Ϊ265532 九、發明說明： 【發明所屬之技術領域】 本發明關於一種被動元件之製造方法；詳言之，本發明 係關於一種利用精密金屬鋼板以製造被動元件之方法。 【先前技術】 參考圖1 a及lb，分別顯示習用印刷製程中所使用之網版 之局部俯視圖及剖視圖。在被動元件之製程中，通常皆需 • 要至少一印刷製程，習用之印刷製程所使用之工具係為一 網版10(稱為網版印刷），其係為一由複數個線狀體丨丨彼此垂 直交錯而成之網狀結構。 參考圖2a及2b，分別顯示利用圖！之習用網版1〇所列印出 之印刷層之俯視圖及剖視圖。由於該網版丨〇本身之結構， 其所列印出之印刷層12之邊緣13不是平直狀而會形成波浪 狀或郵票狀，如圖2a所示。此外，由圖2b之剖視圖可看出， 該印刷層不是方正之結構而是一錐形結構，這是因為在印 • W過程中，印刷材料容易被擠至該網版1〇下緣與所欲印刷 之基板間之間隙，也就是所謂之擴散效應。 參考圖3a及3b，分別顯示習用印刷製程中使用之鋼板之 局部俯視圖及剖視圖。為了改善習用網版1〇之缺點，於是 便有鋼板14之產生（稱為鋼板印刷）。該鋼板14係為一版狀結 構’其包括複數個排列有序之開孔15。 參考圖4a及4b，分別顯示利用圖3之習用鋼板^所列印出 之印刷層之俯視及剖視之放大示意圖。該印刷層16之面積 與外形係大致與該開孔15相同，由於該鋼板14本身之結構 98530.doc -1265532 剛性’其所列印出之印刷層16之邊緣17會比圖仏之印刷層 12之邊緣13較接近平直狀，如圖乜所示。然而，由圖扑之 剖視圖可看出，該印刷層〗6仍然不是方正之結構而是一錐 幵y、、^構這疋因為在印刷過程中，印刷材料容易被擠至該 鋼板14與所欲印刷之基板間之間隙，因而還是不可避免地 產生該擴散效應而形成該錐形結構。 參考圖5及圖6，分別顯示習用網版印刷所製成之晶片電 阻器之立體及俯視示意圖。該晶片電阻器2〇包括一基板 21、二上電極22、23及一電阻本體24。由圖中可看出，由 於τ»亥電阻本體24係以網版印刷之方式列印至該基板21上， 因此該電阻本體24之側邊係為波浪狀，使得其長度L及寬度 W會有變異之產生，進而造成不同電阻器顆粒彼此之電阻 值的變異很大。其原因如下，依電阻值R之公式： R=p L/A=p L/(Wt) 其中，P係電阻率，L係該電阻本體24之有效長度，貿係 該電阻本體24之寬度，t係該電阻本體24之厚度。 虽4有效長度L及該寬度W之變異大時，則電阻值尺的變 異亦Ik之變大。如此會造成後續之鐳射切割調值製程之成 本增高。 此外’由於上述之擴散效應，會使得產品良率無法提升。 當該電阻器20之尺寸微小化（例如：微小至〇2〇1之尺寸）時 產品良率會隨之降低，甚至會做不出該產品。 參考圖7，顯示習用網版印刷所製成之積層陶竟電容器 立體示意圖。該積層陶瓷電容器30包括一陶咨接旺_ ° n見積層體31及 98530.doc 1265532 ^端電極32，纟中該陶竟積層體31包括複數個介電層33及 複數個内電極3 4，該等介電層3 3係由陶究生片於燒結後所 、5荨内電極3 4係利用網版印刷而列印至該陶究生片 上。由圖中可看出，由於該等内電極34係利用網版印刷而 成〃卜形係為波浪狀，因此不同層之介電層3 3之電容值 曰有交異存在，而當該複數介電層33疊層形成該陶竟積層 體3 1後β亥艾異會累加，進而造成不同電容器顆粒彼此之 電容值的變異隨之變大，加上上述之擴散效應，如此會造 成產品之良率無法提高。 參考圖8，顯示習用網版印刷所製成之積層陶瓷電感器之 電路圖型之不意圖。該積層陶竟電感器（圖中未示）包括複數 個隹且之；丨電層，§亥等介電層上具有利用網版印刷而列印 之電路圖型40。由圖中可看出，由於該電路圖型4〇係利用 、、’罔版Ρ刷而成’其外形係為波浪狀，因此其可用範圍4工會Ϊ265532 IX. Description of the Invention: [Technical Field] The present invention relates to a method of manufacturing a passive component; more particularly, the present invention relates to a method of manufacturing a passive component using a precision metal steel plate. [Prior Art] Referring to Figures 1a and 1b, a partial plan view and a cross-sectional view of a screen used in a conventional printing process are respectively shown. In the process of passive components, it is usually necessary to have at least one printing process. The tool used in the conventional printing process is a screen 10 (called screen printing), which is composed of a plurality of linear bodies.网 A network structure that is vertically interlaced with each other. Referring to Figures 2a and 2b, the utilization maps are shown separately! A top view and a cross-sectional view of the printed layer printed on the screen of the conventional screen. Due to the structure of the screen itself, the edges 13 of the printed layer 12 printed thereon are not straight and form a wavy or stamp shape, as shown in Figure 2a. In addition, as can be seen from the cross-sectional view of FIG. 2b, the printed layer is not a square structure but a tapered structure, because in the process of printing, the printed material is easily squeezed to the lower edge of the screen. The gap between the substrates to be printed is also called the diffusion effect. Referring to Figures 3a and 3b, there are shown a partial plan view and a cross-sectional view, respectively, of a steel sheet used in a conventional printing process. In order to improve the shortcomings of the conventional screen, there is a steel sheet 14 (referred to as steel sheet printing). The steel sheet 14 is a plate-like structure which includes a plurality of aligned openings 15. Referring to Figures 4a and 4b, there are shown enlarged views of a plan view and a cross-sectional view of a printed layer printed by the conventional steel sheet of Figure 3, respectively. The area and shape of the printed layer 16 is substantially the same as that of the opening 15, since the structure of the steel plate 14 itself is 98530.doc -1265532 rigidly, the edge 17 of the printed layer 16 printed thereon will be compared to the printed layer of the drawing. The edge 13 of 12 is relatively flat, as shown in FIG. However, as can be seen from the cross-sectional view of the figure, the printed layer 6 is still not a square structure but a cone y, y, because the printing material is easily squeezed to the steel plate 14 and the printing