(1) 1334319 玖、發明說明 相關申請案之相互參考 本案主張於2002年5月8日提出申請之美國專 時申請案60/378，693號案、2002年12月4日提出 之60/430，677號案及2002年12月23日提出申 60/43 5，278號案，所有這些專利案皆在此援引爲本 參考。 【發明所屬之技術領域】 本發明係關於利用電漿觸媒以點火、調整及維持 於氣體之電漿的方法及裝置。 【先前技術】 已知一電漿可以藉由使一氣體受到足量的微波輻 加以點火。然而，在氣體壓力大致小於大氣壓力的情 ，電漿點火通常較爲容易。然而，用以降低氣體壓力 空設備相當昂貴，並且緩慢而耗費能量。再者，此類 之使用會限制製造的彈性。 【發明內容】 在此提供用於點火、調整及維持一電漿之電漿觸 該電漿觸媒可爲被動型或主動型。依照本發明，一被 電漿觸媒可包括任何能夠藉由改變一局部電場（例如 電磁場）而引致產生一電漿之任何物體，其不需要添 利臨 [―f~i S-fe 甲δΡ3 請之 案之 來自 射來 況下 之真 設備 媒。 動型 5 —— 加額 -4 - (2) (2)1334319 外的能量。另一方面’ 一主動型電漿觸媒可包括在電磁輻 射存在的情況下能夠傳送足夠能量給一氣態原子或分子以 自該氣態原子或分子移除至少一電子的任何顆粒或高能量 波封包。在上述兩例中，一電漿觸媒可以改善或解除用以 點火一電漿之環境條件。 在此亦提供形成一電漿之方法及裝置。依照本發明之 一實施例中’該方法包包括使一氣體流入至一多重模式處 理凹室中，且在至少一被動型電漿觸媒存在的情況下，藉 由使一位在該凹室中之氣體受到具有小於約3 3 3 GHz之頻 率的電磁波照射來點火該電漿，其中該被動型電漿觸媒包 含一至少爲半導電性之材料。 在本發明之另一實施例中亦提供用於點火一電漿之方 法及裝置，其係藉由在一包含一粉末之電漿觸媒存在的情 況下，使一氣體受到具有小於約3 3 3 GHz之頻率的電磁波 照射而達成。 在本發明又另一實施例中係提供利用一雙凹室系統來 形成一電漿之另外的方法及裝置。該系統可包括彼此流體 連通之一第一點火凹室及一第二凹室。該方法包括：（i)使 第一點火凹室中之一氣體受到具有小於約3 3 3 GHz之頻率 的電磁輻射照射，使得在第一凹室中之電漿會造成在該第 二凹室中形成一電漿；及（ii)藉由使該第二電漿受到其他電 磁輻射照射來維持第二凹室中之第二電漿。 本發明亦提供其他的電漿觸媒及用以點火、調整及維 持一電獎之方法及裝置。 (3) (3)1334319 【實施方式】 本發明係關於用於點火、調整及維持用於各種不同應 用之電漿的方法及裝置，其中該等應用包括熱處理、人工 合成及沉積碳化物、氮化物、硼化物、氧化物及其他物質 、摻雜、滲碳 '氮化及碳氮化、燒結、多部件處理、連結 、去結晶化、製造及運作火爐 '廢氣處理、廢棄物處理、 焚化、刮除 '灰化、成長碳結構、產生氫氣及其他氣體、 形成無電極電漿噴射流、在生產線上之電漿處理、殺菌、 淸潔等等。 本發明亦可用於可控制地產生熱及用於電漿輔助處理 ，以降低能量成本及增加熱處理效率及電漿輔助式製造彈 性。 因此，在此提供一種用於點火、調變及維持一電漿之 電漿觸媒。該觸媒可以爲被動型或主動型。一被動型電漿 觸媒包括能夠依照本發明藉由轉變一局部電場（例如，一 電磁場）引致產生一電漿之任何物體，而毋需透過該觸媒 來添加額外的能量，諸如藉由施加一電壓來產生一火花。 在另一方面，一主動型電漿觸媒亦可以爲任何能夠在電磁 輻射存在的情況下傳輸足量的能量至一氣態原子或離子以 自該氣態原子或分子移除至少一電子之粒子或高能量波封 包。 本案申請人共同擁有且同時申請之美國專利申請案的 全文援引爲本案之參考：美國專利申請案第 10/_，_號（代理人檔案編號1 8 3 7.0008)、美國專利 (4) (4)1334319 申請案第10/_，_號（代理人檔案編號1 8 3 7.0009)、 美國專利申請案第1〇/_，_號（代理人檔案編號 1 8 3 7.00 1 0) '美國專利申請案第10/_，_號（代理人 檜案編號1 8 3 7.00 1 1 )、美國專利申請案第 10/_，_號（代理人檔案編號1 83 7.00 1 2)、美國專利 申請案第10/_，_號（代理人檔案編號U3 7.00 1 3 )、 美國專利申請案第1〇/_，_號（代理人檔案編號 1837.0015)、美國專利申請案第10/_，_號（代理人 檔案編號1 837.00 1 6)、美國專利申請案第 10/_，_號（代理人檔案編號1 83 7.00 1 7)、美國專利 申請案第10/_，_號（代理人檔案編號1 83 7.00 18)、 美國專利申請案第10/_，_號（代理人檔案編號 1 8 3 7.0020)、美國專利申請案第10/_，___號（代理人 檔案編號1837.0021)、美國專利申請案第 10/_，_號（代理人檔案編號1 8 3 7.002 3 )、美國專利 申請案第10/_，_號（代理人檔案編號1 8 3 7.0024)、 美國專利申請案第10/_，_號（代理人檔案編號 1 83 7.0025)、美國專利申請案第10/_，_號（代理人 檔案編號1 8 3 7.0026)、美國專利申請案第 10/_，_號（代理人檔案編號1 8 3 7.002 7)、美國專利 申請案第10/_，_號（代理人檔案編號1 837.0028)、 美國專利申請案第10/_，_號（代理人檔案編號 1837.0030)、美國專利申請案第10/_，_號（代理人 檔案編號1 83 7.003 2)及美國專利申請案第 (5) (5)1334319 10/_’ _號（代理人檔案編號183 7.003 3 )。 闡述電漿系統 圖1顯示依照本發明之一態樣之示例性電漿系統1 0 。在此實施例中，凹室12形成在一容器中，該容器定位 在輻射腔室（亦即，施加器）14。在另一實施例中（未圖示） ，容器12與輻射腔室14爲相同，藉此便可避免需要兩個 獨立的元件。形成有凹室12之容器可包括一個或多個輻 射穿透性絕緣層，以增進其熱絕緣特性但不會明顯地屏蔽 該凹室1 2照射輻射。 在一實施例中，凹室12形成在一由陶材所製成之容 器中。由於依照本發明可達成極高的溫度，因此可採用能 夠在3 00 0 °F溫度下操作之陶材。該陶材可包括重量百分 比 2 8 · 9 %的矽土 ' 6 8.2 %的礬土 ' 0.4 %的氧化鐵、1 %的二 氧化鈦'〇.〗％的石灰、0.1%的氧化鎂、0.4%的鹼，此材 料由美國賓州 New Castle 郡之 New Castle Refractories 公 司以LW-30之型號販售。然而，對於此技藝有普通瞭解 之人士應可瞭解，其他材料，諸如石英，以及不同於上述 之諸多材料都可使用於本發明中。 在一成功的實驗中，電漿形成在一部分打開的凹室中 ，該凹室位在一第一方塊內部並以一第二方塊加以蓋頂。 該凹室具有約2英吋乘以約2英吋乘以約1.5英吋之尺寸 。在該方塊中亦設有至少兩個開孔，以與該凹室相連通： 其中一開孔用以觀看該電漿，且至少一開孔用於提供氣體 -8- (6) (6)1334319 。凹室之尺寸可取決於所欲執行之合適電漿製程而定。再 者，該凹室亦應至少構形爲可防止電漿溢出/飄流出主要 處理區域* 凹室12藉由可由電源28供電之管路20及控制閥22 而連接至一個或多個氣體源24(例如，氬氣、氮氣、氦氣 、氖氣、氪氣供應源）。管路20可以爲管體（例如，介於 約1 /1 6英吋及約1 /4英吋之間，諸如約1 /8英吋）。再者 ，若有需要，可將一真空泵連接至腔室以移除在電漿製程 期間產生之煙氣。在一實施例中，氣體可經由在一多部件 式容器中之一個或多個間隙而流入及/或流出凹室1 2。藉 此，相符於本發明之氣體孔口便不一定需要爲特定之開孔 ，而是可以具有其他型式，諸如許多細小的分散開孔。 一輻射洩漏偵測器（未圖示）安裝在供應源26及波導 3 0附近，並且連接至一安全互鎖系統，俾當偵測到一洩 漏量高於一預定安全限制値（諸如FCC及/或OSHA(例如 ，5mW/cm2))時，可自動關閉該輻射（例如，微波）電源。 可由電源供應器28供電之輻射源26係經由一個或多 個波導30而將輻射能量直接導入至輻射腔室14中。對於 此技藝有普通瞭解之人士應可明白，輻射源26可直接連 接至凹室12，藉此避免該波導30。進入至凹室12中之輻 射能量係用以在該凹室中點火一電漿。此電漿可藉由耦接 具有觸媒之額外輻射而大致被維持且限制在該凹室。再者 ，一般相信輻射（例如，微波輻射）之頻率在許多應用中並 非重要。 -9- (7) (7)1334319 可經由循環器32及調整器34(例如，3段式調整器） 來供應輻射能量。調整器3 4可用以避免反射功率爲改變 點火或製程條件之函數，尤其係在電漿已形成之後，因爲 例如微波功率會由電漿所強力地吸收。 如以下將更爲詳細說明者，若腔室14支援多重模式 ，則在輻射腔室14中之輻射穿透型凹室12並非重要，尤 其當該等模式係連續或週期性地混合時。亦如以下將更爲 詳細說明者，馬達3 6可連接至模式混合器3 8，以製造出 大致均勻輸出該腔室14之時間平均的輻射能量分佈。再 者，窗口 40(例如，一石英窗口）可配置在該腔室14相鄰 於該凹室12之一壁體，俾使溫度感應器42(例如，一光 學高溫計）可用以觀測到凹室1 2內部之製程。在一實施例 中，該光學高溫計輸出値可自零伏特隨著溫度上升而增加 至追蹤範圍。 感應器42可形成輸出信號爲溫度或與一位在凹室12 中之工件（未圖示）有關之任何其他可監視條件的函數，並 且提供信號至控制器44。亦可使用雙溫度感測及加熱， 以及自動冷卻速率及氣流控制。控制器44接著便可用以 控制電源供應器2 8之操作，該電源供應器如上述具有一 輸出連接至輻射源26以及另一輸出連接至控制閥22，以 控制氣體流入至凹室1 2。 本發明在實務上已可同樣成功地採用由通訊及動力工 業（CPI)所提供之915MHz及2.45GHz的微波供應源，雖 然亦可採用具有任何小於 3 3 3 GHz頻率之輻射。該 -10- (8) (8)1334319 2.45GHz系統可提供自約0.5仟瓦至約5.0仟瓦之連續可 變微波功率。一 3段式調整器可針對最大功率傳輸提供阻 抗匹配，且一雙向耦合器係用以測量正向及反射功率。再 者，光學高溫計係用以遠距感測樣本溫度。 如上所述，本發明可採用具有任何頻率小於3 3 3 G Η z 之輻射。舉例來說，可以採用頻率，諸如電源線頻率（約 50Hz至約60Hz)，然而用以形成電漿之氣體壓力可能需要 降低以輔助點火。再者，本發明亦可採用任可射頻或微波 頻率，包括大於1〇〇 kHz之頻率。在大部分的例子中，用 於此類較高頻率之氣體壓力並不一定要降低以點火、調整 或維持一電漿，藉此可使許多電漿製程在大氣壓力或以上 之壓力下來進行。 該設備由電腦使用LabView 6i軟體所控制，該軟體 可以提供即時溫度監視及微波功率控制。藉由使用適當數 量資料點的移動平均數可降低雜訊。再者，爲增進速度及 計算效率，在緩衝陣列中所儲存的資料點數量可利用位移 暫存器及緩衝器縮放來加以限制。 該高溫計測量大約1平方公分的感應面積的溫度，其 用以計算一平均溫度。該高溫計感測兩波長之輻射強度， 且利用普朗克定律（Planck’s law)插入這些強度値來測定 溫度。然而，應瞭解，在本發明中亦可使用其他裝置及方 法來監視及控制溫度。在本發明中可以使用之控制軟體係 揭露在例如本案申請人共同擁有的美國專利申請案 10/_，_(代理人檔案編號爲1837.0033)，該案全文 -11 - (9) (9)1334319 內容援引爲本案之參考。 腔室14具有數個玻璃覆蓋之觀看孔口及輻射屏蔽以 及一用以使高溫計進入之石英窗口。亦提供有用以連接至 一真空泵之數個孔口以及一氣體源，然而這並不一定需要 使用。 系統10亦包括一封閉迴路去離子水冷卻系統（未圖示 )，以及一藉由自來水冷卻之外部熱交換器。在操作期間 ，該去離子水係先冷卻磁電管，然後在轉儲於循環器中（ 用以保護該磁電管），且最後該輻射腔室通過焊接在腔室 外表面上之水通道。 電漿觸媒 依照本發明之一電漿觸媒可包括一或多種不同材料， 且亦可爲主動型或被動型。除此之外，可利用電漿觸媒來 點火、調整及/或維持於一氣體壓力，該氣體壓力係小於 、等於或大於大氣壓力。 一種形成依照本發明之電漿的方法可包括使位在一凹 室中之氣體在被動型電漿觸媒存在的情況下受到電磁輻射 照射，該電磁輻射具有小於約333GHz的頻率。依照本發 明之被動型電漿觸媒可包括任何能夠藉由依照本發明將一 局部電場（例如，一電磁場）轉變而引致產生一電漿之物體 ，而不需要藉由觸媒來增添額外的能量，諸如藉由供應一 電壓以產生一火花。 依照本發明之一被動型電漿觸媒亦可以爲一奈米顆粒 -12- (10) (10)1334319 或奈米管。在此所用之”奈米顆粒”一詞係指任何具有小於 約1 00奈米之最大物理維度且至少爲半導電性之顆粒。再 者，依照本發明，單壁式及多壁式且經摻雜或未經摻雜之 碳奈米管，由於其極佳的導電性及長形的形狀，因此特別 適用於點火電漿。該奈米管可具有任何習知的長度，且可 以爲一固定至一基板之粉末。若爲固定式，則在點火或維 持該電漿時，該奈米管可以在基板表面上任意定向或固定 至該基板（例如，以某預定方向）。 依照本發明，一被動型電漿觸媒亦可以爲粉末，且不 需要包含奈米潭粒或奈米管。例如，其可以由纖維、塵粒 、碎片或薄片等所形成。當爲粉末型式時，該觸媒可以至 少暫時地懸浮在氣體中。藉由使粉末懸浮在氣體中，該粉 末可以快速地散佈於整個凹室且若有需要，其可更容易被 消耗。 在一實施例中，該粉末觸媒可被攜入至凹室中，且至 少暫時地懸浮於一承載氣體中。再者，在被導入至凹室之 前，該粉末可被添加至氣體中。舉例來說，如圖1A所示 ，輻射源5 2可供應輻射至輻射凹室5 5，於其中設置有電 漿凹室60。粉末源65將觸媒粉末70提供至氣體75中。 在另一實施例中，粉末70可以塊狀（例如，一積塊）先添 加至凹室60，然後以數種方法散佈在凹室中，包括使一 氣體流經或通過該塊狀粉末。此外，粉末可藉由移動、輸 送、滴落、噴霧、吸拂或其他方式將粉末饋進或饋入該凹 室，俾添加至氣體中以點火、調整或維持一電漿。 -13- (11) (11)1334319 在一實驗中，藉由將一碳纖維粉末積塊放置在一伸入 至凹室之銅管中，而在凹室中點火一電漿。雖然將足量輻 射導入至凹室中，然而該銅管可屏蔽粉末受到輻照，且不 會發生電漿點火。然而，一旦承載氣體開始流經該管體， 將粉末迫出管體而進入至凹室，藉此可使粉末受到輻照， 電漿在凹室中便可被幾乎瞬間點火。 依照本發明之一粉末電漿觸媒可爲實質不可燃的，藉 此便可不需要包含氧氣或在氧氣存在下燃燒。如此一來， 如上所述，該觸媒可包括一金屬、碳、碳基合金、碳基複 合物、導電性聚合物、導電性矽酮橡膠、聚合奈米複合物 、有機-無機複合物及其任何組合。 再者，粉末觸媒可實質散佈在電漿凹室中（例如，當 懸浮在一氣體中），且在凹室中可以精確地控制電漿點火 。在某些應用中，均勻點火相當重要，包括那些需要簡單 電漿爆炸之應用，諸如以一個或多個爆炸之型式。再者， 粉末觸媒需要一特定的時間來將其散佈於一凹室，尤其在 複雜、多腔室凹室中。因此，依照本發明另一態樣，一粉 末觸媒可經由複數個點火口而被導入至凹室中，俾能夠更 快速地獲得更均勻的觸媒分佈（參照下文）。 除了粉末以外，舉例來說，依照本發明之一被動型電 漿觸媒可包括譬如一個或多個微觀或巨觀纖維 '薄片、針 體、細線、線束、纖管束、棉、麻線、刨片、屑片、織物 、帶體、細絲或其任意組合。在這些例子中，該電漿觸媒 可具有至少一部分，該部分之實體尺寸可實質大於其他實 -14- (12) (12)1334319 體尺寸。舉例來說，在至少兩正交尺寸之間的比率應至少 約爲1:2，但亦可大於約1:5或甚至大於約1:1〇。 因此，一被動型電漿觸媒可包括至少一材料部分，該 部分相較於其長度而言係相當薄。亦可採用一束狀觸媒（ 例如，纖維），且舉例來說可包括一石墨帶之片段。在― 實驗中，可成功地採用具有大約三萬束石墨纖維（每一束 具有約2-3微米直徑）之片段。纖維之數量以及束體之長 度對於點火、調整或維持該電漿並不重要。舉例來說，使 用大約四分之一英吋長之石墨帶片段可以得到令人滿意的 結果。依照本發明可成功使用一種碳纖維，其係由美國南 卡洲之安德森市的 Hexcel公司以 Magnamite®之商標所 販售之型號爲AS4C-GP3K的產品。再者，亦有成功地使 用矽·碳纖維。 依照本發明另一態樣之被動型電漿觸媒可包括一個或 多個部分，其舉例來說可大致爲球形、環圈狀、角錐形、 立方形、扁平狀、圓柱形、矩形或長形。 上述揭露之被動型電漿觸媒包括至少一材料，該材料 至少爲半導電性材料。在一實施例中，該材料可具有高導 電性。舉例來說，依照本發明之被動型電漿觸媒可包括一 金屬、無機材料、碳、碳基合金、碳基複合物、導電性聚 合體、導電性矽酮橡膠、聚合奈米複合物、有機-無機複 合物或其任意組合。某些可被包括在電漿觸媒中之可用的 無機材料包括碳、碳化矽、鉬、鉑、鎢、氮化碳及鋁，雖 然一般相信其他導電性無機材料亦可具有良好功效。 -15- (13) (13)1334319 除了 一或多種導電性材料以外，依照本發明之一種被 動型電漿觸媒可包括一或多種添加劑（其不一定要具有導 電性）。在此所用之添加劑一詞可包括使用者所欲添加至 電漿中之任何材料。舉例來說，在摻雜半導體或其他材料 時，可經由觸媒來添加一種或多種摻雜劑。例如，參考本 案申請人共同擁有且同時申請之美國專利申請案第 10/_’ _號（代理人檔案編號1 83 7.0026)，該案全文 內容援引爲本案之參考。該觸媒可包括摻雜劑本身，或其 可包括一預成體材料，該預成體材料在分解之後可以形成 摻雜劑。因此，該電漿觸媒可依照任何所需之比率而包括 一或多種添加劑及一或多種導電性材料，此取決於最終所 想要的電漿成份及利用該電漿之製程。 被動型電漿觸媒中之導電性成份與添加劑之比率在消 耗的同時會隨時間改變。舉例來說，在點火期間，該電漿 觸媒可能有需要包括一較大比例的導電性成份以改善點火 狀態。另一方面，若在維持電漿時使用，則該觸媒可包括 較大比例的添加劑。對於此技藝有普通瞭解之人士應可瞭 解，用以點火及維持電漿之電漿觸媒的成份比例可以相同 〇 一預設之比率輪廓分佈可用以簡化許多電漿製程。在 許多習知的電漿製程中，在電漿中之成份可視需要來添加 ，但此類添加通常需要可程式設備依照預定的排程來添加 。然而，依照本發明，可以改變觸媒中之成份比率’並藉 以使電漿本身中之成份比率可以自動改變。換言之’在任 -16- (14) (14)1334319 何特定時間中，在電漿中之成份比率可取決於觸媒的那一 個部分現在正由電漿所消耗。因此，在觸媒中之不同部位 的觸媒成份比率可以不同。且，在一電漿中之現行成份比 率可視該觸媒那一個部分及/或先前所消耗之部分而定， 尤其當一通過電漿腔室之氣體的流動比率較爲緩慢時。 依照本發明之一被動式電漿觸媒可以爲均質的、非均 質的或分級的。再者，在整個觸媒中，該電漿觸媒成份比 率可以連續或非連續地改變。舉例來說，在圖2中，該比 率可以平緩地改變以構成一沿著觸媒1 00之長度的梯度。 觸媒100可包括一束材料，其在片段105包括較低濃度之 成份以及一朝向片段110而連續遞增的濃度。 或者，如圖3所示，該比率可以在每一觸媒120中呈 不連續變化，其包括例如具有不同濃度之交錯部分1 2 5及 130。應瞭解，該觸媒120可具有兩個以上的部分類型。 因此’由電漿所消耗之觸媒成分比率能以任何預定型式改 變。在一實施例中，當電漿被監視且偵測到一特定添加劑 時，便可自動開始進行或結束進一步的製程處理。 改變在一維持電漿中之成分比率的另一方法係藉由在 不同時間或以不同比率導入多種具有不同成分比率之觸媒 。舉例來說，可種多種觸媒導入凹室中大致相同或不同的 部位。當導入不同部位時，形成在凹室中之電漿可具有由 不同觸媒之部位所決定之成分濃度梯度。因此，一自動化 系統可包括一裝置，俾藉以在點火、調整及/或維持電漿 之前及/或期間來機械式地置入可消耗的電漿觸媒。 -17- (15) (15)1334319 依照本發明之一被動型電漿觸媒亦可加以塗覆。在一 實施例中’一觸媒可包括一大致上非導電性之塗覆物沉積 在一大致爲導電性材料之表面上。或者，該觸媒可包括一 大致爲導電性之塗覆物沉積在一大致非導電性材料之表面 上。舉例來說，圖4及5顯示纖維140，其包括底層145 及塗覆物150。在一實施例中，一電漿觸媒包括一塗覆鎳 之碳核心，以防止碳氧化。 一單一電漿觸媒亦可包括多種塗覆物。若該塗覆物在 與觸媒相接觸期間被消耗，則該塗覆物可依序自外部塗覆 物至最內層塗覆物而被導入至觸媒中，藉此產生一時間解 除機制。因此，一經塗覆之電漿觸媒可包括任意數量的材 料，只要該觸媒之一部分爲至少半導電性。 依照本發明之另一實施例，一電漿觸媒係整體定位在 一輻射凹室中，以大致減少或防止輻射能量洩漏。在此方 式中，該電漿觸媒不會電性地或磁性地耦合該容納凹室之 容器或者與凹室外面之任何導電性物體相耦合。這可以防 止在點火孔產生火花，且若電漿被維持時，這可防止輻射 在點火期間或稍後滲洩至凹室外面。在一實施例中，該觸 媒可定位在一延伸通過一點火孔之大致非導電性延長件之 末梢。 舉例來說，圖6顯示於其中設置電漿凹室165之輻射 腔室160。電漿觸媒170呈長形且延伸通過該點火孔175 。如圖7所示，依照本發明，觸媒170可包括導電性遠端 部分180(其放置在腔室160中）及非導電性部分185(其大 -18- (16) (16)1334319 致放置在腔室160外面）。此一構形可以防止在遠端部分 180及腔室160之間的電氣連接（例如，產生火花）。 在另一實施例中，如圖8所示，該觸媒可以由複數個 導電性區段1 90所形成，其中該等區段係由複數個非導電 性區段195所隔開並且機械式地與其相連接。在此一實施 例中，該觸媒可以延伸通過介於一位在凹室內部之點與一 位在凹室外面之點之間的點火孔，但該電性不連續造型可 大大地防止火花及能量洩漏。 依照本發明之另一種形成一觸媒的方法包括使一位在 一凹室中之氣體在一主動型電漿觸媒存在的情況下受到具 有頻率小於約3 3 3 GHz之電磁輻射照射，其中該電漿觸媒 可產生或包括至少一離子化顆粒。 依照本發明之一主動型電漿觸媒可以爲任何顆粒或高 能波封包’其能夠在電磁輻射存在的情況下來傳輸足量的 能量給一氣態原子或分子，以自氣態原子或分子移除至少 —電子。視供應源而定，離子化顆粒能以一聚合或準直束 之型式被導入至凹室中’其者其能以噴灑、噴射、噴濺或 其他方式導入。 舉例來說，圖9顯示可將輻射導入至輻射腔室205中 之輻射源200。電漿凹室210係定位在腔室205內部，且 可允許一氣流經由孔口 2 1 5及2 1 6而流經其間。供應源 220將離子化顆粒225導入至凹室210中。舉例來說，供 應源220可以藉由一金屬篩網所保護，其可以讓離子化顆 粒通過’但可屏蔽供應源2 2 0受到輻照。若有需要，供應 -19- (17) (17)1334319 源2 2 0可以爲水冷式。 依照本發明之離子化顆粒之實例包括X射線顆粒、伽 瑪（gamma)射線顆粒、阿爾法（alpha)顆粒、貝塔（beta)顆 粒、中子、質子及其任意組合。因此，一離子化顆粒觸媒 可以帶電荷（例如，來自於一離子供應源之離子）或不帶電 荷，且可以爲放射性核分裂反應的產物。在一實施例中， 於其中形成電漿凹室之容器可以完全地或部分地穿透至離 子化顆粒觸媒。因此，當一放射性核分裂源定位在凹室外 面時，該供應源可導引核分裂產物通過容器以點火該電漿 。放射性核分裂源可定位在輻射腔室內部，以實質地防止 核分裂產物（亦即，離子化顆粒觸媒）發生安全性危害。 在另一實施例中，該離子化顆粒可以爲一自由電子， 但其並不一定要在一放射性衰減反應中發出。舉例來說， 該電子可藉由供能該電子源（諸如一金屬）而被導入至凹室 中，使得具有足夠能量之電子可以脫離該供應源。該電子 源可定位在凹室內部、與凹室相鄰或甚至定位在凹室壁體 中。對於此技藝有普通瞭解之人士應可明瞭，本發明亦可 採用電子供應源的任意組合。一種普遍用以產生電子的方 式爲加熱一金屬，且這些電子可藉由供應一電場而被進一 步加速。 除了電子以外，自由能質子亦可用以觸發一電漿。在 —實施例中，一自由質子可以藉由解離氫氣而產生，且視 情況需要，可以藉由一電場加速之。 依照本發明之主動型及被動型觸媒之一優點在於，其 -20- (18) (18)1334319 能以一種大致連續方式來觸發一電漿。舉例來說，一點火 裝置僅能在一火花存在時才可觸發一電漿。然而，一火花 通常係藉由供應一電壓通過兩電極而產生。一般而言，火 花係週期性產生且由未產生火花之週期所隔開。在這些非 點火週期期間，一電漿不會被觸發。再者，舉例來說，點 火裝置通常需要電能來運作，然而依照本發明之主動型及 被動型電漿觸媒並不需要電能來運作。 多重模式輻射凹室 一輻射波導、凹室或腔室可設計成能夠支援或促進至 少一電磁輻射模式之傳播。在此所用之”模式”一詞係指滿 足馬克士威爾方程式及可實行之邊界條件（例如，凹室之 邊界條件）之任何固定或傳播電磁波的特定樣式。在一波 導或凹室中，該模式可以爲傳播或固定電磁場之各種可行 樣式的任何一種。每一模式之特徵在於電場之頻率及極性 及/或磁場向量。一模式之電磁場樣式取決於頻率、折射 率或介電常數以及波導或凹室的幾何形狀。 —橫向電場（TE)模式係一種其電場向量垂直於傳播方 向之模式。類似地，一橫向磁場（TM)模式係一種其磁場向 量垂直於傳播方向之模式。一橫向電場及磁場（TEM)模式 係一種其電場及磁場向量皆垂直於傳播方向之模式。一中 空金屬波導通常並不支援一輻射傳播之垂直TEM模式。 即使輻射出現而沿著波導長度移動，其亦僅能以某些角度 由波導之內壁反射離開。然而’取決於傳播模式’該輻射 -21 - (19) 1334319 (例如，微波）可具有沿著波導之軸的某些電場分量或 磁場分量（通常稱之爲Z軸）。 在一凹室或波導內部的實際場分佈係內部模式的 。每一模式可藉由一個或多個下標符號（例如，TE , 〇 ee one zero”）。該下標符號通常會列出在波導波長上 及y方向上包含多少個”半波”。熟習此項技術之人士 瞭解，波導波長與自由空間波長不同，因爲在波導內 輻射傳播係以某角度由波導內壁所反射。在某些例子 可添加一第三下標符號，以定義出有多少個沿著z軸 立波模式。 針對一給定的輻射頻率，可選擇波導之尺寸，以 小到以使其支援一單一傳播模式。在此例中，該系統 之爲單模式系統（亦即，單模式施加器）。在一矩形單 式波導中，該TE1C模式通常佔大多數。 隨著波導（或波導所連接之凹室）之尺寸的增加， 導或施加器有時可支援構成一多模式系統之額外較高 式。當許多模式被同時支援時，該系統通常可稱爲較 模式化。 一簡單、單一模式系統具有一場分佈，其包括至 最大及/或最小値。一最大値主要取決於供應至系統 射量。因此，一單一模式的場分佈會有劇烈變化且大 不均勻。 不像一單一模式凹室，一多重模式凹室可同時支 種傳播模式，當該等模式重疊時，會造成一複雜的場 某些 重疊 (“tee 在X 應可 部的 中， 之直 使其 可稱 一模 該波 階模 高階 少一 的輻 致爲 援數 域分 -22- (20) 1334319 佈樣式。在此一樣式中’場域傾向於在空間上模 此該場域分佈通常不會在凹室中顯示相同類型的 大場域値。此外，如以下將更完全地說明，一模 可用以”激發”或》重新分佈”模式（例如，藉由一 器之機械式運動）。此一重新分佈可在凹室中適 一更爲均勻的時間平均場域重新分佈。 依照本發明之一多重模式凹室可支援至少兩 可支援多於兩種模式。每一模式具有一極大的電 雖然可以有兩種或以上之模式，其中一模式爲主 具有比另一模式還大之最大電場向量値。如在此 多重模式凹室可以爲任何凹室，其中在第一及第 値之間的比率係小於約1:1 〇 ’或小於約1:5，或 約1:2。對於此技藝有普通瞭解之人士應可明白 愈小，則會愈加分佈多種模式之間的電場能量， 室中會愈加分佈輻射能量。 在一處理凹室中之電漿分佈可主要取決於所 之分佈。舉例來說，在一純粹單一模式系統中， 具有一單一位置的電場爲最大値。因此，一強大 能形成在該單一位置上。在許多應用中’此一強 漿會不當地導致不均勻的電漿處理或加熱（亦即 過度加熱及加熱不足）° 依照本發明，不論採用一單一或多重模式凹 本技藝有普通瞭解之人士應可明白，於其中形成 室可以完全封閉或部分打開。舉例來說’在某些 糊，且因 極小及極 式混合器 輻射反射 當地提供 模式，且 場向量。 要模式且 所用，一 二模式量 甚至小於 ，該比率 進而在凹 供應輻射 其可能僅 電漿僅可 大局部電 ，局部性 室，對於 電漿之凹 應用中， -23- (21) (21)1334319 諸如電漿輔助式鍋爐，該凹室可被完全封閉。舉例來說， 參考本案申請人共同擁有且同時申請之美國專利申請案第 10/_，_號（代理人檔案編號1837.0020)，該案全文 內容援引爲本案之參考。然而，在其他應用中，吾人可能 希望氣體流經該凹室，且因此該凹室必須打開至某一程度 。在此方式中，流動之氣體的流量、類型及壓力可隨時間 而改變。如此作法可能相當恰當，因爲某些氣體可以促進 電漿形成，諸如氬氣，其係較容易被點火，怛在後續電漿 處理期間不能並不需要。 模式混合 對許多應用而Η，吾人需要一內含均句電榮之凹室。 然而，由於微波輻射可能具有較長之波長（例如，幾十分 之一公分），因此可能難以達成一均勻的分佈。因此，依 照本發明之一樣態，在多重模式凹室中之輻射模式在經過 一段時間後可加以混合或重新分佈。由於在凹室中之場域 分佈必須滿足所有由凹室內表面（若爲金屬）所設定之邊界 條件，這些場域分佈可以藉由改變內表面之任何部分之位 置來加以改變。 在依照本發明之一實施例中，一可移動反射表面可以 定位在輻射凹室內部。當組合時，反射性表面之形狀及運 動在運動期間會改變凹室之內表面。例如，當繞任何軸線 轉動時，一”L”形金屬物件（亦即，”模式混合器”）將改變 凹室中之反射性表面之位置或方向，且因此改變其中之輻 -24- (22) (22)1334319 射分佈。亦可採用任何其他非對稱性形狀之物件（當轉動 時），但對稱性形狀物件亦可具有功效，只要相對運動（例 如轉動、平移或兩者之組合）會對反射性表面之位置或方 向造成某些改變即可。在一實施例中，一模式混合器可以 爲一圓柱體，其可以繞著一非爲該圓柱體縱軸之軸線來轉 動。 多重模式之每一模式具有至少一最大電場向量，但這 些向量都可以在整個凹室之內部尺寸上週期性發生。通常 ，這些最大値爲固定的，假設輻射之頻率不會改變。然而 ，藉由移動一模式混合器使其與輻射相互作用，吾人便可 以移動該最大値之位置。例如，模式混合器3 8可用以最 佳化凹室1 4中之場域分佈，使得電漿點火條件及/或電漿 維持條件得以最佳化。因此，一旦電漿被激發時，針對一 均勻時間平均化電漿製程（例如，加熱），模式混合器之位 置可以被改變以移動最大値之位置。 因此，依照本發明，在電漿點火期間可以使用模式混 合。例如，當使用一導電性纖維作爲電漿觸媒時，吾人已 知該纖維之方向會大大地影響最小電漿點火條件。例如， 已有報告指出，當此一纖維定位成相對於電場而呈一大於 6〇之角度時，該觸媒幾乎不會增進或者解除這些條件。 然而，不論藉由移動凹室內或靠近凹室之反射性表面，該 電場分佈會大大地改變。 可譬如藉由一可安裝在施加器腔室內部之轉動波導接 頭來將輻射發射至施加器腔室中，如此亦可達到模式混合 -25- (23) (23)1334319 。該旋轉式接頭可以機械式移動（例如，轉動），以沿不同 方向將輻射有效射入至輻射腔室中。因此，在施加器腔室 中便可以產生一改變的場域樣式。 亦可以藉由一可撓性波導將輻射投入至輻射腔室中來 達成模式混合。在一實施例中，該波導可以安裝在腔室內 部。在另一實施例中，該波導可以伸入至該腔室中。可撓 性波導之端部位置可以任可適當方式連續或週期性移動（ 例如彎曲），以將輻射（例如，微波）以不同方向及/或位置 射入至腔室中。此一運動亦可以造成模式混合且促進更爲 均勻的以時間平均爲基準的電漿處理（例如加熱）。或者， 針對點火或其他電漿輔助製程，此一運動可用以最佳化一 電漿之位置。 若可撓性波導爲矩形，則波導之開口端的簡單扭轉便 可轉動在施加器腔室內部之輻射中的電場以及磁場向量之 方位。然後，該波導之一週期性扭轉可產生模式混合以及 轉動電場，這可用以輔助點火、調整或維持一電漿。 因此，即使觸媒之初始方位垂直於電場，電場向量之 重新定向亦可將無效方位改變至一較有效之方位。習於此 技者應知，該模式混合可以爲連續性、週期性或預先程式 化。 除了電漿點火以外，在後續電漿處理期間亦可使用模 式混合，以減少或產生（例如，調整）腔室中之”熱點”。當 —微波凹室僅支援少量的模式時（例如，小於5)，一或多 個局部化雷場最大値可導致”熱點”（例如，在凹室1 2中） -26- (24) (24)1334319 。在一實施例中，這些熱點可加以構形以符合一個或多個 分離的但同時的電漿點火或處理事件。因此，電漿觸媒可 定位在一個或多個這些點火或後續的處理位置。 多重位置點火 一電漿可以利用多個電漿觸媒在不同位置上來點火。 在一實施例中，多個纖維可用以在凹室中之不同位置來點 火電漿。當有需要一均勻的電漿點火時，此類多重位置點 火係特別有利的。例如，當一電獎在局頻（亦即，數十赫 茲及更高）被調整時，或者以一較大體積被點火時，或者 兩者同時存在時，可以實質增進均勻的瞬間點火或重新點 火。或者，當電漿觸媒在多個位置點使用時，其可藉由在 不同位置點選擇性導入觸媒而在電漿腔室中之不同位置處 依序點火一電漿。在此方式中，若有需要，可在凹室中控 制式地形成一電漿點火梯度。 再者，在一多重模式凹室中，在凹室中之整個多重位 置的觸媒任意分佈會增加至少一纖維或依照本發明之任何 其他被動型電漿觸媒由電場線最佳化地定向。再者，即使 在觸媒並非爲最佳化定向的情況（大致未與電場線對準）， 仍可以增進點火條件。 此外，由於一觸媒粉末可懸浮在一氣體中，吾人相信 每一粉末顆粒可具有被放置在凹室中之不同實體位置的效 果，藉此增進凹室中之點火均勻性。 -27- (25) (25)1334319 雙凹室電漿點火/維持 依照本發明，一種雙凹室配置可用以點火及維持一電 漿。在一實施例中，一系統包括至少一第一點火凹室及一 與該第一凹室流體連通之第二凹室。爲了點火一電漿，視 一電漿觸媒存在與否，在第一點火凹室中之氣體可受到具 有小於約3 3 3 GHz之頻率的電磁輻射所照射。以此方式， 第一及第二凹室的靠近可允許形成在第一凹室中之電漿點 火第二凹室中之電漿，其中該第二凹室中之電漿可由一另 外的電磁輻射所維持。 在本發明之一實施例中，第一凹室可以極小且主要或 僅設計成用於電漿點火。在此方式中，可能僅需要極小的 微波能量來點火該電漿，且可以更容易點火，尤其當使用 依照本發明之電漿觸媒時。 在一實施例中，第一凹室可大致爲一單一模式凹室， 而第二凹室爲一多重模式凹室。當第一點火凹室僅支援一 單一模式時，在凹室中之電場分佈可以有極大的變化，以 形成一個或多個精確定位的電場最大値。此等最大値通常 爲電漿點火所在之第一位置，因此這些是放置電漿觸媒的 理想位置點。然而，應瞭解，當使用一電漿觸媒時，其並 不一定要放置在電場最大値處，且在許多例子中，其並不 需要定向在任何特定方向。 在前述實施例中，爲了流暢地闡述本發明，在單一實 施例中可以結合各種特徵。此一闡述方法不應解釋爲在此 主張之本發明需要具有多於陳述在每一申請項中之特徵的 -28- (26) (26)1334319 意圖。相反地，如以下申請專利範圍所述，本發明之特徵 少於上述單一實施例之所有特徵。因此，以下之申請專利 範圍倂入此一實施例之詳細說明的段落中，且每一申請項 可各自爲本發明之一獨立的較佳實施例。 【圖式簡單說明】 由以上之詳細說明並配合後附之圖式，將可瞭解本發 明之進一步特徵，其中在諸圖式中，相同之元件符號係表 示相同之部件，且其中： 圖1顯示依照本發明之一示例性電漿系統之槪要示意 圖； 圖1Α顯示依照本發明用以添加一粉末電漿觸媒至一 電漿凹室中以點火、調整或維持在一凹室中之電漿之電漿 系統之一部分的示例性實施例； 圖2顯示依照本發明具有至少一成分之示例性電漿觸 媒纖維，該成分沿其長度上具有一濃度梯度； 圖3顯示依照本發明具有多重成分之示例性電漿觸媒 纖維，其中該成分之比率係沿其長度而有所變化； 圖4顯示依照本發明之另一示例性電漿觸媒纖維，該 纖維包括一核心內層及一塗覆物； 圖5顯示沿著圖4之剖面線5-5所取之依照本發明電 漿觸媒纖維之一截面視圖； 圖6顯示依照本發明之一電漿系統之另一部分的示例 性實施例，其中該電漿系統包括一延伸通過點火孔之長形 -29- (27) (27)1334319 電漿觸媒； 圖7顯示依照本發明可用於圖6之系統中之長形電漿 觸媒之示例性實施例； 圖8顯示依照本發明可用於圖6之系統中之長形電漿 觸媒之另一示例性實施例；及 圖9顯示依照本發明用以將輻射導引至一輻射腔室之 電漿系統之一部分的示例性實施例。 元件符號對照表 10 電漿系統 12 凹室 14 輻射腔室 20 管路 22 控制閥 24 氣體源 26 輻射源 28 電源供應器 30 波導 32 循環器 34 調整器 36 馬達 38 模式混合器 40 窗口 42 溫度感應器 -30 * (28) 控制器 輻射源 輻射凹室 電漿凹室 粉末源 觸媒粉末 氣流 觸媒 片段 片段 觸媒 片段 片段 纖維 底層 塗覆物 輻射腔室 電漿凹室 電漿觸媒 點火孔 導電性遠端部 非導電性部分 導電性區段 非導電性區段 -31 - (29) 1334319 200 輻射源 205 輻射腔室 2 10 電漿凹室 2 15 孔口 2 16 孔口 220 供應源 225 離子化顆粒(1) 1334319 玖, invention description of the relevant application of the cross-references This case is filed on May 8, 2002, the application of the US special application case 60/378, 693, December 4, 2002 proposed 60/430 Case No. 677 and Case No. 60/43 5,278 of December 23, 2002, all of which are incorporated herein by reference. TECHNICAL FIELD OF THE INVENTION The present invention relates to a method and apparatus for igniting, adjusting, and maintaining a plasma of a gas using a plasma catalyst. [Prior Art] It is known that a plasma can be ignited by subjecting a gas to a sufficient amount of microwave radiation. However, plasma ignition is generally easier when the gas pressure is substantially less than atmospheric pressure. However, to reduce the gas pressure, the empty equipment is quite expensive and slow and energy consuming. Moreover, the use of such a type limits the flexibility of manufacturing. SUMMARY OF THE INVENTION A plasma contact for igniting, adjusting, and maintaining a plasma is provided herein. The plasma catalyst can be passive or active. In accordance with the present invention, a plasma catalyst can include any object capable of producing a plasma by changing a local electric field (e.g., an electromagnetic field), which does not require the addition of [-f~i S-fe 甲δΡ3 Please ask for the real equipment from the shooting situation. Type 5 - Add the amount of energy -4 - (2) (2) 1334319. In another aspect, an active plasma catalyst can include any particle or high energy wave packet capable of delivering sufficient energy to a gaseous atom or molecule to remove at least one electron from the gaseous atom or molecule in the presence of electromagnetic radiation. . In both cases, a plasma catalyst can improve or deactivate the environmental conditions used to ignite a plasma. Methods and apparatus for forming a plasma are also provided herein. In accordance with an embodiment of the invention, the method package includes flowing a gas into a multi-mode processing chamber and, in the presence of at least one passive plasma catalyst, by placing a bit in the recess The gas in the chamber is ignited by electromagnetic waves having a frequency of less than about 3 3 3 GHz, wherein the passive plasma catalyst comprises a material that is at least semi-conductive. In another embodiment of the present invention, there is also provided a method and apparatus for igniting a plasma by subjecting a gas to less than about 3 3 in the presence of a plasma catalyst comprising a powder. This is achieved by electromagnetic wave irradiation at a frequency of 3 GHz. In yet another embodiment of the present invention, an additional method and apparatus for forming a plasma using a dual chamber system is provided. The system can include one of a first ignition recess and a second recess in fluid communication with one another. The method includes: (i) illuminating one of the first ignition chambers with electromagnetic radiation having a frequency of less than about 3 3 3 GHz such that plasma in the first recess causes the second recess Forming a plasma in the chamber; and (ii) maintaining the second plasma in the second chamber by irradiating the second plasma with other electromagnetic radiation. The present invention also provides other plasma catalysts and methods and apparatus for igniting, adjusting and maintaining a power prize. (3) (3) 1334319 [Embodiment] The present invention relates to a method and apparatus for igniting, adjusting, and maintaining plasma for various applications, including heat treatment, artificial synthesis, and deposition of carbides, nitrogen. Compounds, borides, oxides and other materials, doping, carburizing, nitriding and carbonitriding, sintering, multi-component processing, joining, decrystallization, manufacturing and operation of furnaces, waste gas treatment, waste treatment, incineration, Scraping 'ashing, growing carbon structure, generating hydrogen and other gases, forming electrodeless plasma jets, plasma processing, sterilization, chasing, etc. on the production line. The invention can also be used to controllably generate heat and for plasma assisted processing to reduce energy costs and increase heat treatment efficiency and plasma assisted manufacturing flexibility. Accordingly, a plasma catalyst for igniting, modulating, and maintaining a plasma is provided herein. The catalyst can be passive or active. A passive plasma catalyst includes any object capable of producing a plasma by transforming a local electric field (e.g., an electromagnetic field) in accordance with the present invention without the need to add additional energy through the catalyst, such as by application. A voltage produces a spark. In another aspect, an active plasma catalyst can also be any material capable of transmitting a sufficient amount of energy to a gaseous atom or ion in the presence of electromagnetic radiation to remove at least one electron from the gaseous atom or molecule or High energy wave package. The full text of the U.S. patent application filed concurrently and concurrently by the applicant of the present application is hereby incorporated by reference in its entirety: U.S. Patent Application Serial No. 10/_, No. (Attorney Docket No. 1 8 3 7. 0008), US Patent (4) (4) 1334319 Application No. 10/_, _ (Agent File Number 1 8 3 7. 0009), US Patent Application No. 1/_, _ (Agent File Number 1 8 3 7. 00 1 0) 'US Patent Application No. 10/_, _ (Agent No. 1 8 3 7. 00 1 1 ), US Patent Application No. 10/_, _ (Agent File Number 1 83 7. 00 1 2), US Patent Application No. 10/_, _ (Agent File Number U3 7. 00 1 3), US Patent Application No. 1/_, _ (Agent File Number 1837. 0015), US Patent Application No. 10/_, _ (Attorney File No. 1 837. 00 1 6), US Patent Application No. 10/_, _ (Agent File Number 1 83 7. 00 1 7), US Patent Application No. 10/_, _ (Agent File Number 1 83 7. 00 18), US Patent Application No. 10/_, _ (Agent File Number 1 8 3 7. 0020), US Patent Application No. 10/_, ___ (Attorney File No. 1837. 0021), US Patent Application No. 10/_, _ (Agent File Number 1 8 3 7. 002 3), US Patent Application No. 10/_, _ (Agent File Number 1 8 3 7. 0024), US Patent Application No. 10/_, _ (Agent File Number 1 83 7. 0025), US Patent Application No. 10/_, _ (Agent File Number 1 8 3 7. 0026), US Patent Application No. 10/_, _ (Agent File Number 1 8 3 7. 002 7), US Patent Application No. 10/_, _ (agent file number 1 837. 0028), US Patent Application No. 10/_, _ (Agent File Number 1837. 0030), US Patent Application No. 10/_, _ (Agent File Number 1 83 7. 003 2) and US Patent Application No. (5) (5) 1334319 10/_’ _ (Agent File Number 183 7. 003 3). Illustrating a Plasma System FIG. 1 shows an exemplary plasma system 10 in accordance with one aspect of the present invention. In this embodiment, the recess 12 is formed in a container that is positioned in a radiation chamber (i.e., applicator) 14. In another embodiment (not shown), the container 12 is identical to the radiant chamber 14, thereby avoiding the need for two separate components. The vessel in which the recesses 12 are formed may include one or more radiation penetrating insulating layers to enhance its thermal insulation properties without significantly shielding the recesses 12 from illuminating the radiation. In one embodiment, the recess 12 is formed in a container made of ceramic material. Since extremely high temperatures can be achieved in accordance with the present invention, ceramics capable of operating at temperatures of 300 °F can be used. The pottery may comprise a weight percentage of 2 8 · 9 % of alumina ' 6 8. 2% alumina ' 0. 4% iron oxide, 1% titanium dioxide '〇. 〗% lime, 0. 1% magnesium oxide, 0. 4% alkali, this material is sold under the model LW-30 by New Castle Refractories, New Castle County, Pennsylvania, USA. However, it will be understood by those of ordinary skill in the art that other materials, such as quartz, and many other materials than those described above can be used in the present invention. In a successful experiment, the plasma was formed in a partially open recess that was placed inside a first block and covered with a second square. The chamber has about 2 inches multiplied by about 2 inches multiplied by about 1. 5 inches in size. At least two openings are also provided in the block to communicate with the recess: one opening for viewing the plasma and at least one opening for providing gas-8-(6) (6) 1334319. The size of the alcove may depend on the appropriate plasma process to be performed. Furthermore, the recess should also be configured to at least prevent plasma from overflowing/floating out of the main processing area. * The recess 12 is connected to one or more gas sources by a line 20 and a control valve 22 that can be powered by a power source 28. 24 (for example, argon, nitrogen, helium, neon, helium supply). The conduit 20 can be a tubular body (e.g., between about 1/16 inch and about 1/4 inch, such as about 1/8 inch). Further, if necessary, a vacuum pump can be connected to the chamber to remove the fumes generated during the plasma process. In one embodiment, the gas may flow into and/or out of the recess 1 2 via one or more gaps in a multi-part container. Thus, the gas orifices consistent with the present invention do not necessarily need to be specific openings, but may have other types, such as many fine discrete openings. A radiation leak detector (not shown) is mounted adjacent the supply source 26 and the waveguide 30 and is coupled to a safety interlock system to detect a leakage above a predetermined safety limit (such as FCC and / or OSHA (for example, 5mW / cm2)), the radiation (for example, microwave) power can be automatically turned off. Radiation source 26, which may be powered by power supply 28, directs radiant energy directly into radiant chamber 14 via one or more waveguides 30. It will be apparent to those of ordinary skill in the art that the radiation source 26 can be directly coupled to the recess 12, thereby avoiding the waveguide 30. The radiant energy entering the recess 12 is used to ignite a plasma in the recess. The plasma can be substantially maintained and confined to the recess by coupling additional radiation with a catalyst. Moreover, it is generally believed that the frequency of radiation (e.g., microwave radiation) is not critical in many applications. -9- (7) (7) 1334319 Radiant energy can be supplied via a circulator 32 and a regulator 34 (for example, a 3-stage regulator). The adjuster 34 can be used to avoid the reflected power as a function of changing the ignition or process conditions, especially after the plasma has been formed, since for example the microwave power is strongly absorbed by the plasma. As will be explained in greater detail below, if the chamber 14 supports multiple modes, the radiation-transmissive recess 12 in the radiant chamber 14 is not critical, especially when the modes are continuously or periodically mixed. As will also be described in greater detail below, motor 36 can be coupled to mode mixer 38 to produce a time averaged radiant energy distribution that substantially uniformly outputs the chamber 14. Furthermore, a window 40 (eg, a quartz window) can be disposed adjacent to one of the walls of the chamber 12 such that a temperature sensor 42 (eg, an optical pyrometer) can be used to observe the recess. The process inside the chamber 1 2 . In one embodiment, the optical pyrometer output 增加 can be increased from zero volts to the tracking range as the temperature rises. The inductor 42 can form a function of the output signal as a function of temperature or any other monitorable condition associated with a workpiece (not shown) in the recess 12 and provide a signal to the controller 44. Dual temperature sensing and heating, as well as automatic cooling rate and airflow control are also available. The controller 44 can then be used to control the operation of the power supply 28, which has an output connected to the radiation source 26 and another output connected to the control valve 22 as described above to control the flow of gas into the chamber 12. The present invention has been equally successful in using the 915 MHz and 2. provided by the Communications and Power Industry (CPI). The 45 GHz microwave supply, although it is possible to use any radiation with a frequency less than 3 3 3 GHz. The -10- (8) (8) 1334319 2. 45 GHz system can provide about 0. 5 仟 瓦 to about 5. Continuously variable microwave power of 0 watts. A 3-stage regulator provides impedance matching for maximum power transfer and a bi-directional coupler measures forward and reflected power. Furthermore, an optical pyrometer is used to sense the sample temperature remotely. As noted above, the present invention can employ radiation having any frequency less than 3 3 3 G Η z. For example, a frequency such as a power line frequency (about 50 Hz to about 60 Hz) may be employed, however the gas pressure used to form the plasma may need to be reduced to aid ignition. Furthermore, the invention may also employ any radio frequency or microwave frequency, including frequencies greater than 1 kHz. In most of the examples, the gas pressure for such higher frequencies does not have to be lowered to ignite, adjust, or maintain a plasma, thereby allowing many of the plasma processes to be carried out at atmospheric pressure or above. The device is controlled by a computer using LabView 6i software, which provides instant temperature monitoring and microwave power control. Noise can be reduced by using a moving average of the appropriate number of data points. Furthermore, to increase speed and computational efficiency, the number of data points stored in the buffer array can be limited by the use of shift registers and buffer scaling. The pyrometer measures the temperature of the sensing area of approximately 1 square centimeter, which is used to calculate an average temperature. The pyrometer senses the radiant intensity at two wavelengths and inserts these intensity enthalpy using Planck's law to determine the temperature. However, it should be understood that other devices and methods can be used in the present invention to monitor and control temperature. A control soft system that can be used in the present invention is disclosed, for example, in U.S. Patent Application Serial No. 10/_, _ (Attorney Docket No. 1837. 0033), the full text of the case -11 - (9) (9) 1334319 The content of this case is cited. The chamber 14 has a plurality of glass-covered viewing apertures and a radiation shield and a quartz window for the pyrometer to enter. Several orifices are also provided to connect to a vacuum pump and a gas source, however this does not necessarily require use. System 10 also includes a closed loop deionized water cooling system (not shown) and an external heat exchanger cooled by tap water. During operation, the deionized water first cools the magnetron and then dumps it in a circulator (to protect the magnetron), and finally the radiant chamber passes through a water channel welded to the outer surface of the chamber. Plasma Catalyst A plasma catalyst in accordance with the present invention may comprise one or more different materials, and may also be active or passive. In addition, the plasma catalyst can be used to ignite, adjust, and/or maintain a gas pressure that is less than, equal to, or greater than atmospheric pressure. A method of forming a plasma in accordance with the present invention can include subjecting a gas positioned in a chamber to electromagnetic radiation in the presence of a passive plasma catalyst having a frequency of less than about 333 GHz. A passive plasma catalyst in accordance with the present invention can include any object capable of producing a plasma by converting a local electric field (e.g., an electromagnetic field) in accordance with the present invention without the need to add additional particles by means of a catalyst. Energy, such as by supplying a voltage to generate a spark. A passive plasma catalyst according to the present invention may also be a nanoparticle -12-(10) (10) 1334319 or a nanotube. As used herein, the term "nanoparticle" means any particle having a maximum physical dimension of less than about 100 nm and at least semiconducting. Furthermore, in accordance with the present invention, single-walled and multi-walled, doped or undoped carbon nanotubes are particularly suitable for use in ignition plasma due to their excellent electrical conductivity and elongated shape. The nanotube can have any known length and can be a powder that is fixed to a substrate. If it is stationary, the nanotube can be arbitrarily oriented or fixed to the substrate (e.g., in a predetermined direction) upon ignition or maintenance of the plasma. In accordance with the present invention, a passive plasma catalyst can also be a powder and does not need to comprise nanometer or nanotubes. For example, it may be formed of fibers, dust particles, chips or flakes or the like. When in powder form, the catalyst can be temporarily suspended in the gas at least temporarily. By suspending the powder in a gas, the powder can be quickly dispersed throughout the alcove and can be more easily consumed if needed. In one embodiment, the powder catalyst can be carried into the chamber and at least temporarily suspended in a carrier gas. Further, the powder may be added to the gas before being introduced into the chamber. For example, as shown in Fig. 1A, a radiation source 52 can supply radiation to a radiation chamber 55 in which a plasma chamber 60 is disposed. Powder source 65 provides catalyst powder 70 to gas 75. In another embodiment, the powder 70 may be added to the cavity 60 in the form of a block (e.g., a block) and then dispersed in the cavity in several ways, including passing a gas through or through the cake. In addition, the powder may be fed or fed into the chamber by moving, transporting, dripping, spraying, sucking or otherwise, and added to the gas to ignite, adjust or maintain a plasma. -13- (11) (11) 1334319 In one experiment, a plasma was ignited in the chamber by placing a carbon fiber powder block in a copper tube that protruded into the chamber. Although a sufficient amount of radiation is introduced into the chamber, the copper tube shields the powder from being irradiated and plasma ignition does not occur. However, once the carrier gas begins to flow through the tube, the powder is forced out of the tube and into the chamber, whereby the powder is irradiated and the plasma is ignited almost instantaneously in the chamber. A powdered plasma catalyst in accordance with the present invention can be substantially non-flammable, thereby eliminating the need to contain oxygen or to combust in the presence of oxygen. As such, as described above, the catalyst may include a metal, carbon, a carbon-based alloy, a carbon-based composite, a conductive polymer, a conductive anthrone rubber, a polymeric nanocomposite, an organic-inorganic composite, and Any combination of them. Further, the powder catalyst can be substantially dispersed in the plasma chamber (e.g., when suspended in a gas), and plasma ignition can be precisely controlled in the chamber. Uniform ignition is important in some applications, including those that require a simple plasma explosion, such as in one or more explosions. Furthermore, the powder catalyst requires a certain amount of time to spread it in an alcove, especially in a complex, multi-chamber alcove. Therefore, according to another aspect of the present invention, a powder catalyst can be introduced into the chamber through a plurality of ignition ports, and a more uniform catalyst distribution can be obtained more quickly (refer to the following). In addition to powders, for example, passive plasma catalysts in accordance with the present invention may include, for example, one or more micro or macroscopic fibers, sheets, needles, threads, strands, bundles of fibers, cotton, twine, planing Sheet, chip, fabric, tape, filament or any combination thereof. In these examples, the plasma catalyst can have at least a portion of which may have a substantial physical size that is substantially larger than the other real -14-(12)(12)1334319 body dimensions. For example, the ratio between at least two orthogonal dimensions should be at least about 1:2, but can also be greater than about 1:5 or even greater than about 1:1. Thus, a passive plasma catalyst can include at least one portion of material that is relatively thin compared to its length. A bundle of catalyst (e.g., fibers) may also be employed and, for example, may include a segment of a graphite ribbon. In the experiment, a segment having approximately 30,000 bundles of graphite fibers (each having a diameter of about 2-3 microns) can be successfully employed. The amount of fiber and the length of the bundle are not critical to igniting, adjusting or maintaining the plasma. For example, a satisfactory result can be obtained by using a graphite band segment of about a quarter inch length. A carbon fiber can be successfully used in accordance with the present invention, which is sold under the trademark AS4C-GP3K by the Hexcel Corporation of Anderson, South Carolina, USA under the trademark Magnamite®. Furthermore, carbon fiber has also been successfully used. A passive plasma catalyst in accordance with another aspect of the present invention can include one or more portions, which can be, for example, generally spherical, looped, pyramidal, cubic, flat, cylindrical, rectangular or long. shape. The passive plasma catalyst disclosed above comprises at least one material which is at least a semiconductive material. In an embodiment, the material can have high electrical conductivity. For example, the passive plasma catalyst according to the present invention may comprise a metal, an inorganic material, a carbon, a carbon-based alloy, a carbon-based composite, a conductive polymer, a conductive anthrone rubber, a polymeric nanocomposite, Organic-inorganic composite or any combination thereof. Some of the inorganic materials that can be included in the plasma catalyst include carbon, tantalum carbide, molybdenum, platinum, tungsten, carbon nitride, and aluminum, although other conductive inorganic materials are generally believed to have good efficacy. -15-(13) (13) 1334319 In addition to one or more electrically conductive materials, a passive plasma catalyst in accordance with the present invention may include one or more additives (which do not necessarily have to be electrically conductive). The term additive as used herein may include any material that the user desires to add to the plasma. For example, when doping a semiconductor or other material, one or more dopants may be added via a catalyst. For example, refer to U.S. Patent Application Serial No. 10/_’_ (Attorney Docket No. 1 83 7. 0026), the full text of the case is cited as a reference for this case. The catalyst may comprise the dopant itself, or it may comprise a preform material which, upon decomposition, may form a dopant. Thus, the plasma catalyst can include one or more additives and one or more electrically conductive materials in any desired ratio, depending on the final desired plasma composition and the process utilizing the plasma. The ratio of conductive components to additives in passive plasma catalysts changes over time while being consumed. For example, during ignition, the plasma catalyst may need to include a relatively large proportion of conductive components to improve the ignition state. On the other hand, if used while maintaining plasma, the catalyst may include a larger proportion of additives. Those who have a general understanding of this technique should be able to understand that the proportion of the composition of the plasma catalyst used to ignite and maintain the plasma can be the same. 〇 A preset ratio profile can be used to simplify many plasma processes. In many conventional plasma processes, the components in the plasma can be added as needed, but such additions typically require programmable equipment to be added in accordance with a predetermined schedule. However, according to the present invention, the ratio of components in the catalyst can be changed and the ratio of components in the plasma itself can be automatically changed. In other words, in the case of any -16-(14) (14)1334319, the ratio of the components in the plasma may depend on which portion of the catalyst is now being consumed by the plasma. Therefore, the ratio of the catalyst components in different parts of the catalyst can be different. Moreover, the current composition ratio in a plasma may depend on which portion of the catalyst and/or the portion previously consumed, particularly when the flow rate of gas through the plasma chamber is relatively slow. Passive plasma catalysts in accordance with the present invention may be homogeneous, non-homogeneous or graded. Further, the plasma catalyst composition ratio may be changed continuously or discontinuously throughout the catalyst. For example, in Figure 2, the ratio can be varied gently to form a gradient along the length of the catalyst 100. Catalyst 100 can include a bundle of materials that include a lower concentration of components in segment 105 and a continuously increasing concentration toward segment 110. Alternatively, as shown in Figure 3, the ratio may vary discontinuously in each catalyst 120, including, for example, interlaced portions 1 25 and 130 having different concentrations. It should be appreciated that the catalyst 120 can have more than two partial types. Therefore, the ratio of the catalyst component consumed by the plasma can be changed in any predetermined pattern. In one embodiment, when the plasma is monitored and a particular additive is detected, further processing can be initiated or terminated. Another method of changing the ratio of components in a maintained plasma is by introducing a plurality of catalysts having different composition ratios at different times or at different ratios. For example, a plurality of catalysts can be introduced into substantially the same or different locations in the recess. When introduced into different portions, the plasma formed in the recess may have a compositional concentration gradient determined by the location of the different catalysts. Accordingly, an automated system can include a means for mechanically placing a consumable plasma catalyst before and/or during ignition, adjustment, and/or maintenance of the plasma. -17- (15) (15) 1334319 A passive plasma catalyst according to the present invention may also be coated. In one embodiment, a catalyst can include a substantially non-conductive coating deposited on the surface of a substantially electrically conductive material. Alternatively, the catalyst may comprise a substantially electrically conductive coating deposited on the surface of a substantially non-conductive material. For example, Figures 4 and 5 show fibers 140 that include a bottom layer 145 and a coating 150. In one embodiment, a plasma catalyst comprises a nickel-coated carbon core to prevent carbon oxidation. A single plasma catalyst can also include a variety of coatings. If the coating is consumed during contact with the catalyst, the coating can be introduced into the catalyst sequentially from the outer coating to the innermost coating, thereby creating a time release mechanism. . Thus, a coated plasma catalyst can include any number of materials as long as one portion of the catalyst is at least semi-conductive. In accordance with another embodiment of the present invention, a plasma catalyst is integrally positioned in a radiation cavity to substantially reduce or prevent leakage of radiant energy. In this manner, the plasma catalyst is not electrically or magnetically coupled to the container housing the chamber or to any conductive object outside the recess. This prevents sparking in the ignition hole and prevents radiation from leaking out of the recess during ignition or later if the plasma is maintained. In one embodiment, the catalyst can be positioned at a distal end of a substantially non-conductive extension extending through an ignition aperture. For example, Figure 6 shows a radiant chamber 160 in which a plasma alcove 165 is disposed. The plasma catalyst 170 is elongated and extends through the ignition aperture 175. As shown in FIG. 7, in accordance with the present invention, the catalyst 170 can include a conductive distal portion 180 (which is placed in the chamber 160) and a non-conductive portion 185 (which is large -18-(16) (16) 1334319 Placed outside the chamber 160). This configuration prevents electrical connections (e.g., sparking) between the distal portion 180 and the chamber 160. In another embodiment, as shown in FIG. 8, the catalyst may be formed by a plurality of electrically conductive segments 190, wherein the segments are separated by a plurality of non-conductive segments 195 and mechanically The ground is connected to it. In this embodiment, the catalyst may extend through an ignition hole between a point inside the recess and a point outside the recess, but the electrically discontinuous shape can greatly prevent sparks. And energy leakage. Another method of forming a catalyst according to the present invention comprises subjecting a gas in a chamber to electromagnetic radiation having a frequency of less than about 3 3 3 GHz in the presence of an active plasma catalyst, wherein The plasma catalyst can produce or include at least one ionized particle. An active plasma catalyst in accordance with the present invention can be any particle or high energy wave package that is capable of transmitting a sufficient amount of energy to a gaseous atom or molecule in the presence of electromagnetic radiation to remove at least a gaseous atom or molecule. -electronic. Depending on the source of supply, the ionized particles can be introduced into the chamber in a polymeric or collimated beam pattern which can be introduced by spraying, spraying, spraying or otherwise. For example, Figure 9 shows a radiation source 200 that can introduce radiation into the radiation chamber 205. The plasma chamber 210 is positioned inside the chamber 205 and allows a gas stream to flow therethrough through the orifices 2 15 and 2 16 . The supply source 220 introduces the ionized particles 225 into the recess 210. For example, the supply source 220 can be protected by a metal screen that allows the ionized particles to be irradiated through the 'but shieldable supply source 220. If required, supply -19- (17) (17) 1334319 Source 2 2 0 can be water-cooled. Examples of ionized particles in accordance with the present invention include X-ray particles, gamma ray particles, alpha particles, beta particles, neutrons, protons, and any combination thereof. Thus, an ionized particle catalyst can be charged (e.g., from an ion supply source) or uncharged and can be the product of a radioactive nuclear cleavage reaction. In one embodiment, the container in which the plasma chamber is formed may penetrate completely or partially into the ionized particle catalyst. Thus, when a source of radioactive nuclear fission is positioned outside the concave surface, the supply source can direct nuclear fission products through the vessel to ignite the plasma. A source of radioactive nuclear fission can be positioned inside the radiant chamber to substantially prevent a safety hazard from nuclear fission products (i.e., ionized particle catalysts). In another embodiment, the ionized particles can be a free electron, but it does not have to be emitted in a radioactive decay reaction. For example, the electrons can be introduced into the chamber by energizing the electron source (such as a metal) such that electrons having sufficient energy can be removed from the source. The electron source can be positioned within the interior of the chamber, adjacent to the recess or even positioned within the wall of the recess. It should be apparent to those having ordinary skill in the art that the present invention may also employ any combination of electronic sources. One common method for generating electrons is to heat a metal, and these electrons can be further accelerated by supplying an electric field. In addition to electrons, free energy protons can also be used to trigger a plasma. In an embodiment, a free proton can be generated by dissociating hydrogen and, if desired, accelerated by an electric field. One of the advantages of active and passive catalysts in accordance with the present invention is that -20-(18)(18)1334319 can trigger a plasma in a substantially continuous manner. For example, an ignition device can only trigger a plasma in the presence of a spark. However, a spark is typically produced by supplying a voltage through the two electrodes. In general, the sparks are periodically generated and separated by a period in which no spark is produced. During these non-ignition cycles, a plasma will not be triggered. Moreover, for example, ignition devices typically require electrical energy to operate, however active and passive plasma catalysts in accordance with the present invention do not require electrical energy to operate. Multiple Mode Radiation Cavities A radiating waveguide, cavity or chamber can be designed to support or promote the propagation of at least one electromagnetic radiation pattern. The term "pattern" as used herein refers to any particular pattern of fixed or propagating electromagnetic waves that satisfies the Maxwell's equation and the impermissible boundary conditions (e.g., the boundary conditions of the alcove). In a waveguide or alcove, the mode can be any of a variety of possible modes of propagating or immobilizing an electromagnetic field. Each mode is characterized by the frequency and polarity of the electric field and/or the magnetic field vector. The electromagnetic field pattern of a mode depends on the frequency, refractive index or dielectric constant and the geometry of the waveguide or cavity. The transverse electric field (TE) mode is a mode in which the electric field vector is perpendicular to the propagation direction. Similarly, a transverse magnetic field (TM) mode is a mode in which the magnetic field is perpendicular to the direction of propagation. A transverse electric field and magnetic field (TEM) mode is a mode in which both the electric field and the magnetic field vector are perpendicular to the direction of propagation. A hollow metal waveguide typically does not support a vertical TEM mode of radiated propagation. Even if radiation occurs along the length of the waveguide, it can only be reflected off the inner wall of the waveguide at some angle. However, depending on the mode of propagation, the radiation -21 - (19) 1334319 (e.g., microwave) may have some electric field component or magnetic field component (commonly referred to as the Z axis) along the axis of the waveguide. The actual field distribution inside an alcove or waveguide is internal to the mode. Each mode can be represented by one or more subscript symbols (eg, TE, 〇ee one zero). This subscript symbol usually lists how many "half-waves" are included in the waveguide wavelength and in the y-direction. Those skilled in the art understand that the waveguide wavelength is different from the free-space wavelength because the radiation propagation within the waveguide is reflected by the inner wall of the waveguide at an angle. In some examples, a third subscript symbol can be added to define how many A vertical wave mode along the z-axis. For a given radiation frequency, the size of the waveguide can be chosen to be small enough to support a single propagation mode. In this example, the system is a single mode system (ie, Single mode applicator. In a rectangular single waveguide, the TE1C mode is usually the majority. As the size of the waveguide (or the alcove to which the waveguide is connected) increases, the guide or applicator can sometimes support a large number of configurations. An extra higher version of the pattern system. When many modes are supported simultaneously, the system can often be referred to as moderation. A simple, single mode system has a field distribution that includes up to and/or minimum. The maximum 値 depends mainly on the supply to the system. Therefore, the field distribution of a single mode will vary greatly and be uneven. Unlike a single mode alcove, a multi-mode alcove can simultaneously propagate the propagation mode. When these modes overlap, it will cause a certain overlap of a complex field ("tee is in the X-capable part, so that it can be called a mode. The wave-order mode is higher than the first-order one." 22- (20) 1334319 Cloth style. In this style, the 'field' tends to be spatially shaped. This field distribution usually does not show the same type of large field in the alcove. In addition, it will be more complete as follows. It can be noted that a mode can be used to "excite" or "redistribute" mode (for example, by mechanical motion of a device). This redistribution can provide a more uniform time-averaged field redistribution in the alcove. According to one aspect of the present invention, the multi-mode alcove can support at least two to support more than two modes. Each mode has a maximum power, although there may be two or more modes, one of which is predominantly more than the other The mode is still big The maximum electric field vector 値. As in this multi-mode recess, any recess can be used, wherein the ratio between the first and third turns is less than about 1:1 〇' or less than about 1:5, or about 1:2. Those who have a general understanding of this technique should be able to understand that the smaller the electric field energy between the various modes, the more the radiant energy will be distributed in the chamber. The distribution of plasma in a processing chamber can depend mainly on For example, in a purely single mode system, the electric field with a single location is the largest enthalpy. Therefore, a strong energy can be formed at this single location. In many applications, this strong slurry can be improperly caused. Non-uniform plasma treatment or heating (i.e., overheating and insufficient heating). In accordance with the present invention, it will be apparent to those of ordinary skill in the art that a single or multiple mode of the art may be employed, in which the forming chamber may be completely enclosed or partially turn on. For example, in some pastes, and due to the extremely small and polar mixer radiation reflection local provides the mode, and the field vector. To mode and use, the amount of one or two modes is even smaller, and the ratio is then in the concave supply radiation, which may only be plasma, only a large part of the electricity, localized chamber, for plasma concave applications, -23- (21) (21 1334319 For example, a plasma-assisted boiler, the chamber can be completely enclosed. For example, refer to U.S. Patent Application Serial No. 10/_,_, which is jointly owned and filed by the applicant of the present application (Attorney Docket No. 1837. 0020), the full text of the case is cited as a reference for this case. However, in other applications, we may wish to have gas flowing through the chamber, and therefore the chamber must be opened to some extent. In this manner, the flow, type, and pressure of the flowing gas can change over time. This may be quite appropriate because certain gases can promote plasma formation, such as argon, which is easier to ignite and which is not required during subsequent plasma processing. Pattern blending For many applications, we need an alcove with a qualifier. However, since microwave radiation may have a longer wavelength (e.g., a few tenths of a centimeter), it may be difficult to achieve a uniform distribution. Thus, in the same manner as the present invention, the radiation pattern in the multimode chamber can be mixed or redistributed after a period of time. Since the field distribution in the recess must satisfy all of the boundary conditions set by the interior of the recess (if metal), these field distributions can be altered by changing the position of any portion of the inner surface. In an embodiment in accordance with the invention, a movable reflective surface can be positioned within the radiant recess. When combined, the shape and motion of the reflective surface changes the inner surface of the recess during motion. For example, an "L" shaped metal object (i.e., "mode mixer") will change the position or orientation of the reflective surface in the recess when rotated about any axis, and thus change the spokes - 24 - ( 22) (22) 1334319 Shooting distribution. Any other asymmetrical shape of the object (when rotating) can also be used, but the symmetrical shape object can also be effective as long as the relative motion (eg, rotation, translation, or a combination of both) will be the position or orientation of the reflective surface. Make some changes. In one embodiment, a mode mixer can be a cylinder that can be rotated about an axis other than the longitudinal axis of the cylinder. Each mode of the multiple modes has at least one maximum electric field vector, but all of these vectors can occur periodically over the internal dimensions of the entire cavity. Usually, these maximum enthalpy are fixed, assuming that the frequency of the radiation does not change. However, by moving a mode mixer to interact with the radiation, we can move the position of the maximum 値. For example, mode mixer 38 can be used to optimize the field distribution in the alcove 14 such that plasma ignition conditions and/or plasma maintenance conditions are optimized. Thus, once the plasma is energized, the plasma mixer process (e.g., heating) is averaged for a uniform time, and the position of the mode mixer can be changed to move the position of the maximum enthalpy. Thus, in accordance with the present invention, mode mixing can be used during plasma ignition. For example, when a conductive fiber is used as the plasma catalyst, it is known that the direction of the fiber greatly affects the minimum plasma ignition conditions. For example, it has been reported that when the fiber is positioned at an angle greater than 6 相对 with respect to the electric field, the catalyst hardly promotes or relieves these conditions. However, the electric field distribution can vary greatly, either by moving the reflective chamber or near the reflective surface of the recess. The radiation can be emitted into the applicator chamber by a rotating waveguide joint mountable inside the applicator chamber, thus also achieving mode mixing -25-(23)(23)1334319. The rotary joint can be mechanically moved (e.g., rotated) to effectively inject radiation into the radiant chamber in different directions. Thus, a changing field pattern can be created in the applicator chamber. Mode mixing can also be achieved by placing radiation into the radiant chamber through a flexible waveguide. In an embodiment, the waveguide can be mounted within the chamber. In another embodiment, the waveguide can extend into the chamber. The end position of the flexible waveguide may be continuously or periodically moved (e.g., bent) in a suitable manner to inject radiation (e.g., microwave) into the chamber in different directions and/or positions. This movement can also result in mode mixing and promote a more uniform plasma processing (e.g., heating) based on time average. Alternatively, for an ignition or other plasma assisted process, this motion can be used to optimize the position of a plasma. If the flexible waveguide is rectangular, a simple twist of the open end of the waveguide can rotate the electric field in the radiation inside the applicator chamber and the orientation of the magnetic field vector. Then, one of the waveguides is periodically twisted to produce mode mixing and a rotating electric field, which can be used to assist in igniting, adjusting or maintaining a plasma. Thus, even if the initial orientation of the catalyst is perpendicular to the electric field, the reorientation of the electric field vector can change the ineffective orientation to a more efficient orientation. As will be appreciated by those skilled in the art, the pattern blending can be continuous, periodic or pre-programmed. In addition to plasma ignition, mode mixing can also be used during subsequent plasma processing to reduce or create (e.g., adjust) "hot spots" in the chamber. When the microwave cavity supports only a small number of modes (eg, less than 5), one or more localized minefield maxima may result in "hot spots" (eg, in the alcove 1 2) -26- (24) ( 24) 1334319. In an embodiment, the hot spots may be configured to conform to one or more separate but simultaneous plasma ignition or processing events. Thus, the plasma catalyst can be positioned at one or more of these ignition or subsequent processing locations. Multiple Position Ignition A plasma can be ignited at various locations using multiple plasma catalysts. In one embodiment, a plurality of fibers can be used to ignite the plasma at different locations in the chamber. Such multiple position ignition systems are particularly advantageous when a uniform plasma ignition is desired. For example, when a jackpot is adjusted at a local frequency (ie, tens of Hertz and higher), or when it is ignited in a larger volume, or both, the uniform instantaneous ignition or re-energization can be substantially enhanced. ignition. Alternatively, when the plasma catalyst is used at a plurality of locations, it can sequentially ignite a plasma at different locations in the plasma chamber by selectively introducing the catalyst at different locations. In this manner, a plasma ignition gradient can be controllably formed in the chamber if desired. Furthermore, in a multi-mode chamber, the random distribution of the catalyst at the entire multiple locations in the recess increases at least one fiber or any other passive plasma catalyst in accordance with the present invention is optimized by electric field lines. Orientation. Furthermore, the ignition condition can be improved even when the catalyst is not optimized for orientation (substantially not aligned with the electric field lines). Moreover, since a catalyst powder can be suspended in a gas, it is believed that each powder particle can have the effect of being placed at different physical locations in the chamber, thereby enhancing ignition uniformity in the chamber. -27- (25) (25) 1334319 Double-cavity plasma ignition/maintaining In accordance with the present invention, a dual-cavity configuration can be used to ignite and maintain a plasma. In one embodiment, a system includes at least a first ignition pocket and a second recess in fluid communication with the first recess. In order to ignite a plasma, depending on the presence or absence of a plasma catalyst, the gas in the first ignition chamber can be exposed to electromagnetic radiation having a frequency of less than about 3 3 3 GHz. In this manner, the proximity of the first and second recesses may allow the plasma formed in the first recess to ignite the plasma in the second recess, wherein the plasma in the second recess may be an additional electromagnetic Radiation is maintained. In an embodiment of the invention, the first recess can be extremely small and designed primarily or only for plasma ignition. In this manner, only minimal microwave energy may be required to ignite the plasma and it may be easier to ignite, especially when using a plasma catalyst in accordance with the present invention. In one embodiment, the first recess can be substantially a single mode recess and the second recess is a multi-mode recess. When the first ignition cavity supports only a single mode, the electric field distribution in the recess can vary greatly to form one or more precisely positioned electric fields. These maximum enthalpies are usually in the first position where the plasma is ignited, so these are ideal locations for placing the plasma catalyst. However, it should be understood that when a plasma catalyst is used, it does not have to be placed at the maximum enthalpy of the electric field, and in many instances it does not need to be oriented in any particular direction. In the foregoing embodiments, in order to explain the present invention smoothly, various features may be combined in a single embodiment. This method of explanation should not be construed as requiring that the invention claimed herein be intended to have more than -28-(26) (26) 1334319 intent of the features recited in each application. On the contrary, the features of the present invention are less than all of the features of the single embodiment described above, as described in the following claims. The scope of the following patent application is hereby incorporated by reference in its entirety in its entirety in its entirety in the the the the the the BRIEF DESCRIPTION OF THE DRAWINGS [0009] Further features of the present invention will become apparent from the Detailed Description of the Drawings. A schematic diagram showing an exemplary plasma system in accordance with the present invention; FIG. 1A shows the use of a powdered plasma catalyst in a plasma chamber for ignition, adjustment or maintenance in an alcove in accordance with the present invention. Exemplary embodiment of a portion of a plasma plasma system; Figure 2 shows an exemplary plasma catalyst fiber having at least one component in accordance with the present invention having a concentration gradient along its length; Figure 3 is shown in accordance with the present invention An exemplary plasma catalyst fiber having multiple components, wherein the ratio of the components varies along its length; Figure 4 shows another exemplary plasma catalyst fiber in accordance with the present invention, the fiber comprising a core inner layer And a coating; Figure 5 shows a cross-sectional view of the plasma catalyst fiber in accordance with the present invention taken along section line 5-5 of Figure 4; Figure 6 shows another portion of the plasma system in accordance with the present invention. An exemplary embodiment wherein the plasma system includes an elongated -29-(27) (27) 1334319 plasma catalyst extending through the ignition aperture; Figure 7 shows the length of the system of Figure 6 that can be used in accordance with the present invention. Illustrative embodiment of a shaped plasma catalyst; Figure 8 shows another exemplary embodiment of an elongated plasma catalyst that can be used in the system of Figure 6 in accordance with the present invention; and Figure 9 shows the use of radiation in accordance with the present invention. An exemplary embodiment of a portion of a plasma system that is directed to a radiant chamber. Component Symbol Table 10 Plasma System 12 Alcove 14 Radiation Chamber 20 Line 22 Control Valve 24 Gas Source 26 Radiation Source 28 Power Supply 30 Waveguide 32 Circulator 34 Regulator 36 Motor 38 Mode Mixer 40 Window 42 Temperature Sensing -30 * (28) controller radiation source radiation alcove plasma alcove powder source catalyst powder gas flow catalyst fragment fragment catalyst fragment fragment fiber bottom coating radiation chamber plasma chamber plasma catalyst ignition hole Conductive distal portion non-conductive portion conductive segment non-conductive segment -31 - (29) 1334319 200 radiation source 205 radiation chamber 2 10 plasma alcove 2 15 orifice 2 16 orifice 220 supply source 225 Ionized particles