1308687 九、發明說明： 【發明所屬之技術領域】 本發明係關於一種散熱模組，特別係關於一種用於發 熱電子元件散熱之散熱模組。 【先前技術】 隨著中央處理器（CPU)等發熱電子元件功率之不斷 提高，散熱問題越來越受到人們重視，在電腦中更是如此， 為了在有限之空間内高效地帶走系統產生之熱量，目前業 界主要採用由散熱片、熱管及風扇組成之散熱模組，並通 過彈片等固定元件將散熱模組裝設於電路板上，借彈片之 力量使散熱模組與CPU良好接觸。 目前散熱模組所使用彈片之外形多採用直線片狀設 計，如圖5所示即係常見之直型彈片，該彈片整體呈“T” 形，包括一連接部42c和一裝配部44c。連接部42c上開 有兩個固定孔421c，通過該等固定孔421c將該連接部42c 與散熱模組鉚合連接，當然也可通過螺合等方式相連接。 裝配部44c從連接部4七之末端向兩邊縱向延伸。裝配部 44c之兩端各開一裝配孔441c，供裝配該裝配部44c至電 路板之螺絲穿設之用。組裝時，通過彈片上之固定孔421c 將彈片與散熱模組固定連接在一起，然後用螺絲等固定件 通過兩裝配孔441c將彈片與電路板鎖合，將散熱模組裝設 於電路板之發熱電子元件上，使散熱模組能及時有效地對 其散熱。 散熱模組與電子元件之間接觸之優劣直接影響兩元件 1308687 .之間之接觸熱阻值，即直接影響散熱模組之效率。而散熱 • 難主要係借助於施加在彈片兩端之裝配孔 441c之鎖合 力來固^，礙於空間限制，㈣孔42lc與裝配孔441c之 間彈I·生|之長度較知，彈性臂會隨著施力產生變形，其壓 •，缩位移行程之變化會產生彈力上極劇之變化，彈力設計控 ' 科目岐響純組與發熱電子元件接觸之穩定 性，進而影響到散熱模組之散熱性能。 【發明内容】 馨 轉於此’有必要提供—種具有能提供穩定壓力之彈 片之散熱模組。 該散熱模組用於對發熱電子元件散熱，包括一底座及 將該底座固定至發熱電子元件之至少一彈片，該彈片包括 與底座相結合之一結合部及用於將底座鎖固於發熱電子元 件上之至少-鎖合部’其中該鎖合部由該結合部延伸形成 彎曲形。 • 與習知技術相比，該彈片之鎖合部呈彎曲形，可以在 既有之空間，減緩彈片因行程些微變動即引發彈力極劇之 變化’使發熱電子元件接觸面和散熱模組產生穩定之接觸 壓力從而使散熱模組能與發熱電子元件緊密相連，提高 散熱模組之散熱效率。 【實施方式】 如圖1和圖2所示為本發明散熱模組之一較佳實施 例’该散熱模組包括一風扇10、一籍片組20、一熱管30 及一對將該散熱模組鎖合在電路板（圖未示）上之彈片40。 1308687 • 風扇10包括一殼體102,殼體102内設有一扇輪50，殼體 - 102 —側形成出風口 60，供風扇10產生之氣流通過。殼體 102另一側向外延伸形成一底座104,底座1〇4中央形成一 通孔108，通孔108兩側分別形成一板體1〇7，每一板體 • 107上設有三個大小相同、等距排列之銷釘1〇9,用於固定 彈片40。通孔108呈方形’其大小與熱管30之外殼大小 相當，且該通孔108下方設有一吸熱塊70。底座104之上 側形成一凹槽106 ’該凹槽106用於定位熱管30且與通孔 P 108相連通。 兩個彈片40結構形狀相同，均為平面彎曲型結構，且 相對於底座104對稱設置，如圖3所示，每一彈片40包括 一結合部42和第一、第二鎖合部44、46，結合部42呈縱 長直線狀，於其中間部位沿縱向設有三個大小相同、等距 排列之固定孔，分別為第一固定孔421、第二固定孔422、 第三固定孔423,其大小與風扇10之底座104上之銷釘109 | 大小相應。第二固定孔422處在直線部42之正中間，第一 固定孔421和第三固定孔423分別在第二固定孔422之兩 側並相對第二固定孔422呈對稱分佈，各固定孔421、422、 423之間之間距與各銷釘1〇9之間之間距相同。第一鎖合 部44和第二鎖合部46分別從結合部42之兩端反向彎曲延 伸形成’其形狀貌似字母“L” ，且呈相向設置。在第一 鎖合部44之末端設有一裝配孔441，該裝配孔441呈圓 形。在第二鎖合部46之末端設有另一裝配孔461，該裝配 孔461呈腰圓形。兩個裝配孔441、461呈不同形態，主要 8 1308687 係考慮到散熱模組與電路板組裝時之配合公差問題，在滿 足公差之前提下，兩個裝配孔441、461亦可以為相同形狀。 鰭片組20設置在風扇模組1〇之出風口 6〇處，由複數 平行相間排列之鰭片22組成，相鄰之兩鰭片22之間形成 供氣流通過之流道24。熱管30包括一蒸發端3〇2和一冷 凝端304。熱管30之蒸發端302放置在底座1〇4之凹槽1〇6 中’吸熱塊70收容于通孔ι〇8内並與熱管3〇之蒸發端如2 相接觸，從而將發熱電子元件（圖未示）產生之熱量傳遞 至熱g 30。熱管30之冷凝端304呈彎曲延伸與,韓片紐如 熱連接。 ^ 該散熱模組組裝時，將兩個彈片40與風扇1〇之底座 104固定，本實施例中，彈片40上之三個固定孔421、422、 423分別與底座1〇4上之三個銷釘1〇9相結合，其可通過 干涉配合相固定，該結合部42亦可借由螺鎖或卡扣等方式 與底座104相固接。而彈片4〇之鎖合部44、46則通過其 裝配孔441 461，用螺絲等固定件固定連接於電路板上， 從而將該散熱模組與f路板鎖合蚊，使散減組置於發 熱電子兀件上以吸收並散發其產生之熱量。該散熱模組與 毛熱電子元件接觸之穩定性及緊密度主要由加在平面彎曲 型彈片4〇、上之作用力來保證，每-裝配孔441 (或461) 與第-固定孔422之間相當於形成一彈性臂，根據懸臂 原理，施加於每—彈性臂上之㈣： ^ p (1) 9 1308687 其中，p為載荷，亦即等效於該彈性臂被鎖合產生之 彈力’E為彈性模量，γ為撓度，也即該彈性臂之壓縮行 程，w為該彈性臂之寬度，t為該彈性臂之厚度，l為該彈 性臂之有效長度。由公式⑴可知，呈三次方關係， 而Y與P呈-次方關係’因而當其他因素確定之情況下， L值增大-定程度後，γ之相應變化對p值之影響則變小。1308687 IX. Description of the Invention: [Technical Field] The present invention relates to a heat dissipation module, and more particularly to a heat dissipation module for heat dissipation of an electronic component. [Prior Art] With the continuous improvement of the power of heat-generating electronic components such as a central processing unit (CPU), the problem of heat dissipation has been paid more and more attention, especially in computers, in order to efficiently take away the system in a limited space. At present, the heat sink module consisting of a heat sink, a heat pipe and a fan is mainly used in the industry, and the heat sink module is assembled on the circuit board through a fixing component such as a shrapnel, and the heat sink module is in good contact with the CPU by the force of the shrapnel. At present, the shape of the shrapnel used in the heat dissipating module is mostly in the form of a straight sheet. As shown in FIG. 5, it is a common