TWI402517B - Test system and test method - Google Patents
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Description
本發明係關係一種檢測系統及檢測方法,特別是一種批次測試電子元件之檢測系統及檢測方法。The invention relates to a detection system and a detection method, in particular to a detection system and a detection method for batch test electronic components.
隨著科技的進步,電子產品在日常生活中隨處可見,並愈趨多樣化發展。各種電子產品之功能及應用領域雖有不同,為使系統順利運作,相關必要元件包含如:處理器、儲存單元及電連接器等。其中,由於製程技術的發展迅速,使得電子元件的體積漸小,為確保良率,電子元件通常在出廠或組裝前,需要進行檢測,以確保電子產品之良率。With the advancement of technology, electronic products are everywhere in daily life and are increasingly diversified. Although the functions and application fields of various electronic products are different, in order to make the system operate smoothly, related necessary components include: a processor, a storage unit, and an electrical connector. Among them, due to the rapid development of process technology, the size of electronic components is getting smaller. To ensure the yield, electronic components are usually tested before leaving the factory or assembled to ensure the yield of electronic products.
以儲存單元為例,依照現有之不同技術及結構分類,包含:動態隨機存取記憶體(dynamic random access memory,DRAM)、快閃記憶體(flash memory)、固態硬碟(Solid State Disk,SSD)等。當針對儲存單元進行檢測時,隨著儲存容量的增大,可想見檢測時間會亦隨之增加。Taking a storage unit as an example, according to different technologies and structure classifications, including: dynamic random access memory (DRAM), flash memory, solid state disk (SSD) )Wait. When detecting for a storage unit, as the storage capacity increases, it is conceivable that the detection time will also increase.
習知的檢測系統,可採用多個測試裝置同時進行操作。如第1圖所示,習知的檢測系統10包含四個測試裝置111、112、113、114,其中,測試裝置111、112共用一個機械手臂131,測試裝置113、114則共用另一個機械手臂132。複數個待測元件14置放於承載盤15上備用,機械手臂16抓取已就緒之承載盤15,並放置於輸送裝置171、172上,輸送裝置171、172可分別於輸送軌道181、182上來回移動,用以將容置有待測元件14之承載盤15送進檢測系統10內,或待測元件14經檢測系統10檢測後,隨承載盤19自檢測系統10中移出。Conventional detection systems can be operated simultaneously using multiple test devices. As shown in FIG. 1, the conventional detection system 10 includes four test devices 111, 112, 113, 114, wherein the test devices 111, 112 share one robot arm 131, and the test devices 113, 114 share another robot arm. 132. A plurality of components 14 to be tested are placed on the carrier 15 for backup. The robot arm 16 grabs the ready carrier 15 and places it on the conveying devices 171 and 172. The conveying devices 171 and 172 can respectively be disposed on the conveying rails 181 and 182. The carrier disk 15 accommodating the device under test 14 is fed into the detection system 10, or the device under test 14 is detected by the detection system 10, and is removed from the detection system 10 with the carrier disk 19.
更明確而言,當載有待測元件14的承載盤15送進檢測系統10,機械手臂131、132忙碌地反覆來回作動,依序將待測元件14置放於測試裝置111、112、113、114中。各個待測元件14有電性接點(圖未示),測試裝置111、112、113、114則具有電路板及複數探針(圖未示),當待測元件14之電性接點與測試裝置111、112、113、114上之探針接觸,將可與電路板電性連接。為了確保接觸,通常的作法為將待測元件14放置且佈滿測試裝置111、112、113、114上,再以一壓板下壓確保電性連接,以對測試裝置111、112、113、114上之所有待測元件14,同時進行測試。More specifically, when the carrier 15 carrying the device under test 14 is fed into the detection system 10, the robot arms 131, 132 are repeatedly oscillated back and forth, and the components 14 to be tested are sequentially placed on the testing devices 111, 112, 113. , 114. Each of the devices 14 to be tested has electrical contacts (not shown), and the test devices 111, 112, 113, 114 have a circuit board and a plurality of probes (not shown), when the electrical contacts of the components 14 to be tested are The probe contacts on the test devices 111, 112, 113, 114 will be electrically connectable to the circuit board. In order to ensure contact, it is common practice to place the device under test 14 and fill the test devices 111, 112, 113, 114, and then press down with a platen to ensure electrical connection to the test devices 111, 112, 113, 114. All the components 14 to be tested are tested simultaneously.
