TWI416816B - Audio connector and an electronic device using the same - Google Patents

Abstract

The invention discloses an audio connector and an electronic device using the same. The connector includes an audio jack and a power management chip. The audio jack is used for inserting an audio plug. The audio plug includes several connecting portions. The audio jack includes a grounded terminal, a voltage connected terminal, a first speaker connected terminal and a second speaker connected terminal, which corresponds to the several connecting portions. The power management chip is connected to the voltage connected terminal. The power management chip is used for detecting if the audio plug is inserted into the audio jack, and judging if a microphone bias voltage is required to supply on the audio jack. The audio connector and an electronic device using the same can avoid a noise generated while the audio plug is inserted. The electronic device has good performance and voice quality.

Description

Audio jack device and electronic device using the same

The present invention relates to an audio jack device, and more particularly to an audio jack device that can prevent an audio plug from being inserted into a jack to instantly generate noise, and an electronic device using the same.

With the improvement of people's living and consumption standards, mobile phones, MP3 (Moving Picture Experts Group Audio Layer III) players, CD players (Compact Disc Player, CD Player), notebook computers and other electronic products are competing, so that consumers can Enjoy the convenience of high technology anytime, anywhere. At the same time, in order to meet the needs of consumers, the electronic devices have various audio-visual entertainment functions such as playing video and listening to songs.

As shown in FIG. 1 , the conventional electronic device 100 includes a motherboard circuit 1, a headphone jack module 2, and an audio plug 3. The mainboard circuit 1 includes an audio circuit 11 for processing audio signals, a receiver 13 for receiving signals, and a mobile station modem (MSM) chip 15. The MSM wafer 15 has a microphone bias voltage (Mic Bias) interface 151. The MSM chip 15 can output a voltage through the microphone bias voltage interface 151. The audio circuit 11 is electrically connected to the receiver 13. The receiver 13 and the headphone jack module 2 are both connected to the microphone bias voltage of the MSM chip 15. The surface 151 is electrically connected.

When the receiver 13 receives the voice signal, the sound is generated by the microphone bias voltage division outputted by the MSM chip 15. During the conversation of the electronic device 100, the microphone bias voltage on the MSM chip 151 has been turned on. If the audio plug 3 is suddenly inserted into the earphone jack module 2, the instantaneous voltage change during the insertion will generate the earphone jack module. An instantaneous current is generated in 2, and the instantaneous current flows through the coil in the earphone, and a current between the wire and the wire in the coil generates an electric field, and noise is generated at the listening end due to interference between the electric fields. The generation of noise can affect the performance of electronic devices, and it is difficult to meet the increasing quality requirements of consumers for electronic devices. Moreover, the generation of an instantaneous current can damage the coils in the earphone, which in turn reduces the life of the earphone.

In view of the above problems, it is necessary to provide an audio jack device that can prevent the headphone from being inserted into an instant, and an electronic device using the audio jack device.

An audio jack device for an electronic device, comprising a headphone jack module for inserting an audio plug, the audio jack having a plurality of connecting portions, the headphone jack module comprising a grounding end, a voltage connecting end, and a a first speaker connection end and a second speaker connection end; when the audio plug is inserted into the earphone jack module, the audio plug connection portion is respectively connected to the ground end, the voltage connection end, the first speaker connection end and the second speaker The electronic device further includes a power management chip electrically connected to the voltage connection end and a filter circuit, wherein the voltage connection end is connected to the power management chip via the filter circuit, and the power management chip is used for Detect whether the audio plug is inserted into the earphone jack module, and determine whether to provide a microphone bias voltage to the earphone jack module; if the power management chip detects that the audio plug is inserted into the earphone jack module, the power is detected The source management chip initiates a microphone bias voltage; if the power management chip detects that the audio plug is not plugged in, the microphone bias voltage is not activated.

An electronic device includes a headphone jack module for inserting an audio plug, and an audio circuit, a receiver and a mobile station modem chip, which are sequentially electrically connected, and the mobile station modem chip is configured to output a microphone bias voltage; The earphone jack module includes a grounding end, a voltage connecting end, a first speaker connecting end and a second speaker connecting end; the first speaker connecting end and the second speaker connecting end are electrically connected to the audio circuit The electronic device further includes a power management chip electrically connected to the voltage connection end and a filter circuit, wherein the voltage connection end is connected to the power management chip via the filter circuit, and the power management chip is used for detecting the audio plug Whether to insert the headphone jack module and determine whether to provide a microphone bias voltage to the headphone jack module.

Compared with the prior art, the audio jack device and the electronic device using the audio jack device separate the microphone bias voltage used in the earphone from the microphone bias voltage used in the normal call, and the earphone is not inserted during the call. The microphone bias voltage for the earphone is turned off. At this time, there is no instantaneous current flowing through the earphone jack, so no noise is generated. After detecting the insertion of the earphone, the power management integrated circuit (PMIC) is used to activate the microphone bias voltage for the earphone, thereby avoiding the noise generated by the insertion of the audio plug, improving the sound quality of the earphone, and avoiding The instantaneous current damage to the inner coil of the earphone prolongs the service life of the earphone and enhances the performance of the electronic device.

100a‧‧‧Electronic devices

10‧‧‧ motherboard circuit

101‧‧‧Audio circuit

103‧‧‧ Receiver

105‧‧‧MSM wafer

1051‧‧‧First microphone bias voltage interface

107‧‧‧PMIC chip

1071‧‧‧Second microphone bias voltage interface

109‧‧‧Filter circuit

20‧‧‧Headphone jack module

21‧‧‧ channel

211‧‧‧ side wall

213‧‧‧ Grounding terminal

215‧‧‧voltage connection

217‧‧‧First speaker connection

218‧‧‧Second speaker connection

22‧‧‧ base

30‧‧‧Audio plug

31‧‧‧First connection

32‧‧‧Second connection

33‧‧‧ Third connection

34‧‧‧fourth connection

1 is a schematic diagram of an electronic device in the prior art.

2 is a schematic diagram of an electronic device according to a preferred embodiment of the present invention.

FIG. 3 is a view showing a state of use of the electronic device when the audio plug is inserted into the earphone jack structure.

Referring to FIG. 2 and FIG. 3, the electronic device 100a according to the preferred embodiment of the present invention is a mobile phone, an MP3 player, a CD player, a notebook computer, or the like. The electronic device 100a includes a motherboard circuit 10 and a headphone jack module 20. An audio circuit 101 for processing audio signals, a receiver 103 for receiving signals, an MSM chip 105, a PMIC chip 107, and a filter circuit 109 are provided on the motherboard circuit 10. The MSM wafer 105 has a first microphone bias voltage interface 1051 through which the MSM wafer 105 can output a voltage. The audio circuit 101 is electrically connected to the receiver 103. The receiver 103 is electrically connected to the first microphone bias voltage interface 1051 of the MSM wafer 105. The PMIC wafer 107 has a second microphone bias voltage interface 1071 through which the PMIC wafer 107 can output a voltage.

The audio circuit 101, the receiver 103, the MSM chip 105 and the PMIC chip 107 are also connected to other functional units such as a central processing unit, a power supply (not shown) on the mainboard circuit 10. The PMIC chip 107, the filter circuit 109 and the headphone jack module 20 constitute an audio jack device (not shown) of the electronic device 100a.

The earphone jack module 20 is configured to connect an audio plug 30 of an audio playback device (not shown) such as an earphone or a speaker. During use, the earphone jack module 20 is electrically connected to the audio plug 30, thereby The audio signal of the electronic device 100a is transmitted to the audio playback device. The earphone jack module 20 includes a base 22 fixed to the electronic device 100a, a channel 21 opened in the base 22, and two disposed on the side wall 211 of the channel 21. A ground terminal 213, a voltage connection terminal 215, a first speaker connection end 217, and a second speaker connection end 218. The grounding end 213, the voltage connecting end 215, the first speaker connecting end 217 and the second speaker connecting end 218 protrude slightly from the surface of the side wall 211 and can extend slightly into the channel 21. The voltage connection terminal 215 is connected to the microphone bias voltage interface 1071 of the PMIC wafer 107 via the filter circuit 109. The first speaker connection end 217 and the second speaker connection end 218 are connected to the audio circuit 101.

The channel 21 is used to insert the audio plug 30. The audio plug 30 includes a first connecting portion 31, a second connecting portion 32, a third connecting portion 33 and a fourth connecting portion 34. The first connecting portion 31 is a ground end; the second connecting portion 32 is a voltage connecting end; and the third connecting portion 33 and the fourth connecting portion 34 respectively correspond to left and right channels of the earphone.

When the audio plug 30 is inserted into the channel 21 of the earphone jack module 20, the first connecting portion 31 of the audio plug 30 is in contact with the grounding end 213 for grounding the audio plug 30. The second connecting portion 32 is electrically connected to the voltage connecting end 215 to provide an operating voltage for the audio plug 30. The third connecting portion 33 and the fourth connecting portion 34 are electrically connected to the first speaker connecting end 217 and the second speaker connecting end 218 respectively for transmitting audio signals to the audio device.

During use, when the receiver 103 of the electronic device 100a receives the voice signal, the sound is generated by the voltage division of the microphone bias voltage output by the MSM chip 105. The PMIC chip 107 is used to detect whether the audio plug 30 is inserted into the channel 21 of the headphone jack module 20. If the audio plug 30 is not inserted, the second microphone bias voltage of the PMIC chip 107 is turned off, and no current passes through the filter circuit 109 and the headphone jack module 20, so that no noise is generated. If the PMIC chip 107 detects the insertion of the audio plug 30, the PMIC wafer 107 A microphone bias voltage is activated, connected to the audio plug 30 via the second microphone bias voltage interface 1071 and the filter circuit 109, thereby turning on an audio device such as a headphone or a speaker. It can be understood that the filter circuit 109 can be omitted, and the PMIC chip 107 is directly connected to the voltage connection end 215 of the earphone jack module 20.

