TWI229430B - Optical micro electromechanical system package and manufacturing method thereof - Google Patents

Abstract

An optical micro electromechanical system (MEMS) package and manufacturing method thereof are provided. The optical MEMS package includes a substrate, an optical MEMS module, a bond wire, an electrostatic discharge (ESD) protective conductor and an encapsulating mold. An upper surface of the substrate has at least a bond finger. The optical MEMS module includes an optical MEMS die, a transparent insulating plate, an optical MEMS device and a gap ring. The optical MEMS die is deposited on the upper surface of the substrate. An upper surface of the optical MEMS die has at least a die pad. The die pad is adjacent to a lateral surface of the optical MEMS die and the bond finger. The gap ring is deposited on the upper surface of the optical MEMS die. The transparent insulating plate is deposited on the gap ring. The optical MEMS die, the transparent insulating plate and the gap ring enclose the space. The optical MEMS device is deposited on the upper surface of the optical MEMS die or a down surface of the transparent insulating plate insides the pace. The bond wire is electrically connected to the die pad and the bond finger. The ESD protective conductor is deposited between the transparent insulating plate and the substrate. The ESD protective conductor is electrically connected to the ground. The ESD protective conductor is positioned besides another lateral surface of the optical MEMS die. The encapsulating mold is formed to cover part of the upper surface of the optical MEMS die, part of the lateral surface of the optical MEMS die, the bond wire and part of the upper surface of the substrate.

Description

1229430 V. Description of the invention (l) [Technical field to which the invention belongs] The present invention relates to a micro electromechanical system (ME MS) package structure and manufacturing method ', and particularly to an optical micro electromechanical system (opticai MEMS) Packaging structure and manufacturing method. [Prior art]

In today's fast-changing era of science and technology, optical micro-electro-mechanical element systems have been widely used in modern life. Tenth, the optical microelectromechanical element includes a sensing element and a movable element. The sensing element is, for example, photon sensing, and the movable element is, for example, a micromirror. These optical micro-electro-mechanical elements are usually arranged on a semiconductor element in a sensible or movable manner. The semiconductor element is, for example, a complementary metal-oxide semiconductor (CMOS). Since the role of these optical microelectromechanical elements depends on their mobility or senseability, it is important that the packaging structure used to encapsulate these optical microelectromechanical elements must not interfere with the activities of these optical microelectromechanical elements Space or sensing area.

Please refer to FIG. 1. The edge diagram is a cross-sectional view of a conventional MEMS package structure. In the first figure, the MEMS package structure includes a substrate 12, a MEMS chip module 14, gold wires 16a and 16b, a sealing compound 18, and solder balls 20a and 20b. The substrate 12 has an opposite substrate top surface 12a, a substrate bottom surface 12b, and vias 15a and 15b. The substrate top surface i2a has fresh gold fingers 13a and 13b, and the substrate bottom surface 12b has solder pads i7a and i7b.

1229430 V. Description of the invention (2) The through holes 15a and 15b penetrate the substrate 12, the top surface I2a and the bottom surface 12b of the substrate. The through hole 15a is used to electrically connect the gold finger i3a and the solder pad 17a, and the through hole 15b is used to electrically The gold finger 13b and the pad 17b are soldered to each other.

The MEMS wafer module 14 includes a complementary gold oxide semiconductor wafer 22, a micromechanical structure 24, and an outer cover 26. The complementary gold oxide semiconductor wafer 22 is disposed on the top surface 12a of the substrate in an adhesive manner. The top surface 22a of the complementary gold oxide semiconductor wafer 22 has pads 28a and 28b. The micromechanical structure 24 is arranged on the top surface 22a of the complementary gold oxide semiconductor wafer 22. The outer cover 26 is arranged in a notch-down manner. On the top surface 2 2 a of the complementary gold oxide semiconductor wafer 22 and the cover 2 6 and the top surface 22 a of the complementary gold oxide semiconductor wafer 22 form a space 30 so that the micromechanical structure 24 is located in the space 30. . The gold wire 16a is used to electrically connect the pad 28a and the gold finger 13a, and the gold wire 16b is used to electrically connect the pad 28b and the gold finger 13b. The encapsulant 18 covers the micro-electro-mechanical chip module 14, part of the substrate positive fil2a, pads 28a and 28b, gold wires 16a and 16b, and solder gold fingers 13a and 13b. In addition, the solder balls 20a and 2 Ob are arranged on the solder pads i7a and 17b, respectively, for electrically connecting an external printed circuit board (PCB). However, the operation of the MEMS chip module 14 During the process, the outer cover 2 6 will accumulate electrostatic charges. Since the outer cover 26 does not have any electrostatic discharge (ESD) protection grounding design, the electrostatic charge accumulated on the outer cover 26 will cause the MEMS chip module 14 to operate the helmet method. In addition, the covering volume of the sealant 18 is too large, which will increase the production cost. In addition, the micro-electro-mechanical chip module 14 also generates heat during operation.

