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TWI560323B - Electrochemical plating device and anode assembly thereof - Google Patents

Electrochemical plating device and anode assembly thereof

Info

Publication number
TWI560323B
TWI560323B TW104105008A TW104105008A TWI560323B TW I560323 B TWI560323 B TW I560323B TW 104105008 A TW104105008 A TW 104105008A TW 104105008 A TW104105008 A TW 104105008A TW I560323 B TWI560323 B TW I560323B
Authority
TW
Taiwan
Prior art keywords
anode assembly
plating device
electrochemical plating
electrochemical
anode
Prior art date
Application number
TW104105008A
Other languages
Chinese (zh)
Other versions
TW201629276A (en
Inventor
Sen Min Yang
Chun Wei Tsai
Yen Shin Liao
Original Assignee
Inotera Memories Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Inotera Memories Inc filed Critical Inotera Memories Inc
Priority to TW104105008A priority Critical patent/TWI560323B/en
Priority to CN201510096086.7A priority patent/CN105986304A/en
Publication of TW201629276A publication Critical patent/TW201629276A/en
Application granted granted Critical
Publication of TWI560323B publication Critical patent/TWI560323B/en

Links

TW104105008A 2015-02-13 2015-02-13 Electrochemical plating device and anode assembly thereof TWI560323B (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
TW104105008A TWI560323B (en) 2015-02-13 2015-02-13 Electrochemical plating device and anode assembly thereof
CN201510096086.7A CN105986304A (en) 2015-02-13 2015-03-04 Electrochemical plating apparatus and anode member thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW104105008A TWI560323B (en) 2015-02-13 2015-02-13 Electrochemical plating device and anode assembly thereof

Publications (2)

Publication Number Publication Date
TW201629276A TW201629276A (en) 2016-08-16
TWI560323B true TWI560323B (en) 2016-12-01

Family

ID=57039458

Family Applications (1)

Application Number Title Priority Date Filing Date
TW104105008A TWI560323B (en) 2015-02-13 2015-02-13 Electrochemical plating device and anode assembly thereof

Country Status (2)

Country Link
CN (1) CN105986304A (en)
TW (1) TWI560323B (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6859150B2 (en) * 2017-03-22 2021-04-14 株式会社荏原製作所 How to determine the plating equipment and plating tank configuration

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200643226A (en) * 2005-03-03 2006-12-16 Applied Materials Inc Plating of a thin metal seed layer
CN101736376A (en) * 2008-11-07 2010-06-16 诺发系统有限公司 Method and apparatus for electroplating

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4687562A (en) * 1986-12-23 1987-08-18 Amp Incorporated Anode assembly for selectively plating electrical terminals
EP1055020A2 (en) * 1998-02-12 2000-11-29 ACM Research, Inc. Plating apparatus and method
IT1303889B1 (en) * 1998-12-01 2001-03-01 Giovanna Angelini PROCEDURE AND EQUIPMENT FOR CONTINUOUS CHROME PLATING OF BARS RELATED ANODE STRUCTURE
US6478936B1 (en) * 2000-05-11 2002-11-12 Nutool Inc. Anode assembly for plating and planarizing a conductive layer
US7153400B2 (en) * 2002-09-30 2006-12-26 Lam Research Corporation Apparatus and method for depositing and planarizing thin films of semiconductor wafers
US6966976B1 (en) * 2003-01-07 2005-11-22 Hutchinson Technology Incorporated Electroplating panel with plating thickness-compensation structures

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200643226A (en) * 2005-03-03 2006-12-16 Applied Materials Inc Plating of a thin metal seed layer
CN101736376A (en) * 2008-11-07 2010-06-16 诺发系统有限公司 Method and apparatus for electroplating

Also Published As

Publication number Publication date
TW201629276A (en) 2016-08-16
CN105986304A (en) 2016-10-05

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