TWI580089B - Barrier functional film and manufaturing thereof, environmental sensitive element, and display apparatus - Google Patents

Description

Barrier functional film and its manufacturing method, environmentally sensitive electronic components and display Display device

The present disclosure relates to a functional film and a method of fabricating the same, an environmentally sensitive electronic component, and a display device, and more particularly to a barrier functional film and a method of fabricating the same, an environmentally sensitive electronic component, and a display device.

Flexible environment sensitive electronic components or display devices are more widely used than general hard environment sensitive electronic components or display devices. They can be crimped, portable, safe, and widely used, but less resistant to high temperatures and resistance. Water resistance is poor, chemical resistance is poor, and thermal expansion coefficient is large. In general, flexible environmentally sensitive electronic components or flexible substrates of display devices can be used to carry electronic components and/or as a cover to package electronic components, since the flexible substrate cannot be completely blocked. The penetration of moisture and oxygen, so the infiltration of moisture and oxygen will accelerate the aging of electronic components on the flexible substrate, which in turn leads to a shortened life of the electronic components and cannot meet the market demand.

The present disclosure provides a barrier functional film and a method of fabricating the same to provide good moisture and oxygen barrier properties.

The present disclosure further provides an environmentally sensitive electronic component and a display device for improving the ability of environmentally sensitive electronic components to block moisture and oxygen, such as organic electronic components, such as an organic light emitting diode (Organic Light Emitting Diode). ), Organic Solar Cell, Organic Photo-Sensitive Device, and the like.

The present disclosure provides a barrier functional film comprising a substrate, at least one sidewall barrier structure, a release film, and a glue. The sidewall barrier structure is on the substrate. The release film is disposed above the substrate, wherein the sidewall barrier structure is located between the substrate and the release film. The glue coats the sidewall barrier structure and is located between the substrate and the release film.

The present disclosure proposes a method for fabricating a barrier functional film comprising the following method. At least one sidewall barrier structure is formed on the substrate. A glue is formed on the release film. The release film is attached to the substrate through a rubber material, wherein the rubber material covers the sidewall barrier structure and is located between the substrate and the release film.

The present disclosure provides an environmentally sensitive electronic component including a first substrate, at least a first sidewall barrier structure, an environmentally sensitive electronic component backplate, and a first adhesive. The first sidewall barrier structure is on the first substrate. The first substrate is disposed above the environmentally sensitive electronic component backplane, and the first sidewall barrier structure is located between the first substrate and the environmentally sensitive electronic component backplane. The first adhesive material is disposed on the first substrate and the environment sensitive electricity The first component is coated with the first sidewall barrier structure, and the first substrate and the first sidewall barrier structure are adhered to the environmentally sensitive electronic component backplane through the first adhesive.

The present disclosure provides a display device including an environmentally sensitive electronic component, a second substrate, at least a second sidewall barrier structure, and a second adhesive. The second sidewall barrier structure is on the second substrate, and the second sidewall barrier structure is located between the environmentally sensitive electronic component and the second substrate. The second adhesive material is disposed between the second substrate and the environmentally sensitive electronic component, and the second adhesive material is coated with the second sidewall barrier structure, wherein the second substrate and the second sidewall barrier structure are adhered to the second adhesive material through the second adhesive material Environmentally sensitive electronic components.

Based on the above, the barrier functional film of the present disclosure has a glue material bonded between the substrate and the release film, and the sidewall barrier structure is disposed on the substrate, wherein the sidewall barrier structure is located between the substrate and the release film. In addition, the environmentally sensitive electronic component and the display device of the present disclosure have a glue material bonded between the two substrates, wherein the sidewall barrier structure is disposed between the two substrates and at least a portion of the sidewall barrier structure surrounds the environmentally sensitive electronic component backplane, wherein The sidewall barrier structure is covered by a rubber material. In other words, the barrier function, the environmentally sensitive electronic component and the display device of the present disclosure have a good ability to block moisture and oxygen and are easy to mass-produce.

In order to make the disclosure more apparent, the following embodiments are described in detail with reference to the accompanying drawings.

10, 10a‧‧‧Hydraulic materials

20‧‧‧Solution aids

30‧‧‧Anti-electromagnetic interference materials

100A~100R‧‧‧Disability function film

110‧‧‧Substrate

110a, 210a‧‧‧flexible substrate

110b, 210b‧‧‧ barrier layer

120‧‧‧ sidewall barrier structure

130‧‧‧ release film

140, 140a, 240a‧‧‧ glue

200A~200R‧‧‧Environmentally sensitive electronic components

210‧‧‧First substrate

220‧‧‧First sidewall barrier structure

230‧‧‧Environmentally sensitive electronic component backplane

230a‧‧‧Flexible substrate

230b‧‧‧Environmentally sensitive electronic component unit

232b‧‧‧Active components

234b‧‧‧Circuit wire

240‧‧‧First glue

300‧‧‧ Explicit device

310‧‧‧second substrate

320‧‧‧Second sidewall barrier structure

340‧‧‧Second rubber

CAR‧‧‧Flexible carrier board

CF‧‧‧ color filter layer

DIS‧‧‧ display panel

L‧‧‧Light

LID‧‧‧ Cover Department

PA‧‧‧ photoresist layer pattern

PC‧‧‧Photo Mask

POL‧‧‧ quarter-wave compensation film plus polarizing film

PR‧‧‧ photoresist layer

TP‧‧‧ touch layer

1A is a schematic cross-sectional view showing a barrier functional film according to a first embodiment of the present disclosure.

FIG. 1B is a top view of the barrier functional film of FIG. 1A.

2 is a schematic cross-sectional view showing a barrier functional film of a second embodiment of the present disclosure.

3A is a schematic cross-sectional view showing a barrier function film according to a third embodiment of the present disclosure.

3B is a schematic cross-sectional view of a barrier functional film according to a fourth embodiment of the present disclosure.

4A is a schematic cross-sectional view showing a barrier functional film according to a fifth embodiment of the present disclosure.

4B is a schematic cross-sectional view of a barrier functional film according to a sixth embodiment of the present disclosure.

FIG. 5A is a schematic cross-sectional view showing a barrier function film according to a seventh embodiment of the present disclosure.

FIG. 5B is a schematic cross-sectional view showing a barrier function film according to an eighth embodiment of the present disclosure.

5C is a schematic cross-sectional view showing a barrier function film according to a ninth embodiment of the present disclosure.

5D is a schematic cross-sectional view of a barrier functional film according to a tenth embodiment of the present disclosure.

Fig. 6A is a cross-sectional view showing a barrier functional film of an eleventh embodiment of the present disclosure.

6B is a schematic cross-sectional view showing a barrier functional film according to a twelfth embodiment of the present disclosure.

6C is a cross-sectional view showing a barrier functional film of a thirteenth embodiment of the present disclosure.

6D is a schematic cross-sectional view showing a barrier functional film of the fourteenth embodiment of the present disclosure.

7A is a schematic cross-sectional view showing a barrier functional film of a fifteenth embodiment of the present disclosure.

7B is a schematic cross-sectional view showing a barrier functional film of a sixteenth embodiment of the present disclosure.

Fig. 7C is a cross-sectional view showing the barrier functional film of the seventeenth embodiment of the present disclosure.

7D is a schematic cross-sectional view showing a barrier functional film of an eighteenth embodiment of the present disclosure.

8A-1 to 8D are schematic cross-sectional views showing a method of fabricating the barrier functional film of the present disclosure.

FIG. 9 is a schematic cross-sectional view of an environmentally sensitive electronic component according to a first embodiment of the present disclosure Figure.

Figure 10 is a cross-sectional view of an environmentally sensitive electronic component of a second embodiment of the present disclosure.

11A is a cross-sectional view of an environmentally sensitive electronic component of a third embodiment of the present disclosure.

11B is a cross-sectional view of an environmentally sensitive electronic component of a fourth embodiment of the present disclosure.

12A is a cross-sectional view of an environmentally sensitive electronic component of a fifth embodiment of the present disclosure.

12B is a cross-sectional view of an environmentally sensitive electronic component of a sixth embodiment of the present disclosure.

13A is a cross-sectional view of an environmentally sensitive electronic component of a seventh embodiment of the present disclosure.

13B is a cross-sectional view of an environmentally sensitive electronic component of an eighth embodiment of the present disclosure.

13C is a cross-sectional view of an environmentally sensitive electronic component of a ninth embodiment of the present disclosure.

13D is a cross-sectional view of an environmentally sensitive electronic component of a tenth embodiment of the present disclosure.

Figure 14A is a cross-sectional view showing an environmentally sensitive electronic component of an eleventh embodiment of the present disclosure.

