[go: up one dir, main page]
More Web Proxy on the site http://driver.im/

TWI588194B - Resin composite - Google Patents

Resin composite Download PDF

Info

Publication number
TWI588194B
TWI588194B TW100148409A TW100148409A TWI588194B TW I588194 B TWI588194 B TW I588194B TW 100148409 A TW100148409 A TW 100148409A TW 100148409 A TW100148409 A TW 100148409A TW I588194 B TWI588194 B TW I588194B
Authority
TW
Taiwan
Prior art keywords
resin
resin composition
weight
parts
graft copolymer
Prior art date
Application number
TW100148409A
Other languages
Chinese (zh)
Other versions
TW201326280A (en
Inventor
許順益
戴嘉宏
蘇文義
Original Assignee
奇美實業股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 奇美實業股份有限公司 filed Critical 奇美實業股份有限公司
Priority to TW100148409A priority Critical patent/TWI588194B/en
Priority to CN2012104972499A priority patent/CN103172993A/en
Publication of TW201326280A publication Critical patent/TW201326280A/en
Application granted granted Critical
Publication of TWI588194B publication Critical patent/TWI588194B/en

Links

Landscapes

  • Compositions Of Macromolecular Compounds (AREA)

Description

樹脂組成物Resin composition

本發明係關於一種樹脂組成物,尤指一種可提升熱傳導係數之樹脂組成物。The present invention relates to a resin composition, and more particularly to a resin composition which can increase the heat transfer coefficient.

聚碳酸酯系樹脂具有極佳之模具和塑形能力,因此廣泛應用於日常生活中的各種領域。例如,樹脂組成物可用於製作成筆記型電腦、攜帶型儀器之外殼,而由於設置於其內部之中央處理器(CPU)、記憶體、硬碟等元件係為發熱源,並且隨著筆記型電腦、攜帶型儀器之高速化,使得中央處理器之發熱量會越來越增加,因此散熱問題就顯得更為重要。Polycarbonate resins are widely used in various fields of daily life because of their excellent mold and shape. For example, the resin composition can be used as a casing for a notebook computer or a portable device, and a component such as a central processing unit (CPU), a memory, a hard disk, or the like disposed inside is a heat source, and is attached to a notebook. The high speed of computers and portable instruments makes the heat generated by the central processor more and more, so the heat dissipation problem is even more important.

對於散熱而言,外殼所使用之材料較佳是具有高熱傳導率者,由於一般的樹脂材料熱傳導率都很低,因此就必須探討使用樹脂製外殼時,使外殼散熱之其他方法。For the heat dissipation, the material used for the outer casing is preferably one having a high thermal conductivity. Since the general thermal conductivity of the resin material is low, it is necessary to investigate other methods of dissipating the outer casing when using the resin outer casing.

此外,從環境方面來考量,對應德國或瑞士等國家之環保標籤(Eco Label)之要求,較佳係使用不含有氯或溴等鹵素之阻燃性材料。In addition, from the environmental point of view, it is preferable to use a flame retardant material which does not contain a halogen such as chlorine or bromine, in accordance with the requirements of the Eco Label of a country such as Germany or Switzerland.

例如,日本專利特開2000-349486號中,係揭露一種外殼係對經成形加工熱可塑性樹脂所得到之樹脂成形品的表面進行金屬電鍍,使可得到輕質量且具有高剛硬性、熱傳導性良好及低成本之機器外殼。然而,其使用的磷酸酯系阻燃劑會使得樹脂組成物在成形時氣體之產生量會變多而導致良率低下的問題。For example, Japanese Laid-Open Patent Publication No. 2000-349486 discloses a case in which a surface of a resin molded article obtained by forming a thermoplastic resin is subjected to metal plating to obtain a light weight, high rigidity, and good thermal conductivity. And a low-cost machine casing. However, the phosphate-based flame retardant used therein causes a problem that the amount of gas generated during the molding of the resin composition increases, resulting in a low yield.

有鑑於上述之狀況,本領域需研究開發新的改良配方,使可不斷的提升熱傳導係數,而可具有長的使用壽命,並同時符合環保要求。In view of the above situation, it is necessary to research and develop new and improved formulations in the field, so that the heat transfer coefficient can be continuously improved, and the service life can be long and at the same time meet environmental protection requirements.

藉此,本發明提供了一種樹脂組成物,其係包括:一熱塑性樹脂;以及一鱗片型石墨,其係包括至少二種粒徑之鱗片型石墨。Accordingly, the present invention provides a resin composition comprising: a thermoplastic resin; and a flaky graphite comprising flaky graphite of at least two particle sizes.