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The heat dissipation effect on the substrate 12 and the sealing compound 18 is limited, so that the heat of the micro-electromechanical package structure 14 cannot be completely dissipated to the outside, which affects the operation quality of the micro-electromechanical chip module 14 greatly. [Summary of the Invention] It is to provide an optical micro-electro-mechanical manufacturing method, which is equipped with electrostatic discharge (ESD) protective conductors, encapsulants, and the amount of electrostatic discharge and production costs of micro-electro-mechanical chip modules, and improve the effect. An optical micro-electro-mechanical package structure, an electric chip module, a connecting line, and a. The top surface of the substrate has at least one solder including a transparent insulating plate and an optical micro-electro-mechanical element. The top surface of the optical micro-electro-mechanical optical micro-electro-mechanical chip has one side of the electric chip and the top surface of the welding flashlight chip. The transparent insulating clothing and the optical micro-electro-mechanical chip are surrounded by the optical micro-electro-mechanical crystal placed in the space. The electrical connection and conduction system is adhered between the surfaces with a conductive silver adhesive and grounded. In view of this, the purpose of the present invention (optical MEMS) packaging structure and the design of the electrostatic discharge heat-dissipating solder ball can increase the photoelectric protection. According to the purpose of the present invention, it is proposed to include at least a substrate, an optical microcomputer electrostatic discharge protection conductor and a colloidal finger, and an optical microelectromechanical chip module microelectromechanical chip. A spacer ring and a light sun sheet are arranged on the top surface of the substrate, a pad, the pad is close to the optical microcomputer finger. The spacer ring is arranged on the optical microcomputer board and is arranged on the spacer ring, and Space. Optical micro-electro-mechanical components are the top surface of the matching plate or the bottom surface of the transparent insulation board and welding fingers. The electrostatic discharge protection is transparent The bottom surface of the top plate and the edge of the substrate

TW1289PA.ptd Page 12 1229430 V. Description of the invention (4) The guide system is located on the top surface of the light-covered substrate. Connect the finger according to the manufacturing method of this structure. Then on the top of the top surface of the substrate, at least one of the static electromechanical chip module, the top surface spacer of a spacer ring chip and the optical micro are placed in the space, and the top of the optical microcomputer optical microelectromechanical crystal plate The surface adhesive is located on the top surface of the optical micro-electro-mechanical system where the connection between the optical micro and the transparent insulating plate is connected and welded. For the purpose of understanding the present invention, the other side of the optical micro-electro-mechanical chip is mentioned below. The encapsulant is used to learn the top and side surfaces of the micro-electromechanical chip, the connection line and the other purpose of the part, and an optical microcomputer is proposed. First, a substrate is provided. The top surface of the substrate is pasted with a conductive silver adhesive to prevent electrostatic discharge. Then, the substrate is coated with light and coated with another conductive electrical discharge to prevent dislocation. The substrate includes a light and a transparent protective system. The top of the substrate is a micro-electromechanical insulation board. On the insulation board, a transparent electro-mechanical wafer surrounds an empty optical microcomputer silver glue to ground. Surface. The wafer and the spacer ring are arranged in between. The top surface of the photovoltaic chip or the top surface of the chip has at least one side surface. The optical proximity soldering 'pad is a finger on the bottom surface of the other side of the electromechanical chip. The top of the chip MEMS finger. Outside the surface, an optical micro-system is set on the spacer ring, and the micro-electro-mechanical transparent insulation pad is connected to the bottom of the wafer for electrostatic discharge and attached by another. Then, the shape surface and the side surface form a connecting wire into a gel, and the connecting wire and a part of the electrical packaging junction have a welding protective conductor to the protective conductor, an optical micro-electromechanical electromechanical element optical microcomputer, and are matched with the inter-element. The bottom pad of the board is close to the surface and the conductive silver glue of the base protective conductor, and the above-mentioned purposes, features, and advantages of the base of the substrate are electrically covered. The above-mentioned purpose, features, and advantages can be more clearly and easily a preferred embodiment, and with the accompanying drawings, make Detailed

