TWI299007B - Processing device for substrate surface - Google Patents
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- TWI299007B TWI299007B TW93105282A TW93105282A TWI299007B TW I299007 B TWI299007 B TW I299007B TW 93105282 A TW93105282 A TW 93105282A TW 93105282 A TW93105282 A TW 93105282A TW I299007 B TWI299007 B TW I299007B
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1299007 說明圖，第7圖之（4 )係該重要部位的平面說明圖，第7圖 之（5 )係該重要部位之正面說明圖。第8圖之（丨）係說明側 面圖，第8圖之（2)係平面說明圖。 在顯像裝置、蝕刻裝置，剝離裝置等之此類型之表面處 理裝置，係將基板材A以搬運裝置2呈水平姿態搬運，針 對受到搬運之基板材A，由相對向設置之各噴霧噴嘴3噴出 處理液B，對基板材A以處理液B進行處理。 作爲搬運裝置2，乃是以直線狀的直進滾輪群4，在轉 軸5上以一定之節距排列設置之輪盤群6代表性地受到使 用。然後，如此之直線狀之直進滾輪群4與輪盤群6係如 圖示般設置於基板材A的下方，或上下兩側。 還有，作爲噴霧噴嘴3係如第7圖之（1 )、第7圖之（2 ) 所示般，圓錐狀地噴出處理液B之完全圓錐形噴嘴，又如 第7圖之（3)、第7圖之（4)、第7圖之（5)所示般，薄膜狀 地噴出處理液B之狹縫噴嘴，代表性地受到使用。之後， 如所述之噴霧噴嘴3係如圖所示般在搬運被基板材A之上 方’或上下兩側，遍佈前後左右地複數個受到排列設置。 作爲習知例之基板A之表面處理裝置1，例如可例舉以 下之特許文獻1 (參照第7圖之習知例），特許文獻2 (參照 第5圖、第6圖、第7圖之習知例），特許文獻3 (參照第 5圖之習知例）等。 [特許文獻1]特許第3 0 1 0487號公報 [特許文獻2]特許第3 47 9 6 36號公報 [特許文獻3]特開200卜7 1 4789號公報 ^99007 但是，關於前述習知例之基板A的表面處理裝置1， 以下之問題受到質疑。 (第1問題點） 第1，在前述習知例之表面處理裝置1中，從噴霧噴 嘴3所噴出之處理液B，係如第7圖所示般，首先，利用愈 _近噴射中心方面愈濃密壓力愈高，而愈靠近外側愈疏鬆 ’壓力愈低之噴霧噴嘴類型C，也就是說利用跟隨濃淡之噴 霧噴嘴類型C，對基板材Α進行噴射，因此，基板材Α的衝 擊作用，產生誤差。 φ 與此同時，噴霧噴嘴3在第7圖之（1)、第7圖之（2) 所示之完全圓錐形噴嘴之場合時，因處理液B會呈圓錐狀 、角錐狀噴出，所以對於基板材A未受到噴射而對於搬運 裝置2之直進滾輪4或是當對於輪盤6所噴出之重量係相 當高。然後因此，對於基板材A之處理衝擊會變弱。 也就是說，處理液B是會因過度飛散在前後之搬運方 向D上’以處理液B形成之噴霧類型C(例如前後尺寸爲150 mm )，會大大超越搬運裝置2的間隔空間E。會大大地超過 β 在直進滾輪4與輪盤6間形成處理液Β噴射用之間隔空間 Ε (例如前後尺寸3 0mm )也就是有效區域，造成飛散而浪費 〇 另一方面，噴霧噴嘴3在第7圖之（3)、第7圖之（4) 、第7圖之（5 )所示之的狹縫噴嘴之場合中，處理液β係呈 現薄膜狀·約略呈扇形地被噴出，在基板材A前後之搬運 方向D方面，係以相當薄之前後寬度尺寸加以噴出。 一 8 - 1299007 也就是說，處理液B對於基板材A，乃是在前後之搬 運方向以寬度較窄之水平薄膜狀，主要是在左右之寬度方 向F上呈約略直線狀地加以噴出，之後，所形成之噴霧類 型C，僅能局部利用間隔空間正也就是前後極端狹小部分。 因此，對於基板材A之處理作用會受到限定。1299007 explanatory diagram, Fig. 7 (4) is a plan explanatory view of the important part, and Fig. 7 (5) is a front explanatory view of the important part. Fig. 8(丨) is a side view, and Fig. 8(2) is a plan view. In the surface treatment apparatus of the type such as a developing device, an etching device, and a peeling device, the base material A is conveyed in a horizontal posture by the conveying device 2, and the respective spray nozzles 3 are disposed opposite to each other for the substrate A to be conveyed. The treatment liquid B is discharged, and the base material A is treated with the treatment liquid B. The transporting device 2 is a linear linear roller group 4, and the roulette group 6 which is arranged at a constant pitch on the rotating shaft 5 is typically used. Then, the linear forward roller group 4 and the disk group 6 are disposed below the base plate A or on the upper and lower sides as shown. Further, as the spray nozzle 3, as shown in Fig. 7 (1) and Fig. 7 (2), the completely conical nozzle for ejecting the treatment liquid B in a conical shape is also shown in Fig. 7 (3). As shown in Fig. 7 (4) and Fig. 7 (5), the slit nozzle for ejecting the treatment liquid B in a film form is typically used. Thereafter, as described above, the spray nozzles 3 are arranged in a plurality of positions on the upper side or the upper and lower sides of the base material sheet A as shown in the figure. For example, the following Patent Document 1 (see the conventional example of Fig. 7), Patent Document 2 (see Fig. 5, Fig. 6, and Fig. 7) Conventional example), Patent Document 3 (refer to the conventional example of Fig. 5) and the like. [Patent Document 1] Japanese Patent Publication No. 3 0 0 487 [Patent Document 2] Patent No. 3 47 9 6 36 [Patent Document 3] JP-A-200-B 7 1 4789 No. 99007 However, the above-described conventional example In the surface treatment apparatus 1 of the substrate A, the following problems are questioned. (First problem) First, in the surface treatment apparatus 1 of the above-described conventional example, the treatment liquid B discharged from the spray nozzle 3 is first used as shown in Fig. 7 The thicker the pressure, the closer the outer side becomes looser. The lower the pressure, the type of spray nozzle C, that is, the spray nozzle type C that follows the shading, the base plate is sprayed, and therefore, the impact of the base plate is An error has occurred. φ At the same time, when the spray nozzle 3 is in the case of a completely conical nozzle shown in (1) and (2) of Fig. 7, the treatment liquid B is ejected in a conical shape or a pyramid shape. The base sheet A is not sprayed and is relatively high for the straight feed roller 4 of the handling device 2 or when the weight is ejected for the wheel 6. Then, the impact on the substrate A is weakened. In other words, the treatment liquid B is a spray type C (for example, a front-rear size of 150 mm) formed by the treatment liquid B due to excessive scattering in the conveyance direction D before and after, and greatly exceeds the space E of the conveyance device 2. Will greatly exceed β. The space between the straight-moving roller 4 and the wheel 6 to form a treatment liquid Β spray space Ε (for example, the front and rear dimensions of 30 mm) is also the effective area, causing scattering and wasting. On the other hand, the spray nozzle 3 is in the first In the case of the slit nozzles shown in Fig. 3 (3), Fig. 7 (4), and Fig. 7 (5), the treatment liquid β is formed into a film shape and is ejected in a substantially fan shape. In the direction of the transport direction D before and after the sheet A, it is ejected in a relatively thin front and rear width dimension. In the case of the base material A, the processing liquid B is in the form of a horizontal film having a narrow width in the front and rear conveyance directions, and is mainly ejected in a substantially linear shape in the width direction F of the left and right, and then The spray type C formed can only partially utilize the space of the space, that is, the extreme narrow portion. Therefore, the treatment effect on the base sheet A is limited.
如此，在此類型之習知例之表面處理裝置1，噴射到 基板材A之處理液B之噴霧類型C，跟隨著濃淡的同時，因 未噴射到基板材A而過剩且浪費地飛散於前後，形成寬度 狹窄之間歇性之弱小衝擊。 因此，關於基板材A的藥水處理方面，例如關於在顯 像處理，蝕刻處理，剝膜處理，處理準確度和處理能力上 具有問題而受到指正。Thus, in the surface treatment apparatus 1 of the conventional example of this type, the spray type C of the treatment liquid B sprayed to the base material A follows the gradation, and is excessively and wastefully scattered before and after being sprayed onto the base material A. , forming an intermittent small weak impact with a narrow width. Therefore, regarding the syrup treatment of the base material A, for example, there is a problem in terms of development processing, etching treatment, film peeling treatment, processing accuracy, and processing ability, and it is corrected.
