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TWI348330B - Organic light-emitting display device with frit seal and reinforcing structure - Google Patents

Organic light-emitting display device with frit seal and reinforcing structure

Info

Publication number
TWI348330B
TWI348330B TW095143707A TW95143707A TWI348330B TW I348330 B TWI348330 B TW I348330B TW 095143707 A TW095143707 A TW 095143707A TW 95143707 A TW95143707 A TW 95143707A TW I348330 B TWI348330 B TW I348330B
Authority
TW
Taiwan
Prior art keywords
display device
organic light
emitting display
reinforcing structure
frit seal
Prior art date
Application number
TW095143707A
Other languages
English (en)
Other versions
TW200738047A (en
Inventor
Dong Soo Choi
Dae Ho Lim
Jae Sun Lee
Jin Woo Park
Jong Woo Lee
Sang Wook Sin
Ung Soo Lee
Original Assignee
Samsung Mobile Display Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Samsung Mobile Display Co Ltd filed Critical Samsung Mobile Display Co Ltd
Publication of TW200738047A publication Critical patent/TW200738047A/zh
Application granted granted Critical
Publication of TWI348330B publication Critical patent/TWI348330B/zh

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01F—MEASURING VOLUME, VOLUME FLOW, MASS FLOW OR LIQUID LEVEL; METERING BY VOLUME
    • G01F19/00—Calibrated capacity measures for fluids or fluent solid material, e.g. measuring cups
    • G01F19/002—Measuring spoons or scoops
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/02—Details
    • H05B33/04—Sealing arrangements, e.g. against humidity
    • A—HUMAN NECESSITIES
    • A47—FURNITURE; DOMESTIC ARTICLES OR APPLIANCES; COFFEE MILLS; SPICE MILLS; SUCTION CLEANERS IN GENERAL
    • A47G—HOUSEHOLD OR TABLE EQUIPMENT
    • A47G21/00—Table-ware
    • A47G21/04—Spoons; Pastry servers
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C17/00—Surface treatment of glass, not in the form of fibres or filaments, by coating
    • C03C17/34—Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions
    • C03C17/36—Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions at least one coating being a metal
    • C03C17/40—Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions at least one coating being a metal all coatings being metal coatings
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C27/00—Joining pieces of glass to pieces of other inorganic material; Joining glass to glass other than by fusing
    • C03C27/06—Joining glass to glass by processes other than fusing
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C8/00—Enamels; Glazes; Fusion seal compositions being frit compositions having non-frit additions
    • C03C8/24—Fusion seal compositions being frit compositions having non-frit additions, i.e. for use as seals between dissimilar materials, e.g. glass and metal; Glass solders
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/842—Containers
    • H10K50/8426—Peripheral sealing arrangements, e.g. adhesives, sealants
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/871—Self-supporting sealing arrangements
    • H10K59/8722—Peripheral sealing arrangements, e.g. adhesives, sealants
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C2217/00—Coatings on glass
    • C03C2217/20—Materials for coating a single layer on glass
    • C03C2217/25—Metals
    • C03C2217/251—Al, Cu, Mg or noble metals
    • C03C2217/252—Al
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C2217/00—Coatings on glass
    • C03C2217/20—Materials for coating a single layer on glass
    • C03C2217/25—Metals
    • C03C2217/251—Al, Cu, Mg or noble metals
    • C03C2217/253—Cu
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C2218/00—Methods for coating glass
    • C03C2218/30—Aspects of methods for coating glass not covered above
    • C03C2218/34—Masking
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/17—Passive-matrix OLED displays
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/40—Thermal treatment, e.g. annealing in the presence of a solvent vapour
    • H10K71/421—Thermal treatment, e.g. annealing in the presence of a solvent vapour using coherent electromagnetic radiation, e.g. laser annealing
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/851—Division of substrate

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Geochemistry & Mineralogy (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Organic Chemistry (AREA)
  • Ceramic Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Fluid Mechanics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Electroluminescent Light Sources (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
TW095143707A 2006-01-20 2006-11-27 Organic light-emitting display device with frit seal and reinforcing structure TWI348330B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020060006148A KR100673765B1 (ko) 2006-01-20 2006-01-20 유기전계발광 표시장치 및 그 제조방법

Publications (2)

Publication Number Publication Date
TW200738047A TW200738047A (en) 2007-10-01
TWI348330B true TWI348330B (en) 2011-09-01

Family

ID=38007045

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095143707A TWI348330B (en) 2006-01-20 2006-11-27 Organic light-emitting display device with frit seal and reinforcing structure

Country Status (6)

Country Link
US (2) US8415880B2 (zh)
EP (1) EP1811587B1 (zh)
JP (1) JP4926580B2 (zh)
KR (1) KR100673765B1 (zh)
CN (2) CN101009307A (zh)
TW (1) TWI348330B (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI586013B (zh) * 2016-06-01 2017-06-01 智晶光電股份有限公司 有機發光二極體封裝結構

Families Citing this family (133)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW521303B (en) * 2000-02-28 2003-02-21 Semiconductor Energy Lab Electronic device
US20070108900A1 (en) * 2005-11-15 2007-05-17 Boek Heather D Method and apparatus for the elimination of interference fringes in an OLED device
US7537504B2 (en) * 2005-12-06 2009-05-26 Corning Incorporated Method of encapsulating a display element with frit wall and laser beam
US7597603B2 (en) * 2005-12-06 2009-10-06 Corning Incorporated Method of encapsulating a display element
US7425166B2 (en) 2005-12-06 2008-09-16 Corning Incorporated Method of sealing glass substrates
US8038495B2 (en) 2006-01-20 2011-10-18 Samsung Mobile Display Co., Ltd. Organic light-emitting display device and manufacturing method of the same
KR100635514B1 (ko) 2006-01-23 2006-10-18 삼성에스디아이 주식회사 유기전계발광표시장치 및 그 제조방법
JP4624309B2 (ja) * 2006-01-24 2011-02-02 三星モバイルディスプレイ株式會社 有機電界発光表示装置及びその製造方法
JP4456092B2 (ja) * 2006-01-24 2010-04-28 三星モバイルディスプレイ株式會社 有機電界発光表示装置及びその製造方法
KR100671641B1 (ko) 2006-01-25 2007-01-19 삼성에스디아이 주식회사 유기 전계 발광 표시장치 및 그 제조 방법
US8164257B2 (en) * 2006-01-25 2012-04-24 Samsung Mobile Display Co., Ltd. Organic light emitting display and method of fabricating the same
KR100688796B1 (ko) * 2006-01-25 2007-03-02 삼성에스디아이 주식회사 유기전계발광 표시 장치 및 그의 제작 방법
KR100685853B1 (ko) * 2006-01-25 2007-02-22 삼성에스디아이 주식회사 유기전계발광표시장치 및 그 제조방법
KR100688795B1 (ko) * 2006-01-25 2007-03-02 삼성에스디아이 주식회사 유기전계발광 표시장치 및 그 제조방법
KR100671647B1 (ko) * 2006-01-26 2007-01-19 삼성에스디아이 주식회사 유기전계발광 표시 장치
JP4633674B2 (ja) 2006-01-26 2011-02-16 三星モバイルディスプレイ株式會社 有機電界発光表示装置及びその製造方法
KR100732808B1 (ko) * 2006-01-26 2007-06-27 삼성에스디아이 주식회사 유기전계발광 표시장치의 제조방법
KR100671639B1 (ko) * 2006-01-27 2007-01-19 삼성에스디아이 주식회사 유기 전계 발광 표시장치 및 그 제조 방법
KR100688790B1 (ko) * 2006-01-27 2007-03-02 삼성에스디아이 주식회사 유기 전계 발광 표시장치 및 그 제조 방법
US20070188757A1 (en) * 2006-02-14 2007-08-16 Jeffrey Michael Amsden Method of sealing a glass envelope
KR100732817B1 (ko) 2006-03-29 2007-06-27 삼성에스디아이 주식회사 유기전계발광 표시장치 및 그 제조방법
US20070267972A1 (en) * 2006-05-22 2007-11-22 Menegus Harry E Method for forming a temporary hermetic seal for an OLED display device
US20080124558A1 (en) * 2006-08-18 2008-05-29 Heather Debra Boek Boro-silicate glass frits for hermetic sealing of light emitting device displays
US20080048556A1 (en) * 2006-08-24 2008-02-28 Stephan Lvovich Logunov Method for hermetically sealing an OLED display
US20080049431A1 (en) * 2006-08-24 2008-02-28 Heather Debra Boek Light emitting device including anti-reflection layer(s)
US7800303B2 (en) 2006-11-07 2010-09-21 Corning Incorporated Seal for light emitting display device, method, and apparatus
KR100787463B1 (ko) 2007-01-05 2007-12-26 삼성에스디아이 주식회사 글래스 프릿, 실링재 형성용 조성물, 발광 장치 및 발광 장치의 제조방법
US20080168801A1 (en) * 2007-01-12 2008-07-17 Paul Stephen Danielson Method of sealing glass
KR100796129B1 (ko) * 2007-01-30 2008-01-21 삼성에스디아이 주식회사 유기 전계 발광 표시장치 및 그 제조방법
US20080200088A1 (en) * 2007-02-21 2008-08-21 Chong Pyung An Method for reducing interference fringes in a display device
US7652305B2 (en) * 2007-02-23 2010-01-26 Corning Incorporated Methods and apparatus to improve frit-sealed glass package
US20080213482A1 (en) * 2007-03-01 2008-09-04 Stephan Lvovich Logunov Method of making a mask for sealing a glass package
KR20080088696A (ko) * 2007-03-30 2008-10-06 삼성전자주식회사 유기 발광 장치 및 이의 제조 방법
KR100897132B1 (ko) 2007-09-12 2009-05-14 삼성모바일디스플레이주식회사 표시패널 봉지장치 및 이를 이용한 유기전계발광표시장치의 제조방법
US7815480B2 (en) * 2007-11-30 2010-10-19 Corning Incorporated Methods and apparatus for packaging electronic components
KR101465478B1 (ko) * 2008-02-18 2014-11-26 삼성디스플레이 주식회사 유기발광 표시장치 및 이의 제조방법
KR20090089010A (ko) * 2008-02-18 2009-08-21 삼성전자주식회사 유기발광 표시장치 및 이의 제조방법
JP5308718B2 (ja) 2008-05-26 2013-10-09 浜松ホトニクス株式会社 ガラス溶着方法
US7992411B2 (en) 2008-05-30 2011-08-09 Corning Incorporated Method for sintering a frit to a glass plate
US8147632B2 (en) 2008-05-30 2012-04-03 Corning Incorporated Controlled atmosphere when sintering a frit to a glass plate
JP5535652B2 (ja) 2008-06-11 2014-07-02 浜松ホトニクス株式会社 ガラス溶着方法
US8448468B2 (en) 2008-06-11 2013-05-28 Corning Incorporated Mask and method for sealing a glass envelope
DE112009001456T5 (de) 2008-06-23 2011-05-19 Hamamatsu Photonics K.K., Hamamatsu-shi Glasverschmelzungsverfahren
DE102008049060B4 (de) * 2008-09-26 2018-11-22 Osram Oled Gmbh Organisches, optoelektronisches Bauteil und Herstellungsverfahren hierfür
KR100965255B1 (ko) 2008-11-11 2010-06-22 삼성모바일디스플레이주식회사 유기발광 표시장치
EP2442621A4 (en) * 2009-06-11 2013-10-09 Sharp Kk ORGANIC EL DISPLAY DEVICE AND MANUFACTURING METHOD THEREFOR
US20110014731A1 (en) * 2009-07-15 2011-01-20 Kelvin Nguyen Method for sealing a photonic device
KR101267534B1 (ko) * 2009-10-30 2013-05-23 엘지디스플레이 주식회사 유기전계발광소자의 제조방법
JP5481167B2 (ja) * 2009-11-12 2014-04-23 浜松ホトニクス株式会社 ガラス溶着方法
JP5525246B2 (ja) 2009-11-25 2014-06-18 浜松ホトニクス株式会社 ガラス溶着方法及びガラス層定着方法
JP5481173B2 (ja) 2009-11-25 2014-04-23 浜松ホトニクス株式会社 ガラス溶着方法及びガラス層定着方法
JP5481172B2 (ja) 2009-11-25 2014-04-23 浜松ホトニクス株式会社 ガラス溶着方法及びガラス層定着方法
JP5567319B2 (ja) 2009-11-25 2014-08-06 浜松ホトニクス株式会社 ガラス溶着方法及びガラス層定着方法
JP5535590B2 (ja) 2009-11-25 2014-07-02 浜松ホトニクス株式会社 ガラス溶着方法及びガラス層定着方法
JP5466929B2 (ja) 2009-11-25 2014-04-09 浜松ホトニクス株式会社 ガラス溶着方法及びガラス層定着方法
JP5535589B2 (ja) 2009-11-25 2014-07-02 浜松ホトニクス株式会社 ガラス溶着方法及びガラス層定着方法
JP5535588B2 (ja) 2009-11-25 2014-07-02 浜松ホトニクス株式会社 ガラス溶着方法及びガラス層定着方法
CN102079619B (zh) * 2009-11-27 2012-02-15 洛阳兰迪玻璃机器股份有限公司 一种玻璃板复合封接方法
KR101074812B1 (ko) 2010-01-05 2011-10-19 삼성모바일디스플레이주식회사 유기전계발광 표시 장치와 그 제조 방법
KR101119046B1 (ko) * 2010-01-08 2012-03-02 삼성모바일디스플레이주식회사 유기전계발광표시장치 및 그의 제조방법
KR101073564B1 (ko) 2010-02-02 2011-10-17 삼성모바일디스플레이주식회사 유기 발광 표시장치 및 이의 제조방법
US9171721B2 (en) 2010-10-26 2015-10-27 Medtronic, Inc. Laser assisted direct bonding
US8666505B2 (en) 2010-10-26 2014-03-04 Medtronic, Inc. Wafer-scale package including power source
TWI418064B (zh) * 2010-11-16 2013-12-01 Au Optronics Corp 發光裝置
US8796109B2 (en) 2010-12-23 2014-08-05 Medtronic, Inc. Techniques for bonding substrates using an intermediate layer
BR112013016635B1 (pt) * 2010-12-28 2020-10-27 Tvp Solar Sa Método para a fabricação de um painel térmico solar a vácuo
US8953120B2 (en) * 2011-01-07 2015-02-10 Semiconductor Energy Laboratory Co., Ltd. Display device
CN102617025B (zh) * 2011-01-31 2014-06-25 洛阳兰迪玻璃机器股份有限公司 一种制作真空玻璃构件时获得真空的方法
TWI671911B (zh) 2011-05-05 2019-09-11 日商半導體能源研究所股份有限公司 半導體裝置及其製造方法
KR20120139392A (ko) * 2011-06-17 2012-12-27 삼성디스플레이 주식회사 디스플레이 패널, 그 제조방법 및 이에 사용되는 프릿 조성물
TWI570906B (zh) * 2011-11-29 2017-02-11 半導體能源研究所股份有限公司 密封結構，發光裝置，電子裝置，及照明裝置
TWI496328B (zh) * 2012-04-24 2015-08-11 Innocom Tech Shenzhen Co Ltd 有機發光二極體顯示裝置及其製造方法
TW201347167A (zh) * 2012-05-15 2013-11-16 Innocom Tech Shenzhen Co Ltd 有機發光二極體顯示裝置
KR101372412B1 (ko) * 2012-06-19 2014-03-10 삼성코닝정밀소재 주식회사 저융점 프릿을 이용한 유기발광소자용 대면적 인캡글라스 제조방법
KR101924526B1 (ko) * 2012-08-22 2018-12-04 삼성디스플레이 주식회사 유기 발광 표시장치 및 그 제조방법
KR102161078B1 (ko) * 2012-08-28 2020-09-29 가부시키가이샤 한도오따이 에네루기 켄큐쇼 표시 장치 및 그 제작 방법
US9625764B2 (en) 2012-08-28 2017-04-18 Semiconductor Energy Laboratory Co., Ltd. Display device and electronic device
KR20140029202A (ko) 2012-08-28 2014-03-10 가부시키가이샤 한도오따이 에네루기 켄큐쇼 표시 장치
KR101987423B1 (ko) * 2012-11-16 2019-06-11 삼성디스플레이 주식회사 유기 발광 표시 장치와 이의 제조 방법
CN102931214A (zh) * 2012-11-26 2013-02-13 李崇 Oled显示单元以及采用该显示单元的oled显示装置
KR102071007B1 (ko) * 2013-02-13 2020-01-30 삼성디스플레이 주식회사 유기 발광 표시 장치
US20140301088A1 (en) * 2013-04-08 2014-10-09 Radiant Opto-Elec Technology Co., Ltd. Led display screen
TWI479464B (zh) * 2013-05-09 2015-04-01 Au Optronics Corp 顯示面板及其封裝方法
KR102114154B1 (ko) * 2013-07-02 2020-05-25 삼성디스플레이 주식회사 표시 장치
US20150008819A1 (en) * 2013-07-05 2015-01-08 Shenzhen China Star Optoelectronics Technology Co., Ltd. OLED Panel and Package Method Thereof
CN103367658B (zh) 2013-07-17 2016-08-31 深圳市华星光电技术有限公司 一种玻璃封装结构和封装方法
JP2015041480A (ja) * 2013-08-21 2015-03-02 株式会社ジャパンディスプレイ 有機エレクトロルミネッセンス表示装置
KR102100374B1 (ko) * 2013-10-11 2020-04-14 삼성디스플레이 주식회사 유기 발광 표시 장치 및 그 제조 방법
KR20150043080A (ko) * 2013-10-14 2015-04-22 삼성디스플레이 주식회사 유기 발광 표시 장치
KR102062353B1 (ko) * 2013-10-16 2020-01-06 엘지디스플레이 주식회사 유기전계발광소자 및 그 제조방법
JP2015141749A (ja) * 2014-01-27 2015-08-03 株式会社ジャパンディスプレイ 表示装置およびその製造方法
JP6200340B2 (ja) 2014-02-04 2017-09-20 株式会社ジャパンディスプレイ 表示装置およびその製造方法
CN103794637B (zh) * 2014-02-24 2016-08-24 上海和辉光电有限公司 一种有源矩阵有机发光二极体面板及其封装方法
KR102256308B1 (ko) * 2014-04-16 2021-05-27 삼성디스플레이 주식회사 표시장치
KR102223676B1 (ko) * 2014-06-24 2021-03-08 삼성디스플레이 주식회사 디스플레이 장치
CN104183785B (zh) * 2014-06-27 2016-05-11 京东方科技集团股份有限公司 一种oled器件的封装方法、oled显示面板及oled显示装置
CN104201187B (zh) * 2014-08-18 2017-07-04 京东方科技集团股份有限公司 一种oled显示装置
WO2016067159A1 (en) 2014-10-28 2016-05-06 Semiconductor Energy Laboratory Co., Ltd. Functional panel, method for manufacturing the same, module, data processing device
KR102439023B1 (ko) 2014-10-28 2022-08-31 가부시키가이샤 한도오따이 에네루기 켄큐쇼 표시 장치, 표시 장치의 제작 방법, 및 전자 기기
CN104282730B (zh) * 2014-10-29 2017-11-21 京东方科技集团股份有限公司 Oled显示面板、oled显示装置及其制作方法
EP3212589A1 (en) 2014-10-31 2017-09-06 Corning Incorporated Laser welded glass packages and methods of making
KR102334393B1 (ko) 2014-11-26 2021-12-01 삼성디스플레이 주식회사 표시 장치
KR102456654B1 (ko) 2014-11-26 2022-10-18 가부시키가이샤 한도오따이 에네루기 켄큐쇼 표시 장치 및 전자 기기
US10136535B2 (en) 2014-12-24 2018-11-20 Medtronic, Inc. Hermetically-sealed packages including feedthrough assemblies
US9865533B2 (en) 2014-12-24 2018-01-09 Medtronic, Inc. Feedthrough assemblies
US9968794B2 (en) 2014-12-24 2018-05-15 Medtronic, Inc. Implantable medical device system including feedthrough assembly and method of forming same
US10124559B2 (en) 2014-12-24 2018-11-13 Medtronic, Inc. Kinetically limited nano-scale diffusion bond structures and methods
CN104576707B (zh) * 2015-01-28 2018-04-06 京东方科技集团股份有限公司 Oled面板及其制备方法和显示装置
DE102015207285B4 (de) * 2015-04-22 2019-05-02 Schott Ag Glasiges oder zumindest teilweise kristallisiertes Einschmelzmaterial, Fügeverbindung, Sperrschicht, und Schichtsystem mit dem Einschmelzmaterial und dessen Integration in Bauteilen
CZ306248B6 (cs) * 2015-08-31 2016-10-26 Varroc Lighting Systems, s.r.o. Svítilna motorového vozidla
US10098589B2 (en) 2015-12-21 2018-10-16 Medtronic, Inc. Sealed package and method of forming same
CN105739154B (zh) * 2016-04-29 2019-09-27 上海天马有机发光显示技术有限公司 一种显示面板以及电子设备
CN106098735B (zh) * 2016-06-20 2020-10-09 武汉华星光电技术有限公司 Oled显示屏
US10146090B2 (en) 2016-08-01 2018-12-04 Microsoft Technology Licensing, Llc Minimizing border of a display device
CN106501998B (zh) * 2016-10-26 2020-01-17 京东方科技集团股份有限公司 背光源、显示装置及其驱动方法
CN106784379A (zh) * 2016-12-29 2017-05-31 长春海谱润斯科技有限公司 一种有机发光显示面板及其制造方法
CN107316612B (zh) * 2017-07-11 2019-08-30 深圳市华星光电半导体显示技术有限公司 一种oled显示面板及oled显示器
US10522607B2 (en) * 2017-07-11 2019-12-31 Shenzhen China Star Optoelectronics Semiconductor Display Technology Co., Ltd OLED display panel and OLED display apparatus
CN107644945B (zh) * 2017-09-13 2019-07-26 上海天马有机发光显示技术有限公司 阵列基板、显示面板、显示面板的封装方法及显示装置
CN107731876B (zh) * 2017-10-19 2020-12-04 京东方科技集团股份有限公司 一种显示面板及其制作方法、显示装置
KR102566157B1 (ko) * 2018-06-28 2023-08-11 삼성디스플레이 주식회사 표시장치
CN110767818A (zh) * 2018-07-26 2020-02-07 Oppo广东移动通信有限公司 Oled屏幕及其制造方法和电子装置
CN110767821A (zh) * 2018-07-26 2020-02-07 Oppo广东移动通信有限公司 Oled屏幕及其制造方法和电子装置
CN110767820A (zh) * 2018-07-26 2020-02-07 Oppo广东移动通信有限公司 Oled屏幕及其制造方法和电子装置
CN110767822A (zh) * 2018-07-26 2020-02-07 Oppo广东移动通信有限公司 Oled屏幕及其制造方法和电子装置
CN208444841U (zh) * 2018-08-09 2019-01-29 云谷（固安）科技有限公司 显示屏及显示装置
US10831070B2 (en) 2018-10-01 2020-11-10 Himax Display, Inc. Display panel
TWI750421B (zh) * 2018-10-30 2021-12-21 立景光電股份有限公司 顯示面板
KR102663522B1 (ko) * 2018-11-05 2024-05-16 삼성디스플레이 주식회사 표시장치 및 그 제조방법
CN111190310B (zh) * 2018-11-15 2022-11-18 立景光电股份有限公司 显示面板
CN113302745A (zh) * 2019-01-18 2021-08-24 株式会社半导体能源研究所 显示装置、显示模块及电子设备
JP6696025B1 (ja) * 2019-04-22 2020-05-20 信越エンジニアリング株式会社 貼合デバイスの貼り合わせ装置及び貼り合わせ方法並びに貼合デバイス
CN111261793B (zh) * 2020-01-20 2021-11-02 Tcl华星光电技术有限公司 一种显示面板及其制备方法、显示装置

Family Cites Families (275)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US619512A (en) * 1899-02-14 Adam slucki
US3966449A (en) 1975-02-10 1976-06-29 International Business Machines Corporation Sealing glass composition and process
US4105292A (en) 1975-09-02 1978-08-08 Minnesota Mining And Manufacturing Company Optical element to assure a minimum spacing
US4004936A (en) 1976-05-19 1977-01-25 International Business Machines Corporation Low temperature sealed glass compositions and process for their preparation
US4238704A (en) 1979-02-12 1980-12-09 Corning Glass Works Sealed beam lamp of borosilicate glass with a sealing glass of zinc silicoborate and a mill addition of cordierite
US4469602A (en) 1982-08-27 1984-09-04 Autotrol Corporation Microcomputer controlled demand/scheduled water softener having automatic resin bed sensing
JPS5966157A (ja) 1982-10-08 1984-04-14 Fujitsu Ltd 半導体装置及びその製造方法
JPS60216333A (ja) 1984-04-12 1985-10-29 Asahi Glass Co Ltd エレクトロクロミツク表示素子
JPH0682765B2 (ja) 1985-12-25 1994-10-19 株式会社日立製作所 液晶表示素子
JPH0774583B2 (ja) 1986-10-29 1995-08-09 三菱重工業株式会社 ボ−リングマシンのケ−シングチユ−ブ押込・引抜装置
JPS63163423U (zh) 1987-04-14 1988-10-25
JPH04138688A (ja) 1990-09-28 1992-05-13 Mitsubishi Kasei Polytec Co Ｅｌ素子封止方法
JPH04147217A (ja) 1990-10-11 1992-05-20 Hitachi Ltd 液晶表示素子セルの加圧装置
JPH0766237B2 (ja) 1991-03-29 1995-07-19 岡谷電機産業株式会社 表示パネルの製造方法
JP3158667B2 (ja) * 1991-08-01 2001-04-23 セイコーエプソン株式会社 液晶表示素子の製造方法及び液晶表示素子の再生方法
JPH06337429A (ja) 1993-05-27 1994-12-06 M B K Maikurotetsuku:Kk 液晶セル用のプレスおよびアラインメント装置
US6980275B1 (en) 1993-09-20 2005-12-27 Semiconductor Energy Laboratory Co., Ltd. Electro-optical device
JP3135793B2 (ja) 1994-09-02 2001-02-19 シャープ株式会社 液晶表示装置およびその製造方法
JPH09171192A (ja) * 1995-12-19 1997-06-30 Semiconductor Energy Lab Co Ltd アクティブマトリクス型液晶表示装置及びその製造方 法
JPH10125463A (ja) 1995-12-28 1998-05-15 Matsushita Electric Ind Co Ltd 有機エレクトロルミネセンス素子、液晶照明装置、表示デバイス装置、および、有機エレクトロルミネセンス素子の製造方法
US6195142B1 (en) 1995-12-28 2001-02-27 Matsushita Electrical Industrial Company, Ltd. Organic electroluminescence element, its manufacturing method, and display device using organic electroluminescence element
JPH09258671A (ja) 1996-03-25 1997-10-03 Seikosha Co Ltd Ｅｌ表示装置
JP3814810B2 (ja) 1996-04-05 2006-08-30 日本電気硝子株式会社 ビスマス系ガラス組成物
US5811927A (en) 1996-06-21 1998-09-22 Motorola, Inc. Method for affixing spacers within a flat panel display
JPH1074583A (ja) 1996-08-30 1998-03-17 Sanyo Electric Co Ltd 有機ｅｌディスプレイ及び有機ｅｌディスプレイの 製造方法
JPH10161137A (ja) 1996-11-27 1998-06-19 Kyocera Corp 液晶表示パネルの製造方法
US6109994A (en) 1996-12-12 2000-08-29 Candescent Technologies Corporation Gap jumping to seal structure, typically using combination of vacuum and non-vacuum environments
JP3741506B2 (ja) 1997-01-20 2006-02-01 セントラル硝子株式会社 鏡
US5874804A (en) 1997-03-03 1999-02-23 Motorola, Inc. Organic electroluminescent device hermetic encapsulation package and method of fabrication
JPH10270592A (ja) 1997-03-24 1998-10-09 Texas Instr Japan Ltd 半導体装置及びその製造方法
JP3022809B2 (ja) 1997-06-18 2000-03-21 日本電気エンジニアリング株式会社 液晶表示セルの封孔方法及び封孔装置
JP3169864B2 (ja) 1997-09-18 2001-05-28 日本電気株式会社 液晶パネル製造装置
US5965907A (en) 1997-09-29 1999-10-12 Motorola, Inc. Full color organic light emitting backlight device for liquid crystal display applications
JP3024609B2 (ja) 1997-10-09 2000-03-21 日本電気株式会社 液晶表示素子セルの封孔装置
JP3624082B2 (ja) 1997-11-13 2005-02-23 キヤノン株式会社 反射防止膜及びその製造方法
JP2845239B1 (ja) 1997-12-17 1999-01-13 日本電気株式会社 有機薄膜ｅｌデバイスおよびその製造方法
JPH11202349A (ja) * 1998-01-12 1999-07-30 Semiconductor Energy Lab Co Ltd 表示装置
JP3543170B2 (ja) 1998-02-24 2004-07-14 カシオ計算機株式会社 電界発光素子及びその製造方法
JP3912711B2 (ja) 1998-11-27 2007-05-09 ローム株式会社 有機ｅｌ素子
JP2000173780A (ja) 1998-12-08 2000-06-23 Kawaguchiko Seimitsu Co Ltd エレクトロルミネッセンス
KR100535361B1 (ko) 1998-12-30 2006-03-16 현대엘씨디주식회사 유기 전계 발광 표시 소자
JP3517624B2 (ja) * 1999-03-05 2004-04-12 キヤノン株式会社 画像形成装置
JP2000268969A (ja) 1999-03-17 2000-09-29 Tdk Corp 有機ｅｌ素子
JP2000306664A (ja) 1999-04-21 2000-11-02 Stanley Electric Co Ltd 有機ｅｌ表示装置
US6383664B2 (en) * 1999-05-11 2002-05-07 The Dow Chemical Company Electroluminescent or photocell device having protective packaging
TWI240592B (en) 1999-06-03 2005-09-21 Koninkl Philips Electronics Nv Organic electroluminescent device
JP2001022293A (ja) * 1999-07-07 2001-01-26 Sony Corp 平面表示素子
JP2001052858A (ja) 1999-08-05 2001-02-23 Futaba Corp 有機ｅｌ表示装置
JP3912938B2 (ja) 1999-08-17 2007-05-09 セントラル硝子株式会社 着色被膜形成法
US6452323B1 (en) 1999-09-20 2002-09-17 Omnion Technologies, Inc. Luminous gas discharge display having dielectric sealing layer
JP3942770B2 (ja) 1999-09-22 2007-07-11 株式会社半導体エネルギー研究所 Ｅｌ表示装置及び電子装置
JP4345153B2 (ja) 1999-09-27 2009-10-14 ソニー株式会社 映像表示装置の製造方法
JP3423261B2 (ja) 1999-09-29 2003-07-07 三洋電機株式会社 表示装置
US6833668B1 (en) 1999-09-29 2004-12-21 Sanyo Electric Co., Ltd. Electroluminescence display device having a desiccant
JP2001110564A (ja) 1999-10-07 2001-04-20 Gunze Ltd エレクトロルミネッセンスランプ
JP4255187B2 (ja) 1999-10-22 2009-04-15 スタンレー電気株式会社 有機ｅｌ表示装置の製造方法および該方法により製造された有機ｅｌ表示装置
KR100480146B1 (ko) 1999-10-30 2005-04-06 엘지.필립스 엘시디 주식회사 액정표시소자의 제조장치 및 방법
JP4776769B2 (ja) * 1999-11-09 2011-09-21 株式会社半導体エネルギー研究所 発光装置の作製方法
JP2001155855A (ja) 1999-11-24 2001-06-08 Toyota Motor Corp 有機ｅｌ素子の封止方法
JP3409764B2 (ja) 1999-12-28 2003-05-26 日本電気株式会社 有機ｅｌ表示パネルの製造方法
WO2001051985A1 (fr) * 2000-01-13 2001-07-19 Seiko Epson Corporation Lcd, son procede de fabrication et dispositif electronique
US6515417B1 (en) 2000-01-27 2003-02-04 General Electric Company Organic light emitting device and method for mounting
US6555025B1 (en) 2000-01-31 2003-04-29 Candescent Technologies Corporation Tuned sealing material for sealing of a flat panel display
US6624572B1 (en) 2000-02-17 2003-09-23 Lg Electronics, Inc. Organic electroluminescence display panel and method for sealing the same
JP2001230072A (ja) 2000-02-18 2001-08-24 Denso Corp 有機ｅｌ表示装置
KR100316781B1 (ko) 2000-02-25 2001-12-20 김순택 레이저를 이용한 유리평판표시패널의 프릿 프레임 밀봉 방법
US6650392B2 (en) 2000-03-15 2003-11-18 Kabushiki Kaisha Toshiba Cell structure of liquid crystal device
JP2001307633A (ja) 2000-04-20 2001-11-02 Mitsubishi Electric Corp フラットディスプレイパネル、フラットディスプレイ装置およびフラットディスプレイパネルの製造方法
US7579203B2 (en) 2000-04-25 2009-08-25 Semiconductor Energy Laboratory Co., Ltd. Light emitting device
JP2001319775A (ja) 2000-05-10 2001-11-16 Auto Network Gijutsu Kenkyusho:Kk 有機ｅｌ表示装置の封止方法および封止構造
JP2001324662A (ja) 2000-05-16 2001-11-22 Ricoh Co Ltd レンズ連動機構
JP2002020169A (ja) 2000-07-03 2002-01-23 Murata Mfg Co Ltd 高周波用誘電体磁器組成物、誘電体共振器、誘電体フィルタ、誘電体デュプレクサおよび通信機装置
JP4889883B2 (ja) 2000-07-10 2012-03-07 株式会社半導体エネルギー研究所 成膜方法および成膜装置
US6956324B2 (en) 2000-08-04 2005-10-18 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and manufacturing method therefor
JP4583568B2 (ja) 2000-09-19 2010-11-17 株式会社半導体エネルギー研究所 発光装置の作製方法
US6605826B2 (en) * 2000-08-18 2003-08-12 Semiconductor Energy Laboratory Co., Ltd. Light-emitting device and display device
US7255823B1 (en) 2000-09-06 2007-08-14 Institute Of Materials Research And Engineering Encapsulation for oled devices
JP2002169135A (ja) 2000-09-07 2002-06-14 Seiko Epson Corp セルギャップ調整装置、加圧封止装置及び液晶表示装置の製造方法
JP4801297B2 (ja) 2000-09-08 2011-10-26 株式会社半導体エネルギー研究所 発光装置
US6924594B2 (en) 2000-10-03 2005-08-02 Semiconductor Energy Laboratory Co., Ltd. Light emitting device
JP2002117777A (ja) 2000-10-11 2002-04-19 Matsushita Electric Ind Co Ltd ガス放電パネルおよびガス放電パネルの製造方法
US7178927B2 (en) 2000-11-14 2007-02-20 Semiconductor Energy Laboratory Co., Ltd. Electroluminescent device having drying agent
JP4223211B2 (ja) 2000-11-14 2009-02-12 株式会社半導体エネルギー研究所 発光装置の作製方法
JP2002170664A (ja) 2000-12-05 2002-06-14 Toray Ind Inc 有機電界発光素子
US6646284B2 (en) 2000-12-12 2003-11-11 Semiconductor Energy Laboratory Co., Ltd. Light emitting device and method of manufacturing the same
JP2002190267A (ja) 2000-12-21 2002-07-05 Toshiba Corp 表示装置とその製造方法
KR100370406B1 (ko) 2000-12-22 2003-02-05 삼성에스디아이 주식회사 레이저를 이용한 평판표시장치의 진공 패키징 방법
MY145695A (en) 2001-01-24 2012-03-30 Nichia Corp Light emitting diode, optical semiconductor device, epoxy resin composition suited for optical semiconductor device, and method for manufacturing the same
US6554672B2 (en) 2001-03-12 2003-04-29 Micron Technology, Inc. Flat panel display, method of high vacuum sealing
JP2002280169A (ja) * 2001-03-19 2002-09-27 Futaba Corp 有機ｅｌ装置
TWI222838B (en) 2001-04-10 2004-10-21 Chi Mei Optoelectronics Corp Packaging method of organic electroluminescence light-emitting display device
JP2002318547A (ja) * 2001-04-24 2002-10-31 Sony Corp 表示パネルの製造方法
US6424009B1 (en) 2001-05-04 2002-07-23 Advanced Micro Devices, Inc. Polysilicon insulator material in semiconductor-on-insulator (SOI) structure
JP2005510831A (ja) 2001-05-24 2005-04-21 オリオン エレクトリック カンパニー，リミテッド 有機発光ダイオードのエンカプセレーションのための容器及びその製造方法
JP2002359070A (ja) 2001-05-31 2002-12-13 Matsushita Electric Ind Co Ltd 有機発光素子およびそれを用いた表示パネル
US6565400B1 (en) 2001-06-26 2003-05-20 Candescent Technologies Corporation Frit protection in sealing process for flat panel displays
JP4894987B2 (ja) * 2001-06-29 2012-03-14 三洋電機株式会社 表示用パネルの製造方法
KR100442240B1 (ko) 2001-07-03 2004-07-30 엘지전자 주식회사 유기 전계발광 소자
US6660547B2 (en) 2001-07-26 2003-12-09 Osram Opto Semiconductors Gmbh Stabilization for thin substrates
JP2003068472A (ja) 2001-08-29 2003-03-07 Hitachi Ltd 有機発光素子およびそれを用いた有機発光表示装置
KR100705273B1 (ko) 2001-09-14 2007-04-11 엘지전자 주식회사 유기전계발광소자 및 그의 제조방법
TW517356B (en) 2001-10-09 2003-01-11 Delta Optoelectronics Inc Package structure of display device and its packaging method
US20030077396A1 (en) 2001-10-23 2003-04-24 Lecompte Robert S. Dip coating system
KR100865284B1 (ko) 2001-10-31 2008-10-27 엘지디스플레이 주식회사 액정패널의 실링구조
TW564563B (en) 2001-11-29 2003-12-01 Highlink Technology Corp Light-emitting device with increased stability
KR20030044656A (ko) 2001-11-30 2003-06-09 오리온전기 주식회사 유기 ｅｌ 소자의 봉지 캡
KR100819864B1 (ko) 2001-12-28 2008-04-07 엘지.필립스 엘시디 주식회사 유기전기발광소자
TW515062B (en) 2001-12-28 2002-12-21 Delta Optoelectronics Inc Package structure with multiple glue layers
CN1212662C (zh) 2002-01-16 2005-07-27 翰立光电股份有限公司 显示元件的封装构造
US7038377B2 (en) 2002-01-16 2006-05-02 Seiko Epson Corporation Display device with a narrow frame
JP2003216059A (ja) 2002-01-24 2003-07-30 Sharp Corp 表示素子およびその製造方法
TW200303439A (en) * 2002-02-04 2003-09-01 Mitsui Chemicals Inc Method for producing liquid crystal display cell and sealing agent for liquid crystal display cell
JP2003228302A (ja) 2002-02-04 2003-08-15 Toshiba Electronic Engineering Corp 表示装置及びその製造方法
JP4310984B2 (ja) 2002-02-06 2009-08-12 株式会社日立製作所 有機発光表示装置
US6791660B1 (en) 2002-02-12 2004-09-14 Seiko Epson Corporation Method for manufacturing electrooptical device and apparatus for manufacturing the same, electrooptical device and electronic appliances
JP4069639B2 (ja) 2002-02-12 2008-04-02 セイコーエプソン株式会社 電気光学装置の製造方法
US6791256B2 (en) 2002-02-15 2004-09-14 Hitachi, Ltd. Display device having an improved envelope for containing pixels therein
KR100720414B1 (ko) 2002-02-27 2007-05-22 엘지.필립스 엘시디 주식회사 액정 표시 장치의 제조 방법
JP2004311385A (ja) 2002-03-12 2004-11-04 Hitachi Chem Co Ltd 条部材、これを用いた封止材、シート状封止材、封止用基板、封止構成体、実装体及びこれらの製造方法
JP3875130B2 (ja) 2002-03-26 2007-01-31 株式会社東芝 表示装置及びその製造方法
JP4010845B2 (ja) 2002-03-28 2007-11-21 富士フイルム株式会社 発光素子
JP2003297552A (ja) 2002-03-29 2003-10-17 Pioneer Electronic Corp 有機エレクトロルミネッセンス表示パネル
KR100563675B1 (ko) 2002-04-09 2006-03-28 캐논 가부시끼가이샤 유기 발광소자 및 유기 발광소자 패키지
GB0208143D0 (en) 2002-04-09 2002-05-22 Ibm Data recovery system
JP2003323978A (ja) 2002-04-26 2003-11-14 Sanyo Electric Co Ltd エレクトロルミネッセンス表示装置の製造方法
DE10219951A1 (de) 2002-05-03 2003-11-13 Patent Treuhand Ges Fuer Elektrische Gluehlampen Mbh Verfahren zur Verkapselung eines Bauelements auf Basis organischer Halbleiter
US7423375B2 (en) 2002-05-07 2008-09-09 Osram Gmbh Encapsulation for electroluminescent devices
TWI263339B (en) 2002-05-15 2006-10-01 Semiconductor Energy Lab Light emitting device and method for manufacturing the same
KR100477745B1 (ko) 2002-05-23 2005-03-18 삼성에스디아이 주식회사 유기 전계발광 소자의 봉지방법 및 이를 이용하는 유기전계발광 패널
KR100434408B1 (ko) 2002-05-29 2004-06-04 엘지.필립스디스플레이(주) 컬러 평면 디스플레이용 소자
JP2004014332A (ja) 2002-06-07 2004-01-15 Pioneer Electronic Corp フラットディスプレイパネルおよびその製造方法
JP4021258B2 (ja) 2002-06-27 2007-12-12 株式会社アドバンスト・ディスプレイ 液晶表示素子の製法
KR20050011009A (ko) 2002-07-12 2005-01-28 니혼 이타가라스 가부시키가이샤 일렉트로·루미네슨스 소자용 봉지판, 그 제조 방법 및상기 봉지판 다량 생산용 마더 글래스 기판
JP4094919B2 (ja) 2002-07-18 2008-06-04 東北パイオニア株式会社 有機発光表示装置
JP4171258B2 (ja) 2002-07-25 2008-10-22 三洋電機株式会社 有機ｅｌパネル
JP4454262B2 (ja) 2002-07-25 2010-04-21 三洋電機株式会社 エレクトロルミネッセンス表示装置
KR100439749B1 (ko) 2002-07-29 2004-07-12 우리로광통신주식회사 유도결합형 플라즈마 식각장치를 이용하여 용융 석영계 기판에 광도파로를 제조하는 방법
CN1708970A (zh) * 2002-08-21 2005-12-14 皇家飞利浦电子股份有限公司 记录和/或再现装置与远程单元之间的通信系统及方法
JP2004093760A (ja) * 2002-08-30 2004-03-25 Fujitsu Display Technologies Corp 液晶表示装置の製造方法
JP2004103337A (ja) 2002-09-06 2004-04-02 Semiconductor Energy Lab Co Ltd 発光装置およびその作製方法
US7193364B2 (en) 2002-09-12 2007-03-20 Osram Opto Semiconductors (Malaysia) Sdn. Bhd Encapsulation for organic devices
JP4261861B2 (ja) 2002-09-30 2009-04-30 双葉電子工業株式会社 蛍光表示管用封着材及び蛍光表示管
JP4050972B2 (ja) 2002-10-16 2008-02-20 株式会社 日立ディスプレイズ 表示装置
JP2004151656A (ja) 2002-11-01 2004-05-27 Seiko Epson Corp 電気光学装置の製造方法および製造装置、並びに電気機器
JP2004171968A (ja) 2002-11-21 2004-06-17 Hitachi Ltd 平面型表示装置
JP4467879B2 (ja) 2002-11-22 2010-05-26 株式会社フジクラ 色素増感太陽電池の製法
AU2003280766A1 (en) 2002-11-28 2004-06-18 Konica Minolta Holdings, Inc. Display element, display and method for manufacturing display
JP4711595B2 (ja) 2002-12-10 2011-06-29 株式会社半導体エネルギー研究所 Ｅｌディスプレイ及び電子機器
KR100497095B1 (ko) 2002-12-26 2005-06-28 엘지.필립스 엘시디 주식회사 듀얼패널타입 유기전계발광 소자용 어레이 기판 및 그 제조방법
KR100641793B1 (ko) 2002-12-26 2006-11-02 샤프 가부시키가이샤 표시패널 및 그 제조방법
JP2004226880A (ja) * 2003-01-27 2004-08-12 Sharp Corp 表示パネルおよびその製造方法
CN1234148C (zh) * 2003-03-28 2005-12-28 孙伯彦 窄密封边等离子显示屏及制造方法
JP4299021B2 (ja) 2003-02-19 2009-07-22 ヤマト電子株式会社 封着加工材及び封着加工用ペースト
JP3975944B2 (ja) 2003-02-27 2007-09-12 住友電気工業株式会社 半導体あるいは液晶製造装置用保持体およびそれを搭載した半導体あるいは液晶製造装置
JP2004303733A (ja) 2003-03-31 2004-10-28 Osram Opto Semiconductors Gmbh 構成素子、とりわけ有機発光ダイオードを備える表示装置
US7202602B2 (en) 2003-04-08 2007-04-10 Organic Lighting Technologies Llc Metal seal packaging for organic light emitting diode device
JP4346012B2 (ja) 2003-04-11 2009-10-14 大日本印刷株式会社 有機エレクトロルミネッセンス素子
US7098589B2 (en) 2003-04-15 2006-08-29 Luminus Devices, Inc. Light emitting devices with high light collimation
US7265543B2 (en) 2003-04-15 2007-09-04 Honeywell International Inc. Integrated set/reset driver and magneto-resistive sensor
US20040206953A1 (en) 2003-04-16 2004-10-21 Robert Morena Hermetically sealed glass package and method of fabrication
US7344901B2 (en) 2003-04-16 2008-03-18 Corning Incorporated Hermetically sealed package and method of fabricating of a hermetically sealed package
US6998776B2 (en) * 2003-04-16 2006-02-14 Corning Incorporated Glass package that is hermetically sealed with a frit and method of fabrication
US6908573B2 (en) 2003-04-17 2005-06-21 General Electric Polymeric resin blends and methods of manufacture thereof
JP4518747B2 (ja) 2003-05-08 2010-08-04 三洋電機株式会社 有機ｅｌ表示装置
JP2004342336A (ja) 2003-05-13 2004-12-02 Semiconductor Energy Lab Co Ltd 発光装置およびその作製方法
US7247986B2 (en) 2003-06-10 2007-07-24 Samsung Sdi. Co., Ltd. Organic electro luminescent display and method for fabricating the same
JP4288475B2 (ja) * 2003-06-12 2009-07-01 セイコーエプソン株式会社 ディスプレイ装置の製造方法と製造装置
AU2003241651A1 (en) 2003-06-13 2005-01-04 Fuji Electric Holdings Co., Ltd. Organic el display and method for producing the same
JP2006527908A (ja) 2003-06-16 2006-12-07 コーニンクレッカ　フィリップス　エレクトロニクス　エヌ　ヴィ 可撓性のある有機ディスプレイ内にゲッターを有する二重シール
SG142140A1 (en) 2003-06-27 2008-05-28 Semiconductor Energy Lab Display device and method of manufacturing thereof
KR100544123B1 (ko) 2003-07-29 2006-01-23 삼성에스디아이 주식회사 평판표시장치
KR100544127B1 (ko) 2003-08-27 2006-01-23 삼성에스디아이 주식회사 수분 흡수층을 구비한 유기 전계 발광 표시 장치
US7928654B2 (en) 2003-08-29 2011-04-19 Semiconductor Energy Laboratory Co., Ltd. Display device and method for manufacturing the same
KR100552965B1 (ko) 2003-09-03 2006-02-15 삼성에스디아이 주식회사 유기 전계 발광 표시 장치
JP2005112676A (ja) 2003-10-08 2005-04-28 Nippon Sheet Glass Co Ltd Ｅｌ素子用封止板の製造方法及び該製造方法により製造されたｅｌ素子用封止板
JP2005123089A (ja) 2003-10-17 2005-05-12 Fuji Electric Holdings Co Ltd カラー有機ｅｌディスプレイおよびその製造方法
JP2005134476A (ja) 2003-10-28 2005-05-26 Sharp Corp 表示装置および能動素子アレイ基板ならびに増幅素子
US7193218B2 (en) 2003-10-29 2007-03-20 Canon Kabushiki Kaisha Radiation detection device, method of producing the same, and radiation image pick-up system
US20060284556A1 (en) * 2003-11-12 2006-12-21 Tremel James D Electronic devices and a method for encapsulating electronic devices
EP1683209A2 (en) 2003-11-12 2006-07-26 E.I. Dupont De Nemours And Company Encapsulation assembly for electronic devices
CN1617636A (zh) * 2003-11-12 2005-05-18 铼宝科技股份有限公司 具有疏水层的有机发光面板
KR100741962B1 (ko) 2003-11-26 2007-07-23 삼성에스디아이 주식회사 평판표시장치
KR100635049B1 (ko) 2003-11-29 2006-10-17 삼성에스디아이 주식회사 유기 전계 발광 표시 장치
US7186020B2 (en) 2003-12-12 2007-03-06 University Of Washington Thermal interface material (TIM) with carbon nanotubes (CNT) and low thermal impedance
JP4485184B2 (ja) 2003-12-15 2010-06-16 株式会社半導体エネルギー研究所 発光装置および電子機器
KR100560430B1 (ko) 2003-12-18 2006-03-13 한국전자통신연구원 자외선 조사에 의해 경화 가능한 유기 소자용 봉지 조성물 및 그 제조 방법
TWI238026B (en) 2003-12-19 2005-08-11 Ind Tech Res Inst Structure and fabricating method of a high-dielectric film formed on an organic substrate
JP2005190683A (ja) 2003-12-24 2005-07-14 Canon Inc 有機ｅｌ素子及びその製造方法
KR20050070543A (ko) 2003-12-30 2005-07-07 주식회사 팬택앤큐리텔 유기발광다이오드 디스플레이 장착구조 및 이를 구비한이동통신 단말기
JP2005209413A (ja) 2004-01-20 2005-08-04 Sanyo Electric Co Ltd 表示パネルの製造方法および表示パネル
JP4899286B2 (ja) 2004-01-30 2012-03-21 セイコーエプソン株式会社 有機ｅｌ表示装置及びその製造方法、並びに電子機器
JP2005222807A (ja) 2004-02-05 2005-08-18 Seiko Epson Corp 封止構造体、電子機器及び画像形成装置
JP3992001B2 (ja) 2004-03-01 2007-10-17 セイコーエプソン株式会社 有機エレクトロルミネッセンス装置及び電子機器
JP2005251407A (ja) 2004-03-01 2005-09-15 Sanyo Electric Co Ltd 表示パネルの製造方法および表示パネル
KR100615212B1 (ko) 2004-03-08 2006-08-25 삼성에스디아이 주식회사 평판 표시 장치
KR100581903B1 (ko) 2004-03-09 2006-05-22 삼성에스디아이 주식회사 전계 발광 디스플레이 장치
JP4455904B2 (ja) 2004-03-10 2010-04-21 東北パイオニア株式会社 両面表示装置及びその製造方法
US7619258B2 (en) 2004-03-16 2009-11-17 Semiconductor Energy Laboratory Co., Ltd. Display device
JP4776949B2 (ja) 2004-03-16 2011-09-21 株式会社半導体エネルギー研究所 発光装置
JP2005267991A (ja) 2004-03-18 2005-09-29 Hitachi Ltd 表示装置
DE102004017078A1 (de) 2004-04-07 2005-11-03 Recaro Aircraft Seating Gmbh & Co. Kg Fahrzeugsitzsystem, insbesondere für Luftfahrzeuge
US7764012B2 (en) 2004-04-16 2010-07-27 Semiconductor Energy Laboratory Co., Ltd Light emitting device comprising reduced frame portion, manufacturing method with improve productivity thereof, and electronic apparatus
KR20070015590A (ko) * 2004-04-22 2007-02-05 오스람 옵토 세미컨덕터스 게엠베하 유기 전자 부품용 캡슐, 그의 제조 방법 및 용도
US20050248270A1 (en) 2004-05-05 2005-11-10 Eastman Kodak Company Encapsulating OLED devices
KR100581913B1 (ko) 2004-05-22 2006-05-23 삼성에스디아이 주식회사 유기 전계 발광 표시장치
KR100603345B1 (ko) * 2004-05-25 2006-07-20 삼성에스디아이 주식회사 평판 표시장치의 제조방법, 평판 표시장치, 및 평판표시장치의 패널
JP2005340020A (ja) 2004-05-27 2005-12-08 Hitachi Displays Ltd 有機エレクトロルミネッセンス表示装置およびその製造方法
TWI227094B (en) 2004-06-03 2005-01-21 Au Optronics Corp Organic light-emitting display device and fabricating thereof
KR100626004B1 (ko) 2004-06-03 2006-09-20 삼성에스디아이 주식회사 평판 표시장치 및 그 제조방법
TWI272867B (en) 2004-06-08 2007-02-01 Au Optronics Corp Organic light-emitting display and fabricating method thereof
US7679591B2 (en) 2004-07-09 2010-03-16 Au Optronics Corporation Light emitting display device
KR100605117B1 (ko) 2004-07-15 2006-07-31 (주)엔텔스 Ｗｃｄｍａ 패킷 과금 데이터 처리 방법 및 시스템
KR20060006149A (ko) 2004-07-15 2006-01-19 삼성전자주식회사 화상형성장치의 현상유닛
KR101108041B1 (ko) 2004-07-20 2012-01-25 엘지전자 주식회사 의류건조기용 건조랙의 구조
KR101049126B1 (ko) 2004-07-20 2011-07-14 엘지전자 주식회사 컨트롤 패널의 엘이디 윈도우 구조
KR101053597B1 (ko) 2004-07-20 2011-08-03 엘지전자 주식회사 드럼세탁기
KR100689890B1 (ko) 2004-07-22 2007-03-08 주식회사 쓰리비 시스템 플랫패널용 광관련판요소의 결함검출방법
KR20060007890A (ko) 2004-07-22 2006-01-26 주식회사 팬택 무선통신 단말기의 음성감도 측정 시스템 및 그 방법
KR100660135B1 (ko) 2004-07-22 2006-12-21 이화여자대학교 산학협력단 Ｐ형 전도성 산화막의 투명전극을 갖는 소자 및 그제조방법
KR100632087B1 (ko) 2004-07-22 2006-10-04 주식회사 팬택앤큐리텔 사용 빈도에 따른 특수문자 제공 기능을 갖는 이동통신단말기 및 방법
KR20060007962A (ko) 2004-07-23 2006-01-26 주식회사 성우크린테크 공기정화 기능을 갖는 침대