本發明之樹脂組成物透過成形製得之樣品可具有高的熱傳導係數(實驗結果測得為0.76 W/m*K以上),亦即提高散熱效果。因此,本發明之樹脂組成物的改良配方,可提升樣品的熱傳導係數,故能提高其商業上的價值。The sample obtained by the molding of the resin composition of the present invention can have a high heat transfer coefficient (the experimental result is measured to be 0.76 W/m*K or more), that is, the heat dissipation effect is improved. Therefore, the improved formulation of the resin composition of the present invention can increase the heat transfer coefficient of the sample, thereby improving its commercial value.

本發明之樹脂組成物中,以該樹脂組成物之總重為100重量份計,該熱塑性樹脂之含量較佳可為60~70重量份;該鱗片型石墨之含量較佳可為15~30重量份。鱗片型石墨之含量少於15重量份則熱傳導性有下降趨勢,含量高於30重量份則表面外觀和加工性不佳。In the resin composition of the present invention, the content of the thermoplastic resin is preferably from 60 to 70 parts by weight based on 100 parts by weight of the total of the resin composition; and the content of the scaly graphite is preferably from 15 to 30. Parts by weight. When the content of the flake type graphite is less than 15 parts by weight, the thermal conductivity tends to decrease, and when the content is more than 30 parts by weight, the surface appearance and workability are not good.

本發明之樹脂組成物中,該鱗片型石墨較佳可係包括:平均粒徑為30μm~40μm之鱗片型石墨;以及平均粒徑為300μm~400μm之鱗片型石墨。其中,該平均粒徑為30μm~40μm之鱗片型石墨與該平均粒徑為300μm~400μm之鱗片型石墨之重量含量比較佳可為1:5~1:7。In the resin composition of the present invention, the flaky graphite may preferably include flaky graphite having an average particle diameter of 30 μm to 40 μm; and flaky graphite having an average particle diameter of 300 μm to 400 μm. The flaky graphite having an average particle diameter of 30 μm to 40 μm and the flaky graphite having an average particle diameter of 300 μm to 400 μm preferably have a weight content of 1:5 to 1:7.

本發明之樹脂組成物中,適用於擠壓或射出成型之任一種熱塑性樹脂均可作為本發明之熱塑性樹脂,如一般常見之熱塑性塑膠及熱塑型工程級塑膠。舉例來說,熱塑性樹脂可包括:聚乙烯系樹脂、聚丙烯系樹脂、聚氯乙烯系樹脂、聚苯乙烯系樹脂、聚苯乙烯系接枝共聚物樹脂、苯乙烯-丁二烯系共聚物樹脂、聚醯胺系樹脂、聚甲醛系樹脂、聚碳酸酯系樹脂、聚甲基丙烯酸甲酯系樹脂、液晶聚合物樹脂、聚偏氟乙烯系樹脂、聚苯醚系樹脂、或聚苯硫醚系樹脂。上述樹脂可為共聚物或兩種以上之混合物。In the resin composition of the present invention, any thermoplastic resin suitable for extrusion or injection molding can be used as the thermoplastic resin of the present invention, such as a thermoplastic plastic and a thermoplastic engineering grade plastic which are generally used. For example, the thermoplastic resin may include a polyethylene resin, a polypropylene resin, a polyvinyl chloride resin, a polystyrene resin, a polystyrene graft copolymer resin, and a styrene-butadiene copolymer. Resin, polyamine resin, polyoxymethylene resin, polycarbonate resin, polymethyl methacrylate resin, liquid crystal polymer resin, polyvinylidene fluoride resin, polyphenylene ether resin, or polyphenylene sulfide Ether resin. The above resin may be a copolymer or a mixture of two or more.

較佳地,本發明之樹脂組成物中,該熱塑性樹脂係包括至少一種選自:聚苯乙烯系樹脂、及非聚苯乙烯系樹脂;更佳係包括至少一種選自:聚苯乙烯系接枝共聚物樹脂、及聚碳酸酯樹脂。其中,該聚苯乙烯系接枝共聚物樹脂例如可為苯乙烯系-共軛二烯橡膠-丙烯腈系接枝共聚物樹脂或苯乙烯系-共軛二烯橡膠-(甲基)丙烯酸酯系接枝共聚物樹脂。Preferably, in the resin composition of the present invention, the thermoplastic resin comprises at least one selected from the group consisting of polystyrene resins and non-polystyrene resins; more preferably at least one selected from the group consisting of polystyrene Branch copolymer resin, and polycarbonate resin. Here, the polystyrene-based graft copolymer resin may be, for example, a styrene-conjugated diene rubber-acrylonitrile-based graft copolymer resin or a styrene-conjugated diene rubber-(meth)acrylate. A graft copolymer resin.