straight type shrapnel. The shrapnel has a "T" shape as a whole, and includes a connecting portion 42c and a fitting portion 44c. Two fixing holes 421c are formed in the connecting portion 42c, and the connecting portion 42c is connected to the heat dissipating module by the fixing holes 421c, and of course, it may be connected by screwing or the like. The fitting portion 44c extends longitudinally from both ends of the connecting portion 47 to both sides. A mounting hole 441c is formed at each end of the mounting portion 44c for screwing the mounting portion 44c to the circuit board. During assembly, the elastic piece and the heat dissipation module are fixedly connected by the fixing hole 421c on the elastic piece, and then the elastic piece is locked with the circuit board through the two mounting holes 441c by screws and the like, and the heat dissipation die is assembled on the circuit board. On the heating electronic components, the heat dissipation module can dissipate heat in a timely and effective manner. The contact between the thermal module and the electronic component directly affects the contact thermal resistance between the two components 1308687, which directly affects the efficiency of the thermal module. The heat dissipation is difficult to fix mainly by the locking force applied to the mounting holes 441c at both ends of the elastic piece. Due to the space limitation, the length of the hole (42) between the hole 42lc and the mounting hole 441c is relatively good, and the elastic arm is known. It will deform according to the force applied, and the change of the pressure and contraction stroke will produce a change in the elastic force. The elastic design control will stabilize the contact between the pure group and the heating electronic component, thus affecting the heat dissipation module. Thermal performance. SUMMARY OF THE INVENTION It is necessary to provide a heat dissipating module having a shrapnel capable of providing a stable pressure. The heat dissipation module is configured to dissipate heat from the heat-generating electronic component, and includes a base and at least one elastic piece fixing the base to the heat-generating electronic component, the elastic piece including a joint portion combined with the base and the base for locking the heat-generating electron At least a latching portion on the component, wherein the latching portion is extended from the joint portion to form a curved shape. • Compared with the conventional technology, the locking part of the shrapnel is curved, which can reduce the change of the elastic piece due to slight fluctuation of the elastic piece in the existing space, so that the contact surface of the heating electronic component and the heat dissipation module are generated. The stable contact pressure enables the heat dissipation module to be closely connected with the heat-generating electronic components, thereby improving the heat dissipation efficiency of the heat dissipation module. [Embodiment] As shown in FIG. 1 and FIG. 2, a heat dissipation module of the present invention includes a fan 10, a chip set 20, a heat pipe 30, and a pair of heat dissipation modules. The group 40 is locked to the spring 40 on a circuit board (not shown). 1308687 • The fan 10 includes a housing 102 having a wheel 50 therein, and a side of the housing - 102 forms an air outlet 60 for airflow generated by the fan 10. The other side of the housing 102 extends outwardly to form a base 104. A through hole 108 is formed in the center of the base 110. The two sides of the through hole 108 respectively form a plate body 1〇7, and each plate body 107 has three same sizes. The pins 1〇9 are arranged equidistantly for fixing the elastic piece 40. The through hole 108 has a square shape corresponding to the size of the outer casing of the heat pipe 30, and a heat absorbing block 70 is disposed below the through hole 108. A groove 106 is formed on the upper side of the base 104. The groove 106 is for positioning the heat pipe 30 and communicating with the through hole P108. The two elastic pieces 40 have the same structural shape and are flat curved structures, and are symmetrically disposed with respect to the base 104. As shown in FIG. 3, each elastic piece 40 includes a joint portion 42 and first and second locking portions 44 and 46. The joint portion 42 has a longitudinally long straight shape, and three fixing holes of the same size and equidistant arrangement are disposed in the longitudinal direction of the middle portion thereof, respectively being the first fixing hole 421, the second fixing hole 422, and the third fixing hole 423. The size corresponds to the size of the pin 109 | on the base 104 of the fan 10. The second fixing hole 422 is located in the middle of the straight portion 42 . The first fixing hole 421 and the third fixing hole 423 are respectively symmetrically distributed on the two sides of the second fixing hole 422 and opposite to the second fixing hole 422 . The distance between 422 and 423 is the same as the distance between each pin 1〇9. The first lock portion 44 and the second lock portion 46 are respectively bent and extended from opposite ends of the joint portion 42 to form a shape which looks like the letter "L" and is disposed opposite to each other. An assembly hole 441 is provided at the end of the first lock portion 44, and the assembly hole 441 has a circular shape. At the end of the second lock portion 46, another fitting hole 461 is provided, which is rounded in a waist shape. The two mounting holes 441 and 461 have different shapes. The main 8 1308687 considers the tolerance problem of the assembly of the heat dissipation module and the circuit board. The two assembly holes 441 and 461 can also be the same shape before being fully satisfied. The fin assembly 20 is disposed at the air outlet 6 of the fan module 1 and is composed of a plurality of fins 22 arranged in parallel, and a flow passage 24 through which air flows is formed between the adjacent fins 22. The heat pipe 30 includes an evaporation end 3〇2 and a condensation end 304. The evaporation end 302 of the heat pipe 30 is placed in the groove 1〇6 of the base 1〇4. The heat absorption block 70 is received in the through hole ι8 and is in contact with the evaporation end of the heat pipe 3〇, such as 2, thereby heating the electronic component ( The heat generated is not transferred to the heat g 30. The condensing end 304 of the heat pipe 30 is bent and extended, and the Korean film is thermally connected. When the heat dissipating module is assembled, the two elastic pieces 40 are fixed to the base 104 of the fan 1 . In this embodiment, the three fixing holes 421 , 422 , and 423 on the elastic piece 40 and the three of the bases 1 and 4 respectively The pins 1 〇 9 are combined, and they can be fixed by an interference fit. The joint portion 42 can also be fixed to the base 104 by means of a screw lock or a snap. The locking portions 44 and 46 