process. The gap between the substrates to be printed, and thus the diffusion effect, is inevitably generated to form the tapered structure. Referring to Figures 5 and 6, a schematic perspective view and a plan view of a wafer resistor made by conventional screen printing are shown. The chip resistor 2 includes a substrate 21, two upper electrodes 22, 23, and a resistor body 24. As can be seen from the figure, since the τ»hai resistor body 24 is printed on the substrate 21 by screen printing, the side of the resistor body 24 is wavy, so that the length L and the width W thereof There is a variation, which in turn causes a large variation in the resistance values of the different resistor particles. The reason is as follows, according to the formula of the resistance value R: R = p L / A = p L / (Wt) where P is the resistivity, L is the effective length of the resistor body 24, and the width of the resistor body 24 is t is the thickness of the resistor body 24. When the variation of the effective length L and the width W is large, the variation of the resistance scale is also large. This will increase the cost of the subsequent laser cutting process. In addition, due to the above-mentioned diffusion effect, the product yield cannot be improved. When the size of the resistor 20 is miniaturized (for example, the size is as small as 〇2〇1), the yield of the product is lowered, and the product cannot even be produced. Referring to Fig. 7, there is shown a perspective view of a laminated ceramic capacitor fabricated by conventional screen printing. The multilayer ceramic capacitor 30 includes a ceramic layer 31 and a 98530.doc 1265532 ^ terminal electrode 32. The ceramic layer 31 includes a plurality of dielectric layers 33 and a plurality of internal electrodes 34. The dielectric layer 3 3 is printed on the ceramic tile by screen printing after the ceramic film is sintered and the 5 荨 internal electrode 34 is screen printed. As can be seen from the figure, since the internal electrodes 34 are printed by screen printing and the wavy shape is wavy, the capacitance values of the dielectric layers 33 of different layers are different, and when the plural After the dielectric layer 33 is laminated to form the ceramic layer 3 1 , the β hai yi will be accumulated, which causes the variation of the capacitance values of the different capacitor particles to become larger, and the above diffusion effect, which causes the product to be The yield cannot be improved. Referring to Fig. 8, there is shown a schematic diagram of a circuit pattern of a laminated ceramic inductor manufactured by conventional screen printing. The laminated ceramic inductor (not shown) includes a plurality of layers; the electrical layer, the dielectric layer such as §Hai has a circuit pattern 40 printed by screen printing. As can be seen from the figure, since the circuit pattern is made of , and the '罔 Ρ 而成 ' is shaped like a wave, its usable range 4 union
是j此外，虽忒積層陶瓷電感器微小化時，該電路圖型 40之二延伸端42、43可能會有相接觸之情況發生，而造成 產品失敗。再加上上述之擴散效應’產品之良率將無法提 高0 因此，有必要提供一種創新且具進步性的被動元件之製 造方法，以解決上述問題。 【發明内容】 本發明之主要目的在於將一金屬鋼板應用於被動元件之 印刷製程，讜金屬鋼板至少包括一上金屬層及一下金屬 層，該上金屬層具有複數個上開孔，該下金屬層具有複數 98530.doc 126.5532 . 個下開 母一下開孔之開孔面積係大於每一上開孔之 孔面積，曰益 ^ 、且母—下開孔之上方係設置有至少二個上開孔。 吞亥等-ρ戸气 、汗1^之形狀係對應所欲印刷之圖樣，該等上開孔係 作為印刷材料進入該等下開孔之通道。藉此，所列印出之 Ρ刷層之邊緣較為平直，且該印刷層可以形成一方正之結 構，因此當該被動元件微小化時，仍能維持高印刷精度及 高產品良率。 【實施方式】 參考圖9及圖10，分別顯示本發明印刷製程中所使用之金 屬鋼板之俯視及剖視示意圖。本發明係關於一種被動元件 (例，·晶片電阻器、積層陶瓷電容器、積層陶瓷電感器等) 7製造方法’其包括一印刷製程，且其特徵在於，該印刷 製程係使用一金屬鋼板5〇，該金屬鋼板5〇包括：一上金屬 層51及一下金屬層52，其中該上金屬層51及該下金屬層52 之材質可以相同或是不同。該上金屬層51具有複數個上開 孔5U，該下金屬層52係於該上金屬層51之下，該下金屬層 52具有複數個下開孔521，每一下開孔521之開孔面積係大 於每一上開孔5 11之開孔面積，且每一下開孔52丨之上方係 設置有至少二個上開孔511。該等下開孔521之形狀係對應 所欲印刷之圖樣，該等上開孔5丨丨係作為印刷材料進入該等 下開孔521之通道。亦即，該印刷材料係被注入該等上開孔 5 11後經由該等上開孔5丨丨進入該等下開孔52丨以形成所需 之圖樣。 參考圖11，顯示本發明中利用圖10之金屬鋼板50所列印 98530.doc •1265532 出之印刷層53之立體示意圖。該印刷層53之體積與外形係 大致與该下開孔521相同，由於該金屬鋼板5〇本身之結構剛 欧其所列印出之印刷層53之邊緣會比習用之印刷層之邊 緣較接近平直狀，而线印刷層53是—方正之結構而非習 用印刷層之錐狀外觀，這是由於該金屬鋼板50不會引發上 述擴散效應。因此以該金屬鋼板50所製成之被動元件其印 刷層邊緣較為平直，即使微小化尺寸之被動元件亦可製 成，且產品良率可以大幅提高。 參考圖12，顯示根據本發明所製成之晶片電阻器之剖視 圖。根據本發明所製成之晶片電阻器60係與習知晶片電阻 窃大致相同，其包括一基板61、二下電極68、二上電極62、 -電阻本體63、第一保護層64、一第二保護層“、二辅助 電極66及二端面電極。 參考圖13 ’顯示本發明中晶片電阻器6〇之製造方法之流 程示意圖。