TWI566308B - High accuracy die bonding apparatus with high yield - Google Patents

Description

High-output high-precision wafer bonding device

The present invention is a high-output, high-precision wafer bonding apparatus that provides a device capable of transferring crystal grains in multiple stages and accomplishing high-precision and high-output bonding of crystal grains.

In recent years, the development of semiconductor processes has become increasingly mature. In order to reduce the size, reduce the cost and improve the performance, existing ICs continue to reduce the line pitch of IC circuits under the concept of 2D IC, but when the IC line distance has been developed to below 20 nm process The existing development direction has gradually emerged as a bottleneck. In order to break through the limitations of IC performance, the development of 3D IC has become a new trend. However, one of the most critical and important processes in the process of 3D IC is high-precision crystal. Particle bonding, and the most commonly used is the high-precision flip chip bonding technology.

In today's flip chip process, a wafer is cut to form a plurality of wafers, and the grains are flipped and subjected to a Die Bond step to crystallize The particles adhere to a substrate.

In the step of bonding the crystal, the suction module of the die bonding machine sucks the die on a wafer or a die (Die Tray), and moves the die to a glue module to The die is adhered with an adhesive, and the die having the adhesive is moved to a substrate, and then the positioning module is positioned and the die is lowered to adhere the die to the substrate, and then the module is sucked again. Returning to the upper side of the die disc by another path or the original path to pick up the die again. This process arrangement cannot meet the requirements of high precision and high throughput, and is limited to flip chip applications where the wafer must be turned over for high-precision alignment and bonding.

However, there is still no manufacturer thinking about a segmented die-bonding mode. The multi-stage process is used to simultaneously or sequentially glue multiple grains, and the bonded die can be adhered in time. And can be balanced for non-reclaping applications, wafers The high-precision press-fitting measures on the front side also cause bottlenecks in the development of 3D IC slime.

As mentioned above, one of the main bottlenecks that cannot be broken in the existing steps of the die-bonding process is glued, because the glue will cause the suction module to stagnate in this step, and the process is inconveniently caused, and the suction is taken. The travel path of the module in the die-bonding and absorbing crystals is too long and affects the production efficiency. The second bottleneck is that there is no flexibility for the application of flip chip and non-clad, so the existing die bonder still has room for improvement.

In view of the above disadvantages, the object of the present invention is to provide a high-output, high-precision wafer bonding apparatus capable of overcoming the troubles of the process and maintaining the smoothness of the die bonding operation to segment the die bonding process. The action of sticking and sticking can be carried out at the same time, thereby increasing the speed of the bonding and increasing the elasticity and production efficiency of the machine; in particular, the invention utilizes a rotating platform as a relay station of the die (wafer), together with a turning mechanism, The machine is capable of elasticity and corresponds to high-precision die bonding applications of flip chip and non-clad.

In order to achieve the above object, the technical means of the present invention is to provide a high-output high-precision wafer bonding apparatus for adhering at least one die, the wafer bonding apparatus comprising: one for at least one die a supply module; a receiving module that can receive the at least one die, which is disposed on one side of the supply module; and a rotating module that is disposed between the supply module and the receiving module; a turntable, which is disposed between the supply module and the rotary module; a first pick and place module disposed above the supply module, and the supply module and the turntable Moving between; and at least two second pick-and-place modules are disposed in the rotating module.

In summary, the present invention utilizes a rotating module to maintain a relatively smooth flow of the die during gluing, and the individual dies do not interfere with one another during the gluing process.

In addition, the present invention utilizes a transfer table to serve as a die from a supply module to a receiving The relay station between the modules uses a plurality of pick-and-place modules, so each pick-and-place module has only a short travel path, thereby making the die bonder elastic.

