TWI587063B - Projector - Google Patents

Description

Projection device

The present invention generally relates to a projection apparatus, and more particularly to a projection apparatus having a speaker structure design.

Conventional projectors are generally used as video devices that project images to a target screen, or further built-in speaker systems to provide sound effects at the same time. However, the speaker system of the conventional projector usually achieves the function of sound generation by adding a horn, and is often limited by the limitation of heat dissipation and internal airflow, lack of space, etc., resulting in poor sound performance.

For example, a conventional projector usually finds an area corresponding to the diameter of a horn on the surface of the casing, that is, a horn is attached, but there is not enough resonance cavity inside the projector, so that the horn is low-frequency and intermediate-frequency. Poor performance and unable to meet user needs.

Therefore, how to improve the sound quality of the projector in the limited space and high heat dissipation requirements is one of the important topics for research and development.

It is an object of the present invention to provide a projection apparatus having a speaker structure design to provide a resonance space and thereby provide a prominent performance of the horn at low frequencies and intermediate frequencies.

It is an object of the present invention to provide a projection apparatus that establishes a speaker structure to produce a resonance effect without affecting the heat dissipation airflow.

It is an object of the present invention to provide a projection apparatus that integrates power in a circuit board / Lower temperature board or part of the board in the speaker cavity to provide a resonance space for enhanced sound in a limited device space, effectively improving space utilization.

In one embodiment, the present invention provides a projection apparatus including a housing, a optomechanical system, a horn, and a circuit board, wherein the housing includes a first housing portion and a second housing portion, the first housing portion and the second The housing portions are adjacent to each other such that the first housing portion has an accommodating space, and the second housing portion surrounds the resonance space to serve as a speaker cavity; the optomechanical system is disposed in the accommodating space; and the horn is disposed in the second a housing portion facing the outer side of the housing; and the circuit board is disposed in the speaker cavity and electrically connected to the optical system, wherein the circuit board is a power supply circuit board of the projection device, a main control circuit board, and an input/output circuit At least a portion of the board of at least one of the boards.

In one embodiment, the second housing portion includes a plurality of panels to enclose the resonance space, and at least one of the plurality of panels is made of metal. In one embodiment, the metal comprises aluminum, copper or an alloy thereof.

In one embodiment, the wall plate made of metal is at least one of a top plate and a plurality of side plates of the second casing portion.

In one embodiment, the projection apparatus of the present invention further includes a plurality of heat dissipation fins, wherein the plurality of heat dissipation fins are disposed on the wall plate made of metal and extend toward the outer side of the second housing portion.

In one embodiment, the circuit board is selected from at least one of a power supply circuit board, a main control circuit board, and an input/output circuit board.

In one embodiment, the optomechanical system includes a light source module, an imaging module, and a light transmitting component, wherein the light transmitting component is coupled between the light source module and the imaging module.

In one embodiment, the portion of the circuit board is a portion of at least one of a power supply circuit board, a main control circuit board, and an input/output circuit board having a relatively low power or/and temperature.

10‧‧‧Projector

100‧‧‧shell

104a, 114a, 124a‧‧‧ top board

104b, 114b, 124b‧‧‧ bottom plate

104c, 114c, 124c‧‧‧ front side panels

104d, 114d, 124d‧‧‧ back side panels

110‧‧‧First housing part

112‧‧‧ accommodating space

114e, 124e‧‧‧ outside board

120‧‧‧Second housing part

122‧‧‧Speaker cavity

130‧‧‧Baffle

200‧‧‧ optomechanical system

210‧‧‧Light source module

212‧‧‧Lighting unit

214‧‧‧Hybrid unit

220‧‧‧ imaging module

222‧‧‧ lens unit

224‧‧‧ imaging optical unit

224a‧‧‧Digital Micromirror Device

230‧‧‧Light transmission parts

300‧‧‧ horn

400, 410, 420, 430, 440‧‧‧ circuit boards

500‧‧‧fan

600‧‧ ‧ heat sink

610‧‧‧Heat fins

612‧‧‧ ventilation duct

1 is a schematic view of a projection apparatus according to an embodiment of the present invention; FIG. 2 is a schematic view of a housing of a projection apparatus according to an embodiment of the present invention; and FIGS. 3 to 6 are schematic views of a projection apparatus according to various embodiments of the present invention.