14B is a cross-sectional view of an environmentally sensitive electronic component of a twelfth embodiment of the present disclosure. intention.

Figure 14C is a cross-sectional view showing the environmentally sensitive electronic component of the thirteenth embodiment of the present disclosure.

Figure 14D is a cross-sectional view of an environmentally sensitive electronic component of a fourteenth embodiment of the present disclosure.

15A is a cross-sectional view of an environmentally sensitive electronic component of a fifteenth embodiment of the present disclosure.

Figure 15B is a cross-sectional view showing the environmentally sensitive electronic component of the sixteenth embodiment of the present disclosure.

Figure 15C is a cross-sectional view showing the environmentally sensitive electronic component of the seventeenth embodiment of the present disclosure.

Figure 15D is a cross-sectional view showing an environmentally sensitive electronic component of the eighteenth embodiment of the present disclosure.

FIG. 16 is a cross-sectional view of a display device according to an embodiment of the present disclosure.

1A is a schematic cross-sectional view showing a barrier functional film according to a first embodiment of the present disclosure. FIG. 1B is a top view of the barrier functional film of FIG. 1A. Referring to FIG. 1A , the barrier function film 100A of the present embodiment includes a substrate 110 , at least one sidewall barrier structure 120 , a release film 130 , and a glue 140 . The sidewall barrier structure 120 is located on the substrate 110. The release film 130 is disposed above the substrate 110 , wherein the sidewall barrier structure 120 is located between the substrate 110 and the release film 130 . The glue 140 covers the sidewall barrier structure 120 and is located The substrate 110 is separated from the release film 130. In general, the release film 130 of the functional barrier layer 100A can be torn from the adhesive 140 via a suitable application force.

In this embodiment, the substrate 110 is, for example, a metal substrate or a glass substrate, and the moisture absorbing material 10 may be further disposed on the substrate 110, wherein the moisture absorbing material 10 is located between the substrate 110 and the rubber material 140 and surrounded by the sidewall barrier structure 120. . In general, the absorbent material 10 is, for example, a tape-type getter, or an evaporation getter, which can be used to absorb moisture and oxygen. Specifically, as shown in FIG. 1B, the moisture absorbing material 10 of the present embodiment is, for example, a tape-type absorbing material having a rectangular bottom area. Of course, in other embodiments not shown, suction The wet material 10 may also be a sheet-like absorbent material having a bottom surface area of other different types of polygonal shapes, or a sheet-shaped absorbent material having a circular or elliptical bottom surface. The disclosure is not limited herein.

In addition, the barrier function film 100A further has a heat dissipation auxiliary material 20, wherein the heat dissipation auxiliary material 20 is also distributed in the glue material 140, for example, in the form of particles. In general, the heat dissipating auxiliary material 20 is, for example, a high heat dissipation coefficient material of diamond, diamond-like, copper, silver, gold, aluminum, platinum, ceramic material or an oxide thereof, which can be used to derive heat. On the other hand, the barrier functional film 100A may also have an anti-electromagnetic interference material 30, wherein the anti-electromagnetic interference material 30 is distributed, for example, in the form of particles in the glue 140. In general, the electromagnetic interference resistant material 30 is, for example, gold, silver, copper, carbon or lead, etc., which can be used to attenuate the effects of electromagnetics.

As shown in FIG. 1A and FIG. 1B, the sidewall barrier structure 120 of the present embodiment is, for example, a continuous and closed annular structure, wherein the sidewall barrier structure 120 is perpendicular to the substrate. The section of 110 is, for example, a trapezoid. In other embodiments not shown, the cross section may also be a rectangle or other different type of polygon, or a circular or elliptical shape, which is not limited herein. In general, the sidewall barrier structure 120 is formed by, for example, exposure, development, and etching processes, or is formed by etching on a metal substrate, and the continuous and closed annular structure is formed on the substrate 110. In addition, in other embodiments not shown, the sidewall barrier structure 120 may also be a non-closed structure.

On the other hand, the release film 130 is, for example, a polyethylene terephthalate (PET) or a silicon-containing compound, and the release film 130 is attached to the adhesive 140 to avoid the adhesive 140. Exposed and contaminated by external impurities, wherein the release film 130 can be separated from the glue 140 by appropriate application of force. In general, the glue material 140 is, for example, an optical glue material having a certain transmittance. Of course, the embodiment may also adopt an optical glue material having optical reflection characteristics or an optical glue material having semi-transparent and semi-reflective properties. Specifically, the adhesive material 140 is made of, for example, an epoxy resin, an acrylic compound, or a silicone. In the present embodiment, the material of the rubber material 140 is, for example, a material that can be cured by heating, light irradiation, or the like. In other words, the material of the rubber material 140 is cured without being heated or irradiated with light, for example. (curing) material.

The substrate 110 of the barrier functional film 100A of the above embodiment is, for example, a metal substrate or a glass substrate, and the moisture absorbing material 10 is disposed on the substrate 110, for example, a tape-type getter having a rectangular bottom surface. However, in other embodiments, Different structural designs or configurations that can achieve the ability to block moisture and oxygen are still within the scope of the present disclosure, without departing from the scope of the present disclosure. A plurality of different embodiments will be enumerated below to separately illustrate the design of the barrier functional films 100B to 100R.

2 is a schematic cross-sectional view showing a barrier functional film of a second embodiment of the present disclosure. Referring to FIG. 2, the barrier function film 100B of FIG. 2 is similar to the barrier function film 100A of FIG. 1A, except that the moisture absorbing material 10a of the barrier function film 100B of FIG. 2 is, for example, in the form of particles. Distributed within the gel material 140, in general, the moisture absorbing material 10a is, for example, a transparent or opaque absorbent material that can be used to absorb moisture and oxygen.

3A is a schematic cross-sectional view showing a barrier functional film according to a third embodiment of the present disclosure. Figure. 3B is a schematic cross-sectional view of a barrier functional film according to a fourth embodiment of the present disclosure. Referring to FIG. 3A, the barrier function film 100C of FIG. 3A is similar to the barrier function film 100A of FIG. 1A, except that the substrate 110 of the barrier function film 100C of FIG. 3A may further include a flexible substrate 110a and The barrier layer 110b, wherein the material of the flexible substrate 110a may be polyamidamine (PI), polyethylene terephthalate (PET) or polyethylene isophthalate (polyethylene terephthalate). Polyethylene naphthalate (PEN), polyethersulfone (PES), polymethyl methacrylate (PMMA), polycarbonate (PC) or metal foil.

On the other hand, the barrier layer 110b is disposed on the flexible substrate 110a, wherein the barrier layer 110b is, for example, a single layer or a plurality of layers of inorganic materials, such as a silicon oxide compound (SiO _x ), a nitrogen compound (SiN _x ), or a germanium. Nitrogen oxides (SiN _x O _y ) or alumina (Al ₂ O ₃ ), etc., may also be inorganic and organic mixed materials, such as carbon germanium (Si-C) polymers, or organic and inorganic multilayer stacks. The layer, wherein the organic material is, for example, a material such as Acrylic, Epoxy or Parylene. In general, the inorganic material can be formed on the flexible substrate 110a by a manufacturing method such as chemical vapor deposition (CVD) or sputtering. The inorganic and organic mixed materials can be formed on the flexible substrate 110a by a chemical vapor deposition (CVD) fabrication method. The organic material can be formed on the flexible substrate 110a by a production method such as chemical vapor deposition (CVD), spraying, or coating.

In short, the barrier layer 110b of the present embodiment is, for example, a barrier structure of a single-layer film layer, which can be used to block external moisture and oxygen. In other embodiments, the barrier layer 110b can also be a film of two or more layers. The barrier structure formed by the layer is not limited herein.

Referring to FIG. 3B, the barrier function film 100D of FIG. 3B is similar to the barrier function film 100C of FIG. 3A, except that the moisture absorbing material 10a of the barrier function film 100D of FIG. 3B is, for example, in the form of particles. Distributed within the gel material 140, in general, the moisture absorbing material 10a is, for example, a transparent or opaque absorbent material that can be used to absorb moisture and oxygen.

4A is a schematic cross-sectional view showing a barrier functional film according to a fifth embodiment of the present disclosure. 4B is a schematic cross-sectional view of a barrier functional film according to a sixth embodiment of the present disclosure. Referring to FIG. 4A, the barrier function film 100E of FIG. 4A is similar to the barrier function film 100C of FIG. 3A, except that the barrier function film 100E of FIG. 4A further has a quarter-wave compensation film and a polarizing film. POL, wherein the quarter-wavelength compensation film plus polarizing film POL is disposed on the flexible substrate 110a, and the quarter-wavelength compensation film is provided with a polarizing film The POL and the barrier layer 110b are respectively located on opposite sides of the flexible substrate 110a. In general, the quarter-wavelength compensation film is provided with a polarizing film POL, wherein the compensation film is, for example, a retardation film having a quarter-length whose wavelength (λ) is delayed for a specific wavelength (λ).