10‧‧‧Supply module

11‧‧‧First pick and place module

12‧‧‧Transfer platform

13‧‧‧Rotary Module

14‧‧‧Second pick and place module

15‧‧‧ glued module

16‧‧‧Receiving modules

17‧‧‧ Third Visual Positioning Module

18‧‧‧Second Visual Positioning Module

19‧‧‧First Vision Positioning Module

20‧‧‧ grain

21‧‧‧Light source unit

30‧‧‧Supply module

31‧‧‧First pick and place module

32‧‧‧Flip module

33‧‧‧Transfer platform

34‧‧‧Rotary Module

35‧‧‧Second pick and place module

36‧‧‧ glued module

37‧‧‧Accept module

38‧‧‧ Third Vision Positioning Module

39‧‧‧Second Visual Positioning Module

40‧‧‧First Vision Positioning Module

41‧‧‧Light source unit

50‧‧‧ grain

60‧‧‧Accept module

70‧‧‧Visual Positioning Module

71‧‧‧Mirror unit

72‧‧‧ grain

80‧‧‧Up and down visual positioning module

81‧‧‧ camera unit

82‧‧‧First Guide

83‧‧‧second mirror

10A‧‧‧Supply Module

11A‧‧‧First pick and place module

12A‧‧‧Return platform

13A‧‧‧Rotary Module

14A‧‧‧Second pick and place module

15A‧‧‧ glued module

16A‧‧‧Receiving modules

17A‧‧‧ Third Vision Positioning Module

18A‧‧‧Second Visual Positioning Module

19A‧‧‧First Vision Positioning Module

20A‧‧‧ grain

21A‧‧‧Light source unit

30A‧‧‧Supply Module

31A‧‧‧First pick and place module

32A‧‧‧Flip Module

33A‧‧‧Return platform

34A‧‧‧Rotary Module

35A‧‧‧Second pick-and-place module

36A‧‧‧ glued module

37A‧‧‧Receiving modules

38A‧‧‧The third visual positioning module

39A‧‧‧Second Visual Positioning Module

40A‧‧‧First Vision Positioning Module

41A‧‧‧Light source unit

50A‧‧‧ grain

BRIEF DESCRIPTION OF THE DRAWINGS Figure 1 is a partial top plan view of a first embodiment of a high throughput, high precision wafer bonding apparatus of the present invention.

2 is a schematic view showing the operation of the first embodiment of the high-output high-precision wafer bonding apparatus of the present invention.

3 is a partial top plan view of a second embodiment of a high throughput, high precision wafer bonding apparatus of the present invention.

4 is a schematic view showing the operation of the second embodiment of the high-output high-precision wafer bonding apparatus of the present invention.

Figure 5 is a schematic view showing the operation of the third embodiment of the high-output high-precision wafer bonding apparatus of the present invention.

Figure 6 is a schematic view showing the operation of the fourth embodiment of the high-output high-precision wafer bonding apparatus of the present invention.

Figure 7 is a schematic view showing the operation of the fifth embodiment of the high-output high-precision wafer bonding apparatus of the present invention.

Figure 8 is a schematic view showing the operation of the sixth embodiment of the high-output high-precision wafer bonding apparatus of the present invention.

Figure 9 is a partial schematic view showing the seventh embodiment of the high-output high-precision wafer bonding apparatus of the present invention.

Figure 10 is a partial schematic view showing the eighth embodiment of the high-output high-precision wafer bonding apparatus of the present invention.

Figure 11 is a partial schematic view showing the ninth embodiment of the high-output high-precision wafer bonding apparatus of the present invention.

12 is a schematic diagram of a visual positioning module.

Figure 13 is a perspective view of a top and bottom visual positioning module.

The embodiments of the present invention are described below by way of specific embodiments, and those skilled in the art can easily disclose the contents disclosed in the present specification. Other advantages and effects of the present invention are understood.

Referring to FIG. 1 and FIG. 2, the present invention is a high-output high-precision wafer bonding apparatus. The first embodiment has a supply module 10, a first pick-and-place module 11, and a turntable. 12, a rotating module 13, at least two second pick-and-place module 14, a glue module 15, a receiving module 16, a third visual positioning module 17, a second visual positioning module 18, a The first visual positioning module 19 and a light source unit 21 are provided.

As shown in FIGS. 1 and 2, the supply module 10 is provided for a plurality of crystal grains 20.

