TWI446064B - Display panel - Google Patents

Description

Display panel

The invention relates to a method for cutting a mother panel of a display panel and a display panel, in particular to a display panel having a plurality of predetermined cutting lines and capable of selecting a large-sized display panel unit or a small-sized display panel unit in a cutting process according to requirements. The cutting method of the mother board and the display panel thereof.

The liquid crystal display panel mainly comprises a color filter substrate, an array substrate and a liquid crystal layer between the two substrates. The conventional liquid crystal display panel is formed by stacking a whole array of array substrates and a whole color filter substrate, and sealing the liquid crystal layer therebetween to form a mother of a liquid crystal display panel having a plurality of display panel units. board. Thereafter, the mother board of the liquid crystal display panel is cut to form a plurality of independent liquid crystal display units (display panel chips).

Considering the wide range of applications of liquid crystal displays, there are often different designs. For example, for the same 42-inch liquid crystal display panel, the peripheral area of the liquid crystal display panel having a narrow bezel design is smaller than the peripheral area of the liquid crystal display panel having a wide bezel design. In the prior art, manufacturers of liquid crystal display panels must develop different masks for liquid crystal display panels having the same display area size but different peripheral area sizes, thus producing liquid crystal display panels having the same display area size but different peripheral area sizes. Will greatly increase production costs.

One of the objects of the present invention is to provide a display panel and a method for cutting a motherboard of the display panel to reduce the manufacturing cost and applicability of the display panel.

A preferred embodiment of the present invention provides a display panel including a substrate, a plurality of signal lines, a plurality of first connection pads, a plurality of first connection lines, a plurality of second connection pads, and a plurality of second connection lines, A pair of substrates, a light shielding pattern and an adhesive material. The substrate includes a display area and a peripheral area, the peripheral area is adjacent to the display area, and the peripheral area includes at least one first connection area and at least one second connection area. The signal line is disposed in the display area of the substrate. The first connection pad is disposed in the first connection area. The first connecting line is disposed between the first connecting area and the display area, and the two ends of each of the first connecting lines are electrically connected to the corresponding first connecting pads and the corresponding signal lines. The second connection pad is disposed in the second connection area. The second connecting line is disposed between the first connecting area and the second connecting area, and the two ends of each of the second connecting lines are electrically connected to the corresponding first connecting pads and the corresponding second connecting pads. The opposite substrate is disposed opposite to the substrate. The light shielding pattern is disposed on the opposite substrate, and the light shielding pattern at least partially covers the first connection region of the substrate in a vertical projection direction. The adhesive material is disposed between the substrate and the opposite substrate and surrounds the display area. The display medium layer is disposed between the substrate and the opposite substrate.

Another preferred embodiment of the present invention provides a method of cutting a motherboard of a display panel, comprising the following steps. A motherboard is provided, comprising a substrate, an opposite substrate disposed opposite the substrate, and a display medium layer between the substrate and the opposite substrate. A plurality of first predetermined cutting lines and a plurality of second predetermined cutting lines are defined on the motherboard. The first predetermined cutting lines intersect each other to define at least one first display panel unit predetermined area, and the second predetermined cutting lines intersect each other to define at least one second display panel unit predetermined area, and the first display panel unit predetermined area is smaller than the second The panel unit predetermined area is displayed, and the first display panel unit predetermined area is located within the predetermined area of the second display panel unit. A cutting process is performed to cut the motherboard along one of the first predetermined cutting line and the second predetermined cutting line to form at least one display panel unit.

The cutting method of the present invention is provided with a first connection area and a second connection area on the substrate of the mother board of the display panel, and the substrate and the opposite substrate are cut along the first predetermined cutting line to form a narrow frame (small size) as needed. The first display panel unit is either a second display panel unit that cuts the substrate and the opposite substrate along the second predetermined cutting line to form a wide bezel (large size). Therefore, the method of the present invention can define display panel units having different specifications before using the same photomask on the motherboard of the display panel, and determine the specifications of the display panel unit to be formed during the cutting process. Significantly reduce production costs.

The present invention will be further understood by those of ordinary skill in the art to which the present invention pertains. .