然而,習知檢測系統10中,測試裝置111、112、113、114必須等待機械手臂131、132將待測元件14逐步配置完成,才能進行檢測動作,此段時間測試裝置111、112、113、114即處於閒置狀態;一旦測試裝置111、112、113、114可進入檢測程序,此時機械手臂131、132則呈現閒置狀態。如前所述,隨著儲存容量的增大,檢測時間會亦隨之增加,機械手臂131、132的閒置時間將更多。由於檢測設備價格昂貴(機械手臂的售價甚至更高於測試裝置本身),若設備經常出現閒置狀態,皆造成檢測效率的降低及成本的增加。However, in the conventional detection system 10, the test devices 111, 112, 113, 114 must wait for the mechanical arms 131, 132 to gradually configure the device under test 14 to perform the detection operation, and the test devices 111, 112, 113, 114 is in an idle state; once the test devices 111, 112, 113, 114 can enter the detection procedure, the robot arms 131, 132 are now in an idle state. As mentioned above, as the storage capacity increases, the detection time will also increase, and the idle time of the robot arms 131, 132 will be more. Since the detection equipment is expensive (the price of the robot arm is even higher than that of the test device itself), if the equipment is often idle, the detection efficiency is lowered and the cost is increased.
習知的檢測系統10或可考慮增加測試裝置的數量,以增加整體系統的總和產量,然而,測試裝置的體積龐大,且成套的機械手臂數量亦必須同時增加,此僅為擴大檢測系統的規模,對於工作效率及成本問題,仍無法有效解決。The conventional detection system 10 may consider increasing the number of test devices to increase the total output of the overall system. However, the size of the test device is large, and the number of robot arms must also be increased at the same time, which is only to expand the scale of the detection system. For work efficiency and cost issues, it still cannot be effectively solved.
有鑑於此,提供一種高效率且具有批次概念的檢測系統及檢測方法,乃為此一業界亟待解決的問題。In view of this, it is an urgent problem to be solved in the industry to provide a detection system and a detection method with high efficiency and batch concept.
本發明之一目的在於提供一種檢測系統及檢測方法,可批次地對複數個待測元件進行檢測。明確而言,本發明係將載滿待測元件的承載盤,直接送入測試裝置中,並隨即進行電性連接及檢測,省卻習知檢測系統中,必須依賴機械手臂依序將待測元件分配至測試裝置的方式。檢測程序完成後,即可卸除該承載盤,並緊接著送入另一承載盤,如此重複操作,故測試裝置可大幅減少分配待測元件的閒置時間,使得各個測試裝置的每小時產能(units per hour,UPH)最大化。An object of the present invention is to provide a detection system and a detection method for detecting a plurality of components to be tested in batches. Specifically, the present invention directly feeds the carrier tray carrying the device to be tested into the test device, and then electrically connects and detects the device. In the conventional detection system, the component to be tested must be sequentially dependent on the robot arm. The way it is assigned to the test device. After the detection process is completed, the carrier tray can be removed and then transferred to another carrier tray, and the operation is repeated, so that the test device can greatly reduce the idle time for allocating the components to be tested, so that the hourly capacity of each test device ( Units per hour, UPH) maximize.
本發明之另一目的在於提供一種檢測系統及檢測方法,藉由導入生產線的概念,以一輸送部串連多個測試裝置,並將專責從事將待測元件配載至承載盤的分配機構(或機械手臂),設置於檢測系統的前端區域,故分配機構幾乎不會閒置,每小時產能可最大化。載滿待測元件的承載盤,將被置於輸送部的進口區,隨時因應各個測試裝置的狀況,將該承載盤輸送至空閒的測試裝置進行檢測。Another object of the present invention is to provide a detection system and a detection method. By introducing the concept of a production line, a plurality of test devices are connected in series by a transport portion, and a distribution mechanism for carrying the components to be tested to the carrier tray is exclusively engaged ( Or the robot arm) is placed in the front end area of the inspection system, so the distribution mechanism is hardly idle and the hourly capacity can be maximized. The carrier tray filled with the component to be tested will be placed in the inlet area of the conveying section, and the carrier tray will be transported to an idle testing device for detection according to the condition of each testing device.
本發明檢測系統中,可視分配機構的工作效率,對應配置適當數量的測試裝置。如此一來,由於測試裝置及分配機構皆能避免閒置,處於接近產能滿載的狀態。此時,檢測系統的每小時產能(即總和所有測試裝置的產能),將與分配機構的每小時產能接近。可想見地,檢測效率可獲提升、而成本得以降低。In the detection system of the present invention, the working efficiency of the visual distribution mechanism is correspondingly configured with an appropriate number of test devices. In this way, both the test device and the distribution mechanism can avoid being idle, and are in a state of being close to full capacity. At this point, the hourly capacity of the inspection system (ie, the total capacity of all test units) will be close to the hourly capacity of the distribution facility. Conceivably, the detection efficiency can be improved and the cost can be reduced.
本發明之又一目的在於提供一種檢測系統及檢測方法,輸送部串連多個測試裝置的概念,並不侷限於平面配置,視測試裝置的擺設而可為三維空間配置,以有效利用廠房的空間。Another object of the present invention is to provide a detection system and a detection method. The concept of a plurality of test devices connected in series is not limited to a planar configuration, and can be configured in a three-dimensional space depending on the arrangement of the test device, so as to effectively utilize the plant. space.
為達上述目的,本發明揭露一種檢測系統,用以批次檢測複數個待測元件,該檢測系統包含一輸送部、至少一承載盤、至少一測試裝置、及一分配機構。其中,該輸送部具有進口區、出口區、及位於進口區與出口區之間的檢測區;該承載盤可自進口區被輸送至檢測區、及自檢測區被輸送至出口區,承載盤包含複數個承載座,用以容置該等待測元件;測試裝置係鄰設於檢測區,用以接受該承載盤,並對承載盤上之等待測元件進行檢測;該分配機構用以將該等待測元件,預先置放於該至少一承載盤之承載座中。To achieve the above objective, the present invention discloses a detection system for batch detecting a plurality of components to be tested, the detection system comprising a conveying portion, at least one carrier tray, at least one testing device, and a dispensing mechanism. Wherein, the conveying portion has an inlet zone, an outlet zone, and a detection zone between the inlet zone and the outlet zone; the carrier tray can be transported from the inlet zone to the detection zone, and the self-test zone is transported to the exit zone, the carrier disk a plurality of carriers for receiving the waiting component; the testing device is disposed adjacent to the detecting area for accepting the carrier and detecting the waiting component on the carrier; the distributing mechanism is configured to The waiting component is pre-placed in the carrier of the at least one carrier.
本發明更揭露一種檢測方法,用以批次檢測複數個待測元件,該檢測方法包含下列步驟:將等待測元件依序分配至複數個承載盤上,其中各承載盤具有複數個承載座,以容置該等待測元件;依據至少一測試裝置之操作狀態,輸送該承載盤至該至少一測試裝置;利用該至少一測試裝置檢測該等待測元件;以及,自該至少一測試裝置卸載該承載盤。The invention further discloses a detecting method for batch detecting a plurality of components to be tested, the detecting method comprising the steps of: sequentially assigning waiting components to a plurality of carrier disks, wherein each carrier disk has a plurality of carrier seats. Accommodating the waiting component; transporting the carrier to the at least one testing device according to an operating state of the at least one testing device; detecting the waiting component by using the at least one testing device; and unloading the device from the at least one testing device Carrier disk.
為讓上述目的、技術特徵、和優點能更明顯易懂,下文係以較佳實施例配合所附圖式進行詳細說明。The above objects, technical features, and advantages will be more apparent from the following description.
本發明之第一實施例如第2圖所示,其係關於一種用以批次檢測複數個待測元件之檢測系統20,檢測系統20包含至少一承載盤(tray)21及一分配機構(handler)22,較佳地,測試系統20係包含複數個承載盤21,承載盤21用以承載該等待測元件23。請一併參閱第3圖,其係為承載盤(tray)21及分配機構22於操作狀態之側視示意圖,該承載盤21包含複數個承載座211,用以容置該等待測元件23,分配機構22用以將該等待測元件23,預先置放於該承載盤21之該等承載座211。待測元件23可先收集存放於一存料裝置24中,分配機構22自該存料裝置24依序抓取待測元件23並分配至承載盤21之承載座211。A first embodiment of the present invention, as shown in FIG. 2, relates to a detection system 20 for batch detecting a plurality of components to be tested, the detection system 20 including at least one tray 21 and a dispensing mechanism (handler) 22, preferably, the test system 20 includes a plurality of carrier trays 21 for carrying the waiting component 23. Please refer to FIG. 3 , which is a side view of the tray 21 and the distribution mechanism 22 in an operating state. The carrier 21 includes a plurality of carriers 211 for accommodating the waiting component 23 . The distribution mechanism 22 is configured to pre-position the waiting component 23 on the carrier 211 of the carrier 21 . The component to be tested 23 can be collected and stored in a storage device 24, and the dispensing mechanism 22 sequentially grabs the component 23 to be tested from the storage device 24 and distributes it to the carrier 211 of the carrier 21 .
