1302823 九、發明說明： 【發明所屬之技術領域】 特別係一種用於電子元件上 本發明係一種散熱裝置 之散熱裝置。 【先前技術】 發熱電子元件（如中央處理器）運行時產生大量献量， 而使其本身及系統溫度升高，繼而導致其運行性能之下 降。為讀保發熱電子元件能正常運行，通常在發熱電子元 件上安裝一散熱器，排出其所產生之熱量。 但隨著發熱電子元件之功率越來越強大，其生產之熱 量也越來越多，為提高散熱器之性能，通常需增大散熱器、 之散熱面積，習知技術將兩個獨立之散熱器通過一熱管連 接起來，如中國臺灣專利公告第547914號所揭示。只是 這種散熱裝置佔用空間比較大，受制程所限制其散熱鰭片 相對密度小，單體積散熱面積有限，其散熱效率有待進一 步提高。 【發明内容】 有鑒於此，在此有必要提供一種高密度鰭片且散熱面 積大之散熱裝置。 該散熱裝置包括一苐一散熱器與一第二散熱器，該第 一散熱器具有一第一基座及複數設置於第一基座上之第— 導熱板’該第二散熱器具有一第二基座及複數設置於第一 基座上之第二導熱板；該每一第一導熱板之兩侧面形成有 1302823 第政熱鰭片，該每一第二導熱板之兩侧面形成有第二散 熱鰭片，該第一、第二導熱板位於二基座之間且間隔交替 排列。 本發明散熱裝置與先前技術相比具有如下優點：由於 ^發明散熱裴置之第一散熱器與第二散熱器導熱板兩侧之 放熱鰭片在二散熱器組合以後可獲得高密度散熱鰭片使單 位體積散熱面積大幅增加，大大提高了散熱裝置之性能。 ,【實施方式】 圖1所示為本發明散熱裝置一較佳實施例，該散熱裝 置包括二結構相同之散熱器10及連接該二散熱器10之熱 官30。在本實施例中，該散熱器1〇為鋁擠型散熱器。 請參閱圖2,該每一散熱器1〇包括一基座12及自該基 座12頂部一體垂直延伸設置之複數導熱板14。基座12頂 部相鄰導熱板14之間設有複數橫向延伸之凹槽13，該等凹 槽13平行且等距間隔排列，該等凹槽13平行於導熱板14 .且共橫截面呈矩形；該基座12底面中部形成一縱向延伸之 凸出部11，該凸出部11設有一縱向貫穿該基座12之貫穿 孔16，用以收容熱管30。該導熱板14平行且等距間隔排 列，每一導熱板14兩側面形成複數平行等距間隔排列之散 熱鰭片15且每一導熱板14末端設置成圓角，該等散熱鰭 片15垂直於導熱板14且其厚度小於導熱板14之厚度，相 鄰二導熱板14上相對之散熱鰭片15之間形成有一與凹槽 13位置相對應且橫向延伸之通道18，該通道18之寬度與 1302823 周圍之空氣中；另一部分熱量通過熱管30傳至該倒置散熱 器10之凸出部11，再經過該倒置散熱器10之基座傳至 所有導熱板14 ’最後通過所有散熱鰭片15，散發至空氣中。 由於組裝後散熱器10之散熱鰭片15與該倒置散熱器 10之散熱鰭片15相互間隔錯位並均勻排佈，使整個組合之 散熱裝置具有高密度之散熱鰭片15,在有限空間中獲得較 大之散熱面積，有效地提高整個散熱裝置之散熱效果。並 且，在本實施例中，二散熱器1〇可採取同一模具生產，大 大提高了生產效率，降低了不良率及生產成本。 綜上所述，本發明符合發明專利要件’爰依法提出專 利申請。惟，以上該者僅為本發明之較佳實施例，舉凡孰 悉本案技藝之人士，在爰依本發明精神所作之等效ς 變化，皆應涵蓋於以下之申請專利範圍内。 ' s 【圖式簡單說明】 圖1係本發明散熱裝置之組裝圖。 圖2係圖1中散熱裝置之分解 【主要元件符號說明】 散熱器 10 基座 12 導熱板 14 穿槽 16 熱管 30 放熱段 32 凸出部 11 凹槽 13 散熱鰭片 15 通道 18 吸熱段 31 連接段 331302823 IX. Description of the invention: [Technical field to which the invention pertains] In particular, the invention relates to a heat dissipating device for a heat dissipating device. [Prior Art] When a heating electronic component (such as a central processing unit) operates, it generates a large amount of contribution, which causes itself and the temperature of the system to rise, which in turn causes the running performance to drop. In order to ensure that the heat-generating electronic components can operate normally, a heat sink is usually mounted on the heat-generating electronic component to discharge the heat generated by the heat-emitting electronic component. However, as the power of the heat-generating electronic components becomes more and more powerful, the heat generated by them is also increasing. In order to improve the performance of the heatsink, it is usually necessary to increase the heat-dissipating area of the heat sink, and the conventional technology will dissipate two independent heats. The devices are connected by a heat pipe, as disclosed in Taiwan Patent Publication No. 547914. However, such a heat dissipating device occupies a relatively large space, and the relative density of the heat dissipating fins is limited by the manufacturing process, and the heat dissipating area of a single volume is limited, and the heat dissipating efficiency needs to be further improved. SUMMARY OF THE INVENTION In view of the above, it is necessary to provide a heat sink having a high density fin and a large heat dissipation area. The heat sink includes a first heat sink and a second heat sink. The first heat sink has a first base and a plurality of first heat conducting plates disposed on the first base. The second heat sink has a second base. And a second heat conducting plate disposed on the first base; the two sides of each of the first heat conducting plates are formed with 1302823 heat-insulating fins, and the second heat radiating plates are formed with a second heat dissipation on both sides thereof The fins, the first and second heat conducting plates are located between the two pedestals and are alternately arranged at intervals. Compared with the prior art, the heat dissipating device of the present invention has the following advantages: since the first heat sink of the heat dissipating device and the heat radiating fins on both sides of the heat dissipating plate of the second heat sink are combined with the two heat sinks, high-density heat dissipating fins can be obtained. The heat dissipation area per unit volume is greatly increased, and the performance of the heat sink device is greatly improved. [Embodiment] FIG. 1 shows a preferred embodiment of a heat dissipating device according to the present invention. The heat dissipating device comprises two heat sinks 10 of the same structure and a heat exchanger 30 connecting the two heat sinks 10. In this embodiment, the heat sink 1 is an aluminum extruded heat sink. Referring to FIG. 2, each of the heat sinks 1A includes a base 12 and a plurality of heat conducting plates 14 extending vertically from the top of the base 12. A plurality of laterally extending grooves 13 are disposed between the adjacent heat conducting plates 14 at the top of the base 12, and the grooves 13 are arranged in parallel and equidistantly spaced, and the grooves 13 are parallel to the heat conducting plate 14 and have a rectangular cross section. A longitudinally extending projection 11 is formed in the middle of the bottom surface of the base 12, and the projection 11 is provided with a through hole 16 extending longitudinally through the base 12 for receiving the heat pipe 30. The heat conducting plates 14 are arranged in parallel and equidistantly spaced apart. Each of the heat conducting plates 14 forms a plurality of parallel fins 15 arranged at equal intervals, and the ends of each of the heat conducting plates 14 are rounded, and the heat radiating fins 15 are perpendicular to The heat conducting plate 14 has a thickness smaller than the thickness of the heat conducting plate 14, and a channel 18 corresponding to the position of the groove 13 and extending laterally is formed between the opposite heat radiating fins 15 of the adjacent two heat conducting plates 14, and the width of the channel 18 is 1302823 in the surrounding air; another part of the heat is transmitted to the protruding portion 11 of the inverted heat sink 10 through the heat pipe 30, and then passes through the base of the inverted heat sink 10 to all the heat conducting plates 14' and finally passes through all the heat radiating fins 15, Dissipated into the air. Since the heat dissipating fins 15 of the heat sink 10 and the heat dissipating fins 15 of the inverted heat sink 10 are spaced apart from each other and evenly arranged, the heat dissipating device of the entire assembly has a high-density heat dissipating fin 15 and is obtained in a limited space. The larger heat dissipation area effectively improves the heat dissipation of the entire heat sink. Moreover, in the present embodiment, the two heat sinks 1 can be produced by the same mold, which greatly improves the production efficiency and reduces the defective rate and the production cost. In summary, the present invention complies with the invention patent requirement 爰 提出 patent application. However, the above is only a preferred embodiment of the present invention, and those skilled in the art will be able to cover the equivalents of the present invention within the scope of the following claims. 's BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is an assembled view of a heat sink of the present invention. Figure 2 is a breakdown of the heat sink in Figure 1. [Main component symbol description] Heat sink 10 Base 12 Thermal plate 14 Through slot 16 Heat pipe 30 Heat release section 32 Projection 11 Groove 13 Heat sink fin 15 Channel 18 Heat sink section 31 Connection Paragraph 33