也就是說，如前述所形成之電路其高密度化，細微化 相當顯著，幾乎不容許誤差之基板材A及其基板，基板材A 其處理之遲緩·不均-之地方會偏頗地產生，因此所形成 之電路寬度會過細而產生偏差•誤差，存在有處理準確度 不佳之問題。還有，在將噴霧噴嘴3作爲狹縫噴嘴之場合 中，形成於左右之寬度方向F之電路，與形成於前後之搬 運方向D之電路比較之下，因處理液B之流動所產生之衝 擊過強，處理過快而形成過度細小，在此方面，電路上亦 容易產生誤差。 又，處理液B之浪費多，處理上浪費時間等，處理速 度與處理能力亦存在有問題而受到指正。 (第2問題點） 一 9一 1299007 第2，從噴霧噴嘴3噴射到基板材A之處理液B，係向 左方或右方之寬度方向F流過基板材A外表面進行藥水處 理之後，然後從左右兩旁邊流下。 但是，在習知例之表面處理裝置1方面，特別是噴霧 噴嘴3爲狹縫噴嘴的場合時，受到噴出之處理液B，不僅朝 向是左右之寬度方向F亦朝向前後的搬運方向D流過基板 材A之外表面，如第8圖之（1)所示般，形成積存液G之後 滯留於基板材A之外表面很多。 又，前述之噴霧噴嘴3，乃是對於受到搬運之基板材A · 相對向且複數個設置於前後左右，然而在前後的搬運方向D 方面乃是位於與其他的噴霧噴嘴3之位置，與噴射中心重 疊地排列。 如此，在習知例之表面處理裝置1，從各噴霧噴嘴 3所 噴射出之處理液B之噴射中心，係沿著搬運方向D加以覆 蓋重疊，以前後之搬運方向D流過基板材A的外表面，形 成積存液G而滯留之現象很多。因此，關於基板材A之藥 水處理方面，例如在顯像處理，蝕刻處理，剝膜處理上， ® 由此方面來看，其處理準確度和處理能力上具有問題受到 指摘。 也就是，關於基板材A之基板，會由於噴射中心的重 疊、向前後之流動、積存液G等起因，而產生處理之遲緩 、不均-，然後在所形成之電路寬度上產生偏差、誤差， 存在有處理準確度不佳之問題。同時，處理液B的浪費多 ，處理上浪費時間等，處理速度與處理能力亦存在有問題 - 1 0- 1299007 (第3之問題點） 第3，此類型之基板材A，係如前述般，極薄化·柔軟 化相當顯著。在習知例之表面處理裝置1，將前述基板材A ，由搬運裝置2之直進滾輪群4與輪盤群6進行搬運，從 噴霧噴嘴3將處理液B噴出時，所噴出之處理液B之重量 爲起因，產生了搬運上的麻煩Η。 也就是說，關於基板材Α，如第8圖之（1)、第8圖之（2) 所示般，容易產生彎曲，波狀化、皺摺、折彎、腰折，下 垂，卡住、纒繞、落下、損壞等搬運上之麻煩Η。 如此，在習知例之表面處理裝置1方面，容易產生搬 運上的麻煩Η，因此，由此方面來看，基板材Α之處理準確 度和處理能力問題亦受到指摘。也就是說，關於基板材A 之基板·搬運上之麻煩Η爲起因，產生處理之不均一’然 後電路寬度會產生偏差、誤差的同時’浪費亦變多’之後 處理準確度和處理能力亦產生了問題。 (三）發明內容 本發明之基板材之表面處理裝置，係有鑒於前述實際 問題，以解決前述習知之問題爲目的。 然後，關於由噴霧噴嘴所噴出之處理液’其特徵係設 置有調整對基板材之噴霧類型之調整機構。也就是說’其 特徵爲採用存在前後間隔而相對向之一對的限制板。 又，除此之外，其特徵爲將各噴霧噴嘴朝向左右而傾 斜地排列設置，並且前後不重疊地排列設置。又，其特徵 1299007 利範圍第6項之基板材之表面處理裝置，其特徵爲在申請 專利範圍第5項，噴霧噴嘴，關於在前後的搬運方向方面 ，位於不與其他噴霧噴嘴相對向之位置，其噴射中心未重 疊而向左右之寬度方向偏離般地排列設置。 關於申請專利第7項係如以下所述。申請專利範圍第 7項之基板材之表面處理裝置，在申請專利範圍第6項，前 述基板材，係相當薄且富有柔軟性；前述搬運裝置係將基 板材上下挾持進行搬運，具有水平之上方直進滾輪群與水 平之下方齒型滾輪群。前述直進滾輪群與齒型滾輪群，除 # 了與噴霧噴嘴相對向位置之處理液噴射用的間隔空間之外 ，以上下對應地排列設置，前述間隔空間，具有至少平衡 處理液之噴霧類型之區域，而作爲特徵。 關於申請專利第8項係如以下所述申請專利第8項之 基板材之表面處理裝置，在申請專利範圍第7項，前述直 進滾輪群，係具備有挾持前述間隔空間而位於相對向位置 之前後一對限制滾輪，其特徵爲該限制滾輪，會限制•阻 止所噴出之處理液會以前後之搬運方向流過基板材的外表 ® 面。 申請專利範圍第9項係如以下所述。申請專利範圍第 9項之基板材之表面處理裝置，在申請專利範圍第8項，前 述齒型滾輪群之齒型滾輪，係凹部和凸部在左右方向以相 同節距交互地多數形成之凹凸元件，外嵌固定於軸上。如 此，前後之齒型滾輪，除了間隔空間之外，其凹部和凸部 ，係以對應位置下而具有些許間隙之非接觸狀態下，滑動 一 1 4 一 1299007 插入旋轉重疊後進行咬合，而作爲特徵。 (關於作用） 本發明因係如上述所形成，而成爲如以下所述。 (1 )本表面處理裝置，係使用基板之製造程序，對基板 進行藥水處理。具有般運用搬運裝置、處理液之噴霧噴嘴 、調整噴霧類型之調整機構。That is to say, the circuit formed as described above is highly densified, and the miniaturization is remarkable, and the base material A and its substrate which hardly allow error, and the slowness and unevenness of the processing of the base material A are generated unevenly. Therefore, the width of the circuit formed is too small to cause variations and errors, and there is a problem that the processing accuracy is not good. Further, when the spray nozzle 3 is used as a slit nozzle, the circuit formed in the width direction F of the right and left is compared with the circuit formed in the front and rear transport direction D, and the impact due to the flow of the treatment liquid B Too strong, too fast to form too small, in this respect, the circuit is also prone to errors. Further, the waste of the treatment liquid B is large, the time is wasted in the treatment, and the processing speed and the processing capability are also problematic and corrected. (Second problem point) 9:1299007 Second, the treatment liquid B sprayed from the spray nozzle 3 to the base material A flows through the outer surface of the base material A in the width direction F of the left or the right to perform the syrup treatment. Then flow down from the left and right. However, in the case of the surface treatment apparatus 1 of the conventional example, in particular, when the spray nozzle 3 is a slit nozzle, the processing liquid B that is discharged is flowed not only in the width direction F but also in the forward and backward conveyance direction D. The outer surface of the base material A has a large amount of surface remaining on the outer surface of the base material A after forming the accumulation liquid G as shown in Fig. 8 (1). Further, the spray nozzle 3 described above is disposed on the front and rear left and right sides of the base material A· to be conveyed, but is located at a position adjacent to the other spray nozzles 3 in the front and rear conveyance directions D, and is sprayed. The centers are arranged in an overlapping manner. As described above, in the surface treatment apparatus 1 of the conventional example, the injection center of the treatment liquid B ejected from each of the spray nozzles 3 is covered and overlapped in the conveyance direction D, and the conveyance direction D flows through the base material A in the subsequent direction. There are many phenomena in which the outer surface forms the accumulation liquid G and stays. Therefore, regarding the syrup treatment of the base material A, for example, in the development processing, the etching treatment, and the stripping treatment, ® from this point of view, the processing accuracy and the processing ability are problematic. That is, with respect to the substrate of the base material A, there is a delay or unevenness in the processing due to the overlap of the ejection center, the flow to the front and the back, the accumulation of the liquid G, and the like, and then variations and errors occur in the width of the formed circuit. There is a problem with poor processing accuracy. At the same time, the waste of the treatment liquid B is too much, the time is wasted on the treatment, and the processing speed and the processing capacity are also problematic - 1 0 - 1299007 (question point 3) 3rd, the base material A of this type is as described above It is extremely thin and soft and quite remarkable. In the surface treatment apparatus 1 of the prior art, when the base material sheet A is conveyed by the straight feed roller group 4 of the conveying device 2 and the roulette group 6, and the processing liquid B is ejected from the spray nozzle 3, the treated liquid B is ejected. The weight is the cause, causing trouble in handling. In other words, as for the base sheet Α, as shown in Fig. 8 (1) and Fig. 8 (2), it is easy to cause bending, wavy, wrinkles, bends, waist folds, sagging, and jamming. Trouble with handling, swaying, falling, damage, etc. As described above, in the surface treatment apparatus 1 of the prior art, troubles in transportation are liable to occur, and therefore, the handling accuracy and handling ability of the substrate sheet are also pointed out from this point of view. That is to say, regarding the trouble of the substrate and the transportation of the base material A, the processing is uneven, and then the circuit width is deviated, the error is caused, and the waste is also increased. The processing accuracy and the processing capability are also generated. The problem. (III) SUMMARY OF THE INVENTION The surface treatment apparatus for a base material of the present invention has an object of solving the above-mentioned conventional problems in view of the above-mentioned practical problems. Then, the treatment liquid ejected by the spray nozzle is characterized by an adjustment mechanism for adjusting the type of spray to the base material. That is to say, 'characterized by using a restriction plate having a front-to-back interval and a pair facing each other. Further, in addition to this, it is characterized in that each of the spray nozzles is arranged obliquely toward the left and right, and is arranged side by side without overlapping. Further, the surface treatment apparatus of the base material of item No. 2,299,007, which is characterized in that in the fifth aspect of the patent application, the spray nozzle is located at a position opposite to the other spray nozzles in terms of the front and rear conveyance directions. The ejection centers are arranged so as to be offset from each other in the width direction of the left and right. The seventh item of patent application is as follows. The surface treatment device for the base material of claim 7 is in the sixth aspect of the patent application, wherein the base plate is relatively thin and flexible; and the conveying device holds the base plate up and down for transport, and has a level above Straight forward roller group and horizontal lower gear roller group. The straight-in roller group and the tooth-shaped roller group are arranged in the upper and lower portions in addition to the space for spraying the processing liquid at a position opposite to the spray nozzle, and the space is at least balanced with the spray type of the treatment liquid. Area, and as a feature. In the eighth aspect of the patent application, the surface treatment device for a base material according to the eighth aspect of the invention is the seventh aspect of the patent application, wherein the straight-in roller group is provided with the space of the opposite position and is located at a relative position. A pair of front and rear restraining rollers, characterized by the restricting roller, which limits the prevention of the flow of the sprayed liquid flowing through the outer surface of the base material in the forward and backward direction of transport. The ninth item of the patent application scope is as follows. The surface treatment device for the base material of the ninth application of the patent application, in the eighth aspect of the patent application, the toothed roller of the toothed roller group, wherein the concave portion and the convex portion are alternately formed at the same pitch in the left-right direction. The component is externally fixed to the shaft. In this way, the front and rear toothed rollers, except for the space, the concave portion and the convex portion are in a non-contact state with a slight gap under the corresponding position, and the sliding one 14 4299007 is inserted and rotated to be engaged, and the feature. (About action) The present invention is formed as described above and is as follows. (1) In the surface treatment apparatus, the substrate is subjected to a syrup treatment using a manufacturing procedure of the substrate. It has a spray nozzle that uses a handling device, a treatment liquid, and an adjustment mechanism that adjusts the type of spray.
(2 )搬運裝置係除了間隔空間以外，上下對應地設置有 直進滾輪群與齒型滾輪群。間隔空間，具有至少平衡處理 液之噴霧類型之區域。 (3 )噴霧噴嘴係相對向於基板材而遍佈前後左右地複 數個排列設置，朝向左右方向的同時，以具有傾斜之噴射 角度般受到設置，朝向左方之噴霧噴嘴之列與朝向右方之 噴霧噴嘴之列之設置個數係相同，在每一列上均設置有前 述調整機構。此外，前後方向上其噴射中心未重疊而偏離 般地排列設置。(2) The transport device is provided with a straight-in roller group and a toothed roller group in addition to the space in the upper and lower portions. The compartment has an area that at least balances the type of spray of the treatment liquid. (3) The spray nozzles are arranged in a plurality of rows in front, rear, left, and right with respect to the base plate, and are disposed in the left-right direction as well as the spray angles of the inclined, toward the left of the spray nozzles and toward the right. The number of the spray nozzles is the same, and the aforementioned adjustment mechanism is provided in each column. Further, the ejection centers are arranged in an offset manner without overlapping in the front-rear direction.