檢測系統20更包含一輸送部25,為方便清楚說明,可將輸送部25區分為進口區251、出口區252、及位於進口區251與出口區252之間的檢測區253;輸送部25可選用輸送軌或輸送帶,視實際需求而定,在此不作限制。當採用輸送軌為輸送部25時,可更配置一輸送裝置(shuttle)255,輸送裝置255適可沿該輸送部25來回移動,以運載該承載盤21。例如,承載盤21可自進口區251被輸送至檢測區253進行檢測,以及於檢測完成後自檢測區253被輸送至出口區252。The detecting system 20 further includes a conveying portion 25, which can be divided into an inlet region 251, an outlet region 252, and a detection zone 253 between the inlet zone 251 and the outlet zone 252 for convenience of clarity; the conveying section 25 can be The use of conveyor rails or conveyor belts depends on actual needs and is not limited here. When the conveying rail is used as the conveying portion 25, a shuttle 255 may be further disposed, and the conveying device 255 is adapted to move back and forth along the conveying portion 25 to carry the carrier tray 21. For example, the carrier tray 21 can be transported from the inlet zone 251 to the detection zone 253 for detection and from the detection zone 253 to the outlet zone 252 upon completion of the detection.
須說明的是,分配機構22及存料裝置24較佳係鄰設於輸送部25之進口區251,但不以此為限,分配機構22及存料裝置24亦可視環境空間的配置需求,設置於遠端,待分配機構22將承載盤21載入待測元件23後,再運送至輸送部25之進口區251,亦可實施本發明。It should be noted that the distribution mechanism 22 and the storage device 24 are preferably disposed adjacent to the inlet region 251 of the conveying portion 25, but not limited thereto, the distribution mechanism 22 and the storage device 24 may also be configured according to the environmental space. Provided at the distal end, the to-be-distributed mechanism 22 loads the carrier disk 21 into the device under test 23 and transports it to the inlet region 251 of the transport portion 25, and can also implement the present invention.
檢測系統20更包含至少一測試裝置26,鄰設於輸送部25之檢測區253,較佳地,檢測系統20係包含複數個測試裝置26,模組化地沿該輸送部25之檢測區253設置,故可各別地針對測試裝置26進行組裝或拆卸,方便進行維修保養。當承載盤21被運送至檢測區253,測試裝置26可接受該承載盤21,並對其上之待測元件23進行檢測。更明確而言,各測試裝置26包含第一移轉機構261,用以自輸送部25抓取承載盤21,並定位至可進行測試的適當位置,當測試程序結束後,第一移轉機構261亦可將該承載盤21釋放回輸送部25,承載盤21隨後將沿輸送部25被運送至出口區252。The detection system 20 further includes at least one test device 26 adjacent to the detection area 253 of the transport unit 25. Preferably, the detection system 20 includes a plurality of test devices 26, and the detection area 253 along the transport portion 25 is modularly disposed. Since it is installed, the test device 26 can be assembled or disassembled separately for convenient maintenance. When the carrier tray 21 is transported to the detection zone 253, the test device 26 can accept the carrier tray 21 and detect the component 23 to be tested thereon. More specifically, each test device 26 includes a first transfer mechanism 261 for grasping the carrier tray 21 from the transport portion 25 and positioning it to an appropriate position for testing. When the test procedure is completed, the first transfer mechanism The carrier tray 21 can also be released back to the transport portion 25, which will then be transported along the transport portion 25 to the exit region 252.