TW1289PA.ptd

1229430 5. Description of the invention (5) The description is as follows: [Embodiment] Please refer to FIG. 2, which shows a cross-sectional view of an optical micro-electro-mechanical (opt i cal MEMS) packaging structure according to a preferred embodiment of the present invention. In FIG. 2 'the optical micro-electro-mechanical package structure 40 includes at least a substrate 42, an optical micro-electro-mechanical chip module 44, an electrostatic discharge (ESD) protective conductor 46, a connection line 48, and a gel. 50. A solder ball 52 and a plurality of heat-dissipating solder balls 54. The substrate 42 has an opposite substrate top surface 42a, a substrate bottom surface 42b, and a through hole 59. The substrate top surface 42a and the substrate bottom surface 42b have a soldering finger 58 and a solder pad 60, respectively. The through hole 59 penetrates the substrate 42, the substrate top surface 42a, and the substrate bottom surface 42b, and is used to electrically connect the fingers 58 and 60. The optical micro-electro-mechanical chip module 44 includes at least an optical micro-electro-mechanical chip 62, a transparent insulating plate 64, an optical micro-electro-mechanical element 66 and a spacer ring 68. The optical micro-electro-mechanical chip 62 has a top surface 62a, a bottom surface 62d, and an opposite surface. The side surfaces 62b and 62c and the bottom surface 62d of the optical micro-electro-mechanical chip 62 are adhered to the top surface 42a of the substrate by an adhesive 63. The top surface 62a of the optical micro-electro-mechanical chip 62 has a pad 65, and the pad 65 is close to the side surface 62b of the optical micro-electro-mechanical chip 62 and the soldering finger 58. The spacer ring 68 is arranged on the top surface 62a of the optical micro-electro-mechanical chip 62, and the transparent insulating plate 64 is arranged on the spacer ring 68, and forms a space 70 with the spacer ring 68 and the optical micro-electro-mechanical chip 62. The pad 6 5 is located outside the space 70. Among them, the optical micro-electro-mechanical element 66 is the top surface 62a of the photoelectric micro-electro-mechanical chip 62 disposed in the space 70 or the transparent insulating plate 64.

TW1289PA.ptd Page 14 1229430 V. Description of the invention (6) On the bottom surface 64a. In the embodiment, the optical micro-electro-mechanical element 66 is arranged on the top surface 62 a of the photoelectric micro-electro-mechanical chip 62 in the space 70 in the present invention. It should be noted that the spacer ring 68 can be arranged between the top surface 62a of the optical micro-electro-mechanical chip 62 and the bottom surface 6 4 a of the transparent insulating plate 64 by UV glue or epoxy to make a transparent insulating plate. The bottom surface β 4 b of 64 and the top surface 62 a of the optical micro-electro-mechanical chip 62 are separated by a height difference. The optical micro-electro-mechanical element 66 may be a movable element, such as a micromirror. The movable element is disposed on the top surface 6 2 a of the optical micro-electro-mechanical wafer 62 or the bottom surface 64 a of the transparent insulating plate β 4. The optical micro-electro-mechanical element 66 may be a sensing element. The sensing element is disposed on the top surface 6 2 a of the optical micro-electro-mechanical chip 62.

The electrostatic discharge protective conductor 46 is adhered to the top surface 4 2 a of the substrate and the bottom surface 6 4 a of the transparent insulating plate 64 with conductive silver glues 72a and 72b, respectively, and grounded. The electrostatic discharge protective conductor 46 is located on the optical micro-electromechanical chip 62. Outside 62c. In this way, the electrostatic discharge protective conductor 46 can introduce the static electricity of the transparent insulating plate 64 into an external ground terminal or the ground layer of the substrate 52 to strengthen the electrostatic discharge protection capability of the optical micro-electro-mechanical chip module 44 and maintain it. Operational performance of the optical micro-electro-mechanical chip module 44.