參考圖14至2〇,顯示對應圖13之不同步驟之立 體示意圖。該等圖式係顯示單一晶片電阻器6〇之製程，然 而可以理解的是本發明亦可以應用在批次生產。該晶片電 阻器60之製造方法包括以下步驟：首先，步驟隨係提供 該基板61。值得注意的是，如果在批次生產之製程，該基 板係為一多連晶片電阻基板。 之後，步驟S102係提供一下電極糊。接著，步驟§1〇3係 提供一金屬鋼板，該金屬鋼板係與圖9及圖1〇之金屬鋼板5〇 相類似，#包括-上金屬層及—下金屬層，該上金屬層具 有複數個上開孔，該下金屬層係位於該上金屬層之下，該 98530.doc 1265532 下金屬層具有至少一下開孔，每一下開孔之開孔面積係大 於每一上開孔之開孔面積，且每一下開孔之上方係設置有 至少一個上開孔。該下開孔具有一下電極圖型。接著，步 驟S104係印刷該等下電極68，其係利用該金屬鋼板將該下 電極糊印刷於該基板61之下表面，使該基板6丨下表面具有 一下電極68’如圖14所示。 之後，步驟S105係提供一上電極糊。接著，步驟“⑽係 提供一第一金屬鋼板，該第一金屬鋼板係與圖9及圖"之金 屬鋼板50相類似，其包括一第一上金屬層及一第一下金屬 層，該第一上金屬層具有複數個第一上開孔，該第一下金 屬層係位於該第一上金屬層之下，該第一下金屬層具有至 少一第一下開孔，每一第一下開孔之開孔面積係大於每一 第一上開孔之開孔面積，且每一第一下開孔之上方係設置 有至少二個第一上開孔。該第一下開孔具有一上電極圖型。 接著，步驟S107係印刷該等上電極62，其係利用該第一 金屬鋼板將该上電極糊印刷於該基板6丨上，使該基板61上 具有二上電極62，如圖15所示。步驟31〇8係提供一電阻本 體糊。步驟S109係提供一第二金屬鋼板，該第二金屬鋼板 係與圖9及圖1〇之金屬鋼板5〇相類似，其中該第二金屬鋼板 包括一第二上金屬層及一第二下金屬層，該第二上金屬層 具有複數個第二上開孔，該第二下金屬層係位於該第二上 金屬層之下，該第二下金屬層具有至少一第二下開孔，每 一第二下開孔之開孔面積係大於每一第二上開孔之開孔面 積，且每一第二下開孔之上方係設置有至少二個第二上開 98530.doc -10- 1265532 孔。該第二下開孔具有一電阻本體圖型。 接著，步驟S 110係印刷該電阻本體63，其係利用該第二 金屬鋼板將該電阻本體糊印刷於該基板61上，以形成該電 阻本體63且其連接於該等上電極62，如圖16所示。 之後，步驟S 111係提供一第一保護材料。步驟s丨丨2係提 供一第三金屬鋼板，該第三金屬鋼板係與圖9及圖1〇之金屬 鋼板50相類似，該第三金屬鋼板包括一第三上金屬層及一 第三下金屬層，該第三上金屬層具有複數個第三上開孔， 該第三下金屬層係位於該第三上金屬層之下，該第三下金 屬層具有至少一第三下開孔，每一第三下開孔之開孔面積 係大於母一弟二上開孔之開孔面積，且每一第三下開孔之 上方係设置有至少二個第三上開孔。該第三下開孔具有一 第一保護層圖型。 接著，步驟S113係印刷該第一保護層64，其係利用該第 二金屬鋼板將該第一保護材料印刷於該電阻本體63上，以 形成該第一保護層64。接著，步驟SU4係鐳射切割調值製 程，其係以鐳射切割該電阻本體63之部分以調整該晶片電 阻器60之電阻值，如圖17所示。之後，步驟3115係形成該 第二保護層65，如圖18所示，其方式係與形成該第一保護 層64相同，亦即包括提供一第二保護材料及利用一本發明 之金屬鋼板以印刷該第二保護層65等步驟。可以理解的 疋，該步驟S114係為可選擇性之步驟，亦即該步驟可省略。 接著，步驟S116係形成輔助電極66於該等上電極q之 上，如圖19所示，該步驟S116係為可選擇性之步驟，亦即 98530.doc •11- .1265532 該步驟可省略。。之後，步驟S117係分別形成一端面電極 67於該基板61之二侧，以製得該晶片電阻器⑼，如圖⑼所 示。最後，如果需要的話，彳以再分別形成一金屬電鍍層 以包覆該等端面電極67。 參考圖21，顯示根據本發明所製成之積層陶瓷電容器之 剖視圖。根據本發明所製成之積層陶瓷電容器7〇係與習知 積層陶莞電容器大致相同，其包括一陶咖體71及二端 電極72,丨中該陶£積層體71包括複數個介電層73及複數 個内電極74,該等介電層73係由陶£生片於燒結後所形 成，該等内電極74係利用本發明之鋼板印刷而列印至該陶 竟生片上。 參考圖22，顯示本發明中積4陶竞電容器％之製造方法 之流程示意圖。配合參考圖21，該積層陶£電容器7〇之製 造方法包括以下步驟：首先，步驟S2〇1係提供一陶究漿料。In addition, although the cascading ceramic inductor is miniaturized, the extension ends 42, 43 of the circuit pattern 40 may be in contact with each other, causing product failure. In addition, the yield of the above-mentioned diffusion effect product cannot be improved. Therefore, it is necessary to provide an innovative and progressive method of manufacturing passive components to solve the above problems. SUMMARY OF THE INVENTION The main object of the present invention is to apply a metal steel plate to a printing process of a passive component. The base metal steel plate includes at least an upper metal layer and a lower metal layer, the upper metal layer having a plurality of upper openings, the lower metal The layer has a plurality of 98530.doc 126.5532. The opening area of the lower opening of the female opening is larger than the area of the opening of each upper opening, and the top of the female-lower opening is provided with at least two upper openings. hole. The shape of the Swallowing, etc. - 戸 、, 汗 1 ^ corresponds to the pattern to be printed, and the upper opening is used as a passage for the printing material to enter the lower opening. Thereby, the edges of the printed brush layers are relatively straight, and the printed layer can form a positive structure, so that when the passive component is miniaturized, high printing precision and high product yield can be maintained. [Embodiment] Referring to Fig. 9 and Fig. 10, a plan view and a cross-sectional view, respectively, of a metal steel plate used in the printing process of the present invention are shown. The present invention relates to a passive component (for example, a wafer resistor, a multilayer ceramic capacitor, a laminated ceramic inductor, etc.) 7 manufacturing method which includes a printing process, and is characterized in that the printing process uses a metal steel plate 5〇 The metal steel plate 5 includes an upper metal layer 51 and a lower metal layer 52. The materials of the upper metal layer 51 and the lower metal layer 52 may be the same or different. The upper metal layer 51 has a plurality of upper openings 5U. The lower metal layer 52 is under the upper metal layer 51. The lower metal layer 52 has a plurality of lower