本實施例之檢測系統20,可更包含第二移轉機構27,鄰設於輸送部25之進口區251。當該等待測元件23經由分配機構22配置承載於該等承載盤21,該第二移轉機構27用以將該承載盤21搬運至輸送部25之進口區251。同樣地,本實施例之檢測系統20可更包含第三移轉機構28,鄰設於輸送部25之出口區252,當完成檢測之待測元件23隨承載盤21被運載至該出口區252,第三移轉機構28可用以自出口區252卸載該承載盤21。The detection system 20 of the present embodiment may further include a second transfer mechanism 27 adjacent to the inlet region 251 of the transport portion 25. When the waiting component 23 is disposed on the carrying tray 21 via the dispensing mechanism 22, the second shifting mechanism 27 is used to transport the carrying tray 21 to the inlet region 251 of the conveying portion 25. Similarly, the detection system 20 of the present embodiment may further include a third transfer mechanism 28 adjacent to the exit region 252 of the transport portion 25, and the test element 23 to be tested is carried to the exit region 252 with the carrier 21 when the detection is completed. The third transfer mechanism 28 can be used to unload the carrier tray 21 from the exit zone 252.
本實施例中測試裝置26之操作說明如下。如第4圖所示,各待測元件23具有至少一電性接點231,而該測試裝置26具有複數探針263及電路板265。當該測試裝置26接受該承載盤21,並定位至預定位置,可藉由一壓板267壓掣待測元件23,確保待測元件23之電性接點231與測試裝置26之探針263接觸,以與該電路板265電性連接。The operation of the test device 26 in this embodiment is explained below. As shown in FIG. 4, each of the devices 23 to be tested has at least one electrical contact 231, and the test device 26 has a plurality of probes 263 and a circuit board 265. When the test device 26 accepts the carrier 21 and is positioned to a predetermined position, the device under test 23 can be pressed by a pressing plate 267 to ensure that the electrical contact 231 of the device under test 23 is in contact with the probe 263 of the test device 26. To electrically connect to the circuit board 265.
藉由本實施例所揭露之檢測系統20,模組化設計及配置的測試裝置26,可分別接受對應之承載盤21,並獨立地對其上之待測元件23進行檢測。且當該測試裝置26對其中一承載盤21上之待測元件23進行檢測時,分配機構22仍同時運作,可操作地將待測元件23依序置放至另一承載盤21之承載座中211。With the detection system 20 disclosed in the embodiment, the modular design and configuration of the test device 26 can respectively accept the corresponding carrier 21 and independently detect the device 23 to be tested thereon. And when the testing device 26 detects the device under test 23 on one of the carrier disks 21, the dispensing mechanism 22 still operates simultaneously, and operatively places the device under test 23 into the carrier of the other carrier disk 21 in sequence. In 211.
本發明之第二實施例如第5圖所示。於本實施例中,輸送部25之進口區251與出口區252彼此相鄰,例如輸送部25呈現U型的配置。當該等待測元件23完成檢測且該承載盤21被運載至該出口區252,該第二移轉機構27自該出口區252卸載該承載盤21。如此一來,可省卻如第一實施例之第三移轉機構28之配置,僅利用第二移轉機構27即可同時提供裝卸承載盤21之功能。進一步而論,本發明之檢測系統20不限於圖式所繪示之平面配置,更可視廠房三維空間配置,只要以輸送部25加以串連即可本發明之第三實施例係為一種用以批次檢測複數個待測元件之檢測方法,相關步驟如第6A圖及第6B圖所示,請一併參考前述之第一實施例或第二實施例之檢測系統。首先,將該等待測元件依序分配至複數個承載盤上,其中各該承載盤具有複數個承載座,以容置待測元件。詳言之,先執行步驟601提供複數個承載盤,其中該等承載盤係呈現未承載待測元件之空載狀態;接下來利用分配裝置,例如一機械手臂,於步驟602,依序地將待測元件載入於承載盤之承載座中。A second embodiment of the present invention is shown in Fig. 5. In the present embodiment, the inlet region 251 and the outlet region 252 of the conveying portion 25 are adjacent to each other, for example, the conveying portion 25 assumes a U-shaped configuration. When the waiting component 23 completes the detection and the carrier 21 is carried to the exit zone 252, the second transfer mechanism 27 unloads the carrier 21 from the exit zone 252. In this way, the configuration of the third transfer mechanism 28 as in the first embodiment can be omitted, and the function of loading and unloading the carrier 21 can be simultaneously provided by only using the second transfer mechanism 27. Further, the detection system 20 of the present invention is not limited to the planar configuration illustrated in the drawings, and can be more visually arranged in a three-dimensional configuration of the factory. The third embodiment of the present invention can be used as long as it is connected in series by the conveying portion 25. The detection method of the plurality of components to be tested is detected by the batch, and the relevant steps are as shown in FIGS. 6A and 6B. Please refer to the detection system of the first embodiment or the second embodiment. First, the waiting component is sequentially allocated to a plurality of carrier disks, wherein each of the carrier disks has a plurality of carriers to accommodate the device to be tested. In detail, step 601 is performed to provide a plurality of carrier disks, wherein the carrier disks are in an unloaded state in which the components to be tested are not carried; and then, using a distribution device, such as a robot arm, in step 602, sequentially The component to be tested is loaded in the carrier of the carrier.
然後,依據至少一測試裝置之操作狀態,輸送該承載盤至該至少一測試裝置。詳言之,先執行步驟603,將載有待測元件之承載盤搬移至輸送部上;再以步驟604,沿輸送部運送承載盤;然後步驟605係測試裝置利用第一移轉機構,自該輸送部抓取該承載盤。Then, the carrier tray is transported to the at least one test device according to the operating state of the at least one test device. In detail, step 603 is performed first, and the carrier tray carrying the device to be tested is moved to the transport portion; then, in step 604, the carrier tray is transported along the transport portion; then step 605 is performed by the test device using the first transfer mechanism. The conveying portion grabs the carrier tray.
接下來,執行步驟606,利用該至少一測試裝置檢測該等待測元件;詳言之,各該待測元件具有至少一電性接點,該至少一測試裝置具有至少一電路板及複數探針,步驟606係將各該待測元件之該至少一電性接點經由與該至少一測試裝置之探針接觸,以與該至少一電路板電性連接並進行檢測作業。Next, step 606 is executed to detect the waiting component by using the at least one testing device; in detail, each of the testing elements has at least one electrical contact, and the at least one testing device has at least one circuit board and a plurality of probes Step 606: contacting the at least one electrical contact of each of the devices to be tested with a probe of the at least one test device to electrically connect to the at least one circuit board and perform a detecting operation.
待測試結束後,即可自該至少一測試裝置卸載該承載盤。詳言之,執行步驟607,該至少一測試裝置利用第一移轉機構,將承載盤釋放至輸送部;然後,執行步驟608,沿輸送部運送承載盤;最後以步驟609,將承載盤自輸送部卸除。最後,本實施例之檢測方法,進行步驟610,依據檢測該等待測元件之結果,篩選該等待測元件,剔除未能通過檢測標準之元件,僅保留合格的元件,以進行後續作業。After the test is completed, the carrier can be unloaded from the at least one test device. In detail, in step 607, the at least one test device releases the carrier tray to the transport portion by using the first transfer mechanism; then, step 608 is performed to transport the carrier tray along the transport portion; and finally, in step 609, the carrier tray is self-contained. The conveying section is removed. Finally, in the detecting method of the embodiment, in step 610, the waiting component is screened according to the result of detecting the waiting component, and the component that fails the detection standard is removed, and only the qualified component is retained for subsequent operations.
須說明的是,上述檢測方法可應用於前述第一實施例及第二實施例之檢測系統,該系統內較佳係配置有多個承載盤及多個測試裝置,其數量可依據步驟602之分配裝置的能力進行搭配,以降低閒置的發生。It should be noted that the above detection method can be applied to the detection systems of the first embodiment and the second embodiment. The system is preferably configured with a plurality of carrier disks and a plurality of test devices, the number of which can be determined according to step 602. The ability to assign devices is matched to reduce idleness.
綜合上述,本發明所揭露之檢測系統及檢測方法,可對複數個待測元件進行批次檢測,且測試裝置無須等待機械手臂的分配,機械手臂亦不會因為測試時間的增加而閒置,各元件的效能可充分利用,成本可顯著降低。In summary, the detection system and the detection method disclosed in the present invention can perform batch detection on a plurality of components to be tested, and the test device does not have to wait for the distribution of the robot arm, and the robot arm does not idle because of the increase of the test time. The performance of the components can be fully utilized and the cost can be significantly reduced.
