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TWI560449B - Method of manufacturing microelectrode circuit test pin and microelectrode circuit test pin manufactured using the same - Google Patents

Method of manufacturing microelectrode circuit test pin and microelectrode circuit test pin manufactured using the same

Info

Publication number
TWI560449B
TWI560449B TW103127468A TW103127468A TWI560449B TW I560449 B TWI560449 B TW I560449B TW 103127468 A TW103127468 A TW 103127468A TW 103127468 A TW103127468 A TW 103127468A TW I560449 B TWI560449 B TW I560449B
Authority
TW
Taiwan
Prior art keywords
circuit test
test pin
microelectrode circuit
manufacturing
microelectrode
Prior art date
Application number
TW103127468A
Other languages
English (en)
Other versions
TW201522982A (zh
Inventor
Kyu Han Lee
Byung June Jun
Ho Sub Bang
Hee-Seok Jung
Hwang-Sub Koo
Hyun Je Kim
Original Assignee
Gigalane Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Gigalane Co Ltd filed Critical Gigalane Co Ltd
Publication of TW201522982A publication Critical patent/TW201522982A/zh
Application granted granted Critical
Publication of TWI560449B publication Critical patent/TWI560449B/zh

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06716—Elastic
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06733—Geometry aspects
    • G01R1/06738—Geometry aspects related to tip portion
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R3/00—Apparatus or processes specially adapted for the manufacture or maintenance of measuring instruments, e.g. of probe tips

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Geometry (AREA)
  • Measuring Leads Or Probes (AREA)
  • Manufacturing Of Electrical Connectors (AREA)
TW103127468A 2013-08-13 2014-08-11 Method of manufacturing microelectrode circuit test pin and microelectrode circuit test pin manufactured using the same TWI560449B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR20130095887 2013-08-13
KR1020140039468A KR102018784B1 (ko) 2013-08-13 2014-04-02 미세 전극 회로 검사용 핀 제조 방법 및 이의 방법으로 제조된 미세 전극 회로 검사용 핀

Publications (2)

Publication Number Publication Date
TW201522982A TW201522982A (zh) 2015-06-16
TWI560449B true TWI560449B (en) 2016-12-01

Family

ID=52579279

Family Applications (1)

Application Number Title Priority Date Filing Date
TW103127468A TWI560449B (en) 2013-08-13 2014-08-11 Method of manufacturing microelectrode circuit test pin and microelectrode circuit test pin manufactured using the same

Country Status (4)

Country Link
JP (1) JP6376541B2 (zh)
KR (1) KR102018784B1 (zh)
CN (1) CN105452878B (zh)
TW (1) TWI560449B (zh)

Families Citing this family (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101954900B1 (ko) * 2015-06-03 2019-05-31 (주)에이피텍 테스트 핀 및 이를 포함하는 테스트 장치
JP6515877B2 (ja) * 2016-06-17 2019-05-22 オムロン株式会社 プローブピン
JP6744209B2 (ja) * 2016-12-27 2020-08-19 株式会社エンプラス 電気接触子及び電気部品用ソケット
JP2018197714A (ja) * 2017-05-24 2018-12-13 山一電機株式会社 Ｍｅｍｓ型プローブ、及び、これを使用した電気検査用装置
KR101949871B1 (ko) * 2017-06-28 2019-02-20 양희성 전기 신호 연결용 마이크로 컨택터
KR101913355B1 (ko) * 2017-09-19 2018-12-28 윌테크놀러지(주) 미세피치 대응이 가능한 수직형 프로브 카드용 니들유닛 및 이를 이용한 프로브 카드
CN111239447B (zh) * 2018-01-11 2022-07-08 欧姆龙株式会社 探针、检查工具、检查单元和检查装置
JP7318297B2 (ja) * 2019-04-25 2023-08-01 オムロン株式会社 プローブピン、検査治具および検査ユニット
WO2020222327A1 (ko) * 2019-04-30 2020-11-05 (주)위드멤스 미세 전극 회로 검사용 핀
KR102166677B1 (ko) * 2019-08-09 2020-10-16 주식회사 오킨스전자 멤스 포고 핀 및 이를 이용한 검사 방법
KR102232788B1 (ko) * 2019-12-17 2021-03-26 주식회사 오킨스전자 하우징 일체형 멤스 핀
KR102147699B1 (ko) * 2020-04-29 2020-08-26 (주)피티앤케이 프로브 핀 및 이의 제조 방법
KR102498040B1 (ko) * 2021-02-22 2023-02-10 (주)포인트엔지니어링 전기 전도성 접촉핀 어셈블리
KR102517778B1 (ko) * 2021-02-26 2023-04-04 (주)포인트엔지니어링 전기 전도성 접촉핀 어셈블리 및 그 제조방법
KR20230032064A (ko) * 2021-08-30 2023-03-07 (주)포인트엔지니어링 캔틸레버형 프로브 핀
KR20230032058A (ko) * 2021-08-30 2023-03-07 (주)포인트엔지니어링 전기 전도성 접촉핀 및 이를 구비하는 수직형 프로브 카드
KR20230032057A (ko) * 2021-08-30 2023-03-07 (주)포인트엔지니어링 전기 전도성 접촉핀 및 이를 구비하는 수직형 프로브 카드
KR102685910B1 (ko) * 2021-10-06 2024-07-17 (주)포인트엔지니어링 전기 전도성 접촉핀 및 이를 구비하는 검사장치
KR102685839B1 (ko) * 2021-10-07 2024-07-17 (주)포인트엔지니어링 전기 전도성 접촉핀 및 이를 구비하는 검사장치
KR20230112812A (ko) * 2022-01-21 2023-07-28 (주)포인트엔지니어링 전기 전도성 접촉핀 및 이를 구비하는 검사장치
KR20230127719A (ko) * 2022-02-25 2023-09-01 (주)포인트엔지니어링 전기 전도성 접촉핀
KR20230127709A (ko) * 2022-02-25 2023-09-01 (주)포인트엔지니어링 전기 전도성 접촉핀
KR20230157096A (ko) * 2022-05-09 2023-11-16 (주)포인트엔지니어링 전기 전도성 접촉핀 및 이를 구비하는 검사장치

