TWI427513B - Construction Method and Structure of Bridge Erection with Shaded High Brightness - Google Patents

Description

Bridge electrode placement method with shielding bright spots and structure thereof

The invention relates to a method for laying a bridge electrode with shielding bright spots and a structure thereof, in particular to a method and a structure for shielding a bright spot generated by the conductive layer by using a conductive corresponding layer on one side of the conductive layer.

In the prior art, in the process of the capacitive touch panel, two different axial electrodes are formed on the substrate, and an insulating layer is formed on one of the axial electrodes to provide another axis. The electrodes are electrically connected through the metal wires provided on the insulating layer. However, conventionally, the metal wire disposed on the insulating layer may be damaged due to damage of the metal wire in a subsequent process, thereby causing the conductivity of the capacitive touch panel to decrease.

Therefore, in some techniques, the metal wire can be placed in the bridge groove by the technique of a bridge groove, which can prevent the metal wire from being damaged. However, after solving the problem that the metal wire can be damaged, the metal wire generates a plurality of bright spots on the touch panel after assembling the capacitive touch panel, as shown in FIG. 1 , which causes trouble for display. .

Therefore, it is necessary to provide a new structure, in addition to effectively improving the yield of the capacitive touch panel, and also to avoid the occurrence of such bright spots.

An object of the present invention is to provide a bridge electrode placement method with a shielding bright spot, which utilizes a conductive corresponding layer for shielding the conductive layer for the purpose of generating no bright spots.

Another object of the present invention is to provide a bridge electrode structure having a shielding bright spot, and a conductive corresponding layer is disposed on one side of the conductive layer for shielding a bright spot generated by the conductive layer.

To achieve the above and other objects, the present invention provides a bridge electrode placement method with a bright spot, the method step of: providing a substrate; forming a transparent conductive layer on the substrate, and the transparent conductive layer has a plurality of pattern regions The blocks are disposed adjacent to each other; an alignment film layer is formed on the substrate, and the alignment film layer has a plurality of bridged trenches for spanning between the pattern blocks; forming a conductive layer on the substrate, and the conductive layer The layer has a plurality of electrical wires respectively disposed on the bridged trenches; a conductive corresponding layer is disposed on one side of the conductive layer for shielding the electrical wires; and a protective layer is formed on the substrate for The optical transmittance is increased and the substrate, the transparent conductive layer, the alignment film layer and the conductive layer are protected.

To achieve the above and other objects, the present invention provides a bridge electrode structure with a bright spot, which is used for a capacitive touch panel, comprising a substrate, a plurality of first electrode blocks, a plurality of second electrode blocks, and a bridge The insulating unit and the plurality of electrodes correspond to the block. The first electrode blocks are disposed on the substrate and are electrically connected in series through the first wires; the second electrode blocks are disposed on the substrate and the second electrode blocks are respectively disposed on the substrate The two sides of the first wire; the bridge insulation unit is vertically disposed on the first wire, and the bridge insulation unit has a bridge groove, and the height of the bridge groove is lower than the height of the bridge insulation unit; And the corresponding blocks of the electrodes shield the first electrode blocks and/or the second electrode blocks. The second electrode blocks are electrically connected in series by the bridge insulating unit having the second wire.

To achieve the above and other objects, the present invention provides a bridge electrode structure having a masking bright spot, comprising a substrate layer, a transparent conductive layer, an alignment film layer, a conductive layer and a conductive corresponding layer. The transparent conductive layer is disposed on at least one side of the substrate; the alignment film layer is disposed on one side of the substrate layer; the conductive layer is adjacent to one side of the alignment film layer; and the conductive corresponding layer is And disposed on one side of the conductive layer to shield the conductive layer. In addition, the bridge electrode structure with shielding bright spots further includes a protective layer disposed on at least one side of the bridge electrode structure.

Compared with the prior art, the method for arranging the bridged electrodes with shielding spots and the structure thereof are not only effective for improving the process yield, but also shielding the conductive layer by the conductive corresponding layer. There is no bright spot on the capacitive touch panel, and in one embodiment, especially in the case where the photoresist of the conductive layer is not stripped, the highlight of the capacitive touch panel can be achieved. purpose.