openings 521, and an opening area of each lower opening 521. The opening area is larger than the opening area of each of the upper openings 5 11 , and at least two upper opening holes 511 are disposed above each of the lower opening holes 52 . The shape of the lower opening 521 corresponds to the pattern to be printed, and the upper opening 5 is used as a passage for the printing material to enter the lower opening 521. That is, the printing material is injected into the upper openings 5 11 and then enters the lower openings 52 through the upper openings 5 to form a desired pattern. Referring to Fig. 11, there is shown a perspective view of a printed layer 53 of the present invention which utilizes the stamps 93530.doc • 1265532 of the metal steel sheet 50 of Fig. 10. The volume and shape of the printed layer 53 are substantially the same as those of the lower opening 521. Since the metal plate 5 itself has a structure, the edge of the printed layer 53 printed by the metal plate is closer than the edge of the conventional printed layer. The flat print layer 53 is a square-shaped structure rather than a tapered appearance of a conventional printed layer because the metal steel sheet 50 does not cause the above-described diffusion effect. Therefore, the passive component made of the metal steel plate 50 has a flat edge at the printing layer, and even a passive component of a miniaturized size can be produced, and the product yield can be greatly improved. Referring to Figure 12, there is shown a cross-sectional view of a wafer resistor made in accordance with the present invention. The wafer resistor 60 fabricated in accordance with the present invention is substantially identical to the conventional wafer resistor burglary, and includes a substrate 61, two lower electrodes 68, two upper electrodes 62, a resistor body 63, a first protective layer 64, and a first The second protective layer, the second auxiliary electrode 66 and the two-end electrode. Referring to Fig. 13', there is shown a schematic flow chart of the manufacturing method of the wafer resistor 6 in the present invention. Referring to Figs. 14 to 2, the three-dimensional corresponding to the different steps of Fig. 13 is shown. The drawings show a single wafer resistor 6 , process, however it will be appreciated that the invention can also be applied to batch production. The method of fabricating the wafer resistor 60 includes the following steps: First, the steps are provided The substrate 61. It is worth noting that, in the batch production process, the substrate is a multi-chip resistor substrate. Thereafter, step S102 provides an electrode paste. Next, step §1〇3 provides a metal steel sheet. The metal steel plate is similar to the metal steel plate 5 of FIG. 9 and FIG. 1 , and includes an upper metal layer and a lower metal layer, the upper metal layer having a plurality of upper openings, and the lower metal layer Under the upper metal layer, the metal layer of the 98530.doc 1265532 has at least one opening, and the opening area of each lower opening is larger than the opening area of each upper opening, and the upper of each lower opening is At least one upper opening is provided. The lower opening has a lower electrode pattern. Then, in step S104, the lower electrode 68 is printed, and the lower electrode paste is printed on the lower surface of the substrate 61 by using the metal steel plate. The lower surface of the substrate 6 has a lower electrode 68' as shown in Fig. 14. Thereafter, step S105 provides an upper electrode paste. Next, step (10) provides a first metal steel plate, the first metal steel plate and the figure. 