The connecting wire 58 is used to electrically connect the pad 65 and the soldering finger 58 so that the optical micro-electromechanical chip 62 and the substrate 42 are electrically connected. The sealing compound 50 is used to cover a part of the top surface 62a and the side surface 62b of the optical micro-electromechanical wafer 62, the connection line 58 and a part of the substrate top surface 42a. Furthermore, the sealing compound 50 can cover the side surface 64b of the transparent insulating plate 64 and a part of the spacer ring 68. Since the sealant 50 does not need to cover the entire optical micro-electro-mechanical chip module 44, the amount of sealant material is greatly reduced 'and the production cost is greatly reduced. ,

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The solder balls 52 are disposed on the solder pads 52 for electrically connecting an external printed circuit board. The heat-dissipating solder balls 54 are arranged on the bottom surface 42b of the substrate to form P dummy solder balls. These heat-dissipating solder balls 54 are used to help the optical micro-electro-mechanical chip module 44 dissipate heat and improve the operation quality of the optical micro-electro-mechanical chip module 44. As shown in FIG. 3A, the bottom surface 42b of the present invention may further have a plurality of bonding pads 60, and these bonding pads 60 are discharged in an array manner, and the optical microelectromechanical packaging structure 40 is a flat grid array. (1 an (j gr id array, LGA)). As shown in FIG. 3B, a solder ball 5 2 can be arranged on each solder pad 60, and these solder balls 52 are also discharged in an array manner. The optical micro-electro-mechanical packaging structure 40 is a ball grid array (BGA) packaging structure. Please refer to FIGS. 4A to 4F, which show a method for manufacturing an optical micro-electro-mechanical packaging structure according to a preferred embodiment of the present invention. First, in FIG. 4A, a substrate 42 is provided. The substrate 42 has a substrate top surface 42a, a substrate bottom surface 4 2b, and at least one through hole 59, the substrate top surface 42a, and the substrate bottom surface 42b. A soldering finger 58 and a soldering pad 60. The hole penetrates the substrate 42 and is used to electrically connect the soldering finger 58 and the soldering pad 60. Next, as shown in FIG. 4B, a static silver paste 72a is used to stick a static electricity. The discharge protection conductor 46 is on the top surface 42a of the substrate, and is coated with another conductive electrostatic discharge The top of the protective guide ship. Among them, it is adhered to 42a formed between the electrostatic discharge protective conductor 46 and the welding finger 5 8 to prepare for the subsequent sticking crystal step. Then, as shown in FIG. As shown, an optical micro-electro-mechanical chip module 44 is disposed on the substrate top surface 42a by performing a die-bonding step. Among them, the optical micro-electro-mechanical device

TW1289PA.ptd Page 16 1229430 V. Description of the invention (8) The chip module 44 includes at least an optical micro-electro-mechanical chip 62, an optical micro-electro-mechanical element 66, a transparent insulating plate 64, and a spacer ring 68. The spacer ring 68 is provided. On the top surface 62 a of the optical micro-electro-mechanical wafer 62. The transparent insulating plate 64 is arranged on the spacer ring 68, and forms a space 70 with the optical micro-electromechanical wafer 62 and the spacer ring 68. The optical micro-electro-mechanical element 66 is arranged on the top surface 62 a of the optical micro-electro-mechanical chip 62 or the bottom surface 64 a of the transparent insulating plate 64 in the space 70. The pad 65 is located outside the space 70 'and is near the side 62b of the optical micro-electromechanical wafer 62. The bottom surface 62d of the optical micro-electro-mechanical chip 62 is adhered to the substrate top surface 42a by an adhesive 63, and the pad 65 is close to the soldering finger 58. The ESD protection conductor 46 is located outside the other side 62b of the optical micro-electro-mechanical chip 62, and is adhered to the bottom surface 64a of the transparent insulating plate 64 by a conductive silver glue 72b. The phonetic system that requires phonetic transcription can be used to form the bottom step of the optical micro-electro-mechanical chip 62 '. In addition, the optical micro-electro-mechanical wafer module 44 can be completed through the joining and cutting steps of a wafer having a plurality of optical micro-electro-mechanical wafers 62 to a continuous plate having a plurality of transparent insulating plates 64. Next, as shown in FIG. 4D, a wire bonding step is performed to form a connection 48 'to electrically connect the pad 65 and the soldering finger 58. Then, as shown in Fig. 4, the sealing step is performed to form a piece of colloid 50 to cover the optical portion of the sheet. The 62Λ top surface 62, the side surface 62b, the connecting line 48, and a part of the base side surface 62b I mi cow seal gel 50 can also cover the side surface 62b of the transparent insulating plate 64 into the lamp ball planting step to form a solder ball 52 on the Hui 6 ball 54 on On the underside of the substrate, optical micro-electro-mechanical packaging junction 2

