TWI404464B - Circuit board, and layout of cof and driving circuit - Google Patents

Abstract

A structure of a circuit board has a first board and a second board. The first board has a plurality of leads electrical connected to the second board. Wherein, a integrate circuit (IC) having a plurality of contact pads which cover with bump is disposed on the film board. Portion of the contact pads are electrical contacted to one of the leads, and are transmitted the same signal.

Description

Structure of wiring of circuit board, flip chip circuit, and drive circuit

The present invention relates to a wiring structure of a wafer, and more particularly to a wiring structure of a wafer for a flip chip process.

Various semiconductor packages have been developed due to the demand for highly integrated integrated circuit (IC) drivers that can drive liquid crystal display (LCD) panels after bonding. In general, a Tape Carrier Package (TCP), a Chip On Glass (COG), and a Chip On Flexible Printed Circuit (COF) can be used for driving a semiconductor panel. Package. Since the 1980s, flip chip (COF) semiconductor packages have been used to drive high resolution screen displays. A flip chip (COF) type semiconductor package is one of the semiconductor packaging methods commonly used in the field of LCDs.

FIG. 1 is a schematic view showing the wiring of a conventional flip chip. Referring to FIG. 1, on the flexible substrate 102, an integrated circuit 104, such as a driver for an LCD panel, may be disposed. The integrated circuit 104 has a plurality of contact pads overlying the metal bumps, such as 112, 114, 16, 118, and 120. On each contact pad, a transmission wire such as 122, 124, 126, 128 and 130 is respectively connected. One of the transmission wires 122, 124, 126, 128, and 130 is connected to a corresponding contact pad, and the other end is connected to the second substrate 106 for signal transmission.

In the TFT-LCD, when the LCD is in operation, the driver tends to generate a large amount of thermal energy, which may cause the display of the LCD panel to be abnormal. Therefore, the heat dissipation problem of the driver in the LCD is the key point that various manufacturers have to solve.

The invention provides a circuit board structure, and a wiring structure of a flip chip and a driving circuit, respectively, which can effectively solve the problem of heat dissipation.

The present invention provides a wiring structure of a flip chip, comprising a first substrate having a plurality of transmission lines, and an integrated circuit further disposed on the first substrate. The integrated circuit has a plurality of contact pads for receiving or outputting a plurality of signals. Wherein, part of the contact pads are electrically connected to the same transmission line and transmit the same signal.

From another point of view, the present invention provides a circuit board structure including a first substrate and a second substrate. The first substrate has a plurality of transmission wires, so that the second substrate can be electrically connected to the first substrate through the transmission wires. In addition, an integrated circuit can be disposed on the first substrate, and the integrated circuit has a plurality of contact pads for receiving or outputting a plurality of signals. Wherein, part of the contact pads can be connected in common to one of the transmission lines and transmit the same signal.

From another point of view, the present invention further provides a wiring structure of a driving circuit which can be used for a liquid crystal display. The wiring structure of the present invention may include a first substrate and a second substrate. The first substrate has a plurality of transmission wires for electrically connecting the second substrate. In addition, a plurality of drivers are disposed on the first substrate, and each driver has a plurality of contact pads to respectively receive or output a plurality of signals. Wherein, a part of the contact pads on each driver can be electrically connected to the corresponding first transmission line and transmit the same signal.

In an embodiment of the invention, the contact pads on the integrated circuit are covered with metal bumps.

In an embodiment of the invention, the first substrate may be a flexible substrate or a flexible substrate. In addition, the material of the second substrate may be glass or a printed circuit board.

In addition, the contact pads that are electrically connected to the same transmission line or the first transmission line can transmit a power signal or a ground potential.

In some embodiments, the locations of the contact pads on the integrated circuit or on each of the drivers that are electrically connected to the transmission lines or the first transmission lines may be in the same row or in different rows.

Since a part of the contact pads on the integrated circuit or each driver can electrically connect the same transmission line, the line width of the transmission line can be increased to increase the heat dissipation area, and the heat dissipation problem can be effectively solved. In addition, the locations of the contact pads that are commonly connected to the same transmission line can be in different rows. Therefore, the volume of the integrated circuit can also be reduced.

The above and other objects, features and advantages of the present invention will become more <RTIgt;

2 is a schematic diagram of a circuit board structure in accordance with a preferred embodiment of the present invention. Referring to FIG. 2, the circuit board structure provided in this embodiment includes a first substrate 202 and a second substrate 206. The material of the second substrate 206 may be glass or a printed circuit board. In addition, the first substrate 202 may be a flexible substrate or a flexible substrate.

In the present embodiment, the first substrate 202 has a plurality of transmission lines, such as 222, 224, and 226. Thereby, the first substrate 202 can be electrically connected to the second substrate 206 through the transmission wires 222, 224 and 226. Hereinafter, for convenience of description, the transmission line 222 is referred to as a first transmission line, and the transmission lines 224 and 226 may be referred to as a second transmission line. The material of the first transmission line 222 and the second transmission lines 224 and 226 may be copper or other metals.

