TWI416310B - Thermal module and the thermal device had cooling effect - Google Patents

Abstract

This invention is using to cooling the Heater or Hot component, Using great conductivity material to make barrel feature, Then arrange the barrel in Radiated order and combine with Hot device with the other head. In order to increase the surface are to efficient the cooling capability, the barrel is making by different kind of Structure and Compound materials. This invention not only highly increase surface area contact to the air, but also have a extremely great convection to cooling the hot device.

Description

Heat sink and device combination with heat sink

The invention relates to a heat dissipating device, in particular to a heat dissipating device having a large heat dissipating surface area and a structure of the heat dissipating device protruding radially outward.

The development of electronic products is changing with each passing day. The higher the efficiency of electronic products, such as computers and LED lamps, the higher the thermal energy emitted. About 70~80% of the input power of the aforementioned LED lamps is converted into heat energy. Under the premise of constantly demanding performance and power, improving heat dissipation efficiency is of course the primary goal in research and development.

The electronic device is exemplified by a lighting tool. Referring to FIG. 20 to FIG. 21, the lighting tool 90 is an LED lamp, which comprises a lighting component 91 and a heat sink 92. The heat sink 92 is a hollow column. The hollow portion of the cylinder is provided with a partition 922. The outer surface of the outer surface of the heat sink 92 is provided with a plurality of heat dissipating fins 921 arranged at intervals. The lighting element 91 has a carrier 911. The board 911 is provided with at least one LED lamp 912. The lighting element 91 is mounted on the surface of the partition plate 922. As shown in FIG. 21, the heat dissipating fin 921 is easy to generate a heat-dissipating end due to its position and manner. The angles 93, and because the heat dissipating fins 921 are arranged at intervals, the spacing between the two heat dissipating fins 921 is limited, and the space for heat dissipation and convection is also limited. Both of the above cases reduce the heat dissipation effect.

Moreover, the surface area of the heat dissipating fins 921 for dissipating heat is limited to the outer surface of the column protruding from the heat dissipating device 92. The reason is that the heat dissipating fins 921 and the column of the heat dissipating device 92 are connected to each other. The connection will cause the heat dissipation area to be wasted in contact with the column of the heat sink 92 and The placement position causes the convection space to be small, and the convection cannot be effectively generated to the external space, and the heat dissipation effect is not improved, which is a waste of production cost.

In summary, the current heat sinks still have problems such as poor heat dissipation efficiency and limitation of heat dissipation surface area.

The inventors have re-invented and improved the shortcomings of the current heat dissipating device for the waste surface of the heat dissipating fins, the heat dissipating surface of the heat dissipating fins, and the poor heat dissipating effect of the structure, and the heat dissipating device of the present invention is used to solve the aforementioned disadvantages. For the purpose of the present invention.

The present invention provides a device assembly having a heat dissipating device, comprising a heating element and at least one heat dissipating device; the heating element having a carrier plate carrying a heating element; the heat dissipating device having a plurality of columns The column body is fixed to each other and has two ends, one end is a heat conduction starting point, and the other end is a heat conduction end point, and the column system is made of a heat conductive material, and the column body has the heat conduction starting end The carrier plates of the heating element are coupled to each other and arranged in a radial three-dimensional structure.

In the heat dissipating device, the heat dissipating device is further provided with an auxiliary heat dissipating body, and the auxiliary heat dissipating system is composed of at least one cylinder made of a heat conducting material and is combined with the column body.

In the heat dissipating device, the auxiliary heat dissipating body is a spiral body, and the spiral system is surrounded by a cylinder made of a heat conducting material, and the spiral body of the auxiliary heat dissipating body and the column of the heat dissipating device are combined with each other.

In the heat dissipating device, the auxiliary heat dissipating system is composed of a plurality of ring-shaped ring bodies having different diameters and diameters, and the ring system is made of a heat-conducting material. The cylindrical body of the auxiliary heat sink is combined with the cylinder of the heat dissipating device.

In the heat dissipating device, the column of the heat dissipating device and the column of the auxiliary heat dissipating body have a circular, elliptical or hexagonal cross section.

In the heat dissipating device, the column of the heat dissipating device and the column of the auxiliary heat dissipating body are formed on the surface with a plurality of slots arranged at intervals and extending in the axial direction.

In the heat dissipating device, the column of the heat dissipating device and the column system of the auxiliary heat dissipating body are a column formed by a spiral elongated body or a spiral flat strip.

In the heat dissipating device, the column of the heat dissipating device and the column system of the auxiliary heat dissipating body are composed of a column body in which two strips having a circular cross section are mutually entangled.

The heat dissipating device, the column of the heat dissipating device and the column system of the auxiliary heat dissipating body are collected by a plurality of layers of heat conducting materials.

Preferably, the column of the heat dissipating device and the column of the auxiliary heat dissipating body are internally made of a cylinder made of copper, and a cylinder made of copper is coated on the outside of the cylinder made of copper.

The following advantages and effects can be achieved by the technical means provided by the heat sink of the present invention:

1. The columns of the heat dissipating device are processed into a three-dimensional structure with a cone shape, and there is no substantial contact between the columns, so that the surface area of the column can be dissipated and the heat dissipation convection space has no dead angle. Its heat dissipation efficiency can protect the heating elements from damage.

2. The heat sink may further be provided with an auxiliary heat sink, the auxiliary heat sink The heat body can be a spiral body or a plurality of ring-shaped ring bodies. The auxiliary heat sink body is coupled to the column of the heat dissipating device to increase the heat dissipation surface area and improve the heat dissipation effect.

3. The column of the heat dissipating device and the auxiliary heat dissipating body are made of a plurality of shapes, structures and materials, and the change in appearance and structure can increase the surface area in contact with air, and contribute to heat dissipation; Composite fabrication of thermally conductive materials also helps to improve heat dissipation.

The present invention is a heat dissipating device, and the heat dissipating device can be applied to various electronic components that generate heat energy. Taking a lighting tool as an example, as shown in FIG. 1 , which is an LED lamp, the LED lamp includes a light emitting device. Element 10 and a heat sink 20.

In a specific embodiment of the present invention, the light-emitting element 10, as shown in FIG. 2, includes a carrier 11 and a heating element 12. The carrier 11 is an aluminum substrate and the heating element 12 is at least one. The LED lamp is configured to be disposed on one surface of the carrier 11, and the carrier 11 is coupled to the heat sink 20 by a surface on which the heat generating body 12 is not loaded.

In another embodiment of the present invention, the light-emitting element 10A, as shown in FIG. 3, the light-emitting element 10A includes a carrier 13 and a heating element, wherein the heating element includes a PCB board 14 and at least one The LED lamp 15 is mounted on the PCB board 14. To help dissipate heat, the PCB board 14 provided with the LED lamp 15 is disposed on one side surface of the carrier board 13. The carrier board 13 is a A heat dissipation plate that is coupled to the heat sink 20 with a surface on which the PCB board 14 is not loaded.

In a specific embodiment of the present invention, please refer to FIG. The heat device 20 includes a plurality of spaced-apart cylinders 21 and has a hollow cone shape. The pillars 21 have two ends, one end is a heat conduction starting point 211, and the other end is a heat conduction end point 212, and the column bodies 21 are heat-conducting. The pillars 21 are formed by the end of the heat-conducting starting point 211 and the light-emitting element 10, and the cylinders 21 are processed at an angle away from the light-emitting component 10, and the pillars 21 are thermally conductive. The end of the end point 212 is radially outward, so that the heat dissipating device 20 has a hollow tapered structure, and the heat dissipating convection space of the heat dissipating device 20 is large and has no dead angle. The surface area of the column 21 can be used for heat dissipation and heat energy. The heat conduction starting point 211, which is combined with the light emitting unit 10, is transmitted to the heat conduction end point 212 away from the light emitting unit 10, 10A, so that the light emitting elements 10, 10A are not overheated.

In a specific embodiment of the present invention, as shown in FIG. 4, the heat dissipating device 20A is composed of a plurality of cylinders 21A having two ends, one end is a heat conduction starting point 211A, and the other end is heat conduction. At the end point 212A, the columns 21A are arranged in a spaced relationship with the light-emitting element 10 at the end of the heat-conducting starting point 211A. The heat-conducting end point 212A of the column 21A faces the outside of the light-emitting element 10, so that the heat-dissipating device 20A is a The planar structure of the heat dissipating device 20A is such that the space provided by the mounting portion of the heat dissipating device 20A is different, and the heat dissipating device 20A occupies a small volume, so that it can be placed. In a relatively small installation space.

In order to achieve a better heat dissipation effect, an auxiliary heat sink 30, 30A is further added to the heat sink 20, 20A. Referring to FIG. 5, the auxiliary heat sink 30 is a spiral cylinder having a three-dimensional structure. The auxiliary heat sink 30 is coupled to the surfaces of the columns 21 of the heat sink 20 to increase The heat dissipation surface area is increased to improve the heat dissipation effect. Referring to FIG. 6 , the auxiliary heat sink 30A is a spiral column having a planar structure, and the auxiliary heat sink 30A and the column 21A of the heat sink 20A are mutually connected. Combined, it can increase the heat dissipation surface area.

The auxiliary heat sink 30 has another specific embodiment. Referring to FIG. 7 to FIG. 8 , the auxiliary heat sink 30B is composed of a plurality of ring-shaped ring bodies having different diameters and diameters, and the ring system adopts the heat dissipation. The device 20 is made of the same material, and the ring system of the auxiliary heat sink 30B is coaxially disposed from the light-emitting element 10 toward the light-emitting component 10 according to the diameter of the circle, and is respectively connected to the column of the heat-dissipating device 20, 20A. 21, 21A combined with each other, can increase the heat dissipation surface area and improve heat dissipation.

It is further explained that the column 21 of the heat sink 20 has a plurality of specific embodiments to increase the heat dissipation surface area. Referring to FIG. 9 to FIG. 17, as shown in FIG. 9, the column 21B has a circular cross section. As shown in FIG. 10, the cylinder 21C is an elongated body having an elliptical cross section; as shown in FIG. 11, the cylinder 21D is a long strip having a hexagonal cross section; As shown in FIG. 12, the cylindrical body 21E is formed with a plurality of elongated cylinders which are arranged at intervals and axially extending; as shown in FIG. 13, the cylinder 21F is formed by a spiral elongated body. a cylinder; as shown in FIG. 14, the cylinder 21G is a cylindrical body formed by a spiral flat strip, wherein one side of the flat strip is opposite to the other side; as shown in FIG. The cylinder 21H is a cylinder formed by winding two long strips of circular cross-section; as shown in FIG. 16, the cylinder 21I is a cylinder which is spirally wound around the surface of another cylinder. Columnar structure; as shown in FIG. 17, the cylinder 21J is a cylinder composed of a two-layer material, and the specific embodiment is The cylinder made of copper is externally coated with a cylinder of an outer layer of aluminum, and the foregoing specific embodiment of the cylinder can be applied to the auxiliary heat sink 30, 30A to be manufactured into the spiral body and the ring body.

Referring to FIG. 18A to FIG. 18B, a heat sink 20 having an auxiliary heat sink 30 is taken, and a heat sink 20B having a smaller size than the heat sink 20 is taken. The heat sink 20B is provided with a smaller heat sink 30. For the small auxiliary heat sink 30C, the heat sinks 20, 20B and the auxiliary heat sinks 30, 30C are different in size, so that the two heat sinks 20, 20B are combined with each other to improve heat dissipation efficiency.

The same applies to the heat dissipating device 20A provided with the auxiliary heat sink 30B. Referring to FIG. 19A to FIG. 19B, the heat dissipating device 20C having a smaller size than the heat dissipating device 20A is taken, and the heat dissipating device 20A is provided with the auxiliary device. The heat dissipating body 30B is a small auxiliary heat dissipating body 30D, so that the two heat dissipating devices 20A and 20C can be used in combination with each other.

The heat dissipating device 20, 20A, 20B, and 20C can transmit the thermal energy generated by the light emitting device 10 away from the light emitting device 10, and is not substantially integrated with other objects except for being bonded to the light emitting device 10. Therefore, the surface areas of the pillars 21 and 21A are all used for heat dissipation, and the radial three-dimensional structure can eliminate the dead angle which is not easy to dissipate heat on the structure, and the large heat dissipation convection space, so that the heat dissipation effect is good, thereby ensuring the The efficacy of the illuminating element 10 is protected from damage due to overheating.

In addition, it should be noted that the heat dissipating devices 20, 20A, 20B, and 20C described above are simple in processing, and the heat dissipating devices 20, 20A, 20B, and 20C of the present invention can be fabricated only by post-molding with a columnar material. Spring numerical control (NC) molding or braiding machine can be used It is made by metal casting or metal die casting, which requires a large amount of energy and long processing time, such as aluminum alloy die casting or aluminum extrusion molding. Therefore, the invention is also environmentally friendly. The advantages of energy saving.

The above is only a preferred embodiment of the present invention, and is not intended to limit the scope of the present invention. The present invention has been described above by way of a preferred embodiment, but is not intended to limit the invention, and any skilled person skilled in the art. The equivalent embodiments of the above-disclosed technical contents may be modified or modified to equivalent variations, without departing from the technical scope of the present invention, and in accordance with the present invention, without departing from the scope of the present invention. It is still within the scope of the technical solution of the present invention to make any simple modifications, equivalent changes and modifications to the above embodiments.

10, 10A‧‧‧Lighting elements

11‧‧‧ Carrier Board

12‧‧‧heating body

13‧‧‧ Carrier Board

14‧‧‧PCB board

15‧‧‧heating body

20, 20A, 20B, 20C‧‧‧ heat sink

21, 21A, 21B, 21C, 21D, 21E, 21F, 21G, 21H, 21I, 21J‧‧‧ cylinder

211‧‧‧thermal starting point

212‧‧‧thermal end point

30, 30A, 30B, 30C, 30D‧‧‧ auxiliary heat sink

90‧‧‧Lighting tools

91‧‧‧Lighting elements

911‧‧‧Aluminum substrate

912‧‧‧LED lights

92‧‧‧heating device

921‧‧‧heat fins

922‧‧ ‧ partition

93‧‧‧End angle

Figure 1 is a perspective view of the present invention.

Fig. 2 is a perspective view of a light-emitting element of the present invention.

Fig. 3 is a perspective view showing another embodiment of the light-emitting element of the present invention.

4 is a perspective view of another embodiment of the heat sink of the present invention.

FIG. 5 is a perspective view of the heat dissipating device of the present invention with an auxiliary heat sink.

FIG. 6 is a perspective view showing an auxiliary heat sink disposed on a heat dissipating device according to another embodiment of the present invention.

Fig. 7 is a perspective view showing the auxiliary heat sink of another embodiment of the heat dissipating device of the present invention.

Figure 8 is a diagram showing another arrangement of a heat sink according to another embodiment of the present invention. A perspective view of an auxiliary heat sink of a specific embodiment.

Figure 9 is still another embodiment of the cylinder of the heat sink of the present invention.

Figure 10 is still another embodiment of the cylinder of the heat sink of the present invention.

Figure 11 is still another embodiment of the cylinder of the heat sink of the present invention.

Figure 12 is still another embodiment of the cylinder of the heat sink of the present invention.

Figure 13 is still another embodiment of the cylinder of the heat sink of the present invention.

Figure 14 is still another embodiment of the cylinder of the heat sink of the present invention.

Figure 15 is still another embodiment of the cylinder of the heat sink of the present invention.

Figure 16 is still another embodiment of the cylinder of the heat sink of the present invention.

Figure 17 is still another embodiment of the cylinder of the heat sink of the present invention.

Figure 18A is a side elevational view of the combined structure of two heat sinks of the present invention.

Figure 18B is a perspective view of the combined structure of the two heat sinks of the present invention.

Figure 19A is a side elevational view of the combined structure of two heat sinks of the present invention.

19B is a perspective view of the combined structure of the two heat sinks of the present invention.

Figure 20 is a perspective view of a prior art lighting element and heat sink.

Figure 21 is a cross-sectional view of a prior art lighting element and heat sink.