本發明之苯乙烯系單體可為:苯乙烯、α-甲基苯乙烯、間-氯苯乙烯、對-第三丁基苯乙烯、對-甲基苯乙烯、鄰-氯苯乙烯、對-氯苯乙烯、2,5-二氯苯乙烯、3,4-二氯苯乙烯、2,4,6-三溴苯乙烯、或2,5-二溴苯乙烯等,其中,以苯乙烯或α-甲基苯乙烯較佳。The styrene monomer of the present invention may be: styrene, α-methylstyrene, m-chlorostyrene, p-tert-butylstyrene, p-methylstyrene, o-chlorostyrene, or the like. -chlorostyrene, 2,5-dichlorostyrene, 3,4-dichlorostyrene, 2,4,6-tribromostyrene, or 2,5-dibromostyrene, among others, styrene Or α-methylstyrene is preferred.

適用於本發明之共軛二烯橡膠,較佳如丁二烯橡膠、異戊間二烯橡膠、或氯丁二烯橡膠等;其中,丁二烯橡膠有高順式(Hi-Cis)含量及低順式(Los-Cis)含量之分;高順式橡膠中,其順式(Cis)/乙烯基(Vinyl)之典型重量組成為94~98%/1~5%,其餘組成為反式(Trans)結構;其Mooney黏度在20~120間,分子量範圍以100,000~800,000為佳;低順式橡膠中,順式/乙烯基之典型重量組成為20~40%/1~20%,其餘為反式結構;其Mooney黏度在20~120間;其他適合的橡膠材料尚有:丙烯 橡膠、苯乙烯/丁二烯橡膠,或是上述不同橡膠之混合,苯乙烯/丁二烯橡膠即俗稱的SBR;適合於本發明之苯乙烯/丁二烯共聚合橡膠,其聚合型式可為二段式(di-block)共聚合、三段式(tri-block)共聚合、無規則共聚物(random)或星式共聚合(star type)。而苯乙烯/丁二烯橡膠之重量比例範圍較佳為5/100到80/20,分子量範圍較佳為50,000~600,000;上述適用於本發明之橡膠以丁二烯橡膠及苯乙烯/丁二烯橡膠為佳,其中又以丁二烯橡膠更佳。The conjugated diene rubber suitable for use in the present invention is preferably a butadiene rubber, an isoprene rubber, or a chloroprene rubber; among them, the butadiene rubber has a high cis (Hi-Cis) content. And low cis (Los-Cis) content; in high cis rubber, the typical weight composition of cis (Cis) / vinyl (Vinyl) is 94 ~ 98% / 1 ~ 5%, the rest of the composition is reverse Trans (Trans) structure; its Mooney viscosity is between 20 and 120, and the molecular weight range is from 100,000 to 800,000; in low cis rubber, the typical weight composition of cis/vinyl is 20-40%/1 to 20%. The rest is a trans structure; its Mooney viscosity is between 20 and 120; other suitable rubber materials are: propylene rubber, styrene/butadiene rubber, or a mixture of the above different rubbers, styrene/butadiene rubber Commonly known as SBR; a styrene/butadiene copolymerized rubber suitable for the present invention, the polymerization type of which can be a di-block copolymerization, a tri-block copolymerization, a random copolymer (random) or star type. The weight ratio of the styrene/butadiene rubber is preferably from 5/100 to 80/20, and the molecular weight range is preferably from 50,000 to 600,000; the above-mentioned rubber suitable for the present invention is butadiene rubber and styrene/butadiene. The olefin rubber is preferred, and the butadiene rubber is more preferred.

使用於本發明之丙烯腈系單體可為:丙烯腈、或α-甲基丙烯腈等,其中以丙烯腈較佳;其中,(甲基)丙烯酸酯系單體可為:甲基丙烯酸甲酯、甲基丙烯酸乙酯、甲基丙烯酸丙酯、甲基丙烯酸丁酯、甲基丙烯酸苯甲酯、甲基丙烯酸己酯、甲基丙烯酸環己酯、甲基丙烯酸十二酯、甲基丙烯酸2-羥乙酯、甲基丙烯酸縮水甘油酯、甲基丙烯酸二甲氨基乙酯、或丙烯酸甲酯及丙烯酸丁酯等,其中以甲基丙烯酸甲酯、或丙烯酸丁酯為佳。The acrylonitrile-based monomer used in the present invention may be: acrylonitrile or α-methacrylonitrile, and among them, acrylonitrile is preferable; and the (meth) acrylate monomer may be: methacrylic acid Ester, ethyl methacrylate, propyl methacrylate, butyl methacrylate, benzyl methacrylate, hexyl methacrylate, cyclohexyl methacrylate, dodecyl methacrylate, methacrylic acid 2-hydroxyethyl ester, glycidyl methacrylate, dimethylaminoethyl methacrylate, or methyl acrylate and butyl acrylate, etc., of which methyl methacrylate or butyl acrylate is preferred.