(4 )調整機構係具備有存在相對向之限制板，噴霧噴 嘴係複數個設置於面對前述限制板之前後間隔之間。限制 板係具有平衡基板材之左右寬度之左右長度。然後，處理 液會垂直通過前後間隔，噴向前後方向之處理液會受到反 射、屈折。又，調整機構，亦可容易地以後置安裝方式進 行安裝。 (5 )因此，處理液由該噴霧噴嘴朝向左方或朝向右方 傾斜地持續噴出之後β經已調整機構作區域調整，噴霧類 型受到調整之後噴射到基板材—朝向左方或朝向右方地流 -15- 1299007 過基板木材的外表面進行藥水處理之後—從左右兩旁流下 〇 (6) 然後，由表面處理裝置來看，第1、處理液雖然是 由完全圓錐型噴嘴所噴出-藉由調整機構將，依既定前後 寬度進行區域調整-形成並無濃淡差別之噴霧類型之後， 噴到基板材。—因此，對於基板材而言，a .無濃淡差別地 受到噴射、b .以平衡搬運裝置之間隔空間後之前後寬度受 到噴射、c .狹窄之前後寬度係不會受到噴射。 由此，由表面處理裝置來看，基板材之藥水處理不會 β 遲緩而可均一化，所形成之電路寬度之誤差會受到解除， 例如左右方向之電路會形成與前後方向之電路相同電路之 電路寬度。又，不會造成處理液之浪費，可提高處理速度 〇 (7) 第2，將噴霧噴嘴朝向左右同時傾斜地排列設置， 並且前後偏移地加以排列設置。此外，搬運裝置之直進滾 輪群中更具備有滾輪群。 然後，處理液不會流向基板材之前後方向，不會形成 ^ 積存液，亦不會覆蓋噴射中心。本表面處理裝置，在此方 面，其藥水處理受到均一化而解除誤差，不會造成處理液 之浪費，可提高處理速度。 (8) 第3、作爲搬運裝置，係將直進滾輪群與齒型滾輪 群上下組合加以採用。然後，即使基板材其極薄化、柔軟 化相當顯著，對於處理液之重量與噴射壓，將齒型滾輪維 持於中心，受到支撐而無麻煩地加以搬運。 、 -1 6 - 1299007 本表面處理裝置，在此方面，其藥水處理受到均一化 而解除誤差，不會造成處理液之浪費，可提高處理速度。 (發明之效果） (本發明之特徵） 與本發明有關之基板材的表面處理裝置，係如前述般 ’就由噴霧噴嘴所噴出之處理液而言，其特徵爲設置有調 整對於基板材之噴霧類型之調整機構。也就是說，其特徵 爲採用存在前後間隔而相對向之限制板。 除4此之外，其特徵更爲將各噴霧噴嘴朝向左右並傾斜 β 地排列設置，並且前後不重疊地排列設置。又，關於輸送 裝置，其特徵爲採用上方之直進滾輪群·與下方之齒型滾輪 群。然後，本發明之基板材的表面處理裝置，可發揮以下 之效果。 (第1效果） 第1，處理準確度與處理能力提高。也就是，在本發 明之表面處理裝置，由噴霧噴嘴所噴出之處理液，係藉由 調整機構依既定之前後間隔作區域調整，集中於濃淡差別 ® 少之噴霧類型，噴射到基板材。然後，以平衡搬運裝置之 間隔空間之前後寬度，適切地予以分布而噴射。 接著，如前述之習知例所述般，愈靠近噴射中心愈濃 密壓力愈高之現象受到解除，又，亦可防止搬運裝置之直 進滾輪或齒型滾輪受到噴射，此外，更不會造成如前後寬· 度狹窄之略呈薄膜狀般之噴射現象。 因此，依本發明之表面處理裝置，基板材然後基板之 - 17- 1299007 藥水處理，不會遲緩而可均一化，電路寬度之偏差•誤差 受到解除，提高處理準確度。又，沒有處理液的浪費，處 理速度而且，電路之高密度化、細微化會變得明顯，對於 幾乎不允g午有5吳差之基板而g »其意義相當重大。 又，前述調整機構，後置安裝亦可容易地進行安裝。 (第2效果） 第2，受到噴射之處理液，會向左右滯留而流過基板 材，由此方面來看，可提高處理準確度與處理能力。 也就是，以本發明之表面處理裝置，.，將各噴霧噴嘴朝 向左右並傾斜地排列設置，並且前後不重疊地排列設置。 又’搬運裝置之直進滾輪群係具備有限制滾輪群。因此， 如前述習知例般，受噴射之處理液向前後方向流過基板材 之現象受到限制，積存液亦受到解除，噴射中心係不會在 噴射方向上造成覆蓋重疊。 因此’由本發明之表面處理裝置方來看，基板材然後 基板之藥水處理，不會遲緩而可均一化，電路寬度之偏差 •誤差受到解除，提高處理準確度。又，不會造成處理液 之浪費，可提高處理速度。 (第3效果） 第3，搬運上的麻煩可受到防止，就此方面來看，提 高了處理準確度與處理能力。也就是，以本發明之表面處 理裝置’作爲搬運裝置，係將直進滾輪群與齒型滾輪群上 下組合加以採用。由上方之噴霧噴嘴所噴出之處理液之重 M ’以下方之齒型滾輪充分地受到支撐。 -18 - 1299007 因此，即使基板材其極薄化、柔軟化相當顯著’由本 發明之表面處理裝置方來看，可防止前述習知例所述之彎 曲，波狀化、皴摺、折彎、腰折’下垂’卡住、纏繞、落 下、損壞等搬運上之麻煩。 因此，由此方面來看，基板材然後基板之藥水處理， 可受到均一化，電路寬度之偏差•誤差受到解除，提高處 理準確度。又，不會造成處理液之浪費，可提高處理速度 〇 如此，存在於習知例之問題全部受到解決，本發明所 發揮之效果，顯著而且相當大。 (四）實施方法 以下，將根據圖面所示之本發明之最佳實施例，詳細 地說明本發明之基板材之表面處理裝置。第1圖、第2圖 、第3圖、第4圖、第5圖、第6圖等係說明本發明之最 佳實施例之說明圖。 然後，第1圖係有關於本發明之基板材的表面處理裝 置，說明實施本發明之最佳形態之重要部位側視剖面說明 圖。第2圖係說明實施本發明之最佳形態之前方剖面說明 圖。第3圖（調整手段的圖I V已省略）係說明實施本發明之 最佳形態之噴霧噴嘴的全體平面圖。第4圖係說明實施本 發明之最佳形態之重要部位平面圖，第4圖之（1 )係表示向 左方向流的處理液，第4圖之（2 )係表示向右方向流的處理 液。 第5圖之（1 )係調整機構其一例之側視剖面圖，第5圖 一 1 9一 1299007 之（2 )係調整機構其他例子之側視剖面圖，第5圖之（3 )係 朝向左方之噴霧噴嘴列等之平面剖面圖，第5圖之（4 )係朝 向右方之噴霧噴嘴列等之平面剖面圖。第6圖係說明實施 本發明之最佳形態之齒型滾輪群之平面剖面圖。又，第9 圖係將基板（基板材）模組化之平面說明圖。 (關於基板J) 基板材A之表面處理裝置7，係使用於電路K用之基 板Γ之製造程序。首先，參照第9圖，說明基板7之槪略(4) The adjustment mechanism is provided with a relative restriction plate, and the plurality of spray nozzles are disposed between the front and rear intervals facing the restriction plate. The limiting plate has a length to the left and right of the width of the balance substrate. Then, the treatment liquid passes vertically through the front and rear intervals, and the treatment liquid in the forward and backward directions is reflected and inflected. Moreover, the adjustment mechanism can be easily installed in a later installation manner. (5) Therefore, the treatment liquid is continuously ejected obliquely from the spray nozzle toward the left or toward the right, and the β is adjusted by the adjusted mechanism, and the spray type is adjusted and then ejected to the base sheet - toward the left or toward the right. -15- 1299007 After the syrup treatment of the outer surface of the substrate wood - 〇 (6) from both sides of the substrate, and then, by the surface treatment device, the first treatment liquid is ejected by the full cone nozzle - by adjustment The mechanism will adjust the area according to the predetermined front and rear widths - after forming a spray type that does not have a difference, spray it onto the base material. - Therefore, for the base material, a. is sprayed without bluishness, b. After balancing the space between the transporting devices, the front and rear widths are sprayed, and c. The width is not sprayed before and after the narrowing. Therefore, from the viewpoint of the surface treatment device, the syrup treatment of the base plate is not uniform and can be uniformized, and the error of the formed circuit width is released. For example, the circuit in the left and right direction forms the same circuit as the circuit in the front and rear direction. Circuit width. Further, the processing liquid is not wasted, and the processing speed can be increased. (7) Second, the spray nozzles are arranged obliquely toward the right and left, and are arranged side by side. In addition, the roller group of the transport device has a roller group. Then, the treatment liquid does not flow to the front and rear directions of the base material, and does not form a reservoir or cover the injection center. In the surface treatment device, the syrup treatment is uniformized to cancel the error, and the treatment liquid is not wasted, and the processing speed can be improved. (8) Third, as the transporting device, the straight-in roller group and the toothed roller group are combined up and down. Then, even if the base material is extremely thin and soft, the toothed roller is held at the center for the weight of the processing liquid and the ejection pressure, and is supported without any trouble. -1 6 - 1299007 The surface treatment apparatus is characterized in that the syrup treatment is uniformized to cancel the error, and the treatment liquid is not wasted, and the processing speed can be improved. (Effects of the Invention) The surface treatment apparatus for a base material according to the present invention is characterized in that, as described above, the treatment liquid sprayed from the spray nozzle is characterized in that adjustment is provided for the base material. Spray type adjustment mechanism. That is to say, it is characterized in that the front and rear intervals are used to limit the plates. In addition to the above, the spray nozzles are arranged such that the spray nozzles are arranged side by side and inclined by β, and are arranged side by side without overlapping. Further, the conveying device is characterized in that the upper straight roller group and the lower tooth roller group are used. Then, the surface treatment apparatus for a base material of the present invention exerts the following effects. (First effect) First, processing accuracy and processing ability are improved. That is, in the surface treatment apparatus of the present invention, the treatment liquid sprayed by the spray nozzle is adjusted by the adjustment mechanism in accordance with the predetermined interval, and is concentrated on the spray type of the difference between the shade and the spray. Then, it is appropriately distributed and sprayed by balancing the space before and after the space of the conveying device. Then, as described in the above-mentioned conventional example, the higher the pressure is, the higher the pressure becomes closer to the center of the spray, and the phenomenon that the straight-in roller or the toothed roller of the conveying device is prevented from being sprayed, and further, A film-like spray phenomenon with a narrow width and a narrow front and back. Therefore, according to the surface treatment apparatus of the present invention, the base material and then the substrate - 17 - 1299007 syrup treatment can be uniform without delay, and the deviation of the circuit width and the error are released, thereby improving the processing accuracy. Further, there is no waste of the treatment liquid, and the processing speed is high, and the density and the miniaturization of the circuit become conspicuous. For the substrate which has almost no difference, the meaning of g is very significant. Further, the adjustment mechanism can be easily mounted after the rear mounting. (Second effect) Second, the processing liquid to be ejected flows to the left and right and flows through the substrate, whereby the processing accuracy and the processing ability can be improved. That is, in the surface treating apparatus of the present invention, the respective spray nozzles are arranged side by side and obliquely, and are arranged side by side without overlapping. Further, the straight-forward roller group of the handling device is provided with a restricted roller group. Therefore, as in the conventional example described above, the phenomenon in which the sprayed treatment liquid flows through the base material in the front-rear direction is restricted, and the accumulation liquid is also released, and the injection center does not cause overlap in the injection direction. Therefore, from the viewpoint of the surface treatment apparatus of the present invention, the treatment of the base material and then the substrate can be uniform without delay, and the deviation of the circuit width can be eliminated, thereby improving the processing accuracy. Moreover, the waste of the treatment liquid is not caused, and the processing speed can be increased. (Third effect) Third, the trouble of handling can be prevented, and in this respect, processing accuracy and processing ability are improved. That is, with the surface treating apparatus 'of the present invention as the conveying means, the straight running roller group and the toothed roller group are combined in combination with the upper and lower. The toothed roller below the weight M' of the treatment liquid sprayed from the upper spray nozzle is sufficiently supported. -18 - 1299007 Therefore, even if the base sheet is extremely thin and soft, it is quite remarkable. From the viewpoint of the surface treatment apparatus of the present invention, it is possible to prevent the bending, undulation, folding, bending, and the like described in the above conventional examples. The waist fold 'sag' is troublesome to jam, entangle, drop, damage, etc. Therefore, from this point of view, the syrup treatment of the base plate and then the substrate can be uniformized, and the deviation of the circuit width and the error are released, thereby improving the processing accuracy. Further, the waste of the treatment liquid is not caused, and the processing speed can be improved. Thus, the problems existing in the conventional examples are all solved, and the effects exerted by the present invention are remarkable and considerable. (4) Method of implementation Hereinafter, a surface treatment apparatus for a base material of the present invention will be described in detail based on a preferred embodiment of the present invention shown in the drawings. Fig. 1, Fig. 2, Fig. 3, Fig. 4, Fig. 5, Fig. 6, etc. are explanatory views for explaining a preferred embodiment of the present invention. 1 is a surface treatment apparatus for a base material of the present invention, and a side cross-sectional explanatory view of an important part for carrying out the best mode of the present invention will be described. Fig. 2 is a cross-sectional explanatory view showing the best mode for carrying out the invention. Fig. 3 (the figure I V of the adjustment means is omitted) is a plan view showing the entire spray nozzle which is the best mode for carrying out the invention. Fig. 4 is a plan view showing an important part for carrying out the best mode of the present invention. Fig. 4 (1) shows a treatment liquid flowing in the left direction, and Fig. 4 (2) shows a treatment liquid flowing in the right direction. . Fig. 5 (1) is a side cross-sectional view showing an example of an adjusting mechanism, and Fig. 5 is a side sectional view showing another example of the adjusting mechanism of (2), and Fig. 5 (3) is oriented A plan sectional view of a spray nozzle row or the like on the left side, and (4) in Fig. 5 is a plan sectional view showing a spray nozzle row or the like toward the right. Figure 6 is a plan sectional view showing a toothed roller group in which the best mode of the present invention is carried out. Further, the ninth drawing is a plan explanatory view in which a substrate (base material) is modularized. (About Substrate J) The surface treatment apparatus 7 of the base material A is a manufacturing procedure for the substrate used for the circuit K. First, referring to FIG. 9, the description of the substrate 7 will be described.