10‧‧‧Lighting elements

20‧‧‧heating device

21‧‧‧Cylinder

211‧‧‧thermal starting point

212‧‧‧thermal end point

Claims (18)

A heat dissipating device is composed of a plurality of cylinders which are fixed to each other and each have two ends, one end is a heat conduction starting point, and the other end is a heat conduction end point, and the column system is made of a heat conductive material, The columns are spaced apart from each other to form a radial three-dimensional structure; the heat dissipating device is further provided with an auxiliary heat dissipating body, and the auxiliary heat dissipating system is composed of a column made of at least one heat conducting material and is combined with the column body. The heat dissipating device according to claim 1, wherein the auxiliary heat dissipating body is a spiral body, and the spiral system is formed by a cylinder made of a heat conducting material, and the spiral body of the auxiliary heat dissipating body and the heat dissipating body The cylinders of the device are combined with each other. The auxiliary heat dissipating system is composed of a plurality of ring-shaped ring bodies having different diameters and diameters, and the ring system is surrounded by a cylinder made of a heat-conducting material. The ring body of the auxiliary heat sink and the cylinder of the heat sink are coupled to each other. The heat sink according to claim 1, wherein the cylinder of the heat sink and the pillar of the auxiliary heat sink have a circular, elliptical or hexagonal cross section. The heat dissipating device of claim 1, wherein the column of the heat dissipating device and the column of the auxiliary heat dissipating body are formed with a plurality of spaced and axially extending slots on the surface. The heat sink according to claim 1, wherein the column of the heat sink and the column system of the auxiliary heat sink are a column formed by a spiral elongated body or a spiral flat strip. . The heat dissipating device according to claim 1, wherein the heat dissipating device The column body and the column system of the auxiliary heat sink are composed of a column body in which two elongated strips are circularly wound with each other. The heat sink according to claim 1, wherein the column of the heat sink and the column system of the auxiliary heat sink are collected by a plurality of layers of heat conductive material. The heat sink of claim 8, wherein the cylinder of the heat sink and the cylinder of the auxiliary heat sink are internally made of a cylinder made of copper, and the outer cylinder of the copper is coated with a layer of aluminum. The cylinder that constitutes it. A device assembly having a heat dissipating device, comprising: a heating element and at least one heat dissipating device; the heating element having a carrier plate carrying a heating element; the heat dissipating device being composed of a plurality of columns The columns have two ends, one end is a heat conduction starting point, and the other end is a heat conduction end point. The column systems are made of a heat conductive material, and the columns are combined with the carrier plate of the heating element by the heat conduction starting end. And the radial arrangement is arranged in a radial three-dimensional structure; the heat dissipating device is further provided with an auxiliary heat dissipating body, and the auxiliary heat dissipating system is formed by a cylinder made of at least one heat conductive material and combined with the column body. The device assembly of claim 10, wherein the auxiliary heat sink is a spiral body, and the spiral system is surrounded by a cylinder made of a heat conductive material, and the auxiliary heat sink is The spiral body and the column of the heat sink are coupled to each other. The auxiliary heat dissipating system is composed of a plurality of ring-shaped ring bodies having different circular diameters and the like, and the ring system is a column made of a heat-conducting material. Surrounded by the annular body of the auxiliary heat sink and the column of the heat sink Combine. The combination of the heat dissipating device and the column of the auxiliary heat dissipating body are circular, elliptical or hexagonal. The combination of the heat dissipating device and the column of the auxiliary heat dissipating body are formed with a plurality of spaced and axially extending slots on the surface. The combination of the device having the heat dissipating device according to claim 10, wherein the column of the heat dissipating device and the column system of the auxiliary heat dissipating body are formed by a spiral elongated body or a spiral flat strip. The cylinder that constitutes it. The combination of the device having the heat dissipating device according to claim 10, wherein the column of the heat dissipating device and the column system of the auxiliary heat dissipating body are composed of a column body in which two elongated strips are circularly wound with each other. The combination of the heat sink having the heat sink and the pillar system of the auxiliary heat sink is a plurality of pillars made of a heat conductive material. The combination of the device having the heat dissipating device according to claim 17, wherein the column of the heat dissipating device and the column of the auxiliary heat dissipating body are internally made of a cylinder made of copper, and the outer portion of the cylinder made of copper Covered with a layer of aluminum.