TWI389757B - Laser processing device - Google Patents

Description

Laser processing device

This invention relates to apparatus and methods for processing wafers by irradiation of laser light.

By processing a predetermined line IC, an LSI or the like to divide the wafer formed on the surface side by the processing, the processing target line is detected by the photographic surface, and the high-speed rotating cutting tool is applied to all the processing lines to be divided into Each device.

However, when a wafer having a relatively thin metal layer such as a lead layer or a metal having a thickness of about 1 μm to 10 μm is laminated on the back surface, when the cutting tool is used, the clogging life of the cutting tool is shortened. Further, since the cutting resistance is caused, there is a problem that a relatively large gap is formed above the cutting line formed by the cutting of the planned line to reduce the quality of the apparatus. Here, a method of cutting the laser beam by the irradiation of the planned line is also used (refer to Japanese Laid-Open Patent Publication No. 2006-255761).

However, by cutting the laser light, the laser beam called a debris is attached to the surface of the device by irradiating the laser beam with a predetermined line for processing the surface. Further, in order to prevent such a problem, it is necessary to adhere a protective film for device protection to the surface of the wafer, which has a problem of low productivity.

If the laser light is irradiated from the back side of the wafer, although this problem does not occur, when the laser light is irradiated from the back side of the wafer, it must be The photographing by the infrared rays of the surface detects a planned line formed on the surface. However, when the metal film is coated on the back surface, since the infrared rays are not transmitted, the planned processing line cannot be detected from the back side.

Here, the problem to be solved by the present invention is that, when processing a wafer by irradiation of laser light, even if the wafer on which the predetermined line cannot be processed is detected from the back side, the quality of the device is not lowered, and the productivity is not lowered. Processed from the back side.

The present invention relates to a laser processing apparatus comprising: at least a jig table capable of rotating a wafer; and a laser light irradiation means for irradiating the wafer held by the jig table with laser light; and the jig table and the thunder The processing and feeding means for processing the relative irradiation of the light-emitting means; and the indexing feeding means for indexing and feeding the relative of the fixture table and the laser light irradiation means, wherein the fixture table has the retention of the wafer a first imaging means and a second imaging means for the wafer surface on the side where the image is held by the holding portion, and the first image obtained by the first image capturing means and the second image capturing means The coordinate information obtained by the second image is used to detect the line detection means for processing the planned line; and the control means for performing the alignment of the planned processing line and the processing head detected by the line detecting means.

The line detecting means preferably has an adjusting means for making the direction of the predetermined line coincide with the direction in which the machining is fed. The adjustment means includes, for example, an angle calculation means for calculating an angle of a corner formed by the planned line and the machining feed direction, and an angle correction means for rotating the holding portion only by the angle.

The line detecting means includes a coordinate identifying means for recognizing the coordinates of the main pattern having a certain positional relationship with the planned line, and the adjusting means preferably includes a coordinate converting means for calculating the coordinates of the main pattern after the rotation of the holding portion.

The control means is preferably performed by the coordinate of the main pattern after the rotation and the positional relationship of the main pattern after the rotation of the coordinate conversion means, and the alignment of the planned line and the processing head is performed.

According to the present invention, the first photographing means and the second photographing means provided with the surface of the wafer held by the photograph holding portion, and the line detecting means for detecting the planned line from the obtained image, and the processing head are located Since the control means for the planned processing line is detected, the processing line formed on the surface can be detected while the holding portion is formed with the surface of the apparatus, and the laser beam is incident from the back side and processed. Therefore, the debris does not adhere to the surface of the device. Furthermore, since it is not necessary to adhere the protective film for device protection to the surface of the wafer, productivity is not lowered.

Further, since the adjustment means for matching the direction of the planned line to the direction of the processing feed is provided, the direction of the planned line and the processing are only in a direction in which the direction is not uniform, even when the wafer is fixed to the holding portion. It is also possible to make the direction of the planned line and the direction of the processing feed consistent and correctly processed.

