ±1 mm) and the overflow width of the adhesive (for example, about 3 mm at the maximum), it is necessary to design the outer end of the cap portion of the moisture-proof body to be connected to the electrode. The interval between the Pad portions (TAB or the like) is ensured to be, for example, 4 mm or more. In the case where the Pad portion for electrode connection (TAB or the like) is located on both sides of the signal line side (usually X-TAB) and the control line side (usually Y-TAB), in order to achieve the above object, for example, it is necessary to vertically and horizontally respectively It is 8mm in size.

The size required for the peripheral portion of such a moisture-proof body relative to the same effective pixel area or the size of the region of the scintillator layer formed thereon may increase the size outside the radiation detector, thereby hindering the small size as a radiation detector. Design. Moreover, the overall size of the radiation detector is excessively variable, resulting in an excessive increase in the weight of the detector. It is a major drawback in portable radiological detectors that are particularly lightweight and compact.

In order to suppress the overflow of the adhesive layer, a method of reducing the amount of application of the adhesive or reducing the pressing force is considered. However, in this case, the sealing of the flange portion of the moisture-proof body and the substrate is likely to be insufficient, and thus the temperature is high. The reliability of the high-humidity test or the joint in a hot and cold environment is prone to problems.

Therefore, the purpose of the embodiment is to maintain the reliability of the moisture-proof structure and to downsize the radiation detector.

In order to achieve the above object, a method of manufacturing a radiation detector according to an embodiment is characterized by comprising: an array substrate forming step of forming an array substrate, wherein the array substrate is formed by two-dimensionally arranging photoelectric conversion elements on a substrate; and a scintillator layer forming step Forming a scintillator layer covering the region of the array substrate on which the photoelectric conversion element is arranged and converting the radiation into fluorescence; and the moisture-proof body forming step of forming the metal to form a moisture-proof body, the prevention The wet body includes a surface opposite to a portion of the array substrate surrounding the scintillator layer; and a subsequent step of the opposite end portion between the bonding surface (flange portion) and the array substrate and the pair a region in which the adhesive portion overflows from the outer edge of the flange portion to the outer side, and an overflow portion in which the adhesive agent protrudes higher from the flange portion than the flange portion is formed, and the pressure jig having the frame portion is used to The flange portion is pressurized, and the moistureproof body is connected to the array substrate, and the frame portion is formed with the flange portion Relative to the pressing surface toward the opposite side of the surface portion of the next.

Further, the radiation detector of the embodiment includes: an array substrate obtained by two-dimensionally arranging photoelectric conversion elements on a substrate; and a scintillator layer covering a region of the array substrate on which the photoelectric conversion element is arranged, and Converting radiation into fluorescent light; a moisture-proof body covering a metal formed body of the scintillator layer, and including a flange portion opposed to a portion of the array substrate surrounding the scintillator layer; and an adhesive layer An opposing portion between the flange portion and the array substrate and a region where the opposite end portion overflows from the outer edge of the flange portion to the outside has an overflow portion that protrudes higher from the array substrate than the flange portion And the moisture-proof body is connected to the array substrate.

According to the above embodiment, the reliability of the moisture-proof structure can be maintained, and the radiation detector can be downsized.

10‧‧‧radiation detection device

11‧‧‧radiation detector

12‧‧‧Array substrate

13‧‧‧ scintillation layer

14‧‧‧Reflective film

15‧‧‧Damps

16‧‧‧ glass substrate

18‧‧‧Control line

19‧‧‧Information line

20‧‧ ‧ pixels

21‧‧‧Photoelectric diode

22‧‧‧film transistor

23‧‧‧gate electrode

24‧‧‧Source electrode

25‧‧‧汲electrode

26‧‧‧Terminal group

27‧‧‧Storage capacitor

28‧‧‧Protective film

29‧‧‧ solder pads

30‧‧‧ circuit board

31‧‧‧Support board

32‧‧‧Flexible substrate

33‧‧‧Integral amplifier

34‧‧‧A/D converter

35‧‧‧ column selection circuit

36‧‧‧Image Synthesis Circuit

38‧‧‧ parallel/serial converter

39‧‧‧gate driver

50‧‧‧Flange

51‧‧‧ top board

52‧‧‧Bevel

62‧‧‧ lead

80‧‧‧Next tray

81‧‧‧Border Department

82‧‧‧ recess

84‧‧‧Next tray

85‧‧‧Border Department

86‧‧‧ recess

90‧‧‧Next layer

91‧‧‧ opposite head

92‧‧‧Overflow

93‧‧‧Rewinding Department

94‧‧‧Binder

Fig. 1 is a schematic perspective view of a radiation detecting apparatus according to an embodiment.

Fig. 2 is a circuit diagram of an array substrate of a radiation detector of an embodiment.

Fig. 3 is a block diagram showing a radiation detecting apparatus of an embodiment.

Fig. 4 is a partially enlarged cross-sectional view showing a cross section of a radiation detector of an embodiment.

Fig. 5 is a plan view showing a radiation detector of an embodiment.

Fig. 6 is a side view of a radiation detector of an embodiment.

Fig. 7 is an enlarged cross-sectional view showing the vicinity of the outer peripheral portion of the radiation detector of the embodiment.

Fig. 8 is an enlarged cross-sectional view showing the vicinity of the outer peripheral portion of the radiation detector according to a modification of the embodiment.

Fig. 9 is a schematic cross-sectional view showing the moisture barrier of the embodiment and the array substrate.

Fig. 10 is a graph showing the results of trial production evaluation of the overflow width of the adhesive layer to the outside of the flange portion of the moisture-proof body in the case where the coating amount and the pressing force of the adhesive are changed in one embodiment.

Fig. 11 is a graph showing the results of trial production evaluation of the overflow height of the adhesive agent to the outside of the flange portion of the moisture-proof body in the case where the amount of the adhesive applied and the pressing force are changed in one embodiment.

Fig. 12 is a schematic cross-sectional view showing the adhesion of the moisture-proof body and the array substrate in the comparative example.