使用於本發明之聚碳酸酯系樹脂可能是任何習知技藝中已知的單一單體聚碳酸酯或共聚碳酸酯,上述聚碳酸酯系樹脂可以根據任何習知技藝中已知的製程來備,例如利用界面縮聚製程、在均相中的縮聚作用、或過酯化作用(transesterification),這些製程和組合反應物、聚合物、催化劑、溶劑和條件是既有技藝中所熟知的,合適的聚碳酸酯可從下列雙酚類作選擇:二羥基聯苯、雙-(羥苯基)-烷、雙-(羥苯基)-雙烷、雙-(羥苯基)-硫化物、雙-(羥苯基)-醚、雙-(羥苯基)-酮、雙-(羥苯基)-亞碸、雙-(羥苯基)-碸、烷基環亞己基雙酚類、對-(羥苯基)-二異丙基苯,以及前述化合物的核烷化、核鹵化衍生物及其混合物。The polycarbonate-based resin used in the present invention may be any single-comon polycarbonate or copolycarbonate known in the art, and the above-mentioned polycarbonate-based resin may be prepared according to any process known in the art. For example, utilizing interfacial polycondensation processes, polycondensation in homogeneous phase, or transesterification, such processes and combinations of reactants, polymers, catalysts, solvents, and conditions are well known in the art, suitable Polycarbonates can be selected from the following bisphenols: dihydroxybiphenyl, bis-(hydroxyphenyl)-alkane, bis-(hydroxyphenyl)-bis, bis-(hydroxyphenyl)-sulfide, double -(hydroxyphenyl)-ether, bis-(hydroxyphenyl)-one, bis-(hydroxyphenyl)-arylene, bis-(hydroxyphenyl)-fluorene, alkylcyclohexylene bisphenol, pair -(Hydroxyphenyl)-diisopropylbenzene, and the core alkylation, nuclear halogenated derivatives and mixtures thereof of the foregoing compounds.

前述雙酚類的具體實施例有:4,4'-二羥基聯苯、2,2-雙-(4-羥苯基)-丙烷、2,4-雙-(4-羥苯基)-2-甲基丁烷、1,1-雙-(4-羥苯基)-環己烷、α,α-雙-(4-羥苯基)-二異丙基苯、2,2-雙-(3-甲基-4-羥苯基)-丙烷、2,2-雙-(3-氯-4-羥苯基)-丙烷、雙-(3,5-二甲基-4-羥苯基)-甲烷、2,2-雙-(3,5-二甲基-4-羥苯基)-丙烷、雙-(3,5-二甲基4-羥苯基)-碸、2,4-雙-(3,5-二甲基-4-羥苯基)-2-甲基丁烷、1,1-雙-(3,5-二甲基-4-羥苯基)-環己烷、α,α-雙-(3,5-二甲基-4-羥苯基)-對-二異丙基苯、2,2-雙-(3,5-二氯-4-羥苯基)-丙烷、以及2,2-雙-(3,5-二溴-4-羥苯基)-丙烷;特別適合的雙酚類為:2,2-雙-(4-羥苯基)-丙烷,即一般俗稱的雙酚A(bisphenol A),前述雙酚類可以和光氣(phosgene)反應產生芳香族聚碳酸酯;另外亦可如日本公開特許平1-158033號專利案之製法,其係將雙酚類及雙羥苯基碳酸酯單體預先聚合成低分子量聚合物,再經過結晶化過程作固態聚合(solid polymerization)而得聚碳酸酯系樹脂。Specific examples of the aforementioned bisphenols are: 4,4'-dihydroxybiphenyl, 2,2-bis-(4-hydroxyphenyl)-propane, 2,4-bis-(4-hydroxyphenyl)- 2-methylbutane, 1,1-bis-(4-hydroxyphenyl)-cyclohexane, α,α-bis-(4-hydroxyphenyl)-diisopropylbenzene, 2,2-double -(3-methyl-4-hydroxyphenyl)-propane, 2,2-bis-(3-chloro-4-hydroxyphenyl)-propane, bis-(3,5-dimethyl-4-hydroxyl Phenyl)-methane, 2,2-bis-(3,5-dimethyl-4-hydroxyphenyl)-propane, bis-(3,5-dimethyl 4-hydroxyphenyl)-indole, 2 ,4-bis-(3,5-dimethyl-4-hydroxyphenyl)-2-methylbutane, 1,1-bis-(3,5-dimethyl-4-hydroxyphenyl)- Cyclohexane, α,α-bis-(3,5-dimethyl-4-hydroxyphenyl)-p-diisopropylbenzene, 2,2-bis-(3,5-dichloro-4- Hydroxyphenyl)-propane, and 2,2-bis-(3,5-dibromo-4-hydroxyphenyl)-propane; particularly suitable bisphenols are: 2,2-bis-(4-hydroxybenzene) Propane, which is commonly known as bisphenol A, which can be reacted with phosgene to produce an aromatic polycarbonate, and can also be used as disclosed in Japanese Patent Laid-Open No. Hei 1-158033. The method of pre-polymerizing bisphenols and bishydroxyphenyl carbonate monomers into low molecular weight polymers, and then Process for the crystallization of the solid state polymerization (solid polymerization) to give a polycarbonate resin.