The first substrate 202 can be subjected to a flip chip process. That is, an integrated circuit wafer 204 can be disposed on the first substrate 202. The integrated circuit chip 204 may have a plurality of contact pads overlying the metal bumps, such as 212, 214, 216, 218, and 220, for outputting or receiving an electronic signal. In particular, portions of the contact pads, such as 214, 216, and 218, can be electrically coupled to the first transmission line 222 and can deliver the same electronic signal. In this embodiment, the remaining contact pads, such as 212 and 220, can be electrically connected to corresponding second transmission wires, such as 224 and 226, respectively.

As is apparent from FIG. 2, since the first transmission line 222 is electrically connected to a plurality of contact pads, the line width of the first transmission line 222 is significantly larger than the second transmission line 224 or 226. And because the line width of the first transmission line 222 is significantly wider. Therefore, the circuit board structure provided by the present invention has a large heat dissipation area on the integrated circuit wafer. That is to say, with the structure of the embodiment, the problem of heat dissipation of the circuit can be effectively solved.

Applying the above embodiments, the present invention also provides a wiring structure of a driving circuit of a liquid crystal display, as shown in FIG. Referring to FIG. 3, in the embodiment, the wiring structure of the driving circuit may include a flexible substrate or a flexible substrate 302 and a glass substrate 304. A plurality of drivers 312, 314, 316, ..., 31n are disposed on the flexible substrate or the flexible substrate 302. Each of the drivers may have a plurality of contact pads overlying the metal bumps for outputting or receiving electronic signals, as in the integrated circuit chip 204 of FIG.

In addition, each driver can be electrically connected to a corresponding first transmission line, such as 322, 324, 326, and 328, and a second transmission line, such as 332, 334, 336, 338, 340, 342, 344, and 346. Each of the first transmission wires is as described in the above embodiment, wherein one end is electrically connected to a part of the contact pads on the corresponding driver, and the other end is electrically connected to the glass substrate 304 by using an anisotropic conductive film (ACF). on. As described above, each driver is electrically connected to the contact pads of the first transmission line, and can transmit the same electronic signal, such as a power signal or a ground potential.

In addition, the contact pads of each driver that are not connected to the first transmission line may be electrically connected to the corresponding second transmission lines, respectively. Thereby, each driver can drive the pixel array disposed on the glass by the corresponding first transmission line and the second transmission line. Similarly, in the present embodiment, the line width of the first transmission line is significantly larger than that of the second transmission line, thus providing a large area of heat dissipation area. Thereby, the driving circuit provided by the embodiment can have better heat dissipation characteristics.

Although the wiring structure provided in FIG. 2, the circuit can have better heat dissipation characteristics. However, since the first transmission wires 222 are electrically connected to the plurality of contact pads in common. Therefore, when the wires are bonded to the contact pads, the anisotropic conductive film coated on the metal bumps may overflow, resulting in a possibility that a short circuit may occur in the adjacent contact pads. In addition, since the wiring structure provided by the present invention can be applied to a driving circuit of a liquid crystal display, the size of a driving circuit of the liquid crystal display is also required to be reduced because the size of the electronic product is becoming smaller and smaller. Therefore, the following invention discloses another embodiment to solve the above problems.

4 is a schematic diagram of a circuit board structure in accordance with another embodiment of the present invention. Referring to FIG. 4, the circuit board structure provided in this embodiment also includes a first substrate 402 and a second substrate 406. The first substrate 402 may be a flexible substrate or a flexible substrate. On the first substrate 402, at least one integrated circuit 404 can also be disposed, which also has a plurality of contact pads overlying the metal bumps, such as 412, 414, 416, 418, 420, 422 and 424. Similarly, portions of the contact pads, such as 414, 416, 418, 420, and 422, are electrically coupled to the same transmission line 432, while the remaining contact pads are at least partially electrically connectable to corresponding transmission lines, such as 434 and 436.

More specifically, in the embodiment of Figure 2, all of the contact pads are oriented in a predetermined direction and are disposed in the same row. However, in this embodiment, all of the contact pads may also face the preset direction, but need not be arranged in the same row. For example, the contact pads 412, 414, 420, and 424 and the contact pads 416 and 422 are arranged in a plurality of rows toward a predetermined direction. Thereby, the line width of the first transmission line 432 can be reduced, so that the volume of the integrated circuit 404 can be reduced. Therefore, the structure provided by the embodiment is more suitable for implementation on a driving circuit of a liquid crystal display.

In addition, since the contact pads are not necessarily arranged in the same row, when the wires are bonded to the contact pads, the adjacent metal bumps can also avoid the short circuit caused by the overflow of the anisotropic conductive film.

While the present invention has been described in its preferred embodiments, the present invention is not intended to limit the invention, and the present invention may be modified and modified without departing from the spirit and scope of the invention. The scope of protection is subject to the definition of the scope of the patent application.

102. . . Flexible substrate

106, 206, 304, 406. . . Second substrate

202, 302, 402. . . First substrate

104, 204. . . Integrated circuit

112, 114, 116, 118, 120, 212, 214, 216, 218, 220, 412, 414, 416, 418, 420, 422, 424. . . Overlying metal bump contact pads

122, 124, 126, 128, 130. . . Transmission wire

222, 322, 324, 326, 328, 432. . . First transmission wire

224, 226, 332, 334, 336, 338, 340, 342, 344, 346, 434, 436. . . Second transmission wire

312, 314, 316...31n. . . driver

FIG. 1 is a schematic view showing the wiring of a conventional flip chip.

