!244619 五'發明説明( 存媒體可為熱性擦除，之後可再重新多次寫入。為擦除該 儲存媒體，該聚合物層會被加熱到該聚合物層足可重新流 移的水準，藉此來移除所有被記錄在該儲存媒體内之陷孔 或坑洞。 經濟部智慧財產局貝工消費合作社印製 各個加熱器元件也可提供一熱性讀回感測器，因為該 者具有一個與溫度相關的電阻值。對於資料讀出作業，可 循序地將加熱信號施加於該陣列裡的各個橫列上。該加熱 信號可將所選定之橫列内的加熱器元件加熱，然現為增高 至不足以令該聚合物層變形的溫度。諸加熱器元件與該儲 存媒體間的熱導性會根據諸加熱器元件與該儲存媒體兩 者之間的距離而改變。當該陣列被掃描泛越整個儲存媒體 而尖點移動進入位元陷孔中時，諸加熱器元件與該儲存媒 體兩者之間的距離會縮短。諸加熱器元件與該儲存媒體兩 者之間的媒體會傳導諸加熱器元件與該儲存媒體兩者之 間的熱性。而當相關的尖點移入一陷孔内時，諸加熱器元 件與該儲存媒體兩者之間的熱性傳導會變得更有效率。從 而’溫度與因之加熱器元件的電阻性會降低。可依平行方 式來監視各橫列内經連續加熱之加熱器元件的溫度變 化，俾利於偵測所記錄的諸位元。傳統上，為達到可接.受 的仏號雜訊比故採取相當長深的尖點。但是，這種長型+ 點極為精密而不易製造。並且，在傳統裝置中，為易於寫 入故採行相當軟的聚合物層。不過，有關在這種材質的問 題是’於其内的變形結果對於溫度變化確是相當地敏感。 尤其是，這些變形會因環境溫度改變而被移除，造成相對 第5頁 本紙張尺度適用中國國家標準(CNS)A4規格(2丨Οχ297公釐) 1244619 A7 ___ _^B7 五、發明説明（） 應的資料損失。此外，由於會橫越整個表面來掃描該陣 列’因此這些尖點會接觸該聚合物層而磨損。 發明目的及槪沭： 根據本發明，茲提供一種用以透過一尖點對表面上的 諸位置進行寫入資料及/或讀出資料之方法，該方法至少包 含：於該表面上諸位置處移動該尖點；並且，在各個位置 處，將能量選擇性地經該尖點而施加在該表面上，並且， 於該選擇性的能量施加之同時，選擇性地將該尖點與該表 面強制併合。這種排置方式可改善讀出與寫入敏感度。 該尖點最好是可交替地移動朝向與遠離於該表面。這 可減少當尖點移動於諸位置處間時該尖點所生之磨損。 本發明諸具體實施例中可藉由於經該尖點處對該表 面的選擇性能量施加之同時，而選擇性地強制該尖點和表 面併合，俾以達到進一步的讀出與寫入作業改善結果。 在本發明特別較佳諸具體實施例中，藉由相對於選擇 性強制該尖點和表面併合，對該表面的選择性能量施加作 業予以移位，來達到進一步的讀出與寫入作業改善結果。 ‘ 纟本發明諸具體實施例中，可藉由選擇性能二作 業，包含當將該尖點與表面彼此朝向移動時，透過尖點對 該表面施加能量，而達到經改善之寫入作業效能。在本發 明特別較佳之諸具體實施例中，可藉由 " 稽由選擇性地對該表面 施加能量，包含於該尖點啣接到該表 回乏冋時，即透過尖 點對該表面施加能量，而進一步地改盖 °馬入作業效能。 本紙張尺度適用中國國家標準(CNS)A4規格(21〇>< 297公釐) V ' · (請先閲讀背面之注意事項再畴寫本頁} 訂 線 經 濟 部 智 慧 財 產 局 員 工 消 費 合 作 社 印 製 第6頁! 244619 Five 'invention description (The storage medium can be thermally erased, and then it can be written again multiple times. In order to erase the storage medium, the polymer layer will be heated to a level where the polymer layer can be re-flowed. In order to remove all the pits or pits recorded in the storage medium. Each heater element printed by the Shellfish Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs can also provide a thermal read-back sensor because it It has a temperature-dependent resistance value. For the data reading operation, the heating signal can be sequentially applied to each row in the array. The heating signal can heat the heater element in the selected row, then It is now a temperature that is not high enough to deform the polymer layer. The thermal conductivity between the heater elements and the storage medium will change depending on the distance between the heater elements and the storage medium. When the array When the entire storage medium is scanned and the sharp point moves into the bit cavity, the distance between the heater elements and the storage medium will be shortened. The medium between them will conduct the heat between the heater element and the storage medium. When the relevant sharp point moves into a recess, the heat conduction between the heater element and the storage medium will change. It is more efficient. Therefore, the temperature and the resistance of the heater element will be reduced. The temperature changes of the continuously heated heater elements in each row can be monitored in parallel to facilitate the detection of the recorded bits. Traditionally, in order to achieve acceptable noise, a relatively long and sharp point was adopted. However, this long + point is extremely precise and difficult to manufacture. Moreover, in traditional devices, it is easy to write Therefore, a rather soft polymer layer is used. However, the problem with this material is that the deformation results within it are indeed quite sensitive to temperature changes. In particular, these deformations are removed due to changes in ambient temperature. As a result, the Chinese paper standard (CNS) A4 specification (2 丨 χ 297 mm) applies to the paper size on page 5. 1244619 A7 ___ _ ^ B7 V. The description of the invention () should be lost. In addition, because it will cross the entire table To scan the array 'so that the sharp points will contact the polymer layer and wear out. OBJECTS AND PROBLEMS OF THE INVENTION According to the present invention, there is provided a method for writing data and / or locations on a surface through a sharp point. A method for reading data, the method includes at least: moving the sharp point at various positions on the surface; and, at each position, applying energy selectively to the surface through the sharp point, and At the same time of selective energy application, the sharp point is selectively forced to merge with the surface. This arrangement can improve read and write sensitivity. The sharp point should preferably be alternately moved towards and away from The surface. This can reduce the wear caused by the sharp point when it moves between positions. In specific embodiments of the present invention, due to the selective energy applied to the surface through the sharp point, The cusp and the surface are selectively forced to merge to achieve further improvement in reading and writing operations. In particularly preferred embodiments of the present invention, by selectively forcing the sharp point to merge with the surface, the selective energy application operation on the surface is shifted to achieve further reading and writing operations. Improve results. ‘In specific embodiments of the present invention, improved performance of writing operations can be achieved by selecting performance two jobs, including when the sharp point and the surface are moved toward each other, applying energy to the surface through the sharp points. In the particularly preferred embodiments of the present invention, energy can be selectively applied to the surface by "quoting", including when the sharp point is connected to the surface, and the surface is exposed to the surface through the sharp point. Applying energy, the performance is further changed. This paper size applies to China National Standard (CNS) A4 specifications (21〇 > < 297 mm) V '· (Please read the precautions on the back before writing this page) Printing Page 6