本發明之樹脂組成物中,該熱塑性樹脂係包括一聚苯乙烯系接枝共聚物樹脂及一聚碳酸酯樹脂,以該樹脂組成物之總重為100重量份計,該聚苯乙烯系接枝共聚物樹脂之含量較佳可為5~15重量份,且該聚碳酸酯樹脂之含量較佳可為50~60重量份。In the resin composition of the present invention, the thermoplastic resin comprises a polystyrene-based graft copolymer resin and a polycarbonate resin, and the polystyrene is connected in an amount of 100 parts by weight based on the total weight of the resin composition. The content of the branched copolymer resin is preferably from 5 to 15 parts by weight, and the content of the polycarbonate resin is preferably from 50 to 60 parts by weight.

本發明之樹脂組成物,其熱傳導係數之範圍較佳可為0.73~1.57 W/m*K。The resin composition of the present invention preferably has a heat transfer coefficient in the range of 0.73 to 1.57 W/m*K.

為得到本發明之樹脂組成物,其混合方法具代表性者是:以一般使用之漢歇爾混合機乾混後,再以諸如押出混合機、捏合機或班伯立混練機等之混合機溶融混合。In order to obtain the resin composition of the present invention, the mixing method is representative: after dry mixing by a generally used Hanschel mixer, and then a mixer such as an extrusion mixer, a kneader or a Banbury mixer. Melt and mix.

本發明之樹脂組成物適合用於射出成型法、押出成型法、壓縮成型法、吹延成型法、熱成型法、真空成型法及中空成型法等成型方法中。The resin composition of the present invention is suitably used in molding methods such as injection molding, extrusion molding, compression molding, blow molding, thermoforming, vacuum molding, and hollow molding.

本發明之樹脂組成物可依需要添加使用其他的添加劑,例如:抗氧化劑、可塑劑、加工助劑、紫外線安定劑、紫外線吸收劑、填充劑、強化劑、著色劑、滑劑、帶電防止劑、難燃劑、難燃助劑、熱安定劑、偶合劑或其他添加劑等,上述添加劑可在聚合反應中、聚合反應後、凝結前或押出混練的過程中添加。The resin composition of the present invention may be added with other additives as needed, for example, an antioxidant, a plasticizer, a processing aid, an ultraviolet stabilizer, a UV absorber, a filler, a strengthening agent, a colorant, a slip agent, and a charge prevention agent. The flame retardant, the flame retardant, the heat stabilizer, the coupling agent or other additives may be added during the polymerization reaction, after the polymerization reaction, before the coagulation or during the kneading.

本發明下述各實施例及比較例所使用的原料代號對應型號及規格如下:The corresponding model numbers and specifications of the raw material codes used in the following examples and comparative examples of the present invention are as follows:

PC:粒狀聚碳酸酯系樹脂;奇美公司產品,產品型號PC-115。PC: granulated polycarbonate resin; Chi Mei's product, product model PC-115.

3290(+):鱗片型石墨,潤優公司產品,粒徑大於400um以上,純度為90%。3290(+): scaly graphite, Runyou company's product, particle size greater than 400um, purity 90%.

590(+):鱗片型石墨,潤優公司產品,粒徑介於300~400um,純度為90%。590 (+): scaly graphite, Runyou company's product, particle size between 300 ~ 400um, purity of 90%.