電路K用之基板J係廣泛地使用於各種電子機器上， 存在有單層基板、雙層基板、以及多層基板（含最近之集結 法之物件）等各種物件。接著，作爲前述基板J之一環，I C 、LS I元件、被動元件、驅動元件、電容等之半導體元件， 出現有與電路K 一體組合之模組基板（半導體之一體型封裝 基板）、將電路K與半導體元件埋入玻璃本體之玻璃基板、 也就是等離子顯示器PDP用之玻璃基板或是液晶LCD用之 玻璃基板、CSP、PBGA等。 當然，本發明所述之基板；[係指除了習知之印刷電路 基板之外，亦廣泛地包含有前述物件。 接著，前述之電路K用之基板〗方面，例如伴隨著行 動電話、照相機等電子機器之高性能化、高功能化、小型 輕量化，高準確度化、細微化、然後極薄化、柔軟化，更 朝向多層化、多樣化等進步，形成外表面也就是上面•表 面或是下面•裡面之一方又或者是雙方之電路K，形成於更 -20 - 1299007 內部之電路κ之高密度化、細微化係相當顯著。 基板J方面例如印刷電路基板，其長寬例如爲500mmX 5 0 0mm程度。其肉厚方面，絕緣層（核心元件）部分，由習知 之1 · 6龍到1 · 〇mm〜60 μ m程度爲止，持續極薄化中。 路K部分（銅泊部分）之肉厚’由75/ΖΙΏ〜35//Π1，到目 前之16//m〜10//m前後程度爲止受到極薄化。即使在多層基 板之場合中，全體之肉厚亦持續極薄化到l.〇mm〜〇.4m程度 。電路K寬度或是電路K間之空間亦由30 // m〜1 5 # m到目 前的1 0 // m爲止，具有細微化之傾向。 φ 基板〗係槪略如以上所述。 (關於基板J之製造方法之實施例） 接著，針對使用於本發明之基板材A之表面處理裝置 7之基板J之製造方法，參照第1圖與第9圖加以說明。首 先，針對第1實施例之製造方法加以說明。在第1實施例 之製造方法，基板J例如印刷電路基板係由以下之步驟加 以製造。 首先，最初準備好在玻璃製、陶瓷製、又或者是薄片 ® 狀樹脂製之絕緣層（核心元件）之外表面，藉由熱沖壓等貼 附上銅箔之銅箔層積板之基板材A。 然後，針對前述所準備之基板材A，在所貼附之銅箔 表面進行粗化之表面粗化處理（軟性鈾刻）之後，切成較短 之工作物大小。表面化處理，在以往係藉由機械硏磨加以 進行，最近藉由處理液B之噴射之方式變多。 然後，在多數之場合中，通孔用之開孔加工，係使用 - 21 - 1299007 雷射等。該通孔，係由基板A (基板J )之兩外表面間之細微 貫穿孔所構成，每一片上，極小口徑之貫穿孔係形成有數 百個，其口徑以〇 · 5mni〜0 · 2mm程度以下較多。然後，通孔 係作爲兩外表面之電路K (銅箔）間或是多層基板之電路κ ( 銅箔）間其層與層之間導通連接用，以及作爲實裝於電路K 上之元件之安裝用。 又’最近，以形成小突起狀、略呈圓錐狀作爲連接點 之突點，取代需要開孔加工之通孔，在多層基板方面，藉 由該突點已開發出實現與通孔相同功能之技術。又，前述 Φ 突點，係根據電路K經過顯像處理、蝕刻處理、以及剝膜 處理所加以製造。 然後，前述之基板材A其銅箔之外表面（上面•表面也 就是下面•裡面之一方又或者是雙方）上，塗抹或是貼附有 膜狀之感光性抗阻。接著，與作爲電路K之底片電路照片 之相接觸，藉由曝光之方式，外表面之感光性抗阻，會留 下因曝光而硬化之電路K形成部分，其他不需要之部分， 係藉由作爲處理液B之顯像液之噴射加以溶解除去。 ® 然後，前述基板材A之銅箔，會留下感光性阻抗硬化 而受到覆蓋之電路K之形成部分，藉由顯像感光性阻抗受 到溶解除去而露出之部分，係藉由作爲處理液B之蝕刻液（ 氯化亞銅、氯化亞鐵、或其他腐蝕液）之噴射，加以溶解除 去·蝕刻。The substrate J for the circuit K is widely used in various electronic devices, and includes various materials such as a single-layer substrate, a two-layer substrate, and a multilayer substrate (including the most recent assembly method). Then, as a ring of one of the substrates J, a semiconductor element such as an IC, an LS I element, a passive element, a driving element, and a capacitor, a module substrate (semiconductor type package substrate) integrally formed with the circuit K appears, and the circuit K is formed. The glass substrate embedded in the glass body with the semiconductor element, that is, the glass substrate for the plasma display PDP or the glass substrate for the liquid crystal LCD, CSP, PBGA, or the like. Of course, the substrate of the present invention; [refers to the above-mentioned items in addition to the conventional printed circuit board. In the case of the substrate for the circuit K described above, for example, high performance, high functionality, small size and light weight of electronic devices such as mobile phones and cameras are used, and high accuracy, miniaturization, thinning, and softening are achieved. More progress toward multi-layering, diversification, etc., forming the outer surface, that is, the upper surface or the lower surface, one of the inside or the circuit K of both sides, and the circuit κ is formed in a higher density of -20 - 1299007. The miniaturization system is quite remarkable. For example, in the case of the substrate J, the printed circuit board has a length and a width of, for example, about 500 mm×500 mm. In terms of flesh thickness, the portion of the insulating layer (core component) is continuously thinned by the conventional 1 · 6 dragon to 1 · 〇 mm to 60 μ m. The meat thickness of the portion K (copper portion) is extremely thinned from 75/ΖΙΏ to 35//Π1 to the current level of 16//m to 10//m. Even in the case of a multi-layer substrate, the thickness of the whole body is continuously reduced to a thickness of l.〇mm~〇.4m. The width of the circuit K or the space between the circuits K is also from 30 // m to 1 5 # m to the current 1 0 // m, which has a tendency to be fine. The φ substrate is similar to the above. (Example of Manufacturing Method of Substrate J) Next, a method of manufacturing the substrate J of the surface treatment apparatus 7 used for the base material sheet A of the present invention will be described with reference to Figs. 1 and 9 . First, the manufacturing method of the first embodiment will be described. In the manufacturing method of the first embodiment, the substrate J, for example, a printed circuit board, is produced by the following steps. First, the base sheet of the copper foil laminated board to which copper foil is attached by hot stamping or the like is prepared on the outer surface of the insulating layer (core component) made of glass, ceramic, or sheet® resin. A. Then, the surface of the base material A prepared as described above is subjected to roughening surface roughening treatment (soft uranium engraving) on the surface of the attached copper foil, and then cut into a shorter workpiece size. The surface treatment has been carried out by mechanical honing in the past, and has recently been increased by the injection of the treatment liquid B. Then, in most cases, the through holes are processed by the opening, and the - 21 - 1299007 laser is used. The through hole is formed by a fine through hole between the outer surfaces of the substrate A (substrate J). On each piece, there are hundreds of through holes of a very small diameter, and the diameter thereof is 〇·5mni~0 · 2mm More than the extent. Then, the via hole serves as a conductive connection between the circuit K (copper foil) between the two outer surfaces or between the layers κ (copper foil) of the multilayer substrate, and as a component mounted on the circuit K. For installation. Moreover, recently, a bump having a small protrusion shape and a slightly conical shape as a connection point is formed, and a through hole which requires hole drilling is replaced. In terms of a multilayer substrate, the bump has been developed to achieve the same function as the through hole. technology. Further, the above-mentioned Φ bumps are produced by the development process of the circuit K, the etching process, and the stripping process. Then, the base material A of the above-mentioned base material A is coated or adhered with a film-like photosensitive resistance on the outer surface of the copper foil (the upper surface, the surface is also the one side or the inside or both sides). Then, in contact with the photo of the negative circuit as the circuit K, by exposure, the photosensitive resistance of the outer surface leaves a portion of the circuit K which is hardened by exposure, and other unnecessary portions are caused by The jet of the developing liquid of the treatment liquid B is dissolved and removed. Then, the copper foil of the base material A is left with a portion formed by the photosensitive circuit which is subjected to the photosensitive resistance hardening, and is exposed by the dissolution and removal of the photosensitive resistive impedance, and is used as the treatment liquid B. The etching solution (copper chloride, ferrous chloride, or other etching solution) is sprayed, removed, and etched.
接著，剩餘之電路K型程度份之感光性抗阻，係藉由 作爲處理液B之蝕刻液之噴射受到剝膜除去，留下之電路K -22 - 1299007 形成部分之銅箱，係在基板材A之外表面（上面•表面也就 是下面•裡面之一方又或者是雙方）上形成既定之電路K， 然後製造出基板J。 又，在前述顯像程序、蝕刻程序、剝膜程序中，分別 設置有後處理用，又或者是剝膜程序之後一並之後處理用 ，噴射水洗液、中和液以及其他洗淨液之洗淨程序，然後 ，附著於基板材A之外表面之顯像液、蝕刻液、剝離液爭 處理液B受到洗淨·除去。 第1實施例之製造方法，係由前述之濕式製作法所構 成。第1實施例之製造方法，係如以上所述。 接著，針對第2實施例之製造方法加以說明。基板J ，例如印刷電路基板之製造方法中，前述第1實施例之濕 式製造法係爲代表，第2 1實施例中多使用半添加法。 在半添加法方面，首先，在於先形成通孔之係在基板 材A之外表面（上面•表面也就是下面•裡面之一方又或者 是雙方）上，施加非電解銅之電鍍。然後，—將該非電解銅 之鍍銅上，將感光性抗組作膜狀之塗抹或是張貼之後，— 與作爲電路K薄膜之電路K照片接觸進行曝光。—然後， 感光性阻抗會留下受到曝光而硬化之部分，其他部分也就 是電路K形成部分會藉由作爲處理液B之顯像液之噴射加 以溶解除去。 又，殘 然後’—電路K形成部份，也就是說藉由顯像其感光 性阻抗受到溶解除去之鍍銅部份，也就是針對非電解銅鍍 銅其露出部分，施加電解銅電鍍之後形成電路K。— 一23 - 1299007 留之硬化的電路K形成部份以外之感光性阻抗，係藉由作 爲處理液Β之剝離液之噴射加以剝膜除去，—露出之非電 解銅鍍銅，係藉由作爲處理液Β之飩刻液之噴射加以蝕刻 後，而受到融化除去。—又，作爲各程序之後處理用，根 據前述之地方設置洗淨程序。 在第2實施例之半添加法方面，如前述般，在電解銅 鍍銅上形成電路Κ，然後製造基板J。第2實施例之製造方 法係如以上所述。 但是，印刷電路基板其他電路Κ用基板J之製造方法 ，最近越來越多樣化，上述之第1實施，第2實施例子以 外，亦有其他各種方法開發受到使用。本發明當然亦適用 於此類型之各種基板J。 (關於表面處理裝置7之槪要） 以下，針對本發明基板材Α之表面處理裝置7，參照 第1圖、第2圖、第3圖、第4圖、第5圖、第6圖，加 以說明。 表面處理裝置7，係使用於前述基板〗的製造程序中 ，將處理液B噴射到受到搬運之基板材A上，對基板材A 進行藥水處理。也就是，基板· J之製造方法的各程序中， 例如在顯像程序，蝕刻程序，或剝落膜程序等中，作爲裝 置顯像，蝕刻裝置，或作爲剝離裝置加以使用，對於受到 搬運基板材A，分別將顯像液、餓刻液，或剝離液等處理液 B加以噴射進行藥水處理、表面處理。 然後’在各表面處理裝置7中，共通地在處理室 8內 1299007 具備有搬運裝置9、噴霧噴嘴1 〇、以及調整機構1 1。也就 是說，將基板材Α作水平搬運之搬運裝置9、將處理液Β噴 \ 射到被搬運之基板材A上噴霧噴嘴1 0、以及在途中對於基 板材A其霧器類型之調整機構1 1。 表面處理裝置 7，槪略地如以上所述。 (關於搬運裝置9) 首先，針對表面處理裝置之搬運裝置9，參照第1圖 、第2圖、第4圖、第6圖，加以說明。 ； 搬運裝置9，係具備有由上下挾持基板材A進行搬運 ，呈水平之上方之直進滾輪1 2與呈水平之下方之齒型滾輪 群1 3。然後，直進滾輪群1 2和齒型滾輪群1 3，乃是除了 位於與噴霧噴嘴1 0相對向位置之處理液B噴射用之間隔空 間E之外，將進行搬運之基板材A加以挾持般上下對應地 排列設置。 間隔空間E，至少具備有與處理液B之噴霧類型L進 行平衡之區域。也就是間隔空間E，直進滾輪群1 2和齒型 滾輪群13之途中，各自間歇性地形成，在搬運方向 D上 下之形成位置會偏離的同時，分別位於與噴霧噴嘴1 0之相 對向位置。 然後，間隔空間E，係由與從噴霧噴嘴1 0所噴出支處 理液B之對於基板材A之噴霧類型L幾乎相同區域所構成（ 幾乎與搬運方向D其前後尺寸以及寬度方向F之左右尺寸 相同），或者是較噴霧類型L更爲廣泛之區域（較搬運方向D 其前後尺寸爲長，幾乎與寬度方向F之左右尺寸相同）。Then, the photosensitive resistance of the K-type portion of the remaining circuit is stripped and removed by the ejection of the etching liquid as the processing liquid B, leaving the circuit K -22 - 1299007 forming part of the copper box, which is based on A predetermined circuit K is formed on the outer surface of the sheet A (the upper surface, the surface, or the inside, or both), and then the substrate J is fabricated. Further, in the development program, the etching program, and the film stripping program, the post-processing is separately provided, or the stripping program is used after the stripping process, and the washing liquid, the neutralizing liquid, and the other washing liquid are washed. After the cleaning process, the developer liquid, the etching liquid, and the stripping liquid adhering to the surface of the base material A are washed and removed. The manufacturing method of the first embodiment is constituted by the above-described wet production method. The manufacturing method of the first embodiment is as described above. Next, a description will be given of a manufacturing method of the second embodiment. In the substrate J, for example, a method of manufacturing a printed circuit board, the wet manufacturing method of the first embodiment is representative, and in the second embodiment, a semi-additive method is often used. In the semi-additive method, first, a method of forming a through hole is to apply electroless copper plating on the outer surface of the substrate A (on the surface, the surface, or the inside, or both). Then, on the copper plating of the electroless copper, the photosensitive anti-assembly is applied or film-coated, and then exposed to the photo of the circuit K as the film of the circuit K. - Then, the photosensitive impedance leaves a portion which is hardened by exposure, and the other portion, that is, the portion where the circuit K is formed, is dissolved and removed by the ejection of the developing liquid as the processing liquid B. Moreover, the residue then forms a portion of the circuit K, that is, a copper plated portion which is dissolved and removed by the photosensitive resistive image, that is, an exposed portion of the electroless copper plated copper, which is formed by applying electrolytic copper plating. Circuit K. — A 23 - 1299007 The photosensitive impedance other than the portion of the hardened circuit K is stripped and removed by spraying as a stripping solution for the treatment liquid, and the exposed electroless copper plating is used as The jet of the liquid helium is etched and then removed by melting. - Again, as a post-processing for each program, the cleaning procedure is set according to the above-mentioned places. In the semi-additive method of the second embodiment, as described above, a circuit crucible is formed on the electrolytic copper-plated copper, and then the substrate J is produced. The manufacturing method of the second embodiment is as described above. However, the manufacturing method of the other circuit board substrate J for printed circuit boards has recently become more and more diverse. In addition to the first embodiment and the second embodiment described above, various other methods have been developed and used. The invention is of course also applicable to a variety of substrates J of this type. (Related to the surface treatment apparatus 7) Hereinafter, the surface treatment apparatus 7 of the base sheet of the present invention is referred to the first, second, third, fourth, fifth, and sixth figures. Description. The surface treatment apparatus 7 is used in the manufacturing process of the above-mentioned substrate, and the processing liquid B is sprayed onto the substrate A to be conveyed, and the base material A is subjected to a syrup treatment. In other words, in each of the processes of the manufacturing method of the substrate J, for example, in a developing process, an etching process, or a peeling film process, it is used as a device development, an etching device, or as a peeling device, and is used for a substrate to be conveyed. A. The treatment liquid B such as a developing solution, a starving solution, or a peeling liquid is sprayed to perform a syrup treatment and a surface treatment. Then, in each of the surface treatment apparatuses 7, a conveyance device 9, a spray nozzle 1A, and an adjustment mechanism 1 are provided in the processing chamber 8 in common. That is to say, the base plate is used as a conveying device 9 for horizontal conveyance, the treatment liquid is sprayed onto the substrate A of the substrate A to be conveyed, and the adjustment mechanism of the fog type for the base plate A on the way. 1 1. The surface treatment device 7, as outlined above. (Transportation device 9) First, the conveying device 9 of the surface treatment device will be described with reference to Figs. 1, 2, 4, and 6. The conveying device 9 is provided with a straight roller 12 which is conveyed by the upper and lower holding base sheets A, and a toothed roller group 13 which is horizontally below. Then, the straight-rolling roller group 1 2 and the toothed roller group 13 are held in the same manner as the space A for spraying the processing liquid B at the position opposite to the spray nozzle 10, and the substrate A to be conveyed is held. Arrange and arrange correspondingly up and down. The space E is at least provided in an area balanced with the spray type L of the treatment liquid B. That is, the space E, the straight-rolling roller group 1 2 and the toothed roller group 13 are formed intermittently, and the positions of the upper and lower directions in the conveying direction D are deviated, respectively, and are located opposite to the spray nozzle 10, respectively. . Then, the space E is formed by almost the same area as the spray type L for the base material A from which the processing liquid B is sprayed from the spray nozzle 10 (almost the front and rear dimensions and the left and right dimensions of the width direction F in the conveyance direction D). The same), or a wider area than the spray type L (the front and rear dimensions are longer than the transport direction D, and are almost the same as the left and right dimensions of the width direction F).
-25- 1299007 也就是，齒型滾輪13具有左右寬度之環狀凹部15或 凸部1 6的凹凸元件1 7外嵌固定於軸1 8上，然後外圍面係 成爲凹凸狀、約略齒型狀。然後，前後之齒型滾輪1 3中， 一方之凹部15對於另一方之凸部16，又，一方之凸部16 對於另一方之凹部1 5，各自依序互相咬合般滑動嵌合。在 滑動嵌合之凹部1 5與凸部1 6之間，形成微小之前後間隔 與左右間隔。 也就是說，前後之齒型滾輪1 3係緊密地受重疊，然後 將上方之基板材A，由約略點接觸趨近於約略面接觸之狀態 ，由下方加以搬運維持。 搬運裝置9，係如以上所述。 (關於噴霧噴嘴1 0 ) 其次，針對表面處理裝置7之噴霧噴嘴1 0，參照第1 圖、第2圖、第3圖、第5圖，加以說明。 此噴霧噴嘴1 0，係持續與被搬運之基板材A相對向， 遍佈前後左右地複數個排列設置，朝向對於前後之搬運方 向D呈垂直相交之左右之寬度方向F的同時，以傾斜之噴 射角度N排列設置。 然後，朝向左方之噴霧噴嘴1 0之列與朝向右方向的噴 霧噴嘴1 0之列，係具有相同數量，如此朝向左方或朝向右 方之噴霧噴嘴1 0之列，係設置有調整機構1 1。-25- 1299007, that is, the toothed roller 13 has the annular recess 15 of the left and right width or the uneven element 17 of the convex portion 16 is externally fitted and fixed to the shaft 18, and then the peripheral surface is concave-convex, approximately tooth-shaped . Then, in the front and rear toothed rollers 1, one of the concave portions 15 is slidably fitted to the other convex portion 16, and one of the convex portions 16 and the other concave portion 15 are sequentially engaged with each other. Between the sliding fitting recess 15 and the convex portion 16, a small front-back interval and a left-right interval are formed. That is to say, the front and rear toothed rollers 13 are closely overlapped, and then the upper base material A is brought into contact with the approximate surface contact by the approximate point contact, and is transported and maintained from below. The conveying device 9 is as described above. (About the spray nozzle 10) Next, the spray nozzle 10 of the surface treatment apparatus 7 will be described with reference to Figs. 1, 2, 3, and 5. The spray nozzle 10 is continuously opposed to the substrate A to be conveyed, and is arranged in a plurality of rows in the front, rear, left and right directions, and is inclined in the width direction F which is perpendicular to the front and rear conveyance directions D. Angle N is arranged. Then, the row of the spray nozzles 10 toward the left and the spray nozzles 10 facing the right direction have the same number, so that the spray nozzles 10 are oriented to the left or to the right, and the adjustment mechanism is provided. 1 1.
