1228023 玖、發明說明： 【發明所屬之技術領域】 本發明係有關基板等的計測裝置，更具體地說，本發明 有關用於計測設置於印刷基板上的膏狀焊料等的計測對象 的計測裝置。 【先前技術】 在印刷基板的製造過程中，具有作爲主要程序者，爲具 有在基板上安裝電子構件的程序。在安裝電子構件時，首 先’在設置於印刷基板上的規定的電極圖形上印刷膏狀焊 料。接著，依據該膏狀焊料的粘性，將電子構件暫時固定 於該印刷基板上。然後，將上述印刷基板送向回焊爐，經 過規定回焊程序以進行焊接。在送向回焊爐的前期階段， 必須檢查膏狀焊料的印刷狀態，在上述檢查時，採用三維 計測裝置。 近年’人們提出各種採用光的所謂的非接觸式的三維計 測裝置，作爲在計測時所採用的方式，例舉有相位偏移法、 光切斷法、空間代碼法、聚焦法等\ 但是’在三維計測時，在基板翹曲的狀態進行計測，焊 料等的位置關係發生變化，對正確的計測造成妨礙。由此， 必須在對基板的翹曲進行矯正（補償）後，進行計測。 在過去，爲了矯正這樣的翹曲，在支承固定以水平狀態 所設置之基板端部的狀態下，從下方向上方，將上推銷壓 靠於基板底面上以進行抬起，藉此，對基板的翹曲進行矯 $ °但是’此種物理性的矯正不一定能夠正確地將基板矯 1228023 正到平整狀態。另外，還具有必須要求用於矯正的機構， '«Τ' 而具有導致裝置複雜化、整體尺寸大型化之虞。 相對於此，具有通過使感測頭沿Ζ軸（高度）方向移動， · 在計測時，對翹曲量進行補償的技術（例如，參照專利文獻 1 )。在該技術中，通過使感測頭相對印刷基板，沿X γ軸 方向掃描，獲得高度資料’在該高度資料的平均値位於設 定範圍內時，不進行下次的感測頭的掃描時的Ζ軸移動機 構的高度控制，在印刷基板與感測頭的間距一定之狀態下 進行掃描控制。另一方面，在高度資料的平均値在設定範 0 圍之外的場合，在下次之藉由感測頭所達成之掃描時，進 行Ζ軸移動機構的高度控制。 專利文獻1 :日本專利特開200 1 - 1 56425號公報。 【發明內容】 但是，在上述技術中，如果在基板表面具有急劇的高低 差（例如台階等）’則具有在下次不能夠適當地反應該高低 差量的情況。另外，在初次計測時，具有述高低差之情 況下’如果按照縮小的方式對其進行補償，則具有產生在 馨 下次的δ十測中無法適當地反應的情況的危險。另外，在最 後進行計測時’在具有急劇的高低差等的場合下，由於處 於最後狀態’還具有無法適當地反應該高低差量的不利情 況。在此種情況下’具有在不對焦的狀態下進行計測的危 險。其結果是’具有對正確的計測造成妨礙的危險。 另外’在上述的不利情況不僅在必須包括高度計測的三 維計測，而且同樣在進行二維計測的場合均產生。 1228023 本發明是針對上述情況而提出的，本發明的一個主要目 的在於提供一種計測裝置，該計測裝置即使在基板發生翹 曲等的情況下，即使不進行物理性的矯正，仍可進行更加 正確的計測。 下面對可實現上述目的之特徵方案進行描述。另外，對 於各方案，爲依據需要而對特徵的作用和效果進行描述。 方案1有關一種計測裝置，爲包括：計測用照射機構， 爲可對設置於基板上的計測對象，照射規定之光；拍攝機 構，爲在多個拍攝區域中，可拍攝以上述規定之光所照射 馨 的計測對象；計測機構，爲依據至少藉由上述拍攝機構拍 攝的影像資料，進行有關於上述計測對象之二維計測或三 維計測； 其特徵在於：設置有： 移動機構，爲可調整上述基板和上述拍攝機構間之相對 高度關係；偏移量計測機構，爲在各拍攝區域中之上述拍 攝和計測之前，於規定的拍攝區域中，測定相對預定的基 準高度位置的高度方向的偏移量；判斷機構，爲判斷藉由 i 上述偏移量計測機構計測的高度方向的偏移量是否在預定 的允許範圍內； 且構成如下：在以上述判斷機構判定上述偏移量在預定 的允許範圍內之情況下，保持上述基板和上述拍攝機構間 之相對高度關係的狀態，進行該規定的拍攝區域的計測用 的拍攝，當轉移到下一拍攝區域時，控制上述控制機構而 僅以上述偏移量來補償上述相對高度關係； 1228023 在以上述判斷機構判定上述偏移量不在上述允許範圍 內之情況下，以控制上述移動機構而僅以上述偏移量來補 償上述相對高度關係，然後，在該規定的拍攝區域中進行 上述計測用的拍攝。 按照上述方案1，藉由計測用照射機構而對設置於基板 上之計測對象照射規定之光，藉由拍攝機構，使已照射規 定之光的計測對象分別在多個拍攝區域中被拍攝。並且， 依據至少以拍攝機構所拍攝之影像資料，在計測機構中爲 進行有關於計測對象之二維計測或三維計測。此外，在偏 移量計測機構中，爲在各個拍攝區域中之上述拍攝和計測 之前，於規定的拍攝區域中，針對於預定的基準高度位置 而測定局度方向的偏移量。在判斷機構中，爲判斷藉由偏 移量計測機構所測定之高度方向的偏移量是否位於預定的 允許範圍內。並且，在以判斷機構判斷上述偏移量爲位於 預定之允許範圍內之情況下，在保持基板和拍攝機構的相 對關係的狀態而進行在該規定的拍攝區域的計測用的拍 攝。然後，當轉移到下次的拍攝區域時，藉由控制移動機 構而僅以上述偏移量而補償基板和拍攝機構間之相對高度 關係。因此，相較於以逐一在各個拍攝區域中調整相對高 度關係之情況，係確保有關於計測之高速性。另外，在以 判斷機構而判斷上述偏移量不位於允許範圍內之情況下， 以控制移動機構而僅以上述偏移量來補償相對高度關係， 然後進行在該規定之拍攝區域的計測用的拍攝。從而，即 使在規定之拍攝區域中，具有急劇的高低差（例如台階等） 1228023 之情況下，藉由在當時快速地對相對高度關係進行補償， * 而可即時的反應高低差量、進行計測。其結果是，針對各 拍攝區域，在進行對焦的狀態下可正確地進行計測。 另外，也可採用下述方案，即，「在以上述判斷機構判 斷上述偏移量不位於允許範圍內之情況下，爲控制上述移 動機構而僅以上述偏移量來補償上述相對高度關係，再以 上述偏移量計測機構計測偏移量，同時以上述判斷機構判 斷該偏移量是否在預定之允許範圍內，在位於允許範圍內 之情況下，進行在該規定之拍攝區域中之上述計測用的拍 β 攝」，另外，還可採用下述方案，即，「在以上述判斷機構 判定上述偏移量不在上述允許範圍內之情況下，控制上述 移動機構，以上述偏移量而補償上述相對高度關係，在藉 由上述偏移量計測機構來測定偏移量，同時，以上述判斷 機構判斷該偏移量是否在預定的允許範圍內，在判定不在 規定次數允許範圍內之情況下，則爲判斷錯誤」。 方案2有關一種計測裝置，爲包括：計測用照射機構， 爲對設置於基板上之計測對象，可照射規定之光；拍攝機 ^ 構，爲在多個拍攝區域中，可拍攝以上述規定之光所照射 的計測對象；計測機構，爲依據至少藉由上述拍攝機構拍 攝的影像資料，進行有關於上述計測對象之二維計測或三 維計測； 其特徵在於：設置有： Ζ軸方向移動機構，爲可調整上述基板和上述拍攝機構 間之相對高度關係； 1228023 χγ軸方向移動機構，爲可調整應切換拍攝區域之上述 基板與拍攝機構之間的相對位置關係； 偏移量計測機構，爲在各拍攝區域的上述拍攝和計測之 _ 前，在各個拍攝區域中，測定對於預定的基準高度位置之 高度方向的偏移量； 判斷機構，爲判斷藉由上述偏移量計測機構所測定之高 度方向的偏移量是否在預定的允許範圍內； 控制機構，爲在第1拍攝區域中，當藉由上述判斷機構 判定上述偏移量爲在上述允許範圍內之情況下，保持上述 基板和上述拍攝機構間之相對高度關係，允許在該第1拍 攝區域中之計測用的拍攝，當控制上述ΧΥ軸方向移動機 構而將拍攝區域切換到第2拍攝區域時，控制上述Ζ軸方 向移動機構，且僅以上述偏移量來補償上述相對高度關 係； 在第1拍攝區域中，當藉由上述判斷機構判定上述偏移 量不在上述允許範圍內之情況下，控制上述Ζ軸方向移動 機構，而僅以上述偏移量補償上述相對高度關係，然後， ^ 允許在該第1拍攝區域中之上述計測用的拍攝。 按照該方案2，藉由Ζ軸方向移動機構調整基板和拍攝 機構的相對高度關係。另外，藉由ΧΥ軸方向移動機構， 藉由調整基板與拍攝機構間之相對位置關係而切換拍攝區 域。而在偏移量計測機構中，在各個拍攝機構區域中之拍 攝和計測之前，在各個拍攝區域中，計測相對預定的基準 高度位置之高度方向的偏移量，在判斷機構中，爲判斷該 -10- 1228023 偏移量是否在預定的允許範圍內。另外，在第1拍攝區域 中，當藉由判斷機構判定上述偏移量在預定的允許範圍內 之情況下，爲藉由控制機構來保持基板與上述拍攝機構間 之相對高度關係，允許在第1拍攝區域中之計測用的拍 攝。再者，對XY軸方向移動機構進行控制，將拍攝區域 切換到第2拍攝區域時，對Z軸方向移動機構進行控制、 且僅以偏移量補償相對高度關係。因此，相較於逐一在各 個拍攝區域中調整相對高度關係之情況，爲確保有關於計 測之高速性。另外，在第1拍攝區域中，當藉由判斷機構 · 判定上述偏移量不在允許範圍內之情況下，爲控制Z軸方 向移動機構而僅以上述偏移量來補償相對高度關係，然 後，允許在第1拍攝區域中之計測用的拍攝。從而，即使 在第1拍攝區域中具有急劇的高低差（例如台階等）的情況 下，爲即時且快速地補償相對高度關係，由此，可即時場 反應高低差値來進行計測。其結果，分別在各拍攝區域中， 爲可在對焦狀態下正確地進行計測。 方案3係有關上述方案2所述之計測裝置，其特徵在 馨 於’在上述第1拍攝區域中，當以上述判斷機構判定上述 偏移量不在上述允許範圍內之情況下，控制上述z軸方向 移動機構，而僅以上述偏移量來補償上述相對高度關係， 然後，允許在該第1拍攝區域中之上述計測用的拍攝，當 控制上述XY軸方向移動機構而將拍攝區域切換到第2拍 攝區域時，保持上述相對高度關係。 按上述方案3 ’在封弟1拍攝區域中已進行大幅補償 -11 - 1228023 之情況下，當切換到第2拍攝區域時，先保持該已補償之 相對高度關係。從而，在第2拍攝區域中如不需進行補償， 則可更進一步地確保有關計測之高速性。 方案4係有關上述方案1至3中之任一項所述之計測裝 置，其特徵在於，在上述各個拍攝區域中之上述拍攝和計 測之前，設置抽取計測對象的計測對象抽取機構。 按照方案4，以計測對象抽取機構抽取計測對象，然後， 進行在各個拍攝區域中之拍攝和計測。因此，有關於計測 對象’係可進行更加正確的計測。 · 方案5係有關方案4所述的計測裝置，其特徵在於，上 述基板爲印刷基板；上述計測對象爲設置於印刷基板的銅 箔上的膏狀焊料；上述計測對象抽取機構係爲，將來自可 在上述印刷基板上進行藍色、或是以此爲基準之波長帶域 之光照射的抽取用照射機構之光，照射在上述印刷基板， 依據以上述拍攝機構拍攝所得之影像資料而抽取上述膏狀 焊料之區域。 按照方案5，針對設置於印刷基板的銅箔上的膏狀焊料 馨 進行計測。在此，以抽取用照射機構而在印刷基板上進行 藍色或以其爲基準之波長帶域之光照射，在計測對象抽取 機構中，將其照射面依據以拍攝機構所拍攝而得的影像資 料來抽取霄狀焊料的區域。一般，在印刷基板中，銅箱係 具有紅色系統的顏色，膏狀焊料具有藍色系統的顏色。因 此’藍色系統之光係由銅范部分變暗而不反射。藉此，銅 箔部分係更暗、造成增大明暗的差距。從而，可更加正確 - 12- 1228023 地抽取膏狀焊料，藉此進行拍攝、計測。 β 方案6係有關方案4所述之計測裝置，其特徵在於’上 述基板爲印刷基板；上述計測對象爲設置於印刷基板的銅 箔上的膏狀焊料；上述計測對象抽取機構係爲’將可同時 進行在上述印刷基板上以紅色或是以其爲基準之波長帶域 的小入射角之光照射、以及藍色或是以其爲基準之波長帶 域的大入射角之光照射的抽取用照射機構之光’照射在上 述印刷基板，基於以上述拍攝機構拍攝而得之影像資料來 抽取上述膏狀焊料之區域。 φ 按照方案6，對設置於印刷基板之銅箔上的膏狀焊料進 行計測。在此，藉由抽取用照射機構而在印刷基板上同時 進行紅色或以其爲基準之波長帶域的小入射角中之光照 射、以及藍色或以其爲基準之波長帶域的大入射角中之光 照射，在計測對象抽取機構中，將其照射面依據以拍攝機 構所拍攝而得之影像資料，抽取膏狀焊料的區域。通常， 在印刷基板中，銅箔具有紅色系統的顏色，膏狀焊料具有 藍色系統的顏色。因此，紅色系統之光爲由膏狀焊料部分 鲁 開始變暗而不反射，藍色系統之光爲由銅箔部分開始變暗 而不反射。藉此，作爲藍色圖像，銅箔部分更加變暗，作 爲紅色圖像，膏狀焊料更加變暗，如此，造成各個顏色圖 像均增大明暗的差距。從而，可更加正確地抽取膏狀焊料 而進行拍攝、計測。 方案7係有關方案4所述的計測裝置，其特徵在於，上 述偏移量計測機構係爲，將來自補償用照射機構而對於上 -13- 1228023 述基板面傾斜照射之規定之光，基於以上述拍攝裝置所拍 攝而得的影像資料，按照三角測量的原理而對基準高度之 偏移量進行運算。 ^ 按照方案7，在偏移量計測機構中，來自補償用照射機 構而對於基板面傾斜照射之規定之光，爲基於以拍攝機構 所拍攝而得的影像資料，按照三角測量的原理而對基準高 度的偏移量進行運算。因此，不會導致結構的複雜化，而 可藉由較簡單之構造來測定偏移量。 方案8係有關方案7所述之計測裝置，其特徵在於，由 φ 上述補償用照射機構所照射之規定之光係爲線光。 依據方案8，由補償用照射機構所照射之規定之光係爲 線光，因此，較容易掌握來自基準高度之偏移量。 方案9係有關方案4所述之計測裝置，其特徵在於，上 述偏移量計測機構係爲，將來自補償用照射機構而對於上 述基板面傾斜照射之規定的線光，依據以上述拍攝機構所 拍攝而得之影像資料，按照三角測量的原理而對基準高度 之偏移量進行運算，其中，上述規定的線光係爲其波長帶 鲁 域不同於在以上述計測對象抽取機構而抽取計測對象時所 照射之光的波長帶域之光。 按照方案9，由於由補償用照射機構對基板面傾斜地照 射規定的線光，係爲其波長帶域與在以計測對象抽取機構 所抽取計測對象時照射之光的波長帶域爲不同之光，因 此，即使同時照射規定的線光與抽取計測對象時的光之情 況下，拍攝機構若是可區別如彩色照相機等之色彩的差異 -14- 1228023 時，則可較容易區別兩者。由此’在以1次的拍攝，爲可 同時進行計測對象之抽取與偏移量的運算。其結果，可更 加縮短計測時間、簡化資料。 ‘ 方案1 〇有關方案5所述的計測裝置，其特徵在，上述 偏移量計測機構係爲’將來自補償用照射機構而對於上述 基板面傾斜照射之規定的線光，依據以上述拍攝機構所拍 攝而得之影像資料，按照三角測量的原理而對基準高度之 偏移量進行運算，其中，上述規定的線光係爲不同於來自 上述抽取用照射機構的照射光，而爲綠色或以該顏色爲基 0 準之波長帶域的光。 按照方案1 〇，由補償用照射機構對基板面傾斜照射之規 定的線光爲綠色或以其爲基準之顏色的波長帶域之光，其 中，與由抽取用照射機構所照射之藍色系統、或是藍色和 紅色系統之光的波長帶域不同。由此，即使同時照射線光 與抽取計測對象時之光，若是拍攝機構仍可區別如彩色照 相機等之色彩的差異時，則可較容易地區別兩者。因此， 藉由1次的拍攝，而可同時進行計測對象的抽取和偏移量 鲁 的運算。其結果，可更加縮短計測時間，簡化資料。 方案Π係有關方案4所述之計測裝置，其特徵在於， 上述基板爲印刷基板；上述計測對象爲設置於印刷基板之 銅箔上的膏狀焊料；上述計測對象抽取機構係爲，將來自 可進行將規定的波長帶域之光照射至上述印刷基板上的抽 取用照射機構之光，照射至上述印刷基板，基於以上述拍 攝機構進行拍攝而得之影像資料來抽取膏狀焊料之區域； -15- 1228023 再者，上述偏移量計測機構係爲，將來自補償用照射機 構而對於上述基板面傾斜照射之規定的線光，依據以上述 拍攝機構所拍攝而得之影像資料，按照三角測量的原理而 對基準高度之偏移量進行運算，其中，上述規定的線光係 爲，其波長帶域不同於由上述抽取用照射機構照射之光的 波長帶域之光。 按照方案11，可藉由1次的拍攝而一倂進行計測對象的 抽取與偏移量的運算。其結果，可更加縮短計測時間，簡 化資料。 d 方案1 2係有關方案4所述的計測裝置，其特徵在於， 上述基板爲印刷基板；上述計測對象爲設置於印刷基板的 銅箔上的膏狀焊料；上述計測對象抽取機構係爲，將來自 可同時進行在上述印刷基板上之第1波長帶域的小入射角 中之光照射、以及不同於該第1波長帶域之第2波長帶域 大入射角中之光照射的抽取用照射機構之光，照射至上述 印刷基板，依據以上述拍攝裝置所拍攝而得之影像資料來 抽取上述膏狀焊料之區域； · 再者，上述偏移量計測機構係爲，將來自補償用照射裝 置而對上述基板面傾斜照射之規定的線光，依據以上述拍 攝裝置所拍攝而得之影像資料，按照三角測量的原理而運 算對於基準高度之偏移量，其中，上述規定的線光爲不同 於由上述抽取用照射機構照射之光的第1、第2波長帶域 的第3波長帶域之光。 按照方案1 2，藉由1次拍攝，爲可同時進行計測對象的 •16- 1228023 抽取與偏移量的運算。其結果，可更加縮短計測時間、簡 化資料。另外，特別是藉由將第1波長帶域和第2波長帶 域設定在適合上述銅箔或是膏狀焊料之顏色的波長帶域， ^ 而可更加明確地抽取作爲計測對象的膏狀焊料。 方案1 3係有關方案1 1所述的計測裝置，其特徵在於， 在同時照射來自上述補償用照射機構的規定之光、以及來 自上述抽取用照射機構之光後，藉由上述拍攝機構進行拍 攝。 按照1 3方案，由於可在同時照射來自補償用照射機構 · 的規定之光、以及來自抽取用照射機構之光後，實際以拍 攝機構進行拍攝，因此爲更加確實地實現上述作用效果。 方案1 4係有關一種計測裝置，該計測裝置包括： 計測用照射機構，爲對設置於基板上的計測對象可照射 規定之光； 補償用照射機構，爲可對上述基板面傾斜地照射不同於 上述計測用照射機構之光的規定之波長帶域的圖型光； 拍攝機構，爲在多數之各個拍攝區域中分別可拍攝使光 鲁 同時照射上述規定之光以及圖型光的計測對象； 計測機構，爲依據以上述拍攝機構所拍攝之規定之光的 影像資料，至少進行有關上述計測對象之二維計測和三維 計測中之任一方； 偏移量運算機構’爲依據以上述拍攝機構所拍攝而得之 上述圖型光的影像資料’運算對於基準高度的偏移量。 按照方案1 4所述的方案’對設置於基板上之計測對象’ -17- 1228023 爲照射來自計測用照射機構之規定之光。另外，由補償用 照射機構爲對於基板面傾斜地照射不同於計測用照射機構 之光的規定之波長帶域的圖型光。並且，同時照射規定之 光和圖型光的計測對象係藉由拍攝機構，分別在多個拍攝 區域中進行拍攝。接著，依據以拍攝機構所拍攝之規定之 光的影像資料，在計測機構中爲進行有關於計測對象之二 維計測和三維計測中之至少一方。另外，依據以拍攝機構 所拍攝而得之上述圖型光的影像資料，藉由偏移量運算機 構而演算對於基準高度之偏移量。由此，可在不導致結構 k 複雜、且藉由較簡單之結構來測定偏移量。另外，係可反 應該偏移量而進行計測。再者，在本方案中，以同時照射 來自補償用照射機構之圖型光與來自計測用照射機構之 光，而實際地藉由拍攝機構來進行拍攝。因此，相對於在 過去不得不在進行多次的拍攝後才可進行計測與偏移量之 運算的情況，可進行以1次拍攝而計測已加上偏移量的計 測。其結果，可更加縮短計測時間。另外，由於規定之光 與光圖案之波長帶域分別相異，故可容易區別兩者，難以 · 在偏移量運算和計測中造成妨礙。 方案1 5係有關一種計測裝置，爲包括： 計測用照射機構，爲對設置於基板上的計測對象可照射 規定之光； 拍攝機構，爲在多個拍攝區域中’可拍攝以上述規定之 光所照射的計測對象； 計測機構，爲至少依據以上述拍攝機構所拍攝之影像資 -18- 1228023 料，進行有關上述計測對象之二維計測和三維計測中之至 少一方； 其特徵在於：該計測裝置設置有： 偏移量運算機構，爲在各個拍攝區域中之上述拍攝以及 計測之前，在規定的拍攝區域中，由可照射規定之波長帶 域之圖型光的補償用照射機構，將其圖型光對於上述基板 面傾斜地照射，將其照射面依據以上述拍攝機構所拍攝而 得之影像資料，運算對於基準高度之偏移量； 計測對象抽取機構，爲在上述各個拍攝區域中之上述拍 攝以及計測之前，將來自可在基板上進行照射與上述規定 之波長帶域不同之波長帶域之光照射的抽取用照射機構之 光，照射在上述基板，依據以上述拍攝機構所拍攝而得之 影像資料來抽取上述計測對象之區域； 在同時照射來自上述補償用照射機構之圖型光、以及來 自上述抽取用照射機構之光後，以上述拍攝機構進行拍 攝。 按照方案1 5，藉由抽取用照射機構而在基板上進行光照 射，在計測對象抽取機構中，其照射面爲依據以拍攝機構 所拍攝而得之影像資料而抽取計測對象之區域。從而，可 更加正確地抽取計測對象以進行拍攝、計測。另外，在偏 移量計測機構中，由補償用照射機構對基板面傾斜地照射 規定之波長帶域的圖型光，其照射面爲依據以拍攝機構所 拍攝而得之影像資料，運算對於基準高度之偏移量。因此， 可在導致結構複雜、且以較簡單之構造來測定偏移量。另 1228023 外，係可反應其偏移量來進行計測。再者，於本方案中， 爲同時照射來自補償用照射機構之圖型光、以及來自抽取 < 用照射機構之光，而實際地藉由拍攝機構來進行拍攝。因 此，相對於在過去若不進行抽取及偏移量之運算便無法獲 得之情況下，可藉由1次之拍攝來進行計測對象區域之抽 取和偏移量的運算，其結果，可更加縮短計測時間、簡化 資料。另外，由於各光之波長帶域分別不同，故不對抽取、 運算造成妨礙。 方案1 6係有關一種計測裝置，爲包括： 。 計測用照射機構，爲對於設置在印刷基板之銅箔上的膏 狀焊料可照射規定之光； 拍攝機構，爲分別在多個拍攝區域中，可拍攝上述規定 之光照射的計測對象； 計測機構，爲至少依據以上述拍攝機構所拍攝之影像資 料，進行有關上述計測對象之二維計測和三維計測中之至 少一方·， 其特徵在於：該計測裝置設置有： · 偏移量運算機構，爲在各個拍攝區域中之上述拍攝以及 計測之前，在規定的拍攝區域中，由可照射規定之波長帶 域之圖型光的補償用照射機構，將該圖型光對於上述印刷 基板面傾斜照射，將其照射面基於以上述拍攝機構所拍攝 而得之影像資料，按照三角測量的原理而運算對於基準高 度之偏移量； 計測對象抽取機構，爲在各個拍攝區域中之上述拍攝以 -20- 1228023 及計測之前，將來自可在上述印刷基板上進行與上述規定 之波長帶域不同的波長帶域之光照射的抽取用照射機構之 光，照射在上述印刷基板上，依據以上述拍攝機構所拍攝 而得之影像資料而抽取上述膏狀焊料之區域； 以同時照射來自上述補償用照射機構之圖型光、以及來 自上述抽取用照射機構之光後，藉由上述拍攝機構進行拍 攝。 按照該方案1 6，藉由抽取用照射機構而在印刷基板上進 行光照射，在計測對象抽取機構中，其照射面爲依據以拍 匕 攝機構所拍攝而得之影像資料來抽取膏狀焊料之區域。從 而’可更加正確地抽取膏狀焊料，以進行拍攝、計測。另 外’在偏移量計測機構中，爲由補償用照射機構對基板面 而傾斜地照射規定之波長帶域的圖型光，其照射面爲依據 以拍攝機構所拍攝而得的影像資料，按照三角測量的原 理’演算對於基準高度之偏移量。由此，將不會導致構造 之複雜化而可藉由較簡單的結構來測定偏移量。另外，可 反應該偏移量以進行計測。再者，於本方案中，同時照射 鲁 來自補償用照射機構之圖型光、以及來自抽取用照射機構 之光’而實際地藉由拍攝機構進行拍攝。因此，相對於在 過去若不進行多次之拍攝便無法進行抽取及偏移量之運算 便無法獲得之情況下，可藉由1次之拍攝來進行計測對象 區域之抽取和偏移量的運算，其結果，可更加縮短計測時 間、簡化資料。另外，由於各光之波長帶域分別不同，故 不對抽取、運算造成妨礙。 -21 - 1228023 方案1 7係有關一種計測裝置，包括： 計測用照射機構，爲對於設置在印刷基板之銅箔上的膏 狀焊料可照射規定之光； 拍攝機構，爲分別在多個拍攝區域中，可拍攝上述規定 之光照射的計測對象； 計測機構，爲至少依據以上述拍攝機構所拍攝之影像資 料，進行有關上述計測對象之二維計測和三維計測中之至 少一方； 其特徵在於：該計測裝置設置有： 偏移量運算機構，爲在各個拍攝區域中之上述拍攝以及 計測之前，在規定的拍攝區域中，將第3波長帶域之圖型 光由可照射之補償用照射裝置，將該圖型光對於上述印刷 基板面傾斜照射，將其照射面依據以上述拍攝機構所拍攝 而得之影像資料，按照三角測量的原理而演算對於基準高 度之偏移量； 計測對象抽取機構，爲在上述各個拍攝區域中之上述拍 攝以及計測之前，將來自可同時進行在上述印刷基板上之 與上述第3波長帶區域不同之第1波長帶域的小入射角中 之光照射、以及與上述第3以及第1波長帶域不同之第2 波長帶域的大入射角中之光照射的抽取用照射機構之光， 照射在上述印刷基板，依據以上述拍攝機構所拍攝而得之 影像資料而抽取上述膏狀焊料之區域； 同時照射來自上述補償用照射機構之圖型光、以及來自 上述抽取用照射機構之光，藉由上述拍攝機構進行拍攝。 -22· 1228023 按照方案1 7，藉由抽取用照射機構，爲在印刷基板上同 Λ 時進行第1波長帶域中之小入射角之光照射、以及第2波 囑 長帶域之大入射角之光照射，在計測對象抽取機構中，其 照射面爲依據以拍攝機構所拍攝而得之影像資料來抽取膏 狀焊料之區域。一般，由於呈現與印刷基板上的銅箔與膏 狀焊料不同的顏色，故藉由使各波長帶域配合適當的色 彩，而可明確地抽取膏狀焊料部分。從而，可更加正確地 抽取膏狀焊料，以進行拍攝、計測。另外，在偏移量計測 機構中，爲由補償用照射機構對於基板面而傾斜地照射圖 U 型光，其照射面爲依據以拍攝裝置所拍攝而得之影像資 料’按照三角測量的原理而運匱對於基準高度之偏移量。 由此，係不會導致構造之複雜畫、而可藉由較簡單支構造 來測定偏移量。另外，爲可反應該偏移量以進行計測。再 者’在本方案中，爲同時照射來自補償用照射機構之圖型 光 '以及來自抽取用照射機構之光，而實際地藉由拍攝機 構進行拍攝。因此，可藉由1次拍攝而進行膏狀焊料之抽 取和偏移量之運算。其結果，可更加縮短計測資料、簡化 0 資料。另外，由於各光之波長帶域分別不同，故不對抽取、 運算造成妨礙。 方案1 8係有關一種計測裝置，包括： 計*測用照射機構，爲對於設置在印刷基板之銅箔上的膏 狀焊料可照射規定之光； 拍攝機構，爲分別在多個拍攝區域中，可拍攝上述規定 之光照射的計測對象； -23- 1228023 S十測機構，爲至少依據以 料，進行有關上述計測對象 少一方； 其特徵在於：該計測裝置 偏移量運算機構，爲在各 計測之前，在規定的拍攝區 爲基準之圖型光的補償用照 印刷基板面傾斜照射，將其 拍攝而得之影像資料，按照 度之偏移量進行運算； 計測對象抽取機構，爲在 攝以及計測之前，將來自可 紅色或是以其爲基準之波長 以及藍色或是以其爲基準支 射的抽取用照射裝置之光， 上述拍攝機構所拍攝而得之 之區域；同時照射來自上述 及來自上述抽取用照射機構 行拍攝。 按照方案1 8，藉由抽取用 進行紅色或以其爲基準之赶 射、以及藍色或以其爲基準 照射，在計測對象拍攝機構 置所拍攝而得之影像資料來 上述拍攝機構所拍攝之影像資 之二維計測和三維計測中之至 設置有： 個拍攝區域中之上述拍攝以及 域中，由可照射綠色或是以其 射裝置，將該圖型光對於上述 照射面依據以上述拍攝機構所 三角測量的原理而對於基準高 上述各個拍攝區域中之前述拍 同時進行在上述印刷基板上之 帶域的小入射角中之光照射、 波長區域之大射入角中之光照 照射在上述印刷基板，依據以 影像資料來抽取上述膏狀焊料 補償用照射機構之圖型光、以 之光，以藉由上述拍攝機構進 照射機構，在印刷基板上同時 乏長帶域的小入射角中之光照 之波長帶域的大入射角中之光 中’將其照射面依據以拍攝裝 抽取霄狀焊料之區域。一般， -24- 1228023 在印刷基板上，銅箔爲具有紅色系統之顏色，膏狀焊料具 具有藍色系統之顏色。因此，紅色系統之光係由膏狀焊料 開始變暗而不反射，藍色系統之光係由銅箔部分開始變暗 _ 而不反射。藉此，由於作爲藍色圖像，銅箔部分更暗，作 爲紅色圖像，膏狀焊料部分更暗，故各個顏色圖像均爲增 大明暗的差異。從而，可更加正確地抽取膏狀焊料，以進 行拍攝、計測。另外，在偏移量計測機構中，爲由補償用 照射裝置對於基板面傾斜照射圖型光，將其照射依據以拍 攝機構所拍攝而得之影樣資料，按照三角測量的原理，對 · 於基準高度之偏移量進行運算。因此，不會導致構造複雜 畫，而可藉由較簡單支構造來測定偏移量。另外，可反應 該偏移量進行計測。再者，在本方案中，同時照射來自補 償用照射機構之圖型光、以及來自抽取用照射機構之紅色 系統和藍色系統的光，以實際地藉由拍攝機構進行拍攝。 因此，可藉由1次拍攝來進行膏狀焊料區域之抽取和偏移 量的運算，其結果，可更加縮短計測時間、簡化資料。另 外，由於各光之波長帶域分別不同，故不對抽取或運算造 · 成妨礙。 方案1 9係有關方案1 4至1 8中任一項所述之計測裝置， 其特徵在於，依據上述偏移量運算機構之運算結果，調整 上述基板和上述拍攝機構間之相對高度關係的方式所構 成。 按照方案1 9，由於可實際地調整相對高度關係中之計 測，故可確保更加正確的計測。 -25- 1228023 方案2 0係有關1 4至1 8中任一項所述的計測裝置，其 特徵在於，由上述補償用照射機構照射之圖型光係爲線 光。 按照方案20，較容易掌握相對基準高度的偏移量。 此外，在上述各方案中，以計測機構所達成之計測亦可 在拍攝區域之轉移時進行。在此場合下，沒有等待計測完 畢將拍攝區域轉移的情況。因此，可進行有效的計測，可 縮短總和性的計測時間。 此外，也可由下述檢查裝置具體實現，其具有設置有上 · 述各方案中描述的計測裝置，依據上述計測機構的計測結 果而進行有關上述計測對象是否良好之判斷所構成的檢查 裝置。藉此，對應於上述各方案之作用效果爲在進行是否 良好之檢查時實現。 【實施方式】 下面參照附圖，對一實施例進行描述。 第1圖爲以不意方式表示在本實施例中作爲計測裝置之 三維計測裝置1的槪略構成圖。另外，在本實施例中，三 ® 維計測裝置1是由印刷狀態檢查裝置具體實現的，該印刷 狀態檢查裝置係用以檢查印刷於印刷基板Κ(之銅箔）上的 膏狀焊料（主要構成計測對象）的印刷狀態。 該三維計測裝置1具有基座2，並且在該基座2上設置 有X軸移動機構3和Υ軸移動機構4。在Υ轉移動機構4 上，設置有導軌10，在該導軌10上爲載置有作爲基板之 印刷基板Κ。並且，以作動X軸移動機構3和Υ軸移動機 •26- 1228023 構4而使印刷基板K可沿χ軸方向和γ軸方向移動。該等 X軸移動機構3和Υ軸移動機構4係構成X γ軸向移動機 構。 三維計測裝置1又具備有作爲計測用照射機構之三維計 測用照射機構5、作爲攝像機構的CCD照相機（彩色照相 機）6、與該C C D照相機6電性連接的主控制機構7。三維 計測用照射機構5係被構成爲由斜上方將規定之光圖型對 於印刷基板Κ之表面照射。CCD照相機6係被配設於印刷 基板Κ之正上方，形成爲可拍攝印刷基板κ上之上述光圖 案所照射的部分。另外，在主控制機構7中，藉由規定的 三維計測方法’依據以上述CCD照相機6所拍攝之影像資 料來進行圖像處理，而形成進行膏狀焊料之三維計測（主要 爲高度計測）以及膏狀焊料之印刷狀態的檢查。亦即，主控 制機構7具有依據膏狀焊料之高度（體積）而檢查印刷狀態 的檢查機構8 (參照弟4圖）。另外，在本貫施例中之三維計 測時’適合採用相位偏移法、光切斷法、空間代碼法、聚 焦法等任意的計測方法。 在本實施例中，上述C C D照相機6係被安裝於ζ軸移 動機構9。亦即，藉由使Ζ軸移動機構9驅動，而可將CCD 照相機6沿上下方向移動。藉此，形成爲可變更印刷基板 Κ與CCD照相機6間之相對高度的關係。 另外，在本實施例中之三維計測裝置1，爲具有在上述3 維計測時（之前），用以抽取設置有膏狀焊料所形成之區域 的機構（計測對象抽取機構）。該機構包括焊料抽取用照射 -27- 1228023 機構1 1。焊料抽取用照射機構〗1係爲，在藉由三維計測 用照射機構5之光圖案的照射之前，而對於印刷基板κ照 射規定之光。更加詳細說明係爲，焊料抽取用照射機構1 1 係如第2圖所示，具有上下一對的環狀燈1 2，1 3。 上部的環狀燈1 2係形成爲可藉由小入射角來進行光照 射，並且構成爲可照射紅色之光。底部的環狀燈1 3係形成 爲可藉由大入射角來進行光照射，同時構成爲可照射藍色 之光。通常，在印刷基板K中，爲使紅色系統之銅箔設在 基板K上，而在其上印刷藍色系統的膏狀焊料，故紅色光 係由膏狀焊料部分開始變暗而不反射，藍色光係由銅箔部 分開始變暗而不反射。藉此，作爲藍色圖像之銅箔部分爲 更暗，作爲紅色圖像之膏狀焊料部分爲更暗，如此，各色 影像圖像均形成明暗的反差增加。在此，於本實施例中， 爲在三維計測爲進行作爲計測對象之膏狀焊料的區域抽取 之前，藉由兩個環狀燈1 2，1 3而照射紅色藍色之光，以 C CD照相機6拍攝照射面，在主控制機構7中，爲形成進 行指定（抽取）膏狀焊料之設置區域的作業。 另外，在本實施例中之三維計測裝置1，係具有在上述 三維計測時（之前），用以補償印刷基板K之翹曲的機構。 在該機構中爲包括Ζ軸補償用照射機構1 4。該ζ軸補償用 照射機構1 4係爲，在藉由上述三維計測用照射機構5所達 成之光圖案的照射之前，進行以上述焊料抽取用照射機構 1 1所進行之光的照射，並且對於印刷基板κ ’爲照射作爲 規定之圖型光的線光。更詳細說明係爲’ ζ軸補償用照射 -28- 1228023 機構1 4係形成爲可照射與環狀燈1 2、1 3不同波長帶域的 圖型光（在本實施例中，爲綠色的線光）。 以Z軸補償用照射機構1 4所達成之綠色的線光之照射 係爲，用以掌握起因於印刷基板K之翹曲之來自基準高度 的「高度偏移量」。亦即，如第3圖所示，以Z軸補償用照 射機構1 4照射線光，當以CCD照相機6拍攝該光之情況 下，在某個拍攝區域具有如圖所示之印刷基板K的高度位 置不同時，則以CCD照相機6所拍攝之線光的位置係形成 爲在左右方向上之不同。在本實施例中，於主控制機構7 中，依據上述線光的位置，按照三角測量的原理，運算印 刷基板K之高度偏移量。亦即，主控制機構7係具備有作 爲運算印刷基板K之高度偏移量之偏移量計測機構的Z軸 偏移量運算機構1 5 (參照第4圖）。 其次，針對將主控制機構7爲中心之三維計測裝置1的 電氣構造進行說明。 如第4圖所示，CCD照相機6係對於主控制機構7進行 電性連接。主控制機構7係如上所述，具備有檢查機構8 和Z軸偏移量運算機構1 5。同時，主控制機構7係具備有 作爲依據Z軸偏移量運算機構i 5之運算結果而判定「偏移 量」之適當與否之判定機構的偏移量判斷機構1 6。 主控制機構7係被連接至照射控制機構2 i。照射控制機 構2 1係被連接至上述三維計測用照射機構5、焊料抽取照 射機構1 1 (環狀燈1 2，1 3 )、Z軸補償用照射機構1 4，依據 來自上述主控制機構7的控制信號，切換控制各個照射機 •29- 1228023 構5，1 1，1 4的照射。 主控制機構7係被連接至X軸移動控制機構2 2和γ軸 移動控制機構23。該等X軸移動控制機構22和Y軸移動 控制機構2 3適當地對上述X軸移動機構3和Y軸移動機 構4進行驅動控制，以便切換各拍攝區域。藉此，可使印 刷基板κ朝向X軸方向、γ軸方向適當地移動。 另外，主控制機構7又被連接至z軸移動控制機構2 4。 該Z軸移動控制機構2 4係依據來自主控制機構7、特別是 依據來自偏移量判斷機構1 6之輸入信號，驅動控制上述Z 軸移動機構9。藉此，可調整CCD照相機6與印刷基板K 間之相對高度關係（在具有翹曲的場合，對其進行補償）。 下面以主控制機構7所進行之控制內容爲中心，說明如 上所構成之三維計測裝置1中之作用效果。 首先，在第1拍攝區域中，主控制機構7係爲，經由上 述照射控制機構2 1，照射來自焊料抽取用照射機構1 1的 兩個環狀燈1 2，1 3之光，並且照射來自Z軸補償用照射機 構1 4的線光，以便進行膏狀焊料區域的抽取和高度偏移量 之測定。然後，以CCD照相機6拍攝抽取用之照射光和線 光所照射之第1拍攝區域。此時，關於以拍攝所得之影像 資料，爲混合有來自兩個環狀燈1 2、1 3之紅色藍色的光、 以及來自Z軸補償用照射機構1 4之綠色的線光。但是，由 於各光之波長帶域分別不同，故即使在爲1個影像資料的 情況下，仍可容易地進行區別。另外，依據上述影像資料 而暫時進行膏狀焊料區域之抽取。 -30- 1228023 接著，該主控制機構7(Z軸偏移量運算機構15)爲在上 述影像資料中，依據綠色的線光而算出高度偏移量Za。例 如，在第5(a)圖中，線光係由基準高度（若無翹曲等情況， 則線光應到達該位置之位置）僅偏移有規定量額（在圖中爲 α )。在該Z軸偏移量運算機構1 5中，依據該規定的偏移 量，按照上述的三角測量的原理，算出來自基準高度之Ζ 軸方向（高度方向）的偏移量Za。 接著’主控制機構7(偏移量判斷機構1 6)係判斷上述偏 移量Za是否在預定之基準範圍內。並且，藉由該判斷結果 而進行下述之控制。 (1 )當偏移量Z a爲在預定的基準範圍內之情況。 當偏移量Z a在基準範圍內之情況下，主控制機構7係 在該第1拍攝區域中，實施有關於上述已抽取之膏狀焊料 區域的三維計測。亦即，經由照射控制機構2 1，由三維計 測用照射機構5照射規定之光圖案。並且，以c C D照相機 6拍攝所照射之光圖案。 在結束拍攝後，主控制機構7係經由X軸移動控制機構 2 2和Y軸移動控制機構2 3，驅動X軸移動機構3和γ軸 移動機構4，將拍攝區域切換到下一拍攝區域（第2拍攝區 域）的方式進行控制。 然後，在該拍攝區域之切換的途中，主控制機構7係經 由Z軸移動控制機構24而驅動ζ軸移動機構9，使cCD 如、相機6移動上述偏移量z a，補償（調整）其高度位置。藉 此，在下一個拍攝區域中，使得前次之拍攝區域的允許範 -31 - 1228023 圍內的偏移量得以補償，在大多數之情況下， 相機6與印刷基板K表面間之高度位置關係形 另外，在該拍攝區域的切換期間，主控制機 構8 )依據在上述第1拍攝區域中之抽取資料和 進行三維計測（膏狀焊料之高度計算和體積計; 狀焊料之印刷狀態是否適合的判斷。如此，藉 域之轉移間進行計測（運算），可進行有效的進 縮短總和計測時間。 (2)當偏移量Za不在預定之基準範圍內的情 另一方面，當上述偏移量Za不在基準範圍內 主控制機構7係在該第1拍攝區域中，首先， K的翹曲等現象顯著，必須快速地進行補償， 測之前，爲經由Z軸移動控制機構24以驅動 構9，使CCD照相機6僅移動上述偏移量Za、 其高度位置。藉此，在該第1拍攝區域中，快 量進行補償，使CCD照相機6與印刷基板K表 位置關係適當化，藉以沒有C C D照相機6的異 況。 在補償後，在將主控制機構7經由照射控制 射來自焊料抽取用照射機構1 1之兩個環狀燈1 並且照射來自Z軸補償用照射機構1 4的線光< CCD照相機6來拍攝抽取用之照射光和線光两 拍攝區域，再次進行膏狀焊料區域的抽取。 此外，在此時間點下，由於藉由上述補償， 爲使CCD照 i成爲適當。 構7 (檢查機 I影像資料， 算），進行膏 由在拍攝區 行計測，可 況。 之情況下， 在印刷基板 而在三維計 Z軸移動機 補償（調整） 速地對偏移 面間之高度 常等特殊情 機構21，照 2、1 3的光， ，並且，藉由 ί照射的第1 高度位置關 -32- 1228023 理應形成爲適當狀，基本上係不必再次進行確認偏移量， 但是爲求謹慎，亦可再次依據上述線光計算偏移量z a。另 外，當再次計算之偏移量Z a (反覆）脫離允許範圍之情況 下，亦可作爲產生異常而判斷爲錯誤。 但是，基本上，藉由上述補償，在該第1拍攝區域中之 高度位置關係理應形成爲適當狀，故主控制機構7接著允 許三維計測的實施。亦即，經由過照射控制機構2 1而照射 來自三維計測用照射機構5之規定之光圖案。接著，以CCD 照相機6拍攝所照射之光圖案。在結束拍攝後，主控制機 構7係經由X軸移動控制機構2 2和Y軸移動控制機構2 3， 使X軸移動機構3和Y軸移動機構4驅動，將拍攝區域切 換到下一拍攝區域（第2拍攝區域）的方式進行控制。 然後，在該拍攝區域切換時，主控制機構7係爲使Z軸 移動機構9驅動（未補償C C D照相機6之高度位置）而切換 拍攝區域。此係由於在上述第1拍攝區域中已結束補償之 故。 在上述拍攝區域的切換期間，主控制機構7(檢查機構8) 係依據在上述第1拍攝區域中之再次抽取資料和影像資 料’進fj二維計測（霄狀焊料的局度計算和體積計算），判 斷骨狀焊料的印刷狀態是否適合。如此，藉由進行在拍攝 區域之轉移期間進行計測（運算），可進行有效率的計測， 可縮短總和計測時間。 在本實施例中，藉由主控制機構7而分別在各個拍攝區 域中反覆實施上述作業，另外，結束於全部的拍攝區域中 -33- 1228023 之檢查的時間點下，結束三維計測和檢查。 如上詳述’在本實施例中，在各個拍攝區域中之三維計 測之前’測定對於預定之基準高度位置的高度方向之偏移 量Za，在判斷該偏移量Za在允許範圍內之情況下，保持 印刷基板K與CCD照相機6間之相對高度關係，進行在該 拍攝區域之拍攝。然後，在轉移到下一拍攝區域時，藉由 控制Z軸移動機構9而僅以上述偏移量Za來補償高度位置 關係9。 例如，如第5(a)圖所示，在檢查區域（拍攝區域）a中， 由基準高度之偏移量Za係設成在允許範圍內的α。在此情 況下，於該檢查區域Α中，係未補償C C D照相機6之高度 而進丫了二維5十測用的拍攝。並且’當轉移到下一^檢查區域 B時，爲進行運算、檢查的同時，僅以上述之α量額來補 償C C D照相機6之高度。並且，在下一檢查區域Β中爲進 行同樣的處理。在轉移到檢查區域Β時，由於補償c C D照 相機6之高度位置，故而在大多數之情況下，由基準高度 位置之偏移量較少。 由此，相較於逐一在各個拍攝區域中分別調整相對高度 關係之情況，爲確保有關於計測之高速性。 此外，當判定偏移量z a不在允許範圍內之情況下，以 即刻控制Z軸移動機構9而僅以上述偏移量Z a之量額來補 償高度位置關係。在其上，進行該拍攝區域中之拍攝和計 測。 例如，如第5(b)圖所示’在檢查區域A中，由基準高度 -34 - 1228023 於如 度而 域B CCD 行同 的高 情況 照相 高低 即刻 中， 補償 先保 係爲 時， 和計 確的 之偏移量z a係被設在允許範圍內之α。在此情況下， 上述之該檢查區域Α中，將不補償CCD照相機6之高 進行三維計測用的拍攝。並且，當轉移到下一檢查區 時，進行運算、檢查，並且僅以上述α之量額來補償 照相機6之高度。並且，在下一檢查區域Β中，爲進 樣的處理。此時，在該檢查區域Β中，如果具有急劇 低差時，則有偏移量Za脫離允許範圍之情況。在此 下，於本實施例中，係爲在該檢查區域B中補償c C D 機6之高度位置。 從而，即使在於規定之拍攝區域中存在有急劇的 差，卻由於在此處快速地進行相對高度之補償，故可 反應高低差量以進行計測。其結果，在各個拍攝區域 爲可在對焦之狀態下進行正確的計測。 另外，如第5(b)圖所示，在檢查區域B已進行大幅 之情況下，在切換至下一檢查區域（拍攝區域）時，首 持該已補償之相對高度關係。換言之，在切換的途中 補償高度位置。從而，若在下一檢查區域無須進行補償 則將進一步地確保計測的高速性。 此外，在本實施例中，伴隨在各檢查區域的拍攝 測，抽取計測對象。由此，可對計測對象進行更加正 計測。 並且，由於該抽取用之照射光與用於計算偏移量Za之 線光的波長帶域不同’故即使同時照射抽取用的照射光和 線光，若CCD照相機6可區分顏色的差異時，則可較容易 1228023 地區分兩者。因此，藉由一次拍攝，可同時進行膏狀焊料 ， 的抽取與偏移量z a的計算。其結果，可更加縮短計測時 間、削減資料量。 同時，在本實施例中，可在拍攝區域轉移時進行膏狀焊 料的局度計算和檢查。即，不會有等待計測結束，將拍攝 區域轉移的情況。因此，可進行有效的計測，可縮短總和 計測時間。 另外，也可不限於上述實施例的記載內容，也可例如如 同下述之實施例。 φ (a) 在上述實施例中’係以膏狀焊料爲主、而將進行高度 I十測（二維計測）之場合具體化，但是，亦可例如進行膏狀 焊料的面積計測等的二維計測。在此情況下，還可兼用膏 狀焊料之抽取和二維計測。換言之，也可省略抽取作業， 同時進行偏移量運算用之照射與計測用之照射，然後，進 行拍攝，依據該影像資料，進行偏移量的運算，對其進行 反應並進行計測。 (b) 作爲拍攝機構，除了如上述實施例之可拍攝區域的 鲁 C C D照相機以外’亦可爲線式照相機。另外，還可爲例如， C Μ Ο S照相機等、可呈區域狀或線狀進行拍攝的照相機， 而不必限於C C D照相機。 (c) 在上述實施例中’抽取膏狀焊料區域，然後，進行三 維計測，但是，也可省略相關的抽取機構。 (d) 構成各照射機構5、1 1、1 4的光源既可爲鹵素燈，亦 可爲LED。另外，還可採用可照射雷射的照射機構。 -36- 1228023 (Ο在上述實施例中，採用在印刷基板κ沿χγ軸方向， C CD照相機6沿ζ軸方向分別移動的方案，但是兩者也可 相對移動，例如，印刷基板Κ可沿上下移動，CCD照相機 6可沿ΧΥ軸方向移動。 (Ό在上述實施例中，是通過用於檢查膏狀焊料的印刷狀 態的檢查裝置而具體化。相對於此，如上述之方案亦可具 體化有關於基板之製造等的其他裝置。例如，也可由用於 檢查安裝於基板上的電子構件的安裝狀態、缺陷等的有無 的檢查裝置來實現。 _ (g) 在上述實施例中，由Z軸補償用照射機構1 4照射綠 色的線光，但是，如果爲與用於抽取的照射光不同的波長 帶域，則不必限於綠色，例如，亦可爲可照射紅外線、紫 外線的方案。另外，如果爲獨立於用於抽取用的照射光而 進行拍攝，則也可照射與抽取用的光相同的波長帶域的 光。 (h) 在上述實施例中，由Z軸補償用照射機構1 4照射線 光，但是，該線光既可爲一道，亦可爲多道。在爲多道線 · 光之情況下，亦可分別保持平行、亦可具有（如相互交叉狀） 規定的角度（例如，亦可垂直）。另外，線光之寬度係分別 爲可超過拍攝區域的寬度、也可足夠地短於該寬度，例如 爲點。但是，如果爲覆蓋檢查區域的寬度，則可更加確實 地包括例如銅箔部等能夠穩定地計測高度偏移量的部分。 【圖式簡單說明】 第1圖爲以示意方式表示一個實施例的計測裝置的槪略 -37-1228023 发明 Description of the invention: [Technical field to which the invention belongs] The present invention relates to a measuring device such as a substrate, and more specifically, the present invention relates to a measuring device for measuring a measuring object such as a paste solder provided on a printed substrate. . [Prior Art] In the manufacturing process of a printed circuit board, a person who has a main program is a program having an electronic component mounted on the substrate. When mounting an electronic component, first, a solder paste is printed on a predetermined electrode pattern provided on a printed circuit board. Next, the electronic component is temporarily fixed to the printed circuit board based on the viscosity of the paste solder. Then, the printed circuit board is sent to a reflow furnace, and a prescribed reflow process is performed to perform soldering. In the early stage of feeding to the reflow furnace, it is necessary to check the printing state of the paste solder. During the above inspection, a three-dimensional measuring device is used. In recent years, various so-called non-contact three-dimensional measuring devices using light have been proposed. As a method used in the measurement, for example, a phase shift method, a light-cutting method, a space code method, a focusing method, etc. \ But ' During three-dimensional measurement, the measurement is performed in a state where the substrate is warped, and the positional relationship of the solder or the like changes, which hinders accurate measurement. Therefore, it is necessary to perform measurement after correcting (compensating) the warpage of the substrate. In the past, in order to correct such warpage, in the state of supporting and fixing the end portion of the substrate provided in a horizontal state, the upward push pin is pressed against the bottom surface of the substrate from above and lifted, thereby, the substrate is lifted. The warpage is corrected, but 'this physical correction may not be able to correctly correct the substrate 1228023 to a flat state. In addition, there is a mechanism that must be required for correction, and "« T "may complicate the device and increase the overall size. On the other hand, there is a technology that compensates the amount of warpage during measurement by moving the sensor head in the Z-axis (height) direction (for example, refer to Patent Document 1). In this technology, by scanning the sensor head against the printed substrate and scanning in the X γ axis direction, height data is obtained. 'When the average of the height data is within a set range, the next time the scanning of the sensor head is not performed, The height control of the Z-axis moving mechanism performs scanning control in a state where the distance between the printed substrate and the sensor head is constant. On the other hand, when the average of the height data is outside the setting range 0, the height control of the Z-axis moving mechanism is performed in the next scan by the sensor head. Patent Document 1: Japanese Patent Laid-Open No. 200 1-56425. SUMMARY OF THE INVENTION However, in the above technique, if there is a sharp step difference (for example, a step or the like) on the surface of the substrate ', the step difference may not be appropriately reflected next time. In addition, in the case of the first measurement, there is a case where the difference in height is described. If it is compensated in a reduced manner, there is a danger that it will not respond appropriately in the next δ ten measurement. In addition, when the measurement is performed at the last time, when there is a sharp level difference, etc., it is in the final state, and there is a disadvantage that the level difference cannot be appropriately reflected. In this case, there is a risk that measurement is performed without focusing. As a result, there is a risk that it will prevent accurate measurement. In addition, the above-mentioned disadvantages occur not only in the three-dimensional measurement that must include the height measurement but also in the two-dimensional measurement. 