Referring to FIG. 4B, the barrier function film 100F of FIG. 4B is similar to the barrier function film 100E of FIG. 4A, except that the moisture absorbing material 10a of the barrier function film 100F of FIG. 4B is, for example, in the form of particles. Distributed within the gel material 140, in general, the moisture absorbing material 10a is, for example, a transparent or opaque absorbent material that can be used to absorb moisture and oxygen.

FIG. 5A is a schematic cross-sectional view showing a barrier function film according to a seventh embodiment of the present disclosure. FIG. 5B is a schematic cross-sectional view showing a barrier function film according to an eighth embodiment of the present disclosure. 5C is a schematic cross-sectional view showing a barrier function film according to a ninth embodiment of the present disclosure. 5D is a schematic cross-sectional view of a barrier functional film according to a tenth embodiment of the present disclosure. Referring to FIG. 5A, the barrier function film 100G of FIG. 5A is similar to the barrier function film 100C of FIG. 3A, and the difference is that the barrier function film 100G of FIG. 5A further has a touch layer TP, wherein the touch layer TP The touch layer TP and the glue material 140 are respectively disposed on the opposite sides of the barrier layer 110b. In detail, the touch layer TP of the embodiment is located between the flexible substrate 110a and the barrier layer 110b. In addition, the barrier function film 100G further has a flexible carrier CAR, wherein the flexible carrier CAR is adhered to the flexible substrate 110a through an optical adhesive (not shown), for example, the flexible carrier The CAR can be separated from the flexible substrate 110a by a suitable biasing force.

Referring to FIG. 5B, the barrier function film 100H of FIG. 5B is similar to the barrier function film 100G of FIG. 5A, and the difference is that the touch layer TP of the barrier function film 100H of FIG. 5B is affixed, for example, through the adhesive 140a. Fitted to the exterior of the flexible substrate 110a For example, the flexible carrier CAR is attached to the touch layer TP through an optical adhesive (not shown), wherein the touch layer TP and the adhesive 140 are respectively located on opposite sides of the flexible substrate 110a, and The touch layer TP is located between the flexible carrier CAR and the glue 140a.

Please refer to FIG. 5C, the barrier functional film 100I of FIG. 5C and the barrier of FIG. 5A. The functional film 100G is similar in that the moisture absorbing material 10a of the barrier function film 100I of FIG. 5C is distributed, for example, in the form of particles in the rubber material 140. Generally, the moisture absorbing material 10a is, for example, transparent or An opaque absorbent that absorbs moisture and oxygen.

Please refer to FIG. 5D, the barrier functional film 100J of FIG. 5D and the barrier of FIG. 5B. The functional film 100H is similar in that the moisture absorbing material 10a of the barrier function film 100J of FIG. 5D is distributed, for example, in the form of particles in the rubber material 140. Generally, the moisture absorbing material 10a is, for example, transparent or An opaque absorbent that absorbs moisture and oxygen.

6A is a schematic cross-sectional view showing a barrier function film of an eleventh embodiment of the present disclosure; Figure. 6B is a schematic cross-sectional view showing a barrier functional film according to a twelfth embodiment of the present disclosure. 6C is a cross-sectional view showing a barrier functional film of a thirteenth embodiment of the present disclosure. 6D is a schematic cross-sectional view showing a barrier functional film of the fourteenth embodiment of the present disclosure. Referring to FIG. 6A, the barrier function film 100K of FIG. 6A is similar to the barrier function film 100G of FIG. 5A, except that the flexible substrate 110a of the barrier function film 100K of FIG. 6A is arranged with a quarter. A wavelength compensation film plus polarizing film POL replaces the flexible carrier CAR of the barrier functional film 100G, wherein the quarter-wavelength compensation film plus polarizing film POL and the barrier layer 110b are respectively located on the flexible substrate 110a. side. In general, the quarter-wavelength compensation film is provided with a polarizing film POL, wherein the compensation film is, for example, a retardation film having a quarter-length whose wavelength (λ) is delayed for a specific wavelength (λ).

Please refer to FIG. 6B, the barrier functional film 100L of FIG. 6B and the barrier of FIG. 6A. The functional film 100K is similar in that the touch layer TP of the barrier function film 100L of FIG. 6B is adhered to the outer surface of the flexible substrate 110a through the adhesive 140a, for example, and the quarter-wavelength compensation film is attached. The polarizing film POL is disposed on the touch layer TP, wherein the touch layer TP and the glue 140 are respectively located on two opposite sides of the flexible substrate 110a, and the touch layer TP is located in the quarter-wave compensation film and the polarizing film POL. Between the glue 140a. In general, the quarter-wavelength compensation film is provided with a polarizing film POL, wherein the compensation film is, for example, a retardation film having a quarter-length whose wavelength (λ) is delayed for a specific wavelength (λ).

Please refer to FIG. 6C, the barrier functional film 100M of FIG. 6C and the barrier of FIG. 6A. The functional film 100K is similar in that the moisture absorbing material 10a of the barrier function film 100M of FIG. 6C is distributed, for example, in the form of particles in the rubber material 140. Generally, the moisture absorbing material 10a is, for example, transparent or An opaque absorbent that absorbs moisture and oxygen.

Please refer to FIG. 6D, the barrier functional film 100N of FIG. 6D and the barrier of FIG. 6B. The functional film 100L is similar in that the moisture absorbing material 10a of the barrier function film 100N of FIG. 6D is distributed, for example, in the form of particles in the rubber material 140. Generally, the moisture absorbing material 10a is, for example, transparent or An opaque absorbent that absorbs moisture and oxygen.

7A is a schematic cross-sectional view showing a barrier functional film of a fifteenth embodiment of the present disclosure; Figure. 7B is a schematic cross-sectional view showing a barrier functional film of a sixteenth embodiment of the present disclosure. Fig. 7C is a cross-sectional view showing the barrier functional film of the seventeenth embodiment of the present disclosure. 7D is a schematic cross-sectional view showing a barrier functional film of an eighteenth embodiment of the present disclosure. Referring to FIG. 7A, the barrier function film 100O of FIG. 7A is similar to the barrier function film 100G of FIG. 5A, which is not The same is to say that the barrier function film 100O of FIG. 7A further has a color filter layer CF, wherein the color filter layer CF is disposed between the touch layer TP and the flexible substrate 110a, and the color filter layer CF and the resistor The barrier layer 110b is located on two opposite sides of the touch layer TP.

Please refer to FIG. 7B, the barrier functional film 100P of FIG. 7B and the barrier of FIG. 5B. The function film 100H is similar, and the difference is that the barrier function film 100P of FIG. 7B further has a color filter layer CF, and the color filter layer CF, the touch layer TP and the barrier layer 110b are located on the flexible substrate 110a. Two opposite sides.

Please refer to FIG. 7C, the barrier functional film 100Q of FIG. 7C and the barrier of FIG. 5C. The function film 100I is similar, and the difference is that the barrier function film 100Q of FIG. 7C further has a color filter layer CF, wherein the color filter layer CF is disposed between the touch layer TP and the flexible substrate 110a, and the color The filter layer CF and the barrier layer 110b are located on opposite sides of the touch layer TP.

Referring to FIG. 7D, the barrier function film 100R of FIG. 7D is similar to the barrier function film 100J of FIG. 5D, and the difference is that the barrier function film 100R of FIG. 7D further has a color filter layer CF, wherein the color filter is colored. The layer is located between the touch layer TP and the flexible carrier, and the color filter layer CF, the touch layer TP and the barrier layer 110b are located on opposite sides of the flexible substrate 110a.

Only the barrier functional films 100A to 100R of some embodiments of the present disclosure are described above, and the method for fabricating the barrier functional film of the present disclosure is not described. In this regard, the environmentally sensitive electronic component package 100A of FIG. 1A will be taken as an example, and the method for fabricating the barrier functional film will be described in detail with reference to FIGS. 8A-1 to 8D.

