TWI272673B - Cutting machine - Google Patents

Abstract

Single side door portion, central door portion and the other side door portion are disposed on the front portion of the cutting machine housing. The single side door portion is mounted to have the capability of moving freely in between the opening positions, which cover the closing position of the front portion of the cleaning region and change position toward the single side direction of the housing to open the front portion of the cleaning region. The central door portion is mounted to have the capability of moving freely in between the opening positions by covering the closing position of the front portion of the adsorbing region and changing position toward the single side direction so as to open the front portion of the adsorbing region at least when it is mostly at the backside or front side of the single side door. The other side door portion is mounted to have the capability of moving freely in between the opening positions for covering the front portion of the wafer cartridge box region and opening the front portion of the wafer cartridge box region. The invention is provided with a means for transferring the processed object. The transferring means of the processed object is disposed to have the first holding means and the second means for holding the processed object on the commonly movable supporting frame body.

Description

1272673 A7 B7 Ministry of Economic Affairs Intellectual Property Office Employees Consumption Cooperatives Printing 5, Invention Description (1) Technical Field The present invention relates to a cutting machine suitable for cutting a semiconductor wafer, and more particularly to a cutting machine, The front half in the casing is disposed with an adsorption region located at the center in the width direction, a rinsing region located on one side of the adsorption region, and a wafer cassette mounting region on the other side of the adsorption region, and the shell The rear half of the body is provided with a cutting area located at the center in the width direction. [PRIOR ART] In Japanese Laid-Open Patent Publication No. 2000-75, a cutting machine suitable for cutting a semiconductor wafer with high efficiency is disclosed. Such a cutting machine has a casing that extends elongated in the front-rear direction, and an operation panel is disposed at a front portion of the casing. On one side of the casing, the wafer cassette mounting area, the adsorption area, and the rinsing area are arranged in order toward the rear. A cutting region is disposed at a central portion in the front-rear direction on the other side of the casing. A temporary support means is provided in the adsorption zone. Instead, it is provided with a movable adsorption means capable of selectively positioning it in the adsorption zone and the cutting zone. A support means is disposed in the wafer cassette mounting area, and a rinsing means is disposed in the rinsing area. On the other side of the casing, two cutting means, i.e., a first cutting means and a second cutting means, are provided. The first cutting means includes a first rotating shaft and a cutting tool attached to the first rotating shaft, and the second cutting means includes a second rotating shaft and a cutting tool attached to the second rotating shaft. The first rotating shaft and the second rotating shaft extend the other side of the casing in a front-rear direction, and the first cutting tool and the second cutting tool are respectively applicable to the Chinese National Standard (CNS) A4 specification (210X297). () Please read the note on the back to write this page. i Install '1272673 A7 B7 5. Invention description (2) Installed on the inner side of the first rotating shaft, that is, the rear end and the inner end, that is, the front end , making their positions opposite each other. The cutting machine that is provided with the three workpieces for conveying the workpiece to convey the two rotating shafts is also the first workpiece conveying means, the second workpiece conveying means, and the third workpiece conveying means. A wafer cassette is placed on the wafer cassette supporting means, and the inside of the cassette is accommodated at intervals in the vertical direction, and the plurality of pieces are attached to the center of the frame to be installed in the center of the frame. Cooperatives print wafers. Each time the workpiece is moved, the workpiece is transported by the second tool. The semiconductor material is transported. The first material is transported out of the transporter area to the area where the wafer acts on the wafer. The pick-up of the work is carried out by means of the means that the processed part will transport the hand area. Being processed and cut. And sent to the wash.输送 Delivered to the temporary transporter to the temporary temporary support. Then, the object is cut into three. After the washing is done, the support section will support the supporting means to absorb the workpiece at the completion of the cutting line. The inside of the wafer cassette on the segment of the cleaning method is added. The next processed part of the processed object will make the first cutting, and the means of adsorption will send the means to be processed by the semiconductor in the wafer, that is, the semiconductor of the mouth. The means of transporting the material in place is a tool and, in other words, the second processed portion that is moved to the adsorption means for cutting. Then, the first processed workpiece is transported to the wafer cassette loaded on the wafer cassette support means, which is placed on the back surface Sj. The cutting machine as described above, which is disclosed in Japanese Laid-Open Patent Publication No. 2000-75, and other types of cutting machines, for example, Japanese Patent Laid-Open No. Hei No. Hei No. Hei. No. Hei. The scale applies to the Chinese National Standard (CNS) A4 specification (210 X 297 mm) -6- 1272673 A7 B7 V. Inventive Note (3) Compared with the cutting machine disclosed in the publication, the configuration of each area is further reduced. More miniaturized. However, it is not a perfect construction and has the following problems. The cutting tool of the cutting means will wear out due to the execution of the cutting, and needs to be exchanged, but there is a considerable distance from the front side of the casing to the mounting position of the cutting tool, and the cutting tool is exchanged from the front side of the casing, not Impossible but also quite difficult. Usually, the operator is placed on the side of the casing to perform the exchange operation of the cutting tool, and the exchange operation is complicated. Since it is necessary to allow the operator to be positioned on the side of the casing during the exchange of the cutting tool, it is necessary to ensure the required space in the vicinity of the side portion of the casing, which results in a space for mounting the cutting machine. Big. When a cutting machine is used to cut a semiconductor wafer, it is necessary to equip the cutting machine in a so-called clean room, and the necessary space for arranging the cutting machine becomes large, and this problem cannot be ignored. The Ministry of Economic Affairs, the Intellectual Property Office, and the Employees' Cooperatives Co., Ltd. are designed to solve the problems as described above, to facilitate the exchange operation of the cutting tool, and to reduce the necessary space for the machine to be equipped with the cutting machine. The specification and drawings of the 2 0 0 1 - 1 6 2 9 5 8 (hereinafter referred to as "pre-application instructions and drawings") disclose a cutting machine in the front half of the casing and in the center in the width direction. The adsorption region is disposed, the rinsing region is disposed on one side of the adsorption region, and the wafer cassette placement region is disposed on the other side, and the cutting region is disposed at the central portion in the width direction at the rear half of the casing. In such a cutting machine, when a specific region of the front surface of the casing is opened, the cutting tool of the cutting means can be accessed from the front portion of the casing, and the exchange operation of the cutting tool can be performed easily and quickly. It is not necessary to keep the operator on both sides of the casing or the paper size is applicable to the Chinese National Standard (CNS) A4 specification (210X297 mm) 1272673 Α7 Β7 V. Invention description (4) The space of the face can be sufficient Shrinking room. However, in the previous application specification and the lack of sufficient review, the structure of the door can be performed in accordance with the structure of the door, and the mounting operation of the cutting hand or the wafer cassette mounting area is not performed. The opening and closing operation of the door portion is very close to the display means of the various states of the cutting machine when the cutting tool of the cutting means is to be exchanged into the casing, and is small for the cutting of the necessary empty surface of the cutting machine. The wafer cassette support hand of the cutting tool in the front section of the open casing is often complicated to execute the door, and there is such a thing that the operator will use it as a means, and there should be no such a machine, and the plural of the face The problem of opening and closing of the wafer portion on the exchange operation period. The upper body enters and sees the problem. Please read the back-to-back items