The audio jack device and the electronic device 100a using the audio jack device separate the microphone bias voltage used for the audio plug 30 from the microphone bias voltage used in a normal call, when the audio plug 30 is not inserted during a call, The microphone bias voltage for the audio plug 30 is turned off. At this time, no instantaneous current flows through the headphone jack module 20, so no noise is generated. After the PMIC chip 107 detects the insertion of the earphone, the microphone bias voltage for the earphone is activated, thereby avoiding the noise generated by the insertion of the audio plug 30, improving the sound quality of the earphone, and avoiding the instantaneous current to the inner coil of the earphone. The damage extends the life of the earphone and enhances the performance of the electronic device.

100a‧‧‧Electronic devices

10‧‧‧ motherboard circuit

101‧‧‧Audio circuit

103‧‧‧ Receiver

105‧‧‧MSM wafer

1051‧‧‧First microphone bias voltage interface

107‧‧‧PMIC chip

1071‧‧‧Second microphone bias voltage interface

109‧‧‧Filter circuit

20‧‧‧Headphone jack module

21‧‧‧ channel

211‧‧‧ side wall

213‧‧‧ Grounding terminal

215‧‧‧voltage connection

217‧‧‧First speaker connection

218‧‧‧Second speaker connection

22‧‧‧ base

30‧‧‧Audio plug

31‧‧‧First connection

32‧‧‧Second connection

33‧‧‧ Third connection

34‧‧‧fourth connection

Claims (10)

An electronic device includes a headphone jack module for inserting an audio plug, and an audio circuit, a receiver and a mobile station modem chip, which are sequentially electrically connected, and the mobile station modem chip is configured to output a microphone bias voltage; The earphone jack module includes a grounding end, a voltage connecting end, a first speaker connecting end and a second speaker connecting end; the first speaker connecting end and the second speaker connecting end are electrically connected to the audio circuit The improvement is that the electronic device further includes a power management chip electrically connected to the voltage connection end and a filter circuit, wherein the voltage connection end is connected to the power management chip via the filter circuit, and the power management chip is used for Detect whether the audio plug is plugged into the headphone jack module and determine whether to provide a microphone bias voltage to the headphone jack module. The electronic device of claim 1, wherein when the receiver receives the signal, the mobile station modem chip outputs a microphone bias voltage, and the power management chip detects the audio plug inserted into the earphone jack module, and the power management chip A microphone bias voltage is activated; if the power management chip detects that the audio plug is not inserted, the power management chip does not activate the microphone bias voltage. The electronic device of claim 2, wherein the mobile station modem chip comprises a first microphone bias voltage interface, and the receiver is electrically connected to the first microphone bias voltage interface. The electronic device of claim 2, wherein the power management chip comprises a second microphone bias voltage interface, and the voltage connection terminal is electrically connected to the second microphone bias voltage interface. The electronic device of claim 4, wherein the filter circuit is connected between the second microphone bias voltage interface and the voltage connection terminal of the power management chip. The electronic device of claim 5, further comprising a motherboard circuit, wherein the audio circuit, the receiver, the mobile station modem chip, the power management chip, and the filter circuit are disposed on the motherboard circuit. The electronic device of claim 1, wherein the earphone jack module further comprises a base, a passage opened in the base, the ground end, the voltage connection end, the first speaker connection end, and a The second speaker connection end is disposed on the side wall of the channel. The electronic device of claim 7, wherein the audio plug comprises a first connecting portion, a second connecting portion, a third connecting portion and a fourth connecting portion which are sequentially disposed, and when the audio plug is inserted into the earphone jack module In the channel, the first connecting portion is in contact with the grounding end, the second connecting portion is electrically connected to the voltage connecting end, and the third connecting portion and the fourth connecting portion are respectively connected to the first speaker connecting end and the second speaker connecting end Electrically connected. An audio jack device for an electronic device, comprising a headphone jack module for inserting an audio plug, the audio plug having a plurality of connecting portions, the headphone jack module comprising a grounding end and a voltage connecting end a first speaker connection end and a second speaker connection end; when the audio plug is inserted into the earphone jack module, the audio plug connection portion is respectively connected to the ground end, the voltage connection end, the first speaker connection end, and the second The speaker connector is electrically connected; the audio jack device further includes a power management chip and a filter circuit electrically connected to the voltage connection end, and the voltage connection terminal is connected to the power management chip via the filter circuit The power management chip is configured to detect whether the audio plug is inserted into the earphone jack module, and determine whether to provide a microphone bias voltage to the earphone jack module; if the power management chip detects the audio plug Inserting the headphone jack module, the power management chip activates a microphone bias voltage; if the power management chip detects that the audio plug is not inserted, the microphone bias voltage is not activated. The audio jack device of claim 9, wherein the power management chip includes a second microphone bias voltage interface, and the filter circuit is connected to the second microphone bias voltage interface of the power management chip and the voltage connection. Between the ends.