111 1244619 五 、發明説明（ a :樣地’在本發明較佳諸具體實施例中，可藉由選擇 性能量施加作業，包含 3田將該尖點與表面彼此朝離移動 時，透過尖點對該表面施加能量，而達到經改善之讀出作 業效能。在本發明特別較佳之諸具體實施例中，可藉由選 擇性地對該表面施加能景 月匕置包含同時於該尖點卸離該表 面，透過尖點對該表面施加能量，而進一步地改善讀出作 業效能。 在本發月特別較佳之諸具體實施例中，該選擇性地強 制該尖點和表面併合白人、强 农囬1幵σ包含選擇性地產生一作用於該尖點 上之力場，以驅使該尖點和該表面併合。最好，可藉由選 擇性地產生該力場，將該尖點移入與移離接觸該表面為 佳。該力場可包含電場。或另者，該力場含有磁場。在本 發明特別較佳之諸具體實施例中，該能量係包含熱能。 而從另一觀點觀察本發明，可兹提供一種用以透過一 尖點對表面上的諸位置進行寫入資料及/或讀出資料之裝 置，該裝置至少包含一第一傳導體子系統，以移動該尖點 於該表面上諸位置間；一第二傳導體子系統，以將能量選 擇性地經該尖點而施加在該表面上；和一第三傳導體子系 統，以同時於該第二傳導體子系統的能量施加，而將該尖 點與該表面選擇性地強制併合。 該第三傳導體子系統最好是可同時於該第二傳導體 子系統的能量施加，而交替地移動朝向與遠離於該表面。 在本發明較佳之諸具體實施例中，該第三傳導體子系統可 同時於該第二傳導體子系統的能量施加，而選擇性地經該 本紙張尺度適用中國國家標準(CNS)A4規格(210X297公釐) 五、發明說明（） 將該太點與該表面強制併合。 /在本發明特別較佳之諸具體實施例中，該第二傳導體 子系、、先對該表面的能量施加作業，係相對於該第三傳導體 子系統的選擇性強制併合該尖點與該表面而移位。在該等 、實施例裡，該第二傳導體子系統最好是當於寫入作業 中’該第三傳導體子系統將該尖點與表面彼此朝向移動 時’透過該尖點對表面施加能量為佳。在寫入作業裡，該 第一傳導體统彳同時於該尖點被該第s #導體子系 統:彺接觸到該表面，透過該尖點對該表面施加能量。而 在讀出作業裡，該第二傳導體子系統最好是當於寫入作業 5第一傳導體子系統將該尖點與表面彼此朝離移動 時，透過該尖點對表面施加能量為佳。在讀出作業裡，該 第一傳導體子系統可同時於該尖點被該第三傳導體子系 統帶出卸離於該表面，透過該尖點對該表面施加能量。 在本發明特別較佳之諸具體實施例中，該第三傳導體 子系統包含一力場產生器，以選擇性地產生一作用於該尖 點上之力場，以驅使該尖點和該表面併合。該力場產生器 最好可藉由選擇性地產生該力場，將該尖點移入與移離接 觸該表面為佳。該力場產生器可包含一電場產生器。或另 者’該力場含有一磁場產生器。 該第二傳導體子系統最好是包含一加熱器，以按熱能 形式來對該表面施加能量。 本發明亦可延伸至一種含有一儲存表面、一面朝該儲 存表面之尖點，和用以即如前述般透過該尖點對該表面上 第8頁 1244619 五、發明説明（ 濟 部 智 慧 財 產 局 員 費 合 作 社 印 的諸位置進行寫入資料及/或讀出資料之裝置的資料儲存 裝置。本發明更可延伸為一種含有—巾央處理單元，和連 接至該中央處理單元之資料儲存裝置的資料處理系統。 i式簡翠說明： 現將僅按範例方式，並連同參酌於隨附圖式，以說 本發明各款較佳具體實施例，其中： 第1圖為一採行發明之資料儲存裝置感測器的平面視圖 第2圖為當按箭頭A — A，方向時該感測器之剖視圖； 第3圖為該資料儲存裝置之同構視圖； 第4圖為經寫入作業後，該資料儲存裝置儲存媒體之剖Ρ5Π · 圖， 第5圖為經選擇性擦除作業後，該資料儲存裝置儲存媒 之剖視圖； 第6圖為經選擇性擦除作業後，該f料储存裝置館存媒 之另一剖視圖； 、 第7圖為該儲存媒體表面處之能量圖示； 第8圖為寫入作業過程中，該儲存媒體之剖視圖· 第9圖為選擇性擦除作業過程中，該儲存媒體之剖視 第10® 4選擇性擦除作業過程巾，該f堵存媒體之另 視圖； 第11A®為當該感測器朝指☆該儲存表面上連續位 時，該感測器與該儲存媒體其間隔距之圖示； 第11B圖為在各個連續位置處’施加於該感測器上的 圖 剖 置處 寫入 製 細x297 明 體 體111 1244619 V. Description of the invention (a: sample plots) In the preferred embodiments of the present invention, the selective energy application operation may be included, including 3 days when the sharp point and the surface are moved away from each other through the sharp point. Energy is applied to the surface to achieve improved readout performance. In the particularly preferred embodiments of the present invention, the energy can be selectively applied to the surface including unloading at the cusp at the same time. From the surface, energy is applied to the surface through the sharp points, thereby further improving the readout performance. In the particularly preferred embodiments of the present month, the selective points and the surface are forced to merge with white people, strong farmers Returning to 1 幵 σ includes selectively generating a force field acting on the sharp point to drive the sharp point to merge with the surface. Preferably, the sharp point can be moved into It is better to move away from contacting the surface. The force field may include an electric field. Or, the force field may include a magnetic field. In a particularly preferred embodiment of the present invention, the energy system includes thermal energy. Looking at this from another point of view invention A device for writing data and / or reading data to various locations on a surface through a sharp point may be provided. The device includes at least a first conductor subsystem to move the sharp point on the surface. Between the upper positions; a second conductor sub-system to selectively apply energy to the surface through the cusp; and a third conductor sub-system at the same time as the second conductor sub-system Energy is applied, and the cusp is selectively forced to merge with the surface. The third conductor subsystem is preferably applied simultaneously with the energy of the second conductor subsystem, and alternately moves towards and away from the Surface. In preferred embodiments of the present invention, the third conductor subsystem can be applied to the energy of the second conductor subsystem at the same time, and the Chinese National Standard (CNS) is selectively applied to the paper size. A4 specification (210X297mm) 5. Explanation of the invention () The compulsory merging of the too-point with the surface. / In a particularly preferred embodiment of the present invention, the second conductor sub-system, Energy application In contrast to the selective conduction of the third conductor subsystem, the sharp point and the surface are merged and displaced. In the embodiments, the second conductor subsystem is preferably used for writing. It is better to apply energy to the surface through the cusp when the third conductor system moves the cusp and the surface toward each other. In the writing operation, the first conductor is simultaneously at the cusp. The s # conductor subsystem: 彺 contacts the surface and applies energy to the surface through the sharp point. In the reading operation, the second conductor subsystem is preferably the first conduction in the writing operation 5. When the body subsystem moves the cusp and the surface away from each other, it is better to apply energy to the surface through the cusp. In the reading operation, the first conductor system can be simultaneously conducted by the third point at the cusp. The body subsystem is taken out of the surface, and energy is applied to the surface through the sharp point. In a particularly preferred embodiment of the present invention, the third conductor subsystem includes a force field generator to selectively generate a force field acting on the cusp to drive the cusp and the surface. Merge. Preferably, the force field generator can selectively generate the force field, and preferably move the cusp into and out of contact with the surface. The force field generator may include an electric field generator. Or else 'the force field contains a magnetic field generator. The second conductor subsystem preferably includes a heater to apply energy to the surface in the form of thermal energy. The present invention can also be extended to a point containing a storage surface, one pointed toward the storage surface, and used to pass through the point to the surface as described previously. Page 8 1244619 A data storage device of a device for writing data and / or reading data from various locations printed by bureau fee cooperatives. The present invention can be extended to include a central processing unit and a data storage device connected to the central processing unit. Data processing system. Brief description of i-type: Now, we will only use the example method, and refer to the accompanying drawings to describe the preferred embodiments of the present invention, where: Figure 1 is a collection of invention data Plane view of the sensor of the storage device. Figure 2 is a cross-sectional view of the sensor when the arrow A-A is pressed. Figure 3 is a homogeneous view of the data storage device. Figure 4 is after the writing operation. Figure 5 is a sectional view of the storage medium of the data storage device. Figure 5 is a sectional view of the storage medium of the data storage device after the selective erasing operation. Figure 6 is a view of the selective media after the selective erasing operation. f. Another cross-sectional view of the storage medium of the material storage device hall; Figure 7 is a diagram of the energy at the surface of the storage medium; Figure 8 is a cross-sectional view of the storage medium during the writing operation; Figure 9 is a selective wipe Except during the operation, a cross-section of the storage medium is selectively removed during the operation. The other view of the storage medium is f. The 11A® is when the sensor is pointing toward the finger. ☆ The storage surface is continuously positioned. At the same time, the distance between the sensor and the storage medium is illustrated; Figure 11B is a thin x297 light body written in the section of the figure 'applied to the sensor' at each successive position.