In order to fully understand the objects, features and advantages of the present invention, the present invention will be described in detail with reference to the accompanying drawings. Schematic diagram of a bridge electrode placement method for shielding bright spots. In FIG. 2, the step of the method of arranging the bridge electrodes starts from step S1 to provide a substrate; then, in step S2, a transparent conductive layer is formed on the substrate, and the transparent conductive layer has a plurality of pattern blocks Adjacent to; and then step S3, forming an alignment film layer on the substrate, and the alignment film layer has a plurality of bridged trenches for traversing between the pattern blocks; and then step S4 is formed The conductive layer is disposed on the substrate, and the conductive layer has a plurality of electrical wires respectively disposed on the bridged trenches. In another embodiment, the electrically conductive wires of the conductive layer are formed by at least one of overexposure or overexposure by an optical compensation reticle; and then, in step S5, a conductive corresponding layer is formed. Provided on one side of the conductive layer for shielding the electric wires; and a further step S6, forming a protective layer on the substrate for increasing optical transmittance and protecting the substrate, the transparent conductive layer, An alignment film layer and the conductive layer.

Furthermore, in the third step of the above step S3, the step of forming the alignment film layer further comprises: starting with step S3-1, applying a photoresist to the substrate; and then step S3- 2, is to provide a mask or a mask having a halftone dot pattern, and the mask is used to expose the pattern or the halftone dot pattern to the photoresist; then step S3 -3, developing the pattern or the halftone dot pattern on the photoresist to form the bridged trenches spanning between the pattern blocks; and, following step S3-4, baking Bake the photoresist.

It should be noted that the step of forming the reticle having the halftone dot pattern includes the line diameter of the opaque region provided on the surface of the reticle being larger than the wire diameter of the halftone dot pattern or forming a plurality of holes (for example, The holes may be circular, rectangular or arbitrarily shaped, and are disposed evenly on the surface of the reticle, and the interference and diffraction caused by the light during exposure to the halftone dot pattern, so that the bridge groove The bridged trench is developed to have a lower height than the bridging insulating unit after development.

Figure 4 is a detailed step of the above step S4, the step of forming the conductive layer further comprises: starting at step S4-1, sputtering a conductive material on the substrate; and subsequently applying a photoresist to the step S4-2 On the substrate; and then in step S4-3, the optical compensation type reticle is provided, and the electrical wiring pattern corresponding to the electric wires is overexposed on the photoresist through the optical compensation reticle; and then In step S4-4, the electrical lead pattern is developed to form the pattern blocks having adjacent to each other, and the electric lead pattern is generated by overexposure and overdevelopment.

Figure 5 is a detailed step of the above step S5, wherein the step of forming the conductive corresponding layer further comprises: starting in step S5-1, sputtering a conductive material on the substrate; and subsequently coating the light in step S5-2 Blocking on the substrate; then, in step S5-3, providing the optical compensation type reticle, and forming, by the optical compensation type reticle, a corresponding electric wire pattern corresponding to the electric conductor to be overexposed on the photoresist; Next, in step S5-4, the corresponding electrical conductor pattern is developed and stripped, and another photoresist is coated and a photomask of the electrical conductor is used to form a conductive corresponding layer pattern shielding the electrical conductor pattern.

Figure 6 is another detailed step of the above step S5, the step of forming the conductive corresponding layer further comprises: starting at step S5'-1, sputtering a conductive material on the substrate; and then step S5'-2, Applying a colored photoresist to the substrate; then, in step S5'-3, providing the optically compensated reticle, and forming an appropriate electrical lead pattern corresponding to the isoelectric conductor through the optically compensated reticle to overexpose And the step S5'-4 is followed by developing and not stripping the corresponding electric trace pattern of the colored photoresist to form a conductive corresponding layer pattern shielding the electric trace pattern.

Figure 7 is still another detailed step of the above step S5, wherein the step of forming the conductive corresponding layer further comprises, in step S5"-1, passing through a screen printing or mask having a corresponding electrical conductor pattern (and forming a conductive layer The process is equivalent to coating the colored photoresist on the electrical conductor pattern to form a conductive corresponding layer pattern that shields the electrical conductor pattern.

Figure 8 is a detailed step of the above step S6, further comprising starting at step S6-1, coating at least one of a photoresist, a photoresist or an organic substance on the substrate; and then following step S6-2, The photoresist or the organic substance is baked to form a hard protective film.