Fig. 13 is a graph showing the results of trial production evaluation of the overflow width of the adhesive layer to the outside of the flange portion of the moisture-proof body when the application amount of the adhesive is applied and the pressure is applied in the comparative example of the embodiment.

Fig. 14 is a graph showing the results of trial production evaluation of the overflow height of the adhesive agent to the outside of the flange portion of the moisture-proof body when the application amount of the adhesive is applied and the pressure is applied in the comparative example of the embodiment.

Fig. 15 is a table showing an outline of evaluation samples of a high-temperature high-humidity test and a cold-heat cycle test in one embodiment and a comparative example.

Fig. 16 is a table showing the results of high temperature and high humidity tests in an embodiment and a comparative example.

Figure 17 is a view showing the resolution in the high temperature and high humidity test in an embodiment and a comparative example. A graph of the test results of the characteristics.

Fig. 18 is a table showing the results of the cold heat reliability test in the embodiment and the comparative example.

Fig. 19 is a graph showing the presence or absence of an abnormality in the thermal reliability test in the embodiment and the comparative example.

Fig. 20 is a table showing conditions for producing an underlayer of a sample according to an embodiment and a modification.

Fig. 21 is a table showing the results of a high temperature and high humidity test of a sample according to an embodiment and a modification.

Fig. 22 is a table showing the results of the cold heat reliability test of the samples of the embodiment and the modification.

Fig. 23 is a graph showing the test results of the resolution characteristics in the high-temperature and high-humidity test of the samples of the embodiment and the modification.

Fig. 24 is a graph showing the presence or absence of an abnormality in the cold heat reliability test of the sample according to the embodiment and the modification.

Fig. 1 is a schematic perspective view of a radiation detecting apparatus according to an embodiment. Fig. 2 is a circuit diagram of an array substrate of the radiation detector of the embodiment. Fig. 3 is a block diagram of the radiation detecting apparatus of the embodiment. Fig. 4 is a partially enlarged cross-sectional view showing a cross section of the radiation detector of the embodiment. Fig. 5 is a plan view showing a radiation detector of the embodiment. Fig. 6 is a side view of the radiation detector of the embodiment.

The radiation detector 11 of the present embodiment is an X-ray plane sensor that detects an X-ray image as a radiographic image, and can be used, for example, in general medical applications. The radiation detecting device 10 includes the radiation detector 11, the support plate 31, the circuit substrate 30, and the flexible substrate 32. The radiation detector 11 includes an array substrate 12 and a scintillator layer 13. The radiation detector 11 detects the incident X-rays and converts them into fluorescent light, and converts the fluorescent light into an electrical signal. The radiation detecting device 10 drives the radiation detector 11 and outputs a self-radiation inspection The electrical signal output by the detector 11 is used as image information. The image information output from the radiation detecting device 10 is displayed on an external display or the like.

The array substrate 12 is a photoelectric conversion substrate that converts fluorescence into electrical signals. The array substrate 12 includes a glass substrate 16. On the surface of the glass substrate 16, a plurality of fine pixels 20 are arranged in a square lattice shape. The pixels 20 are arranged in, for example, a rectangular pixel area (working area) having a diagonal length of 13 inches. Each of the pixels 20 includes a thin film transistor 22 and a photodiode 21. Further, on the surface of the glass substrate 16, the control line 18 extends between the pixels 20 along the square lattice in which the pixels 20 are arranged. Further, on the surface of the glass substrate 16, the data lines 19 extend between the pixels 20 along the line of the square lattice in which the pixels 20 are arranged. The scintillator layer 13 is formed on the surface of the region of the array substrate 12 on which the pixels 20 are arranged.

The scintillator layer 13 is provided on the surface of the array substrate 12 of, for example, 14 × 17 inches, and generates fluorescence in the visible light region when X-rays are incident. The generated fluorescent light reaches the surface of the array substrate 12.

The scintillator layer 13 is formed by forming a columnar structure such as cesium iodide (CsI): strontium (Tl) or sodium iodide (NaI): strontium (Tl) by a vacuum deposition method. For example, a vapor deposited film of CsI:Tl is used for the scintillator layer 13, and the film thickness thereof is about 600 μm. The thickness of the column of the columnar crystal of CsI: Tl is, for example, about 8 to 12 μm on the outermost surface. Alternatively, the yttrium oxysulfide (Gd ₂ O ₂ S) phosphor particles may be mixed with a binder material, applied to the array substrate 12, fired and hardened, and diced by a dicer, thereby forming The groove portion is formed in a quadrangular prism shape to form the scintillator layer 13. An inert gas such as nitrogen (N ₂ ) for the atmosphere or anti-oxidation may be enclosed between the columns, or may be in a vacuum state.

The array substrate 12 receives the fluorescent light generated by the scintillator layer 13 and generates an electrical signal. As a result, the visible light image generated by the incident X-rays on the scintillator layer 13 is converted into image information expressed in the form of an electrical signal.

The radiation detector 11 is supported by the support plate 31 so that the surface on the opposite side to the surface on which the scintillator layer 13 is formed is in contact with the support plate 31. The circuit board 30 is disposed on the support board 31 Opposite to the opposite side of the radiation detector 11. The radiation detector 11 and the circuit board 30 are electrically connected by a flexible substrate 32.

Each of the photodiodes 21 is connected to the control line 18 and the data line 19 via a thin film transistor 22 as a switching element. Further, a storage capacitor 27 is connected in parallel to each of the photodiodes 21. The storage capacitor 27 is formed in a rectangular flat plate shape and disposed opposite to the lower portion of each of the photodiodes 21. Further, the storage capacitor 27 is not essential, and the capacitance of the photodiode 21 also serves as the storage capacitor 27.

The photodiode 21 and the storage capacitor 27 connected thereto in parallel are connected to the drain electrode 25 of the thin film transistor 22. The gate electrode 23 of the thin film transistor 22 is connected to the control line 18. The source electrode 24 of the thin film transistor 22 is connected to the data line 19.

