TWI292196B - Flip chip test structure - Google Patents

Description

1292196

1 FIELD OF THE INVENTION The present invention relates to a sturdy β u, a low-cost flip chip seal; test structure, ^ 2 invention background: flip chip packaging process (Flip Chip Packagi door surface directly packaged g) The Japanese yen is spliced and fixed in a 匕; (; 曰. The wafer is bonded to the substrate by a flip-chip package of square zinc, the pad on the wafer / the sunday piece and a soldering ridge / heart But the metal layer under the bump is connected, the solder bump is used, and the substrate is pre-S〇ldering, and the flip-chip package structure/pre-Ball is mechanically and electrically completed with the printed circuit board. The use of #球 (Solder and pre-welded soldering combined to complete the electrical connection, but the junction. Welding bumps are locally connected. In order to fully integrate the wafer with the substrate, it is only flip-chip filling (Underf i 1 1 Filling the wafer with the substrate 'usually will have a difference in thermal expansion coefficient between the substrate and the complete junction' to integrate the interface between the wafer and the substrate to protect it from: = and the substrate, and Keep out of breath). The impact (such as wet on the surface of the wafer directly on the flip chip packaging process must be tested first. The test is to cover the crystal with the crystal = test, the wafer of the round test each wafer. The first and second figures respectively ^曰一9 Test card one by one, ♦, a traditional flip chip seal

Page 5 1292196 V. Invention Description (2) Wafer test card. As shown in the first figure, a test card printed circuit board 1 〇 2 and a turn 曰曰 曰曰 package wafer test card are included. This test card·printed circuit board 1〇2 has | (Transformer) 104 signal transmitted to a test equipment (not shown: / adapter board 104 test used as test card printed circuit board 丨 G2 * ^ ^. The board 104 is an interface. The board 丨 04-side has a circuit break and the signal distribution between the chips is transmitted to the test card printed circuit board i 〇 2 way and contact = to output the test signal of the j test signal / Input soldering plate 104 is also used for making and manufacturing. The second figure shows another two pairs, technology 9nft ^ 匕 3 劂 4 card printed circuit board 2 〇 2 with a transfer # 士e. Adapter plate 2 0 6 The test signal is transmitted to the second P brush circuit board 2 〇 2 through the contact point 2 0 4 . The adapter plate 2 〇 6 has a probe structure for contacting the output/input pad/bump of the tested wafer (Pr 〇be Fa,) 2〇8 〇

= Test the flip chip with the above conventional flip chip package test card ^ Probe 1 〇 6 or probe structure 2 0 8 will be in contact with the wafer output/input pad/bump. The probe 106 or the probe structure 2〇8 transmits the test signal from the wafer to the turn, ^1 0 4 or 2 0 6, and the adapter board 1 〇 4 or 2 0 6 will receive the test nickname knife ^ The cloth meets the requirements of the test card printed circuit board. The adapter board 1 〇 4 or 2 0 6 then transmits the test signal to the test card printed circuit board. However, there are some adapter boards for the above-mentioned flip chip package wafer test card.

1292196 V. Description of invention (3) ::. The traditional adapter plate is made of ceramic material and the device adapter plate used to make the ceramic adapter plate. The tested wafer % v w 3 is very expensive. In addition, the amount required for the system is very small and expensive:: The cost of designing and special ordering. This greatly increases wafer testing. In view of the above-mentioned conventional flip chip package wafer testing, it is necessary to develop a novel advancement: the disadvantages of the process, to overcome the need for a package wafer test structure of a conventional flip chip sealed wafer test card. Research point. While the present invention is capable of 5-3, it is an object and summary of the invention: It is an object of the present invention to provide a flip chip package wafer test structure. Effectively reduce the wafer test cost development time 66 change n ^ h ^ ^, the day-to-day package wafer test structure Another object of the present invention is to provide a process and save the wafer test card to open the sputum test card It is yet another object of the present invention to provide a flip chip θ ΰ, a, ^ E for a suitable test condition to provide the most suitable test structure for the wafer under test. In order to achieve the above purpose, the present invention provides a flip-chip seal 1292196. 5. Description of the invention (4) 丨 test structure, the flip-chip package wafer tear structure includes a flip chip package a substrate, wherein the substrate and a test wafer are matched with each other, and a test signal of the test chip is distributed, and a fixed substrate and a signal communication device are disposed. The fixed substrate and the signal communication device are used for fixing the substrate and transmitting the substrate. The test signal from the wafer is from the substrate to a test device. The above description of the invention and the following detailed description are merely examples and are not limiting. Other equivalent changes or modifications that do not depart from the spirit of the invention are intended to be included in the scope of the invention. 5-4 Detailed Description of the Invention: It must be noted here that the process steps and structures described below are not complete processes and structures. The present invention can be implemented by various processes, software and hardware, and only the process methods and structures required for understanding the present invention are mentioned herein. The detailed description of the present invention is to be construed in accordance with the claims Qiao 9 shows a flip chip type array package structure (I seal two P: a丄1曰Gri “rray package) as shown in the third figure. This flip chip type array ^.3 - wafer 3 0 4 and a substrate 3 0 2 . The substrate 3 〇 2 is used as a wafer stage and the signal from the wafer 304 is distributed to the solder balls 3 〇 8 , fresh balls 曰曰

Page 8 1292196 V. Description of invention (5) The distance between 3 and 8 is in line with the requirements of printed circuit boards. The cymbal 3 〇 4 is connected to the substrate 302 by a bump 30 6 (Bump). The fourth figure shows the wafer 3〇4 and the substrate 3〇2 before soldering in conjunction with the underfill. The wafers 3, 4 are bonded to the substrate 306 by solder bonding between the bumps 306 and the circuit traces 31 。. In order to be accurately combined, the circuit traces 31 of the wafers 3 and 4 and the substrate 302 must be aligned with each other. The bumps 3 〇 6 are formed on the pads 31 2 'that is, the pads 312 and the circuit traces 31 〇 must also be H-i! The block 306 includes solder bumps. The flip-chip sealing substrate has the same function as the interposer 10 04 or 206. For example, the *J J 0 2 2 also distributes the signal from the chip 3〇4 to the ball 3 in the flip chip package structure. 0 8, and the distance between the solder balls 3 08 must meet the requirements of the transmission and contact of the =, so the substrate (4) solder ball m ^ surface can be added with appropriate contacts, probes or other contact devices and flip chip sealing steps Wafer test card contact. Since the circuit trace 31 of the substrate 3Q2_the solder pad 312 on the wafer, 404 is originally aligned, it can be, == this side' plus the appropriate contact, probe or two = ϊ Ϊ Ϊ carry out testing. The substrate 3Q2 originally has a multi-turn connection structure for distributing the signals from the wafer 304 to circuits in the printed circuit board 3 = Π 104 or 206. Therefore, it is feasible to replace the conventional interposer board f 2 with a flip chip package structure with a flip chip package structure. The wafer flip-chip package substrate comprises an organic material package substrate, for example:::: P〇lyraer Thin Film BuUd_Up liquid crystal with a crystal material (Liquid Crystal Polymer) 0

1292196 V. INSTRUCTIONS (6) Traditionally, when measuring the substrate of the inclusion or 曰 y > { 3 3 〇 β 〇 ^ / 2 〇 SM stage, 3 0 2 曰, 丨 # : 士一·, /, ... The substrate 302, which is mainly used as the wafer substrate of the wafer 304, is now used for the circuit trace 31 of the wafer 304 board 302 to take the 3^ board 1〇4 or 2〇6, due to alignment matching. The solder pad 312 which can be hot 原 has already been connected to the circuit trace 31 0 of the probe or the structure of the probe. The mechanical device similar to the like is added. Fresh balls or elastic adapter plates must be • oblique ίI package crystal #, the substrate is mass produced 'and the special order f is 4 & 杌丨Γ 贝p shell and time-consuming extra set but feasible" , ... the substrate replaces the adapter plate made of material, :=:. Further, the substrate is made of a low-cost organic material. Moreover, the apparatus for manufacturing the ceramic adapter plate is also very expensive. The fifth figure shows a test structure 5 having a flip chip package substrate 504. . As shown in the fifth figure, the flip chip package wafer includes a fixed substrate and a signal communication device 5 〇 2, and contact devices 5 〇 6 and 508. The fixed substrate and signal communication device 5 〇 2 includes circuitry that receives signals from the substrate 504 via the contact device 506 and transmits the signals to two test devices (not shown). The fixed substrate and signal communication device 5 〇 2 fixed the substrate 504 for wafer testing. Substrate 5 〇 4 includes an inner multi-connection junction $ and receives signals from the wafer under test via contact device 508.讯 The signal of the contact device 5 ή 8 with a smaller spacing is distributed to a larger space

Page 10 1292196 V. Description of the invention (7) Distance contact device 506. The test pitch of the contact device 5 0 8 must be matched, and the contact device 5. 6 pitch must be matched with the second = distance, and the substrate of the substrate 50 4 is welded to the master pad or the motherboard. Contact device 5 〇 = with a printed circuit such as a spring. The contact device 5 0 8 includes a probe = 5 ball or mechanical device fixed substrate and signal communication device 5 〇 c, (, or magazine. The road plate. The contact device 5 0 8 contact is tested f Μ 2 1 measured 4 card Printed electrical test wafer and substrate 504. Contact device solder pad and signal communication is communicated with device 502 and substrate 504. No. 6 communication fixed substrate and chip substrate 604 flip chip package wafer test structure 1J another:: with flip chip The sealing test structure 600 includes a fixed lens, and thereafter the crystal package wafer contact devices 6〇6 and 608. The substrate and signal communication device 602, the present invention provides a flip chip test structure 'this flip chip The packaged wafer test is used to replace the conventional package board of the crystal packaged wafer. Since the flip chip package substrate is replaced by the 曰曰 package substrate, it does not need to be separately designed and manufactured, and the cover: f 1 is necessary and a large number of originals correspond to the wafer. Matching, and the design and manufacturing test of the board is expensive and time-consuming. The board needs to be replaced by a chip-cracked substrate instead of the overlay: the cost of the device tool-on-wafer test card development Cheng.··First The adapter plate can reduce the cost and other details of the above invention are only examples and are not limited.

Page 11 1292196 V. INSTRUCTIONS (8) Equivalent changes or modifications that are within the spirit of the invention are intended to be included within the scope of the invention. llBli Page 12 1292196 Brief Description of the Drawings Brief Description of the Drawings: In order to make the other objects, features, and advantages of the present invention more comprehensible, the following detailed description of the preferred embodiments The detailed description is as follows: The first figure shows a conventional flip chip package wafer test card; the second figure shows a conventional flip chip package wafer test card; the third figure shows a flip chip type array package structure; The fifth graph showing the wafer and substrate before solder bonding and flip chip filling shows a flip chip package wafer test structure with a flip chip package substrate; and the sixth figure shows another flip chip package wafer test structure with a flip chip package substrate. . Representative symbols for the main part: 1 0 2 test card printed circuit board 104 adapter plate

Page 13 1292196 Brief description of the diagram 1 0 6 probe 2 0 2 test card printed circuit board 2 0 4 contact point 2 〇 6 adapter plate 2 0 8 probe structure 3 0 2 substrate 3 0 4 wafer 3 0 6 convex Block 3 0 8 Glow ball 3 1 0 circuit trace 3 1 2 pad 5 0 0 flip chip package wafer test structure 5 0 2 fixed substrate and signal communication device 5 0 4 flip chip package substrate 5 0 6 contact device 5 0 8 Contact device 600 0 flip chip package wafer test structure 6 0 2 fixed substrate and signal communication device 6 0 4 flip chip package substrate 6 0 6 contact device 6 0 8 contact device

Page 14

Claims (1)

1292196 VI. Patent Application Range 1. A flip chip package wafer test structure, the flip chip package wafer test structure comprising: a substrate for a flip chip package, wherein the substrate communicates with a test chip signal and is distributed from the Testing a test signal of the chip; and a fixed substrate and signal communication device for fixing the substrate and transmitting the test signal distributed from the wafer from the substrate to a test device. 2. The flip chip package wafer test structure of claim 1, wherein the substrate comprises a contact device, the contact device contacts the pad of the wafer and signals the wafer and the substrate. 3. The flip chip package wafer test structure of claim 2, wherein the contact device comprises a probe. 4. The flip chip package wafer test structure of claim 2, wherein the contact device comprises a pin. 5. The flip chip package wafer test structure of claim 2, wherein the contact device comprises a magazine. 6. The flip chip package wafer test structure of claim 1, wherein the fixed substrate and signal communication device comprises a printed circuit board of a probe test card. 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 8. The flip-chip package wafer test structure according to claim 1, wherein the fixed substrate and the signal communication device comprise a contact device, and the contact device signal communicates the fixed substrate and the signal communication device with the substrate. 9. A flip chip package wafer test structure, the flip chip package wafer test structure comprising: a substrate for a flip chip package, wherein the substrate communicates with a test chip signal and distributes test signals from the test chip; a fixed substrate and signal communication device for fixing the substrate and transmitting the test signal distributed from the wafer from the substrate to a test device; and a first contact device, the first contact device Contacting the pad of the wafer and signaling the wafer and the substrate. The flip-chip package wafer test structure of claim 9, wherein the fixed substrate and the signal communication device comprise a second contact device, and the second contact device signal communicates the fixed substrate and the signal communication device With the substrate. 11. The flip chip package wafer test structure as described in claim 10 Page 16 1292196 VI. The scope of application for patents, wherein the contact device described above comprises solder balls. 1 2. The flip chip package wafer test structure of claim 10, wherein the substrate comprises a substrate made of an organic material. 1 3. A flip chip package wafer test structure, the flip chip package wafer test structure comprising: a substrate for a flip chip package, wherein the substrate communicates with a test chip signal and distributes the test from the test chip a first contact device, the first contact device contacts the pad of the wafer and signals the chip and the substrate; a fixed substrate and a signal communication device, the fixed substrate and the signal communication device are used for fixing the substrate and transmitting The wafer is distributed from the substrate to a test device; and the second contact device communicates the fixed substrate and the signal communication device with the substrate. Page 17