1314365 五'發明說明（υ 【發明所屬 本發明 可擴大發光 該造的相關 二極體。 【先前技術 之技術領域】 係涉及發光二極體之增光技術， 晶片的光源發射角度的載體構造 製造方法，藉以獲致較佳亮度表 旨在提供一種 以及用以構成 現效果之發光 按 將發光 電路之 光源， _發光晶 波長結 因 光晶片 作用， 現亮度 種直接 結構， 深入基 片2： 0 3 0的 >0所產 ，而且 提升整 一般發光二 晶片包覆’並 連結，以在發 其光源並且經 片的光源與封 合，以形成預 此，包覆在發 包覆固定之作 以發光晶片的 ;再者，如第 利用基板1 0 此類型的發光 板1 0表面的 定置以及填充 區域侷限在凹 生的光源不但 限制封裝材3 體發光二極的 極體之 且利用 光晶片 由所包 裝材當 期之光 光晶片 用以外 光源能 一圖所 做為發 二極體 凹座1 封裝材 座1 1 會被凹 0對光 亮度表 基本 金線 通電 覆的 中的 色。 外部 ，係 夠在 示， 光晶 係在 1， 3 0 的範 座1 源折 現效 構造 構成 作用 封裝 效果 的封 同時 幾乎 係為 片2 基板 由此 的空 圍當 1周 射、 果。 ，係由 發光晶 下，令 材向外 材（例 裝材除 具有光 整個封 目前所 0載體 1 0的 凹座1 間，如 中，因 圍的基 擴散的 相關的封裝材 片電極與相關 發光晶片產生 照射，或者由 如螢光材）的 了具 線折 裝材 普遍 的發 既定 1做 此將 此發 板部 範圍 有可 射擴 的區 習用 光二 位置 為發 使封 光晶 位所 ，而 將發 散的 域呈 的一 極體 設有 光晶 裝材 片2 阻擋 無法1314365 5 'Inventive Description (υ The invention according to the invention can expand the related diodes of the light-emitting device. [Technical Field of the Prior Art] A light-increasing technology involving a light-emitting diode, a carrier structure manufacturing method for a light source emission angle of a wafer In order to obtain a better brightness table, it is intended to provide a light source for illuminating the light source, and the light source of the light-emitting circuit is formed by the action of the light wafer, and the direct structure of the brightness species is deep into the substrate 2: 0 3 0 Manufactured by >0, and the entire general illuminating two-wafer is coated and bonded to the light source and the light source of the sheet is sealed and sealed to form a pre-coating Further, as the first substrate 10, the surface of the light-emitting panel 10 of this type and the filling area are limited to the concave light source, which not only limits the polar body of the package body 3, but also utilizes the optical wafer. The light-emitting wafer of the current packaging material can be made into a diode recess with a different light source. The package holder 1 1 will be concave 0 to the brightness table. The color of the gold wire is covered by the outer layer. The external light is shown in the figure. The light crystal system is in the frame of 1 and 30. The source-folding effect structure constitutes the sealing effect of the package effect, and is almost the same as the film 2 substrate. It is a one-week shot and a fruit. It is made of luminescent crystals, and the material is made of an outer material. (In addition to the light, the whole package has a recess 1 between the current zero carrier 10, as in the case of the base diffusion. The package sheet electrode and the related light-emitting chip are irradiated, or the wire-folded material, such as a fluorescent material, is generally issued as a predetermined one, so that the hair-emitting portion of the hair-emitting portion has a range of light-emitting areas. The light crystal position is set, and the one body of the divergent domain is provided with the photocrystalline material sheet 2
_Γ_Γ
第5頁 1314365 五、發明說明（2) 【發明内容】 有鑒於此， 板表面既定高度 體，以便進一步 路連結 在封裝 大發光 提高封 亮度表 【實施 • 為 式，茲 本 發光晶 相關製 極體* 凸出基 置發光 電極與 2 0、 據 ’盆部1 的阻擋 晶片 2 ，並由封 材將發光 晶片的光 裝材與基 現效果及 方式】 能使 貴 配合圖式 發明「發 片的光源 造方法， 如第二圖 板1 0表 晶片2 0 基板1 0 金線4 0 以，在封 2包覆的 ，以及增 0的光源 本發明即 的盆部， 利用金線 裝材將發 晶片、金 源發射角 板的接著 信賴性。 審查 說明 光晶 發射 藉以 所示 面既 ,以 的電 以及 裝材 狀態 加封 發射 委員 如下 片之 角度 獲致 ，主 定尚 便利 路連 盆部 3 0 下， 裝材 角度 在一基板.上至少設有 由此盆部做為容置發 構成發光晶片的電極 光晶片、金線以及盆 線以及盆部包覆的狀 度，同時增大封裝材 力，進而提升整體發 一個凸出基 光晶片的載 與基板的電 部包覆，俾 態下，可擴 接觸面積， 光二極體之 清楚本發明之組成，以及實施方 載體構 的載體 具有較 要係在 度的盆 用金線 結，並 1 2包 將發光 可減少 3 0的 ，提升 造」旨 構造以 佳亮度 基板1 部1 2 4 0構 由封裝 覆。 晶片 2 基板1 範圍， 整體發 在提供 及用以 表現效 0上至少設有 ，由此 成發光 材3 0 種可擴大 構成該造的 果之發光二 個 盆部1 2容 晶片.2 0的 將發光晶片 0、金 0對發 因此能 光二極 線4 0以及 光晶片2 0 夠擴大發光 體之亮度表Page 5 1314365 V. Description of the Invention (2) [Invention] In view of this, the surface of the board is a predetermined height body, so that the road is further connected to the package to increase the brightness of the package. The body* protrudes from the base of the illuminating electrode and 20, according to the 'blocking wafer 2 of the bowl 1 and the light-emitting material and the base effect and the way of the illuminating wafer by the sealing material 】 The light source manufacturing method, such as the second board 10 wafer 104 0 substrate 10 0 gold line 40, the cover 2, and the 0 increase of the light source of the present invention, the use of gold wire will be issued The subsequent reliability of the wafer and gold source horn plate. The review shows that the light crystal emission is obtained by the angle of the surface, the electricity and the state of the material, and the angle of the film is obtained from the following film. The mounting angle is provided on at least one of the substrates. The electrode wafer, the gold wire, the basin wire, and the basin cover of the illuminating wafer are arranged as the accommodating portion, and the package is enlarged. The force, in turn, enhances the electrical coating of the substrate and the substrate of the bulging substrate, the expandable contact area, the clearness of the photodiode, the composition of the present invention, and the carrier of the carrier structure. It is necessary to tie the pot with a gold knot, and 12 packs will reduce the light emission by 30, and the structure is improved by a good brightness substrate 1 part 1 2 4 0 package. The wafer 2 substrate 1 range, the overall distribution is provided at least for the performance effect 0, thereby forming the illuminating material 30 kinds of illuminating light constituting the fruit of the two pots 1 2 to the wafer. Brightening the illuminating wafer 0, gold 0, and thus the photodiode 40 and the optical wafer 20
第6頁 1314365 五、發明說明（3) 現效果。 在具體實 一黏著在基板 或者是如第四 ，在本實施例 金屬基板為佳 示， 型至 區塊 光晶 |光晶 金線 發光 包覆 利用一道 少一 1 2 片的 片2 4 0 晶片 ，即 再者 先以一道 一個 在隆 夠放 示， 並且 % 3 塊1 發光 具既 起區 置發 將發 搭接 0將 2 2 二極 個具 2的 盆部 0定 ，最 2 0 構成 ，亦 沖壓 定面 塊1 光晶 光晶 金線 發光 包覆 體。 施時， 1 0表 圖所示 當中， ，而得 沖壓動 既定高 頂面成 1 2構 置在盆 後如第 、金線 前述具 可以如 動作將 度的隆 2 2的 片的盆 片2 0 4 0, 晶片2 ，同樣 如第三 面的環 ，為與 基板1 以如第 作，將 度的隆 型有一 造，以 部1 2 五圖（4 0以 有高亮 第六圖 基板1 起區塊 頂面成部1 2 定置在 最後如 0、金 能夠構 圖所示， 體1 2 1 基板1 0 0係以鋁 五圖（A 基板1 0 起區塊1 凹坑1 2 便如第五 的凹坑1 D )所示 及盆部1 度表現效 (A )及 0 (金屬 12 2, 型有一凹 構造，以 盆部1 2 第六圖（ 線4 0以 成前述具 其盆部1 (或凹杯 一體 基覆 )及 (金 2 2 3以圖（ 2 3 ，利 2的 果的 第六 基板 再以 坑1 便如 的凹 D ) 及盆 有南 力σ工 銅或 第五 屬基 ，同 構成 C ) 當中 用封 隆起 發光 圖（ )沖 另一 2 3 第六 坑1 所示 部1 贵度 2係 )所 成型 銅基 圖（ 板） 時在 能夠 所示 ，並 裝材 區塊 二極 Β ) 壓成 道沖 ，以 圖（ 2 3 ，利 2的 表現 可以由 構成， 的結構 覆銅的 Β )所 沖壓成 此隆起 放置發 ，將發 且搭接 3 0將 12 2 體。 所示， 型至少 壓動作 構成能 C )所 當中， 用封裝 隆起區 效果的Page 6 1314365 V. Description of invention (3) Current effect. In particular, the metal substrate is adhered to the substrate, or the fourth embodiment is used in the present embodiment. The type-to-block optical crystal|photocrystalline gold wire is coated with a film of less than 1 2 wafers. , that is, the first one is to be displayed one by one in the long, and the % 3 block 1 light fixture has both the hair and the hair will be connected to the 0, the 2 2 poles with the 2 pots 0, the most 20 composition, It also stamps the fixed block 1 photo-crystallized gold wire light-emitting cladding. At the time of the application, in the table shown in Fig. 1, the punched moving high top surface is set to 1 2 in the basin, such as the first and the gold wire, and the above-mentioned piece 2 of the sheet 2 can be as long as the action. 0 4 0, the wafer 2, also the ring of the third side, is the same as the substrate 1, as shown in the first, the degree of the ridge is made, with the part 1 2 five (40 to highlight the sixth substrate 1 The top surface of the block is set to 1 2 at the end as shown in Fig. 0, and the gold can be patterned. The body 1 2 1 substrate 1 0 0 is in aluminum five (A substrate 10 0 block 1 pit 1 2 is like Five pits 1 D) and the basin 1 degree performance (A) and 0 (metal 12 2, type has a concave structure, with the basin 1 2 sixth figure (line 40 to the above with its basin) 1 (or the concave cup is covered by the base) and (the gold 2 2 3 is the figure (2 3 , the sixth substrate of the fruit of the 2 is further the pit D as the pit 1) and the basin has the south force σgong copper or the fifth The base group and the same composition C) can be used to display the copper base map (plate) when the ridge is illuminated by the seal (2) and the other part of the 6th pit 1 Block two Β) Pressing into a road, the figure (2 3, the performance of the 2 can be composed of the structure of the copper-clad Β) is stamped into the ridge and placed, and the 3 0 will be 12 2 body. The type of at least the pressure action constitutes C), and the effect of the package ridge area is utilized.
第7頁 1314365 五'發明說明（4) 值得一提的是，在第五圖（A) 、 （B)以及第六圖 (A ) 、 （ B )所示的實施例當中，可直接利用成型模具 5 0的截面構造，讓盆部1 2的凹坑1 2 3形成圓形、橢 圓形或是多邊形的輪廓造型，而且能夠同時在盆部1 2的 底部形成一個凹部1 3 ，俾由此凹部1 3增加發光二晶片 的散熱作用。 如上所述，本發明提供一種可擴大發光晶片的光源發 射角度的載體構造以及用以構成該造的相關製造方法，藉 以獲致較佳亮度表現效果之發光二極體，爰依法提呈發明 專利之申請；惟，以上之實施說明及圖式所示，係本發明 g較佳實施例者，並非以此侷限本發明，是以，舉凡與本發 _明之構造、裝置、特徵等近似、雷同者，均應屬本發明之 創設目的及申請專利範圍之内。Page 7 1314365 V'Inventive Description (4) It is worth mentioning that in the examples shown in the fifth (A), (B) and sixth (A), (B), direct molding can be used. The cross-sectional configuration of the mold 50 allows the dimples 1 2 3 of the bowl portion 12 to form a circular, elliptical or polygonal contour shape, and at the same time, a recess 13 can be formed at the bottom of the bowl portion 12, thereby The recess 13 increases the heat dissipation effect of the light-emitting two wafers. As described above, the present invention provides a carrier structure that can expand the emission angle of a light source of a light-emitting chip, and a related manufacturing method for forming the same, thereby obtaining a light-emitting diode having a better brightness performance effect, and presenting a patent for invention according to law. The present invention is not limited thereto, and is not limited thereto, and is similar to the structure, device, features, etc. of the present invention. All should be within the scope of the creation of the invention and the scope of the patent application.
第8頁 1314365Page 8 1314365
第9頁Page 9