8A-1 to 8D are cross-sectional views showing a method of fabricating the barrier functional film of the present disclosure. Schematic diagram. Referring to FIG. 8A-1 to FIG. 8A-5, at least one sidewall barrier structure 120 is first formed on the substrate 110, wherein the substrate 110 is, for example, a metal substrate or a glass substrate. In more detail, as shown in FIG. 8A-1, the method of forming at least one sidewall barrier structure 120 on the substrate 110 is to form a photoresist layer PR on the substrate 110. Next, as shown in FIG. 8A-2, a mask PC is disposed above the photoresist layer PR, and the light is transmitted through the mask PC by the projection light L to expose the photoresist layer PR to achieve pattern transfer. Next, as shown in FIG. 8A-3, the exposed photoresist layer PR is developed to cause the photoresist layer pattern PA to be transferred by the photoresist layer PR to appear. Next, as shown in FIG. 8A-4, an etching process is performed in accordance with the photoresist layer pattern PA on the substrate 110. Generally, for example, a portion of the material of a predetermined thickness on the substrate 110 is removed by wet etching. Thereafter, as shown in FIGS. 8A-5, the photoresist layer pattern PA is removed to form the sidewall barrier structure 120, and the fabrication of the sidewall barrier structure 120 has been substantially completed. As shown in FIG. 1B, the sidewall barrier structure 120 of the present embodiment is, for example, a continuous and closed annular structure. In addition, as shown in FIG. 8A-5, a cross section of the sidewall barrier structure 120 perpendicular to the substrate 110 is, for example, a trapezoid. It may also be a rectangle or a different type of polygon, or a circle or an ellipse, and the disclosure is not limited herein.

Next, as shown in FIG. 8B, a glue material 140 is formed on a release film 130. Generally, the release film 130 is, for example, polyethylene terephthalate (PET) or germanium (silicone). The compound 140, for example, is an optical glue having a certain transmittance. Of course, this embodiment can also use an optical glue having optical reflection characteristics or an optical glue having semi-transparent and semi-reflective properties. material. Specifically, the adhesive material 140 is made of, for example, an epoxy resin, an acrylic compound, or a silicone. In the present embodiment, the material of the rubber material 140 is, for example, a material that can be cured by heating, light irradiation, or the like. In other words, the material of the rubber material 140 is cured without being heated or irradiated with light, for example. (curing) material.

In addition, the glue material 140 further has a heat dissipation auxiliary material 20, wherein the heat dissipation auxiliary material 20 is distributed in the glue material 140, for example, in the form of particles. In general, the heat dissipating auxiliary material 20 is, for example, a high heat dissipation coefficient material of diamond, diamond-like, copper, silver, gold, aluminum, platinum, ceramic material or an oxide thereof, which can be used to derive heat. On the other hand, the glue material 140 may also have an electromagnetic interference resistant material 30, wherein the electromagnetic interference resistant material 30 is distributed, for example, in the form of particles in the glue material 140. In general, the electromagnetic interference resistant material 30 is, for example, gold, silver, copper, carbon or lead, etc., which can be used to attenuate the effects of electromagnetics.

Next, as shown in FIG. 8C , the release film 130 is adhered to the substrate 110 through the adhesive material 140 , wherein the adhesive material 140 covers the sidewall barrier structure 120 and is disposed between the substrate 100 and the release film 130 . Previously, a moisture absorbing material 10 was formed on the substrate 110, wherein the moisture absorbing material 10 was located between the substrate 110 and the rubber material 140, and the moisture absorbing material 10 was surrounded by the sidewall barrier structure 120. In general, the absorbent material 10 is, for example, a tape-type getter, or an evaporation getter, which can be used to absorb moisture and oxygen. Specifically, as shown in FIG. 1B, the moisture absorbing material 10 of the present embodiment is, for example, a tape-type absorbing material having a rectangular bottom area, and of course, in other embodiments not shown, moisture absorbing. Material 10 can also be the bottom The sheet-like absorbent material having an area of other different types of polygons or a sheet-shaped absorbent material having a circular or elliptical bottom surface is not limited herein.

Thereafter, referring to FIG. 8D, the release film 130 is attached to the adhesive film 140 through the adhesive 140. On the substrate 110, the glue 140 covers the sidewall barrier structure 120 and is located between the substrate 110 and the release film 130. Generally, after the release film 130 is pressed against the substrate 110, the sidewall barrier structure 120 of the substrate 110 may be in close contact with the release film 130 through the adhesive 140 by means of a roller or a frame. Thus far, the manufacturing method of the barrier functional film 100A has been substantially completed.

In addition, the disclosure is not limited to the formation of the moisture absorbing material 10 on the substrate 110. The manner and method of manufacture, that is, the other refinements and adjustments can be implemented to achieve the technical effect of absorbing water and oxygen without departing from the spirit and scope of the present disclosure. For example, as shown in FIG. 2A, the adhesive material 140 of the present disclosure may further be provided with a moisture absorbing material 10a, wherein the moisture absorbing material 10a is distributed in the rubber material 140, for example, in the form of particles, and may be similar. In the method of producing the barrier functional film 100A, the barrier functional film 100B is further obtained.

The manufacturing method and structure of the barrier functional film of each of the above embodiments are substantially the same Same or similar. In this regard, the difference between the barrier functional films 100C to 100R and the method of fabricating the barrier functional film 100A will be described below, and the same features of the same components will not be described again.

Referring to FIG. 3A, the method for fabricating the barrier function film 100C of FIG. 3A is substantially the same as the method for fabricating the barrier function film 100A, and the difference is that the substrate 100 of the barrier function film 100C of FIG. 3A may further include the flexible substrate 110a and the barrier layer 110b, wherein the barrier layer 110b, for example, single or multiple layer inorganic material, for example, silicon oxides (SiO _x), silicon nitrogen compound (SiN _x), silicon oxynitride (SiN _x O _y ) or alumina (Al ₂ O ₃ ) or the like. In addition, the barrier layer 110b may also be an inorganic and organic mixed material, such as a Si-C polymer or the like, or an organic and inorganic multilayer stacked layer, wherein the organic material is, for example, Acrylic, epoxy resin ( Epoxy) or polyarylene ether (Parylene) series and other materials. In general, the inorganic material can be formed on the flexible substrate 110a by a manufacturing method such as chemical vapor deposition (CVD) or sputtering. The inorganic and organic mixed materials can be formed on the flexible substrate 110a by a chemical vapor deposition (CVD) fabrication method. The organic material can be formed on the flexible substrate 110a by a production method such as chemical vapor deposition (CVD), spraying, or coating. The barrier layer 110b formed on the flexible substrate 110a by the above materials and manufacturing methods can be used to block external moisture or oxygen.

In short, the barrier layer 110b formed on the flexible substrate 110a is, for example The barrier structure of the single-layer film layer can be used to block the external moisture and oxygen. Of course, the barrier layer 110b can also be a barrier structure composed of two or more layers. The disclosure is not limited herein.

Please refer to FIG. 3B , the manufacturing method and the diagram of the barrier functional film 100D of FIG. 3B . The method for producing the barrier functional film 100C of 3A is substantially the same, except that the absorbent member 10a is disposed in the adhesive material 140 of the barrier functional film 100D of FIG. 3B, and more specifically, the absorbent member 10a is, for example, It is distributed in the form of particles in the glue 140 to absorb moisture or oxygen.

Please refer to FIG. 4A, the barrier function of the barrier functional films 100E and 3A of FIG. 4A. The method for fabricating the energy film 100C is substantially the same, except that the barrier function film 100E of FIG. 4A further forms a quarter-wavelength compensation film plus a polarizing film POL on the flexible substrate, wherein the quarter-wavelength compensation The film-plus polarizing film POL and the barrier layer 110b are respectively located on opposite sides of the flexible substrate 110a.

Please refer to FIG. 4B, the barrier function of the barrier functional films 100F and 3B of FIG. 4B. The method for fabricating the energy film 100D is substantially the same, except that the barrier function film 100F of FIG. 4B further forms a quarter-wavelength compensation film plus a polarizing film POL on the flexible substrate, wherein the quarter-wavelength compensation The film-plus polarizing film POL and the barrier layer 110b are respectively located on opposite sides of the flexible substrate 110a.

Please refer to FIG. 5A, the barrier functional film 100G of FIG. 5A and the barrier of FIG. 3A. The method for fabricating the functional film 100C is substantially the same, except that before the barrier layer 110b is attached to the flexible substrate 110a, a touch layer TP is further formed on the flexible substrate 110a, wherein the touch layer The TP and the glue 140 are respectively located on opposite sides of the barrier layer 110b. Then, a flexible carrier CAR is further formed on the flexible substrate 110a. The flexible carrier CAR is bonded to the flexible substrate 110a via an optical adhesive (not shown), for example. The plate CAR can be separated from the flexible substrate 110a by a suitable biasing force.