of the elastic piece 4 are fixedly connected to the circuit board through fixing holes 441 461 through screws, and the like, thereby fixing the heat dissipation module and the f-way plate to the mosquito, so as to reduce the assembly. On the heating electronic component to absorb and dissipate the heat it generates. The stability and tightness of the contact between the heat dissipating module and the hot metal component are mainly ensured by the force applied to the flat curved elastic piece 4, and the mounting hole 441 (or 461) and the first fixing hole 422 are The equivalent of forming a resilient arm, according to the cantilever principle, is applied to each of the elastic arms (4): ^ p (1) 9 1308687 where p is the load, which is equivalent to the elastic force generated by the elastic arm being locked. E is the elastic modulus, γ is the deflection, that is, the compression stroke of the elastic arm, w is the width of the elastic arm, t is the thickness of the elastic arm, and l is the effective length of the elastic arm. It can be known from the formula (1) that there is a cubic relationship, and Y and P are in a power relationship - so when the other factors are determined, the L value is increased to a certain extent, and the corresponding change of γ is less affected by the p value. .
彈片40由於鎖合部44、46呈彎曲形，增加了分擔彈 片4〇形變壓力之長度，亦即實質上增大了公式⑴中之l 值，因而彎曲型彈片40壓縮行程上之微小變化（即γ值 之微小變化）不會導致彈力（即？值）極劇之波動，因而 能使散熱模組與發熱電子元件之接觸壓力變得穩定，有利 於熱量之傳遞，提高散熱模組之散熱效率。 如下表1為直型彈片與彎曲型彈片一系列對比實驗所 知之資料，其中彈片採用之材料為不錄銅（SUS3〇i)，分 1/2H、3/4H兩種硬度，彈片之厚度為0.3mm和〇 4mm兩 種規格，彈片之寬度為6mm和4.5mm兩種規格。 表1 直型彈片與彎曲型彈片對比實驗資料The elastic piece 40 has a curved shape due to the locking portions 44, 46, which increases the length of the deformation pressure of the shared elastic piece 4, that is, substantially increases the value of l in the formula (1), and thus the small change in the compression stroke of the curved elastic piece 40 ( That is, the slight change of the γ value does not cause the fluctuation of the elastic force (ie, the value), so that the contact pressure between the heat dissipation module and the heat-generating electronic component can be stabilized, which is beneficial to the heat transfer and the heat dissipation of the heat dissipation module. effectiveness. Table 1 below shows the data of a series of contrast experiments between straight and curved shrapnel. The material used for shrapnel is copper (SUS3〇i), which is divided into 1/2H and 3/4H hardness. Available in 0.3mm and 〇4mm sizes, the width of the shrapnel is 6mm and 4.5mm. Table 1 Comparison of experimental data between straight and curved shrapnel
No. 彈片 厚度 彈片 寬度 材質 壓縮 行程 彈力 型式 1 0.3mm 6mm SUS301,1/2H 1mm 9.2KG 直型 2 0.3mm 6mm SUS301,3/4H 1mm 7.7KG 直型 3 0.4mm 4.5mm SUS301,1/2H 1mm 10.2KG 直型 4 0.4mm 4.5mm SUS301，3/4H 1mm 10.8KG 直型 5 0.4mm 6mm SUS301，1/2H 1mm 5.8KG 彎1曲型 1308687 * —6 丨0.4細 6mm SUS301，3/4H 1mm 5.8KG 彎曲型 由表1中之No.5與No.l之對比和No.6與No.2之對 比可知’在彈片寬度、材質相同之情況下，作相同之壓縮 行私變化’相對較厚之彎曲型彈片產生之彈力之變化反而 要小；由表1中之No.5與Νο·3之對比和No.6與No.4之 對比可知，在彈片厚度、材質相同之情況下，作相同之壓 縮行程變化，相對較寬之平面彎曲型彈片產生之彈力之變 化反而較小（由公式0)得知，在其他因素確定之情況下， P值隨著w值或t值之增大而增大）。由此可見，該散熱 杈組採用彎曲型彈片，與採用直型彈片相比，可以在既有 之空間，減緩彈片因行程些微變動即引發彈力極劇之變 化，使發熱電子元件接觸面和散熱模組產生穩定之接觸壓 力，從而使散熱模組能與發熱電子元件緊密相連，提高散 熱模組之散熱效率。 如圖4所示為本發明另一實施例中之平面彎曲型彈片 4〇a之俯視圖。該實施例中，除了彈片4〇a作形狀上之改 變外，散熱模組之其他元件都與前述實施例中基本相同， 在此不再贅述。彈片40a亦包括一結合部42a和第一、第 一鎖合部44a、46a，結合部42a呈“τ”型，其上沿橫向 設有兩個大小相同之固定孔421a，這些固定孔42u用於 將彈片40a固定至底座1〇4上，底座ι〇4上之銷钉1〇9隨 固定孔421a之位置、數量之變化亦作相應調整，當然亦可 以螺鎖或卡扣等方式將彈片40a與底座1〇4固定連接。第 11 •1308687 一鎖合部44a和第二鎖合部46a分別從結合部42a之兩侧 彎曲延伸形成，其形狀貌似字母“C” ，且其開口朝相同 方向。