1310127 九、發明說明： 【發明所屬之技術領域】 本發明係關於一種散熱裝置’尤指一種熱管散熱裝置。 【先前技術】 發熱電子元件（如中央處理器）運行時產生大量熱量， 使其本身及系統溫度升高，繼而導致其運行性能之下降。 為確保發熱電子元件能正常運行，通常在發熱電子元件上 Φ女農散熱裝置，排出其所產生之熱量。 圖9所示為一習知散熱裝置，包括一吸熱板i〇a，複數 安置在該吸熱板10a上面之散熱鰭片3〇a，及一連接吸熱板 與散熱鰭片30a之熱管2〇a。該熱管2〇a之橫截面呈圓 形，其包括一與吸熱板l〇a接觸之吸熱段、及兩相互平行 之放熱段，該放熱段貫穿散熱鰭片30a。使用過程中，該散 熱裝置置於一發熱電子元件40a上吸收其產生之熱量並散 籲發至空氣中。首先，發熱電子元件4〇a產生之熱量通過吸 熱板10a傳輸到熱管20a之吸熱段；隨後，該吸熱段吸收 之熱里通過熱官20a之放熱段傳輸到散熱鰭片3〇a，最後釋 放於空氣中。 然而，藉由該熱管20a與散熱鰭片3〇a僅通過散熱鰭片 30a之穿孔，故該熱管2〇a與散熱鰭片3〇a之接觸面積小，並 從吸熱板10a到散熱鰭片3〇3之熱傳導率較低，影響整個散 熱裝置之散熱效率及高散熱性能。 【發明内容】 1310127 有鑒於此’有必要提供一種熱管散熱裝置，其熱管與 散熱體具有較大接觸面積，以達到較大熱傳導率。 一種熱管，包括：一基座，其中該基座上設有一通孔； 一散熱體，該散熱體上形成有複數通道；及一板型熱管， 用於連接一發熱電子元件與該散熱體，其中該板型熱管包 括一吸熱段、一放熱段以及一連接吸熱段與放熱段之連接 段’該吸熱段覆蓋該發熱電子元件之上表面，該吸熱段置 於基座之底部並於該基座通孔處與散熱體之底部接觸，該 放熱段平行於吸熱段並與散熱體之頂部接觸，該連接段連 接吸熱段與放熱段之同側端。 與習知技術相比較，該散熱裝置具有較大接觸面積之 板型熱官’該板型熱管連接發熱電子元件與散熱體，可迅 速、均勻地將發熱電子元件產生之熱量傳遞至散熱體上以 提高其熱傳導率。 【實施方式】 .請參閱圖1，係本發明散熱裝置之第一實施例之組裝 圖。所示散熱裝置用於對一發熱電子元件（圖未示）散熱，該 政熱裝置包括一基座10、一安置於該基座10上之散熱體 20、一連接發熱電子元件與散熱體20之板型熱管30及一 安裝於該散熱體20 —側之風扇40。 請參閱圖2’該散熱體20由複數散熱鰭片組成，各散 熱鰭片相互間隔形成複數通道，風扇4〇產生之氣流流經該 通道對該散熱體20進行散熱。該散熱體20底面22設有一 8 1310127 凸出部（未圖示）’該凸出部穿過基座10之通孔16〇與電子 元件上表面接觸。 板型熱管30呈U型設置，由高熱傳導率之金屬材料製 成，如銅或者鋁。該板型熱管30具有一密封之U型腔室， 且在該腔室内壁形成毛細結構（圖未示）並盛有工作流體（圖 未示）。該毛細結構可以係具有溝槽之管壁，亦可以為貼附 於言壁内之金屬網或金屬細絲，或經由銅粉燒結制程在管 •壁内形成之毛細結構層，亦可以為上述不同結構之組合形 態。該板型熱管30包括一吸熱段32、一放熱段34及一連 接吸熱段32與放熱段34之連接段36。該吸熱段32上表面 與散熱體20底面22之凸出部接觸，該吸熱段32下表面與 發熱電子元件接觸；放熱段34與散熱體2〇之頂部24接觸。 板型熱官30之吸熱段32、放熱段34及連接段36各有一相 互連通之真工腔至。該吸熱段32、放熱段34及連接段％ 寬度相同，厚度亦相同，並且為使板型熱管3〇能夠與散熱 •體2〇之頂部24、底面22之凸出部大面積接觸，板型熱管 30各段之寬度要比厚度大。 基座10用於將散熱裝置固定安裝於一帶有發熱電子元 件之電路板（圖未示）上。該基座1〇包括四支標片14，該支 撐片14從基座1〇之每一角落向外延伸。每一支撐片μ上 都：有-鎖固孔140,用以供鎖固件(圖未示)穿過且與電路 板月：之月板相螺合，從而將散熱裝置固定在該電路板 孚-杜長：开:之凸出體16自基座10向上凸起且與發熱電 兀之曰形成—空間162以容納板型熱管3〇之吸熱段 9 1310127 =凸出體16上設有-矩形通孔⑽，使板型熱管3〇吸熱 又之頂〇[5與散熱體2〇之底面22之凸出部緊密接觸。 風扇40安裝於散熱體2〇 一側並靠近散熱體加之通 用以提供-氣流流經散熱體2〇之通道，以持續排出散 …20上之熱量，大大提高散熱裝置之散熱效率。 散熱裝置對發熱電子元件散熱過程中，板型熱管邛之 吸熱段32接觸並覆蓋發熱電子元件，以吸收發熱電子元件 •產生之熱量。該發熱電子元件與吸熱段％大面積接觸，以 使熱量迅速均勻地傳遞至吸熱段32。吸熱段％吸收之一部 分熱量通過連接段36傳導至放熱段％，再通過放熱段34 .、散熱體20頂部24之接觸’從放熱段34傳遞至散熱體 2〇,最後由散熱體20將熱量散發到空氣中；該吸熱段'32 吸收之另一部分熱量則直接傳導至散熱體2〇再發散在空氣 中因此，發熱電子元件產生之熱量可以通過板型熱管3〇 快速、持續不斷地傳導到散熱體20，最後通過散熱體2〇 φ散發到周圍空氣中，使裝置之散熱效率得到極大提升。 圖3係本發明散熱裝置之第二實施例之立體分解圖。 該第二實施例與第一實施例之結構大致相似。不同之處在 於，第二實施例中採用一散熱體20,取代第一實施例中之散 熱體20。該散熱體2〇，由一發泡金屬材料製成，其上設有複 數蜂窩狀小孔26’以形成複數通道，該散熱體2〇,相對散熱 體20在散熱性能上有顯著提高，而且其結構及制程更簡單。 圖4係本發明散熱裝置之第三實施例之立體分解圖。 1310127 在第三實施例中，一 “口”字型板型熱管3〇，代替了第一實 •施例中之板型熱管30。該板型熱管30,包括一吸熱段32,、 一平行該吸熱段32,之放熱段34’以及分別連接吸熱段32，與 .放熱段34,兩端之二連接段36’，並在該板型熱管3〇，裏面形 成一用於循環工作流體之腔室’使工作流體在板型熱管3〇, 内部循環工作。吸熱段32，、放熱段34,及連接段36,之寬度 相同，厚度亦相同，並且為使熱管3〇，與散熱體2〇及發熱 _電子元件有大面積接觸，各部分寬度要比厚度大。在該裝 置中，熱量從吸熱段32’通過兩連接段36，傳導到放熱段 34，這樣就使吸熱段32i之熱量可以沿兩循環回路傳導，加 速熱量之傳導和提高散熱裝置之散熱效率。 圖5係本發明裝置第四實施例之散熱裝置，其與第一 實施例區別在於，本施例用“口，，字型板型熱管3;替第 一實施例板型熱管30,並且用散熱體2〇，代替了散执體2〇。 該板型熱管30,與第三實施例中之板型熱管3〇，相同，該散 鲁熱體20’與第二實施例中之散熱體2(y結構相同。 圖6至8所示分別為本發明散熱裝置之第五實施例、 第六實施例及第七實施例。第五實施例係在第三實施例之 板型熱管30,除吸熱段32，外之其他外表面形成複數第二轉 片50,以進-步提高散熱裝置之散熱效率。第六實施例係 在第:實施例之板型熱管3〇除吸熱段32外之其他外表面 形成視數第m〇。第七實施例係在第四實施例之板型 熱管30,除吸熱段32，外之其他外表面形成複數第二鰭片％。 綜上所述，本發明符合發明專利要件，美依法提出專 11 1310127 利1叫。惟’以上所述者僅為本發明之較佳實施例，舉凡 熟悉本案技藝之人士’在爰依本發明精神所作之等效修都 或變化，皆應涵蓋於以下之申請專利範圍内。 【圖式簡單說明】 圖1係本發明散熱裝置之第一實施例之組裝圖。 圖2係圖1之立體分解圖。 圖3係本發明散熱裝置之第二實施例之立體分解圖。 丨圖4係本發明散熱裝置之第二實施例之立體分解圖。 圖5係本發明散熱裝置之第四實施例之截面圖，圖中 省略了風扇。 圖6係本發明散熱裝置之第五實施例之截面圖。 圖7係本發明散熱裝置之第六實施例之截面圖。 圖8係本發明散熱裝置之第七實施例之截面圖，圖中 省略了風扇。 . 圖9係一習知散熱裝置及相關電子元件之剖視圖。 【主要元件符號說明】 [習知] 吸熱板 10a 熱管 20a 散熱鰭片 30a 發熱電子元件40a [本發明] 基座 10 支撐片 14 鎖固孔 140 凸出體 16 12 1310127 矩形通孔 160 容納空間 162 散熱體 20、20' 散熱體底面 22 散熱體頂部 24 蜂窩狀小孔 26' 板型熱管 30 > 30' 吸熱段 32、32 放熱段 34、34' 連接段 36、36 風扇 40 第二鰭片 50 131310127 IX. Description of the Invention: [Technical Field] The present invention relates to a heat dissipating device, particularly a heat pipe heat dissipating device. [Prior Art] When a heating electronic component (such as a central processing unit) operates, a large amount of heat is generated, which causes itself and the temperature of the system to rise, which in turn causes a decrease in its running performance. In order to ensure the normal operation of the heating electronic components, the female agricultural heat sink is usually placed on the heat-generating electronic components to discharge the heat generated by the female. FIG. 9 shows a conventional heat dissipating device including a heat absorbing plate i〇a, a plurality of heat dissipating fins 3〇a disposed on the heat absorbing plate 10a, and a heat pipe 2〇a connecting the heat absorbing plate and the heat dissipating fins 30a. . The heat pipe 2A has a circular cross section, and includes a heat absorbing section in contact with the heat absorbing plate 10a, and two mutually parallel heat releasing sections, the heat radiating section penetrating through the heat radiating fins 30a. During use, the heat sink is placed on a heat-generating electronic component 40a to absorb the heat generated by it and to dissipate it into the air. First, the heat generated by the heat-generating electronic component 4〇a is transmitted to the heat-absorbing section of the heat pipe 20a through the heat-absorbing plate 10a; then, the heat absorbed by the heat-absorbing section is transmitted to the heat-dissipating fins 3〇a through the heat-dissipating section of the heat officer 20a, and finally released. In the air. However, since the heat pipe 20a and the heat dissipation fins 3a are only perforated by the heat dissipation fins 30a, the contact area of the heat pipes 2A and the heat dissipation fins 3a is small, and the heat dissipation plate 10a to the heat dissipation fins The thermal conductivity of 3〇3 is low, which affects the heat dissipation efficiency and high heat dissipation performance of the entire heat sink. SUMMARY OF THE INVENTION 1310127 In view of the need to provide a heat pipe heat sink, the heat pipe and the heat sink have a large contact area to achieve a large thermal conductivity. A heat pipe includes: a pedestal, wherein the pedestal is provided with a through hole; a heat dissipating body, the heat dissipating body is formed with a plurality of channels; and a plate type heat pipe for connecting a heat generating electronic component and the heat dissipating body, Wherein the plate type heat pipe comprises a heat absorption section, a heat release section and a connection section connecting the heat absorption section and the heat release section, the heat absorption section covers the upper surface of the heat generating electronic component, and the heat absorption section is disposed at the bottom of the base and at the base The through hole is in contact with the bottom of the heat dissipating body, and the heat releasing portion is parallel to the heat absorption portion and is in contact with the top of the heat dissipating body, and the connecting portion is connected to the same side end of the heat absorption portion and the heat releasing portion. Compared with the prior art, the