The gate electrodes 23 of the thin film transistors 22 arranged in the same column of pixels 20 are connected to the same control line 18. The source electrodes 24 of the thin film transistors 22 arranged in the same row of pixels 20 are connected to the same data line 19.

The gate electrodes 23 of the thin film transistors 22 in the pixels 20 of the same column are connected to the same control line 18. The source electrodes 24 of the thin film transistors 22 in the pixels 20 of the same row are connected to the same data line 19.

Each of the thin film transistors 22 is responsible for switching the charge storage and release generated by the fluorescence incident on the photodiode 21. The thin film transistor 22 is at least partially formed of a semiconductor material such as an amorphous germanium (a-Si) which is an amorphous semiconductor or a polycrystalline semiconductor (P-Si) which is a semiconductor material having crystallinity.

Further, in FIGS. 1 and 2, only five columns of five rows or four columns of four rows are described, but actually there are more, and necessary pixels are formed in accordance with the resolution and the imaging area.

The radiation detecting apparatus 10 includes a radiation detector 11, a gate driver 39, a column selection circuit 35, an integrating amplifier 33, an A/D (analog to digital) converter 34, a parallel/serial converter 38, and a diagram. Like the synthesis circuit 36. The gate driver 39 is connected to each control line 18 of the radiation detector 11. The gate driver 39 controls each of the thin film transistors 22 The action state, that is, on and off. The integrating amplifier 33 is connected to each of the data lines 19 of the radiation detector 11.

The column selection circuit 35 is connected to the gate driver 39. The parallel/series converter 38 is connected to the integrating amplifier 33. The A/D converter 34 is connected to the parallel/series converter 38. The A/D converter 34 is connected to the image synthesizing circuit 36.

The integrating amplifier 33 is provided, for example, on the flexible substrate 32 that connects the radiation detector 11 and the circuit board 30. Other components are provided on, for example, the circuit substrate 30.

The gate driver 39 receives the signal from the column selection circuit 35, and controls the operation state of each of the thin film transistors 22, that is, on and off. That is, the voltage of the control line 18 is sequentially changed. The gate driver 39 is mounted near, for example, the periphery of the surface of the array substrate 12. The column selection circuit 35 transmits a signal for selecting a specific column of the scanned X-ray image to the gate driver 39. The integrating amplifier 33 amplifies and outputs an extremely small charge signal output from the radiation detecting panel through the data line 19.

An insulating protective film 28 is formed on the surface of the array substrate 12, and the insulating protective film 28 covers the detecting elements such as the photodiode 21 and the thin film transistor 22, and the metal wiring such as the control line 18 and the data line 19. The scintillator layer 13 is formed on the surface of the protective film 28 so as to cover the region in which the pixels 20 are arranged.

In many cases, the reflective film 14 is provided on the surface of the scintillator layer 13. The reflective film 14 reflects the phosphor generated by the scintillator layer 13 away from the array substrate 12 toward the array substrate 12 side. Thereby, the amount of fluorescent light reaching the photodiode 21 is increased.

The reflection film 14 is formed by a method of forming a film on a scintillator layer by a metal having a high fluorescence reflectance such as a silver alloy or aluminum. Alternatively, a reflector having a metal surface such as aluminum may be adhered to the scintillator layer 13, or a reflective film 14 containing a diffuse reflectance of a light-scattering substance such as TiO ₂ and a binder resin may be applied. Further, the reflection film 14 is not necessarily required depending on characteristics such as resolution and brightness required by the radiation detector 11.

The radiation detector 11 is provided with a moisture proof structure. The moisture-proof structure will cover the scintillator layer 13 The moisture-proof body 15 of the reflective film 14 is then formed by sealing on the surface of the array substrate 12.

The moisture-proof body 15 is formed in a hat shape in which the central portion is raised. The peripheral portion of the moisture-proof body 15 is a flat band-shaped flange portion 50. The flange portion 50 is formed in a strip shape that surrounds the outer surface of the region of the array substrate 12 on which the scintillator layer 13 is formed. A top plate portion 51 is formed inside the flange portion 50. The top plate portion 51 is a flat portion slightly larger than the scintillator layer 13. A slope portion 52 is formed between the flange portion 50 and the top plate portion 51.

The flange portion 50 faces the array substrate 12. The flange portion 50 and the array substrate 12 are followed. The scintillator layer 13 and the reflective film 14 formed on the array substrate 12 are covered by the top plate portion 51 and the slope portion 52 of the moistureproof body 15. The moistureproof body 15 protects the scintillator layer 13 and the reflective film 14 from the outside atmosphere or humidity.

The moistureproof body 15 is formed of a foil such as aluminum or aluminum alloy. As the present embodiment, the moisture-proof body 15 is formed of a 0.1 mm AlN30-O material (annealed material of a pure aluminum-based material). The width of the flange portion 50 is, for example, 2.5 mm.

A terminal pad 26 is formed by arranging the pads 29 exposed at the ends of each of the control line 18 and the data line 19 on the array substrate 12. The terminal groups 26 are arranged along the sides of the array substrate 12. The terminal group 26 connected to the control line 18 and the terminal group 26 connected to the data line 19 are arranged along different sides. The terminal groups 26 are electrically connected to the circuit board 30 via the flexible substrate 32.

Fig. 7 is an enlarged cross-sectional view showing the vicinity of the outer peripheral portion of the radiation detector of the embodiment.

Lead wires 62 are extended from the working region in which the X-ray image is obtained from the central portion of the array substrate 12 to the pads 29 arranged in the peripheral portion of the substrate. An inorganic film of about 0.2 to 0.3 μm and an organic film of about 2 μm are formed as the protective film 28 on the outermost layer of the array substrate 12. As the lead wire, a control line 18 for driving a TFT (Thin Film Transistor), a data line 19 for reading an electric charge corresponding to an X-ray image, and a signal line 19 for applying the photodiode 21 are applied. The bias voltage of the bias voltage.

The moisture-proof body 15 and the array substrate 12 are followed by the subsequent layer 90. Layer 90 then contains The opposite portion 91 and the overflow portion 92 are opposed. The opposing portion 91 is formed between the flange portion 50 and the array substrate 12. The overflow portion 92 is a portion that overflows outward from the outer edge of the flange portion 50, that is, from the outer edge of the flange portion 50 toward the outer edge of the array substrate 12. The overflow portion 92 of the layer 90 then protrudes from the surface of the array substrate 12. The protruding height of the overflow portion 92 is at least higher than the surface of the flange portion 50 opposite to the array substrate 12 in the case of this example.

Fig. 8 is an enlarged cross-sectional view showing the vicinity of the outer peripheral portion of the radiation detector according to a modification of the embodiment.

In this modification, the overflow portion 92 is wound around the surface of the flange portion 50 opposite to the opposite end portion 91. That is, the vicinity of the outer edge of the flange portion 50 is sandwiched by the opposing end portion 91 and the rewinding portion 93.

Next, a method of manufacturing the radiation detector will be described.

First, the array substrate 12 is manufactured by forming the pixel 20, the control line 18, the data line 19, and the like on the glass substrate 16. Next, a scintillator layer 13 is formed on the surface of the array substrate 12. Further, a foil of aluminum or aluminum alloy is press-formed, and the moisture-proof body 15 is obtained in advance. Then, the moistureproof body 15 is followed by the array substrate 12.

Fig. 9 is a schematic cross-sectional view showing the state of the moisture barrier and the array substrate of the embodiment.

When the moisture-proof body 15 and the array substrate 12 are next to each other, a tray (pressure fixture) 80 is used. Next, the tray 80 is formed with a frame portion 81 on which the flange portion 50 is placed. A concave portion 82 is formed on the inner side of the frame portion 81. The moisture-proof body 15 is placed on the next tray 80 in a state where the flange portion 50 is placed on the frame portion 81 and the top plate portion 51 and the inclined surface portion 52 are disposed in the concave portion 82.

The width of the frame portion 81 is substantially the same as the width of the flange portion 50. Further, the size of the concave portion 82 is substantially the same as the size of the top plate portion 51 and the inclined surface portion 52. Therefore, the outer periphery of the moisture-proof body 15 placed on the tray 80 is disposed so as to substantially overlap the outer circumference of the tray 80. The width of the flange portion 50 and the frame portion 81 is, for example, 2.5 mm. Considering the size of the moistureproof body 15 The error may also make the width of the frame portion slightly narrower or slightly wider than the width of the flange of the moisture-proof body.

An adhesive 94 is applied to the surface of the flange portion 50 of the moisture-proof body 15 placed on the tray 80 facing the array substrate 12. The subsequent agent 94 is applied over the entire circumference in a strip shape having a narrower width than the flange portion 50 by, for example, a dispenser. The subsequent agent 94 may be applied while the moisture-proof body 15 is placed on the tray 80, or the moisture-proof body 15 coated with the adhesive 94 may be placed on the subsequent tray.

By pressing the adhesive tray 80 toward the array substrate 12 while the adhesive 94 is applied to the flange portion 50, the flange portion 50 is pressed toward the array substrate 12. The coating amount of the adhesive 94 is such a degree that the adhesive 94 overflows from the outer edge of the flange portion 50 when the flange portion 50 is pressed against the array substrate 12 by a specific pressure. After the flange portion 50 is attached to the array substrate 12 via the adhesive 94, the adhesive 94 is cured.

When the moisture-proof body 15 is pressed against the array substrate 12, the frame portion 81 is not present at least in the region outside the flange portion 50 except for the vicinity of the flange portion 50. That is, the moisture-proof body 15 is located outside the outer edge of the flange portion 50, and has no structure for suppressing the flow of the adhesive 94. As a result, the adhesive 94 that overflows from the outer edge of the flange portion 50 when the flange portion 50 is pressed toward the array substrate 12 spreads along the side surface (edge surface) of the tray 80. Therefore, the expansion of the overflow portion of the bonding layer 90 toward the outer side in the surface direction of the array substrate 12 is suppressed to be small, but is formed in a convex shape in the height direction. In particular, when the moisture-proof body 15 is pressed against the array substrate 12 from the vertically downward direction toward the vertical direction, that is, when the overflowing adhesive 94 hangs down along the side of the tray 80 by gravity, the adhesive 94 The expansion of the overflow portion to the outer side in the surface direction is further suppressed.

After the moisture-proof structure is formed in this manner and the radiation detector 11 is completed, the radiation detecting apparatus 10 is completed by the following steps, that is, the wiring of the signal processing circuit is connected to the pad 29 of the data line 19, and the wiring of the control circuit is connected. In the bonding pad 29 of the control line 18, another mounting step is performed, and an electrical test for confirming whether or not the photoelectric conversion element or the Pad is abnormal is attached, and is assembled in the casing to perform an X-ray image test or the like.

Next, an example of the radiation detector 11 of the present embodiment will be described.

A vapor deposition film of CsI:Tl is used for the scintillator layer 13, and a column having a thickness of about 600 μm and a columnar structure of CsI:Tl has a thickness of about 8 to 12 μm on the outermost surface. The scintillator layer 13 is formed by forming a CsI:Tl film (600 μm) on a substrate corresponding to a size of 14 × 17 inches by vacuum evaporation. The reflective film 14 is formed by applying a coating liquid containing a submicron powder of TiO ₂ , a binder resin, and a solvent onto the scintillator layer 13 and drying it.

The moisture-proof body 15 is formed by press-forming an AL foil having a thickness of 0.1 mm into a structure having a hat portion having a width of 2.5 mm in the peripheral portion. The adhesive 94 is applied to the flange portion 50 of the cap-shaped moisture-proof body 15 by a dispenser device, and bonded to the substrate on which the scintillator film 13 and the reflective film 14 are formed. The subsequent agent 94 is produced by both a heat curing type and an ultraviolet curing type of an epoxy-based material. The subsequent agent 94 has a specific gravity of about 1.4 g/cc. The coating amount of the adhesive agent 94 to the flange portion 50 of the cap-shaped moisture-proof body 15 is 5 standards of 0.4 mg/mm, 0.6 mg/mm, 0.8 mg/mm, 1.2 mg/mm, and 1.6 mg/mm. Trial production.