The invention provides a projection device, in particular to a projection device with a speaker structure design, to provide a resonance space and thereby enhance the sound effect of the speaker. Furthermore, the projection device of the present invention integrates a circuit board or a part of a circuit board with a low power/temperature in the circuit board in the speaker cavity without affecting the heat dissipation airflow, so as to provide resonance for enhancing sound effects in a limited device space. Space, effectively improve the utilization of space. Embodiments of the projection apparatus of the present invention will be described in detail later with reference to the drawings.

As shown in FIG. 1 , the projection device 10 includes a housing 100 , a optomechanical system 200 , a horn 300 , and a circuit board 400 . The housing 100 includes a first housing portion 110 and a second housing portion 120 , and a first housing portion The first housing portion 110 has an accommodation space 112, and the second housing portion 120 surrounds the resonance space to serve as the speaker cavity 122. The optomechanical system 200 is disposed in the accommodating space 112. The horn 300 is disposed on the second housing portion 120 and faces the outer side of the housing 100. The circuit board 400 is disposed in the speaker cavity 122 and electrically connected to the optomechanical system 200, wherein the circuit board 400 is a circuit board or a portion of a circuit board in which the power or/and temperature is relatively low in the circuit board of the projection device 10. In addition, the projection device 10 further includes a circuit board 410, wherein the circuit board 410 is disposed in the accommodating space 112 and is a circuit board (such as a driving circuit board) having relatively high power or/and temperature in the circuit board of the projection device 10. Or part of the board.

Specifically, the optomechanical system 200 is disposed in the accommodating space 112 of the first housing portion 110 and includes a light source module 210, an imaging module 220, and a light transmitting member 230. The imaging module 220 is disposed in the light source module 230. One side, and the light transmitting member 230 is connected between the light source module 210 and the imaging module 220. In this embodiment, the light transmitting component 230 can be a light pipe, a light guiding column or other component for transmitting light, and the light source module 210, the imaging module 220 and the light transmitting component 230 are configured in an L shape, but not Limited. In other embodiments, the light source module 210, the imaging module 220, and the light transmitting member 230 may be configured in a straight line or in any suitable shape according to design requirements. The light source module 210 transmits light to the imaging module 220 through the light transmitting member 230, and the imaging module 220 processes the light according to the image data and projects the light outside the casing 10 to form an image.

The light source module 210 can include a plurality of light emitting units 212 and a light mixing unit 214. The light emitting unit 212 is disposed around the light mixing unit 214 and emits light to the light mixing unit 214. In this embodiment, one side of the light mixing unit 214 is connected to the light transmitting member 230, and the light emitting unit 212 is respectively disposed on different sides (for example, the other three sides) of the light mixing unit 214 and is emitted to the light mixing unit 214 with different colors or The wavelength of light. The light mixing unit 214 receives and mixes the light emitted from the light emitting unit 212 and outputs mixed light (for example, white light) to the light transmitting member 230. In this embodiment, the light-emitting unit 212 is preferably a light-emitting diode that outputs red, green, and blue light, but is not limited thereto. In other embodiments, the light emitting unit 212 can be a light emitting diode that emits white or other color (or wavelength) light. The imaging module 220 includes a lens unit 222 and an imaging optical unit 224. The imaging optical unit 224 is connected to the light transmitting member 230 to receive light, and the light is processed according to the image data to obtain a corresponding target light, and the target light is obtained by the lens unit 222. Projected outside the casing 10 to form an image. In one embodiment, imaging optics unit 224 includes a digital micromirror device 224a that controls the micromirrors to form an image based on the image signals.