在第一鎖合部44a、第二鎖合部46a遠離結合部42a 之末端上分別設有一裝配孔441a、461a，都呈腰圓形，當 然亦可為圓形等其他不同形狀。每一裝配孔441a(或461a) 與固定孔421a之間相當於形成一彎曲形彈性臂，該等裝配 孔441a、461a用於裝配該裝配部44a、46a至電路板上。No. Shrapnel thickness Shrapnel width Material Compression stroke Elastic type 1 0.3mm 6mm SUS301, 1/2H 1mm 9.2KG Straight 2 0.3mm 6mm SUS301, 3/4H 1mm 7.7KG Straight 3 0.4mm 4.5mm SUS301, 1/2H 1mm 10.2KG Straight type 4 0.4mm 4.5mm SUS301, 3/4H 1mm 10.8KG Straight type 5 0.4mm 6mm SUS301, 1/2H 1mm 5.8KG Bend 1 curved type 1308687 * —6 丨0.4 Fine 6mm SUS301,3/4H 1mm 5.8 The KG bending type is compared with No. 5 and No. 1 in Table 1 and No. 6 and No. 2. It can be seen that 'the same compression and private change in the case of the same width and material of the shrapnel' is relatively thick. The change of the elastic force generated by the curved elastic piece is small; the comparison between No. 5 and Νο·3 in Table 1 and the comparison between No. 6 and No. 4 show that in the case of the same thickness and material of the elastic piece, The same compression stroke change, the change of the elastic force generated by the relatively wide flat curved elastic piece is relatively small (by the formula 0), and the P value increases with the value of w or t when other factors are determined. And increase). It can be seen that the heat-dissipating group adopts a curved elastic piece, which can reduce the elastic force of the elastic piece due to slight fluctuation of the stroke, and the contact surface and heat dissipation of the heat-generating electronic component can be reduced in the existing space compared with the straight elastic piece. The module generates a stable contact pressure, so that the heat dissipation module can be closely connected with the heat-generating electronic components, thereby improving the heat dissipation efficiency of the heat dissipation module. Fig. 4 is a plan view showing a planar curved elastic piece 4〇a according to another embodiment of the present invention. In this embodiment, except for the shape change of the elastic piece 4〇a, other components of the heat dissipation module are substantially the same as those in the foregoing embodiment, and details are not described herein again. The elastic piece 40a also includes a joint portion 42a and first and first locking portions 44a, 46a. The joint portion 42a has a "τ" shape, and two fixing holes 421a of the same size are disposed on the upper side thereof, and the fixing holes 42u are used for the fixing holes 42u. The elastic piece 40a is fixed to the base 1〇4, and the pin 1〇9 on the base 〇4 is adjusted correspondingly according to the position and quantity of the fixing hole 421a. Of course, the elastic piece can be screwed or buckled. 40a is fixedly connected to the base 1〇4. 11:1308687 A locking portion 44a and a second locking portion 46a are respectively formed by bending and extending from both sides of the joint portion 42a, and have a shape resembling the letter "C" and having openings in the same direction. Mounting holes 441a, 461a are respectively provided at the ends of the first latching portion 44a and the second latching portion 46a away from the joint portion 42a, and are all formed in a waist shape, and of course, may have other shapes such as a circular shape. A fitting elastic hole is formed between each of the fitting holes 441a (or 461a) and the fixing hole 421a, and the fitting holes 441a, 461a are for fitting the fitting portions 44a, 46a to the circuit board.
以上實施例中，每一彈片40或40a上形成相互對稱設 置之兩彈性臂，本發明亦可以以其他方式來實現，如彎曲 型彈片40、40a在形狀上可作進一步之等效變換，並非僅 限於上述實施例所描述之形狀。 综上所述，本發明符合發明專利之要件，絲法提出 =申請。惟以上所述者僅為本發明之較佳實施例，舉凡 :本案技藝之人士’在爰依本發明精神所作之等效修飾 或史化，皆應涵蓋於以下之申請專利範圍内。 【圖式簡單說明】 圖1為本發明散熱模組—實施例之分解圖。 圖2為該散熱模組之組合立體圖。 圖3為該實施例中平面彎曲型彈片之俯視圖。In the above embodiment, each of the elastic pieces 40 or 40a is formed with two elastic arms symmetrically disposed, and the present invention can also be implemented in other manners, for example, the curved elastic pieces 40, 40a can be further transformed in shape, not It is limited to the shape described in the above embodiment. In summary, the present invention meets the requirements of the invention patent, and the silk method proposes = application. However, the above description is only the preferred embodiment of the present invention, and the equivalent modifications or history of the present invention in the spirit of the present invention should be included in the following claims. BRIEF DESCRIPTION OF THE DRAWINGS Figure 1 is an exploded view of an embodiment of a heat dissipation module of the present invention. 2 is a combined perspective view of the heat dissipation module. Figure 3 is a plan view of the planar curved elastic piece in this embodiment.
圖4為本發明另—實施例中平面彎曲型彈片之俯視 之結構示意圖 圖5為習知技術中直型彈片 【主要元件符號說明】 〈本發明〉 •13086874 is a schematic structural view of a planar curved elastic piece according to another embodiment of the present invention. FIG. 5 is a vertical elastic piece of the prior art. [Main component symbol description] <The present invention> • 1308687
風扇 10 殼體 102 底座 104 凹槽 106 板體 107 通孔 108 銷釘 109 鰭片組 20 鰭片 22 流道 24 熱管 30 蒸發端 302 冷凝端 304 彈片 40、 40a 結合部 42、42a 固定孔 421a 第一固定孔 421 第二固定孔 422 第三固定孔 423 第一鎖合部 44 ' 44a 裝配孔 441、441a、 461 、 461a 第二鎖合部 46 、 46a 扇輪 50 出風口 60 吸熱塊 70 〈習知〉 連接部 42c 固定孔 421c 裝配部 44c 裝配孔 441c 13Fan 10 housing 102 base 104 groove 106 plate 107 through hole 108 pin 109 fin group 20 fin 22 flow channel 24 heat pipe 30 evaporation end 302 condensation end 304 spring 40, 40a joint portion 42, 42a fixing hole 421a first Fixing hole 421 second fixing hole 422 third fixing hole 423 first locking portion 44 ' 44a mounting hole 441, 441a, 461, 461a second locking portion 46, 46a fan wheel 50 air outlet 60 heat absorbing block 70 〉 Connection part 42c fixing hole 421c fitting part 44c mounting hole 441c 13