Referring to Figures 9a through 9d, there is shown a schematic view of a bridged electrode structure with a bright spot in the present invention. In the present embodiment, the present invention provides a bridge type electrode structure for a capacitive touch panel comprising a substrate 10, a plurality of first electrode blocks 12, a plurality of second electrode blocks 14 and a bridge insulating unit 16 . The material of the substrate 10 may be a glass material, that is, a glass substrate. The first electrode blocks 12 are disposed on the substrate 10 and are electrically connected in series through the first wires 18 . The second electrode blocks 14 are disposed on the substrate 10 and the second electrode blocks 14 are respectively disposed on two sides of the first wire 18, and the second electrode blocks 14 are disposed on the second electrode block 14 The second wire 24. The bridge insulating unit 16 is vertically disposed on the first wire 18, and the bridge insulating unit 16 has a bridge groove 20, and the height of the bridge groove 20 is lower than the height of the bridge insulating unit 16. It should be noted that, in FIG. 9c, the plurality of electrode corresponding blocks 22 shield the first wires 18 on the first electrode blocks 12 and/or the second electrodes on the second electrode blocks 14 Wire 24. The electrode corresponding blocks 22 corresponding to the electrode blocks 12 and 14 may overlap the first electrode blocks 12, or the electrode corresponding blocks 22 may completely cover the corresponding portions. An electrode block 12 and the second electrode blocks 14, for example, the electrode corresponding blocks 22 are colored photoresists.

Referring to Figures 10a through 10d, there is shown a vertical cross-sectional view of a bridged electrode structure with a bright spot in the present invention. In this embodiment, the bridge electrode structure with shielding bright spots is used for a capacitive touch panel, which comprises a substrate layer S, a transparent conductive layer ECL, an alignment film layer PI, a conductive layer CL, a conductive corresponding layer SL and a protective layer. PL. The transparent conductive layer ECL is disposed on at least one side of the substrate layer S. The alignment film layer PI is provided on one side of the substrate layer S. The conductive layer CL is adjacent to one side of the alignment film layer PI, and the conductive layer CL may be a structure of molybdenum (MO)-aluminum (AL)-molybdenum (MO). The conductive corresponding layer SL is disposed on one side of the conductive layer CL for shielding the conductive layer CL, that is, the conductive corresponding layer SL can be disposed between the conductive layer ECL and the protective layer PL. In an embodiment, referring to FIG. 10a, a conductive corresponding layer SL is disposed between the conductive layer CL and the alignment film layer PI. It is noted that the conductive layer CL is connected to the transparent conductive layer ECL. The length of the conductive layer CL is longer than the conductive corresponding layer SL. In another embodiment, referring to FIG. 10c, the conductive corresponding layer SL is disposed on the conductive layer CL side; in addition, the 10b and 10d The figure corresponds to the bridged electrode structure with a masking bright spot after the simplified process of the 10th and 10th drawings, respectively. Therefore, the present invention is a bridged electrode structure with a masking bright spot including a standard process, a simplified process, and an improved process.

In addition, the bridge electrode structure described above is provided with a protective layer PL on at least one side. In an embodiment, the conductive corresponding layer SL may be disposed between the conductive layer ECL and the protective layer PL. For example, the protective layer PL may be an organic layer, a photoresist layer, an anti-reflection layer (AR), an anti-glare layer (AG), or a combination thereof. Those skilled in the art should be able to understand that the protective layer PL can also be ignored, and the ordering process of each layer can also be changed as needed.

Compared with the prior art, the bridge electrode arrangement method and structure thereof with shielding bright spots can effectively shield the conductive layer by the conductive corresponding layer, in addition to effectively improving the process yield. There is no bright spot on the touch panel, and in one embodiment, the photoresist of the conductive layer can achieve the purpose of shielding the bright spot on the capacitive touch panel without stripping.

The invention has been described above in terms of the preferred embodiments, and it should be understood by those skilled in the art that the present invention is not intended to limit the scope of the invention. It should be noted that variations and permutations equivalent to those of the embodiments are intended to be within the scope of the present invention. Therefore, the scope of the invention is defined by the scope of the following claims.

10. . . Substrate

12. . . First electrode block

14. . . Second electrode block

16. . . Bridge insulation unit

18. . . First wire

20. . . Bridged trench

twenty two. . . Electrode corresponding block

twenty four. . . Second wire

PL. . . The protective layer

ECL. . . Transparent conductive layer

S. . . Substrate layer

PI. . . Alignment layer

CL. . . Conductive layer

SL. . . Conductive corresponding layer

Figure 1 is a schematic diagram of a conventional capacitive touch panel;

2 to 8 are schematic flow diagrams of a method for laying bridge electrodes with shielding bright spots;

Figures 9a to 9d are schematic views of a bridged electrode structure with a bright spot; and

Figures 10a through 10d are schematic vertical cross-sectional views of a bridged electrode structure with a bright spot.