1229430 V. Description of the invention (9) Of course, those skilled in the art can also understand that the technology of the present invention is not limited to this. For example, the ESD protection conductor 46 is a metal and is gold, silver or copper. In addition, the substrate 42 is a flexible substrate, a ceramic substrate, a j3ismaleifflide triazene (BT) resin substrate, or a transparent insulating plate fiber epoxy copper foil (epoxy woven glass fabric). copper clad laminate (FR4) substrate. When the substrate 42 is a flexible substrate, the substrate bottom surface 42b of the substrate 42 can be connected to a printed circuit board of the outside by a row of wires, and the optoelectronic micro-electromechanical packaging structure with the flexible substrate can improve the process design flexibility. flexibility). In addition, the optical micro-electro-mechanical chip 62 is a complementary meta-oxide semiconductor (CMOS) chip, and the transparent insulating plate is a transparent glass plate or a transparent plastic plate. The connecting wire 48 is gold-plated and wide-encapsulated. 5 . Can be underfill material (und = 8) "= hair: the optical micro-electro-mechanical package structure and manufacturing system disclosed in the above embodiment, it can be Ϊ the force of the electrostatic discharge protection conductor, sealing gel and heat-dissipating solder ball, Reduce the amount of sealing material and electricity: heat dissipation effect of energy-saving electrical packaging structure. The cost is not as described above. Although the present invention is not intended to limit too respectful day γ y ^ Quan Jia embodiment is disclosed as above, the spirit and scope of the present invention ", when the three artists' The scope of protection of the invention should be attached as follows ===; by r TW1289PA.ptd page 18 1229430 Simple illustration of the drawing [Simplified illustration of the drawing]: Yes: It is a sectional view according to the traditional micro-electromechanical packaging structure. Package structure "The HI drawing on the optical micro-electro-mechanical surface of the embodiment is a schematic diagram of the state of the substrate of the optical micro-electro-mechanical package structure of the present invention when there are arrayed pads. = 3 !, the drawing shows the state of the state when the solder balls are arrayed on the bottom surface of the substrate of the optical micro-electromechanical structure of the present invention. Figures 4A to 4F are shown in accordance with the present invention. The flow chart of the method is shown in the figure of the first sub-pattern. 10, 4 0 · Optical micro-electro-mechanical package structure 12, 4 2: Substrate 12a, 42a: Substrate top surface 12b, 42b: Substrate bottom surface 13a, 13b: Solder gold Finger 14: MEMS package structure 15a, 15b, 59: Through hole 16a, 16b: Gold wire 17a, 17b, 60: Pad 18, 50: Sealing gel 20a, 20b, 52: Solder ball 22: complementary gold oxide semiconductor wafer

1229430 Schematic illustration 22a: Top surface of complementary gold oxide semiconductor wafer 24: Micromirror 26: Covers 28a, 28b, 65: Pads 30, 70: Space 44: Optical microelectromechanical package structure 46: Electrostatic discharge protection conductor 48 : Connecting wire 5 4: Heat-dissipating solder ball 58: Welding finger 62: Optical micro-electro-mechanical chip 62 a · Top surfaces of optical micro-electro-mechanical chip 62 b, 62 c: Side surfaces of optical micro-electro-mechanical chip 62 d: Bottom surface of optical micro-electro-mechanical chip 63: Adhesion Agent 64: transparent insulation board 6 4 a: bottom surface of transparent insulation board 6 4 b: side surface of transparent insulation board 68: spacer ring 72a, 72b · conductive silver glue

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Claims (1)