.........%: (請先閲讀背面之注意事項再填、寫本頁} #-· I I I 1244619 A7 B7 五、發明説明（） 信號圖示； 第11 C圖為在各個連續位置處，施加於該感測器上的讀出 信號圖示；而 第1 1 D圖為在各個連續位置處，施加於該感測器上而依時 間所變化的電場圖示。 圖號對照說明= 10 二維陣列懸桁感測器 15 U型矽質懸桁 20 基板 30 電阻性加熱器元件 40 矽質尖點 50 縱行導體 60 橫列導體 70 凹陷 80 中介二極體 90 聚合物層 100 矽質基板 110 緩衝層 120 陷孔 121 陷孔 122 陷孔 123 陷孔 124 陷孔 130 縱行多工器 140 控制線路 150 控制線路 160 定位傳導器 170 定位傳導器 180 橫列多工器 190 聚合材質環狀物 210 控制器 220 定位傳導器 230 穩定或地面狀態 240 超穩定狀態 250 電壓信號產生器 發明詳細說明： 第10頁 本紙張尺度適用中國國家標準(CNS)A4規格(210X297公釐) (請先閲讀背面之注意事項再填寫本頁) 并· 經濟部智慧財產局員工消費合作社印製 1244619 A7 五、發明説明（ (請先閲讀背面之注意事項再填寫本頁) 現參考第1圖’此為—具體實作本發明之資料儲存系 統範例，包含有置放於該基板2〇上的二維陣列懸桁感測 益10。橫列導體60與縱行導體5〇也是被排置在該機板 2〇上。各個感測器丨〇係由不同的橫列導體6〇與縱行導體 5〇組合所表指。各個感測器10包含一長度為70 um而厚 度為數微米範圍的u型矽質懸桁15。該懸桁15的諸支腳 在其末稍處被固定在該矽質基板2〇上。該懸桁15的頂點 駐置於一構成於該基板2〇内之凹陷7〇處，並可按垂直法 向於該基板20的方向上自由移動。該懸桁15於其頂端處 载有電阻性加熱器元件30，和一朝離於該基板20的矽 質尖點40。該懸桁丨5的諸支腳係屬高度摻質，藉此改善 電導性。該加熱器元件30是由該懸桁1 5的頂點但具較低 捧質者所構成，藉此引入一個對於流經該懸桁1 5處電流 具經提增之電阻性範圍。該懸桁15的其中一個支腳係透 過一中介二極體80而連接到一橫列導體60。該懸桁15 的其它各支腳則是連接到一縱行導體50。該橫列導體6〇、 縱行導體50和二極體80亦可被排置於該基板20上。 經濟部智慧財產局員工消費合作社印製 現參考第2圖，該尖點40會被驅離於一如聚甲基丙 婦酸甲酯（PMMA)、厚度為40 nm範圍内的聚合物層9〇形 式之平面儲存媒體。該聚合物層90載置於一矽質基板i 〇〇 上。一互連光阻的可選擇性緩衝層110,即如厚度為70 nm 範圍内之SU-8者，可被置放在該聚合物層90與該基板100 間。在讀出和寫入兩者作業中，該陣列的尖點40會被移 動跨越該儲存媒體表面。在寫入作業裡，該尖點陣列可相 第11頁 氏張尺度適用中國國家標準(CNS)A4規格(210X297公董） 1244619.........%: (Please read the notes on the back before filling and writing this page) #-· III 1244619 A7 B7 V. Description of the invention () Signal diagram; Diagrams of the readout signal applied to the sensor at consecutive positions; and Figures 1 1D are diagrams of the electric field applied to the sensor at each successive position as a function of time. Comparative description = 10 Two-dimensional array cantilever sensor 15 U-shaped silicon cantilever 20 Substrate 30 Resistive heater element 40 Silicon cusp 50 Row conductor 60 Row conductor 70 Depression 80 Intermediate diode 90 Polymer Layer 100 Silicon substrate 110 Buffer layer 120 Recessed hole 121 Recessed hole 122 Recessed hole 123 Recessed hole 124 Recessed hole 130 Vertical line multiplexer 140 Control line 150 Control line 160 Positioning conductor 170 Positioning conductor 180 Row multiplexer 190 Polymer material ring 210 controller 220 positioning transmitter 230 stable or ground state 240 super stable state 250 voltage signal generator Detailed description of the invention: page 10 This paper size applies to China National Standard (CNS) A4 specification (210X297 mm) (Please read the back first Please pay attention to this page and then fill in this page) and · Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economy 1244619 A7 V. Description of the invention ((Please read the precautions on the back before filling this page) Now refer to Figure 1 'This is-specific An example of implementing the data storage system of the present invention includes a two-dimensional array cantilever sensing benefit 10 placed on the substrate 20. The horizontal conductor 60 and the vertical conductor 50 are also arranged on the machine plate 2. 〇. Each sensor 丨 〇 is indicated by a combination of different row conductors 60 and vertical conductors 50. Each sensor 10 includes a u-type silicon with a length of 70 um and a thickness of a few micrometers. Cantilever 15. The legs of the cantilever 15 are fixed on the silicon substrate 20 at the end. The apex of the cantilever 15 resides in a depression 70 formed in the substrate 20 And can move freely in the direction perpendicular to the substrate 20 according to the vertical normal. The cantilever 15 carries a resistive heater element 30 at its top end, and a silicon cusp 40 facing away from the substrate 20. The The legs of the cantilever 5 are highly doped, thereby improving electrical conductivity. The heater element 30 is made of The apex of the cantilever 15 is formed by the lower supporter, thereby introducing an increased resistance range for the current flowing through the cantilever 15. One of the legs of the cantilever 15 is penetrated An intermediary diode 80 is connected to a row of conductors 60. The other legs of the cantilever 15 are connected to a row of conductors 50. The row of conductors 60, the row of conductors 50, and the diode 80 It can also be arranged on the substrate 20. Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs, refer to Figure 2. The sharp point 40 will be driven away from a polymer layer, such as polymethylmethacrylate (PMMA), within a thickness of 40 nm. 9 〇 form of flat storage media. The polymer layer 90 is placed on a silicon substrate iOO. An optional photoresistive buffer layer 110, such as SU-8 having a thickness in the range of 70 nm, can be placed between the polymer layer 90 and the substrate 100. In both reading and writing operations, the sharp points 40 of the array are moved across the surface of the storage medium. In the writing operation, the sharp point array can be related to page 11 scales applicable to the Chinese National Standard (CNS) A4 specification (210X297 public director) 1244619
對於該健存媒體而移動，以供允在該聚合物層90的區域 上寫入資料。 可藉由透過尖點施加一局部力度·給該聚合物層9〇，並 透過笑點4 0藉由傳通寫入電流從相對應的橫列導體6 〇 經懸桁15而到相對應的縱行導體50處，按熱能形式施加 一能量給該表面兩者的組合，依此方式將資料寫出至該儲 存媒體。電流傳通該懸桁1 5會引起該加熱器元件3 〇温度 '曰南 熱此會被從該加熱器元件30處，透過熱導写而傳 通到該尖點40。 經濟部智慧財產局員工消費合作社印製 現參考第3圖，諸橫列導體60各者係連接於橫列多 工器180的個別線路上。同樣地，諸縱行導體5〇各者係 連接於縱行多工器130的個別線路上。資料與控制信號可 分別地經控制線路14〇和150而被傳通於控制器21〇和該 等橫列與縱行多工器180和130之間。可透過諸定位傳導 器160、17〇和220,按相對於該陣列為正交方向，依既經 控制的方式來移動該儲存媒體90。該等定位傳導器16〇 和1 70可影響該陣列在平行於該儲存媒體9〇表面之平面 内的移動。而該定位傳導器220可影響該陣列在垂直於該 陣列方向上的移動。操作上，控制器2丨〇可於寫入作業·過 程中產生寫入#號以驅動該陣列，亦可於讀出作業過程中 產生讀出信號以驅動該陣列，以及產生定位信號以驅動諸 定位傳導器160、170和22〇來控制該陣列中諸尖點相對 於該聚合物層90的移動方式。該控制器21〇也可於讀出 作業過程中接收從該陣列傳來的輸出。在本發明特別較佳 第12頁 本紙張尺度適用中國國家標準(CNS)A4規格(210X297公釐) 1244619 A7 B7 經 濟 部 智 慧 財 產 局 員 X 消 費 合 作 社 印 製 五、發明說明（） 之諸具體實施例中，該等傳導器160、170和22〇是由壓 電傳導器、電磁傳導器或彼等組合所實作。不過，應瞭解 亦可採取其它的實作方式。該控制器2 1 0可為至少部分係 按微處理器、微控制器或類似的控制裝置或控制装置集組 所實作。在本發明的一些具體實施例中，亦得省略該傳導 器 220。 現參考第4圖，選取寫入電流以加熱該尖點4〇至— 足夠以讓該聚合物層90局部變形的水準，藉此讓該尖•點 40得以凹縮該聚合物層90表面，而遺留一直徑約4〇 範圍的陷孔120。藉由範例，發現可藉由加熱該尖點4〇 至約攝氏700度的溫度來達到PMMA薄膜的局部變形 選擇性的緩衝層110具有比起該PMMA薄膜90為高的炼 點，並因而可作為一穿透停止器，以防止該尖點4〇磨損 該基板110。陷孔120周圍所環繞有隆起於該聚合物層％ 之聚合材質環狀物1 90。而第二個且重疊之陷孔i 2丨則b 按虛線所不^ 該加熱器元件30也會提供一熱性讀回感測器，因為 該者具有一與&度相關的電阻值。對於資料讀出作業而 言，加熱電流會經該懸桁1 5從相對應的橫列導體6 〇济到 相對應的縱行導體50。