Further, the line detecting means is provided with a coordinate identifying means for recognizing the coordinates of the main pattern having a certain positional relationship with the planned line of processing, Since the adjustment means has the coordinate means for calculating the coordinates of the main coordinates after the rotation of the holding portion, the planned planned line can be aligned with the processing head by the calculated transformed coordinates.

The laser processing apparatus 1 shown in FIG. 1 is a device for cutting or opening a workpiece such as a wafer, and is provided with a jig table 2 that is rotatable while holding a wafer belonging to the workpiece. And a laser light irradiation means 3 that performs processing by irradiating laser light to the workpiece held by the jig table 2.

In the jig table 2, the support plate 20 is supported such that the holding portion 21 is rotatable and movable in the Y-axis direction.

The jig table 2 is machined and fed to the X-axis direction by the machining feed means 4. The machining feed means 4 includes a ball screw 40 disposed in the X-axis direction, a pair of guide rails 41 disposed in parallel with the ball screw 40, and a ball connected to the ball by the relative processing feed jig table 2 and the laser beam irradiation means 3. The motor 42 at one end of the screw 40, when the inner nut is screwed with the ball screw 40, the lower portion simultaneously slides on the moving plate 43 of the guide rail 41, the position adjusting means 44 provided on the moving plate 43, and the position adjusting means 44 On the other hand, the holding portion turning means 45, which is driven to move in the Y-axis direction, moves the ball screw 40, and the moving plate 43, the position adjusting means 44, and the pulse motor 45 are guided to the guide rail 41 and moved to The composition of the X-axis direction.

The position adjusting means 44 is a ball screw 440 disposed on the moving plate 43 in the Y-axis direction, a pair of guide rails 441 disposed in parallel with the ball screw 440, and a pulse motor 442 coupled to one end of the ball screw 440, and the inside. When the nut is screwed to the ball screw 440, the lower portion is simultaneously slidably coupled to the moving plate 443 of the guide rail 441. The ball screw 440 is rotated by the pulse motor 442, and the moving plate 443 and the holding portion rotating means 45 are It is guided to the guide rail 441 and moved in the Y-axis direction.

The holding portion 21 constituting the jig table 2 is coupled to the holding portion turning means 45, and is driven by a non-drawing pulse motor provided in the holding portion rotating portion 45 to rotate the desired angle. The holding portion 21 has a first photographing means 210 and a second photographing means 221 which face the wafer and photograph the surface thereof.

The laser light irradiation means 3 is constituted by supporting the processing head 31 by the casing 30. The processing head 31 has a function of irradiating the laser light downward, and the output of the irradiated laser light is adjusted by the output adjusting means 33a. The laser light is oscillated by the oscillation means 33b to become pulsed laser light. The oscillation means 33b can oscillate the pulsed laser light at a frequency set by the frequency setting means 33c.

An alignment means 5 having an imaging unit 50 for photographing a wafer is fixed to a side portion of the casing 30. Although the alignment means 5 has a function of detecting the position to be processed by the exposed surface of the photographic wafer, it is not required in the present invention.

The laser light irradiation means 3 and the alignment means 5 are movable in the Z-axis direction by the Z-axis direction feeding means 6. The Z-axis direction feeding means 6 is a ball screw 61 disposed in the Z-axis direction in one of the wall portions 60, a pair of guide rails 62 disposed in parallel with the ball screw 61, and coupled to the ball screw 61. When the pulse motor 63 at one end and the inner nut are screwed to the ball screw 61, the side portions are simultaneously slidably coupled to the rail support portion 64. The support portion 64 is a housing 30 that supports the laser light irradiation means 3, and becomes a ball screw 61. The pulse motor 63 is driven to rotate, and the support portion 64 is guided to the guide rail 62 to be raised and lowered, and the laser light irradiation means 3 supported by the support portion 64 is also raised and lowered.