S1~S6. . . Method step

Claims (12)

A bridging electrode arrangement method for shielding bright spots, comprising: providing a substrate; forming a transparent conductive layer on the substrate, wherein the transparent conductive layer has a plurality of pattern blocks adjacent to each other; forming an alignment film layer On the substrate, the alignment film layer has a plurality of bridged trenches for spanning between the pattern blocks; forming a conductive layer on the substrate, and the conductive layer has a plurality of electrical wires, the electrical wires Correspondingly disposed on the bridged trenches respectively; forming a conductive corresponding layer at least correspondingly disposed above or below the conductive layer in the bridged trenches to shield the electrical wires; and forming a protection The layer is on the substrate for increasing optical transmittance and protecting the substrate, the transparent conductive layer, the alignment film layer and the conductive layer. The arranging method of claim 1, wherein the electrically conductive wires of the conductive layer are formed by at least one of overexposure or overexposure by an optically compensated reticle. The arranging method of the second aspect of the invention, wherein the step of forming the alignment film layer further comprises: coating a photoresist on the substrate; providing a mask having a pattern or having a half tone dot (Half tone) a reticle of the pattern and by the reticle for the pattern or the halftone a dot pattern is exposed on the photoresist; developing the pattern or the halftone dot pattern on the photoresist to form the bridged trenches spanning between the pattern blocks; and baking the Light resistance. The method of fabricating the method of claim 3, wherein the step of forming the conductive layer further comprises: sputtering a conductive material on the substrate; applying a photoresist to the substrate; providing the optical compensation light a cover, and overexpressing an electrical lead pattern corresponding to the electrical conductor through the optically compensated reticle; and developing the electrical lead pattern to form the pattern blocks adjacent to each other, And the electrical lead pattern is produced by overexposure and overdevelopment. The method of fabricating the method of claim 4, wherein the step of forming the conductive corresponding layer further comprises: sputtering a conductive material on the substrate; applying a photoresist to the substrate; providing the optical compensation a reticle, and the optically compensated reticle is formed to overexpose a corresponding electrical lead pattern corresponding to the electrical conductor to the photoresist; The corresponding electrical conductor pattern is developed and stripped, and another photoresist is coated and the photomask of the electric conductor is used to form a conductive corresponding layer pattern shielding the electrical conductor pattern. The method of claim 4, wherein the step of forming the conductive corresponding layer further comprises: sputtering a conductive material on the substrate; applying a colored photoresist to the substrate; providing the optical compensation a reticle, and through the optically compensated reticle, forming a corresponding electrical lead pattern corresponding to the electrical conductor to be overexposed on the photoresist; and developing and not stripping the corresponding electrical trace pattern of the colored resist, Forming a conductive corresponding layer pattern for shielding the electrical lead pattern. The method of fabricating the method of claim 4, wherein the step of forming the conductive corresponding layer further comprises: applying a colored photoresist to the electrical conductor pattern through a screen printing or mask having a corresponding electrical conductor pattern; And forming a conductive corresponding layer pattern for shielding the electrical lead pattern. The method of forming the protective layer according to the method of claim 5, 6 or 7, wherein the step of forming the protective layer further comprises: coating at least one of a photoresist, a photoresist or an organic substance on the substrate; And baking the photoresist or the organic material to form a hard protective film. A bridge type electrode structure with a shielding spot is used for a capacitive touch panel, comprising: a substrate; a plurality of first electrode blocks disposed on the substrate and electrically connected in series through a first wire; a second electrode block is disposed on the substrate and the second electrode blocks are respectively disposed on two sides of the first wire; a bridge insulating unit is vertically disposed on the first wire, and the bridge is The insulating unit has a bridged trench, and the height of the bridged trench is lower than the height of the bridging insulating unit; and the plurality of electrode corresponding blocks block the first electrode block and/or the second The electrode blocks, and the corresponding blocks of the electrodes, are at least disposed above or below the bridged trench; wherein the second electrode blocks are electrically connected in series by the bridge insulating unit having a second wire . The bridge electrode structure of claim 9, wherein the corresponding blocks of the electrodes are a colored photoresist. A bridge type electrode structure with a shielding spot is used for a capacitive touch panel, comprising: a substrate layer; a transparent conductive layer disposed on at least one side of the substrate layer; and an alignment film layer disposed on One side of the substrate layer; a conductive layer is disposed adjacent to one side of the alignment film layer; a conductive corresponding layer is disposed on one side of the conductive layer for shielding the conductive layer, wherein the conductive corresponding layer is disposed on the conductive layer Between the transparent conductive layers, the length of the conductive layer is longer than the conductive corresponding layer; and a protective layer is disposed on one side of the conductive corresponding layer. The bridge electrode structure of claim 11, wherein the conductive corresponding layer is disposed between the conductive layer and the protective layer.