TWI496238B - Alignment system and method thereof - Google Patents

Description

Alignment system and method thereof

The present invention relates to an alignment system and method thereof, and more particularly to an alignment system and method for forming a plurality of sensing values and their alignment results by mutual induction and aligning the results according to the alignment results.

Wafer-level packaging (WLP) is an advanced semiconductor packaging technology, all of which need to be done at the wafer level before slicing, so that the package size is not much larger than the wafer itself, providing a 3D package. Competitive mass production packaging technology.

The production cycle of the wafer-level process is almost independent of the wafer size. For the packaged device, the trade-off between speed and accuracy must be made. With the high alignment accuracy, the risk of capacity reduction is always paid. Because it is necessary to wait for the operation of the vibration stop and alignment control feedback loop, it is conventional to use the optical alignment technique for alignment correction in the wafer pole package operation.

Since the germanium wafer is opaque, the infrared light source must be used to penetrate the wafer to assist the alignment. However, since the wafer has a thickness, the optical alignment resolution using the infrared light source penetration mode is relatively easy. Error due to thickness effects.

In view of the above-described problems of the prior art, it is an object of the present invention to provide an alignment system and method for solving the problem that the alignment of the prior art is more susceptible to errors.

In accordance with the purpose of the present invention, an alignment system is provided that includes a first carrier, a second carrier, and a processing module. The first carrier loads a first target component having at least one first inductive component. The second carrier corresponds to the first carrier, and loads a second target component having a plurality of second sensing components on a side corresponding to the first target component, when the first target component is separated from the second target component by a preset distance The at least one first sensing component and the plurality of second sensing components respectively sense each other to form a plurality of sensing values. The processing module compares the plurality of sensing values to obtain a comparison result, and adjusts the relative positions of the first carrier and the second carrier according to the comparison result, so that the first target component and the second target component are aligned with each other.

Preferably, the first target component and the second target component can be wafers or wafers.

Preferably, the distance between each of the at least one first sensing element is equal to the geometric center of the first target element, and the distance between each of the plurality of second sensing elements is equal to the geometric center of the second target element.

Preferably, the alignment action can be completed when the sensing values formed by the at least one first sensing element and the plurality of second sensing elements are respectively mutually equal.

Preferably, when the first target component is separated from the second target component by a predetermined distance, the first carrier and the second carrier are stopped from each other; when the alignment operation is completed, the first carrier and the second carrier continue to be continued. Approaching each other such that the first target element and the second target element are attached to each other to complete the package.

In addition, the present invention further provides an alignment method comprising the steps of: loading a first target component having at least one first sensing component onto a first carrier; loading a second target component having a plurality of second sensing components to a a second carrier; the first carrier and the second carrier are adjacent to each other; and the first sensing component is at least a first sensing component when the first target component is at a predetermined distance from the second target component Forming a plurality of sensing values with the plurality of second sensing members; comparing the plurality of sensing values by the processing module to obtain a comparison result; adjusting the relative positions of the first carrier and the second carrier according to the comparison result, so that the first A semiconductor component and a second semiconductor component are aligned with each other.

According to the present invention, the alignment system and method thereof have the following advantages: the alignment system and the method thereof can be mutually inductively sensed by the sensing member to form an induced value, and then processed by the processing module. Then, the alignment correction is performed based on the comparison result, thereby improving the accuracy of the alignment correction operation.

1‧‧‧Alignment system

11‧‧‧First Vehicle

111‧‧‧First target component

1111‧‧‧First sensing parts

12‧‧‧Second Vehicle

121‧‧‧second target component

1211‧‧‧Second sensing parts

13‧‧‧Processing module

311, 511‧‧‧ first wafer

3111, 5111‧‧‧ first electrode

3112, 5112‧‧‧ first geometric center

321, 521‧‧‧second wafer

3211, 5211‧‧‧ second electrode

3212, 5212‧‧‧ Second Geometric Center

C ₁ , C ₂ ‧‧‧ capacitance values

S61 to S66‧‧‧ steps

Figure 1 is a block diagram of the alignment system of the present invention.

Figure 2 is a schematic illustration of the alignment system of the present invention.

Figure 3 is a schematic illustration of a first embodiment of an alignment system of the present invention.

Figure 4 is a circuit diagram of a capacitive sensing differential circuit.

Figure 5 is a schematic illustration of a second embodiment of the alignment system of the present invention.

Figure 6 is a flow chart of the alignment method of the present invention.

The embodiments of the alignment system and the method thereof according to the present invention will be described below with reference to the accompanying drawings. For the sake of understanding, the same components in the following embodiments are denoted by the same reference numerals.