9 is similar to the metal steel plate 50 of FIG. 3, comprising a first upper metal layer and a first lower metal layer, the first upper metal layer having a plurality of first upper openings, the first lower metal layer Located under the first upper metal layer, the first lower metal layer has at least one first lower opening, and the opening area of each of the first lower openings is larger than the opening area of each of the first upper openings. And the top of each of the first lower openings is provided to Two first upper opening. The first lower opening has an upper electrode pattern. Next, in step S107, the upper electrodes 62 are printed, and the upper electrode paste is printed on the substrate 6 by the first metal steel plate so that the substrate 61 has the upper electrodes 62 as shown in FIG. Step 31〇8 provides a resistor body paste. Step S109 provides a second metal steel plate similar to the metal steel plate 5 of FIG. 9 and FIG. 1 , wherein the second metal steel plate includes a second upper metal layer and a second lower metal layer. a layer, the second upper metal layer has a plurality of second upper openings, the second lower metal layer is located under the second upper metal layer, and the second lower metal layer has at least one second lower opening, each The opening area of a second lower opening is larger than the opening area of each second upper opening, and each of the second lower opening is provided with at least two second upper openings 98530.doc -10- 1265532 hole. The second lower opening has a resistive body pattern. Next, in step S110, the resistor body 63 is printed, and the resistor body is paste-printed on the substrate 61 by the second metal steel plate to form the resistor body 63 and connected to the upper electrodes 62, as shown in the figure. 16 is shown. Thereafter, step S 111 provides a first protective material. Step s丨丨2 provides a third metal steel plate similar to the metal steel plate 50 of FIG. 9 and FIG. 1 , the third metal steel plate including a third upper metal layer and a third lower metal plate. a metal layer, the third upper metal layer has a plurality of third upper openings, the third lower metal layer is located under the third upper metal layer, and the third lower metal layer has at least a third lower opening, The opening area of each of the third lower openings is larger than the opening area of the upper opening of the parent and the second lower opening, and at least two third upper openings are disposed above each of the third lower openings. The third lower opening has a first protective layer pattern. Next, in step S113, the first protective layer 64 is printed, and the first protective material is printed on the resistor body 63 by the second metal steel plate to form the first protective layer 64. Next, step SU4 is a laser cutting adjustment process for cutting a portion of the resistor body 63 by laser to adjust the resistance value of the wafer resistor 60, as shown in FIG. Thereafter, step 3115 forms the second protective layer 65, as shown in FIG. 18, in the same manner as the first protective layer 64, that is, including providing a second protective material and using a metal steel plate of the present invention. The second protective layer 65 and the like are printed. It can be understood that the step S114 is an optional step, that is, the step can be omitted. Next, step S116 forms an auxiliary electrode 66 on the upper electrodes q. As shown in FIG. 19, the step S116 is an optional step, that is, 98530.doc •11-.1265532 This step can be omitted. . Thereafter, in step S117, an end surface electrode 67 is formed on each side of the substrate 61 to form the wafer resistor (9), as shown in Fig. (9). Finally, if necessary, a metal plating layer is separately formed to cover the end face electrodes 67. Referring to Figure 21, there is shown a cross-sectional view of a multilayer ceramic capacitor fabricated in accordance with the present invention. The multilayer ceramic capacitor 7 made according to the present invention is substantially the same as the conventional laminated ceramic capacitor, and includes a ceramic pot body 71 and a two-terminal electrode 72. The ceramic layer 71 includes a plurality of dielectric layers. 73 and a plurality of internal electrodes 74 formed by sintering the green sheets, and the internal electrodes 74 are printed on the ceramic sheets by printing with the steel sheets of the present invention. Referring to Fig. 22, there is shown a flow chart showing the manufacturing method of the product 4 of the present invention. Referring to Fig. 21, the method for manufacturing the laminated capacitor 7 包括 includes the following steps: First, step S2〇1 provides a ceramic slurry.
