TWI385485B - A photosensitive resin composition, a display panel spacer, and a display panel - Google Patents
A photosensitive resin composition, a display panel spacer, and a display panel Download PDFInfo
- Publication number
- TWI385485B TWI385485B TW094138879A TW94138879A TWI385485B TW I385485 B TWI385485 B TW I385485B TW 094138879 A TW094138879 A TW 094138879A TW 94138879 A TW94138879 A TW 94138879A TW I385485 B TWI385485 B TW I385485B
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- Taiwan
- Prior art keywords
- group
- methyl
- ethyl
- carbon atoms
- weight
- Prior art date
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- 125000006850 spacer group Chemical group 0.000 title claims description 53
- 239000011342 resin composition Substances 0.000 title claims description 29
- 150000001875 compounds Chemical class 0.000 claims description 47
- 125000004432 carbon atom Chemical group C* 0.000 claims description 45
- 229920001577 copolymer Polymers 0.000 claims description 35
- 239000003999 initiator Substances 0.000 claims description 27
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 claims description 21
- 125000000217 alkyl group Chemical group 0.000 claims description 20
- 125000000753 cycloalkyl group Chemical group 0.000 claims description 13
- 125000000623 heterocyclic group Chemical group 0.000 claims description 12
- 150000001732 carboxylic acid derivatives Chemical class 0.000 claims description 10
- 125000003545 alkoxy group Chemical group 0.000 claims description 8
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 7
- 229910052799 carbon Inorganic materials 0.000 claims description 7
- QJGQUHMNIGDVPM-UHFFFAOYSA-N nitrogen group Chemical group [N] QJGQUHMNIGDVPM-UHFFFAOYSA-N 0.000 claims description 7
- 239000001257 hydrogen Substances 0.000 claims description 6
- 229910052739 hydrogen Inorganic materials 0.000 claims description 6
- 229910052717 sulfur Inorganic materials 0.000 claims description 6
- 239000011593 sulfur Substances 0.000 claims description 6
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 claims description 5
- 125000002723 alicyclic group Chemical group 0.000 claims description 5
- 150000001244 carboxylic acid anhydrides Chemical class 0.000 claims description 5
- 125000001424 substituent group Chemical group 0.000 claims description 5
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 4
- 125000005843 halogen group Chemical group 0.000 claims description 4
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims description 4
- 229910052760 oxygen Inorganic materials 0.000 claims description 4
- 239000001301 oxygen Substances 0.000 claims description 4
- -1 methyl 6,7-epoxyheptyl acrylate Chemical compound 0.000 description 110
- FDPIMTJIUBPUKL-UHFFFAOYSA-N pentan-3-one Chemical compound CCC(=O)CC FDPIMTJIUBPUKL-UHFFFAOYSA-N 0.000 description 88
- 229910052757 nitrogen Inorganic materials 0.000 description 40
- 239000010408 film Substances 0.000 description 37
- 239000000243 solution Substances 0.000 description 33
- 239000000203 mixture Substances 0.000 description 24
- 239000000758 substrate Substances 0.000 description 22
- 238000000034 method Methods 0.000 description 21
- 239000000178 monomer Substances 0.000 description 20
- DNIAPMSPPWPWGF-UHFFFAOYSA-N monopropylene glycol Natural products CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 19
- 238000011161 development Methods 0.000 description 16
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 14
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 14
- 230000035945 sensitivity Effects 0.000 description 14
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 13
- 230000015572 biosynthetic process Effects 0.000 description 12
- 125000003700 epoxy group Chemical group 0.000 description 12
- 239000002904 solvent Substances 0.000 description 12
- 238000000576 coating method Methods 0.000 description 11
- 239000004094 surface-active agent Substances 0.000 description 11
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 10
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 10
- 238000011156 evaluation Methods 0.000 description 10
- 239000004973 liquid crystal related substance Substances 0.000 description 10
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 10
- KPSSIOMAKSHJJG-UHFFFAOYSA-N neopentyl alcohol Chemical compound CC(C)(C)CO KPSSIOMAKSHJJG-UHFFFAOYSA-N 0.000 description 10
- QTBSBXVTEAMEQO-UHFFFAOYSA-M Acetate Chemical compound CC([O-])=O QTBSBXVTEAMEQO-UHFFFAOYSA-M 0.000 description 9
- 229940022663 acetate Drugs 0.000 description 9
- KAKZBPTYRLMSJV-UHFFFAOYSA-N Butadiene Chemical compound C=CC=C KAKZBPTYRLMSJV-UHFFFAOYSA-N 0.000 description 8
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 8
- 150000005215 alkyl ethers Chemical class 0.000 description 8
- 239000011248 coating agent Substances 0.000 description 8
- 150000002148 esters Chemical class 0.000 description 8
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 8
- 239000002245 particle Substances 0.000 description 8
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 7
- KWYHDKDOAIKMQN-UHFFFAOYSA-N N,N,N',N'-tetramethylethylenediamine Chemical compound CN(C)CCN(C)C KWYHDKDOAIKMQN-UHFFFAOYSA-N 0.000 description 7
- VPVSTMAPERLKKM-UHFFFAOYSA-N glycoluril Chemical compound N1C(=O)NC2NC(=O)NC21 VPVSTMAPERLKKM-UHFFFAOYSA-N 0.000 description 7
- 125000000999 tert-butyl group Chemical group [H]C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 7
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 6
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 6
- SOGAXMICEFXMKE-UHFFFAOYSA-N Butylmethacrylate Chemical compound CCCCOC(=O)C(C)=C SOGAXMICEFXMKE-UHFFFAOYSA-N 0.000 description 6
- 229920000877 Melamine resin Polymers 0.000 description 6
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 6
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 6
- 239000003513 alkali Substances 0.000 description 6
- 230000001588 bifunctional effect Effects 0.000 description 6
- VYHBFRJRBHMIQZ-UHFFFAOYSA-N bis[4-(diethylamino)phenyl]methanone Chemical compound C1=CC(N(CC)CC)=CC=C1C(=O)C1=CC=C(N(CC)CC)C=C1 VYHBFRJRBHMIQZ-UHFFFAOYSA-N 0.000 description 6
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 description 6
- 238000006116 polymerization reaction Methods 0.000 description 6
- 239000000047 product Substances 0.000 description 6
- 239000000126 substance Substances 0.000 description 6
- LEJBBGNFPAFPKQ-UHFFFAOYSA-N 2-(2-prop-2-enoyloxyethoxy)ethyl prop-2-enoate Chemical compound C=CC(=O)OCCOCCOC(=O)C=C LEJBBGNFPAFPKQ-UHFFFAOYSA-N 0.000 description 5
- 229920003171 Poly (ethylene oxide) Polymers 0.000 description 5
- DAKWPKUUDNSNPN-UHFFFAOYSA-N Trimethylolpropane triacrylate Chemical compound C=CC(=O)OCC(CC)(COC(=O)C=C)COC(=O)C=C DAKWPKUUDNSNPN-UHFFFAOYSA-N 0.000 description 5
- MPIAGWXWVAHQBB-UHFFFAOYSA-N [3-prop-2-enoyloxy-2-[[3-prop-2-enoyloxy-2,2-bis(prop-2-enoyloxymethyl)propoxy]methyl]-2-(prop-2-enoyloxymethyl)propyl] prop-2-enoate Chemical compound C=CC(=O)OCC(COC(=O)C=C)(COC(=O)C=C)COCC(COC(=O)C=C)(COC(=O)C=C)COC(=O)C=C MPIAGWXWVAHQBB-UHFFFAOYSA-N 0.000 description 5
- WEVYAHXRMPXWCK-UHFFFAOYSA-N acetonitrile Substances CC#N WEVYAHXRMPXWCK-UHFFFAOYSA-N 0.000 description 5
- 239000002585 base Substances 0.000 description 5
- 125000001449 isopropyl group Chemical group [H]C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 5
- 125000004108 n-butyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 5
- 125000004123 n-propyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])* 0.000 description 5
- 239000007787 solid Substances 0.000 description 5
- 238000003860 storage Methods 0.000 description 5
- 238000003786 synthesis reaction Methods 0.000 description 5
- ARXJGSRGQADJSQ-UHFFFAOYSA-N 1-methoxypropan-2-ol Chemical compound COCC(C)O ARXJGSRGQADJSQ-UHFFFAOYSA-N 0.000 description 4
- WYGWHHGCAGTUCH-UHFFFAOYSA-N 2-[(2-cyano-4-methylpentan-2-yl)diazenyl]-2,4-dimethylpentanenitrile Chemical compound CC(C)CC(C)(C#N)N=NC(C)(C#N)CC(C)C WYGWHHGCAGTUCH-UHFFFAOYSA-N 0.000 description 4
- VAJVDSVGBWFCLW-UHFFFAOYSA-N 3-Phenyl-1-propanol Chemical compound OCCCC1=CC=CC=C1 VAJVDSVGBWFCLW-UHFFFAOYSA-N 0.000 description 4
- YEJRWHAVMIAJKC-UHFFFAOYSA-N 4-Butyrolactone Chemical compound O=C1CCCO1 YEJRWHAVMIAJKC-UHFFFAOYSA-N 0.000 description 4
- 239000004593 Epoxy Substances 0.000 description 4
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 4
- XBDQKXXYIPTUBI-UHFFFAOYSA-M Propionate Chemical compound CCC([O-])=O XBDQKXXYIPTUBI-UHFFFAOYSA-M 0.000 description 4
- 239000000654 additive Substances 0.000 description 4
- 239000012965 benzophenone Substances 0.000 description 4
- 239000003795 chemical substances by application Substances 0.000 description 4
- 125000006165 cyclic alkyl group Chemical group 0.000 description 4
- 125000000113 cyclohexyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])C1([H])[H] 0.000 description 4
- 125000001511 cyclopentyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C1([H])[H] 0.000 description 4
- DIOQZVSQGTUSAI-UHFFFAOYSA-N decane Chemical compound CCCCCCCCCC DIOQZVSQGTUSAI-UHFFFAOYSA-N 0.000 description 4
- 238000013461 design Methods 0.000 description 4
- POLCUAVZOMRGSN-UHFFFAOYSA-N dipropyl ether Chemical compound CCCOCCC POLCUAVZOMRGSN-UHFFFAOYSA-N 0.000 description 4
- LZCLXQDLBQLTDK-UHFFFAOYSA-N ethyl 2-hydroxypropanoate Chemical compound CCOC(=O)C(C)O LZCLXQDLBQLTDK-UHFFFAOYSA-N 0.000 description 4
- 125000003709 fluoroalkyl group Chemical group 0.000 description 4
- 125000000524 functional group Chemical group 0.000 description 4
- VOZRXNHHFUQHIL-UHFFFAOYSA-N glycidyl methacrylate Chemical compound CC(=C)C(=O)OCC1CO1 VOZRXNHHFUQHIL-UHFFFAOYSA-N 0.000 description 4
- 238000010438 heat treatment Methods 0.000 description 4
- JDSHMPZPIAZGSV-UHFFFAOYSA-N melamine Chemical compound NC1=NC(N)=NC(N)=N1 JDSHMPZPIAZGSV-UHFFFAOYSA-N 0.000 description 4
- 125000001280 n-hexyl group Chemical group C(CCCCC)* 0.000 description 4
- 125000000740 n-pentyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 4
- LLHKCFNBLRBOGN-UHFFFAOYSA-N propylene glycol methyl ether acetate Chemical compound COCC(C)OC(C)=O LLHKCFNBLRBOGN-UHFFFAOYSA-N 0.000 description 4
- 230000005855 radiation Effects 0.000 description 4
- 239000007870 radical polymerization initiator Substances 0.000 description 4
- 230000009257 reactivity Effects 0.000 description 4
- 239000011734 sodium Substances 0.000 description 4
- 229910052708 sodium Inorganic materials 0.000 description 4
- YSBPNMOAQMQEHE-UHFFFAOYSA-N (2-methyloxiran-2-yl)methyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCC1(C)CO1 YSBPNMOAQMQEHE-UHFFFAOYSA-N 0.000 description 3
- CNJRPYFBORAQAU-UHFFFAOYSA-N 1-ethoxy-2-(2-methoxyethoxy)ethane Chemical compound CCOCCOCCOC CNJRPYFBORAQAU-UHFFFAOYSA-N 0.000 description 3
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 3
- WRMNZCZEMHIOCP-UHFFFAOYSA-N 2-phenylethanol Chemical compound OCCC1=CC=CC=C1 WRMNZCZEMHIOCP-UHFFFAOYSA-N 0.000 description 3
- LSTZTHCEEPHCNQ-UHFFFAOYSA-N 3-(2,5-dioxabicyclo[2.1.0]pentan-3-yloxy)-2,5-dioxabicyclo[2.1.0]pentane Chemical compound C1(C2C(O2)O1)OC1C2C(O2)O1 LSTZTHCEEPHCNQ-UHFFFAOYSA-N 0.000 description 3
- KWOLFJPFCHCOCG-UHFFFAOYSA-N Acetophenone Natural products CC(=O)C1=CC=CC=C1 KWOLFJPFCHCOCG-UHFFFAOYSA-N 0.000 description 3
- WWZKQHOCKIZLMA-UHFFFAOYSA-N Caprylic acid Natural products CCCCCCCC(O)=O WWZKQHOCKIZLMA-UHFFFAOYSA-N 0.000 description 3
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 3
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 3
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 3
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 3
- RZVAJINKPMORJF-UHFFFAOYSA-N N-acetyl-para-amino-phenol Natural products CC(=O)NC1=CC=C(O)C=C1 RZVAJINKPMORJF-UHFFFAOYSA-N 0.000 description 3
- OFOBLEOULBTSOW-UHFFFAOYSA-N Propanedioic acid Natural products OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 3
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 3
- LCXXNKZQVOXMEH-UHFFFAOYSA-N Tetrahydrofurfuryl methacrylate Chemical compound CC(=C)C(=O)OCC1CCCO1 LCXXNKZQVOXMEH-UHFFFAOYSA-N 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- ZMANZCXQSJIPKH-UHFFFAOYSA-N Triethylamine Chemical compound CCN(CC)CC ZMANZCXQSJIPKH-UHFFFAOYSA-N 0.000 description 3
- 150000001252 acrylic acid derivatives Chemical class 0.000 description 3
- 239000007864 aqueous solution Substances 0.000 description 3
- 238000001816 cooling Methods 0.000 description 3
- 238000007334 copolymerization reaction Methods 0.000 description 3
- 125000005265 dialkylamine group Chemical group 0.000 description 3
- SBZXBUIDTXKZTM-UHFFFAOYSA-N diglyme Chemical compound COCCOCCOC SBZXBUIDTXKZTM-UHFFFAOYSA-N 0.000 description 3
- SZXQTJUDPRGNJN-UHFFFAOYSA-N dipropylene glycol Chemical compound OCCCOCCCO SZXQTJUDPRGNJN-UHFFFAOYSA-N 0.000 description 3
- 125000001301 ethoxy group Chemical group [H]C([H])([H])C([H])([H])O* 0.000 description 3
- 125000003983 fluorenyl group Chemical group C1(=CC=CC=2C3=CC=CC=C3CC12)* 0.000 description 3
- 229910052731 fluorine Inorganic materials 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 125000000956 methoxy group Chemical group [H]C([H])([H])O* 0.000 description 3
- YKYONYBAUNKHLG-UHFFFAOYSA-N n-Propyl acetate Natural products CCCOC(C)=O YKYONYBAUNKHLG-UHFFFAOYSA-N 0.000 description 3
- UAJRSHJHFRVGMG-UHFFFAOYSA-N p-Methoxystyrene Natural products COC1=CC=C(C=C)C=C1 UAJRSHJHFRVGMG-UHFFFAOYSA-N 0.000 description 3
- NFHFRUOZVGFOOS-UHFFFAOYSA-N palladium;triphenylphosphane Chemical compound [Pd].C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 NFHFRUOZVGFOOS-UHFFFAOYSA-N 0.000 description 3
- 238000005498 polishing Methods 0.000 description 3
- 229940051841 polyoxyethylene ether Drugs 0.000 description 3
- 229920000056 polyoxyethylene ether Polymers 0.000 description 3
- 238000002360 preparation method Methods 0.000 description 3
- 229940090181 propyl acetate Drugs 0.000 description 3
- 238000003756 stirring Methods 0.000 description 3
- 238000006467 substitution reaction Methods 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- SSLASPHAKUVIRG-UHFFFAOYSA-N (2-methylcyclohexyl) prop-2-enoate Chemical compound CC1CCCCC1OC(=O)C=C SSLASPHAKUVIRG-UHFFFAOYSA-N 0.000 description 2
- QYGBYAQGBVHMDD-XQRVVYSFSA-N (z)-2-cyano-3-thiophen-2-ylprop-2-enoic acid Chemical compound OC(=O)C(\C#N)=C/C1=CC=CS1 QYGBYAQGBVHMDD-XQRVVYSFSA-N 0.000 description 2
- IJURQEZAWYGJDB-UHFFFAOYSA-N 1,1,2,2-tetrafluoro-1-(1,1,2,2-tetrafluorobutoxy)butane Chemical compound CCC(F)(F)C(F)(F)OC(F)(F)C(F)(F)CC IJURQEZAWYGJDB-UHFFFAOYSA-N 0.000 description 2
- LZDKZFUFMNSQCJ-UHFFFAOYSA-N 1,2-diethoxyethane Chemical compound CCOCCOCC LZDKZFUFMNSQCJ-UHFFFAOYSA-N 0.000 description 2
- VPBZZPOGZPKYKX-UHFFFAOYSA-N 1,2-diethoxypropane Chemical compound CCOCC(C)OCC VPBZZPOGZPKYKX-UHFFFAOYSA-N 0.000 description 2
- KBPLFHHGFOOTCA-UHFFFAOYSA-N 1-Octanol Chemical compound CCCCCCCCO KBPLFHHGFOOTCA-UHFFFAOYSA-N 0.000 description 2
- PAMIQIKDUOTOBW-UHFFFAOYSA-N 1-methylpiperidine Chemical compound CN1CCCCC1 PAMIQIKDUOTOBW-UHFFFAOYSA-N 0.000 description 2
- SDJHPPZKZZWAKF-UHFFFAOYSA-N 2,3-dimethylbuta-1,3-diene Chemical compound CC(=C)C(C)=C SDJHPPZKZZWAKF-UHFFFAOYSA-N 0.000 description 2
- OISVCGZHLKNMSJ-UHFFFAOYSA-N 2,6-dimethylpyridine Chemical compound CC1=CC=CC(C)=N1 OISVCGZHLKNMSJ-UHFFFAOYSA-N 0.000 description 2
- OZAIFHULBGXAKX-UHFFFAOYSA-N 2-(2-cyanopropan-2-yldiazenyl)-2-methylpropanenitrile Chemical compound N#CC(C)(C)N=NC(C)(C)C#N OZAIFHULBGXAKX-UHFFFAOYSA-N 0.000 description 2
- MIYRHXBYLQWDQS-UHFFFAOYSA-N 2-(2-ethoxypropoxy)-1-methoxypropane Chemical compound CCOC(C)COC(C)COC MIYRHXBYLQWDQS-UHFFFAOYSA-N 0.000 description 2
- PFHOSZAOXCYAGJ-UHFFFAOYSA-N 2-[(2-cyano-4-methoxy-4-methylpentan-2-yl)diazenyl]-4-methoxy-2,4-dimethylpentanenitrile Chemical compound COC(C)(C)CC(C)(C#N)N=NC(C)(C#N)CC(C)(C)OC PFHOSZAOXCYAGJ-UHFFFAOYSA-N 0.000 description 2
- XFCMNSHQOZQILR-UHFFFAOYSA-N 2-[2-(2-methylprop-2-enoyloxy)ethoxy]ethyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCCOCCOC(=O)C(C)=C XFCMNSHQOZQILR-UHFFFAOYSA-N 0.000 description 2
- TXBCBTDQIULDIA-UHFFFAOYSA-N 2-[[3-hydroxy-2,2-bis(hydroxymethyl)propoxy]methyl]-2-(hydroxymethyl)propane-1,3-diol Chemical compound OCC(CO)(CO)COCC(CO)(CO)CO TXBCBTDQIULDIA-UHFFFAOYSA-N 0.000 description 2
- FDSUVTROAWLVJA-UHFFFAOYSA-N 2-[[3-hydroxy-2,2-bis(hydroxymethyl)propoxy]methyl]-2-(hydroxymethyl)propane-1,3-diol;prop-2-enoic acid Chemical compound OC(=O)C=C.OC(=O)C=C.OC(=O)C=C.OC(=O)C=C.OC(=O)C=C.OCC(CO)(CO)COCC(CO)(CO)CO FDSUVTROAWLVJA-UHFFFAOYSA-N 0.000 description 2
- NQBXSWAWVZHKBZ-UHFFFAOYSA-N 2-butoxyethyl acetate Chemical compound CCCCOCCOC(C)=O NQBXSWAWVZHKBZ-UHFFFAOYSA-N 0.000 description 2
- SVONRAPFKPVNKG-UHFFFAOYSA-N 2-ethoxyethyl acetate Chemical compound CCOCCOC(C)=O SVONRAPFKPVNKG-UHFFFAOYSA-N 0.000 description 2
- XLLIQLLCWZCATF-UHFFFAOYSA-N 2-methoxyethyl acetate Chemical compound COCCOC(C)=O XLLIQLLCWZCATF-UHFFFAOYSA-N 0.000 description 2
- LWRBVKNFOYUCNP-UHFFFAOYSA-N 2-methyl-1-(4-methylsulfanylphenyl)-2-morpholin-4-ylpropan-1-one Chemical compound C1=CC(SC)=CC=C1C(=O)C(C)(C)N1CCOCC1 LWRBVKNFOYUCNP-UHFFFAOYSA-N 0.000 description 2
- POYODSZSSBWJPD-UHFFFAOYSA-N 2-methylprop-2-enoyloxy 2-methylprop-2-eneperoxoate Chemical compound CC(=C)C(=O)OOOC(=O)C(C)=C POYODSZSSBWJPD-UHFFFAOYSA-N 0.000 description 2
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Classifications
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- C08F2/48—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light
- C08F2/50—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light with sensitising agents
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- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
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- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
- C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
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- C08F220/32—Esters containing oxygen in addition to the carboxy oxygen containing epoxy radicals
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- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
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Description
本發明係關於感光性樹脂組成物、顯示面板用間隔物及顯示面板。更詳細而言,係關於形成液晶顯示面板或觸控面板等顯示面板用之間隔物之感光性樹脂組成物,由該感光性樹脂組成物所形成之顯示面板用間隔物及具備該間隔物所成顯示面板。
以往液晶顯示面板為了使2片基板間之間隔(晶胞間隙)保持一定,而使用具有所定粒徑之玻璃珠、塑膠珠等之間隔物粒子。這些間隔物粒子在玻璃基板等透明基板上呈不規則散布,因此在像素形成區域含有間隔物粒子時,會產生間隔物粒子之映入現象或入射光散亂,液晶面板之對比降低之問題。
因此,為了解決這些問題,而採用藉由光蝕刻來形成間隔物的方法。此方法係將感光性樹脂組成物塗佈於基板上,經由所定之光罩以紫外線曝光後進行顯像,形成點狀或條帶狀之間隔物者,因僅在像素形成區域以外之所定場所可形成間隔物,因此基本上解決如前述的問題。
實際之間隔物形成步驟,例如在彩色濾光片等所用之基板上藉由光蝕刻形成間隔物時,大多使用接近式曝光機。此接近式曝光機曝光時,光罩與塗佈感光性組成物之基板之間設置一定之間隙曝光,如光罩之圖案曝光較理想。但是前述間隙充滿空氣或氮氣,通過光罩之開口部(透明部)之光以該間隙部擴散,因此產生比光罩圖案之設計尺寸更寬曝光的問題。
為了解決這種問題,本申請人已於日本特開2001-261761號公報中揭示使用1,2-辛烷二酮-1-〔4-(苯硫基)苯基〕-2-(O-苯醯基肟)作為感光性組成物之光聚合引發劑,即使以接近式曝光也可忠實實現光罩圖案之設計尺寸,可形成強度、耐熱性等優異之顯示面板用間隔物。
隨著液晶顯示面板之大型化,必須精確控制晶胞間隙,但是由間隔物用感光性組成物所形成之被膜與基板之密著性不足時,所形成之間隔物會偏離基板,結果精確保持晶胞間隙。液晶顯示面板係進行像素之高開口率化,結果可配置間隔物之黑色矩陣區域之面積漸漸縮小。因此即使在某程度可進入像素區域也不影響像素之色調,對於間隔物仍要求更高透明性。
但是也包括特開2001-261761號公報所記載者,形成間隔物所用之感光性組成物在與基板之密著性及透明性方面仍不充分,需要開發兼具這些特性之感光性組成物。
近年,因液晶顯示裝置之大面積化或提高生產性等,因此主玻璃基板也進行大型化。以往之基板尺寸(680×880mm)係基板尺寸小於光罩,因此可使用一次曝光方式。
但是大型基板(例如1500×1800mm)幾乎無法製作與此基板相同之光罩尺寸,很難使用一次曝光方式。大型基板曝光方式提案使用階段曝光方式。但是階段曝光方式係對於基板進行數次曝光,每一次需要對準位置、階段移動之時間。階段曝光方式相較於一次曝光方式,可能會降低生產率。一次曝光方式可容許3000J/m2
之曝光感度,但是階段曝光方式則要求1500J/m2
以下之曝光感度。以往之材料很難要求以1500J/m2
以下之曝光量得到充分之間隔物形狀及膜厚。
關於間隔物形狀、膜厚之控制性之要求值,近年越來越嚴格,仍有形成間隔物時因製程變動產生形狀、膜厚之變動、組成物溶液之經時變化所產生之形狀、膜厚之安定性的問題。特別是1500J/m2
以下之曝光量範圍,仍有對於曝光量之間隔物形狀、膜厚之控制性的問題。
近年液晶顯示面板製造用之感光性組成物,因保存期間,使用中因組成物中之成分結晶等產生雜質污染裝置等問題嚴重,因而期待降低這種問題之感光性組成物。
本發明之課題係高感度,且可忠實實現光罩圖案之設計尺寸,且與基板之密著性優,在1500J/m2
以下之曝光量也可得到充分之間隔物形狀及膜厚,可形成強度、耐熱性優異,另外在低曝光區域之間隔物形狀及膜厚之抑制性優異,保存期間中,使用中不易產生異物,可形成製程安定性、經過時間之安定性優異之顯示面板用間隔物的感光性樹脂組成物,顯示面板用間隔物及顯示面板。
依據本發明時,前述課題第一可藉由下述感光性樹脂組成物(以下稱為「感光性樹脂組成物(甲)」)來達成。
一種感光性樹脂組成物,其特徵為含有:〔A〕(a1)乙烯性不飽和羧酸及/或乙烯性不飽和羧酸酐與(a2)其他乙烯性不飽和化合物之共聚物,〔B〕具有乙烯性不飽和鍵之聚合性化合物及〔C〕由下述式(1)或(2)表示之化合物所構成之光聚合引發劑,
〔R1
表示碳數1~20之烷基、碳數3~8之環烷基或苯基,R2
與R3
分別為氫原子、碳數1~20之烷基、碳數3~8之環烷基、取代或未取代之苯基或碳數7~20之脂環基(但是碳數7~8之環烷基除外),上述取代苯基之取代基為碳數1~6之烷基、碳數1~6之烷氧基、苯基或鹵原子,R4
為碳數4~20之含氧雜環基、碳數4~20之含氮雜環基或碳數4~20之含硫雜環基,R5
係表示氫、碳數1~12之烷基或碳數1~12之烷氧基,n為1~5之整數,m為0~5之整數,n+m≦5,
R1
、R2
、R3
、R4
、R5
、m及n之定義係與上述相同,l為0~6之整數。
依據本發明時,前述課題第二可藉由感光性樹脂組成物(甲)所形成之顯示面板用間隔物來達成。
依據本發明時,前述課題第三可藉由具備前述顯示面板用間隔物所成之顯示面板來達成。
以下詳細說明本發明。
感光性樹脂組成物(甲)-共聚物〔A〕-感光性樹脂組成物(甲)之〔A〕成分係由(a1)乙烯性不飽和羧酸及/或乙烯性不飽和羧酸酐與(a2)其他乙烯性不飽和化合物之共聚物(以下稱為「共聚物〔A〕」)所構成。
構成共聚物〔A〕之各成分中,(a1)乙烯性不飽和羧酸及/或乙烯性不飽和羧酸酐(以下這些統稱為「不飽和羧酸系單體(a1)」例如有丙烯酸、甲基丙烯酸、巴豆酸、2-甲基丙烯醯氧基乙基琥珀酸、2-甲基丙烯醯氧基乙基六氫鄰苯二甲酸之單羧酸;順丁烯二酸、反丁烯二酸、檸康酸、中康酸、依康酸之二羧酸;前述二羧酸之酸酐等。
這些不飽和羧酸系單體(a1)中,從共聚反應性、共聚物對於鹼水溶液之溶解性及易於取得之觀點而言,較佳為丙烯酸、甲基丙烯酸、順丁烯二酸酐等。
在感光性樹脂組成物(甲)中,不飽和羧酸系單體(a1)可單獨使用或混合2種以上使用。
共聚物〔A〕中,來自不飽和羧酸系單體(a1)之重覆單元之含有比率較佳為5~50重量%,更佳為10~40重量%,特佳為15~30重量%。來自不飽和羧酸系單體(a1)之重覆單元之含有比率未達5重量%時,對於鹼水溶液之溶解性有降低之傾向,另外超過50重量%時,對於鹼水溶液之溶解性可能過大。
又,(a2)其他乙烯性不飽和化合物可使用含環氧基乙烯性不飽和化合物(以下稱為「含環氧基單體」)及不含環氧基之其他乙烯性不飽和化合物(以下僅稱「其他單體」)。這些可單獨或組合使用。含環氧基單體例如有丙烯酸環氧丙酯、丙烯酸2-甲基環氧丙酯、丙烯酸3,4-環氧基丁酯、丙烯酸6,7-環氧基庚酯、丙烯酸3,4-環氧基環己酯之丙烯酸環氧基烷酯;甲基丙烯酸環氧丙酯、甲基丙烯酸2-甲基環氧丙酯、甲基丙烯酸3,4-環氧基丁酯、甲基丙烯酸6,7-環氧基庚酯、甲基丙烯酸3,4-環氧基環己酯之甲基丙烯酸環氧基烷酯;α-乙基丙烯酸環氧丙酯、α-正丙基丙烯酸環氧丙酯、α-正丁基丙烯酸環氧丙酯、α-乙基丙烯酸6,7-乙氧基庚酯之α-烷基丙烯酸環氧基烷酯;鄰乙烯基苄基環氧丙基醚、間乙烯基苄基環氧丙基醚、對乙烯基苄基環氧丙基醚之環氧丙基醚。
這些含環氧基單體中,從共聚反應性及間隔物之強度之觀點而言,較佳為甲基丙烯酸環氧丙酯、甲基丙烯酸2-甲基環氧丙酯、甲基丙烯酸6,7-環氧基庚酯、鄰乙烯基苄基環氧丙基醚、間乙烯基苄基環氧丙基醚、對乙烯基苄基環氧丙基醚。
感光性樹脂組成物(甲)中,含環氧基單體可單獨使用或混合2種以上使用。
共聚物〔A〕中,來自含環氧基單體之重覆單元之含有比率較佳為10~70重量%,更佳為20~60重量%,特佳為30~50重量%。來自含環氧基單體之重覆單元之含有比率未達10重量%時,所得之間隔物之強度有降低的傾向,另外超過70重量%時,所得之共聚物之保存安定性有降低的傾向。
(a3)乙烯性不飽和化合物之其他單體,例如有丙烯酸甲酯、丙烯酸異丙酯等之丙烯酸烷酯;甲基丙烯酸甲酯、甲基丙烯酸乙酯、甲基丙烯酸正丁酯、甲基丙烯酸第二丁酯、甲基丙烯酸第三丁酯之甲基丙烯酸烷酯;丙烯酸環己酯、丙烯酸2-甲基環己酯、丙烯酸三環〔5.2.1.02 , 6
〕癸烷-8-酯、丙烯酸2-(三環〔5.2.1.02 , 6
〕癸烷-8-氧基)乙酯、丙烯酸異冰片酯之丙烯酸脂環酯;甲基丙烯酸環己酯、甲基丙烯酸2-甲基環己酯、甲基丙烯酸三環〔5.2.1.02 , 6
〕癸烷-8-基、甲基丙烯酸2-(三環〔5.2.1.02 , 6
〕癸烷-8-氧基)乙酯、甲基丙烯酸異冰片酯之甲基丙烯酸脂環酯;丙烯酸苯酯、丙烯酸苄酯之丙烯酸之芳酯或芳烷酯;甲基丙烯酸苯酯、甲基丙烯酸苄酯之甲基丙烯酸芳酯或芳烷酯;順丁烯二酸二乙酯、反丁烯二酸二乙酯、依康酸二乙酯之二羧酸二烷酯;甲基丙烯酸2-羥基乙酯、甲基丙烯酸2-羥丙酯之甲基丙烯酸羥烷酯;甲基丙烯酸四氫糠酯、甲基丙烯酸四氫呋喃酯、甲基丙烯酸四氫哌喃-2-甲酯之含氧一原子之不飽和雜五及六員環甲基丙烯酸酯;苯乙烯、α-甲基苯乙烯、間甲基苯乙烯、對甲基苯乙烯、對甲氧基苯乙烯之乙烯芳香族化合物;1,3-丁二烯、異戊二烯、2,3-二甲基-1,3-丁二烯之共軛二烯系化合物及丙烯腈、甲基丙烯腈、丙烯醯胺、甲基丙烯醯胺、氯化乙烯、偏氯乙烯、乙酸乙烯等。
這些其他單體中,從共聚反應性及所得之共聚物對鹼水溶液之溶解性的觀點而言,較佳為丙烯酸2-甲基環己酯、甲基丙烯酸第三丁酯、甲基丙烯酸三環〔5.2.1.02 , 6
〕癸烷-8-酯、苯乙烯、對甲氧基苯乙烯、甲基丙烯酸四氫糠酯、1,3-丁二烯等。
感光性樹脂組成物(甲)中,其他之單體可單獨使用或混合2種以上使用。
共聚物〔A〕中,來自其他單體之重覆單元之含有比率,較佳為10~70重量%,更佳為20~50重量%,特佳為30~50重量%。來自其他單體之重覆單元之含有比率未達10重量%時,所得之共聚物之保存安定性有降低的傾向,而超過70重量%時,所得之共聚物對鹼水溶液之溶解性有降低的傾向。
共聚物〔A〕係具有羧基及/或羧酸酐基與環氧基,對於鹼水溶液具有適度溶解性,同時,即使不併用特別的硬化劑藉由加熱也可容易硬化,含有該共聚物之感光性樹脂組成物(甲)在顯像時,不會產生顯像殘留及膜變薄,可容易形成設定圖型之間隔物。
共聚物〔A〕可在適當溶劑及自由基聚合引發劑之存在下,使不飽和羧酸單體(a1)、含環氧基單體及/或其他單體(a2)藉由聚合製造。
製造共聚物〔A〕所用之溶劑例如有醇、醚、乙二醇醚、乙二醇烷基醚乙酸酯、二乙二醇、二丙二醇、丙二醇單烷醚、丙二醇烷醚乙酸酯、丙二醇烷醚丙酸酯、芳香族烴、酮、酯等。
這些具體例,其中醇有甲醇、乙醇、苄醇、2-苯基乙醇、3-苯基-1-丙醇等;醚例如有四氫呋喃等;乙二醇醚例如有乙二醇單甲醚、乙二醇單乙醚等;乙二醇烷醚乙酸酯例如有甲基溶纖劑乙酸酯、乙基溶纖劑乙酸酯、乙二醇單丁醚乙酸酯、乙二醇單乙醚乙酸酯等;二乙二醇例如有二乙二醇單甲醚、二乙二醇單乙醚、二乙二醇二甲醚、二乙二醇二乙醚、二乙二醇乙基甲醚等;二丙二醇例如有二丙二醇單甲醚、二丙二醇單乙醚、二丙二醇二甲醚、二丙二醇二乙醚、二丙二醇乙基甲醚等;丙二醇單烷醚例如有丙二醇單甲醚、丙二醇單乙醚、丙二醇單丙醚、丙二醇單丁醚等;丙二醇烷醚乙酸酯例如有丙二醇甲醚乙酸酯、丙二醇乙醚乙酸酯、丙二醇丙醚乙酸酯、丙二醇丁醚乙酸酯等;丙二醇烷醚丙酸酯例如有丙二醇甲醚丙酸酯、丙二醇乙醚丙酸酯、丙二醇丙醚丙酸酯、丙二醇丁醚丙酸酯等;芳香族烴例如有甲苯、二甲苯等;酮例如有甲基乙基酮、環己酮、4-羥基-4-甲基-2-戊酮等;酯例如有乙酸甲酯、乙酸乙酯、乙酸丙酯、乙酸丁酯、2-羥基丙酸乙酯、2-羥基-2-甲基丙酸甲酯、2-羥基-2-甲基丙酸乙酯、羥基乙酸甲酯、羥基乙酸乙酯、羥基乙酸丁酯、乳酸甲酯、乳酸乙酯、乳酸丙酯、乳酸丁酯、3-羥基丙酸甲酯、3-羥基丙酸乙酯、3-羥基丙酸丙酯、3-羥基丙酸丁酯、2-羥基-3-甲基丁酸甲酯、甲氧基乙酸甲酯、甲氧基乙酸乙酯、甲氧基乙酸丙酯、甲氧基乙酸丁酯、乙氧基乙酸甲酯、乙氧基乙酸乙酯、乙氧基乙酸丙酯、乙氧基乙酸丁酯、丙氧基乙酸甲酯、丙氧基乙酸乙酯、丙氧基乙酸丙酯、丙氧基乙酸丁酯、丁氧基乙酸甲酯、丁氧基乙酸乙酯、丁氧基乙酸丙酯、丁氧基乙酸丁酯、2-甲氧基丙酸甲酯、2-甲氧基丙酸乙酯、2-甲氧基丙酸丙酯、2-甲氧基丙酸丁酯、2-乙氧基丙酸甲酯、2-乙氧基丙酸乙酯、2-乙氧基丙酸丙酯、2-乙氧基丙酸丁酯、2-丁氧基丙酸甲酯、2-丁氧基丙酸乙酯、2-丁氧基丙酸丙酯、2-丁氧基丙酸丁酯、3-甲氧基丙酸甲酯、3-甲氧基丙酸乙酯、3-甲氧基丙酸丙酯、3-甲氧基丙酸丁酯、3-乙氧基丙酸甲酯、3-乙氧基丙酸乙酯、3-乙氧基丙酸丙酯、3-乙氧基丙酸丁酯、3-丙氧基丙酸甲酯、3-丙氧基丙酸乙酯、3-丙氧基丙酸丙酯、3-丙氧基丙酸丁酯、3-丁氧基丙酸甲酯、3-丁氧基丙酸乙酯、3-丁氧基丙酸丙酯、3-丁氧基丙酸丁基等之酯。
這些中,較佳為乙二醇烷基醚乙酸酯、二乙二醇、二丙二醇、二丙二醇單烷醚、丙二醇烷醚乙酸酯,更佳為二乙二醇二甲醚、二乙二醇乙基甲醚、二丙二醇二甲醚、二丙二醇乙基甲醚、丙二醇甲醚、丙二醇甲醚乙酸酯。
上述溶劑可單獨使用或混合2種以上使用。
上述聚合所用之自由基聚合引發劑,無特別限定,例如有2,2'-偶氮雙異丁腈、2,2'-偶氮雙-(2,4-二甲基戊腈)、2,2'-偶氮雙-(4-甲氧基-2,4-二甲基戊腈)、4,4'-偶氮雙(4-氰基戊酸)、二甲基2,2'-偶氮雙(2-甲基丙酸酯)、2,2'-偶氮雙(4-甲氧基-2,4-二甲基戊腈)之偶氮化合物;苯醯基過氧化物、月桂醯基過氧化物、第三丁基過氧三甲基乙酸酯、1,1-雙(第三丁基過氧)環己烷之有機過氧化物;過氧化氫等。自由基聚合引發劑使用過氧化物時,可與還原劑併用,作為氧化還原型引發劑。
這些自由基聚合引發劑可單獨使用或混合2種以上使用。
上述所得之共聚物〔A〕可為溶液狀態,直接供調製輻射敏感性樹脂組成物用,也可從溶液中分離,供調製輻射敏感性樹脂組成物用。
共聚物〔A〕之凝膠滲透層析法(GPC)之聚苯乙烯換算重量平均分子量(以下稱為「Mw」),較佳為2,000~100,000,更佳為5,000~50,000。Mw未達2,000時,所得之被膜之顯像性、殘膜率等會降低,且可能損及圖案形狀、耐熱性等,又超過100,000時,解像度降低,或可能影響圖案形狀。
-聚合性化合物〔B〕-感光性樹脂組成物(甲)中之〔B〕成分係具有乙烯性不飽和鍵之聚合性化合物(以下稱為「聚合性化合物〔B〕」)。
聚合性化合物〔B〕無特別限定,但單官能、2官能或3官能以上(甲基)丙烯酸酯因聚合性良好,可提高所得之間隔物的強度,因此較佳。
單官能(甲基)丙烯酸酯例如有,2-羥乙基丙烯酸酯、2-羥乙基甲基丙烯酸酯、二乙二醇單乙醚丙烯酸酯、二乙二醇單乙醚甲基丙烯酸酯、異冰片基丙烯酸酯、異冰片基甲基丙烯酸酯、3-甲氧基丁基丙烯酸酯、3-甲氧基丁基甲基丙烯酸酯、2-丙烯醯氧基乙基-2-羥丙基鄰苯二甲酸酯、2-甲基丙烯醯氧基乙基-2-羥丙基鄰苯二甲酸酯等,又市售品例如有Aronix M-101、同M-111、同M-114(東亞合成(股)製);KAYARAD TC-110S,同TC-120S(日本化藥(股)製);Viscoat 158、同2311(大阪有機化學工業(股)製)等。
2官能基(甲基)丙烯酸酯例如有乙二醇二丙烯酸酯、乙二醇二甲基丙烯酸酯、二乙二醇二丙烯酸酯、二乙二醇二甲基丙烯酸酯、丁二醇二丙烯酸酯、丁乙二醇二甲基丙烯酸酯、1,6-己二醇二丙烯酸酯、1,6-己二醇二甲基丙烯酸酯、1,9-壬二醇二丙烯酸酯、1,9-壬二醇二甲基丙烯酸酯、雙苯氧基乙醇芴二丙烯酸酯、雙苯氧基乙醇芴二甲基丙烯酸酯等,又市售品例如有Aronix M-210、同M-240、同M-6200(東亞合成(股)製)、KAYARAD HDDA、同HX-220、同R-604(日本化藥(股)製)、Viscoat 260、同312、同335HP(大阪有機化學工業(股)製)等。
3官能以上之(甲基)丙烯酸酯例如有三羥甲基丙烷三丙烯酸酯、三羥甲基丙烷三甲基丙烯酸酯、新戊四醇三丙烯酸酯、新戊四醇三甲基丙烯酸酯、新戊四醇四丙烯酸酯、新戊四醇四甲基丙烯酸酯、二新戊四醇五丙烯酸酯、二新戊四醇五甲基丙烯酸酯、二新戊四醇六丙烯酸酯、二新戊四醇六甲基丙烯酸酯、三(2-丙烯醯基氧乙基)磷酸酯、三(2-甲基丙烯醯基氧乙基)磷酸酯等。
特別是9官能以上之(甲基)丙烯酸酯係具有伸烷基直鏈及脂環構造,將含有2個以上異氰酸酯基之化合物與分子內含有1個以上羥基之3官能、4官能及5官能之(甲基)丙烯酸酯化合物產生反應所得之胺基甲酸乙酯丙烯酸酯化合物。
上述市售品例如有Aronix M-309、同M-400、同M-405、同M-450、同M-7100、同M-8030、同M-8060、同TO-1450(東亞合成(股)製)、KAYARAD TMPTA、同DPHA、同DPCA-20、同DPCA-30、同DPCA-60、同DPCA-120(日本化藥(股)製)、Viscoat 295、同300、同360、同GPT、同3PA、同400(大阪有機化學工業(股)製)等。9官能以上之多官能胺基甲酸乙酯丙烯酸酯之市售品,例如有New frontier R-1150(以上,第一工業製藥(股)製)、KAYARAD DPHA-40H(以上,日本化藥(股)製)等。
這些單官能、2官能或3官能以上之(甲基)丙烯酸酯中,以3官能以上之(甲基)丙烯酸酯較佳,特佳為三羥甲基丙烷三丙烯酸酯、新戊四醇三丙烯酸酯、新戊四醇四丙烯酸酯、二新戊四醇五丙烯酸酯及二新戊四醇六丙烯酸酯。
上述單官能、2官能或3官能以上之(甲基)丙烯酸酯可單獨或組合2種以上使用。
感光性樹脂組成物(甲)中,聚合性化合物〔B〕之使用量係對於共聚物〔A〕100重量份時,較佳為50~140重量份,更佳為60~120重量份。聚合性化合物〔B〕使用量未達50重量份時,顯像時可能會發生顯像殘留,另外超過140重量份時,所得之間隔物之硬度有降低的傾向。
-光聚合引發劑〔C〕-感光性樹脂組成物(甲)之〔C〕成分係由O-醯基肟型光聚合引發劑所構成,特別是上述式(1)或(2)表示之化合物(以下稱為「光聚合引發劑〔C〕」)較佳。
本發明之光聚合引發劑係指藉由可見光線、紫外線、遠紫外線、帶電粒子線、X射線等之曝光,可產生使聚合性化合物〔B〕之開始聚合之活性種的成分。
上述式(1)或(2)表示之「光聚合引發劑〔C〕」中,R1
表示碳數1~20之烷基、碳數3~8之環烷基或苯基,R2
與R3
分別表示氫原子、碳數1~20之烷基、碳數3~8之環烷基,取代或未取代之苯基或碳數7~20之脂環基(但是碳數7~8之環烷基除外)。上述取代苯基之取代基為碳數1~6之烷基、碳數1~6之烷氧基、苯基及鹵原子。此等取代基可為1~5個,R4
為碳數4~20之含氧雜環基、碳數4~20之含氮雜環基或碳數4~20之含硫雜環基。R5
係表示氫、碳數1~12之烷基或碳數1~12之烷氧基。n為1~5之整數,m為0~5之整數,n+m≦5,l為0~6之整數。
式(1)或(2)之R1
之碳數1~20之烷基可為直鏈狀或支鏈狀之烷基,其具體例為甲基、乙基、正丙基、異丙基、正丁基、第二丁基、第三丁基、正戊基、正己基、正庚基、正辛基、正壬基、正癸基、正十一烷基、正十二烷基。碳數3~8之環烷基例如有環戊基、環己基等。
R2
與R3
之碳數1~20之烷基可為直鏈狀或支鏈狀之烷基,其具體例為甲基、乙基、正丙基、異丙基、正丁基、第二丁基、第三丁基、正戊基、正己基、正庚基、正辛基、正壬基、正癸基、正十一烷基、正十二烷基。碳數3~8之環烷基例如有環戊基、環己基等。
R2
與R3
之取代苯基之取代基之碳數1~6之烷基可為直鏈狀、支鏈狀或環狀之烷基,其具體例為甲基、乙基、正丙基、異丙基、正丁基、第二丁基、第三丁基、正戊基、正己基、環戊基、環己基等。
碳數1~6之烷氧基可為直鏈狀、支鏈狀或環狀之烷基,其具體例為甲氧基、乙氧基、正丙氧基、異丙氧基、正丁氧基、第三丁氧基等。鹵原子例如有氟原子、氯原子等。
碳數7~20之脂環基(但是碳數7~8之環烷基除外),例如有雙環烷基、三環烷基、螺烷基、第三環烷基、含帖烯骨架之基、含金剛烷骨架之基等。
R4
之碳數4~20之含氮雜環基、碳數4~20之含氧雜環基、碳數4~20之含硫雜環基,例如有四氫噻吩基、吖庚因基、二氫吖庚因基、二氧雜環戊烷基、三嗪基、氧雜硫雜基、噻唑基、氧雜二嗪基、二氧雜茚滿基、二硫雜萘基、呋喃基、苯硫基、吡咯基、噁唑基、異噁唑基、噻唑基、異噻唑基、吡唑基、呋咱基、吡喃基、吡啶基、噠嗪基、嘧啶基、吡嗪基、吡咯啉基、嗎啉基、哌嗪基、奎寧環基、吲哚基、異吲哚基、苯並呋喃基、苯並苯硫基、吲哚嗪基、色烯基、喹啉基、異喹啉基、嘌呤基、喹唑啉基、異喹唑啉基、酞嗪基、喋啶基、咔唑基、吖啶基、菲繞啉基、噻噸基、吩嗪基、吩噻嗪基、吩噁嗪基、吩噻噁基、噻蒽基、四氫呋喃基、四氫吡喃基等。其中較佳者為四氫呋喃基、四氫吡喃基等。
R5
之碳數1~12之烷基可為直鏈狀、支鏈狀或環狀之烷基,其具體例為甲基、乙基、正丙基、異丙基、正丁基、第二丁基、第三丁基、正戊基、正己基、正辛基、正壬基、正癸基、正十一烷基、正十二烷基、環戊基、環己基等。
碳數1~12之烷氧基可為直鏈狀、支鏈狀或環狀之烷基,其具體例為甲氧基、乙氧基、正丙氧基、異丙氧基、正丁氧基、第三丁氧基、正戊氧基等。
R5
中,較佳者為甲基、乙基、正丙基、異丙基、正丁基、甲氧基、乙氧基。
n為1較佳。m為0、1、2其中之一,更佳為1。l為0、1、2其中之一,更佳為1。
化合物〔C〕之具體例為乙酮,1-〔9-乙基-6-(2-甲基-2-四氫呋喃氧基苯醯基)-9.H.-咔唑-3-基〕-,1-(O-乙醯肟);乙酮,1-〔9-乙基-6-(2-甲基-2-四氫吡喃氧基苯醯基)-9.H.-咔唑-3-基〕-,1-(O-乙醯肟);乙酮,1-〔9-乙基-6-(2-甲基-2-四氫呋喃基甲氧基苯醯基)-9.H.-咔唑-3-基〕-,1-(O-乙醯肟);乙酮,1-〔9-乙基-6-(2-甲基-2-四氫吡喃基甲氧基苯醯基)-9.H.-咔唑-3-基〕-,1-(O-乙醯肟);乙酮,1-〔9-乙基-6-(2-甲基-3-四氫呋喃氧基苯醯基)-9.H.-咔唑-3-基〕-,1-(O-乙醯肟);乙酮,1-〔9-乙基-6-(2-甲基-3-四氫吡喃氧基苯醯基)-9.H.-咔唑-3-基〕-,1-(O-乙醯距);乙酮,1-〔9-乙基-6-(2-甲基-3-四氫呋喃基甲氧基苯醯基)-9.H.-咔唑-3-基〕-,1-(O-乙醯肟);乙酮,1-〔9-乙基-6-(2-甲基-3-四氫吡喃基甲氧基苯醯基)-9.H.-咔唑-3-基〕-,1-(O-乙醯肟);乙酮,1-〔9-乙基-6-(2-甲基-4-四氫呋喃氧基苯醯基)-9.H.-咔唑-3-基〕-,1-(O-乙醯肟);乙酮,1-〔9-乙基-6-(2-甲基-4-四氫吡喃氧基苯醯基)-9.H.-咔唑-3-基〕-,1-(O-乙醯肟);乙酮,1-〔9-乙基-6-(2-甲基-4-四氫呋喃基甲氧基苯醯基)-9.H.-咔唑-3-基〕-,1-(O-乙醯肟);乙酮,1-〔9-乙基-6-(2-甲基-4-四氫吡喃基甲氧基苯醯基)-9.H.-咔唑-3-基〕-,1-(O-乙醯肟);乙酮,1-〔9-乙基-6-(2-甲基-5-四氫呋喃氧基苯醯基)-9.H.-咔唑-3-基〕-,1-(O-乙醯肟);乙酮,1-〔9-乙基-6-(2-甲基-5-四氫吡喃氧基苯醯基)-9.H.-咔唑-3-基〕-,1-(O-乙醯肟);乙酮,1-〔9-乙基-6-(2-甲基-5-四氫呋喃基甲氧基苯醯基)-9.H.-咔唑-3-基〕-,1-(O-乙醯肟);乙酮,1-〔9-乙基-6-(2-甲基-5-四氫吡喃基甲氧基苯醯基)-9.H.-咔唑-3-基〕-,1-(O-乙醯肟);乙酮,1-〔9-乙基-6-(2-甲基-2-四氫呋喃氧基苯醯基)-9.H.-咔唑-3-基〕-,1-(O-苯醯基乙醯肟);乙酮,1-〔9-乙基-6-(2-甲基-2-四氫吡喃氧基苯醯基)-9.H.-咔唑-3-基〕-,1-(O-苯醯基乙醯肟);乙酮,1-〔9-乙基-6-(2-甲基-2-四氫呋喃基甲氧基苯醯基)-9.H.-咔唑-3-基〕-,1-(O-苯醯基乙醯肟);乙酮,1-〔9-乙基-6-(2-甲基-2-四氫吡喃基甲氧基苯醯基)-9.H.-咔唑-3-基〕-,1-(O-苯醯基乙醯肟);乙酮,1-〔9-乙基-6-(2-甲基-3-四氫呋喃氧基苯醯基)-9.H.-咔唑-3-基〕-,1-(O-苯醯基乙醯肟);乙酮,1-〔9-乙基-6-(2-甲基-3-四氫吡喃氧基苯醯基)-9.H.-咔唑-3-基〕-,1-(O-苯醯基乙醯肟);乙酮,1-〔9-乙基-6-(2-甲基-3-四氫呋喃基甲氧基苯醯基)-9.H.-咔唑-3-基〕-,1-(O-苯醯基乙醯肟);乙酮,1-〔9-乙基-6-(2-甲基-3-四氫吡喃基甲氧基苯醯基)-9.H.-咔唑-3-基〕-,1-(O-苯醯基乙醯肟);乙酮,1-〔9-乙基-6-(2-甲基-4-四氫呋喃氧基苯醯基)-9.H.-咔唑-3-基〕-,1-(O-苯醯基乙醯肟);乙酮,1-〔9-乙基-6-(2-甲基-4-四氫吡喃氧基苯醯基)-9.H.-咔唑-3-基〕-,1-(O-苯醯基乙醯肟);乙酮,1-〔9-乙基-6-(2-甲基-4-四氫呋喃基甲氧基苯醯基)-9.H.-咔唑-3-基〕-,1-(O-乙醯肟);乙酮,1-〔9-乙基-6-(2-甲基-4-四氫吡喃基甲氧基苯醯基)-9.H.-咔唑-3-基〕-,1-(O-乙醯肟);乙酮,1-〔9-乙基-6-(2-甲基-5-四氫呋喃氧基苯醯基)-9.H.-咔唑-3-基〕-,1-(O-乙醯肟);乙酮,1-〔9-乙基-6-(2-甲基-5-四氫吡喃氧基苯醯基)-9.H.-咔唑-3-基〕-,1-(O-乙醯肟);乙酮,1-〔9-乙基-6-(2-甲基-5-四氫呋喃基甲氧基苯醯基)-9.H.-咔唑-3-基〕-,1-(O-乙醯肟);乙酮,1-〔9-乙基-6-(2-甲基-5-四氫吡喃基甲氧基苯醯基)-9.H.-咔唑-3-基〕-,1-(O-乙醯肟);乙酮,1-〔9-乙基-6-(2-甲基-4-(2,2-二甲基-1,3-二氧雜環戊基)甲氧基苯醯基)-9.H.-咔唑-3-基〕-,1-(O-乙醯肟)等。
其中較佳者為乙酮,1-〔9-乙基-6-(2-甲基-4-四氫呋喃基甲氧基苯醯基)-9.H.-咔唑-3-基〕-,1-(O-乙醯肟);乙酮,1-〔9-乙基-6-(2-甲基-4-四氫吡喃基甲氧基苯醯基)-9.H.-咔唑-3-基〕-,1-(O-乙醯肟);乙酮,1-〔9-乙基-6-(2-甲基-5-四氫呋喃基甲氧基苯醯基)-9.H.-咔唑-3-基〕-,1-(O-乙醯肟);乙酮,1-〔9-乙基-6-(2-甲基-5-四氫吡喃基甲氧基苯醯基)-9.H.-咔唑-3-基〕-,1-(O-乙醯肟);及乙酮,1-〔9-乙基-6-(2-甲基-4-(2,2-二甲基-1,3-二氧雜環戊基)甲氧基苯醯基)-9.H.-咔唑-3-基〕-,1-(O-乙醯肟)。
這些光聚合引發劑〔C〕這些可單獨一種或組合2種以上使用。
光聚合引發劑〔C〕也可併用上述式(1)以外之O-乙醯肟型光聚合引發劑(以下稱為「光聚合引發劑〔C-2〕」)。
這些光聚合引發劑〔C-2〕之具體例為1,2-辛二酮-1-〔4-(苯硫基)苯基〕-2-(O-苯醯基肟)、1,2-丁二酮-1-〔4-(苯硫基)苯基〕-2-(O-苯醯基肟)、1,2-丁二酮-1-〔4-(苯硫基)苯基〕-2-(O-乙醯基肟)、1,2-辛二酮-1-〔4-(甲硫基)苯基〕-2-(O-苯醯基肟)、1,2-辛二酮-1-〔4-(苯硫基)苯基〕-2-(O-(4-甲基苯醯基肟))等。其中較佳者為1,2-辛二酮-1-〔4-(苯硫基)苯基〕-2-(O-苯醯基肟)。光聚合引發劑〔C-2〕可使用光聚合引發劑〔C〕之30重量%以下。
使用這些光聚合引發劑〔C〕即使以1500J/m2
以下之曝光量也可得到具有充分感度、密著性之間隔物。
感光性樹脂組成物(甲)中之光聚合引發劑〔C〕之使用量係對於聚合性化合物〔B〕100重量份時,較佳為1~20重量份,更佳為2~15重量份。光聚合引發劑〔C〕之使用量未達1重量份時,顯像時之殘膜率有下降的傾向,另外超過20重量份時,顯像時未曝光部對於鹼性顯像液之溶解性有降低的傾向。
感光性樹脂組成物(甲)中,可併用光聚合引發劑〔C〕與至少一種O-乙醯肟型光聚合引發劑以外之其他光聚合引發劑。
上述其他光聚合引發劑例如有雙咪唑系化合物、苯偶因系化合物、乙醯苯系化合物、二苯甲酮系化合物、α-二酮系化合物、多核醌系化合物、呫噸酮系化合物、膦系化合物、三嗪系化合物等。其中較佳者為乙醯苯系化合物(以下有時稱為「(D)成分」)、雙咪唑系化合物(以下有時稱為「(E)成分」)。
(D)成分:乙醯苯系化合物乙醯苯系化合物例如有α-羥基酮系化合物、α-胺基酮系化合物、這些以外之化合物。
α-羥基酮系化合物之具體例,例如1-苯基-2-羥基-2-甲基丙烷-1-酮、1-(4-異丙基苯基)-2-羥基-2-甲基丙烷-1-酮、4-(2-羥基乙氧基)苯基-(2-羥基-2-丙基)酮、1-羥基環己基苯基酮等。α-胺基酮系化合物之具體例,例如2-甲基-1-〔4-(甲硫基)苯基〕-2-嗎啉基丙烷-1-酮、2-苄基-2-二甲基胺基-1-(4-嗎啉基苯基)-丁酮-1、2-(4-甲基苄基)-2-二甲基胺基-1-(4-嗎啉基苯基)-丁酮-1等。這些以外之化合物之具體例,例如2,2-二甲氧基乙醯苯、2,2-二乙氧基乙醯苯、2,2-二甲氧基-2-苯基乙醯苯等。
這些乙醯苯系化合物可單獨使用或混合2種以上使用。
使用這些乙醯苯系化合物可提高感度、間隔物形狀及壓縮強度。
(E)成份:雙咪唑系化合物雙咪唑系化合物之具體例,例如2,2'-雙(2-氯苯基)-4,4',5,5'-四(4-乙氧基羰基苯基)-1,2'-雙咪唑,2,2'-雙(2-溴苯基)-4,4',5,5'-四(4-乙氧基羰基苯基)-1,2'-雙咪唑,2,2'-雙(2-氯苯基)-4,4',5,5'-四苯基-1,2'-雙咪唑,2,2'-雙(2,4-二氯苯基)-4,4',5,5'-四苯基-1,2'-雙咪唑,2,2'-雙(2,4,6-三氯苯基)-4,4',5,5'-四苯基-1,2'-雙咪唑,2,2'-雙(2-溴苯基)-4,4',5,5'-四苯基-1,2'-雙咪唑,2,2'-雙(2,4-二溴苯基)-4,4',5,5'-四苯基-1,2'-雙咪唑,2,2'-雙(2,4,6-三溴苯基)-4,4',5,5'-四苯基-1,2'-雙咪唑等。
上述雙咪唑系化合物中,較佳者為2,2'-雙(2-氯苯基)-4,4',5,5'-四苯基-1,2'-雙咪唑、2,2'-雙(2,4-二氯苯基)-4,4',5,5'-四苯基-1,2'-雙咪唑、2,2'-雙(2,4,6-三氯苯基)-4,4',5,5'-四苯基-1,2'-雙咪唑等,更佳為2,2'-雙(2,4-二氯苯基)-4,4',5,5'-四苯基-1,2'-雙咪唑。
上述雙咪唑系化合物可單獨使用或混合2種以上使用。
使用這些雙咪唑系化合物可提高感度、解像度及密著性。
又,為了使雙咪唑化合物增感,可使用具有二烷基胺基之脂肪族或芳香族系化合物(以下有時稱為「增感劑〔E-2〕」)。
上述增感劑〔E-2〕之具體例,例如N-甲基二乙醇胺、4,4'-雙(二甲基胺基)二苯甲酮、4,4'-雙(二乙基胺基)二苯甲酮、對二甲基胺基苯甲酸乙酯、對二甲基胺基苯甲酸異戊酯等。這些增感劑中,較佳者為4,4'-雙(二乙基胺基)二苯甲酮。
這些增感劑〔E-2〕可使用1種或2種以上。
增感劑〔E-2〕之使用量係對於〔A〕100重量份時,較佳為0.1~50重量份,更佳為1~20重量份。
增感劑〔E-2〕之量未達0.1重量份時,所得之間隔物有膜變薄或圖案形狀不良的傾向,又,超過50重量份時,同樣地會有圖案形狀不良的傾向。
使用雙咪唑化合物時,可使用提供氫之化合物的硫醇系化合物(以下有時稱為「硫醇系化合物〔E-3〕。雙咪唑化合物係因具有二烷基胺基之二苯甲酮系化合物產生增感,使雙咪唑化合物開裂產生咪唑自由基。此時,未產生高自由基聚合開始能,常形成倒圓錐形狀之不良形狀。此問題可在雙咪唑化合物與具有二烷基胺基之二苯甲酮系化合物之共存體系中添加硫醇系化合物〔E-3〕予以緩和。將硫醇化合物之氫自由基供給咪唑自由基,產生具有中性之咪唑基與聚合引發能較高之硫自由基的化合物。藉此可由倒圓錐形狀形成較佳之圓錐形狀。
上述硫醇系化合物〔E-3〕之使用比率係對於化合物〔C〕100重量份時,較佳為0.1~50重量份,更佳為1~20重量份。硫醇系化合物〔E-3〕之量未達0.1重量份時,所得之間隔物有膜變薄或圖案形狀不良的傾向,又,超過50重量份時,同樣地也有圖案形狀不良的傾向。
其具體例為2-氫硫基苯并噻唑、2-氫硫基苯并噁唑、2-氫硫基苯并咪唑、2-氫硫基-5-甲氧基苯并噻唑、2-氫硫基-5-甲氧基苯并咪唑等之芳香族系硫醇、3-氫硫基丙酸、3-氫硫基丙酸甲酯、3-氫硫基丙酸乙酯、3-氫硫基丙酸辛酯等之脂肪族系單硫醇。2官能基以上之脂肪族硫醇例如3,6-二氧雜-1,8-辛二硫醇、季戊四醇四(氫硫基乙酸酯)、季戊四醇四(3-氫硫基丙酸酯)等。
其他光聚合引發劑之使用比例係對於全光聚合引發劑100重量份時,較佳為100重量份以下,更佳為80重量份以下,特佳為60重量份以下。此時其他光聚合引發劑之使用比例超過100重量份時,有時會影響本發明之效果。
-添加劑-在感光性樹脂組成物(甲)中,在不影響本發明之效果的範圍內,可因應需要使用上述成分以外之添加劑。
例如,為了提高塗佈性,可配合界面活性劑。該界面活性劑,可適度使用氟系界面活性劑及聚矽氧系界面活性劑。
在氟系界面活性劑可使用末端、主鏈及側鏈之至少任一部位具有氟烷基或氟伸烷基之化合物。其具體例有1,1,2,2-四氟辛基(1,1,2,2-四氟丙基)醚、1,1,2,2-四氟辛基己基醚、八乙二醇二(1,1,2,2-四氟丁基)醚、六乙二醇(1,1,2,2,3,3-六氟戊基)醚、八丙二醇二(1,1,2,2-四氟丁基)醚、六丙二醇二(1,1,2,2,3,3-六氟戊基)醚、全氟十二烷基磺酸鈉、1,1,2,2,8,8,9,9,10,10-十氟十二烷、1,1,2,2,3,3-六氟癸烷、氟烷基苯磺酸鈉、氟烷基膦酸鈉、氟烷基羧酸鈉、氟烷基聚氧乙烯醚、二甘油基四(氟烷基聚氧乙烯醚)、氟烷基碘化銨、氟烷基甜菜鹼、氟烷基聚氧乙烯醚、全氟烷基聚氧基乙醇、全氟烷基烷基化物、氟系烷基酯等。
又,這些市售品例如有BM-1000、BM-1100(以上,BMCHEMIE公司製)、Megafac F142D、同F172、同F173、同F183、同F178、同F191、同F471、同F476(以上,大日本油墨化學工業(股)製)、Fulorad FC-170C、FC-171、FC-430、FC-431(以上,住友3M(股)製)、Surflon S-112、同S-113、同S-131、同S-141、同S-145、同S-382、同SC-101、同SC-102、同SC-103、同SC-104、同SC-105、同SC-106(以上,旭硝子(股)製)、Ftop EF301、同303、同352(以上,新秋田化成(股)製)、Ftergent FT-100、同FT-110、同FT-140A、同FT-150、同FT-250、同FT-251、同FTX-251、同FTX-218、同FT-300、同FT-310、同FT-400S(以上,(股)Neos製)等。
又,聚矽氧系界面活性劑例如Toray聚矽氧DC3PA、同DC7PA、同SH11PA、同SH21PA、同SH28PA、同SH29PA、同SH30PA、同SH-190、同SH-193、同SZ-6032、同SF-8428、同DC-57、同DC-190(以上,Toray.DowCorning.Silicone(股)製)、TSF-4440、TSF-4300、TSF-4445、TSF-4446、TSF-4460、TSF-4452(以上,GE東芝Silicone(股)製)等之商品名市售者。
又,前述以外之界面活性劑例如有聚氧乙烯月桂基醚、聚氧乙烯硬脂醯基烯丙基醚、聚氧乙烯油基醚之聚氧乙烯烷基醚;聚氧乙烯正辛基苯醚、聚氧乙烯正壬基苯醚之聚氧乙烯芳基醚;聚氧乙烯二月桂酸酯、聚氧乙烯二硬脂酸酯之聚氧乙烯二烷基酯等之非離子系界面活性劑或市售品之KP341(信越化學工業(股)製)、Polyflow No.57,95(共榮社油脂化學工業(股)製)等。
這些界面活性劑可單獨使用或混合2種以上使用。
界面活性劑之配合量係對於共聚物〔A〕100重量份時,較佳為5重量份以下,更佳為2重量份以下。此時,界面活性劑之配合量超過5重量份時,在塗佈時容易產生膜粗糙的傾向。
又,為了提高與基體之密著性,可配合接著助劑。
該接著助劑較佳為官能性矽烷偶合劑,例如具有羧基、甲基丙烯醯基、異氰酸酯基、環氧基等反應性官能基之矽烷偶合劑。更具體例如有三甲氧基矽烷基苯甲酸、γ-甲基丙烯醯氧基丙基三甲氧基矽烷、乙烯基三乙醯氧基矽烷、乙烯基三甲氧基矽烷、γ-異氰酸酯丙基三乙氧基矽烷、γ-環氧丙基丙基三甲氧基矽烷、2-(3,4-環氧基環己基)乙基三甲氧基矽烷等。
這些接著助劑可單獨使用或混合2種以上使用。
接著助劑之配合量係對於共聚物〔A〕100重量份時,較佳為20重量份以下,更佳為10重量份以下。接著助劑之配合量超過20重量份時,有容易產生顯像殘留的傾向。
可添加其他添加劑。為了提高保存安定性等而添加之添加劑,具體言例為硫、醌類、氫醌類、聚氧化合物、胺、硝基亞硝基化合物。其例有4-甲氧基苯酚、N-亞硝基-N-苯基羥基胺鋁等。這些係對於共聚物〔A〕100重量份時,較佳使用3.0重量份以下,更佳為0.001~0.5重量份。超過3.0重量份時,無法獲得充分感度,且圖案形狀變差。
又,為了提高耐熱性,可添加N-(烷氧基甲基)甘脲化合物、N-(烷氧基甲基)三聚氰胺化合物及1分子中具有2官能以上之環氧基的化合物。上述N-(烷氧基甲基)甘脲化合物之具體例,N,N,N,N-四(甲氧基甲基)甘脲、N,N,N,N-四(乙氧基甲基)甘脲、N,N,N,N-四(正丙氧基甲基)甘脲、N,N,N,N-四(異丙氧基甲基)甘脲、N,N,N,N-四(正丁氧基甲基)甘脲、N,N,N,N-四(第三丁氧基甲基)甘脲等。這些中,特別理想為N,N,N,N-四(甲氧基甲基)甘脲。上述N-(烷氧基甲基)三聚氰胺化合物之具體例為N,N,N,N,N,N-六(甲氧基甲基)三聚氰胺、N,N,N,N,N,N-六(乙氧基甲基)三聚氰胺、N,N,N,N,N,N-六(正丙氧基甲基)三聚氰胺、N,N,N,N,N,N-六(異丙氧基甲基)三聚氰胺、N,N,N,N,N,N-六(正丁氧基甲基)三聚氰胺、N,N,N,N,N,N-六(第三丁氧基甲基)三聚氰胺等。這些當中,特別是N,N,N,N,N,N-六(甲氧基甲基)三聚氰胺較佳。這些之市售品例如有Nikalac N-2702,MW-30M(以上三和化學(股)製)等。
1分子中具有2官能以上環氧基之化合物例如有乙二醇二環氧丙基醚、二乙二醇二環氧丙基醚、聚乙二醇二環氧丙基醚、丙二醇二環氧丙基醚、三丙二醇二環氧丙基醚、聚丙二醇二環氧丙基醚、新戊二醇二環氧丙基醚、1,6-己二醇二環氧丙基醚、甘油二環氧丙基醚、三羥甲基丙烷三環氧丙基醚、氫化雙酚A二環氧丙基醚、雙酚A二環氧丙基醚等。這些市售品之具體例有EPOLIGHT 40E、EPOLIGHT 100E、EPOLIGHT 200E、EPOLIGHT 70P、EPOLIGHT 200P、EPOLIGHT 400P、EPOLIGHT 40E、EPOLIGHT 1500NP、EPOLIGHT 1600、EPOLIGHT 80MF、EPOLIGHT 100MF、EPOLIGHT 4000、EPOLIGHT 3002(以上共榮社化學(股)製)等。這些可單獨或者組合2種以上使用。
組成物溶液感光性樹脂組成物(甲)在使用時,將共聚物〔A〕、聚合性化合物〔B〕、光聚合引發劑〔C〕聚合物等之構成成分溶解於適當溶劑中,形成組成物溶液來調製較佳。上述組成物溶液調製所用之溶劑係使用可均勻溶解構成感光性樹脂組成物(甲)之各成分,且不與各成分反應者。
這種溶劑例如有製造上述共聚物〔A〕所用之溶劑所例示者。
這些溶劑中,從各成分之溶解性、與各成分之反應性、塗膜形成之容易性等觀點,較佳為使用醇、乙二醇醚、乙二醇烷基醚乙酸酯、酯及二乙二醇。其中較佳為苄基醇、2-苯基乙基醇、3-苯基-1-丙醇、乙二醇單丁基醚乙酸酯、二乙二醇單乙基醚乙酸酯、二乙二醇二乙基醚、二乙二醇乙基甲基醚、二乙二醇二甲基醚、丙二醇單甲基醚、丙二醇單甲基醚乙酸酯、甲氧基丙酸甲酯、乙氧基丙酸乙酯。
上述溶劑為了提高膜厚面內之均勻性,可併用高沸點溶劑。可併用之高沸點溶劑例如有N-甲基甲醯胺、N,N-二甲基甲醯胺、N-甲醯苯胺、N-甲基乙醯胺、N,N-二甲基乙醯胺、N-甲基吡咯啶酮、二甲基亞碸、苄基乙基醚、二己基醚、丙酮基丙酮、異佛爾酮、己酸、辛酸、1-辛醇、1-壬醇、乙酸苄酯、苯甲酸乙酯、草酸二乙酯、順丁烯二酸二乙酯、γ-丁內酯、碳酸乙烯酯、碳酸丙烯酯、苯基乙二醇乙醚乙酸酯等。其中較佳者為N-甲基吡咯啶酮、γ-丁內酯、N,N-二甲基乙醯胺。
上述調製之組成物溶液在必要時,可藉由孔徑例如0.2~0.5μm之millipore過濾器等過濾後,供使用。感光性樹脂組成物(甲)特別適用於形成液晶面板或觸控面板等顯示面板用間隔物的材料。
顯示面板用間隔物使用感光性樹脂組成物(甲)形成顯示面板用間隔物時,將組成物溶液塗佈於基板表面後,經過預烘烤除去溶劑,藉此形成塗膜。
組成物溶液之塗佈方法例如有噴灑法、輥塗佈法、旋轉塗佈法、縫隙模塗佈法、棒塗佈法、噴墨塗佈法等適當方法,特別理想為旋轉塗佈法、縫隙模塗佈法。
又,預烘烤之條件係因各構成成分之種類、配合比率等而異,例如70~90℃下,預烘烤1~15分鐘。
接著,經由所定之圖案光罩曝光於被預烘烤後之塗膜上,使之聚合後,以顯像液顯像,除去不要的部分形成圖案。
使用於曝光之放射線可適度選擇可見光、紫外線、遠紫外線、帶電粒子線、X射線等,較佳為波長190~450nm之範圍的放射線。
顯像方法例如有攪拌法、浸漬法、沖洗法等任一方法,顯像時間通常為30~180秒。
該顯像液可使用例如氫氧化鈉、氫氧化鉀、碳酸鈉、矽酸鈉、偏矽酸鈉、氨之無機鹼;乙胺、正丙胺之1級胺;二乙胺、二正丙胺之2級胺;三甲胺、甲基二乙胺、乙基二甲基胺、三乙胺之3級胺;二甲基乙醇胺、甲基二乙醇胺、三乙醇胺之3級烷醇胺;吡咯、哌啶、N-甲基哌啶、N-甲基吡咯啶、1,8-二氮雜雙環〔5.4.0〕-7-十一烯、1,5-二氮雜雙環〔4.3.0〕-5-壬烯之脂環族3級胺;吡啶、三甲基吡啶、二甲基吡啶、喹啉之芳香族3級胺;氫氧化四甲銨、氫氧化四乙銨之4級銨鹽等之鹼性化合物之水溶液。
又,上述鹼性化合物之水溶液中可添加適當量之甲醇、乙醇等之水溶性有機溶劑及/或界面活性劑。
顯像後,例如藉由流水洗淨等,例如30~90秒洗淨去除不要部後,吹入壓縮空氣或壓縮氮使之乾燥,可形所定之圖案。
其後,此圖案藉由熱板、烘箱等加熱裝置,以所定溫度例如150~250℃,以所定時間,在熱板上例如5~30分鐘,烘箱中例如以30~90分鐘加熱處理,可得到目的之間隔物。
本發明之感光性樹脂組成物(甲)係高感度,且可忠實實現光罩圖案之設計尺寸,且與基板之密著性優,在1500J/m2
以下之曝光量可得到充分之間隔物形狀及膜厚,且強度、耐熱性優異,另外在低曝光區域之間隔物形狀及膜厚之抑制性優異,保存期間中,使用中不易產生異物。
以下,以實施例及比較例更具體說明本發明,但本發明不限於這些實施例。
將2,2'-偶氮雙(2,4-二甲基戊腈)5重量份、二乙二醇甲基乙基醚200重量份投入具備冷卻管、攪拌機之燒瓶中,接著添加甲基丙烯酸18重量份、甲基丙烯酸環氧丙酯40重量份、苯乙烯5重量份、甲基丙烯酸三環〔5.2.1.02 , 6
〕癸烷-8-基酯32重量份,進行氮取代後,再添加1,3-丁二烯5重量份,緩慢攪拌使溶液之溫度上升至70℃,此溫度保持5小時進行聚合,得到共聚物〔A-1〕之溶液。
此溶液之固形分濃度為33.0重量%,共聚物〔A-1〕之Mw為11,000。
將2,2'-偶氮雙(2,4-二甲基戊腈)7重量份、二乙二醇甲基乙基醚200重量份投入具備冷卻管、攪拌機之燒瓶中,接著添加甲基丙烯酸15重量份、甲基丙烯酸環氧丙酯20重量份、甲基丙烯酸2-甲基環氧丙酯25重量份、苯乙烯5重量份、甲基丙烯酸三環〔5.2.1.02 , 6
〕癸烷-8-基酯20重量份、甲基丙烯酸四氫糠基酯10重量份,進行氮取代後,再添加1,3-丁二烯5重量份,緩慢攪拌使溶液之溫度上升至70℃,此溫度保持5小時進行聚合,得到共聚物〔A-2〕之溶液。
此溶液之固形分濃度為33.4重量%,共聚物〔A-2〕之Mw為7,000。
將2,2'-偶氮雙(2,4-二甲基戊腈)5重量份、二乙二醇甲基乙基醚250重量份投入具備冷卻管、攪拌機之燒瓶中,接著添加甲基丙烯酸10重量份、2-甲基丙烯醯氧基乙基琥珀酸30重量份、甲基丙烯酸正丁酯25重量份、苯甲基甲基丙烯酸酯30重量份,進行氮取代後,再添加1,3-丁二烯5重量份,緩慢攪拌使溶液之溫度上升至80℃,此溫度保持5小時進行聚合,得到固形分濃度28.0重量%之共聚物〔A-3〕之溶液。所得之共聚物〔A-3〕之Mw為9,000。
組成物溶液之調製將共聚物〔A〕:以合成例1所得之共聚物〔A-1〕之溶液100重量份(固形份)、聚合性化合物〔B〕:KAYARAD DPHA(日本化藥(股)製)80重量份、光聚合引發劑〔C〕:乙酮,1-〔9-乙基-6-(2-甲基-4-四氫吡喃基甲氧基苯醯基)-9.H.-咔唑-3-基〕-,1-(O-乙醯基酮肟)5重量份溶解於丙二醇單甲醚乙酸酯,使固形成份濃度成為35重量%後,以孔徑0.2 μ m之milipore過濾器過濾,調製組成物溶液(S-1)。
(I)間隔物之形成使用旋轉器將上述組成物溶液塗佈於無鹼玻璃基板上後,以90℃於熱板上預烘烤3分鐘形成膜厚6.0μm之塗膜。
經由殘留10μm方形之圖案光罩,曝光間隙為150μm,波長365nm之曝光強度為300W/m2
之紫外線在上述製得之塗膜上曝光。接著以氫氧化鉀0.05重量%水溶液以25℃、顯像60秒後,使用純水清洗1分鐘。再於烘箱中,以150℃加熱120分鐘,形成間隔物。
(II)解像度之評價在上述(1)所得之圖案中,顯像後之殘膜率(顯像後之膜厚/初期膜厚×100)為90%以上之感度之最小圖案尺寸來評價。圖案尺寸越小解像度越佳。結果如表2所示。
(III)感度評價在上述(1)所得之圖案中,顯像後之殘膜率為90%以上之感度為1,500J/m2
以下時,表示感度良好。
(IV)圖案剖面形狀之評價以掃描型電子顯微鏡觀察上述(1)所得之圖案斷面形狀之結果,其形狀如第1圖所示相當於A~C之其中任一形狀。如A所示,圖案邊緣為圓錐型時,圖案形狀良好。如B所示,圖案邊緣形成垂直狀時,表示圖案形狀稍微良好。
又,如C所示,形成倒圓錐(斷面形狀之膜表面之邊比基板側之邊更長者,倒三角形狀)之形狀係在其後研磨步驟時,圖案剝離之可能性非常高,因此,這種形狀不佳。
(V)壓縮強度之評價使用微小壓縮試驗機(MCTM-200,(股)島津製作所製)評價上述(1)所得之間隔物之壓縮強度。藉由直徑50μm之平面壓頭,測定施加10mN之負荷之變形量(測定溫度:23℃)。此值在0.5以下時,壓縮強度良好。結果如表2所示。
(VI)研磨耐性之評價藉由液晶配向膜塗佈用印刷機將液晶配向劑之AL3046(JSR(股)製)塗佈於上述(1)所得之基板上,以180℃乾燥1小時,形成乾燥膜厚0.05μm之配向劑之塗膜。
對於此塗膜藉由具有捲繞耐綸製之布之滾筒的研磨機,以滾筒之轉數500rpm、研磨台之移動速度1cm/秒進行研磨處理。此時之間隔物圖案之切削或剝離之有無如表2所示。
(VII)密著性之評價除了不使用圖案光罩外,其他與上述(1)同樣地實施,形成密著性評價用之硬化膜,進行密著性試驗。試驗法係依據JIS K-5400(1900)8.5之附著性試驗中之8.5.2之棋盤格膠帶法。此際殘留棋盤格之數目如表2所示。
(VIII)保存安定性之評價調製組成物物後,以-15℃保存,與上述(III)感度評價相同,追蹤顯像後之殘膜率成為90%以上之必要曝光量之經時變化,測定對於保存3個月後之感度與剛調製後之感度的相對值。以光散射式粒子檢知器(KS-28B,Lion股份公司製)測定3個月後之溶液中之0.5 μ m以上之異物產生的情形。結果如表2所示。
(IX)耐熱性之評價了未使用光罩外,其餘與間隔物之形成相同,形成硬化膜後,在240℃之烘箱中加熱60分鐘,測定加熱前後之膜厚,評價殘膜率(加熱後之膜厚×100/初期膜厚)。結果如表2所示。
除了在實施例1中,〔A〕成分~〔E〕成分使用如表1之種類、量外,其他與實施例1相同,調製組成物溶液形成間隔物進行評價。〔B〕~〔E〕之添加量係對於共聚物〔A〕100重量份時之重量比。
表1中,成分之簡稱係表示以下之化合物。
(B-1):(KAYARAD DPHA(日本化藥(股)製)(B-2):KAYARAD DPHA-40H(日本化藥(股)製)(B-3):二乙二醇二丙烯酸酯(C-1):乙酮,1-〔9-乙基-6-(2-甲基-4-四氫吡喃氧基苯醯基)-9.H.-咔唑-3-基〕-,1-(O-乙醯基酮肟)(C-2):乙酮,1-〔9-乙基-6-(2-甲基-4-四氫呋喃基甲氧基苯醯基)-9.H.-咔唑-3-基〕-,1-(O-乙醯基酮肟)(C-3):乙酮,1-〔9-乙基-6-(2-甲基-5-四氫吡喃基甲氧基苯醯基)-9.H.-咔唑-3-基〕-,1-(O-乙醯基酮肟)(C-4):乙酮,1-〔9-乙基-6-(2-甲基-5-四氫呋喃基甲氧基苯醯基)-9.H.-咔唑-3-基〕-,1-(O-乙醯基酮肟)(C-5):乙酮,1-〔9-乙基-6-〔2-甲基-4-(2,2-二甲基-1,3-二氧雜環戊基)甲氧基苯醯基)-9.H.-咔唑-3-基〕-,1-(O-乙醯基酮肟)(D-1):2-甲基-1-〔4-(甲硫基)苯基〕-2-嗎啉基丙烷-1-酮(Ciba geigy chemicals公司製Irgacure 907)(D-2):2-(4-甲基苄基)-2-二甲基胺基-1-(4-嗎啉基苯基)丁酮-1(Ciba geigy chemicals公司製Irgacure 306)(E-1):2,2'-雙(2,4-二氯苯基)-4,4',5,5'-四苯基-1,2'-雙咪唑(E-2):4,4'-雙(二乙基胺基)二苯甲酮(E-3):2-氫硫基苯并噻唑表1中,-之記號表示未添加該成分。
評價結果如表2所示。
第1圖係例示圖案之斷面形狀圖。
Claims (3)
- 一種感光性樹脂組成物,其特徵為含有:〔A〕(a1)乙烯性不飽和羧酸及/或乙烯性不飽和羧酸酐與(a2)其他乙烯性不飽和化合物之共聚物,〔B〕具有乙烯性不飽和鍵之聚合性化合物及〔C〕由下述式(2)表示之化合物所構成之光聚合引發劑,
- 一種顯示面板用間隔物,其特徵係由申請專利範圍第1項之感光性樹脂組成物所形成。
- 一種顯示面板,其特徵係具備申請專利範圍第2項之顯示面板用間隔物所成。
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WO2004050653A2 (en) * | 2002-12-03 | 2004-06-17 | Ciba Specialty Chemicals Holding Inc. | Oxime ester photoinitiators with heteroaromatic groups |
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ATE446322T1 (de) * | 2001-06-11 | 2009-11-15 | Basf Se | Oxim ester photoinitiatoren mit kombinierter struktur |
TW200714651A (en) * | 2002-10-28 | 2007-04-16 | Mitsubishi Chem Corp | Photopolymerization composition and color filter using the same |
KR100888780B1 (ko) * | 2002-12-13 | 2009-03-13 | 주식회사 코오롱 | 컬럼 스페이서용 광경화형 수지 조성물 |
JP4437651B2 (ja) * | 2003-08-28 | 2010-03-24 | 新日鐵化学株式会社 | 感光性樹脂組成物及びそれを用いたカラーフィルター |
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KR100796123B1 (ko) | 2008-01-21 |
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