1228023 The present invention is made in view of the above-mentioned circumstances, and a main object of the present invention is to provide a measuring device that can perform more accurate even if the substrate is warped or the like without physical correction. Measurement. The following describes the characteristic schemes that can achieve the above purpose. In addition, for each scheme, the function and effect of the feature will be described as needed. Solution 1 relates to a measurement device including: a measurement irradiation mechanism for irradiating a predetermined light on a measurement object provided on a substrate; and a photographing mechanism for photographing in a plurality of shooting areas with the predetermined light The measurement object that is illuminated by Xin; the measurement mechanism is based on at least two-dimensional or three-dimensional measurement of the measurement object based on the image data captured by the above-mentioned shooting mechanism; it is characterized in that: a moving mechanism is provided to adjust the above The relative height relationship between the substrate and the above-mentioned imaging mechanism; the offset measuring mechanism measures the height direction deviation from a predetermined reference height position in a predetermined imaging area before the above-mentioned imaging and measurement in each imaging area The judging mechanism is for judging whether the offset in the height direction measured by the above-mentioned offset measuring mechanism is within a predetermined allowable range; and the structure is as follows: the judging mechanism determines that the offset is within the predetermined allowable range; Within the range, the state of the relative height relationship between the substrate and the imaging mechanism is maintained. State, to perform the shooting for the measurement of the predetermined shooting area, when moving to the next shooting area, control the control mechanism to compensate the relative height relationship only by the offset; 1228023 determine the deviation by the judgment mechanism When the shift amount is not within the allowable range, the relative height relationship is compensated only by the shift amount to control the moving mechanism, and then, the shooting for the measurement is performed in the predetermined shooting area. According to the above-mentioned scheme 1, the measurement object provided on the substrate is irradiated with a predetermined light by the measurement irradiation mechanism, and the measurement object that has irradiated the predetermined light is imaged in each of the plurality of imaging regions by the imaging mechanism. In addition, based on at least the image data captured by the imaging mechanism, the measurement mechanism performs two-dimensional or three-dimensional measurement on the measurement object. In addition, in the offset amount measuring mechanism, before the above-mentioned shooting and measurement in each shooting area, the amount of deviation in the local direction is measured for a predetermined reference height position in a predetermined shooting area. The judging mechanism is for judging whether the amount of deviation in the height direction measured by the deviation measuring unit is within a predetermined allowable range. When the judging means determines that the offset is within a predetermined allowable range, the measurement is performed in the predetermined imaging area while maintaining the relative relationship between the substrate and the imaging means. Then, when moving to the next shooting area, the relative height relationship between the substrate and the shooting mechanism is compensated only by the above-mentioned offset by controlling the moving mechanism. Therefore, compared with the case where the relative height relationship is adjusted in each shooting area one by one, the high-speed measurement is ensured. In addition, when it is determined by the judging mechanism that the above-mentioned offset is not within the allowable range, the relative height relationship is compensated only by the above-mentioned offset by controlling the moving mechanism, and then the measurement in the prescribed shooting area is performed. Shoot. Therefore, even in the case where there is a sharp height difference (such as a step, etc.) 1228023 in a predetermined shooting area, the relative height relationship can be quickly compensated at that time. * The height difference can be immediately reflected and measured. . As a result, the measurement can be performed accurately for each shooting area while focusing. In addition, it is also possible to use the following scheme, "In the case where the above-mentioned determination mechanism determines that the offset is not within the allowable range, in order to control the moving mechanism, only the above-mentioned offset is used to compensate the relative height relationship, Then, the above-mentioned offset measuring mechanism is used to measure the offset, and at the same time, the above-mentioned judging mechanism is used to judge whether the offset is within a predetermined allowable range, and if it is within the allowable range, perform the above in the prescribed shooting area. In addition, it is also possible to adopt the following scheme, that is, "if the above-mentioned judging mechanism determines that the shift amount is not within the allowable range, control the moving mechanism and use the shift amount to To compensate the relative height relationship, the offset is measured by the above-mentioned offset measurement mechanism, and at the same time, the above-mentioned determination mechanism is used to determine whether the offset is within a predetermined allowable range, and when it is judged that it is not within a predetermined number of allowable ranges. Then it is a judgment error. " Solution 2 relates to a measuring device including: a measuring irradiation mechanism for irradiating a predetermined light on a measurement object provided on a substrate; and a camera mechanism for shooting in a plurality of shooting areas in accordance with the above-mentioned regulations. The measurement object irradiated by the light; the measurement mechanism performs two-dimensional or three-dimensional measurement on the measurement object based on at least the image data captured by the shooting mechanism; it is characterized by being provided with: a movement mechanism in the Z-axis direction, In order to adjust the relative height relationship between the above substrate and the above-mentioned shooting mechanism; 1228023 χγ axis direction moving mechanism is to adjust the relative positional relationship between the above substrate and the shooting mechanism that should switch the shooting area; the offset measuring mechanism is in the Before the above-mentioned shooting and measurement of each shooting area, in each shooting area, the offset in the height direction with respect to a predetermined reference height position is measured; the judging mechanism is for judging the height measured by the above-mentioned offset measuring mechanism Whether the direction deviation is within a predetermined allowable range; the control mechanism is to be in the first shooting area When the determination unit determines that the shift amount is within the allowable range, the relative height relationship between the substrate and the imaging mechanism is maintained, and measurement shooting in the first imaging region is allowed. When the above-mentioned X-axis direction moving mechanism is controlled to switch the shooting area to the second shooting area, the Z-axis direction moving mechanism is controlled, and only the above-mentioned offset is used to compensate the relative height relationship; in the first shooting area, when borrowing When the judging means determines that the shift amount is not within the allowable range, the z-axis direction moving mechanism is controlled, and the relative height relationship is compensated only by the shift amount. Then, ^ is allowed in the first shooting area The shooting for the above measurement. According to the second aspect, the relative height relationship between the substrate and the imaging mechanism is adjusted by the Z-axis direction moving mechanism. In addition, the imaging area is switched by moving the mechanism in the XY axis direction and adjusting the relative positional relationship between the substrate and the imaging mechanism. In the offset measuring mechanism, before the shooting and measurement in each shooting mechanism area, the offset in the height direction relative to a predetermined reference height position is measured in each shooting area. -10- 1228023 Whether the offset is within the predetermined allowable range. In addition, in the first imaging area, when the above-mentioned offset is determined to be within a predetermined allowable range by the judging mechanism, in order to maintain the relative height relationship between the substrate and the above-mentioned imaging mechanism by the control mechanism, the 1 Shooting for measurement in the shooting area. Furthermore, when the XY-axis direction moving mechanism is controlled to switch the shooting area to the second shooting area, the Z-axis direction moving mechanism is controlled and only the relative height relationship is compensated by the offset. Therefore, compared with the case where the relative height relationship is adjusted in each shooting area one by one, in order to ensure the high speed of the measurement. In addition, in the first photographing area, when the above-mentioned offset is not within the allowable range by the judging mechanism, in order to control the Z-axis direction moving mechanism, only the above-mentioned offset is used to compensate the relative height relationship, and then, Allows measurement shooting in the first shooting area. Therefore, even in the case where there is a sharp level difference (such as a step) in the first shooting area, the relative height relationship can be compensated immediately and quickly, so that the field response can be measured in real time. As a result, the measurement can be performed accurately in each of the shooting areas in the focused state. The third aspect is the measuring device according to the second aspect, characterized in that in the first shooting area, when the determination means determines that the offset is not within the allowable range, the z-axis is controlled. The direction movement mechanism compensates the relative height relationship only by the offset, and then allows the measurement shooting in the first shooting area. When the XY axis direction movement mechanism is controlled, the shooting area is switched to the first 2 When shooting the area, keep the above-mentioned relative height relationship. According to the above scheme 3 ', in the case where the compensation of Fengdi 1 has