In the trial production, the succeeding tray 80 shown in Fig. 9 is used next to the flange portion 50 of the moistureproof body 15 and the array substrate 12. The tray 80 is produced by making the width of the frame portion 81 which is pressed at the time of bonding and the width of the flange portion 50 of the moisture-proof body 15 substantially equal to 2.5 mm. In consideration of the positional deviation at the time of bonding, the width of the frame may be slightly, for example, 0.1 to 0.5 mm, and the frame may be slightly wider, for example, having a width of 2.6 to 3.0 mm.

Next to the pressing conditions of the flange portion of the moistureproof body 15 per unit area of 50 to ^{0.5kgf / cm 2, 1.0kgf / cm} 2, 1.5kgf / cm 2, 2.0kgf / cm 2, 2.5kgf / 5 standards for cm ² .

The thickness of the adhesive layer or the amount of overflow of the adhesive layer is determined by determining the thickness of the adhesive layer and the amount of application of the adhesive 94 and the pressing force at the time of bonding. The appropriate viscosity must be selected according to the thickness of the desired layer or the possible manufacturing conditions (coating amount or pressure). Follow-up agent. In the case of using an ultraviolet curable adhesive, although depending on the viscosity, after applying the adhesive, a small amount of ultraviolet rays may be irradiated before the adhesion, and the hardness of the adhesive may be increased by a certain amount. Hehe. The adhesive used for the trial production has a viscosity of about 400 Pa. Sec, for a fairly high viscosity.

Fig. 10 is a graph showing the results of trial production evaluation of the overflow width of the adhesive layer to the outside of the flange portion of the moisture-proof body when the application amount of the adhesive is applied and the pressure is applied in the embodiment. Fig. 11 is a graph showing the results of trial production evaluation of the overflow height of the adhesive agent to the outside of the flange portion of the moisture-proof body in the case where the amount of the adhesive applied and the pressing force are changed in the present embodiment. The values of the overflow width and the overflow height represent the average value.

In the present embodiment, since there is no structure for suppressing the flow of the adhesive 94 on the outer side of the flange portion 50 of the moisture-proof body, the overflow portion 92 of the adhesive layer 90 formed by curing the adhesive 94 is along the side of the tray 80 ( Extended). As a result, the expansion of the overflow portion 92 of the subsequent layer 90 to the outside in the planar direction is suppressed to be small, but is formed in a convex shape along the height direction.

Then, the overflow width of the overflow portion 92 of the layer 90 becomes larger as the coating amount and the pressing force become larger. However, if the applied pressure exceeds about 1.0 kgf/cm ² , the increase in the overflow width accompanying the increase in the pressing force is saturated and becomes substantially constant. Further, the overflow height of the overflow portion 92 of the subsequent layer 90 becomes larger as the coating amount and the pressing force become larger. However, if the applied pressure exceeds about 1.0 kgf/cm ² , the increase in the overflow height accompanying the increase in the pressing force is saturated and becomes substantially constant.

For comparison, a trial production using a tray with a wide frame portion was also carried out.

Fig. 12 is a schematic cross-sectional view showing the adhesion of the moisture-proof body and the array substrate in the comparative example.

In this comparative example, the width of the frame portion 85 of the tray 84 is sufficiently wider than the width of the flange portion 50 of the moistureproof body 15. In this comparative example, the width of the frame of the tray 84 was 20 mm. The size of the recess 86 of the tray 84 is the same as the size of the recess 82 of the tray 80 of the embodiment.

Fig. 13 is a graph showing the results of trial production evaluation of the overflow width of the adhesive layer to the outside of the flange portion of the moisture-proof body when the application amount of the adhesive is applied and the pressure is applied in the comparative example of the present embodiment. Fig. 14 is a graph showing the results of trial production evaluation of the overflow height of the adhesive agent to the outside of the flange portion of the moisture-proof body when the application amount of the adhesive is applied and the pressure is applied in the comparative example of the embodiment.

In the comparative example, the frame portion 85 of the tray 84 that suppresses the flow of the adhesive 94 in the height direction is present on the outer side of the flange portion 50 of the moistureproof body 15. Therefore, the overflow portion of the adhesive 94 spreads toward the outer side of the substrate. Further, the gap between the array substrate 12 and the frame portion 85 of the tray 84 is at most the thickness of the flange portion 50 of the moisture-proof body 15 (0.1 mm in this comparative example), and even if a small amount of the adhesive 94 overflows, The expansion to the outside of the array substrate 12 also becomes large.

As described above, according to the present embodiment, it is understood that the width of the overflow portion 92 of the subsequent layer 90 is remarkably small even with the same amount of the adhesive applied and the pressing condition. Even if the coating amount and the pressure condition range of the adhesive 94 are largely changed, the width of the overflow portion 92 of the layer 90 is converged to at most about 1.5 mm even if it becomes large. According to the present embodiment, according to the present embodiment, when the moisture-proof body 15 is 2 to 3 mm from the outer periphery of the adhesive layer 90, it is possible to realize a miniaturization design in which the bonding pads 29 and the like are disposed on the outer side.

On the other hand, in the comparative example in which the frame portion 85 of the tray 84 was enlarged, depending on the amount of application of the adhesive 94 and the conditions of pressurization, an overflow of the adhesive of more than 10 mm occurred in the current research range. It can be seen that under the tendency that the coating amount of the adhesive 94 is increased and the pressing force is increased, the maximum height of the overflow portion of the subsequent layer is not largely changed, and the width of the overflow portion of the subsequent layer is remarkably large. Therefore, in order to appropriately ensure the width of the adhesive layer and suppress the overflow of the sealing material so as not to reach the surrounding pad portion or the like, the control of the conditions becomes extremely difficult. If a difference occurs in the width of the overflow portion of the adhesive layer in the front, back, left, and right directions, the size to be ensured on the outer side of the effective pixel region may be as large as 10 mm or more. That is, as in the present embodiment, the outer side of the flange portion 50 of the moistureproof body is removed. The configuration of the flow of the adhesive 94 is clearly advantageous for the miniaturization design of the radiation detector 11.