Please refer to Figures 1 to 7. 1 to 7 are schematic views showing a method of cutting a mother board of a display panel according to a first preferred embodiment of the present invention. 1 is a perspective view of a motherboard of a display panel; FIG. 2 is a partial top view of a substrate of a motherboard of the display panel, and in order to highlight the features of the present invention, FIG. 2 does not show the opposite direction. The substrate; FIG. 3 to FIG. 7 are schematic cross-sectional views of the mother board of the display panel taken along line AA′ of FIG. 2 . As shown in Fig. 1, a mother board 10 of a display panel is first provided. The motherboard 10 includes a substrate 20, a pair of substrates 30, and a display medium layer 40. The substrate 20 and the opposite substrate 30 are disposed opposite to each other, and the display medium layer 40 is disposed between the substrate 20 and the opposite substrate 30. In this embodiment, the display panel selects a liquid crystal display panel for illustrative purposes. Therefore, the substrate 20 can be an array substrate of the liquid crystal display panel, and the opposite substrate 30 can be a color filter substrate of the liquid crystal display panel, and the display medium The layer 40 can be a liquid crystal layer, but is not limited thereto. For example, the substrate 20 can also be a substrate with a color filter layer on a color filter on array (COA), a substrate with an array layer on an array on color filter (AOC), or a black matrix. A substrate on a black matrix on array (BOA). Wherein, the liquid crystal material of the liquid crystal layer comprises a negative liquid crystal material, that is, a dielectric constant of less than zero, a positive liquid crystal material, that is, a dielectric constant greater than zero, a blue phase liquid crystal material, a liquid crystal material having optical refraction, a polymerizable liquid crystal material, Or other suitable materials, or a combination of the above. In addition, the cutting method of the mother board of the display panel of the present invention is not limited to application to a liquid crystal display panel, but can be applied to other various types of display panels, such as an organic electroluminescence display panel, an inorganic electroluminescence display panel (for example, : a plasma display panel, a field emission display panel, or other suitable panel), an electrowetting display panel, or an electrophoretic display panel, other suitable panels, or a combination of at least two of the above. The basic structure of the above display panel, that is, the substrate 20, the opposite substrate 30, and the display medium layer 40. The substrate 20 and the opposite substrate 30 are disposed opposite to each other, and the display medium layer 40 is disposed between the substrate 20 and the opposite substrate 30. Wherein at least one of the substrate 20 and the opposite substrate 30 of the display panel is glass, quartz, metal, plastic, enamel, ceramic, other suitable materials, or the above-mentioned flexible, or a combination of at least two of the foregoing . Next, a plurality of first predetermined cutting lines C1 and a plurality of second predetermined cutting lines C2 are defined on the mother board 10. The first predetermined cutting lines C1 intersect each other to define at least one first display panel unit predetermined area DP1, and the second predetermined cutting lines C2 cross each other to define at least one second display panel unit predetermined area DP2. Further, the first display panel unit predetermined area DP1 is smaller than the second display panel unit predetermined area DP2, and the first display panel unit predetermined area DP1 is located within the second display panel unit predetermined area DP2. In other words, in the present embodiment, the area of the first display panel unit predetermined area DP1 is smaller than the second display panel unit predetermined area DP2, and in the subsequent cutting process, if the cutting along the first predetermined cutting line C1 is formed, A liquid crystal display panel with a narrow bezel design, and if cut along the second predetermined cutting line C2, a liquid crystal display panel having a wide bezel design is formed. Alternatively, cutting along one of the first predetermined cutting lines C1 and cutting one of the second predetermined cutting lines C2 forms a design having a partial narrow bezel and another partially wide bezel.