heat dissipating device has a large contact area, and the plate type heat pipe connects the heat generating electronic component and the heat dissipating body, and can quickly and uniformly transfer the heat generated by the heat generating electronic component to the heat dissipating body. To increase its thermal conductivity. [Embodiment] Fig. 1 is an assembled view of a first embodiment of a heat sink according to the present invention. The heat dissipating device is configured to dissipate heat from a heat-generating electronic component (not shown). The thermal device includes a base 10, a heat sink 20 disposed on the base 10, and a heat-generating electronic component and a heat sink 20 The plate type heat pipe 30 and a fan 40 mounted on the side of the heat sink 20 are provided. Referring to FIG. 2', the heat sink 20 is composed of a plurality of heat radiating fins, and the heat radiating fins are spaced apart from each other to form a plurality of channels, and the airflow generated by the fan 4〇 flows through the channel to dissipate the heat sink 20. The bottom surface 22 of the heat sink 20 is provided with an 8 1310127 projection (not shown). The projection passes through the through hole 16 of the base 10 to contact the upper surface of the electronic component. The plate type heat pipe 30 is U-shaped and made of a metal material having a high thermal conductivity such as copper or aluminum. The plate-type heat pipe 30 has a sealed U-shaped chamber, and a capillary structure (not shown) is formed inside the chamber wall and contains a working fluid (not shown). The capillary structure may be a wall having a groove, or may be a metal mesh or a metal filament attached to the wall of the wall, or a capillary structure layer formed in the tube wall by a copper powder sintering process, or may be the above The combination of different structures. The plate type heat pipe 30 includes a heat absorbing section 32, a heat releasing section 34, and a connecting section 36 connecting the heat absorbing section 32 and the heat releasing section 34. The upper surface of the heat absorbing section 32 is in contact with the convex portion of the bottom surface 22 of the heat sink 20. The lower surface of the heat absorbing section 32 is in contact with the heat generating electronic component; the heat releasing section 34 is in contact with the top portion 24 of the heat sink 2. The heat absorbing section 32, the heat releasing section 34 and the connecting section 36 of the plate type heat official 30 each have a real working chamber connected to each other. The heat absorption section 32, the heat release section 34, and the connection section have the same width and the same thickness, and the plate type heat pipe 3〇 can be in contact with the convex portion of the top portion 24 and the bottom surface 22 of the heat dissipation body 2, the plate type The width of each section of heat pipe 30 is greater than the thickness. The susceptor 10 is used to fix the heat sink to a circuit board (not shown) with a heat generating electronic component. The base 1 includes four tabs 14, which extend outwardly from each corner of the base 1''. Each support piece μ has: a locking hole 140 for the fastener (not shown) to pass through and is screwed with the moon plate of the circuit board, thereby fixing the heat sink to the circuit board - Du Chang: On: The protruding body 16 is raised upward from the base 10 and formed with the heat generating electric raft - a space 162 for accommodating the heat absorbing section of the plate type heat pipe 3 13 13 1310127 = provided on the protruding body 16 - The rectangular through hole (10) causes the heat of the plate type heat pipe 3 to be in close contact with the convex portion of the bottom surface 22 of the heat sink 2 . The fan 40 is mounted on the side of the heat sink 2 并 and is adjacent to the heat sink to provide a passage for the airflow to flow through the heat sink 2 to continuously discharge the heat of the heat sink 20, thereby greatly improving the heat dissipation efficiency of the heat sink. During the heat dissipation process of the heat-dissipating electronic component, the heat-absorbing section 32 of the plate-type heat pipe contacts and covers the heat-generating electronic component to absorb the heat generated by the heat-generating electronic component. The heat-generating electronic component is in contact with the heat absorbing section % in a large area so that heat is quickly and uniformly transmitted to the heat absorbing section 32. A part of the heat absorbed by the heat absorption section is conducted to the heat release section % through the connection section 36, and then passes through the heat release section 34. The contact 24 of the heat sink 20 is transferred from the heat release section 34 to the heat sink 2〇, and finally the heat is radiated by the heat sink 20. Dissipated into the air; the other part of the heat absorbed by the endothermic section '32 is directly transmitted to the heat sink 2 and then dissipated in the air. Therefore, the heat generated by the heat-generating electronic components can be quickly and continuously transmitted to the heat exchanger of the plate type. The heat sink 20 is finally dissipated into the surrounding air through the heat sink 2〇φ, so that the heat dissipation efficiency of the device is greatly improved. Figure 3 is a perspective exploded view of a second embodiment of the heat sink of the present invention. This second embodiment is substantially similar to the structure of the first embodiment. The difference is that a heat dissipating body 20 is used in the second embodiment instead of the heat radiating body 20 in the first embodiment. The heat dissipating body 2 is made of a foamed metal material, and a plurality of honeycomb small holes 26 ′ are formed thereon to form a plurality of channels, and the heat dissipating body 2 〇 has a significant improvement in heat dissipation performance relative to the heat dissipating body 20 , and Its structure and process are simpler. Figure 4 is a perspective exploded view of a third embodiment of the heat sink of the present invention. 1310127 In the third embodiment, a "mouth" type plate type heat pipe 3 is replaced by the plate type heat pipe 30 of the first embodiment. The plate type heat pipe 30 includes a heat absorbing section 32, a heat absorbing section 32 parallel to the heat absorbing section 32, and a heat absorbing section 32, and a heat releasing section 34, and two connecting sections 36' at both ends, and The plate type heat pipe is 3 〇, and a chamber for circulating a working fluid is formed therein, so that the working fluid is circulated in the plate type heat pipe, and the inside is circulated. The heat absorbing section 32, the heat