In the present embodiment and the comparative example, in order to investigate the reliability of the moisture-proof structure, a high-temperature high-humidity test and a cold-heat cycle test were performed. These tests were carried out in the form of a panel formed to have a moisture-proof structure. In addition, the high-temperature and high-humidity test and the hot and cold cycle test were finally confirmed in the state of the product which was incorporated into the casing, but the results were basically the same as those in the state of being formed into the panel having the moisture-proof structure.

Fig. 15 is a table showing an outline of evaluation samples of the high-temperature high-humidity test and the cold-heat cycle test in the present embodiment and the comparative example.

The evaluation samples for the reliability tests were produced using a pure dummy panel including a photoelectric conversion element or a TFT without forming a pixel pattern. The glass substrate and the uppermost protective film correspond to a solid substrate, and no other film or pattern is formed. The reason for this is that it is suitable to separately measure the brightness or the resolution of the panel formed to have a moisture-proof structure. Further, regarding the moisture-proof reliability or the cold-heat reliability of the subsequent structure portion of the present embodiment, it is considered that evaluation by the trial production evaluation of the dummy panel can be achieved in the same manner as the physical substrate.

Fig. 16 is a table showing the results of the high-temperature and high-humidity test in the present embodiment and the comparative examples. Fig. 17 is a graph showing the test results of the resolution characteristics in the high-temperature and high-humidity test in the present embodiment and the comparative example.

The reliability under high temperature and high humidity was evaluated by tracking how the luminance and resolution characteristics obtained by the scintillator layer and the reflective film deteriorated according to the storage time in the environment of 60 ° C - 90% RH. Fig. 16 shows the results of evaluation of the resolution characteristics which are particularly sensitive to humidity. The resolution characteristic was carried out by arranging the resolution map on the surface side of the sample, irradiating X-rays corresponding to RQA-5, and measuring a CTF (Contrast transfer function) of 2 Lp/mm from the back side. The CTF in the initial state was set to 100%, and the retention rate (%) with respect to the storage time of 60 ° C - 90% RH was shown.

By comparing with the table of Fig. 15, it can be seen that there is a sample with overflow of the subsequent layer and no overflow. Compared with the sample, the resolution retention rate of high temperature and high humidity is good. Further, in the case of the succeeding tray production using a narrow bezel, the sample having a small overflow width on the outer side of the layer and having a large overflow height is formed on the succeeding tray using the wide bezel, and the overflow width on the outer side of the subsequent layer is large and the overflow height is small. No significant differences were observed in the samples. The reason why this feature is considered to be that the portion of the adhesive layer 90 that overflows to the outside of the flange portion 50 of the moisture-proof body 15 does not particularly affect the moisture-proof performance, but is formed on the flange portion 50 of the moisture-proof body 15 and Part of the array substrate 12 restricts moisture resistance.

Fig. 18 is a table showing the results of the cold heat reliability test in the present embodiment and the comparative example. Fig. 19 is a graph showing the presence or absence of an abnormality in the thermal reliability test in the present embodiment and the comparative example.

The thermal reliability test was carried out under the conditions of (-20 ° C × 1 h) → (room temperature × 30 minutes) → (60 ° C × 1 h) → (room temperature × 30 minutes), and the number of cycles was at most 100 cycles. Each of the 10 cycles in the middle was reciprocated, and it was confirmed for each sample whether or not an abnormality such as peeling or cracking of the portion having the subsequent layer occurred. In Fig. 19, the vertical axis indicates the number of samples in which the abnormality is not produced, i.e., the sample in which the sealing state is maintained.

As can be seen from the comparison with the table of Fig. 15, the sample having the overflow of the subsequent layer 90 is less likely to cause the peeling or cracking of the adhesive layer in the cold heat test as compared with the sample without overflow. Further, in the case of the succeeding tray 80 which is formed by the narrow frame, the sample having a small overflow width on the outer side of the layer and a large overflow height is formed on the succeeding tray 84 using the wide frame, and the overflow width on the outer side of the layer is large and the overflow height is large. For the smaller sample, no particular difference was observed. The reason why this feature is considered to be that the portion of the layer 90 that overflows to the outside of the flange portion 50 of the moisture-proof body 15 does not particularly affect the adhesion or strength of the adhesive layer with respect to the change of the hot and cold temperature, but is formed on The portion between the flange portion 50 of the moisture-proof body 15 and the array substrate 12 restricts the degree of adhesion or the strength with respect to the thermal stress.

When the flange portion 50 of the moisture-proof body 15 is pressed and the side surface of the frame portion of the tray is located inside the outer edge of the flange portion of the moisture-proof body 15, the vicinity of the layer 90 is formed. It is a shape as shown in FIG. When the adhesive agent is sufficiently overflowed from the flange portion 50 of the moisture-proof body 15 to the outside, the subsequent layer 90 is wound around the opposite side of the flange portion 50 of the moisture-proof body 15 opposite to the array substrate 12. surface.

A reliability test was conducted on a sample in which the adhesive layer of the modification of the present embodiment was wound around the surface of the flange portion of the moisture-proof body opposite to the surface facing the array substrate and a comparative example thereof.

Fig. 20 is a table showing the conditions for producing the underlayer of the sample of the embodiment and the modification. Fig. 21 is a table showing the results of the high-temperature and high-humidity test of the samples of the present embodiment and the modifications. Fig. 22 is a table showing the results of the cold heat reliability test of the samples of the present embodiment and the modifications. Fig. 23 is a graph showing the test results of the resolution characteristics in the high-temperature and high-humidity test of the samples of the present embodiment and the modifications. Fig. 24 is a graph showing the presence or absence of an abnormality in the cold heat reliability test of the sample of the present embodiment and the modification. In Fig. 24, the vertical axis indicates the number of samples in which the sample which is not abnormal, that is, the sample which is maintained in a sealed state.