KR100995042B1 (ko) 2004-07-23 2010-11-22 엘지전자 주식회사 디지털 방송 수신기 및 그의 긴급 경고 메시지 처리 방법
KR20060008761A (ko) 2004-07-24 2006-01-27 주식회사 대우일렉트로닉스 디지털 ｔｖ 방송의 사용자 인증 시스템 및 방법
KR20060008769A (ko) 2004-07-24 2006-01-27 주식회사 대우일렉트로닉스 무신호시 동일 가상 채널 전환 방법
KR100938984B1 (ko) 2004-08-17 2010-01-26 현대중공업 주식회사 고능률 후판 양면동시 일렉트로가스 입향 용접방법
KR100690719B1 (ko) 2004-08-17 2007-03-09 엘지전자 주식회사 지문인식을 이용한 휴대폰의 기능 선택방법
KR20060016446A (ko) 2004-08-17 2006-02-22 현대모비스 주식회사 간헐 와이퍼 구동시간 제어 방법
KR100612182B1 (ko) 2004-08-19 2006-08-16 현대자동차주식회사 자동차용 핸드폰 홀더
KR100590164B1 (ko) 2004-08-19 2006-06-19 현대자동차주식회사 자동차용 핸드폰 홀더
KR20060020109A (ko) 2004-08-31 2006-03-06 엘지전자 주식회사 리모콘을 이용한 셋업 밸유 백업장치 및 방법
US7078726B2 (en) 2004-09-09 2006-07-18 Osram Opto Semiconductors Gmbh Sealing of electronic device using absorbing layer for glue line
KR100733920B1 (ko) 2004-09-17 2007-07-02 주식회사 엘지화학 에칭 레지스트용 잉크 조성물, 이를 이용한 에칭 레지스트패턴 형성 방법 및 미세 유로 형성 방법
KR100673597B1 (ko) 2004-09-21 2007-01-24 (주)아이씨디 플라즈마 챔버
KR20060028571A (ko) 2004-09-25 2006-03-30 주식회사리팩 백 포장기
US7371143B2 (en) 2004-10-20 2008-05-13 Corning Incorporated Optimization of parameters for sealing organic emitting light diode (OLED) displays
JP4329740B2 (ja) 2004-10-22 2009-09-09 セイコーエプソン株式会社 有機エレクトロルミネッセンス装置の製造方法、及び有機エレクトロルミネッセンス装置
KR20060035455A (ko) 2004-10-22 2006-04-26 곽효진 매설관 교체방법
JP2006156967A (ja) 2004-11-08 2006-06-15 Sanyo Electric Co Ltd 薄膜トランジスタの製造方法及び有機エレクトロルミネッセンス表示装置
US7393257B2 (en) 2004-11-12 2008-07-01 Eastman Kodak Company Sealing of organic thin-film light-emitting devices
KR100637193B1 (ko) 2004-11-25 2006-10-23 삼성에스디아이 주식회사 전계 발광 디스플레이 장치 및 이의 제조 방법
JP2006244808A (ja) 2005-03-02 2006-09-14 Seiko Epson Corp 有機ｅｌ装置の製造方法及び有機ｅｌ装置
JP2006244809A (ja) 2005-03-02 2006-09-14 Seiko Epson Corp 有機ｅｌ装置の製造方法及び有機ｅｌ装置
CN1290121C (zh) 2005-03-08 2006-12-13 东南大学 汇流电极用感光性银浆料及其制备方法
US7579220B2 (en) 2005-05-20 2009-08-25 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device manufacturing method
US20060278965A1 (en) 2005-06-10 2006-12-14 Foust Donald F Hermetically sealed package and methods of making the same
US20060290261A1 (en) 2005-06-17 2006-12-28 Yuichi Sawai Bonding material
KR100685845B1 (ko) 2005-10-21 2007-02-22 삼성에스디아이 주식회사 유기전계 발광표시장치 및 그 제조방법
US20070120478A1 (en) 2005-11-28 2007-05-31 Au Optronics Corporation Double-sided display device and method of making same
US7597603B2 (en) 2005-12-06 2009-10-06 Corning Incorporated Method of encapsulating a display element
US7537504B2 (en) 2005-12-06 2009-05-26 Corning Incorporated Method of encapsulating a display element with frit wall and laser beam
US7425166B2 (en) 2005-12-06 2008-09-16 Corning Incorporated Method of sealing glass substrates
KR20060007353A (ko) 2005-12-14 2006-01-24 주식회사 엠엠아이 이동통신 단말기 카메라를 이용한 웹캠코드
KR20060007354A (ko) 2005-12-14 2006-01-24 주식회사 엠엠아이 블루투스 헤드셋 발신자번호표시 표시 및 장치
US8038495B2 (en) 2006-01-20 2011-10-18 Samsung Mobile Display Co., Ltd. Organic light-emitting display device and manufacturing method of the same
US20070172971A1 (en) 2006-01-20 2007-07-26 Eastman Kodak Company Desiccant sealing arrangement for OLED devices
KR100635514B1 (ko) 2006-01-23 2006-10-18 삼성에스디아이 주식회사 유기전계발광표시장치 및 그 제조방법
JP4456092B2 (ja) 2006-01-24 2010-04-28 三星モバイルディスプレイ株式會社 有機電界発光表示装置及びその製造方法
JP4624309B2 (ja) 2006-01-24 2011-02-02 三星モバイルディスプレイ株式會社 有機電界発光表示装置及びその製造方法
KR100688796B1 (ko) 2006-01-25 2007-03-02 삼성에스디아이 주식회사 유기전계발광 표시 장치 및 그의 제작 방법
KR100671641B1 (ko) 2006-01-25 2007-01-19 삼성에스디아이 주식회사 유기 전계 발광 표시장치 및 그 제조 방법
KR100685853B1 (ko) 2006-01-25 2007-02-22 삼성에스디아이 주식회사 유기전계발광표시장치 및 그 제조방법
KR100671646B1 (ko) 2006-01-25 2007-01-19 삼성에스디아이 주식회사 유기 전계 발광 표시장치 및 그 제조 방법
KR100688795B1 (ko) 2006-01-25 2007-03-02 삼성에스디아이 주식회사 유기전계발광 표시장치 및 그 제조방법
US8164257B2 (en) 2006-01-25 2012-04-24 Samsung Mobile Display Co., Ltd. Organic light emitting display and method of fabricating the same
KR100671647B1 (ko) 2006-01-26 2007-01-19 삼성에스디아이 주식회사 유기전계발광 표시 장치
KR100732808B1 (ko) 2006-01-26 2007-06-27 삼성에스디아이 주식회사 유기전계발광 표시장치의 제조방법
JP4633674B2 (ja) 2006-01-26 2011-02-16 三星モバイルディスプレイ株式會社 有機電界発光表示装置及びその製造方法
KR100671639B1 (ko) 2006-01-27 2007-01-19 삼성에스디아이 주식회사 유기 전계 발광 표시장치 및 그 제조 방법
KR100688790B1 (ko) 2006-01-27 2007-03-02 삼성에스디아이 주식회사 유기 전계 발광 표시장치 및 그 제조 방법
KR100713987B1 (ko) 2006-02-20 2007-05-04 삼성에스디아이 주식회사 기판 밀착장치 및 이를 이용한 유기전계발광 표시장치의밀봉방법
US7564185B2 (en) 2006-02-20 2009-07-21 Samsung Mobile Display Co., Ltd. Organic electroluminescence display device and manufacturing method thereof
KR100703446B1 (ko) 2006-02-21 2007-04-03 삼성에스디아이 주식회사 유기 전계 발광표시장치의 제조방법
KR100703519B1 (ko) 2006-02-21 2007-04-03 삼성에스디아이 주식회사 유기 전계 발광표시장치의 제조방법
KR100732817B1 (ko) 2006-03-29 2007-06-27 삼성에스디아이 주식회사 유기전계발광 표시장치 및 그 제조방법
KR100729084B1 (ko) 2006-09-21 2007-06-14 삼성에스디아이 주식회사 유기 전계 발광표시장치

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI586013B (zh) * 2016-06-01 2017-06-01 智晶光電股份有限公司 有機發光二極體封裝結構

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EP1811587B1 (en) 2016-12-14
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US8415880B2 (en) 2013-04-09
US20130237115A1 (en) 2013-09-12

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