TWI277525B - Print chip - Google Patents
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- TWI277525B TWI277525B TW94134534A TW94134534A TWI277525B TW I277525 B TWI277525 B TW I277525B TW 94134534 A TW94134534 A TW 94134534A TW 94134534 A TW94134534 A TW 94134534A TW I277525 B TWI277525 B TW I277525B
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Ϊ277525 九、發明說明: 【發明所屬之技術領域】 本案係關於一種列印晶片,尤指一種應用於喷墨印 表機之列印晶片。 【先前技術】 • p 遺著電腦多媒體技術的提昇及數位化電子設備的> 展,印輸出裝置如印表機#,6非僅 而是成為一個同時可使用於文宣資料輸出,或數位照片 、輪出,集商務辦公、家用娛樂等功能於—體的設備。而 4 τ墨印表機因其具有價格低廉、操作容易以及低噪音等 優點’又可列印於如紙張、相片紙等多種噴墨媒體,係 為-種經濟、有效的彩色列印輸出裝置,因此被廣為使 用。 -般而言’噴墨印表機之列印品質取決於墨滴的體 •積、墨滴的形狀、以及列印喷孔的數目等,皆與墨水g •的設計有關’尤其是㈣列印晶片釋出墨滴至喷墨媒體 之結構設計,更為墨水匣設計的主要考量因素。 ' 以現有熱汽泡式(thermal bubble)噴墨技術而言,多半 、採用中央供墨流道之設計,藉此增加喷孔排列數的方 式’以提㊅喷墨時的解析度。請參閱第—圖,其係為習 知使用中央供墨流道之噴墨頭結構示意圖,如圖所示, 1277525 •該喷墨頭1係由一列印晶片11以及一喷孔板12所構成, , 該列印晶片11之兩相對側邊具有複數個焊墊111,且列 " 印晶片11的中央設置有一平行於兩側邊複數個焊墊111 之中央供墨流道112,中央供墨流道112之兩相對側邊則 • 设置有複數個墨水腔113及複數個加熱電阻(未圖示)。而 " 喷孔板12係具有複數個喷孔121,且喷孔121之位置相 對於列印晶片11上的複數個墨水腔113,故當列印晶片 籲11與喷孔板12組裝,並設置於墨水匣之出墨口(未圖示) 時,墨水便會自中央供墨流道112流至其兩侧之複數個 墨水腔113,並經過加熱電阻(未圖示)加熱後,再由喷孔 板12上相對應的喷孔121喷至噴墨媒體上。 • 使用中央供墨流道112之列印晶片π固然具有較高 " 的解析度,但需利用噴砂、雷射切割或蝕刻等加工方式 來形成列印晶片11上的中央供墨流道112,而噴砂製程 之潔淨度低,雷射之加工費用昂貴,蝕刻則會使列印晶 • 片11之結構較為脆弱,進而增加加工及製造的成本。且 _為了預留空間形成中央供墨流道112,列印晶片u因此 需要較大的體積,這將會提昇列印晶片u之製造成本。 •此夕—卜,由於中央供墨流道112之墨水必須同時供給兩侧 •之複數個墨水腔113,才能使墨水自喷孔121噴出至喷墨 •媒體上,故容易造成供墨不順暢或供墨不均之情形。貝 為了解決上述中央供墨流道的問題,現有 展出一種採用侧邊供墨流道之列印晶片,請參閱第2 圖,其係為習知使用侧邊供墨流道之喷墨頭結構示: 1277525 圖,如圖所示,喷墨頭2亦包括一列印晶片21以及一喷 - 孔板22,列印晶片21之兩相對側邊設置有複數個焊墊 ^ 211,而相異於焊墊211設置的另外兩侧邊則分別具有側 邊供墨流道212,列印晶片21上鄰近側邊供墨流道212 • 的一側亦設有複數個墨水腔213及複數個加熱電阻(未圖 • 示)。而喷孔板22則具有位置對應於墨水腔213的複數 個喷孔221,故當列印晶片21與喷孔板22組裝,並設置 於墨水匣之出墨口(未圖示)上時,墨水便會自列印晶片 • 21之側邊供墨流道212流至複數個墨水腔213,並經過 加熱電阻加熱後再由喷孔板22上相對應的喷孔221喷至 喷墨媒體上。 • 然而,使用侧邊供墨流道212之列印晶片22雖不需 ^ 以喷砂、雷射或蝕刻等方式進行加工,且其結構亦較使 用中央供墨流道之列印晶片為強,尺寸也相對較小,具 有降低列印晶片21之加工成本及物料成本等優點,但 φ 是,這種使用側邊供墨流道212的設置方式,相對列印 晶片21只能利用兩側來配置構成喷孔221,因此喷墨頭 ’ 2之喷孔221數目會受到限制,間接影響解析度。 • 因此,如何設計一種列印晶片,同時考量成本及解 析度,並在有限的列印晶片面積上增加喷孔數,以增加 ' 列印速度,並增加列印的變化以及提升列印品質,實為 ^ 相關技術領域者目前所迫切需要解決之問題。 【發明内容】 1277525 • 本案之主要目的為提供一種列印晶片,適用於一墨 • 水匣,其係結合中央供墨流道及側邊供墨流道,主要藉 ’ 由側邊供墨流道來節省列印晶片之整體面積,以降低製 作成本,而結合中央供墨流道之設計則可增加噴孔排列 數’以具有較高解析度及提升列印品質。此外,本案亦 ^ 將墨滴產生器群組中的墨滴產生器預設成不同排列之位 置及相隔間距,且利用供墨流道中同色、異色或濃淡不 φ 同之墨水,使列印晶片得以用最佳的列印方式呈現在喷 墨媒體上。 ' 為達上述目的,本案之一較廣義實施樣態為提供一 種列印晶片,其係適用於墨水匣之喷墨頭,且墨水匣係 /、有本體列印晶片包含:曰⑤片本體;複數個焊墊,設置 ^ 於晶片本體之兩相對侧;至少一出墨侧邊,其係垂直於 焊墊设置之方向,用以與墨水匣之本體構成至少一侧邊 供墨流道,·至少—中央供墨流道,設置於晶片本體上, 鲁且置於焊墊之兩相對側之間並平行於側邊供墨流道設置 .之;複數個墨滴產生器群組,設置於晶片本體上, 且貝貝上鄰近側邊供墨流道及中央供墨流道;其中,墨 滴產生㈣組係分職含複數個墨滴產生器,用以因加 熱作用產生複數個墨滴,且墨滴產生器之間係以一特定 方式排列。 /根據本案之構想,其中列印晶片具有兩出墨侧邊, :置於垂直焊墊之方向’用以與墨水匣之本體構成兩側 邊供墨流道。 1277525 =本案之構想,其中列印晶片具有並列或串列之 喜中央t、墨流道,設置於焊墊之兩相對側 邊供墨流道之方向。 十仃側 根據本案之構想,其中列印晶片具有並列或 -中央供墨流道,設置於焊墊之兩相 邊供墨流道之方向。 門且千仃側 根據本案之構想’其中列印晶片具有並列之五中央 供墨流道,設置^焊墊之兩相對侧之間 暮 流道之方肖。 丁側透供墨 ㈣根據本案之構想,其中墨滴產生器群組於晶片本體 實質上鄰近侧邊供墨流道者為側邊墨滴產生器群组,而 .鄰近中央供墨流道者為中央墨滴產生器群組。 ' 減本案之構想,其中墨滴產生器群組之總數為 m’而特定方式為每—相鄰之墨滴產生器群組間對應的墨 滴產生器於垂直焊墊之方向具有一間距p,而每一墨滴產 •生器群組自身群組中相鄰的墨滴產生器於垂直焊墊之方 •向具有一間距mp ’其中P丨U150英对、1/300英对或 1/600英吋;而m為3或大於3的整數’例如6,以配置 同色墨水做單色喷墨列印。 根據本案之構想,其中特定方式為每一相鄰之墨滴 •產生益群組間對應的墨滴產生器位於平行焊塾方向之同 直線上’而每一個墨滴產生器群組中相鄰的墨滴產生 器於垂直焊墊之方向具有一間距p,以配置不同色墨水做 多色喷墨列印。 1277525 孔案之構想,其中列印晶片上覆蓋喷孔板,喷 滴彦u ^ 貝孔對應於晶片本體上之側邊墨 田商產生時組以及中央墨滴產生器群組 , 用以將墨滴產生器所產生之複數彳ra + 王<稷數個墨滴分別自對應於噴 L板上之贺孔喷出至喷墨媒體上。 為達上述目的,本案亦提供另—種1♦墨頭結構,其 用於墨水E ’用以將複數個墨滴噴至喷墨媒體上, :喷墨頭具有··列印晶片,大體上成矩形,包括:晶片本 體;複數個谭墊,設置於晶片本體之兩相對側;至少一 出墨側邊,位於垂直焊墊設置之方向,用以與墨水匿之 ^體構成至少-側邊供墨流道,·至少_中央供墨流道, 設置於晶片本體上,且置於烊墊之兩相對側之間且平行 側邊供墨流道之方向;複數個墨滴產生器群組,由至少 一側邊墨滴產生器群組及至少一中央墨滴產生器群組所 組成,墨滴產生器群組總數為m,最小構成單位為墨滴 產生為,且晶片本體實質上鄰近侧邊供墨流道之表面僅 分別配置有一側邊墨滴產生器群組,而晶片本體實質上 鄰近中央供墨流道之表面僅分別配置有一中央墨滴產生 裔群組,其中每一相鄰之墨滴產生器群組間對應的墨滴 產生器於垂直知塾之方向具有一間距P,而每一墨滴產生 裔群組自身群組中相鄰的墨滴產生器於垂直焊墊之方向 具有一間距mp ;以及一喷孔板,覆蓋於列印晶片上,係 具有對應於墨滴產生器群組之複數個喷孔;其中墨滴產 生器群組係配置同色墨水,當喷孔板與列印晶片結合 11 1277525 日才’用以將侧邊墨滴產生哭雜 所、〜 財央心㈣生器群組 =:::=r所對應之噴孔—噴墨媒 為達上述目的,本案亦描征里 係適用於一"「田 贺墨頭結構,其 ’、χ ^水匣,用以將複數個墨滴喷至一嘖累 上’該喷墨頭具有:列印晶片,大體、^f㈣ A體上成矩形,包括:晶片 本體,_焊墊,設置於晶片本體之兩相對侧;至少 一出墨側邊,其係位於垂直焊墊設置之方向,用以與墨 水匣之本體構成至少一侧邊供墨流道;至少一中央供黑 流遏’設置於晶片本體上,且置於焊墊之兩相對側之間 且平行侧邊供墨流道之方向;複數個墨滴產生器群組, 由至少一側邊墨滴產生器群組及至少一中央墨滴產生器 群、j所組成,墨滴產生裔群組之最小構成單位為墨滴產 生為,且晶片本體實質上鄰近側邊供墨流道之表面僅分 別配置有一側邊墨滴產生器群組,而晶片本體實質上鄰 近中央供墨流道之表面僅分別配置有一中央墨滴產生器 群組,其中每一相鄰之墨滴產生器群組間對應的墨滴產 生器位於平行焊墊方向之同一直線上,而每一墨滴產生 时群組自身群組中相鄰的墨滴產生器於垂直焊墊之方向 具有一間距P;以及喷孔板,覆蓋於列印晶片上,係具有 對應於墨滴產生器群組之複數個喷孔;其中墨滴產生器 群組係配置不同色墨水,當喷孔板與列印晶片結合時, 用以將侧邊墨滴產生器群組及中央墨滴產生器群組所產 生之複數個不同色墨滴自所對應之喷孔喷出至噴墨媒體 12 1277525 蠊 ^ 上,做多色喷墨列印。 :〃、為達上述目的,本案亦提供另一種噴墨頭結構,其 、係適用於墨水匣,用以將複數個墨滴噴至一噴黑媒體 上,噴墨頭具有:列印晶片,大體上成矩形,包括二片本 •體;複數個焊墊,設置於該晶片本體之兩相對側曰;曰至少 • 一出墨側邊,其係位於垂直焊墊設置之方向,用以與墨 水匣之本體構成至少一侧邊供墨流道;複數個中央供墨 φ 机迢,其係位於晶片本體上焊墊之兩相對侧之間且平行 侧邊供墨流道之方向,其中中央供墨流道係串列排列; 複數個墨滴產生器群組,由至少—側邊墨滴產生器群組 及複數個中央墨滴產生器群組所組成,墨滴產生器群組 •總數為m,最小構成單位為墨滴產生器,且晶片I體實 .質上:近侧邊供墨流道之表面僅分別配置有一侧邊墨滴 產生裔群組,而晶片本體實質上鄰近中央供墨流道之表 面僅分別配置有一中央墨滴產生器群組,其中每一相鄰 ,之墨滴產生器群組間對應的墨滴產生器於垂直谭塾之方 向具有-間距p’而每-墨滴產生器群組自身群組中相鄰 的墨滴產生裔於垂直焊墊之方向具有一間距mp;以及喷 孔板覆蓋於列印晶片上,係具有對應於墨滴產生器群 組之複數個噴孔;其中墨滴產生器群組係配置同色墨 水,田喷孔板與列印晶片結合時,用以將側邊墨滴產生 裔群組及中央墨滴產生器群組所產生之複數個同色墨滴 自所對應之喷孔喷出至喷墨媒體上,做單色喷墨列印。Ϊ 277525 IX. Description of the invention: [Technical field to which the invention pertains] The present invention relates to a print wafer, and more particularly to a print wafer applied to an ink jet printer. [Prior Art] • The promotion of computer multimedia technology and the development of digital electronic devices, print output devices such as printers #6, not only become a simultaneous output for texts, or digital photos. , turn out, set business office, home entertainment and other functions of the body. The 4 τ ink printer has the advantages of low price, easy operation and low noise, and can be printed on various inkjet media such as paper and photo paper. It is an economical and effective color printing output device. Therefore, it is widely used. - Generally speaking, the printing quality of the inkjet printer depends on the volume of the ink droplets, the shape of the ink droplets, and the number of printing nozzles, etc., all related to the design of the ink g • especially the (four) column The structural design of the printed wafer to release ink droplets to the inkjet media is a major consideration for ink cartridge design. In the case of the existing thermal bubble inkjet technology, the design of the central ink supply flow path is mostly used, thereby increasing the number of orifice arrays to improve the resolution of the six ink jets. Please refer to the first drawing, which is a schematic view of a conventional ink jet head structure using a central ink supply flow path, as shown in the drawing, 1277525. The ink jet head 1 is composed of a printing wafer 11 and an orifice plate 12. The two opposite sides of the print wafer 11 have a plurality of pads 111, and the center of the print wafer 11 is provided with a central ink supply path 112 parallel to the plurality of pads 111 on both sides. The opposite sides of the ink flow path 112 are provided with a plurality of ink chambers 113 and a plurality of heating resistors (not shown). The ' orifice plate 12 has a plurality of orifices 121, and the orifices 121 are positioned relative to the plurality of ink chambers 113 on the wafer 11, so that the wafers 11 are assembled with the orifices 12 and When it is disposed at the ink outlet (not shown) of the ink cartridge, the ink flows from the central ink supply passage 112 to the plurality of ink chambers 113 on both sides thereof, and is heated by a heating resistor (not shown). The corresponding orifices 121 on the orifice plate 12 are sprayed onto the inkjet medium. • Printing of the wafer π using the central ink supply path 112 has a higher resolution, but requires a process such as sand blasting, laser cutting or etching to form the central ink supply path 112 on the printing wafer 11. However, the cleanliness of the sandblasting process is low, the processing cost of the laser is expensive, and the etching makes the structure of the printed wafer 11 relatively fragile, thereby increasing the processing and manufacturing costs. Moreover, in order to reserve the space to form the central ink supply path 112, the printing of the wafer u requires a large volume, which will increase the manufacturing cost of the printing chip u. • On the same day, since the ink of the central ink supply path 112 must be supplied to the ink chambers 113 on both sides simultaneously, the ink can be ejected from the ejection holes 121 to the inkjet medium, so that the ink supply is not easily smoothed. Or the situation of uneven ink supply. In order to solve the above problem of the central ink supply flow path, a printed wafer using a side ink supply flow path has been exhibited. Please refer to FIG. 2, which is a conventional ink jet head using a side ink supply flow path. The structure shows: 1277525. As shown, the inkjet head 2 also includes a printing chip 21 and a spray-hole plate 22. The opposite sides of the printing chip 21 are provided with a plurality of pads 211, which are different. The other two sides of the solder pad 211 respectively have a side ink supply flow path 212, and a side of the print wafer 21 adjacent to the side ink supply flow path 212 is also provided with a plurality of ink chambers 213 and a plurality of heating Resistance (not shown). The orifice plate 22 has a plurality of nozzle holes 221 corresponding to the ink chamber 213. Therefore, when the print wafer 21 and the orifice plate 22 are assembled and disposed on the ink outlet (not shown) of the ink cartridge, The ink flows from the side ink supply channel 212 of the printing chip to 21 to a plurality of ink chambers 213, and is heated by the heating resistor and then sprayed onto the inkjet medium by the corresponding nozzle holes 221 of the orifice plate 22. . • However, the print wafer 22 using the side ink supply path 212 does not need to be sandblasted, lasered, or etched, and its structure is stronger than that of the central ink supply. The size is also relatively small, which has the advantages of reducing the processing cost and material cost of the printing chip 21, but φ is such that the side ink supply path 212 is disposed, and the opposite printing wafer 21 can only use both sides. Since the orifices 221 are configured to be arranged, the number of the orifices 221 of the inkjet head '2 is limited, which indirectly affects the resolution. • Therefore, how to design a print wafer, taking into account cost and resolution, and increasing the number of orifices on a limited print wafer area to increase the print speed, increase print variations, and improve print quality. In fact, there is an urgent need to solve the problem in the related technical field. SUMMARY OF THE INVENTION 1277525 • The main purpose of this case is to provide a printing chip suitable for an ink • water raft, which is combined with a central ink supply flow path and a side ink supply flow path, mainly by 'inside the ink supply flow from the side The channel saves the overall area of the printed wafer to reduce the manufacturing cost, and the design of the central ink supply channel can increase the number of orifice arrays to have higher resolution and improved print quality. In addition, in the present case, the ink drop generators in the ink drop generator group are preset to different positions and spaced intervals, and the inks of the same color, different colors or shades in the ink supply flow path are used to print the wafer. It can be presented on the inkjet media in the best way. In order to achieve the above object, one of the more general embodiments of the present invention provides a print wafer which is suitable for an ink jet head of an ink cartridge, and the ink cartridge/body print wafer comprises: a 5-piece body; a plurality of solder pads are disposed on opposite sides of the wafer body; at least one ink emitting side is perpendicular to the direction in which the solder pads are disposed, and is configured to form at least one ink supply flow path with the body of the ink cartridge. At least a central ink supply flow path is disposed on the wafer body and disposed between the opposite sides of the bonding pad and parallel to the side ink supply flow path; a plurality of ink drop generator groups are disposed on On the wafer body, and adjacent to the side ink supply flow channel and the central ink supply flow path on the babe; wherein the ink droplet generation (4) group is divided into a plurality of ink droplet generators for generating a plurality of ink droplets due to heating And the ink drop generators are arranged in a specific manner. / According to the concept of the present invention, the printing wafer has two ink-extending sides, and is disposed in the direction of the vertical pad to form a two-side ink supply path with the body of the ink cartridge. 1277525 = The concept of the present invention, wherein the printed wafer has a juxtaposed or a series of hi center t, ink flow paths disposed in the direction of the ink supply flow paths on opposite sides of the pad. The tenth side According to the concept of the present invention, the print wafer has a juxtaposed or - central ink supply flow path disposed in the direction of the two-phase ink supply flow path of the pad. Door and Millennium Side According to the concept of the present invention, in which the printed wafer has juxtaposed five central ink supply flow paths, the square of the flow path between the opposite sides of the solder pad is disposed. According to the concept of the present invention, wherein the ink drop generator group is substantially adjacent to the side of the wafer body, the ink supply flow path is a side ink drop generator group, and adjacent to the central ink supply flow path. Is the central drop generator group. The concept of reducing the case, wherein the total number of ink drop generator groups is m', and the specific way is that each of the adjacent drop generator groups has a pitch in the direction of the vertical pad. And each ink drop generator and its own group of ink droplet generators in the group of vertical solder pads on the side of the vertical pad; the direction has a spacing mp 'where P 丨 U150 s, 1 / 300 s or 1 /600 inches; and m is an integer of 3 or greater than '3, for monochrome inkjet printing with the same color ink. According to the concept of the present invention, the specific way is that each of the adjacent ink droplets and the corresponding droplet generators are located on the same straight line in the parallel welding direction direction and adjacent each of the ink droplet generator groups The ink drop generator has a pitch p in the direction of the vertical pads to configure different color inks for multicolor ink jet printing. 1277525 The concept of the hole case, in which the printing chip covers the orifice plate, and the spray droplets are corresponding to the sides of the wafer body and the central ink droplet generator group for the ink droplets. The plurality of ink droplets generated by the generator are ejected from the corresponding holes on the sprayed L plate to the ink jet medium, respectively. In order to achieve the above object, the present invention also provides another 1♦ ink head structure for ink E' for spraying a plurality of ink droplets onto an inkjet medium. The inkjet head has a print wafer, substantially Rectangular, comprising: a wafer body; a plurality of tan pads disposed on opposite sides of the wafer body; at least one ink emitting side disposed in a direction of the vertical pad for forming at least a side with the ink Ink supply flow path, at least _ central ink supply flow path, disposed on the wafer body, and disposed between two opposite sides of the mattress and parallel to the direction of the ink supply flow path; a plurality of ink drop generator groups , consisting of at least one side drop generator group and at least one central drop generator group, the total number of drop generator groups is m, the smallest constituent unit is ink drop generation, and the wafer body is substantially adjacent The surface of the side ink supply flow path is only respectively disposed with one side ink drop generator group, and the wafer body is disposed substantially adjacent to the surface of the central ink supply flow path, and only one central ink droplet generating group is respectively disposed, wherein each phase Corresponding ink between adjacent ink drop generator groups The drop generator has a pitch P in the direction of the vertical knowledge, and each of the ink drop generators in the group of the own group has a pitch mp in the direction of the vertical pad; and a orifice plate Covering the printing wafer, having a plurality of nozzle holes corresponding to the ink droplet generator group; wherein the ink droplet generator group is configured with the same color ink, when the orifice plate is combined with the printing wafer 11 1177525 In order to achieve the above purpose, the ink droplets in the side of the ink droplets are generated by the ink droplets on the side of the ink droplets, and the inkjet medium corresponding to the ::::=r is used for the above purposes. " "Tianhe ink head structure, its ', χ ^ water 匣, used to spray a plurality of ink drops to a smashing' inkjet head has: print wafer, general, ^ f (four) A body into a rectangle The method includes: a wafer body, a solder pad disposed on two opposite sides of the wafer body; and at least one ink emitting side disposed in a direction of the vertical pad for forming at least one side ink supply with the body of the ink cartridge a flow channel; at least one central black-flow suppressor is disposed on the wafer body and placed on the solder pad a direction of the ink supply flow path between the opposite sides and the parallel side; a plurality of ink drop generator groups, consisting of at least one side drop generator group and at least one central drop generator group, j, ink The smallest constituent unit of the drip generation group is that the ink droplets are generated, and the wafer body is substantially adjacent to the side of the side ink supply flow path, and only one side of the ink drop generator group is disposed, and the wafer body is substantially adjacent to the center. The surface of the ink flow path is only respectively disposed with a central ink drop generator group, wherein the corresponding ink drop generators between each adjacent ink drop generator group are located on the same straight line in the direction of the parallel solder pads, and each ink When the droplets are generated, the adjacent droplet generators in the group own group have a pitch P in the direction of the vertical pads; and the orifice plate covers the printing wafers and has a group corresponding to the ink droplet generators. a plurality of orifices; wherein the droplet generator group is configured with different color inks, and when the orifice plate is combined with the printing wafer, the ink droplet generator group and the central ink droplet generator group are generated. a plurality of different color ink droplets Should be discharged to the injection hole of the ink jet media 121,277,525 ^ cockroach, the color ink jet printing do. In order to achieve the above object, the present invention also provides another ink jet head structure, which is suitable for ink cartridges for spraying a plurality of ink droplets onto a black jet medium having a print wafer. Generally, it is rectangular, including two pieces of body; a plurality of pads are disposed on opposite sides of the body of the wafer; at least one side of the ink is disposed in the direction of the vertical pad for The body of the ink cartridge constitutes at least one ink supply flow path; a plurality of central ink supply φ is located between two opposite sides of the pad on the wafer body and parallel to the direction of the ink supply flow path, wherein the center Ink flow channels are arranged in series; a plurality of ink drop generator groups consisting of at least a side drop generator group and a plurality of central drop generator groups, ink drop generator groups For m, the smallest constituent unit is the ink drop generator, and the wafer I is solid. The surface of the near-side ink supply flow path is only respectively disposed with one side of the ink droplet generating group, and the wafer body is substantially adjacent to the center. The surface of the ink supply flow path is only respectively provided with a central ink a group of drop generators, wherein each adjacent drop generator group has a pitch-p' in the direction of the vertical Tanner and in each group of the drop generator group Adjacent ink droplets have a pitch mp in the direction of the vertical pad; and the orifice plate covers the print wafer with a plurality of orifices corresponding to the droplet generator group; wherein the ink droplet generator The group is configured with the same color ink, and when the field orifice plate is combined with the printing chip, the plurality of ink droplets of the same color generated by the group of the side ink droplets and the central ink droplet generator group are sprayed from the corresponding ink droplets. The holes are ejected onto the ink jet medium for monochrome ink jet printing.
13 1277525 【實施方式】 說明中詳細敘述。;典型實施例將在後段的 具有各種的變化,以不脫==能夠在不同的態樣上 明及圖示在本質上二的範圍’且其中的說 往炎田作5兄明之用,而非用以限制本案。 頭心圖’其係為本案第一較佳實施例之喷墨 ^冓+不思圖,如圖所示,喷墨頭3可包含列印晶片 以及贺孔板32,且嘴墨頭3係組裝於一 本13 1277525 [Embodiment] The description will be described in detail. The typical embodiment will have various changes in the latter stage, so that it can be used in different situations, and it can be used in the context of the second aspect. Not used to limit the case. The head center diagram is the inkjet image of the first preferred embodiment of the present invention. As shown, the inkjet head 3 may include a printing chip and a hole plate 32, and the ink nozzle 3 is attached. Assembled in one
=(如第四圖所示)。如第三圖所示,列印晶片31 = 曰曰曰片本體311 ’該晶片本體311大致成矩形形狀,且其 中晶片本體311之兩相對側邊分別設置有複數個焊墊 =2 ’主要用來與噴墨印表機的系統控制電路(未圖示) :性連接用,使列印晶片31根據喷墨印表機的系統控制 包路所傳送之控制仏號的觸發而將墨水匣内部所儲存之 墨水加熱,透過喷孔板32上之喷孔322喷射至喷墨媒體 (未圖示)上,且列印晶片31之晶片本體3ιι於垂直於複 數個焊墊312設置方向的兩側邊,即平行於喷墨媒體移 動之列印方向,分別設置有兩出墨侧邊313,因此當第三 圖所示之噴墨頭3與墨水匣組裝在一起時,列印晶片3 i 之晶片本體311的兩側之兩出墨侧邊313將與墨水匣之 本體4構成兩侧邊供墨流道314(如第四圖所示),於本實 施例中,介於複數個焊墊312以及兩個側邊供墨流道314 之間另外設有一中央供墨流道315,中央供墨流道315 14 1277525 係平行於兩側邊供墨流道314。 — 請再參閱第三圖並請配合第五圖,第五圖係為第三 ’ 圖之局部放大圖。如圖所示,列印晶片31之晶片本體311 的表面上係具有複數個墨滴產生器群組316,係由兩組側 _ 邊墨滴產生器群組3161及一組中央墨滴產生器群組 ' 3162所組成,該兩侧邊墨滴產生器群組3161其係分別設 置於該晶片本體311上且鄰近於該兩側邊供墨流道314, φ 而該中央墨滴產生器群組3162係設置於列印晶片31之 晶片本體311上且鄰近於中央供墨流道315。複數個墨滴 產生裔群組316之最小構成單位為一個墨滴產生器,其 中每一個墨滴產生器皆包含一墨水腔317以及一設置於 •墨水腔317中的加熱電阻318,故當喷墨頭組裝於墨水匿 '之本體4上時(如第四圖所示),墨水E内部所儲存的墨 水將經由兩侧邊供墨流道314及中央供墨流道315分別 ,至對應的侧邊墨滴產生器群組3161以及中央墨滴產生 鲁ϋ群組3162的每一個墨滴產生器的墨水腔317中,並經 尺腔317中的加熱電阻318加熱後,透過噴孔板%對 應之噴孔322,將墨水喷射至噴墨媒體上。 明再苓閱第三圖並配合第四及五圖,其中第三及第 .五圖之圖式係截切部份之喷孔板32以暴露出列印晶片 、31之部分晶片本體3U的結構示意圖,於本實施例中, 列印晶片的晶片本體311上方係覆蓋有一喷孔板%, 而實孔板32之長度實質上與列印晶片31之晶片本體311 15 1277525 的長度大致相等(如第四圖所示)。為了避免列印晶片31 _ 的晶片本體311與喷孔板32之間發生電性連接,喷孔板 - 32設有兩凹口 321,使其形狀大致上呈“H”字形,喷孔板 32之凹口 321的設置位置係對應於晶片本體311上的複 • 數個焊墊312,因此當喷孔板32與晶片本體311組合時 - 將露出焊墊312,使焊墊312能夠與喷墨印表機的系統控 制電路電性連接。而喷孔板32的寬度則實質上較列印晶 片31之晶片本體311的寬度為大,故當喷孔板32與列 ® 印晶片31的晶片本體311組合成喷墨頭3並安裝至墨水 匣本體4時,墨水不至於自側邊供墨流道314滲出(如 第四圖所示)。又喷孔板32上設有複數個喷孔322,而喷 • 孔322所設置的位置係分別對應於晶片本體311上之複 4 數個墨滴產生器群組316,更詳細地說明,每一個喷孔 322係分別對應於侧邊墨滴產生器群組3161或是中央墨 滴產生器群組3162每一個墨滴產生器之墨水腔317中的 φ 加熱電阻318,是以墨水匣内部所儲存的墨水可由侧邊供 墨流道314及中央供墨流道315分別流至其對應的側邊 ' 墨滴產生器群組3161及中央墨滴產生器群組3162之每 , 一個墨滴產生器的墨水腔317中,藉由墨水腔317中的 加熱電阻318加熱並經喷孔板32上相對應的喷孔322喷 " 出至喷墨媒體上。 請參閱第六圖,其係為第三圖組裝後之透視圖。如 圖所示,晶片本體311與喷孔板32組合後即成為一喷墨 16 1277525 、 頭3’且晶片本體311鄰近兩側邊供墨流道314之表面各 • 自設有一側邊墨滴產生器群組3161,於晶片本體311鄰 • 近中央供墨流道315的表面則設有一中央墨滴產生器群 組3162,喷孔板32上的複數個喷孔322的位置則對應於 側邊墨滴產生器群組3161以及中央墨滴產生器群組 -3162每一個墨滴產生器之墨水腔317,使墨水得以經由 每一個墨滴產生器的墨水腔317中之加熱電阻318(如第 φ 五圖所示)加熱成墨水氣泡,透過加熱電阻318相對應的 喷孔322喷出至噴墨媒體上。 雖然於第六圖中,晶片本體311鄰近兩侧邊供墨流 迢314的表面上係分別設置有一組侧邊墨滴產生器群組 • 3161,而晶片本體311鄰近且平行於中央供墨流道315 " 的表面上僅於該中央供墨流道315之一側邊設置有一中 央墨滴產生器群組3162,但該複數個墨滴產生器群組316 的實施態樣並不以此為限。舉例而言,配合本實施例之 • 兩侧邊供墨流道314及一中央供墨流道315,亦可於鄰近 兩侧邊供墨流道314分別設置有兩組墨滴產生器群組 3161 ’該兩側邊墨滴產生器群組3161之設置位置與第六 圖實施例相似,皆設置於晶片本體311上鄰近兩側邊供 墨流道314的表面,且以交錯的方式排列,以便該侧邊 供墨流道314中的墨水可流至其鄰近的兩個側邊墨滴產 生器群組3161,而中央供墨流道315的一側或兩側可分 別設置有一組或兩組中央墨滴產生器群組3162。換言 17 1277525 之,側邊墨滴產生器群組3161及中央墨滴產生器群組 ‘ M62的數目與側邊供墨流道314及中央供墨流道315之 、 數目並無必然的相關性,可藉設計視需求任意地在侧邊 供墨流道314或中央供墨流道315分別配置一或多個側 . 邊墨滴產生器群組3161或中央墨滴產生器群組3162,而 /、育孔板32上育孔322的位置,同樣的也必須對應該側 邊墨滴產生器群組3161以及中央墨滴產生器群組3162 的每一個墨滴產生器。 當然,晶片本體311上供墨流道的設計結構並非僅 限於上述兩侧邊供墨流道314及一中央供墨流道315,請 參閱第七圖,其係本案第二較佳實施例之噴墨頭結構之 • 透視圖。如圖所示,喷墨頭3中之晶片本體311上複數 ^個焊墊312及側邊供墨流道314、中央供墨流道315的設 置方向已詳細描述於第一較佳實施例中,故此處不再贅 述。於本較佳實施例中,晶片本體311的單一側邊僅具 _ 有個侧邊供墨流道314,而於晶片本體311的表面係具 有兩個中央供墨流道315,該兩中央供墨流道315係並列 设置’亦即兩兩併排平行於該側邊供墨流道314。此外, 晶片本體311更具有複數個墨滴產生器群組316,包括晶 片本體311鄰近於側邊供墨流道314的表面上設置的一 側邊墨滴產生器群組3161,以及晶片本體311鄰近且平 行於兩中央供墨流道315的表面上,各自設置於兩中央 供墨流這315的一側邊的中央墨滴產生器群組3162。當= (as shown in the fourth figure). As shown in the third figure, the print wafer 31 = the wafer body 311 'the wafer body 311 has a substantially rectangular shape, and wherein the opposite sides of the wafer body 311 are respectively provided with a plurality of pads = 2 'mainly used The system control circuit (not shown) of the inkjet printer is used for sexual connection, so that the print wafer 31 is internally charged according to the trigger of the control nickname transmitted by the system control package of the inkjet printer. The stored ink is heated and ejected through an orifice 322 in the orifice plate 32 onto an inkjet medium (not shown), and the wafer body 3 of the wafer 31 is printed on both sides perpendicular to the direction in which the plurality of pads 312 are disposed. The sides, that is, parallel to the printing direction of the movement of the inkjet medium, are respectively provided with two ink discharging sides 313, so when the inkjet head 3 shown in the third figure is assembled with the ink cartridge, the wafer 3i is printed. The two ink discharge sides 313 of the two sides of the wafer body 311 will form a two-side ink supply flow path 314 with the body 4 of the ink cartridge (as shown in the fourth figure). In this embodiment, the plurality of pads are interposed. 312 and a central ink supply passage 31 are additionally disposed between the two side ink supply passages 314. 5. The central ink supply flow path 315 14 1277525 is parallel to the two side ink supply flow paths 314. — Please refer to the third figure and please cooperate with the fifth figure. The fifth picture is a partial enlarged view of the third figure. As shown, the wafer body 311 of the print wafer 31 has a plurality of drop generator groups 316 on its surface, consisting of two sets of side-edge drop generator groups 3161 and a set of central drop generators. The group ' 3162 is composed of the two sides of the ink drop generator group 3161 respectively disposed on the wafer body 311 adjacent to the two sides of the ink supply flow path 314, φ and the central ink drop generator group The group 3162 is disposed on the wafer body 311 of the print wafer 31 adjacent to the central ink supply flow path 315. The smallest constituent unit of the plurality of ink droplet generating group 316 is an ink droplet generator, wherein each ink droplet generator comprises an ink chamber 317 and a heating resistor 318 disposed in the ink chamber 317, so that when When the ink head is assembled on the body 4 of the ink (as shown in the fourth figure), the ink stored in the ink E will pass through the two side ink supply channels 314 and the central ink supply flow path 315, respectively, to the corresponding The side drop generator group 3161 and the central ink drop generate the ink chamber 317 of each drop generator of the reckless group 3162, and are heated by the heating resistor 318 in the ruler 317, through the orifice plate% The corresponding orifice 322 ejects ink onto the inkjet medium. Referring again to the third drawing and in conjunction with the fourth and fifth figures, wherein the third and fifth figures are cut into portions of the orifice plate 32 to expose the portion of the wafer, 31 of the wafer body 3U. In the present embodiment, the wafer body 311 of the printing wafer is covered with a perforated plate %, and the length of the solid plate 32 is substantially equal to the length of the wafer body 311 15 1277525 of the printing chip 31 ( As shown in the fourth figure). In order to avoid electrical connection between the wafer body 311 of the printing wafer 31_ and the orifice plate 32, the orifice plate-32 is provided with two notches 321 which are substantially H-shaped in shape, and the orifice plate 32 is provided. The recess 321 is disposed at a position corresponding to the plurality of pads 312 on the wafer body 311. Therefore, when the orifice plate 32 is combined with the wafer body 311, the pad 312 will be exposed, so that the pad 312 can be inked. The system control circuit of the printer is electrically connected. The width of the orifice plate 32 is substantially larger than the width of the wafer body 311 of the printing wafer 31. Therefore, when the orifice plate 32 and the wafer body 311 of the column® printing wafer 31 are combined into the inkjet head 3 and mounted to the ink. When the body 4 is attached, the ink does not ooze out from the side ink supply path 314 (as shown in the fourth figure). Further, the orifice plate 32 is provided with a plurality of orifices 322, and the nozzles 322 are disposed at positions corresponding to the plurality of droplet generator groups 316 on the wafer body 311, which are explained in more detail. An orifice 322 corresponds to the φ heating resistor 318 in the ink chamber 317 of each of the droplet generators 3161 or the central droplet generator group 3162, respectively. The stored ink may be flowed from the side ink supply flow path 314 and the central ink supply flow path 315 to its corresponding side, each of the ink drop generator group 3161 and the central ink drop generator group 3162, one ink drop is generated. The ink chamber 317 of the device is heated by the heating resistor 318 in the ink chamber 317 and sprayed onto the ink jet medium through the corresponding nozzle hole 322 of the orifice plate 32. Please refer to the sixth figure, which is a perspective view of the assembled third figure. As shown, the wafer body 311 and the orifice plate 32 are combined to form an ink jet 16 1277525, the head 3' and the wafer body 311 adjacent to the sides of the ink supply flow path 314. The generator group 3161 is provided with a central ink drop generator group 3162 on the surface of the wafer body 311 adjacent to the central ink supply flow path 315. The positions of the plurality of spray holes 322 on the orifice plate 32 correspond to the side. The ink drop generator group 3161 and the central ink drop generator group-3162 each ink drop generator ink chamber 317 enable ink to pass through the heating resistor 318 in the ink chamber 317 of each ink drop generator (eg The bubble shown in Fig. 5 is heated to form an ink bubble, which is ejected through the nozzle hole 322 corresponding to the heating resistor 318 to the ink jet medium. Although in the sixth figure, the wafer body 311 is provided with a set of side drop generator groups 3161 adjacent to the sides of the ink supply flow 314, and the wafer body 311 is adjacent to and parallel to the central ink supply flow. A central drop generator group 3162 is disposed on the surface of one of the central ink supply channels 315 on the surface of the 315 " but the implementation of the plurality of drop generator groups 316 is not Limited. For example, in combination with the two-side ink supply flow path 314 and a central ink supply flow path 315 of the embodiment, two groups of ink drop generator groups may be respectively disposed adjacent to the two-side ink supply flow path 314. 3161' The position of the two-side drop generator group 3161 is similar to that of the sixth embodiment, and is disposed on the wafer body 311 adjacent to the surfaces of the two-side ink supply channels 314, and arranged in a staggered manner. So that the ink in the side ink supply flow path 314 can flow to its adjacent two side drop generator group 3161, and one or both sides of the central ink supply flow path 315 can be respectively provided with one or two. Group central drop generator group 3162. In other words, in the case of 17 1277525, the number of side drop generator groups 3161 and the central drop generator group 'M62 is not necessarily related to the number of the side ink supply passages 314 and the central ink supply flow path 315. The side ink supply flow path 314 or the central ink supply flow path 315 can be arbitrarily disposed on the side ink supply flow path 314 or the central ink supply flow path 315, respectively, by one or more sides, the edge drop generator group 3161 or the central drop generator group 3162, and /, the position of the well 322 on the orifice board 32, as well as each drop generator of the side drop generator group 3161 and the central drop generator group 3162. Of course, the design structure of the ink supply channel on the wafer body 311 is not limited to the two-side ink supply flow path 314 and a central ink supply flow path 315. Please refer to the seventh figure, which is the second preferred embodiment of the present invention. • Inkjet head structure • Perspective view. As shown in the figure, the direction in which the plurality of pads 312 and the side ink supply channels 314 and the central ink supply path 315 are disposed on the wafer body 311 in the ink jet head 3 has been described in detail in the first preferred embodiment. Therefore, it will not be repeated here. In the preferred embodiment, the single side of the wafer body 311 has only one side ink supply flow path 314, and the surface of the wafer body 311 has two central ink supply flow paths 315. The ink flow paths 315 are arranged side by side, that is, two to two side by side parallel to the side ink supply flow path 314. In addition, the wafer body 311 further has a plurality of ink drop generator groups 316 including a side ink drop generator group 3161 disposed on the surface of the wafer body 311 adjacent to the side ink supply flow path 314, and the wafer body 311. Adjacent and parallel to the surfaces of the two central ink supply channels 315, central droplet generator groups 3162 are disposed on one side of the two central ink supply streams 315, respectively. when
18 1277525 然,侧邊墨滴產生器群組3161及中央墨滴產生器群組 - 3162均由複數個墨滴產生器所組成,且每一個墨滴產生 - 器都由一個墨水腔317及一個位於墨水腔317中的加熱 電阻318所構成(請配合參考第五圖),而喷孔板32上的 • 複數個喷孔322係對應於複數個墨滴產生器群組316每 - 一墨滴產生器之墨水腔317中的加熱電阻318,故墨水得 以經加熱電阻318加熱,再自喷孔322噴出至喷墨媒體 (未圖示)上。 ^ 相同地,於第七圖中僅揭露之晶片本體311於鄰近 側邊供墨流道314的表面上設置有一侧邊墨滴產生器群 3161,而兩個中央供墨流道315的一侧邊各設置有一中 • 央墨滴產生器群組3162,但配合本實施例流道設計的複 • 數個墨滴產生器群組316並非只限定於上述的配置態 樣,舉例而言,配合本實施例之單一侧邊供墨流道314 及兩中央供墨流道315,亦可於晶片本體311上鄰近侧邊 φ 供墨流道314的表面同時設置兩組側邊墨滴產生器群組 3161,而兩中央供墨流道315的兩側分別設置有一組或 兩組中央墨滴產生器群組3162。當然,亦可於原侧邊供 " 墨流道314的相對側再增加一側邊供墨流道314,使晶片 本體311具有兩個側邊供墨流道314加上兩個中央供墨 流道315,而該增加的側邊供墨流道314其側邊墨滴產生 器群組3161的配置方式可與原側邊供墨流道314之侧邊 墨滴產生器群組3161有相同的變化。 請參閱第八圖,其係本案第三較佳實施例之喷墨頭 19 1277525 結構之透視圖,如圖所示,晶片本體311上複數個焊墊 、 312及側邊供墨流道314、中央供墨流道315的設置方向 - 已詳細描述於第一較佳實施例中,故此處不再贅述。於 本較佳實施例中,晶片本體311其側邊具有兩個側邊供 • 墨流道314,·而於兩個側邊供墨流道314之間則設置有平 • 行於該侧邊供墨流道314之三個中央供墨流道315,且該 三個中央供墨流道315係並列設置,晶片本體311於鄰 近兩侧邊供墨流道314的表面上係分別具有侧邊墨濟產 • 生器群組3161,而晶片本體311於鄰近中央供墨流道315 的一側邊則分別具有一中央墨滴產生器群組3162,其設 置之方式皆與第七圖所示之第二較佳實施例相同,故於 • 此處不再贅述。 . 由第七圖及第八圖所揭露之實施例可知,喷墨頭3 可依據需求於晶片本體311上設置一侧邊供墨流道314 配合多個中央供墨流道315,或兩侧邊供墨流道314配合 φ 多個中央供墨流道315,舉例而言,該多個中央供墨流道 315的數目可為四個或五個,但不以此為限,使喷孔板 — 32之喷孔322排列數可配合侧邊供墨流道314及中央供 墨流道315的數目相對地增加,以提供較佳的列印品質 以及提高列印的解析度。 第三圖至第八圖所揭露之側邊供墨流道314及中央 供墨流道315之間均以並列的方式平行設置,然於本案 可施行的較佳實施例中,側邊供墨流道314及中央供墨 流道315不僅止於平行的並列設置,亦可使用串列的實 20 1277525 施態樣。請參閲第九圖,1 ^ ^ ^ /、係本案弟四較佳實施例之喷 之透視圖。於本實施例中,喷墨頭3係包含有 :個以串列的方式排列之喷墨群組§1、§2及、3,亦即嗔 墨群組gl、g2及g3传平杆於而丨h +二 、 列印方向設置,當然,喷 ϋ & 配合喷墨群組…2及㈣設置態 樣同樣以W的方式㈣,㈣平行 而每一個喷墨群組gl、g2或是万门^置 S 乂疋以係分別由兩側邊供墨 、机這314以及一中央供墨流道315配合側邊墨滴產生器 群組3161以及中央墨滴產生器群組3162所構成,當缺, 於每一個噴墨群組gl、g2&3t的侧邊供墨流道叫、 中央供墨流道315、側邊墨滴產生器群組3161、以及中 央墨滴產生器群組遍的配置數量及方式並不以此為 限,亦可使用第三圖至第人圖的實施方式,喷墨頭製造 廠商可依據實際需求做各種變化,以增加魏的排列數 目’又串列的喷墨群組之數目亦可增加或減少,即依需 求做不同的調整。 另外,設置於於本案列印晶片3 i之晶片本體3 i i表 面之側邊墨滴產生器群、组3161及中央墨滴產生器群組 3162中的每—個墨滴產生器的㈣方式可分為差排及同 排的排列方式,請參㈣十圖,其係本案侧邊墨滴產生 器群組及中央墨滴產生器群組之墨滴產生器之間以差排 排列之一較佳實施例示意圖。如圖所示,該複數個墨滴 產生态群組316係包括兩側邊墨滴產生器群組3161及一 中央墨滴產生裔群組3162 ’而複數個墨滴產生器群組316 21 1277525 之總數為m,於本實施例中係以m等於3的情況提出規 明,且該兩側邊墨滴產生器群組3161及該中央墨 器群組3162係平行於列印方向排列而成,又該側邊墨滴 產生盗群組3161及中央墨滴產生器群組3162並自己本 身群組之每—個墨滴產生器皆成—直線排列,且任意兩 墨滴產生器群組3 i 6之間的距離大致相等。由於喷墨頭3 之喷孔板32上的複數個喷孔322係對應於晶片本體祀 上之墨滴產生ϋ群組316的每—個墨滴產生^,故本實 施例中係於嗔孔板32上之噴孔322標示墨滴產生器群电 316之墨滴產生器的差排排列方式。 設置於晶片本體311表面之側邊墨滴產生器群组 3161與其鄰近的中央墨滴產生器群組3162,在平行於焊 墊312設置的方向上最接近之兩相對應的墨滴產生器, 具有一間距Ρ,該間距ρ係垂直於焊墊312設置方向的一 長Ϊ ’、,而中央墨滴產生器群組3162與另一個側邊墨滴產 生盗群組3161 ’在平行於焊墊312設置的方向上最接近 之兩相對應的墨滴產生器,亦具有一間距ρ。 除了複數個墨滴產生器群組316之間對應的墨滴產 生器具有特定的間距ρ外,每一側邊墨滴產生器群組 3161以及中央墨滴產生器群組3162自己本身群組之墨 滴產生益也有特定的排列方式。請再參閱第十圖,該侧 邊墨滴產生器群組3161自身群組中相鄰的兩個墨滴產生 器具有一間距mp,由於m係為複數個墨滴產生器群組的 總數’且於本實施例中,複數個墨滴產生器群組之總數 22 ^277525 ’=為、3’故每一侧邊墨滴產生器群組3ΐ6ι自己本身群組 郝兩们墨滴產生$之間距為3p,而該中央墨滴產生 、、且3162其自己本身群組中相鄰的兩個墨滴產生器之 ^具有3P之間距。於本案之列印晶片3"吉構中p係 ^預定長度’例如1/15G英对、1/3G()英忖或1/6〇〇英 时等’但不以此為限。 M、,由於第十圖所示的較佳實施例中相鄰的兩墨滴產生 •斋群組其對應的墨滴產生器之間於垂直焊墊312設置方 向的間距為p ’且同—墨滴產生器群組自身相鄰的兩墨滴 產生器之間距為3p,因此噴孔板32上與墨滴產生器所對 應之噴孔322,其與平行焊墊312設置方向之兩相鄰近的 贺孔322間於垂直複數個焊墊312設置之方向上具有一 • 間距為P,舉例而言,噴孔3221與3222之間於垂直焊墊 312设置方向的間距為p,同理喷孔3222與3223之間於 重直:tp墊312 5又置方向的間距同為p,且同一組墨滴產生 • 器自身群組中相鄰的兩喷孔之間的間距為3p,舉例而 言’噴孔3221與3224之間於垂直焊墊312設置方向的 間距為3P,同理噴孔3225與3226之間於垂直焊墊312 設置方向的間距同為3p,至於其他喷孔322之間的距離 則以此類推。 由於m係指複數個墨滴產生器群組316之總數,並 配合第三至九圖之較佳實施例說明應可理解,若墨滴產 生器的排列方式使用差排的排列方式,則列印晶片31中 每一個墨滴產生器群組316自己本身之複數個墨滴產生 23 1277525 器中相鄰近的兩墨滴產生器的間距 化,例如:m可a 1 n i p應』具有多種變 ]广了為3或疋大於3的整數,如4、 但不以此為限,當對廡三— 荨 本體311上所報署的/真—圖的貫施例時,因晶片 所,又置的側邊墨滴產生器群組贿盘 =生器群组3162的總數為3n 排二 方式使用差排的㈣方式,騎 的排列 ό , 叭則母一墨滴產生器群組316 自己本身之複數個墨滴產生器中 ^ Pb^ ^ i Τ邳砷近的兩墨滴產生器 3ll j Μ對應第八圖的實施例時,因晶片本體 生哭置的側邊墨滴產生器群組3161與中央墨滴產 时群、、且162的總數為5,則每一墨滴產生器群組316 己本身之複數個墨滴產生器中相鄰近的兩 的間距為5p。 』座玍的 _ 當然,複數個墨滴產生器群組M6的墨滴產生器亦 :使用同排的排列方式以因應不同的列印需求。請參閱 第::圖,其係本案側邊墨滴產生器群組及中央墨滴產 籲生f群組之墨滴產生器之間以同排排列之—較佳實施例 不意圖。如圖所示,該複數個墨滴產生器群組316係包 括兩侧邊墨滴產生益群組3161及一中央墨滴產生器群組 3162,而複數個墨滴產生器群組316之總數為㈤,於本 實施例中同樣以m等於3的情況提出說明,且兩側邊墨 滴產生為群組3161及中央墨滴產生器群組3i62的排列 方向係與第十圖相同,即平行於列印方向排列而成,又 側邊墨滴產生器群組3161及中央墨滴產生器群組3162 其自己本身群組之複數個墨滴產生器係排列成一直線, 24 1277525 且兩兩墨滴產生器群組316之間的距離大致相等。且本 實施例同樣以喷孔板32上之喷孔322來標示墨滴產生器 群組316之墨滴產生器的同排排列方式。 …請再參閱第十-圖,晶片本體311之側邊墨滴產生 器群組3161與其鄰近的中央墨滴產生器群組3162,在平 行於焊塾312设置的方向上最接近之兩相對應的墨滴產 生器係位於同一直線上(如同第三至九圖所示之結構), 換言之’該複數個墨滴產生器群組316中每—群組的墨 滴產生器與相對應之墨滴產生器皆位於平行烊墊312設 置方向的同一直線上。 另外,每一側邊墨滴產生器群組3161自已本身群組 之鄰近兩墨滴產生器之間具有一間距p,而中央墨滴產生 器群組3162自己本身群組中鄰近的兩墨滴產生器之間的 間距亦同為p。當然’p係為一預定長度,例如1/15〇英 吋、1/300英吋或1/600英吋等,但不以此為限。 由於,於第十一圖所示的實施例中,晶片本體3ιι之 侧邊墨滴產生器群組3161與其鄰近的中央墨滴產生器群 組3162,在平行於焊墊312設置的方向上最接近之=相 對應的墨滴產生器係位於同一直線上,且每一侧邊墨滴 產生器群組3161自己本身群組之鄰近兩墨滴產生器之間 具有一間距p,因此喷孔板3 2上與墨滴產生器所對應之 喷孔322’其與平行焊墊312設置方向之相鄰噴孔322 係位於同一直線,舉例而言,喷孔3227、3228與^29 係與同一直線上,且同一墨滴產生器群組316之兩噴孔 25 1277525 之間的間距為P,舉例而言,喷孔3227與其相鄰之噴孔 之間於垂直焊墊3i2設置方向的間距為p,至於其他喷孔 322之間的距離則以此類推。 、/' 、 當然’第三圖至第九圖所述之較佳實施例之側邊墨 滴產生器群組與中央墨滴產生器群組3162所包含 之墨滴產生器的排列方式並不侷限於同排排列方式,亦 可依需求採用第十圖所示之差排排列方式。 • 而第十圖之差排排列的列印晶片31與噴孔板32袓 合形成-喷墨頭3且組裝於墨水E之本體4上後(如第 四圖所示)’於實際應用時墨水g之本體4内部係備置同 色之墨水,用以將侧邊墨滴產生器群組及中央墨滴 產生器群組3162所產生之複數個同色墨滴自所對應之複 數個喷孔322喷出至噴墨媒體上,做—單色喷墨列印。 而第十-圖之同排排列的列印晶片31與喷孔板%会且人 形成一^墨頭3且組裝於墨水g本體(如第四圖所 不)’於貫際應用時墨水匣本體4内部係備置複數種不同 色之墨水’用以將側邊墨滴產生器群組3161及中央墨滴 ^生器群組316 2所產生之複數個不同色墨滴自所對應之 複數個噴孔322噴出至該喷墨媒體上,做-多色噴墨列 印。 J上述說明可知’本案之列印晶片的主要技術特徵 …。。側邊供墨流道及中央供墨流道,以使應用於喷墨 P表叙喷墨頭具有較佳的列印品質、較高的列印解析 又以及較低的生產成本。此外’側邊供墨流道及中央供 26 1277525 墨流道的配置態樣並無特別的限制,舉凡晶片本體上具 有至少一侧邊供墨流道,以及至少一中央供墨流道的列 印曰曰片,皆為本案之保護範圍。再者,本案之晶片本體 上的側邊供墨流道及中央供墨流道,其排列數目及方式 亦無所設限,可為至少一側邊供墨流道配合一中央供墨 流道、一侧邊供墨流道配合多個並列中央流道(如第七圖 所示)、兩個側邊供墨流道配合多個並列中央供墨流道(如18 1277525 However, the side drop generator group 3161 and the central drop generator group - 3162 are each composed of a plurality of drop generators, and each drop generator is composed of an ink chamber 317 and a The heating resistor 318 is located in the ink chamber 317 (please refer to the fifth figure), and the plurality of nozzles 322 on the orifice plate 32 correspond to a plurality of droplet generator groups 316. The heating resistor 318 in the ink chamber 317 of the generator is heated by the heating resistor 318 and ejected from the orifice 322 to an ink jet medium (not shown). Similarly, only the wafer body 311 disclosed in the seventh figure is provided with a side ink drop generator group 3161 on the surface of the adjacent side ink supply flow path 314, and one side of the two central ink supply flow paths 315. A central droplet generator group 3162 is disposed on each side, but the plurality of droplet generator groups 316 designed in accordance with the flow channel design of the embodiment is not limited to the above configuration, for example, cooperation The single side ink supply flow path 314 and the two central ink supply flow paths 315 of the embodiment may also be provided with two sets of side ink drop generator groups on the surface of the wafer body 311 adjacent to the side edge φ ink supply flow path 314. Group 3161, and two or two sets of central drop generator groups 3162 are disposed on each side of the two central ink supply channels 315, respectively. Of course, one side of the ink supply channel 314 may be further added on the opposite side of the original side of the ink channel 314, so that the wafer body 311 has two side ink supply channels 314 plus two central ink supply. Flow path 315, and the increased side ink supply flow path 314 has its side drop generator group 3161 arranged in the same manner as the side drop generator group 3161 of the original side ink supply flow path 314. The change. Please refer to the eighth embodiment, which is a perspective view of the structure of the inkjet head 19 1277525 according to the third preferred embodiment of the present invention. As shown in the drawing, the wafer body 311 has a plurality of pads, 312 and side ink supply channels 314, The direction in which the central ink supply passage 315 is disposed has been described in detail in the first preferred embodiment, and therefore will not be described herein. In the preferred embodiment, the wafer body 311 has two side ink supply channels 314 on its side, and is disposed on the side between the two side ink supply channels 314. Three central ink supply flow paths 315 of the ink supply flow path 314, and the three central ink supply flow paths 315 are juxtaposed, and the wafer body 311 has side edges on the surfaces of the adjacent ink supply flow paths 314, respectively. The ink body generator group 3161 is disposed, and the wafer body 311 has a central ink drop generator group 3162 on one side adjacent to the central ink supply flow path 315, and the manner of setting is the same as that shown in the seventh figure. The second preferred embodiment is the same, and therefore will not be described again here. According to the embodiment disclosed in FIG. 7 and FIG. 8 , the inkjet head 3 can be provided with one side ink supply channel 314 and a plurality of central ink supply flow paths 315 on the wafer body 311, or both sides. The side ink supply passage 314 cooperates with φ a plurality of central ink supply flow paths 315. For example, the number of the plurality of central ink supply flow paths 315 may be four or five, but not limited thereto. The number of orifices 322 of the plates 32 can be relatively increased in conjunction with the number of side ink supply channels 314 and central ink supply channels 315 to provide better print quality and improved resolution of the print. The side ink supply flow path 314 and the central ink supply flow path 315 disclosed in the third to eighth embodiments are arranged in parallel in a side-by-side manner. However, in the preferred embodiment of the present invention, the side ink supply is provided. The flow path 314 and the central ink supply flow path 315 are not only arranged in parallel in parallel, but also in the form of a series of real 12 1277525. Please refer to the ninth figure, 1 ^ ^ ^ /, which is a perspective view of the spray of the preferred embodiment of the present invention. In the present embodiment, the inkjet head 3 includes: an inkjet group §1, §2, and 3 arranged in a tandem manner, that is, the inkjet groups gl, g2, and g3 are horizontally And 丨h + two, printing direction setting, of course, sneeze & with inkjet group... 2 and (d) setting the same way in W (four), (d) parallel and each inkjet group gl, g2 or The plurality of ink supply units 314 and a central ink supply flow path 315 are respectively formed by the side ink drop generator group 3161 and the central ink drop generator group 3162. When absent, the ink supply flow path of each of the inkjet groups gl, g2 & 3t, the central ink supply flow path 315, the side ink drop generator group 3161, and the central ink drop generator group are repeated. The number and method of configuration are not limited to this. The implementation of the third to the first figure can also be used. The inkjet head manufacturer can make various changes according to actual needs to increase the number of Wei's arrays. The number of inkjet groups can also be increased or decreased, that is, different adjustments can be made according to requirements. In addition, the (four) mode of each of the ink drop generator groups, the group 3161 and the central ink drop generator group 3162 disposed on the surface of the wafer body 3 ii of the wafer 3 i of the present invention may be Divided into the arrangement of the difference row and the same row, please refer to (4) 10 map, which is one of the difference between the ink drop generator group on the side of the case and the drop generator of the central ink drop generator group. A schematic diagram of a preferred embodiment. As shown, the plurality of drop generation states 316 includes both side drop generator groups 3161 and a central drop generator group 3162' and a plurality of drop generator groups 316 21 1277525 The total number is m, which is specified in the case where m is equal to 3, and the two sides of the ink drop generator group 3161 and the central ink group 3162 are arranged parallel to the printing direction. And the side ink droplets generate the pirate group 3161 and the central ink drop generator group 3162 and each of the ink droplet generators of the group itself is arranged in a straight line, and any two ink drop generator groups 3 The distance between i 6 is approximately equal. Since the plurality of nozzle holes 322 on the orifice plate 32 of the ink jet head 3 correspond to each ink droplet generation of the ink droplet generating group 316 on the wafer body, the present embodiment is tied to the pupil. The orifices 322 on the plate 32 indicate the arrangement of the rows of droplet generators of the droplet generator group 316. a pair of ink drop generator groups 3161 disposed at a side of the surface of the wafer body 311 and a central drop generator group 3162 adjacent thereto, and two ink drop generators corresponding to the two closest to the pads 312, Having a pitch Ρ that is perpendicular to the direction in which the pads 312 are disposed, and the central drop generator group 3162 and the other side ink drop generating group 3161' are parallel to the pads The two closest droplet generators in the direction set by 312 also have a pitch ρ. Each of the side drop generator groups 3161 and the central drop generator group 3162 themselves are grouped apart, except that the corresponding drop generators between the plurality of drop generator groups 316 have a particular pitch ρ. There are also specific arrangements for the benefits of ink droplets. Referring to FIG. 10 again, the two adjacent drop generators in the group of side drop generator groups 3161 have a pitch mp, since m is the total number of the plurality of drop generator groups' and In this embodiment, the total number of the plurality of ink drop generator groups is 22^277525 '= is, 3', so each side of the ink drop generator group 3ΐ6ι own group Hao two ink droplets generate $ spacing It is 3p, and the central ink droplets are generated, and 3162 has two 3D distances between adjacent two ink drop generators in their own group. In the case of the wafer 3" in the present invention, p is a predetermined length, e.g., 1/15 G, 1/3 G (), or 1/6 ’, etc., but is not limited thereto. M, because in the preferred embodiment shown in the tenth embodiment, two adjacent ink droplets are generated, and the spacing between the corresponding ink droplet generators in the direction of the vertical pad 312 is p' and the same The distance between the two ink drop generators adjacent to the ink drop generator group is 3p, so that the spray holes 322 corresponding to the ink drop generator on the orifice plate 32 are adjacent to the two directions of the parallel solder pads 312. The holes 322 have a spacing P in the direction in which the vertical plurality of pads 312 are disposed. For example, the spacing between the nozzles 3221 and 3222 in the direction of the vertical pads 312 is p, and the same is the same. The distance between 3222 and 3223 is straight: the pitch of the tp pad 312 5 is the same as p, and the spacing between adjacent nozzles in the same group of ink droplet generators is 3p, for example, The spacing between the nozzle holes 3221 and 3224 in the direction in which the vertical pads 312 are disposed is 3P, and the spacing between the nozzles 3225 and 3226 in the direction in which the vertical pads 312 are disposed is 3p, as for the other nozzles 322. The distance is like this. Since m is the total number of the plurality of drop generator groups 316, and should be understood in conjunction with the preferred embodiment of the third through nine figures, if the arrangement of the drop generators uses the arrangement of the differential rows, then the column Each of the ink droplet generator groups 316 in the printing wafer 31 has its own plurality of ink droplets generating 23 1277525. The spacing between two adjacent ink droplet generators in the device, for example: m can be a 1 nip should have a variety of variations] An integer of 3 or 疋 greater than 3, such as 4, but not limited to this, when the implementation of the / true - map reported on the — — 荨 body 311, due to the wafer, and The side of the ink drop generator group bribes = the total number of the live group 3162 is 3n, the second way is to use the difference (four) way, the arrangement of the ride is ό, the beater is a drop generator group 316 itself In the plurality of ink drop generators, the two ink drop generators 3 ll j Μ 近 Μ Μ Μ Μ Μ Μ Μ Μ Μ Μ Μ Μ Μ Μ Μ Μ Μ Μ Μ Μ Μ Μ Μ Μ Μ Μ Μ Μ Μ Μ Μ And the central ink droplet generation group, and the total number of 162 is 5, then each ink droplet generator group 316 has its own plurality The spacing between the two adjacent to the drop generator is 5p.玍 _ Of course, the ink drop generators of the plurality of drop generator groups M6 also use the same row arrangement to meet different printing needs. Please refer to the :: diagram, which is arranged in the same row between the group of ink droplet generators on the side of the case and the droplet generator of the central ink droplet generation group - the preferred embodiment is not intended. As shown, the plurality of drop generator groups 316 includes both sides of the drop generating benefit group 3161 and a central drop generator group 3162, and the total number of the plurality of drop generator groups 316. (5), in the present embodiment, the description is also made in the case where m is equal to 3, and the arrangement direction of the ink droplets generated on both sides as the group 3161 and the central droplet generator group 3i62 is the same as that of the tenth figure, that is, parallel. Arranged in the printing direction, the side drop generator group 3161 and the central drop generator group 3162 are arranged in a line of a plurality of ink drop generators in their own group, 24 1277525 and two inks. The distance between the drop generator groups 316 is approximately equal. Also, in this embodiment, the same row arrangement of the drop generators of the drop generator group 316 is indicated by the orifices 322 on the orifice plate 32. ... Referring again to the tenth-figure, the side drop generator group 3161 of the wafer body 311 and its adjacent central drop generator group 3162 correspond to the two closest in the direction parallel to the solder fillet 312. The droplet generators are on the same line (as in the structures shown in Figures 3 to 9), in other words, the ink droplet generator and the corresponding ink in each of the plurality of droplet generator groups 316. The drop generators are all located on the same line in the direction in which the parallel pad 312 is disposed. In addition, each of the side drop generator groups 3161 has a pitch p between two adjacent drop generators of its own group, and the central drop generator group 3162 has two adjacent ink drops in its own group. The spacing between the generators is also p. Of course, the 'p is a predetermined length, such as 1/15 inch, 1/300 inch or 1/600 inch, but not limited thereto. As shown in the eleventh embodiment, the side drop generator group 3161 of the wafer body 3 ι is adjacent to the central drop generator group 3162 in the direction parallel to the pad 312. Close to the corresponding drop generators are on the same line, and each side of the drop generator group 3161 has its own spacing p between adjacent two drop generators, so the orifice plate The nozzle hole 322' corresponding to the ink droplet generator is disposed in the same straight line as the adjacent nozzle hole 322 of the parallel pad 312. For example, the nozzle holes 3227, 3228 and ^29 are the same straight. The spacing between the two nozzle holes 25 1277525 of the same droplet generator group 316 is P. For example, the spacing between the nozzle holes 3227 and the adjacent nozzle holes in the direction of the vertical pad 3i2 is p. As for the distance between the other nozzles 322, and so on. And/or, of course, the arrangement of the side drop generators of the preferred embodiment described in the third to ninth embodiments and the drop generators included in the central drop generator group 3162 are not arranged. It is limited to the same row arrangement, and the difference arrangement shown in the tenth figure can also be adopted according to requirements. • The print wafer 31 and the orifice plate 32 arranged in the difference of the tenth image are combined to form the ink-jet head 3 and assembled on the body 4 of the ink E (as shown in the fourth figure). The inside of the body 4 of the ink g is provided with ink of the same color for spraying a plurality of ink droplets of the same color generated by the side ink drop generator group and the central ink drop generator group 3162 from the corresponding plurality of nozzle holes 322 Go out to the inkjet media and do - monochrome inkjet printing. And the printing wafer 31 and the orifice plate % arranged in the same row of the tenth-figure will form an ink head 3 and be assembled in the ink g body (as shown in the fourth figure). The body 4 is provided with a plurality of inks of different colors to use a plurality of different color ink droplets generated by the side ink drop generator group 3161 and the central ink droplet generator group 316 2 from the corresponding plurality of ink droplets The orifice 322 is ejected onto the ink jet medium for multi-color ink jet printing. J The above description shows the main technical features of the printed wafer in this case. . The side ink supply flow path and the central ink supply flow path enable the ink jet head to be applied to the ink jet P to have better print quality, higher print resolution, and lower production cost. In addition, there is no particular limitation on the configuration of the side ink supply channel and the central ink supply channel of the 26 1277525 ink channel, wherein the wafer body has at least one side ink supply flow path and at least one central ink supply flow path column. Neem tablets are the scope of protection for this case. Furthermore, the side ink supply flow path and the central ink supply flow path on the wafer body of the present invention are not limited in the arrangement number and manner, and at least one side ink supply flow path can be matched with a central ink supply flow path. One side ink supply channel cooperates with a plurality of parallel central flow channels (as shown in the seventh figure), and two side ink supply flow channels cooperate with a plurality of parallel central ink supply flow paths (eg
第八圖所示)以及側邊或中央供墨流道以串列之方式設 置(如第九圖所示)。 又本案之侧邊供墨流道及中央供墨流道旁雖以配置 一侧邊墨滴產生器群組及一中央墨滴產生器群組為例, 但不以此為限,換言之,一個側邊供墨流道亦可配合兩 群或多群交錯設置的侧邊墨滴產生器群組,而中央供墨 流迢亦然,一個或多個中央墨滴產生器群組可單設於平 行且鄰近一個中央供墨流道的一側,或分別設置於中央 墨滴產生盗群組的兩侧邊,亦即可依照實際需求調整供 墨流道及墨滴產生器群組的設置方式,進而提 产、 與列印品質。 又 m當然,墨滴產生器群組亦可依色彩使用的需求選用 早色或不同色的墨水,並配合採用差排或同排排列設 置,利用墨滴產生器群組中墨滴產生器的排列方式,使 所產生的複數個墨滴喷印於噴墨媒體上的預定位置,以 提高列印解析度及列印品質,並以最佳的列印方式完= 一單色噴墨列印或是多色喷墨列印於噴墨媒體上。凡 27 1277525 综上所述,本發明係提供—結合側邊供墨流道及中 央供墨流道的列印晶片’其細㈣供墨流道為主並輔 =中央供墨流道,使本案之列印晶片同時具有侧邊供墨 机逼及中央供墨流道之優點,而本案更進—步以特定的 方式及間距設置晶片本體上的墨滴產生器群組及其對應 之噴孔板上的喷孔’且利用供墨流道中同色、異色或濃 =同的墨水’使噴墨頭以最佳的列印方式形成於喷墨 媒體上,,亦使墨水^之運用得以更螓完備。因此,本案 極具產業之價值,爰依法提出申請。 、 ㈣本發明已由上述之實施例詳細敘述而可由孰来 =二人士任施匠思而為諸般修飾,然皆不脫如二The eighth or central ink supply flow path is arranged in series (as shown in Figure 9). In the case of the side ink supply channel and the central ink supply flow path, the side ink drop generator group and a central ink drop generator group are arranged as an example, but not limited thereto, in other words, one The side ink supply flow path can also be combined with two or more groups of side ink drop generator groups arranged in a staggered manner, and the central ink supply flow is also the same, and one or more central ink drop generator groups can be set on the single Parallel and adjacent to one side of a central ink supply flow path, or respectively disposed on both sides of the central ink droplet generation group, the ink supply flow path and the ink drop generator group can be adjusted according to actual needs. , and then improve production, and print quality. And of course, the ink drop generator group can also use early or different colors of ink according to the requirements of color use, and use the difference row or the same row arrangement, using the ink drop generator in the ink drop generator group. Arranging the plurality of ink droplets to be printed on a predetermined position on the inkjet medium to improve the printing resolution and print quality, and to finish printing in an optimal manner. Or multi-color inkjet printing on inkjet media. GENERAL 27 1277525 In summary, the present invention provides a printing wafer that combines a side ink supply flow path and a central ink supply flow path, and a fine (four) ink supply flow path and a secondary central ink supply flow path. The printed wafer of the present case has the advantages of the side ink supply device and the central ink supply flow path, and the present invention further sets the ink drop generator group on the wafer body and its corresponding spray in a specific manner and spacing. The orifices on the orifice plate and the ink of the same color, different color or richness = the same ink in the ink supply channel are used to form the inkjet head on the inkjet medium in an optimal printing manner, and the ink is further utilized. Complete. Therefore, this case is of great industrial value and is submitted in accordance with the law. (4) The present invention has been described in detail by the above embodiments, and can be modified by the likes of the two people.
凊專利範圍所欲保護者。 T 【圖式簡單說明】 第一圖·其係為習知使用中央供墨流道之 意圖。 、 第一圖·纟係為習知使用側邊供墨流道之喷 意圖。 墨頭結構 不 墨頭結構 不 第一圖·其係為本案第一較佳實施例之嘴 意圖。 墨頭結構之 不 片 曰曰 第四圖··其係為具有本案$—較佳實施例之 %孔板與墨水匣之組合示意圖。 第五圖··其係為第三圖之局部放大圖。 28 1277525 頭結構之透視 第圖·其係為第三圖組裝後之透視圖。 第七圖··其係為本案第二較佳實施例之噴黑 第八圖:其係為本案第 圖0 三較佳實施狀噴墨頭結構之透視 第九圖:其係為本㈣四較佳實施例之噴墨頭結構之透視 圖。欲 Whoever wants to protect the patent scope. T [Simple description of the drawing] The first figure is intended to use the central ink supply flow path. The first figure is a conventional intention to use the side ink supply flow path. Ink head structure No ink head structure No. Fig. 1 is the mouth of the first preferred embodiment of the present invention. The ink head structure is not a piece of film. The fourth figure is a combination of the % orifice plate and the ink cartridge of the present invention. The fifth figure is a partial enlarged view of the third figure. 28 1277525 Perspective of the head structure Fig. · It is a perspective view of the assembled figure in the third figure. The seventh figure is the eighth figure of the blackout of the second preferred embodiment of the present invention: it is the ninth diagram of the structure of the ink jet head of the preferred embodiment of the present invention: it is based on (4) A perspective view of the ink jet head structure of the preferred embodiment.
第十圖:其係本案側邊墨滴產生器群組及巾央墨滴產生器 群組之墨滴產生mu排排狀—較佳實施例示意 圖。 第十一圖·其係本案側邊墨滴產生器群組及中央墨滴產生 器群組之墨滴產生器之間以同排排列之一較佳實施例示 意圖。Fig. 10 is a schematic view of a preferred embodiment of the ink droplet generator group and the ink droplet generator group of the present invention. Figure 11 is a preferred embodiment of the same row arrangement between the side drop generator groups of the present case and the drop generator of the central drop generator group.
29 127752529 1277525
【主要元件符號說明】 1 喷墨頭 11 列印晶片 111 焊墊 112 中央供墨流道 113 墨水腔 12 喷孔板 121 喷孔 2 喷墨頭 21 列印晶片 211 焊墊 212 側邊供墨流道 213 墨水腔 22 喷孔板 221 喷孔 ' 3 喷墨頭 31 列印晶片 311 晶片本體 312 焊墊 313 出墨侧邊 314 侧邊供墨流道 315 中央供墨流道 316 墨滴產生群組 3161 側邊墨滴產生器群組 3162 中央墨滴產生器群組 317 墨水腔 318 加熱電阻 32 喷孔板 321 凹口 322 喷孔 ^ 3221-3229 喷孔 322 喷孔 4 墨水匣本體[Main component symbol description] 1 inkjet head 11 printing wafer 111 pad 112 central ink supply channel 113 ink chamber 12 orifice plate 121 nozzle hole 2 inkjet head 21 printing wafer 211 pad 212 side ink supply flow Lane 213 ink chamber 22 orifice plate 221 orifice '3 inkjet head 31 printing wafer 311 wafer body 312 pad 313 ink exit side 314 side ink supply flow path 315 central ink supply flow path 316 ink drop generation group 3161 side drop generator group 3162 central drop generator group 317 ink chamber 318 heating resistor 32 orifice plate 321 notch 322 nozzle hole ^ 3221-3229 nozzle hole 322 nozzle hole 4 ink cartridge body
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Cited By (5)
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US8820893B2 (en) | 2011-03-23 | 2014-09-02 | Microjet Technology Co., Ltd. | Inkjet printhead |
TWI468303B (en) * | 2011-03-23 | 2015-01-11 | Microjet Technology Co Ltd | Inkjet head structure |
TWI472437B (en) * | 2011-03-23 | 2015-02-11 | Microjet Technology Co Ltd | Inkjet head structure |
TWI472436B (en) * | 2011-03-23 | 2015-02-11 | Microjet Technology Co Ltd | Inkjet head structure |
TWI472438B (en) * | 2011-03-23 | 2015-02-11 | Microjet Technology Co Ltd | Inkjet head structure |
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US8820893B2 (en) | 2011-03-23 | 2014-09-02 | Microjet Technology Co., Ltd. | Inkjet printhead |
TWI468303B (en) * | 2011-03-23 | 2015-01-11 | Microjet Technology Co Ltd | Inkjet head structure |
TWI472437B (en) * | 2011-03-23 | 2015-02-11 | Microjet Technology Co Ltd | Inkjet head structure |
TWI472436B (en) * | 2011-03-23 | 2015-02-11 | Microjet Technology Co Ltd | Inkjet head structure |
TWI472438B (en) * | 2011-03-23 | 2015-02-11 | Microjet Technology Co Ltd | Inkjet head structure |
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