It can be seen that in the sample having the back layer 90 rewinded on the back surface of the flange portion 50, higher reliability can be ensured particularly in the cold and heat cycle test than in the case of the unwound sample. The reason is considered as follows. That is, the thermal expansion of the array substrate 12 and the moisture-proof body 15 is inferior, and the stress in the peeling direction is applied between the flange portion 50 of the moisture-proof body 15 and the adhesive layer 90. However, it is presumed that the configuration in which the flange portion 50 of the moisture-proof body 15 is sandwiched by the adhesive layer 15 from the back side may exert a resistance against peeling stress.

There is a case where the adhesive 94 which is subsequently overflowed adheres to the frame portion 81 of the tray 80 and the side wall (edge surface) portion of the frame portion 81, and the moisture-proof body 15 and the array substrate 12 are removed from the subsequent tray 80. Become a hindrance. Therefore, it is preferable that the portions where the adhesive 94 is likely to overflow are coated with a material which is difficult to adhere to an adhesive such as a Teflon (registered trademark) tape. Or it is preferable to pre-coat (coat) a material which is difficult to adhere to the adhesive.

The following is clarified by experiment: although it is slightly different depending on the material of the adhesive 94, it is polytetrafluoroethylene (Teflon (registered trademark)), polyoxyl resin, polypropylene. When the surface energy at room temperature (20 to 25 ° C) at a room temperature (20 to 25 ° C) is approximately 30 mN/m or less (at a temperature state in which sealing is performed), the overflow of the adhesive 94 is prevented from being firmly fixed to the subsequent tray 80. Therefore, no particular problem arises when the array substrate 12 and the moisture-proof body 15 are removed from the subsequent tray 84. Further, in addition to the method of attaching the tape, it is also effective to apply Teflon (registered trademark) or polyoxymethylene resin to the portion of the tray 84 in advance. Further, it is also possible to apply a low surface energy fat or the like to the portion of the tray 84 in advance, and to prevent the overflowing adhesive 94 from adhering to the subsequent tray 80.

The bonding of the moistureproof body 15 and the array substrate 12 can also be performed under a reduced pressure atmosphere. When the bonding is performed under reduced pressure, the moisture-proof body 15 is in close contact with the film surface on the array substrate 12, and is adhered to the reflective film 14 on the scintillator layer 13 in the present embodiment. As a result, even if there is vibration or impact, the moisture-proof body 15 does not move on the film surface, and it is difficult to cause an abnormality such as image shake due to the howling effect. Further, by observing the state in which the moisture-proof body 15 is in contact with the film surface, the pressure-reduced state inside the moisture-proof body can be confirmed, and the presence or absence of a leak such as a pinhole of the moisture-proof body 15 or a defect of the adhesive layer 90 can be determined. Avoid spilling out to customers in the event of a leak.

When the moisture-proof body 15 and the array substrate 12 are bonded together under a reduced pressure atmosphere, when the periphery is returned to the atmospheric pressure after that, the difference between the pressure (atmospheric pressure) and the inside pressure of the outer layer 90 is caused. The layer 90 is then subjected to a force that is sucked into the inside of the moisture-proof body 15. In order to avoid such a problem as leakage due to the phenomenon, it is necessary to ensure the hardness, thickness, and subsequent width of the adhesive layer 90 which can withstand external pressure, and the array substrate 12 and the moisture-proof body 15 under reduced pressure before returning to atmospheric pressure. Close contact.

When a cationically polymerized ultraviolet curable adhesive is used, it can be produced, for example, as follows. The width of the flange portion 50 of the moistureproof body 15 was set to 2.5 mm, and the coating amount of the adhesive 94 was set to 0.8 mg/mm. After the application of the adhesive, ultraviolet rays of 365 nm were irradiated at 80 mJ/cm ² .

Thereafter, the subsequent tray 80 on which the moisture-proof body 15 is placed and the array substrate 12 with the scintillator film 13 or the reflective film 14 are placed in a vacuum chamber, and the chamber is decompressed to a pressure of 0.1 atm. The moistureproof body 15 is bonded to the array substrate 12. Thereafter, the chamber is returned to atmospheric pressure, and ultraviolet rays are irradiated from the back surface of the array substrate 12 to about 6 J/cm ² to increase the hardness of the adhesive 94. Further, the curing of the adhesive layer 90 was completed by heat treatment at 60 ° C for 3 hours.

The lead 62 connecting the pixel region and the pad 29 of the external circuit is bonded to the portion of the array substrate 12 by the flange portion 50 of the moisture-proof body 15. Therefore, when ultraviolet rays are irradiated from the back surface of the array substrate 12, part of the ultraviolet rays in the lead 62 are not irradiated to the adhesive. That is, it does not harden.

Therefore, a cationic polymerization type ultraviolet curing adhesive can be used. The cationic polymerization type ultraviolet ray adhesive has a characteristic that the curing reaction generated in the ultraviolet ray irradiation portion is continued after the ultraviolet ray irradiation, and also propagates to the peripheral portion of the ultraviolet ray irradiation portion. According to this feature, the curing reaction of the portion irradiated by the ultraviolet rays between the peripheral wirings propagates, and the propagation of the curing reaction at the time of heat curing is promoted, thereby becoming an adhesive 94 of a portion of the lead 62 of, for example, about 50 μm to 100 μm. A certain hardness can also be obtained. Due to this effect, the viscosity of the ultraviolet curable adhesive is excellent, the long-term application period, the ease of handling, and the like, and the metal wiring 62 can be provided by irradiating ultraviolet rays from the back surface of the array substrate 12. The region forms an adhesive layer 90.

Although the material of the moistureproof body 15 to the aluminum foil of 0.1mmt, but the material is not limited to aluminum, aluminum alloy may also be used, with the resin or inorganic film (Al or light metal such as _{SiO 2, SiON, Al 2 O} 3 ceramics such It is a low moisture permeability moistureproof material with a laminated structure. Further, the thickness is not excessively absorbed to the extreme extent of X-rays as much as necessary, and the range is not particularly limited as long as it does not cause a problem with the substrate due to its rigidity.