Please refer to FIG. 5B, the barrier functional film 100H of FIG. 5B and the barrier of FIG. 5A. The method for fabricating the functional film 100G is substantially the same, except that the touch layer TP of the barrier function film 100H of FIG. 5B is formed on the outer surface of the flexible substrate 110a. In detail, the touch layer TP is, for example, The adhesive substrate 140a is bonded to the flexible substrate 110a. Then, the flexible carrier CAR is adhered, for example, through an optical adhesive (not shown). The touch layer TP and the adhesive material 140 are respectively located on opposite sides of the flexible substrate 110a, and the touch layer TP is located between the flexible carrier CAR and the adhesive material 140a.

Please refer to FIG. 5C, the barrier functional film 100I of FIG. 5C and the barrier of FIG. 5A. The method for producing the functional film 100G is substantially the same, and the difference is that the moisture absorbing material 10a is disposed in the rubber material 140 of the barrier function film 100I of FIG. 5C, and more specifically, the moisture absorbing material 10a is, for example, a particle type. The state is distributed within the glue 140 and can be used to absorb moisture or oxygen.

Please refer to FIG. 5D, the barrier functional film 100J of FIG. 5D and the barrier of FIG. 5B. The method for producing the functional film 100H is substantially the same, and the difference is that the moisture absorbing material 10a is disposed in the rubber material 140 of the barrier function film 100J of FIG. 5D, and more specifically, the moisture absorbing material 10a is, for example, a particle type. The state is distributed within the glue 140 and can be used to absorb moisture or oxygen.

Please refer to FIG. 6A, the barrier functional film 100K of FIG. 6A and the barrier of FIG. 5A. The functional film 100G is manufactured in substantially the same manner, and the difference is that the barrier function film 100K of FIG. 6A forms a quarter-wavelength compensation film and a polarizing film POL on the flexible substrate 110a, replacing the barrier function film. The 100G flexible carrier CAR, wherein the quarter-wavelength compensation film-plus-polarization film POL and the barrier layer 110b are respectively located on opposite sides of the flexible substrate 110a.

Please refer to FIG. 6B, the barrier functional film 100L of FIG. 6B and the barrier of FIG. 5B. The functional film 100H is manufactured in substantially the same manner, and the difference is that the barrier function film 100LR of FIG. 6B further forms a quarter-wave compensation film on the touch layer TP. The polarizing film POL is replaced with the flexible carrier CAR of the barrier function film 100H. The touch layer TP and the adhesive material 140 are respectively located on two opposite sides of the flexible substrate 110a, and the touch layer TP is located at four quarters. A wavelength compensation film is added between the polarizing film POL and the adhesive material 140a.

Please refer to FIG. 6C, the barrier functional film 100M of FIG. 6C and the barrier of FIG. 6A. The method for producing the functional film 100K is substantially the same, and the difference is that the moisture absorbing material 10a is disposed in the rubber material 140 of the barrier function film 100M of FIG. 6C, and more specifically, the moisture absorbing material 10a is, for example, a particle type. The state is distributed within the glue 140 and can be used to absorb moisture or oxygen.

Please refer to FIG. 6D, the barrier functional film 100N of FIG. 6D and the barrier of FIG. 6B. The method for producing the functional film 100L is substantially the same, and the difference is that the moisture absorbing material 10a is disposed in the rubber material 140 of the barrier function film 100N of FIG. 6D, and more specifically, the moisture absorbing material 10a is, for example, a particle type. The state is distributed within the glue 140 and can be used to absorb moisture or oxygen.

Please refer to FIG. 7A, the barrier functional film 100O of FIG. 7A and the barrier of FIG. 5A. The method for fabricating the functional film 100G is substantially the same, except that the color filter layer CF is first formed on the flexible substrate 110a, and the touch layer TP is further formed on the color filter layer CF, wherein the color filter layer is formed. The CF is disposed between the flexible substrate 110a and the touch layer TP, and the color filter layer CF and the barrier layer 110b are located on opposite sides of the touch layer TP.

Please refer to FIG. 7B, the barrier functional film 100P of FIG. 7B and the barrier of FIG. 5B. The manufacturing method of the functional film 100H is substantially the same, and the difference is that the touch is first A color filter layer CF is formed on the layer TP, wherein the color filter layer CF and the barrier layer 110b are located on opposite sides of the touch layer TP. Then, the flexible carrier CAR is attached to the touch layer TP through an optical adhesive (not shown), wherein the flexible carrier CAR and the touch layer TP are located on opposite sides of the color filter layer CF.

Please refer to FIG. 7C, the barrier functional film 100Q of FIG. 7C and the barrier of FIG. 5C. The method for fabricating the functional film 100I is substantially the same, except that the color filter layer CF is first formed on the touch layer TP, and then the flexible substrate 110a is further formed on the color filter layer CF, wherein the color filter layer is formed. The CF is disposed between the flexible substrate 110a and the touch layer TP, and the color filter layer CF and the barrier layer 110b are located on opposite sides of the touch layer TP.

Please refer to FIG. 7D, the barrier functional film 100R of FIG. 7D and the barrier of FIG. 5D. The method for fabricating the functional film 100J is substantially the same, except that the color filter layer CF is first formed on the touch layer TP, and the color filter layer CF and the barrier layer 110b are located on opposite sides of the touch layer TP. Then, the flexible carrier CAR is attached to the color filter layer CF through an optical adhesive (not shown), wherein the flexible carrier CAR and the touch layer TP are located on opposite sides of the color filter layer CF. .

9 is a cross-sectional view of an environmentally sensitive electronic component of the first embodiment of the present disclosure intention. Referring to FIG. 9 , the environmentally sensitive electronic component 200A of the present embodiment includes a first substrate 210 , at least one first sidewall barrier structure 220 , an environmentally sensitive electronic component backplate 230 , and a first adhesive 240 . The first sidewall barrier structure 220 is located on the first substrate 210. The first substrate 210 is disposed above the environmentally sensitive electronic component backplane 230, and the first sidewall barrier structure 220 is located on the first substrate 210 and the environmentally sensitive electronic component backplane Between 230. The first adhesive material 240 is disposed between the first substrate 210 and the environmentally sensitive electronic component back plate 230 , and the first adhesive material 240 covers the first sidewall barrier structure 220 , wherein the first substrate 210 and the first sidewall barrier structure 220 is attached to the environmentally sensitive electronic component backplate 230 through the first adhesive 240.

Further, the environmentally sensitive electronic component 200A of the present example is, for example, After the release film 130 of the barrier function film 100A of FIG. 1A is peeled off, the substrate 110 and the sidewall barrier structure 120 are bonded to the environmentally sensitive electronic component back plate 230 through the adhesive 140. Generally, after the substrate 110 is pressed against the environmentally sensitive electronic component back plate 230, the sidewall barrier structure 120 of the substrate 110 may be transmitted through the adhesive 140 by means of a roller, a flat pressing, a cushioning, or other external force. In close contact with the environmentally sensitive electronic component backplate 230. It should be noted that after the substrate 110 is pressed over the environmentally sensitive electronic component back plate 230 through the adhesive 140, the substrate 110 is formed as the first substrate 210 and the sidewall barrier structure 120 is formed as the first sidewall barrier. Structure 220. Thereafter, the rubber material 140 is cured (eg, heat curing, ultraviolet curing, etc.) to form the first rubber 240, whereby the first substrate 210 and the first sidewall barrier structure 220 pass through the first adhesive 240 and environmentally sensitive electronic components. The backing plate 230 is firmly joined.

In this embodiment, the environmentally sensitive electronic component backplate 230 can include a flexible The substrate 230a and the plurality of environmentally sensitive electronic component units 230b, wherein the environmentally sensitive electronic component unit 230b is arranged on the flexible substrate 230a. Specifically, the flexible substrate 230a is made of, for example, polyamine (PI), and may be made of another flexible material. On the other hand, each environmentally sensitive electronic component unit 230b includes an active component 232b and a circuit and a wire 234b, and the circuit conductor 234b is active. Element 232b is electrically connected. In this embodiment, the active component 232b is, for example, an active environmentally sensitive electronic display component, wherein the active environmentally sensitive electronic display component is, for example, an Active Matrix Organic Light Emitting Diode (AM-OLED). Or Active Matrix Electro Phoretic Display (AM-EPD), commonly known as electronic paper, or Active Matrix Liquid Crystal Display (AM-LCD), or active matrix blue phase liquid crystal Active Matrix Blue Phase Liquid Crystal Display.