As shown in FIGS. 2 and 3, the substrate 20 includes a display area 20D and a peripheral area 20P. The peripheral area 20P is adjacent to the display area 20D, and the peripheral area 20P includes at least one first connection area 20P1 and at least one second connection area 20P2. In addition, the motherboard 10 of the display panel further includes a plurality of signal lines 21, a plurality of first connection pads 22, a plurality of first connection lines 23, a plurality of second connection pads 24, and a plurality of second connection lines 25 disposed on the substrate. 20 on. The signal line 21 is disposed in the display area 20D of the substrate 20. The first connection pad 22 is disposed in the first connection region 20P1. The first connecting line 23 is disposed between the first connecting area 20P1 and the display area 20D, and the two ends of the first connecting lines 23 are electrically connected to the corresponding first connecting pads 22 and the corresponding signal lines 21 respectively. The second connection pad 24 is disposed in the second connection region 21P2. The second connecting line 25 is disposed between the first connecting portion 21P1 and the second connecting portion 21P2, and the two ends of the second connecting lines 25 are electrically connected to the corresponding first connecting pads 22 and the corresponding second connecting pads 24, respectively. connection. In addition, the motherboard 10 of the display panel further includes a light shielding pattern 32 disposed on the opposite substrate 30 and at least partially covering the first connection region 20P1 and the second connection region 20P2 of the substrate 20 in a vertical projection direction. And an adhesive material 34 is disposed between the substrate 20 and the opposite substrate 30 and surrounds the display area 20D of the substrate 20. In this embodiment, the light shielding pattern 32 is, for example, a black matrix pattern, and the light shielding pattern 32 is in the vertical projection direction and covers the first connection region 20P1 and the second connection region 20P2 of the substrate 20 for shielding the periphery of the display. Light leakage in the area 20P, but not limited to this. In other embodiments, the light shielding pattern 32 may at least partially cover the first connection region 20P1 without covering the second connection region 20P2, or the light shielding pattern 32 may all cover the first connection region 20P1 without covering the second connection region. 20P2, or the light-shielding pattern 32 covers all of the first connection regions 20P1, and covers at least a portion of the second connection region 20P2, or the first connection region 20P1 and a portion of the second connection region of the portion of the light-shielding pattern 32 20P2. The adhesive material 34 is also referred to as a sealant for bonding the substrate 20 and the opposite substrate 30. In the present embodiment, the adhesive material 34 is located between the signal line 21 and the first connection line 23 and spans the first connection line 23.

In this embodiment, the signal line 21 may include a plurality of gate lines GL and a plurality of data lines DL. A part of the first connecting line 23 (for example, the first connecting line 23 on the left side of the second figure) is electrically connected to the gate line GL, thereby being subsequently connected to the first connecting pad 22 or the second connecting pad 24 A flexible circuit board (not shown) or a driving chip (not shown) can provide a gate signal to the gate line GL via the first connection line 23 described above. Another portion of the first connection line 23 (for example, the first connection line 23 located on the lower side of FIG. 2) is electrically connected to the data line DL, thereby being subsequently connected to the first connection pad 22 or the second connection pad 24. A flexible circuit board (not shown) or a driving chip (not shown) can provide a data signal to the data line DL via the first connection line 23 described above. In addition, the signal line 21, the first connection line 23, the first connection pad 22, the second connection line 25 and the second connection pad 24 may be composed of the same or different conductive layers, and each of the above may be a single layer or a multilayer structure. Composition. Furthermore, in the present embodiment, the number of the first connection regions 20P1 is equal to the number of the second connection regions 20P2, as shown in FIG. 2, but is not limited thereto. In addition, in the present embodiment, the first connection area 20P1 and the second connection area 20P2 are disposed in the peripheral area 20P located on both sides of the display area 20D, but are not limited thereto. For example, the first connection region 20P1 and the second connection region 20P2 may also be disposed only in the peripheral region 20P on one side of the display region 20D or in the peripheral region 20P on the three sides of the display region 20D. Or it is disposed in the peripheral area 20P located on the four sides of the display area 20D.

As shown in FIG. 3, in the embodiment, the first predetermined cutting line C1 includes a plurality of first lower predetermined cutting lines C11 and a plurality of first upper predetermined cutting lines C12, and the first lower predetermined cutting line C11 is on the substrate 20. A first lower unit predetermined area DP11 of the first display panel unit predetermined area DP1 is defined, and the first upper predetermined cutting line C12 defines one of the first display panel unit predetermined areas DP1 on the opposite substrate 30. The unit is reserved for the area DP12. The second predetermined cutting line C2 includes a plurality of second lower predetermined cutting lines C21 and a plurality of second upper predetermined cutting lines C22, and the second lower predetermined cutting line C21 defines one of the second display panel unit predetermined areas DP2 on the substrate 20. The second lower unit predetermined area DP21 defines a second upper unit predetermined area DP22 of the second display panel unit predetermined area DP2 on the opposite substrate 30. In the present embodiment, the first lower unit predetermined area DP11 is smaller than the second lower unit predetermined area DP21, and the first lower unit predetermined area DP11 is located within the second lower unit predetermined area DP21, and the first upper unit predetermined area DP12 is smaller than The second upper unit predetermined area DP22, and the second upper unit predetermined area DP12 is located within the second upper unit predetermined area DP22. Further, the first upper unit predetermined area DP12 is smaller than the first lower unit predetermined area DP11, and the first upper unit predetermined area DP12 corresponds to the first lower unit predetermined area DP11 and is covered by the first lower unit predetermined area DP11; the second upper unit The predetermined area DP22 is smaller than the second lower unit predetermined area DP21, and the second upper unit predetermined area DP22 corresponds to the second lower unit predetermined area DP21 and is covered by the second lower unit predetermined area DP21. Furthermore, the first connection region 20P1 is located within the first lower cell predetermined region DP11, and the second connection region 20P2 is located outside the first lower cell predetermined region DP11 and the second lower cell predetermined region DP12.

The method of the present invention may optionally select one of the first predetermined cutting line C1 and the second predetermined cutting line to cut the mother board 10 to form at least one display panel chip. As shown in FIG. 4, if the first display panel unit DPC1 having a narrow bezel design is to be formed, a cutting process is performed to cut the mother board 10 along the first predetermined cutting line C1. The step of cutting the mother board 10 along the first predetermined cutting line C1 includes cutting the substrate 20 along the first lower predetermined cutting line C11, and cutting the opposite substrate 30 along the first upper predetermined cutting line C12, whereby a narrow frame design can be formed. The first display panel unit DPC1. As shown in FIG. 5, after the substrate 20 is cut along the first lower predetermined cutting line C11, the second connection region 20P2 of the substrate 20 is cut away to retain only the first connection region 20P1 of the substrate 20, and along the first After the predetermined cutting line C12 cuts the opposite substrate 30, the opposite substrate 30 exposes the first connection region 20P1, and the light shielding pattern 32 is located at the edge of the opposite substrate 30, and corresponds to the peripheral region 20D of the portion of the substrate 20 to shield Light is leaked and the first connection region 20P1 is exposed. After the cutting process is completed, at least one circuit board 42 such as a flexible printed circuit board (FPC) is disposed in the first connection region 20P1 and the circuit board 42 is electrically connected to the corresponding first connection pad 22, For example, the circuit board 42 is electrically connected to the corresponding first connection pad 22 by using a conductive adhesive 43. In addition, the first display panel unit DPC1 can further include at least one driving chip 44 electrically connected to the circuit board 42 and electrically connected to the first connecting pad 22 through the circuit board 42 , thereby providing the driving signal to the signal line 21 . In this embodiment, the driving wafer 44 can be pressed onto the circuit board 42, that is, the driving chip 44 and the circuit board 42 can form a chip on film (COF), but not limited thereto. For example, the driving chip 44 can also be disposed on another circuit board (not shown) and electrically connected to the circuit board 42 through the circuit board. Alternatively, the driving wafer 44 is press-fitted onto the corresponding first connection pad 22 and electrically connected to the first connection pad 22, and then another circuit board (not shown) is electrically connected to the driving chip 44, and is driven. The wafer 44 is electrically connected to its corresponding signal line 21 (for example, a scan line or a data line). Still alternatively, as shown in Fig. 6, if a second display panel unit DPC2 having a wide bezel design is to be formed, a cutting process is performed to cut the mother board 10 along the second predetermined cutting line C2. The step of cutting the mother board 10 along the second predetermined cutting line C2 includes cutting the substrate 20 along the second lower predetermined cutting line C21, and cutting the opposite substrate 30 along the second upper predetermined cutting line C22, whereby a wide bezel design can be formed. The second display panel unit DPC2. In addition, after forming the second display panel unit DPC2 having a wide bezel design, if a specification change occurs or based on other factors, the substrate 20 may be further cut along the first lower predetermined cutting line C11, and along the first upper predetermined cutting line C12. The opposite substrate 30 is cut to form a first display panel unit DPC1 having a narrow bezel design. As shown in FIG. 7, after the substrate 20 is cut along the second lower predetermined cutting line C21, the first connection region 20P1 and the second connection region 20P2 of the substrate 20 are retained, and are cut along the second upper predetermined cutting line C22. After the opposite substrate 30, the opposite connection substrate 30 exposes the second connection region 20P2, and the light shielding pattern 32 is located at the edge of the opposite substrate 30 and corresponds to the first connection region 20P1 of the substrate 20 to shield the light leakage. After the cutting process is completed, at least one circuit board 42 such as a flexible printed circuit board can be disposed in the second connection region 20P2 and the circuit board 42 is electrically connected to the corresponding second connection pad 24. In addition, the second display panel unit DPC2 can further include at least one driving chip 44 electrically connected to the circuit board 42 and electrically connected to the second connection pad 24 through the circuit board 42 , thereby providing the driving signal to the signal line 21 . In this embodiment, the driving wafer 44 can be pressed onto the circuit board 42, that is, the driving wafer 44 and the circuit board 42 can form a flip chip, but not limited thereto. For example, the driving chip 44 can also be disposed on another circuit board (not shown) and electrically connected to the circuit board 42 through the circuit board. In addition, in a variation of the embodiment, the circuit board 42 can also be disposed in the second connection region 20P2 and the first connection region 20P1, and at the same time electrically connected to the second connection pad 24 and the first connection pad 22. Alternatively, the driving die 44 is press-fitted onto the corresponding second connection pad 24 and electrically connected to the second connection pad 24. Then, another circuit board (not shown) is electrically connected to the driving chip 44, and is driven. The wafer 44 is electrically connected to its corresponding signal line 21 (for example, a scan line or a data line). Or, the driving die 44 is pressed onto the corresponding first connecting pad 22, the circuit board 42 is pressed onto the corresponding second connecting pad 24, and the first connecting pad 22 pressed by the driving die 44 corresponds to The second connection pad 24 is pressed by the circuit board 42 and the second connection pad 24 is connected to the first connection pad 22 through the second connection line 25. Then, the first connection pad 22 is connected to the corresponding first connection line 23, and is electrically connected. Connected to the corresponding signal line 21 (for example: scan line or data line).

Please refer to Figure 7 again. As shown in FIG. 7, after the dicing, the peripheral region 20P of the second display panel unit DPC2 of the present embodiment includes at least one first connection region 20P1, at least one second connection region 20P2, and at least one adhesive material 34. The first connection pad 22 in the first connection region 20P1 is electrically connected to the second connection pad 24 in the second connection region 20P2, and the adhesive material 34 is disposed between the display region 20D and the first connection region 20P1. . The configuration of the peripheral area of the display panel unit of the present embodiment is generated by the selection of the display panel unit having a wide bezel design when the motherboard of the display panel is selected to be formed when cutting. A display panel unit having a narrow bezel design has the same configuration in the display area.

The method of cutting the mother board of the display panel of the present invention and the display panel are not limited to the above embodiments. Hereinafter, the cutting method and the display panel of the mother panel of the display panel according to other preferred embodiments of the present invention will be sequentially described, and in order to facilitate the comparison of the differences of the embodiments and simplify the description, the same is used in the following embodiments. The symbols are labeled with the same elements, and are mainly described for the differences between the embodiments, and the repeated parts are not described again.

Please refer to Figure 8 and Figure 9. 8 and 9 are schematic views showing a method of cutting a mother board of a display panel according to a second preferred embodiment of the present invention, wherein FIG. 8 is a partial top view of the substrate of the motherboard of the display panel, In order to highlight the features of the present invention, FIG. 8 does not show the opposite substrate; FIG. 9 is a cross-sectional view of the mother board of the display panel taken along line B-B' of FIG. As shown in FIG. 8 and FIG. 9, unlike the first preferred embodiment, in the embodiment, the substrate 20 of the motherboard 50 of the display panel has at least one driving circuit integrated on the substrate, which is in this embodiment. Taking the GOA as an example, that is, the peripheral region 20P of the substrate 20 further includes a gate driving circuit region 20G, and the gate driving circuit 26 is integrated into the gate driving circuit region 20G formed on the substrate 20. That is to say, the film layers required for fabricating the components of the driver circuit are the same as those required for the components of the signal lines, the transistors, and the pixel electrodes to be fabricated. The light shielding pattern 32 covers the gate driving circuit region 20G in the vertical projection direction. In other embodiments, other driving circuits may be integrated in any area of the substrate. For example, a source driving circuit (not shown) integrates a source driving circuit region (not shown) fabricated on the substrate 20, and a common voltage control. A circuit (not shown) is integrally formed on the substrate 20, and a common voltage control circuit (not shown) is selectively disposed in the gate driving circuit region 20G or in a region other than the gate driving circuit region 20G. The pulse control circuit (not shown) can be selectively disposed in the gate drive circuit region 20G or in a region other than the gate drive circuit region 20G, other suitable drive circuits, or integration of any of the above two circuits. In this embodiment, since the signal line 21 as the gate line does not need to be electrically connected externally, the gate driving circuit area is selected whether the display panel unit of the narrow bezel design or the display panel unit of the wide bezel design is selected. 20G does not need to be exposed, that is, in the peripheral region 20P provided with the gate driving circuit region 20G, the first predetermined cutting line C1 and the second predetermined cutting line C2 are both defined outside the gate driving circuit region 20G. And the first predetermined cutting line C1 and the second predetermined cutting line C2 may overlap. In addition, the signal line 21 as the data line must be electrically connected externally, so the first predetermined cutting line C1 and the second predetermined cutting line C2 can be defined as taught in the first preferred embodiment, and can be selected as needed. Cutting is performed along the first predetermined cutting line C1 or along the second predetermined cutting line C2.

Please refer to Figure 10 and Figure 11. 10 and 11 are schematic views showing a cutting method of a mother board of a display panel according to a third preferred embodiment of the present invention, wherein FIG. 10 is a partial top view of the substrate of the mother board of the display panel, In order to highlight the features of the present invention, FIG. 10 does not show the opposite substrate; FIG. 11 is a cross-sectional view of the mother board of the display panel taken along line C-C' of FIG. As shown in FIG. 10 and FIG. 11, in the embodiment, another adhesive material 36 may be formed between the substrate 20 of the mother board 60 of the display panel and the opposite substrate 30, and the adhesive material 36 surrounds the display area 20D, and Located between the first connection region 20P1 and the second connection region 20P2 and spanning the second connection line 25. When it is determined that a display panel unit having a wide bezel design is to be made, in order to protect the exposed first connection pad 22, the exposed first connection pad 22 can be reduced to affect the first connection line 23 due to oxidation or corrosion. The electrical performance of the second connecting line 25. Then, the cutting along the first predetermined cutting line C1 to form the display panel unit having the narrow bezel design or the cutting along the second predetermined cutting line C2 may be selected as needed in the first preferred embodiment. A display panel unit with a wide bezel design. Alternatively, cutting along one of the first predetermined cutting lines C1 and cutting one of the second predetermined cutting lines C2 forms a design having a partial narrow bezel and another partially wide bezel.