按此’會再度加熱該加熱器元件 40，不過現在是加熱到不足以將該聚合物層9〇變形 度。例如溫度約為攝氏400度的讀出溫度不足以溶解該 PMMA薄膜，但是仍可提供足夠的讀出效能。該加熱器= 件30與該聚合物層90之間的熱性傳導會根據加熱器一 "·、σ几件 第13頁 本紙張尺度適用中國國家標準(CNS)A4規格(210X297公楚） .............ΜΨ............· (請先閲讀背面之注意事項再填寫本頁} 1244619 五、發明説明（ 與該聚合物層90兩者之間距離而變化。在讀出作業過程 中，尖點40掃插在整個該聚合物層9〇的表面。這可藉由 相對於該聚合物層90來移動該陣列而達成。當該尖點4〇 被移入陷孔120時，該加熱器元件3〇與該聚合物層9〇之 間的距離會縮短。而該加熱器元件30與該聚合物層9〇之 間的媒體傳送該尖點4〇與該聚合物層9〇之間的熱能。當 該尖點40被移入陷孔12〇後，該加熱器元件3〇與該聚合 物層90之間的熱能傳送更有效率。其溫度並且因而該加 熱器元件30的電阻即可減少。可依平行方式來監視經加 熱之加熱器元件30橫列内的溫度變化，俾利於偵測所記 錄的諸位元。 · 可藉由將一加熱電壓脈衝施加於相對應的橫列導體 60來產生前述之加熱電流。因此，加熱電流會經各個連接 於該檢列導體6 0的感測器1 〇，而流到加熱電壓脈衝所施 加者。從而，該陣列中相對應橫列内的所有加熱器元件3〇 皆會被加熱。然後，該經加熱橫列之感測器丨〇會按平行 方式將既經記錄之資料讀出。在此，即按一多工法則而循 序地讀取該陣列的各橫列。在本發明的較佳具體實施例 中’該儲存媒體可提供3 mm><3 mm的儲存表面。 現參考第5圖，可藉由構成新的陷孔121- 124，彼等 係彼此覆蓋於先前記錄而欲待加擦除至該聚合物層川表 面之大致程度的資料上，來將該等經記錄之資料位元予以 選擇性地擦除。這可藉由執行前述之寫入作業，按更高密 度之新陷孔124,該等彼此覆蓋而使得各個新陷孔可 1244619 B7_ 五、發明説明（) 有效地擦除掉之前的陷1，來覆寫諸待加擦除之陷孔所達 成。現參考第6圖，該些覆蓋的新陷孔12ι — 124會各者 會與待加擦除之陷孔12〇彼此併合而·至該聚合物層％表 面之大致程度。即如先前所述，.這項擦除並不需要為完全 無誤。可在該聚合物層9〇的表面上遺留一系列的起伏波 紋200。只需既經擦除之位元不會在讀出作業的過程中债 測成一資料位元即已足夠。這當然是根據資料讀出的敏感 程度而定。該控制器21〇可運作於一擦除模式下以控制新 陷孔121 - 124的資訊。現回返到第5圖，在某些應用上， 某一被寫入以擦除非欲資料序列之序列中的最新位元，即 如新的陷孔124所表示者，以構成待加記錄之新資料序列 的一部份係可接受者。而在其它的排置裡，經寫入以擦除 非欲位元的新位元密度，可為讓沒有新的位元會被遺存於 該表面上記錄者。 經濟部智慧財產局員工消費合作社印製 現參考第7圖，該聚合物層9〇的表面具有一穩定或 地面狀態230和一超穩定狀態24〇。透過尖點4〇對該表面 施加一力度Fw和能量Ew組合可在該尖點4〇的接觸點處 將該表面變形成為其超穩定狀態240 〇現參考第7和8圖 兩者，在本發明較佳具體實施例裡，一藉由定位該尖點40 於該位置而被寫入於該表面處之資料位元，並透過尖點 對該表面施加一力度Fw和能量Ew組合以於該位置處將該 表面變形。現參考第9圖，接著，會藉由於變形作業中定 位該尖點40，並透過尖點4〇對該表面施加一能量&以將 該資料位元擦除。該能量Ee可為低於所需用以於表面上 第15頁 本紙張尺度適用中國國家標準(CNS)A4規格(210x297公爱) 1244619 B7 五、發明説明（ 寫入資料位元，但高於所需用以讀出記錄於表面上之資料 位兀*者。或另者，該能量Ee可為類似於該能量之規模。 然無論如何，該能量&確足以鬆緩該表面離於其超穩定 狀態240而至穩定狀態23〇。在該擦除作業裡，力摩〜 會被減少或可併同移除。可透過傳導器22〇來實作釋除該 力度Fw。藉經釋除之力度Fw和被施加以激發該變形表面 内之分子的能量Ee，當該表面鬆緩為其穩定狀態時，該表 面内的分子間力度Fm即足將該尖點4〇推離。即如前文所 述，可藉由該控制器210，將讀出、寫入和選擇性地擦除 作業所要求的能量與力度之不同組合方式提供給該陣 列。 經濟部智慧財產局員工消費合作社印製 現參考第1 0圖，在本發明較佳具體實施例裡，該基 板110係屬導體，並且該控制器210含有一電壓信號產生 器250,該者可選擇性地接通至該陣列的各個尖點4〇，藉 以選擇性地建立各個尖點40與該儲存媒體鄰接範圍之間 的電位差。這個電位差可在各個尖點的範圍内產生一電場 £。該電場I係經指向以驅使該尖點4〇在該電場[的影響 下可朝於該聚合物層90的表面。該尖點4〇如此會在該電 場互的影響下，對該聚合物層90的表面施加一額外力度·。 這個額外力度可被用來加強讀出和尤其是寫入兩者的作 業。更詳細地說，這個額外力度可供允達到讀出和寫入兩 者作業更高的資料速率。各項實驗指出，在奈米的範圍 中，阻滯（viscous)反作用力會藉由該尖點4〇按高於約5 微秒之速度，來作用於該聚合物層90表面變形處。這個 第16頁 本紙張尺度適用中國國家標準(CNS)A4規格⑵〇Χ297公爱) 1244619The storage medium is moved to allow data to be written on the area of the polymer layer 90. It is possible to apply a local force through the sharp point to the polymer layer 90, and pass the write current through the laughing point 40 to the corresponding row conductor 60 through the cantilever 15 to the corresponding At the vertical conductor 50, an energy is applied to the surface as a combination of both in the form of thermal energy, and data is written to the storage medium in this way. The current passing through the cantilever 15 will cause the temperature of the heater element 30. The heat will be transmitted from the heater element 30 to the cusp 40 through thermal conduction. Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs Referring now to FIG. 3, each of the row conductors 60 is connected to an individual line of the row multiplexer 180. Similarly, each of the vertical conductors 50 is connected to an individual line of the vertical multiplexer 130. The data and control signals can be transmitted to the controller 21 and the horizontal and vertical multiplexers 180 and 130 via the control lines 14 and 150, respectively. The storage medium 90 can be moved through the positioning conductors 160, 170, and 220 in an orthogonal direction with respect to the array in a controlled manner. The positioning conductors 160 and 170 can affect the movement of the array in a plane parallel to the surface of the storage medium 90. The positioning conductor 220 can affect the movement of the array in a direction perpendicular to the array. In operation, the controller 2 can generate a write # number to drive the array during a write operation, and can also generate a read signal to drive the array during a read operation, and generate a positioning signal to drive the array. Conductors 160, 170, and 22 are positioned to control the movement of the sharp points in the array relative to the polymer layer 90. The controller 21 can also receive output from the array during a read operation. In the present invention, it is particularly preferred on page 12. This paper size applies the Chinese National Standard (CNS) A4 specification (210X297 mm) 1244619 A7 B7 Member of the Intellectual Property Bureau of the Ministry of Economic Affairs X Printed by Consumer Cooperatives 5. Specific Examples of Inventions In the embodiment, the conductors 160, 170, and 22 are implemented by a piezoelectric conductor, an electromagnetic conductor, or a combination thereof. However, it should be understood that other implementations are possible. The controller 210 may be implemented at least in part by a microprocessor, microcontroller or similar control device or group of control devices. In some embodiments of the present invention, the conductor 220 may be omitted. Referring now to FIG. 4, a write current is selected to heat the sharp point 40 to a level sufficient to locally deform the polymer layer 90, thereby allowing the sharp point 40 to condense the surface of the polymer layer 90, A trap hole 120 having a diameter of about 40 is left. By way of example, it has been found that the buffer layer 110, which can achieve local deformation selectivity of the PMMA film by heating the cusp 40 to about 700 degrees Celsius, has a higher melting point than the PMMA film 90, and thus can As a penetration stopper, the sharp point 40 is prevented from abrading the substrate 110. Surrounded by the recessed hole 120 is a polymer material ring 190 raised in the polymer layer%. The second and overlapping trap hole i 2 丨 is not shown by the dashed line. The heater element 30 will also provide a thermal read-back sensor because it has a resistance value related to & degree. For the data reading operation, the heating current will be transmitted from the corresponding row conductor 60 to the corresponding row conductor 50 through the suspension beam 15. This' will heat the heater element 40 again, but now it is not heated enough to deform the polymer layer 90 °. For example, a read temperature of about 400 degrees Celsius is not sufficient to dissolve the PMMA film, but still provides sufficient read performance. The heater = the thermal conduction between the piece 30 and the polymer layer 90 will be according to the heaters ", several pieces on page 13. This paper size applies to the Chinese National Standard (CNS) A4 specification (210X297). ............ ΜΨ ............ · (Please read the notes on the back before filling out this page} 1244619 V. Description of the invention (and the polymer layer The distance between the two 90 varies. During the reading operation, the sharp point 40 is swept across the entire surface of the polymer layer 90. This can be achieved by moving the array relative to the polymer layer 90. When the sharp point 40 is moved into the recess 120, the distance between the heater element 30 and the polymer layer 90 will be shortened, and the medium between the heater element 30 and the polymer layer 90. Transfer the thermal energy between the sharp point 40 and the polymer layer 90. When the sharp point 40 is moved into the recessed hole 120, the thermal energy transfer between the heater element 30 and the polymer layer 90 is even more Efficiency. Its temperature and thus the resistance of the heater element 30 can be reduced. The temperature changes in the rows of the heated heater element 30 can be monitored in parallel, Facilitates the detection of the recorded bits. The aforementioned heating current can be generated by applying a heating voltage pulse to the corresponding row of conductors 60. Therefore, the heating current will pass through each of the 60 The sensor 1 〇, and the heating voltage pulse is applied. Therefore, all the heater elements 30 in the corresponding row in the array will be heated. Then, the sensor in the heated row 丨〇 The recorded data will be read out in parallel. Here, the rows of the array are sequentially read according to a multiplexing rule. In a preferred embodiment of the present invention, the storage medium may Provide a storage surface of 3 mm > < 3 mm. Referring now to Figure 5, by forming new recesses 121-124, they are covered with previous records on each other and are to be erased to the polymer layer. The recorded data bits can be selectively erased on the surface of the approximate degree of data. This can be performed by performing the aforementioned writing operation and pressing the new recesses 124 of higher density, which cover each other. And each new trap can be 1244619 B7_ V. Explain that () effectively erases the previous trap 1 to overwrite the traps to be erased. Now referring to Figure 6, these covered new traps 12ι — 124 will each meet with the Plus the erasure holes 120 merge with each other to the approximate degree of the% surface of the polymer layer. That is, as described previously, this erasure does not need to be completely error-free. A series of undulating ripples 200 remains on the surface. It is sufficient that the erased bits will not be measured as a data bit during the reading operation. This is of course dependent on the sensitivity of the data reading The controller 21 can operate in an erase mode to control the information of the new traps 121-124. Returning to Figure 5, in some applications, a certain bit written to erase the latest bit in the sequence of non-desired data, that is, as indicated by the new trap hole 124 to constitute a new record to be added Part of the data series is acceptable. In other arrangements, the new bit density that is written to erase non-desired bits can be such that no new bits will be left on the surface of the recorder. Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs Referring now to Figure 7, the surface of the polymer layer 90 has a stable or ground state 230 and an ultra-stable state 24. Applying a combination of force Fw and energy Ew to the surface through the sharp point 40 can deform the surface into its super-stable state at the point of contact of the sharp point 240. Now refer to both FIGS. 7 and 8 In a preferred embodiment of the invention, a data bit written on the surface by locating the sharp point 40 at the position, and applying a combination of force Fw and energy Ew to the surface through the sharp point to the The surface is deformed at locations. Referring now to Fig. 9, next, the data point will be erased by positioning the sharp point 40 during the deformation operation, and applying an energy & to the surface through the sharp point 40. The energy Ee can be lower than required to be used on the surface. Page 15 This paper size applies Chinese National Standard (CNS) A4 specifications (210x297 public love) 1244619 B7 V. Description of the invention (write data bits, but higher than It is necessary to read out the data recorded on the surface. Alternatively, the energy Ee may be on a scale similar to the energy. However, the energy & is indeed sufficient to relax the surface from it. Super stable state 240 to stable state 23. In this erasing operation, Limo ~ will be reduced or can be removed together. The force Fw can be implemented through the conductor 22o. By the release The force Fw and the energy Ee applied to excite the molecules in the deformed surface, when the surface is relaxed to its stable state, the intermolecular force Fm in the surface is enough to push the sharp point 40 away. That is, as As mentioned above, the controller 210 can be used to provide the array with different combinations of energy and intensity required for reading, writing, and selective erasing operations. Printed by the Consumer Cooperative of Intellectual Property Bureau, Ministry of Economic Affairs Reference is now made to Figure 10, which is a preferred embodiment of the present invention. Here, the substrate 110 is a conductor, and the controller 210 includes a voltage signal generator 250, which can be selectively connected to each of the sharp points 40 of the array, thereby selectively establishing each sharp point 40 and The potential difference between the adjoining ranges of the storage medium. This potential difference can generate an electric field within the range of each sharp point. The electric field I is pointed to drive the sharp point 40 toward the aggregation under the influence of the electric field [ The surface of the object layer 90. The sharp point 40 will thus exert an additional force on the surface of the polymer layer 90 under the influence of the electric field interaction. This additional force can be used to enhance reading and especially writing Both operations. In more detail, this extra strength allows for higher data rates for both read and write operations. Various experiments have shown that in the nanometer range, viscous reaction forces The sharp point 40 will act on the surface of the polymer layer 90 at a speed higher than about 5 microseconds. This page 16 of this paper applies the Chinese National Standard (CNS) A4 specification 〇〇297 Love) 1244619