然後，步驟S202係將該陶瓷漿料形成複數個陶瓷生片。接 著’步驟S203係提供一導電性糊。 接著，步驟S204提供-第四金屬鋼板，該第四金屬鋼板 係與圖9及圖1〇之金屬鋼板5〇相_，其包括一第四上金屬 層及-第四下金屬| ’該第四上金屬層具有複數個第四上 開孔，該第四下金屬層係位於該第四上金屬層之下，該第 四下金屬層具有至少一第四下開孔，每一 ^ 弟四下開孔之開 孔面積係大於每一第四_L開孔之開孔面冑，且每—第四下 開孔之上方係設置有至少二個第四 汗J ^ 邊第四下開孔 具有一内電極圖型。 98530.doc -12- 1265532 接著，步驟S205係印刷内電極，其係利用該第四金屬鋼 板將該導電性糊印刷於該等H生片Λ，使每-該陶竟生 片上具有内電極74。之後，步驟S2〇6係疊層該等陶瓷生片。 接著，步驟S207係壓合該等陶竞生片，以形成一陶竟積層 體接著，如果是批次生產，則需再經過一步驟S2〇8，其 係裁斷或截斷該陶瓷積層體，以形成複數個積層晶片。之 後步驟S209係燒結該等積層晶片，以形成複數個燒結體， 其中該等陶瓷生片即變成該等介電層73。最後，步驟s2i〇 係分別形成該端電極72於每一該燒結體之二端，以形成該 積層«電容器70。此外’如果需要的話’可以再分別形 成一金屬電鍍層以包覆該等端電極72。 參考圖23，顯示本發明中積層冑冑電感器之製造方法之 /爪私不忍圖。參考圖24a至24h顯示對應圖U之不同步驟之 立體不忍圖。該等圖式係顯示單一積層陶瓷電感器之製 程，然而可以理解的是本發明亦可以應用在批次生產。 忒積層陶瓷電感器之製造方法包括以下步驟··首先，步 驟S301係提供-陶竟漿料。然後，步驟謂2係將該陶究聚 料形成複數個陶究生片，其包括一第一陶究生片81，如圖 24a所示。值得注意的是，如果在批次生產之製程，該第一 陶瓷生片81係為一多連電感基板。然後，步驟s3〇3係提供 -導電性糊。接著’步驟S304係提供一第五金屬鋼板，該 第五金屬鋼板係與圖9及圖1〇之金屬鋼板5〇相類似，其包括 -第五上金屬層及一第五下金屬層，該第五上金屬層具有 複數個第五上開？L，該第五下金屬層係位於該第五上金屬 98530.doc -13- 1265532 層之下’ β第五下金屬層具有至少一第五下開孔，每一第 五：開孔之開孔面積係大於每一第五上開孔之開孔面積， 且每一第五下開孔之上方係設置有至少二個第五上開孔。 該第五下開孔具有-第五預定電路圖型。接著，步驟S305 係p刷第五電路82，其係利用該第五金屬鋼板將該導電 性糊印刷於該第一陶瓷生片81上，使該第一陶瓷生片以上 具有一第五電路82，如圖24b所示。 接著，步驟S306係提供一第二陶瓷生片83，該第二陶瓷 生片83覆蓋部分該第五電路82，如圖24c所示。接著，步驟 S307係提供一導電性糊。接著，步驟“⑽係提供一第六金 屬鋼板，該第六金屬鋼板係與圖9及圖10之金屬鋼板5〇相類 似，其中該第六金屬鋼板包括一第六上金屬層及一第六下 金屬層，該第六上金屬層具有複數個第六上開孔，該第六 下金屬層係位於該第六上金屬層之下，該第六下金屬層具 有至少一第六下開孔，每一第六下開孔之開孔面積係大於 每一第六上開孔之開孔面積，且每一第六下開孔之上方係 叹置有至少一個第六上開孔，該第六下開孔具有一預定第 六電路圖型。接著，步驟S309係印刷一第六電路84，其係 利用該第六金屬鋼板將該導電性糊印刷於該第二陶瓷生片 83上，以形成該第六電路84，該第六電路料係連接該第五 電路82，如圖24d所示。 接著’步驟S3 10係疊層步驟，亦即，重複上述步驟，提 供一第三陶莞生片85以覆蓋該第五電路82及部分該第六電 路84，如圖24e所示。然後，再形成一第七電路86於該第三 98530.doc -14 - 1265532 陶瓷生片85上，如圖24f所示。此一重複步驟之次數可視該 積層陶瓷電感器之電感值而定。之後，覆蓋一上絕緣層而 形成一陶瓷積層體。接著，步驟S3 11係壓合該等陶瓷生片。 如果是批次生產製程，會同時產生多個陶瓷積層體，因 此需要多一個將該多連陶瓷積層體截斷之步驟（步驟 S3 12)，以形成複數個積層晶片。接著，步驟S313係燒結該 等積層晶片，以形成複數個燒結體87，如圖24g所示。最後，Then, in step S202, the ceramic slurry is formed into a plurality of ceramic green sheets. Next, the step S203 is to provide a conductive paste. Next, in step S204, a fourth metal steel plate is provided, which is in phase with the metal steel plate of FIG. 9 and FIG. 1 , and includes a fourth upper metal layer and a fourth lower metal | The upper metal layer has a plurality of fourth upper openings, the fourth lower metal layer is located under the fourth upper metal layer, and the fourth lower metal layer has at least one fourth lower opening, each of the four The opening area of the lower opening is larger than the opening surface 每一 of each fourth _L opening, and at least two fourth sweat J ^ sides and the fourth lower opening are arranged above each of the fourth lower opening It has an internal electrode pattern. 98530.doc -12- 1265532 Next, step S205 is to print the inner electrode by printing the conductive paste on the H green sheets by the fourth metal steel plate so that the inner electrode 74 is provided on each of the ceramic sheets. Thereafter, the ceramic green sheets are laminated in step S2〇6. Next, step S207 is to press the ceramics to form a ceramic layer. Then, if it is batch production, it needs to go through a step S2〇8, which cuts or cuts the ceramic layer to form a plurality. Multilayer wafers. Thereafter, the step S209 is to sinter the laminated wafers to form a plurality of sintered bodies, wherein the ceramic green sheets become the dielectric layers 73. Finally, step s2i is formed to form the terminal electrode 72 at each of the two ends of the sintered body to form the buildup layer «capacitor 70. Further, if necessary, a metal plating layer may be separately formed to cover the terminal electrodes 72. Referring to Fig. 23, there is shown a method of manufacturing a laminated germanium inductor according to the present invention. Referring to Figures 24a through 24h, a stereoscopic map corresponding to the different steps of Figure U is shown. These figures show the process of a single laminated ceramic inductor, however it will be appreciated that the invention can also be applied to batch production. The manufacturing method of the slab ceramic inductor includes the following steps: First, in step S301, a ceramic slurry is provided. Then, the step 2 