The Ministry of Economic Affairs, the Intellectual Property Office, and the Employees' Cooperatives Co., Ltd. printed the above-mentioned cutting machine disclosed in the Japanese Patent Laid-Open Publication No. 2000-70, which is separately provided with three workpiece conveying means, that is, the first In the workpiece conveyance means, the second workpiece conveyance means, and the third workpiece conveyance means, the presence of the three workpiece conveyance means is generated, the size is reduced, and the production cost is increased. The problem. DISCLOSURE OF THE INVENTION The present invention has been made in view of the above circumstances, and a first object thereof is to improve the structure of a plurality of door portions provided in a casing of the above-described cutting machine disclosed in the above-mentioned specification and drawings. Fully and reasonably performing the opening and closing operation of the door portion of the required area for opening the front portion of the casing in response to the need, in addition to achieving the above first object, when the paper size is applied to the Chinese National Standard (CNS) Α 4 specification (210Χ 297 mm) -8- 1272673 A7 Ministry of Economic Affairs Intellectual Property Bureau Employees Consumption Cooperatives Printing V. Invention Description (5) The operator allows the operator to enter the upper part of the casing in order to exchange cutting tools. It is easy to approach various operating means, and it is possible to easily visually display the display means for displaying various states of the cutting machine. The third object of the present invention is to provide the first workpiece conveying means and the second workpiece conveying means. The structure is partially common, and the processing machine can be miniaturized and the manufacturing cost can be reduced. With the first invention of the present invention, The first object described above is to provide three kinds of door portions at the front portion of the casing, that is, to be disposed to be: a closed position covering the front portion of the rinsing region and a singular position from the closed position toward the casing The side direction changing position is to open the one-side door portion that is freely movable between the open positions of the front portion of the washing area, and is mounted on the one-side door portion. When the one-side door portion is in the closed position, the front portion of the adsorption area can be closed. a central door portion that is movable between a position and an open position in which the position is changed from the closed position toward the one-side direction and at least a majority of which is located behind or in front of the one-side door portion, and is mounted to be movable : covering the other side door portion that is freely movable between the closed position of the front portion of the wafer cassette region and the open position of the front portion of the open wafer cassette region. That is, by the first invention of the present invention, The cutting machine of the first object is disposed in the front half of the casing: an adsorption region located at a central portion in the width direction, and one side of the adsorption region a cleaning region and a wafer cassette mounting region on the other side of the adsorption region, wherein a rear portion of the housing is a cutting region disposed at a central portion in the width direction, and is disposed in the cleaning region The means of washing, equipped with this (please read the note on the back to write this page) • Loading - ordering - line paper size applicable to China National Standard (CNS) A4 specification (210X297 mm) 9- 1272673 A7 B7 Economy (5) The wafer cassette supporting means in the wafer cassette mounting area is movably disposed in the center in the width direction of the housing in the front-rear direction. Selectively, the adsorption means located in the adsorption zone and the cutting zone, and the rear half disposed in the casing, have cutting means for the cutting tool located in the cutting zone, and the wafer cassette supporting means is loaded A wafer cassette containing a plurality of workpieces is placed, and the workpiece contained in the wafer cassette is sequentially transported to the adsorption area, and is adsorbed to the adsorption area. The adsorption means is transported to the cutting area together with the adsorption means, and the cutting area is cut by the cutting tool of the cutting means, and then returned to the adsorption area together with the cutting means, from the adsorption area It is conveyed to the rinsing area and is washed and then transported back to the wafer cassette. At the front part of the housing, it is arranged to be installed so as to cover the front side of the rinsing area and the closed position a one-side door portion that is freely movable between an open position of the front portion of the rinsing region and a one-side door portion when the one-side door portion is in the closed position is changed from the closed position to the one-side direction of the housing. The opening position covering the front portion of the adsorption region and the changing position from the closed position to the one-side direction and at least a majority of the opening position of the front portion of the adsorption region open behind or in front of the one-side door portion a central door portion that is freely movable between, and a closed position that can be attached to cover the front portion of the wafer cassette area and a front portion of the open wafer cassette area The other side doors that move freely between the open positions. The other side door portion, preferably the other side door portion, is centered on a central axis of the revolution that extends substantially perpendicularly to the other side of the housing, and is applicable to the Chinese National Standard (CNS) A4 specification at the paper scale ( 210X297 mm)~' (Please read the notes on the back first\^write this page)

-IJ· I IWI •Installation·

, 1T -10- 1272673 A7 B7 Ministry of Economic Affairs Intellectual Property Bureau employee consumption cooperative printing 5, invention description (7) The closed position and the open position freely swing. In the cutting machine for achieving the above second object, when the central door portion is moved to the open position, at least a majority of the central door portion is located behind the one-sided door portion, in front of the one-sided door portion a portion that is mounted at a normal position along a front side portion of the one-side door portion and a single-side door centered on a center of a center of rotation substantially perpendicular to an inner side edge portion of the one-side door portion A support member that swings freely between the extended positions that extend forward, and an operation panel is attached to the support member. The operation panel is preferably constituted by a touch panel. In a preferred embodiment, the cutting means includes a first cutting means and a second cutting means, the first cutting means having: a first rotating shaft and a first cutting tool mounted on the first rotating shaft, The second cutting means has a second rotating shaft and a second cutting tool mounted on the second rotating shaft, the first rotating shaft and the second rotating shaft extending in the width direction in the casing In the second half, the first cutting tool and the second cutting tool are respectively mounted at positions inward in the width direction of the first rotating shaft and inward in the width direction of the second rotating shaft, and are located opposite to each other. In the adsorption zone, a temporary support means is provided, and the workpiece conveyed from the wafer cassette to the adsorption zone is initially placed on the temporary support means, and then from the temporary support means. The workpiece to be transported to the adsorption means, and then divided and washed, is transported from the scrubbing area to the adsorption zone, and after being placed on the temporary support means, is transported into the crystal Round box. The temporary supporting means is constituted by a pair of supporting members which are capable of placing the position of the workpiece between the two at a predetermined interval therebetween (please read the back sheet first) Write this page)

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, ^ This paper scale applies to China National Standard (CNS) A4 specification (210X297 mm) 1272673 A7 B7 V. Invention description (8) (Please read the note on the back to write this page), and separate from the action position The direction of movement allows the workpiece to move freely between the inactive positions that are lowered between the two, so that when the adsorption means is located in the adsorption zone, the adsorption means will be located below the temporary support means. The workpiece is a semiconductor wafer having a circular plate shape and containing diamond particles to cut the semiconductor wafer. According to another aspect of the present invention, in order to achieve the above-described third object, a workpiece conveying means in which a first workpiece conveying means and a second workpiece conveying means are combined with a conventional cutting machine is provided, that is, The common movable supporting structure is provided with a first holding means which functions as a first workpiece conveying means of a conventional cutting machine, and a second holding means which is a conventional cutting machine The function of the second workpiece transport means is to equip the workpiece transport means thus constituted to the cutting machine. In other words, the cutting machine for achieving the above-described third object is provided with a wafer 配置 disposed in a wafer cassette mounting area by another invention of the present invention. a cartridge supporting means, a temporary supporting means disposed in the adsorption region, a cutting means disposed in the cutting region, a movable adsorption means for selectively positioning the adsorption region and the cutting region, and a workpiece conveying means; In the wafer cassette supporting means, a wafer cassette in which a workpiece is housed is placed, and the workpiece conveying means causes the workpiece to be loaded from the wafer cassette placed on the wafer cassette supporting means. The cartridge is conveyed, conveyed to the temporary support means, and then transported from the temporary support means to the adsorption means located in the adsorption zone, and after being cut, placed on the temporary support means The processed material is transported into the wafer. The paper size is applicable to the Chinese National Standard (CNS) A4 specification (210X297 mm) -12- 1272673 A7 B7 V. Invention Description (9 a cutting machine in the wafer cassette in the supporting means, wherein the workpiece conveying means includes: a common movable supporting structure, and is disposed in the common movable supporting structure and enters into the wafer cassette a first holding means for holding the workpiece in the wafer cassette freely and openly, and a workpiece attached to the temporary movable supporting structure and being detachably held by the temporary supporting means a second holding means for placing the workpiece when it is transported from the wafer cassette loaded on the wafer cassette support means to the temporary support means, and when the cutting is completed When the workpiece on the temporary supporting means is transported into the wafer cassette loaded on the wafer cassette supporting means, the first holding means holds the workpiece, and when the workpiece is supported from the temporary support When the means is transported to the adsorption means located in the adsorption zone, the second holding means retains the workpiece. The present invention is also applicable to a cutting machine that does not have a rinsing means and a related workpiece conveying means, that is, a third workpiece conveying means of a conventional cutting machine. In a preferred embodiment, the workpiece is a semiconductor wafer mounted on the mounting opening of the frame having the opening in the center via a mounting tape, and the wafer cassette is accommodated in the wafer cassette at intervals in the vertical direction. A processed object. The common movable supporting structure includes: a horizontal moving member mounted parallel to a separating direction from the wafer cassette mounting region and the adsorption region and substantially movable in a horizontal direction, and mounted to be movable The elevating moving member that is freely movable up and down in a direction substantially perpendicular to the horizontal moving means; the first holding means and the second holding means are preferably disposed on the elevating moving member. The paper size of the processed material conveying means is applicable to the Chinese National Standard (CNS) A4 specification (210X297 mm) ' "" -13 - (please read the notes on the back ^^^ write this page) Ιτ Ministry of Economic Affairs Intellectual Property Office Staff Consumer Cooperative Printed 1272673 A7 B7 V. Invention Description (1〇) (Please read the note on the back 5? ^ Write this page) Ministry of Economic Affairs Intellectual Property Bureau employee consumption cooperative printed the first The holding means, wherein at least one of the protrusions in the up-and-down direction is separated by an interval, and is constituted by a pair of holding pieces that are freely accessible and separated from each other, and the pair of holding pieces hold the side edge of the frame The second holding means of the workpiece conveying means is constituted by a plurality of adsorbers for vacuum-absorbing the upper surface portion of the frame. The elevating and moving member of the workpiece conveying means is a movable member to which an inoperative position that can be selectively lowered to the lower side and an inactive position that extends upward is attached, and the pair of holding pieces are disposed at The movable member, when the movable member is at the acting position, the pair of holding pieces protrude outward from the movable member. The base end portion of the movable member can be rotatably attached to the elevating member about a center of a whirling center extending substantially horizontally. In a preferred embodiment, the temporary support means comprises a pair of support members, the pair of support members being selectively positionable to: position the frame across the frame, and allow the frame to pass In the non-acting position between the two, when the adsorption means is located in the adsorption area, the adsorption means is located below the pair of support members of the temporary support means. The cutting machine provided with the rinsing means disposed in the rinsing area is provided with the processed workpiece only for conveying the processed material located in the adsorption area from the adsorption means to the 淸An additional workpiece conveying means used for the washing means, the workpiece conveying means is also used for conveying the workpiece from the rinsing means to the temporary supporting means, and conveying the workpiece from the rinsing means When the temporary supporting means is reached, the second holding means can be held by the workpiece. This paper scale applies to China National Standard (CNS) A4 specification (210X 297 mm) -14- 1272673 A7 B7 V. Description of invention (11) [Description] Fig. 1 shows the cutting machine constructed by the present invention. A perspective view of a preferred embodiment. Fig. 2 is a perspective view showing the cutting machine shown in Fig. 1 in a state in which the center door portion is in the open position and the one-side door portion to which the center door portion is attached is in the open position. Fig. 3 is a perspective view showing the internal structure of the cutting machine of Fig. 1 and omitting a casing or the like. Fig. 4 is a perspective view showing a workpiece (a semiconductor wafer mounted on a frame via a mounting tape) which is cut by the cutting machine of Fig. 1; Fig. 5 is a perspective view showing a workpiece conveying means disposed in the cutting machine of Fig. 1. [Description of the figure] A: Wafer cassette mounting area B: Adsorption area C: Washing area D: Cutting area 2: Housing 4: One-sided door part 6: Central door part 8: Other side door part 1 0 : Support Component 1 2 : Touch panel The paper size is applicable to China National Standard (CNS) Α4 specification (210Χ297 mm) (Please read the note on the back to write this page). Install·, *ιτ Ministry of Economic Affairs Intellectual Property Bureau staff consumption Co-operative printing -15- 1272673 A7 B7 Ministry of Economic Affairs Intellectual Property Bureau employee consumption cooperative printing 5, invention description (12) 1 4: handle 1 6: handle 2 0: handle 3 4: wafer cassette support means 4 0: Lifting table 4 2 : Guide rail 4 4 : Male threaded shaft 4 6 : Workpiece 4 8 : Wafer cassette 5 0 : Frame 5 2 : Mounting strip 5 4 : Semiconductor wafer 5 6 : Cutting path 6 4 : Temporary support Means 6 6 : Supporting member 6 8 : Adsorption means 7 0 : Supporting base 7 2 : Supporting block 7 4 : Guide rail 7 6 : Slide block 7 8 : Male threaded shaft 8 4 : Holding mechanism 8 6 : Movable holding piece 8 8 : Hollow protective catheter (please read the note on the back to write this page) $ , 1' This paper scale applies to China National Standard (CNS) A4 specification 210X29?mm) 1272673 A7 B7 V. Description of invention (13) 9 0 : Washing means 1 0 0 : Air cylinder mechanism 1 1 2 a : First cutting means 1 1 2 b : Second cutting means 1 5 0 :Processing material conveying means [Invention embodiment] Hereinafter, a preferred embodiment of the cutting machine constructed by the present invention will be described in more detail with reference to the drawings shown in the drawings. Fig. 1 is a view showing the entirety of a cutting machine constructed by the present invention. This cutting machine is provided with a housing which is shown in the figure 2 as a whole. The housing 2 shown in the drawing has a vertically long rectangular parallelepiped shape. In the front part of the casing 2, three door parts are provided which are freely openable and closable, that is to say: one side in the width direction (in the illustrated embodiment, the left side is seen from the front) The one-side door portion 4, the central door portion 6 located at the center in the width direction, and the other side door portion 8 located on the other side in the wide portion direction (the right side in the illustrated embodiment in the front view). The portion of the casing 2 other than the one-side door portion 4, the central door portion 6, and the other side door portions 8 is the casing main body, and can be constituted by joining appropriate plate-like members or the like. The one-side door portion 4 is of an inverted L shape and protrudes slightly forward and upward from the front portion and the upper surface portion of the other region of the casing 2. The single-sided door portion 4 is a plane that extends substantially horizontally and substantially vertically between a closed position shown by a solid line and an open position shown by a two-dot dotted line by a suitable mounting means (not shown). The front part of the body 2 is movably mounted on the main paper size of the casing. Applicable to the Chinese National Standard (CNS) A4 specification (210X297 mm) (please read the notes on the back to write this page) • Install and order the Ministry of Economic Affairs Intellectual Property Bureau employee consumption cooperative printed 1272673 A7 B7 V. Invention description (14) (Please read the note on the back first to write this page) Ministry of Economic Affairs Intellectual Property Bureau employee consumption cooperative printed body. An appropriate locking mechanism (not shown) is attached to the one-side door portion 4, and the one-side door portion 4 can be freely disengaged in both the closed position and the open position. A support member 1 is attached to the intermediate portion in the up-and-down direction of the front portion of the one-side door portion 4. The support member 1 is mounted on the center of the center of rotation 1 1 extending substantially perpendicularly in the width direction of the one side door portion 4 by a suitable attachment means, and is mounted as shown by a solid line. The position, that is, the normal position extending along the front portion of the one-sided door portion 4, and the position indicated by the two-dot dotted line, that is, the extension extending substantially perpendicularly from the one-side door portion 4 with respect to the front portion thereof Free spin between the out positions. Further, the supporting means 10 itself is maintained at a stationary state at an arbitrary angular position from the normal position and the extended position by a conventional maintenance means (not shown). The support member 10 is a touch panel 12 to which a rectangular shape is attached. The touch panel is composed of display means for displaying various operating states of the cutting machine (for example, a flow state of the cooling liquid, a flow state of the compressed air, etc.), and is included to control the operation of the cutting machine. The operation panel of the operation means is constituted. In the lower portion of the support member 10, a handle 14 extending in the horizontal direction is provided, and when the support member 10 is to be rotated, the handle 1 4 can be held. The central door portion 6 is a substantially vertically extending flat plate. The shape 'is not mounted on the housing body, but is a closed position and two points shown by the solid line along a substantially vertically extending plane (a plane in which the central door portion 6 itself extends) by a suitable mounting means. The one-side door portion 4 is mounted substantially freely horizontally between the open positions indicated by the broken lines. Appropriate locking mechanism (not shown) is attached to the central door portion 6. The central door portion 6 is applicable to the Chinese National Standard (CNS) A4 specification (210X297 mm) relative to the one-sided door paper size. -18- 1272673 A7 B7 (Invention) (15) The portion 4 can be locked freely at both the closed position and the open position. In the illustrated embodiment, the central door portion 6 is mounted at the rear portion of the one-sided door portion 4, and when moved to the above-described open position, the main portion (i.e., other than the right edge portion seen from the front) Part) will be located behind the one-sided door 4. As will be described later, when the central door portion 6 is moved to the open position shown in Fig. 1, the one-side door portion 4 is moved to the open position indicated by the two-dotted line shown in Fig. 1, and the central door portion is moved. 6 moves in accordance with the movement of the one-side door portion 4, and becomes the state shown in Fig. 2 . The lower portion of the right side edge portion of the center door portion 6 as viewed from the front is provided with a handle 16 extending in the vertical direction, and the handle portion 16 can be held when the center door portion 6 is to be moved. Referring to Fig. 1 again, the other side door portion 8 has an L-shaped cross-sectional shape and is substantially perpendicularly extended to the other side of the casing 2 by a suitable mounting means (not shown). The center of the center of rotation of the right side is viewed from the front, and the center of the center of rotation 8 8 is rotatably mounted on the casing body between the closed position indicated by the solid line and the open position indicated by the two-dotted line. An appropriate locking mechanism (not shown) is attached to the other side door portion 8, and both the closed position and the open position can be freely unlocked. The center portion of the left side edge portion of the other side door portion 8 as viewed from the front is provided with a handle 20 extending in the vertical direction, and the handle 20 can be held when the one-side door portion 8 is to be rotated. Referring to FIGS. 1 and 3 together, in the casing 2, the wafer cassette mounting area A, the adsorption area B, and the rinsing area C are disposed in the front half. The adsorption area B is disposed at the center of the width direction, and the size of the crystal paper is applicable to the Chinese National Standard (CNS) A4 specification (210X 297 mm). (Please read the notes on the back first ^^ Write this page) • Install _ Ministry of Economics Property Bureau Staff Consumer Cooperative Printed -19- 1272673 A7 B7 V. INSTRUCTIONS (16) The round box area A is disposed on one side of the adsorption area B (the right side from the front), and the wash area C is It is disposed on the other side of the adsorption area B (the left side as viewed from the front). A processing region D is disposed at the center in the width direction of the rear half in the casing. For convenience of explanation, the front and rear directions are referred to as the X-axis direction, the width direction is referred to as the Y-axis direction, and the upper and lower directions are referred to as the Z-axis direction. It is preferable that the rinsing area C, the absorbing area B, and the wafer cassette mounting area A are substantially aligned in the Y-axis direction. The adsorption region B and the processing region D are substantially aligned in the X-axis direction, preferably as shown in FIG. 3, and the wafer cassette mounting region A is provided with the wafer cassette supporting means 3. 4. The body may be of a conventional type, and the wafer cassette supporting means 34 is provided with a lifting table 40. Two guide rails 4 2 extending substantially vertically are fixed, and a guide groove (not shown) is formed in the lift table 40, and the guide groove of the lift platform 40 is slidably engaged. The guide rails 4 2 are used to allow the lifting platform 40 to be mounted freely up and down along the guide rails 4 2 . Further, a male shaft 4 4 extending substantially vertically is rotatably mounted, and a female screw member (not shown) which can be screwed to the male shaft 44 is fixed to the lifting table 40. An electric motor (not shown) is connected to the male screw shaft 4 4, and the lift shaft 40 can be raised and lowered by positively rotating and reversing the male screw shaft 4 by an electric motor. On the elevating table 40 of the wafer cassette supporting means 34, a wafer cassette 48 in which a plurality of workpieces 46 are accommodated is placed. The workpiece 4 of the illustrated embodiment is shown in Fig. 2, and is mounted on the frame 5 of which the mounting opening 51 is formed in the center via the mounting belt 52. (CNS) A4 size (210X 297 mm) (Please read the note on the back ^^ write this page) - Installed and subscribed to the Ministry of Economic Affairs Intellectual Property Bureau employee consumption cooperative printing -20- 1272673 A7 B7 Ministry of Economic Affairs Intellectual Property Bureau Printed by the employee consumption cooperative. V. Description of invention (17) Conductor wafer 5 4. The mounting strip 52 is a mounting opening 5 1 extending from the frame 50 and attached to the back surface of the frame 50. The semiconductor wafer 54 located in the mounting opening 51 of the frame 50 is attached to the back surface. With 5 2 . On the surface of the semiconductor wafer 504, a cutting line arranged in a lattice shape, that is, a dicing line 56, is formed in each of the rectangular regions 58 surrounded by the dicing streets 56. The wafer cassette 48 has a pair of side wall portions 60, and the inner surface portion of the side wall portion 60 is formed with a plurality of storage grooves extending in the horizontal direction at predetermined intervals in the vertical direction. The workpieces 46 are inserted into the pair of receiving grooves of the pair of side wall portions 60 by the side edges of the frame 50, and are accommodated in a state of being substantially horizontally extended at a predetermined interval in the vertical direction. With. The left side surface is open from the front portion of the wafer cassette 48, that is, from the front portion of the casing. By the lifting and lowering of the lifting table 4, the pairs of the receiving grooves of the wafer cassette 48 are located at a predetermined height, and as will be described later, the workpiece to be cut 46 will be received from the receiving groove at a predetermined height. Each pair is conveyed and processed, that is, a cutting action, and then the workpiece 4 to be washed is conveyed into a pair of receiving grooves at a predetermined height. Continuing with reference to Fig. 3, a temporary support means 64 is disposed in the adsorption zone B. The temporary supporting means 64 includes a pair of supporting members 6 6 disposed in the X-axis direction with an interval therebetween. The pair of support members 66 are mounted so as to be movable in the X-axis direction, and are selectively placed at an inactive position indicated by a solid line in Fig. 1 and an action position indicated by a two-dotted broken line. As will be described later, when the pair of support members 66 are in the active position, the workpiece 46 conveyed from the wafer cassette 48 will span a pair of support members (please read the back note first) Writing

This paper scale applies to the Chinese National Standard (CNS) A4 specification (210X297 mm) 1272673 A7 B7 V. Invention description (18) 6 6 is placed (in other words, both sides of the frame 50 of the workpiece 46) When the pair of supporting members 6 6 ) are supported and the pair of supporting members 6 6 are moved to the inactive position and separated from each other, the workpiece 46 can be moved up and down by the pair of supporting members 6 6 . Between the adsorption region B and the dicing region D, an adsorption means is provided which is substantially horizontally movable in the X-axis direction. In detail, a stationary support base 70 that extends substantially horizontally is disposed. On the support base 70, a pair of support blocks 7 2 are fixed at intervals in the X-axis direction (only one of them is shown in Fig. 2). A pair of guide rails 7 extending in the X-axis direction at intervals in the Y-axis direction are fixed between the pair of support blocks 7 2 . A slide block 716 is attached to the pair of guide rails 7 4 . A pair of guided grooves extending in the X direction are formed at a lower portion of the sliding block 76, and a pair of guided grooves are engaged to a pair of guide rails. The guide rail 74 is mounted to be freely movable in the X-axis direction. A male threaded shaft 7 extending in the X-axis direction is also rotatably mounted between the pair of support blocks 7.2. On the other hand, a female screw member (not shown) is fixed to the lower surface of the slider 76, and the female screw member is screwed to the male screw shaft 78. The male screw shaft 78 is connected to an electric motor (not shown), and is moved in the X-axis direction along the guide rail 74 by the forward rotation of the electric motor and the reverse transfer sliding block 76. A cylindrical support member 8 is fixed to the slide block 76, and the adsorption member 8 is rotatably attached to the support member 80 about a central axis extending substantially vertically. 2° is provided in the support member 80. A rotary drive source (not shown) that can be an electric motor for rotating the adsorption member 82 is provided. The disc-shaped adsorption member 8 2 is made of the Chinese National Standard (CNS) A4 specification for porosity (210乂). 297 mm (please read the note on the back to write this page) - Packing · Ministry of Economic Affairs Intellectual Property Bureau employee consumption cooperative printing - 22- 1272673 A7 B7 V. Invention Description (19) Ceramic porous material. The suction member 8 2 is provided with a pair of holding mechanisms 8 4 projecting in the X-axis direction. Each of the holding mechanisms 8 4 includes a movable holding piece 8 6 and the movable holding piece 8 6 is actuated by, for example, an air pressure actuator. Means (not shown) are selectively placed in the non-holding position shown in Fig. 1 and the holding position in the inner side from the non-holding position. When the adsorption means 68 is located in the adsorption area B as shown in Fig. 1 , adsorption member 8 2 In the X-axis direction, it is located between the pair of support members 66 of the temporary support means 64, and is located below the pair of support members 66 of the temporary support means 64 in the Z-axis direction. 6 is a hollow protective pipe 8 8 which is appropriately deformed in a state indicated by a solid line in Fig. 1 and a state indicated by a two-dotted line in response to the movement of the sliding block 76. The formed adsorption member 82 is selectively connected to an appropriate suction source via a suction passage (not shown) disposed in the support member 80, the slide block 76, and the hollow protective conduit 8 (not shown) The circuit wiring for actuating the movable holding piece 86 of the gripping mechanism 84 is also extended in the supporting member 80, the sliding block 76, and the hollow duct 88. The washing area C is disposed. The rinsing means 90. The main body may be a rinsing means 90 of a conventional form, and includes a cylindrical partition portion 943 fixed to the stationary support plate 921 and rotatably disposed thereon. Adsorption mechanism 96 in the partition portion 94. Adsorption mechanism 9 6 It is a lifting table 9 that is moved up and down between a rising position and a falling position that is lowered by a predetermined amount from the rising position. The lifting table 98 is a piston that is connected to the air cylinder mechanism 100 that is substantially vertically disposed. With the air pressure red mechanism, the paper size applies to the Chinese National Standard (CNS) A4 specification (210X297 mm) (please read the note on the back to write this page) • Installed _ Customized Ministry of Economic Affairs Intellectual Property Bureau employee consumption cooperative printing - 23- 1272673 A7 B7 V. INSTRUCTIONS (2〇) The action of 1〇0 moves it up and down. At the upper end of the elevating table 98, a disk-shaped adsorbing member 102 that is rotatable about a central axis extending substantially vertically is disposed. The adsorption member 102 is formed of a porous material such as porous ceramic, and is selectively connected to an appropriate suction source via a suction passage (not shown) disposed in the elevation table 98 (not shown) Show). Four holding mechanisms 1 0 4 are also disposed around the adsorption member 102. Each of the holding mechanisms 104 includes a movable holding piece 1 〇6, and the movable holding piece 160 is selectively placed in the non-holding position shown in FIG. 1 by an operation means (not shown) such as a battery coil. And a holding position that swings from the non-holding position toward the inside. In the elevating table 98, an adsorption member 102 and an electric motor (not shown) for rotating the gripping mechanism 1 〇 4 attached thereto are disposed. The rinsing means 90 also contains a nozzle (not shown) for ejecting the rinsing liquid which can be pure water. As will be described later, when the rinsing is performed, the adsorption member 1 0 2 and the holding mechanism 1 0 4 holding the workpiece 46 are rotated at a high speed, and the rinsing liquid is ejected from the nozzle toward the adsorption member 102. The workpiece is 46. Referring to Fig. 3, the support base 70 will have an upright support substrate 1 〇 8 extending in the Y-axis direction. In the central portion of the support base plate 108, a large notch portion 1 1 0 for accommodating the adsorption member 8 2 is formed. A pair of cutting means, that is, a first cutting means 1 1 2 a and a second cutting means 1 1 2 b are attached to the support substrate 108. More specifically, a pair of guide rails 1 1 4 extending in the Y-axis direction at intervals in the vertical direction are disposed on the front surface of the support substrate 1 〇 8 . The first cutting means 1 1 2 a and the second cutting means 1 1 2 b 1 The paper scale applies to the Chinese national standard (€~8) eight 4 specifications (210 father 297 mm) — -24- (please read the back Precautions write this page} - Binding Ministry of Economic Affairs Intellectual Property Bureau Staff Consumer Cooperatives Printed 1272673 A7 B7 V. Invention Description (21) Contains sliding blocks 1 1 6 a and 1 1 6 b, respectively, in these sliding blocks 1 1 6 A rear portion of a and 1 1 6 b is formed with a pair of guided grooves (not shown) extending in the Y-axis direction, and the slide block a and the slide block b are slidably slid in the Y-axis direction. A pair of guide rails 1 1 4. A male threaded shaft 1 1 extending in the Y-axis direction is rotatably attached to the front surface of the support substrate 108 by interposing bearing members 1 2 0 a and 1 2〇b. 8 a and 1 1 8 b. The male threaded shafts 1 1 8 a and 1 1 8 b are arranged on a straight line. On the other hand, the female threaded members are fixed at the rear portions of the sliding blocks 1 1 6 a and 1 χ 6b. (not shown), and the female screw members are respectively screwed to the male thread shafts 1 1 8 a and 1 18b. The male thread shafts 1 1 8 a and 1 18b are connected to the electric motor 1 2 2 a and 1 2 2 b, when the male threaded shafts 1 1 8 a and 1 1 8 b are rotated by the electric motors 1 2 2 a and 1 2 2 b, the sliding blocks 1 1 6 a and 1 1 6 The Ministry of Economic Affairs, the Intellectual Property Bureau, the employee consumption cooperative, prints b, and moves along the pair of guide rails 1 1 4 in the Y-axis direction. The sliders 1 1 6 a and 1 16 6b are respectively mounted with the lift blocks 1 26 a and 1 26 b . Each of the front portions ' of the sliders 1 1 6 a and 1 1 6 b is provided with a pair of guide rails 1 2 4 a and 1 2 4 extending in the Y-axis direction at intervals and substantially perpendicular to the z-axis direction. b. The rear portion of the lifting blocks 1 2 6 a and 1 2 6 b is formed with a pair of guided grooves extending in the Z-axis direction by engaging the pair of guided grooves into a pair The guide rails 1 2 4 a and 124b are mounted on the slide blocks 1 1 6 a and 1 1 6 b so that the lift blocks 126a and 126b are freely movable in the Z-axis direction. In the slide blocks 1 1 6 a and 1 1 6 b It is also freely rotatably mounted with male threaded shafts 1 3 0 a and 1 3 0 b extending in the direction of 2 axes. On the other hand, 'in the -25- paper scale applies to the Chinese National Standard (CNS) A4 specification (210X297) PCT) 1272673 A7 B7 V. Description of invention (22 Please read the notes on the back. The rear part of the lifting block 1 2 6 a and 1 2 6 b is fixed with a female threaded member (not shown), and the female threaded member is screwed to the male threaded shaft 1 3 0 a and 1 respectively. 3 Ob. The male threaded shafts 1 3 0 a and 1 3 〇b are connected to the electric motors 132a and 132b' when the male screw shafts 1 3 0 a and 1 3 〇b are rotated by the electric motors 132a and 1 3 2b Blocks 1 2 6 a and 1 2 6b will move up and down along a pair of rails 1 24 a and 1 24 b. Printed by the Intellectual Property Office of the Ministry of Economic Affairs, the Consumer Cooperatives, in each of the lifting blocks 1 2 6 a and 1 2 6 b, the cutting units 1 36 a and 1 36 b are attached via the connecting brackets 1 34 a and 1 34 b. Each of the cutting units 1 1 2 a and 1 1 2 b is a box body 1 38 a and 1 38 b having a substantially rectangular parallelepiped shape. In the casings 1 38a and 1 38b, a rotating shaft extending toward the Y-axis is rotatably attached (only the rotating shaft 1 4 0 b attached to the casing 1 3 8 B is shown in Fig. 2). The rotating shaft extends linearly in the width direction. The cutting tool is fixed to the inner end in the width direction of the rotating shaft, that is, the end portion facing each other (only the cutting tool 1 4 2 b fixed to the rotating shaft 1 4 0 b is shown in Fig. 2). The cutting tool can be made up of a thin circular plate containing diamond particles. Electric motors 1 4 4 a and 144b are connected to the outer ends of the rotating shafts 1 4 0 a and 1 4 0 b. Imaging means 1 4 6 a and 1 4 6 b including a microscope are also attached to the casings 13 8 a and 13 8b. In the cutting machine constructed by the present invention, it is important to arrange the entire workpiece conveying means shown by the drawing No. 150. In Fig. 3, in order to avoid complication of the drawing, the workpiece conveying means 15 〇 is shown by a two-dot chain line. Referring to Figure 5, the paper size applies to the Chinese National Standard (CNS) A4 specification (210X 297 mm) -26- 1272673 Ministry of Economic Affairs Intellectual Property Office Staff Consumer Cooperative Printed A7 B7 V. Invention Description (23) The workpiece conveyance means 150 includes a common movable support structure 152, and the common movable support structure 152 includes a horizontal moving member 154 and a lifting and lowering member 156. More specifically, at a predetermined position in the casing 2 of the cutting machine, a pair of guide rails 157 extending substantially horizontally in the width direction are fixed via an appropriate support bracket (not shown). On the other hand, between the pair of guide rails 157, a male screw shaft 158 extending substantially in the width direction is rotatably attached via a suitable bearing member (not shown). The male threaded shaft 1 58 is an output shaft that is connected to an electric motor 160 that is fixed at a predetermined position. The horizontal moving member 154 is slidably attached to the pair of guide rails 157 in the width direction, that is, in the Y-axis direction. More specifically, the horizontal moving member 154 has a base portion 162, and the base portion 162 is formed with a substantially horizontally extending first reading of the back.

1 5 4 movable member 1 6 4 female thread 1 When the motor 1 is driven, when the horizontal electric motor rotates, a pair of guided grooves 1 6 1 6 4 of the horizontal moving mechanism 1 6 2 are engaged with the pair By moving the 157, the free movement is formed by the threaded shaft 1 shaft 1 5 8 Y-axis direction axis 1 5 The Y-axis connecting arm portion supporting portion 1 is guided by the groove flat moving member. In the horizontal direction, the guide groove 6, which is penetrated, moves the rotating end in the electric direction to move the side in the opposite direction. The water is connected to the base 7 4 and is mounted with a pair of flanges along a base of a support of a pair of 15 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 The member 1 5 is reversed and the member 14 is a portion 1 7 4 , and the above-mentioned male male thread 4 extending from the guide rail 15 7 16 2 will have the male screw 5 4 to be installed by a pair of water. In a pair of lines 1 6 5 8° toward one of the 8 directions toward the other paper scale applicable to the Chinese National Standard (CNS) A4 specification (210X297 mm) -27- 1272673 A7 B7 Ministry of Economic Affairs Intellectual Property Bureau employee consumption cooperative V. INSTRUCTION OF THE INVENTION (24) The air cylinder mechanism, the piston 176 of the pair of air cylinder mechanisms protrudes substantially vertically downward from the support portion 174 (only a pair of air pressures are illustrated in Fig. 5) The piston of the cylinder mechanism is 1 7 6 ). Further, at the lower end of the piston 176, the above-described lifting and lower moving member 156 is fixed. When the pair of air cylinders start to move and the piston 174 expands and contracts, the lifting and lowering member 156 is raised and lowered (i.e., moved in the Z-axis direction). The lifting and lowering moving member 156 is provided with a first holding means 178 and a second holding means 18 0. The first holding means 178 is a double which is attached to the front end of the lifting and lowering member 156. The movable member 1 8 2 of the strand shape portion. The movable member 182 of the first holding means 178 is attached via the mounting pin 184 to an action position shown by the solid line in Fig. 5, that is, from the front end of the lifting and lowering member 156. The inoperative position of the lower sag and the inactive position indicated by the two-dotted line in Fig. 5 are freely swirled between the inactive positions extending upward from the front end of the lifting and lowering member 156. The mounting pin 184 is disposed substantially horizontally, and the movable member 182 is freely rotatable about a center axis of the rotation that extends substantially horizontally. The mounting pin 184 is provided with an actuating means 186 which may be an air motor. The actuating means 186 allows the movable member 182 to be selectively positioned between the active position and the inactive position. A pair of holding pieces 1 8 8 are attached to the movable member 1 8 2 . At least one of the pair of holding pieces 188 is preferably both, and is moved to each other by an actuating means (not shown) formed by electromagnetic coils housed in the movable member 182. The direction of approaching and separating is free to be lifted and mounted (please read the back of the note first? % write this page) - Packing and binding k This paper scale applies to China National Standard (CNS) A4 specification (2丨〇 X297 mm) -28- 1272673 A7 ________ B7 V. Description of invention (25) (Please read the note on the back to write this page) The workpiece 4 shown in the dotted line at the bottom of Figure 5 is the semiconductor crystal. A single side edge of the frame 50 of the circle 5 4 . The pair of holding pieces 188 are sufficiently miniaturized, and as will be described in more detail later, when the workpiece 4 is held by the first holding means 178, the workpiece 46 is removed from the wafer cassette. 4 8 (Fig. 3) When transporting or feeding it into the wafer cassette 4 8 , a pair of holding sheets 1 8 8 can be inserted into the wafer cassette 48 to hold the workpiece 4 6 Or, it is entered into the wafer cassette 48 by holding the workpiece 46. Printed by the Intellectual Property Office of the Ministry of Economic Affairs, the Consumers' Cooperatives Co., Ltd. The second holding means 180 is a U-shaped support plate 190 that is fixed to the lower portion of the base of the lifting and lowering moving member 156. The four front end portions of the support plate 1 90 which are substantially horizontally extended are each equipped with an adsorber 192 which hangs downward. A suction manifold (not shown) is disposed in the base of the lifting and lowering moving member 156, and each adsorber 192 is connected to the suction manifold by a conduit 194, and the suction manifold 194 is It is selectively connected to a vacuum source (not shown) via conduit 196. The second holding means 180, as shown by the dotted line in Fig. 5, the adsorber 1 9 2 will adsorb the upper surface of the frame 50, and will hold the workpiece 46, that is, the frame 50. Semiconductor wafer 54. Referring to Fig. 3 again, in the illustrated cutting machine, an additional workpiece conveying means 196 is further provided. The front end portion of the casing 2 is provided with a pair of support plates 198 spaced apart in the width direction, and a guide bar 2 extending substantially horizontally in the width direction is fixed between the support plates 198 0 0, and the male screw shaft 2 0 2 extending substantially horizontally in the width direction is rotatably attached in the same manner. The male threaded shaft 2 0 2 is the standard for connecting the paper. The Chinese National Standard (CNS) Α4 specification (210Χ297 mm) -29 - 1272673 A7 B7 Ministry of Economic Affairs Intellectual Property Bureau employee consumption cooperative printing 5, invention description (26) There is an electric motor 2 0 4 . The additional workpiece conveying means 196 has a sliding block 205, and the sliding block 260 is formed with a guide hole for inserting the guide rod 200, and is used for screwing the above Female threaded hole of the male threaded shaft 2 0 2 . The slider block 206 is provided with an air cylinder mechanism having a piston 2 0 8 extending substantially vertically upward, and a slightly L-shaped arm portion 2 1 0 is fixed to the tip end of the piston 2 0 8 . A pair of support piece portions 2 1 2 are fixed to a lower portion of a portion extending in the front-rear direction of the arm portion 2 10 , and an adsorber 2 14 is attached to a lower surface portion of each of the support piece portions 2 1 2 . Each of the adsorbers 2 14 is selectively connected to a suction source (not shown) via an appropriate suction passage (not shown), so that the frame 50 of the workpiece 46 can be adsorbed. When the electric motor 220 is actuated, the sliding block 206 is moved toward the width direction, that is, the Y direction, so that the adsorber 2 14 moves in the Y-axis direction, and the piston of the air cylinder mechanism is 2 0 8 If it is telescopic, the adsorber 2 14 will move up and down in the vertical direction, that is, in the Z-axis direction. As will be described later, the additional workpiece conveying means 196 is used to transport the workpiece 46 on the adsorption member 8 2 of the adsorption means 68 to the adsorption member 102 of the rinsing means 90. The function of the above cutting machine will be briefly explained as follows. The lifting table 40 of the wafer cassette supporting means 34 is raised to a required height (or lowered), and a plurality of processed in the wafer cassette 48 loaded on the lifting table 40 are processed. A particular one of the objects 46 will be at a predetermined height. In this state, the workpiece conveyance means 150 is actuated, and the pair of holding pieces 1 8 8 of the first holding means 178 located at the action position indicated by the solid line in Fig. 5 enters the wafer cassette. Box 4 8 to hold the above specific one (please read the note on the back to write this page) - Install _, 11 line paper size applies to China National Standard (CNS) A4 specification (210X 297 mm) - 30- 1272673 A7 B7 V. INSTRUCTION OF THE INVENTION (27) The frame 50 of the workpiece 46 will transport the workpiece 46 from the wafer cassette mounting area A to the adsorption area B, and the adsorption area B will The workpiece 46 is located on the temporary support means 64. Then, the pair of holding pieces 1 8 8 of the first holding means 178 are detached from the workpiece 46, and the first holding means 178 is rotated back to the inactive position shown in Fig. 5. Then, the second holding means 180 of the workpiece conveying means 150 is positioned above the workpiece 46 located on the temporary supporting means 64, and then the lower holding means 1 80 is adsorbed. The device 192 is tightly joined to the frame 50 of the workpiece 46. The adsorber 192 is connected to the suction source, and the workpiece 46 is adsorbed to the adsorber 192. Then, the pair of support members 66 of the temporary supporting means 64 are moved to the non-use position indicated by the solid line, and are retracted from the lower side of the workpiece 46. Then, the second holding means 180 is lowered, and the workpiece 46 adsorbed on the adsorber 192 is positioned on the adsorbing member 8 2 of the adsorbing means 68. The adsorption member 82 is connected to the attraction source, whereby the semiconductor wafer 5 of the workpiece 46 is adsorbed on the adsorption member 82. On the other hand, the movable holding piece 86 of the pair of holding mechanisms 8 4 attached to the adsorption member 8 2 is placed at the holding position to hold the frame 50. The adsorber 1 9 2 of the second holding means 180 is lifted from the suction source to cause the workpiece 46 to be detached. Next, the adsorption means 68 moves rearward across the required distance, and the microscopes attached to the first cutting means 1 1 2 a and the second cutting means 1 1 2 b are microscopes 1 4 6 a and 1 4 6 b The image of the surface of the semiconductor wafer 54 is taken at a position facing the surface of the semiconductor wafer 54 on the adsorption member 82, whereby the paper size on the adsorption member 8 2 is applied to the Chinese national standard ( CNS ) A4 size (210X 297 mm) Please read the back-to-back matters first.

Ministry of Economic Affairs, Intellectual Property Office, Staff and Consumer Cooperatives, Printing - 31 - 1272673 A7 B7 V. INSTRUCTIONS (28) The semiconductor wafer 5 4 is cut relative to the first cutting means 1 1 2 a (not shown) and the second cutting The cutting tool 1 4 2 b of the means 1 1 2 b performs a sufficiently precise position proofing. In the proofreading position, the suction member 82 moves in the X-axis direction as needed, and rotates around the center axis. Then, the adsorption means 68 is moved further rearward to be located in the cutting region D, so that the cutting of the semiconductor wafer 5 4 adsorbed on the adsorption member 8 2 is cut. When the cutting is performed, the adsorption member 82 moves in the X-axis direction, and the cutting tool of the first cutting means 1 1 2 a and the cutting tool 1 4 2 b of the second cutting means 1 1 2 b are simultaneously or accompanied by a slight The time difference acts on the semiconductor wafer 54 to cut along the scribe line 56 extending in the X-axis direction. The cutting unit 1 3 6 a of the first cutting means 1 1 2 a and the cutting unit 1 3 6 b of the second cutting means 1 1 2 b are positioned at a desired height and periodically move in the Y-axis direction. When the cutting operation is performed along the cutting path 56 extending in the X-axis direction, the adsorption member 82 is rotated by 90 degrees, and the cutting is started again starting along the cutting path 56 in the state along the Y-axis. Thus, the semiconductor wafers 54 on the adsorbing member 8 2 are cut along the dicing streets 56 arranged in a lattice shape. The mounting strip 52 existing between the frame 50 and the semiconductor wafer 54 is not cut, and after the semiconductor wafer 54 is cut, the frame 50, the mounting strip 52, and the semiconductor crystal that has been diced are cut. The circle 54 will be maintained as one. Next, the adsorption means 68 will return to the adsorption zone B. The adsorber 2 1 4 of the additional workpiece conveying means 196 is positioned above the workpiece 46 held on the adsorbing member 8 2 and then lowered to apply the Chinese national standard (CNS) to the paper scale. A4 size (210X297 mm) (Please read the note on the back to write this page) --$ , ^^: Write too, τ Ministry of Economic Affairs Intellectual Property Bureau employee consumption cooperative print 32- 1272673 A7 B7 Ministry of Economics intellectual property Bureau employee consumption cooperative printing 5, invention description (29) The frame 50 of the workpiece 46 is tightly joined. The adsorber 2 14 will be connected to the attraction source and the workpiece 46 will be adsorbed to the adsorber 2 14 , and the adsorption member 8 2 will be separated from the attraction source to release the semiconductor wafer to the adsorption member 8 2 . 5 4 adsorption. On the other hand, the movable holding piece 86 of the pair of holding mechanisms 8 4 attached to the adsorption member 8 2 returns to the non-holding position, and the holding of the frame 50 is released. Then, the adsorber 2 1 4 to which the workpiece conveyance means 1 6 is attached is slightly raised, and then moved in the Y-axis direction to move the workpiece 46 to the rinsing area C. Then, the adsorber 2 14 of the additional workpiece conveying means 196 is lowered, and the workpiece 46 adsorbed to the adsorber 2 14 is placed on the adsorption member 10 of the rinsing means 90. on. The adsorption member 102 is connected to the suction source to allow the workpiece 46 to be adsorbed onto the adsorption member 1 〇 2, and the adsorber 2 1 4 to which the workpiece conveyance means 196 is attached is cut away from the suction source. The workpiece will be detached from the adsorber 2 1 4 . On the other hand, in the rinsing region C, the adsorption member 110 that adsorbs the workpiece 46 is connected to the suction source, and the semiconductor wafer 54 is adsorbed on the adsorption member 102. On the other hand, the movable holding piece 160 of the holding mechanism 1 0 4 attached to the suction member 102 holds the frame 50 at the holding position. Next, the elevating table 98 is lowered, and the adsorbing member 102 which is attached to the workpiece 46 is lowered to a desired position. The rinsing liquid which can be pure water is ejected from the nozzle (not shown) to the workpiece 46, and the adsorption member is rotated at a speed of about 60 rpm, p.m. The workpiece of the generated chips is 46. Then, the jetting of the rinsing liquid from the nozzle is stopped, and the absorbing member is rotated at a speed of about 30,000 r·p.m to force the port (please read the precautions on the back and ^-- , write this page), the paper size applies to the Chinese National Standard (CNS) A4 specifications (210X 297 mm) -33- 1272673 Α7 Β7 5, invention description (30) Rotary drying of objects. Please read the back of the note first and then fill in this page. When the washing operation is completed, the lifting table 98 will rise and the adsorption member 1 ◦ 2 will rise. Then, the adsorption member 1 〇 2 is separated from the suction source to release the adsorption of the semiconductor wafer 54, and the movable holding piece 160 of the holding mechanism 1 〇 4 returns to the non-holding position to release the holding of the frame 50. Next, the second holding means 180 of the workpiece transport means 150 is positioned above the workpiece 46 on the adsorbing member 1 〇 2, and the adsorber 192 is tightly joined to the frame 50. The adsorber 192 of the second holding means 180 is connected to the suction source to allow the workpiece to be adsorbed on the adsorber 2 14 . Next, the adsorber 192 of the second holding means 180 is raised to the required height and moved to the adsorption zone B in the Y-axis direction. Then, the second holding means 180 is slightly lowered, and the workpiece 46 is carried over a pair of supporting members 6 6 of the temporary supporting means 6 4 located at the acting position indicated by the two-dotted line in Fig. 3 Set. Then, the adsorber 192 is detached from the suction source, and the workpiece 46 is detached from the adsorber 192. The Ministry of Economic Affairs, the Intellectual Property Office, and the Employees' Cooperatives Co., Ltd. print the first holding means of the workpiece conveying means 150 when the workpieces 46 which have been cut and washed as described above are placed on the temporary supporting means 64. The movable member 1 8 2 of 1 7 8 will be rotated to the acting position shown by the solid line in Fig. 5, and a pair of holding pieces 1 8 8 equipped with the movable member 1 8 2 will be positioned with respect to the workpiece 46. The position required is to hold the position of the left edge of the width direction of the frame 50. Then, the pair of holding pieces 1 8 8 of the first holding means 178 are actuated to hold the frame 50 of the workpiece 46 on the temporary supporting means 64. Next, make the paper scale applicable to China National Standard (CNS) Α4 specification (210Χ: 297 mm) -34- 1272673 A7 B7 Ministry of Economic Affairs Intellectual Property Bureau employee consumption cooperative printing 5, invention description (31) processed material conveying means The 150 moves toward the wafer cassette mounting area A, whereby the workpiece 46 is inserted into the wafer cassette 48. Then, the pair of holding pieces 1 8 8 of the first holding means 178 are separated from the workpiece 46, and the workpiece conveying means 150 returns to the predetermined standby position. During the rinsing of the previous workpiece 46 in the rinsing area C, the workpiece 46 to be cut, which is to be cut in the wafer cassette 48, is transported from the wafer cassette 46. To the temporary support means 64, and then adsorbed onto the adsorption member 8 2 of the adsorption means 68, and after transporting it to the cutting area D after performing the required position proofing, the first cutting means 1 1 2 a can be used. And the second cutting means 1 1 2 b to start cutting. It can be correctly understood by referring to Figs. 1 and 3 that when the one-side door portion 4 is located at the closed position shown by the solid line in Fig. 1, the front half of the casing 2 is disposed in the width direction. The side scrubbing area C is covered by the one-sided door portion 4. Further, when the one-side door portion 4 is located at the closed position, when the central door portion 6 attached to the one-side door portion 4 is also located at the closed position shown by the solid line in Fig. 1, the front half of the casing 2 is disposed at the width. The suction region B at the center of the direction (and the rear side of the adsorption region B, that is, the cutting region D disposed at the center portion in the width direction of the rear half of the casing 2) is covered by the center door portion 6. Further, when the other side door portion 8 is at the closed position shown by the solid line in Fig. 1, the wafer cassette mounting area A is covered by the other side door portion 8. When the wafer cassette 48 is placed on the wafer cassette supporting means 34 disposed in the wafer cassette mounting area A, and the wafer cassette 48 is loaded from the wafer cassette supporting means 3 4 When taking it out, or holding the handle 2 0 will be the other (please read the back of the note before filling this page) 1

, τ This paper scale applies to China National Standard (CNS) A4 specification (210X 297 mm) -35 - 1272673 A/ B7 _ V. Invention description (32) Please read the back note first side door 8 towards the first picture The open position shown by the two-dotted line is rotated. This will open the front portion of the wafer cassette mounting area A, and the wafer cassette 48 can be easily placed on the wafer cassette supporting means 34 or the wafer cassette 48 can be removed from the wafer. The E-box support means 34 is taken out. The Ministry of Economic Affairs, the Intellectual Property Office, the employee consumption cooperative, prints the first cutting means 1 1 2 a when the semiconductor wafer 54 is repeatedly cut by the first cutting means 1 1 2 a and the second cutting means 1 1 2 b. The cutting tool and the second cutting means 1 1 2 b of the cutting tool 1 4 2 b are worn out and need to be exchanged. At this time, the handle 16 is held, and the central door portion 6 is moved toward the open position indicated by the two dotted lines in Fig. 1 . Further, if necessary, the one-side door portion 4 to which the center door portion 6 is attached is moved to the opening position indicated by the two-dotted line at the two points in Fig. 1 together with the center door portion 6, and is in the state shown in Fig. 2 . At this time, the handle 16 holding the central door portion 6 is moved to the opening direction of the one-side door portion _4 together with the central door portion 6. In the state shown in Fig. 2, the adsorption region B at the center portion in the width direction of the front half of the casing 2 and the cutting region D located at the rear thereof are opened in the front, and the rinsing region C is also in front. open. Thus, the operator can enter the upper body from the front portion of the casing 2 into the casing 2, and can easily access the cutting tool located in the cutting region D, and the cutting operation of the cutting tool can be performed quickly and easily. When the work is required, when the cutting machine needs to be operated or the operating state of the cutting machine is to be visually observed, the support member 10 disposed on the one-side door portion 4 is held toward the first and second figures. The extended position indicated by the dotted line is swirled. In this way, even if the operator enters the upper body into the casing 2, it is possible to touch the required portion of the touch panel 1 2 disposed on the supporting means 10 to apply the paper size to China. National Standard (CNS) A4 Specification (210X 297 mm) -36- 1272673 A7 ____B7 V. INSTRUCTIONS (33) The cutting machine must be operated or identified by visually touching the desired part of the touch panel 1 2 The cutting machine must be in an active state. Although the present invention is not limited to the embodiment, the present invention is not limited to the embodiment, and various modifications and changes can be made without departing from the scope of the invention. For example, in the embodiment shown in the drawing, the wafer cassette mounting area A is disposed on the right side of the adsorption area B from the front side, and the cleaning area C is disposed on the left side of the adsorption area B, Alternatively, the wafer cassette placement area A may be disposed on the left side of the adsorption area B and the rinse area C may be disposed on the right side as needed. In this case, it is preferable to arrange the arrangement of the one-side door portion 4, the center door portion 6, and the other side door portions 8 in a line symmetrical with the case shown. Printed by the Intellectual Property Office of the Ministry of Economic Affairs, the Consumer Cooperatives. This paper scale applies the Chinese National Standard (CNS) A4 specification (210 >< 297 mm)

Claims (1)

1272673 Α8 Β8 C8 D8 VI. Patent Application 1 1 · A cutting machine characterized by: (Please read the note on the back and fill in the page first) The front half of the housing is equipped with: located in the center of the width direction The adsorption region, the rinsing region located on one side of the adsorption region, and the wafer cassette mounting region on the other side of the adsorption region are disposed at the central portion in the width direction in the rear half of the housing The cutting region includes: a rinsing means disposed in the rinsing area, and a wafer cassette supporting means disposed in the wafer cassette mounting area, and is movably disposed in the housing in the front-rear direction The central portion in the width direction is selectively provided with the adsorption means located in the adsorption region and the cutting region, and the second half disposed in the casing, and has cutting means for the cutting tool located in the cutting region, and the intellectual property of the Ministry of Economy In the wafer cassette support means, the wafer employee support means mounts a wafer cassette containing a plurality of workpieces and is housed in the wafer cassette. The workpiece is sequentially transported to the adsorption zone, and is adsorbed to the adsorption means in the adsorption zone, and is transferred to the cutting zone together with the adsorption means, and the cutting zone is used in the cutting zone Cutting tool for cutting, and then returning to the adsorption zone together with the cutting means, being transported from the adsorption zone to the scrubbing zone to be scrubbed, and then being transported back to the wafer cassette, in the casing The front portion is configured to be mounted to: a closed position covering the front portion of the rinsing region and a position at which the front portion of the rinsing region is opened by changing the position from the closed position to the one-side direction of the housing The single-sided door portion that is freely movable between the one-side door portion and the one-side door portion can be used to: when the one-side door portion is in the closed position, the closed position covering the front portion of the adsorption region and the position from the closed position to the one-side direction at least Most of the meeting places are applicable to the Chinese National Standard (CNS) A4 specification (210X297 public 38 - " 1272673 A8 B8 C8 D8 VI. Patent application scope 2 (please read the back first) Precautions. Fill in this page again. The central door portion that moves freely between the open position of the front side of the single-sided door portion and the front portion of the suction area, and is installed to cover the wafer cassette area. The other side door portion that is freely movable between the closed position of the front portion and the open position of the front portion of the open wafer cassette area. 2 The cutting machine of claim 1, wherein the other side door portion is substantially Centering on the center of the center of the rotation of the other side of the housing, is free to swing between the closed position and the open position. 