Please refer to Figure 12. FIG. 12 is a schematic view showing a cutting method of a mother board of a display panel according to a fourth preferred embodiment of the present invention. As shown in FIG. 12, the number of the first connection regions 20P1 of the motherboard 70 of the display panel of the present embodiment is greater than the number of the second connection regions 20P2, and the second connection pads 24 located in the second connection regions 20P2. The number is greater than the number of first connection pads 22 located in each of the first connection regions 20P1. In the present embodiment, the total number of first connection pads 22 located in all of the first connection regions 20P1 will be equal to the total number of second connection pads 24 located in all of the second connection regions 20P2. That is, according to Fig. 12, the second connection pads 24 in a second connection region 20P2 are distributed to the first connection pads 22 in the at least two first connection regions 20P1, that is, a second connection region 20P2. The inner second connecting pad 24 corresponds to the first connecting pad 22 in one of the two first connecting regions 20P1, and the other second connecting pad 24 in the second connecting portion 20P2 corresponds to The first connection pads 22 in the other of the two first connection regions 20P1. However, since the second connection region 20P2 is located outside the peripheral region 20P and has a large wiring space, the number of the second connection regions 20P2 can be reduced to form more second connection pads in each of the second connection regions 20P2. twenty four. In this case, if the second display panel unit of the wide bezel design is selected, the cutting may be performed along the second predetermined cutting line C2 and the circuit board (not shown) may be connected as described in the first preferred embodiment. To the second connection pad 24, the same driving chip (not shown) can be electrically connected to the plurality of second connection pads 24, so that the number of driving chips can be reduced and the cost can be saved. In addition, if the first display panel unit of the narrow bezel design is selected, the cutting may be performed along the first predetermined cutting line C1 and the circuit board (not shown) may be connected to the first connection pad 22 according to, for example, the first preferred embodiment. .

The display medium layer 40 in the above embodiment is preferably located within the area surrounded by the adhesive material 34, that is, the display area 20D. In general, the display medium layer 40 is not formed between the first connection region 20P1 and the second connection region 20P2, that is, the display dielectric layer 40 is not formed in a predetermined region of the adhesive material 34 and a predetermined region of the adhesive material 36. between. Even if the display medium layer 40 is regarded as a residue between the first connection region 20P1 and the second connection region 20P2 described above, it does not have a dielectric layer which can serve as a display function.

In summary, the cutting method of the present invention is provided with a first connection area and a second connection area on the substrate of the motherboard of the display panel, and the substrate and the opposite substrate are cut along the first predetermined cutting line as needed. A first display panel unit having a narrow bezel (small size) or a second display panel unit that cuts the substrate and the opposite substrate along the second predetermined cutting line to form a wide bezel (large size). Therefore, the method of the present invention can define display panel units having different specifications before using the same photomask on the motherboard of the display panel, and determine the specifications of the display panel unit to be formed during the cutting process. Significantly reduce production costs. It should be noted that the cutting method of the present invention is not limited to one of the display panel units in which two kinds of frame widths are formed. For example, if more connection areas are predefined on the substrate, the width of the plurality of frames may also be The desired display panel unit is created as needed in the display panel unit (for example, three frame widths or more). Furthermore, the mother panel on the same display panel is not limited to cutting a plurality of display panel units having peripheral regions of the same size, for example, can be cut along a first predetermined cutting line around a portion of the display panel unit to have a narrow border. a display panel unit designed to cut a display panel unit having a wide bezel design along a second predetermined cutting line around the partial display panel unit, in other words, a peripheral having a different size can be cut on the mother panel of the same display panel The display panel unit of the area.

The above are only the preferred embodiments of the present invention, and all changes and modifications made to the scope of the present invention should be within the scope of the present invention.