五、發明説明（ 經濟部智慧財產局員工消費合作社印製 由該電場互所施加的額外力度有助於克服這種阻滯力。尚 可藉由減> 該尖點40的大小來進一步改善該電場亙的效 應各項實驗指出，當該尖點4 0顯著地短於1微米時， 大部分的力度都會被局部地施加在該聚合物層90 .的表面 處。對於這種短型的尖點，該感測器1 〇和基板1 00之間 的電谷值會變得相當地高。例如，各項實驗指出，施加在 該基板100與長度為100 nm之尖點40間的10, V電遷會 對該聚3物層90施加約〇 1 mN的力度。這個力度已足夠 強到可在相當地軟性的聚合物内產生凹縮，即使是當該尖 點40與該聚合物層9〇屬室溫狀態下亦然。缺少該電場， 該尖點會施加約為0 〇〇〇1 mN的荷載。而當出現該電場亙 時’將該尖點40加熱可大幅地縮短穿透時間。尤其是， 各項實驗指出，由該電場互所提供的額外力度可於寫入作 業的過程中將資料速率帶至奈秒的範圍内。並且，加熱該 尖點40與施加該電場互的組合可提高執行選擇性位元擦 除或覆寫作業的彈性。為寫入一位元並同時擦除相鄰位 元，最好是可維持該尖點40的溫度在相當高的水準。各 項實驗指出，由前述電場亙與組合所施加的力度和加熱該 尖點40之組合方式可使得資料儲存密度增加*倍。 現參考第1 1 A圖，在本發明特別較佳具體實施例裡， 該尖點40會在連續性讀出作業和連續性寫入作業兩者之 間’昇起離於該聚合物層90的表面。僅以範例說明，第 11A圖顯示尖點40與該聚合物層90的表面之間空域間隔 變化’會依經該聚合物層90上的連續位置a到E處而循 第17頁 本紙張尺度適用中國國家標準(CNS)A4規格(210X297公爱) 1244619 A7 五、發明説明（） 序地移動0 d〇表示當該尘寶上 大點40接觸到該表面時其間隔情 況。而位置A到為等距或非等方式間隔離於該表面上。按 此，d〇 = 0, dl表示當該尖點4〇最遠移離於該表面時的間 隔。間隔d是由控制器21〇經該傳導器22〇所控制。 現 > 考第11B圖’在為於位置A到E處寫入資料位 元的寫入作業裡，當該尖點4〇撞擊到該聚合物層9〇時， 該控制器210可跨於相對應之尖點4〇的加熱器元件來施 加一寫入電壓脈衝Wl。該寫入電壓脈衝％可在加熱器元 件内造成一電流’而該者的規模大小足夠在該尖點4〇處 產生充分能：ft，以冑該尖•點4〇 圍處之聚合物^ 9〇表面 予以變形。可透過該尖•點4〇自遠端位置撞擊該表面處， 而達成該聚合物層90表面經強化的變形結果，此因額外 的能量可藉此穿入該聚合物層9〇的表面。經強化的變形 結果可改善既經記錄資料的定義。當位置A到E的序列被 循序地寫入後，相對應的連續寫入脈衝可構成一交替於高 電壓水準Wl和低電壓水準w〇之間的寫入信號w。在本 發明的一些具體實施例中，該寫入脈衝Wi可同時於該尖 點40接觸到該聚合物層9〇表面之時段。不過，在本發明 特別較佳的具體實施例中，該寫入脈衝Wi相對於該尖點 40與該聚合物層90間之接觸時段略為偏傾，使得在該尖 點40梭擊到該聚合物層9〇表面的時刻之前，寫入電壓會 被施加跨越於該加熱器元件3〇處；繼續被施加到該尖點 4〇接觸到該聚合物層90表面的時段裡；然後，在該尖點 4〇卸離於該聚合物層90表面之前先予以移開。相對於接 (請先閲讀背面之注意事項再塡寫本頁) %. 經濟部智慧財產局員工消費合作社印製 第18頁V. Description of the invention (The extra energy exerted by the electric field mutual printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs helps to overcome this blocking force. It can be further improved by reducing the size of the sharp point 40 The effects of the electric field chirp various experiments indicate that when the sharp point 40 is significantly shorter than 1 micron, most of the force will be locally applied to the surface of the polymer layer 90. For this short type Sharp point, the electrical valley value between the sensor 10 and the substrate 100 will become quite high. For example, various experiments indicate that the 10 applied between the substrate 100 and the sharp point 40 with a length of 100 nm is 10 , V electromigration will apply a force of about 0 1 mN to the polymer layer 90. This force is strong enough to cause shrinkage in a relatively soft polymer, even when the sharp point 40 and the polymer The same is true for layer 90 at room temperature. In the absence of the electric field, a load of about 0.001 mN is applied to the sharp point. When the electric field occurs, the heating of the sharp point 40 can greatly shorten the penetration. Through time. In particular, experiments indicate that the additional force provided by the electric field It can bring the data rate to the nanosecond range during the writing operation. Furthermore, the combination of heating the sharp point 40 and the application of the electric field can improve the flexibility of performing a selective bit erase or overwrite operation. In order to write a bit and erase adjacent bits at the same time, it is preferable to maintain the temperature of the sharp point 40 at a relatively high level. Various experiments have pointed out that the force exerted by the foregoing electric field and combination and the heating of the The combination of the sharp points 40 can increase the data storage density by a factor of *. Now referring to FIG. 1A, in a particularly preferred embodiment of the present invention, the sharp points 40 will be used in continuous readout operations and continuous write operations. Between the two operations, 'rising away from the surface of the polymer layer 90. By way of example only, FIG. 11A shows that the change in the space interval between the sharp point 40 and the surface of the polymer layer 90' will depend on the polymer. Continuing positions a to E on layer 90, page 17. This paper size applies the Chinese National Standard (CNS) A4 specification (210X297 public love) 1244619 A7 V. Description of the invention () Sequentially moving 0 d〇 means when the dust The interval of Baoshang big point 40 when it touches the surface The position A is isolated from the surface in an equidistant or non-equivalence manner. According to this, d0 = 0, dl represents the interval when the sharp point 40 moves farthest from the surface. The interval d is controlled by The actuator 21 is controlled by the conductor 22. Now, as shown in FIG. 11B, in the writing operation for writing data bits at positions A to E, when the sharp point 40 hits the polymer At layer 90, the controller 210 may apply a write voltage pulse W1 across the heater element corresponding to the sharp point 40. The write voltage pulse% may cause a current in the heater element, and the The size of the person is sufficient to generate sufficient energy at the sharp point 40: ft to deform the polymer surface around the sharp point 40. The sharpened point 40 can be used to strike the surface from a distal position to achieve a strengthened deformation of the surface of the polymer layer 90. This extra energy can penetrate the surface of the polymer layer 90. Enhanced deformation results can improve the definition of previously recorded data. When the sequence of positions A to E is written