3. The cutting machine of claim 1, wherein the central portion When the door portion is moved to the open position, at least a majority of the central door portion is located behind the one-sided door portion, and at a front portion of the one-side door portion is mounted to be substantially perpendicular to the one-sided door portion The center of the center of the swivel extending in the width direction is centered on the normal position extending along the front portion of the one-sided door portion and the extension extending forward from the one-side door portion Freely revolving supporting member between positions in which the support member is attached to the operation panel. Printed by the Intellectual Property Office of the Ministry of Economic Affairs, Employees' Consumer Cooperatives. 4. A cutting machine as claimed in claim 2, wherein at least a majority of the central door is located in the single door when the central door is moved to the open position. The rear side of the side door portion is attached to the front side portion of the one-side door portion so as to be centered on a center of the center of rotation of the one-side door portion in the width direction, and is adjacent to the one-side door portion A support member that is rotatable between a normal position in which the front portion extends and an extended position that extends forward from the one-side door portion, and an operation panel is attached to the support member. -39 - This paper size is applicable to China National Standard (CNS) A4 specification (210x297 mm) 1272673 A8 B8 C8 D8 VI. Patent application scope 3 5 · For the cutting machine of patent application No. 3, the operation panel is composed of The touch panel is constructed. (Please read the note on the back and fill out this page.) 6. The cutting machine of the fourth paragraph of the patent application, wherein the operation panel is composed of a touch panel. 7. The cutting machine of claim 1, 2, 3, 4, 5 or 6 wherein the cutting means comprises a first cutting means and a second cutting means, the first cutting means having: a first rotation a shaft and a first cutting tool mounted on the first rotating shaft, the second cutting means having: a second rotating shaft and a second cutting tool mounted on the second rotating shaft, the first rotating shaft and the first cutting shaft a second rotating shaft extending in a width direction in a rear half of the housing, the first cutting tool and the second cutting tool being respectively mounted at an inner side in a width direction of the first rotating shaft and the second The inner side ends of the rotating shaft in the width direction are located at positions facing each other. Printed by the Intellectual Property Office of the Ministry of Economic Affairs, the Consumers' Cooperatives. 8 · For the cutting machine of the patent scope 1, 2, 3, 4, 5 or 6, wherein the adsorption zone is equipped with temporary support means from the wafer. The workpiece conveyed to the adsorption zone is initially placed on the temporary support means, then transported from the temporary support means to the adsorption means, and then cut and washed. The workpiece is transported from the scrubbing area to the adsorption zone, and is placed on the temporary support means before being transported into the wafer cassette. 9. The cutting machine according to claim 8, wherein the temporary supporting means is constituted by a pair of supporting members, and the pair of supporting members are disposed between the two at predetermined intervals The position of the workpiece and the direction of separation from the action position are allowed to allow the -40- paper scale to be applied to the Chinese National Standard (CNS) A4 specification (210X297 mm) 1272673 A8 B8 C8 D8 申请, the scope of patent application 4 (Please read the precautions on the back and fill out this page.) The workpiece is freely moved between the inactive positions that fall between the two. When the adsorption means is located in the adsorption zone, the adsorption means is located in the temporary support. Below the means. 1 0 · For a cutting machine according to the patent scope 1, 2, 3, 4 ' 5 or 6 , wherein the workpiece is a semiconductor wafer, the cutting tool is in the shape of a disk and contains diamond particles to cut the semiconductor wafer . 1 1 . A cutting machine comprising: a wafer cassette supporting means disposed in a wafer cassette mounting area; a temporary supporting means disposed in the adsorption area; and a cutting means disposed in the cutting area, and selective a movable adsorption means for the 1H adsorption region and the cutting region, and a workpiece transporting means; the wafer cassette supporting means is provided with a wafer cassette containing the workpiece, the The workpiece transport means transports the workpiece from the wafer cassette loaded on the wafer cassette support means and transports it to the temporary support means, and the picker takes it from the temporary support means Delivered to the adsorption means located in the adsorption zone, and after being cut, the workpiece placed on the temporary support means is transported into the wafer cassette placed on the wafer cassette support means. The cutting machine is characterized in that: ^ The Ministry of Economic Affairs, the Intellectual Property Office, the employee consumption cooperative, which prints the processed object conveying means, includes: a common movable supporting structure, and is disposed in the common movable supporting structure and a first holding means that is inserted into the wafer cassette and that can hold the workpiece in the wafer cassette freely and openly, and is disposed in the common movable support structure and is rotatably held and supported by the a second holding means for the workpiece on the temporary supporting means, when the workpiece is conveyed from the wafer cassette placed on the wafer cassette supporting means, and conveyed to the temporary supporting means, and When the paper size is applicable to the Chinese National Standard (CNS) A4 specification (210X297 mm) -41 - 1272673 A8 B8 C8 D8 VI. Patent scope 5 After the cutting is completed, the workpiece placed on the temporary support means is conveyed. When placed in the wafer cassette on the wafer cassette supporting means, the first holding means holds the workpiece, and when the workpiece is transported from the temporary supporting means to the adsorption area When the adsorption means is applied, the second holding means holds the workpiece. The cutting machine of claim 11, wherein the workpiece is a semiconductor wafer mounted on the mounting opening of the frame having the opening in the center via a mounting tape, and is in the wafer cassette A plurality of workpieces are accommodated in the vertical direction at intervals. The cutting machine of claim 12, wherein the common movable supporting structure includes: a mounting direction parallel to a separation direction from the wafer cassette mounting area and the adsorption area, and substantially a horizontal moving member movable freely back and forth in a horizontal direction, and an elevating moving member mounted to be freely movable up and down in a direction substantially perpendicular to the horizontal moving means; the first holding means and the second holding means are matched It is provided in the lifting and lowering moving member. The cutting machine of claim 13, wherein the first holding means of the workpiece conveying means, wherein the upper and lower directions are protruded at intervals and at least one of them is opposite to the other Freely approaching and separating the moving pair of holding pieces, the pair of holding pieces holding the one side edge of the frame, and the second holding means of the workpiece conveying means is for vacuum adsorbing the upper surface of the frame It consists of a plurality of adsorbers in the department. 1 5. For the cutting machine of patent application No. 14, the Chinese National Standard (CNS) A4 specification (210X297 mm) is applied to the paper scale _ 42 - (Please read the note on the back and fill in this page) ) Ministry of Economic Affairs, Intellectual Property Bureau, employee consumption cooperative, printing, τ 1272673 A8 B8 C8 D8 VI. Patent Application No. 6 (Please read the note on the back side and fill out this page.) The lifting and moving member of the common movable support structure is mounted with a position that can be selectively suspended downward. The movable member having an inactive position extending upward, the pair of holding pieces are disposed on the movable member, and when the movable member is at the acting position, the pair of holding pieces protrude outward from the movable member. The cutting machine according to the fifteenth aspect of the invention, wherein the base end portion of the movable member is rotatably attached to the elevating member centering on a central axis of rotation substantially extending horizontally. 17. The cutting machine of claim 1, wherein the temporary support means comprises a pair of support members, the pair of support members being selectively Locating: a position at which the frame spanning between the two is placed, and an inactive position at which the frame can be moved up and down. If the adsorption means is located in the adsorption area, the adsorption means is located at the temporary support means. Below the pair of support members. 1 8 ·If the scope of application for patents is 1st, 1 2, 1 3, 1 4, the Ministry of Economic Affairs, the Intellectual Property Office, the employee consumption cooperative prints 1 5 or 16 cutting machines, which are equipped with: a rinsing means for the region, and an additional workpiece transporting means for transporting the cut workpiece from the absorbing means from the absorbing means to the rinsing means, The workpiece conveying means is also used to convey the workpiece from the crucible means to the temporary supporting means, and when the workpiece is conveyed from the purging means to the temporary supporting means, the second holding means Will keep the workpiece. 1 9 · For the cutting machine of the patent application scope item 11, which is provided with: a washing means disposed in the washing area, and only for the purpose of placing the paper size in the Chinese National Standard (CNS) A4 Specification (210X297 mm) 1272673 A8 B8 C8 D8 VI. Patent Application No. 7 The object to be processed on the adsorption means in the adsorption zone is transported from the adsorption means to the additional workpiece used in the rinsing means. a conveying means for conveying the workpiece from the rinsing means to the temporary supporting means, and when the workpiece is conveyed from the rinsing means to the temporary supporting means, The second holding means will hold the workpiece. (Please read the notes on the back and fill out this page.) Printed by the Ministry of Economic Affairs, Intellectual Property Office, Staff and Consumer Cooperatives. This paper scale applies to the Chinese National Standard (CNS) A4 specification (210X297 mm) -44 _