is to form the ceramic material into a plurality of ceramic tablets, which includes a first ceramic film 81, as shown in Fig. 24a. It is worth noting that, in the batch production process, the first ceramic green sheet 81 is a multi-connected inductor substrate. Then, step s3〇3 provides a conductive paste. [Step S304] A fifth metal steel plate is similar to the metal steel plate 5 of FIG. 9 and FIG. 1 , and includes a fifth upper metal layer and a fifth lower metal layer. The fifth upper metal layer has a plurality of fifth upper openings? L, the fifth lower metal layer is located under the fifth upper metal 98530.doc -13-1265532 layer. The β fifth lower metal layer has at least one fifth lower opening, and each fifth: opening of the opening The hole area is larger than the opening area of each of the fifth upper openings, and at least two fifth upper openings are disposed above each of the fifth lower openings. The fifth lower opening has a fifth predetermined circuit pattern. Next, in step S305, the fifth circuit 82 is brushed by the fifth metal plate, and the conductive paste is printed on the first ceramic green sheet 81, so that the first ceramic green sheet has a fifth circuit 82. , as shown in Figure 24b. Next, step S306 provides a second ceramic green sheet 83 covering a portion of the fifth circuit 82, as shown in Fig. 24c. Next, step S307 provides a conductive paste. Next, the step "(10) provides a sixth metal steel plate similar to the metal steel plate of FIG. 9 and FIG. 10, wherein the sixth metal steel plate includes a sixth upper metal layer and a sixth metal plate. a lower metal layer having a plurality of sixth upper openings, the sixth lower metal layer being located under the sixth upper metal layer, the sixth lower metal layer having at least a sixth lower opening The opening area of each of the sixth lower openings is larger than the opening area of each of the sixth upper openings, and each of the sixth lower openings is slid with at least one sixth upper opening, the first The six lower openings have a predetermined sixth circuit pattern. Then, in step S309, a sixth circuit 84 is printed, which uses the sixth metal steel plate to print the conductive paste on the second ceramic green sheet 83 to form The sixth circuit 84 is connected to the fifth circuit 82, as shown in Fig. 24d. Next, the step S3 10 is a lamination step, that is, the above steps are repeated to provide a third ceramic green sheet 85. Covering the fifth circuit 82 and a portion of the sixth circuit 84, as shown in FIG. 24e Then, a seventh circuit 86 is formed on the third 98530.doc -14 - 1265532 ceramic green sheet 85, as shown in Fig. 24f. The number of repeated steps can be determined by the inductance value of the laminated ceramic inductor. Thereafter, an upper insulating layer is covered to form a ceramic laminate. Then, step S3 11 is to press the ceramic green sheets. If it is a batch production process, a plurality of ceramic laminates are simultaneously produced, so one more need to be The step of cutting the plurality of ceramic laminates (step S3 12) to form a plurality of stacked wafers. Next, step S313 is to sinter the stacked wafers to form a plurality of sintered bodies 87, as shown in Fig. 24g. Finally,
步驟S3 14係分別形成一端電極88於每一該燒結體87之二 端，以形成該積層陶瓷電感器8〇，如圖24h所示。此外，如 果需要的話，可以再分別形成一金屬電鍍層以包覆該等端 電極88。 上述實施例僅為說明本發明之原理及其功效，並非限制 ^發明。因此習於此技術之人士對上述實施例進行修改及 變化仍不脫本發明之精神。本發明之權利範圍應如後述之 申請專利範圍所列。 【圖式簡單說明】 2顯示u印刷製程中所使用之網版之局部俯視圖； 示習用印刷製程t所使用之網版之局部剖視圖； 圖_示利用圖!之習用網版所列印出之印刷層之俯視 刷層之剖視 圖A顯不利用圖1之習用網版所列印出之印 圖； = 印刷製程中使用之鋼板之局部俯視圖; …、白用印刷製程中使用之鋼板之局部剖視圖; 98530.doc -15- 1265532 圖4a顯示利用圖3之習用鋼板所列印出之印刷層之俯視 放大示意圖； 圖4b顯示利用圖3之習用鋼板所列印出之印刷層之剖視 放大不意圖， 圖5顯示習用網版印刷所製成之晶片電阻器之立體示音、 圖； 圖6顯不習用網版印刷所製成之晶片電阻器 < 俯視示音 圖； 圖7顯示習用網版印刷所製成之積層陶竟電容器之立體 示意圖； 圖8顯示習用網版印刷所製成之積層陶瓷電感器之電路 圖型之示意圖； 圖9顯示本發明印刷製程中所使用之金屬鋼板之俯視示 意圖； 圖10顯示本發明印刷製程中所使用之金屬鋼板之剖視示 意圖； 圖11顯示本發明中利用圖10之金屬鋼板所列印出之印刷 層之立體示意圖； 圖12顯示根據本發明所製成之晶片電阻器之剖視圖； 圖13顯示本發明中晶片電阻器之製造方法之流程示意 圖， 圖14至20顯示對應圖13之不同步驟之立體示意圖； 圖21顯示根據本發明所製成之積層陶瓷電容器之剖視 圖， 98530.doc •16- 1265532 圖22顯示本發明中積層陶瓷電容器之製造方法之流程示 意圖， 圖23顯示本發明中積層陶瓷電感器之製造方法之流程示 意圖；及 圖24a至24h顯示對應圖23之不同步驟之立體示意圖。 