890(+):鱗片型石墨,潤優公司產品,粒徑介於40~400um,純度為90%。890 (+): scaly graphite, Runyou company's product, particle size between 40 ~ 400um, purity of 90%.

399(-):鱗片型石墨,潤優公司產品,粒徑介於30~40um,純度為99%。399(-): scaly graphite, Runyou company's product, particle size between 30~40um, purity 99%.

992u:鱗片型石墨,潤優公司產品,粒徑小於2um,純度>99%。992u: Scale-type graphite, Runyou company's product, particle size less than 2um, purity >99%.

M-51:甲基丙烯酸甲酯-丁二烯-苯乙烯接枝共聚物,為耐衝擊改質劑,台塑公司產品,產品型號FORMOLON M-51。M-51: Methyl methacrylate-butadiene-styrene graft copolymer, an impact-resistant modifier, Formosa Plastics, product model FORMORON M-51.

表1係顯示了本發明各個實施例以及比較例之配方以及物理特性測試結果。Table 1 shows the formulation and physical property test results of various examples and comparative examples of the present invention.

[實施例1][Example 1]

取60重量份之粒狀聚碳酸酯系樹脂(PC-115)、13.125重量份之鱗片型石墨+590、1.875重量份之鱗片型石墨-399、以及10重量份之耐衝擊改質劑(M-51),以附有排氣口的雙軸押出機熔融混練,設定溫度260~270℃押出,轉速為300RPM,可製得本發明之樹脂組成物粒子。接著將上述樹脂組成物粒子成形以製備樣品(5cm*5cm*3mm)並測量其物理性質,結果如表1所示。60 parts by weight of a granular polycarbonate resin (PC-115), 13.125 parts by weight of flaky graphite + 590, 1.875 parts by weight of flaky graphite-399, and 10 parts by weight of an impact-resistant modifier (M) -51), the resin composition particles of the present invention can be obtained by melt-kneading with a two-axis extruder equipped with a vent, and setting at a temperature of 260 to 270 ° C, and rotating at 300 RPM. Next, the above resin composition particles were shaped to prepare a sample (5 cm * 5 cm * 3 mm) and physical properties thereof were measured, and the results are shown in Table 1.

其中,測試條件如下:Among them, the test conditions are as follows:

熱傳導率測定:Thermal conductivity measurement:

依ISO 22007-2法測定,以5cm*5cm*3mm之樣品測定,單位為W/K*m。Determined according to ISO 22007-2 method, measured in a sample of 5 cm * 5 cm * 3 mm, the unit is W / K * m.

[實施例2-4][Example 2-4]

除了需依照表1所示之配方以外,使用如同實施例1之方法製備實施例2-4之樹脂組成物粒子。並將實施例2-4之樹脂組成物粒子成形以製備樣品並測量其各種物理性質,結果如表1所示(測試條件如上述)。The resin composition particles of Example 2-4 were prepared in the same manner as in Example 1 except that the formulation shown in Table 1 was required. The resin composition particles of Example 2-4 were shaped to prepare a sample and various physical properties thereof were measured, and the results are shown in Table 1 (test conditions are as described above).

[比較例1-10][Comparative Example 1-10]

除了需依照表1所示之配方以外,使用如同實施例1之方法製備比較例1-10之樹脂組成物粒子。並將比較例1-10之樹脂組成物粒子成形以製備樣品並測量其各種物理性質,結果如表1所示(測試條件如上述)。The resin composition particles of Comparative Example 1-10 were prepared in the same manner as in Example 1 except that the formulation shown in Table 1 was required. The resin composition particles of Comparative Examples 1-10 were shaped to prepare samples and various physical properties thereof were measured, and the results are shown in Table 1 (test conditions are as described above).

由表1之實驗結果可看出,實施例1~4之樹脂組成物所製得之樣品具有較高的熱傳導係數(皆為0.73 W/m*K以上),其中尤其以實施例4之熱傳導係數為最高(1.57W/m*K)。因此,證實了本發明之樹脂組成物確實可提升熱傳導係數,亦即提高散熱效果,達到本發明之目標。It can be seen from the experimental results of Table 1 that the samples prepared by the resin compositions of Examples 1 to 4 have a high heat transfer coefficient (all of which is 0.73 W/m*K or more), in particular, the heat conduction of Example 4. The coefficient is the highest (1.57W/m*K). Therefore, it was confirmed that the resin composition of the present invention can actually increase the heat transfer coefficient, that is, to improve the heat dissipation effect, and achieve the object of the present invention.