Please refer to FIG. 1 and FIG. 2, which are block diagrams of the alignment system of the present invention; and FIG. 2 is a schematic view of the alignment system of the present invention. As shown, the alignment system 1 of the present invention includes a first carrier 11, a second carrier 12, and a processing module 13. First carrier 11 The first target element 111 having the first sensing element 1111 is carried. The second carrier 12 corresponds to the first carrier 11 and loads a second target component 121 having a second sensing component 1211 on a side corresponding to the first target component 111, when the first target component 111 is away from the second target component When the predetermined distance is met (for example, the distance can be appropriately sensed), the first sensing element 1111 and the second sensing element 1211 respectively sense each other to form an induced value. The processing module 13 compares the sensing values to obtain a comparison result, and controls the relevant driving elements according to the comparison result to adjust the relative positions of the first carrier 11 and the second carrier 12 to make the first target component 111 and the second target The elements 121 are aligned with each other. Incidentally, the technique of the processing module 13 for controlling the relative position of the first carrier 11 and the second carrier 12 by controlling the actuating member (for example, a robot arm, etc.) is well known to those skilled in the art, and thus Let me repeat.

The first target component 111 and the second target component 121 can be a wafer or a wafer. Therefore, the first target component 111 and the second target component 121 applicable to the alignment system 1 can be a wafer and a wafer, or a wafer. For the wafer. In addition, the first carrier 11 and the second carrier 12 are disposed corresponding to each other. In the following embodiments, the first carrier 11 is disposed on the second carrier 12 as an example, but should not be limited thereto. .

In more detail, in the following embodiments, the first target element 111 and the second target element 121 are each exemplified by a wafer, but should not be limited thereto. The first sensing element 1111 corresponds to the wafer as the first electrode, and the second sensing element 1211 can correspond to the wafer as the second electrode; further, if the number of the first sensing elements 1111 is one, the first sensing element The position of 1111 can be located at the geometric center position of the first target element 111; if the number of the first sensing elements 1111 is plural, preferably, the first sensing element 1111 is located at the geometric center of the first target element 111. The distances should be equal, and the distance between each of the plurality of second sensing members 1211 from the geometric center of the second target member 121 is also equal.

Therefore, when the first target element 111 is at a predetermined distance from the second target element 121, the sensing values formed by the at least one first sensing element 1111 and the plurality of second sensing elements 1211 are respectively equal to each other; in other words, the first sensing The number of the pieces 1111 is taken as an example. Since the geometric centers of the first target element 111 and the second target element 121 should correspond to each other, the plurality of second sensing elements 1211 and the first sensing element 1111 are respectively equidistant from the geometric center. The distances should be equal and the resulting values should be equal.

As shown in FIG. 2, the first carrier 11 and the second carrier 12 will gradually bring the first target element 111 and the second target element 121 closer to each other, and the moving direction thereof may be indicated by an arrow in the figure, or only the first carrier. If the distance between the first target element 111 and the second target element 121 is a preset distance, the movement will stop, the first sensing element 1111 and the plurality of second parts. The sensing component 1211 will inductively form a plurality of sensing values, and then compare the processing module 13 to obtain a comparison result, and adjust the relative positions of the first carrier 11 and the second carrier 12 according to the comparison result; When the sensing value is formed and compared, when the comparison result to be obtained is equal to the plurality of sensing values, it indicates that the first target component 111 has been aligned with the second target component 121, and therefore, the first carrier 11 and the second carrier 12 continues to move so that the first target element 111 and the second target element 121 are close to each other to complete the package.

Please refer to FIG. 3 and FIG. 4 together. FIG. 3 is a schematic diagram of a first embodiment of the alignment system of the present invention: FIG. 4 is a circuit diagram of a capacitive sensing differential circuit. As shown in the figure, in the embodiment, the first target component is a first wafer 311 having a first sensing component (first electrode 3111) located on the first geometric center 3112 of the first wafer 311; The second target component 321 is a second wafer having two second sensing members (second electrodes 3211) corresponding to two sides of the second geometric center 3212 of the second wafer 321, and each second The electrodes 3211 are equidistant from the second geometric center 3212. When the first wafer 311 and the second wafer 321 are apart from each other by a predetermined distance, the first electrode 3111 and the second electrode 3211 are mutually induced to form a capacitance value C ₁ , and the first electrode 3111 is also coupled to the other second electrode 3211. Inductively forming a capacitance value C ₂ ; and the processing module 13 in the above includes a capacitance sensing differential circuit, which can compare the capacitance values C ₁ and C ₂ ; if the capacitance value C _{1 is} greater than the capacitance value C ₂ , the first electrode 3111 corresponding to the capacitance value C is closer to the second electrode _32111, a first electrode 3111 also indicates the direction to bias the more; if the capacitance value C ₂ is greater than the capacitance value C ₁ represents the first capacitor electrode 3111 is closer to the corresponding The second electrode 3211 of the value C ₂ also indicates that the first electrode 3111 is biased in the direction. Thereby, it is determined which direction the first electrode 3111 is biased, and the positions of the first carrier 11 and the second carrier 12 are aligned and corrected.

It should be noted that this embodiment exemplifies the manner in which the geometric center of the first target element 111 is aligned with the geometric center of the second target element 121. In practice, the capacitance values C ₁ and C ₂ have a predetermined difference. It indicates the alignment in its specific mode, so it should not be limited to this.

According to the first embodiment, the present invention further provides a second embodiment for further exemplification.

Please refer to FIG. 5, which is a schematic view of a second embodiment of the alignment system of the present invention. As shown in the present embodiment, the first target component is a first wafer 511 having a first sensing component (first electrode 5111) located on a first geometric center 5112 of the first wafer 511; The second target component is a second wafer 521 having four second sensing members (second electrodes 5211 ) correspondingly disposed around the second geometric center 5212 of the second wafer 521 , and The distance between each of the second electrodes 5211 and the second geometric center 5212 is equal. As described in the first embodiment, the first electrode 5111 and the fourth second electrode 5211 are respectively induced to form four capacitance values; the capacitance sensing differential circuit compares the magnitude of the four capacitance values; to determine the first electrode 5211 bias In which direction, the positions of the first carrier 11 and the second carrier 12 are corrected to be aligned with each other.

As described above, the first electrode and the second electrode are added to the wafer during the process of producing the wafer, and the related art is familiar to those skilled in the art, and will not be described herein.

Although the foregoing description of the alignment method of the present invention has been described in the foregoing description of the alignment system of the present invention, for the sake of clarity, the flow chart will be described in detail below.

Please refer to FIG. 6, which is a flow chart of the alignment method of the present invention. As shown, the alignment method of the present invention comprises the following steps:

(S61) loading the first target component having the at least one first sensing component onto the first carrier.

(S62) loading the second target component having the plurality of second sensing members onto the second carrier.

(S63) bringing the first carrier and the second carrier closer to each other.

(S64) When the first target component is separated from the second target component by a predetermined distance, the at least one first sensing component and the plurality of second sensing components sense each other to form a plurality of sensing values.

(S65) The processing module compares the plurality of sensing values to obtain a comparison result.

(S66) Adjusting the relative positions of the first carrier and the second carrier according to the comparison result to align the first semiconductor element and the second semiconductor element with each other.

The detailed description and embodiments of the alignment method of the present invention have been described above in connection with the alignment system of the present invention, and will not be described again for the sake of brevity.

The above is intended to be illustrative only and not limiting. Any equivalent modifications or alterations to the spirit and scope of the invention are intended to be included in the scope of the appended claims.

1‧‧‧Alignment system

11‧‧‧First Vehicle

111‧‧‧First target component

1111‧‧‧First sensing parts

12‧‧‧Second Vehicle

121‧‧‧second target component

1211‧‧‧Second sensing parts

13‧‧‧Processing module

Claims (10)

An alignment system comprising: a first carrier loaded with a first target component having at least one first sensing component; a second carrier corresponding to the first carrier and corresponding to One side of the first target component is loaded with a second target component having a plurality of second sensing components. When the first target component is at a predetermined distance from the second target component, the at least one first sensing component respectively The plurality of second sensing members mutually induce a plurality of capacitance values; and a processing module compares the plurality of capacitance values to obtain a comparison result, and adjusts the first carrier and the second according to the comparison result The relative positions of the carriers are such that the first target element and the second target element are aligned with each other. The alignment system of claim 1, wherein the first target component and the second target component are wafers or wafers. The alignment system of claim 1, wherein each of the at least one first sensing element is equidistant from a geometric center of the first target element, and each of the plurality of second sensing elements is spaced apart from the second target The geometric centers of the components are equidistant. The alignment system of claim 3, wherein the alignment action is completed when the capacitance values sensed by the at least one first sensing element and the plurality of second sensing elements are respectively mutually equal. The alignment system of claim 4, wherein the first target component stops the first carrier when the first target component is separated from the second target component by the predetermined distance The second carrier is adjacent to each other, and when the alignment operation is completed, the first carrier and the second carrier continue to approach each other, so that the first target component and the second target component are attached to each other to complete the packaging. . An alignment method comprising the steps of: loading a first target component having at least one first sensing component onto a first carrier; loading a second target component having a plurality of second sensing components to a second carrier The first carrier and the second carrier are adjacent to each other; and the at least one first sensing component and the plurality of second components are provided when the first target component is at a predetermined distance from the second target component The sensing components are mutually inductively formed to form a plurality of capacitance values; using a processing module, comparing the plurality of capacitance values to obtain a comparison result; and adjusting the relative positions of the first carrier and the second carrier according to the comparison result, The first target element and the second target element are aligned with each other. The alignment method of claim 6, wherein the first target component and the second target component are wafers or wafers. The alignment method of claim 6, wherein each of the at least one first sensing member is equidistant from a geometric center of the first target component, and each of the plurality of second sensing members is spaced apart from the second target The geometric centers of the components are equidistant. The alignment method of claim 8, wherein the at least one When the sensing value formed by the sensing element and the plurality of second sensing elements are respectively equal to each other, the alignment operation is completed. The alignment method of claim 9, wherein the first target component is stopped from the second target component by a predetermined distance, and the first carrier and the second carrier are stopped from each other when completed. During the alignment operation, the first carrier and the second carrier continue to approach each other such that the first target component and the second target component are attached to each other to complete the package.