been substantially compensated -11-1228023, when switching to the second shooting area, the compensated relative height relationship is maintained first. Therefore, if compensation is not required in the second imaging area, the high-speed measurement can be further ensured. The fourth aspect is the measurement device according to any one of the first to third aspects, characterized in that a measurement object extraction mechanism for extracting a measurement object is provided before the imaging and measurement in each of the imaging areas. According to the scheme 4, the measurement object is extracted by the measurement object extraction mechanism, and then shooting and measurement are performed in each shooting area. Therefore, it is possible to perform more accurate measurement on the measurement target. · Item 5 is the measuring device according to item 4, characterized in that the substrate is a printed substrate; the measurement object is a paste solder provided on a copper foil of the printed substrate; the measurement object extraction mechanism is to The light on the printed substrate can be irradiated on the printed substrate with blue or the light of the extraction irradiation mechanism irradiated with the light in the wavelength band based on the printed substrate, and the printed substrate can be irradiated based on the image data obtained by the imaging mechanism. Area of paste solder. According to the fifth aspect, the measurement was performed on the solder paste on the copper foil of the printed circuit board. Here, the extraction substrate is irradiated with blue light or a light in a wavelength band based on the printed substrate, and the measurement target extraction mechanism is based on the image obtained by the imaging mechanism. Data to extract the area of the solder. Generally, in a printed circuit board, a copper box has a color of a red system, and a paste solder has a color of a blue system. Therefore, the light of the 'blue system' is partially darkened by the copper range without reflection. As a result, the copper foil portion becomes darker, which increases the gap between lightness and darkness. Therefore, it is more accurate-12- 1228023 to extract the solder in a paste form, and to perform shooting and measurement. β Scheme 6 is the measuring device according to Scheme 4, characterized in that 'the substrate is a printed substrate; the measurement object is a paste solder provided on a copper foil of the printed substrate; the measurement object extraction mechanism is' will be possible Simultaneous extraction of light irradiation with red or small incident angle light in the wavelength band based on the printed substrate and light irradiation with blue or large incident angle light in wavelength band based on the printed substrate The light of the irradiation mechanism is irradiated on the printed substrate, and an area of the solder paste is extracted based on image data obtained by the imaging mechanism. φ Measure the solder paste on the copper foil of the printed circuit board according to item 6. Here, the irradiation mechanism for extraction is used to simultaneously irradiate light on a printed substrate in red or a small incident angle in a wavelength band based on the same, and blue or large incident in a wavelength band based on the same. The light in the corner is irradiated. In the measurement object extraction mechanism, the irradiated surface is used to extract the area of the paste solder based on the image data obtained by the imaging mechanism. Generally, in a printed substrate, the copper foil has the color of the red system and the paste solder has the color of the blue system. Therefore, the light of the red system starts to darken without reflection from the solder paste part, and the light of the blue system starts to darken without reflection from the copper foil part. As a result, as a blue image, the copper foil portion becomes darker, and as a red image, the paste solder becomes darker. As a result, the difference between light and dark is increased in each color image. As a result, the solder paste can be extracted more accurately for imaging and measurement. The seventh aspect is the measurement device according to the fourth aspect, characterized in that the above-mentioned offset measuring mechanism is a predetermined light that is obliquely irradiated from the compensation irradiation mechanism to the substrate surface described in -13-1228023 above, based on the The image data obtained by the above-mentioned shooting device calculates the offset of the reference height according to the principle of triangulation. ^ According to scheme 7, in the offset measurement mechanism, the prescribed light from the compensation irradiation mechanism that obliquely irradiates the substrate surface is based on the image data obtained by the imaging mechanism, and the reference is based on the principle of triangulation. The height offset is calculated. Therefore, the structure is not complicated, and the offset can be measured with a simpler structure. The eighth aspect is the measuring device according to the seventh aspect, characterized in that the predetermined light irradiated by the above-mentioned compensation irradiation means is linear light. According to the scheme 8, since the prescribed light irradiated by the compensation irradiation mechanism is linear light, it is easier to grasp the offset from the reference height. The ninth aspect is the measurement device according to the fourth aspect, wherein the offset measuring mechanism is a predetermined line of light that is obliquely irradiated from the compensation irradiation mechanism to the substrate surface according to the above-mentioned imaging mechanism. The image data obtained from the calculation is based on the principle of triangulation to calculate the offset of the reference height. Among them, the above-mentioned linear light system has a wavelength region different from that in the above-mentioned measurement object extraction mechanism to extract the measurement object. Light in the wavelength band of the light irradiated at the time. According to the scheme 9, since the predetermined ray of light is obliquely irradiated to the substrate surface by the compensation irradiation mechanism, the wavelength band of which is different from that of the light irradiated when the measurement object is extracted by the measurement object extraction mechanism. Therefore, even when the predetermined line light and the light at the time of extraction of the measurement object are simultaneously irradiated, if the photographing mechanism can distinguish the difference in color such as a color camera, etc., it is easier to distinguish the two. In this way, it is possible to perform the extraction of the measurement object and the calculation of the offset amount at the same time in one shot. As a result, measurement time can be shortened and data can be simplified. 'Option 10' The measurement device according to claim 5, wherein the offset measuring mechanism is' a predetermined line of light that is obliquely irradiated from the compensation irradiation mechanism to the substrate surface based on the above-mentioned imaging mechanism The captured image data is calculated based on the principle of triangulation, and the offset of the reference height is calculated. Among them, the above-mentioned line light is different from the irradiation light from the above-mentioned extraction irradiation mechanism, and is green or colored. The color is light in the wavelength range of the base zero. According to the scheme 10, the prescribed line light irradiating the substrate surface obliquely by the compensation irradiating means is green or a light in a wavelength band of a color based on the ray. Among them, the blue light irradiated by the extraction irradiating means is blue. Or, the wavelength bands of the light of the blue and red systems are different. Therefore, even if the light is irradiated simultaneously with the light when the measurement object is extracted, if the difference between the colors of a color camera and the like can be distinguished by the imaging mechanism, the two can be easily distinguished. Therefore, it is possible to perform the extraction of the measurement object and the calculation of the offset amount at the same time by one shot. As a result, measurement time can be shortened and data can be simplified. Scheme II is the measurement device according to scheme 4, wherein the substrate is a printed substrate; the measurement object is a paste solder provided on a copper foil of the printed substrate; and the extraction mechanism of the measurement object is to obtain the Irradiating light of a predetermined wavelength band to the extraction irradiation mechanism on the printed substrate, irradiating the printed substrate, and extracting the area of the paste solder based on image data obtained by the imaging mechanism;- 15-1228023 Furthermore, the above-mentioned offset measuring mechanism is a method of measuring the predetermined line of light from the compensation irradiation mechanism and obliquely irradiating the substrate surface based on the image data obtained by the above-mentioned imaging mechanism and performing triangulation. The principle is to calculate the offset of the reference height. The predetermined line light is a light having a wavelength band different from that in the wavelength band of the light irradiated by the extraction irradiation means. According to the scheme 11, the measurement object can be extracted and the offset calculation can be performed in one shot. As a result, measurement time can be shortened and data can be simplified. d Scheme 1 2 is the measuring device according to Scheme 4, wherein the substrate is a printed substrate; the measurement object is a paste solder provided on a copper foil of the printed substrate; and the measurement object extraction mechanism is: Illumination for extraction from light irradiation in a small incident angle of the first wavelength band on the printed substrate and light irradiation in a large incident angle of the second wavelength band different from the first wavelength band The light of the mechanism is irradiated onto the printed substrate, and the area of the solder paste is extracted based on the image data obtained by the imaging device; Furthermore, the offset measuring mechanism is to send the light from the compensation irradiation device. The predetermined line light that is irradiated onto the substrate surface is calculated based on the image data obtained by the above-mentioned shooting device, and the deviation from the reference height is calculated according to the principle of triangulation. Among them, the predetermined line light is different Light in the third wavelength band of the first and second wavelength bands of the light irradiated by the extraction irradiation means. According to the scheme 12, it is possible to perform the calculation of the measurement object's 16-1628023 extraction and offset by one shot. As a result, measurement time can be shortened and data can be simplified. In addition, by setting the first wavelength band and the second wavelength band to a wavelength band suitable for the color of the copper foil or the solder paste, it is possible to more clearly extract the solder paste as a measurement target. . Item 13 is a measurement device according to item 11 which is characterized in that after the predetermined light from the compensation irradiation mechanism and the light from the extraction irradiation mechanism are irradiated simultaneously, the imaging is performed by the imaging mechanism. . According to the 13th plan, since the prescribed light from the compensation irradiation mechanism and the light from the extraction irradiation mechanism can be simultaneously irradiated, the actual shooting can be performed by the shooting mechanism, so that the above-mentioned effect can be achieved more reliably. The fourteenth aspect relates to a measuring device including: a measurement irradiation mechanism for irradiating a predetermined light on a measurement object provided on a substrate; a compensation irradiation mechanism for irradiating the substrate surface obliquely different from the above Pattern light of a predetermined wavelength band of light of a measurement irradiation mechanism; The photographing mechanism is a measurement object that can photograph the measurement target that causes the light beam to irradiate the above-mentioned predetermined light and pattern light at the same time in most of the respective shooting regions; To perform at least one of two-dimensional measurement and three-dimensional measurement on the above-mentioned measurement object based on the image data of the prescribed light captured by the above-mentioned shooting mechanism; the offset calculation mechanism is based on the above-mentioned shooting mechanism The image data of the pattern light obtained above is used to calculate the offset from the reference height. In accordance with the scheme 'for a measurement object provided on a substrate' described in scheme 14-17-1728023, a predetermined light from an irradiation mechanism for measurement is irradiated. In addition, the compensation irradiating means is pattern light which irradiates the substrate surface obliquely with a predetermined wavelength band different from the light of the measuring irradiating means. In addition, the measurement target that irradiates the predetermined light and the pattern light at the same time is imaged in a plurality of imaging regions by the imaging mechanism. Then, based on the image data of the predetermined light captured by the imaging mechanism, the measurement mechanism performs at least one of two-dimensional measurement and three-dimensional measurement on the measurement object. In addition, based on the image data of the pattern light obtained by the photographing mechanism, the offset amount with respect to the reference height is calculated by the offset amount calculating mechanism. Thereby, the offset can be measured without causing a complicated structure k and with a simpler structure. The measurement can be performed in response to the offset. Furthermore, in this scheme, pattern light from the compensation irradiation mechanism and light from the measurement irradiation mechanism are simultaneously irradiated, and the imaging is actually performed by the imaging mechanism. Therefore, in contrast to the case where calculation of the measurement and the offset amount had to be performed after taking multiple shots in the past, it is possible to perform measurement in which the offset amount is measured in one shot. As a result, the measurement time can be further shortened. In addition, since the wavelength bands of the prescribed light and the light pattern are different from each other, it is easy to distinguish the two, and it is difficult to cause obstacles in the calculation and measurement of the offset. Solution 15 relates to a measuring device including: a measuring irradiation mechanism for irradiating a predetermined light on a measurement object provided on a substrate; and a photographing mechanism for 'capable of shooting with the predetermined light in a plurality of shooting areas] The measurement object to be irradiated; the measurement mechanism is to perform at least one of the two-dimensional measurement and the three-dimensional measurement on the measurement object based on at least the image data taken by the above-mentioned shooting mechanism -18-1228023; and its characteristics are: The device is provided with an offset calculation mechanism for compensating an irradiation mechanism that can illuminate pattern light in a predetermined wavelength band in a predetermined shooting area before the above-mentioned shooting and measurement in each shooting area. The pattern light is irradiated obliquely to the substrate surface, and the irradiated surface is calculated based on the image data obtained by the above-mentioned shooting mechanism to calculate the offset from the reference height. The measurement object extraction mechanism is the above-mentioned in each of the above-mentioned shooting areas. Before imaging and measurement, the radiation from the substrate can be different from the wavelength band specified above. The light of the extraction irradiating mechanism irradiated with light in the wavelength band is irradiated onto the substrate, and the area of the measurement object is extracted based on the image data obtained by the imaging mechanism; the image from the compensation irradiating mechanism is irradiated simultaneously After the patterned light and the light from the above-mentioned extraction irradiating mechanism, the imaging is performed by the imaging mechanism. According to the scheme 15, the irradiation is performed on the substrate by the extraction irradiation mechanism. In the measurement object extraction mechanism, the irradiation surface is based on the image data obtained by the imaging mechanism to extract the area of the measurement object. Therefore, it is possible to more accurately extract the measurement target for shooting and measurement. In addition, in the offset measurement mechanism, the compensation irradiation mechanism illuminates the pattern light in a predetermined wavelength band on the substrate surface, and the irradiation surface is based on the image data obtained by the imaging mechanism, and the reference height is calculated. Offset. Therefore, the amount of offset can be measured with a simpler structure that results in a complicated structure. In addition to 1228023, the measurement can be performed by reflecting the offset. Furthermore, in this solution, the pattern light from the compensation irradiation mechanism and the extraction light are simultaneously irradiated. < Actually, shooting is performed by the shooting mechanism using the light of the irradiation mechanism. Therefore, compared with the case where it was impossible to obtain the calculation without the extraction and offset calculation in the past, the extraction and calculation of the measurement target area can be performed by one shot, and the result can be shortened even more. Measure time and simplify data. In addition, since the wavelength bands of the respective lights are different, it does not hinder the extraction and calculation. Option 16 is related to a measuring device, which includes:. The measurement irradiating mechanism can irradiate predetermined light to the paste-like solder provided on the copper foil of the printed circuit board; the imaging mechanism can measure the measurement object irradiated by the predetermined light in a plurality of imaging regions, respectively; the measuring mechanism In order to perform at least one of the two-dimensional measurement and the three-dimensional measurement on the measurement object based on at least the image data captured by the above-mentioned shooting mechanism, the measuring device is provided with: · an offset calculation mechanism for Before the above-mentioned shooting and measurement in each shooting area, in a predetermined shooting area, the pattern light is irradiated obliquely onto the printed substrate surface by a compensation irradiation mechanism that can illuminate pattern light in a predetermined wavelength band. The irradiation surface is calculated based on the image data obtained by the above-mentioned shooting mechanism, and the offset to the reference height is calculated according to the principle of triangulation; the measurement object extraction mechanism is used for -20- 1228023 and before measurement, it will be from the wavelength range that can be performed on the printed substrate The light of the extraction irradiating mechanism irradiated with light of the same wavelength band is irradiated on the printed substrate, and the area of the paste solder is extracted based on the image data obtained by the photographing mechanism; and the compensation from the compensation is irradiated simultaneously. After the pattern light of the irradiation mechanism and the light from the extraction irradiation mechanism are used, imaging is performed by the imaging mechanism. According to the scheme 16, light irradiation is performed on the printed substrate by the extraction irradiation mechanism. In the measurement object extraction mechanism, the irradiation surface is used to extract the paste solder based on the image data obtained by the shooting mechanism. Area. Therefore, the paste solder can be extracted more accurately for imaging and measurement. In addition, in the offset measurement mechanism, the pattern light in a predetermined wavelength band is irradiated obliquely to the substrate surface by the compensation irradiation mechanism, and the irradiation surface is based on the image data obtained by the imaging mechanism, and the triangle The principle of measurement 'calculates the offset from the reference height. Thereby, the amount of offset can be measured with a simpler structure without complicating the structure. In addition, this offset can be measured for measurement. Furthermore, in this scheme, the pattern light from the compensation irradiation mechanism and the light from the extraction irradiation mechanism are simultaneously irradiated, and the shooting is actually performed by the imaging mechanism. Therefore, in the past, if the extraction and offset calculation could not be performed without taking multiple shots in the past, the measurement target area extraction and offset calculation can be performed by one shot. As a result, measurement time can be shortened and data can be simplified. In addition, since the wavelength bands of the respective lights are different, there is no obstacle to the extraction and calculation. -21-1228023 Scenario 1 The 7 series relates to a measuring device including: a measuring irradiation mechanism for irradiating prescribed light to the paste-like solder provided on the copper foil of the printed circuit board; a shooting mechanism for each of a plurality of shooting areas In the above, the measurement object illuminated by the above-mentioned prescribed light can be photographed; the measurement mechanism performs at least one of the two-dimensional measurement and the three-dimensional measurement on the measurement object based on at least the image data captured by the above-mentioned imaging mechanism; This measuring device is provided with an offset calculation mechanism for irradiating the compensation light for the pattern light in the third wavelength band in a predetermined shooting area in the predetermined shooting area before the above-mentioned shooting and measurement in each shooting area. The patterned light is irradiated obliquely to the printed substrate surface, and the irradiated surface is calculated based on the image data obtained by the above-mentioned shooting mechanism, and the offset of the reference height is calculated according to the principle of triangulation; the measurement object extraction mechanism In order to perform the above-mentioned shooting and measurement in each shooting area, Light irradiation in the small incident angle of the first wavelength band different from the third wavelength band region on the printed substrate, and large incident angle of the second wavelength band different from the third and first wavelength band regions The light of the extraction irradiating mechanism irradiated with light is irradiated on the printed substrate, and the area of the paste solder is extracted based on the image data obtained by the imaging mechanism; and the pattern from the compensation irradiating mechanism is irradiated at the same time. The light and the light from the extraction irradiation mechanism are captured by the imaging mechanism. -22 · 1228023 According to the scheme 17, the irradiation mechanism for extraction is used to irradiate light with a small incident angle in the first wavelength band and large incidence in the second wave length band on the printed substrate at the same time. The light of the corner is irradiated. In the measurement object extraction mechanism, the irradiation surface is based on the image data obtained by the imaging mechanism to extract the area of the solder paste. Generally, since the colors are different from those of the copper foil and the solder paste on the printed circuit board, the solder paste portion can be clearly extracted by matching the appropriate colors to each wavelength band. As a result, the solder paste can be extracted more accurately for imaging and measurement. In addition, in the offset measurement mechanism, the U-shaped light is irradiated to the substrate surface by the compensation irradiation mechanism at an angle. The irradiation surface is based on the image data obtained by the imaging device. The offset from the reference height. Therefore, it does not cause complicated drawing of the structure, and the offset can be measured by a simpler supporting structure. In addition, measurement is performed so as to reflect the amount of shift. Furthermore, in this scheme, the pattern light from the compensation irradiation mechanism and the light from the extraction irradiation mechanism are simultaneously irradiated, and the shooting is actually performed by the imaging mechanism. Therefore, the extraction of the solder paste and the calculation of the offset amount can be performed in one shot. As a result, measurement data can be further shortened and 0 data can be simplified. In addition, since the wavelength bands of the respective lights are different, it does not hinder the extraction and calculation. The eighteenth aspect relates to a measuring device, which includes: an irradiation mechanism for measurement and measurement, which can irradiate a predetermined light to the paste-like solder provided on a copper foil of a printed substrate; The measurement object that can be illuminated by the above prescribed light can be photographed; -23- 1228023 S ten measurement mechanism, at least one of the above-mentioned measurement objects is based on at least the material; it is characterized in that the measurement device offset calculation mechanism is Before the measurement, the compensation of the pattern light in the predetermined shooting area is used to obliquely illuminate the printed substrate surface, and the image data obtained from the shooting is calculated according to the degree of deviation; the measurement object extraction mechanism is for the on-camera And before the measurement, the light from the extraction irradiation device that can be red or its reference wavelength and blue or its reference emission is taken from the area obtained by the above-mentioned shooting mechanism; at the same time, it is irradiated from the above And shooting from the above-mentioned extraction irradiation mechanism. According to the scheme 18, the image data obtained by the above-mentioned shooting mechanism is obtained by extracting and shooting the red or the base as the reference, and the blue or the reference as the reference. In the two-dimensional measurement and three-dimensional measurement of video materials, the following are provided in the above-mentioned shooting in the shooting area and the field, which can be illuminated by green or by its shooting device, and the pattern light is shot according to the above according to the above irradiation surface The principle of triangulation of the mechanism is to simultaneously irradiate light in a small incident angle of the band on the printed substrate and light in a large incident angle of the wavelength region to the aforementioned shots in each of the above-mentioned shooting areas at a reference height. The printed substrate is based on the image data to extract the pattern light of the above-mentioned paste solder compensation irradiating mechanism, and the light is used to enter the irradiating mechanism through the above-mentioned imaging mechanism. At the same time, the printed substrate lacks a small incident angle with a long band The light in the large incident angle in the wavelength range of the light is used to photograph the area where the solder is extracted. Generally, -24-1228023 on the printed circuit board, the copper foil has the color of the red system, and the paste solder has the color of the blue system. Therefore, the light of the red system starts to darken without reflection from the solder paste, and the light of the blue system starts to darken from the copper foil without reflection. As a result, as the blue image, the copper foil portion is darker, and as the red image, the paste solder portion is darker, so the difference in lightness and darkness is increased for each color image. As a result, the solder paste can be extracted more accurately for imaging and measurement. In addition, in the offset measurement mechanism, the pattern light is obliquely irradiated to the substrate surface by the compensation irradiation device, and the irradiation is based on the sample data obtained by the imaging mechanism, and according to the principle of triangulation, The offset of the reference height is calculated. Therefore, it will not lead to a complicated structure, but the offset can be measured by a simpler support structure. In addition, measurement can be performed in response to this offset. Further, in this scheme, pattern light from the compensation irradiation mechanism and light from the red and blue systems of the extraction irradiation mechanism are simultaneously irradiated to actually take a picture by the imaging mechanism. Therefore, the extraction of the solder paste area and the calculation of the offset amount can be performed in one shot. As a result, the measurement time can be shortened and the data can be simplified. In addition, since the wavelength band of each light is different, it does not hinder extraction or calculation. Scheme 19 is a measuring device according to any one of schemes 14 to 18, characterized in that the method of adjusting the relative height relationship between the substrate and the imaging mechanism is based on a calculation result of the offset calculation mechanism. Made up. According to the scheme 19, since the measurement in the relative height relationship can be actually adjusted, a more accurate measurement can be ensured. -25- 1228023 Scheme 2 0 is the measuring device according to any one of 14 to 18, wherein the pattern light irradiated by the compensation irradiation means is linear light. According to the scheme 20, it is easier to grasp the offset from the reference height. In addition, in each of the above schemes, the measurement achieved by the measurement mechanism may be performed when the imaging area is moved. In this case, there is no waiting for the measurement area to be shifted. Therefore, effective measurement can be performed, and the total measurement time can be shortened. In addition, it can also be implemented by the following inspection device, which is provided with the measurement device described in each of the above schemes, and an inspection device configured to judge whether the measurement object is good or not based on the measurement results of the measurement mechanism. Therefore, the effect corresponding to each of the above-mentioned schemes is realized when a good inspection is performed. [Embodiment] An embodiment will be described below with reference to the drawings. Fig. 1 is a schematic configuration diagram showing the three-dimensional measuring device 1 as a measuring device in this embodiment in an unintended manner. In addition, in this embodiment, the three-dimensional measuring device 1 is specifically implemented by a printing condition inspection device, which is used to inspect paste solder (mainly printed on a printed substrate K (a copper foil)) Constitute the measurement target). The three-dimensional measuring device 1 includes a base 2 and an X-axis moving mechanism 3 and a y-axis moving mechanism 4 are provided on the base 2. The rotary movement mechanism 4 is provided with a guide rail 10 on which a printed substrate K as a substrate is placed. In addition, by operating the X-axis moving mechanism 3 and the Υ-axis moving machine 26-2628023, the printed circuit board K can be moved in the x-axis direction and the γ-axis direction. The X-axis moving mechanism 3 and the y-axis moving mechanism 4 constitute an X γ axial moving mechanism. The three-dimensional measurement device 1 further includes a three-dimensional measurement irradiation mechanism 5 as a measurement irradiation mechanism, a CCD camera (color camera) 6 as an imaging mechanism, and a main control mechanism 7 electrically connected to the CC camera 6. The three-dimensional measurement irradiation mechanism 5 is configured to irradiate a predetermined light pattern on the surface of the printed substrate K from an obliquely upward direction. The CCD camera 6 is disposed directly above the printed substrate K, and is formed so as to capture a portion illuminated by the light pattern on the printed substrate κ. In addition, in the main control mechanism 7, a predetermined three-dimensional measurement method is used to perform image processing based on the image data captured by the CCD camera 6 to form three-dimensional measurement (mainly height measurement) of paste solder and Inspection of printing state of paste solder. That is, the main control mechanism 7 has an inspection mechanism 8 (see Fig. 4) for inspecting the printing state in accordance with the height (volume) of the solder paste. In the three-dimensional measurement in the present embodiment, any measurement method such as a phase shift method, a light cut method, a space code method, and a focus method is suitable. In this embodiment, the above-mentioned CC camera 6 is mounted on the z-axis moving mechanism 9. That is, by driving the Z-axis moving mechanism 9, the CCD camera 6 can be moved in the vertical direction. Thereby, the relationship between the relative height between the printed circuit board K and the CCD camera 6 can be changed. In addition, the three-dimensional measurement device 1 in this embodiment has a mechanism (measurement object extraction mechanism) for extracting an area