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040190085A1 (en) * 1999-09-17 2004-09-30 Silverbrook Research Pty Ltd Sensing device for coded data
TW200813441A (en) * 2006-09-11 2008-03-16 Jung-Tang Huang Vertical probe card
US20110080332A1 (en) * 2007-04-20 2011-04-07 Skycross, Inc. Multimode antenna structure
CN102019033A (zh) * 2009-09-18 2011-04-20 格雷特巴奇有限公司 具有主动固定电极的医疗电性引线中的电性隔离电性部件
TW201229518A (en) * 2010-07-02 2012-07-16 Jae-Hak Lee Test probe for test and fabrication method thereof

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7007408B2 (en) * 2004-04-28 2006-03-07 Solid State Measurements, Inc. Method and apparatus for removing and/or preventing surface contamination of a probe
KR100984876B1 (ko) 2008-05-08 2010-10-04 한국기계연구원 가변강성 기능을 가진 수직형 미세 접촉 프로브
JP5049904B2 (ja) * 2008-07-17 2012-10-17 パナソニック株式会社 可動構造体及びそれを用いた光走査ミラー
US7928751B2 (en) * 2009-02-18 2011-04-19 Winmems Technologies Holdings Co., Ltd. MEMS interconnection pins fabrication on a reusable substrate for probe card application
JP5686541B2 (ja) * 2009-09-03 2015-03-18 富士通コンポーネント株式会社 プローブ
KR101178237B1 (ko) * 2010-03-26 2012-08-29 박연재 접촉 프로브 및 이의 제조 방법
KR101236312B1 (ko) * 2011-10-17 2013-02-28 (주)기가레인 반도체 검사용 프로브

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040190085A1 (en) * 1999-09-17 2004-09-30 Silverbrook Research Pty Ltd Sensing device for coded data
TW200813441A (en) * 2006-09-11 2008-03-16 Jung-Tang Huang Vertical probe card
US20110080332A1 (en) * 2007-04-20 2011-04-07 Skycross, Inc. Multimode antenna structure
CN102019033A (zh) * 2009-09-18 2011-04-20 格雷特巴奇有限公司 具有主动固定电极的医疗电性引线中的电性隔离电性部件
TW201229518A (en) * 2010-07-02 2012-07-16 Jae-Hak Lee Test probe for test and fabrication method thereof

Also Published As

Publication number Publication date
KR102018784B1 (ko) 2019-09-05
CN105452878B (zh) 2019-01-04
JP6376541B2 (ja) 2018-08-22
CN105452878A (zh) 2016-03-30
JP2016527512A (ja) 2016-09-08
KR20150020500A (ko) 2015-02-26
TW201522982A (zh) 2015-06-16

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