綜上所述,本發明之樹脂組成物透過擠壓及射出後製得之樣品可具有高的熱傳導係數(實驗結果測得為0.73W/m*K以上,實施例4之結果更可達1.57W/m*K)。因此,本發明之樹脂組成物的改良配方,可提升樣品的熱傳導係數,可幫助產品散熱效果,故能提高其商業上的價值。In summary, the sample prepared by the resin composition of the present invention after being extruded and injected can have a high heat transfer coefficient (the experimental result is determined to be 0.73 W/m*K or more, and the result of the embodiment 4 is up to 1.57). W/m*K). Therefore, the improved formulation of the resin composition of the present invention can increase the heat transfer coefficient of the sample and can help the heat dissipation effect of the product, thereby improving its commercial value.

此外,本發明藉由同時使用二種不同粒徑之鱗片型石墨於樹脂組成物中,使可提升熱傳導特性,幫助產品散熱效果,此為習知技術所未具有之獨特特徵。In addition, the present invention can improve the heat conduction characteristics and help the heat dissipation effect of the product by simultaneously using two kinds of flaky graphite of different particle diameters in the resin composition, which is a unique feature not found in the prior art.

上述實施例僅係為了方便說明而舉例而已,本發明所主張之權利範圍自應以申請專利範圍所述為準,而非僅限於上述實施例。The above-mentioned embodiments are merely examples for convenience of description, and the scope of the claims is intended to be limited to the above embodiments.

Claims (5)

一種樹脂組成物,其係包括:一熱塑性樹脂,其係包括至少一種選自聚苯乙烯系接枝共聚物樹脂、及聚碳酸酯樹脂;以及一鱗片型石墨,其係包括至少二種粒徑之鱗片型石墨,其中該鱗片型石墨係包括:平均粒徑為30μm~40μm之鱗片型石墨;以及平均粒徑為大於300μm~小於等於400μm之鱗片型石墨,其中,以該樹脂組成物之總重為100重量份計,該熱塑性樹脂之含量為70~85重量份,該鱗片型石墨之含量為15~30重量份。 A resin composition comprising: a thermoplastic resin comprising at least one selected from the group consisting of polystyrene-based graft copolymer resins and polycarbonate resins; and a flaky graphite comprising at least two particle sizes a scale-type graphite, wherein the scale-type graphite comprises: flaky graphite having an average particle diameter of 30 μm to 40 μm; and flaky graphite having an average particle diameter of more than 300 μm to 400 μm, wherein the total of the resin composition The content of the thermoplastic resin is 70 to 85 parts by weight based on 100 parts by weight, and the content of the scaly graphite is 15 to 30 parts by weight. 如申請專利範圍第1項所述之樹脂組成物,其中,該平均粒徑為30μm~40μm之鱗片型石墨與該平均粒徑為大於300μm~小於等於400μm之鱗片型石墨之重量含量比為1:5~1:7。 The resin composition according to claim 1, wherein the flaky graphite having an average particle diameter of 30 μm to 40 μm and the weight ratio of the flaky graphite having an average particle diameter of more than 300 μm to 400 μm are 1 :5~1:7. 如申請專利範圍第1項所述之樹脂組成物,其中,該聚苯乙烯系接枝共聚物樹脂係選自苯乙烯系-共軛二烯橡膠-甲基丙烯酸甲酯系接枝共聚物樹脂或苯乙烯系-共軛二烯橡膠-丙烯腈系接枝共聚物。 The resin composition according to claim 1, wherein the polystyrene-based graft copolymer resin is selected from the group consisting of styrene-conjugated diene rubber-methyl methacrylate-based graft copolymer resin. Or a styrene-conjugated diene rubber-acrylonitrile-based graft copolymer. 如申請專利範圍第1項所述之樹脂組成物,其中,該熱塑性樹脂係包括一聚苯乙烯系接枝共聚物樹脂及一聚碳酸酯樹脂,以該樹脂組成物之總重為100重量份計,該聚苯乙烯系接枝共聚物樹脂之含量為5~15重量份,且該聚碳酸酯樹脂之含量為50~70重量份。 The resin composition according to claim 1, wherein the thermoplastic resin comprises a polystyrene-based graft copolymer resin and a polycarbonate resin, and the total weight of the resin composition is 100 parts by weight. The content of the polystyrene-based graft copolymer resin is 5 to 15 parts by weight, and the content of the polycarbonate resin is 50 to 70 parts by weight. 如申請專利範圍第1項所述之樹脂組成物,該樹脂組成物之熱傳導係數之範圍係0.73~1.57W/m*K。 The resin composition according to claim 1, wherein the heat transfer coefficient of the resin composition ranges from 0.73 to 1.57 W/m*K.
TW100148409A 2011-12-23 2011-12-23 Resin composite TWI588194B (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
TW100148409A TWI588194B (en) 2011-12-23 2011-12-23 Resin composite
CN2012104972499A CN103172993A (en) 2011-12-23 2012-11-29 Resin composition

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW100148409A TWI588194B (en) 2011-12-23 2011-12-23 Resin composite

Publications (2)

Publication Number Publication Date
TW201326280A TW201326280A (en) 2013-07-01
TWI588194B true TWI588194B (en) 2017-06-21

Family

ID=48633212

Family Applications (1)

Application Number Title Priority Date Filing Date
TW100148409A TWI588194B (en) 2011-12-23 2011-12-23 Resin composite

Country Status (2)

Country Link
CN (1) CN103172993A (en)
TW (1) TWI588194B (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2021200711A1 (en) * 2020-03-30 2021-10-07 東洋紡株式会社 Thermally conductive resin composition and molded article comprising same

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1969000A (en) * 2004-06-18 2007-05-23 纳幕尔杜邦公司 Electrically conductive polyetherester composition comprising carbon black and product made therefrom
TW200907040A (en) * 2007-05-22 2009-02-16 Honeywell Int Inc Thermal interconnect and interface materials, methods of production and uses thereof
CN102203191A (en) * 2009-01-20 2011-09-28 尤尼吉可株式会社 Resin composition and molded article comprising the same

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2006126606A1 (en) * 2005-05-26 2006-11-30 Techno Polymer Co., Ltd. Heat-conductive resin composition and molded item containing the same
JP4681382B2 (en) * 2005-07-28 2011-05-11 帝人化成株式会社 Thermoplastic resin composition
WO2008015775A1 (en) * 2006-07-31 2008-02-07 Techno Polymer Co., Ltd. Heat dissipating chassis and heat dissipating case

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1969000A (en) * 2004-06-18 2007-05-23 纳幕尔杜邦公司 Electrically conductive polyetherester composition comprising carbon black and product made therefrom
TW200907040A (en) * 2007-05-22 2009-02-16 Honeywell Int Inc Thermal interconnect and interface materials, methods of production and uses thereof
CN102203191A (en) * 2009-01-20 2011-09-28 尤尼吉可株式会社 Resin composition and molded article comprising the same

Also Published As

Publication number Publication date
CN103172993A (en) 2013-06-26
TW201326280A (en) 2013-07-01

Similar Documents

Publication Publication Date Title
CN101210107B (en) Polycarbonate resin composition and plastic article
KR20160055799A (en) Mineral reinforced thermoplastic polymer compositions with improved properties
CN111954687B (en) Composition for producing molded articles having increased gloss and thermoplastic molding compounds
KR102453601B1 (en) Compositions and Thermoplastic Molding Compounds with Good Notched Impact Toughness and Improved Melt Stability
WO2005030819A1 (en) Flowability improver for engineering plastics, thermoplastic resin compositions containing the same, and molded articles of the compositions
CN103180388A (en) Polycarbonate resin composition and molded article using same
CN117157359A (en) Compositions and methods for producing translucent thermoplastic polycarbonate/polymethylmethacrylate molding compounds
JP5776391B2 (en) Heat-resistant and paint-resistant thermoplastic resin composition
TWI478974B (en) Resin composite
JP2016044221A (en) Thermoplastic resin composition and molded article thereof
CN104903400B (en) Poly carbonate resin composition and the mechanograph formed by it
JPS5837049A (en) Forming composition
BRPI0613648A2 (en) polycarbonate molding compositions
TWI588194B (en) Resin composite
CN106609029B (en) Resin combination and resin-formed body
JP2004059690A (en) Aromatic polycarbonate-based colored flame-retardant resin composition and molded article
JP4248906B2 (en) Flame retardant aromatic polycarbonate resin composition
CN107075240B (en) Polycarbonate-based resin composition containing polycarbonate-polyorganosiloxane copolymer and molded article thereof
CN104559002B (en) Resin combination, its manufacture method, formed body and light guide plate
CN110088202B (en) Composition and thermoplastic moulding material having reduced gloss and good chemical resistance
JP2003342462A (en) Flame-retardant aromatic polycarbonate resin composition
CN118922497A (en) Polycarbonate compositions
CN113444351B (en) Resin composition and resin molded body
JP2015168814A (en) Thermoplastic resin composition and molded article
JPH06313103A (en) Polycarbonate resin composition

Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees