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TWI394951B - - Google Patents

Info

Publication number
TWI394951B
TWI394951B TW97143975A TW97143975A TWI394951B TW I394951 B TWI394951 B TW I394951B TW 97143975 A TW97143975 A TW 97143975A TW 97143975 A TW97143975 A TW 97143975A TW I394951 B TWI394951 B TW I394951B
Authority
TW
Taiwan
Application number
TW97143975A
Other languages
Chinese (zh)
Other versions
TW201018917A (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to TW97143975A priority Critical patent/TW201018917A/zh
Publication of TW201018917A publication Critical patent/TW201018917A/zh
Application granted granted Critical
Publication of TWI394951B publication Critical patent/TWI394951B/zh

Links

TW97143975A 2008-11-13 2008-11-13 Method of manufacturing probe card and structure thereof TW201018917A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW97143975A TW201018917A (en) 2008-11-13 2008-11-13 Method of manufacturing probe card and structure thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW97143975A TW201018917A (en) 2008-11-13 2008-11-13 Method of manufacturing probe card and structure thereof

Publications (2)

Publication Number Publication Date
TW201018917A TW201018917A (en) 2010-05-16
TWI394951B true TWI394951B (ko) 2013-05-01

Family

ID=44831493

Family Applications (1)

Application Number Title Priority Date Filing Date
TW97143975A TW201018917A (en) 2008-11-13 2008-11-13 Method of manufacturing probe card and structure thereof

Country Status (1)

Country Link
TW (1) TW201018917A (ko)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI721715B (zh) * 2019-12-17 2021-03-11 英業達股份有限公司 基板管理控制器的壓力測試方法、系統、儲存媒體及裝置

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2011162363A1 (ja) * 2010-06-25 2011-12-29 日本発條株式会社 プローブホルダ、プローブホルダおよびプローブユニットの製造方法
WO2013006771A2 (en) 2011-07-06 2013-01-10 Celadon Systems, Inc. Test systems with a probe apparatus and index mechanism
CN103930982B (zh) * 2011-07-06 2016-07-06 塞莱敦体系股份有限公司 具有探针卡的测试设备及连接器机构
JP6103821B2 (ja) 2012-05-29 2017-03-29 株式会社日本マイクロニクス 通電試験用プローブ

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5808475A (en) * 1996-06-07 1998-09-15 Keithley Instruments, Inc. Semiconductor probe card for low current measurements
US20030057976A1 (en) * 2001-09-27 2003-03-27 Mitsubishi Denki Kabushiki Kaisha Probe card
US20050156613A1 (en) * 2004-01-20 2005-07-21 Hisatomi Hosaka Probe card
TWI271522B (en) * 2001-04-05 2007-01-21 Toray Eng Co Ltd Probe substrate and method of manufacturing thereof
US20070126443A1 (en) * 2001-07-11 2007-06-07 Formfactor, Inc. Method of Manufacturing A Probe Card
TWI292827B (en) * 2005-03-21 2008-01-21 Phicom Corp Probe card and method of manufacturing the same

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5808475A (en) * 1996-06-07 1998-09-15 Keithley Instruments, Inc. Semiconductor probe card for low current measurements
TWI271522B (en) * 2001-04-05 2007-01-21 Toray Eng Co Ltd Probe substrate and method of manufacturing thereof
US20070126443A1 (en) * 2001-07-11 2007-06-07 Formfactor, Inc. Method of Manufacturing A Probe Card
US20030057976A1 (en) * 2001-09-27 2003-03-27 Mitsubishi Denki Kabushiki Kaisha Probe card
US20050156613A1 (en) * 2004-01-20 2005-07-21 Hisatomi Hosaka Probe card
TWI292827B (en) * 2005-03-21 2008-01-21 Phicom Corp Probe card and method of manufacturing the same

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI721715B (zh) * 2019-12-17 2021-03-11 英業達股份有限公司 基板管理控制器的壓力測試方法、系統、儲存媒體及裝置

Also Published As

Publication number Publication date
TW201018917A (en) 2010-05-16

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees