TWI370507B - Apparatus for processing a substrate - Google Patents
Apparatus for processing a substrateInfo
- Publication number
- TWI370507B TWI370507B TW097143759A TW97143759A TWI370507B TW I370507 B TWI370507 B TW I370507B TW 097143759 A TW097143759 A TW 097143759A TW 97143759 A TW97143759 A TW 97143759A TW I370507 B TWI370507 B TW I370507B
- Authority
- TW
- Taiwan
- Prior art keywords
- substrate
- processing
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
- B05B13/00—Machines or plants for applying liquids or other fluent materials to surfaces of objects or other work by spraying, not covered by groups B05B1/00 - B05B11/00
- B05B13/02—Means for supporting work; Arrangement or mounting of spray heads; Adaptation or arrangement of means for feeding work
- B05B13/04—Means for supporting work; Arrangement or mounting of spray heads; Adaptation or arrangement of means for feeding work the spray heads being moved during spraying operation
- B05B13/0405—Means for supporting work; Arrangement or mounting of spray heads; Adaptation or arrangement of means for feeding work the spray heads being moved during spraying operation with reciprocating or oscillating spray heads
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Liquid Crystal (AREA)
- Weting (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020070118944A KR100930887B1 (en) | 2007-11-21 | 2007-11-21 | Apparatus for processing a substrate |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200931572A TW200931572A (en) | 2009-07-16 |
TWI370507B true TWI370507B (en) | 2012-08-11 |
Family
ID=40726358
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW097143759A TWI370507B (en) | 2007-11-21 | 2008-11-12 | Apparatus for processing a substrate |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP5179324B2 (en) |
KR (1) | KR100930887B1 (en) |
CN (1) | CN101441989B (en) |
TW (1) | TWI370507B (en) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR102529274B1 (en) * | 2018-04-11 | 2023-05-08 | 주식회사 디엠에스 | Apparatus for supplying fluid and assembling method thereof and substrate process system using the same |
CN111451942A (en) * | 2020-05-27 | 2020-07-28 | 东莞市欧莱溅射靶材有限公司 | Automatic sand blasting equipment and automatic sand blasting method for planar target |
CN118002335B (en) * | 2024-04-08 | 2024-07-09 | 山东智宏新材料科技有限公司 | Aluminum alloy door and window leakproofness drenches water check out test set |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4251894B2 (en) * | 2003-03-24 | 2009-04-08 | 大日本スクリーン製造株式会社 | Substrate processing equipment |
JP4393941B2 (en) * | 2004-07-30 | 2010-01-06 | 大日本スクリーン製造株式会社 | Substrate processing equipment |
JP2006135162A (en) * | 2004-11-08 | 2006-05-25 | Fuji Photo Film Co Ltd | Spraying method and apparatus thereof |
JP2006287159A (en) * | 2005-04-05 | 2006-10-19 | Nikon Corp | Gas supplying apparatus, exposure apparatus and method of manufacturing device |
-
2007
- 2007-11-21 KR KR1020070118944A patent/KR100930887B1/en active IP Right Grant
-
2008
- 2008-11-10 JP JP2008287905A patent/JP5179324B2/en active Active
- 2008-11-12 TW TW097143759A patent/TWI370507B/en active
- 2008-11-21 CN CN2008101768060A patent/CN101441989B/en active Active
Also Published As
Publication number | Publication date |
---|---|
TW200931572A (en) | 2009-07-16 |
CN101441989A (en) | 2009-05-27 |
CN101441989B (en) | 2010-09-22 |
JP2009130353A (en) | 2009-06-11 |
JP5179324B2 (en) | 2013-04-10 |
KR20090052446A (en) | 2009-05-26 |
KR100930887B1 (en) | 2009-12-10 |
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