Further, in Fig. 9, the side surface (edge surface) of the frame portion 81 of the tray 80 is perpendicular to the pressing surface, but the side surface (edge surface) may be curved or may be chamfered. Then layer 90 overflows The vertical shape of the outlet portion 92 differs depending on the shape of the side surfaces. However, the adhesive 94 flows so as to become convex upward from the surface of the array substrate 12, and the expansion to the outside of the array substrate 12 is suppressed.

As described above, according to the present embodiment, the array substrate 12 and the flange portion 50 of the moisture-proof body 15 are followed by the adhesion layer 90 except for the opposite portion between the flange portion 50 of the moisture-proof body 15 and the surface of the array substrate 12. In addition to 91, it is also formed by overflowing onto the surface of the array substrate 12 outside the flange portion 50. Further, the overflow portion 92 formed by the overflow of the layer 90 to the outside of the flange portion 50 is convex on the upper side, and the maximum height thereof exceeds the height of the upper surface of the flange portion 50. The radiation detector 11 is formed on the moisture-proof body 15 when the adhesive layer 94 is interposed between the flange portion 50 of the moisture-proof body 15 including the scintillator layer 13 and the array substrate 12 to form the adhesive layer 90. The backing tray 80 having a frame-shaped pressing surface is disposed on the back side of the flange portion 50 facing the array substrate 12, and then the outer side surface (edge surface) of the pressing surface of the tray 80 is located on the moistureproof body 15 The outer edge of the flange portion 50 is on the extension line or near the outer edge of the flange portion 50.

According to the method for producing a radiation detector and the radiation detector, the amount of the adhesive 94 or the pressing force at the time of bonding can be adjusted, and a sufficient sealing material can be surely formed to the outer portion of the cap-shaped moisture-proof body. Further, by the subsequent pressing of the flange portion 50 of the moisture-proof body 15 to a predetermined shape, the expansion of the adhesive layer 90 in the outer direction is minimized. As a result, the flange portion 50 of the moisture-proof body 15 and the array substrate 12 are in close contact with each other with the largest area, so that it is possible to reliably have high moisture-proof performance, high thermal environment change, or high reliability in a high-temperature and high-humidity environment. Further, at the same time, it is possible to reduce the possibility of occurrence of defects due to the expansion of the adhesive agent to the pads 29 disposed around the moisture-proof body 15. That is, it is possible to provide a radiation detector having a highly reliable moisture-proof structure and also having a compact design.

The embodiments of the present invention have been exemplified above, but the embodiments are presented as examples and are not intended to limit the scope of the invention. These novel implementations The form can be implemented in various other forms, and various omissions, substitutions, and changes can be made without departing from the spirit of the invention. The embodiments and variations thereof are included in the scope of the invention and the scope of the invention as set forth in the appended claims. Further, each of the above embodiments can be implemented in combination with each other.

11‧‧‧radiation detector

12‧‧‧Array substrate

13‧‧‧ scintillation layer

14‧‧‧Reflective film

15‧‧‧Damps

16‧‧‧ glass substrate

28‧‧‧Protective film

29‧‧‧ solder pads

50‧‧‧Flange

51‧‧‧ top board

52‧‧‧Bevel

62‧‧‧ lead

90‧‧‧Next layer

91‧‧‧ opposite head

92‧‧‧Overflow

Claims (8)

A method for manufacturing a radiation detector, comprising: an array substrate forming step of forming an array substrate, wherein the array substrate is formed by two-dimensionally arranging photoelectric conversion elements on a substrate; and a scintillator layer forming step of forming a scintillator layer, The scintillator layer covers a region of the array substrate on which the photoelectric conversion element is arranged, and converts radiation into fluorescence; a moisture-proof body forming step forms a moisture-proof body, and the moisture-proof body includes the above-mentioned array substrate a portion of the body layer facing the flange portion; and a further step of overflowing the opposite end portion between the flange portion and the array substrate from the outer edge of the flange portion to the outer side a region in which an adhesive is formed from the overflow portion of the array substrate that protrudes higher than the flange portion, and the flange portion is pressurized by a pressurizing jig having a frame portion to cause the moisture-proof body and the In the array substrate, the frame portion is formed with a pressing surface that faces the surface opposite to the opposite end portion of the flange portion. The method of manufacturing the radiation detector of claim 1, wherein the outer edge of the frame portion is located further inside than the outer edge of the flange portion. The method of manufacturing a radiation detector according to claim 2, wherein the overflow portion is formed to be wound around a surface opposite to the opposite side of the flange portion. The method of manufacturing a radiation detector according to any one of claims 1 to 3, wherein in said subsequent step, said moisture-proof system is pressed against said array substrate from a vertically lower side. The method of manufacturing a radiation detector according to claim 1, wherein the surface of the frame portion that is in contact with the adhesive is coated with a material having a surface energy of 30 mN/m or less at room temperature. The method of manufacturing the radiation detector of claim 1, wherein the subsequent step is performed under a reduced pressure atmosphere of subatmospheric pressure. The method of producing a radiation detector according to claim 1, wherein the adhesive is an ultraviolet curing adhesive which is subjected to a curing reaction by cationic polymerization, and is disposed in a region of the array substrate having circuit wiring, by using the array The surface of the opposite side of the substrate is hardened by ultraviolet rays. A radiation detector comprising: an array substrate formed by two-dimensionally arranging photoelectric conversion elements on a substrate; a scintillator layer covering an area of the array substrate on which the photoelectric conversion elements are arranged, and converting the radiation a phosphor; a moisture-proof body which is a molded body formed of a metal foil or a thin plate covering the scintillator layer, and includes a flange portion opposed to a portion of the array substrate surrounding the scintillator layer; and a layer having a facing portion between the flange portion and the array substrate and a region where the opposite portion overflows from an outer edge of the flange portion to an outer side, and the flange portion is formed from the array substrate The overflow portion is protruded higher, and the moisture-proof body is followed by the array substrate.