In general, active component 232b is the primary display area in the display, A thin film transistor (TFT) (not shown) is included, and the thin film transistor may be an amorphous germanium thin film transistor (a-Si TFT) and a metal oxide thin film transistor or a polycrystalline germanium thin film transistor (p) -Si TFT). In addition, the polycrystalline germanium thin film transistor (p-Si TFT) may further include a low-temperature p-Si TFT and a high-temperature p-Si TFT, a continuous grain germanium film. Continuous Grain Silicon TFT (CGS TFT) or Super Grain Silicon TFT (SGS TFT) or the like.

In addition, the first rubber 240 further has a heat dissipation auxiliary material 20, wherein the heat dissipation auxiliary material 20 is distributed in the first rubber material 240, for example, in the form of particles. In general, the heat dissipating auxiliary material 20 is, for example, a high heat dissipation coefficient material of diamond, diamond-like, copper, silver, gold, aluminum, platinum, ceramic material or an oxide thereof, which can be used to derive heat. On the other hand, the first adhesive 240 may also have an anti-electromagnetic interference material 30, wherein the anti-electromagnetic interference material 30 is distributed in the first adhesive 240, for example, in the form of particles. In general, the electromagnetic interference resistant material 30 is, for example, gold, silver, copper, carbon or lead, etc., which can be used to attenuate the effects of electromagnetics.

Although the environmentally sensitive electronic component 200A of the above embodiment is formed, for example, the barrier functional film 100A after the release film 130 is removed is bonded to the environmentally sensitive electronic component back plate 230. However, in other embodiments, the combination of the barrier functional films 100B to 100R and the environmentally sensitive electronic component backplate 230 can also achieve different structural designs or configurations for blocking the moisture and oxygen. The technical solution does not depart from the scope of the disclosure. A number of different embodiments will be enumerated below to illustrate the design of environmentally sensitive electronic components 200B through 200R, respectively.

Figure 10 is a cross-sectional view of an environmentally sensitive electronic component of a second embodiment of the present disclosure. Referring to FIG. 10, the environmentally sensitive electronic component 200B of FIG. 10 is similar to the environmentally sensitive electronic component 200A of FIG. 9, except that the moisture absorbing material 10a of the environmentally sensitive electronic component board 200B of FIG. 10 is, for example, of a particle type. The state is distributed within the first rubber 240. Generally, the absorbent material 10a is, for example, a transparent or opaque absorbent material that can be used to absorb moisture and oxygen.

11A is a cross-sectional view of an environmentally sensitive electronic component of a third embodiment of the present disclosure. 11B is a cross-sectional view of an environmentally sensitive electronic component of a fourth embodiment of the present disclosure. Referring to FIG. 11A, the environmentally sensitive electronic component 200C of FIG. 11A is similar to the environmentally sensitive electronic component 200A of FIG. 9 except that the first substrate 210 of the environmentally sensitive electronic component 200 of FIG. 11A may further include a flexible substrate. 210a and the barrier layer 210b, wherein the material of the flexible substrate 210a may be polyamidamine (PI) or polyethylene terephthalate (polyethylene terephthalate). PET), polyethylene naphthalate (PEN), polyethersulfone (PES), polymethyl methacrylate (PMMA), polycarbonate (Polycarbonate, PC) or Metal foil.

On the other hand, the barrier layer 210b is disposed on the flexible substrate 210a, wherein the barrier layer 210b is, for example, a single layer or a plurality of layers of inorganic materials, such as a silicon oxide compound (SiO _x ), a nitrogen compound (SiN _x ), or a germanium. Nitrogen oxide (SiN _x O _y ) or alumina (Al ₂ O ₃ ). In addition, the barrier layer 210 may also be an inorganic and organic mixed material, such as a carbon germanium (Si-C) polymer or the like, or an organic and inorganic multilayer stacked layer, wherein the organic material is, for example, Acrylic. Materials such as epoxy resin (Epoxy) or polyarylene ether (Parylene) series, inorganic materials can be formed by chemical vapor deposition (CVD) or sputtering (Sputter), and inorganic and organic mixed materials can be chemically used. Formed by a vapor deposition (CVD) fabrication method, the organic material can be formed by a method such as chemical vapor deposition (CVD), spraying, or coating, which can be used to block external moisture and oxygen.

Please refer to FIG. 11B, the environmentally sensitive electronic component 200D and the diagram of FIG. 11B. The environmentally sensitive electronic component 200C of 11A is similar, except that the moisture absorbing material 10a of the environmentally sensitive electronic component 200D of FIG. 11B is distributed, for example, in the form of particles in the first adhesive 240, in general, moisture absorption. The material 10a is, for example, a transparent or opaque absorbent material that can be used to absorb moisture and oxygen.

12A is a cross-sectional view of an environmentally sensitive electronic component of a fifth embodiment of the present disclosure. 12B is a cross section of an environmentally sensitive electronic component according to a sixth embodiment of the present disclosure. schematic diagram. Referring to FIG. 12A, the environmentally sensitive electronic component 200E of FIG. 12A is similar to the environmentally sensitive electronic component 200C of FIG. 11A, except that the environmentally sensitive electronic component 200E of FIG. 12A further has a quarter-wave compensation film and a polarizing film. POL, wherein the quarter-wavelength compensation film plus polarizing film POL is disposed on the flexible substrate 210a, and the quarter-wavelength compensation film-plus polarizing film POL and the barrier layer 210b are respectively located on opposite sides of the flexible substrate 210a. . In general, the quarter-wavelength compensation film plus polarizing film POL in which the compensation film is, for example, means that a retardation film having a quarter of its wavelength (λ) is delayed for a specific wavelength (λ).

Please refer to FIG. 12B, the environmentally sensitive electronic component 200F of FIG. 12B and FIG. 12A. The environmentally sensitive electronic component 200E is similar, except that the moisture absorbing material 10a of the environmentally sensitive electronic component 200F of FIG. 12B is distributed, for example, in the form of particles in the first adhesive 240. Generally, the absorbent material 10a is, for example, a transparent or opaque absorbent material that can be used to absorb moisture and oxygen.

13A is a cross section of an environmentally sensitive electronic component of a seventh embodiment of the present disclosure. schematic diagram. 13B is a cross-sectional view of an environmentally sensitive electronic component of an eighth embodiment of the present disclosure. 13C is a cross-sectional view of an environmentally sensitive electronic component of a ninth embodiment of the present disclosure. 13D is a cross-sectional view of an environmentally sensitive electronic component of a tenth embodiment of the present disclosure. Referring to FIG. 13A, the environmentally sensitive electronic component 200G of FIG. 13A is similar to the environmentally sensitive electronic component 200C of FIG. 11A, except that the environmentally sensitive electronic component 200G of FIG. 13A further has a touch layer TP, wherein the touch layer TP The touch layer TP and the first adhesive 240 are respectively disposed on opposite sides of the barrier layer 210b. Specifically, the environmentally sensitive electronic component 200G of the present example For example, after the release film 130 of the barrier functional film 100G is peeled off, the substrate 110 and the sidewall barrier structure 120 are attached to the environmentally sensitive electronic component back plate 230 through the adhesive 140 and the flexible carrier is further removed. Formed after CAR. It should be noted that after the substrate 110 is pressed against the environmentally sensitive electronic component back plate 230 , the substrate 110 is formed as the first substrate 210 and the sidewall barrier structure 120 is formed as the first sidewall barrier structure 220 . Thereafter, the rubber material 140 is cured (eg, heat curing, ultraviolet curing, etc.) to form the first rubber 240, whereby the first substrate 210 and the first sidewall barrier structure 220 pass through the first adhesive 240 and environmentally sensitive electronic components. The backing plate 230 is firmly joined.

Please refer to FIG. 13B, the environmentally sensitive electronic component 200H and the diagram of FIG. 13B. The environmentally sensitive electronic component 200G of the 13A is similar, and the difference is that the touch layer TP of the environmentally sensitive electronic component 200H of FIG. 13B is adhered to the outer surface of the flexible substrate 210a through the adhesive 240a, wherein the touch layer is The TP and the first glue 240 are respectively located on opposite sides of the flexible substrate 210a.

Please refer to FIG. 13C, the environmentally sensitive electronic component 200I of FIG. 13C and FIG. 13A. The environmentally sensitive electronic component 200G is similar, except that the moisture absorbing material 10a of the environmentally sensitive electronic component 200I of FIG. 13C is distributed, for example, in the form of particles in the first adhesive 240. Generally, the absorbent material 10a is, for example, a transparent or opaque absorbent material that can be used to absorb moisture and oxygen.