【圖式元件符號說明】Step S3 14 forms an end electrode 88 at each of the two ends of the sintered body 87 to form the laminated ceramic inductor 8A, as shown in Fig. 24h. Further, if necessary, a metal plating layer may be separately formed to coat the terminal electrodes 88. The above embodiments are merely illustrative of the principles and effects of the invention, and are not intended to be limiting. Therefore, those skilled in the art can make modifications and changes to the above embodiments without departing from the spirit of the invention. The scope of the invention should be as set forth in the appended claims. [Simple description of the drawing] 2 shows a partial top view of the screen used in the u printing process; a partial cross-sectional view of the screen used for the printing process t of the drawing; Figure _ shows the printed version of the screen using the drawing! The cross-sectional view A of the top layer of the printed layer is not marked with the printed version of the printed screen of Figure 1; = a partial top view of the steel sheet used in the printing process; ..., a partial cross-sectional view of the steel sheet used in the white printing process 98530.doc -15- 1265532 Figure 4a shows a top plan view of the printed layer printed with the conventional steel sheet of Figure 3; Figure 4b shows a cross-sectional view of the printed layer printed with the conventional steel sheet of Figure 3 Intent, FIG. 5 shows a stereoscopic sound diagram of a wafer resistor made by conventional screen printing; FIG. 6 shows a wafer resistor made by screen printing < top view sound map; FIG. 7 shows a conventional screen printing station. FIG. 8 is a schematic view showing a circuit pattern of a laminated ceramic inductor made by conventional screen printing; FIG. 9 is a view showing a metal used in the printing process of the present invention; FIG. 10 is a schematic cross-sectional view showing a metal steel sheet used in the printing process of the present invention; FIG. 11 is a perspective view showing a printed layer printed by the metal steel sheet of FIG. 10 in the present invention; 1 is a schematic cross-sectional view showing a method of manufacturing a wafer resistor in the present invention, and FIGS. 14 to 20 are schematic perspective views showing different steps corresponding to FIG. 13; FIG. 22 is a flow chart showing a method of manufacturing a multilayer ceramic capacitor in accordance with the present invention, and FIG. 23 is a flow chart showing a method of manufacturing a multilayer ceramic inductor according to the present invention; Figures 24a through 24h show perspective views of the different steps corresponding to Figure 23. [Graphic component symbol description]
10 習用網版 11 線狀體 12 印刷層 13 邊緣 14 習用鋼板 15 開孔 16 印刷層 17 邊緣 20 晶片電阻器 21 基板 22 > 23 上電極 24 電阻本體 30 積層陶瓷電容器 31 陶瓷積層體 32 端電極 33 介電層 34 内電極 40 電路圖型 98530.doc -17- 126553210 Conventional screen 11 Linear body 12 Printed layer 13 Edge 14 Conventional steel plate 15 Opening 16 Printed layer 17 Edge 20 Chip resistor 21 Substrate 22 > 23 Upper electrode 24 Resistive body 30 Laminated ceramic capacitor 31 Ceramic laminate 32 Terminal electrode 33 dielectric layer 34 internal electrode 40 circuit pattern 98530.doc -17- 1265532
41 可用範圍 42、43 延伸端 50 金屬鋼板 51 上金屬層 52 下金屬層 53 印刷層 60 晶片電阻裔 61 基板 62 上電極 63 電阻本體 64 第一保護層 65 第二保護層 66 輔助電極 67 端面電極 68 下電極 70 積層陶瓷電容器 71 陶瓷積層體 72 端電極 73 介電層 74 内電極 80 積層陶瓷電感器 81 第一陶瓷生片 82 第五電路 83 第二陶瓷生片 98530.doc •18- 1265532 84 第六電路 85 第三陶瓷生片 86 第七電路 87 燒結體 88 端電極 511 上開孔 521 下開孔 98530.doc -19-41 usable range 42, 43 extension end 50 metal plate 51 upper metal layer 52 lower metal layer 53 printed layer 60 wafer resistor 61 substrate 62 upper electrode 63 resistance body 64 first protective layer 65 second protective layer 66 auxiliary electrode 67 end electrode 68 Lower electrode 70 Laminated ceramic capacitor 71 Ceramic laminate 72 Terminal electrode 73 Dielectric layer 74 Internal electrode 80 Laminated ceramic inductor 81 First ceramic green sheet 82 Fifth circuit 83 Second ceramic green sheet 98530.doc • 18- 1265532 84 Sixth circuit 85 third ceramic green sheet 86 seventh circuit 87 sintered body 88 terminal electrode 511 upper opening 521 lower opening 98530.doc -19-