In this embodiment, the first housing portion 110 is designed such that the accommodating space 112 accommodates the imaging system (eg, the optomechanical system 200) of the projection device 10, and the heat dissipation system (see, for example, the fan 500, FIG. 3-5). 6 heat sink 600 and its heat dissipation fins 610 and air passages 612, etc.) and the remaining high heat source components (for example, a circuit board 410 that generates relatively high heat), and the second housing portion 120 is designed to have the specifications of the speaker housing. The resonance space enclosed by the second casing portion 120 can be used as the speaker cavity 122. In one embodiment, as shown in FIG. 2, the housing 100 may be made of metal (such as aluminum, copper or alloy thereof) or a plastic material of equivalent thickness, and is partitioned into an accommodation space 112 and a speaker cavity by a partition 130. 122, wherein the top plate 114a, the bottom plate 114b, the front side plate 114c, and the back side plate 114d of the first casing portion 110 are respectively connected to the top plate 124a, the bottom plate 124b, the front side plate 124c, and the back side plate 124d of the second casing portion 120 to become the casing 110. The top plate 104a, the bottom plate 104b, the front side plate 104c and the back side plate 104d, and the partition plate 130 is connected between the top plates 114a, 124a, the bottom plates 114b, 124b, the front side plates 114c, 124c and the back side plates 114d, 124d as the first case The side plate shared by the body portion 110 and the second casing portion 120 is located on the opposite side of the outer side plate 114e of the first casing portion 110 and the outer side plate 124e of the second casing portion 120. In this embodiment, the material and thickness of the spacer 130 are preferably considered as a speaker panel, and more preferably as a speaker panel and meeting the heat dissipation requirements. In a limited device space condition, the position of the spacer 130 is preferably such that the overall heat dissipation requirement of the projection device 10 is not affected, and a plurality of relatively low power/low temperature circuit boards or partial circuit boards are integrated, that is, the projection device 10 is not affected. The overall heat dissipation requirements make the speaker cavity 122 as large as possible.

It should be noted that in the present invention, the wall plate connecting the top plates 114a, 124a and the bottom plates 114b, 124b may be generally referred to as a side plate. However, in the embodiment, for convenience of description, the plurality of side plates are further labeled as the front side plate 114c, 124c, back side plates 114d and 124c, outer side plates 114e and 124c, and a partition plate 130 as an inner side plate. Furthermore, the top plate 114a, the bottom plate 114b, and the front of the first housing portion 110 The side plate 114c, the back side plate 114d and the outer side plate 114e are corresponding to the position of the fan and/or the heat dissipation plate of the heat dissipation system, and can be designed with corresponding heat dissipation holes (not shown) to improve the heat dissipation effect. The top plate 124a, the bottom plate 124b, the front side plate 124c, the back side plate 124d, the outer side plate 124e of the second casing portion 120, and the partition plate 130 as the common side plate are preferably not provided with other holes except for the line holes and the horn holes. The wall surrounding the speaker cavity 122 enhances the resonance effect. In other words, the top plate 124a, the bottom plate 124b, the front side plate 124c, the back side plate 124d, the outer side plate 124e of the second casing portion 120, and the partition plate 130 as the common side plate are connected to surround the substantially sound cavity to enhance the resonance effect. Improve the sound performance of the speaker 300 at low frequency and intermediate frequency.

As shown in FIG. 1 , in this embodiment, the horn 300 is disposed on the front side plate 124 c of the second housing portion 120 and faces the front of the housing 100 , but is not limited thereto. In other embodiments, the horn 300 may be disposed on the outer wall of the second housing portion 120, such as the top plate 124a, the bottom plate 124b, the back side plate 124d, and the outer side plate 124e, depending on actual needs. The horn 300 can be a conventional horn unit and has suitable power according to actual needs.