formed by a paste solder when the three-dimensional measurement is performed (before). This mechanism includes irradiation for solder extraction -27-1228023 mechanism 1 1. The irradiation mechanism 1 for solder extraction is a method of irradiating a predetermined light to the printed substrate κ before irradiation with a light pattern by the irradiation mechanism 5 for three-dimensional measurement. A more detailed description is that the irradiation mechanism 1 1 for solder extraction has, as shown in FIG. 2, a pair of upper and lower ring lamps 12 and 13. The upper ring lamp 12 is formed so that light can be irradiated with a small incident angle, and is configured to illuminate red light. The ring lamp 13 at the bottom is formed so that light can be irradiated by a large incident angle, and is configured to illuminate blue light. Generally, in the printed substrate K, the copper foil of the red system is provided on the substrate K, and the paste solder of the blue system is printed thereon. Therefore, the red light starts to darken without reflection from the paste solder portion. The blue light is darkened from the copper foil and does not reflect. As a result, the copper foil portion as the blue image is darker, and the paste solder portion as the red image is darker. In this way, the contrast between light and dark is increased in each color image. Here, in this embodiment, before the three-dimensional measurement is performed to extract the area of the paste-like solder as the measurement object, the red and blue light is irradiated by two ring lamps 12 and 13 and C CD is used. The camera 6 captures the irradiation surface, and in the main control mechanism 7, the operation of designating (extracting) the installation area of the cream solder is performed. In addition, the three-dimensional measurement device 1 in this embodiment is provided with a mechanism for compensating the warpage of the printed substrate K during the three-dimensional measurement (before). This mechanism includes a Z-axis compensation irradiation mechanism 14. The irradiation mechanism 14 for z-axis compensation is to irradiate the light with the irradiation mechanism 11 for solder extraction before irradiating the light pattern achieved by the irradiation mechanism 5 for three-dimensional measurement. The printed substrate κ ′ is a linear light that is irradiated with predetermined pattern light. A more detailed description is the irradiation for the z-axis compensation -28-1228023 The mechanism 1 4 system is formed to illuminate the pattern light with different wavelength bands than the ring lamp 1 2, 1 3 (in this embodiment, it is green Line light). The green linear light irradiation system achieved by the Z-axis compensation irradiation mechanism 14 is used to grasp the "height offset" from the reference height caused by the warpage of the printed substrate K. That is, as shown in FIG. 3, the linear light is irradiated by the Z-axis compensation irradiation mechanism 14. When the light is captured by the CCD camera 6, a photo substrate having a printed substrate K as shown in FIG. When the height position is different, the position of the linear light captured by the CCD camera 6 is formed to be different in the left-right direction. In this embodiment, in the main control mechanism 7, the height offset of the print substrate K is calculated based on the above-mentioned position of the linear light and according to the principle of triangulation. That is, the main control means 7 is provided with a Z-axis offset amount calculating means 15 (refer to Fig. 4) as an offset amount measuring means for calculating a height offset amount of the printed substrate K. Next, the electrical structure of the three-dimensional measurement device 1 centered on the main control mechanism 7 will be described. As shown in FIG. 4, the CCD camera 6 is electrically connected to the main control mechanism 7. As described above, the main control mechanism 7 includes the inspection mechanism 8 and the Z-axis offset calculation mechanism 15. At the same time, the main control means 7 is provided with an offset determination means 16 as a determination means which determines whether the "offset" is appropriate based on the calculation result of the Z-axis offset calculation means i5. The main control mechanism 7 is connected to the irradiation control mechanism 2 i. The irradiation control mechanism 2 1 is connected to the above-mentioned three-dimensional measurement irradiation mechanism 5, the solder extraction irradiation mechanism 1 1 (ring lights 1 2, 1 3), and the Z-axis compensation irradiation mechanism 14 according to the above-mentioned main control mechanism 7 The control signal is used to switch and control each irradiation machine. • 29-1228023 Structures 5, 11 and 14 irradiation. The main control mechanism 7 is connected to the X-axis movement control mechanism 22 and the γ-axis movement control mechanism 23. The X-axis movement control mechanism 22 and the Y-axis movement control mechanism 23 appropriately drive-control the X-axis movement mechanism 3 and the Y-axis movement mechanism 4 to switch each shooting area. Thereby, the print substrate κ can be appropriately moved in the X-axis direction and the γ-axis direction. In addition, the main control mechanism 7 is connected to the z-axis movement control mechanism 24. The Z-axis movement control mechanism 24 drives and controls the above-mentioned Z-axis movement mechanism 9 in accordance with an input signal from the main control mechanism 7 and particularly from an offset determination mechanism 16. Thereby, the relative height relationship between the CCD camera 6 and the printed circuit board K can be adjusted (when there is warpage, it is compensated). The following describes the functions and effects of the three-dimensional measuring device 1 configured as above, focusing on the control content performed by the main control mechanism 7. First, in the first imaging region, the main control mechanism 7 is configured to irradiate light from the two ring lamps 1 2 and 1 3 of the solder extraction irradiation mechanism 11 via the above-mentioned irradiation control mechanism 21 and irradiate light from The linear light of the irradiating mechanism 14 for the Z-axis compensation is used to extract the paste solder area and measure the height offset. Then, the CCD camera 6 photographs the first imaging area irradiated with the extraction irradiation light and the linear light. At this time, the image data obtained by shooting are mixed with red and blue light from the two ring lamps 12 and 13 and green linear light from the Z-axis compensation irradiation mechanism 14. However, since the wavelength bands of the respective lights are different, they can be easily distinguished even in the case of one image data. In addition, extraction of the solder paste area is temporarily performed based on the above-mentioned image data. -30-1228023 Next, the main control unit 7 (Z-axis offset calculation unit 15) calculates the height offset Za based on the green line light in the above-mentioned image data. For example, in Figure 5 (a), the line of light is shifted from the reference height (the position where the line of light should reach if there is no warpage, etc.) by a predetermined amount (α in the figure). The Z-axis offset calculation means 15 calculates an offset Za from the reference height in the Z-axis direction (height direction) based on the predetermined offset and the principle of triangulation described above. Next, the 'main control means 7 (offset judgment means 16) judges whether the above-mentioned offset amount Za is within a predetermined reference range. The following control is performed based on the determination result. (1) When the offset amount Z a is within a predetermined reference range. When the offset amount Z a is within the reference range, the main control unit 7 performs three-dimensional measurement on the extracted solder paste region in the first imaging region. That is, a predetermined light pattern is irradiated by the three-dimensional measurement irradiation mechanism 5 through the irradiation control mechanism 21. The CCD camera 6 captures an irradiated light pattern. After the shooting is completed, the main control mechanism 7 drives the X-axis movement mechanism 3 and the γ-axis movement mechanism 4 via the X-axis movement control mechanism 22 and the Y-axis movement control mechanism 23 to switch the shooting area to the next shooting area ( 2nd shooting area). Then, during the switching of the shooting area, the main control mechanism 7 drives the ζ-axis movement mechanism 9 via the Z-axis movement control mechanism 24 to move the cCD such as the camera 6 by the above-mentioned offset za to compensate (adjust) its height position. In this way, in the next shooting area, the offset within the allowable range of the previous shooting area -31-1228023 can be compensated. In most cases, the height position relationship between the camera 6 and the surface of the printed circuit board K In addition, during the switching of the shooting area, the main control mechanism 8) based on the data extracted in the above-mentioned first shooting area and performing three-dimensional measurement (height calculation of the solder paste and volume meter; whether the printing state of the solder paste is suitable Judgment. In this way, by performing measurement (calculation) between the transitions of the domain, it is possible to effectively advance and shorten the total measurement time. (2) When the offset Za is not within the predetermined reference range On the other hand, when the offset is above Za is not in the reference range. The main control mechanism 7 is in the first shooting area. First, K's warpage and other phenomena are significant and must be quickly compensated. Before testing, in order to drive the mechanism 9 through the Z-axis movement control mechanism 24, The CCD camera 6 is moved only by the above-mentioned offset amount Za and its height position. As a result, in the first shooting area, compensation is performed quickly to position the CCD camera 6 and the printed board K surface. The system is adapted so that there is no abnormality of the CCD camera 6. After the compensation, the main control mechanism 7 shoots the two ring lamps 1 from the solder extraction irradiation mechanism 11 via the irradiation control and irradiates the irradiation from the Z-axis compensation Rays of light from institutions 1 4 < The CCD camera 6 captures both the irradiated light and the ray light for extraction, and extracts the paste solder area again. In addition, at this time, due to the compensation described above, the CCD camera i is appropriate. Structure 7 (inspection machine I image data, calculation), can be measured in the shooting area, as appropriate. In this case, when the printed circuit board is compensated (adjusted) by a three-dimensional meter Z-axis moving machine, the special situation mechanism 21 such as the height of the offset surface is often illuminated by the light of 2, 13 and irradiated by The 1st height position Guan-32-1228023 should be formed as appropriate. Basically, it is not necessary to confirm the offset again. However, for the sake of caution, the offset za can also be calculated based on the above-mentioned line light. In addition, if the recalculated offset Z a (repeatedly) deviates from the allowable range, it can be judged as an error as