sequentially, the corresponding continuous write pulses can form a write signal w alternately between the high voltage level W1 and the low voltage level w0. In some specific embodiments of the present invention, the write pulse Wi can be in contact with the surface of the polymer layer 90 at the same time as the sharp point 40. However, in a particularly preferred embodiment of the present invention, the write pulse Wi is slightly skewed with respect to the contact period between the sharp point 40 and the polymer layer 90, so that the polymer is shuttled at the sharp point 40 to the aggregate Before the time of the surface of the object layer 90, the writing voltage will be applied across the heater element 30; it will continue to be applied to the period where the sharp point 40 contacts the surface of the polymer layer 90; The sharp point 40 is removed before being detached from the surface of the polymer layer 90. Relative to (Please read the notes on the back before copying this page)%. Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs Page 18
A7 B7A7 B7
1244619 五、發明説明（） (請先閲讀背面之注意事項再填寫本頁} 觸時段的寫入脈衝偏傾可將從該尖點40至該聚合物層90 表面的能量傳送予以最佳化，藉此加強該聚合物表面變形 的程度。 經濟部智慧財產局員工消費合作社印製 現參考第11C圖’在為於位置A到E處讀出資料位 元的讀出作業裡，當該尖點40移離於該聚合物層90時， 該控制器2 1 0可跨於相對應之該尖點40的加熱器元件來 施加一讀出電壓脈衝R!。該讀出電壓脈衝R〗可在加熱器 元件30内造成一電流，而該者的規模大小足夠在該尖點 4〇範圍處產生充分能量，以供允偵測到對應於該聚合物層 90表面變形之能量傳送變化。可藉由在該聚合物層9〇表 面上，而與該尖點40卸離於該聚合物層90表面相反作用 的力度，來增強偵測既經記錄之資料。當位置A到E的序 列被循序地讀出後，相對應的連續讀出脈衝可構成一交替 於高電壓水準R!和低電壓水準Ro間的讀出信號r。在本 發明的一些具體實施例中，該讀出脈衝Ri可同時於該尖 點4 0接觸到該聚合物層9 0表面之時段。不過，在本發明 特別較佳的具體實施例中，該寫入脈衝Ri相對於該尖點 40與該聚合物層90間之接觸時段略為偏傾，使得在該尖 點40接觸到該聚合物層90表面的時段裡，該讀出電壓會 被施加跨越於該加熱器元件30處，並且在該尖點40卸離 於該聚合物層90表面之後但在該尖點40下一次接觸到該 聚合物層90表面之前會被移開。這個相對於接觸時段的 讀出脈衝偏傾，可將被記錄於該聚合物層90表面變形内 的資料位元偵測予以最佳化。 第19頁 本紙張尺度適用中國國家標準(CNS)A4規格(210X297公爱) 1244619 A7 B7 五、發明説明（ 應知悉在如圖11Af，HlC所述之讀出和寫入作業的 過程中，該陣列的尖點40只會在一相當短的時段内保持 接觸於聚合物層90 (通常是數毫秒至數微秒的範_以 可有利地降低對該尖點4G相料該聚合物層剛之邊側 移動的摩擦阻力。此外，這可限制或另因該尖點40盘兮 聚合物層9〇間的延長接觸時間而產生對於該尖點40的磨 損。並且，這可降低對於該尖點4〇大小之均句性和精確 度的要求。該尖點40和該聚合物層1〇〇之間的間隔大小 可容忍具較大的變異性。如此可減少製造成本並改善製程 產出。 訂 現參考第1 1D圖，在本發明特別較佳的具體實施例 中，可透過控制器210的電壓信號產生器250,藉由改變 該尖點40與該基板1〇〇間電壓％與％的電位差來加 強讀出和寫入作業兩者。可將該電壓變化性同步於該尖點 4〇對該聚合物層9Q間之接作和卸離時段。更詳細地說， 可對該尖點40對該聚合物層⑽之接觸時段予以計時，以 符遇於由該錢錢產生器25Q加諸在該尖點4。與該基 板110間之電壓脈衝的施加作業。該電場互係經指向以驅 經濟部智慧財產局員工消費合作社印製 使該头：點40在該電場五^^鄉 你X电野A的衫響下可朝於該聚合物層9〇的 表面》如此’該尖點40會在該電場_影響下，對該聚合 物層9…面施加一額外力度。在本發明具體實施例的 較佳修飾方式中’加諸在該基板m與該尖點則之電 壓脈衝，會在寫入作業下同時於施加給該尖點4〇的寫入 脈衝’俾以加強將資料記錄在該聚合物層9"的作業。 第20貫 本紙張尺度適用中國國家標準(cns)^J(_210x297/J^ 12446191244619 V. Description of the invention () (Please read the notes on the back before filling this page} The writing pulse deflection during the touch period can be optimized from the point 40 to the surface of the polymer layer 90, This enhances the degree of surface deformation of the polymer. The Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs prints the reference to Figure 11C. In the reading operation for reading data bits at positions A to E, the sharp point When 40 is moved away from the polymer layer 90, the controller 210 can apply a read voltage pulse R! Across the heater element corresponding to the sharp point 40. The read voltage pulse R can be A current is caused in the heater element 30, and the size of the current is sufficient to generate sufficient energy in the range of the sharp point 40 to allow the change in energy transmission corresponding to the deformation of the surface of the polymer layer 90 to be detected. The force acting on the surface of the polymer layer 90 and opposite to the point 40 detached from the surface of the polymer layer 90 enhances the detection of the recorded data. When the sequence of positions A to E is sequentially After ground readout, the corresponding continuous readout pulse can be constructed A readout signal r alternated between a high voltage level R! And a low voltage level Ro. In some embodiments of the present invention, the readout pulse Ri can simultaneously contact the polymer layer 9 at the sharp point 40. 0 period. However, in a particularly preferred embodiment of the present invention, the write pulse Ri is slightly deviated from the contact period between the sharp point 40 and the polymer layer 90, so that at the sharp point 40 During the period of contact with the surface of the polymer layer 90, the readout voltage is applied across the heater element 30, and after the sharp point 40 is detached from the surface of the polymer layer 90 but at the sharp point 40 It will be removed before the next contact with the surface of the polymer layer 90. This read pulse deflection relative to the contact period can optimize the detection of the data bits recorded in the surface deformation of the polymer layer 90 Page 19 This paper size applies the Chinese National Standard (CNS) A4 specification (210X297 public love) 1244619 A7 B7 V. Description of the invention (It should be noted that during the read and write operations described in Figure 11Af, HlC The sharp points 40 of the array will only The segment is kept in contact with the polymer layer 90 (typically in the range of several milliseconds to several microseconds) to advantageously reduce the frictional resistance to the sharp point of the 4G material when the polymer layer moves side by side. In addition, this can limit Or another wear of the sharp point 40 is caused by the prolonged contact time between the sharp point 40 and the polymer layer 90. Moreover, this can reduce the requirements for the uniformity and accuracy of the sharp point 40. The size of the gap between the sharp point 40 and the polymer layer 100 can tolerate greater variability. This can reduce manufacturing costs and improve process output. Reference is made to Figure 11D, which is particularly important in the present invention. In a preferred embodiment, the voltage signal generator 250 of the controller 210 can be used to enhance both the read and write operations by changing the potential% and% voltage difference between the sharp point 40 and the substrate 100. . The voltage variability can be synchronized with the cusp 40 and the period of time between the contact and the detachment of the polymer layer 9Q. In more detail, the