2 is a schematic diagram of a circuit board structure in accordance with a preferred embodiment of the present invention.

3 is a circuit diagram of a driving circuit of a liquid crystal display according to a preferred embodiment of the present invention.

4 is a schematic diagram of a circuit board structure in accordance with another embodiment of the present invention.

202. . . First substrate

206. . . Second substrate

204. . . Integrated circuit

1212, 214, 216, 218, 220. . . Contact pad

222, 224, 226. . . Transmission wire

Claims (26)

A wiring structure of a flip chip comprises: a first substrate having a plurality of transmission lines; an integrated circuit disposed on the first substrate and having a plurality of contact pads for receiving or outputting a plurality of signals, wherein The contact pads are at least partially electrically connected to one of the transmission wires and transmit the same signal, and the line width of the transmission wires electrically connected to the plurality of contact pads is greater than the electrical connection. The line width of the transmission wire of one of the pads. The wiring structure of the flip chip according to claim 1, wherein the contact pads are covered with metal bumps. The wiring structure of the flip chip as described in claim 1, wherein the first substrate is a flexible substrate or a flexible substrate. The wiring structure of the flip chip according to claim 1, wherein the contact pads electrically connected to the same transmission line are arranged in a row in a predetermined direction. The wiring structure of the flip chip according to claim 1, wherein the contact pads electrically connected to the same transmission line are arranged in a plurality of rows in a predetermined direction. The wiring structure of the flip chip according to claim 1, wherein the contact pads electrically connected to the same transmission line are used for transmitting a power signal. The wiring structure of the flip chip according to claim 1, wherein the contact pads electrically connected to the same transmission line are used for Ground. The wiring structure of the flip chip according to claim 1, wherein the transmission wires are made of metal. A circuit board structure includes: a first substrate having a plurality of transmission lines; an integrated circuit disposed on the first substrate and having a plurality of contact pads for receiving or outputting a plurality of signals, wherein the plurality of signals The contact pads are at least partially directly electrically connected to one of the transmission wires and transmit the same signal, and the transmission lines of the plurality of contact pads electrically connected to the plurality of contact pads have a line width greater than the electrical connection. a line width of the transmission wire of one of the pads; a second substrate electrically connected to the first substrate through the transmission wires. The circuit board structure of claim 9, wherein the contact pads are covered with metal bumps. The circuit board structure of claim 9, wherein the contact pads electrically connected to the same transmission line are arranged in a row in a predetermined direction. The circuit board structure of claim 9, wherein the contact pads that are directly and electrically connected to the same transmission line are arranged in a plurality of rows in a predetermined direction. The circuit board structure of claim 9, wherein the contact pads that are directly and electrically connected to the same transmission line are used to transmit a power signal. The circuit board structure of claim 9, wherein the contact pads that are directly and electrically connected to the same transmission line are used for grounding. The circuit board structure of claim 9, wherein the first substrate is a flexible substrate or a flexible substrate. The circuit board structure of claim 9, wherein the second substrate is made of glass or a printed circuit board. The circuit board structure of claim 9, wherein the transmission wires are made of metal. A wiring structure of a driving circuit is applicable to a liquid crystal display, and the wiring structure includes: a first substrate having a plurality of first transmission wires; and a second substrate electrically connected to the first transmission wires through the first transmission wires a plurality of drivers disposed on the first substrate, wherein the drivers each have a plurality of contact pads for receiving or outputting a plurality of signals, wherein the contact pads on each of the drivers are at least partially co-electric Connected to the corresponding first transmission line and transmit the same signal, and the first transmission line electrically connected to the plurality of contact pads has a line width greater than and electrically connected to one of the contact pads The line width of the first transmission wire. The wiring structure of the driving circuit according to claim 18, wherein the contact pads are covered with metal bumps. The wiring structure of the driving circuit according to claim 18, wherein the first substrate further has a plurality of second transmission wires, and is disposed on One end of the first substrate is electrically connected to the contact pad of the corresponding driver that is not electrically connected to the first transmission wires, and the other end is electrically connected to the first Two substrates. The wiring structure of the driving circuit according to claim 20, wherein the first transmission wire and the second transmission wire are made of copper. The wiring structure of the driving circuit according to claim 20, wherein a line width of the first transmission line is larger than a line width of the second transmission line. The wiring structure of the driving circuit of claim 18, wherein the contact pads of each of the drivers electrically connected to the corresponding first transmission wires are arranged in a row in a predetermined direction. The wiring structure of the driving circuit of claim 18, wherein each of the drivers is electrically connected to the contact pads of the corresponding first transmission wires, and is arranged in a plurality of rows in a predetermined direction. The wiring structure of the driving circuit according to claim 18, wherein the first substrate is a flexible substrate or a flexible substrate. The wiring structure of the driving circuit according to claim 18, wherein the second substrate is made of glass or a printed circuit board.