releasing section 34, and the connecting section 36 have the same width and the same thickness, and have a large area contact with the heat radiating body 2 and the heat generating element, and the width of each part is thicker than the thickness. Big. In this arrangement, heat is conducted from the heat absorbing section 32' through the two connecting sections 36 to the heat releasing section 34, so that the heat of the heat absorbing section 32i can be conducted along the two circulating loops, accelerating the conduction of heat and improving the heat dissipation efficiency of the heat sink. Figure 5 is a heat dissipating device of a fourth embodiment of the apparatus of the present invention, which differs from the first embodiment in that the present embodiment uses a "mouth, type plate type heat pipe 3; for the first embodiment plate type heat pipe 30, and The heat dissipating body 2〇 replaces the loose body 2〇. The plate type heat pipe 30 is the same as the plate type heat pipe 3〇 in the third embodiment, and the heat radiating body in the second embodiment 2 (y is the same structure. Figures 6 to 8 are respectively a fifth embodiment, a sixth embodiment and a seventh embodiment of the heat sink of the present invention. The fifth embodiment is the plate type heat pipe 30 of the third embodiment, In addition to the heat absorption section 32, the other outer surface forms a plurality of second rotors 50 to further improve the heat dissipation efficiency of the heat sink. The sixth embodiment is in addition to the heat absorption section 32 of the plate type heat pipe 3 of the embodiment: The other outer surface forms a visual number m. The seventh embodiment is the plate-type heat pipe 30 of the fourth embodiment, except for the heat absorption section 32, and the other outer surfaces form a plurality of second fins %. The invention complies with the requirements of the invention patent, and the United States legally proposes a special 11 1310127. However, the above is only the invention. The preferred embodiment of the present invention is to be construed as being limited to the scope of the invention as described in the following claims. FIG. 1 is a heat dissipation device of the present invention. Figure 2 is an exploded perspective view of the second embodiment of the heat sink of the present invention. Figure 4 is a perspective view of a second embodiment of the heat sink of the present invention. Figure 5 is a cross-sectional view of a fourth embodiment of the heat sink of the present invention, with the fan omitted. Figure 6 is a cross-sectional view of a fifth embodiment of the heat sink of the present invention. Figure 7 is a heat sink of the present invention. Figure 6 is a cross-sectional view of a seventh embodiment of the heat sink of the present invention, with the fan omitted. Figure 9 is a cross-sectional view of a conventional heat sink and associated electronic components. Description] [General] Heat absorbing plate 10a Heat pipe 20a Heat sink fin 30a Heat generating electronic component 40a [Invention] Base 10 Support piece 14 Locking hole 140 Projecting body 16 12 1310127 Rectangular through hole 160 accommodating space 16 2 Heat sink 20, 20' Heat sink bottom 22 Heat sink top 24 Honeycomb hole 26' Plate heat pipe 30 > 30' Heat absorption section 32, 32 Heat release section 34, 34' Connection section 36, 36 Fan 40 Second fin Sheet 50 13