1229430 1. An optical micro-electro-mechanical package structure, comprising at least: a substrate having at least one soldering finger on its top surface; an optical micro-electro-mechanical chip module including at least: s ′ an optical micro-electro-mechanical chip arranged on top of the substrate On the surface, the top mask of the optical micro-electro-mechanical chip has a pad, which is close to one side of the optical micro-electro-mechanical chip and the welding finger; a spacer ring is arranged on the top surface of the optical micro-electro-mechanical chip. A transparent insulating plate is disposed on the spacer ring, and surrounds the spacer ring and the optical micro-electro-mechanical wafer to form a space; and ^ an optical micro-electro-mechanical element, which is the light and micro-electro-mechanical device arranged in the space. The top surface of the chip or the bottom surface of the transparent insulating plate; a connection line for electrically connecting the pad and the welding finger; an electrostatic discharge (E / Dj protective conductor, made of conductive silver) Adhesively adhered between the bottom surface of the transparent insulation board and the top surface of the US board and grounded, and the ESD protection conductive system is located outside the other side of the micro-electro-mechanical chip; and χ dry Sealing gel for covering part of the surface of the optical micro-electro-mechanical chip, the side of the optical micro-electro-mechanical chip, the connecting line and the top surface of the board. The substrate further includes: at least one solder pad, which is arranged on the bottom surface of the substrate, and is electrically connected with fingers. TW1289PA.ptd Page 21 1229430 3. The optical micro-electro-mechanical package structure according to item 2 of the scope of the patent application, wherein the substrate further has at least a via, the via is penetrating the substrate for electrically connecting the welding finger and the pad . 4. The optical micro-electro-mechanical package structure as described in item 2 of the scope of the patent application, wherein the optical micro-electro-mechanical package structure further includes at least one solder ball disposed on the solder pad. 5. The optical micro-electro-mechanical package structure according to item 1 of the scope of the patent application, wherein the substrate further comprises: ° At least one heat-dissipating solder ball is arranged on the bottom surface of the substrate. 6. The optical micro-electro-mechanical package structure according to item 1 of the scope of the patent application, wherein the electrostatic discharge protective conductor is a metal. 7 · The optical micro-electromechanical encapsulation structure described in item 1 of the scope of patent application ', which makes the electrostatic discharge protective conductor be gold, silver or copper. 8. The optical micro-electro-mechanical vibration-damping structure according to item 1 of the scope of patent application, wherein the substrate is a ceramic substrate. 9. The optical micro-electro-mechanical package structure according to item 1 of the scope of the patent application, wherein the substrate is a bismaleimide bis (imide) imide (b i sma 1 e i m i de tr iazene, BT) tree moon substrate. 10 · The optical micro-electro-mechanical package structure described in item 1 of the scope of the patent application, wherein the substrate is a transparent insulating plate fiber epoxy copper flute (e ρ 〇 y woven glass fabric copper clad laminate, FR4) substrate. 11. The optical micro-electro-mechanical package structure according to item 1 of the scope of the patent application, wherein the substrate is a flexible (f 1 ex i b 1 e) substrate. TW1289PA.ptd Page 22 1229430 VI. Scope of Patent Application Structure 12 · Among them, please use a flexible flexible substrate to connect a line of optical microcomputers as described in item 11. Electrical package structure 13. The optical micro-electro-mechanical device described in item 1 of the patent scope, wherein the optical micro-electro-mechanical chip is a complementary gold-oxide semiconductor, 〇 (comp) [ementary metal-oxide semi conductor 5 CMOS) crystal structure 14. The optical micro-electromechanical seal according to item 1 of the patent scope, wherein the transparent insulating plate is a transparent glass plate or a transparent plastic plate. 15. The optical micro-electro-mechanical seal dream structure described in item 1 of the patent scope, wherein the sealant system covers one side of the transparent insulating plate and the spacer ring of the ministry 16. The knife The optical micro-electro-mechanical seal dream structure described in item 1 of the patent scope, wherein the optical micro-electro-mechanical element is a movable element, and the movable element is arranged on the top surface of the optical micro-electro-mechanical chip or the transparent insulating plate. 