10. . . motherboard

20. . . Substrate

20D. . . Display area

20P. . . Surrounding area

20P1. . . First connection area

20P2. . . Second connection zone

twenty one. . . Signal line

twenty two. . . First connection pad

twenty three. . . First connection line

twenty four. . . Second connection pad

25. . . Second connection line

30. . . Counter substrate

32. . . Shading pattern

34. . . Adhesive

36. . . Adhesive

C1. . . First predetermined cutting line

C11‧‧‧First scheduled cutting line

C12‧‧‧First scheduled cutting line

C2‧‧‧second scheduled cutting line

C21‧‧‧Second scheduled cutting line

C22‧‧‧Second scheduled cutting line

DP1‧‧‧First display panel unit reservation area

DP11‧‧‧ first unit reservation area

DP12‧‧‧ first upper unit booking area

DP2‧‧‧second display panel unit reservation area

DP21‧‧‧Second Unit Reservation Area

DP22‧‧‧Second upper unit booking area

GL‧‧‧ gate line

DL‧‧‧ data line

42‧‧‧ boards

44‧‧‧Drive chip

26‧‧‧ gate drive circuit

20G‧‧‧ gate drive circuit area

50‧‧‧ Motherboard

60‧‧‧ mother board

70‧‧‧ Motherboard

1 to 7 are schematic views showing a method of cutting a mother board of a display panel according to a first preferred embodiment of the present invention.

8 and 9 are schematic views showing a method of cutting a mother board of a display panel according to a second preferred embodiment of the present invention.

10 and 11 are schematic views showing a method of cutting a mother board of a display panel according to a third preferred embodiment of the present invention.

FIG. 12 is a schematic view showing a cutting method of a mother board of a display panel according to a fourth preferred embodiment of the present invention.

10‧‧‧ Motherboard

20‧‧‧Substrate

20D‧‧‧ display area

20P‧‧‧ surrounding area

20P1‧‧‧ first connection area

20P2‧‧‧Second connection area

21‧‧‧ Signal Line

22‧‧‧First connection pad

23‧‧‧First connection line

24‧‧‧Second connection pad

25‧‧‧second cable

34‧‧‧Adhesive

C1‧‧‧first scheduled cutting line

C11‧‧‧First scheduled cutting line

C12‧‧‧First scheduled cutting line

C2‧‧‧second scheduled cutting line

C21‧‧‧Second scheduled cutting line

C22‧‧‧Second scheduled cutting line

GL‧‧‧ gate line

DL‧‧‧ data line

Claims (10)

A display panel comprising: a substrate comprising a display area and a peripheral area, the peripheral area adjoining the display area, wherein the peripheral area comprises at least a first connection area and at least a second connection area; a plurality of signal lines, setting In the display area of the substrate; a plurality of first connection pads are disposed in the first connection area; a plurality of first connection lines are disposed between the first connection area and the display area, wherein each of the Two ends of a connecting line are electrically connected to the corresponding first connecting pad and the corresponding signal line; a plurality of second connecting pads are disposed in the second connecting area; and a plurality of second connecting lines are disposed on Between the first connection area and the second connection area, the two ends of each of the second connection lines are electrically connected to the corresponding first connection pads and the corresponding second connection pads respectively; Opposite the substrate; a light shielding pattern disposed on the opposite substrate, wherein the light shielding pattern at least partially covers the at least one first connection region of the substrate in a vertical projection direction; an adhesive material disposed on the Substrate and the Between the substrate and surrounding the display area; and a display medium layer disposed on the substrate and the opposite substrate. The display panel of claim 1, wherein the adhesive material is located between the signal lines and the first connection lines and spans the first connection lines. The display panel of claim 2, further comprising another adhesive material disposed between the substrate and the opposite substrate and surrounding the display area, wherein the other adhesive material is located in the first connection area and the first Between the two connection zones and across the second connection lines. The display panel of claim 1, further comprising at least one circuit board disposed in the first connection area and connected to the corresponding first connection pads. The display panel of claim 1, further comprising at least one circuit board disposed in the second connection area and connected to the corresponding second connection pads. The display panel of claim 1, wherein the peripheral region of the substrate further comprises a gate driving circuit region, and the light shielding pattern covers the gate driving circuit region in a vertical projection direction. The display panel of claim 1, further comprising at least one driving circuit disposed in the first connection area and connected to the corresponding first connection pads. The display panel of claim 1, further comprising at least one driving circuit disposed in the second connection region and connected to the corresponding second connection pads. The display panel of claim 1, wherein the number of the at least one first connection area is equal to the number of the at least one second connection area. The display panel of claim 1, wherein the number of the at least one first connection area is smaller than the number of the at least one second connection area, and the number of the second connection pads located in each of the second connection areas is smaller than The number of the first connection pads located in each of the first connection regions.