The receiving module 16 is disposed on one side of the supply module 10 to receive the die 20 from the supply module 10.

The rotary module 13 is disposed between the supply module 10 and the receiving module 16 .

The turntable 12 is disposed between the supply module 10 and the rotating module 13.

The first pick-and-place module 11 is disposed above the supply module 10 and moves between the supply module 16 and the rotating platform 12 . The first pick-and-place module 11 can have a vacuum suction force and a pneumatic pressure thrust.

At least two second pick-and-place modules 14 are disposed on the rotating module 13 .

The glue module 15 is disposed below the rotary module 13 .

The third visual positioning module 17 is disposed above the supply module 10 .

The second visual positioning module 18 is disposed above the rotation platform 12 .

The first visual positioning module 19 is disposed above the receiving module 16 .

The light source unit 21 is movably disposed between the first visual positioning module 19 and the receiving module 16 , that is, the light source unit 21 is located above the receiving module 16 .

The third visual positioning module 17 captures the image of the die 20 located in the supply module 10. The first pick-and-place module 11 absorbs the die 20 to be sucked according to the information of the image, and absorbs the crystal. The pellets are moved to the transfer table 12.

The second visual positioning module 18 captures the image of the die 20 located at the turntable 12, and the rotation module 13 moves the second pick and place module 14 to the die 20 to be sucked according to the information of the image. The die 20 is sucked up, and after the second pick-and-place module 14 picks up the die 20, the rotating module 13 is rotated by an angle to move the die 20 to the glue module 15 to make the die 20 The adhesive is attached, and the other second pick-and-place module 14 is moved by the rotating module 13 to the top of the rotating platform 12, so as to absorb another waiting The die 20 is sucked.

As described above, the rotary module 13 is continuously rotated to move the die 20 with the adhesive adhered to the upper portion of the receiving module 16 and to move the other die 20 to the adhesive module 15.

The first visual positioning module 19 can improve the positioning accuracy between the die 20 and the receiving module 16 , thereby making the precision of the die bonding operation better, and the first visual positioning module 19 is in the alignment die 20 . When the module 16 is received, the field of view of the first visual positioning module 19 can penetrate the die 20 to capture the mark on the other side of the die 20, thereby improving the positioning accuracy. In addition, the third visual positioning mode The fields of view of the group 17 and the second visual positioning module 18 can also penetrate the die 20 as necessary to capture the indicia on the other side of the die 20.

The light source unit 21 is moved between the first visual positioning module 19 and the receiving module 16, and the movement is up and down and moving left and right. When the light source unit 21 is moved below the first visual positioning module 19, the light source unit 21 The die 20 and the receiving module 16 can be illuminated, so that the first visual positioning module 19 can more clearly obtain the images of the two, and perform the alignment. After the alignment, the bonding operation is performed.

As described above, the third visual positioning module 17 is capable of vertically capturing the image and the one side of the alignment supply module 10 and the die 20, and the second visual positioning module 18 is capable of vertically capturing the image and the alignment bearing table 12. The first visual positioning module 19 can vertically take the image and the one side of the alignment receiving module 16 and the die 20 on one side and the die 20 .

Referring to FIG. 3 and FIG. 4 , the present invention is a high-output high-precision wafer bonding apparatus with improved adhesion ratio, which has a supply module 30 and a first pick-and-place module 31. a selective flipping module 32, a rotating platform 33, a rotating module 34, at least two second pick-and-place modules 35, a glue module 36, a receiving module 37, and a third visual positioning The module 38, a second visual positioning module 39, a first visual positioning module 40 and a light source unit 41.

As shown in the first embodiment, the supply module 30, the first pick-and-place module 31, the turntable 33, the rotating module 34, the second pick-and-place module 35, the glue module 36, the receiving module 37, The arrangement, position and action of the third visual positioning module 38, the second visual positioning module 39, the first visual positioning module 40 and the light source unit 41 are the same as the first embodiment, so More details.

In this embodiment, the inverting module 32 is disposed between the supply module 30 and the rotating platform 33. The inverting module 32 has a function of flipping and sucking the die. When the first pick-and-place module 31 is sucked and located After the die 50 of the module 30 is supplied, and moved to the flip module 32, the first pick-and-place module 31 will transfer the die to the flip module 32, and the flip module 32 will be the first die. The pick-and-place module 31 is rotated by an angle. For example, the angle can be any one of 0 to 360 degrees, but is not limited, and is preferably any one of 0 to 180 degrees. 50 is placed on the transfer table 33. As in the first embodiment, the die 50 is adhered to the receiving module 37 via the glue module 36.

Referring to FIG. 5, the present invention is a third embodiment of a high-output high-precision wafer bonding apparatus which is similar to the second embodiment described above, so that the component symbols follow the second embodiment.

In the embodiment, the inversion module 32 is disposed between the rotating module 34 and the rotating platform 33.

After the first pick-and-place module 31 picks up the die 50 located in the supply module 30 and places the die 50 on the turntable 33, the flip module 32 sucks the die 50 located on the turntable 33 and flips the crystal The granule 50 and the second pick-and-place module 35 pick up the dies of the flip module 32 and glue and bond the dies.

Referring to FIG. 6, a fourth embodiment of the present invention is further derived from the first embodiment of the present invention, so that the component symbols follow the first embodiment.

The other supply module 10 is disposed on the other side of the receiving module 16 .

The other rotating module 13 is disposed between the other supply module 10 and the receiving module 16 .

The other first pick-and-place module 11 is disposed above the other supply module 10 .

The other at least two second pick-and-place modules 14 are disposed on the other rotating module 13 .

The other glue module 15 is disposed below the other rotating module 13 .

The other third visual positioning module 17 is disposed above the other supply module 10.

Another second visual positioning module 18 is disposed above the other pivoting platform 12 .

The other first visual positioning module 19 is disposed above the receiving module.

The above supply module 10, the second visual positioning module 18, and the third visual positioning module The operation of the group 16 , the first pick-and-place module 11 , the rotating module 13 and the glue module 15 has been discussed in the first embodiment, and therefore will not be described here. This embodiment is described in another example of the receiving module 16 . At least one supply module 10, at least one second visual positioning module 18, at least two second pick-and-place modules 14, at least one third visual positioning module 16, and at least one first pick-and-place module 11 can be further disposed on the side. At least one rotating module 13 and at least one glue module 15 by increasing the number of the supply module 10, the first pick-and-place module 11, the rotating module 13 and the second pick-and-place module 14, and the first vision The module 19 is positioned to increase the throughput of the die transfer. However, the two first visual positioning modules 19 can be integrated with a first visual positioning module 19 as necessary.

Referring to FIG. 7 , a fifth embodiment of the present invention is further derived from the second embodiment of the present invention. The high-output high-precision wafer bonding apparatus has a supply module 10A and a first take-up. The module 11A, the second rotating platform 12A, the two rotating modules 13A, the at least two second pick-and-place modules 14A, the two-dipped module 15A, the second receiving module 16A, a third visual positioning module 17A, two The second visual positioning module 18A, the two first visual positioning modules 19 and the two light source units 21A.

The top end of the supply module 10A has at least one die 20A.

The first pick-and-place module 11A is respectively disposed above the supply module 10A. As shown in FIG. 7, a first take-off module 11A is located on the right side of the supply module 10A, or one side, and the other A snap module 11A is located on the right side above the supply module 10A, or the other side, and the left, right or side and the other side are only for ease of discussion and understanding of the present invention, and are not limiting.

The two receiving modules 16A are respectively located on both sides of the supply module 10A. As described above, a receiving module 16A is located on one side of the supply module 10A. The other receiving module 16A is located on the other side of the supply module 10A.

A rotating module 13A is located between the supply module 10A and a receiving module 16A. Another rotating module is located between the supply module 10A and another receiving module 16A.

At least two second pick-and-place modules 14A are coupled to the rotating module 13A. The other at least two second pick-and-place modules are disposed on the other rotating module 13A.

The glue module 15A is disposed below the rotary module 13A. The other glue module 15A is disposed below the other rotation module 13A.

The third visual positioning module 17A is disposed above the supply module 10A.

The second visual positioning module 18A is disposed above the turntable 12A. The other second visual positioning module 18A is disposed above the other revolving table 12A.

The first visual positioning module 19A is disposed above the receiving module 16A. The other first visual positioning module 19A is disposed above the other receiving module 16A.

The light source unit 21A is movably disposed between the first visual positioning module 19A and the receiving module 16A. The other light source unit 21A is movably disposed between the other first visual positioning module 19A and the other receiving module 16A.

The supply module 10A, the first pick-and-place module 11A, the turntable 12A, the rotating module 13A, the second pick-and-place module 14A, the glue module 15A, the receiving module 16A, the third visual positioning module 17A, The relationship between the second visual positioning module 18A, the first visual positioning module 19 and the light source unit 21A is as described above, and therefore will not be described again.

Referring to FIG. 8 , a sixth embodiment of the present invention is further derived from the second embodiment of the present invention. As in the fourth embodiment, the other side of the receiving module 37 is sequentially disposed. Another rotating module 34, another at least two second pick-and-place modules 35, another glue module 36, another second vision positioning module 39, another first vision positioning module 40, and another flip mode The group 32, another transfer platform 33, another supply module 30, another first pick-and-place module 31 and another third visual positioning module 38. As described above, the two first visual positioning modules 40 can be integrated into a single first visual positioning module 40.

Referring to FIG. 9 , a seventh embodiment of the present invention is further derived from the third embodiment of the present invention. As in the fifth embodiment described above, in the present embodiment, another rotating platform 33 is The other inverting module 32 is different from the fifth embodiment, and the other inverting module 32 is disposed between the other rotating platform 33 and the other rotating module 34.

As shown in FIGS. 6, 8 and 9, respectively, two first visual positioning modules are disposed above the receiving module. As described above, the two first visual positioning modules can be integrated into a single first visual. Positioning module. The plurality of first visual positioning modules are intended to cooperate with a plurality of rotating modules and a second pick-and-place module disposed in the rotating module.

Referring to FIG. 10, an eighth embodiment of the present invention is further derived from the second embodiment of the present invention. The supply module 30A, the die 50A, and the first pick and place are provided. The module 31A, the rotating platform 33A, the rotating module 34A, the second pick-and-place module 35A, the glue module 36A, the receiving module 37A, the third visual positioning module 38A, the second visual positioning module 39A, The arrangement of a visual positioning module 40A and the light source unit 41A is as discussed above in FIG. In this embodiment, a flip module 32 is disposed between the turntable 33A and the supply module 30A. The other transfer module 32A is disposed between the other transfer table 33A and the supply module 30A.

Referring to FIG. 11 , an eighth embodiment of the present invention is further derived from the second embodiment of the present invention. The difference from the seventh embodiment is that a flip module 32 is set in the turn. Between the cap 33A and the rotating module 34A. The other transfer module 32A is disposed between the other transfer table 33A and the other rotary module 34A. In the present embodiment, all the components are equivalent to the seventh embodiment described above, and the component symbols are similar to those in FIG. 10 except that the setting positions are slightly different.

As shown in FIG. 12 , a visual positioning module 70 is movably disposed above the receiving module 60 , that is, the visual positioning module 70 is located between the receiving module 60 and the pick-and-place module, and a mirror unit The 71 is disposed above the receiving module 60 and adjacent to the visual positioning module 70 that moves to the upper of the receiving module 60.

The visual positioning module 70 is capable of selectively capturing images of one side of the receiving module 60. The visual positioning module 70 is capable of capturing an image of the die 72 located in the pick-and-place module, or simultaneously capturing the pick-and-place module. The image of the die 72 and one side of the module 60 is received, or the visual positioning module 70 captures only an image of one side of the receiving module 60.

If the above description is further described, when a die 72 is moved over the receiving module 60, the visual positioning module 70 moves toward the upper side of the receiving module 60, and the mirror unit 71 directs the die 72 toward the receiving module 60. The image of one side is reflected to the visual positioning module 70 for the visual positioning module 70 to capture the image, that is, the mark of the die 72 located on the surface is taken to improve the accuracy of the die, or the mirror unit 71 The image of one side of the receiving module 60 is reflected to the visual positioning module 70 for the visual positioning module 70 to capture the image, and the image can be simultaneously or separately performed to improve the positioning accuracy. The visual positioning module 70 exits the upper portion of the receiving module 60 to perform a die-bonding operation.

Please refer to FIG. 13 for the visual positioning module 70 and the mirror as shown in FIG. The firing unit 71 can be replaced by a top and bottom visual positioning module 80.

The upper and lower visual positioning module 80 is movably disposed above the receiving module, that is, the upper and lower visual positioning module 80 is located between the receiving module and the pick-and-place module, and the upper and lower visual positioning module 80 has two camera units 81, A plurality of first guiding mirrors 82 and a plurality of second guiding mirrors 83 are disposed on one side of the first guiding mirror 82, and the first guiding mirrors 82 are disposed at one end of each of the imaging units 81, and each of the imaging units The unit 81 passes through the first guiding mirror 82 and the second guiding mirror 83 respectively to capture the upper and lower images. The upper image is an image of a die located in the pick-and-place module, and the lower image is an image of one side of the receiving module or an image of a die of the receiving module.

In summary, when the die is moved from the supply module to the receiving module, the die system acts as a relay station, so each pick-and-place module can reciprocate in a short stroke to Moving from one station to another until the die is placed or adhered to the receiving module 37, the die bonding process is more flexible.

The invention further applies the rotating module to the plurality of suction modules, and the plurality of crystal grains are sequentially glued and placed or glued to maintain the smoothness of the glue.

In addition, the visual field of the visual positioning module to which the present invention is applied can penetrate the die to capture the mark on the other side of the die, that is, the first to first visual positioning modules can capture the mark on the other side of the die, thereby Make the positioning of the crystals more precise.

The third visual positioning module is capable of vertically taking an image and a side of the alignment supply module and the die.

The second visual positioning module is capable of vertically taking an image and a side of the alignment bearing table and the die.

The first visual positioning module is capable of vertically taking an image and a face and a die of the alignment receiving module.

Furthermore, the inverting module described in the second embodiment is an optional component, that is, when the inverting module is installed, the distance between the first pick-and-place module and the rotating platform can be shortened to increase The first pick-and-place module moves at a speed, thereby being able to absorb a large number of dies, and the purpose of flipping the dies is that the positions of the sizing of the dies may be different due to different processes, so by flipping the module To flip the die to the desired position and angle.

Furthermore, the purpose of the transfer table is to resilience of the process, and the resulting design, as described in the first embodiment, when the die does not require a flip chip process, the first pick-and-place module places the die directly on the turn The cap and the second pick-and-place module then take the die out of the turntable.

Secondly, if the die needs a flip chip process, as described in the second embodiment, the first pick-and-place module feeds the die to the flip module, the flip module flips the die, and then places the die in the turn-around The second pick-and-place module removes the die from the turntable for the die bonding process.

Further, as described in the third embodiment, the first pick-and-place module directly places the die on the turntable, the flipping module sucks the die from the turntable, and flips the die, and the second pick and place module sucks Flip the grain to perform the die bonding process.

Fourthly, as described in the fourth, fifth and sixth embodiments, the supply module, the second visual positioning module, the second pick-and-place module, the third visual positioning module, the first pick-and-place module, and the rotating module The number of adhesive modules can be increased to increase the throughput of die transfer.

The specific embodiments described above are only used to exemplify the features and functions of the present invention, and are not intended to limit the scope of the present invention, and may be used without departing from the spirit and scope of the invention. Equivalent changes and modifications made to the disclosure of the invention are still covered by the scope of the following claims.

10‧‧‧Supply module

11‧‧‧First pick and place module

12‧‧‧Transfer platform

13‧‧‧Rotary Module

14‧‧‧Second pick and place module

15‧‧‧ glued module

16‧‧‧Receiving modules

17‧‧‧ Third Visual Positioning Module

18‧‧‧Second Visual Positioning Module

19‧‧‧First Vision Positioning Module

20‧‧‧ grain

21‧‧‧Light source unit

Claims (33)

A high-output, high-precision wafer bonding apparatus for bonding at least one die, the wafer bonding apparatus comprising: a supply module for at least one die; and a substrate capable of receiving the at least one die The module is disposed on one side of the supply module; a rotary module is disposed between the supply module and the receiving module; and a rotating platform is disposed on the supply module Between the rotating module and the rotating module; a first pick-and-place module is disposed above the supply module and moves between the supply module and the rotating platform; at least two second pick-and-place modules, The system is disposed on the rotating module; and a first visual positioning module is disposed above the receiving module, wherein the first visual positioning module is capable of vertically capturing and aligning one side of the receiving module With the grain. The high-output high-precision wafer bonding apparatus according to claim 1, further comprising a glue module disposed under the rotation module. The high-output high-precision wafer bonding apparatus of claim 1, further comprising a flipping module disposed between the supply module and the rotating platform. The high-output high-precision wafer bonding apparatus of claim 1, further comprising a flipping module disposed between the rotating module and the rotating platform. The high-output high-precision wafer bonding apparatus of claim 1, further comprising a light source unit capable of being between the receiving module and the rotating module. The high-output high-precision wafer bonding apparatus of claim 1, further comprising a third visual positioning module, the third visual positioning module being disposed above the supply module. High-yield high-precision wafer bonding package as described in claim 1 The device further has a second visual positioning module, and the second visual positioning module is disposed above the rotating platform. The high-output high-precision wafer bonding apparatus according to claim 7, wherein the second visual positioning module is capable of vertically taking and aligning one side of the rotating table and the die. The high-output high-precision wafer bonding apparatus of claim 1, wherein the first visual module is capable of capturing the front side and the other side of the die. The high-output high-precision wafer bonding apparatus of claim 1, further comprising a visual positioning module movably disposed above the receiving module. The high-output high-precision wafer bonding apparatus according to claim 110, wherein the visual positioning module is capable of selectively capturing an image of one side of the receiving module, or the visual positioning module is capable of Taking an image of the die located in the second pick-and-place module, or the visual positioning module is capable of capturing an image of a die located on the pick-and-place module and a side of the receiving module. The high-output high-precision wafer bonding apparatus according to claim 10, further comprising a mirror unit, the mirror unit is disposed above the receiving module, and adjacent to the moving to the receiving The visual positioning module above the module. The high-output high-precision wafer bonding apparatus according to claim 1, further comprising a further supply module disposed on the other side of the receiving module; and another rotating module The system is disposed between the other supply module and the receiving module; another first pick-and-place module is disposed above the other supply module; and at least two second pick-and-place modules It is disposed in the other rotating module; and a further adhesive module is disposed under the other rotating module. The high-output high-precision wafer bonding apparatus of claim 13, further comprising another flip module, the other flip module being disposed in the other supply module and the other turn Between the caps. The high-output high-precision wafer bonding apparatus of claim 13, further comprising another flip module, the other flip module being The other rotating module is between the other rotating platform. The high-output high-precision wafer bonding apparatus of claim 13, further comprising a further third visual positioning module, wherein the other third visual positioning module is disposed in the other supply mode Above the group. The high-output high-precision wafer bonding apparatus of claim 13, further comprising another second visual positioning module, wherein the other second visual positioning module is disposed on the other transposition Above the stage. The high-output high-precision wafer bonding apparatus according to claim 1, further comprising an upper and lower visual positioning module, wherein the upper and lower visual positioning modules are movably disposed above the receiving module. The high-output high-precision wafer bonding apparatus according to claim 18, wherein the upper and lower visual positioning module has two imaging units, a plurality of first guiding mirrors and a plurality of second guiding mirrors, and the second guiding The mirror is disposed on one side of the first guiding mirror, and the first guiding mirror is disposed at one end of each imaging unit. A high-output, high-precision wafer bonding apparatus for bonding at least one die, the wafer bonding apparatus comprising: a supply module for at least one die; and a substrate capable of receiving the at least one die The module is disposed on one side of the supply module; a rotary module is disposed between the supply module and the receiving module; and a rotating platform is disposed on the supply module And a first pick-and-place module disposed above the supply module and moving between the supply module and the transfer platform; and at least two second pick-and-place modules The system is disposed on the rotating module; the other receiving module capable of receiving the at least one die is disposed on the other side of the supply module; and the other rotating module is disposed on the rotating module Between the supply module and the other receiving module; a further rotating platform is disposed between the supply module and the other rotating module; An other first pick-and-place module is disposed above the supply module and moves between the supply module and the other transfer platform; and another at least two second pick-and-place modules The first visual positioning module is disposed above the receiving module, and the first visual positioning module is capable of vertically capturing and aligning the receiving module. One side and the die; and another first visual positioning module disposed above the other receiving module, the other first visual positioning module capable of vertically capturing and aligning the other The side of the module is received with the die. The high-output high-precision wafer bonding apparatus according to claim 20, further comprising a glue module and a further glue module, wherein the glue module is disposed on the rotation module Below, the other glue module is disposed below the other rotating module. The high-output high-precision wafer bonding apparatus according to claim 20, further comprising a flipping module and a further flipping module, wherein the flipping module is disposed on the supplying module and the turntable Between the stages, the other inverting module is disposed between the supply module and the other rotating platform. The high-output high-precision wafer bonding apparatus according to claim 20, further comprising a flipping module and a further flipping module, wherein the flipping module is disposed on the rotating module and the turntable Between the stages, the other flip module is disposed between the other rotating module and the other rotating platform. The high-output high-precision wafer bonding apparatus according to claim 20, further comprising a light source unit and another light source unit, wherein the light source unit is between the receiving module and the rotating module, Another light source unit can be between the other receiving module and the other rotating module. The high-output high-precision wafer bonding apparatus according to claim 20, further comprising a third visual positioning module, wherein the third visual positioning module is disposed above the supply module. The high-output high-precision wafer bonding apparatus according to claim 20, further comprising a second visual positioning module and another second visual setting The second visual positioning module is disposed above the rotating platform, and the other second visual positioning module is disposed above the other rotating platform. The high-output high-precision wafer bonding apparatus according to claim 26, wherein the second visual positioning module is capable of vertically taking and aligning one side of the rotating table with the die. The high-output high-precision wafer bonding apparatus of claim 20, wherein the first visual module is capable of capturing the front side and the other side of the die. The high-output high-precision wafer bonding apparatus according to claim 20, further comprising a visual positioning module and a further visual positioning module, wherein the visual positioning module is movably disposed on the receiving Above the module, the other visual positioning module is movably disposed above the other receiving module. The high-output high-precision wafer bonding apparatus according to claim 29, wherein the visual positioning module is capable of selectively capturing an image of one side of the receiving module, or the visual positioning module is capable of: Taking an image of the die located in the second pick-and-place module, or the visual positioning module is capable of capturing an image of a die located on the pick-and-place module and a side of the receiving module. The high-output high-precision wafer bonding apparatus of claim 29, further comprising a mirror unit and a further mirror unit, the mirror unit being disposed above the receiving module, and Adjacent to the visual positioning module moving to the top of the receiving module, the other mirroring unit is disposed above the other receiving module and adjacent to the moving to the other receiving module The other visual positioning module. The high-output high-precision wafer bonding apparatus according to claim 20, further comprising an upper and lower visual positioning module and another upper and lower visual positioning module, wherein the upper and lower visual positioning modules are movably The upper and lower visual positioning modules are movably disposed above the other receiving module above the receiving module. The high-output high-precision wafer bonding apparatus according to claim 32, wherein the upper and lower vision positioning module has two imaging units, a plurality of first guiding mirrors and a plurality of second guiding mirrors, and the second guiding a mirror system is provided in the first guide mirror On the side, the first guiding mirror is disposed at one end of each imaging unit.