因此，顯像液，蝕刻液，剝離液，其他之處理液B，— 會由噴霧噴嘴1 0朝向左方或是右方從傾斜地受到噴出，β 以經過調整機構1 1調整後之噴霧類型L，噴射到基板材A -27- 1299007 朝向左方或是右方流過基板材A之外表面進行藥水處 理之後’ θ從左右兩旁邊流下。 關於此種噴霧噴嘴1 0，將更加詳係說明。首先處理液 B 係由液槽19，經由幫浦與管線20 ，—推壓到各噴霧 管2 1然後到噴霧噴嘴丨〇，受到供給之後，噴射到基板材a 然後’事後，再次回收到液槽 1 9之後—循環地受到 使用。 噴霧管2 1，對於受到搬運之基板材a上下相對向的同 時’沿著搬運方向D或左右的寬度方向F若干傾斜之後， Φ 複數根平行地設置。 噴霧噴嘴1 0係由在各噴霧管21上以一定之節距間隔 作排列設置之完全圓錐形噴嘴所構成。然後，從口徑較大 之□導入處理液B，藉由令其通過擴散傾斜板或是螺紋板之 方式，由小口徑之孔擴散成噴霧狀。 因此’前述受到噴出之處理液B，愈靠近噴射中心端 愈緊密且壓力高而衝擊強烈，愈靠近外圍邊緣愈疏鬆壓力 愈低而衝擊較弱，形成圓錐狀、角錐狀之後加以噴射。 Φ 如此之噴霧噴嘴1 〇，對於受到搬運之基板材A係存在 有上下間隔’遍佈前後之搬運方向D與左右之寬度方向F， 依既定之節距間隔排列設置，複數個受到排列設置。 然後噴霧噴嘴10，係如第2圖、第3圖、第5圖之（3 ) 與第5圖之（4 )所示般，每一列沿著寬度方向ρ朝向左方或 右方’而朝向左方之列與朝向右方之列，係具有相同列數 ’此外’在第3圖之圖示例，係朝向搬運方向〇向左方之 -28- 1299007 噴嘴與向右方之噴嘴則是依序交互地排列設置。 同時，噴霧噴嘴1 〇，係如第2圖所示般，以傾斜之噴 射角度N進行排列設置。噴霧噴嘴1 0中，前述朝向左方之 噴嘴與朝向右方之噴嘴均以由水平起30度、45度、60度 等之噴射角度N安裝於噴霧管21上。 又，噴霧噴嘴1 0，如第3圖所示般，在前後之搬運方 向D方面，並非位於與其他之噴霧噴嘴 1 〇相對向之位置 ，噴射中心並未重疊，而是在左右之寬度方向F上稍微偏 離地排列設置。 ® 也就是說，前後之各噴霧噴嘴1 0，並非位於沿著搬運 方向D之平行且直線之各軌跡上，而是在左右之寬度方向F 上稍微偏離地排列設置。也就是多數使用於表面處理裝置7 上之噴霧噴嘴1 0，其全部之噴射中心均不與搬運方向D .重 疊而偏離。 因此，從各噴霧噴嘴1 0所噴出之處理液B，其緊密且 高壓而處理作用強烈之噴射中心，不會重疊而受到分散， 然後在噴射到基板材A之際，因部分強烈衝擊而造成過度 ♦ 處理之地方可防止產生在前後方向上。 又，在圖示例中，噴霧噴嘴10，雖然設置於受搬運之 基板材A之上下兩側，亦存在可以僅設置於一側之實施例 。在此場合中，前述噴霧管2 1、搬運裝置9之間隔空間E 、以及後述之限制機構1 1亦可以僅設置於一側。 噴霧噴嘴1 〇係如以上所述。 (關於調整機構1 1 ) -29- 1299007Therefore, the developing liquid, the etching liquid, the stripping liquid, and the other processing liquid B, are sprayed obliquely from the spray nozzle 10 toward the left or right, and the spray type L adjusted by the adjustment mechanism 1 1 , sprayed to the base plate A -27- 1299007 to the left or right flow through the outer surface of the base plate A for the treatment of the syrup ' θ from the left and right sides. Such a spray nozzle 10 will be described in more detail. First, the treatment liquid B is pumped from the liquid tank 19, through the pump and the line 20, to each spray tube 2 1 and then to the spray nozzle 丨〇, and after being supplied, it is sprayed to the base material a and then 'afterwards, the liquid is recovered again. After slot 1 9 - it is used cyclically. The spray tube 2 1 is inclined in the transport direction D or the left and right width directions F while the substrate plate a to be conveyed is facing up and down, and a plurality of Φ are arranged in parallel. The spray nozzle 10 is composed of a completely conical nozzle which is arranged at intervals of a certain pitch on each spray pipe 21. Then, the treatment liquid B is introduced from a larger diameter, and is diffused into a spray shape by a small-diameter hole by diffusing the inclined plate or the screw plate. Therefore, the closer to the center of the ejection center, the closer the pressure is to the center of the ejection center, the higher the pressure and the stronger the impact. The closer to the peripheral edge, the lower the pressure and the lower the impact, and the conical shape and the pyramid shape are formed. Φ Such a spray nozzle 1 〇 has a vertical spacing ′ for the substrate A to be transported. The transport direction D and the left and right width directions F are arranged at intervals of a predetermined pitch, and a plurality of arrays are arranged. Then, the spray nozzle 10 is oriented as shown in Fig. 2, Fig. 3, Fig. 5 (3), and Fig. 5 (4), and each column is oriented toward the left or right in the width direction ρ. The column on the left and the column on the right have the same number of columns 'in addition'. In the example of Figure 3, the -28-1299007 nozzle to the left and the nozzle to the right are oriented toward the transport direction. Arrange the settings interactively in sequence. At the same time, the spray nozzles 1 are arranged in an inclined injection angle N as shown in Fig. 2 . In the spray nozzle 10, the nozzle to the left and the nozzle to the right are attached to the spray pipe 21 at an injection angle N of 30 degrees, 45 degrees, 60 degrees or the like from the horizontal. Further, as shown in Fig. 3, the spray nozzle 10 is not located at a position facing the other spray nozzles 1 in the front and rear conveyance directions D, and the spray centers are not overlapped but in the width direction of the left and right. F is arranged slightly off the ground. ® In other words, each of the front and rear spray nozzles 10 is not located on each of the parallel and straight lines along the transport direction D, but is arranged slightly offset in the left and right width directions F. That is, most of the spray nozzles 10 used in the surface treating apparatus 7 do not overlap with the entire transport center D. Therefore, the treatment liquid B ejected from each of the spray nozzles 10 is subjected to a compact and high-pressure treatment center which is strongly treated, and is dispersed without being overlapped, and then is sprayed to the base material A due to a part of strong impact. Excessive ♦ treatment can be prevented from occurring in the front and rear direction. Further, in the illustrated example, the spray nozzle 10 is provided on the lower and lower sides of the base sheet A to be conveyed, and there is an embodiment which can be provided only on one side. In this case, the space between the spray pipe 21 and the conveying device 9 and the restriction mechanism 1 1 to be described later may be provided only on one side. The spray nozzle 1 is as described above. (about adjustment mechanism 1 1) -29- 1299007
調整機構11由限制板22形成前後-對而加以使用’ 第5圖之（1 )所示之其他圖示中，此前後之限制板2 2其互 相間之前後間隔P愈靠近噴霧噴嘴1 〇端愈寬廣，愈靠近基 板材A端愈狹小般若干傾斜。也就是在圖示例中之調整機 構1 1之兩限制板22，在愈離開噴霧噴嘴1 〇端而愈接近基 板材A之位置關係下，其側面剖面會呈倒八字狀傾斜地排 列設置。藉由前述之傾斜設置之方式，特別是藉由該傾斜 角之調整，通過而朝向基板材A之處理液B，可容易地適量 受到反射，折射，然後全體均一地受調整到濃淡差距少之 狀態，可限制在理想之噴霧類型L上。 又，如第5圖之（2 )所示般，亦存在是前後-對之限制 板22不傾斜，垂直地平行設置之實施例。也就是說，亦可 存在側面剖面爲平行地設置之實施例。在此場合中，主要 是藉由兩限制板22間之前後間隔P之調整，能夠獲得與前 述之實施例相同之理想之噴霧類型L。The adjustment mechanism 11 is formed by the front and rear sides of the restricting plate 22, and is used in the other drawings shown in Fig. 5 (1). The front and rear restricting plates 2 2 are closer to the spray nozzle 1 than the front and rear intervals P. The wider the end, the closer to the base A end, the narrower the slope. That is, the two restricting plates 22 of the adjusting mechanism 1 in the example of the drawing are arranged in an inverted pentaline shape in a position where the closer to the base plate A is from the end of the spray nozzle 1 . By the above-described inclined arrangement, in particular, by the adjustment of the inclination angle, the treatment liquid B which is directed toward the base sheet A can be easily and appropriately reflected and refracted, and then uniformly adjusted to a small difference in density. The state can be limited to the ideal spray type L. Further, as shown in (2) of Fig. 5, there are also embodiments in which the front and rear-facing restricting plates 22 are not inclined and are vertically arranged in parallel. That is to say, there may be embodiments in which the side sections are arranged in parallel. In this case, the ideal spray type L as in the above-described embodiment can be obtained mainly by the adjustment of the front and rear intervals P between the two restricting plates 22.
又，雖然未圖示，前後—對之限制板22，與在第5圖 之（1)等所示之圖示例比較之下，其上下相反，也就是互相 間之前後間隔P係愈靠近噴霧噴嘴1 0端愈狹小，愈靠近基 板材A端愈寬廣般，若干傾斜排列設置之實施例亦有可能 。也就是說，側面剖面爲略呈八字狀般排列設置之實施例 亦有可能。在此場合中，藉由前述之傾斜設置，特別是藉 由傾斜角之調整，能夠獲得理想之噴霧類型L。 如此，前後一對之限制板22 ，其側面剖面，例如可 以呈逆八字狀、平行、略呈八字狀等，能夠從各種相互位 -31- 1299007 置關係中作適宜選擇使用。 然後，調整機構1 1，在形成前述傾斜之限制板22或 是垂直之限制板22的同時’前後間隔P係變成可變調整’ 然後，可對應於形成於搬運裝置9之間隔空間E。又’如前 述之傾斜之限制板2 2之場合時’並非噴霧噴嘴1 〇端而是 基板材A端之前後間隔P ’因爲與間隔空間E之關係’而成 爲調整之大致目標。 因此，例如搬運裝置9端之間隔空間E之前後尺寸爲 3 0mm之場合時，限制板22間之前後間隔P也被調整爲30mm ，然後噴霧類型L之前後寬度尺寸亦成爲3 0mm，對基板材 A之噴射受到實施。又，更例如間隔空間E爲lOmm、20mm 、或是40mm之場合時亦同樣地，前後間隔P然後噴霧類型 L亦被調整爲10mm、20mm、或是40mm。 但是，對於前述之間隔空間E，令前後間隔 P或噴霧 類型L 一致之方式，並非絕對必要。也就是說，對於搬運 裝置9端之間隔空間E之前後尺寸，限制板22間之前後間 隔P或噴霧類型L之前後寬度尺寸，只要調整到其以下之 必要尺寸即可。當然即使在此場合中，在分布上所必要之 前後間隔P或前後寬度尺寸，係受到確保般加以設定。 調整機構1 1，係如以上所述。 (作用等） 本發明書之基板材A之表面處理裝置7，係如以上說 明般加以構成。因此，係形成以下所述。 (1 )表面處理裝置7使用於電路K之基板J之製造程 - 32- 1299007 序，例如在其顯像程序、蝕刻程序、或是剝膜程序中，對 受到搬運之極薄且柔軟之印刷電路基板等之基板A噴射顯 像液、蝕刻液、或剝離液等處理液B進行藥水處理。 然後，表面處理裝置7係具有搬運裝置9、噴霧噴嘴1〇 、以及調整機構1 1。搬運裝置9係將基板材A作水平搬運 ，噴霧噴嘴1 0係對受到搬運之基板材A噴射處理液B，調· 整機構1 1，係針對從噴霧噴嘴1 〇所噴出之處理液B，在途 中進行對基板材A之噴霧類型L之調整。 (2) 首先，表面處理裝置7之搬運裝置9 (參照第1 # 圖、第2圖、第6圖），其上方之直進滾輪群12和下之齒 型滾輪群1 3，除了處理液B噴射用之間隔空間E之外，係 以上下相對應地排列設置，將基板材A由上下加以挾持。 間隔空間E，係位於與噴霧噴嘴1 〇相對向位置上，至少具 有平衡處理液B之噴霧類型L之區域。 又，齒型滾輪13，凹部15和凸部16在左右方向上以 等節距交互地多數形成，前後.之齒型滾輪1 3，除了間隔空 間E之外令凹部1 5與凸部1位於相對位置，以些許之間隙 % 之非接觸狀態重疊互相咬合。 又，直進滾輪群1 2中，挾持間隔空間E位於相對向位 置之-對限制滾輪Μ，係限制、阻止所噴出處理液b在前後 之搬運方向上流過基板材Α之外表面。 (3) 其次，表面處理裝置7之噴霧噴嘴1〇，係使用完 全圓錐形噴嘴，與受到搬運之基板材A相對向，前後左右 地多數個排列設置。（參照第1圖、第2圖、第3圖、第5 - 33- 1299007 圖）。 然後’朝向對於前後之搬運方向D作垂直相交之左右 之寬度方向F的同時，以傾斜之噴射角度N排列設置。又 ，朝向左方之噴霧噴嘴1 0之列與朝向右方向的噴霧噴嘴1 〇 之列，係具有相同數量如此，朝向左方或朝向右方之噴霧 噴嘴1 0之每一列，係設置有調整機構1 1。 又，噴霧噴嘴10，在前後之搬運方向D方面，並非 位於與其他之噴霧噴嘴1 0相對向之位置，噴射中心並未重 疊，而是在左右之寬度方向F上稍微偏離地排列設置（參照 φ 第3圖）。 (4 )然後，表面處理裝置7之調整機構1 1具有存在前 後間隔P而相對向之一對限制板22、連結限制板22間之連 結元件23。噴霧噴嘴10以面臨限制板22之前後間隔P方 式複數個排列設置（參照第1圖、第5圖）。又，然後限制 板22具備有平衡基板材A其左右寬度之左右長度。 然後，調整機構1 1之限制板22，噴霧噴嘴1 0噴射到 基板材A之途中之處理液B，垂直通過互相間之前後間隔P % 的同時，朝向前後方向之處理液B，會碰觸而進行反射、折 射。. 又，具有前述限制板2 2之調整機構1 1，對於既存的 表面處理裝置7以及對於噴霧噴嘴1 〇，即使後置安裝亦能 夠簡單容易地安裝。也就是說，在霧噴嘴10與搬運裝置9 之間之空間，即使後置安裝亦#夠簡卓谷易地安裝。 (5 )因此，處理液B，係由噴霧噴嘴1 〇向左方或右方 一 3 4 - 1299007 ，傾斜地噴出之後（參照第2圖），4以調整機構1 1之限制 板22，依既定之前後寬度作區域調整，—集中於濃淡差距 少之略呈平面狀之噴霧類型L(參照第1圖、第5圖）。 —然後處理液B，係經由前述之調整機構1 !以受到調 整之噴霧類型L，噴射到基板材A(參照第1圖），-> 朝向 左方或右方流過基板材A之外表面進行藥水處理之後（參照 第4圖），—從基板材A之左右兩旁邊流下。 (6 )那麼，因此，由這個基板材A之表面處理裝置7 來看首先，第1如以下所述般。在表面處理裝置7中，顯 # 像液、蝕刻液、或剝離液等之處理液B，—由完全圓錐形噴 嘴之噴霧噴嘴10，呈圓錐狀、角錐狀被噴出。