an error. However, basically, due to the compensation described above, the height positional relationship in the first imaging area should be properly formed, and the main control mechanism 7 then allows the three-dimensional measurement to be performed. That is, a predetermined light pattern from the three-dimensional measurement irradiation mechanism 5 is irradiated through the over-irradiation control mechanism 21. Next, the irradiated light pattern is captured by the CCD camera 6. After the shooting is completed, the main control mechanism 7 drives the X-axis movement mechanism 3 and the Y-axis movement mechanism 4 via the X-axis movement control mechanism 22 and the Y-axis movement control mechanism 2 3 to switch the shooting area to the next shooting area (Second shooting area). Then, when the shooting area is switched, the main control mechanism 7 switches the shooting area in order to drive the Z-axis moving mechanism 9 (the height position of the CC camera 6 is not compensated). This is because compensation has been completed in the first shooting area. During the switching of the above-mentioned shooting area, the main control mechanism 7 (inspection mechanism 8) performs two-dimensional measurement based on the re-extracted data and image data in the above-mentioned first shooting area (local calculation and volume calculation of Xiao solder). ) To determine whether the print status of the bone solder is suitable. In this way, by performing measurement (calculation) during the transition of the shooting area, efficient measurement can be performed, and the total measurement time can be shortened. In this embodiment, the main control mechanism 7 repeatedly implements the above-mentioned operations in each shooting area, respectively, and ends the inspection at -33-1228023 in all shooting areas, and ends the three-dimensional measurement and inspection. As described above, 'in this embodiment, before the three-dimensional measurement in each shooting area', the amount of deviation Za in the height direction with respect to a predetermined reference height position is measured, and when it is judged that the amount of deviation Za is within the allowable range , Maintaining the relative height relationship between the printed substrate K and the CCD camera 6 to perform photographing in the photographing area. Then, when shifting to the next shooting area, the height-position relationship 9 is compensated only by the above-mentioned offset amount Za by controlling the Z-axis moving mechanism 9. For example, as shown in FIG. 5 (a), in the inspection area (imaging area) a, the deviation amount Za from the reference height is set to α within an allowable range. In this case, in the inspection area A, the height of the CC camera 6 was not compensated, and the two-dimensional 50-point shooting was performed. In addition, when moving to the next inspection area B, the height of the CC camera 6 is only compensated by the above-mentioned amount of α for calculation and inspection. The same processing is performed in the next inspection area B. When shifting to the inspection area B, the height position of the c C D camera 6 is compensated. Therefore, in most cases, the amount of shift from the reference height position is small. Therefore, compared with the case where the relative height relationship is adjusted in each shooting area one by one, in order to ensure high-speed measurement. In addition, when it is determined that the offset amount z a is not within the allowable range, the height-position relationship is compensated by controlling the Z-axis movement mechanism 9 immediately and only by the amount of the offset amount z a described above. On this, shooting and measurement in the shooting area are performed. For example, as shown in Figure 5 (b), 'In the inspection area A, the reference height -34-1228023 is in the same degree as the field B CCD, and the height of the photograph is instantly high. The calculated offset za is α which is set within the allowable range. In this case, in the inspection area A described above, imaging for three-dimensional measurement is performed without compensating for the height of the CCD camera 6. In addition, when moving to the next inspection area, calculation and inspection are performed, and the height of the camera 6 is compensated only by the above-mentioned amount of α. In the next inspection area B, the injection process is performed. At this time, if there is a sharp difference in the inspection area B, the offset amount Za may be out of the allowable range. Here, in this embodiment, it is to compensate the height position of the c C D machine 6 in the inspection area B. Therefore, even if there is a sharp difference in a predetermined shooting area, since the relative height compensation is quickly performed here, the difference in height can be reflected for measurement. As a result, accurate measurement can be performed in each shooting area while focusing. In addition, as shown in FIG. 5 (b), when the inspection area B has been significantly enlarged, the compensated relative height relationship is first held when switching to the next inspection area (shooting area). In other words, the height position is compensated during the switching. Therefore, if no compensation is required in the next inspection area, the high-speed measurement can be further ensured. In addition, in this embodiment, the measurement target is extracted along with the imaging measurement in each inspection area. This allows more accurate measurement of the measurement target. In addition, since the irradiation light used for the extraction is different from the wavelength band of the line light used to calculate the offset Za ', even if the extraction light and the line light are irradiated at the same time, if the CCD camera 6 can distinguish the color difference, It is easier to distinguish between the two. Therefore, with one shot, the extraction of the paste solder and the calculation of the offset amount z a can be performed simultaneously. As a result, the measurement time can be shortened and the amount of data can be reduced. Meanwhile, in this embodiment, the local calculation and inspection of the paste-like solder can be performed when the shooting area is transferred. That is, there is no need to wait for the measurement to be completed and shift the imaging area. Therefore, effective measurement can be performed, and the total measurement time can be shortened. It should be noted that the present invention is not limited to the content described in the above embodiment, and may be, for example, the following embodiment. φ (a) In the above-mentioned embodiment, the case where the solder paste is mainly used and the height I ten measurement (two-dimensional measurement) is performed is concrete, but it is also possible to perform, for example, the area measurement of the solder paste. Dimension measurement. In this case, extraction of paste solder and two-dimensional measurement can be used at the same time. In other words, it is also possible to omit the extraction operation, and perform irradiation for offset calculation and irradiation for measurement at the same time, and then take a picture, perform offset calculation based on the image data, and react and measure it. (b) As a photographing mechanism, in addition to the CCD camera of the photographable area as in the above embodiment, it may be a line camera. In addition, the camera may be a camera capable of shooting in an area or a line, such as a CMOS camera, without being limited to a CC camera. (c) In the above embodiment, 'the paste solder region is extracted, and then three-dimensional measurement is performed, but the relevant extraction mechanism may be omitted. (d) The light source constituting each of the irradiation mechanisms 5, 11 and 14 may be a halogen lamp or an LED. In addition, an irradiation mechanism capable of irradiating a laser may be used. -36- 1228023 (0 In the above embodiment, a scheme is adopted in which the printed circuit board κ moves along the χγ axis direction, and the C CD camera 6 moves separately along the ζ axis direction, but the two can also move relatively. For example, the printed circuit board κ can move along Moving up and down, the CCD camera 6 can be moved in the XY axis direction. (Ό In the above embodiment, it is embodied by an inspection device for inspecting the printing state of the paste solder. In contrast, the above-mentioned solution can also be specific Other devices related to the manufacture of substrates can be realized. For example, it can also be implemented by an inspection device for inspecting the mounting state of electronic components mounted on a substrate, the presence or absence of defects, etc. _ (g) In the above embodiment, the The Z-axis compensation irradiating mechanism 14 radiates green linear light. However, if the wavelength range is different from the irradiated light used for extraction, it is not necessarily limited to green. For example, it may be a scheme that can irradiate infrared rays and ultraviolet rays. If the shooting is performed independently of the irradiation light used for extraction, light in the same wavelength band as the light used for extraction can also be irradiated. (H) In the above embodiment, the Z axis Compensating the irradiating mechanism 14 to irradiate the linear light, but the linear light may be one or multiple lines. In the case of multiple lines and light, they may be kept parallel or have (such as cross each other) (Such as vertical). In addition, the width of the line of light is the width that can exceed the shooting area, or it can be shorter than the width, such as dots. However, if it covers the inspection area The width can more surely include a portion such as a copper foil portion that can stably measure the height offset. [Brief Description of the Drawings] Fig. 1 is a schematic view of a measuring device according to an embodiment -37-
I I1228023 立體圖。 第2圖爲表示焊料抽取用照射機構和Z軸補償用照射機 構等的配置組成的示意圖。 < 第3圖爲用於說明偏移量計算時的槪念的示意圖。 第4圖爲說明主控制機構等的電氣組成的方塊圖。 第5 (a)圖、第5(b)圖均爲表示用於說明實施例的作用效 果的每個檢查區域的影像資料等的示意圖。 【主要部分之代表符號說明】 1 :三維計測裝置 馨 3 :作爲XY軸方向移動機構之X軸移動機構 4 :作爲XY軸方向移動機構之Y軸移動機構 5 :三維計測用照射機構 6 :作爲拍攝機構之CCD照相機 7 :主控制機構 8 :檢查機構 9 : Z軸移動機構 1 1 :焊料抽取用照射機構 ® 1 2、1 3 :環狀燈 1 4 : Z軸補償用照射機構 1 5 : Z軸偏移量運算機構 1 6 :偏移量判斷機構 K :印刷基板 -38-I I1228023 perspective view. Fig. 2 is a schematic diagram showing the arrangement of the irradiation mechanism for solder extraction, the irradiation mechanism for Z-axis compensation, and the like. < FIG. 3 is a schematic diagram for explaining an idea when calculating an offset. FIG. 4 is a block diagram illustrating the electrical configuration of the main control mechanism and the like. 5 (a) and 5 (b) are schematic diagrams showing image data and the like of each inspection area for explaining the effect of the embodiment. [Description of Representative Symbols of Main Parts] 1: Three-dimensional measuring device 3: X-axis moving mechanism as the XY-axis moving mechanism 4: Y-axis moving mechanism as the XY-axis moving mechanism 5: Three-dimensional measuring irradiation mechanism 6: As CCD camera of the imaging mechanism 7: Main control mechanism 8: Inspection mechanism 9: Z-axis movement mechanism 1 1: Irradiation mechanism for solder extraction® 1 2, 1 3: Ring lamp 1 4: Irradiation mechanism for Z-axis compensation 1 5: Z-axis offset calculation mechanism 16: offset determination mechanism K: printed circuit board -38-