上述之實施例僅用來例舉本發明之實施態樣,以及闡釋本發明之技術特徵,並非用來限制本發明之保護範疇。任何熟悉此技術者可輕易完成之改變或均等性之安排均屬於本發明所主張之範圍,本發明之權利保護範圍應以申請專利範圍為準。The embodiments described above are only intended to illustrate the embodiments of the present invention, and to explain the technical features of the present invention, and are not intended to limit the scope of protection of the present invention. Any changes or equivalents that can be easily made by those skilled in the art are within the scope of the invention. The scope of the invention should be determined by the scope of the claims.
10...檢測系統10. . . Detection Systems
111...測試裝置111. . . Test device
112...測試裝置112. . . Test device
113...測試裝置113. . . Test device
114...測試裝置114. . . Test device
131...機械手臂131. . . Mechanical arm
132...機械手臂132. . . Mechanical arm
14...待測元件14. . . Component to be tested
15...承載盤15. . . Carrier disk
16...機械手臂16. . . Mechanical arm
171...輸送裝置171. . . Conveyor
172...輸送裝置172. . . Conveyor
181...輸送軌道181. . . Transport track
182...輸送軌道182. . . Transport track
19...承載盤19. . . Carrier disk
20...檢測系統20. . . Detection Systems
21...承載盤twenty one. . . Carrier disk
211...承載座211. . . Carrier
22...分配機構twenty two. . . Distribution agency
23...待測元件twenty three. . . Component to be tested
231...電性接點231. . . Electrical contact
24...存料裝置twenty four. . . Storage device
25...輸送部25. . . Transport department
251...進口區251. . . Import area
252...出口區252. . . Export area
253...檢測區253. . . Detection area
255...輸送裝置255. . . Conveyor
26...測試裝置26. . . Test device
261...第一移轉機構261. . . First transfer mechanism
263...探針263. . . Probe
265...電路板265. . . Circuit board
267...壓板267. . . Press plate
27...第二移轉機構27. . . Second transfer mechanism
28...第三移轉機構28. . . Third transfer mechanism
第1圖係習知檢測系統之示意圖;Figure 1 is a schematic diagram of a conventional detection system;
第2圖係本發明第一實施例之檢測系統之示意圖;Figure 2 is a schematic view of a detection system of a first embodiment of the present invention;
第3圖係本發明第一實施例中,承載盤及分配機構於操作狀態之側視示意圖;Figure 3 is a side elevational view showing the carrier tray and the dispensing mechanism in an operational state in the first embodiment of the present invention;
第4圖係係本發明第一實施例中,測試裝置與待測元件電性連接之示意圖;Figure 4 is a schematic view showing the electrical connection between the test device and the device to be tested in the first embodiment of the present invention;
第5圖係本發明第二實施例之檢測系統之示意圖;及Figure 5 is a schematic view showing a detection system of a second embodiment of the present invention;
第6圖係本發明第二實施例之檢測方法之流程圖。Figure 6 is a flow chart showing the detection method of the second embodiment of the present invention.
20...檢測系統20. . . Detection Systems
21...承載盤twenty one. . . Carrier disk
211...承載座211. . . Carrier
22...分配機構twenty two. . . Distribution agency
23...待測元件twenty three. . . Component to be tested
24...存料裝置twenty four. . . Storage device
25...輸送部25. . . Transport department
251...進口區251. . . Import area
252...出口區252. . . Export area
253...檢測區253. . . Detection area
255...輸送裝置255. . . Conveyor
26...測試裝置26. . . Test device
261...第一移轉機構261. . . First transfer mechanism
27...第二移轉機構27. . . Second transfer mechanism
28...第三移轉機構28. . . Third transfer mechanism
Claims (17)
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US7129726B2 (en) * | 2005-03-31 | 2006-10-31 | Fujitsu Limited | Testing device and testing method of a semiconductor device |
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TWI264549B (en) * | 2001-07-12 | 2006-10-21 | Advantest Corp | Pusher with heater, electronic component handling device, and method of controlling temperature of the electronic component |
WO2006059553A1 (en) * | 2004-11-30 | 2006-06-08 | Advantest Corporation | Electronic component handling device and defective component determination method |
US7129726B2 (en) * | 2005-03-31 | 2006-10-31 | Fujitsu Limited | Testing device and testing method of a semiconductor device |
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