The Z-axis direction feeding means 6 and the laser light irradiation means 3 are movable in the Y-axis direction by the index feeding means 7. The indexing means 7 is relating to the indexing of the jig table 2 and the laser beam irradiation means 3, and the ball screw 70 disposed in the Y-axis direction and the guide rail 71 arranged in parallel with the ball screw 70 are connected. The pulse motor 72 at one end of the ball screw 70, the inner nut and the ball screw 70 are screwed together, and the lower portion is slidably connected to the moving base 73 of the guide rail 71. The moving base 73 is integrally formed with the wall portion 60 constituting the Z-axis direction feeding means 6, and the ball screw 70 is rotated by the pulse motor 72, and the moving base 73 and the wall portion 60 are guided to the guide rail 71. In the Y-axis direction, the Z-axis direction feeding means 6 and the laser beam irradiation means 3 are moved in the Y-axis direction.

As shown in FIG. 2, the holding portion 21 is formed of a porous member such as porous ceramic, and can communicate with a suction source to suck and hold a workpiece such as a wafer. The first imaging means 210 and the second imaging means 211 are embedded in the holding portion 21, and the surface of the wafer held by the holding portion 21 can be imaged.

As shown in FIG. 3, in the surface W1 of the wafer W held by the holding portion 21, a plurality of devices D are formed by dividing a predetermined line, and are cut by a vertical and horizontal cutting planned line to be divided into individual devices. D. At any position of the wafer W, a main pattern having a positional relationship with the planned line is formed. The planned processing line is composed of a guide groove S1 in the lateral direction and a guide groove S2 in the longitudinal direction orthogonal to the guide groove S1. And the main pattern is also There is a case where a dedicated person for detecting the planned line S is formed, but the circuit pattern formed on the device D may be set as a main pattern.

As shown in FIG. 2, the first photographing means 210 and the second photographing means 211 are connected to the line detecting means 23, and the in-line detecting means 23 is based on the portrait obtained by the first photographing means 210 and the second photographing means 211. A predetermined processing line formed on the surface of the wafer is detected.

The line detecting means 232 includes a display means 230 for displaying the first image obtained by the first imaging means 210 and the second image obtained by the second imaging means 211; and the first image and the second image are included The coordinate identifying means 231 of the coordinates of the main pattern; the adjusting means 232 for controlling the direction of the processing target line and the direction of the processing feed in accordance with the position or orientation of the control holding portion 21 in accordance with the identification result in the coordinate identifying means 231.

The adjustment means 232 includes an angle calculation means 232a for calculating an angle of a corner formed by the guide groove S1 or the guide groove S2 of the machining planned line and the machining feed direction of the jig table 2, and only the angle calculation means 232a calculates The angle correcting means 232b that corrects the direction of the wafer W by rotating the holding portion 21 at an angle.

Further, the adjustment means includes coordinate conversion means 232c for calculating the coordinates of the main pattern after the direction of the holding portion 21 is corrected by the angle correction means 232b. The coordinates obtained by the obtained angle correction are used for the alignment of the jig table 2 and the laser light irradiation means 3 at the time of processing.

The coordinates of the main pattern corrected by the angle obtained by the conversion are transmitted to the control unit 24. The control unit 24 controls the operation of the jig table 2 and the laser light irradiation means 3 based on the corrected coordinates.

Further, the adjustment means 23 includes a CPU and a memory, and the coordinates recognition means 231, the angle calculation means 232a, the angle correction means 232b, and the coordinate conversion means 232c are processed by the CPU, and data is written and read from the memory. Execute from the data of the memory.

When the processing line S of the wafer W shown in FIG. 3 is cut, the wafer W is reversed as shown in FIG. Then, as shown in FIG. 5, the tape T is adhered to the surface side of the wafer W, and is integrated with the frame F adhered to the peripheral portion of the tape T. The wafer W is passed through the tape T in a state where the back surface W2 is exposed. It is supported in the state of the frame F.

The wafer W supported by the frame F via the tape T is held by the holding portion 21 of the jig table 2 shown in Figs. 1 and 2 . At this time, the wafer W is placed so that the direction of the guide groove S1 shown in FIG. 3 and the X-axis direction are parallel.