Please refer to FIG. 13D, the environmentally sensitive electronic component 200J of FIG. 13D and FIG. 13B. The environmentally sensitive electronic component 200H is similar in that the moisture absorbing material 10a of the environmentally sensitive electronic component 200J of FIG. 13D is distributed, for example, in the form of particles in the first adhesive 240. Generally, the absorbent material 10a is, for example, transparent or opaque moisture absorption Material that can be used to absorb moisture and oxygen.

14A is a cross-sectional view of an environmentally sensitive electronic component of an eleventh embodiment of the present disclosure. Schematic diagram. 14B is a cross-sectional view of an environmentally sensitive electronic component of a twelfth embodiment of the present disclosure. Figure 14C is a cross-sectional view showing the environmentally sensitive electronic component of the thirteenth embodiment of the present disclosure. Figure 14D is a cross-sectional view of an environmentally sensitive electronic component of a fourteenth embodiment of the present disclosure. Referring to FIG. 14A, the environmentally sensitive electronic component 200K of FIG. 14A is similar to the environmentally sensitive electronic component 200G of FIG. 13A, except that the flexible substrate 210a of the environmentally sensitive electronic component 200K of FIG. 6A is disposed with a quarter. A wavelength compensation film is provided with a polarizing film POL, wherein the quarter-wavelength compensation film-plus polarizing film POL and the barrier layer 210b are respectively located on opposite sides of the flexible substrate 210a.

Please refer to FIG. 14B, the environmentally sensitive electronic component 200L and the diagram of FIG. 14B. The environmentally sensitive electronic component 200K of the 14A is similar, except that the touch layer TP of the environmentally sensitive electronic component 200L of FIG. 14B is adhered to the outer surface of the flexible substrate 210a through the adhesive 240a, for example, and is divided into four quarters. A wavelength compensation film and a polarizing film POL are disposed on the touch layer TP, wherein the touch layer TP and the first glue 240 are respectively located on opposite sides of the flexible substrate 210a, and the touch layer TP is located at a quarter wavelength. The compensation film is provided between the polarizing film POL and the adhesive material 240a.

Please refer to FIG. 14C, the environmentally sensitive electronic component 200M and the diagram of FIG. 14C. The environmentally sensitive electronic component 200K of 14A is similar, except that the moisture absorbing material 10a of the environmentally sensitive electronic component 200M of FIG. 14C is distributed, for example, in the form of particles in the first adhesive 240, in general, moisture absorption. The material 10a is, for example, a transparent or opaque absorbent material that can be used to absorb moisture and oxygen.

Please refer to FIG. 14D, the environmentally sensitive electronic component 200N and the diagram of FIG. 14D. The environmentally sensitive electronic component 200L of 14B is similar, except that the moisture absorbing material 10a of the environmentally sensitive electronic component 200N of FIG. 14D is distributed, for example, in the form of particles in the first adhesive 240, in general, moisture absorption. The material 10a is, for example, a transparent or opaque absorbent material that can be used to absorb moisture and oxygen.

15A is a cross-sectional view of an environmentally sensitive electronic component of a fifteenth embodiment of the present disclosure. Schematic diagram. Figure 15B is a cross-sectional view showing the environmentally sensitive electronic component of the sixteenth embodiment of the present disclosure. Figure 15C is a cross-sectional view showing the environmentally sensitive electronic component of the seventeenth embodiment of the present disclosure. Figure 15D is a cross-sectional view showing an environmentally sensitive electronic component of the eighteenth embodiment of the present disclosure. Referring to FIG. 15A, the environmentally sensitive electronic component 200O of FIG. 15A is similar to the environmentally sensitive electronic component 200G of FIG. 13A, except that the environmentally sensitive electronic component 200O of FIG. 15A further has a color filter layer CF, wherein the color filter is colored. The layer CF is disposed on the touch layer TP, and the color filter layer CF and the barrier layer 210b are located on opposite sides of the touch layer TP.

Please refer to FIG. 15B, the environmentally sensitive electronic component 200P of FIG. 15B and FIG. 13B. The environmentally sensitive electronic component 200H is similar in that the environmentally sensitive electronic component 200P of FIG. 15B further has a color filter layer CF, wherein the color filter layer CF is disposed on the touch layer TP, and the color filter layer CF The barrier layer 210b is located on opposite sides of the touch layer TP.

Please refer to FIG. 15C, the environmentally sensitive electronic component 200Q and FIG. 15C. The environmentally sensitive electronic component 200I of the 13C is similar, except that the environmentally sensitive electronic component 200Q of FIG. 15C further has a color filter layer CF, wherein the color filter layer The CF is disposed on the touch layer TP, and the color filter layer CF and the barrier layer 210b are located on opposite sides of the touch layer TP.

Referring to FIG. 15D, the environmentally sensitive electronic component 200R of FIG. 15D is similar to the environmentally sensitive electronic component 200J of FIG. 13D, except that the environmentally sensitive electronic component 200R of FIG. 15D further has a color filter layer CF, wherein the color filter is colored. The layer CF is disposed on the touch layer TP, and the color filter layer CF and the barrier layer 210b are located on opposite sides of the touch layer TP.

FIG. 16 is a cross-sectional view of a display device according to an embodiment of the present disclosure. Please refer to The display device 300 of the present embodiment includes at least a display panel DIS, a second substrate 310, at least one second sidewall barrier structure 320, and a second adhesive 340. The second substrate 310 is disposed on one side of the display panel DIS. The second sidewall barrier structure 320 is located on the second substrate 310 , and the second sidewall barrier structure 320 is located between the display panel DIS and the second substrate 310 . The second adhesive material 340 is disposed between the second substrate 310 and the display panel DIS, and the second adhesive material 340 covers the second sidewall barrier structure 320, wherein the second substrate 310 and the second sidewall barrier structure 320 pass through the second The glue 340 is attached to the display panel DIS.

It must be noted here that the display panel DIS is, for example, the ones of FIGS. 9 to 15 . One of the environmentally sensitive electronic components 200A to 200R, and thus, the display panel DIS includes at least a first substrate 210, at least one first sidewall barrier structure 220, an environmentally sensitive electronic component backplate 230, and a first adhesive 240. The first sidewall barrier structure 220 is located on the first substrate 210. The first substrate 210 is disposed above the environmentally sensitive electronic component back plate 230, and the first sidewall barrier structure 220 is located on the first substrate 210 and the ring Between the sensitive electronic components backplane 230. The first adhesive material 240 is disposed between the first substrate 210 and the environmentally sensitive electronic component back plate 230 , and the first adhesive material 240 covers the first sidewall barrier structure 220 , wherein the first substrate 210 and the first sidewall barrier structure 220 is attached to the environmentally sensitive electronic component backplate 230 through the first adhesive 240.

On the other hand, the second substrate 310 and the at least one second sidewall barrier structure 320 And the second rubber 340 constitutes a cover portion LID. It can be understood that the cover portion LID is, for example, one of the barrier function films 100A to 100K, after being peeled off the release film 130, is adhered to the other side of the environmentally sensitive electronic component back plate 230 through the adhesive 140. And the sidewall barrier structure 120 of the substrate 110 is formed in close contact with the environmentally sensitive electronic component backplate 230 through the adhesive material 140, for example, by a roller, a flat pressing head, a cushioning pressure, or other external force. In detail, after the substrate 110 is pressed against the environmentally sensitive electronic component back plate 230 , the substrate 110 is formed as the second substrate 310 and the sidewall barrier structure 120 is formed as the second sidewall barrier structure 320 . Thereafter, the adhesive material 140 is cured (eg, heat cured, UV cured, etc.) to form a second adhesive 340, whereby the second substrate 310 and the second sidewall barrier structure 320 pass through the second adhesive 340 (ie, the cover) The portion LID) is firmly engaged with the environmentally sensitive electronic component backplate 230.

In the present embodiment, the environmentally sensitive electronic component backplate 230 can include a flexible substrate 230a and an environmentally sensitive electronic component unit 230b, wherein the environmentally sensitive electronic component unit 230b is disposed on the flexible substrate 230a. Specifically, the flexible substrate 230a is made of, for example, polyamine (PI), and may be made of another flexible material. On the other hand, the environmentally sensitive electronic component unit 230b includes an active component 232b and a circuit and a wire 234b, and the circuit conductor 234b and the active component 232b Electrical connection. In this embodiment, the active component 232b is, for example, an active environmentally sensitive electronic display component, wherein the active environmentally sensitive electronic display component is, for example, an Active Matrix Organic Light Emitting Diode (AM-OLED). Or Active Matrix Electro Phoretic Display (AM-EPD), commonly known as electronic paper, or Active Matrix Liquid Crystal Display (AM-LCD), or active matrix blue phase liquid crystal Active Matrix Blue Phase Liquid Crystal Display.