1 1 On the bottom surface, the optical micro-electromechanical seal structure described in item 16 of the patent scope, wherein the movable element is a micromirror. [18] The optical micro-device described in item 1 of the patent application scope. An electromechanical packaging structure, wherein the optical microelectromechanical element is a sensing element, and the sensing element is disposed on a top surface of the optical microelectromechanical chip. "19. The optical micro-electro-mechanical package structure described in item 丨 of the scope of application for patent, wherein the connection line is a gold wire. 20 · A method for manufacturing an optical micro-electro-mechanical package structure, including at least: 1229430 6. The scope of the patent application provides a substrate. The top surface of the substrate has a soldering finger and a conductive silver adhesive is used to stick an electrostatic discharge protective conductor on the surface. And another conductive silver adhesive is coated on the electrostatic discharge protective ^. 'The electrostatic discharge protection conductive system is grounded; an optical micro-electro-mechanical chip module is arranged on the top of the substrate' The optical micro-electro-mechanical chip module includes at least an optical micro-computer, a spacer ring, a transparent insulating plate, and an optical micro-electro-mechanical device. The device is disposed on the top surface of the optical micro-electro-mechanical wafer, the transparent insulation is placed on the spacer ring, and a space is formed with the spacer ring and the optical micro-electro-mechanical device. The optical micro-electro-mechanical device is arranged in the space. The top surface of the electromechanical chip or the bottom surface of the transparent insulating plate, the top surface of the optical chip has at least one pad. The pad is close to one side of the optical chip, and the bottom surface of the optical microelectromechanical chip is adhered to the surface. 'The connection is close to the welding finger, the electrostatic discharge is located outside the optical micro-electro-mechanical chip, and the silver glue is adhered to the bottom surface of the transparent insulating plate; Form a connection line to electrically connect the pad to the welding surface, seal the body to cover part of the optical micro-electromechanical & 2 and the side of the sub-micro-electro-mechanical chip, the connection line and the part board (the The method described in Item 20 of the U.S. Patent Application, which has a bottom surface with a minimum contact of ^ M, the method "shape: the front pad is formed with the welding finger, a colloid After the step, the top surface of the top body of the substrate includes the electric chip and the spacer ring plate, and the wafer is surrounded by the wafer to form the top protective conductor of the optical microelectronic microelectromechanical microelectromechanical substrate and the conductive finger; The substrate on the top of the wafer is electrically connected to the substrate. Surface TW1289PA.ptd Page 24 1229430 VI. Scope of patent application At least one solder ball is formed on the solder pad. 22. The method according to item 20 of the patent application scope, wherein after the step of forming a colloid, the method further comprises: forming at least one heat-dissipating solder ball on the top surface of the substrate. 23. The method according to item 20 of the scope of patent application, wherein the electrostatic discharge protective conductor is a metal. 24. The method according to item 23 of the scope of patent application, wherein the electrostatic discharge protective conductor is gold, silver or copper. 25. The method according to item 20 of the scope of patent application, wherein the substrate is a ceramic substrate. 26. The method according to item 20 of the application, wherein the substrate is a bismaleimide triazene (BT) resin substrate. 27. The method as described in item 20 of the patent application, wherein the substrate is a transparent insulating plate fiber epoxy woven glass fabric copper clad laminate (FR4) substrate. 28. The method as described in claim 20 of the patent application scope, wherein the substrate is a flexible substrate. 29. The method according to item 28 of the scope of patent application, wherein the flexible substrate can be connected with a row of wires. 30. The method according to item 20 of the scope of the patent application, wherein the optical micro-electro-mechanical chip is a complementary metal oxide semiconductor (CMOS) chip. 31. The method as described in claim 20 of the patent application scope, wherein the transparent TO289PA.ptd Page 25 1229430 Patent ϊ ϊ-— ---- ---- ---------------moxibustion, head is transparent glass plate or transparent plastic plate. The system is frost ^ ▲ The method described in the patent application No. 20, wherein the sealant 3 is urgent on one side and a part of the spacer ring of the transparent insulation board. Microcomputer Thunder-The method as described in Item 20 of the scope of the patent application, wherein the optical element is a movable element, and the movable element is arranged on the top surface of the optical micro 1: a sheet or the transparent insulating plate On the bottom surface. A 34. The method according to item 33 of the scope of patent application, wherein the movable element is a micromirror. ^ 35. The method according to item 20 of the scope of patent application, wherein the optical mechatronic element is a sensing element, and the sensing element is arranged on the surface of the optical microelectromechanical chip. 36. The method as described in claim 20 of the scope of patent application, wherein the connection line is a gold line. TW1289PA.ptd Buy 26