As shown in Fig. 6, the line connecting the center of the first photographing means 210 and the center of the second photographing means 211 coincides with the X-axis direction, and has the center of the processing head 31 at the extended line position. In the example of Fig. 6, the line connecting the center of the first photographing means 210 and the center of the second photographing means 211 and the center of the processing head 31 is set to the X-axis, and the center of rotation in the current position of the holding portion 21 is The line orthogonal to the X axis is set to the Y axis. Hereinafter, the control based on the coordinate system will be described.

The first photographing means 210 and the second photographing means 211 are over the surface of each of the photographing wafers W of the tape T. For example, as shown in FIG. 7, the display means 230 arranges the first image 230a obtained by the first photographing means 210 and the second image 230b obtained by the second photographing means 211. Show it. The first imaging means 210 and the second imaging means 211 are formed with a reference line 212 that coincides with the X axis, and the reference line 212 is displayed on the display means 230.

The first image 230a and the second image 230b shown in Fig. 7 each include main patterns K1 and K2 formed on the surface of the wafer W. The distance between the main patterns K1 and K2 and the center line S1o of the guide groove S1 to be processed is previously stored in the control means 24. By determining the coordinates of the main patterns K1 and K2, the coordinates of the center line S1o can be found. The alignment of the processing head 31 (see Fig. 1) with the laser light irradiation means 3 can be performed.

The first image 230a and the second image 230b are transmitted to the coordinate recognition means 231 shown in Fig. 2 . The coordinate recognition means 231 is a memory image of the main pattern K1 which is stored in the memory of the coordinate recognition means 231, for example, by the number and attributes of the main images constituting the main pattern K1 in the first image 230a (first The number of the pixels of the main pattern in the memory image and the matching of the attributes, the number and the attributes of the pixels constituting the main pattern K2 in the second image 230b, and the memory which is previously stored in the coordinate recognition means 231 The number of pixels of the main pattern in the memory image (second memory image) of the main pattern K2 and the matching of the attributes are executed. Then, the coordinate identifying means 231 is stored in the coordinates of the main patterns K1, K2 at which the matching is made. As the coordinates, the coordinates of any of the main patterns K1 and K2 can be used. However, in the example of Fig. 7, the coordinates of the even corners on the outer sides of the main patterns K1 and K2 are used. Furthermore, the X-axis in the example of Fig. 7 is the direction of the machining feed, that is, the moving direction of the jig table 2 generated by the machining feed means 4, and the Y-axis is the indexing feed. The direction is the moving direction of the laser light irradiation means 3 generated by the indexing means 7. Since the machining head 31 is on the X-axis, the state in which the guide groove S1 coincides with the X-axis is a state in which the guide groove S1 can be processed.

The coordinates (X1, Y1) of the main pattern K1 and the coordinates (X2, Y2) of the main pattern K2 obtained by the coordinate identifying means 231 shown in Fig. 2 are read by the angle calculating means 232a. The angle calculation means 232a calculates the deviation angle θ of the planned line S in the X-axis direction shown in Fig. 7 by the following calculation formula (1).

θ=tan ^-1 {(Y1-Y2)/(X1-X2)}.........(1)

The obtained θ value is read by the angle correcting means 232b shown in Fig. 2 . The angle correction means 232b obtains the number of pulses corresponding to the number of θ values, and sends the information of the number of pulses to the control means 24. In this way, the pulse motor of the holding unit turning means 45 sends the pulse signal by the number of pulses from the control means 24, and the holding portion 21 rotates only at the angle θ. As shown in Fig. 8, the guide groove S1 and the X-axis become parallel. Further, since the first photographing means 210 and the second photographing means 211 are also rotated simultaneously with the holding portion 21, the image displayed on the display means 230 does not change.

When the angle correction is completed, the coordinate conversion means 232c shown in FIG. 2 reads the coordinates (X1, Y1) of the main pattern K1 before the angle correction and the coordinates (X2, Y2) of the main pattern K2 from the angle correction means 232b. And the correction angle θ value, and the coordinates (X1', Y1') and (X2' of the main patterns K1 and K2 after the movement after the angle correction are obtained by the following calculation formulas (2) and (3). Y2').

(X1', Y1')= (Y1sin θ+X1cos θ, Y1cos θ-X1sin θ).........(2)

(X2', Y2') = (Y2sin θ + X2cos θ, Y2cos θ - X2sin θ)... (3)

As shown in Fig. 8, after the angle is corrected, since the guide groove S1 and the X axis are parallel, the values of the Y coordinate Y1' of the main pattern K1 and the Y coordinate Y2' of the main pattern K2 are equal. That is, the following formula (4) is established.

Y1cos θ-X1sin θ=Y2cos θ-X2sin θ.........(4)

When the X axis coincides with the center line S1o of the guide groove S1 after the angle correction, the feed jig table 2 can be processed in the state to irradiate the laser light, but in the example of Fig. 8, the X axis and the guide groove S1 The central line S1o is inconsistent. Here, it is necessary to move the holding portion 21 in the Y-axis direction so that the X-axis and the center line S1o of the guide groove S1 coincide with each other.

In Fig. 8, the distance L1 between the center line S1o of the guide groove S1 and the main patterns K1, K2 is previously stored in the control means 24. Therefore, the control means 24 can obtain the Y coordinate Y1s of the center line S1o of the planned line S by subtracting L1 from the value of Y1' or Y2' obtained by the above equations (2) and (3). . That is, the Y coordinate Y1s = (Y1' - L) = (Y2' - L) of the center line S1o. When the holding portion 21 is moved in the Y-axis direction only by the value of Y1s, the center line S1o coincides with the X-axis, and the processing head 31 is located on the extension line of the center line S1o.

The control means 24 shown in Figs. 1 and 2 transmits a pulse signal corresponding to the above Y1s to the pulse motor 442 constituting the position adjusting means 44, and moves the jig table 2 in the Y-axis direction only by Y1s. As shown in Fig. 9, the center line S1o is aligned with the X axis, and the guide groove S1 is executed. The alignment of the central line S1o and the processing head 31 in the Y-axis direction.

Then, in this state, the control means 24 drives the motor 42 shown in Fig. 1 which constitutes the machining feed means 4 to move the jig table 2 in the X-axis direction, and when the laser light is irradiated from the machining head 31 to the lower side, Then, a guide groove S1 is cut. Further, the distance between the adjacent guide grooves S1 (the groove interval) is memorized in the control means 24, and the control means 24 drives the pulse motor 72 to index the laser light irradiation means in the Y-axis direction for each groove interval. One side is irradiated with the laser light, and the jig table 2 is moved in the X-axis direction to be processed and fed. As a result, the guide grooves S1 are all cut off.

Next, the control means 24 drives the pulse motor 45 to rotate the holding portion 21 by 90 degrees in the state shown in Fig. 9. As a result, as shown in FIG. 10, the guide groove S2 is parallel to the X-axis direction of the machining feed direction. The coordinates of the main patterns K1 and K2 after the rotation are each (X1", Y1"), (X2", Y2").

Next, in order to match the X-axis belonging to the machining feed direction and the center line S2o of any of the guide grooves S2, the holding portion 21 is moved to the Y-axis direction. For example, the guide groove S2 that determines the positional relationship with the main pattern K2 is aligned with the X-axis direction.

The value of the distance L2 from the main pattern K2 to the center line S2o is previously memorized by the control means 24. Therefore, the control unit 24 obtains the moving distance (Y2"+L2) of the holding portion 21, and moves the holding portion 21 in the Y-axis direction only by the distance. Here, the following formula (5) is established by the formula (3). ).

Y2"=Y2sin θ+X2cos θ.........(5)

Therefore, when the control unit 24 is only made by (Y2sin θ + X2cos θ + L2) When the holding portion 21 moves in the Y-axis direction, as shown in Fig. 11, the center line S2o close to the main pattern K2 coincides with the X-axis, and the center line S2o of the guide groove S2 is located in the X-axis direction of the processing head 31. Extend the line. The movement of the holding portion 21 is performed by the pulse motor 442 constituting the position adjusting means 44. Further, the coordinates of the main patterns K1 and K2 at this time are each set to (X1"', Y1"'), (X2"', Y2"'). Further, the holding portion 21 is moved to the reverse direction, and the center line of the guide groove S2 that determines the positional relationship with the main pattern 1 may be aligned with the X-axis.

Then, in its state, the control means 24 drives the motor 42 constituting the machining feed means 4 to move the jig table 2 in the X-axis direction, and when the laser light is irradiated from the machining head 31 to the lower side, one piece is cut. Guide groove S2. Further, the distance between the adjacent guide grooves (the guide groove interval) is memorized in the control means 24, and the control means 24 drives the pulse motor 72 to drive the pulse motor 72, and the laser light irradiation means 3 is placed on the Y interval. The axial direction indexing is irradiated with the laser light, and the jig table 2 is moved in the X-axis direction to be processed and fed. As a result, the guide grooves S2 are all cut off.

Next, the jig table 8 shown in Fig. 12 will be described. The jig table 8 is an example in which one of the configurations of the jig table 2 shown in FIG. 2 is changed. In the holding portion 21, two first cymbals 80 and a second cymbal 81 are buried without embedding imaging means. By the rotation of the holding portion 21, the places where the two cymbals are placed are obtained, and the photographic means 82 for taking light from any of the cymbals is provided. The photographing means 82 functions as a first photographing means when receiving the light of the first frame 80, and functions as a second photographing means when receiving light from the second pass.

The photographing means 82 is connected to a line detecting means 23 for processing an image obtained by the photographing means 82. The line detecting means 23 is configured similarly to the example of Fig. 2, and the image from the first side 80 and the image from the second side 81 detect the offset from the processing direction of the wafer W, and only The portion of the offset is rotated by the holding portion 21, the coordinates after the rotation are obtained, and the coordinates and the processing head 31 (see Fig. 1) are aligned, and the side cut by the laser beam is performed in the same manner as described above. All guides in one direction. After the guide grooves in all the directions are cut, after the holding portion 21 is rotated by 90 degrees, all the guide grooves on the other side are cut. The processing procedure is the same as the configuration of Fig. 2.

Further, in the example of Fig. 12, although the two cymbals 80, 81 are connected to one photographing means 82, they may be formed by connecting the respective photographing means.

1‧‧‧ Laser processing equipment

2‧‧‧ Fixture table

3‧‧‧Laser light irradiation

4‧‧‧Processing means of feeding

5‧‧‧Alignment means

6‧‧‧Z-axis feed means

7‧‧‧Dividing means of feeding

8‧‧‧ Fixture table

20‧‧‧Support board

21‧‧‧ Keeping Department

23‧‧‧ Line detection means

24‧‧‧Control means

30‧‧‧Shell

31‧‧‧Processing head

33a‧‧‧ Output adjustment means

33b‧‧‧Oscillation means

33c‧‧‧frequency setting means

40‧‧‧Rolling screw

41‧‧‧rails

42‧‧‧Motor

43‧‧‧Mobile board

44‧‧‧Location adjustment means

45‧‧‧pulse motor

50‧‧‧Photography Department

60‧‧‧ wall

61‧‧‧Rolling screw

62‧‧‧rails

63‧‧‧ pulse motor

64‧‧‧Support

70‧‧‧Ball screw

71‧‧‧rails

72‧‧‧ pulse motor

73‧‧‧Mobile abutments

80‧‧‧ first

81‧‧‧Second

82‧‧‧Photography

210‧‧‧First means of photography

211‧‧‧second means of photography

230‧‧‧ Display means

230a‧‧‧ first portrait

230b‧‧‧ second portrait

231‧‧‧Coordinate identification means

232‧‧‧Adjustment means

232a‧‧‧ Angle calculation means

232b‧‧‧ Angle correction means

232c‧‧‧ means of coordinate transformation

440‧‧‧Ball screw

441‧‧‧rail

442‧‧‧pulse motor

443‧‧‧Mobile board

W‧‧‧ wafer

T‧‧‧ Tape

F‧‧‧Frame

Fig. 1 is a perspective view showing an example of a laser processing apparatus.

Fig. 2 is an explanatory view showing the configuration of the jig table and the control system.