In general, the active component 232b is a main display area in the display, including a thin film transistor (TFT) (not shown), and the thin film transistor may be an amorphous germanium thin film transistor (a-Si TFT) and a metal oxide. A metal oxide TFT or a polycrystalline germanium thin film transistor (p-Si TFT). In addition, the polycrystalline germanium thin film transistor (p-Si TFT) may further include a low-temperature p-Si TFT and a high-temperature p-Si TFT, a continuous grain germanium film. Continuous Grain Silicon TFT (CGS TFT) or Super Grain Silicon TFT (SGS FT) and the like.

In addition, the second adhesive 340 further has a heat dissipation auxiliary material 20, wherein the heat dissipation auxiliary material 20 is distributed in the second glue 340, for example, in the form of particles. In general, the heat dissipating auxiliary material 20 is, for example, a high heat dissipation coefficient material of diamond, diamond-like, copper, silver, gold, aluminum, platinum, ceramic material or an oxide thereof, which can be used to derive heat. On the other hand, the second adhesive 340 may also have an anti-electromagnetic interference material 30, wherein the anti-electromagnetic interference material 30 is distributed in the second adhesive 340, for example, in the form of particles. In general, the electromagnetic interference resistant material 30 is, for example, gold, silver, copper, carbon or lead, etc., which can be used to attenuate the effects of electromagnetics.

In short, the display device 300 of the present disclosure may be a combination of any of the environmentally sensitive electronic components 200A to 200R of the above embodiment and any of the barrier functional films 100A to 100R after the release film 130 is removed, wherein the second resistance The barrier structure 320 can be a flexible substrate 230a that is nearly in close proximity to the display panel DIS, or a flexible substrate 230a embedded in the display panel DIS to block external moisture and oxygen. Specifically, the cover portion LID attached to any of the environmentally sensitive electronic components 200A to 200R can be used as a transparent cover or as an opaque cover. In other words, the display device of the present disclosure can be double-sided. The display device may also be a display device that emits light on one side. In addition, the display device of the present disclosure may further be a display device with a touch function, and further has the functions of moisture absorption, heat dissipation, and anti-electromagnetic effect.

In summary, the barrier functional film of the present disclosure has a rubber material bonded between the substrate and the release film, and has a sidewall barrier structure on the substrate, wherein the sidewall barrier structure is located between the substrate and the release film. In addition, the environmentally sensitive electronic component and display device of the present disclosure have a glue material bonded between the two substrates, wherein the sidewall barrier structure is disposed between the two substrates and at least a portion of the sidewall barrier structure surrounds the active component of the environmentally sensitive electronic component unit Wherein the sidewall barrier structure is covered by a rubber material. In other words, the barrier function, the environmentally sensitive electronic component and the display device of the present disclosure not only have good ability to block moisture and oxygen, but also are easy to mass-produce.

In addition, the present disclosure has a moisture absorbing material disposed on the substrate, or a moisture absorbing material distributed in the rubber material, and the rubber material has a heat dissipation auxiliary material and anti-electromagnetic interference. material. In other words, the sidewall barrier functional film, the environmentally sensitive electronic component and the display device of the present disclosure have the functions of absorbing water oxygen, dissipating heat, and attenuating electromagnetic effects, thereby effectively extending the life of the electronic component.

The present disclosure has been disclosed in the above embodiments, but it is not intended to limit the disclosure, and any person skilled in the art can make some changes and refinements without departing from the spirit and scope of the disclosure. The scope of protection of this disclosure is subject to the definition of the scope of the appended claims.

10‧‧‧Hydraulic materials

20‧‧‧Solution aids

30‧‧‧Anti-electromagnetic interference materials

100A‧‧‧Disability function film

110‧‧‧Substrate

120‧‧‧ sidewall barrier structure

130‧‧‧ release film

140‧‧‧Stained materials

Claims (25)

A barrier functional film comprising: a substrate having a central region and a peripheral region located around the central region; at least one sidewall barrier structure on the substrate and located only in the peripheral region; a release film And disposed on the substrate, wherein the sidewall barrier structure is located between the substrate and the release film; and a rubber material covering the sidewall barrier structure and located between the substrate and the release film, the separation The film is in direct contact with the glue. The barrier function film of claim 1, further comprising a moisture absorbing material, wherein the moisture absorbing material is disposed on the substrate between the substrate and the rubber material, and the moisture absorbing material is Surrounded by a sidewall barrier structure. The barrier function film of claim 1, further comprising a moisture absorbing material, wherein the moisture absorbing material is distributed in the rubber material. The barrier function film of claim 1, further comprising a heat dissipation auxiliary material, wherein the heat dissipation auxiliary material is distributed in the glue material. The barrier function film according to claim 1, further comprising an anti-electromagnetic interference material, wherein the anti-electromagnetic interference material is distributed in the glue. The barrier functional film according to claim 1, wherein the substrate comprises a metal substrate or a glass substrate. The barrier functional film of claim 1, wherein the substrate comprises: a flexible substrate; At least one barrier layer is disposed on the flexible substrate. The barrier function film according to claim 7, further comprising a quarter-wave compensation film and a polarizing film, wherein the quarter-wave compensation film and the polarizing film are disposed on the flexible substrate, and The quarter-wavelength compensation film-plus-polarization film and the barrier layer are respectively located on opposite sides of the flexible substrate. The barrier function film of claim 7, further comprising a touch layer, wherein the touch layer is disposed on the flexible substrate, and the touch layer and the glue are respectively located in the barrier layer Two opposite sides of the layer. The barrier function film of claim 9, further comprising a color filter layer, wherein the color filter layer is disposed on the touch layer, and the color filter layer and the barrier layer are located Two opposite sides of the touch layer. The barrier functional film of claim 1, wherein the sidewall barrier structure comprises a continuous and closed annular structure. The barrier functional film according to claim 1, wherein the cross section of the sidewall barrier structure comprises a rectangle, a trapezoid, a polygon, a circle or an ellipse, and the section is perpendicular to the substrate. A method for fabricating a barrier functional film, comprising: forming at least one sidewall barrier structure on a substrate, wherein the substrate has a central region and a peripheral region located around the central region, and the sidewall barrier structure is located only a peripheral material; a glue is formed on a release film, and the release film is in direct contact with the glue; The release film is attached to the substrate through the glue, wherein the glue covers the sidewall barrier structure and is located between the substrate and the release film. The method for fabricating a barrier functional film according to claim 13 , wherein the method for forming the sidewall barrier structure on the substrate comprises: coating a photoresist layer on the substrate; and forming the photoresist layer on the photoresist layer Exposure, development, and etching processes are performed; and the photoresist layer is removed to form the sidewall barrier structure. The method for fabricating a barrier function film according to claim 13 , further comprising: forming a moisture absorbing material on the substrate, wherein the moisture absorbing material is located between the substrate and the glue material, and the moisture absorbing material Surrounded by the sidewall barrier structure. The method for fabricating a barrier functional film according to claim 13, further comprising a moisture absorbing material, wherein the moisture absorbent is distributed in the rubber material. The method for fabricating a barrier functional film according to claim 13 , further comprising a heat dissipation auxiliary material, wherein the heat dissipation auxiliary material is distributed in the rubber material. The method for fabricating a barrier functional film according to claim 13 further includes an anti-electromagnetic interference material, wherein the anti-electromagnetic interference material is distributed in the rubber material. The method for producing a barrier functional film according to claim 13, wherein the substrate comprises a metal substrate or a glass substrate. The method for fabricating a barrier functional film according to claim 13, wherein the substrate comprises: a flexible substrate; and at least one barrier layer formed on the flexible substrate. The method for fabricating a barrier functional film according to claim 20, further comprising: forming a quarter-wavelength compensation film and a polarizing film on the flexible substrate, wherein the quarter-wavelength compensation film The polarizing film and the barrier layer are respectively located on opposite sides of the flexible substrate. The method for fabricating a barrier function film according to claim 20, further comprising: forming a touch layer on the flexible substrate, wherein the touch layer and the glue are respectively located in the barrier layer; Two opposite sides. The method for fabricating a barrier functional film according to claim 22, further comprising: forming a color filter layer on the touch layer, wherein the color filter layer and the barrier layer are located on the touch layer Two opposite sides. The method for fabricating a barrier functional film according to claim 13, wherein the sidewall barrier structure comprises a continuous and closed annular structure. The method for fabricating a barrier functional film according to claim 13, wherein the cross section of the sidewall barrier structure comprises a rectangle, a trapezoid, a polygon, a circle or an ellipse, and the section is perpendicular to the substrate.