Furthermore, in order to effectively utilize the space of the projection device 10 and to consider the heat dissipation requirements of the projection device 10, a circuit board or a portion of the circuit board having a relatively low power or/and temperature in the circuit board of the projection device 10 is disposed in the second housing portion. 120 enclosed in the speaker cavity 122. In one embodiment, the projection device 10 can include a power supply circuit board, a main control circuit board, an input/output circuit board, a driving circuit board, and the like, wherein the power supply circuit board is used to supply power required for each component of the projection device 10. The main control circuit board is a main circuit board for controlling the operation of the projection device 10, the input/output circuit board is for providing input/output of the projection device 10, and the drive circuit board is for driving the light emitting unit 212. Since the current power supply circuit board is very efficient (for example, up to 90% or more), the high-heat element that the projection device needs to dissipate is usually the optomechanical system 200 (especially the light-emitting unit 212) and the driving component (for example, the drive) Moving circuit board). Therefore, the circuit board 400 integrated in the speaker cavity 122 is preferably at least one of a power supply circuit board, a main control circuit board, and an input/output circuit board, or a power supply circuit board, a main control circuit board, and an input. / at least one of the output boards is at least one of the power or / and a relatively low temperature portion of the board. For example, as shown in FIG. 1, circuit board 400 is a power supply circuit board, a main control circuit board, or an input/output circuit board, or a relatively low power or/and temperature portion thereof. As shown in FIG. 3, the circuit board 400 can be a power supply circuit board or a relatively low power or/and temperature portion thereof, and the circuit board 420 can be a main control circuit board or an input/output circuit board or its power or/and temperature. Relatively low part. As shown in FIG. 4, the circuit board 400 can be a power supply circuit board or a relatively low power or/and temperature portion thereof, and the circuit board 420 can be a main control circuit board or a relatively low power or/and temperature portion thereof, and the circuit Plate 430 can be an input/output circuit board or a relatively low portion of its power or/and temperature.

It should be noted that when the circuit board 400 is a part of the power supply circuit board, the main control circuit board, and the input/output circuit board, at least one of the power or/and the temperature is relatively low, the circuit board 400 is disposed in the first housing portion. The circuit board 410 in the accommodating space 112 of the 110 may be a driving circuit board and a power supply circuit board, and the circuit board 440 (shown in FIG. 6) may be at least one of a main control circuit board and an input/output circuit board. The portion of power or / and relatively high temperature. In addition, the position and manner of the circuit board 400 disposed in the speaker cavity 122 can be configured according to the resonance effect, and is not limited to the embodiment. For example, the circuit board 400 can be placed horizontally or vertically with respect to the bottom plate 124b, and when a plurality of circuit boards (eg, 400, 420, 430) are disposed in the speaker cavity 122, a portion of the circuit boards can be placed horizontally and another portion of the circuit The boards can be placed vertically or all boards can be placed horizontally or vertically to achieve the desired resonance.

When the integrated circuit board 400 is in the speaker cavity 122, the heat dissipation material can be provided. The heat dissipation effect of the second housing portion 120 is raised. For example, as shown in FIG. 3, when the housing 110 is made of a plastic material, a metal plate 125 may be added on the outer side of the second housing portion 120 to serve as a heat sink. For example, depending on actual needs, at least one of the top plate 124a, the bottom plate 124b, the front side plate 124c, the back side plate 124d, the outer side plate 124e, and the partition plate 130 as the common side plate of the second casing portion 120 may be outside the wall plate. A metal plate 125 is added to enhance the heat dissipation effect of the second casing portion 120. In one embodiment, the metal plate 125 is preferably disposed on at least one of the top plate 124a, the front side plate 124c, the back side plate 124d, and the outer side plate 124e, but is not limited thereto. In addition, in order to enhance the appearance, the second housing portion 120 preferably has a groove design (not shown) at the position of the wall plate on which the metal plate 125 is disposed, so that the outer surface of the metal plate 125 and the second housing portion 120 are The outer surface is substantially coplanar, but not limited to this.

The first housing portion 110 and the second housing portion 120 of the housing 100 may be the same or different materials and may be formed by molding, insert molding, locking, bonding, and the like. In one embodiment, as shown in FIG. 4, the first housing portion 110 may be made of a plastic material, and the plurality of panels of the second housing portion 120' (eg, the top plate 124a, the bottom plate 124b, the front side plate 124c, and the back side plate 124d) The outer side plate 124e and the partition plate 130) enclose a resonance space (ie, the speaker cavity 122), and at least one of the plurality of wall plates is composed of a metal such as, but not limited to, aluminum, copper or an alloy thereof. For example, the wall plate made of metal is preferably at least one of the top plate 124a of the second casing portion 120' and the plurality of side plates (the front side plate 124c, the back side plate 124d, the outer side plate 124e, and the partition plate 130). But not limited to this.

In addition, in order to further improve the heat dissipation effect of the second housing portion 120, as shown in FIG. 5, the projection device further includes a plurality of heat dissipation fins 126, wherein the plurality of heat dissipation fins 126 are disposed on the wall of the second housing portion 120. Upper, for example, top plate 124a, bottom plate 124b, front side plate 124c, back side plate 124d, outer side plate 124e, and partition plate 130. In one embodiment, the plurality of heat dissipation fins 126 are preferably disposed on the wall plate made of metal along the extending direction of the wall plate, and are extended toward the outside of the second casing portion 120. Stretch, but not limited to this. In another embodiment, the plurality of heat dissipation fins 126 may be disposed on the metal or plastic material wall of the second housing portion 120 shown in FIG. It should be noted that in the embodiment shown in FIG. 3, the plurality of heat dissipation fins 126 may be disposed on the metal plate 125 to provide the heat dissipation fins 126 on the outer side of the plastic casing of the second casing portion 120. Metal plate. In addition, in the embodiment shown in FIG. 4, the plurality of heat dissipation fins 126 can be integrated on the metal-made wall plate such that the metal plate having the plurality of heat dissipation fins 126 constitutes the wall of the second housing portion 120.

Furthermore, as shown in FIG. 1 and FIG. 6 , the first housing portion 110 and the second housing portion 120 are preferably disposed such that the second housing portion 120 is located away from one side of the light source module 210 . The circuit boards 400, 420, and 430 in the second housing portion 120 are separated from the heat source (for example, the light emitting unit 212), but not limited thereto. As shown in FIG. 3 to FIG. 5 , the second housing portion 120 may also be disposed adjacent to one side of the light source module 210 when the heat dissipation requirement is met.

Compared with the prior art, the projection device of the present invention establishes a speaker structure to generate a resonance effect without affecting the heat dissipation airflow, thereby making the speaker have outstanding performance at low frequency and intermediate frequency. Furthermore, the projection device of the present invention integrates a relatively low power/temperature circuit board in the speaker cavity to provide a resonance space for enhancing sound effects in a limited device space, thereby effectively improving space utilization and maintaining a high-efficiency heat dissipation mechanism. .

The present invention has been described by the above embodiments, but the above embodiments are for illustrative purposes only and are not intended to be limiting. It will be apparent to those skilled in the art that the embodiments specifically described herein may have other modifications of the embodiments. Accordingly, the scope of the invention is intended to cover such modifications and are only limited by the scope of the appended claims.

10‧‧‧Projector

100‧‧‧shell

110‧‧‧First housing part

112‧‧‧ accommodating space

120‧‧‧Second housing part

122‧‧‧Speaker cavity

200‧‧‧ optomechanical system

210‧‧‧Light source module

212‧‧‧Lighting unit

214‧‧‧Hybrid unit

220‧‧‧ imaging module

222‧‧‧ lens unit

224‧‧‧ imaging optical unit

224a‧‧‧Digital Micromirror Device

230‧‧‧Light transmission parts

300‧‧‧ horn

400, 410‧‧‧ circuit board

Claims (7)

A projection device comprising: a housing comprising a first housing portion and a second housing portion, wherein the first housing portion and the second housing portion abut each other such that the first housing portion The accommodating space is disposed in the accommodating space; a horn is disposed in the accommodating space; a horn is disposed in the second housing portion And a circuit board disposed in the speaker cavity and electrically connected to the optomechanical system, wherein the circuit board is a power supply circuit board, a main control circuit board, and an input/output circuit of the projection device At least a portion of the board of at least one of the boards. The projection device of claim 1, wherein the second housing portion includes a plurality of panels to enclose the resonance space, and at least one of the plurality of panels is made of metal. The projection device of claim 2, wherein the metal comprises aluminum, copper or an alloy thereof. The projection device of claim 2, wherein the wall made of metal is at least one of a top plate and a plurality of side plates of the second casing portion. The projection device of claim 2 or 4, further comprising a plurality of heat dissipation fins, wherein the plurality of heat dissipation fins are disposed on the wall plate made of metal and extend toward an outer side of the second casing portion. The projection device of claim 1, wherein the optomechanical system comprises a light source module, an imaging module and a light transmission component, wherein the light transmission component is connected between the light source module and the imaging module. The projection device of claim 1, wherein the portion of the circuit board is relatively high in power or/and temperature of at least one of the power supply circuit board, the main control circuit board, and the input/output circuit board. The lower part.