Fig. 3 is a perspective view showing an example of the surface side of the wafer.

Fig. 4 is a perspective view showing an example of the back side of the wafer.

Fig. 5 is a perspective view showing a state in which the wafer is supported by the tape by the tape.

Fig. 6 is an explanatory view showing the positional relationship between the holding portion constituting the jig table and the processing head constituting the laser beam irradiation means.

Fig. 7 is an explanatory view showing an example of an image obtained by two imaging means.

Fig. 8 is an explanatory view showing states of the main patterns before the angle correction and the angle correction, and the positions and directions of the guide grooves constituting the planned line.

Fig. 9 is an explanatory view showing a state in which one of the guide grooves and the machining feed direction are aligned by the movement of the holding portion.

Fig. 10 is an explanatory view showing the state of each main pattern and the position and direction of each of the guide grooves after the rotation of the holding portion.

Fig. 11 is an explanatory view showing a state in which the other guide groove and the machining feed direction are aligned by the movement of the holding portion.

Fig. 12 is an explanatory view showing a modified example of the configuration of the jig table and its control system.

1‧‧‧ Laser processing equipment

2‧‧‧ Fixture table

3‧‧‧Laser light irradiation

4‧‧‧Processing means of feeding

5‧‧‧Alignment means

6‧‧‧Z-axis feed means

7‧‧‧Dividing means of feeding

20‧‧‧Support board

21‧‧‧ Keeping Department

23‧‧‧ Line detection means

24‧‧‧Control means

30‧‧‧Shell

31‧‧‧Processing head

33a‧‧‧ Output adjustment means

33b‧‧‧Oscillation means

33c‧‧‧frequency setting means

40‧‧‧Rolling screw

41‧‧‧rails

42‧‧‧Motor

43‧‧‧Mobile board

44‧‧‧Location adjustment means

45‧‧‧pulse motor

50‧‧‧Photography Department

60‧‧‧ wall

61‧‧‧Rolling screw

62‧‧‧rails

63‧‧‧ pulse motor

64‧‧‧Support

70‧‧‧Ball screw

71‧‧‧rails

72‧‧‧ pulse motor

73‧‧‧Mobile abutments

210‧‧‧First means of photography

211‧‧‧second means of photography

440‧‧‧Ball screw

441‧‧‧rail

442‧‧‧pulse motor

443‧‧‧Mobile board

W‧‧‧ wafer

T‧‧‧ Tape

F‧‧‧Frame

Claims (5)

A laser processing apparatus includes at least a jig table that can rotate while holding a wafer, and a laser light irradiation device that irradiates the wafer held by the jig table with laser light to process the wafer; and the jig table and the thunder a processing feeding means for processing the relative irradiation of the light-emitting means; and an indexing feeding means for indexing the relative of the fixture table and the laser light irradiation means, wherein the fixture table has a holding crystal a first imaging means and a second imaging means at different positions on the surface of the wafer on the side where the respective images are held by the holding portion, and the first imaging means and the rotation of the jig table The second photographing means is also rotated, and includes: a first image obtained by the first photographing means and coordinate information obtained by the second image obtained by the second photographing means, and a line detecting means for detecting a planned line And a control means for performing the alignment of the planned processing line and the processing head detected by the line detecting means. The laser processing apparatus according to claim 1, wherein the line detecting means includes an adjusting means for matching a direction of the planned line to the direction of the feed of the machining. The laser processing apparatus according to claim 2, wherein the adjustment means includes an angle calculation means for calculating an angle of an angle formed by the planned line and the machining feed direction; and rotating the holding portion The angle correction means of the angle. A laser processing apparatus as recited in claim 3, wherein The line detecting means includes a coordinate identifying means for recognizing a coordinate of a main pattern having a predetermined positional relationship with the planned planned line, and the adjusting means includes coordinate conversion means for calculating a coordinate of the main pattern after the rotation of the holding portion . The laser processing apparatus according to claim 4, wherein the control means performs the processing line and the coordinate of the main pattern after the rotation, which is recognized by the coordinate conversion means, and the predetermined positional relationship. The alignment of the above processing heads.