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TWI563352B - Resist developer, method for forming resist pattern and method for manufacturing mold - Google Patents

Resist developer, method for forming resist pattern and method for manufacturing mold

Info

Publication number
TWI563352B
TWI563352B TW101128095A TW101128095A TWI563352B TW I563352 B TWI563352 B TW I563352B TW 101128095 A TW101128095 A TW 101128095A TW 101128095 A TW101128095 A TW 101128095A TW I563352 B TWI563352 B TW I563352B
Authority
TW
Taiwan
Prior art keywords
manufacturing mold
resist
developer
resist pattern
forming
Prior art date
Application number
TW101128095A
Other languages
Chinese (zh)
Other versions
TW201324064A (en
Inventor
Hiromasa Iyama
Hideo Kobayashi
Original Assignee
Hoya Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hoya Corp filed Critical Hoya Corp
Publication of TW201324064A publication Critical patent/TW201324064A/en
Application granted granted Critical
Publication of TWI563352B publication Critical patent/TWI563352B/en

Links

Classifications

    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26Processing photosensitive materials; Apparatus therefor
    • G03F7/30Imagewise removal using liquid means
    • G03F7/32Liquid compositions therefor, e.g. developers
    • G03F7/325Non-aqueous compositions
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B82NANOTECHNOLOGY
    • B82YSPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y10/00Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B82NANOTECHNOLOGY
    • B82YSPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y40/00Manufacture or treatment of nanostructures
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0002Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0005Production of optical devices or components in so far as characterised by the lithographic processes or materials used therefor
    • G03F7/0007Filters, e.g. additive colour filters; Components for display devices
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/039Macromolecular compounds which are photodegradable, e.g. positive electron resists

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Nanotechnology (AREA)
  • Chemical & Material Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Mathematical Physics (AREA)
  • Manufacturing & Machinery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Theoretical Computer Science (AREA)
  • Manufacturing Of Magnetic Record Carriers (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Shaping Of Tube Ends By Bending Or Straightening (AREA)
  • Materials For Photolithography (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
TW101128095A 2011-08-04 2012-08-03 Resist developer, method for forming resist pattern and method for manufacturing mold TWI563352B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2011170898 2011-08-04

Publications (2)

Publication Number Publication Date
TW201324064A TW201324064A (en) 2013-06-16
TWI563352B true TWI563352B (en) 2016-12-21

Family

ID=47629096

Family Applications (1)

Application Number Title Priority Date Filing Date
TW101128095A TWI563352B (en) 2011-08-04 2012-08-03 Resist developer, method for forming resist pattern and method for manufacturing mold

Country Status (3)

Country Link
JP (1) JP6124459B2 (en)
TW (1) TWI563352B (en)
WO (1) WO2013018569A1 (en)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5798466B2 (en) * 2010-12-27 2015-10-21 Hoya株式会社 Resist developer, resist pattern forming method, and mold manufacturing method
JP5837812B2 (en) * 2010-12-27 2015-12-24 Hoya株式会社 Resist developer, resist pattern forming method, and mold manufacturing method
JP5837811B2 (en) * 2010-12-27 2015-12-24 Hoya株式会社 Resist developer, resist pattern forming method, and mold manufacturing method
KR102166974B1 (en) * 2013-11-11 2020-10-16 도쿄엘렉트론가부시키가이샤 Method and hardware for enhanced removal of post etch polymer and hardmask removal
WO2017002497A1 (en) * 2015-06-30 2017-01-05 富士フイルム株式会社 Pattern forming method, and electronic device manufacturing method
JP6699203B2 (en) * 2016-01-29 2020-05-27 日本ゼオン株式会社 Resist pattern formation method
CN108369378B (en) * 2016-01-29 2021-07-20 日本瑞翁株式会社 Method of forming resist pattern
EP3564276B1 (en) * 2016-12-27 2023-04-19 Zeon Corporation Polymer, positive resist composition, and method of forming resist pattern
TWI626516B (en) * 2017-07-03 2018-06-11 Crowningtek Inc Manufacturing method of micron-sized imprinting mold and imprinting mold
JP2019140209A (en) 2018-02-08 2019-08-22 東芝メモリ株式会社 Imprint system, method for manufacturing semiconductor device and program
WO2024014152A1 (en) * 2022-07-11 2024-01-18 東洋合成工業株式会社 Method for producing patterned base material, curable composition and method for producing component

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02221962A (en) * 1989-02-23 1990-09-04 Asahi Glass Co Ltd Resist developer
JP2006227174A (en) * 2005-02-16 2006-08-31 Ricoh Co Ltd Resist developing solution and pattern forming method
JP2009226762A (en) * 2008-03-24 2009-10-08 Toppan Printing Co Ltd Imprint mold, imprint mold manufacturing method and fine structural body

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55100548A (en) * 1979-01-26 1980-07-31 Japan Synthetic Rubber Co Ltd Developer
JPS61245155A (en) * 1985-04-23 1986-10-31 Toray Ind Inc Developing solution for radiation sensitive resist
JPH02275462A (en) * 1989-04-17 1990-11-09 Toppan Printing Co Ltd Pattern forming method for electron beam resist
JPH10228117A (en) * 1997-02-14 1998-08-25 Nippon Telegr & Teleph Corp <Ntt> Method for developing resist and rinsing solution used after same
JP2000039717A (en) * 1998-07-24 2000-02-08 Fujitsu Ltd Resist pattern forming method and production of semiconductor device
SG175915A1 (en) * 2009-05-21 2011-12-29 Tokuyama Corp Method for formation of resist pattern, and developing solution
JP5602475B2 (en) * 2010-03-31 2014-10-08 Hoya株式会社 Resist pattern forming method and mold manufacturing method
JP5705969B2 (en) * 2011-03-28 2015-04-22 富士フイルム株式会社 Planographic printing plate making method

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02221962A (en) * 1989-02-23 1990-09-04 Asahi Glass Co Ltd Resist developer
JP2006227174A (en) * 2005-02-16 2006-08-31 Ricoh Co Ltd Resist developing solution and pattern forming method
JP2009226762A (en) * 2008-03-24 2009-10-08 Toppan Printing Co Ltd Imprint mold, imprint mold manufacturing method and fine structural body

Also Published As

Publication number Publication date
JPWO2013018569A1 (en) 2015-03-05
TW201324064A (en) 2013-06-16
WO2013018569A1 (en) 2013-02-07
JP6124459B2 (en) 2017-05-10

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