contact period of the sharp point 40 to the polymer layer may be timed so as to meet the sharp point 4 imposed by the money generator 25Q. Application of a voltage pulse to the substrate 110. The electric field is directed to drive the consumer consumer cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs to print the head: Point 40 can be directed toward the polymer layer 90 under the sound of the electric field five ^^ your X Dianye A shirt. "Surface" so that the sharp point 40 will exert an additional force on the polymer layer 9 ... face under the influence of the electric field. In a preferred modification of the specific embodiment of the present invention, 'the voltage pulses applied to the substrate m and the sharp point will be simultaneously applied to the writing pulse 40 applied to the sharp point under a writing operation.' Strengthen the work of recording data in this polymer layer 9 ". The 20th paper size applies to Chinese national standards (cns) ^ J (_210x297 / J ^ 1244619
同樣地，在本發明的另一較佳修飾方式中，加諸在該基板 110與該尖點40間之電壓脈衝，會在讀出作業下同時於施 加給該尖點40的讀出脈衝，俾以加強記錄於該聚合物層 90内的資料讀出作業。 在前文按第11D圖所述之本發明的較佳具體實施例 中’會根據該尖點40和該聚合物層9〇的週期性接作而將 電位差變化性加諸於該尖點40與該基板1〇〇間。不過， 應知悉在本發明的一些具體實施例中，可獨立地應用該基 板100與該尖點40間的電位差週期性變化，而與該尖點 40相對於該聚合物層90而按法向垂直於該聚合物層9〇 的移動方式無關。更詳細地說，在這種本發明具體實施例 裡’加諸於該基板100與該尖點40間的電壓脈衝，會依 所欲之作業指述而保持與施加在該尖點4()的讀出或寫入 脈衝同步。不過，當透過傳導器160和17〇致令該尖點4〇 相對於該聚合物層90而側移時，該尖點40會維持固定接 觸到該聚合物層90的表面。 經濟部智慧財產局員工消費合作社印製 現回返參考第10圖’即一本發明特別較佳之具體實 施例，該基板區域會被分割成個別的可定址導體分區。可 透過構成在該基板100上之位址線路，將該電壓信號產生 器250選擇性地連接至諸分區。這可讓該控制器21〇得以 經由該電壓產生器2 5 0與相關位址線路，在一既選分區與 一既選尖點40，或一組既選尖點40，之間建立起電場互。 即如前述，可將該電場亙建立在該基板1〇〇和該災點4〇 的加熱器元件30之間。或另者，可將該電場[建立在該基 第21頁 本紙張尺度適用中國國家標準(CNS)A4規格(210X 297公釐) 1244619 __ 、發明説明（) 板l 〇〇和一個別而經整合於該感測器i 〇内的導體平台 間 曰，俾以產生一獨立於該加熱器3〇的電場互。接著，該控 制器2 1 0可採行構成在基板2 〇内或上，且各條連接到諸 道 體平台之不同者的可定址傳導路徑，俾以對一既遷尖點 4〇或既選尖點40群組施加該電場亙。本發明另一具體實 施例裡，可將該電場亙替換成磁場，而該者係藉由選擇性 地分別導通電流行經構成於該基板2〇内或上之諸導體線 圈以及感測器1 0所產生。 在此總結本文所呈示之本發明各式具體實施例，茲提 供一種用以透過一尖點對表面上的諸位置進行寫入資料 及/或讀出資料之方法，至少包含於該表面上諸位置處移動 该尖點。在各個位置處，可將該尖點與該表面朝向彼此移 動。接著，經由該尖點而將能量與力度施加在該表面上。 之後，該尖點與該表面朝離彼此移開。在前揭之另款排置 方式裡，可於該尖點之範圍内施加一力場，俾驅使該尖點 朝向該表面。 (請先閲讀背面之注意事項再填、寫本頁) %· 、可_ 經濟部智慧財產局員工消費合作社印製 第22頁 本紙張尺度適用中國國家標準(CNS)A4規格(210X297公釐)Similarly, in another preferred modification of the present invention, a voltage pulse applied between the substrate 110 and the sharp point 40 is simultaneously applied to the read pulse applied to the sharp point 40 under a read operation. In order to strengthen the data reading operation recorded in the polymer layer 90. In the preferred embodiment of the present invention as described in FIG. 11D above, the variability of the potential difference is added to the cusp 40 and There are 100 substrates. However, it should be noted that in some specific embodiments of the present invention, the periodic variation of the potential difference between the substrate 100 and the sharp point 40 may be independently applied, and the sharp point 40 is normal to the polymer layer 90 in a normal direction. The manner of movement perpendicular to the polymer layer 90 is irrelevant. In more detail, in such a specific embodiment of the present invention, the voltage pulse applied between the substrate 100 and the sharp point 40 will be maintained and applied at the sharp point 4 () according to the desired operation description. The read or write pulses are synchronized. However, when the sharp point 40 is caused to move laterally with respect to the polymer layer 90 through the conductors 160 and 170, the sharp point 40 will remain in fixed contact with the surface of the polymer layer 90. Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs. Referring back to Figure 10 ', which is a particularly preferred embodiment of the present invention, the substrate area will be divided into individual addressable conductor partitions. The voltage signal generator 250 can be selectively connected to the partitions through an address line formed on the substrate 100. This allows the controller 21 to establish an electric field between the selected partition and a selected point 40, or a group of selected points 40, via the voltage generator 250 and the associated address line. mutual. That is, as described above, the electric field 亘 can be established between the substrate 100 and the heater element 30 at the disaster point 40. Alternatively, the electric field [established on page 21 of this paper applies the Chinese National Standard (CNS) A4 specification (210X 297 mm) 1244619 __, the invention description () board 100 and a separate The conductor platforms integrated in the sensor i0 are used to generate an electric field mutual independent of the heater 30. Then, the controller 2 10 can adopt an addressable conduction path formed in or on the base plate 20, and each of them is connected to a different one of the various body platforms, so as to match an existing cusp 40 or a selected one. The group of sharp points 40 applies this electric field 亘. In another specific embodiment of the present invention, the electric field 亘 can be replaced with a magnetic field, and the electric current is selectively passed through the conductor coils and sensors 10 and 20 formed in or on the substrate 20 respectively. Produced. Various embodiments of the invention presented herein are summarized here, and a method for writing data and / or reading data from various locations on a surface through a sharp point is provided, at least included on the surface. Move the sharp point at the position. At each location, the sharp point and the surface can be moved towards each other. Energy and force are then applied to the surface via the sharp point. After that, the sharp point and the surface move away from each other. In the other arrangement of the previously disclosed method, a force field can be applied within the range of the sharp point, so that the sharp point is directed toward the surface. (Please read the precautions on the back before filling in and writing this page)% · ， 可 _ Printed by the Employee Consumption Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs Page 22 This paper applies the Chinese National Standard (CNS) A4 specification (210X297 mm)