θ然後途中 ，藉由通過調整機構1 1其限制板22之前後間隔P之方式 ，—朝向前後方向之噴嘴，會因爲前後之限制板2 2而被反 射、彎曲，—然後，依既定之前後寬度之略呈矩形地受到 區域調整，—集中於濃淡差距少略呈平面狀之噴霧類型L， —噴射到基板材A 〇Further, although not shown, the front-rear-to-restricted plate 22 is inverted from the upper and lower sides, that is, the closer to the front and rear intervals P, in comparison with the example shown in (1) of FIG. The narrower the nozzle end of the spray nozzle, the closer it is to the A end of the base plate, the more inclined embodiments are arranged. That is to say, embodiments in which the side cross sections are arranged in a substantially splayed shape are also possible. In this case, the desired spray type L can be obtained by the aforementioned tilt setting, in particular by the adjustment of the tilt angle. As described above, the pair of front and rear restricting plates 22 may have a side cross section, for example, an inverted figure-eight shape, a parallel shape, a substantially figure-eight shape, or the like, and can be appropriately selected from various mutual positions -31 to 1299007. Then, the adjustment mechanism 1 1 becomes "variable adjustment" while forming the aforementioned restriction plate 22 or the vertical restriction plate 22, and then corresponds to the space E formed in the conveyance device 9. Further, when the inclined plate 2 2 as described above is not the end of the spray nozzle 1 but the front and rear intervals P ′ of the base material sheet A, the relationship with the space E is an approximate target of the adjustment. Therefore, for example, when the space E of the end of the conveying device 9 is 30 mm before and after, the space P between the limiting plates 22 is also adjusted to 30 mm, and then the width dimension of the spray type L is also 30 mm. The spraying of the sheet A is carried out. Further, for example, in the case where the space E is 10 mm, 20 mm, or 40 mm, the front and rear intervals P and then the spray type L are also adjusted to 10 mm, 20 mm, or 40 mm. However, it is not absolutely necessary for the aforementioned space E to be such that the front and rear intervals P or the spray type L are identical. That is to say, with respect to the size before and after the space E of the end of the transporting device 9, the width of the front and rear spaces P or the type of the spray L before and after the restriction plate 22 can be adjusted to the following necessary dimensions. Of course, even in this case, the front-rear interval P or the front-rear width dimension necessary for distribution is set as sure. The adjustment mechanism 1 1 is as described above. (Action, etc.) The surface treatment apparatus 7 of the base material A of the present invention is constructed as described above. Therefore, the following is formed. (1) The surface treatment device 7 is used in the manufacturing process of the substrate J of the circuit K - 32-1299007, for example, in its development program, etching process, or film stripping process, for extremely thin and flexible printing The substrate A such as a circuit board ejects a treatment liquid B such as a developing solution, an etching solution, or a peeling liquid to perform a syrup treatment. Then, the surface treatment apparatus 7 has a conveying device 9, a spray nozzle 1A, and an adjustment mechanism 1 1. The conveyance device 9 conveys the base material A horizontally, and the spray nozzle 10 sprays the treatment liquid B to the base material A to be conveyed, and the adjustment mechanism 1 1 is directed to the treatment liquid B discharged from the spray nozzle 1 . The adjustment of the spray type L of the base sheet A is carried out on the way. (2) First, the conveyance device 9 of the surface treatment apparatus 7 (refer to the first #图, the second figure, and the sixth figure), the straight forward roller group 12 and the lower tooth type roller group 13 above, except the treatment liquid B In addition to the space E for the injection, the base plate A is held up and down by being arranged correspondingly above and below. The space E is located at a position opposite to the spray nozzle 1 , and has at least a region of the spray type L of the balance treatment liquid B. Further, the toothed roller 13, the concave portion 15 and the convex portion 16 are alternately formed at an equal pitch in the left-right direction, and the toothed roller 13 of the front and rear. The concave portion 15 is located at the convex portion 1 except for the space E. The relative position is overlapped with each other with a slight gap of % non-contact state. Further, in the straight-moving roller group 12, the holding space E is located at the opposite position, and the pair of regulating rollers 限制 restricts and prevents the discharged processing liquid b from flowing through the outer surface of the substrate sheet in the forward and backward conveying directions. (3) Next, the spray nozzle 1 of the surface treatment apparatus 7 is formed by using a full-conical nozzle so as to face the substrate A to be conveyed, and arranged in a plurality of front, back, left, and right. (Refer to Figure 1, Figure 2, Figure 3, Figure 5 - 33 - 1299007). Then, the orientation direction D is perpendicular to the left and right width directions F of the front and rear conveyance directions D, and is arranged at an oblique injection angle N. Further, the row of the spray nozzles 1 to the left and the spray nozzles 1 to the right are the same number, and each row of the spray nozzles 10 facing the left or the right is provided with an adjustment. Agency 1 1. Further, the spray nozzle 10 is not located at a position facing the other spray nozzles 10 in the front and rear conveyance directions D, and the spray centers are not overlapped, but are arranged in a slightly offset manner in the left and right width directions F (refer to φ Figure 3). (4) Then, the adjustment mechanism 1 1 of the surface treatment apparatus 7 has the connection element 23 between the pair of restriction plates 22 and the connection restriction plates 22 in the presence of the front and rear intervals P. The spray nozzles 10 are arranged in a plurality of rows in front of and behind the restriction plate 22 (see Figs. 1 and 5). Further, the restricting plate 22 is then provided with a length of the left and right widths of the balance substrate A. Then, the regulating plate 22 of the adjusting mechanism 1 1 and the processing liquid B which is sprayed onto the base material A by the spray nozzle 10 are vertically passed through the front and rear intervals P % while facing each other, and the processing liquid B toward the front-rear direction is touched. And reflect and refract. Further, the adjustment mechanism 1 1 having the above-described restriction plate 2 2 can be easily and easily attached to the existing surface treatment device 7 and the spray nozzle 1 即使 even after the rear mounting. That is to say, the space between the mist nozzle 10 and the conveying device 9 is easily installed even if it is installed in the rear. (5) Therefore, the treatment liquid B is ejected obliquely from the spray nozzle 1 to the left or right by 3 4 - 1299007 (see Fig. 2), 4 to adjust the restriction plate 22 of the mechanism 1 1 according to the predetermined The area is adjusted before and after the width, focusing on the slightly flat spray type L with a small difference in density (see Fig. 1 and Fig. 5). - Then, the treatment liquid B is sprayed to the base material A (refer to Fig. 1) via the aforementioned adjustment mechanism 1 ! with the adjusted spray type L, -> flowing to the left or right beyond the base material A After the surface is treated with a syrup (see Fig. 4), it flows down from the left and right sides of the base material A. (6) Then, from the surface treatment apparatus 7 of the base material A, first, the first one is as follows. In the surface treatment apparatus 7, the treatment liquid B such as the image liquid, the etching liquid, or the peeling liquid is ejected in a conical shape or a pyramid shape by the spray nozzle 10 of the completely conical nozzle. θ then on the way, by adjusting the mechanism 1 1 to limit the front and rear spacing P of the plate 22, the nozzles in the front-rear direction will be reflected and bent by the front and rear limiting plates 2 2 - and then, as before and after The width is slightly rectangular and is subject to regional adjustment—focusing on the spray type L with a slightly flattened difference between the shades and shades—spraying onto the base plate A 〇
因此，a ·處理液B對於基板材A，係以濃淡差距少之 噴霧類型 L受到噴出，—愈靠近噴射中心端愈緊密且壓力 高，愈靠近外圍邊緣愈疏鬆壓力愈低之現象會受到消除。 —因此，基板材A之處理作用受到均一化 b ·處理液B對於基板材A，係以平衡搬運裝置9其間 隔空間E之前後寬度，以並未過度超出有效區域而適切地 分布之噴霧類型L加以噴出，—因此，即使對於搬運裝置9 之直進滾輪或齒型滾輪1 3亦可防止受到噴出。—因此，對 -35- 1299007 於基板材A之處理作用受到強化。例如，間隔空間E之前 後尺寸爲30mm之場合時，噴霧類型L之前後寬度尺寸也是 30mm程度，或者是在其以下，例如設定在25mm 、20mm 、 1 5 m ιώ程度。Therefore, a · treatment liquid B is sprayed on the base material A with a spray type L having a small difference in density, and the closer to the center of the spray, the closer the pressure is, and the closer the outer edge is, the looser the pressure becomes, the lower the pressure is. . - Therefore, the treatment effect of the base material A is uniformized. b. The treatment liquid B is applied to the base material A, and the width of the space before and after the space E of the handling device 9 is balanced, and the spray type is appropriately distributed without excessively exceeding the effective area. L is ejected, so that even the straight feed roller or the toothed roller 13 of the conveying device 9 can be prevented from being ejected. - Therefore, the treatment of -35-1299007 on the base sheet A is enhanced. For example, when the space E is 30 mm before and after the space E, the width dimension before and after the spray type L is also about 30 mm, or is below it, for example, set to 25 mm, 20 mm, and 15 m ι.
c ·處理液Β對於基板材A，係以平衡搬運裝置9其間 隔空間E之前後寬度，以並未過度狹小而適切地分布之噴 霧類型L加以噴出，因此，不存在有噴出狹小之前後寬 度之成水平薄膜狀•直線狀之現象。—因此，對於基板材A 之處理作用其對於前後之擴張可受到確保。 根據a、b、c，由表面處理裝置7來看，基板材A之 顯像處理、蝕刻處理或剝膜處理等藥水處理，能夠不存在 有快慢之分而受到均一化，所形成之電路K之寬度上均勻 且偏差、誤差受到消除。 形成於左右之寬度方向F之電路K(參照第9圖），亦 與形成前後之搬運方向D之電路Κ具有相同之電路Κ寬度 ，可取得良好平衡地加以形成。c. The treatment liquid Β is sprayed on the base material A by the spray type L which is not excessively narrow and appropriately distributed with respect to the width of the space E before and after the balance conveyance device 9, so that there is no width before and after the discharge is narrowed. It is a horizontal film shape and a linear phenomenon. - Therefore, for the treatment of the base sheet A, its expansion for the front and the back can be ensured. According to a, b, and c, from the surface treatment apparatus 7, the medicinal water treatment such as the development processing, the etching treatment, or the stripping treatment of the base material A can be uniformized without any difference in speed, and the circuit K is formed. The width is uniform and the deviation is eliminated. The circuit K (see Fig. 9) formed in the width direction F of the right and left is also formed to have the same circuit width as the circuit 形成 forming the front and rear transfer directions D, and can be formed in a good balance.
又，不會造成處理液Β之浪費，可提高處理速度。 (7 )根據基板材Α之表面處理裝置7，第2，係如以下 所述。在表面處理裝置7中，複數個受到排列’之各噴霧噴 嘴10，朝向寬度方向F的同時，以傾斜之噴射角度N排列 設置，並且，不重疊於前後之搬運方向D般偏離般排列設 置。又，搬運裝置9之上方的直進滾輪群12’係具備有挾 持噴射用之間隔空間E之前後一對之限制滾輪Μ。 因此，以平衡搬運裝置9其間隔空間Ε之前後寬度之 - 3 6 - 1299007 噴霧類型L所噴出之處理液B，會如所預期地向左方或右方 流過基板材A之外表面，進行藥水處理般運作。從上方之 噴霧噴嘴10所噴出之處理液B，其在搬運方向D上流過基 板材A外表面之狀況會受到阻止，不會形成積存液G (參照 第8圖之（1))滯留。又，從下方之噴霧噴嘴1〇所噴出之處 理液B ’在以左右方向流過基板材A之外表面之後，立刻因 本身重量落下，不會發生前後方向之流動或滯留。 並且，在搬運方向D上，處理液B之噴射中心不會產 生重疊。 表面處理裝置7由此方面來看，基板材A之藥水處理 ，能夠不存在有快慢之分而受到均一化，所形成之電路K 之寬度上均勻且偏差、誤差受到消除。更不會造成處理液B 之浪費，可提高處理速度。 (8 )根據這個基板材A之表面處理裝置7，第3，係如 以下所述。在表面處理裝置7中，作爲搬運裝置9，係將上 方之直進滾輪群1 2和下方之齒型滾輪群1 3作組合採用。 然後，基板材A受挾持於直進滾輪群1 2與齒型滾輪群1 3 間加以搬運。 因此，基板材A，雖然極薄化、柔軟化極爲顯著，但 是對於從上方之噴霧噴嘴10所噴出之處理液B之重量或是 噴射壓，係在下方以些許之間隙互相咬合之齒型滾輪群1 3 爲中心充分地受到支撐。 基板材A係以緊密地設置於下方之齒型滾輪群1 3，緊 密地受到維持同時被導引，更藉由受挾持於與上方之直進 » -37- 1299007 滾輪群間，能夠無麻煩Η而順利地在搬運方向D上受到搬 基板材A係由前述之搬運裝置9所搬運，在受到噴出 之處理液B之重量與噴射壓下，彎曲，波狀化、皺摺、折 彎、腰折，下垂，卡住、纏繞、落下、損壞等搬運上之麻 煩Η的產生（參照第8圖）可確實被防止。 又，從下方之噴霧噴嘴1 〇所噴出之處理液Β，在以左 右方向流過基板材Α之外表面之後，立刻因本身重量落下 ，不存在有基板材A受到其重量等之不良影響之顧慮。 表面處理裝置7，能夠防止前述般在搬運上之各種麻 煩Η之發生，由這個方面來看，基板材A之藥水處理受到 均一化，所形成之電路 K寬度之偏差、誤差亦受到消除。 更不會造成處理液B之浪費，可提高處理速度。 (五）圖式簡單說明 第1圖係有關於本發明之基板材的表面處理裝置，說 明實施本發明之最佳形態之重要部位側視剖面說明圖。 第2圖係說明實施本發明之最佳形態之前視剖面說明 圖。 第3圖係說明實施本發明之最佳形態之噴霧噴嘴的全 體平面圖。 第4圖係說明實施本發明之最佳形態之重要部位平面 圖’第4圖之（1)係表示向左方向流的處理液，第4圖之（2) 係表示向右方向流的處理液。 第5圖係說明實施本發明之最佳形態之示意圖，第5 -38- 1299007 圖之㈠）係調整機構其一例之側視剖面圖，第5圖之（2 )係 調I整機構其他例子之側視剖面圖，第5圖之（3 )係朝向左方 之噴_噴嘴列等之平面剖面圖，第5圖之（4 )係朝向右方之 噴霧噴嘴列等之平面剖面圖。 胃6圖係說明實施本發明之最佳形態之齒型滾輪群之 平面剖面圖。 第7圖係說明習知例之基板材之表面處理裝置，第7 圖之（1 )係完全圓錐形噴嘴例的重要部位之側視說明圖，第 7圖之（2 )係該重要部位之平面說明圖。第7圖之（3 )係噴霧 噴嘴例之重要部位之側視說明圖，第7圖之（4)係該重要部 位之平面說明圖，第7圖之（5)係該重要部位之正面說明圖 〇 第8圖係說明習知例之基板材之表面處理裝置，第8 圖之（1 )係側視說明圖，第8圖之（2 )係平面說明圖。 第9圖係將基板（基板材）模組化之平面說明圖。 【符號之說明】 1〜表面處理裝置 2〜搬運裝 3〜噴霧噴嘴 4〜直進滚輪 5〜軸 8〜輪盤 7〜表面處理裝置 8〜處理室 - 39 - 1299007 9〜搬運裝置 10〜噴霧噴嘴 11〜調整機構 12〜直進滾輪 1 3〜齒型滾輪 1 4〜軸 1 5〜凹部 1 6〜凸部 17〜凹凸元件 # 1 8〜軸 1 9〜液槽 20〜管線 21〜噴霧管 22〜限制板 23〜連結元件 A〜基板材 B〜處理 '液 % C〜噴霧類型 D〜搬運方向 E〜間隔空間 F〜寬度方向 G〜積存液 Η〜問題 J〜基板 -40-Moreover, it does not cause waste of the treatment liquid, and the processing speed can be improved. (7) According to the surface treatment apparatus 7 of the base sheet, the second aspect is as follows. In the surface treatment apparatus 7, a plurality of the respective spray nozzles 10 that are arranged in the direction of the width F are arranged at an oblique injection angle N, and are arranged so as not to overlap with the conveyance direction D of the front and rear. Further, the straight running roller group 12' above the conveying device 9 is provided with a pair of restricting rollers 之前 before and after the space E for jetting. Therefore, the treatment liquid B sprayed by the spray type L with the space of the front and rear widths of the balance handling device 9 will flow to the left or right side of the substrate A as expected. Operate as a potion. The treatment liquid B ejected from the upper spray nozzle 10 is prevented from flowing over the outer surface of the base material A in the conveyance direction D, and the accumulation liquid G (see (1) in Fig. 8) is not retained. Further, the liquid to be ejected from the lower spray nozzle 1A flows through the outer surface of the base material A in the left-right direction, and immediately falls by its own weight, so that the flow or the retention in the front-rear direction does not occur. Further, in the conveyance direction D, the injection center of the treatment liquid B does not overlap. From the viewpoint of the surface treatment apparatus 7, the syrup treatment of the base material A can be uniformized without any difference in speed, and the width of the circuit K formed is uniform and uneven, and the error is eliminated. The waste of the treatment liquid B is not caused, and the processing speed can be increased. (8) The surface treatment apparatus 7 according to this base material A, the third, is as follows. In the surface treatment device 7, as the conveying device 9, a combination of the upper straight roller group 1 2 and the lower tooth roller group 13 is used. Then, the base material A is held between the straight roller group 1 2 and the toothed roller group 1 3 . Therefore, the base material A is extremely thin and soft, and the weight of the treatment liquid B sprayed from the spray nozzle 10 above or the injection pressure is a toothed roller which is engaged with each other with a slight gap below. Group 1 3 is fully supported by the center. The base plate A is closely supported and supported by the toothed roller group 13 which is closely arranged underneath, and is held between the roller group and the upper group of the -37-12999. However, the substrate A is smoothly conveyed in the conveyance direction D by the above-described conveyance device 9, and is bent, wavy, wrinkled, bent, and waisted by the weight of the treatment liquid B to be discharged and the ejection pressure. The occurrence of troubles such as folding, sagging, jamming, entanglement, dropping, damage, etc. (refer to Fig. 8) can be surely prevented. Further, after the treatment liquid 喷 discharged from the lower spray nozzle 1 流 flows through the outer surface of the base sheet 以 in the left-right direction, it immediately falls due to its own weight, and the base sheet A is not adversely affected by its weight or the like. concern. The surface treatment apparatus 7 can prevent the occurrence of various irritations in the above-described transportation, and in this respect, the syrup treatment of the base material A is uniformized, and the variation and error of the formed circuit K width are also eliminated. The waste of the treatment liquid B is not caused, and the processing speed can be improved. (Embodiment) Brief Description of the Drawings Fig. 1 is a side elevational cross-sectional view showing an important part of a preferred embodiment of the present invention, relating to a surface treatment apparatus for a base material of the present invention. Fig. 2 is a front cross-sectional view showing the best mode for carrying out the invention. Fig. 3 is a general plan view showing a spray nozzle which is the best mode for carrying out the invention. Fig. 4 is a plan view showing an important part for carrying out the best mode of the present invention. Fig. 4 (1) shows a treatment liquid flowing in the left direction, and Fig. 4 (2) shows a treatment liquid flowing in the right direction. . Fig. 5 is a schematic view showing the best mode for carrying out the invention, and Fig. 5 - 38 - 1299007 (a) is a side sectional view of an example of an adjustment mechanism, and Fig. 5 (2) is another example of a tuning mechanism. Fig. 5(3) is a plan sectional view showing a spray nozzle row or the like on the left side, and Fig. 5(4) is a plan sectional view showing a spray nozzle row or the like on the right side. The stomach 6 is a plan sectional view showing a toothed roller group in which the best mode of the present invention is carried out. Fig. 7 is a view showing a surface treatment apparatus for a base material according to a conventional example, and Fig. 7 (1) is a side view showing an important part of a completely conical nozzle example, and Fig. 7 (2) is an important part. Plane illustration. Fig. 7 (3) is a side view showing an important part of the spray nozzle example, (4) of Fig. 7 is a plan explanatory view of the important portion, and Fig. 7 (5) is a front view of the important portion. Fig. 8 is a view showing a surface treatment apparatus for a base material according to a conventional example, and Fig. 8 (1) is a side view and Fig. 8 (2) is a plan explanatory view. Fig. 9 is a plan explanatory view showing a substrate (base plate). [Description of Symbols] 1 to Surface Treatment Device 2 to Transport Device 3 to Spray Nozzle 4 to Straight Roller 5 to Axis 8 to Roulette 7 to Surface Treatment Device 8 to Processing Chamber - 39 - 1299007 9 to Transport Device 10 to Spray Nozzle 11~Adjustment mechanism 12~Direction roller 1 3~Toothed roller 1 4~Axis 1 5~Recessed part 1 6~Protruding part 17~Concave element #1 8~Axis 1 9~Liquid tank 20~Line 21~ Spray tube 22~ Restriction plate 23 to connection element A to base plate B to process 'liquid % C to spray type D to conveyance direction E to space F to width direction G to accumulation liquid Η ~ problem J to substrate - 40 -
Claims (1)
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| Application Number | Priority Date | Filing Date | Title |
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| JP2004040140A JP2005232494A (en) | 2004-02-17 | 2004-02-17 | Surface treating apparatus for base board material |
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| TW200528193A TW200528193A (en) | 2005-09-01 |
| TWI299007B true TWI299007B (en) | 2008-07-21 |
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| TW93105282A TWI299007B (en) | 2004-02-17 | 2004-03-01 | Processing device for substrate surface |
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| JP (1) | JP2005232494A (en) |
| CN (1) | CN1658737A (en) |
| TW (1) | TWI299007B (en) |
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| KR100882910B1 (en) * | 2007-07-19 | 2009-02-10 | 삼성모바일디스플레이주식회사 | Etching apparatus |
| JP2012052205A (en) * | 2010-09-03 | 2012-03-15 | Dowa Metaltech Kk | Method of removing tin or tin alloy layer on surface of copper or copper alloy material |
| JP6189279B2 (en) * | 2014-11-14 | 2017-08-30 | 新光電気工業株式会社 | Etching equipment |
| CN110344057A (en) * | 2018-04-03 | 2019-10-18 | 东莞市腾明智能设备有限公司 | A kind of etching machines |
| CN111640901A (en) * | 2020-05-26 | 2020-09-08 | 湖南中锂新材料科技有限公司 | Preparation method of lithium ion battery diaphragm, lithium ion battery and preparation method thereof |
| CN114713469B (en) * | 2022-03-30 | 2023-07-25 | 丰宾电子科技股份有限公司 | Silver paste spraying process for laminated pole piece of capacitor |
| CN114760765B (en) * | 2022-06-16 | 2022-09-02 | 深圳市惠利电子科技有限公司 | Dry-type circuit board chemical etching equipment |
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2004
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